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Endoscope electronics assemblyRelated Patent Categories: Surgery, Endoscope, With Camera Or Solid State Imager, Having Signal WiresEndoscope electronics assembly description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070276182, Endoscope electronics assembly. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application claiming priority to and the benefit of U.S. patent application Ser. No. 10/901,376, filed Jul. 29, 2004, by Doron Adler, et al., entitled ENDOSCOPE ELECTRONICS ASSEMBLY, the contents of which is hereby incorporated by reference for all purposes as if listed in its entirety herein. BACKGROUND [0002] The present invention relates generally to endoscopy, and specifically to improved methods for assembly of endoscopes, as well as electronic parts and subassemblies for use in endoscopes. [0003] Electronic endoscopes typically comprise an imaging subassembly, comprising an image sensor and suitable optics, at the distal end of the endoscope insertion tube. The imaging subassembly is connected to wires that pass through the insertion tube to the proximal end of the endoscope, where they are connected to a video processor board. Typically, the video processor board provides power and control signals to the image sensor, and receives and processes raw video signals from the image sensor in order to generate standard video output. [0004] Thus, in general, the electronics assembly of the endoscope (comprising the imaging subassembly, video processor board and connecting wires) can undergo final testing only after the entire endoscope has been assembled, whereupon the wires are connected to the imaging assembly at one end of the insertion tube and the video processor board at the other. If a fault in the electronics assembly is discovered at this late stage, it may be necessary to disassemble the entire endoscope in order to repair it. SUMMARY [0005] There is a need for new methods of assembling endoscopes that permit the electronics assembly to be completely assembled and tested before it is assembled into the endoscope. Embodiments of the present invention that are described hereinbelow provide methods and devices that address this need. [0006] In these embodiments, the electronics assembly comprises an imaging subassembly, wires, and a long, narrow connector, which is thin enough to pass through the endoscope insertion tube. The imaging subassembly is fixed to the distal end of the wires, and the connector is fixed to the proximal end, by soldering or by any other suitable technique, before the wires are passed through the insertion tube. The electronics assembly may then be tested by plugging the connector into a suitable video processor board or test jig. After testing, the electronics assembly is installed in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end. After the connector and wires have passed through the insertion tube, the imaging subassembly is installed and sealed in the distal end of the insertion tube. The connector may then be plugged into a suitable receptacle in a processing subassembly, and the endoscope is ready for use. [0007] Although the embodiments described hereinbelow relate specifically to imaging subassemblies, the principles of the present invention are equally applicable to other types of electronic subassemblies that are installed at the distal end of an endoscope and must be connected to processing or control electronics at the proximal end. Furthermore, the novel connectors and methods of assembly described hereinbelow may be used not only in endoscopes, but also in other types of electronic devices and systems. [0008] There is therefore provided, in accordance with an embodiment of the present invention, a method for assembling an endoscope that includes an imaging subassembly inside an insertion tube having distal and proximal ends, the method including: coupling the imaging subassembly to a plurality of wires, which have respective first and second ends, by fixing the first ends of the wires to the imaging subassembly; coupling a connector to the wires by fixing the second ends of the wires to the connector; after coupling the imaging subassembly and the connector to the wires, installing the imaging subassembly in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end; and after passing the connector through the insertion tube, inserting the connector in a receptacle. [0009] In a disclosed embodiment, the method includes testing the imaging subassembly by receiving signals from the connector after coupling the imaging subassembly and the connector to the wires and before installing the imaging subassembly in the insertion tube. [0010] Typically, inserting the connector in the receptacle includes coupling the imaging subassembly to convey signals to a processing subassembly via the wires. [0011] In some embodiments, the connector has an axis and includes a first array of conductive elements disposed along the axis, and coupling the connector to the wires includes connecting the wires to the conductive elements. Typically, the receptacle includes a second array of conductive pads, and coupling the connector to the receptacle includes aligning the first and second arrays, and exerting a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads. In a disclosed embodiment, coupling the connector to the receptacle includes inserting between the first and second arrays an elastomeric material including alternating conductive and non-conductive layers so that the electrical contact is formed through the elastomeric material. [0012] Additionally or alternatively, the connector includes a dielectric substrate, and the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate. Further additionally or alternatively, while passing the connector through the insertion tube, the axis of the connector is approximately parallel to the wires. [0013] There is also provided, in accordance with an embodiment of the present invention, an electronic assembly for use in an endoscope that includes an insertion tube, the assembly including: an imaging subassembly, including an image sensor; an elongate connector, which has an axis and includes a first array of conductive elements disposed along the axis, and which has transverse dimensions that are sufficiently small to permit the connector to pass through the insertion tube of the endoscope; and wires, which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the conductive elements of the connector. [0014] There is additionally provided, in accordance with an embodiment of the present invention, a connector assembly, including: an elongate connector, which has an axis and includes a first array of conductive elements disposed along the axis, and which is adapted for coupling of respective wires to the conductive elements; a receptacle, of a size and shape suitable for receiving the connector, and including a second array of conductive pads, positioned so as to be aligned with the first array when the connector is inserted in the receptacle; and an elastomeric material, which includes alternating conductive and non-conductive layers, and which is adapted to be held in the receptacle between the first and second arrays so as to provide electrical contact between the conductive elements and the conductive pads when the connector is inserted in the receptacle. [0015] In disclosed embodiments, the connector includes a dielectric substrate, and the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate. Typically, the layer of conductive material is disposed on at least first and second sides of the substrate, wherein the first side is configured to contact the elastomeric material, and wherein the wires are attached to the conductive material on the second side. In one embodiment, the first and second sides are opposing sides of the substrate, and wherein the conductive material on the second side is electrically connected by through-holes passing through the substrate to the conductive elements on the first side. [0016] There is further provided, in accordance with an embodiment of the present invention, an endoscope, including: an insertion tube having distal and proximal ends and having an internal dimension; an electronic assembly, which is installed inside the insertion tube, and includes: an imaging subassembly, including an image sensor, positioned in the distal end of the insertion tube; an elongate connector, which protrudes from the proximal end of the insertion tube, and which has transverse dimensions that are smaller than the internal dimension of the insertion tube; and wires, which pass through the insertion tube and which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the connector; and a processing assembly, including a receptacle that is adapted to receive the connector outside the proximal end of the insertion tube. [0017] The present invention will be more fully understood from the following detailed description of the embodiments thereof, taken together with the drawings in which: BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a schematic, cutaway view of a system for endoscopy, in accordance with an embodiment of the present invention; [0019] FIG. 2 is a schematic, pictorial view of an electronics assembly for use in an endoscope, in accordance with an embodiment of the present invention; [0020] FIGS. 3A and 3C are schematic bottom and top views of a connector, while FIGS. 3B and 3D are schematic left and right side views of the connector, in accordance with an embodiment of the present invention; Continue reading about Endoscope electronics assembly... Full patent description for Endoscope electronics assembly Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Endoscope electronics assembly patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Endoscope electronics assembly or other areas of interest. ### Previous Patent Application: System of accessories for use with bronchoscopes Next Patent Application: Endoscopic imaging system Industry Class: Surgery ### FreshPatents.com Support Thank you for viewing the Endoscope electronics assembly patent info. 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