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  Electropolishing system and processUSPTO Application #: 20080099344Title: Electropolishing system and process Abstract: The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with the contact solution. Further, during the process a process electrode in a process solution contacts a process region on the conductive surface with the process solution while applying an electrical potential between the contact electrode and the process electrode to electropolish the surface of the conductive layer of the process region. (end of abstract) Agent: Knobbe Martens Olson & Bear LLP - Irvine, CA, US Inventors: Bulent M. Basol, Homayoun Talieh USPTO Applicaton #: 20080099344 - Class: 205668000 (USPTO) Related Patent Categories: Electrolysis: Processes, Compositions Used Therein, And Methods Of Preparing The Compositions, Electrolytic Erosion Of A Workpiece For Shape Or Surface Change (e.g., Etching, Polishing, Etc.) (process And Electrolyte Composition), Local Application Of Electrolyte
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