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Electromagnetic interference containment in a transceiver moduleElectromagnetic interference containment in a transceiver module description/claimsThe Patent Description & Claims data below is from USPTO Patent Application 20070224851, Electromagnetic interference containment in a transceiver module. Brief Patent Description - Full Patent Description - Patent Application Claims
CROSS-REFERENCE TO RELATED APPLICATIONS [0001]This application claims priority to U.S. Provisional Patent Application Ser. No. 60/784,801, filed on Mar. 22, 2006, which is incorporated herein by reference in its entirety. BACKGROUND OF THE INVENTION [0002]1. The Field of the Invention [0003]The present invention relates generally to transceiver modules. More particularly, embodiments of the invention relate to an electromagnetic interference containment structure for reducing electromagnetic interference radiated from a transceiver module. [0004]2. The Related Technology [0005]Transceiver modules often include one or more printed circuit boards with electronic circuitry. The electronic circuitry of a printed circuit board can create electromagnetic interference. Electromagnetic interference, or EMI, is electromagnetic radiation that can be emitted by electrical circuits carrying rapidly changing signals. EMI is produced as a by-product of the normal operation of the electrical circuitry of a printed circuit board in a transceiver module. EMI can cause unwanted signals (also known as interference or noise) to be induced in other electronic circuitry of the transceiver module and also in any copper cabling that is electrically connected to the transceiver module. [0006]Transceiver modules must comply with governmental regulations concerning EMI, such as the United States Federal Communication Commission's Part 15, Class A. Beyond causing transceiver modules to be non-compliant with governmental regulations, unintentionally introduced EMI, can interrupt, obstruct, or otherwise degrade or limit the effective performance of a transceiver module or other nearby electronic circuits. [0007]In light of the above discussion, a need currently exists for a transceiver module that includes an electromagnetic interference containment structure for reducing electromagnetic interference radiated from the transceiver module. BRIEF SUMMARY OF SOME EXAMPLE EMBODIMENTS [0008]In general, embodiments of the invention are concerned with a transceiver module, such as a copper transceiver module, that utilizes an electromagnetic interference (EMI) containment structure for dealing with electromagnetic interference generated within the transceiver module. [0009]In one example embodiment, a transceiver module includes a housing, a printed circuit board disposed within the housing, and an EMI shield disposed about a portion of the printed circuit board. In this example embodiment, the housing is operative to be electrically connected to chassis ground. Also, the printed circuit board includes electronic circuitry and a plurality of differential signal lines. Further, the EMI shield includes a body having a slot, a plurality of fingers on at least one edge of the body, and tabs that are operative to connect the body to the printed circuit board. The slot of the EMI shield receives the portion of the printed circuit board such that the differential signal lines of the printed circuit board pass through the slot. The fingers of the EMI shield enable the body to maintain a biased contact with the housing. [0010]In another example embodiment, a transceiver module includes a housing, a connector structure at least partially disposed within the housing, a printed circuit board electrically connected to the connector structure and at least partially disposed within the housing, and an EMI shield disposed about a portion of the printed circuit board. In this example embodiment, the housing is at least partially formed from electrically conductive material and the printed circuit board including electronic circuitry and at least one differential signal line. Also, the EMI shield includes a body having a slot and a plurality of fingers on at least one edge of the body. A portion of the printed circuit board is disposed in the slot such that the at least one differential signal line of the printed circuit board passes through the slot. Further, the fingers enable the body to maintain a biased contact with the housing. [0011]These and other aspects of example embodiments of the present invention will become more fully apparent from the following description and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0012]To further clarify aspects of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are disclosed in the appended drawings. It is appreciated that these drawings depict only example embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which: [0013]FIG. 1 is a perspective view of one example embodiment of an assembled transceiver module; [0014]FIG. 2 is an exploded perspective view of the transceiver module of FIG. 1 including an example EMI shield and an example printed circuit board; [0015]FIG. 3A is a front perspective view of the EMI shield and printed circuit board of FIG. 2; [0016]FIG. 3B is a upside-down rear perspective view of the EMI shield of FIG. 2; [0017]FIG. 3C is an upside-down rear perspective view of an example alternative embodiment of the EMI shield of FIG. 2; and [0018]FIG. 4 is a schematic diagram of the function of the EMI shield shown in FIGS. 2 and 3. DETAILED DESCRIPTION OF SOME EXAMPLE EMBODIMENTS [0019]Example embodiments of the present invention relate to a transceiver module, such as a copper transceiver module, that utilizes an electromagnetic interference (EMI) containment structure for dealing with electromagnetic interference generated within the transceiver module. While described in the context of copper transceiver modules used in the field of communications networking, it will be appreciated that example embodiments of the present invention are applicable to other applications as well. For example, other types of transceiver modules, both electronic and opto-electronic, could utilize embodiments of the structure for providing EMI containment within the transceiver modules. Continue reading about Electromagnetic interference containment in a transceiver module... Full patent description for Electromagnetic interference containment in a transceiver module Brief Patent Description - Full Patent Description - Patent Application Claims Click on the above for other options relating to this Electromagnetic interference containment in a transceiver module patent application. ###  How KEYWORD MONITOR works... a FREE service from FreshPatents1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored. 3. Each week you receive an email with patent applications related to your keywords. Start now! - Receive info on patent apps like Electromagnetic interference containment in a transceiver module or other areas of interest. ### Previous Patent Application: Flat circuit board electrical connector Next Patent Application: Plug connection adapter Industry Class: Electrical connectors ### FreshPatents.com Support Thank you for viewing the Electromagnetic interference containment in a transceiver module patent info. 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