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02/21/08 | 20 views | #20080041728 | Prev - Next | USPTO Class 205 | About this Page  205 rss/xml feed  monitor keywords

Electrolytic looping for forming layering in the deposit of a coating

USPTO Application #: 20080041728
Title: Electrolytic looping for forming layering in the deposit of a coating
Abstract: A method for depositing a metal onto a substrate including the steps of providing a plating bath including ions of the metal, positioning the substrate in the plating bath, positioning at least one counter electrode in the plating bath, performing a first electrolytic process for a predetermined first period of time, performing a second electrolytic process for a predetermined second period of time and looping between the first and second electrolytic processes to form a coating of the metal on the substrate.
(end of abstract)
Agent: Thompson Hine L.L.P. Intellectual Property Group - Dayton, OH, US
Inventors: Paul Chalmer, John J. Fortman, Phillip O. Miller, Robert Renz
USPTO Applicaton #: 20080041728 - Class: 205283 (USPTO)


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Method and system for depositing alloy composition
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Aluminium electrowinning with enhanced electrolyte circulation
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Electrolysis: processes, compositions used therein, and methods of preparing the compositions

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