Electrolysis: processes, compositions used therein, and methods of preparing the compositions inventions 04/06

20060086614 - Reinforced and thickened mold insert and method of manufacturing the same: A reinforced and thickened mold insert and a method of manufacturing the same include the procedures of: first, providing an original mandrel that has an electroformed metal mold insert; next, forming a plurality of protrusive or indented coupling reinforced sections on the electroformed metal mold insert; finally forming a thickened...

20060086615 - Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts: A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an...

20060086616 - Plating apparatus and plating method: A plating apparatus can securely carry out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member...

20060086617 - Electrical-discharge surface-treatment method: An electrode for an electrical-discharge surface-treatment method is molded with a metallic powder or a metallic compound powder having an average grain diameter of 6 micrometers to 10 micrometers. A coat on a surface of a workpiece is formed with a material constituting the electrode or a substance that is...

20060086618 - Method and apparatus for forming interconnects: An interconnects-forming method can form a film of interconnect material, having a sufficient adhesion, by electroplating uniformly on an entire surface of a substrate and thus can form highly-reliable embedded interconnects even when the design rule is strict, and which can remove an extra interconnect material at a lower pressure....

20060086619 - Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment: A method of forming a conductive pattern having superior conductivity and better adhesion with a substrate is provided, thereby enabling a thick conductive pattern to be formed. The method comprises the steps of preparing a substrate, forming a metallic core containing metallic particles on the substrate by a droplet ejecting...

20060086620 - Textured decorative plating on plastic components: A relatively inexpensive process for making plastic components having textured chrome finishes that may have fine, crisp, clean lines and intricate details includes steps of electroplating a layer of etchable metal on a surface of a plastic article, typically preserving the surface of the etchable metal, etching a desired relief...

20060086621 - Electrochemical processing of solid materials in fused salt: The subject invention pertains to methods for processing a solid material (M1X) comprising a solid solution of a non-metal species (X) in a metal or semi-metal (M1) or a compound between the non-metal species and the metal or semi-metal is immersed in a molten salt (M2Y). A cathodic potential is...

20060086622 - Apparatus and method for electrolytic cleaning: Apparatus and methods that can be used to clean instruments by removing proteins from surgical instruments. The apparatus comprises an electrolytic device comprising an anode, a cathode, an electrolyte and a power supply, wherein the cathode is an instrument to be cleaned. The methods relate to the use of said...

20060086624 - Techniques to improve polyurethane membranes for implantable glucose sensors: The invention provides an implantable membrane for regulating the transport of analytes therethrough that includes a matrix including a first polymer; and a second polymer dispersed throughout the matrix, wherein the second polymer forms a network of microdomains which when hydrated are not observable using photomicroscopy at 400× magnification or...

20060086623 - Time-based integrated potentiostat: An integrated potentiostat includes a voltage controller that maintains within a predetermined range a potential between a reference electrode and a working electrode in an electrochemical cell. The integrated potentiostat further includes a capacitor that supplies or receives a current through the working electrode or reference electrode of the electrochemical...

20060086625 - Method and device for transporting or binding-specific separation of electrically charged molecules: Electrically charged molecules need to be transported in order to create a DNA sensor. The following measures are undertaken: base metals are introduced into a solution as a positive ion; negatively charged molecules are transported in an opposite direction and are enriched in the vicinity of the measuring electrodes. Binding-specific...

20060086626 - Nanostructure resonant tunneling with a gate voltage source: The invention provides an apparatus and method for sequencing and identifying a biopolymer. The invention provides a first nanostructure electrode, a second nanostructure electrode, a first gate electrode, a second gate electrode, a gate voltage source and a potential means. The gate electrodes may be ramped by a voltage source...

20060081475 - Reverse pulse plating composition and method: A composition and method for electroplating a metal on a substrate. The composition has a chloride to brightener concentration ratio of from 20:1 to 125:1. The method of electroplating, which employs the composition, employs pulse patterns that improve physical properties of metal surfaces....

20060081476 - Printed circuit board and method of manufacturing the same: A wiring pattern can be formed with a high density on a substrate as a highly reliable printed circuit board. A method of manufacturing a printed circuit board includes a step of forming a conductive layer, which is to be used as a plating power supplying layer, on a substrate,...

20060081477 - Method and apparatus for establishing additive differential on surfaces for preferential plating: A method and apparatus for establishing additive differential on surfaces for preferential plating of conductive material on the surface of a semiconductor wafer having surface portions and cavities on the surface. An additive is adsorbed on the surface in an auxiliary chamber. Conductive material is electrodeposited on the surface after...

20060081478 - Plating apparatus and plating method: A plating apparatus employs a dipping method with good gas-bubble releasability and, by regulating the flow of plating solution in a plating tank, can enhance the in-plane uniformity of a thickness of a plated film. The plating apparatus includes a plating tank for holding a plating solution, a plating solution...

20060081479 - Electrochemical miniaturization of organic micro-and nanostructures: The invention provides a simple and convenient strategy for reducing the dimensions of organic micro- and nanostructures on metal surfaces. By varying electrochemical desorption conditions, organic structures patterned by Dip-Pen Nanolithography or any of the micro-contact printing procedures can be gradually desorbed in a controlled fashion. The electrochemical desorption is...

20060081480 - Method for machining workpieces: A method for machining workpieces provides a machining electrode, which is guided at a specific distance to the workpiece. An electrolyte is provided between the workpiece and the machining electrode, through which an operating current flows between the machining electrode and the workpiece. The operating current results from an operating...

20060081481 - Electrode and method for electrochemically machining a workpiece: An electrode and method for the electrochemical machining of a workpiece is disclosed. The electrode is designed as a cathodically polarized tool electrode. It has a geometry that corresponds to the geometry to be removed from the workpiece, at least in a machining range, and perviousnesses in the electrode to...

20060076240 - Conversion circuit, system and method of executing an electrochemical process: A conversion circuit for converting an alternating current into a feed current for an electrochemical process is provided with at least one supply terminal for supplying an alternating feed current, a rectifier circuit for rectifying a supplied alternating feed current, and an output stage for supplying the rectified current to...

20060076241 - Device and method for electrolytically treating an at least superficially electrically conducting work piece: A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically...

20060076242 - Producing method of wired circuit board: A producing method of a wired circuit board that can prevent meandering of the elongate base material conveyed with the rolls and also prevent entry of air bubbles in between a light-transparency protecting film and a photosensitive solder resist layer when the light-transparency protecting film is laminated on the photosensitive...

20060076243 - Electrode foil for electrolytic capacitor and method for manufacturing the same: A manufacturing method including: forming a boehmite film on a roughened surface of an aluminum foil; forming a particulate gel of a valve metal oxide on the surface of the aluminum foil on which the boehmite film is formed; then carrying out heat treatment for forming particulate valve metal oxide;...

20060076244 - Barrier enhancement process for copper interconnects: A damascene process for introducing copper into metallization layers in microelectronic structures includes a step of forming an enhancement layer of a metal alloy, such as a copper alloy or Co—W—P, over the barrier layer, using PVD, CVD or electrochemical deposition prior to electrochemically depositing copper metallization. The enhancement layer...

20060076245 - Process for preparing a non-conductive substrate for electroplating: A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after des{acute over (m)}ear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies...

20060076246 - Water electrolysis method and device for determination of hydrogen and oxygen stable isotopic composition: Water electrolysis device determining stable isotopic composition of water and a water electrolysis method for stable isotopic composition of water capable of analyzing many samples easily, safely and at low cost in very short time, and rapidly analyzing 17O are provided. The water electrolysis device performing mass spectrometry of hydrogen...

20060076247 - Pickling or brightening/passivating solution and process for steel and stainless steel: The use of complex fluoride ions of elements of groups 4, 13, or 14 of the periodic table of the chemical elements (preferably selected from complex fluoride ions of the elements B, Si, Ti, and Zr) in concentrations from 30 t 500 millimoles per liter in process solutions for pickling...

20060076248 - Apparatus and method for producing electrolyzed water: An apparatus for producing electrolyzed water includes an electrochemical cell and a solution reservoir containing a solution and having an outlet. An injection pump has an input end in fluid communication with the outlet of the solution reservoir and an output end in fluid communication with the electrochemical cell, wherein...

20060076249 - Measuring device and measuring method for detecting analytes: A measuring device for the detection and determination of the concentration of at least one analyte in a liquid medium consists of a polymeric carrier having biologically active specific binding molecules dried on its upstream portion. A multiple electrode set consisting of at least one reference electrode and at least...

20060070881 - Aluminum support for planographic printing plate, its manufacturing process, and planographic printing plate material: Disclosed is an aluminum support for a planographic printing plate comprising an electrolytically surface-roughened aluminum plate, and a sulfuric acid anodization layer and a phosphoric acid anodization layer provided in that order on the surface-roughened surface of the surface-roughened aluminum plate, the sulfuric acid anodization layer having micro-pores with a...

20060070882 - Method and device for filling material separations on a surface: Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often influenced in a negative manner by high processing temperatures and dissimilar additives. The inventive method overcomes said disadvantage, taking...

20060070884 - Electrochemical processing apparatus and method: A processing apparatus electrochemically processes part of a first surface of a member having the first surface and a second surface. The processing apparatus includes a support which supports the member to expose the first surface, a first electrode which is arranged to oppose a first portion of the first...

20060070883 - Fixtureless vertical paddle electroplating cell: A submersible assembly for exposing respective front surfaces of different work-pieces to an electroplating bath as a partial respective electrodes thereof, while protecting opposing, rear surfaces of the work-pieces from the bath. The assembly includes a wall, having a front surface also partially forming a first electrode of the bath,...

20060070885 - Chip interconnect and packaging deposition methods and structures: The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed layer from a top...

20060070886 - Methods of removing sulfur from a fuel cell electrode: A method of optimizing a waveform of an electrical current applied to an electrode includes the steps of: applying an electrical current to an electrode of a device; determining a waveform of the voltage or the current of the electrical current; representing the waveform by a mathematical description such as...

20060070887 - Active matrix electrochemical machining apparatus and method: An apparatus and method of electrochemical machining utilizes a computer controlled static array of electrically insulated cathode sections to selectively and individually energize the electrodes for the purpose of shaping the surface of a part. The tightly clustered array of electrodes can be formed by individual wires as an example....

20060070888 - Electropolishing electrolyte and method for planarizing a metal layer using the same: The present electropolishing electrolyte comprises an acid solution and an alcohol additive having at least one hydroxy group, wherein the contact angle of the alcohol additive is smaller than the contact angle of the acid solution on a metal layer under electropolishing. The alcohol additive is selected methanol, ethanol and...

20060070890 - Gas concentration measurement method gas sensor: The gas sensor in accordance with one embodiment of the present invention is a gas sensor comprising: a solid electrolyte member; a sensing electrode provided on the solid electrolyte member and comprising at least one of a metal carbonate and a metal hydrogen carbonate; and a plurality of reference electrodes...

20060070889 - Reference electrode for potentiometric measurements, and method of monitoring the reference electrode: A reference electrode for potentiometric measurements has a housing (2) with a hollow space (4) containing a liquid reference electrolyte (6) as well as a conductor element (8) immersed in the reference electrolyte. In addition, the housing has a diaphragm (12) through which the reference electrolyte can be brought into...