| Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures -> Monitor Keywords |
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  Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structuresUSPTO Application #: 20080105558Title: Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added. (end of abstract) Agent: Microfabrica Inc. Att: Dennis R. Smalley - Van Nuys, CA, US Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Vacit Arat, Christopher A. Bang, John C. Dixon USPTO Applicaton #: 20080105558 - Class: 205170000 (USPTO) Related Patent Categories: Electrolysis: Processes, Compositions Used Therein, And Methods Of Preparing The Compositions, Electrolytic Coating (process, Composition And Method Of Preparing Composition), Forming Multiple Superposed Electrolytic Coatings
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