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Electrochemical processing apparatus and method of processing a semiconductor deviceUSPTO Application #: 20080029402Title: Electrochemical processing apparatus and method of processing a semiconductor device Abstract: An electrochemical processing apparatus is provided, in which a substrate and an anode placed in a chamber are partitioned into a cathode region including the substrate and an anode region including the anode by placing a multi-layered structure of a filtration film and a cation exchange film so that the filtration film is positioned on the substrate side. A plating solution containing additives is introduced into the cathode region, whereby a substrate is plated. (end of abstract)
Agent: Young & Thompson - Arlington, VA, US Inventors: Tetsuya Kurokawa, Koji Arita, Kaori Noda USPTO Applicaton #: 20080029402 - Class: 205157 (USPTO)
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