|Electricity: electrical systems and devices patents - Monitor Patents|
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Electricity: electrical systems and devicesBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/05/2015 > 64 patent applications in 50 patent subcategories.
20150036247 - Apparatus for a voltage protection tranceiver and device therewith: A voltage protection transceiver is introduced herein. The voltage protection transceiver includes a transmission element and a voltage-driven switch circuit. The voltage-driven switch circuit at least includes a sensing circuit and a protection switch. The voltage-driven switch circuit and the transmission element for transmitting input signals are separated from each... Agent: Industrial Technology Research Institute
20150036248 - Esd protection component and method for manufacturing esd protection component: An ESD suppressor is configured including first and second discharge electrodes arranged as separated from each other, and a discharge inducing portion kept in contact with the first and second discharge electrodes so as to connect mutually opposed portions of the first and second discharge electrodes to each other. The... Agent:
20150036249 - Protection circuit for power supply unit: A protection circuit is coupled between a power supply unit and a device. The protection circuit includes a delay circuit, a power circuit, a switch circuit, and a determining circuit. The power supply unit supplies power to the device through the power circuit when the device works normally. The delay... Agent:
20150036250 - Over-current and over-voltage protection circuit and method for an electronic cigarette: An over-current and over-voltage protection circuit for an electronic cigarette, comprising a battery and an interface, a control unit and a charging detection switch unit; the control unit is configured for calculating an actual charging current according to the first working voltage and determining whether the actual charging current exceeds... Agent:
20150036251 - Transmission circuit for ethernet: A transmission circuit including four transmission component sets for Ethernet is provided. For each of the transmission component sets, a first capacitor and a first inductor are cascaded, the first inductor is coupled to the Ethernet connector via the first transmission line (TL), the first capacitor is coupled to the... Agent: Nlightning Technology Ltd.
20150036252 - Semiconductor driving device and semiconductor device: A semiconductor driving device includes a negative surge detection circuit and a level shifter circuit. The negative surge detection circuit detects whether the negative surge occurs at a connection point between a P-side SW element and N-side SW element. The level shifter circuit maintains a driving voltage used in driving... Agent: Mitsubishi Electric Corporation
20150036253 - Lossless snubber circuit and operation method thereof: The present invention discloses a lossless snubber circuit and an operation method thereof. The lossless snubber circuit includes a first snubber circuit. The first snubber circuit includes a first diode (D7) and a capacitor (C3). The capacitance of the capacitor (C3) is big enough so that a voltage spike generated... Agent: Emerson Network Power Co., Ltd.
20150036254 - Modular power skid that can meet two or more different datacenter tier ratings: A method, apparatus, and system in which one or more instances of a same modular power skid are assembled with main and backup uninterruptible power supplies and multiple power distribution cabinets arranged in different electrical configurations and control sequences to meet two or more different datacenter tier ratings with a... Agent: Rosendin Electric, Inc.
20150036255 - Device for discharging an electrical overvoltage: The invention relates to a device (1) for discharging an electrical overvoltage, comprising an overvoltage discharge unit (10) having a non-linear current/voltage characteristic at least in sections, wherein a first terminal electrode (16) of the overvoltage discharge unit (10) is connected to a high-voltage terminal (18) of the device (1)... Agent:
20150036256 - Method for design of subsea electrical substation and power distribution system: A subsea electrical subsystem and a power distribution utilizing the same. The electrical substation located subsea is electrically connected to AC power provided by a power generator located topside. The electrical substation comprises a plurality of circuit breakers and a circuit breaker operating system associated with each circuit breaker. The... Agent:
20150036257 - Flexible displaying apparatus: A displaying apparatus includes a flexible substrate, at least one composite layer disposed on the flexible substrate, and an electronic device disposed on the composite layer. The composite layer includes a stack of an organic layer and an inorganic layer, and at least one of the inorganic layer and the... Agent:
20150036261 - Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus: A member 10 for a semiconductor manufacturing apparatus includes an AlN electrostatic chuck 20, a cooling plate 30, and a cooling plate-chuck bonding layer 40. The cooling plate 30 includes first to third substrates 31 to 33, a first metal bonding layer 34 between the first and second substrates 31... Agent:
20150036260 - Electrostatic carrier for thin substrate handling: Embodiments provided herein generally relate to an electrostatic chuck (ESC). The ESC may comprise a reduced number of stress initiation points, such as holes through the ESC, which may improve the mechanical integrity of the ESC. Electrodes disposed within the ESC may be connected to electrical contacts and a power... Agent:
20150036258 - Electrostatic clamp: An electrostatic clamp configured to, in use, hold an article, such as a reticle or a wafer in a lithographic apparatus. The clamp includes a lower portion; an upper portion formed of a dielectric material, and a plurality of electrodes disposed between the lower portion and the upper portion. The... Agent:
20150036259 - In-situ removable electrostatic chuck: Embodiments described herein generally relate to an electrostatic chuck (ESC). The ESC may contain a first plurality of electrodes adapted to electrostatically couple a substrate to the ESC and a second plurality of electrodes adapted to electrostatically couple the ESC to a substrate support. Instead of being integrally disposed within... Agent:
20150036262 - Multilayer ceramic electronic device: A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer 3 and a dielectric layer 2 are laminated alternatively, wherein the dielectric layer 2 is comprised of a dielectric ceramic composition including a main component represented by a general formula of ABO3 and a rare-earth component... Agent:
20150036263 - Multilayered ceramic capacitor with improved lead frame attachment: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a... Agent: Kemet Electronics Corporation
20150036264 - Multi-layer ceramic capacitor: A multi-layer ceramic capacitor where its dielectric layers are constituted by a sintered compact that contains a mol of ReO3/2, b mol of SiO2, c mol of MOx, d mol of ZrO2, and e mol of MgO (where Re is a rare earth element, M is a metal element (except... Agent:
20150036265 - Tantalum capacitor and method of manufacturing the same: There is provided a tantalum capacitor, including: a capacitor body including a tantalum powder and having a tantalum wire, a molding part formed to expose an end portion of the tantalum wire and enclose the capacitor body, an anode lead frame including an anode mounting part and an anode terminal... Agent: Samsung Electro-mechanics Co., Ltd.
20150036266 - Modular power skid assembled with different electrical cabinets and components mounted on the skid: An integrated platform assembled with different electrical cabinets and components mounted on a framework in order to provide a complete datacenter critical power distribution package. The integrated platform supports the weight of cabinet enclosures and UPSs mounted onto a skeletal framework, which acts as an equipment support structure and a... Agent: Rosendin Electric. Inc.
20150036267 - Meter socket adapter with integrated automatic transer switch: A transfer switch and load controller that can be plugged into an existing utility meter socket and electrically positioned between the meter socket and a distribution panel to allow switching between utility power and standby power. The plug-in transfer switch functions to transfer the power supplied to a home between... Agent: Briggs & Stratton Corporation
20150036268 - Electric junction block: An electric junction includes an insulated junction block including a passage therein for receiving a conductive insert having a plurality of passages for coupling wires from a utility meter socket with service wires. Several coupling mechanisms for coupling the junction block with the utility meter box provide improved and efficient... Agent:
20150036269 - Flexible display device: A flexible display device includes a flexible display panel, a first outer member disposed on a surface of the flexible display panel, and a first adhesive member attaching the first outer member to the flexible display panel. The first adhesive member includes an ultraviolet curable resin. A conversion rate of... Agent: Samsung Display Co., Ltd.
20150036270 - Rotary mechanism and electronic device thereof: A rotary mechanism includes a supporter and a bracket. The supporter includes a body, a pivot portion and a support portion. The body whereon the pivot portion is disposed is disposed on a base. The support portion includes a bar and a guiding structure. A low end of the bar... Agent: Wistron Corporation
20150036273 - Stacking detachable tablet: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes... Agent:
20150036274 - Input device layers and nesting: Input device layer and nesting techniques are described. In one or more implementations, an input device includes a pressure sensitive key assembly including a substrate having a plurality of hardware elements secured to a surface. The input device also includes one or more layers disposed proximal to the surface, the... Agent:
20150036275 - Instrument-activated sub-surface computer buttons and system and method incorporating same: The present technique provides an example computing system, including a tablet computing device including a display screen, and a keyboard including mounting bar that is rotatably coupled to the keyboard. The tablet computing device is releasably mountable to the mounting bar, and when the tablet computing device is mounted to... Agent:
20150036276 - Transparent conductive film, conductive element, composition, colored self-assembled material, input device, display device, and electronic instrument: A transparent conductive film includes a metal filler and a colored self-assembled material adsorbed to the surface of the metal filler. This transparent conductive film can prevent diffuse reflection of light on the surface of the metal filler.... Agent:
20150036277 - Information processing apparatus: There is provided an information processing apparatus including a case which is provided with an opening. Two or more functional units are allocated to the opening.... Agent:
20150036271 - Electronic device with electrical connection device: An electronic device is provided. The electronic device includes a bezel area disposed on an edge of a display area, a first component, a second component which is spaced apart from the first component, and an electrical connection device electrically connecting the first and second components, wherein the electrical connection... Agent:
20150036278 - Composite socket probing platform for a mobile memory interface: A method and apparatus for composite socket probing for a mobile memory interface. An embodiment provides an integrated circuit package that includes a memory supported by an interposer. The interposer is also removably coupled to a package controller through a first socket. A clamp operates to provide clamping force to... Agent:
20150036279 - Portable system configured to be deployed in a network: A portable system that includes a portable housing having a section for reception of portable wireless computing devices such as tablets, and components to provide recharging capability and information to the portable wireless devices.... Agent:
20150036280 - Centralized chassis architecture for half-width boards: The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling... Agent: Futurewei Technologies, Inc.
20150036281 - Positioning apparatus for expansion card: A positioning apparatus includes a computer chassis and a positioning device. The computer chassis secures a plurality of expansion cards and includes a cover. The cover comprises a first flange and a second flange opposite to the first flange. The positioning device includes a securing member and a positioning member... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.
20150036272 - Electronic device and substrate unit: An electronic device includes: substrate unit including a signal terminal provided over a first edge of a substrate body, and a power terminal provided over a second edge that is different from the first edge; and a case including an insertion unit into which the substrate unit is inserted from... Agent:
20150036282 - Support for a portable electronic device: A support includes a device-receiving groove for receiving a portable electronic device. A centre of gravity of the support being selected to bias the support to remain in a device-receiving position when no portable electronic device is received therein and bias the support to remain in an upright position when... Agent: Blackberry Limited
20150036283 - Adjustable docking stand and method of providing and using the same: A docking stand for an electronic device. The docking stand can include a bottom support surface configured to support a bottom side of the electronic device. The docking stand also can include a back support surface configured to support a side of the electronic device. The back support surface can... Agent:
20150036284 - Compute node cooling with air fed through backplane: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane.... Agent: Amazon Technologies, Inc.
20150036285 - Cover for electronic device and method for manufacturing the same: A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at... Agent:
20150036286 - Cover for electronic device and method for manufacturing the same: A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a display area of the electronic device. The non-transparent portion defines a non-display area of the electronic device beside the display area. The non-transparent portion includes a transparent... Agent:
20150036287 - System for compute node maintenance with continuous cooling: A computing system includes a chassis, one or more backplanes coupled to the chassis. Computing devices are coupled to the one or more backplanes. The one or more backplanes include backplane openings that allow air to pass from one side of the backplane to the other side of the backplane.... Agent: Amazon Technologies, Inc.
20150036288 - Valve controlled, node-level vapor condensation for two-phase heat sink(s): Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as... Agent:
20150036289 - Method for eliminating tilting of laptop devices: A base support structure eliminates tilting of laptops and similar user devices. The base support structure comprises at least one back foot and at least one front foot that is constructed using a first material bonded to a second material. The first material has at least one cavity and is... Agent: Dell Products L.p.
20150036290 - Information processing apparatus: There is provided an information processing apparatus including a first member and a second member which are connected by rotation mechanisms. The rotation mechanisms each have a compression spring which expands and contracts along an axial direction of a rotation shaft serving as a center of a rotation, a cam... Agent:
20150036291 - Protective case with heat dissipation structure for electronic products: A protective case with multiple air tunnels for the protective case, so the heat absorbed by contact blocks from the electronic equipment is radiated rapidly out of the protective case through vent pipes. When the electronic equipment is supported up to watch movie or play games, because the hot air... Agent:
20150036292 - Electrical device for use in an automotive vehicle and method for cooling same: An electrical device is described for use in an automotive vehicle. The device includes a printed circuit board (PCB) having first and second sides. The PCB is adapted for multiple electronic components to be mounted to the first side, including a first component at a first position and a second... Agent: Lear Corporation
20150036293 - Energy saving system and method for cooling computer data center and telecom equipment: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision 5 of one or more partitions to reduce the volume of the cooled environment supplying coldest possible... Agent:
20150036294 - Sealed battery charger housing: A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used to facilitate charging a high voltage vehicle battery with AC energy provided from a utility power grid. The housing may... Agent:
20150036295 - Electronic device and method for manufacturing housing for same: An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole... Agent:
20150036296 - Emi compartment shielding structure and fabricating method thereof: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is... Agent: Universal Scientific Industrial (shanghai) Co., Ltd.
20150036297 - Electronic module and method of making the same: A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the... Agent:
20150036298 - Transparent conductor and optical display apparatus comprising the same: A transparent conductor includes a base layer, and a transparent conductive film on one or both sides of the base layer, the transparent conductive film including a metal nanowire, where the base layer includes a retardation film. An optical display apparatus includes the transparent conductor. The transparent conductor may compensate... Agent:
20150036301 - Display device: Provided is a display device capable of preventing, in a case where a flexible printed circuit board is bent to be fixed to a support portion of the display device, a troublesome phenomenon due to a force generated in the flexible printed circuit board by recovery from deformation, that is,... Agent:
20150036300 - Display device and method of manufacturing the same: Discussed is a display device and a method of manufacturing the display device. The display device according to one example includes a display panel including a first substrate and a second substrate facing and coupled to the first substrate, wherein the first substrate includes a display part in which a... Agent:
20150036299 - Flexible display device: A flexible display device that can suppress spread of cracks of an inorganic layer is provided. A flexible display device includes a flexible substrate including a display area and a periphery surrounding the display area, an inorganic layer formed on the flexible substrate, a display unit formed on the display... Agent:
20150036303 - High-frequency signal transmission line and electronic device: A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line... Agent:
20150036302 - Long-term packaging for the protection of implant electronics: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation... Agent: California Institute Of Technology
20150036304 - Electronic device: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device... Agent: Taiyo Yuden Co., Ltd.
20150036305 - Electronic component built-in multi-layer wiring board and method of manufacturing the same: An electronic component built-in multi-layer wiring board that comprises collectively stacked therein a plurality of first printed wiring boards by thermal compression bonding, and that comprises an electronic component package built in thereto, wherein the electronic component package comprises a first electronic component built in thereto and a plurality of... Agent: Fujikura Ltd.
20150036306 - Rdl system in package: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic... Agent:
20150036307 - Circuit board: A circuit board is described. The circuit board comprises a substrate (4), a set of contact pads (6) supported on the substrate and a plurality of discrete adhesive conductive regions disposed on the contact pads and the substrate such that at some adhesive conductive regions are disposed on and between... Agent: Novalia Ltd.
20150036308 - Magnetic core inductor integrated with multilevel wiring network: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire... Agent:
20150036309 - Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the... Agent: Stmicroelectronics (grenoble 2) Sas
20150036310 - Pressure relief system for switchgear: A compartment of an arc resistant enclosure for an electrical component includes a plurality of wall structures defining an interior space for housing an electrical component. One of the wall structures has aperture structure for permitting pressure and gases to flow there-from and vent from the compartment. A stop structure... Agent: Abb Technology Ag01/29/2015 > 75 patent applications in 54 patent subcategories.
20150029617 - Passive resonance dc circuit breaker: A DC circuit breaker including a pair of arcing contact members for holding an arc, an interaction element, adapted for interacting with the arc in dependence of whether the arc is in a first or second state such that the arc voltage drop in the first state is lower than... Agent:
20150029618 - Non-transformer isolated dc-dc power supply including shut down circuit: A direct current-to-direct current (DC-DC) power supply includes a voltage converter module that converts an input voltage having a first voltage level into an output voltage having a second voltage level that is less than the first voltage level. An over-voltage detection module receives the second voltage and generates an... Agent: Hamilton Sundstrand Corporation
20150029619 - Power supply control device: A power supply control device includes an inverter having plural switching elements, an inverter controller that controls the inverter, a device power supply that generates a first power supplied to the inverter controller, a detector that detects whether there is an abnormality relating to the compressor, and a power supply... Agent:
20150029620 - System and method for controlling the power supply of an electric machine on the basis of the temperature thereof: A control system for controlling power supply of an electric machine of an automobile and which contributes to movement thereof, wherein the control system is connected, at an input thereof, to a mechanism estimating a temperature of a rotor of the electric machine and to a temperature sensor measuring a... Agent: Renault S.a.s.
20150029621 - Arrangement for controlling the electric power transmission in a hvdc power transmission system: An arrangement for controlling the electric power transmission in a high voltage direct current, HVDC, power transmission system includes at least one HVDC transmission or distribution line for carrying direct current, DC, and the arrangement includes an apparatus connectable to the HVDC transmission or distribution line, the apparatus being arranged... Agent: Abb Technology Ltd
20150029623 - Common mode filter: Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member... Agent: Samsung Electro-mechanics Co., Ltd.
20150029622 - Electrostatic discharge protection: A semiconductor device is disclosed that includes a first well of a first conductivity type, a second well of a second conductivity type, a plurality of first regions, a second region and a plurality of electrodes. The first regions are of the first conductivity type and are formed in the... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20150029625 - Hazardous area coupler device for high frequency signals: A hazardous area coupler is provided which uses arrays of diodes to permit low voltage alternating current signals to pass through while shunting to ground any voltages greater than the clamping voltage of the diodes.... Agent:
20150029624 - Protection circuit and protection apparatus including the same: A protection circuit includes a high voltage detection unit configured to activate a high voltage detection signal where a first voltage exceeds a predetermined voltage; and a discharge unit coupled with the first voltage in response to the high voltage detection signal, and configured to discharge the first voltage to... Agent: Sk Hynix Inc.
20150029626 - Controller area network node transceiver: An electronic device comprises a control module, a transceiving module, a first isolator, and a second isolator. The control module is configured to generate a control signal in response to a signal from an MCU. The transceiving module comprises a transceiving unit, which further comprises a first switch and a... Agent: Myson Century, Inc.
20150029628 - Low current protection circuit: A low current protection circuit is configured to detect a lowering of a load current flowing a load to perform a low current protection operation and includes: a load current detection configured to detect a load current; a low current detection configured to detect a lowering of the load current... Agent: Sanken Electric Co., Ltd.
20150029627 - Semiconductor device including a control circuit: A semiconductor device includes a semiconductor portion with a main FET and a control circuit. The main FET includes a gate electrode to control a current flow through a body zone between a source zone and a drift zone. The control circuit receives a local drift zone potential of the... Agent:
20150029629 - Protector for electricity supply circuit: A protector for an electricity supply circuit includes: a power switch for switching between connection and disconnection of the electricity supply circuit; a controller configured to output a switching command signal to the power switch in accordance with an input signal; and a current detector for detecting current flowing to... Agent: Yazaki Corporation
20150029631 - Protector for electricity supply circuit: A protector for an electricity supply circuit includes: a power switch capable to switch between connection and disconnection of the electricity supply circuit; a controller configured to output a switching command signal to the power switch in accordance with an input signal; and a current detector for detecting current flowing... Agent: Yazaki Corporation
20150029630 - Ptc device: The present invention provides a PTC device having a laminate which includes a PTC component having a laminar PTC element defined by main surfaces which are facing each other, laminar electrodes extending on the main surfaces, and a first insulation layer, the PTC component, and a second insulation layer laminated... Agent: Tyco Electronics Japan G.k.
20150029632 - Auto-triggered methods and systems for protecting against direct and indirect electronic attack: Methods and systems for preventing direct and indirect electronic attacks, cyber attacks, and/or minimizing the impact of high voltage pulses are disclosed. In an aspect, an example system can comprise an electromagnetic plasma disrupter device. The electromagnetic plasma disrupter device can comprise a gas pressurized enclosure such a waveguide, grounded... Agent:
20150029633 - Miniature breaker having short circuit self-locking function and miniature breaker having position state detecting function: Both a miniature circuit breaker with short-circuit self-locking function and a miniature circuit breaker with position state detection function include: a first miniature circuit and a miniature circuit breaker operation output device. A motor, an action unit and a control unit are located within the casing of the miniature circuit... Agent:
20150029634 - Network signal processing circuit: A network signal processing circuit includes at least one transmission line and at least two transient voltage suppressors. The transmission line has a first connection end and a second connection end. Each of the transient voltage suppressors is connected between a grounding point and a node on the transmission line.... Agent: Lotes Co., Ltd
20150029635 - Low cost electrical stamp: A low cost electrical stamp is provided in the present invention. The low cost electrical stamp includes a magnetic cylinder matrix, a print circuit board (PCB), a control circuit and an interface circuit. The magnetic cylinder matrix includes a plurality of magnetic cylinders. The PCB includes a plurality of electromagnets... Agent: Generalplus Technology Inc.
20150029636 - Connection structure of electronic device: A connection structure of an electronic device includes a circuit board, a plurality of conductive contact pads and a conductive pattern. The conductive contact pads and the conductive pattern are disposed on the circuit board. The conductive contact pads are electrically insulated from one another. The conductive pattern is electrically... Agent:
20150029637 - Dielectric composition for low-temperature sintering, multilayer ceramic electronic component including the same, and method of manufacturing multilayer ceramic electronic component: There is provided a dielectric composition for low-temperature sintering including BaTiO3 as a main ingredient, and xB2O3-(1-x)BaOas an accessory ingredient, wherein x ranges from 0.25 to 0.8, and the content of the accessory ingredient ranges from 0.1 to 2.00 mol %, based on 100 mol % of the main ingredient.... Agent:
20150029638 - Polyimides as dielectrics: Polyimides derived from a primary aromatic diamine and aromatic dianhydride mono-mer moieties, wherein one or more of said moieties contain at least one substituent on the aromatic ring selected from propyl and butyl, especially from isopropyl, isobutyl, tert.butyl, show good solubility and are well suitable as dielectric material in electronic... Agent: Basf Se
20150029640 - Electrolyte solution for electric double layer capacitors, and electric double layer capacitor: An electrolytic solution for electric double layer capacitors includes an organic solvent and quaternary ammonium salt dissolved in the organic solvent. The organic solvent consists of sulfolane and chain sulfone. The quaternary ammonium salt is at least one of diethyl dimethyl ammonium salt and ethyl trimethyl ammonium salt.... Agent:
20150029639 - Methods and apparatus related to a purge valve for a capacitor: In some embodiments, an apparatus includes a housing and a purge valve. The housing defines a cavity and a lumen extending from a volume of the cavity to a volume outside the cavity. The purge valve is disposed within the lumen and includes an occlusion member. A portion of the... Agent: Loxus, Inc.
20150029641 - Composition and method for forming electroactive polymer solution or coating comprising conjugated heteroaromatic polymer, electroactive polymer solution, capacitor and antistatic object comprising the electroactive coating, and solid electrolytic capacit: wherein X is selected from S, O, Se, Te, PR2 and NR2, Y is hydrogen (H) or a precursor of a good leaving group Y− whose conjugate acid (HY) has a pKa of less than 30, Z is hydrogen (H), silyl, or a good leaving group whose conjugate acid (HY)... Agent:
20150029642 - Conductive polymer composition with a dual crosslinker system for capacitors: A capacitor with improved electronic properties is described. The capacitor has an anode, a dielectric on said anode and a cathode on the dielectric. The cathode has a conductive polymer defined as —(CR1R2CR3R4—)x— wherein at least one of R1, R2, R3 or R4 comprises a group selected from thiophene, pyrrole... Agent: Kemet Electronics Corporation
20150029643 - Enclosure power distribution architectures: Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented... Agent:
20150029645 - Key button and method of manufacturing the same: A key button and a method of manufacturing the same are provided. The key button includes an upper surface, a side surface formed at a certain height along a border of the upper surface, and at least two worked surfaces formed to have a certain slope in a boundary portion... Agent: Samsung Electronics Co., Ltd.
20150029644 - Rf transparent woven material for a wearable device: An electronic device wirelessly connected to one or more portal devices for sensing user activities is provided. The electronic device includes an injected molded housing assembled with RF transparent woven material to be worn by the user and plurality of sensors positioned inside the housing for sensing activities of the... Agent:
20150029646 - Cable tidying device and electronic device with cable tidying device: A tidying device to facilitate the securing of a cable to a tidying slot of an enclosure includes a controller and a gripping module mounted to the controller. A gap is defined for receiving the cable. A pressing module is slidably mounted to the controller. An end of the cable... Agent:
20150029650 - Bag computer system and bag apparatus: Disclosed is a system comprised of a bag and computer combination which allows the bag wearer to quickly access and use a computer while mobile. The system can be in three forms and all three are used in the same way: a pivoting cover is moved out of the way... Agent:
20150029651 - Tablet computer overlay membrane: A tablet computer device comprises a overlay membrane detachably couplable to the tablet computer device to protect a display element of the tablet computer device, the overlay membrane having an integrated keyboard.... Agent:
20150029652 - Foldable display: A foldable display is disclosed. In one aspect, the foldable display includes a base substrate including a flexible area and a rigid area disposed at one or more sides of the flexible area. The foldable display also includes an image display device provided on the base substrate. The base substrate... Agent: Samsung Display Co., Ltd.
20150029653 - Tablet computer overlay membrane: A tablet computer device comprises a overlay membrane detachably couplable to the tablet computer device to protect a display element of the tablet computer device, the overlay membrane having an integrated keyboard.... Agent:
20150029649 - Display device and operation device: There is provided a display device including a main body in which a display section is formed on a front surface side, and an operation body in which an operation section is formed and which is provided on a rear surface side of the main body. The main body and... Agent:
20150029647 - Electronic device: An electronic device includes a frame and a display screen. The frame includes a receiving chamber. The receiving chamber has a slot and a first data connecting portion. The display screen is received in the receiving chamber and removable from the receiving chamber. The display screen includes a display surface,... Agent: Hon Hai Precision Industry Co., Ltd.
20150029648 - Window panel, manufacturing method thereof, and display apparatus including the window panel: A window panel includes an adhesion-base layer having first and second surfaces opposite to each other and including a thermoplastic polymer, a first film on the first surface and including a first plastic layer and a first surface hardness layer on the first plastic layer, and a second film on... Agent: Samsung Display Co., Ltd.
20150029654 - Server and carring structure thereof: A server includes a motherboard module, a storage device and a carrying structure. The motherboard module includes a motherboard and a CPU disposed on the motherboard. The storage device has two fastening portions opposite to each other. The carrying structure includes a carrier, two fastening members and a handle. The... Agent: Inventec (pudong) Technology Corporation
20150029655 - Rugged hard drive: According to an embodiment of the disclosure, an apparatus includes a sleeve configured to surround a hard drive. The sleeve includes a side portion, a bottom portion, a top portion, a front portion, and a back portion. At least one of the side portion, the bottom portion, the top portion,... Agent: Raytheon Company
20150029656 - Mounting apparatus for data storage device: A mounting apparatus for securing a data storage device includes a mounting tray, which includes a bottom wall, two sidewalls perpendicularly extending from the bottom wall, a positioning protrusion extending from the bottom wall, and a latching protrusion extending from each sidewall. The latching protrusions are configured for being received... Agent: Hon Hai Precision Industry Co., Ltd.
20150029657 - Docking station: A docking station for a portable electronic device is provided. The docking station includes a main body, a supporting structure and a pivot. The pivot includes a first fixing portion, a second fixing portion and a pivot portion. The first fixing portion is disposed at the supporting structure, the second... Agent:
20150029658 - System for cooling an integrated circuit within a computing device: One variation of a system for cooling an electrical component within a computing device—including a digital display—includes: an internal heatsink thermally coupled to the integrated circuit and defining a fluid passage including a first end and a second end; a heat exchange layer arranged across a viewing surface of the... Agent: Tactus Technology, Inc.
20150029659 - Deflection device and electronic device having the same: A deflection device and an electronic device are disclosed. The deflection device is located in the electronic device for guiding airflow generated by a fan device to at least one electronic component. The deflection device includes a first fixed part and a plurality of strip structures. The first fixed part... Agent: Wistron Corporation
20150029660 - Configurable heat conducting path for portable electronic device: A portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat removers selectively thermal contact to at least one wall of an enclosure of the portable electronic device depended on the configuration of the portable... Agent: Aztrong Inc.
20150029661 - Wearable portable electronic device with heat conducting path: A wearable portable electronic device includes at least one energy module which further included thermoelectric materials which may convert heat to electric power. A plurality of heat spreader thermally and electronically contact to at least one wall of an enclosure of the wearable portable electronic device by using graphene layer.... Agent: Aztrong Inc.
20150029662 - Programmable controller component with assembly alignment features: A programmable logic controller (PLC) assembly includes a bottom housing with a base, a first plurality of elongate alignment features extending from the bottom housing transverse to the base, and a first connection feature. The PLC assembly includes a central processing unit with a circuit board and at least two... Agent:
20150029663 - Electric power converter: The electric power converter has a transformer having a primary coil and a secondary coil, a first circuit section connected to the primary coil side of the transformer, a second circuit section connected to the secondary coil side of the transformer, and a case that accommodates the transformer, the first... Agent:
20150029664 - Fan anti-corrosion structure: A fan anti-corrosion structure includes a base seat, a circuit board and at least one coating unit. The base seat has a sidewall and a bearing cup. A rest face extends from the sidewall toward the bearing cup. The circuit board is fitted around the bearing cup and disposed on... Agent: Asia Vital Components Co., Ltd.
20150029665 - Cooling fluid flow passage matrix for electronics cooling: A cooling supply package for an electronic component has a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer... Agent: Hamilton Sundstrand Corporation
20150029666 - Power conversion apparatus: Disclosed is a downsized an integrated power-converter apparatus in which a plurality of power converter apparatuses is integrated, and to shorten a wiring connection distance in the power converter apparatus. The power-converter apparatus includes a power semiconductor module, a DC-to-DC converter, a capacitor module, a flow-path forming body for forming... Agent: Hitachi Automotive Systems, Ltd
20150029667 - Receptacle assembly for receiving a pluggable module: A receptacle assembly includes a cage having an interior cavity and a divider that divides the interior cavity into first and second ports. The cage has a front end that is open to the first and second ports, which are configured to receive first and second pluggable modules, respectively, therein... Agent: Tyco Electronics Corporation
20150029668 - Clamping structure for power electronic components: A clamping structure, including a base defined by a height, the base including a first end and a second end, wherein the first end and the second end are on opposite sides of one another; a first end wall situated on the first end of the base and a second... Agent:
20150029669 - Control device and method for producing a control device for a motor vehicle: A control device includes a first circuit carrier with electrical components that are electrically conductively connected to one another and a second circuit carrier with electrical components that are electrically conductively connected to one another. The first circuit carrier and the second circuit carrier are electrically conductively connected to one... Agent: Robert Bosch Gmbh
20150029670 - Sn-cu-based lead-free solder alloy: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass % of Cu and 0.01 to 0.1 mass % of Al are contained, 0.02 to 0.1 mass % of... Agent:
20150029671 - Electric device: An electric device having a printed circuit board fitted with components, and at least one foam component, the foam component surrounding the circuit board at least partially so as to form a housing.... Agent: Sew-eurodrive Gmbh & Co. Kg
20150029672 - Power conversion apparatus: Provided is a power conversion apparatus, including: a power module; a base section including a cooler; a second substrate; a first bus bar; a second bus bar; a smoothing capacitor; and a first substrate. The power module is placed on an upper surface of the base section. The first bus... Agent: Nissan Motor Co., Ltd.
20150029673 - Electronic element and electronic device: An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the... Agent:
20150029674 - Printed circuit board set having high-efficiency heat dissipation: A printed circuit board set having high-efficiency heat dissipation includes a printed circuit board (PCB) and a heat dissipating device. The PCB has multiple electronic elements, at least one heat dissipating hole, and at least one thermally conductive material. The electronic elements are disposed on the top surface of the... Agent:
20150029675 - Cable backplane system having locking assemblies: A cable backplane system includes a backplane having a plurality of openings and mounting blocks proximate the openings. A cable rack is coupled to a rear of the backplane that includes a tray, spacers coupled to the tray and cable connector assemblies held by corresponding spacers. Each cable connector assembly... Agent: Tyco Electronics Corporation
20150029676 - Cable backplane system having a cable tray guide and support system: A cable backplane system includes a backplane and a chassis supporting the backplane. A cable rack is coupled to the chassis and backplane. The cable rack includes upper trays and lower trays each having a frame and cable connector assemblies held by the corresponding frame. The upper trays have upper... Agent: Tyco Electronics Corporation
20150029677 - Multilayer wiring substrate, method of producing the same, and semiconductor product: There is provided a multilayer wiring substrate, including: a trench produced at one surface of an insulation layer, the trench having a depth shallower than a thickness of the insulation layer; and a copper plating applied to the trench. Also, there are provided a method of producing the multilayer wiring... Agent:
20150029679 - Circuit board, production method of circuit board, and electronic equipment: A method for producing circuit board, including: adhering plastic deformable insulating material onto surface of laminate, which contains second-metal-layer of second metal, and first-metal-layer in pattern on second-metal-layer, and the surface of the laminate is surface of second-metal-layer where first-metal-layer is formed, and surface of first-metal-layer, followed by curing the... Agent:
20150029682 - Electronic control unit: Proposed is a C/U that is designed to accomplish the above object. The CU includes a multilayer circuit substrate, a resin cover, and a metal base. Electronic parts are mounted on both surfaces of the multilayer circuit substrate which is covered with the resin cover and the metal base. The... Agent: Hitachi Automotive Systems, Ltd.
20150029681 - Flexible composite, production thereof and use thereof: A flexible composite comprising a plastic foil, having an upper and a lower surface, and at least one dielectric barrier layer against gases and liquids which is applied directly to at least one of the surfaces by plasma-enhanced thermal vapor deposition and comprises an inorganic vapor-depositable material, is provided. The... Agent: Evonik Industries Ag
20150029680 - Mounting structure, electro-optical apparatus, and electronic apparatus: A mounting structure in which a plurality of substrates are electrically connected to each other includes a first substrate having a first alignment mark formed by partially cutting away a first terminal, and a second substrate having a second alignment mark formed by partially cutting away a second terminal. The... Agent:
20150029678 - Substrateless device and the method to fabricate thereof: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are... Agent: Cyntec Co., Ltd.
20150029684 - Flat panel display apparatus and method for manufacturing the same: A flat panel display apparatus for reducing a bezel size and a method for manufacturing the same. The flat panel display apparatus includes a lower substrate having a display area and a peripheral area surrounding the display area, an upper substrate corresponding to the lower substrate, a sealing member disposed... Agent: Samsung Display Co., Ltd.
20150029683 - Foldable display apparatus and method of manufacturing the same: A display apparatus includes a flexible substrate, first pixels, and second pixels. The flexible substrate includes: a first area at least partially bent about an axis; and at least one non-bent area. The first pixels are disposed in the first area. The second pixels are disposed in the at least... Agent: Samsung Display Co., Ltd.
20150029685 - Penetration and assembly structure for flexible circuit board with hinge assembly: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the... Agent: Advanced Flexible Circuits Co., Ltd.
20150029686 - Electrical junction box: An electrical junction box includes a case including a bottom plate portion and case-side peripheral wall portion extending from a peripheral edge of the bottom plate portion, the case having an opening that opens to a lateral side, a circuit structure is accommodated in the case, and a cover closes... Agent:
20150029687 - Device for attenuating propagation and reception of electromagnetic interference for a pcb-chassis structure: A first substantially annular conductive material has a first central opening, the first central opening is sufficient to substantially surround a fastener and maintain an electrical connection between the printed circuit board and the chassis. A second substantially annular conductive material is concentric with the first conductive material and the... Agent: International Business Machines Corporation
20150029688 - Display device: Provided is a display device that is exceptionally easy to assemble. A display device includes an electroconductive housing. A case body accommodates the display device. A connecting member causes electrification between the housing of the display device and a grounding part of a circuit substrate. The connecting member has a... Agent:
20150029689 - Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method: A bump structure provided on an electrode pad includes a solder member, and a metal layer having a cylindrical portion covering a side surface of the solder member, the metal layer being made of a metal which is higher in melting point than the solder member. An upper part of... Agent:
20150029690 - Functional device, electronic apparatus, and moving object: A functional device includes a fixed electrode portion including a first fixed electrode portion and a second fixed electrode portion, a first wiring portion connected to the first fixed electrode portion, and a second wiring portion connected to the second fixed electrode portion. At least one of the first wiring... Agent:
20150029691 - Device housing for receiving display module and manufacturing method: A device housing includes a housing body, a support plate, a buffer frame, and a display module. The housing body defines a receiving opening and forms an inner peripheral wall. The housing body is formed around a peripheral wall of the support plate for covering one side of the receiving... Agent: Fih (hong Kong) Limited01/22/2015 > 72 patent applications in 46 patent subcategories.
20150022920 - Chip with electrostatic discharge protection function: A chip with electrostatic discharge protection function includes two power rails, a pin, a P-type FinFET, an N-type FinFET, two Fin-resistors, two diodes and an ESD unit. The pin is electrically connected to one power rail sequentially through one Fin-resistor and the P-type FinFET and electrically connected to the other... Agent:
20150022922 - Power supply circuit for power control chips: A power supply circuit for power control chips includes a voltage control circuit, a voltage output circuit and a feedback protect circuit. The voltage control circuit receives a first DC voltage, and outputs a voltage driving signal according to the first DC voltage. The voltage output circuit receives the voltage... Agent: Hon Hai Precision Industry Co., Ltd.
20150022921 - Semiconductor structure for enhanced esd protection: A semiconductor structure for enhanced ESD protection is disclosed. The semiconductor structure includes a plurality of fingers, wherein each finger of the plurality of fingers includes a plurality of voltage clamps, and each voltage clamp of the plurality of voltage clamps includes at least a first well having a first... Agent: Intersil Americas LLC
20150022923 - Driver current control apparatus and methods: Apparatus and methods disclosed herein implement steady-state and fast transient electronic current limiting through power transistors, including power transistors used as pass elements associated with general purpose drivers. Embodiments herein prevent excessive steady-state current flow through one or more driver pass elements and/or through load elements in series with the... Agent:
20150022924 - Circuitry and method for monitoring a power supply of an electronic device: The disclosure relates to a circuitry including a first contact connected to a power supply, a first compare unit connected to the first contact and to a first reference signal, wherein the first compare unit is configured to compare a voltage at the first contact with the first reference signal... Agent:
20150022925 - Electronic module, electronic arrangement and method for producing an electronic module: An electronic module (100) has a first and a second circuit (200, 300) with respective first and second output connections (230, 330), respective first and second reference potential connections (220, 320), and respective first and second sensing connections (240, 340), each circuit (200, 300) comprising a respective sensing block (250,... Agent: Ams Ag
20150022926 - Method and circuitry for battery protection: There is disclosed a method comprising providing a first signal to an apparatus comprising a protection circuit and an output for providing electric power. The protection circuit comprises at least an overdischarge detection element and a discharging control output. The first signal is used to change a voltage level at... Agent:
20150022928 - Hybrid dc circuit breaking device: A dc breaker is connected in a main current path between a first dc circuit and a second dc circuit. The dc breaker has a primary current path connected to the main current path. A mechanical interrupter switch and an electronic breaker switch are connected in series in the primary... Agent:
20150022927 - Protection circuit for fan: A fan with a protection circuit includes a connector, a fan operation circuit, and a protection circuit. The protection circuit includes a first resistor, a controller, and an electronic switch. The controller controls the electronic switch to be turned off when a current flowing through the first resistor is greater... Agent:
20150022929 - Over-current protection device: An over-current protection apparatus applied to a secondary battery comprises a lead frame, an IC and a PTC device. The lead frame has a carrier portion and two end portions bending therefrom to form an accommodating space. The two end portions electrically connect to positive and negative electrodes of the... Agent: Polytronics Technology Corp.
20150022930 - Protection device for electricity supply circuit: When a power switch is turned off, a protection device for an electricity supply circuit starts keeping time using a timer and turns on a disconnection flag. Then the protection device turns off the disconnection flag when the timer has counted a predetermined time. When the power switch is turned... Agent:
20150022931 - Overcurrent protection apparatus: An overcurrent protection apparatus that is connectable to a battery control unit to protect the battery control unit from an overcurrent. The overcurrent protection apparatus includes a fuse member that is provided with a fuse and a fusible wire that is connected in series to the fuse. The fusible wire... Agent:
20150022932 - Fault-tolerant self-indicating surge protection system for aircraft: A fault-tolerant self-indicating surge protector system and methods are presented. An unwanted surge of electrical energy induced by a lightning strike is directed away from a sensitive electrical or electronic component, and the unwanted surge of electrical energy is directed through series connected pairs of varistors. A voltage signal is... Agent: The Boeing Company
20150022933 - Device for controling electrically actuable valves in different operating modes: A device for controlling an electrically actuable valve having a valve coil, including a main switch, situated in the current circuit of the valve coil, for adjusting the current flowing through the valve coil, and a freewheeling path, which has a freewheeling diode and is switched in parallel with the... Agent:
20150022934 - Switching device for air purifier: The switching device for an air purifier contains a circuit board, a timing and switching module, a manual switch, a fan module, a positive and negative ion production module, and a negative ion production module. The timing and switching module is configured on the circuit board, and the fan module... Agent: Tsung Shin International Co., Ltd.
20150022936 - Electrostatic chuck for high temperature process applications: Embodiments of the present invention provide a substrate support assembly including an electrostatic chuck with enhanced heat resistance. In one embodiment, an electrostatic chuck includes a support base, an electrode assembly having interleaved electrode fingers formed therein, and an encapsulating member disposed on the electrode assembly, wherein the encapsulating member... Agent:
20150022935 - End effector for transferring a substrate: Embodiments of the present invention provide an end effector capable of generating an electrostatic chucking force to chuck a substrate disposed therein without damaging the substrate. In one embodiment, an end effector for a robot, the end effector includes a body having an electrostatic chucking force generating assembly, and a... Agent:
20150022937 - Composite electronic component and board having the same: A composite electronic component may include: a composite element in which a capacitor and an inductor are spaced apart from each other, the capacitor including a ceramic body, and the inductor including a magnetic body; a first external electrode disposed on a second end surface of the ceramic body, second... Agent:
20150022938 - Chip capacitor and method for manufacturing the same: [Theme] To provide a chip capacitor capable of easily and rapidly accommodating a plurality of types of capacitance values using a common design and a method for manufacturing the chip capacitor. [Solution] A chip capacitor 1 includes a substrate 2, a first external electrode 3, a second external electrode 4,... Agent: Rohm Co., Ltd.
20150022939 - Capacitor and method of fabricating the same: Disclosed are a capacitor and a method of fabricating the same. The capacitor includes a first electrode; a second electrode spaced apart from the first electrode while facing the first electrode; a driving member connected to the second electrode to move the second electrode relative to the first electrode; and... Agent:
20150022947 - Capacitors for high voltage charge and high current discharge rates: A capacitor including: a first conductive plate; a second conductive pate arranged parallel to the first conductive plate to define a spacing between a surface of the first conductive plate and an opposing surface of the second conductive plate; a dielectric material disposed in the plate; and a capacitor lead... Agent: Omnitek Partners LLC
20150022940 - Conductive paste composition for external electrode and multilayer ceramic electronic component including the same: There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the... Agent: Samsung Electro-mechanics Co., Ltd.
20150022942 - Multilayer ceramic capacitor and method of manufacturing the same: A multilayer ceramic capacitor includes a ceramic body; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body with a dielectric layer interposed therebetween; upper and lower cover layers formed on upper and lower surfaces of the active... Agent: Samsung Electro-mechanics Co., Ltd.
20150022946 - Multilayer ceramic capacitor and method of manufacturing the same: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers laminated in a width direction, first and second external electrodes formed on the first main surface of the ceramic body to be spaced apart from each other, third and fourth external electrodes formed... Agent: Samsung Electro-mechanics Co., Ltd.
20150022943 - Multilayer ceramic capacitor to be embedded in board, method of manufacturing the same, and method of manufacturing board having multilayer ceramic capacitor embedded therein: There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers... Agent: Samsung Electro-mechanics Co., Ltd.
20150022945 - Multilayer ceramic capacitor, board having the same mounted thereon, and method of manufacturing the same: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to the third and fourth end surfaces, having the dielectric layers interposed therebetween; and first and... Agent: Samsung Electro-mechanics Co., Ltd.
20150022941 - Multilayer ceramic electronic component and method of manufacturing the same: There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when... Agent: Samsung Electro-mechanics Co., Ltd.
20150022944 - Multilayer ceramic electronic component and method of manufacturing the same: There is provided a multilayer ceramic electronic component including a ceramic body including dielectric layers, internal electrodes formed in the ceramic body and including pores, and first and second external electrodes formed on both end portions of the ceramic body, wherein in a cross section of the ceramic body in... Agent: Samsung Electro-mechanics Co., Ltd.
20150022948 - Capacitor structure: A capacitor structure includes a first electrode structure and a second electrode structure. The first electrode structure includes a first negative plate and a first positive plate spaced apart from each other. The first electrode structure has a first horizontal capacitance between the first negative plate and the first positive... Agent:
20150022949 - Connector arranged between two cylindrical energy storage assemblies: The invention relates to a module comprising at least two electrical energy storage assemblies (20), each storage assembly comprising: a tubular element (21) comprising a so-called side face (23), and at least one cover (50) for covering one of the ends of the tubular element. Said module is characterised in... Agent:
20150022950 - Cover for connecting energy storage assemblies: The invention relates to a cover for covering a tubular element of a first electrical energy storage assembly (20), said cover comprising a covering wall (50). The cover is characterised in that it comprises a radially extending electroconductive tongue (60, 70) comprising a contact face (71) intended to come into... Agent:
20150022951 - Separator for electrolytic capacitor and electrolytic capacitor: A cellulose solution obtained by dissolving cellulose in an amine oxide solvent is formed in a film form, and the resulting cellulose solution is immersed in water or a poor solvent of the amine oxide solvent, so as to coagulate and regenerate the cellulose. The regenerated cellulose is washed with... Agent: Nippon Kodoshi Corporation
20150022952 - Busbar: Disclosed is a busbar mounted on a board and electrically connected to an external element other than the board, including: a base portion; and a conductive pin body protruding from the base portion, wherein the base portion has a fixing portion where a fixing member for fixing the board and... Agent: Kayaba Industry Co., Ltd.
20150022957 - Electronic device: An electronic device of a novel embodiment, specifically an arm-worn electronic device used while being worn on an arm, is provided. An arm-worn secondary battery used while being worn on an arm is provided. An electronic device is provided, which includes a structure body having a curved surface as a... Agent:
20150022956 - Electronic pull tab for battery protection: A battery powered device is configured to allow the device to be stored for extended periods of time with a lithium battery installed and operable. An electronic switch is coupled between the battery and processing logic of the device and is biased off to block all current flow to the... Agent: Texas Instruments Incorporated
20150022953 - Flexible printed circuit film and display device including the same: A display device includes: a display substrate, and a flexible printed circuit film connected to the display substrate. The flexible printed circuit film includes a main body including a bending region, and a first cover layer disposed on a first side of the main body, and the first cover layer... Agent: Samsung Display Co., Ltd.
20150022955 - Lid structure and electronic device: A lid structure includes: a housing; a lid body configured to open and close an opening of the housing; an elastic member configured to be compressed by the housing and the lid body around the opening in a closing position where the lid body closes the opening; and a shaft... Agent: Fujitsu Limited
20150022954 - Measuring machine: A measuring machine includes a measuring device and a protective cover covering the measuring device. The measuring device is configured to measure parameters of a work piece. The measuring device includes a control box, a supporting board, a light ring configured to illuminate the work piece, and a camera module... Agent: Hon Hai Precision Industry Co., Ltd.
20150022958 - Part engaging structure and apparatus having the same: A part engaging structure having sufficient intensity while reducing the use amount of material, and having high positioning accuracy is provided. An engaging structure allows a protruding portion formed at a first part to be received by a receiving portion formed at a second part and engages the first part... Agent:
20150022959 - Server and indicating tag of the same: A server includes a main body and a plurality of indicating tags. The main body includes a plurality of electronic elements. A separating plate is located between each two adjacent electronic elements. The main body defines a plurality of engaging holes corresponding to the electronic elements. A gap is defined... Agent:
20150022960 - Computer assembly incorporating coupling within pantograph: A computer system with an input assembly may include a fastener positioned through a bottom chassis and into a pre-existing opening of a pantograph. In a keyboard assembly, the fastener may couple to a boss axially aligned with the pantograph housed at least partially within a keyboard key. In a... Agent:
20150022962 - Display device and laptop computer: A display device and a laptop computer including the same are disclosed. The display device includes a display module, a front cover including a front horizontal part, which covers an edge of a front surface of the display module and extends in a horizontal direction, and a front vertical part,... Agent:
20150022961 - Support component for an apparatus: A support component for an apparatus is described. In at least some implementations, a support component is attached to an apparatus (e.g., a computing device) via a hinge mechanism. The support component can serve as a “kickstand” that can be positioned via the hinge mechanism to support the apparatus in... Agent:
20150022963 - Storage device: A storage device includes a connector with first to ninth pins, a serial advanced technology attachment (SATA) control chip, a universal serial bus (USB) control chip, and a storage chip. Voltage terminals of the SATA control chip, the USB control chip, and the storage chip are connected to the first... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd .
20150022964 - Mounting apparatus assembly: A mounting apparatus includes a bracket and a pivoting member. A first sliding slot, a second sliding slot, a first guiding slot and a locating hole are defined in the bracket. A pivoting hole, a first guiding portion, a second guiding portion and a resisting wall are located on the... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.
20150022965 - Expansion chassis for laptop computers with bus multiplier and multifunction usb cable: The present invention relates to an expansion chassis for a laptop computer. Specifically, the expansion chassis provides additional expansion bays for increased functionality, storage and/or battery power for the laptop computer. One or more BUS multipliers are integrated into a native SATA BUS, and one or more multifunction USB interconnect... Agent:
20150022966 - Port replicator: A port replicator is applicable to an electronic device having one or more connecting port and includes a shell including an abutting portion and an extending portion connected with each other and a replicating circuit module. The insides of the abutting portion and the extending portion communicate with each other... Agent: Ozaki International Co., Ltd.
20150022967 - System for using constricted convection with closed loop cooling system as the convection plate: A gas cooling system for an electronic display is disclosed herein. A closed loop of circulating gas is preferably positioned to surround the electronic display. An open loop of cooling air preferably travels along the rear surface of the electronic display. In an exemplary embodiment the cooling air does not... Agent:
20150022968 - Plugboard heat dissipation system: A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output... Agent:
20150022969 - Computer case with recorded open and closed states: A computer case includes a backplane, a trigger switch, a first connector, a motherboard, a second connector on the motherboard, and a first cable. The trigger switch is used to detect whether a cover of the computer case is open or closed and outputs different signals accordingly. The first cable... Agent:
20150022971 - Computer case provided with a side plate having power supply lines: The present invention relates to a computer case provided with aside plate having power supply lines, in which a plurality of electronic components including a power supplier and wirings are disposed, and a main board is mounted on one side of the side plate, and the computer case including: power... Agent:
20150022970 - Ratchet module and electronic apparatus having the same: A ratchet module disposed in an electronic apparatus realizes one-way push-push function for a functional module. The ratchet module includes a first member and a second member meshed with each other with axially extending ratchet such that the second member may be pushed to rotate in one direction with respect... Agent: Wistron Corporation
20150022972 - Cooling device: The present disclosure provides a cooling device, the cooling device including a case including a first region and a second region isolated from the first region, a first cooling unit arranged at the first region to cool a first heat generating unit using an outside air, and a second cooling... Agent: Lsis Co., Ltd.
20150022973 - Method and apparatus for controlling a coolant circuit thermally coupled to a power electronics device: A vehicle system includes a power electronics device and a coolant circuit thermally coupled to the power electronics device. The coolant circuit includes a fluidic pump and a fluid/air heat exchanger, an air pump configured to transfer air across the fluid/air heat exchanger, and a shutter device configured to control... Agent:
20150022974 - Power conversion apparatus and electric vehicle: The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base... Agent:
20150022975 - Method and system for an immersion boiling heat sink: A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end... Agent: General Electric Company
20150022976 - Electronic module for a control unit: An electronic module for a vehicle includes a covering element, a component-carrier printed circuit board element, a carrier element having a first side and a second side, a printed circuit board element, and at least one contact-connection element. The contact-connection element is configured to provide a conductive contact-connection between the... Agent: Robert Bosch Gmbh
20150022977 - Power module substrate, power module, and method for manufacturing power module substrate: A power module substrate includes: a ceramics substrate having a surface; and a metal plate connected to the surface of the ceramics substrate, composed of aluminum, and including Cu at a joint interface between the ceramics substrate and the metal plate, wherein a Cu concentration at the joint interface is... Agent:
20150022978 - Circuit assembly and corresponding methods: A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major... Agent: Motorola Mobility LLC
20150022979 - Display device: A display device according to an exemplary embodiment of the present invention includes: a display panel displaying an image; a window disposed on a first surface of the display panel; a first cover film disposed on a second surface of the display panel; a flexible printed circuit (FPC) disposed under... Agent:
20150022980 - Print media with inductive secondary: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load... Agent: Access Business Group International LLC
20150022981 - Electronic card connection device and electronic device: The present disclosure relates to an electronic card connection device and an electronic device. The electronic card connection device comprises a connector, an electronic card tray and a switch. The connector comprises a terminal housing and a shell, the shell and the terminal housing define a mating space. The electronic... Agent: Molex Incorporated
20150022982 - Wiring board and method for manufacturing the same: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having... Agent: Ibiden Co., Ltd.
20150022984 - Embedded printed circuit board and method of manufacturing the same: An embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer, wherein the insulating layer is made of photosensitive... Agent: Samsung Electro-mechanics Co., Ltd.
20150022983 - Techniques for bonding substrates using an intermediate layer: A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM)... Agent:
20150022985 - Device-embedded package substrate and semiconductor package including the same: A package substrate includes a core layer having a core top surface and a core bottom surface, and a build-up layer having a stacked structure in which a plurality of interconnection layers and a plurality of insulating layers are alternately stacked on the core top surface. The core bottom surface... Agent:
20150022986 - Circuit assembly and corresponding methods: A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major... Agent: Motorola Mobility LLC
20150022987 - Electronic device comprising an integrated circuit chip provided with projecting electrical connection pads: An electronic device includes an integrated circuit chip with an insulating passivation layer. An opening in the passivation layer uncovers a first region of an electrical contact. An electrical connection pad is formed to fill the opening by covering the first region and extend in projection in such a way... Agent: Stmicroelectronics (grenoble 2) Sas
20150022988 - Lid body portion and electronic device package using the lid body portion and electronic device: To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and... Agent:
20150022989 - Utilizing chip-on-glass technology to jumper routing traces: A chip-on-glass device comprises a chip-on-glass substrate, a metal layer, and a plurality of chip-on-glass connection bumps. The metal layer comprises a plurality of passive jumper routing traces. The plurality of chip-on-glass connection humps is coupled with passive jumper routing traces of the plurality of passive jumper routing traces.... Agent: Synaptics Incorporated
20150022990 - Vertical blindmate scaling of identical system boards: Two system boards may be connected by a blind plug connector assembly. The top system board supports a first connector and has a hole adjacent the first connector that secures a guide bracket. The blind plug connector assembly is selectively received in the guide bracket to position a proximal connector... Agent:
20150022991 - Capacitor with multiple elements for multiple replacement applications: An apparatus includes a case having an elliptical cross-section capable of receiving a plurality of capacitive elements. One or more of the capacitive elements provide at least one capacitor having a first capacitor terminal and a second capacitor terminal. The apparatus also includes a cover assembly that includes a deformable... Agent:01/15/2015 > 88 patent applications in 58 patent subcategories.
20150015997 - Passive arc protection for main breaker line side power conductors: In a switchgear cabinet, the line side power conductors upstream of the main breaker are surrounded with are attenuating/extinguishing channels and protective conduit in a location prior to the conductor's attachment to the main breaker. Thus, passive arc attenuation can be had prior to the breakers, Personal Protection Equipment (PPE)... Agent: Schneider Electric Usa, Inc.
20150015998 - Solid state switch: A solid-state switch includes a plurality of transistors connected in parallel and a plurality of fuses. Each fuse is connected in series with a separate one of the plurality of transistors. A combination of current ratings of the plurality of fuses is greater than a load current of a load... Agent:
20150015999 - Method of tripping a circuit interrupter in a back fed configuration: A method a tripping a circuit interrupter in a back fed configuration is provided, wherein the circuit interrupter has separable contacts and an actuator, such as a solenoid, operatively coupled to the separable contacts. The method includes detecting within the circuit interrupter that a fault condition exists, and subsequent to... Agent: Eaton Corporation
20150016000 - Preventing moisture damage to a device: A device including a system for preventing moisture damage to the device includes a processor and a module operable on the processor for monitoring for a predetermined capacitance criterion on a surface of the device. The device is automatically powered off in response to detecting the predetermined capacitance criterion.... Agent:
20150016001 - Preventing moisture damage to a device: A method, device and computer program product for preventing moisture damage to electronic circuitry of a device may include monitoring for a predetermined capacitance criterion on a surface of the device; and automatically powering off the device in response to detecting the predetermined capacitance criterion.... Agent:
20150016002 - Power battery assembly and electric vehicle comprising the same: A power battery assembly may include a battery circuit and a circuit protecting unit. The circuit protecting unit may be connected in series with the battery circuit. The circuit protecting unit may include a relay and a current sensing unit connected in series with the battery circuit. A switching unit... Agent: Byd Company Limited
20150016003 - Methods and apparatus to clamp overvoltages for alternating current systems: Methods and apparatus to clamp overvoltages for inductive power transfer systems are described herein. An example overvoltage protection circuit is described, including a first terminal configured to receive an alternating current signal for conversion to a second signal, a capacitor, a first switch configured to selectively electrically couple the capacitor... Agent:
20150016004 - Over-current protection circuit: A circuit protecting the components of a power circuit against passing an over-current is connected to an enable terminal of a pulse width modulation (PWM) controller of a power supply circuit on a motherboard, protecting the field effect transistors (FETs) of a first power circuit of the power supply circuit.... Agent:
20150016005 - Inrush control with multiple switches: A novel system is offered for supplying power from an input node to a load coupled to an output node. The system may have multiple switches coupled between the input node and the output node. One or more limiting circuits may be configured for controlling the switches so as to... Agent:
20150016006 - Method and apparatus for demagnetizing transformer cores in closed loop magnetic current sensors: Automated degaussing methods and apparatus are presented for degaussing a magnetic core in close loop fashion, in which a plurality of pulses are applied to a compensation coil magnetically coupled with the core with duration or energy being decreased in succeeding pulse cycles according to a discrete feedback algorithm, and... Agent: Texas Instruments Deutschland Gmbh
20150016007 - Safety relay circuit: Safety relay circuit, in particular, comprising two series-connected or parallel-connected relay switches (k1, k2) in a load current circuit (LN). The relay switch (k1) is assigned a switch position indicator circuit (A1). An evaluation circuit compares the command input to the relay (k1) with the display of the indicator circuit... Agent:
20150016008 - Grounding structure: Provided is a grounding structure including a grounding member that is grounded, an electrical conduction member that includes a protection section which is placed to protect a protection object, and an elastic portion which is connected to the protection section and is elastically deformed, the electrical conduction member being conductible,... Agent: Fuji Xerox Co., Ltd.
20150016009 - Electrostatic charge dissipation system: An electrostatic charge dissipation system including an electrostatic discharge assembly configured to connect to a conductive article, the electrostatic discharge assembly including a conductor, an insulator positioned between the conductor and the conductive article, and an indicator electrically connected to the conductor and the conductive article, the indicator being configured... Agent:
20150016010 - Carrier device and ceramic member: A ceramic member, in a carrier device, including: a plurality of ceramic layers; a clamping electrode formed on a first ceramic layer among the plurality of ceramic layers and inside of the plurality of ceramic layers, and configured to attract a dielectric material by electrostatic force; an electric heating element... Agent: Ngk Spark Plug Co., Ltd.
20150016011 - Electrostatic check with multi-zone control: An electrostatic chuck for clamping a warped workpiece has a clamping surface comprising a dielectric layer. The dielectric layer has a field and one or more zones formed of differing dielectric materials. One or more electrodes are coupled to a power supply, and a controller controls a clamping voltage supplied... Agent:
20150016012 - Capacitor with multiple elements for multiple replacement applications: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor... Agent:
20150016016 - Array-type multilayer ceramic electronic component and mounting board therefor: An array-type multilayer ceramic electronic component includes a ceramic body in which a plurality of dielectric layers are stacked in a length direction; a plurality of capacitor parts having different capacitances and including a plurality of first and second internal electrodes disposed with predetermined intervals therebetween in the length direction... Agent: Samsung Electro-mechanics Co., Ltd.
20150016018 - Ceramic electronic component and method for manufacturing the same: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and... Agent:
20150016017 - Dielectric composition and multi-layered ceramic capacitor: A dielectric composition may include a first dielectric powder; and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of... Agent: Samsung Electro-mechanics Co., Ltd.
20150016015 - Multi-layered capacitor: Disclosed herein is a multi-layered capacitor including: a multi-layered body which includes a capacity part formed by multi-layering a dielectric layer and an internal electrode and a cover part formed by multi-layering the dielectric layer; and a pair of external terminals disposed on both sides of the multi-layered body, in... Agent: Samsung Electro-mechanics Co., Ltd.
20150016013 - Multilayer ceramic capacitor: There is provided a multilayer ceramic capacitor including, a ceramic body; a plurality of first and second internal electrodes disposed to be alternately exposed through first and second side surfaces facing each other in a width direction; and first and second external electrodes formed on the surfaces of the ceramic... Agent: Samsung Electro-mechanics Co., Ltd.
20150016014 - Multilayer ceramic capacitor and manufacturing method thereof: There is provided a multilayer ceramic capacitor including, a ceramic body having a plurality dielectric layers stacked therein and a groove portion recessed inwardly in a lower surface thereof in a width direction, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed... Agent: Samsung Electro-mechanics Co., Ltd.
20150016020 - Multilayer ceramic electronic component: There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a... Agent:
20150016019 - Multilayer ceramic electronic component to be embedded in board: A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the... Agent:
20150016022 - Multi-layered graphene films, energy storage devices using multi-layered graphene films as electrodes, and methods of manufacturing multi-layered graphene films and energy storage devices: Provided are a multi-layered graphene film, a method of manufacturing the multi-layered graphene film, and an energy storage device using the multi-layered graphene film as an electrode. The multi-layered graphene film includes a first graphene layer, a spacer layer provided on the first graphene layer, and an upper graphene layer... Agent: Samsung Corning Precision Materials Co., Ltd.
20150016023 - Positioning spacer, energy storage module using said spacer and method for assembling the module: The invention concerns a positioning spacer for positioning electrical energy storage elements, such as supercapacitors or ultracapacitors connected in series, in an electrical energy storage module, wherein the spacer comprises a first support part and a second part forming a rim relative to the first part, the positioning spacer comprising,... Agent: Blue Solutions
20150016021 - Stability enhancing additive for electrochemical devices: e
20150016024 - Cathode active material having core-shell structure and producing method thereof: Disclosed is a cathode active material having a core-shell structure. The core-shell cathode active material includes a core including a lithium transition metal oxide with excellent electrochemical properties and a shell formed by coating the surface of the core with a transition metal oxide. The formation of the shell by... Agent: Korea Insitiute Of Science And Technology
20150016025 - Aluminum electrolytic capacitor and rubber seal for same: A lead terminal is passed through a terminal passage hole of a rubber seal, without imposing an excessive burden such that the characteristics of the capacitor element would be degraded, and while maintaining a state of reliable isolation from the outside air. In an aluminum electrolytic capacitor in which the... Agent: Elna Co., Ltd.
20150016026 - Solid electrolytic capacitor: Disclosed is (1) an anode body for capacitors, which is composed of a sintered body containing tungsten dioxide in amount of 80 mass % or more and preferably silicon element in amount of 3.4 mass % or less, (2) a powder as a raw material of the sintered body containing... Agent: Showa Denko K.k.
20150016027 - Electrical distribution system: A portable electrical power distribution assembly using a bucket as a structural supporting element. A power socket and at least one power receptacle are mounted to the bucket. The power socket and power receptacle are electrically connected to establish a complete circuit such that when power is connected to the... Agent:
20150016028 - Power distribution box: An integrated power distribution box including an upper level assembly including a printed circuit board comprising at least one electrical component, a lower housing configured to receive at least a portion of the printed circuit board, an intermediate housing configured to be coupled with at least one fuse, a master... Agent:
20150016029 - Power distribution panel with modular circuit protection elements: A power panel and modules for use in a power panel are disclosed. One disclosed chassis includes a top, a bottom, a front, a rear, and left and right sides, and an input power bus having a plurality of connection apertures therethrough. A plurality of circuit modules are mounted within... Agent:
20150016032 - Display device: Disclosed is a display device that includes a display panel and a multi-layered panel provided adjacent the display panel. The multi-layered panel may include a front plate located toward the display panel, a rear plate provided parallel to the front plate, and a honeycomb mesh interposed between the front plate... Agent:
20150016033 - Display device substrate, display device, and related fabrication method: A substrate is for use in a display device. The substrate may include a plurality of non-uniform surface portions, the non-uniform surface portions being spaced from each other and including a first non-uniform surface portion and a second non-uniform surface portion. The substrate may further include a plurality of substantially... Agent: Samsung Display Co. Ltd.
20150016034 - Electronic display mounting system: An electronic sign having slotted frame cabinets whereby each slotted frame cabinet can conveniently be attached to one or more vertically or horizontally positioned adjacent slotted frame cabinets by using connecting components which are generally located around the periphery of one or more slotted frame cabinets. Connecting components, including splice... Agent: Daktronics, Inc.
20150016031 - Packing piece and packing member formed from the packing piece: A packing member attached to non-coplanar outer surfaces of an electronic component includes a number of non-coplanar plates attached to the outer surfaces of the electronic component. A junction of every two adjacent plates defines a row of a plurality of through holes. A middle line of each row of... Agent: Hon Hai Precision Industry Co., Ltd.
20150016030 - Reducing appearance of physical damage on cosmetic surfaces: The described embodiments relate generally to cosmetic surfaces and associated treatments to form cosmetic surfaces. Cosmetic surface treatments as described herein both increase durability and decrease the appearance of physical damage through implementation of an intermediate barrier layer having a first physical attribute (e.g., color of barrier layer) of a... Agent:
20150016035 - Accessory for wearable computer: An accessory for a wearable computer includes a strap having a cover that covers a plurality of batteries; a first connector that joins a first end of the strap to a first end of the wearable computer; a second connector that joins a second end of the strap to a... Agent:
20150016038 - Electronic device with a reduced friction surface: A surface of an electronic device includes a reduced friction surface that comprises a glass beaded film. The glass beaded film includes glass beads disposed in a polymer layer or in an adhesive layer, where a portion of the glass beads protrude from a surface of the polymer or adhesive... Agent:
20150016037 - Information terminal device: An information terminal device which is portable and capable of charging a charge target device includes: a first body part including a display panel and a case which covers the display panel; and a power transmission coil provided at a position on a back surface of the case opposite to... Agent:
20150016039 - Keyboard protection mechanism: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a keyboard that includes a plurality of keys and... Agent:
20150016040 - Information handling system housing lid with synchronized motion provided by a flexible compressive member: An information handling system converts from a closed position to a tablet position by rotating a lid with a display 360 degrees about a hinge having synchronized and continuous motion. The hinge has first and second axles held in a spaced and substantially parallel orientation by a support. A flexible... Agent: Dell Products L.p.
20150016041 - Electronic apparatus and module: According to one embodiment, an electronic device includes a first attachment part; a second attachment part separated from the first attachment part; a flexible printed circuit board including a first connection part fixed to the first attachment part, a second connection part fixed to the second attachment part, a coupling... Agent:
20150016036 - Translucent panel attachment structure and portable electronic device: A translucent panel attachment structure according to an embodiment of the present invention includes a translucent panel, a casing, and a silicone resin layer. The casing has an opening into which the translucent panel is fitted. The opening has an inner wall surface which faces a peripheral surface of the... Agent: Kyocera Corporation
20150016043 - Integrated circuit package with a conductive grid formed in a packaging substrate: An integrated circuit package includes a packaging substrate, which has an electrically conductive grid formed on a dielectric layer, and an integrated circuit die electrically coupled to the electrically conductive grid at one or more locations. In this embodiment, the electrically conductive grid includes a plurality of electrically conductive portions,... Agent:
20150016042 - Packaging substrate that has electroplated pads that are free of plating tails: An integrated circuit package includes a packaging substrate with an electrical connection pad formed thereon and an integrated circuit die coupled to the electrical connection pad. The electrical connection pad includes an electroplated surface finish layer, but does not include an electrical trace configured as a plating tail. Because the... Agent:
20150016044 - Socket interposer and computer system using the socket interposer: Exemplary embodiments include a socket interposer having a plurality of connectors and at least one of on-board memory and an external communication controller. The plurality of connectors is configured to fit with a form factor of a socket on a server board. The server board includes at least one processor... Agent:
20150016046 - Ina cabled memory appliance: According to one general aspect, an apparatus may include an expansion memory device, a connection printed circuit board, and a connection cable. The expansion memory device may include a plurality of memory chips. The connection printed circuit board may be configured to be physically coupled with a memory socket. The... Agent: Samsung Electronics Co., Ltd.
20150016045 - Memory assembly with processor matching pin-out: A memory device includes one or more memory semiconductor chips housed in a surface-mount semiconductor package and formed on a package substrate. The package substrate includes a two-dimensional array of package leads for connecting signals of the one or more memory semiconductor chips to an external system. The memory assembly... Agent:
20150016047 - Memory module: A memory module that includes: a printed circuit board having a connecting terminal; memory chips arranged on the printed circuit board; data buffers disposed on a first surface of the printed circuit board and corresponding to the memory chips; and resistance units disposed on a second surface of the printed... Agent:
20150016048 - Printed circuit arrangement and method of forming the same: In various embodiments, a printed circuit arrangement may be provided. The printed circuit arrangement may include a processor circuit. The printed circuit arrangement may further include a printed main circuit arrangement in electrical connection with a first input node of the processor circuit. The printed main circuit arrangement may be... Agent:
20150016049 - Semiconductor memory card, printed circuit board for memory card and method of fabricating the same: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically... Agent:
20150016050 - Server device and data storage device replacement mechanism thereof: A server device has a case, a backplane board mounted inside the case, a plurality of data storage device replacement mechanisms inserted inside the case, a plurality of first data storage devices and a plurality of second data storage devices. The data storage device replacement mechanism includes a tray, a... Agent:
20150016051 - Display assembly having graduated magnetic fastening characteristics: A display assembly is provided. The display may include a holder defining a first portion and an electronic device defining a corresponding second portion that is in magnetic attraction to the first portion when the electronic device is positioned about the holder. At least one of the first portion and... Agent:
20150016052 - Cooling electronic devices: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein... Agent:
20150016053 - Housing for at least one electric or electronic device, and electric or electronic device comprising the housing: Housing for at least one electric or electronic device, the housing surrounding a housing interior comprising a storage space, the electric or electronic device being arrangeable in the storage space, the housing comprising a housing upper part, which delimits the housing interior, the housing comprising at least one intermediate ceiling... Agent: Diehl Aerospace Gmbh
20150016054 - Notebook auxiliary device: A notebook auxiliary device includes a first rigid body, a second rigid body and a folding portion. The first rigid body is disposed on a top surface of a screen body of a notebook. The second rigid body is disposed on a bottom surface of a mainframe body of the... Agent:
20150016055 - Piping connection structure, cooling system, and electronic equipment: A piping connection structure includes: a pipe; and an elastic tube connected to the pipe, the tube including a connection into which the pipe is inserted and fitted, and a main body linked seamlessly with the connection, wherein the main body includes a projection that is formed circularly along a... Agent: Fujitsu Limited
20150016056 - Module-type data center: A module type data center includes: a casing having an intake vent and an exhaust vent; a rack accommodating an electronic device; an air blower configured to introduce outside air into the casing through the intake vent and pass air through the rack from one of surfaces of the rack... Agent:
20150016057 - Foot cushion mechanism and electronic device therewith: A foot cushion mechanism with lifting function is disclosed. The foot cushion mechanism includes a foot cushion member, a holding base and at least one shape memory material member. The foot cushion member is installed on a housing and abuts against a supporting surface. The holding base and the foot... Agent: Wistron Corporation
20150016058 - Glass enclosure: A handheld computing device that includes an enclosure having structural walls formed from a glass material that can be radio-transparent. The enclosure can be formed from a hollow glass tube or two glass members bonded together. A laser frit bonding process may be used to hermetically seal the two glass... Agent:
20150016060 - Apparatus and method for cooling a transformer having a non-linear core: A three-phase non-linear transformer is cooled by first (30) and second fans (40). The first fan (30) is attached to the first core clamps (12) of the transformer using a first mounting structure (15). The second fan (40) is attached to the second core clamps (24) of the transformer using... Agent:
20150016059 - Apparatus and method for preventing component overheating and extending system survivability: An example apparatus and method for preventing component overheating and extending system survivability of an appliance is provided and may include a component assembly configured to be inserted in a first slot of the appliance. The component assembly may include a door disposed on its side and extending substantially along... Agent: Cisco Technology, Inc.
20150016061 - Centrifugal fan module and electronic device using the centrifugal fan module: A centrifugal fan module comprising a fan housing and an impeller is provided. The fan housing includes an air inlet and a sidewall. The sidewall is pivotally disposed in the fan housing to rotate in the rotational direction relative to the fan housing. A tongue portion is formed between the... Agent:
20150016062 - Highly integrated power electronic module assembly: A power electronic module assembly according to an exemplary aspect of the present disclosure includes, among other things, a vapor chamber and a substrate integrated with a first surface of the vapor chamber. At least one cooling feature is integrated with a second surface of the vapor chamber.... Agent:
20150016063 - Power semiconductor module: To achieve the above object, each power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion... Agent:
20150016064 - Semiconductor device and manufacturing method therefor: The purpose is to provide a fin-integrated type semiconductor device that is a simple structure and has a high heat dissipating characteristic, and to provide a manufacturing method therefor. The semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other,... Agent: Mitsubishi Electric Corporation
20150016065 - Electronic device having movable display: An electronic device includes a base, a display slidably covering the base, a slide apparatus installed between the base and the display, and an operation apparatus. The slide apparatus includes a rack mounted to the display, a gear pivotably installed in the base, and a pole protruding out from the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20150016066 - Circuit module and method of producing the same: A circuit module includes a wiring substrate, an electronic component, a sealing layer, and a conductive shield. The wiring substrate has a mount surface. The electronic component is mounted on the mount surface. The sealing layer is formed of an insulating material, covers the electronic component, and has a first... Agent: Taiyo Yuden Co., Ltd.
20150016067 - High frequency module and manufacturing method thereof: A high frequency (HF) module and a manufacturing method thereof. The HF module has a single airtight box-like structure formed by a first PCB, a second PCB, and a third PCB. On a lower surface of the third PCB facing the first PCB, a second electronic component is mounted at... Agent:
20150016068 - 3dic package integration for high-frequency rf system: A three-Dimensional Integrated Circuit (3DIC) Chip on Wafer on Substrate (CoWoS) packaging structure or system includes a silicon oxide interposer with no metal ingredients, and with electrically conductive TVs and RDLs. The silicon oxide interposer has a first surface and a second surface opposite to the first surface. The electrically... Agent:
20150016073 - Circuit carrier having a conducting path and an electric shield, and method for producing said circuit carrier: The invention relates to a circuit carrier (11), comprising a digital circuit, which contains at least two components (12, 14) that are electrically connected to each other (19, 21, 20). Additionally, an electric shield (24) is provided. According to the invention, the electric shield (24) and a conducting path (21)... Agent:
20150016070 - Conductive structure and device with the conductive structure as electrode: Provided is a conductive structure and a device with the conductive structure as an electrode. The conductive structure includes a reduced metal layer and an overlapping structure formed by nano metal wires. The overlapping structure has at least one connecting portion, and the reduced metal layer covers the nano metal... Agent: Industrial Technology Research Institute
20150016072 - Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate: A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer... Agent: Taiyo Ink Mfg. Co., Ltd.
20150016071 - Electronic component thickness measurement method, method for manufacturing a series of electronic components using the measurement method, a series of electronic components manufactured by the manufacturing method, and electronic component inspection app: An electronic component thickness measurement method includes extracting, from a plurality of second reference lines in first image data and a plurality of second reference lines in second image data, only a second reference line at which a difference in intensity peak between respective second reference lines at a same... Agent:
20150016069 - Printed circuit board: A printed circuit board (PCB) is disclosed. The PCB includes a main body. A first surface of the main body is a connecting surface for electrical components. A second surface of the main body is a conductive cooper foil layer operating as ground wires. A plurality of grooves is arranged... Agent: Shenzhen China Star Optoelectronics Technology Co., Ltd.
20150016074 - Device housing package: A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout... Agent: Kyocera Corporation
20150016075 - Measurement transmitter: A measurement transmitter for providing a measured value to a control system, comprising: a sensor having a transducer for outputting a primary signal dependent on the measured value; a first electronic circuit for processing the primary signal to an intermediate signal; a second electronic circuit for processing the intermediate signal... Agent: Endress + Hauser Gmbh + Co. Kg
20150016076 - Electrical junction box: An electrical junction box includes a case that includes a bottom plate portion and a case-side peripheral wall portion, the case having an opening that opens to a lateral side, and a cover that closes the opening of the case and includes a lid plate portion and a cover-side peripheral... Agent:
20150016077 - Electrical center for a vehicle: An electrical center for distributing electrical power to an electrical system of a vehicle is provided. The electrical center includes a printed circuit board (PCB) that is configured to fit inside of a cover. The PCB includes a first electrical component that is electrically connected to the electrical system. A... Agent:
20150016078 - Partitioned hybrid substrate for radio frequency applications: The presently claimed invention is to provide a package for compact RF signal system, and a method to form the package thereof in order to miniaturize the size of package, improve signal integrity, and reduce manufacturing cost. The package comprises a hybrid substrate with a sandwiched structure, in which the... Agent:
20150016079 - Printed wiring board: A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer... Agent: Ibiden Co., Ltd.
20150016080 - Method for manufacturing an embedded package and structure thereof: A method for manufacturing an embedded package comprises the steps of: coupling at least one first embedded body including at least one connection port with a first circuit substrate and packaging the first embedded body and the first circuit substrate to form a package; and exposing the connection port of... Agent:
20150016081 - Electronic device with integrated circuit chip provided with an external electrical connection network: An electronic device may include a substrate, and an integrated circuit over the substrate. The substrate may be provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links may include an impedance-compensating inductor.... Agent:
20150016082 - Printed circuit board and method of manufacturing the same: A printed circuit board includes an insulating layer; a via in the insulating layer, a first circuit layer formed at a first side of the insulating layer and having a portion buried in the via; a second circuit layer formed at a second side of the insulating layer and electrically... Agent: Samsung Electro-mechanics Co., Ltd.
20150016083 - Thermocompression bonding apparatus and method: A multi-layer aluminum nitride ceramic, multi-heating element substrate is provided for forming electrical bonds between integrated circuits and an interposer structure using a thermocompression bonding process. The individually energizable heater element traces can be run through common regions of the heater surface platform. A network of cooling vias can be... Agent:
20150016084 - Breaker secondary terminal block isolation chamber: The disclosed concept pertains generally to secondary terminal blocks and, more particularly, to apparatus and methods for isolating the secondary terminal blocks and associated wiring in electrical switching assembly enclosures. The apparatus includes a housing having an outer surface structured to form a cavity therein. The apparatus is positioned in... Agent: Eaton CorporationPrevious industry: Dynamic magnetic information storage or retrieval
Next industry: Illumination
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