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Electricity: electrical systems and devices

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
04/10/2014 > 69 patent applications in 45 patent subcategories.

20140098444 - Stall delay attachment: The Stall Delay Attachment is a copper terminal strip that is designed to increase the life of any battery, voltage regulator or starter by acting as a surge protector or a heat sink that dissipates heat only for electrical current and would be attached and fused into a battery cable... Agent:

20140098445 - Signal activated circuit interrupter: The current invention is an automatic AC power interruption system built into a portable power strip or a portable casing or integrated into an appliances control circuitry. The invention monitors the environment for hazard alarms, for example, a T3 signal smoke detector alarm, and responds by tripping open the power... Agent:

20140098446 - Universal ground fault interrupter (gfci) device and printed circuit board package: A Ground Fault Circuit Interrupter (GFCI) printed circuit board (PCB) for interrupting the flow of current through a pair of lines extending between a source of power and a load. The GFCI PCB is easily adaptable to fit into a plurality of enclosure types having a plurality of load inputs... Agent:

20140098447 - Electrostatic discharge protection for class d power amplifiers: Electrostatic discharge protection for Class D power amplifiers is disclosed. In an exemplary embodiment, an apparatus includes an amplifier having an output transistor coupled to an interface pad, a snapback supply clamp coupled across first and second supplies of the amplifier and configured to provide a clamp voltage across the... Agent: Qualcomm Incorporated

20140098448 - Electrostatic protection for stacked multi-chip integrated circuits: One feature pertains to a multi-chip module that comprises at least a first integrated circuit (IC) die and a second IC die. The second IC die has an input/output (I/O) node electrically coupled to the first IC die by a through substrate via. The second die's active surface also includes... Agent: Qualcomm Incorporated

20140098449 - Method for detecting islanding operation of distributed power generator: A method and an arrangement are disclosed for detecting islanding operation of a distributed power generator. The method can include determining a frequency of a grid to which the distributed power generator is connected, measuring a rate of change of the frequency of the grid at an output of the... Agent: Abb Oy

20140098450 - Protection relay system against single-phase faults for medium-voltage distribution networks: m

20140098451 - Inductive fault current limiter with divided primary coil configuration: An inductive fault current limiter (1) has a normally conducting primary coil assembly (2) with a multiplicity of turns (3) and a superconducting, short-circuited secondary coil assembly (4), wherein the primary coil assembly (2) and the secondary coil assembly (4) are at least substantially coaxial with respect to each other... Agent:

20140098452 - Power supply apparatus relating to dc-dc voltage conversion and having short protection function: A power supply apparatus is provided, and which includes a power conversion circuit, a control chip with soft-start function and a short protection circuit. The power conversion circuit is configured to provide a DC output voltage to a load in response to an output pulse-width-modulation (PWM) signal. The control chip... Agent: Fsp Technology Inc.

20140098453 - Systems and methods for a user interface for electronic weaponry: An apparatus, according to various aspects of the present invention, produces contractions in skeletal muscles of a target to impede locomotion by the target. The apparatus is used with a provided deployment unit that deploys an electrode away from the apparatus. The electrode conducts a current through the target. The... Agent:

20140098455 - Dielectric composition and multilayer ceramic electronic component manufactured using the same: There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectirc composition including dielectric grains having a perovskite structure represented by ABO3, a portion of the dielectric grains having a core-shell structure, wherein dielectric grains having an average length of a core equal... Agent: Samsung Electro-mechanics Co., Ltd.

20140098456 - Electronic component: An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas... Agent: Murata Manufacturing Co., Ltd.

20140098454 - Multilayered ceramic electronic component and method of manufacturing the same: There is provided a multilayered ceramic electronic component including: a ceramic body having first and second main surfaces opposing each other and first and second end surfaces opposing each other and including dielectric layers; internal electrodes disposed to face each other and having the dielectric layer interposed therebetween; and external... Agent: Samsung Electro-mechanics Co., Ltd.

20140098457 - Dielectric composition and multilayer ceramic electronic component manufactured using the same: There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectric composition including a dielectric grain having a perovskite structure represented by ABO3, wherein the dielectric grain has a core-shell structure in which a content of an additive in a shell is 15%... Agent: Samsung Electro-mechanics Co., Ltd.

20140098458 - Graphene-based composite materials, method of manufacture and applications thereof: Disclosed herein is a composite material comprising a relaxor ferroelectric material and a hydrazine-reduced graphene oxide, wherein the weight ratio of the composite material to the hydrazine-reduced graphene oxide is 9:1 to 200:1. The composite materials have high dielectric permittivity and low dielectric losses and can be used to manufacture... Agent: Saudi Basic Industries Corporation

20140098459 - Capacitor and contact structures, and formation processes thereof: Capacitor and contact structures are provided, as well as methods for forming the capacitor and contact structures. The methods include, for instance, providing a layer of conductive material above a conductive structure and above a lower electrode of a capacitor; etching the layer of conductive material to define a conductive... Agent: Globalfoundries, Inc.

20140098460 - Electrode material for aluminum electrolytic capacitor, and process for producing same: Specifically, the present invention provides an electrode material for an aluminum electrolytic capacitor, which comprises, as constituent elements, a sintered body of a powder of at least one member selected from the group consisting of aluminum and aluminum alloys and an aluminum foil substrate that supports the sintered body thereon,... Agent: Toyo Aluminium Kabushiki Kaisha

20140098464 - Carbon surface modification for three-volt ultracapacitor: An electric double-layer ultracapacitor configured to maintain desired operation at an operating voltage of three volts, where the capacitor includes a housing component, a first and a second current collector, a positive and a negative electrode electrically coupled to one of the first and second current collectors, and a separator... Agent: Maxwell Technologies, Inc.

20140098463 - Coated housing for ultracapacitor: An electric double-layer ultracapacitor configured to maintain desired operation at an operating voltage of three volts, where the capacitor includes a housing component, a first and a second current collector, a positive and a negative electrode electrically coupled to one of the first and second current collectors, and a separator... Agent: Maxwell Technologies, Inc.

20140098465 - Electrode porosity for three-volt ultracapacitor: An electric double-layer ultracapacitor configured to maintain desired operation at an operating voltage of three volts, where the capacitor includes a housing component, a first and a second current collector, a positive and a negative electrode electrically coupled to one of the first and second current collectors, a separator positioned... Agent: Maxwell Technologies, Inc.

20140098466 - Electrolyte: An electrolyte system suitable for use in an energy storage device (such as a supercapacitor), and energy devices which comprising the electrolyte system which is made up of an ionic liquid, such as Li or EMI TFSI and a stabilising amount of a stabilising additive. The stabilising additive preferably contains... Agent: Cap-xx Limited

20140098461 - Spacer-modified graphene electrode for supercapacitor: A spacer-modified nano graphene platelet electrode, comprising: (a) multiple nano graphene platelets or sheets having an average thickness smaller than 10 nm; and (b) discrete, non-metallic nano-scaled particles that are disposed between two graphene platelets or sheets to serve as a spacer. In such a spacer-modified graphene electrode, large amounts... Agent:

20140098462 - Super capacitor with fibers: An electrical cell apparatus includes a first current collector made of a multiplicity of fibers, a second current collector spaced from the first current collector; and a separator disposed between the first current collector and the second current collector. The fibers are contained in a foam.... Agent: Lawrence Livermore National Security, LLC

20140098467 - Electroconductive polymer, electroconductive polymer aqueous solution, electroconductive polymer film, solid electrolytic capacitor and method for producing the same: An electroconductive polymer having high electroconductivity, an electroconductive polymer aqueous solution, and an electroconductive polymer film are provided. Further, a solid electrolytic capacitor having a reduced ESR and a method for producing the same are provided. An electroconductive polymer according to an exemplary embodiment of the invention contains a monomolecular... Agent: Nec Tokin Corporation

20140098468 - Subsea electrical power system: A subsea electrical power system is provided. The subsea electrical power system includes a first subsea electric device having a first subsea enclosure and a second subsea electric device having a second subsea enclosure. The first subsea electric device and the second subsea electric device are mounted on a common... Agent:

20140098469 - Dual action shutter for drawout circuit breaker: A shutter device for a drawout circuit breaker. The arrangement includes first and second moveable plungers for contacting the circuit breaker. The arrangement also includes a first slider element attached to a moveable first mask. A first link arm is rotatably attached to the first plunger and the first slider... Agent: Siemens Industry, Inc.

20140098470 - Electrical distribution systems incuding parallel energy source and methods: An electrical distribution system having a meter socket, load center combination apparatus is disclosed. The meter socket, load center combination apparatus has an enclosure having a meter socket section with a meter socket configured to receive an owner utility meter, an owner load center with a plurality of locations configured... Agent: Siemens Industry, Inc.

20140098476 - Electronic device cover: A protective cover assembly having a tray having a concave surface and a perimeter, the concave surface defining a volume sufficient to accommodate a portable electronic device; and an elastomeric collar having an internal rim that reversibly engages and wraps around the perimeter of the tray.... Agent:

20140098471 - Flexible display panel: A flexible display panel including: a flexible substrate comprising a first area and a second area, wherein the first area is formed in a first direction, and the second area is formed in a second direction that is different from the first direction; a first display area formed on the... Agent: Samsung Display Co., Ltd.

20140098472 - Glass enclosure body having mechanical resistance to impact damage: An enclosure for a portable electronic device includes a glass sleeve having an oblong cross-sectional profile and a wall defining a cavity for an electronic insert. The wall comprises a first wall segment with a first thickness and a local radius or curvature of 10 mm or less and a... Agent:

20140098477 - Interlocking system for connecting a programmable logic controller and a power supply: An interlocking system for connecting a programmable logic controller and a power supply of an industrial control and automation system is provided. The interlocking system includes features configured to facilitate coupling with a panel or rail and a plurality of vertical slots and a latch disposed on a side surface... Agent: Rockwell Automation Asia Pacific Business Center Pte. Ltd.

20140098474 - Locking hinge assembly for electronic device: In one embodiment an electronic device comprises a housing having a first section and a second section comprising a display coupled to the first section by a hinge assembly, a rotation control assembly to control rotation of the hinge assembly, and a controller to activate the rotation control assembly in... Agent:

20140098473 - Sliding mechanism and slider electronic apparatus therewith: A sliding mechanism and a slider electronic apparatus therewith are disclosed. The sliding mechanism is disposed in a casing of the slider electronic apparatus and includes a slide, a retaining wall, and a sliding member. The slide and the retaining wall are oppositely fixedly disposed. The sliding member is disposed... Agent: Wistron Corporation

20140098475 - Unidirectional prepreg and processing method thereof: A UniDirectional (UD) preimpregnated material (prepreg) and method of production are provided. A plurality of reinforced fibers are arranged in one direction. At least one auxiliary fiber is arranged such that it crosses the plurality of reinforced fibers to maintain the arrangement of the plurality of reinforced fibers. The plurality... Agent: Samsung Electronics Co., Ltd.

20140098478 - Portable electronic device case accessories and related systems and methods: Case accessories for portable electronic devices are disclosed. In some embodiments, a case accessory may include a base configured to sit on a working surface, a support coupled to the base and configured to support a portable electronic device in an elevated position, a rotational mechanism coupled to the support... Agent: Targus Group International, Inc.

20140098479 - Stabilization and easy repositioning of a display: Techniques applied to a computing device having a display, a base, and components that allow repositioning of the display relative to the base are provided, which can be used for stabilizing and changing the position of the display relative to the base. A determination is made via a processor as... Agent: Acer Incorporated

20140098481 - Cooling fan suspension vibration filter: An information handling system cooling fan has a vibration filter that tunes out predetermined fan vibration frequencies to reduce fan vibration transfer from the cooling fan to an information handling system chassis in a targeted frequency range. For example, a leaf spring and damper are biased between the cooling fan... Agent: Dell Products L.p.

20140098480 - Memory module connector with auxiliary power cable: A memory module includes persistent-storage memory chips and an auxiliary voltage connector for powering the persistent-storage memory chips. An auxiliary power cable has a first end coupled to an electronic power source on the system board and has a second end having connector that plugs in to the auxiliary voltage... Agent: International Business Machines Corporation

20140098482 - System to improve an in-line memory module: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during... Agent: International Business Machines Corporation

20140098483 - Usb device with preassembled lid: A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in turn be received within a connector shell and lid.... Agent: Sandisk Technologies Inc.

20140098484 - Portable computer hard drive structures: Portable computer structures are provided. The portable computer structures may include hard drive mounting structures. The hard drive mounting structures may include elastomeric support members. Each elastomeric support member may have a relatively rigid inner portion. The inner portion may include a hole that receives a hard drive mounting pin.... Agent: Apple Inc.

20140098486 - Active cooling dock for computing device: Various computing devices and methods of thermally managing the same are disclosed. In one aspect, a method of providing air to an interior of a computing device is provided. The method includes docking the computing device to a docking station that includes an air mover operable to deliver air to... Agent:

20140098485 - Asymmetric computer tablet frame docking system: A system for docking a computer tablet with a docking station. The computer tablet has an asymmetrical edge that is adapted to rest in a cradle portion of the docking station. While resting in the docking station the computer tablet may be rotated to various angles and still maintain electrical... Agent:

20140098487 - Cooling fan suspension vibration filter: An information handling system cooling fan has a vibration filter that tunes out predetermined fan vibration frequencies to reduce fan vibration transfer from the cooling fan to an information handling system chassis in a targeted frequency range. For example, a leaf spring and damper are biased between the cooling fan... Agent: Dell Products L.p.

20140098488 - Apparatus, system and method for concealed venting thermal solution: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of... Agent:

20140098489 - Heat dissipating apparatus for folding electronic devices: Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar... Agent: Qualcomm Incorporated

20140098490 - Heat dissipating module with enhanced heat dissipation efficiency and electronic device therewith: A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end... Agent: Aopen Inc.

20140098491 - Electronic device, accessory and method of operating electronic device and accessory: An electronic device and an accessory are provided. The electronic device is installed on the accessory and identifies a type of the accessory. The electronic device includes a housing, a processor and an active sensing element. The processor and the active sensing element are disposed in the housing, and the... Agent: Htc Corporation

20140098492 - Air flow system: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may... Agent:

20140098493 - Heat dissipation system for communication device with box type chassis, box type chassis, and communication device: A heat dissipation system in a box type chassis of a communication device includes an upper heat dissipation channel and a lower heat dissipation channel, which both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat... Agent: Huawei Technologies Co., Ltd.

20140098495 - Display apparatus: The present invention provides a display substrate for reducing resistance deviation occurring in a fan out unit, and a display apparatus including the display substrate. According to the present invention, resistance units are disposed in lines having a relatively short length in an area where lengths of adjacent lines increase... Agent: Samsung Display Co., Ltd.

20140098494 - Efficient cooling duct: A cooling system comprises an electronics module and a duct. The electronics module produces more heat at a first location than at a second location, and is rated to a safe operating temperature. The duct surrounds the electronics module, and has a shaped baffle with a constricted region near the... Agent: Hamilton Sundstrand Corporation

20140098496 - Power conversion apparatus including semiconductor modules and cooler: The power conversion apparatus includes semiconductor modules constituting a part of a power conversion circuit, a cooler including coolant passages, and a frame holding the semiconductor modules and the cooler. The semiconductor modules and the coolant passages are stacked on one another to form a stacked body. The cooler includes... Agent: Denso Corporation

20140098497 - Transceiver assembly: A transceiver assembly includes a transceiver module having ribs and a thermal interface member on an outer surface and a receptacle assembly receiving the transceiver module. The receptacle assembly includes a heat sink and a clip coupling the heat sink to a guide frame. The heat sink has a heat... Agent: Tyco Electronics Corporation

20140098498 - Power system and power converting device thereof: A power converting device includes a first substrate, a driving module, and a converting module. The first substrate is inserted into a main plate. The first substrate has a first axial direction and a second axial direction perpendicular to the first axial direction, the second axial direction is perpendicular to... Agent: Chicony Power Technology Co., Ltd

20140098499 - Electronic device, structure, and heat sink: An electronic device includes a substrate (101), a conductor plane (104) which is provided on an inner layer of the substrate (101), an electronic circuit (102) which is mounted on the substrate (101), a heat sink (103) which is mounted on an upper surface of the electronic circuit (102), includes... Agent: Nec Corporation

20140098500 - Shield frame, shield frame mounting structure, and electronic portable device: A shield frame includes a side plate part that extends so as to be arranged vertically from a circuit board, on which electronic components are mounted, and to surround lateral sides of the electronic components. The side plate part has a base end part that faces the circuit board, and... Agent: Nec Casio Mobile Communications, Ltd.

20140098501 - Cover lay film and flexible printed wiring board: A cover lay film includes an electromagnetic wave shielding layer formed of a conductive material, a resistor layer having a greater surface resistance than the electromagnetic wave shielding layer, and an insulating resin layer provided between the electromagnetic wave shielding layer and the resistor layer, wherein a plurality of openings... Agent: Shin-etsu Polymer Co., Ltd.

20140098503 - Electronic device: An electronic device includes a casing, a circuit board, an electronic component and a plurality of conductive elements. The circuit board is disposed in the casing. The electronic component is disposed on the circuit board and has a shielding surface and an electronic components body, in which the shielding surface... Agent:

20140098502 - Metallization and anodization of plastic and conductive parts of the body of an apparatus: A method of fabricating at least a portion of the body of an apparatus, such as a portable electronic device, that includes both plastic and conductive parts is provided with the body appearing relatively seamless such that the interface between the plastic and conductive parts is indistinguishable. In this regard,... Agent: Nokia Corporation

20140098504 - Electroplating method for printed circuit board: Disclosed is an electroplating method for printed circuit board. The method includes: providing a printed circuit board including a circuit pattern, a pad part on which components are mounted, a terminal part for electrical connection to an external device, and a connector part; masking the portion of the printed circuit... Agent: Ymt Co., Ltd.

20140098505 - Heterogeneous encapsulation: An improved method for producing a PCB assembly requiring at least two different encapsulants is disclosed. The PCB assembly may have two or more separate regions in which electronic devices are attached. In each region, a unique encapsulant with different mechanical, electrical, physical and or chemical properties is used according... Agent: Apple Inc.

20140098506 - Reduced pth pad for enabling core routing and substrate layer count reduction: Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.... Agent:

20140098507 - Printed circuit board, semiconductor package using the same, and method for manufacturing the printed circuit board and the semiconductor package: The present invention relates to a printed circuit board, a semiconductor package using the same, and a method for manufacturing the printed circuit board and the semiconductor package. The method for manufacturing a semiconductor package in accordance with the present invention includes: forming a circuit of a predetermined pattern on... Agent: Samsung Electro-mechanics Co., Ltd.

20140098508 - Direct connect orthogonal connection systems: A direct-connect orthogonal electrical connection system with improved high frequency performance is provided. A conductive member is provided between first and second components, each having signal and ground conductors. The conductive member is electrically coupled to ground conductors of both the first and second components and may also have openings... Agent: Amphenol Corporation

20140098509 - Electronic device and method for manufacturing thereof: An electronic device includes a first substrate, a second substrate that is disposed to be superposed over the first substrate, a connector that connects the first substrate to the second substrate, an inter-substrate frame that is disposed between the first substrate and the second substrate and includes a wall portion,... Agent: Fujitsu Limited

20140098511 - Displaying apparatus and mobile electronic device and displaying frame thereof: Disclosed are a displaying apparatus, a mobile electronic device, and a displaying frame. The displaying apparatus includes a mobile electronic device and a displaying frame. The mobile electronic device includes an electrical power contact, a circuit-breaking contact, and a battery circuit. The electrical power contact is electrically connected to the... Agent: Inventec Appliances Corp.

20140098510 - Electronic device and fixing structure thereof: An electronic device includes a fixing structure and an electronic component. The fixing structure includes a base, a locking element, and a fixing element. The base has a first position-limiting portion, a second position-limiting portion, and an assembling portion. The locking element and the fixing element respectively have a first... Agent: Wistron Corporation

20140098512 - Lightweight electronic device for automotive applications and method: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical... Agent: Delphi Technologies, Inc.

  
04/03/2014 > 80 patent applications in 53 patent subcategories.

20140092499 - Display panel driver circuit and overheat protection device thereof: A display panel driver circuit includes multiple drivers adapted for cooperatively driving a display panel and each operable under a protection mode, and an overheat protection device including multiple protection circuits, each of which controls a respective one of the drivers to operate under the protection mode in response to... Agent: Ili Technology Corporation

20140092500 - Ground loss monitoring circuit and integrated circuit comprising the same: A reference voltage loss monitoring circuit having a first and second reference node. The reference nodes are connected to a voltage reference. A first connection device is connects the first reference node to the second reference node, and includes a first diode to allow a current flowing from the first... Agent: Freescale Semiconductor, Inc.

20140092501 - Motor controller with reverse-bias preventing mechanism: A motor controller with a reverse-bias preventing mechanism includes a pre-charging unit, a protection unit, a conversion unit and a control unit. The pre-charging unit receives a power signal through a first electric-conduction path, and converts the power signal into a pre-charging signal according to a control signal. The protection... Agent: Industrial Technology Research Institute

20140092502 - Residual current device (rcd) with earth current sensing: Safety apparatus is disclosed for use with a load circuit connectable to a power supply via an Active conductor and a Neutral return conductor and including an Earth return conductor. The apparatus comprises means for detecting a difference in load current flowing between an energized Active conductor and the Neutral... Agent: Hybrid Electronics Australia Pty . Ltd.

20140092503 - Processor-based circuit interrupting devices: Circuit interrupting devices are provided. One circuit interrupting device includes a fault sensor configured to output a sensor signal; a voltage sensor configured to sense a reference voltage; and a controller configured to determine an occurrence of an actual fault based on the sensor signal and the reference voltage. The... Agent: Leviton Manufacturing Company, Inc

20140092508 - Clamping circuit, a semiconductor apparatus including the same, and a clamping method of the semiconductor apparatus: A semiconductor apparatus that includes: a first high-voltage transistor having a gate and a first electrode, wherein the first electrode is connected to a first pad and a parasitic capacitance forms between the gate and the first electrode; and a clamping circuit that is connected to the gate of the... Agent:

20140092504 - Electrostatic discharge protection device: An electrostatic discharge protection device including a silicon-controlled rectifier and a path switching circuit is provided. The silicon-controlled rectifier includes a first connection terminal, a second connection terminal, a first control terminal and a second control terminal, wherein the first connection terminal and the second connection terminal are respectively connected... Agent: Macronix International Co., Ltd.

20140092510 - Esd protection device of touch panel: An ESD protection device for a touch panel is disclosed. The protection device includes an ESD protection circuit, and a protection switch connected in series with the ESD protection circuit. The protection switch is configured to turn on in response to an electrostatic potential of a sensing line or a... Agent: Shanghai Tianma Micro-electronics Co., Ltd.

20140092506 - Extended drain non-planar mosfets for electrostatic discharge (esd) protection: Snapback ESD protection device employing one or more non-planar metal-oxide-semiconductor transistors (MOSFETs) are described. The ESD protection devices may further include lightly-doped extended drain regions, the resistances of which may be capacitively controlled through control gates independent of a gate electrode held at a ground potential. Control gates may be... Agent:

20140092511 - Input/output circuit having an inductor: An input/output (I/O) circuit includes an electrostatic discharge (ESD) protection circuit electrically coupled with an output node of the I/O circuit. At least one inductor and at least one loading are electrically coupled in a series fashion and between the output node of the I/O circuit and a power line.... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20140092507 - Mitigating cross-domain transmission of electrostatic discharge (esd) events: An electrostatic discharge (ESD) device is implemented within a power domain to mitigate imparting ESD induced voltages on other power domains for reducing integrated circuit (IC) failures. A first power domain includes an interface with a first terminal where an ESD event is received. The interface includes a second terminal... Agent: Synopsys, Inc.

20140092509 - Protection circuit, interface circuit, and communication system: A protection circuit includes a control circuit coupled to a first power-supply wire applied with a first power-supply voltage. The control circuit generates a control voltage in accordance with the first power-supply voltage and an input voltage. A voltage limitation circuit is coupled between a first node applied with the... Agent: Fujitsu Semiconductor Limited

20140092505 - Sort probe over current protection mechanism: An apparatus includes a probe card, a plurality of sort probes coupled to the probe card and detector circuitry to detect a real time over current occurrence at the sort probes.... Agent:

20140092512 - Battery tester: A battery tester capable of measuring resistance and voltage of a battery using the same input channel. When measuring battery resistance, a testing signal circuit is electrically coupled to two electrodes of a subject battery to conduct a testing signal used in the battery resistance measurement. A response sensing circuit... Agent:

20140092513 - Overvoltage protector: An overvoltage protector having a housing and at least one overvoltage limiter arranged in the housing, especially a gas-filled surge arrester (1), a suppressor diode (2) or a varistor. The functional ability and the state of the overvoltage protector can be controlled during operation by associating a monitoring component with... Agent: Phoenix Contact Gmbh & Co. Kg

20140092514 - Modular lightning surge protection apparatus: A modular lightning surge protection apparatus is applied to a single-phase three-wire power system with a line, a neutral, and a ground. The modular lightning surge protection apparatus includes a substrate, a surge protection unit, a first temperature fuse, and a second temperature fuse. The surge protection unit has a... Agent: Ceramate Technical Co., Ltd.

20140092515 - Electromagnetic coil drive device: An electromagnetic coil drive device has a semiconductor switch connected in series with an electromagnetic coil for controlling a current supplied to the coil; a capacitor; a comparator for comparing a voltage to charge and discharge the capacitor with two different voltages, for generating a signal to operate on-off of... Agent: Fuji Electric Fa Components & Systems Co., Ltd.

20140092517 - Electromagnetic relay: The present invention is provided with a fixed contact; a movable contact which selectively contacts with or separates from the fixed contact; and a drive means which has at least an electromagnetic coil and drives the movable contact so that the movable contact comes into contact with the fixed contact.... Agent: Nissan Motor Co., Ltd.

20140092516 - Modified electrical actuation of an actuator for determining the time at which an armature strikes a stop: A method is disclosed for operating an actuator having a coil and a displaceably mounted armature driven by a magnetic field generated by the coil, in a measurement operating mode for ascertaining a time at which the armature reaches its stop position after activation of the actuator. The method includes... Agent:

20140092518 - Method for suppressing electrical discharges between a web exiting an unwinding roll and a first conveyance roller: When neutralizing the static charges on both sides of a web exiting an unwinding roll, the inside surface of the web may carry a high level of static charge from the unwinding roll to the first conveyance roller. An electrical discharge between the charged inside surface of the web and... Agent: Electrostatic Answers LLC

20140092519 - Touch panel, touch display device and method for manufacturing the touch panel: The embodiments of the present invention disclose a touch panel, a touch display device and method for manufacturing the touch panel. The touch panel comprises a first electrode wire, a second electrode wire being intersected with the first electrode wire, wherein, the first electrode wire comprises first electrodes and a... Agent: Beijing Boe Optoelectronics Technology Co., Ltd.

20140092520 - Equipment for quantum vacuum energy extraction: Embodiments of the present invention comprise different equipment for efficiently and relatively inexpensively producing Casimir cavities for use in quantum vacuum energy extraction. The equipment includes without limitation, sintered materials; submicron porous filter materials; web roll-to-roll produced mesh or foil layers; nanotube arrays; web roll-to-roll produced porous membranes such as... Agent:

20140092521 - Method and equipment for quantum vacuum energy extraction: Embodiments of the present invention comprise different methods and equipment for efficiently and relatively inexpensively producing Casimir cavities for use in quantum vacuum energy extraction. The methods include without limitation, sintering; submicron porous filter materials; web roll-to-roll produced mesh or foil layers; nanotube arrays; web roll-to-roll produced porous membranes such... Agent:

20140092522 - Multilayer ceramic capacitor: There is provided a multilayer ceramic capacitor. The capacitor includes: a multilayer body having a dielectric layer; and first and second internal electrodes disposed in the multilayer body, the dielectric layer being disposed between the first and second internal electrodes, wherein, in a cross-section taken in a width-thickness direction of... Agent: Samsung Electro-mechanics Co., Ltd.

20140092523 - Bone frame, low resistance via coupled metal oxide-metal (mom) orthogonal finger capacitor: An orthogonal finger capacitor includes a layer having an anode bone frame adjacent a cathode bone frame, the anode bone frame having a first portion extending along an axis and a second portion extending perpendicular to the axis. A set of anode fingers extends from the first portion. A set... Agent: Qualcomm Incorporated

20140092524 - Capacitor and method of manufacturing the same: There is provided a capacitor, including: a substrate part including a first substrate having a groove portion and a second substrate positioned above the first substrate and having a protrusion portion; a first capacitance part formed on one surface of the first substrate and having a shape corresponding to that... Agent: Samsung Electro-mechanics Co., Ltd.

20140092525 - Dielectric composition and multilater ceramic electronic component manufactured using the same: There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectric composition including a dielectric grain having a perovskite structure represented by ABO3, wherein, when an imaginary line is drawn in a direction from a center of the dielectric grain to a grain... Agent: Samsung Electro-mechanics Co., Ltd.

20140092526 - Dielectric ceramic and single-plate capacitor: A dielectric ceramic that contains, as its main constituent, a perovskite-type compound containing Ba and Ti, and, with respect to the Ti content of 100 parts by mole, contains Re1 (Re1 is at least one element of La and Nd) in the range of 0.15 to 3 parts by mole,... Agent: Murata Manufacturing Co.,ltd.

20140092527 - Electrical storage device: An electric double-layer capacitor having a capacitor element, a package defining a closed space accommodating the capacitor element, and electrolytic solution loaded in the closed space. The package includes a body and a lid, and the body has a metallic portion and a resin portion. The metallic portion includes two... Agent: Murata Manufacturing Co., Ltd.

20140092528 - High surface area carbon materials and methods for making same: In a method of making a high surface area carbon material, a precursor organic material is prepared. The precursor organic material is subjected to a first elevated temperature while applying a gaseous purge thereto for a first predetermined time. The precursor organic material is subjected to a second elevated temperature... Agent:

20140092529 - Electroconductive polymer solution and method for producing the same, electroconductive polymer material, and solid electrolytic capacitor using the same and method for producing the same: Provided are an electroconductive polymer solution in which the carbon material has excellent dispersibility, an electroconductive polymer material which has a high electroconductivity and which can be produced by a simple method, and a solid electrolytic capacitor and a method for producing the same which has a low ESR without... Agent: Nec Tokin Corporation

20140092536 - Case utilizing reinforced film for in-mold labeling: Described is a case for enclosing a personal electronic device including a first layer co-molded with a second layer and permanently affixed together to form a one-piece assembly; and a reinforcing member. The first layer includes a bottom surface, side surfaces joined to the bottom surface and extending upward therefrom,... Agent: Speculative Product Design, LLC

20140092531 - Display system for mobile electronic devices and associated methods: A display fixture for securely displaying a mobile device includes a cross brace and at least two corner members. The cross brace defines a center portion and arms each radially extending outwardly therefrom and terminating in a free end opposite the center portion. The at least two corner members each... Agent: Target Brands, Inc.

20140092538 - Electronic apparatus: An electronic apparatus includes: a panel having at least one of an input section and a display section; a main body configured to retain the panel rotatably; and a retention mechanism configured to retain the panel at a predetermined rotation angle. The retention mechanism includes: a retaining member provided in... Agent: Brother Kogyo Kabushiki Kaisha

20140092539 - Electronic apparatus: Provided is an electronic apparatus that has enhanced strength and reduced weight. An electronic apparatus includes: a housing having two faces that face each other, having an accommodation space therein, and having an opening on one of the two faces; and an electronic device contained in the accommodation space. The... Agent: Sony Corporation

20140092534 - Electronic device having card holder: An electronic device includes a housing, a card holder, and a card holder mechanism. A sidewall of the housing defines a slot. A projection protrudes from the card holder. The card holder control mechanism includes a knob and a rotatable plate. The knob includes an operation portion and a connecting... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20140092537 - Housing for electronic device and manufacturing method thereof: A housing forms the appearance of an electronic device. A method of manufacturing the housing includes selecting at least one fiber substrate for securing rigidity and at least one fiber substrate for securing ductility, determining quantity and stacking sequence of the selected fiber substrates, and laminating and attaching the fiber... Agent: Samsung Electronics Co., Ltd.

20140092533 - Lock mechanism and related electronic device: A lock mechanism includes a base, a constraining component, a recovering component, a bridging component and an actuating component. The constraining component contacts against a fix portion of an electronic component to constrain its movement. The recovering component includes a bar, a first inclined structure and a second inclined structure.... Agent: Wistron Corporation

20140092530 - Power inverter: In an embodiment, a power inverter casing, comprises: a body having a first component removably attached to a second component, wherein, when joined, a recess is formed therebetween; a member removably attached to the first component and the second component opposite the recess; and a handle located in the recess... Agent:

20140092535 - Sliding mechanism and electronic apparatus having same: An electronic apparatus includes a base, a sliding member and a sliding mechanism. The sliding mechanism includes a first magnet disposed in the sliding member, and a first electromagnet disposed in the base opposite to the first magnet. The first magnet and the first electromagnet are capable of producing a... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20140092532 - Systems and methods for securing components of an electronic device: Systems and methods for securing components of an electronic device are provided. In some embodiments, the electronic device may include a housing having an opening, a cover resting on a portion of the electronic device in a first cover position within the opening, and a lock component configured to move... Agent: Apple Inc.

20140092540 - Portable electronic device: A portable electronic device includes a computer body, a display, and a telescopic structure respectively connected to the computer body and the display. The computer body has a first side edge; the display has a backside; and the telescopic structure includes a first plate and a second plate. The first... Agent:

20140092542 - Electronic device having passive cooling: An electronic device is provided that includes a base having a top portion and a bottom portion. The bottom portion may include a first bottom part and a second bottom part. The first bottom part may form a first plane, and the second bottom part may form a second plane,... Agent:

20140092543 - Keyboard integrated nfc antenna: A metal baseboard with a planar shape which is placed close to a Near Field Communication (NFC) radio antenna may be configured with a number of slots in the metal. These slots may disrupt the eddy current that would otherwise be induced in the metal by magnetic emissions emanating from... Agent:

20140092544 - Electronic device having passive cooling: An electronic device is provided that includes a base having a first side and a second side, and a lid having a first side and a second side. The electronic device may also include a heat exchanger provided at the base. The heat exchanger may have a first surface exposed... Agent:

20140092545 - Portable workstation: The portable workstation includes a portable housing and a plurality of office modules disposed therein. The office modules include a computer module, a scanner module, printer module and a projector module. The computer module is the main interface for operating the other modules. A plurality of fans are disposed at... Agent: Umm Al-qura University

20140092546 - Retractable docking system: An information handling system (IHS) docking system includes an IHS chassis defining an alignment member passageway and an IHS connector opening. An IHS connector is movably coupled to the IHS chassis adjacent the IHS connector opening and resiliently biased into a retracted orientation. An alignment member securing device is moveably... Agent: Dell Products L.p.

20140092547 - Integrated assembly for installing integrated circuit devices on a substrate: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the... Agent:

20140092548 - Micro damper device: A micro damper device comprising a main body, a cover, a sensor component and a control component is provided. The main body has a first surface, a second surface, a convex and a coil. A current is introduced to the coil to form a magnetic field with a first and... Agent:

20140092549 - Container-type data center and air-conditioning control method: A container includes a server and a management server. A general fan takes in outside air to the container and sends the taken-in outside air to the server. An internal server fan is built into the server and cools down a CPU provided in the server. A fan-operation management unit... Agent: Fujitsu Limited

20140092550 - Thermal chamber partition and fan unit for computer system: A method and apparatus are configured to partition a computing system chassis (22, 222) interior into first and second thermal chambers (60, 62, 260, 262), wherein the first thermal chamber (60, 260) includes a processor (24, 224), a memory (30, 230) and a chipset (28, 228) and the second thermal... Agent: Hewlett-packard Development Company, L.p.

20140092541 - Server: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan... Agent: Huawei Technologies Co., Ltd.

20140092551 - Dielectrophoretic cooling solution for electronics: At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the... Agent: Hamilton Sundstrand Corporation

20140092552 - Protective cover for laptop computer: An exterior cover for a laptop computer having a display portion and a keyboard portion is disclosed. The exterior cover includes a first rigid planar element for placement on an outside surface of the display portion. The first rigid planar element includes a raised edge along a perimeter of the... Agent: Tech Shell, Inc.

20140092553 - Blower assembly for electronic device: In one embodiment a blower comprises a case comprising a first surface, a second surface opposite the first surface, and a side wall extending between portions of the first surface and the second surface, wherein the side wall comprises an air inlet and an air outlet, an impeller disposed in... Agent:

20140092554 - Electronic device: An electronic device comprises an enclosure, an air blower disposed within the enclosure, an air blower mounting member for mounting the air blower within the enclosure, and a card holder that is disposed using part of the air blower mounting member so as to overlap with the air blower mounting... Agent: Fujitsu Limited

20140092555 - Heat-dissipating for electronic device: Various embodiments in accordance with the present invention provide a housing, a support, and a heat-dissipating assembly for an electronic device. A heat-dissipating opening is disposed on a rear cover of the housing. The heat-dissipating opening is disposed in correspondence with a heat-generating means of the electronic device. A covering... Agent: Nvidia Corporation

20140092556 - Integrated blower diffuser and heat exchanger for electronics enclosure: An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is... Agent: Hamilton Sundstrand Corporation

20140092557 - Electronic device with heat dissipating module: An electronic device includes a bottom enclosure and a heat dissipating module. The heat dissipating module includes an installation box, a fan received in the installation box, and a plurality of fins secured to the installation box and closed to the fan. The installation box defines a cutout located between... Agent:

20140092558 - Dielectrophoretic restriction to prevent vapor backflow: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an... Agent: Hamilton Sundstrand Corporation

20140092559 - Cooling device and electronic apparatus: A cooling device includes: a heat dissipating part disposed at an end of a heat transfer member; a heat-receiving plate disposed at the other end of the heat transfer member, provided opposite to a noise-generating part mounted on a circuit board, and thermally coupled to the noise-generating part; and a... Agent:

20140092560 - Force and heat spreading pcb for lcd protection and interconnection: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer... Agent: Apple Inc.

20140092561 - Handheld mobile device and back cover for the same: In various embodiments, a handheld mobile device and back cover for the same are provided. The back cover for a handheld mobile device comprises: a back cover body having a first surface and a second surface opposite to the first surface; and a heat dissipating plate fixed to the first... Agent: Nvidia Corporation

20140092562 - Insulation and heat radiation structure of power device, circuit board, and power supply apparatus: Embodiments of the present application provide an insulation and heat radiation structure of a power device, a circuit board, and a power supply apparatus. The insulation and heat radiation structure of the power device includes a power device, an insulation ceramic piece, and a heat radiator, where the power device... Agent: Huawei Technologies Co., Ltd.

20140092563 - Heat radiating substrate and method for manufacturing the same: Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control... Agent: Samsung Electro-mechanics Co., Ltd.

20140092564 - Electronic apparatus and method for assembling the same: An electronic apparatus including a housing, a motherboard, a battery module and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery module is disposed in the accommodating space and stacked over the motherboard.... Agent: Htc Corporation

20140092565 - Optical module with an electronic connector aligned with a substrate and a method to assemble the same: An optical module having a substrate and an electrical connector whose terminals are precisely aligned with pads on the substrate is disclosed. The electrical connector provides upper and lower terminals, while, the substrate provides upper and lower pads each having a V-shaped cut opened for a direction along which the... Agent: Sumitomo Electric Industries, Ltd.

20140092566 - Electronic device: According to one embodiment, device includes first housing, second housing, flexible display, and driving portion. The first housing includes first surface. The second housing is foldably connected to the first housing and includes second surface positioned close to the first surface in folded state and positioned away from the first... Agent:

20140092567 - Clip assembly and electronic device including the same: A clip assembly includes a seat having a surrounding wall with a receiving hole, and a locking mechanism proximate to the surrounding wall and including a pair of movable levers. Each movable lever has an engaging portion movably inserted into the receiving hole, and a driven portion. A drive unit... Agent: Lite-on Electronics (guangzhou) Limited

20140092568 - Display device with height adjustment structure and terminal having the same: A display device and a terminal having the same are disclosed. The terminal includes a base including a circuit board provided therein, and upper and lower housings, a support configured with one side combined with at least a portion of the lower housing and the other side having a head... Agent: Samsung Electronics Co., Ltd.

20140092570 - Electronic assembly and method of manufacturing same: An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly... Agent: Trw Automotive U.s. LLC

20140092569 - Wiring board: A wiring board includes a base wiring board 10 and a frame wiring board 20. The base wiring board 10 has an element mounting portion 1a and a frame-shaped frame joining portion 1b on the upper surface and a solder resist layer 4 deposited in a portion between the element... Agent: Kyocera Slc Technologies Corporation

20140092571 - Systems and methods for ejecting removable entities from electronic devices: Systems and methods for ejecting removable entities from electronic devices are provided. A removable entity ejection system may include a driver that may be controllable by software (e.g., via a control unit that may be configured to send electrical signals to the driver). The driver may include a driving component... Agent: Apple Inc.

20140092572 - Bga structure using ctf balls in high stress regions: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a... Agent:

20140092573 - Contact protection for integrated circuit device loading: In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a... Agent:

20140092574 - Integrated voltage regulators with magnetically enhanced inductors: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV... Agent:

20140092575 - Zero-length or near-zero-length lead for electrical component: An inductor assembly includes an inductor body including an inductor core and a mounting bracket that includes a first leg, a second leg, and a third leg. A portion of the mounting bracket passes through the inductor body, at least one of the first leg and the second leg of... Agent: Murata Manufacturing Co., Ltd.

20140092576 - Film interposer for integrated circuit devices: In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated... Agent:

20140092577 - Unit mounting device, electronic device system, and method for manufacturing unit mounting device: A unit mounting device is a unit mounting device on which an electronic device unit 1 is mounted, and includes a base portion provided to face a side surface of the electronic device unit, an upper-side eaves portion formed to extend from an upper part of the base portion towards... Agent: Mitsubishi Electric Corporation

20140092578 - Shield can of mobile terminal: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield... Agent: Samsung Electronics Co., Ltd.

  
03/27/2014 > 103 patent applications in 60 patent subcategories.

20140085756 - Protection circuit and electronic device using the same: A protection circuit connected between a power supply and a load comprises an interface unit, a control unit, and a first switching unit. The interface unit is capable of connecting to the load. The control unit generates a variable duty cycle of a pulse width modulation (PWM) signal when the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20140085757 - Surge blocking inductor: A surge blocking inductor. In one embodiment, the surge blocking inductor comprises a core; a first winding wound about the core in a first direction; and a second winding wound about the core in a second direction, wherein the first winding and the second winding are magnetically independent when the... Agent: Enphase Energy, Inc.

20140085758 - Integrated circuit device and method of enabling thermal regulation within an integrated circuit device: An integrated circuit device comprising at least one electrostatic discharge (ESD) clamp device. The at least one ESD clamp device comprises a first channel input, a second channel input, and a control input arranged to receive a control signal. The at least one ESD clamp device is arranged to selectively... Agent: Freescale Semiconductor, Inc

20140085759 - Power supply circuit and polarity reversal protection circuit: A power supply circuit for a voltage step-up circuit comprises a diode and a first controllable semiconductor, wherein the diode is connected in series to the first controllable semiconductor in a main current direction of the first controllable semiconductor. The diode electrically connects an output of the first controllable semiconductor... Agent:

20140085760 - Active clamp protection circuit for power semiconductor device for high frequency switching: A protection circuit for a power transistor includes a first transistor connected in parallel with the power transistor and having a control terminal connected to a first power supply voltage through a first resistive element; and a first set of diodes connected between a first terminal and a control terminal... Agent: Alpha & Omega Semiconductor, Inc.

20140085761 - Low power analog switch circuits that provide over-voltage, under-voltage and power-off protection, and related methods and systems: Analog switch circuits, methods for use with analog switch circuits, and devices and systems including analog switch circuits are disclosed herein. Such analog switch circuits include an analog switch input terminal (In), an analog switch output terminal (Out), and an analog switch control terminal (Ctl). During a normal-voltage condition, the... Agent: Intersil Americas LLC

20140085762 - Inverter drive device: An inverter drive device includes a drive circuit that outputs a gate voltage signal of a power semiconductor element; and a Zener clamping protection circuit that acquires an emitter electrode side voltage of the power semiconductor element, and, if that voltage is greater than a predetermined voltage value, performs clamping... Agent: Hitachi Automotive Systems, Ltd.

20140085763 - Fault detection and short circuit current management technique for inverter based distributed generators (dg): Systems, methods, and devices relating to fault detection and short circuit current management support in power transmission and distribution networks using multiple inverter based power generation facilities. A fault detection process uses the waveshape (or the rate of change of the current) of the distributed generator output short circuit current... Agent:

20140085764 - Series r-c graded gap assembly for mov arrester: A gap assembly for a arrester includes a spark gap assembly and an MOV block disposed electrically in series with the spark gap assembly. The spark gap assembly includes a resistor, a capacitor disposed electrically in series with the resistor and a spark gap disposed electrically parallel to the resistor... Agent: Hubbell Incorporated

20140085765 - Magnetorheological devices and associated methods of control: Embodiments of magnetorheological systems, devices, and associated methods of control are described below are described herein. In one embodiment, a magnetorheological device includes an magnetorheological fluid, a shaft proximate and mechanically coupled to the magnetorheological fluid, and a magnetic field generator configured to generate a magnetic flux through the magnetorheological... Agent: Washington State University

20140085766 - Anti-static and lightning compatible transport element: Described are transport elements for dissipating electrostatic charge including at least two outer structural layers coupled in an overlapping arrangement. Some examples may include a transport element having an inner structural layer coupled to an inner surface of the at least two outer structural layers. Other examples may include an... Agent: Aerazur S.a.

20140085768 - Multilayer ceramic capacitor: A multilayer ceramic capacitor, whose CR product can be prevented from dropping with certainty even at a thickness of 1.0 μm or less, includes multiple unit capacitors wherein a part constituted by two adjacent internal electrode layers in the laminating direction and one dielectric layer present between the two internal... Agent: Taiyo Yuden Co., Ltd.

20140085769 - Multilayer ceramic capacitor: A multilayer ceramic capacitor has multiple laminated dielectric ceramic layers made of a dielectric ceramic, internal electrodes formed between the dielectric ceramic layers, and external electrodes electrically connected to the internal electrodes, wherein generation of cracks in the dielectric layer due to expansion of the internal electrode is suppressed by... Agent: Taiyo Yuden Co., Ltd.

20140085767 - Multilayer ceramic capacitor and method of manufacturing the same: There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces opposing each other and third and fourth end surfaces connecting the first and second side surfaces, first and second internal electrodes formed in the ceramic body and having one ends exposed to the... Agent: Samsung Electro-mechanics Co., Ltd.

20140085770 - Chip device and method for manufacturing the same: Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external... Agent: Samsung Electro-mechanics Co., Ltd.

20140085771 - Quaternary data-storage materials and the preparation method thereof: s

20140085772 - Direct current capacitor module: A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the... Agent: Samhwa Capacitor Co., Ltd.

20140085774 - Electrolyte and electric double-layer capacitor using same: An electrolyte includes an organic solvent, a solute and a compound represented by chemical formula [1], both contained in the organic solvent. R1 and R2 represent a methyl group or an ethyl group; R3 represents a functional group having a straight chain including three or more carbon atoms and a... Agent:

20140085773 - Hybrid electrochemical energy storage device: Disclosed is a hybrid electrochemical energy storage device which can store much larger energy density than known electrochemical double layer capacitors (EDLC's) and, simultaneously, can provide high power density and efficiency comparable with those of known EDLC's.... Agent: Yunasko Limited

20140085775 - Electrolytic capacitor and method of manufacturing the same: There is provided an electrolytic capacitor which includes a capacitance portion that includes an anode and a cathode foils wound around, a separator being provided between the foils, a first conductor bar connected to the anode foil, a second conductor bar to the cathode foil, a casing that houses the... Agent: Fujitsu Limited

20140085776 - Multiple cable connector: A power or signal cable connector for allowing two or more electric devices to be connected to a single socket, the connector comprising: a shell having a first mounting block and a second mounting block; a nose piece assembly fastened to one end of the shell; a handle assembly fastened... Agent:

20140085781 - Button assembly and electronic device using the same: An electronic device includes a housing defining an opening, a button body and a sealing member. The button body includes a cap member, a key rod, a resisting rod, and a protruding member. The protruding member protrudes from a lateral surface of the resisting rod. The protruding member includes a... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20140085788 - Computer security lock for trapezoidal security slot: A lock that is configured to be attached to electronic equipment requiring securing against theft and the lock comprising: a lock body; a locking element protruding from the lock body and having a forward distal section that is comparatively wider in cross-sectional size compared to a rear section thereof, the... Agent:

20140085783 - Display device with variable height and angles of view by virtue of rotatable stand: A stand, rotatable through approximately 180 degrees, supports a display device in such a way that whilst the height of the display device above a supporting surface is variable, a full range of viewing angles is also available at any height.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140085780 - Display module and front frame, back frame and plastic frame used in the same: A display module and a front frame, a back frame and a plastic frame used in the display module are disclosed by the invention. The display module includes a front frame, a back frame, a plastic frame and a display unit. The front frame has a top-plate, a plurality of... Agent: Hannstar Display Corporation

20140085779 - Display panel device and a display apparatus comprising the display panel device: A display panel device (1) comprises a front frame (3), a rear frame (5) and a display panel assembly (7) substantially positioned between the front frame and the rear frame. The front frame is provided with a front frame face (3a) directed to the display panel assembly and the rear... Agent: Tp Vision Holding B.v.

20140085786 - Electronic device: An electronic device 100 includes a casing 101 configured to accommodate electronic components. The casing 101 includes an outer layer member 131 formed by a metal and exposed to an outside, and an inner layer member 132 formed by a metal and spaced from an inner surface of the outer... Agent:

20140085785 - Electronic device with rubber pads: An electronic device comprises a chassis and a plurality of rubber pads mounted in a base panel of the chassis. A mounting hole is defined in the base panel. A protruding wall extends from an edge of the mounting hole towards an inner side of the base panel. A groove... Agent:

20140085777 - Handheld electronic apparatus with kickstand: A kickstand includes a holder, a bar, a shaft assembly, a cam assembly, and at least one spring washer. The bar is pivotally connected to the holder by the shaft assembly. The cam assembly is engaged with the holder and the bar and pivotally connected to the shaft assembly, so... Agent: Htc Corporation

20140085787 - On-vehicle electronic device: A first drive arm and a second drive arm are rotatably coupled. A tip portion of the first drive arm and a device main body are connected to each other through a first connection link, and a tip portion of a second drive arm and the device main body are... Agent: Alpine Electronics, Inc.

20140085782 - Power electronic device, power electronic system and hot plug method for power unit: The disclosed is a power electronic device comprising a power unit and a mounting cubicle matching with the power unit. The mounting cubicle is provided with a rail and an entrance for pushing into and pulling out of the power unit. A side of the mounting cubicle is provided with... Agent: Delta Electronics, Inc.

20140085784 - Snap door structure for electronic devices: The present invention discloses a snap door structure configured with an opening and a snap joint part. The snap door structure comprises a door cover, a switch puller and a stopper. The door cover is pivotally connected to the electronic device and installed in correspondence with the opening. The switch... Agent:

20140085778 - Systems and methods for high frequency isolation: Systems and methods for providing vibration isolation for a MEMS device are provided. In at least one embodiment, a system comprises a first assembly and a second assembly, wherein the second assembly and the first assembly are joined together, enclosing the MEMS device, wherein the joined first assembly and the... Agent: Honeywell Intl. Inc., Patent Services M/s Ab/2b

20140085789 - Server: A server, for being disposed in a server cabinet removably, includes a shell, a mother board, a power input port and a connecting element. The mother board is disposed in the shell. The power input port, disposed on the shell, is electrically connected to the mother board. The power input... Agent: Inventec (pudong) Technology Corporation

20140085790 - Server rack: A server rack includes a server rack main body, a mounting bracket, and a power socket secured to the mounting bracket. The server rack main body includes a frame and a pole connected to the frame. The pole includes a first inner wall and a second inner wall connected to... Agent:

20140085792 - Portable electronic device: A portable electronic device includes a lower member, an upper member, a strip-storing unit and an electric connecting strip. The lower member is provided with a keyboard module. The upper member is slidably disposed on the lower member. The strip-storing unit is disposed in the lower member. The electric connecting... Agent: Quanta Computer Inc.

20140085793 - Adjustable hinge stiffness: An assembly can include a first component; a second component that includes a socket; a processor and a memory accessible by the processor, the processor and memory being included in one or more of the first component and the second component; and an interconnection mechanism for pivotable interconnection of the... Agent:

20140085795 - Electronic device: Disclosed is an electronic device including a first body, a second body connected with the first body, and a connecting member. The connecting member is hinged with the first body via a first hinge shaft and is hinged with the second body via a second hinge shaft, such as to... Agent: Beijing Lenovo Software Ltd.

20140085794 - Locking mechanism: An assembly can include a first component; a second component; and an interconnection mechanism for pivotable interconnection of the first component and the second component about a pivot axis where the interconnection mechanism includes a latch mechanism to latch the second component to the interconnection mechanism, an actuator to unlatch... Agent:

20140085796 - Computer display or cover glass/cell attachment to frame: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive... Agent: Apple Inc.

20140085797 - Electronic device: An electronic device includes a display, a base, a stand, and a cable. The display has a space for a motherboard. The base includes a base body. A data storage device is located in the base body. The stand connects the display to the base. The cable connects the motherboard... Agent:

20140085798 - Base with counterweight for display screens: Embodiments are directed towards a support structure for electronic displays with a counterweight that is directed towards maintaining a center of gravity for the support structure, display, and counterweight over the support structure. Embodiments further disclose mechanisms for indirectly coupling the display and providing for counterweight rotations.... Agent: Myerchin Enterprises, Inc.

20140085799 - Flat panel monitor stands: The present disclosure provides flat panel monitor stands and related systems and methods. The flat panel monitor stands can comprise a base including a pedestal and a support arm extending upwardly from the pedestal, the top portion being distally positioned with respect to the pedestal. The stand can also include... Agent:

20140085791 - Non-blocking power management for on-package input/output architectures: An on-package interface. A first set of single-ended transmitter circuits on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits on a second die. The receiver circuits have no termination and no equalization. A plurality of conductive lines couple... Agent:

20140085802 - Server and host module thereof: A server comprises a cabinet and a host module placed inside or taken outside the cabinet along a rail. The host module comprises a supporting tray, a motherboard, a system storage device, a processing module and a stored data controlling module. The motherboard and the system storage device are disposed... Agent:

20140085801 - Server system: A server system includes a rack, multiple servers, an electrically conductive component, a switch, a rack management controller and a power supply. The rack has a first storage area, a middle storage area and a second storage area. The servers are positioned in the first storage area and the second... Agent: Inventec (pudong) Technology Corporation

20140085800 - Slim profile, rear docking tape drive canister: In one embodiment, an automated tape library includes an array of tape drive canister bays which each allow insertion of a tape drive canister therein that supports a tape drive, a power system, a communications system, and a robotic accessor adapted for accessing through insertion and/or removal tape cartridges in... Agent: International Business Machines Corporation

20140085803 - Mounting device for hard disk drive: A mounting device for a hard disk drive (HDD) includes a fixing plate and two fixing members. Two protrusions and a blocking piece adjacent to one of the protrusions protrude from the fixing plate. Each fixing member includes a sidewall, and a top wall and a bottom wall perpendicularly extending... Agent:

20140085804 - Server: A server comprises a frame, a middle plate fixed inside the frame, a vertical plate vertically erected on the middle plate and electrically connected to the middle plate, a mainframe detachably disposed inside the frame, a hard disk module and a power supply detachably disposed inside the frame. The vertical... Agent: Inventec (pudong) Technology Corporation

20140085805 - Storage serve: A storage server includes a cage, a midplane fixed on the cage, a fan module on midplane, at least one host, detachably disposed on the cage and electrically connected to the midplane, a plurality of HDD backplanes, detachably disposed on the cage and electrically connected to the midplane, and a... Agent: Inventec (pudong) Technology Corporation

20140085806 - Storage server system: A storage server system includes a cage, a midplane, a power supply module, a motherboard module, an HDD backplane, and a data HDD. The cage has a first end and a second end. The midplane is fixed inside the cage. The power supply module is disposed inside the cage. The... Agent: Inventec (pudong) Technology Corporation

20140085807 - Server system: A server system includes a rack, a server disposed in the rack, an electronic device and a power supply disposed in the rack. The rack includes a first side and a second side opposite to each other, two first brackets, two second brackets and two lateral rails. Each first brackets,... Agent: Inventec (pudong) Technology Corporation

20140085808 - Server system and server thereof: A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a... Agent: Inventec (pudong) Technology Corporation

20140085811 - Rack server system: A rack server system includes a container, an electrically conductive component, a power supply, a signal connecting base, a server, and an RMC. The electrically conductive component and the signal connecting base are fixed in the container. The power supply is electrically connected to the electrically conductive component for supplying... Agent: Inventec (pudong) Technology Corporation

20140085809 - Server cabinet: A server cabinet, for containing a removable server including a power input port and a connecting element, includes a container, an electrically conductive component, a power supply, a signal connecting base and a rack management controller. The electrically conductive component is connected to the power input port. The power supply... Agent: Inventec (pudong) Technology Corporation

20140085810 - Server system: A server system includes a rack, at least one server, a power supply, a network switch device and a power cable and. The rack has a front side and a rear side disposed oppositely. The rack defines an upper area, a middle area and a lower area. The middle area... Agent: Inventec (pudong) Technology Corporation

20140085812 - Arrangement of computing assets in a data center: A system of computing assets arranges a plurality of backplanes to form a perimeter of a central region of a backplane structure. A plurality of computing assets are coupled to the backplanes and extend away from the central region of the backplane structure. A plurality of air intake openings are... Agent:

20140085813 - Film or composite that includes a nanomaterial: The present disclosure relates to a film or a composite that provides excellent heat removal capabilities and improved chemical stability and methods of forming the film and the composite. The film can be a layer of a nanomaterial. The composite can include a nanomaterial and a thermal interface material (TIM).... Agent: Liquidcool Solutions

20140085814 - Portable computer support: A support for a pad computer and the like includes a body support strap which may be placed around the neck or shoulders of a user, and a body propping unit that positions a computer outwardly from the torso of the user. The body support strap connects to the body... Agent:

20140085815 - Personal cloud with a plurality of modular capabilities: A personal cloud structure for a portable computing device such as a tablet personal computer (PC), mobile phones, portable media players, or the like. The personal cloud structure may be fitted with memory, a network connection, two-way wireless charging, external memory slots, external connections and other components to create a... Agent: Micro Mobio Corporation

20140085816 - Protective enclosure for electronic device: A chemically resistant protective cover for an electronic device that has an interactive control panel includes a protective shell having a first member and a second member. The second member is configured to join with the first case. An aperture defined by the protective shell aligns with the interactive control... Agent: Otter Products, LLC

20140085817 - Immersion-cooling of selected electronic component(s) mounted to printed circuit board: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a... Agent: International Business Machines Corporation

20140085818 - Electronic component enclosure visual shield and method: An electronic device includes one or more electronic components and an electronic enclosure enclosing the electronic components. The electronic enclosure includes venting holes and flaps blocking visibility of the electronic components through the venting holes and from outside the electronic device. In addition, air readily flows through the venting holes... Agent: Brocade Communications Systems, Inc.

20140085819 - Electronic device: An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a... Agent: Inventec (pudong) Technology Corporation

20140085820 - Motor driver and cabinet: Provided is a motor driver including: a housing; an electronic component that is disposed inside the housing, and that drives or controls a motor; and a fan motor that is disposed below a top plate of the housing, and that causes air to pass from an opening in a bottom... Agent: Fanuc Corporation

20140085821 - Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices: A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at... Agent: Liquidcool Solutions, Inc.

20140085822 - Wicking and coupling element(s) facilitating evaporative cooling of component(s): Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system... Agent: International Business Machines Corporation

20140085823 - Immersion-cooling of selected electronic component(s) mounted to printed circuit board: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side... Agent: International Business Machines Corporation

20140085824 - Micro-die natural convection cooling system: A cooling system for an integrated circuit die comprises a heat exchanger and a heat transfer device. The heat transfer device is formed of a plurality of stacked foils. The stacked foils are fused at a heat exchanger region abutting the heat exchanger, and are fused at a die region... Agent: Hamilton Sundstrand Corporation

20140085827 - Circuit board for electric components and circuit board system: A circuit board for electric components has at least one current conductor, which is configured as a molded part, and at least one unhoused electric component affixed to the current conductor. The circuit board exhibits improved operating reliability.... Agent: Continental Automative Gmbh

20140085825 - Electronic device and heat conduction element thereof: A heat conduction element comprises a pressing portion and extending portions. A pressing side of the pressing portion is in thermal contact with a heat generating element. Each of the extending portions has a first end connected to the pressing portion and a second end away from the pressing portion.... Agent: Inventec (pudong) Technology Corporation

20140085826 - Electronic device and plug and play unit thereof: A plug and play unit is provided. The plug and play unit includes a unit housing, a joint, a substrate and a heat conductive member. The joint is connected to the unit housing. The substrate is disposed in the unit housing and the joint, wherein the substrate includes a heat... Agent:

20140085828 - Electronic device with heat sink: An electronic device includes a circuit board and a heat sink. A chip is mounted on the circuit board. The heat sink includes a base mounted on the chip and a number of heat-dissipation poles extending up from the base. Each pole defines a through hole extending through the base... Agent: Hon Hai Precision Industry Co., Ltd.

20140085829 - Multi-layered board and semiconductor package: The invention provides a multi-layered board and a semiconductor package including the multi-layered board with improved heat dissipation performance of the semiconductor package. A multi-layered board includes an anisotropically-conductive member that includes an insulating base which is an anodized film of an aluminum substrate and in which through-holes are formed... Agent: Fujifilm Corporation

20140085831 - Circuit board structure having measures against heat: To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted... Agent: Yazaki Corporation

20140085830 - Heat dissipating substrate, and element equipped with same: A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on... Agent: Dai Nippon Printing Co., Ltd.

20140085832 - Electronic device with efficient heat radiation structure for electronic components: An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a heat generated by the electronic components, and a heat radiation member provided between the metallic body and the heat conduction member. The heat radiation member includes a... Agent: Panasonic Corporation

20140085833 - Chip packaging substrate, method for manufacturing same, and chip packaging structure having same: A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer... Agent: Zhen Ding Technology Co., Ltd.

20140085834 - Device mounting board and semiconductor power module: In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from... Agent: Sanyo Electric Co., Ltd.

20140085835 - Dc link capacitor bank: A capacitor bank comprising at least two series chains each comprising a plurality of capacitors, wherein the series chains are coupled in parallel at corresponding points; and a fusible link arranged to form at least part of each coupling; wherein the corresponding points of each chain that are coupled to... Agent: Control Techniques Limited

20140085836 - Mobile terminal: A mobile terminal is provided. The mobile terminal a case having an inner space where electronic components are mounted, a display arranged in the inner space of the case, the display being exposed at a front surface of the case, an audio output module arranged in the inner space of... Agent: Lg Electronics Inc.

20140085837 - Method of forming flexible conduction trace, flexible conduction trace and flexible electronic device using the same: A flexible conduction trace includes a flexible line; and a plurality of conductive particles arranged in the form of pillars within the flexible line.... Agent:

20140085839 - Electronic control device: An electronic control device has an enclosure accommodating therein a circuit board and having (a) a first enclosure member which is provided at a connecting part thereof with a seal groove and (b) a second enclosure member which is provided at a connecting part thereof with a convex line that... Agent: Hitachi Automotive Systems, Ltd.

20140085838 - Monitor and working vehicle provided with the monitor: A monitor includes a display in a form of a liquid crystal display, a drive substrate that controls the liquid crystal display, a monitor substrate that is provided opposite to the drive substrate with a clearance, a resin-made holder that is disposed in the clearance between the drive substrate and... Agent: Komatsu Ltd.

20140085841 - Circuit device and method of manufacturing the same: A circuit device includes a heat detection component including lead terminals and a heat detection element, a heat-generating electronic component including lead terminals, and a substrate including a wiring pattern, holes, and lands, the heat detection component and the heat-generating electronic component being electrically connected to the substrate through the... Agent: Murata Manufacturing Co., Ltd.

20140085844 - Conducting member and electronic device provided therewith: A conducting member (2) includes a protrusion (2a) that is flange-shaped and is provided on a side surface of the conducting member (2) which side surface is in contact with a casing (1).... Agent: Sharp Kabushiki Kaisha

20140085840 - Electronic circuit and method of fabricating the same: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force... Agent: Electronics And Telecommunications Research Institute

20140085842 - Method for fabricating glass substrate package: A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a... Agent:

20140085843 - Method for producing multi-layer substrate and multi-layer substrate: A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers... Agent: Murata Manufacturing Co., Ltd.

20140085845 - Thick-film hybrid circuit structure and method of manufacture the same: A thick-film hybrid circuit structure includes a first thick-film substrate, a second thick-film substrate stacked on the first thick-film substrate and electrically connected to the first thick-film substrate, a chip and an encapsulation body. The second thick-film substrate defines a receiving area, and the chip is fixed in the receiving... Agent: Ambit Microsystems (zhongshan) Ltd.

20140085846 - Microelectronic structures having laminated or embedded glass routing structures for high density packaging: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed... Agent:

20140085847 - Wiring substrate: A wiring substrate is provided with a core substrate including a first main surface, a second main surface, and a through hole. An electronic component including a resin cover is arranged in the through hole. A projection projects from an inner wall of the through hole toward the resin cover... Agent:

20140085848 - Assembled circuit and electronic component: An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit... Agent: Delta Electronics, Inc.

20140085849 - Circuit board system comprising a spring fastened element: A circuit board system according to the invention comprises a circuit board (101), at least one element (102) mechanically supported with respect to the circuit board, and a spring-fastener (106) arranged to mechanically support the at least one element with respect to the circuit board. The spring-fastener comprises a pressing... Agent: Tellabs Oy

20140085850 - Printed circuit board with compact groups of devices: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an... Agent:

20140085852 - Multilayer ceramic electronic component: There is provided a multilayer ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers and alternately exposed through both end surfaces of the ceramic body... Agent: Samsung Electro-mechanics Co., Ltd.

20140085851 - Small form factor stacked electrical passive devices that reduce the distance to the ground plane: The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed... Agent: Apple Inc.

20140085854 - Circuit board incorporating semiconductor ic and manufacturing method thereof: Disclosed herein is a manufacturing method of a circuit board. The manufacturing method includes a first step for preparing a prepreg in which a core material is impregnated with an uncured resin. The prepreg has a through-hole surrounded by the core material and the resin so as to penetrate through... Agent: Tdk Corporation

20140085853 - Display apparatus: A display apparatus including a display and a waveguide plate is provided. The display panel includes multiple rows of display units and multiple rows of solar cell units. The display units and the solar cell units are substantially parallel to a first direction and alternately arranged along a second direction... Agent: Dongguan Masstop Liquid Crystal Display Co., Ltd.

20140085855 - Electronic device: An electronic device includes a first circuit board, a second circuit board, and a third circuit board. A plurality of loads are mounted on the first circuit board, a plurality of direct current (DC) to DC converters are mounted on the second circuit board, and an alternating current (AC) to... Agent: Hon Hai Precision Industry Co., Ltd.

20140085856 - Flexible printed circuit board and circuit-board connection structure: A terminal portion configured to obtain electrical connection with a printed circuit board includes a first signal pad that is formed in a first conductor layer and is electrically separated from a ground layer, a pair of first ground pads that is formed in the first conductor layer to sandwich... Agent: Mitsubishi Electric Corporation

20140085857 - Electronic module and method for same: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane.... Agent: Universal Scientific Industrial ( Shanghai ) Co., Ltd.

20140085858 - High-frequency package: A high-frequency package includes a first dielectric substrate having a signal line and a grounding conductor provided on a back side, a high-frequency element connected to a back side of the first dielectric substrate with a first connection conductor therebetween, a second dielectric substrate having a signal line and a... Agent: Mitsubishi Electric Corporation

  
03/20/2014 > 90 patent applications in 59 patent subcategories.

20140078622 - Circuit breakers: A circuit breaker comprising a first dc line electrically connectable to first incoming and first outgoing dc lines, wherein the first dc line comprises a first fault-interrupting switch contact system and a first switching aid network. The first switching aid network comprises first and second rectifier strings, wherein each rectifier... Agent: Ge Energy Power Conversion Technology Ltd

20140078623 - Two terminal arc suppressor: A two terminal arc suppressor for protecting switch, relay or contactor contacts and the like comprises a two terminal module adapted to be attached in parallel with the contacts to be protected and including a circuit for deriving an operating voltage upon the transitioning of the switch, relay or contactor... Agent: Arc Suppression Technologies, LLC

20140078624 - Semiconductor integrated circuit with esd protection circuit: According to an embodiment, a semiconductor integrated circuit includes a first power supply terminal, a second power supply terminal, a regulator circuit, an electrostatic discharge (ESD) protection circuit, and a level shift circuit. A first voltage is applied to the first power supply terminal. A second voltage different from the... Agent: Kabushiki Kaisha Toshiba

20140078625 - Islanding detection method and system: The present invention provides an islanding detection method and an islanding detection system. The method includes: acquiring a voltage signal at a grid-connected node of a power generation system, and extracting phase information of the voltage signal; constructing a slip-mode frequency shift islanding detection curve in the form of a... Agent: Boe Technology Group Co., Ltd

20140078627 - Plug connector protecting against overvoltage discharge: A plug connector for protecting an electrical system, in particular an electronic device, a semiconductor component or cable harness, against overvoltage discharge, includes contact pins embedded in a plastic body, wherein the plastic has an area between the contact pins that exhibits an electrical resistance with an essentially electrically insulating... Agent:

20140078626 - Protection circuit: Conditions such as overvoltage/overcurrent (e.g., electrostatic discharge (ESD)) are addressed via a current-shunting approach. As may be consistent with one or more embodiments, an apparatus includes a transistor that couples an output signal, and a thyristor-based shunt circuit having a p-type anode connected to an n-type base including a highly-doped... Agent: Nxp B.v.

20140078628 - Power distribution systems and methods of operating a power distribution system: A power distribution system includes a first circuit protection device and a second circuit protection device coupled to the first circuit protection device downstream of the first circuit protection device. The second circuit protection device includes a trip mechanism configured to interrupt a current flowing through the second circuit protection... Agent: General Electric Company

20140078629 - Semiconductor device including short-circuit protection: A semiconductor device includes a load current path operable to carry a load current from a supply terminal having a supply voltage to an output circuit node. The device further includes a voltage comparator configured to compare the supply voltage with a voltage threshold and to signal a low supply... Agent:

20140078630 - Fail operational power system with single energy storage: Method for operating a fail operational power system for a vehicle includes monitoring a first voltage on a first power distribution path and a second voltage on a second power distribution path. An isolator switch controllably operative between open and closed states is monitored. The closed state connects the first... Agent: Gm Global Technology Operations LLC

20140078632 - Battery pack, controlling method of the same, and energy storage system including the battery pack: A battery protection apparatus is disclosed. In one aspect, the apparatus includes a temperature-dependent resistor electrically connected to at least one battery cell, wherein the temperature-dependent resistor is configured to change internal resistance in a substantially inversely proportional relationship to temperature of one or more of the at least one... Agent: Samsung Sdi Co., Ltd.

20140078631 - Power distribution systems and methods of operating a power distribution system: A power distribution system includes a first circuit protection device and a second circuit protection device coupled to the first circuit protection device downstream of the first circuit protection device. The second circuit protection device includes a trip mechanism configured to interrupt a current flowing through the second circuit protection... Agent: General Electric Company

20140078633 - Circuit breaker including an electronic trip circuit, a number of temperature sensors and an over-temperature trip routine: A circuit breaker includes first and second terminals, separable contacts, conductors electrically connecting the contacts between the terminals, and an operating mechanism to open and close the contacts. A current sensor senses current flowing through the contacts and outputs a current value. A number of temperature sensors output a number... Agent: Eaton Corporation

20140078634 - Strengthening element for a mounting flange of a hollow cylindrical insulator housing: An insulator housing suitable for electrical products for high voltage, for example, surge arresters, breakers or bushings. The insulator housing includes a first cylindrical end and a second cylindrical end having a hollow insulator body. The first end and/or second end is provided with a cylindrical flange for attaching the... Agent:

20140078635 - Integrated surge protection for remote radio head power cable assemblies: A surge protection apparatus for a power cable assembly is disclosed. The surge protection apparatus is located in-line with the power cable and may be integrated into or be a separate component from the power cable assembly and provide surge protection without the need to locate a surge protection device... Agent:

20140078636 - Systems and methods for magnetic shielding: Systems and methods for magnetic shielding are described. A magnetic shield formed of a material having a high magnetic permeability may be degaussed using a toroidal degaussing coil. The toroidal degaussing coil may enclose at least a portion of the shield. Magnetic field gradients may be actively compensated using multiple... Agent: D-wave Systems Inc.

20140078637 - Apparatus and method for neutralizing static charge on both sides of a web exiting an unwinding roll: An apparatus and a method for neutralizing static charges on a web exiting an unwinding roll are disclosed. The apparatus comprises two static dissipaters. The first static dissipater is positioned to neutralize static charges on the outside surface of the unwinding roll. The second static dissipater is positioned to neutralize... Agent: Electrostatic Answers LLC

20140078638 - Stacker and static elimination device for the same: The present invention provides a stacker and a static elimination device for the same. The static elimination device is provided at both sides of each shelf of the stacker, comprising: a rectangular box which can produce charged ions, wherein a rotary shaft is provided through and connected with the rectangular... Agent:

20140078639 - Ion generation device: The present invention provides methods and systems for an ion generator device that includes a base, a first and second pair of spaced-apart, opposed sidewalls projecting from the base to collectively form an interior storage compartment and to define an upper edge, a top portion engaged to the upper edge,... Agent:

20140078640 - Thin film device and method for manufacturing thin film device: In a thin film device including a thin film electrode which has a main electrode layer formed of tungsten, a thin film electrode having a low resistivity is realized. There is provided a thin film device including a thin film electrode that has an underlayer and a main electrode layer... Agent: Murata Manufacturing Co., Ltd.

20140078642 - Laminated ceramic capacitor and producing method for laminated ceramic capacitor: A laminated ceramic capacitor having high electrostatic capacitance and excellent lifetime characteristics, even when in a high electric field intensity employs a dielectric ceramic including crystal grains and crystal grain boundaries which contains, as its main constituent, a perovskite-type compound including Ba, Ca, and Ti, and further contains Mg, R... Agent: Murata Manufacturing Co., Ltd.

20140078641 - Laminated ceramic electronic component and manufacturing method therefor: A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal... Agent: Murata Manufacturing Co., Ltd.

20140078643 - Electronic component and method for producing same: An electronic component comprises: a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers. A plurality of first lead-out conductors are exposed between the insulator layers at the mounting surface. A first external electrode covers the first... Agent: Murata Manufacturing Co., Ltd.

20140078644 - Energy storage device, method of manufacturing same, and mobile electronic device containing same: An energy storage device includes a first electrode (110, 510) including a first plurality of channels (111, 512) that contain a first electrolyte (150, 514) and a second electrode (120, 520) including a second plurality of channels (121, 522) that contain a second electrolyte (524). The first electrode has a... Agent:

20140078645 - Method for manufacturing solid electrolytic capacitor: There is provided a method to provide a capacitor element including a porous body of a valve metal, and a dielectric layer of an oxide layer of the valve metal. The method includes a first sequential process, and a second sequential process. The first sequential process includes: immersing the capacitor... Agent: Tayca Corporation

20140078646 - Solid electrolytic capacitor with interlayer crosslinking: A method for preparing a solid electrolytic capacitor and an improved solid electrolytic capacitor is provided. The method includes providing an anode, forming a dielectric on the anode and forming a cathode on the dielectric wherein the cathode comprises interlayers. At least one interlayer comprises a monomer, oligomer or polymer... Agent: Kemet Electronics Corporation

20140078647 - Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative... Agent: Apaq Technology Co., Ltd.

20140078648 - Gas insulated switchgear: A gas insulated switchgear includes a support frame, a first fixed conductor being installed on one side of the support frame, a second fixed conductor opposing the first fixed conductor and being installed on another side of the support frame, a screw forming an axis on inner of the support... Agent: Hyundai Heavy Industries Co., Ltd.

20140078652 - Apparatus, system and method for resource distribution: A system for the distribution of resources. The system includes a housing including at least one water vapor distillation device, at least one power generating device, at least one source water reservoir, at least one product water reservoir, and at least one energy storage device.... Agent: Deka Products Limited Partnership

20140078654 - Electronic apparatus and connection device: An electronic apparatus includes a first body; a second body; a connection device including: a connection body through which the first body is connected with the second body; with a first torque generator and a second torque generator provided inside the connection body. When an angle value is in a... Agent: Beijing Lenovo Software Ltd.

20140078653 - Enclosure of electronic device with cushion pad: An enclosure of an electronic device includes a case and a cushion pad. The case includes a bottom plate defining a receiving slot and a cutout in communication with the receiving slot. The cushion pad includes a clasp block including a connecting portion and an engaging portion. The connecting portion... Agent:

20140078649 - Handheld electronic device and sliding mechanism assembly thereof: A handheld electronic device, including a first body, a second body, a sliding module and at least one rotating module. The sliding module is coupled to the second body, so that the second body is suitable for sliding between a first position and a second position. The rotating module is... Agent: Htc Corporation

20140078651 - Housing, method for manufacturing the same and electornic device using the housing: A housing includes a base body and a waterproof portion formed on the base body. The base body includes an inner wall, and a first end wall adjacent to the inner wall. The waterproof portion is formed on the inner wall and the first end wall. The waterproof portion contains... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20140078650 - Protective shell holding a portable electronic device to provide optimized sound effects: A protective shell holding a portable electronic device to provide optimized sound effects includes a sound release portion. The protective shell includes a body and a sound effect output portion located on at least one edge of the body. The sound effect output portion includes a curved wall surface and... Agent: King I Tech Corporation

20140078655 - Waterproof structure, electronic device, and waterproofing method: A waterproof structure includes a package having an opening; a lid part which is slidable between a first position that makes the opening be open and a second position that is located closer to the innermost of the opening than the first position and closes the opening; and an elastic... Agent: Nec Casio Mobile Communications, Ltd.

20140078656 - Computer: The Computer is a system built to process data in a timely and orderly fashion.... Agent:

20140078657 - Server rack system and server: The server rack system includes multiple the servers, a central power supply module and an integrated network controller module. Each of the servers includes a case, multiple motherboard modules and a connector module. The case has an accommodating space. The motherboard modules are disposed side by side in the accommodating... Agent: Inventec (pudong) Technology Corporation

20140078659 - Portable terminal: A portable terminal includes an upper body having a lateral edge about its perimeter, a first lower body, and a second lower body. The first lower body is foldable about a horizontal axis and where first lower body is horizontally rotatable about a vertical axis to mutually cross the upper... Agent: Samsung Electronics Co., Ltd.

20140078658 - Detection of oleophobic coating: Apparatus, systems and methods for processing covers for electronic devices are disclosed. In one embodiment, oleophobic coatings can be deposited on the covers. Oleophobicity of the coatings can be monitored. In one embodiment, glass members can pertain to cover glass for housings of the electronic devices.... Agent:

20140078660 - Apparatus for securing memory modules and/or subscriber identity module in an electronic device: An apparatus for securing a memory module or SIM within an electronic device includes an external control (such as a volume control, camera button, or power button) that hides the memory module and/or SIM. When attached to the electronic device, the external control is disposed at the entrance of a... Agent: Motorola Mobility LLC

20140078661 - Server cabinet: A server cabinet includes a rack and a server installed in the rack. The rack includes a top wall, a bottom wall, four support poles respectively connected between four corners of each of the top wall and the bottom wall, four moving plates movably mounted at inner sides of the... Agent:

20140078662 - Storage device and producing method of the same: A storage device including a housing, a connector, and a storage element is provided. The housing has an opening. The connector and the storage element are disposed in the housing. The connector has a main body, a first terminal set, and a second terminal set, the first and the second... Agent: Phison Electronics Corp.

20140078663 - Storage server rack system and storage servers: A storage server rack system includes a rack and multiple storage servers assembled inside the rack. The rack includes an integrated power module and a fan wall. The integrated power module distributes a power to the storage servers. The fan wall is disposed by a side of the storage servers... Agent: Inventec (pudong) Technology Corporation

20140078664 - Computer component connector: A computer component mounting assembly includes a carrier to support a hard drive and a data connector. The carrier is configured to slidably receive the hard drive along a first axis. The data connector includes a first connector configured to mate to pins of the hard drive, a second connector... Agent:

20140078665 - Data storage device assembly: A data storage device assembly includes a data storage device and a bracket. The bracket includes a bottom frame, a locking portion and an installation portion. The locking portion includes a first limiting piece and a stopping tab, and the installation portion includes a second limiting piece, a pressing portion... Agent:

20140078666 - Cooling and noise-reduction apparatus: A cooling and noise-reduction apparatus for a computing device disposable within a structure having a central air conditioning system is provided. The computing device includes a heat generating component, an enclosure having first and second inlets, a fan configured to drive coolant from the first inlet to the heat generating... Agent: International Business Machines Corporation

20140078667 - Data frame hot/cold aisle baffle system: A data room air circulation system has adjacent racks located side by side. The racks have a front, a rear, and a first and second side. A computer system component is mounted in at least one of the racks. A cold aisle, containing cold air, is located at the front... Agent: Cellco Partnership D/b/a Verizon Wireless

20140078668 - Apparatus, system, and method for configuring a system of electronic chassis: An example apparatus is provided and may comprise a housing, an electronic blade system, and a plurality of airflow management components. The housing may have an upper chamber and a lower chamber. The electronic blade system may be located between the upper chamber and the lower chamber. The plurality of... Agent: Cisco Technology, Inc.

20140078669 - Display apparatus and electronic apparatus: An electronic apparatus comprises a case, a circuit board, a heat sink, a heat pipe and a fan. The case includes a first wall which is provided with an input unit for receiving an input operation and a top surface and a second wall which is opposed to the first... Agent: Kabushiki Kaisha Toshiba

20140078670 - Computer enclosure and fan mounting apparatus: A computer enclosure includes a sidewall and a fan mounting apparatus. The sidewall defines a ventilation area and four slide slots around the ventilation area. The fan mounting apparatus includes two opposite first position member, and two opposite second position members alternately arranged with the first position members. The first... Agent:

20140078671 - Battery charging case with changeable panel for an electronic device: A charging case or system for an electronic device case, having a protective housing capable of aesthetic alteration, includes a replaceable and customizable shell and a rechargeable battery unit. A plurality of shells may have different images thereon and can be interchanged in a continuous sidewall portion to alter the... Agent: Uncommon LLC

20140078672 - Electronic assembly with detachable coolant manifold and coolant-cooled electronic module: Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module... Agent: International Business Machines Corporation

20140078674 - Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface... Agent: International Business Machines Corporation

20140078675 - Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface... Agent: International Business Machines Corporation

20140078673 - Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly: An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to... Agent: General Electric Company

20140078676 - Display device: The present invention provides a display device comprising a display panel, a driving chip and a heatsink. The driving chip is used to drive the display panel. The heatsink is thermally connected with the driving chip to dissipate the heat generated by the driving chip. Through the said method, the... Agent: Shenzhen China Star Optoelectronics Technology Co Ltd.

20140078677 - Heat sinking and electromagnetic shielding structures: An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the... Agent:

20140078679 - Electronic device: An electronic device includes: a resin plate; an electronic component disposed on one side of the resin plate in a thickness direction; and a heat transfer member having higher heat conductivity than the resin plate, the heat transfer member transferring heat from the one side to the other side of... Agent: Fujitsu Limited

20140078678 - Electronic device with heat dissipating module: An electronic device includes a circuit board, a heat dissipating module, and a latch member. A heat generating part is located on the circuit board. The heat dissipating module includes a plurality of heat pipes and a heat sink. The heat sink abuts the heat generating part, and the plurality... Agent: Hon Hai Precision Industry Co., Ltd.

20140078680 - Power supply device and display device: This power supply device includes a substrate, a transformer mounted on a first surface of the substrate, and a switch element electrically connected to the transformer, mounted on a second surface of the substrate, while the switch element is arranged in a position different from a position on the second... Agent: Funai Electric Co., Ltd.

20140078681 - Latch mechanism for communications module: In an example embodiment, a module latch mechanism includes a follower and a driver. The follower is configured to be slidingly positioned relative to a housing and to facilitate selective engagement of the housing with a host device. The follower includes a retaining member configured to retain a resilient member... Agent: Finisar Corporation

20140078682 - Systems and methods for ejecting removable modules from electronic devices: An electronic device may be provided with an ejector mechanism for at least partially ejecting a removable module (e.g., a SIM card tray) from the device. The ejector mechanism may include a user interface portion and a tray interface portion, and each interface portion may include a first end fixed... Agent: Apple Inc.

20140078683 - High frequency high isolation multichip module hybrid package: In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component... Agent: National Instruments Corporation

20140078684 - Power module substrate, power module, and method for manufacturing power module substrate: A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint... Agent: Mitsubishi Materials Corporation

20140078685 - Multi-display device: A multi-display device includes a main frame, a plurality of module supporters disposed on the main frame, a plurality of display modules which are hung on the plurality of module supporters, and a spacer positioned between the two adjacent display modules. Each of the plurality of display modules includes a... Agent:

20140078686 - Stackable communications system: A stackable communications apparatus comprises modules to be powered on in a sequence. Each of the modules comprises components that perform an individual function or group of functions of the apparatus, each module in the plurality of modules comprising an individual chassis stackable with at least another individual chassis of... Agent: Tivo Inc.

20140078687 - Device mounting board, semiconductor module, and method for fabricating the device mounting board: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The... Agent: Sanyo Electric Co., Ltd.

20140078689 - Card key for vehicle and making method of the same: Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to... Agent: Hyundai Mobis Co., Ltd.

20140078688 - Switch circuit for serial advanced technology attachment connector: A switch circuit is connected to a serial advanced technology attachment (SATA) connector on a motherboard. The switch circuit includes a switch unit. The switch unit connects a last pin of the SATA connector to either a power supply on the motherboard or a ground pin of the motherboard.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20140078691 - Bonding structure of touch panel and flexible circuit board: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel... Agent: Hannstar Display Corporation

20140078693 - Composite laminate having a flexible circuit bridge and method of manufacture thereof: In a composite component having a laminate body, a conductive layer and a connector can be joined to one another using an intermediate flexible circuit. Among other things, this flexible circuit places the conductive layer and the connector in electrical communication with one another. Furthermore, during the forming process and... Agent:

20140078692 - Display device and method of manufacturing the same: Provided are a display device and a method of manufacturing the same. The display device includes a display panel having one surface and the other surface, a main drive board formed on the other surface of the display panel, a flexible circuit board having one end electrically connected to the... Agent: Samsung Display Co., Ltd.

20140078694 - Mobile wristwatch comprising several electrical and micro mechanical components that acts as a central unit for a variety of tasks: The present invention relates to a mobile wrist watch, in particular to such an accessory comprising several electrical- and micromechanical components acting as a central processing unit for a multitude of tasks including mobile computing, imaging handling, medical monitoring and as a multiple sensor device communicating with far and nearby... Agent:

20140078690 - Reconfigurable stretchable connector substrate: Systems and methods are disclosed that include electrically connecting multiple electrical components via an electrical connection that extends through a common conductor substrate. The electrical components are bonded or otherwise secured to the common conductor substrate and the electrical connection extends between the multiple electrical components. The multiple electrical components... Agent: Palo Alto Research Center Incorporated

20140078697 - Arrangement system: An arrangement system composed of a plurality of electrical/electronic components particularly of a voltage converter device of a power supply system for use in oil/natural gas production composed of at least one support member that is provided on at least one side with a surrounded accommodating recess, a circuit carrier... Agent: Onesubsea, L.l.c

20140078696 - Electronic device: According to one embodiment, an electronic device includes a display panel, an optical layer, an operation panel, a bonding layer, a first housing, and a second housing. The optical layer is provided on a display surface side of the display panel. The operation panel is adhered to the display panel.... Agent: Kabushiki Kaisha Toshiba

20140078695 - Universal serial bus socket and related electronic device: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal... Agent: Wistron Corporation

20140078698 - Electronic apparatus: An electronic apparatus includes: a casing; a conductive film disposed on an inner surface of the casing, the conductive film having a recess in a surface thereof; a circuit board accommodated in the casing; a semiconductor device disposed on the circuit board; and a conductive frame fixed around the semiconductor... Agent: Fujitsu Limited

20140078700 - Circuit board device and electronic device: A circuit board device includes: a circuit board; an electronic component bonded to a first surface of the circuit board via an electronic component-bonding portion that is disposed over a rectangular region; and a reinforcing member disposed at one of four corners of a rectangular region of a second surface... Agent: Fujitsu Limited

20140078701 - Display device and cover member: According to one embodiment, a display device includes a display module including a display panel having a display area which displays an image, and a signal supply source mounted on the display panel, a cover member including a transmissive portion opposed to the display area, a first color portion opposed... Agent: Japan Display Inc.

20140078699 - Foldable machines: Methods to systematize the development of machines using inexpensive, fast, and convenient fabrication processes are disclosed. In an embodiment, a folding pattern and corresponding circuit design can provide the blueprints for fabrication. The folding pattern may be provided (e.g. laser machined) on a flat sheet of substrate material, such as... Agent:

20140078702 - Multilayer printed circuit board: A multilayer printed circuit board having multiple layers includes: a chip mounted on a top layer of the printed circuit board; and at least a conductor connected to a power supply and a conductor connected to a ground as conductors printed on the respective layers, wherein a power plane that... Agent: Sony Corporation

20140078703 - Printed circuit board and method for manufacturing the same: Provided is a method for manufacturing a printed circuit board. The method for manufacturing the printed circuit board includes applying an adhesive on a support board, attaching an electronic device on the adhesive, forming an insulation layer for burying the electronic device, separating the insulation layer from the support board,... Agent: Lg Innotek Co., Ltd.

20140078704 - Functional glass handler wafer with through vias: A composite wiring circuit with electrical through connections and method of manufacturing the same. The composite wiring circuit includes a glass with first electrically-conducting through vias. The first electrically-conducting through vias pass from a top surface of the glass layer to a bottom surface of the glass layer. The composite... Agent: International Business Machines Corporation

20140078705 - Display device: A display device includes: a display substrate in which a display for displaying an image is formed; an encapsulation substrate, which is assembled on the display substrate and has a first surface facing the display substrate and a second surface opposite to the first surface; and a circuit substrate for... Agent:

20140078706 - Packaging substrate, method for manufacturing same, and chip packaging body having same: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads... Agent: Zhen Ding Technology Co., Ltd.

20140078707 - Portable electronic apparatus: A portable electronic apparatus includes a first body, a rotating structure, a supporting element, and a second body. The first body includes an upper surface. The rotating structure combines with the first body and rotates relative to the first body around a first axis which is substantially perpendicular to the... Agent: Wistron Corporation

20140078708 - Mobile terminal: A mobile terminal including a camera module mounted in a terminal body and configured to capture an image; a frame mounted onto the terminal body to cover at least part of the camera module, the frame having a locking hole; and a cover coupled to the terminal body to cover... Agent: Lg Electronics Inc.

20140078710 - Portable terminal: Provided is portable terminal. The portable terminal includes: a front housing forming a frame of the portable terminal: a rear housing disposed beneath the front housing, a shield can interposed between the front housing and the rear housing for shielding electromagnetic waves and coupled with the front housing; wherein the... Agent: Samsung Electronics Co., Ltd.

20140078709 - Semiconductor device: An inductor surrounds an internal circuit in a planar view and also is coupled electrically to the internal circuit. The upper side of the inductor is covered by an upper shield part and the lower side of the inductor is covered by a lower shield part. The upper shield part... Agent: Renesas Electronics Corporation

20140078711 - Ultrasonic welding: The described embodiments relate generally to ultrasonic welding and more particularly to performing an ultrasonic welding operation while rotating one part relative to a mating part. A non-uniform energy director can be disposed along a mating surface of a first part. The energy director can maintain a constant cross-sectional area... Agent: Apple Inc.

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