Electricity: electrical systems and devices inventions

20080106829 - Alternator control device for vehicle: A vehicle alternator control device in which, when a signal detection portion detects a determined input signal, an operating mode of an overvoltage warning portion is switched to a detection operating mode by an overvoltage warning operating mode switching portion. In the detection operating mode, the overvoltage warning portion is... Agent: Sughrue Mion, PLLC

20080106830 - Ac melt to bushing current detector: An AC melt to bushing current detector (FIG. 4) for a channel induction furnace (FIG. 1) which can detect when molten metal from the loop (122) in a saturated inductor (FIG. 5) has come in contact with the metal bushing (236) whereupon the power to the induction coil (234) is... Agent: John P. Richardson

20080106831 - Methods and apparatus for continuous ground fault self test: Methods and apparatus for continuous ground fault self-test are disclosed. An example ground fault detection device includes a sense coil to detect current in a line conductor and a neutral conductor, the sense coil comprising a winding influenced by a current difference between the line conductor and the neutral conductor.... Agent: Texas Instruments Incorporated

20080106833 - Methods and apparatus to facilitate ground fault protection and self test with a single switch: Methods and apparatus to facilitate ground fault protection and self test with a single switch are disclosed. An example ground fault detection device includes a ground fault detector to receive a signal indicative of current in a line conductor and a neutral conductor, and a single switch to simulate a... Agent: Texas Instruments Incorporated

20080106834 - electrostatic discharge protection circuit: An electrostatic discharge protection circuit includes a first inverter, a first transistor having a gate connected with the output of the first inverter and a drain connected with the input of the first inverter, a second transistor having a gate connected with the output of the first inverter and a... Agent: Xin Wen

20080106835 - Active device array substrate having electrostatic discharge protection capability: An active device array substrate includes pixel units, scan lines, data lines, electrostatic discharge (ESD) protection elements, a short ring and an ESD biased generator. Each pixel unit is electrically connected to the corresponding scan line and data line. Each ESD protection element has a first connection terminal, a second... Agent: Jianq Chyun Intellectual Property Office

20080106837 - Hybrid protection circuit for electrostatic discharge and electrical over-stress: A hybrid protection circuit may include a stress detection circuit, a clamp device, and an on-time adjustment circuit. The stress detection circuit may output a detection signal that may be activated when a positive ESD event or a positive EOS event occurs. The on-time adjustment circuit may receive a detection... Agent: Harness, Dickey & Pierce, P.L.C

20080106832 - Systems and methods for arc fault detection: In accordance with one aspect the present disclosure is directed toward a method for detecting arc faults on a power line. The method may include monitoring power signals associated with a power line and filtering the power signals to produce a high frequency signal and a low frequency signal. A... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080106836 - Io clamping circuit method utilizing output driver transistors: Systems and methods are disclosed for a clamping circuit for protecting against voltage overstresses. One embodiment of the system comprises a first voltage comparator adapted to detect when a selected voltage exceeds a first predetermined voltage and a second voltage comparator adapted to detect when the selected voltage falls below... Agent: Mcandrews Held & Malloy, Ltd

20080106838 - Centrally controlled protection systems having reduced energy let-through mode: A centrally controlled protection system is provided. The system includes a plurality of circuit breakers, a plurality of modules, and a central computer. Each of the plurality of breakers are in electrical communication with a respective one of the plurality of modules. The central computer is in communication with each... Agent: Paul D. Greeley Ohlandt, Greeley, Ruggiero & Perle, L.L.P.

20080106839 - Printed circuit board having lightning protection device: An exemplary printed circuit board (2) includes a substrate (21) and a printed circuit (20) formed on the substrate. The printed circuit includes a first input wire (210) and a ground wire (230). The first input wire includes at least one tip and the ground wire includes at least one... Agent: Wei Te Chung Foxconn International, Inc.

20080106840 - Multichannel spark-gap with multiple intervals and pulsed high-power generator: A multichannel spark-gap with multiple intervals for use in pulsed high-power generators of the LTD family. The spark-gap includes a sealed chamber, two discharge electrodes connected to electrical connecting elements, and a number of intermediate electrodes arranged uniformly inside the sealed chamber. One of the intermediate electrodes is called triggering... Agent: Young & Thompson

20080106841 - Systems and methods for immobilization with variation of output signal power: Locomotion by a target is inhibited by passing a current through the target according to various aspects of the present invention. For instance, a circuit having a processor and a signal generator controlled by the processor to provide the current may perform a method that includes: (a) providing the current... Agent: Taser International, Inc.

20080106842 - Mounting device, plasma processing apparatus and plasma processing method: A mounting device includes a mounting body for sustaining a target object to be processed thereon; an electrostatic chuck disposed on the mounting body and having an electrode layer interposed between insulating layers, and the electrostatic chuck serving to electrostatically attract and hold the target object on a surface of... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080106843 - Rotary variable capacitance element and rotary variable capacitance device: A variable capacitance element of the invention includes: a columnar vibrator formed inside a cylindrical hole of a supporting wall; a first circular driving electrode disposed above the columnar vibrator; a first circular capacitive electrode disposed in the middle of the columnar vibrator; a second circular driving electrode disposed on... Agent: Beyer Weaver LLP

20080106845 - Capacitor and method for producing the same: A low-profile capacitor that can be bent and that has excellent interlayer adhesion strength. The capacitor includes a dielectric layer, a first capacitor electrode formed on a first main surface of the dielectric layer, a second capacitor electrode formed on a second main surface of the dielectric layer, and a... Agent: Dickstein Shapiro LLP

20080106844 - Itfc with optimized c(t): A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of... Agent: Intel/blakely

20080106846 - Electrode for thin film capacitor devices: A method of forming a conductor on a substrate including steps of depositing tantalum on a glass layer of the substrate; oxidizing the tantalum; and depositing a noble metal on the oxidized tantalum to form the conductor. The method can be used to form a ferroelectric capacitor or other thin... Agent: Raytheon Company Intellectual Property

20080106847 - Multilayer capacitor: A multi-terminal multilayer capacitor reducing an equivalent series inductance (ESL), whose design flexibility is high, in which cost of electrode material is low, and in which a structural defect hardly occurs includes lead portions of first and second internal electrodes and lead portions of third and fourth internal electrodes that... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080106848 - Itfc with optimized c(t): A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of... Agent: Intel/blakely

20080106849 - Modular energy storage device and method of making the same: An exemplary method for producing the modular energy storage device comprises the steps of generating a standardized energy storage device, receiving a customer-defined parameter, and modifying the standardized energy storage device according to the customer-defined parameter. The step of modifying the standardized energy storage device comprises the steps of modifying... Agent: Harry Silver

20080106850 - Electrochemical double layer capacitor: Active electrode material, such as fibrillized blend of activated carbon, polymer, and conductive carbon, is pretreated by immersion in a sealing coating. After the active electrode material is dried, the coating seals micropores of the activated carbon or another porous material, thus preventing exposure of water molecules or other impurities... Agent: Maxwell Technologies, Inc.

20080106851 - Capacitor: t

20080106852 - Porous anode body for solid electrolytic capacitor, production method thereof and solid electrolytic capacitor: The invention provides a method of manufacturing a porous anode for a solid electrolytic capacitor, comprising a step of subjecting a molded body containing powder of at least one material selected from oxygen-containing niobium material and oxygen-containing tantalum material and a pore-forming agent which is solid at reduction temperature to... Agent: Sughrue Mion, PLLC

20080106853 - Process for producing porous sintered metal: The present invention provides a process for producing a porous sintered metal, in which the pore diameter distribution of porous sintered metal can be easily controlled. The present invention also provides a process including: forming a molding containing a metal powder, a pore forming material, and a binder resin: heating... Agent: Darby & Darby P.c.

20080106854 - Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method: In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080106855 - Solid state electrolyte capacitor and manufacturing method thereof: The invention provides a solid electrolytic capacitor, comprising a stack of solid electrolytic capacitor elements each having an anode part and a cathode part, wherein the stacked structure is such that cathode parts of solid electrolytic capacitor elements are stacked one on another to have some misalignment between the stacked... Agent: Sughrue Mion, PLLC

20080106856 - Sliding mechanism and portable electronic device using the same: A sliding mechanism (100) for use in a portable electronic device (500) is provided. The sliding mechanism includes a first plate (10), a second plate (20), a plurality of limiting structure (17), and a linkage module (30). The second plate is longitudinally slidably connected with the first plate. The plurality... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080106857 - Housing of portable electronic devices and method for manufacturing the same: A housing (100) of portable electronic devices includes a main body (10) and a decorative layer (16). The main body defines a through groove (12) therein and a recessed portion (14) sunken from an outer surface thereof. The groove is formed adjacent to the recessed portion. The decorative layer is... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080106858 - Unit for accomodating electronic component: The present invention provides an electronic control unit which is capable of suppressing harmful effects caused by liquid while suppressing increase in the size thereof. The electronic control unit includes an electronic component in which a circuit element coated with an anti-splash agent is implemented, a casing, and a liquid... Agent: Harness, Dickey & Pierce, P.L.C

20080106859 - Electronic apparatus: There are provided a display panel mounted in a tiltable manner on the front face portion of a main body portion, an operation panel to be mounted in a tiltable manner on the display panel, a tilt control part for controlling to tilt the display panel in response to a... Agent: Oliff & Berridge, PLC

20080106860 - Multi-configuration processor-memory substrate device: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports... Agent: Murabito Hao & Barnes LLP

20080106861 - Multi-configuration processor-memory substrate device: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports... Agent: Nvidia C/o Murabito, Hao & Barnes LLP

20080106862 - Server wherein an interior of which is connected with five expansion boards: A server wherein an interior of which is connected with five expansion boards is composed of a server at a height of 1 U, an interior of which is fixed with a circuit motherboard on which is welded with expansion slots; a first riser card which is inserted into the... Agent: Troxell Law Office PLLC

20080106863 - Heat dissipation assembly for computing devices: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to... Agent: Dergosits & Noah LLP

20080106864 - Method and apparatus for acoustic noise reduction in a computer system having a vented door including a pivotable vented base and a pivotable outer door: A vented door for a computer system includes a vented base and an outer door. The vented base and the outer door are separately pivotable. The vented base is pivotably attached to the computer system's enclosure for movement between a closed configuration where the vented base abuts against a panel... Agent: Ibm Corporation RochesterIPLaw Dept. 917

20080106865 - Computer module: A computer module includes a housing having a cover defining a condenser chamber, and a heat-absorbing unit having at least one cavity body adapted to contact a heat source, and a working fluid received in the cavity body. A tubing unit is connected fluidly to the condenser chamber and the... Agent: Birch Stewart Kolasch & Birch

20080106866 - Electronic appliance: In an electronic appliance, a base is thermally fused by a heat generating component. On the base, a heat dissipating fin group including heat dissipating fins each extending in a Y direction is arranged in spaced relation in an X direction. An exhaust fan and a partition between which the... Agent: Nixon & Vanderhye, P.c.

20080106867 - Fan motor device and electronic apparatus: A fan motor device includes a multi-blade portion that rotates together with a rotor portion of a motor so as to take in air in an axial direction of the motor and discharge the air in a centrifugal direction, and a rib that supportively connects the multi-blade portion to the... Agent: Sonnenschein Nath & Rosenthal LLP

20080106869 - Heat dissipation device: A heat dissipation device includes a retention module (40) and a heat sink (10) both mounted on the printed circuit board (50). The retention module forms a pair of opposite fixture blocks (44) thereon. The heat sink received in the retention module has protective hollow sleeves (28) positioned corresponding to... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080106868 - Thermal interface material volume between thermal conducting members: A heat dissipation apparatus includes a first thermal conducting member including a first thermal transfer surface. A second thermal conducting member including a second thermal transfer surface that is located adjacent the first thermal transfer surface. A thermal interface material engages the first thermal transfer surface and the second thermal... Agent: Haynes And Boone, LLP

20080106870 - Apparatus and method for storing and regulating access to portable electronic devices: A storage unit and associated methods of use enable clinicians to store portable electronic devices in a centralized location while ensuring that proper authorization is needed to access the devices. The storage unit is formed with an enclosure for housing portable electronic devices. A plurality of shelves are disposed within... Agent: Shook, Hardy & Bacon L.L.P. Intellectual Property Department

20080106871 - Slide and tilt mechanism for a telecommunications panel: A mechanism that provides access to a rear termination area of a telecommunications panel. The mechanism including a slide bar that permits the panel to laterally slide, and a tilt element the permits the panel to tilt. The slide bar and tilt element positioning the tilted termination panel over lower... Agent: Merchant & Gould PC

20080106872 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080106873 - Mounting structure: According to an aspect of the present invention, a mounting structure includes a housing, an electronic component mounted at the housing, a pin-shaped terminal arranged upright at the housing, a circuit board having a mounting through-hole into which the in-shaped terminal is inserted, and a mounting support member positioned between... Agent: Buchanan, Ingersoll & Rooney PC

20080106874 - Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus: Disclosed herein is an electro-optical device including a substrate for the electro-optical device connected with a flexible circuit board, wherein the flexible circuit board partially faces one surface of the substrate for the electro-optical device, is folded to face the other surface of the substrate for the electro-optical device at... Agent: Harness, Dickey & Pierce, P.L.C

20080106875 - Circuit device and method of manufacturing the same: Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements... Agent: Fish & Richardson P.c. Citigroup Center

20080106876 - Semiconductor memory module with reverse mounted chip resistor: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection... Agent: Marger Johnson & Mccollom, P.c.

20080106877 - System and method for manufacturing c-shaped leads: A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality of interposing strips, masking lateral sides and a center of the plurality of interposing strips, covering the exposed surface with a... Agent: Steptoe & Johnson LLP

20080106878 - Circuit configuration having a number of electrical components: s

20080106879 - Printed circuit board including embedded chips and method of fabricating the same: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having... Agent: Darby & Darby P.c.

20080106880 - Wiring board and method of manufacturing the same: A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a second terminal area disposed on the other side of the wiring part. A resist... Agent: Oliff & Berridge, PLC

20080106881 - Active signal cross-connect system: A telecommunications system includes a chassis having a front side and a rear side and a plurality of jacks mounted to the chassis. Each jack includes an IN port, an OUT port and a MONITOR port. A cross-connect panel including an array of cross-connect connection locations is accessible from the... Agent: Merchant & Gould PC

20080106883 - Radio frequency unit: The invention provides a radio frequency unit including a box-shaped chassis into which an insulating board loaded with electronic components is housed, and two connectors attached to a front plate of the chassis with a space therebetween. A supporting member protruding into the chassis is provided in a position between... Agent: Beyer Weaver LLP

20080106882 - Wireless network card covering structure: A wireless network card covering structure to couple an upper metal cover and a lower metal cover of a wireless network card is disclosed. The wireless network card covering structure includes a contact structure and a coupling structure. The contact structure includes an upper metal cover wall and a lower... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080106884 - Snap install emi shields with protrusions and electrically-conductive members for attachment to substrates: Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed... Agent: Harness, Dickey, & Pierce, P.l.c

20080106885 - Apparatus and method for mounting audio-visual components: A bracket or support bar system is for installing one or more audio-visual (“A/V”) components or modules and generally overcomes the need for external cables and wiring connections. Every A/V component of the A/V system is attached to a wall bracket or support bar that enables the transfer of power... Agent: Fitch Even Tabin & Flannery

20080100972 - Device for preventing the explosion of an element of an electrical transformer: A device for preventing the explosion of an element of an electrical transformer provided with a tank containing a combustible cooling fluid, comprising a pressure release element for decompressing the tank, and a bag placed downstream of the pressure release element and configured to pass from a flat state to... Agent: Eric B. Meyertons Meyertons, Hood, Kivlin,kowert & Goetzel, P.C.

20080100973 - Electrostatic discharge (esd) protection arrangement and esd protection method: AN ESD protection arrangement is provided which comprises an ESD protection device coupled between a terminal pad of an integrated semiconductor circuit and a supply voltage rail and a compensation loop provided between the terminal pad and an intermediate circuit node of the ESD protection device. The compensation loop comprises... Agent: Maginot, Moore & Beck

20080100975 - Distribution automation system: A distribution automation system is disclosed. The system includes a switch for detecting a voltage/current status of electric power equipment to output the resulting detect signal, and supplying or cutting off power to the power equipment, and a control box including a control unit for converting the detect signal from... Agent: Morgan & Finnegan, L.L.P.

20080100977 - System for overvoltage suppression for construction equipment: An overvoltage suppression system is disclosed, such as for construction equipment, for protecting the construction equipment from overvoltages that may occur in day to day operations. An overvoltage suppression system for construction equipment may have a communication network that includes nodes. A data line may be used to electrically connect... Agent: Brinks Hofer Gilson & Lione

20080100978 - Switching element overcurrent protection circuit which operates within a high-voltage system that incorporates the switching element: A circuit for detecting excessive current flow through a switching element derives an electrical quantity relating to a condition of the switching element and correlated with the current level, and compares the magnitude of that electrical condition quantity with a threshold value corresponding to the maximum allowable level of current.... Agent: Nixon & Vanderhye, PC

20080100974 - Electrical current limiter: An electrical current limiter 1 is provided in which an enclosure 3 combination incorporates an electrical conductor 2 held in effective thermal isolation within an housing 4 having a vacuum 11. In such circumstances known electrical resistivity response of the conductor 2 can be utilised when an electrical fault occurs... Agent: Oliff & Berridge, PLC

20080100976 - Limiting energy in wiring faults combined upstream and downstream protection: An intrinsically safe system in a hazardous atmosphere includes a power supply. The system includes a plurality of load devices. The system includes wiring in communication with the power supply and the load devices that is located in the hazardous atmosphere. The system includes a protector connected to the wiring... Agent: Ansel M. Schwartz Attorney At Law

20080100979 - High voltage over-current protection device: A high voltage over-current protection device includes a positive temperature coefficient (PTC) electrically conductive heat-dissipation layer and two metal electrodes. The PTC electrically conductive heat-dissipation layer includes at least one polymer, an electrically conductive filler, and a heat conductive filler. Due to the high thermal conductivity of the heat conductive... Agent: Seyfarth Shaw LLP

20080100980 - Removable seat sensing system: The present invention relates to removable seating systems of the type wherein all or part of a seat may be removed or otherwise disengaged from a secure connection location, such as but not limited to vehicle seats that me be removed or disengage for folding from a vehicle mounted seat... Agent: Brooks Kushman P.C. / Lear Corporation

20080100981 - Over-current and over-voltage protection assembly apparatus: An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of... Agent: Seyfarth Shaw LLP

20080100982 - System and method for dissipating static electricity in an electronic sheet material dispenser: An electronic dispenser for dispensing a measured sheet from a roll of web material includes an antenna in conductive communication with at least one component of the dispenser that stores static charge generated by operation of the dispenser. The antenna is disposed so as to dissipate the static charge through... Agent: Dority & Manning, P.A.

20080100985 - Electrostatic chuck and manufacturing method thereof: An electrostatic chuck includes a base, and includes an electrode embedded in the base in parallel to a substrate mounting surface of the base. A terminal loaded into a terminal hole drilled into a back surface of the base toward the electrode is bonded to the electrode having a protruded... Agent: Burr & Brown

20080100984 - Low-cost electrostatic clamp with fast de-clamp time: A method for manufacturing a semiconductor wafer electrostatic clamp, comprising providing a mounting plate, forming an insulative layer on an insulating portion of the mounting plate, forming a first electrode on a first portion of the mounting plate, forming a second electrode on a second portion of the mounting plate,... Agent: Thomas G. Eschweiler Eschweiler & Associates, LLC

20080100983 - Sliding wafer release gripper / wafer peeling gripper: The present invention is directed to a system and a method for peeling a wafer off of an electrostatic clamp (ESC). The ESC removal system comprises a electrostatic clamp and a wafer electrically coupled and physically in contact with each other. A plurality of grippers or pins are arranged with... Agent: Eschweiler & Associates, LLC National City Bank Building

20080100986 - Capacitor embedded printed circuit board and manufacturing method thereof: Provided is a method of manufacturing a capacitor embedded printed circuit board. In the method, a laminated body is prepared, including a laminated plate having first and second copper films on both sides thereof, where at least one bottom electrode is provided on at least one side. A dielectric layer... Agent: Mcdermott Will & Emery LLP

20080100987 - Multilayer capacitor, manufacturing method thereof: A multilayer capacitor 10 comprising a dielectric body 12 formed by stacking a plurality of dielectric layers 12a and 12b having an approximately rectangular parallelepiped shape; an internal layer portion 17 in which pluralities of first internal conductor layers 21 and second internal conductor layers 22 to be set at... Agent: Oliff & Berridge, PLC

20080100988 - Multilayer capacitor: A multilayer capacitor has a capacitor element body of a nearly rectangular parallelepiped shape in which a signal electrode layer and a GND electrode layer are laminated with a dielectric layer in between, and signal terminal electrodes and GND terminal electrodes each set of which is provided on either of... Agent: Oliff & Berridge, PLC

20080100989 - Layout for capacitor pair with high capacitance matching: An integrated circuit device includes a capacitor array, which includes unit capacitors arranged in rows and columns, wherein each unit capacitor is formed of two electrically insulated capacitor plates. The unit capacitors include at least one first unit capacitor in each row and in each column of the capacitor array;... Agent: Slater & Matsil, L.L.P.

20080100990 - Cell assemby for an energy storage device using ptfe binder in activated carbon electrodes: A hybrid supercapacitor energy storage device comprises at least one lead electrode, at least one carbon electrode, a separator, a casing, and an acid electrolyte. The lead electrode is enveloped in a common glass mat separator known in the lead-acid battery industry. The carbon electrode comprises a highly conductive current... Agent: Cahn & Samuels LLP

20080100991 - First-wall component for a fusion reactor with a heat sink of a copper alloy: A first-wall component of a fusion reactor has a heat shield and a heat sink. The heat shield is formed of a material from the group of graphite material, carbidic material, tungsten and tungsten alloy. The heat sink is formed of a spray-compacted copper alloy.... Agent: Lerner Greenberg Stemer LLP

20080100992 - User interface module for a computing device: A device that may include a server chassis and a user interface module moveably coupled to the server chassis. In some embodiments, the user interface module is configured to move to a first position that allows access to a first server component and to a second position that allows access... Agent: Hewlett Packard Company

20080100993 - Support platform for electrical components, and module comprising said support platform: A module connects a network having a power mains to a housing. The module includes a platform for holding electrical components. The platform includes a body made of a fiber-composite material and reinforcing glass fibers, a busbar in the body, and a contact element associated with the busbar for making... Agent: Fish & Richardson PC

20080100994 - Bracket assembly for expansion cards: A bracket assembly includes a first expansion card (30), a second expansion card (26), a riser card (20) for horizontally receiving the second expansion card, and a retaining bracket (10) configured for securing to a computer chassis which provides connectors for the first expansion card and the riser card. The... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080100995 - Electronic device docking system: An electronic device docking system comprises a docking station configured to receive docking of an electronic device with an external battery coupled thereto, the docking station comprising at least one mechanism actuatable to cause detachment of the electronic device from both the external battery and the docking station.... Agent: Hewlett Packard Company

20080101001 - Display device: A display device includes a display panel; a backlight unit disposed behind the display panel; a panel supporting part; and a first cover. The first cover includes a first cover part disposed along a non-display region of the display panel. The display device further includes a plurality of second cover... Agent: Cantor Colburn, LLP

20080100999 - Engagement member for display device: In an engagement member 2 comprising a main body part 3 and an engagement part 4, the main body part 3 is separately formed from the engagement part 4A. A screw passage hole 3c is formed in the main body part 3. A screw hole 4a is formed in the... Agent: Osha Liang L.L.P.

20080101000 - Information processing apparatus: An information processing apparatus includes a display section and a main body section. The display section is disposed on a first surface and has a display panel and a display panel case. The display panel case houses the display panel such that the display panel can display an image. The... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080100997 - Monitor turnning device: A monitor turning device includes a base with a box connected thereon and a gear unit is received in the box and driven by a driving member. The gear unit includes a pivotable output gear which has two output members. A disk unit includes a first disk located on a... Agent: Hwa-lo Chen

20080101002 - Plasma display device: A plasma display device includes a plasma display panel (PDP) having electrodes between front and rear substrates, a chassis base on an outer surface of the PDP, a printed circuit board assembly (PBA) on the chassis base, a flexible printed circuit (FPC) connecting the PBA to the electrodes of the... Agent: Lee & Morse, P.C.

20080100996 - Shrinkable & adjustable multi-functional tv: A shrinkable and adjustable multi-functional TV includes a display, a support device, a shrinkable and angle adjusting device. The display has a mirror on its rear side, and an LCD screen on a front side, pivotally received in an interior of a U-shaped frame of the support device and by... Agent: Bruce H. Troxell

20080100998 - Waterproof screen cover: A touch screen cover or overlay for use in association with a user input device having a touch screen disposed within a housing, comprises a membrane (2) of a size sufficient to cover the touch screen. The membrane (2) is formed of a flexible material, and includes means (3) for... Agent: Kennedy Covington Lobdell & Hickman, LLP

20080101003 - Electronic apparatus: An electronic apparatus comprising a base, a first body, a second body and at least an adjusting apparatus is provided. The first body and the second body disposed respectively at two ends of the base are rotatable relative to the base. The adjusting apparatus is coupled to the first body... Agent: Rabin & Berdo, PC

20080101004 - Memory card connector with improved foldable baffler: A memory card connector includes a metal cover defining a receiving space in which two different types of memory cards are insertable in an insertion direction through an insert opening generally at a rear end of the metal cover to respectively correspondingly connect with contacts mounted in a connector housing... Agent: Wei Te Chung Foxconn International, Inc.

20080101009 - Assembly structure for power supply circuit unit of electric device: A wiring substrate has a front face and a rear face opposed the front face. An electric component is mounted on the front face and is electrically connected to the wiring substrate at the rear face. A protection cover is comprised of a resin material and includes an upper plate,... Agent: Morgan Lewis & Bockius LLP

20080101005 - Flexible docking bay: A flexible docking bay is disclosed. The flexible docking bay comprises a body having a cartridge-receiving portion defining a front region that defines an opening and a rear region that defines a rear bounding wall. A cartridge-encasing wall extends from the opening to the rear bounding wall. The flexible docking... Agent: Hewlett Packard Company

20080101008 - Hard drive cartridge protection: According to the invention, a removable rotational disk storage cartridge for storing computer readable data is disclosed. The cartridge may include a chassis, a shock absorption media and a rotational storage disk. The chassis may define an interior space and may be configured to be detachably and mechanically coupled with... Agent: Townsend And Townsend And Crew, LLP

20080101006 - Hard drive deck: A hard drive deck is described. A base portion comprises three support legs and a first fastening portion, wherein each of the three support legs has an opening to be fastened to a computer housing by a screw. A hard drive housing is secured on the base portion. The hard... Agent: Rabin & Berdo, PC

20080101007 - Hard drive deck: A hard drive deck is described. A base portion comprises a first fastening portion, a second fastening portion and a support leg. The support leg has a positioning hole and the first fastening portion has a plurality of slots such that the base portion is fastened to a computer housing.... Agent: Rabin & Berdo, PC

20080101010 - Digital storage element mechanical shock isolation arrangement in a host device and method: A digital storage arrangement is interfaceable with a host device which defines a cavity. The digital storage arrangement includes a housing receivable in the cavity, with a movement margin between the housing and host device, while a resilient support arrangement is provided for fixed engagement with the host device and... Agent: Workman Nydegger

20080101011 - Riser retention system: A riser retention apparatus includes a board. A component connector is mounted to the board. A support frame is coupled to the board adjacent the component connector and extends from the board. A riser guide is located on the support frame and operable to engage a riser and guide a... Agent: Haynes And Boone, LLP

20080101012 - Heat dissipation assembly for computing devices: Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing speed. A heat sink is provided in thermal contact with a microprocessor whereby a water barrier... Agent: Dergosits & Noah LLP

20080101014 - Miniature cooling device: A method for regulating temperature in an enclosure is disclosed. The method involves monitoring a component temperature inside the enclosure. When the component temperature reaches a threshold, the method injects a coolant into the enclosure. The method further involves regulating a flow rate of the coolant by actuating a miniature... Agent: Honeywell International Inc.

20080101013 - Power module having self-contained cooling system: A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly... Agent: General Motors Corporation Legal Staff

20080101015 - Air flow regulation devices: In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second... Agent: Hewlett Packard Company

20080101016 - Airflow baffle for a computer system: An airflow baffle apparatus for a forced-air cooled computer system is comprised of a linearly inflating airflow baffle bladder with a fixable surface and a topologically self-adjusting compliant surface. The linearly inflating airflow baffle bladder is couplable with the computer system. The fixable surface of the linearly inflating airflow baffle... Agent: Hewlett Packard Company

20080101017 - Cooling device and electronic device: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the... Agent: Blakely Sokoloff Taylor & Zafman

20080101020 - Computer system having multi-direction blower: A computer system comprises a chassis and first and second electronic components disposed within the chassis. The computer system also comprises a multi-direction blower module having a blower housing connected to the chassis The blower housing comprises an inlet, a first outlet, and a second outlet. A centrifugal blower is... Agent: Hewlett Packard Company

20080101021 - Fan housing apparatus: A fan housing apparatus includes a shroud defining an air passageway. A housing member is located adjacent the air passageway and moveably coupled to the shroud such that the housing member is moveable relative to the shroud between an operating position and a service position. A fan housing is defined... Agent: Haynes And Boone, LLP

20080101019 - Fan module: A fan module includes a fan (10), a bracket (20), and a locking member (30). The fan includes a pair of parallel side walls (12) each defining through holes (122) therein. The bracket includes a pair of parallel side plates (26) for securing the fan therebetween. The side plates are... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101018 - Heat dissipation device: A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101022 - Micro-fluidic cooling apparatus with phase change: A cooling apparatus (100) for transferring heat away from a hot system (30) includes: a frame (125) having a plurality of channels (102) formed therein, the frame (125) extending between a thermally conductive hot element (105) and a thermally conductive cooling element (107); and a liquid coolant (113) contained within... Agent: Kurt Luther Honeywell International Inc.

20080101024 - Micro-spray cooling system: A micro-spray cooling system for a plurality of heat sources includes an evaporator contacting the heat sources and comprising a plurality of actuators corresponding to the heat sources, a condenser connected to the evaporator, and at least one driving circuit connected to the actuators to drive some or all of... Agent: Quintero Law Office, PC

20080101023 - Negative pressure pump device: A negative pressure pump device includes a water tank installed with a pump having an entrance connector extended out of the water tank. The water tank has an exit connector and a valve set on its topside. The entrance connector and the exit connector are respectively connected with a connecting... Agent: Bruce H. Troxell

20080101025 - Multi-chip module with power system: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the... Agent: Hewlett Packard Company

20080101026 - Thin, passive cooling system: A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an... Agent: Apple Computer, Inc. C/o Park, Vaughan & Fleming LLP

20080101027 - Heat dissipation device: A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101028 - Heat sink: A heat sink (100) includes a plurality of metal fins (10) interlocked with each other by interlocking units (11) formed between them. The interlocking units each include a protruding finger (122), a hole (114) and a controlling member (116, 117). The protruding finger, the hole and the controlling member are... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101029 - Clip for heat sink: A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of the two arms... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101032 - Base plate for a power semiconductor module: A power semiconductor module is to be pressed to a heat sink with a first surface of a first side of a base plate. To reduce the heat transfer resistance between the base plate and the heat sink, the first surface has, at least in a state, when the power... Agent: Coats & Bennett/infineon Technologies

20080101033 - Component retention with distributed compression: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.... Agent: Hewlett Packard Company

20080101030 - Heat sink assembly: A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) is defined therein. The clip includes... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101034 - High-contrast laser mark on substrate surfaces: As part of a first configured laser operation, a smooth, more reflective marking area is formed at a surface of a substrate (e.g., integral heat spreader, or IHS). In a second configured laser operation, a mark is formed at the surface of the substrate within the marking area. The mark... Agent: Intel Corporation C/o Intellevate, LLC

20080101031 - Wedge lock: Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.... Agent: Hewlett Packard Company

20080101038 - Embedded thermal-electric cooling modules for surface spreading of heat: A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that... Agent: Apple Computer, Inc. C/o Park, Vaughan & Fleming LLP

20080101035 - Heat-dissipating assembly structure: A heat-dissipating assembly structure includes a first heat dissipating sheet attached to one side of a memory module and having first hooks at one long side, a second heat dissipating sheet attached to the opposite side of the memory module and having second hooks at one long side respectively hooked... Agent: Birch Stewart Kolasch & Birch

20080101036 - Heat-dissipating assembly structure: A heat-dissipating assembly structure is disclosed that includes a first and a second thermally conductive sheets, each of which includes a plurality of spaced fastening sections including a projection on its outer surface and two parallel guides with the projection disposed there-between; and a plurality of U-shaped clamps including two... Agent: Birch Stewart Kolasch & Birch

20080101039 - Passive heat-dissipating type power supply apparatus for increasing heat-dissipating efficiency and fabricating process thereof: The present invention relates to a power supply apparatus having a passive heat-dissipating mechanism. The power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a closed receptacle therein and includes a first edge, a second edge and a... Agent: Madson & Austin

20080101037 - Securing object relative to pc board using retention device attached to surface-mounted attachment mechanisms: Attachment mechanisms are surface-mounted to a PC board. An object is secured relative to said PC board by a retention device attached to the attachment mechanisms.... Agent: Hewlett Packard Company

20080101040 - Automatic positioning of power supply module handle: Embodiments of the invention automatically rotate a handle of the component from an open position to a closed position when the module is inserted into the chassis by pushing on a bezel of the module. Embodiments of the invention move the module into a seated position within the chassis when... Agent: Hewlett Packard Company

20080101041 - Electronic device having water-repellent structure and draining structure: An electronic device includes a housing, a water-repellent structure and a draining structure. The housing has at least a first air port. The water-repellent structure is connected to the housing and includes at least one draining port. The water-repellent structure and the housing cooperatively define a water-repellent chamber. The draining... Agent: Madson & Austin

20080101042 - Expansion card: An expansion card has a terminal block, a top metal sheet, bottom metal sheet and a plastic seat. Two step retainers are formed respectively on two short edges of the terminal block. Two pairs of hooks are formed on the two long edges adjacent respectively to front and rear ends... Agent: Cooper & Dunham, LLP

20080101043 - Gauge circuit board holding device: A meter spacer unit includes a dial spacer, a lateral spacer flexibly connected to the dial spacer by a joint, and a rear connecting member flexibly connected to the lateral spacer by a joint. The lateral spacer includes a connection member adapted to connect to a printed circuit board.... Agent: Nixon Peabody, LLP

20080101045 - Circuit board and manufacturing method thereof: A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming... Agent: Staas & Halsey LLP

20080101044 - Laminated bond of multilayer circuit board having embedded chips: A multilayer circuit board has a bottom and an upper multilayer circuit boards, a glue layer, multiple outer contact vias and two insulating lacquer layers. The bottom and the upper multilayer circuit boards respectively have multiple conductive wires, an insulating layer, a frame, multiple chips, a press laminate, a patterned... Agent: Birch Stewart Kolasch & Birch

20080101046 - Motherboard: A motherboard for computer is disclosed. The motherboard includes a printed circuit board (PCB), a first slot, a second slot, and a control unit. The first slot, the second slot, and the control unit are disposed on the PCB. The first slot is for receiving-a first double data rate (DDR)... Agent: Bacon & Thomas, PLLC

20080101047 - Socket connector terminals: A socket connector terminal (1) adapted for connecting an IC package to a PCB includes a base portion (10) for retaining, a pair of contacting portion (113) for connecting with the IC package, a pair of resilient arm (11) respectively connecting with the base portion and the contacting portions and... Agent: Wei Te Chung Foxconn International, Inc.

20080101048 - Method of making assembly module and board module and electronic apparatus: A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the... Agent: Staas & Halsey LLP

20080101049 - Systems and methods for electrically connecting circuit board based electronic devices: In one exemplary embodiment, a system for supplying electrical connectivity to one or more circuit board based devices includes a backplane and at least one module. The backplane includes a mounting surface having a plurality of modular power connectors. The at least one module includes an interface portion, a power... Agent: Calfee Halter & Griswold, LLP

20080101050 - layout geometry for printed circuit boards with adaptive antipads: A method of creating a layout geometry for a multilayer printed circuit board is described. The method involves identifying a signal trace connected to a connector pin via. A antipad is selected for use in conjunction with the connector pin via, where the antipad is of a size selected to... Agent: Hewlett Packard Company

20080101051 - Alignment and support apparatus for component and card coupling: A component and card coupling alignment and support apparatus includes a card. A primary component connector is mounted to the card. A primary component including a connection edge engages the primary component connector. A secondary component extends from the primary component. An alignment and support member is included on the... Agent: Haynes And Boone, LLP

20080101052 - Hinge assembly and wireless mobile terminal having the same: A hinge assembly is provided that reduces the SAR value and improves the radiating performance of an antenna for wireless mobile terminals, and a wireless mobile terminal having the hinge assembly is provided. The hinge assembly includes a conductive hinge, and contact connectors for selectively electrically connecting opposite ends of... Agent: The Farrell Law Firm, P.C.

20080094763 - Electrical apparatus with current dampening device: Various electrical apparatuses which include a current dampening device are disclosed. In one embodiment, an electrical apparatus is provided which includes a motor and a switch having an “on” position and an “off” position to control the operation of the motor. A current dampening device is connected in parallel with... Agent: Eileen T. Mathews, Roetzel & Andress

20080094764 - Power plug with leakage current detection and protection circuit: A power plug includes a base, an upper cover attached to the base, a base-side cover adjacent the base and removably attached to the upper cover, an output cord, a leakage current detection and protection circuit for detecting a leakage current in the output cord, and an electrical connection mechanism... Agent: Ying Chen Chen Yoshimura LLP

20080094766 - Linear low capacitance overvoltage protection circuit using a blocking diode: A low capacitance overvoltage protection circuit (80) provides protection to a communication line (12, 14). A diode bridge (46) is connected to the communication line (12, 14) so that overvoltages of both polarities pass through an overvoltage protection device (44) in one direction. A bias voltage supply 48 applies a... Agent: Handley Law Firm, PLLC Roger N. Chauza, PC

20080094767 - Semiconductor device having electrostatic protection circuit: This invention discloses a semiconductor device including a first buffer MOSFET of a first conductivity type, a second buffer MOSFET of a second conductivity type, an ESD protection circuit, an external input terminal, and a control circuit. The external input terminal capacitively couples to a terminal to which a second... Agent: Amin, Turocy & Calvin, LLP

20080094769 - Shock-proof electrical outlet: The present invention relates to a shock-proof electrical output device, which comprises a power outlet having a positive and a negative terminal, a voltage converter with a high voltage input and a low voltage output, a current monitoring relay device, a latching relay device, and a changeover relay device.... Agent: Gordon & Rees LLP

20080094770 - Over current protection circuit for power supplies: An over current protection circuit provides over current protection (O.C.P) and short current protection (S.C.P) and can selectively operate in auto recover mode or latch off mode by replacing certain elements therein. Hence, the present invention can be designed easily and is cheaper than the prior art.... Agent: Rosenberg, Klein & Lee

20080094762 - Power supply apparatus with function of detecting abnormality of current sensor: A current detector (60) samples a motor current (MCRT_A) from a controlling sensor and a motor current (MCRT_B) from a monitoring sensor, and holds respective motor current maximum values (MCRT_Amax, MCRT_Bmax) at each prescribed operation cycle. An abnormality determiner (62a) detects that the motor current maximum value (MCRT_Amax) is in... Agent: Oliff & Berridge, PLC

20080094765 - Circuit interrupting device with automatic end of life test: The present invention provides to a circuit interrupting device, particularly a ground fault circuit interrupter (GFCI), with a test circuit which is capable of automatically generating a simulated leakage current to detect whether the service life of the circuit interrupting device has ended, i.e., whether the main components of the... Agent: Andrews Kurth LLP

20080094768 - Apparatus, system, and/or method for protection and control of an electrical device: An electrical device protection apparatus, such as an overload relay, can include a microprocessor 102 that can receive a wide range of current signals from a current transformer or other current sensor. Also microprocessor 102 can employ a voltage sensor 112 to measure line voltage, for representing true power, and... Agent: NorthwestIPLaw Group

20080094771 - Switching apparatus and method: An improved switching apparatus and method are disclosed. In at least some embodiments, the apparatus includes first and second ports, a first switching device such as a contactor coupled between the ports, and a second switching device coupled in parallel with the contactor between the ports, where the second switching... Agent: Rockwell Automation, Inc. / Whd Attention: Susan M. Donahue

20080094772 - Arrester: The present invention provides an arrester in which energy during discharge is not concentrated in one point and which has good responsiveness to overvoltage. The arrester is provided with an energy absorber 3 that absorbs energy when a lightning strike occurs, and a pair of conductive electrodes 1 and 2.... Agent: Rader Fishman & Grauer PLLC

20080094773 - Electrostatic discharge protection for microwave guided wave structure: Electrostatic discharge protection for guided wave microwave structures is provided by a protection device that imposes minimal disruption on the microwave structures and negligible interference with the normal operation of the structures. The protection device provides a discharge path between a signal conductor and a ground conductor when electrostatic charges... Agent: Miles & Stockbridge PC

20080094774 - Grounding apparatus: A grounding apparatus for connecting electrical equipment to ground comprises a plate comprising a top surface, a bottom surface and first and second end portions. Typically. the plate is connected to opposing support legs, such that an open space is provided under the bottom surface of the plate. The top... Agent: Panduit Corp.

20080094775 - Capacitors with high energy storage density and low esr: Electrostatic capacitors with high capacitance density and high-energy storage are implemented over conventional electrolytic capacitor anode substrates using highly conformal contact layers deposited by atomic layer deposition. Capacitor films that are suitable for energy storage, electrical and electronics circuits, and for integration onto PC boards endure long lifetime and high-temperature... Agent: Patton Boggs LLP

20080094776 - Cylindrical capacitor: A cylindrical capacitor comprising at least a substrate, a cylindrical bottom electrode, a structure layer, a top electrode and a capacitor dielectric layer is provided. The substrate has several plugs. The cylindrical bottom electrodes are disposed on the substrate and electrically connected to the respective plugs. The structure layer surrounds... Agent: Jianq Chyun Intellectual Property Office

20080094777 - Electric double layer capacitor: c

20080094778 - Lithium-ion capacitor: The invention provides a negative electrode material for use with a lithium-ion capacitor, which is high in energy density, output density and excellent in durability. When graphite of which an average distance between 002 lattice planes thereof is within a range from 0.335 nm to 0.337 nm is used for... Agent: Darby & Darby P.C.

20080094779 - Tantalum powder for the production of solid electrolyte capacitors: A tantalum powder consisting of agglomerated primary particle with a minimum primary particle dimension of 0.2 to 0.8 μm, a specific surface area of 0.9 to 2.5 m2/g and a particle size distribution determined to ASTM B 822 corresponding to a D10 value of 5 to 25 μm, a D50... Agent: Connolly Bove Lodge & Hutz, LLP

20080094780 - Solid electrolytic capacitor: A solid electrolytic capacitor (A1) includes a porous sintered body (1), anode conduction members (21A, 21B), surface-mounting anode terminals (3A, 3B), and a surface-mounting cathode terminal. The porous sintered body (1) is made of valve metal. The anode conduction members (21A, 21B) are electrically connected to the porous sintered body... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20080094781 - Electrode sheet for capacitors, method of manufacturing the same, and electrolytic capacitor: A method of manufacturing an electrode sheet for capacitors comprises the step of forming a sprayed layer of an Al-valve action metal alloy on at least one surface of an aluminum foil (2) by thermally spraying Al-valve action metal alloy powder on the surface of the aluminum foil. At the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080094782 - Draw-out power cell disconnect and isolation mechanism with rack-out guide tray: Methods and integrated apparatus are disclosed for electrically disconnecting and allowing external support and access for electrical devices in a power conversion system cabinet. The apparatus includes a support structure that translates a power conversion system component at least partially through a door or other cabinet opening between a first... Agent: Rockwell Automation, Inc./fay

20080094783 - Power regulator with a bypass and splice capability: A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a conductive resilient tab and a conductive rigid tab. The cooling fins are conductive and adjacent... Agent: Thomas E. Sisson Jackson Walker, LLP

20080094784 - Switching system comprising switchgear that can be contacted via pin contacts: A switching system includes switchgear that can be contacted via pin contacts. In at least one embodiment, the switching system is provided with pin contacts and mating pin contacts and at least one device(s) for the transmission of force onto the switchgear, thereby allowing to establish and interrupt contact to... Agent: Harness, Dickey & Pierce, P.L.C

20080094785 - Communication device housing systems and methods: A transaction system includes a peripheral device, a transaction terminal having a printed circuit board disposed within an enclosure, a housing attached with the enclosure, and a cable that couples the peripheral device with the printed circuit board. The peripheral device includes a wireless communication device, a memory device, or... Agent: Townsend And Townsend And Crew, LLP

20080094786 - Waterproof casing for a flat panel display: A waterproof casing includes a first casing having a first base wall and a first surrounding wall, and a second casing having a second base wall and a second surrounding wall. The first surrounding wall surrounds a periphery of the first base wall to cooperatively define a first receiving recess... Agent: Christie, Parker & Hale, LLP

20080094789 - Flat panel display: A flat panel display having a coupling structure for coupling a flat panel display module to a case. The flat panel display comprises a flat panel display module having a plurality of protrusions formed on two opposite sides, and a first case for receiving the flat panel display module. The... Agent: F. Chau & Associates, LLC

20080094788 - Memory card having display function using piezoelectric effect and method thereof: A memory card includes a piezoelectric material and a display unit. The piezoelectric material generates a voltage from external pressure applied thereon, and the display unit displays information using the generated voltage. Thus, information is displayed on the memory card at the discretion of the user pressing the piezoelectric material... Agent: Law Office Of Monica H Choi

20080094790 - Plasma display device: A plasma display device includes a plasma display panel (PDP), a chassis base on the PDP, a plurality of printed circuit board assemblies (PBAs) on the chassis base and electrically connected to the PDP, at least one of the PBAs including a single-sided board with a plurality of insert-holes for... Agent: Lee & Morse, P.C.

20080094787 - Portable electronic device: A portable electronic device is disclosed in which an LCD (140) and a PCB (130) of the device are mounted on to first and second opposed sides of an internal frame. The internal frame has a stiffness chosen to suppress the distortion of the LCD and vibration of the PCB... Agent: Dickstein Shapiro LLP

20080094791 - Display device having an adjustable counterweight structure: A simple structure of display device having the function of self-balance and prevent falling caused by an external force is disclosed to include a display, a base, which has a convex bottom surface and is fixedly connected to the bottom side of the display, and an adjustable counterweight structure, which... Agent: Bacon & Thomas, PLLC

20080094792 - Multi-sectioned arms for portable electronic devices: Multi-sectioned arms are used as a basic mechanism for coupling the display and the base of a portable computer. With this mechanism, one single computer can support all of the following capabilities. The display can move continuously, relative to the back edge of the base, along any combination of up... Agent: Shaofen Chen

20080094793 - Electronic circuit device, electronic device using the same, and method for manufacturing the same: Electronic circuit device (100) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component (190) embedded thereinto is inserted into housing (150) including connecting terminal (120), control circuit (130), and first wiring pattern (140), where the... Agent: Wenderoth, Lind & Ponack L.L.P.

20080094794 - Hard drive carrier assembly having interlocking parts: In some embodiments, an apparatus to carry a hard drive may include one or more of the following features: (a)at least one carrier component, (b) at least one interlocking portion located on the at least one carrier component, (c) a first connector located at the at least one interlocking portion... Agent: Lsi Corporation

20080094795 - Cooling a computing device: Various technologies for cooling a computer system are described. In accordance with one described embodiment, a fan assembly system for a computer comprises a fan operable for cooling the computer and a fan duct coupled with the fan. The fan duct comprises a number of attaching features. The fan is... Agent: Hewlett Packard Company

20080094798 - Apparatus for cooling computer parts and method of manufacturing the same: Provided is an apparatus for cooling heat generating computer parts that installed in a computer. The apparatus includes a heat transferring block capable of being thermally coupled to the heat generating parts to conduct the heat generated by the heat dissipating parts; at least one heat pipe, each including a... Agent: Jason Y. Pahng

20080094797 - Container-based data center: A computing system and method of operating a computing system is provided. The computer system includes: a housing comprising a shipping container having a first interior lateral wall and a second interior lateral wall; a first row of equipment provided along the first interior lateral wall with a first exhaust... Agent: Macpherson Kwok Chen & Heid LLP

20080094796 - Piramidal case, for computer, with high ability to dissipate the heat: Pyramidal case for computer, with a square base including a support on a box, with a rectangular rear section and a trapezoidal front section, which dissipates the heat with greater efficiency and effectiveness, through obliged paths of the air flows which amplify the natural thermodynamics of the warm air masses.... Agent: Frommer Lawrence & Haug

20080094799 - Method and apparatus for providing thermal management in an electronic device: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn... Agent: Bainwood Huang & Associates LLC

20080094801 - Heat dissipation module: A heat dissipation module is suitable to dissipate heat for a heat source on a circuit board, wherein a plurality of locking holes are disposed around the heat source. The heat dissipation module includes a heat sink, a locking rod, and two fasteners. The heat sink has a groove, and... Agent: Jianq Chyun Intellectual Property Office

20080094800 - Heat-dissipating device and method for producing the same: A heat-dissipating device and a method for producing the same, by forming an accommodating space and a plurality of locating part in communicated with said accommodating space on a metal body that contains a plurality of heat-dissipating fins; disposing a plurality of heat-conducting element in each corresponding locating part; disposing... Agent: Troxell Law Office PLLC

20080094802 - Heat sink, circuit board, and electronic apparatus: A heat sink that radiates n exoergic circuit elements mounted on a circuit board includes a housing that has a heat-receiving surface that receives heat from the n exoergic circuit elements, and n+2 fixture parts to each of which a fixture member is attachable, each fixture member compressively fixing the... Agent: Staas & Halsey LLP

20080094803 - High capacity thin module system and method: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on... Agent: Fish & Richardson P.C.

20080094804 - Test sensor cartridges and sensor-dispensing instruments: The cartridge comprises a housing, a plurality of test sensors, a mechanical mechanism, and a pusher assembly. The housing forms at least one opening therethrough. The plurality of test sensors is stacked in the housing. The plurality of test sensors is adapted to assist in testing at least one analyte.... Agent: Nixon Peabody LLP

20080094806 - Electrohydraulic control device: An electrohydraulic control device that includes at least one hydraulic actuator element, at least one sensor element, and at least one electronic control unit. The actuator element and the sensor element are combined in a hydraulically sealed hydraulic control device that is separated from the electronic control unit and that... Agent: Alfred J Mangels

20080094805 - Electronics module and method for manufacturing the same: This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face essentially towards the first surface of the insulating-material layer (1) and which is connected electrically by its contact terminals (7)... Agent: Birch Stewart Kolasch & Birch

20080094808 - Methods and apparatus of dual inline memory modules for flash memory: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may... Agent: Orion Law Group

20080094807 - Single chip usb packages with swivel cover: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The... Agent: Bever Hoffman & Harms, LLP Tri-valley Office

20080094809 - Electronic device installation structure: An electronic device installation structure for housing an electronic device which is coupled with a signal transmission dock includes a chassis which has a housing trough to hold the electronic device. The housing trough and the electronic device have respectively a guiding track and a boss that correspond to each... Agent: Birch Stewart Kolasch & Birch

20080094810 - Mechanism for facilitating hot swap capability: An assembly is disclosed which enables a printed circuit board (PCB) to be added to or removed from a computer system without deactivating other parts of the system. The assembly, which holds the PCB, translates lateral motion into vertical motion to enable lateral motion to be applied to derive the... Agent: Hickman Palermo Truong & Becker, LLP And Sun Microsystems, Inc.

20080094811 - High density high reliability memory module with a fault tolerant address and command bus: A high density high reliability memory module with a fault tolerant address and command bus. The memory module includes a rectangular printed circuit board having a first side and a second side, a length of between 149 and 153 millimeters and first and second ends having a width smaller than... Agent: Cantor Colburn LLP-ibm Poughkeepsie

20080094812 - Solid electrolytic capacitor and structure for mounting this solid electrolytic capacitor on board: A solid electrolytic capacitor 1 includes a capacitor element 2 and a resin package 9 enclosing the capacitor element. The capacitor element includes a sintered body 3 of valve metal powder, an anode 4a provided by embedding an anode wire 4 in the sintered body, and a cathode 5 provided... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20080094813 - Circuit board structure: The present invention provides a circuit board structure, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with at least one through hole penetrating the first and second surfaces; a conductive pillar formed in the through... Agent: Sawyer Law Group LLP

20080094814 - Motherboard positioning apparatus for fast installation: A motherboard positioning apparatus for fast installation aims to position a motherboard on a chassis. The chassis has an elastic unit on one side wall and an anchor boss on the bottom thereof. The motherboard has one end pressing the anchor boss and another end urged by the elastic unit... Agent: Birch Stewart Kolasch & Birch

20080094815 - Electronic device and method of manufacturing the same: An electronic device that enables securing excellent hollow structure and close air-tightness of the space between the substrate and the electronic component, without incurring degradation in production efficiency, is to be provided. The electronic device includes a mounting substrate, an electronic component mounted on the mounting substrate, and