Electricity: electrical systems and devices patents - Monitor Patents
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Electricity: electrical systems and devices

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
09/18/2014 > 197 patent applications in 100 patent subcategories.

20140268430 - Breaker design for power system resiliency: An autonomous breaker can apply a current through a high impedance source to a bus coupled to either end of a breaker in order to measure an impedance of the bus. The status of the bus can be determined from the measurement. Based on the determined status, a fault detection... Agent: Transocean Sedco Forex Ventures Limited

20140268431 - Rotating diode assembly including overvoltage protection circuit: A brushless wound field synchronous generator configured to generate an output power to drive an electrical load includes a rotating rectifier assembly. The rotating rectifier assembly includes a rotating diode assembly and a field effect transistor (FET) to control voltage across the rotating diode assembly.... Agent: Hamilton Sundstrand Corporation

20140268432 - Multimotor variable frequency overload: An apparatus for protecting a motor includes two or more motor overloads, within a motor overload enclosure, protecting two or more motors. Each motor overload includes one or more current sensors where each current sensor includes a magnetic core and each current sensor includes a conductor positioned within the magnetic... Agent: Rockwell Automation Technologies, Inc.

20140268433 - System and method for protection of a compressor with an aluminum winding motor: A compressor is provided and includes a single-phase electric motor and a protector device. The electric motor drives a compression mechanism and has a rotor and a stator. The stator is comprised of aluminum windings. The protector device is attached to the stator and is configured to disconnect the electric... Agent: Emerson Climate Technologies, Inc.

20140268435 - Current saturation detection and clamping circuit and method: A method and circuit for detecting and clamping current in a ground fault circuit interrupter circuit. In accordance with an embodiment the circuit includes an amplifier connected to a switch, where in the amplifier has an input connected to a first conduction terminal of the switch through a resistor and... Agent: Semiconductor Components Industries, LLC

20140268437 - Gfci self test software functional program for autonomous monitoring and fail safe power denial operations: Software code for operating a circuit interrupting device having an auto-monitoring circuit for automatically testing various functions and structures of the device. The auto-monitoring circuit initiates the software code which includes an auto-monitoring routine which, among other things, establishes a self-test fault during the positive or negative half-wave of an... Agent:

20140268434 - Gfci with voltage level comparison and indirect sampling: A circuit interrupting device having an auto-monitoring circuit for automatically testing various functions and structures of the device. The auto-monitoring circuit initiates an auto-monitoring routine which, among other things, establishes a self-test fault during either the positive or negative half-wave, or both, of an AC power cycle and determines whether... Agent:

20140268436 - Protective device with non-volatile memory miswire circuit: The present invention is directed to an electrical wiring device that includes a processing circuit is configured to determine the wiring state based on detecting a wiring state parameter at the plurality of line terminals during a predetermined period after the tripped state has been established. The processing circuit is... Agent:

20140268441 - Active esd protection circuit: A high-voltage gate driver circuit configured to drive a high-side power switch and a low-side power switch includes an active dv/dt triggered ESD protection circuit coupled between a protected node and a power rail node. The active dv/dt triggered ESD protection circuit includes a dv/dt circuit controlling an ESD protection... Agent: Alpha And Omega Semiconductor Incorporated

20140268438 - Apparatuses and method for over-voltage event protection: Circuits, integrated circuits, apparatuses, and methods, such as those for protecting circuits against electrostatic discharge events are disclosed. An example apparatus comprises a thyristor coupled to a node and configured to limit the voltage and discharge the current associated with an over-voltage event at the node. The over-voltage event includes... Agent: Micron Technology, Inc.

20140268449 - Circuit and method of electrically decoupling nodes: A device includes a first power node, a second power node, a first input node, a second input node, a protected circuit, and a switch circuit. The protected circuit is coupled between the first power node and the second power node, and the protected circuit is further coupled with the... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20140268442 - Circuit arrangement and method for evaluating a signal: Circuit arrangement including an interface, a protection circuit and a measurement circuit. The interface is configured to receive a signal. The protection circuit is coupled to the interface. The protection circuit is configured to limit a voltage provided by the interface to a protection voltage. The measurement circuit is coupled... Agent: Infineon Technologies Ag

20140268445 - Cross talk mitigation: Cross-talk is mitigated in a switching circuit. In accordance with one or more embodiments, an apparatus includes a multi-pin connector having signal-carrying electrodes that communicate with a device external to the apparatus, and respective field-effect switches that couple the signal-carrying electrodes to respective communication channels in the apparatus. The switches... Agent: Nxp B.v.

20140268439 - Electrostatic discharge (esd) control circuit: One or more electrostatic discharge (ESD) control circuit are disclosed herein. In an embodiment, an ESD control circuit has first and second trigger transistors, first and second ESD transistors, and first and second feedback transistors. The ESD transistors provide ESD current paths for ESD current generated during an ESD event.... Agent: Taiwan Semiconductor Manufacturing Company Limited

20140268452 - Electrostatic discharge connector and method for an electronic device: An illustrative electronic assembly having an electrical connector therein to ground an electronic component of the electronic assembly to a grounding feature of a printed wiring assembly (PWA) of the electronic assembly. The electronic assembly may include a housing, the PWA, the electronic component and the electrical connector. The electrical... Agent:

20140268444 - Electrostatic discharge protection circuits using carbon nanotube field effect transistor (cntfet) devices and methods of making same: Device structures and methods for providing carbon nanotube field effect transistor (CNTFET) devices with enhanced current carrying capability at lower densities are disclosed. Apparatuses and methods using CNTFET devices for providing protection from electrostatic discharge (ESD) voltages are also disclosed. According to some aspects of the present disclosure the electrostatic... Agent:

20140268451 - High holding voltage clamp: An electrostatic discharge (ESD) protection device with a high holding voltage is disclosed including at least an ESD clamp coupled to a holding voltage tuning circuit. The ESD clamp may be coupled to the holding voltage tuning circuit through a connection circuit such as a diode. The ESD clamp may... Agent: Sofics Bvba

20140268450 - High speed latch with over voltage protection and integrated summing nodes: A latch includes a current source, an input amplifier, and a latch output circuit. The current source is configured to output a current based on a voltage source. The input amplifier is configured to receive a differential analog input signal including a first differential input and a second differential input... Agent: Marvell World Trade Ltd.

20140268443 - Input power protection: In one general aspect, an apparatus can include an input terminal, an output terminal and a ground terminal. The apparatus can also include an overcurrent protection device coupled between the input terminal and the output terminal. The apparatus can further include a thermal shunt device coupled between the output terminal... Agent: Fairchild Semiconductor Corporation

20140268448 - Method and apparatus of esd protection in stacked die semiconductor device: An apparatus includes an interposer and a plurality of dies stacked on the interposer. The interposer includes a first conductive network of a first trigger bus. Each of the plurality of dies includes a second conductive network of a second trigger bus, and an ESD detection circuit and an ESD... Agent:

20140268440 - Micromachined high breakdown voltage esd protection device for light emitting diode and method of making the same: This invention relates to a micromachined ESD protection device and its microfabrication method for light emitting diode (LEDs) chips. The LEDs is coupled to the ESD protection device in a shunt connection to absorb and eliminate the electrostatic charges induced by human contact or other voltage spike sources. The ESD... Agent: Wisenstech Inc.

20140268446 - Radio frequency integrated circuit (rfic) charged-device model (cdm) protection: An apparatus is described. The apparatus includes an input device. The apparatus also includes a positive supply voltage pad. The apparatus further includes an input signal pad. The apparatus also includes a ground pad. The apparatus further includes charged-device model protection circuitry that protects the input device from electrostatic discharge.... Agent: Qualcomm Incorporated

20140268447 - Radio frequency integrated circuit (rfic) charged-device model (cdm) protection: An apparatus is described. The apparatus includes an input device. The apparatus also includes a positive supply voltage pad. The apparatus further includes an input signal pad. The apparatus also includes a ground pad. The apparatus further includes charged-device model protection circuitry that protects the input device from electrostatic discharge.... Agent: Qualcomm Incorporated

20140268453 - Superconducting fault current limiter system: A current limiter system includes a superconducting fault current limiter (SCFCL) operative to conduct load current during a normal operation state in which the SCFCL is in a superconducting state. The current limiter system also includes a shunt reactor connected in an electrically parallel fashion to the SCFCL and configured... Agent: Varian Semiconductor Equipment Associates, Inc.

20140268454 - Systems and methods for power interruption: A power interruption circuit for use in a power distribution module is provided. The power interruption circuit is configured to provide power to a load and includes a shunt resistor, a plurality of switches, and microprocessor. The microprocessor is configured to determine a digitized value of a current flowing through... Agent: General Electric Company

20140268456 - Relay device: A relay device includes a relay circuit to which driving current is supplied from a battery, a driving circuit configured to drive the relay circuit, and a protecting circuit having a Schottky diode and a voltage suppressing element. The battery, the relay circuit, the driving circuit, and the protecting circuit... Agent: Yazaki Corporation

20140268455 - Reverse battery protection for battery-powered devices: Reverse battery protection circuits for devices powered by batteries coupled in parallel can include both P-channel and N-channel MOSFETs. Each positive battery terminal connector of a battery-powered device can be coupled to a gate of an N-channel MOSFET or to both a gate of an N-channel MOSFET and a gate... Agent: Bayer Healthcare LLC

20140268457 - High voltage protection apparatus and method: An apparatus includes first and second switches. The first switch is for coupling a first node to a second node responsive to a first control signal having a first value, and for decoupling these nodes responsive to the first control signal having a second value. The second switch is for... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.

20140268458 - Systems and methods for detecting and determining sources of power disturbances in connection with effective remediation: Apparatus and methods for selective protection of an electrical load from disturbances on an input power line. A power protection circuit includes a selectively variable inrush current limiting circuit and a switch for disconnecting the input power line from the load. A control circuit determines that the electrical load is... Agent: Innovolt, Inc.

20140268461 - Control circuit for electric power circuit switch: A control circuit for an electric power circuit switch includes: a sampling/hold circuit section configured to sample a period of a detection signal of a current of an electric power system and provide a sampled signal; a discrete Fourier transforming (abbreviated as DFT) circuit section perform DFT on the one-period... Agent: Lsis Co., Ltd.

20140268459 - Methods and apparatus for dynamically adjusting an over-current protection threshold: Methods and apparatus for dynamically adjusting an over-current protection threshold (514) are disclosed. A dynamic over-current protection circuit (104) receives a first trigger to switch to a high discharge current mode. The dynamic over-current protection circuit (104) starts a high-current timer (210) and increases the over-current protection threshold (514) in... Agent: Motorola Mobility LLC

20140268460 - Methods and apparatus for protection in a multi-phase machine: In some embodiments, a system includes multiple coils of a multi-phase machine in which the coils are each associated with a different phase. Associated with each coil is a protective element such that each protective element is associated with a different coil. When its associated protective element is in a... Agent: Boulder Wind Power, Inc.

20140268462 - Methods and apparatus related to a precision input power protection device: In one general aspect, an apparatus can include an input terminal and an overvoltage protection device coupled to the input terminal and configured to receive energy via the input terminal. The overvoltage protection device can have a breakdown voltage at an ambient temperature less than a target maximum operating voltage... Agent: Fairchild Semiconductor Corporation

20140268464 - Output over-voltage protection circuit for power factor correction: An output over-voltage protection circuit for power factor correction, which includes a chip external compensation network, a chip external resistor divider network, a static over-voltage detection circuit, a dynamic over-voltage detection circuit and a compare circuit; The chip external compensation network is connected between the chip external resistor divider network... Agent: Csmc Technologies Fab2 Co., Ltd.

20140268463 - Overvoltage protection circuit: Universal Serial Bus (USB) protection circuits are provided. A circuit includes a plurality of first transistors connected in series between a pad and ground. The circuit also includes a plurality of second transistors connected in series between the pad and a supply voltage. The circuit further includes a control circuit... Agent: International Business Machines Corporation

20140268465 - System and method for providing optically triggered circuit breaker: A system/method for providing an optically triggered circuit breaker is provided. The system comprises a junction field-effect transistor (JFET) and gate drive coupled to the JFET's gate. The gate drive applies voltage bias (VG) to the gate and the gate drive is configured to bias VG so that the system... Agent: Northrop Grumman Systems Corporation

20140268466 - Power protection circuit: A power protection circuit includes a power source, a first voltage division module, a second voltage division module, a comparison module, an electronic switch, and a power module. The first voltage division module divides a voltage from the power source and outputs a first voltage. The second voltage division module... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140268467 - Methods and apparatus to provide transient event protection for circuits: Methods and apparatus to provide transient event protection for circuits are disclosed. An example apparatus includes a first clamp circuit. The first power circuit provides a first reference voltage. The first clamp circuit directs energy from a signal node to the first power circuit in response to a transient resulting... Agent: The Boeing Company

20140268468 - Direct current breaker and electrical power system comprising such direct current breaker: A direct current breaker for a high voltage direct current application includes: two high voltage electron tubes arranged in an anti-parallel connection, and a control circuit for receiving, from a control system, infrared pulses including control information, the control circuit further including a device configured to convert the infrared pulses... Agent: Abb Technology Ag

20140268469 - Surge protection device and method: A surge protection device includes, in one embodiment, a reversible surge responder operative to engage an inner conductor engager during a protect mode and disengage the inner conductor engager during a normal mode. The surge responder returns to the normal mode from the protect mode without the intervention of an... Agent: John Mezzalingua Associates, LLC

20140268470 - Surge protection for an electronic device: A surge protection circuit for an electronic device such as an HVAC controller. In one example, the surge protection circuit may include a first voltage clamp, a second voltage clamp, a resistor, and an output port. The first voltage clamp may provide a first clamping voltage between a power input... Agent:

20140268471 - R-stack arrester: An elbow arrester with a T-body is disclosed capable of coupling with an apparatus for protection from transient over voltage, and coupling with additional cable accessories, without having to loosen the initial connection with the coupled apparatus. The elbow body of the T-body arrester has a first portion, and a... Agent: Richards Manufacturing Company

20140268472 - Mobile eas deactivator: A deactivator device for a mobile Point of Sale (mPOS) systems includes a pair of spaced apart, fixed position electromagnets positioned and configured such that magnetic fields generated by the electromagnets aid one another to form a combined magnetic field; a battery; a capacitor; and an electronics assembly including a... Agent: Tyco Fire & Security Gmbh

20140268473 - Electric vehicle support equipment having a smart plug with a relay control circuit: A smart plug for coupling an electric vehicle to a power supply includes a relay including contacts, the relay configured to operate in a closed state to enable power to be supplied to the electric vehicle and an open state to prohibit power from being supplied to the electric vehicle.... Agent: Tyco Electronics Corporation

20140268474 - Method of closing a relay switch and appartus thereof: A load control device for controlling an amount of power delivered from an alternating current (AC) power source to an electrical load includes a relay operable to be coupled in series electrical connection between the AC power source and the electrical load. The relay has one or more relay contacts.... Agent: Lutron Electronics Inc., Co.

20140268475 - Ionizer: An ionizer includes an electrode shaft, a fixing bar, a driver, and a controller. The electrode shaft includes first and second electrode rows, the first electrode row having a plurality of ionizer electrodes arranged in a first direction and the second electrode row having a plurality of ionizer electrodes arranged... Agent: Samsung Display Co., Ltd.

20140268476 - Method and system for significantly improving charge probabilities of nanometer aerosol particles: The various embodiments described herein significantly increase charge probabilities of nanoparticles by first growing them to larger droplets using a diethylene glycol-based preconditioner, neutralizing the droplets with a bipolar charger, and then removing the condensed liquid to recover the original aerosol particles. The small droplet size is an important element... Agent: Tsi Incorporated

20140268477 - Personal defense accessory for a mobile communications device: A personal defense accessory for interaction with a mobile communications device includes a main housing. A pair of electrodes are disposed in the main housing. A controller is disposed with the main housing and connected to the pair of electrodes to deliver a stun rated shock.... Agent:

20140268478 - Methods and apparatus for electrostatic chuck repair and refurbishment: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic... Agent:

20140268479 - Substrate support chuck cooling for deposition chamber: A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central... Agent: Applied Materials, Inc.

20140268480 - High voltage connection sealing method for corona ignition coil: A corona igniter assembly 20 comprises an ignition coil assembly 22, a firing end assembly 24, and a metal tube 26 connecting the ignition coil assembly 22 to the firing end assembly 24. A rubber boot 28 is disposed in the metal tube 26 and compressed symmetrically between a coil... Agent: Federal-mogul Ignition Company

20140268481 - Complex oxide, thin-film capacitive element, liquid droplet discharge head, and method of producing complex oxide: A complex oxide includes a chemical compound represented by ABO3 (Chemical Formula 1). In the Chemical Formula 1, A is one or more elements selected from Ba, Ca, and Sr; and B is one or more elements selected from Ti, Zr, Hf, and Sn. When a field having a size... Agent: Ricoh Company, Ltd.

20140268482 - Actuator plate partitioning and control devices and methods: Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where... Agent:

20140268483 - Ferroelectric capacitor with improved fatigue and breakdown properties: Disclosed is a ferroelectric material and methods for its use in capacitors that includes a polymer blend of at least two polymers, wherein the first polymer is a ferroelectric polymer and the second polymer has a low dielectric constant.... Agent: Saudi Basic Industries Corporation

20140268485 - Conductive paste for external electrodes and multilayer ceramic electronic component using the same: There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20≦a≦60, 10≦b≦40,... Agent:

20140268489 - Dielectric ceramic and laminated ceramic capacitor: A laminated ceramic capacitor which has a long high temperature load life, small variations in life, large capacitance, high electrical insulation property, and favorable capacitance temperature characteristics, even when high strength electric field is applied while reducing the thickness of dielectric ceramic layers uses a dielectric ceramic represented by the... Agent: Murata Manufacturing Co., Ltd.

20140268484 - Dielectric ceramic composition and multilayer ceramic capacitor including the same: A dielectric ceramic composition includes: a base material powder BamTiO3 (0.995≦m≦1.010); 0.2 to 2.0 moles of a first accessory ingredient, an oxide or carbide containing at least one of Ba and Ca, based on 100 moles of the base material powder; a second accessory ingredient, an oxide containing Si or... Agent:

20140268486 - Electronic component: An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are... Agent: Murata Manufacturing Co., Ltd.

20140268487 - Electronic component, substrate-type terminal included therein, and electronic component mounted structure: A substrate-type terminal includes a first major surface with a first mounting electrode and a second mounting electrode. The substrate-type terminal includes a second major surface with a first connecting electrode and a second connecting electrode. The substrate-type terminal includes a first slit located between the first mounting electrode and... Agent: Murata Manufacturing Co., Ltd.

20140268488 - Monolithic capacitor: A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and... Agent: Murata Manufacturing Co., Ltd.

20140268490 - Super capacitor and method for manufacturing the same: The invention provides a super capacitor, comprising: a bottom electrode, made of metal that has a sponge-like porous bicontinuous structure wherein the porous bicontinuous structure comprises a plurality of continuous nano pores; a dielectric layer, made of material with high dielectric constant and disposed on the bottom electrode wherein the... Agent: National Taiwan University

20140268491 - Capacitors using porous alumina structures: Capacitors and methods of making the same are disclosed herein. In one embodiment, a capacitor comprises a structure having first and second oppositely facing surfaces and a plurality of pores each extending in a first direction from the first surface towards the second surface, and each having pore having insulating... Agent: Invensas Corporation

20140268492 - Barium calcium tin titanate powder, dielectric composition and multilayer ceramic capacitor: There is provided a dielectric composition containing barium calcium tin titanate powder composed of (Ba(1-x-y)CaxSny)zTiO3, satisfying 0.01≦x≦0.15, 0.01≦y≦0.20, and 0.99≦z≦1.01.... Agent: Samsung Electro-mechanics Co., Ltd.

20140268493 - Biaxially stretched polypropylene film for capacitor, metallized film, and film capacitor: Provided is a biaxially stretched polypropylene film for capacitors which has high withstand voltage characteristics when used as a dielectric for capacitors and which has highly suitable processability into elements. The biaxially stretched polypropylene film for capacitors has projections on both surfaces and has a thickness (t1, μm) of 4-20... Agent: Toray Industries, Inc.

20140268494 - Low energy milling to produce flake powders: A method for increasing surface area of a valve metal particle is provided as is an improved valve metal particle provided thereby. The method includes charging a mill apparatus with a valve metal powder and a media wherein the media has an average diameter of at least 0.01 cm to... Agent: Kemet Electronics Corporation

20140268496 - Electrical energy storage device and manufacturing method thereof: Disclosed is an electrical energy storage device provided with a metallic casing to receive a bare cell and first and second terminals located outside of the metallic casing corresponding to each electrode of the bare cell, including a plate-like member provided on at least one of the first and second... Agent: Ls Mtron Ltd.

20140268495 - Electrodes for capacitors from mixed carbon compositions: Wet carbon paper processing, wet carbon papers, electrodes prepared from such wet carbon papers, and capacitors prepared from such electrodes.... Agent:

20140268499 - Flat capacitor for an implantable medical device: One aspect provides a capacitor feedthrough assembly having an electrically conductive member dimensioned to extend at least partially through a feedthrough hole of a case of the capacitor, the conductive member having a passage therethrough.... Agent: Cardiac Pacemakers, Inc.

20140268497 - Wet electrolytic capacitor: A wet electrolytic capacitor that contains electrodes (i.e., anode and cathode) and a working electrolyte is provided. The anode and optionally the cathode include a wire assembly containing two or more individual wires. A particulate material is also disposed in contact with at least a portion of the wire assembly.... Agent: Avx Corporation

20140268498 - Wet electrolytic capacitor for use at high temperatures: A wet electrolytic capacitor that contains an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a metal substrate coated an electrochemically-active material. Through a unique and controlled combination of features relating to the capacitor configuration and sealing assembly, the... Agent: Avx Corporation

20140268500 - Winding-type solid electrolytic capacitor package structure using a lead frame and method of manufacturing the same: A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface.... Agent: Apaq Technology Co., Ltd.

20140268501 - Solid electrolytic capacitor for use in extreme conditions: A capacitor assembly that is capable of performing under extreme conditions, such as at high temperatures and/or high voltages, is provided. The ability to perform at high temperature is achieved in part by enclosing and hermetically sealing the capacitor element within a housing in the presence of a gaseous atmosphere... Agent: Avx Corporation

20140268502 - Solid electrolytic capacitor: A capacitor for use in relatively high voltage environments is provided. The solid electrolyte is formed from a plurality of pre-polymerized particles in the form of a dispersion. In addition, the anode is formed such that it contains at least one longitudinally extending channel is recessed therein. The channel may... Agent: Avx Corporation

20140268503 - Winding-type solid electrolytic capacitor package structure without using a lead frame and method of manufacturing the same: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative... Agent: Apaq Technology Co., Ltd.

20140268504 - Modular wire harness arrangements and methods of using same for backside to frontside power and data distribution safety schemes: A large format billboard type electronic sign includes at least one structural frame member mounted to a front side of a planar mounting structure that defines a plurality of structural bay members configured for receiving and removably supporting therein a corresponding plurality of weatherized display modules to conceal and protect... Agent: Adti Media, LLC

20140268505 - Arc chute assembly for an automatic transfer switch system and methods of assembling the same: An arc chute assembly for use in an automatic transfer switch includes a housing including a pair of opposing sidewalls and a primary deionization plate coupled between the pair of opposing sidewalls. The primary deionization plate includes a tongue portion oriented substantially midway between the opposing sidewalls and extending toward... Agent: General Electric Company

20140268506 - Utility meter box and meter box cover: Provided is a meter box, a meter box cover and methods and apparatuses related to meter boxes and meter box covers. The meter box and meter box cover may include features which allow the meter box and meter box cover to be secured to each other and may be manufactured... Agent: Trumbull Manufacturing, Inc.

20140268507 - Cable protector for utility meter: Techniques for the construction and use of cable protectors are described herein. The cable protectors may be used to protect cables in a wide variety of applications, locations and environments, including a utility (e.g., water or gas) metering application. In one example, the cable protector may protect a cable connecting... Agent: Itron, Inc.

20140268516 - Biometric and proximity sensor compatible protective case for mobile device: A protective case can be used with a mobile device having front and back surfaces and side surfaces extending between the front and back surfaces, including a top side, a bottom side, a right side, and a left side, the mobile device having a screen on the front surface. The... Agent: Incipio Technologies, Inc.

20140268512 - Calabria din rail mount bracket: A bracket may be provided. The bracket may comprise a main plate comprising a bend. In addition, the bracket may comprise a slider plate configured to movably slide against the main plate. The slider plate may further comprise an offset that may be substantially parallel with the bend. The bracket... Agent: Cisco Technology, Inc.

20140268525 - Case, method of manufacturing case, and electronic device: A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface... Agent: Samsung Electronics Co., Ltd.

20140268526 - Combining different types of moisture-resistant materials: Protective coatings, including moisture-resistant coatings, that include two or more different types of moisture-resistant materials are disclosed, as are moisture-sensitive substrates that include such protective coatings. Moisture-sensitive substrates that include different types of moisture-resistant coatings on different elements are also disclosed.... Agent: Hzo, Inc.

20140268511 - Control box mounting bracket: A bracket configured to mount a control box to a television mount used to carry a television. An example bracket may have a bracket plate, a bracing element, and attachment elements. The bracing element is attached to a back side of the bracket plate, and the bracing element is attachable... Agent: Related Visual Services, Inc.

20140268513 - Display screen assembly having a selectively engageable mount assembly: A display screen assembly is provided. The display screen defines a channel for allowing selective engagement of the display screen. A mount assembly is provided and includes a base for supporting the display screen assembly about a support surface, and a locking assembly that selectively engages the channel to thereby... Agent: Toshiba Global Commerce Solutions Holdings Corporation

20140268524 - Distributed sensor system: A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able... Agent:

20140268518 - Durable protective battery case: A durable and water-resistant or water-proof communication accessory with a built-in battery for a mobile communication device capable of enclosing, powering, and protecting a mobile device and protecting it from dirt, water, weather, bumps, and scratches. The built-in battery can extend the life of mobile communication device while protecting the... Agent: Mophie, Inc.

20140268521 - Electronic device: An electronic device includes: a first case that includes a first inner surface; a second case that includes a second inner surface that are opposed to the first inner surface; and a packing member that includes a packing portion formed along an entire inner circumference of the first inner surface... Agent: Fujitsu Limited

20140268522 - Electronic device: An electronic device is an electronic device that measures biological information. The electronic device includes a biological-information sensor section configured to measure the biological information and an armor case configured to house the biological-information sensor section. The armor case includes a case main body section and a rear lid section.... Agent: Seiko Epson Corporation

20140268517 - Electronic device with protective case and operating method thereof: An electronic device is provided. The electronic device includes a connector detachable from part of an electronic device including a display, and a cover connected to the connector, wherein the cover is capable of covering at least part of the display of the electronic device, and wherein the cover includes... Agent: Samsung Electronics Co., Ltd.

20140268508 - Framework for tailored personal electronics: One embodiment of the practical framework for production of apparel articles incorporating electronic devices such as wired speakers. This framework securely locates the desired electronic (1) and applique elements (9, 10). The materials of which the substrate (3, 4, 6, 7) is comprised possess distinct qualities enabling it to be... Agent:

20140268514 - Ihs accessible rack securing system: A rack securing system includes a rack having a plurality of posts that are oriented to house a plurality of device chassis. Each of the plurality of posts includes a plurality of post apertures that are operable to receive a fastener to couple an edge of a device chassis to... Agent:

20140268527 - Image reproduction assembly having a front pane fastened in a space-saving manner: An image reproduction assembly having a two-dimensional image presentation matrix bounded by edges and by means of the matrix elements of which images are presented, fastening elements attached adjacent to edges of the matrix, a front pane fastened to the fastening elements, which is fixed in a plane in front... Agent: Tridelity Ag

20140268515 - Magnetic and electrostatic vibration-driven haptic touchscreen: A system adapted for selectively attracting an object to and moving the object on a surface. The system includes an oscillating element including a contact surface such as a computer tablet with a touch screen or a table with a ferrous surface. The system includes a drive (or vibration inducing)... Agent: Disney Enterprises, Inc.

20140268520 - Method of manufacturing member with sealing material layer, member with sealing material layer, and manufacturing apparatus: A method of manufacturing a member with a sealing material layer has a substrate preparation step, a coating step, a firing step, and a pre-process step. In the substrate preparation step, a substrate having a frame-shaped sealing region is prepared. In the coating step, a sealing material paste is applied... Agent: Asahi Glass Company, Limited

20140268509 - Portable device holding apparatus: An apparatus for holding a portable device is provided which includes a cradle for holding the portable device. A support member is operatively coupled to the cradle and includes an inserting member. The inserting member may be received by a receiving member coupled to a base member, wherein the base... Agent: Ford Global Technologies, LLC

20140268519 - Protective case for mobile device: Disclosed is durable and water-resistant or water-proof communication accessory with a built-in battery for a mobile communication device capable of enclosing, powering, and protecting a mobile device and protecting it from dirt, water, weather, bumps, and scratches. The built-in battery can extend the battery operating time of mobile communication device... Agent: Mophie, Inc.

20140268510 - Support module and support device having multiple degrees of freedom: A support device having multiple degrees of freedom includes a base unit, a first support unit, a second support unit and a hinge unit. The base unit includes a base body. The first support unit includes a first support structure disposed on the base body. The second support unit includes... Agent: Flytech Technology Co., Ltd.

20140268523 - Wearable device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor: A wearable device is provided having multiple sensors configured to detect and measure different parameters of interest. The wearable device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS... Agent:

20140268528 - Rack adapter apparatus and method: Embodiments of the present disclosure disclose a rack adapter apparatus. The rack adapter apparatus includes a shelf configured to be mounted in a rack frame having a front opening of a first width and a rear opening of the first width, the shelf being further configured to support a computing... Agent: Rackspace Us, Inc.

20140268531 - Television receiving box docking station rack and system: A cable box docking station rack includes a frame carrying a series of shelves, and each shelf including a series of docking stations for connection with cable boxes. Each docking station includes a fixed back plate and a slide plate in sliding relation. The back plate includes a series of... Agent:

20140268532 - Flexible electronic display and stand: An electronic display assembly may comprise a flexible electronic display screen that may be rolled onto a reel in a retracted configuration and extend from the reel in an extended configuration. Additionally, some electronic display stands are capable of connecting to and supporting a flexible electronic display screen in an... Agent:

20140268533 - Information handling system housing lid with synchronized motion: An information handling system converts from a closed position to a tablet position by rotating a lid with a display 360 degrees about a hinge having synchronized and continuous motion. The hinge has first and second axles held distal by a spacer. A synchronizer translates motion of each axle to... Agent:

20140268535 - Chopped-fibers with axial property gradient for molded parts: A portable computing device includes a processor, a memory, and a portable computing device case that encloses one or more integrated circuits, including at least the processor and the memory. The case includes a molded fiber-reinforced polymer (FRP) material that includes a polymer material and elongated fibers that adhere to... Agent: Google Inc.

20140268536 - High density server storage unit: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and... Agent: Skyera, Inc.

20140268534 - Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises... Agent:

20140268537 - In-package fly-by signaling: In-package fly-by signaling can be provided in a multi-chip microelectronic package having address lines on a package substrate configured to carry address information to a first connection region on the substrate having a first delay from terminals of the package, and the address lines being configured to carry the address... Agent: Invensas Corporation

20140268538 - Jbod cable: Embodiments of the invention include a plurality of flexible electrical conductors configured as a cable wherein a plurality of signal pairs connect printed circuit boards in an array of data storage devices or just a bunch of disks (JBOD) enclosure. By controlling various specific dimensions relating to each signal pair... Agent:

20140268540 - Fixing mechanism and related electronic device: A detachable fixing mechanism includes a supporter, a contacting component, a fixing component, a track component and an ejecting component. An electronic component is hold be the supporter. The supporter includes a base, a rear wall and two lateral walls. The rear wall and the lateral walls are disposed on... Agent: Wistron Corporation

20140268539 - Toolless hot swappable storage module: A toolless hot-swappable storage module system includes a base plate for mounting within a computer enclosure and a toolless hot-swappable storage module. The storage module includes a sled that is removably coupled to the base plate. The storage module further includes a printed circuit board (PCB) that is disposed on... Agent: Silicon Graphics International Corp.

20140268529 - Array of elements and a human-computer interface device: A human-computer interface device comprising an array of elements wherein each element is pivotally coupled to an adjacent first element by a first pivotal coupling and to an adjacent second element by a second pivotal coupling, the first pivotal coupling being operable to pivot about an axis which is substantially... Agent:

20140268542 - Docking apparatus of electronic apparatus: A docking apparatus of an electronic apparatus that can support the electronic apparatus is provided. The docking apparatus of an electronic apparatus may include a body that forms an exterior of the docking apparatus, a support portion rotatably coupled to the body, and an interface module coupled to the body... Agent: Samsung Electronics Co., Ltd.

20140268541 - System for mobile device cradle and tube gripper of non-destructive testing inspection device: A system includes a mobile handset with a handle portion and a gripper portion coupled to the handle portion. The handle portion includes a first dock configured to removably receive a user interface device. The gripper portion is configured to receive an insertion tube of a non-destructive testing (NDT) inspection... Agent: General Electric Company

20140268543 - Docking station for portable electronics: Disclosed is a docking station for holding a plurality of external connectors in position to interface with an electronic device including a main body having a first side and a second side, a positioning member extending vertically from the first side of the main body for receiving the electronic device,... Agent:

20140268544 - Pivotal vehicle mounting system for mobile computing devices: A mounting device includes a cradle including a first recess and configured to be mounted in a vehicle, a pivotable hinge member coupled to the cradle, and a docking tray coupled to the pivotable hinge member. The docking tray is configured to lock in a first position within the first... Agent: Voxx International Corporation

20140268549 - Device for cooling an electronic component in a data center: A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is... Agent: Hewlett-packard Development Company, L.p.

20140268547 - Electronic device rack and information processing apparatus: An electronic device rack includes a plurality of panels surrounding a first space. Moreover, the electronic device rack includes: an electronic-device housing unit disposed in the first space and configured to house electronic devices; a heat exchanger disposed in the first space at a position away from the electronic-device housing... Agent: Fujitsu Limited

20140268546 - Heat and airflow management in a data storage device: A chassis sub-assembly for computing devices includes a first heat sink plate and a second heat sink plate. The first heat sink plate includes a first plurality of perforations and the second heat sink plate includes a second plurality of perforations. The chassis sub-assembly also includes a first computing device... Agent: Evtron, Inc.

20140268545 - Modular synthetic jet ejector and systems incorporating the same: A synthetic jet ejector (501) is provided which includes a diaphragm (503) and a chassis (505). The chassis has first and second major surfaces which are equipped with a set of interlocking features (509) such that a first instance of the synthetic jet ejector releasably attaches to a second instance... Agent: Nuventix, Inc.

20140268548 - Thermosiphon systems for electronic devices: A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a... Agent: Google Inc.

20140268551 - Enclosure high pressure push-pull airflow: High pressure fans are mounted in the middle of an enclosure to create a low pressure zone and a high pressure zone within the enclosure. The high pressure fans pull air through high density sets of hard disk drives in the back of an enclosure and push air through high... Agent: Silicon Graphics International Corp.

20140268550 - Server with heat pipe cooling: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed... Agent: Silicon Graphics International Corp.

20140268530 - Data center facility design configuration: The methods and apparatuses described herein is a data center. In one embodiment is described a data center comprising: a building having a plurality of rooms and first and second exterior load walls disposed on opposite sides of the building; a plurality of air handler and fluid cooler devices disposed... Agent: Switch Communications Group LLC

20140268552 - Server with heat baffle cooling: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air... Agent: Silicon Graphics International Corp.

20140268553 - System for cooling multiple in-line central processing units in a confined enclosure: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin... Agent:

20140268554 - Stackable computing system: Systems and methods providing for stackable rack-based computing systems are discussed herein. A stackable rack-based computing system may include a plurality of stackable shelf frames. Each stackable shelf frame may include a module and one or more cooling elements to cool the module from a first side. The stackable shelf... Agent: Birchbridge Incorporated

20140268556 - Detachable computing system having dual batteries: A computing system may include a base portion to receive one or more first batteries, and a tablet portion having one or more electronic components and the tablet portion to receive one or more second batteries. The tablet portion may be configured to be coupled to and detached from the... Agent:

20140268558 - Electrical assembly having impedance controlled signal traces: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming... Agent:

20140268557 - Information processing apparatus, electronic apparatus, and frame unit for information processing apparatus: An information processing apparatus includes a body, a frame, and a hinge that allows the frame to be attached to a side face of the body in such a manner as to be rotatable and stoppable at any angle.... Agent: Fujitsu Limited

20140268555 - Locking mechanism for hinge assembly: In one embodiment a locking mechanism for a hinge, comprises a housing defining a chamber which is to contain a magnetorheological (MR) fluid, a bias mechanism which disposed at a first end of the chamber, a piston disposed at a second end of the chamber, the piston to be coupled... Agent:

20140268559 - Pcb mounted cover activated intrusion detection switch: An intrusion detection switch is attached directly to a printed circuit board and utilized within an enclosure. Wires are not used to extend the switch to the top of the enclosure. An extension mechanism is used to extend a triggering portion of the intrusion detection switch to an engaging surface... Agent:

20140268560 - Motorized mount for seating system: The present disclosure illustrates a motorized mount with a plurality of degrees of freedom coupled to a seating system.... Agent: Purdue Research Foundation

20140268561 - Electronic equipment and heat receiving device: a heat receiving device, wherein the heat receiving device includes: a case including a contacting surface which contacts the heat generating component; a flow passage, formed within the case, configured to flow a coolant flows, and an inflow port and an outflow port of the flow passage formed in an... Agent: Fujitsu Limited

20140268562 - Compound structural frame and method of using same for efficient retrofitting: Supports for plural billboard display modules include one or more structural frames mountable to existing billboard poster panels and other planar structural surfaces; each individual structural frame having a sufficient number of frame cutout areas to minimize frame weight to no greater than fifty pounds for hand lifting and mounting... Agent: Adti Media, LLC

20140268563 - Method and apparatus for controlling heat in power conversion systems: A power module includes a housing and an AC/DC converter within the housing. The AC/DC converter is configured to convert an AC input signal into a DC output signal. The power module also includes an actuated heat removal device. The actuated heat removal device is configured to remove heat produced... Agent:

20140268564 - Method and apparatus for controlling heat in power conversion systems: A power conversion module, such as a power adapter, includes a heat removal system such as an active heat removal system, a passive heat removal system or a hybrid heat removal system. A small-size power conversion module having a heat removal system is described.... Agent:

20140268565 - Sectional sign assembly and installation kit and method of using same: A modification kit for converting an existing signage mounting structure to an electronic sign generally includes a plurality of weatherized display modules; a plurality of sign sections each having a front-facing portion and a rear-facing portion, the front facing portion defining a two dimensional array of bays arranged in a... Agent: Adti Media, LLC

20140268566 - Digital subscriber line access multiplexer enclosures having onboard power: A system includes a digital subscriber line access multiplexer (DSLAM) enclosure having a power area for housing power components and a component area for housing components configured to receive power from the power components. The system further includes at least one DSLAM positioned in the component area of the DSLAM... Agent: Emerson Network Power, Energy Systems, North America, Inc.

20140268567 - Electronic device enclosure: An electronic device enclosure includes a casing, an air duct mounted in the casing, and a latching member. The air duct includes a receiving bracket formed on the air duct for receiving an uninterruptible power supply module. The latching member is covered on the receiving bracket to position the uninterruptible... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140268568 - Board unit and electronic device: A board unit includes a board to have an object to be cooled, the object being implemented on the board, a baffle plate to be rotatably coupled to the board and to be displaced to a first rotary position to guide a cooling air, flowing from a first direction to... Agent: Fujitsu Limited

20140268569 - Method and system for providing a customized storage container: A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular... Agent: Netapp, Inc.

20140268570 - Power pole isolated heat pipe inverter assembly: A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalk. The housing assembly sidewalls defining an enclosed space. The capacitor assembly... Agent: Eaton Corporation

20140268571 - System and method for cooling heat generating components: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components... Agent: Aavid Thermalloy, LLC

20140268572 - Advanced cooling for power module switches: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the... Agent: Hamilton Sundstrand Corporation

20140268573 - Management of exterior temperatures encountered by user of a portable electronic device in response to an inferred user contact with the portable electronic device: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component... Agent: Elwha LLC

20140268574 - Component built-in board and method of manufacturing the same, and component built-in board mounting body: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring... Agent: Fujikura Ltd.

20140268575 - Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint: A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load... Agent: International Business Machines Corporation

20140268576 - Line replaceable unit with universal heat sink receptacle: A line replaceable unit includes a universal heat sink receptacle formed in an inner surface of a wall of an enclosure. The universal heat sink receptacle is configured to receive a heat spreader for any standard or custom COM Express module so that the line replaceable unit may be efficiently... Agent: Gogo LLC

20140268577 - Chip package connector assembly: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of... Agent:

20140268578 - Electronic device with heat dissipating electromagnetic interference shielding structures: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within... Agent: Apple Inc.

20140268579 - Electronic devices assembled with heat absorbing and/or thermally insulating composition: Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition.... Agent: Henkel Corporation

20140268580 - Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component.... Agent: Cisco Technology, Inc.

20140268581 - Wiring substrate and manufacturing method thereof: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal... Agent: Yazaki Corporation

20140268582 - Electronic device enclosure system and method: An enclosure for storing more than one electronic device. The enclosure includes a frame having a rear surface to be in apposition to a support surface, a rack supported within the frame, the racking having at least one slot for receiving an electronic device, and a door supported by the... Agent: Ergotron, Inc.

20140268584 - Display apparatus: A display apparatus includes a display module for displaying an image, and a variable member for varying a shape of the display module. The variable member includes a first portion capable of varying in shape, and a second portion having opposite ends respectively fixed to opposite ends of the first... Agent: Lg Electronics Inc.

20140268583 - Electrical gasket and electronic module having electrical gasket: An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first... Agent:

20140268585 - Electronic module and electronic device: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the... Agent: Htc Corporation

20140268587 - Module and method of manufacturing the same: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating... Agent: Murata Manufacturing Co., Ltd.

20140268588 - Portable terminal and method of manufacturing a module thereof: A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can.... Agent: Samsung Electronics Co., Ltd.

20140268586 - Semiconductor package and printed circuit board: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is... Agent: Canon Kabushiki Kaisha

20140268592 - Assembling and handling edge interconnect packaging system: Apparatuses and methods related to the field of microchip assembly and handling, in particular to devices and methods for assembling and handling microchips manufactured with solid edge-to-edge interconnects, such as Quilt Packaging® interconnect technology. Specialized assembly tools are configured to pick up one or more microchips, place the microchips in... Agent: Indiana Integrated Circuits, LLC

20140268589 - Circuit board and electronic device provided with same: A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in... Agent: Kyocera Corporation

20140268591 - Printing complex electronic circuits: A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are... Agent: Nthdegree Technologies Worldwide Inc.

20140268590 - Window member and method of manufacturing the same: A window member includes: a glass member; a display member wherein the glass member has a bottom surface which faces and overlays the display member and a pattern layer provided on a first surface of the glass member and having a fine pattern. The pattern layer is silk-screen printed on... Agent: Samsung Electronics Co., Ltd.

20140268595 - Flexible display device: A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached... Agent: Samsung Electronics Co., Ltd.

20140268593 - Flexible interconnect structure for a sensor assembly: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple... Agent: Kulite Semiconductor Products, Inc.

20140268594 - Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly: A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer... Agent:

20140268596 - Flexible metal interconnect structure: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside... Agent: Palo Alto Research Center Incorporated

20140268599 - Data transfer device with configurable slot sizes and methods of using the same: A data transfer device that comprises: a chassis; a backplane; a slot arranged within the chassis and configured to hold a card; and a connector system integrated on the backplane and configured to electrically couple the card with the backplane; wherein the connector system includes a group of connectors arranged... Agent: Mrv Communications Americas, Inc.

20140268598 - Electronic device having connector with integrated shielding: An electronic device may have a housing in which electrical components on a printed circuit board are mounted. A connector may be mounted to the edge of the printed circuit board using solder. The connector may have a threaded portion that protrudes through the housing. A threadless portion of the... Agent: Apple Inc.

20140268601 - Filter packaging for system for wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry: A device comprising: a printed circuit board (PCB); a sensor package mounted on a first side of the PCB; electronics mounted on a second side of the PCB; and one or more filters, wherein the sensor package comprises one or more radiation sensors mounted therein, wherein each of the one... Agent: Landauer, Inc.

20140268600 - Housing for an electronic device internal walls: An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls... Agent:

20140268597 - Metro cell aggregator enclosure: A telecommunications aggregator enclosure includes a housing and a cover movably connected thereto. The cover is movable between open and closed positions. A printed circuit board is disposed in the housing. At least one first optical termination is connected to the printed circuit board to receive cables from a base... Agent: Hubbell Incorporated

20140268602 - Electronic device and methods: An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for... Agent:

20140268603 - Area array device connection structures with complimentary warp characteristics: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics... Agent: International Business Machines Corporation

20140268605 - Electronic package mounting: An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.... Agent:

20140268604 - Methods and systems for embedding filaments in 3d structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh... Agent: Board Of Regents, The University Of Texas System

20140268606 - Package of environmentally sensitive electronic device and fabricating method thereof: A package of an environmentally sensitive electronic device and a fabricating method thereof are provided, wherein the package may include a first substrate, a second substrate, the environmentally sensitive electronic device, a packaging body, and a filler. In one or more embodiments, the environmentally sensitive electronic device may be disposed... Agent: Industrial Technology Research Institute

20140268608 - Component holding structures, system, and method: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in... Agent: General Electric Company

20140268607 - Methods and systems for connecting inter-layer conductors and components in 3d structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.... Agent: Board Of Regents, The University Of Texas System

20140268609 - Support structure for integrated circuitry: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments,... Agent: Taiwan Semiconductor Manufacturing Company Limited

20140268610 - Method and system for forming a microvia in a printed circuit board: A method for forming vias in a multilayered printed circuit board is disclosed, which includes providing a multilayered printed circuit board having at least two or more layers; placing a donut pad on an upper layer of at least one layer of the multilayered printed circuit board for forming a... Agent:

20140268613 - Apparatus for improved power distribution in an electrical component board: Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This... Agent: R&d Circuits,inc.

20140268612 - Coreless substrate with passive device pads: Embodiments of the present disclosure are directed towards coreless substrates with passive device pads, as well as methods for forming coreless substrates with passive device pads and package assemblies and systems incorporating such coreless substrates. A coreless substrate may comprise a plurality of build-up layers, such as bumpless build-up layers... Agent:

20140268611 - System for applying power directly into power connectors for modular systems: A system for providing electrical power connection across components mounted to a backplane of an electrical chassis includes a backplane having multiple apertures and front and rear faces. A daughter board faces the front face of the backplane. The daughter board has multiple traces with individual conductive pads. A power... Agent: Emerson Network Power - Embedded Computing, Inc.

20140268616 - Capacitor with a dielectric between a via and a plate of the capacitor: In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and... Agent: Qualcomm Incorporated

20140268614 - Coupled vias for channel cross-talk reduction: Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent vertical transitions is achieved with overlapping metal surfaces within the vertical transitions. In embodiments, one or... Agent:

20140268617 - Supercapacitor structures: Supercapacitor structures are provided which include, for example: one or more layers of supercapacitors; and one or more contact tabs. The one or more contact tabs electrically contact and extend outward from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, and the one or more contact tabs... Agent: The Paper Battery Co.

20140268615 - Two-stage power delivery architecture: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage... Agent: Qualcomm Incorporated

20140268619 - Method of manufacturing substrate for chip packages and method of manufacturing chip package: Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the... Agent: Lg Innotek Co., Ltd.

20140268618 - Printed board, printed board unit, and method of manufacturing printed board: A printed-board includes a first conductor-layer, a second conductor-layer provided to a layer different from the first conductor-layer, an insulation-layer provided between the first conductor-layer and the second conductor-layer, a plurality of through-holes that pass through the first conductor-layer, the second conductor-layer, and the insulation-layer, and a plurality of vias... Agent: Fujitsu Limited

20140268620 - Expandable backplane: An expandable backplane is provided. The expandable backplane includes a baseboard management controller for connecting several disks, a first expansion board, a second expansion board, and a multiplexer. The multiplexer is connected between the baseboard management controller, the first expansion board, and the second expansion board. The multiplexer is used... Agent: Hon Hai Precision Industry Co., Ltd.

20140268621 - Edge mounting for printed circuit: An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first... Agent: Wintec Industries, Inc.

20140268622 - Fixing mechanism for fixing an portable electronic device and related electronic apparatus: The present invention discloses a fixing mechanism including a base, a cover, a connecting component, at least one resilient component and a pushing component. The base is for containing a portable electronic device. The cover is pivoted to the base. The connecting component is disposed on the base for engaging... Agent: Wistron Corporation

20140268623 - Mobile terminal: Disclosed is a mobile terminal, comprising: a display; a metal frame coupled to a rear surface of the display by an adhesive tape, and having a screw-coupling groove on a rear surface thereof; a front case coupled to the rear surface of the metal frame, and having a screw-coupling hole;... Agent: Lg Electronics Inc.

20140268624 - Carrier for mounting a piezoelectric device on a circuit board and method for mounting a piezoelectric device on a circuit board: A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier... Agent: Adaptive Methods, Inc.

20140268625 - Formulation for packaging an electronic device and assemblies made therefrom: Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.... Agent:

20140268626 - Antenna mechanical faceplate design: A faceplate configured for attachment to a communications module may be provided. The faceplate may comprise a first surface arranged in a vertical direction relative to the chassis and a second surface arranged at an angle to the first surface. The second surface may comprise a connector for attachment to... Agent: Cisco Technology, Inc.

  
09/11/2014 > 154 patent applications in 59 patent subcategories.

20140254049 - Method for eliminating an arc driven by means of at least one phase voltage source of a converter circuit: A method for eliminating an arc driven by at least one phase voltage source of a converter circuit is disclosed. The converter circuit can include a converter unit and an energy storage circuit, wherein the at least one phase voltage source can be connected on an AC voltage side of... Agent: Abb Technology Ag

20140254048 - Protection circuit and electronic device using the same: An exemplary protection circuit is provided to provide a controlled, latency-free, steady voltage. The circuit includes a switch module, an induction, a response module, a protection chip, and a sequence controller. The protection chip turns on the switch module when the voltage provided by a capacitor is less than a... Agent: Hon Hai Precision Industry Co., Ltd.

20140254050 - Protective device for an electrical supply facility: The present invention is directed to a protective device configured to be coupled between an AC power source and an electrical load. A ground continuity monitor is coupled to the ground conductor, the ground continuity monitor being configured to detect a ground discontinuity condition in the ground conductor. A circuit... Agent:

20140254051 - Devices and methods for calibrating and operating a snapback clamp circuit: A device includes a snapback clamp circuit configured to clamp a supply voltage in response to the supply voltage exceeding a trigger voltage level. In at least one embodiment, the snapback clamp circuit includes a clamp transistor and a programmable resistance portion that is responsive to a control signal to... Agent: Qualcomm Incorporated

20140254052 - Display unit configured to display trip information and circuit interrupter including the same: A display unit is configured for use with a circuit interrupter which outputs a trip notification, trip information, and direct current power to the display unit The display unit comprises: a processor having a routine; a secondary power source configured to output secondary power; a memory display configured to receive... Agent: Eaton Corporation

20140254053 - Travelling-wave based fault protection of high-voltage transmission lines: An improved method of fault detection in a high-voltage direct current (HVDC) power transmission line is provided. The fault detection is based on fault-induced travelling waves. The method comprises estimating an amplitude of fault-induced travelling waves at the fault location, and calculating a fault resistance (Rf) based on the estimated... Agent: Abb Technology Ag

20140254054 - Power supply device for plasma processing: A power supply device for plasma processing, wherein electric arcs may occur, comprises a power supply circuit for generating a voltage across output terminals, and a first switch connected between the power supply circuit and one of the output terminals. According to a first aspect the power supply device comprises... Agent:

20140254055 - Over current and short circuit protection device and method for electronic cigarette: The present invention discloses a control device and method for over current or short circuit protection of electronic cigarette. The control device includes an input module, a power module, a heating element, a switch control module, a comparator, and a FET; the FET is used to detect an operating voltage... Agent:

20140254056 - Fault current limiter: A fault current limiter is provided that comprises a magnetically saturable core. The first core includes a first leg, a second leg, with a first AC coil wound on the second leg, a third leg, with a second AC coil wound around the third leg, the first and second AC... Agent:

20140254057 - Surge suppression apparatus: A surge suppression apparatus is applied to an alternating current power supply apparatus. The surge suppression apparatus includes a rectification unit and a first transient voltage surge suppressor. The rectification unit includes a first diode, a second diode, a third diode, and a fourth diode. The first transient voltage surge... Agent: Chicony Power Technology Co., Ltd.

20140254058 - Current control device for solenoid, storage medium storing program for controlling current of solenoid, and method for controlling current of solenoid: A current control device sets a target current value of a solenoid, and sets a duty ratio of a PWM signal outputted to a drive circuit of a solenoid based on the target current value. The target current value is a value that periodically varies in a dither period longer... Agent: Denso Corporation

20140254059 - Electrostatic discharge shoe assembly and electrostatic discharge shoe grounding accessory thereof: An electrostatic discharge shoe grounding accessory comprises an attachment mechanism (2) and a fastening mechanism, wherein, the attachment mechanism (2) is a U-shape holder attached to the back wall of an opening rim of the shoe, and the fastening mechanism includes at least one smaller loop through (5) which a... Agent:

20140254060 - Systems and methods for aquatic electrical barrier desynchronization: The apparatus and methods are described for an electrical fish barrier system that has more than one geographically separate pulsator that are connected to a common electrical grid and are synchronized to prevent the overlapping of electrical pulses to prevent line notching or local line electrical line noise that may... Agent: Smith-root, Inc.

20140254061 - Electrostatic chuck apparatus: An electrostatic chuck apparatus includes a pedestal part including a side surface, an electrostatic chuck including a side surface and provided on the pedestal part, an adhesive part including a side surface and provided between the pedestal part and the electrostatic chuck, the adhesive part containing a resin adhesive agent... Agent: Shinko Electric Industries Co., L To.

20140254062 - Multi layer smectite capacitor (mlsc): Multilayer smectite capacitor (MLSC) provided with a new dielectric film, and a first electric and second electrode formed sandwiching it and facing each other, wherein has dielectric film. The dielectric film in this capacitor is smectite, and either or both of said first electrode and second electrode contain at least... Agent:

20140254063 - Multilayer ceramic capacitor: A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin Dcoa Tmax where Tmax is the maximum thickness of the dielectric layer and... Agent: Taiyo Yuden Co., Ltd.

20140254064 - Electronic component and method for manufacturing the same: In a method for manufacturing an electronic component, when conductive paste used to form outer electrodes is applied to a component body, a side surface of the component body is subjected to an affinity-reducing process to reduce an affinity for solvent, and then an end surface of the component body... Agent: Murata Manufacturing Co., Ltd.

20140254066 - Electrochemical energy storage device with coincident electrical terminal and electrolyte fill hole: An electrochemical energy storage device includes a housing, at least one energy storage element in the housing and operable with an electrolyte, a cap coupled to the housing, at least one electrolyte impregnation hole formed in the cap, and a first terminal lug attachable to the cap via the electrolyte... Agent: Cooper Technologies Company

20140254065 - Electrochemical energy storage device with flexible metal current collector: Electrochemical energy storage devices such as electric double layer capacitors include a flexible metal contact current collector establishing electrical contact with a conductive housing at numerous contact points. The flexible current collector simplifies manufacturing of the device and avoids laser welding on the conductive housing. The manufacture devices are operable... Agent: Cooper Technologies Company

20140254067 - Tantalum capacitor: Disclosed herein is a tantalum capacitor capable of improving equivalent series resistance (ESR) characteristic by increasing the bond between a tantalum wire and a tantalum powder. The tantalum capacitor according to the present invention includes: a tantalum wire; a tantalum powder having embedded a front end of the tantalum wire... Agent: Samsung Electro-mechanics Co., Ltd.

20140254068 - Electrical junction box: An electrical junction box includes a casing and a relay housed in the casing. The relay is located at an outer end in the casing. The relay includes an electrical component case and a terminal. The terminal is attached through the electrical component case and includes a fixed contact and... Agent: Sumitomo Electric Industries, Ltd.

20140254069 - Gateway node: In accordance with one embodiment, a gateway node having a housing, a bracket mounted relay and wireless communication capabilities. The gateway node is connected to a pad mount transformer.... Agent: Florida Power & Light Company

20140254070 - Electrical enclosure: A sealed electrical enclosure for housing an electrical component is provided. In one exemplary embodiment, the sealed electrical enclosure includes a housing, a first and second electrical connector, an actuator, and a terminal. The housing has a sealed interior when a top portion is coupled to a bottom portion. The... Agent: Ericson Manufacturing Company

20140254071 - Devices and methods for connecting device cover components: Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points.... Agent: Lenovo (singapore) Pte. Ltd.

20140254072 - Housing and electronic device using the same: A housing includes a substrate, an oxide transition layer disposed on the substrate, and a color layer disposed on the transition layer. The transition layer is an aluminum oxide layer, a zirconium oxide layer, or a silicon dioxide layer. The color layer is a titanium-aluminum-nitride layer. The color layer provides... Agent:

20140254073 - Methods and systems for integrally trapping a glass insert in a metal bezel: Methods and apparatus for creating an overall assembly formed from a transparent member and a metal member are disclosed. According to one aspect of the present invention, a method includes positioning a transparent member in a mold configured for insertion molding, and providing a liquid metal into the mold. The... Agent: Apple Inc.

20140254076 - Display device, and pos terminal device: It is an object of this invention to provide a display device capable of easily adjusting the height thereof without providing an extension and contraction mechanism. The display device (1) of this invention includes: a casing (3); and a display unit (5) to be installed for use onto the casing... Agent: Nec Infrontia Corporation

20140254075 - Integrating media display into computer peripherals and computing systems: the media mouse, media keyboard, media monitor, media mate, media screen and mediabook: A computer system such as a laptop or Personal Digital Assistant and a computer peripheral such as a mouse, keyboard, monitor and other new devices wherein the user can create, acquire, assemble, file and transmit media to a display enabled screen or screens on the systems, peripherals or new devices,... Agent:

20140254077 - Magnetic connector: An apparatus has a first housing and a second housing. By one approach at least the second housing has at least one exterior edge configured as a pivot surface. The first housing includes at least a first magnet and the second housing includes at least a second magnet that is... Agent: Research In Motion Limited

20140254079 - Electronic device: An electronic device is disclosed, which includes a first unit and a second unit. The first unit includes a housing and a connecting member disposed on the housing. The second unit includes a stand, wherein a guiding rail is formed on the support. When the first unit is selectively connected... Agent: Wistron Corp.

20140254078 - Portable computer housing and assembly methods: A portable computer includes a first housing having a first wall defining a first opening and a surface surrounding the opening and having an inside periphery. A first component is removably received within the opening and defines a body with an outer periphery that is inset with respect to the... Agent:

20140254080 - Electronic apparatus and keyboard thereof: An electronic apparatus includes a first body, a second body, a keyboard, at least one pair of body linkages and at least one pair of keyboard linkages. The second body is pivoted at the first body and has a second side facing the first body. The keyboard is adjacent to... Agent: Acer Incorporated

20140254081 - Electronic device having slidable screen: An electronic device includes a base and a cover. The base includes a sliding member slidably mounted thereon. The cover is pivotally mounted on the sliding member. A bobbin is rotatably mounted on the cover. A transmission line is sleeved around the bobbin. One end of the transmission line is... Agent: Hon Hai Precision Industry Co., Ltd.

20140254082 - Electronic device having movable screen: An electronic device includes a base and a cover. The base includes a sliding member slidably mounted thereon. The cover includes a touch screen. The cover is pivotally mounted on the sliding member. The cover is rotated to be substantially parallel to the base. The sliding member slides along the... Agent: Hon Hai Precision Industry Co., Ltd.

20140254085 - Modular data center: Described are methods, systems, and apparatus relating to a modular data center. In some embodiments, a modular data center includes one or more data modules. The modular data center includes a network module connected to the one or more data modules, the network module containing equipment for facilitating data communications... Agent: Io Data Centers, LLC

20140254084 - Multiprocessor computing apparatus with wireless interconnect for communication among its components: A fan less Multiprocessor Computing Apparatus (MCA) is housed in a metallic Enclosure (ME) that acts as an heat sink and provides extended surface area for heat dissipation. The ME also acts as an electro-magnetic-Shield that provides immunity from Electro-Magnetic-Interference (EMI) from external stray magnetic fields to wireless communications among... Agent:

20140254083 - Protection and data transmission device suitable for use on a portable electronic device: A protection and data transmission device suitable for use on a portable electronic device includes an inner cover, a transmission member, an outer cover assembly and a plurality of bolts. The transmission member is directly formed in the inner cover and have a USB connector and an electronic-device connector formed... Agent:

20140254086 - Pluggable apparatus of circuit board, and server: A pluggable apparatus of a circuit board is provided, which solves the problem that hot plugging of a Peripheral Component Interconnect Express (PCI-E) card is difficult to implement. The pluggable apparatus of the circuit board includes a base plate, a pulling strip, a rotating member, and a carrier plate, where... Agent: Huawei Technologies Co., Ltd.

20140254087 - Electronic device with hard disk drive: An electronic device includes a chassis, a circuit board mounted in the chassis, a hard disk drive, a cover secured to the chassis, and a mounting plate secured to the hard disk drive. The mounting plate secures the hard disk drive to the cover adjacent to the circuit board. The... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140254074 - Connectivity scheme and cooling scheme for a large rack system: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality... Agent: Juniper Networks, Inc.

20140254088 - Docking device: The disclosure relates to a docking device and an assembly comprising the docking device and a tablet computer. The docking device comprises a pair of frame members defining receiving space for receiving the tablet computer, each frame member includes a connection portion and a supporting portion; and a virtual input... Agent: Hewlett-packard Development Company, L.p.

20140254089 - Stall containment of rack in a data center: A system for managing air flow computing devices in a rack includes a stall and filler elements. The stall includes a stall top panel and two side panels spaced apart from one another. The stall accommodates a rack computing system. The filler elements fill gaps between the computing devices of... Agent: Amazon Technologies, Inc.

20140254090 - Managing airflow supplied through soft ducts: A system for conveying air from one location to another includes a soft duct having a passage and an air flow control device. The air flow control device can be operated to vary a cross sectional area of a portion of the passage of the soft duct.... Agent: Amazon Technologies, Inc.

20140254091 - Electronic device: A mobile computer includes: an operation casing 2 including a right side face 2g, a top surface 2a, and a back surface 2d; a lid component 4 configured to cover a battery insertion/detachment opening 6a formed in the right side face 2g; and an engaged component 5 formed on the... Agent: Panasonic Corporation

20140254092 - Semiconductor package and electronic system including the same: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and... Agent: Samsung Electronics Co., Ltd.

20140254093 - Synthetic jet actuator equipped with entrainment features: A thermal management system (201) is provided which includes a housing (203) equipped with a first set of apertures S1={a1, ai} (213), a second set of apertures S2={b1, . . . bj} (215) and a set of entrainment features S3={c1, Ck} (217), wherein i, j, k≧1, and wherein, for any... Agent: Nuventix, Inc.

20140254094 - Assembly structure with filter device and printed circuit board and welding method for making the same: The present invention relates to an assembly structure with filter device and printed circuit board and a welding method for making the same. The welding method is firstly make the metal lines of at least one filter devices be disposed in the metal notches formed on at least one edges... Agent: U. D. (zhong Jiang) Electronic Corp.

20140254095 - Electronic product including a heat dissipating device: An electronic product including a heat dissipating device is disclosed. The electronic product includes a casing, a heat conducting board, at least one fan unit and a plurality of electronic elements. The casing includes a compartment. The heat conducting board divides the compartment into first and second chambers. The first... Agent: Sunonwealth Electric Machine Industry Co., Ltd.

20140254096 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a housing, a fan, and an AC adapter. The fan is accommodated in the housing and has a fan casing at least a portion of which is made of metal. The AC adapter is removably accommodated in the housing and also thermally... Agent: Kabushiki Kaisha Toshiba

20140254097 - Electronic apparatus, such as a modem or the like, comprising a plurality of air-cooled processors: An electronic appliance of modem or analogous type has a fan and an internal casing channeling the air stream generated by the fan, and a plurality of processors fitted with radiators that are mounted in the appliance. The radiators are situated in register with different portions (PS, PI) of the... Agent: Sagemcom Broadband Sas

20140254098 - Multi-component electronic module with integral coolant-cooling: A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A... Agent: International Business Machines Corporation

20140254099 - Electronic component and electronic component cooling method: An electronic component includes a base substance, a cooling channel formed in the base substance and flows a cooling medium in a second direction from a first direction, a radiator formed in a surface of the cooling channel using a material of which thermal conductivity is higher than a thermal... Agent: Nec Corporation

20140254100 - Cooling apparatus for fanless desktop enclosure of an elastomericly suspended circuit board: A desktop enclosure provides cooling for a circuit board without the noise and power consumption of fans. An elastomeric suspension applies a force to a circuit board. The circuit board transmits the force to a heat source which is thermally coupled to a heat conduction rod through a non curing,... Agent:

20140254101 - Smart phone on a chip and method making same: Method and apparatuses for making a smart phone on a chip (SPOC) are described. Active components may be embedded into a copper core. In an aspect, and optionally, passive components may also be embedded into the copper core. Printed circuit board (PCB) laminate may be layered above and below the... Agent: Qualcomm Incorporated

20140254102 - Differential carrier electronics package: A differential carrier electronic package has a package housing that is made of upper and lower portions that are sealed together, where the upper portion has high thermal conductive properties and the lower portion has low thermal conductive properties. The upper and lower portions are in thermal contact with an... Agent:

20140254103 - Electronic control unit: A substrate of an electronic control unit has a control region on which a control component is disposed and a power region on which a power component is disposed. Substrate-fixing portions of a housing project from a bottom portion, and the substrate is fixed to the substrate-fixing portions. A heat... Agent: Denso Corporation

20140254105 - Drive circuit device: A drive circuit device includes a circuit board having a multilayer structure, which includes first to fourth circuit conductor layers, and first to third insulating layers; and heat sinks that dissipate heat of the circuit board to an outside. An upper FET state is embedded in the first insulating layer,... Agent:

20140254104 - Heat dissipating module: A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat... Agent: Delta Electronics, Inc.

20140254106 - Ejector lever locking mechanism design for conduction cooled circuit board assembly: An ejector lever locking mechanism rotatably connected to a heat frame and releasably engaged to a module body includes a lever body rotatably connected to the heat frame. The lever body includes a recessed wall created in a lever body elongated slot. The elongated slot extends only partially through a... Agent: Emerson Network Power - Embedded Computing, Inc.

20140254107 - Electronic module with embedded jumper conductor: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the... Agent: Ge Embedded Electronics Oy

20140254108 - Thermal isolation in printed circuit board assemblies: A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is... Agent: Qualcomm Incorporated

20140254111 - Display device: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably... Agent: Semiconductor Energy Laboratory Co., Ltd.

20140254110 - Electronic device with sensor assembly: An electronic device includes a body and a sensor assembly. The body includes a circuit board. The sensor assembly includes a converting board and a sensor attached to the converting board. The converting board is electrically connected to the circuit board. The sensor is located on one side of the... Agent: Hon Hai Precision Industry Co., Ltd.

20140254113 - Method of providing an electronic device structure and related electronic device structures: Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.... Agent: Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizo

20140254112 - Multi-layered film, electronic device, and manufacturing methods thereof: A multi-layered film includes: a plate-like flexible base member; first inorganic members that are each plate-like and arranged on the base member in separation from each other in a direction parallel to a main surface of the base member; a first organic member provided on the base member so as... Agent: Panasonic Corporation

20140254109 - Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package: An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method... Agent: Alliant Techsystems Inc.

20140254114 - Flexible circuit board and method for producing same and bend structure of flexible circuit board: Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is... Agent: Nippon Steel & Sumikin Chemical Co., Ltd.

20140254115 - Removable sensor modules: A removable telecommunication sensor module is configured to be removably coupled between a power protection device and a backplane. The removable telecommunication sensor module monitors energy usage at a telecommunication equipment circuit level for a piece of telecommunication equipment arranged in a telecommunication network infrastructure.... Agent: Telect Inc.

20140254116 - Semiconductor device: A control terminal of an intelligent power module has a structure in which it is possible to reduce the area used exclusively by the module. An insulating circuit substrate on which power semiconductor elements are mounted, and a printed substrate having a control circuit, are arranged in a tiered structure,... Agent: Fuji Electric Co., Ltd.

20140254117 - Anisotropic conductive film and display apparatus having the same: An anisotropic conductive film includes an insulating adhesive resin layer, and a plurality of conductive particles located at the insulating adhesive resin layer and comprising acutely angled edges.... Agent: Samsung Display Co., Ltd.

20140254118 - Mounting board, sensor unit, electronic apparatus, and moving body: A board main body of a board has a sensor mounting area, in which a physical quantity sensor is mounted, disposed on a surface. A non-electrode forming part and a plurality of electrodes are disposed in the sensor mounting area, the electrodes being disposed so as to be isolated from... Agent: Seiko Epson Corporation

20140254119 - Anisotropic conductive film, display device, and manufacturing method of display device: An anisotropic conductive film includes an adhesive layer formed of a polymer resin, conductive particles dispersed in the adhesive layer, a support layer disposed at one side of the adhesive layer and maintaining the adhesive layer in a film shape, and a releasing sheet disposed at one side of the... Agent: Samsung Display Co., Ltd.

20140254120 - Device packaging structure and device packaging method: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate,... Agent: Fujikura Ltd.

20140254121 - Printed circuit board: Disclosed herein is a printed circuit board having an insulating layer crack preventing port. The printed circuit board includes: an insulating layer part having at least one pair of insulating layers stacked therein; circuit patterns formed on the insulating layers, respectively; and crack preventing ports formed at positions at which... Agent: Samsung Electro-mechanics Co., Ltd.

20140254122 - Power supply control apparatus and manufacturing method of power supply control apparatus: A power supply control apparatus includes: a control board that is configured to control a voltage of a battery module; and a bus bar module that is configured to electrically connect the control board to the battery module, the control board and the bus bar module are arranged in a... Agent:

20140254123 - Positionable keyboard bezel: A system can include a keyboard housing that includes a keyboard and a positionable keyboard bezel, a display housing that includes a display, a hinge that pivotably connects the keyboard housing and the display housing for orienting the display housing with respect to the keyboard housing, and a positioning mechanism... Agent: Lenovo (singapore) Pte. Ltd.

20140254124 - Stud bump bonding in implantable medical devices: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of... Agent:

  
  
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