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Electricity: electrical systems and devices

20130114166 - Inverter for an electric machine and method for operating an inverter for an electric machine: An inverter for an electric machine, and a method for operating the inverter, has at least one output stage unit for producing a connection between the electric machine and a power supply network, a control unit for controlling the output stage unit, a supply unit independent of the power supply... Agent:

20130114167 - Short protection control circuits and related control methods: Short protection control circuits and related control methods are disclosed. A disclosed short protection control circuit is adapted for controlling a short protection mechanism providing short protection to several LED chains. The disclosed short protection control circuit has a detection circuit, a first logic circuit and a timer. Coupled to... Agent: Leadtrend Technology Corp.

20130114171 - Apparatus for electrostatic discharge protection and noise suppression in circuits: An integrated circuit assembly is provided that includes an integrated circuit (IC) package substrate including a package ground rail that is divided into a plurality of segments that are electrically isolated from each other. An IC die is disposed on the IC package substrate, the IC die including a plurality... Agent: Broadcom Corporation

20130114169 - Cmos adjustable over voltage esd and surge protection for led application: Various embodiments relate to a light emitting diode protection circuit, including: a plurality of diodes connected in series; an input connected to a first diode of the plurality of diodes; an output; a first resistor connected between the plurality of diodes and the output; a transistor with a gate connected... Agent: Nxp B.v.

20130114170 - Electrostatic discharge protection apparatus: An electrostatic discharge protection apparatus protects an integrated circuit including a first pad and a first internal circuit operating at a power voltage. The electrostatic discharge protection apparatus includes a first protection unit and a control unit. The first protection unit includes a first P-type diode, a first silicon controlled... Agent: Himax Technologies Limited

20130114173 - Electrostatic discharge protection device: An electrostatic discharge protection device, having a P-type semiconductor substrate set as floating; a first N-well and a second N-well formed in the P-type substrate; a first P-doped region and a second P-doped region formed in the first N-well and the second N-well, respectively. The first N-well and the first... Agent: Via Technologies, Inc.

20130114174 - Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same: Systems and methods for protecting electrical components such as light emitting diodes are described. In some embodiments, electrical components are protected from high level electrostatic discharge (“ESD”) events by a circuit board that provides an intrinsic level of ESD protection. At the same time, such electrical components are protected against... Agent:

20130114172 - Esd protection circuit: An electrostatic discharge (ESD) protection circuit is provided. The ESD protection circuit includes an impedance device coupled between a pad and a power line and a clamp unit coupled between the pad and a ground line.... Agent: Mediatek Inc.

20130114168 - Surge protection: A victim unit (310, 410) connectable to a surge protective device (300, 400a) via an alternating current system or a direct current system, the victim unit (310) comprises at least one victim unit sensor (313a, 314a, 315) adapted to measure at least one status parameter at the victim unit (310,... Agent: Telefonaktiebolaget L M Ericsson (publ)

20130114175 - Switching mode power supply including surge protection circuit and image forming apparatus including the same: A switching mode power supply (SMPS) including a surge protection unit that is connected to a protection pin of a pulse width modulation (PWM) controller to cut off a power supply of the SMPS when a voltage that is applied to the protection pin exceeds a predetermined threshold voltage, where... Agent: Samsung Electronics Co., Ltd.

20130114176 - Protection device to be associated in an electrical circuit with a current-breaker device of increased service life: A protection device is to be associated in an electrical circuit (3) with a current-breaker device (20) including at least one pair (2) of contacts. The protection device includes a measuring device (1.1) for detecting a fault in the electrical circuit, at least one pair (6) of trigger contacts adapted... Agent: Alstom Technology Ltd.

20130114177 - Circuit protection device: A voltage suppression device for suppressing voltage surges in an electrical circuit having a voltage sensitive element within a tubular casing.... Agent: Mersen Usa Newburyport-ma, LLC

20130114178 - Relay drive unit: A relay drive unit drives a relay by supplying a power source voltage from a battery. The relay drive unit includes a power source voltage detector, a drive signal generator, and a relay drive circuit. The power source voltage detector detects the power source voltage. The drive signal generator generates... Agent: Denso Corporation

20130114179 - Control of corona discharge static neutralizer: Self-balancing, corona discharge for the stable production of electrically balanced and ultra-clean ionized gas streams is disclosed. This result is achieved by promoting the electronic conversion of free electrons into negative ions without adding oxygen or another electronegative gas to the gas stream. The invention may be used with electronegative... Agent: Illinois Tool Works Inc.

20130114180 - System for grounding in an electronic device: A system for grounding in a electronic device is disclosed. The system comprises a first electronic board, this latter comprising a first ground plane and at least one footprint intended to connect the first ground plane to a component, the at least one footprint defining a closed line on said... Agent: Thomson Licensing

20130114181 - Substrate clamping system and method for operating the same: An electrostatic chuck includes an electrically conductive baseplate and an electrically non-conductive substrate support member disposed on the baseplate. First and second sets of clamp electrodes are disposed within the support member. A power supply system includes a clamp power supply, a center tap power supply, and a baseplate power... Agent: Lam Research Corporation

20130114182 - Multilayer ceramic capacitor: There is provided a multilayer ceramic capacitor, including: a ceramic element having a plurality of dielectric layers stacked therein; a plurality of inner electrode layers formed on each dielectric layer; margin dielectric layers each formed on a margin part of each dielectric layer, on which the inner electrode layers are... Agent: Samsung Electro-mechanics Co., Ltd.

20130114183 - Electrode active material composition, method for preparing the same, and electrochemical capacitor using the same: Disclosed herein are an electrode active material composition, a method for preparing the same, and an electrochemical capacitor using the same, the electrode active material composition including: an electrode active material; and a conductive material agglomerate having a size of 1/7 to 1/10 times the average particle size of the... Agent: Samsung Electro-mechanics Co., Ltd.

20130114184 - Solid electrolytic capacitor: A silver paste layer constituting a collector layer in a solid electrolytic capacitor includes first silver particles having a peak particle size of 150 nm or less, second silver particles having a peak particle size of 500 nm or more, inorganic particles composed of material different from silver, and resin... Agent: Panasonic Corporation

20130114185 - Switchgear bus assembly having reduced power loss, material and temperature: Electrical switchgear comprising electrical switching equipment for a multi-phase electrical power distribution system, a supporting structure for a bus assembly for supplying electrical current to the switching equipment, and a plurality of spaced buses mounted on the supporting structure each for connecting the switching equipment to respective phases of the... Agent: Schneider Electric Usa, Inc.

20130114186 - Power management system that includes a membrane: Some embodiments relate to a power management system includes a primary power source and a secondary power source. The power management system further includes an enclosure and an electrical component located within the enclosure. The electrical component is connected to the primary power source 11 and the secondary power source.... Agent: Kohler Co.

20130114187 - Load control module that permits testing of power switching devices that are part of the load control module: Some embodiments relate to a load control module that includes an enclosure and a plurality of power switching devices within the enclosure. The load control module further includes an interface mounted on an exterior of the enclosure and a switch connected to the interface. The switch is connected to the... Agent: Kohler Co.

20130114188 - Apparatus and method pertaining to the use of wireless signals to control an appliance: An appliance wirelessly receives any of a plurality of different signals that comprise control instructions from a transmitter for a second appliance other than the appliance and of a different class of appliance. The appliance then provides, in the absence of learning, any of a plurality of different control instructions... Agent: The Chamberlain Group, Inc.

20130114191 - Booklet storage and electronic apparatus: A booklet storage includes a first storage member that includes a first receiver portion and a second receiver portion connecting with the first receiver portion; and a second storage member that includes a third receiver portion and a fourth receiver portion connecting with the third receiver portion, wherein the first... Agent: Fuji Xerox Co., Ltd.

20130114192 - Electronic device having detector window: An electronic device includes a housing, a signal receiving unit receiving in the housing, and a detector window secured to the housing and corresponding to the signal receiving unit. The housing includes a top case having a front sidewall and a bottom case having a front side portion corresponding to... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130114189 - Fixing structure and electronic device applying the same: A fixing structure is disposed on a surface of a case. An opening is disposed on the surface of the case. The fixing structure comprises a suspension arm and a hook portion. The suspension arm is extended from the surface of the case. The suspension arm has an engaging end... Agent: Inventec Corporation

20130114196 - Fixing structure for display panel and method of fixing: A fixing structure for a display panel includes first, second, and third chassis members. The first chassis member includes a first corner securing portion secured to two side surfaces on an outer periphery side of a first corner portion of the display panel. The second chassis member includes a second... Agent: Nec Display Solutions, Ltd.

20130114190 - Flat panel display: A flat panel display includes a housing, a support base, a support plate, a connecting plate, and a fixing element. The housing defines a sliding groove and a plurality of holes arranged in a line parallel to the extending direction of the sliding groove. The support plate is fixed at... Agent: Hon Hai Precision Industry Co., Ltd.

20130114193 - Flexible display apparatus: A flexible display apparatus includes a flexible display panel; a panel deformation member that is disposed on a rear surface of the flexible display panel and deforms the flexible display panel; a panel rotation unit that supports and rotates the flexible display panel; a control unit that controls the panel... Agent: Samsung Electronics Co., Ltd.

20130114194 - Mobile terminal: A mobile terminal includes a terminal main body and a keypad assembly provided in the main body and formed to receive a control command, wherein the keypad assembly includes a key top disposed on one surface of the main body to cover a switch installed in the main body, an... Agent: Lg Electronics Inc.

20130114195 - Mobile terminal: A mobile terminal includes a terminal main body and a keypad assembly provided in the main body and formed to receive a control command, wherein the keypad assembly includes a key top disposed on one surface of the main body to cover a switch installed in the main body, an... Agent: Lg Electronics Inc.

20130114197 - Rack mounted ui device: A user interface (UI) demo is disclosed. The UT device has two displays (106 and 108) that can be moved between a first position and a second position, In the first position the two displays (106 and 108) are side-by-side and the display surface for each of the two displays... Agent:

20130114198 - Multi-functional protective cover for a computing accessory and support accessory for a portable electronic device, and methods and systems relating thereto: A computing system is provided with a portable electronic device, a computing accessory, and a multi-functional support accessory. The support accessory may provide a supportive configuration for supporting the portable electronic device in an upright, working position. The support accessory can also transition to a protective configuration for acting as... Agent: Zagg Intellectual Property Holding Co., Inc.

20130114199 - Key assembly and mobile terminal having the same: A mobile terminal includes a terminal body, and a manipulating portion disposed on one side surface of the terminal body, wherein the manipulating portion includes: a substrate having a first contact point and a second contact point; and a conductive dome configured to conduct the first and second contact points... Agent: Lg Electronics Inc.

20130114200 - Computer system having data transfer rate indication function of serial advanced technology attachment dual in-line memory module: A computer system includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a motherboard, and an indicating unit. An edge connector is set on a bottom edge of the circuit board to engage in a memory slot of the motherboard. A SATA connector is... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130114201 - Side-push type retractable usb memory stick: A side-push retractable USB memory stick includes a PC board providing a data storage function, an insulative PC board holder accommodating the PC board and having a springy plate located on one lateral side thereof and a press portion outwardly protruded from the springy plate, a housing surrounding the insulative... Agent:

20130114202 - Mounting apparatus for multiple hard disk drives and electronic device having the same: A mounting apparatus for hard disk drives includes a plate. A number of spaced supporting portions is formed on at least one of two opposite side surfaces of the plate. A row of first latches extend upward from a top side of the plate. A row of second latches extend... Agent: Hon Hai Precision Industry Co., Ltd.

20130114203 - Systems, apparatuses and methods for improving the performance of computing devices: The present disclosure describes systems, methods, and apparatuses for increasing the performance of portable computing devices, such as smart phones, music players, and tablet computers, without risking damage to the device or its components that may result from excess heat generated by the increased performance. A portable computing device may... Agent:

20130114204 - Heat removal system for computing systems: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed. The low profile heat removal system is capable of removing disproportionately high amounts of heat given its small form factor, by virtue of a highly efficient staggered... Agent: Apple Inc.

20130114205 - Laptop cooling pad with heat-dissipating fan adjustable in position: A laptop cooling pad having one or more heat-dissipating fans adjustable in position is disclosed. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving pushing... Agent:

20130114207 - Electronic assembly with cooling device: The invention relates to an electronic assembly comprising a plurality of electronic component groups and a cooling device for cooling the electronic component groups. The cooling device provides a cooling-power distributor. A cooling power of the cooling device can be individually controlled by the cooling-power distributor for every component group.... Agent: Rohde & Schwarz Gmbh & Co. Kg

20130114206 - Power electronic arrangement: A power electronics assembly having a cooling device, one or more capacitors and one or more circuits, wherein at least one capacitor is electrically connected to at least one circuit, and wherein at least one circuit is disposed on the cooling device, wherein the power electronics assembly also exhibits a... Agent:

20130114208 - Thermally controlled assembly: A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which... Agent: Napatech A/s

20130114209 - Heat management device and electronic apparatus: An electronic apparatus includes a heat dissipating module and an electronic device. The heat dissipating module includes a base and a plurality of heat dissipating layers. The heat dissipating layers are formed on a surface of the base in sequence. Each heat dissipation layer has at least one heat dissipating... Agent:

20130114210 - Power semiconductor system: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the... Agent: Semikron Elektronik Gmbh & Ko. Kg

20130114211 - Connector system with thermal cooling: A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector. A plurality of connectors can be supported and a heat spreader can be associated with each connector. One or more thermal plates can... Agent: Molex Incorporated

20130114212 - Electrically conductive material and electronic device using same: An electrically conductive material used in the formation of heat-releasing filled via holes in an electronic component-incorporated multilayer circuit board with a heat radiation member, in which the electrically conductive material comprises metal particles as a conductive metal which is a mixture of a first conductive metal consisting of silver... Agent: Denso Corporation

20130114213 - Electronic device: An electronic device having a base includes a circuit board, a electronic element, and a heat sink. The electronic element is mounted on the circuit board. The heat sink attaches to the electronic element. The heat sink includes an attaching wall and at least one side wall. The attaching wall... Agent: Silicon Intergrated Systems Corp.

20130114215 - Laser apparatus: A laser apparatus may include: a first module including an oscillator configured to output a laser beam and an oscillator support portion for supporting the oscillator; a second module including a beam delivery unit for delivering the laser beam and a beam delivery unit support portion for supporting the beam... Agent: Gigaphoton Inc.

20130114214 - Television receiver and electronic apparatus: According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first... Agent:

20130114216 - System including a module: In an embodiment a first module can include a first side and a first edge. An optical transmitter connector can be a first distance from the first side at a first position along the first edge. An optical receiver connector can be a second distance from the first side wherein... Agent:

20130114218 - Electronic circuit, method of manufacturing electronic circuit, and mounting member: An electronic circuit includes: a semiconductor chip provided with a single-ended I/F including a pad on which single-ended signals are exchanged; and a mounting unit on which a differential transmission path transmitting a differential signal is formed, and on which the semiconductor chip is mounted so that the pad of... Agent: Sony Corporation

20130114217 - Printed circuit board laminate: A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like... Agent: Sumitomo Wiring Systems, Ltd.

20130114219 - Opto-electronic frontplane substrate: Frontplane articles are described utilizing laminated glass substrates, for example, ion-exchanged glass substrates, with flexible glass and with opto-electronic devices which may be sensitive to alkali migration are described along with methods for making the articles.... Agent:

20130114220 - Electrical harness: An electrical harness is formed from a flexible printed circuit board which provides a plurality of conductive tracks. The harness has one or more harness connectors at respective terminating regions of the flexible printed circuit board for joining the harness to complementary connectors. The or each harness connector includes a... Agent: Rolls-royce PLC

20130114221 - Housing for an electric circuit for a fuel pump: A housing for an electronic circuit for a fuel pump includes a base and a cover which is connected to the base, a printed circuit board and, disposed on one side of the latter, electric and/or electronic components. Disposed on the side of the printed circuit board on which the... Agent: Continental Automotive Gmbh

20130114222 - Locking assembly and electronic device using the same: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member,... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130114224 - Attachment of a control unit for a transmission control module to a carrier board: A control unit for a transmission control module of a motor vehicle transmission includes a circuit mounting device and at least one attachment device configured to attach the circuit mounting device to a carrier board. The circuit mounting device includes an electronic circuit and has a first bearing side with... Agent: Robert Bosch Gmbh

20130114223 - Semiconductor device: A semiconductor device reduces the impedance of a wiring for supplying the circuit excluding a data output circuit with a power source voltage or a ground voltage and of speedup of data signal transmission in the data output circuit. Additional substrates 2a, 2b are on the upper surface of semiconductor... Agent: Elpida Memory, Inc.

20130114225 - Mobile terminal comprising lid unit with key device: The invention relates to a mobile terminal comprising a lid unit arranged to substantially block an opening in a mobile terminal housing in an assembled state of the mobile terminal and arranged to allow access through the opening into the interior of the mobile terminal when removed from the opening,... Agent: Huawei Technologies Co., Ltd.

20130114226 - Cof packaging unit and cof packaging tape: The invention discloses a COF packaging unit and a COF packaging tape. The COF packaging unit comprises COF baseband(s), IC Die(s) packaged on the COF baseband(s), and input end wires and output end wires connected with the IC Die(s); the input end wires and the output end wires are respectively... Agent:

20130114227 - Efficient electronics module: An efficient electronics package comprising an integrated circuit, a transistor case packaging, a power supply, an actuation segment and a sensor segment, wherein engagement of the integrated circuit causes the actuation segment to be activated. The integrated circuit may be engaged, for example, by a level-hold trigger or the sensor... Agent:

20130114228 - Electromagnetic interference shielding techniques: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a... Agent: Apple Inc.

20130114229 - Interconnect board: A combination of an interconnect board and a module board for connecting a plurality of electronic modules to a processing unit is described. The interconnect board comprises a plurality of interconnect data lines connected between a plurality of interconnect board input terminals and interconnect board output terminals. The module board... Agent:

20130114230 - Motherboard assembly having serial advanced technology attachment dual in-line memory module: A motherboard assembly includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board, a memory slot, a platform controller hub (PCH), a storage device interface, and a storage controller connected to the PCH and the storage device interface. An edge connector is set on a... Agent: Hon Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130114231 - Combined type storage case for electronic device accessories: A combined type storage case for electronic device accessories has a first case, a second case and a third case. The first case includes a first receptacle and a pivotable first plug. The first receptacle and the first plug are electrically connected with each other and allow an electronic device... Agent: Sky Tech Worldwide, Inc

20130114232 - Portable electronic module having a holder: A portable electronic module including a portable electronic device and a holder applied to hold the portable electronic device is provided. The portable electronic device includes a first surface, a second surface opposite to the first surface, and a display unit disposed on the first surface, wherein a connecting unit... Agent:

20130114233 - Keypad coupling device for portable terminal: A keypad coupling device for a portable terminal which includes a housing and a display unit bracket coupled to the housing. The keypad is coupled and fixed to the display unit bracket. The keypad coupling device minimizes a thickness of a space of a portable terminal in which a keypad... Agent: Samsung Electronics Co., Ltd.

20130114234 - Lightweight electronic system for automotive applications and method: A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded... Agent: Delphi Technologies, Inc.

20130114235 - Emi shield: An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines.... Agent: Invensas Corporation

20130114236 - Flexible printed circuit board harness: A gas turbine engine installation is provided that has a plurality of flexible printed circuit board (FPCB) harnesses to transfer electrical signals, including electrical power, around a gas turbine engine. The plurality of FPCB harnesses is held to the gas turbine engine installation using clips that have at least two... Agent: Rolls-royce PLC

20130107398 - Limit switch interface circuit: A circuit for interfacing to a limit switch configured to be closed when a wire connected to the limit switch is relatively hot and configured to be opened when the wire is relatively cold includes an input, an output, and a control portion. The input is configured to receive a... Agent: Lear Corporation

20130107399 - Harmonic protection method for capacitor bank: provided that kn=rn/r1, kn is the n-th harmonic coefficient , rn is power consumption equivalent resistance of the capacitor bank for the n-th harmonic, r1 is power consumption equivalent resistance of the capacitor bank at a fundamental frequency. When I≧1.3 IN, the CPU unit controls the protecting device to disconnect... Agent:

20130107400 - System for monitoring a machine using a digital protective relay: A system for monitoring a machine is provided. The system includes a digital protective relay, a communications network, and a central server. The digital protective relay is connected to the machine, and samples at least one parameter of the machine at a rate of at least about twelve samples per... Agent: General Electric Company

20130107401 - Time delay with control voltage sensing: A method is provided for controlling operation of an air conditioning unit. The method comprises supplying line voltage to activate a motor configured to operate the air conditioning unit, and monitoring a supply of control voltage in order to control operation of the air conditioning unit, the supply of control... Agent: Trane International Inc.

20130107402 - Electrostatic protection circuit capable of preventing latch-up effect: An electrostatic protection circuit includes a strained transistor array, an unstrained transistor, and a control circuit. The strained transistor array has a first end electrically connected to a bias terminal. The unstrained transistor has a first end electrically connected to the bias terminal. The control circuit is electrically connected to... Agent:

20130107403 - Esd protection circuit: Disclosed is a circuit (100) comprising a transistor (110) coupled between a supply voltage line (102) and ground (106), the transistor comprising a control terminal coupled to a input signal line (104), the circuit further comprising first and second bipolar transistors (122, 124) coupled in series between the input signal... Agent: Nxp B.v.

20130107404 - Battery protector: A battery is protected without realizing the state of every vehicle element connected to the battery or the battery input/output current. A current limit value setting unit sets a current limit value for limiting the battery input/output current in accordance with state of the battery. A limiting current ratio calculation... Agent: Suzuki Motor Corporation

20130107405 - Fast distance protection for energy supply networks: A method for detecting a short circuit on a multiphase electrical energy supply network line includes recording current and voltage sampled values and generating a fault signal upon a fault evaluation performed by an electrical protection device indicating a short circuit. Instantaneous reference voltage values are calculated from instantaneous current... Agent: Siemens Aktiengesellschaft

20130107406 - Process control field device with circuitry protection: A wireless field device for use in an industrial process control system includes a power source having a power source output. Field device is circuitry powered by the power source output. A protection circuit is configured to protect the field device circuitry. The protection circuit include reverse polarity protection circuit... Agent:

20130107407 - System for electric distribution system protection and control and method of assembling the same: An electric distribution system includes at least one feeder and a protection and control system. The feeder includes at least one segment including a first end and an opposing second end. The protection and control system includes a protective device and an electric current measuring device coupled to the segment... Agent:

20130107408 - Vehicle communication component and process having active overvoltage protection: An active overvoltage protection process and device is disclosed to protect vehicle communication components. The overvoltage protection process and device includes determining an allowed low and high voltage threshold range for a communication interface, monitoring the communication interface, and disconnecting the communication interface when a voltage of the communication outside... Agent: Service Solutions U.s. LLC

20130107410 - Apparatus and method for measuring the dissipation factor of an insulator: An apparatus (1) for measuring the loss factor of an insulator (2) for medium or high voltages, equipped with a tap adapter (3) forming a point for picking up an electrical signal (4), comprises: a reference capacitor (9) having a first electrode (10), which can be connected to the tap... Agent: Techimp Technologies S.r.l.

20130107409 - Device and process for protection against excessive voltage and/or current in systems having usb connections and the like: An apparatus is provided to electrically protect a circuit for USB protection against excessive voltage and/or current such as ground loop damage. A circuit is connected between electrical components where at least one of the connections is a USB connection. There is a possibility for the ground points of the... Agent: Service Solutions U.s. LLC

20130107411 - Driving circuit with output protection and driving protection circuit applied to the same: A driving circuit controls a driving signal according to a control signal at a first or second logic level for driving a load. A driving protection circuit includes a driving signal detection circuit for generating a load error signal in response to that a load is abnormal; a delay judgment... Agent: Green Solution Technology Co., Ltd.

20130107412 - Installation switching device with a current sensing unit: An exemplary installation switching device includes such as a circuit breaker, residual current circuit breaker or motor circuit breaker, a housing, and at least one current path that passes through an internal conductor between at least one input terminal and at least one output terminal. The installation switching device also... Agent: Abb Schweiz Ag

20130107413 - Portable and modular electrical pegboard system: A modular pegboard electrical board comprising an expandable grid of electrical leads to allow connection of various electronic implements, including light fixtures, fluorescent lamp ballasts and heating lamps. A rectangular pegboard having internal circuitry provides columns of electrical leads, whereby every four consecutive columns form a hot-ground-neutral-ground combination of vertical... Agent:

20130107414 - Relay and method for controlling relay: A method for controlling a normally closed relay includes: providing power to at least one of a first electromagnet and a second electromagnet via a power input port, then cause a first actuation member and a second actuation member to separate from each other, and the relay is then in... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130107415 - Electrostatic chuck: Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck for supporting and retaining a substrate having a given width may include a dielectric member having a support surface configured to support a substrate having a given width; an electrode disposed within the dielectric member beneath the... Agent: Applied Materials, Inc.

20130107416 - Altering capacitance of mim capacitor having reactive layer therein: Embodiments of a method include forming a metal-insulator-metal (MIM) capacitor including a first electrode and a second electrode and an insulator layer between the first and second electrodes, the MIM capacitor also including a reactive layer; and altering the reactive layer to change a capacitive value of the MIM capacitor.... Agent: International Business Machines Corporation

20130107418 - Dielectric ceramic composition and laminated ceramic electronic component: A dielectric ceramic composition that contains, as its main constituent, (Ba1-x-yCaxSry)(Ti1-z-wZrzHfw)O3 (in the formula, 0≦x+y≦0.2, 0≦z+w≦0.1), and contains CuO and Bi2O3, and the dielectric ceramic composition has a feature that the total content of the CuO and Bi2O3 is 10 parts by weight or more with respect to 100 parts... Agent: Murata Manufacturing Co., Ltd.

20130107417 - Multilayered ceramic electronic component and method of manufacturing the same: There is provided a multi-layered ceramic electronic component. The multi-layered ceramic electronic component according to embodiments of the present invention includes: a ceramic element in which a plurality of dielectric layers are stacked; and a plurality of first and second internal electrodes formed on at least one surface of the... Agent: Samsung Electro-mechanics Co., Ltd.

20130107419 - Multilayered ceramic capacitor with improved lead frame attachment: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a... Agent: Kemet Electronics Corporation

20130107420 - Ceramic electronic component and manufacturing method thereof: A ceramic electronic component includes a ceramic body and an outer electrode. The outer electrode is disposed on the ceramic body. The outer electrode includes a first conductive layer and a second conductive layer. The first conductive layer includes a resin, a first metal component, and a second metal component... Agent: Murata Manufacturing Co., Ltd.

20130107421 - Ceramic electronic component and manufacturing method thereof: A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of... Agent: Murata Manufacturing Co., Ltd.

20130107422 - Multilayered ceramic electronic component and fabrication method thereof: A multilayered ceramic electronic component includes: a ceramic element having a plurality of dielectric layers laminated therein; first inner electrodes formed on the dielectric layers disposed in upper and lower portions in the ceramic element, the width of a portion of each of the first inner electrodes exposed from one... Agent: Samsung Electro-mechanics Co., Ltd.

20130107423 - Power storage module for railway vehicles: Power storage module for railway vehicles, comprising multiple interconnected capacitors (1) with terminals (2) for establishing an electrical connection with a single connection plate (7) common to all the capacitors (1) and mechanical securing by means of a support plate (6) placed between the terminals (2) and the connection plane... Agent: Caf Power & Automation, S.l.u.

20130107434 - Attachment features for housings: Methods and apparatus for forming a housing, such as for an electronic device, from multi-layer materials are disclosed. The multi-layer materials include at least two layers. Typically, one or more of the layers are metal. However, different layers of the multi-layer materials can be different metals. In one embodiment, an... Agent: Apple Inc.

20130107432 - Bonding structure and electronic device using the same: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface,... Agent:

20130107430 - Flat panel display having storable pedestal: A pedestal structure of a flat panel display is made storable and disposed at the bottom of a main body of the flat panel display. The pedestal structure has substantially similar shape as a container of the main body that contains the pedestal structure and is capable of being completely... Agent:

20130107429 - Front frame and back light module: The invention discloses a front frame and a back light module. The front frame comprises at least one stacked plate which is stacked with the front frame. The invention adds the stacked plate on the front frame which the stacked plate is stacked with, so that the structure thickness of... Agent:

20130107433 - Housing for a portable electronic device: A housing for a portable electronic device including a first transparent curved portion configured to curve from a front face of the housing to a first side face of the housing; a second transparent curved portion configured to curve from the front face of the housing to a second side... Agent:

20130107424 - Latching injector/ejector: A latching apparatus provides selective injection and ejection of an electronic module relative to a chassis that includes a support member. The apparatus includes a housing to be coupled to the electronic module, and a handle pivotably coupled to the housing and movable between a latched position and an unlatched... Agent: Cisco Technology, Inc.

20130107431 - Lock device for latching different casings of a portable electronic device and portable electronic device therewith: A lock device includes a first magnetic component, an electromagnetic member, an electromagnetic lock module and a second magnetic component. The first magnetic component is disposed inside a first casing movably in a first direction. The electromagnetic member is disposed inside a second casing movably in a second direction. The... Agent:

20130107426 - Multimedia reproduction device and disc player: A multimedia reproduction device including: a drive module that is configured to drive a storage medium and that includes a front-end part that processes data read from the storage medium, a back-end module including an audio unit and a video unit that is configured to reproduce audio/video (AV) signals output... Agent:

20130107427 - Portable electronic device: A portable electronic device includes a body and a support structure. The support structure pivotally connected to the body includes a first structural member and a second structural member, and the first structural member is pivotally connected to the body along a first axis. The second structural member pivotally connected... Agent: Inventec Corporation

20130107428 - Portable electronic device: A portable electronic device includes a main body, a first cover and a second cover. The main body includes a display formed on a surface thereof. The first cover is rotatably connected to one end of the main body and the second cover is rotatably connected to another end of... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130107435 - Protective cover and electronic device therewith: A protective cover includes a base, a first member, and a second member. The base includes a sliding portion in an axis direction of the base. The first member includes a first sliding slot and a first fixing portion. The first fixing portion is fixed on a casing of an... Agent:

20130107425 - Zero force conductive membrane: An electronic device may include housing structures, electronic components, and other structures. A gap may be formed between the structures. A membrane structure may be used to bridge the gap to form and environmental seal and electrical pathway between the structures. The membrane structure may be deployed using a temporary... Agent:

20130107439 - Electronic apparatus and cooling method thereof: An electronic apparatus includes a first unit having a first power switch for turning on/off a data processing part, a hard disk drive device, a power supply part and the electronic apparatus, a second unit that is separated from the first unit, is supplied with the power from the power... Agent: Sony Corporation

20130107438 - Portable keyboard: A portable keyboard is disclosed, by which portability can be enhanced with a simple configuration. The present invention includes a plurality of key assemblies, a body part and a flexible connecting member. When the portable keyboard is carried, a plurality of the key assemblies are rolled up around an outer... Agent: Lg Electronics Inc.

20130107437 - Standable electronic device: The disclosure relates to a standable electronic device, which comprises an electronic device body, a supporting member, and a base. The supporting member is disposed on the electronic device body. The supporting member is disposed on the base. A spreading angle is produced between the electronic device body and the... Agent:

20130107440 - Storage device and method for producing the same: A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on... Agent: Phison Electronics Corp.

20130107442 - Flash drive with protecting casings: A flash drive includes a main body and two casings pivotably installed on the main body. The main body includes a base and a connector. One of a top and a bottom of the base defines a pair of fixing holes and a pair of tapered grooves. Each tapered groove... Agent:

20130107443 - Flash memory module and memory subsystem: A mass storage memory module system including a memory module having memory holding members which can be connected to each other, and removably connected to a memory controller. One or more modular memory holding members can be connected to each other to expand the overall storage capacity of the memory... Agent: Mosaid Technologies Incorporated

20130107441 - Mounting apparatus for expansion cards: A mounting apparatus for an expansion card includes a fixing bracket receiving the expansion card, and a supporting member mounted to the fixing bracket. The fixing bracket includes an end plate fixing a rear end of the expansion card. The supporting member includes a support wall substantially parallel to the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130107444 - System and method for flexible storage and networking provisioning in large scalable processor installations: A system and method for provisioning within a system design to allow the storage and IO resources to scale with compute resources are provided.... Agent: Calxeda, Inc.

20130107436 - Power supply unit and power supply system for servers: A power supply unit for providing power to servers and a power supply system for servers is disclosed. The power supply unit for providing power to servers comprises a housing; power supplies assembled inside the housing, each of the power supplies comprising a first power supply array and a second... Agent: Hong Fu Jin Precision Industry (shenzhen) Co.,ltd.

20130107445 - Vehicle dock for ruggedized tablet: A system and apparatus for robustly transferring power and data between a portable computing device, such as a ruggedized tablet, and a docking station is provided. The tablet and the docking station may each have a docking connector and a wireless communication device. In some embodiments, the docking station may... Agent: Xplore Technologies Corp.

20130107446 - Portable device docking station: A docking station formed of a tray having a clamping portion coupled to a receiver portion for motion along a travel axis therebetween. A lever is coupled for moving the clamping portion between an expanded position spaced away from the receiver portion, and a retracted position adjacent to the receiver... Agent:

20130107448 - Modular data center cooling: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at... Agent:

20130107447 - Multi-rack assembly with shared cooling apparatus: A multi-rack assembly is provided which includes adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the... Agent: International Business Machines Corporation

20130107449 - Tablet computer enclosure: A tablet computer enclosure (TCE) that functions in combination with a tablet computer. The TCE includes a back plate that is surrounded by a frame to form a front-facing cavity that is dimensioned to fit over the rear surface of the computer. Rotatably attached to the rear surface of the... Agent:

20130107450 - Electronic device with sliding apparatus: A sliding apparatus includes a sliding member fixed to a first end of a server module, an elongated sleeve shaped first slide rail, and an elongated pole shaped second slide rail. The sliding member includes a first holding portion and a second holding portion each defining a mounting hole. The... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130107452 - Cooling system and electronic device including the cooling system: The present disclosure discloses a cooling system and an electronic device. The cooling system is configured to cool a circuit board assembly in an orthogonal architecture, where the circuit board assembly is arranged inside a cabinet. The cooling system includes: a first cooling air duct that allows air to flow... Agent: Huawei Technologies Co., Ltd.

20130107451 - Server system with air cooling device: A server system including a rack and an air cooling device is provided. The rack includes a plurality of support plates dividing the rack into a first chamber and a second chamber. A gap exists between each two adjacent support plates, communicating with the first chamber and the second chamber.... Agent: Hon Hai Precision Industry Co., Ltd.

20130107454 - Compact network server or appliance: A rack mount network appliance may include a chassis that includes a front compartment proximal a front side of the chassis and a rear compartment proximal a rear side of the chassis. The chassis may be configured to be mounted in an appliance rack. A front vent on the front... Agent: Radisys Corporation

20130107453 - Directly connected heat exchanger tube section and coolant-cooled structure: A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections,... Agent: International Business Machines Corporation

20130107455 - Thermosiphon cooler arrangement in modules with electric and/or electronic components: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating... Agent: Abb Technology Ag

20130107456 - Image recording apparatus and additional cassette device: An image recording apparatus, comprising: a recording device; a cassette; a discharge tray; a conveying path; a conveyor; an electrical power supply; a cooling air flow path; an air blower configured to apply a wind-force to air so as to cause the air to flow through the cooling air flow... Agent:

20130107457 - Coolant manifold with separately rotatable manifold section(s): A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections.... Agent: International Business Machines Corporation

20130107458 - Heat sink device: The present invention provides a heat sink device, suitable to the heat dissipation of a high-power medium-voltage drive power cell. The device comprises a heat dissipation substrate having a first surface, a second surface and an inner layer between the first surface and the second surface; a heat pipe having... Agent: Delta Electronics (shanghai) Co., Ltd.

20130107460 - Method and protection apparatus for protecting a thermal sensitive component in a thermal process: Provided is a method for protecting a thermal sensitive component mounted on a board during a thermal process. The method includes: providing the board, providing a protection apparatus which is removable and made of a thermoelectric material to protect the thermal sensitive component during the thermal process, wherein the protection... Agent: International Business Machines Corporation

20130107459 - Portable electronic device with heat sink assembly: A portable electronic device includes a housing, a radiating assembly, a display, a battery, and a heat sink assembly. The housing includes a front portion and a back portion opposite to the front portion. Both the radiating assembly, the display, the battery, and heat sink assembly are received in the... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130107461 - Fixing mechanism and related electronic device: A fixing mechanism for fixing an electronic component is disclosed in the present invention. The fixing mechanism includes a first casing, a boss disposed on the first casing. The electronic component is disposed on the boss. The fixing mechanism further includes a resilient component disposed on the boss and located... Agent:

20130107462 - Hidden pin type high-power led support and hidden pin type high-power led packaging structure and technology using same: The invention discloses a hidden pin type high-power LED support, which comprises conductive pins and a base for packing the conductive pins, wherein a cavity is formed on the top of the base; a heat sink is fixedly arranged at the bottom of the cavity; the conductive pins pass through... Agent:

20130107463 - Electronic device and display device: An electronic device includes: a semiconductor package; a substrate having an attachment surface to which the semiconductor package is attached; a chassis which is arranged opposite a surface on the opposite side to the attachment surface of the substrate and in which ribs protruding to the side of the substrate... Agent: Sharp Kabushiki Kaisha

20130107464 - Ac/dc power supply apparatus: An AC/DC power supply apparatus includes a hollow casing and a power conversion unit. The hollow casing includes an upright partition therein. The power conversion unit is mounted on the upright partition. The power conversion unit converts alternating current into direct current. The hollow casing includes a detachable casing plate... Agent:

20130107465 - Electronic apparatus: An electronic apparatus including a first body, a second body, a connection port module and a pushing rod module is provided. The second body pivoted to the first body so that the second body is able to be opened and closed relative to the first body. The connection port module... Agent: Acer Incorporated

20130107466 - Vibration absorbing device and server with the same: A vibration absorbing device includes a main board having a pole, a first retaining board fixed to the main board, a second retaining board fixed to the first retaining board opposite to the main board, a loading board including a main body and a flange protruding from the main body,... Agent: Hon Hai Precision Industry Co., Ltd.

20130107468 - Apparatus and method for stacking integrated circuits: A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar... Agent: Stec, Inc.

20130107467 - Circuit substrate, electronic device, electronic apparatus, and method of manufacturing circuit substrate: A circuit substrate includes a single-layer insulating substrate, a through-hole, and wiring conductors that are provided in both main surfaces of the single-layer insulating substrate. The through-hole includes first and second concave portions that are formed in both of the main surfaces of the single-layer insulating substrate, respectively, and a... Agent: Seiko Epson Corporation

20130107470 - Electronic apparatus comprising a recess for receiving an external module: The invention relates to electronic equipment including at least one housing shaped to receive an external module, the external module having at least one connector for co-operating with at least one complementary connector of the equipment arranged at the end of the housing when the external module is placed in... Agent: Sagemcom Broadband Sas

20130107469 - Insulating ring for packaging, insulating ring assembly and package: Embodiments of the present application provide an insulating ring for packaging, an insulating ring assembly and a package. A through hole of the insulating ring drills through a top surface and a bottom surface of the insulating ring to accommodate a chip. An outer sidewall of the insulating ring has... Agent: Huawei Technologies Co., Ltd.

20130107471 - Electronic media production system and system for use therewith: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the... Agent:

20130107472 - Smartconnect flash card adapter: A multi-memory media adapter to read a plurality of different types of memory media cards via contact pins. A controller maps signals to the contact pins depending upon the type of memory media card.... Agent: Mcm Portfolio LLC

20130107474 - Electronic control unit: A control circuit is molded with a package portion and connected with first terminals. A wiring portion includes second terminals connected with the first terminals and partially molded with a molded portion. The molded portion includes a first fitting portion surrounding the control circuit. A cover portion includes a second... Agent: Denso Corporation

20130107473 - Electronic device capable of adjusting orientation of display content in response to rotation of a support: An electronic device includes a front frame, a back cover, a support stand rotatably connected to the back cover, a display panel and a circuit board. The display panel and the circuit board are fixed between the front frame and the back cover. The circuit board includes a first contact... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130107475 - Flexible circuit board stack assembly: A FCB stack assembly includes a PCB, a shield can, and a FCB. The shield can is fixed on the PCB for receiving and shielding electronic components on the PCB. The FCB is fixed onto and directly supported by the shield can.... Agent: Fih (hong Kong) Limited

20130107476 - Display with vias for concealed printed circuit and component attachment: An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The... Agent:

20130107477 - Electronic apparatus and obliquely fastened circuit board module: An electronic apparatus includes an upper cover, a lower cover, a circuit board, and a bracket. The upper cover includes a first boss. The lower cover includes a second boss. The bracket includes a first fixing plate and a second fixing plate that are connected to each other. The first... Agent:

20130107478 - Mounting apparatus for expansion cards: A mounting apparatus for mounting an expansion card with a block piece includes a housing, a first mounting member, and a second mounting member. The housing includes a side plate and a base fixed to the side plate. The first mounting member is pivotably attached to the base. The second... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130107480 - Methods and apparatus for flexible mounting and electrical connection: A connector for connecting surface mount devices, such as light emitting diodes (LEDs), to printed circuit boards (PCBs). The connector may be prepackage with an LED assembly or on a PCB to which the LED assembly will be mounted. Connection complexity can be moved from the PCB to the connector,... Agent: Cree, Inc.

20130107479 - Silicon interposer systems: A universal silicon interposer system and method to enabling the selective use of multiple proprietary microelectronic devices without the need to substantially alter the end-use application(s). The system may be used in the implementation of three-dimensional (stacked) microelectronics having proprietary contact pin patterns.... Agent:

20130107481 - Multi-piece substrate: A multi-piece substrate includes a frame portion, and a unit portion in which multiple wiring boards is arrayed. The frame portion is formed on the periphery of the unit portion, the wiring boards have semiconductor elements built in the wiring boards, respectively, and the frame portion has multiple slits formed... Agent:

20130107482 - Printed circuit board: A printed circuit board includes an accommodating layer, chip capacitor devices accommodated in the accommodating layer, and a buildup structure formed on the accommodating layer such that the buildup structure covers the chip capacitor devices in the accommodating layer. The buildup structure has mounting conductor structures positioned to mount an... Agent:

20130107483 - Printed circuit board and electronic apparatus thereof: Embodiments of a printed circuit board (PCB) and an electronic apparatus are provided. The PCB includes a PCB substrate and a plurality of the pads. The PCB substrate is disposed with the plurality of the pads. The plurality of the pads include a first type of the pads and a... Agent: Mediatek Singapore Pte. Ltd.

20130107484 - Circuit board and method for manufacturing same: A semiconductor device (20) has a plurality of device-side lands (23) which are disposed asymmetrically in relation to an intersection point (B). The plurality of device-side lands (23) include 45 device-side connection lands and four device-side isolation lands. Each of the device-side connection lands is mechanically connected to a printed... Agent: Panasonic Corporation

20130107485 - Interconnect structures and methods of making the same: The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (μm).... Agent: Georgia Tech Research Corporation

20130107486 - Apparatus and associated methods: e

20130107487 - Elastic conformal transducer apparatus: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality... Agent: General Electric Company

20130107488 - Wiring structure of head suspension having a stacked interleaved part and method of manufacturing the same: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities. The wiring structure... Agent: Nhk Spring Co., Ltd.

20130107489 - Backplane, communication device and communication system: A backplane includes multiple vertical insertion plates separately arranged from each other, and connectors connecting circuit boards and a circuit serving as signal wiring are disposed on the vertical insertion plates. Each connector is electronically connected to the circuit of the vertical insertion plate on which the connector is disposed,... Agent: Huawei Technologies Co., Ltd.

20130107490 - Housing of electronic device and electronic device: A housing of an electronic device includes a first housing body, a second housing body and a buffer. The first housing body defines an accommodating recess. The second housing body is assembled to the first housing body and adapted to be foldable relative to the first housing body. The buffer... Agent: Au Optronics Corporation

20130107491 - Electronic apparatus: Provided is means for suppressing noise from leaking to the outside of a frame via a gap in an electronic apparatus in which an electronic component is included in a frame which has conductive properties and has a gap that connects an inner space and an external space. An electronic... Agent:

20130107492 - Vertically mounted capacitor assembly: A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate... Agent: Hamilton Sundstrand Corporation

20130100557 - Protecting circuit and control circuit for reducing leakage current: A protecting circuit for reducing leakage currents comprises a first PMOS transistor (P-channel Metal-Oxide-Semiconductor Field-Effect Transistor), a second PMOS transistor, a first NMOS transistor (N-channel Metal-Oxide-Semiconductor Field-Effect Transistor), and a second NMOS transistor. The first PMOS transistor is coupled between a first voltage node and a node, and comprises a... Agent:

20130100558 - Method for cutting off an electric arc, method and device for protecting an installation against voltage surges: The method comprising displacing the formed electric arc towards an electrode located in an intermediate position between both main electrodes; a separating the formed electric arc into two secondary electric arcs, a semiconductor switch, normally open, connecting the intermediate electrode to one of the main electrodes; closing the semiconductor switch... Agent: Abb France

20130100560 - Power plug with leakage current protection: A power plug, including: a shell, the shell having two sides, a reset button and a test button protruding from the first side, and a live wire pin and a neutral wire pin protruding from the second side; a circuit board; a stationary contact; a movable contact; a tripping device;... Agent: Zhongshan Kaper Electrical Co., Ltd.

20130100559 - Semiconductor component and an operating method for a protective circuit against light attacks: A semiconductor component includes a semiconductor substrate, and a doped well having a well terminal and a transistor structure having at least one potential terminal formed in the semiconductor substrate. The transistor structure has a parasitic thyristor, and is at least partly arranged in the doped well. The potential terminal... Agent: Infineon Technologies Ag

20130100562 - Electrostatic discharge clamp with controlled hysteresis including selectable turn on and turn off threshold voltages: An electrostatic discharge (ESD) clamp for coupling between first and second nodes for providing ESD protection including first and second voltage threshold circuits. The clamp circuit limits operating voltage between the first and second nodes to a maximum level when activated. The first and second voltage threshold circuits each have... Agent: Intersil Americas LLC

20130100561 - Semiconductor device and method of forming same for esd protection: In an embodiment a circuit provides protection against electrostatic discharge (ESD). A shunt device is controlled to provide a current bypass upon the occurrence of an ESD event. A trigger circuit controls operation of the shunt device and includes an inverter and a hysteresis means to prevent oscillation of the... Agent:

20130100563 - Safety component by fuse at high voltage battery sensing line: The apparatus for preventing a secondary accident by short of sensing lines in a high voltage battery using a fuse, includes: a plurality of battery modules provided with a plurality of battery cells; a battery pack including a plurality of battery modules; a battery management system (BMS) for monitoring and... Agent: Sk Innovation Co., Ltd.

20130100564 - Inter-area oscillation detection: A device includes interface circuitry. The interface circuitry receives first input signals related to measurements of characteristics of electricity passing through a first power line. The device includes filtering circuitry that filters the first input signals to generate filtered data. The device also includes a processor that estimates an oscillation... Agent: General Electric Company

20130100565 - Protection circuit for hard disk: A protection circuit includes a switch circuit, a sample circuit, a comparison circuit, and a relay circuit. The switch circuit is connected between a hard disk power supply and a hard disk to control whether to output power from the hard disk power supply to the hard disk. The sample... Agent: Hong Fu Jin Precision Industry (shenzhen)co., Ltd.

20130100566 - Power supply device: Disclosed herein is a power supply device. The power supply device includes a conversion unit converting an applied voltage into a predetermined level, a switching unit performing an opening operation or a closing operation to control a current flowing in the conversion unit, a sensing unit sensing an occurrence of... Agent:

20130100567 - Power distribution apparatus for separate electrical over current and short circuit protection: A system for protecting electrical power distribution circuits and loads electrically connected thereto comprises a circuit breaker or fuse in series with an over current protection device, for example a virtual circuit breaker. The circuit breaker or fuse provides protection against a short circuit condition, and the virtual circuit breaker... Agent: Cyber Switching, Inc.

20130100568 - Information handling system power supply automated de-rating for power output and thermal constraints: An information handling system power supply dynamically adapts thermal and power output protection constraints based upon thermal and power output conditions measured at the power supply. In the event of changing conditions at the information handling system, such as an increase in ambient temperature or an increase in power consumption,... Agent:

20130100569 - Electronic overcurrent release for circuit breakers: An electronic overcurrent release for circuit breakers includes a first setting device connected to at least one control input of a microcontroller and configured to set a selected suitable nominal current value in a range between a minimum nominal current value and a maximum nominal current value. A second setting... Agent: Eaton ElectricalIPGmbh & Co. Kg

20130100570 - Lightning current transfer assembly for a wind turbine: A lightning current transfer assembly (2) for a wind turbine (1) is arranged to transfer lightning current from a wind-turbine part (8) to another part (8) rotatable relative to it. The assembly comprises at least one electric contact arrangement (11′, 11″) comprising complementary contact members (12a′, 12b′, 12a″, 12b″) which... Agent: Vestas Wind Systems A/s

20130100571 - Fully isolated coaxial surge protector: A protective device for a coaxial cable system including a first interface pin and a second interface pin positioned in axial relationship along a longitudinal axis with the first interface pin such that a dielectric gap is formed between the first and second interface pins, the dielectric gap being configured... Agent: John Mezzalingua Associates, Inc.

20130100572 - Apparatus and method for holding a wafer: An apparatus and a method for holding a wafer are provided in this disclosure. The wafer holding apparatus includes: an electrostatic chuck, the electrostatic chuck having a plurality of concentric zones; a plurality of power supply units, each adapted for applying a voltage to one of the zones of the... Agent: Semiconductor Manufacturing International Corp.

20130100573 - Apparatus and method for holding a wafer: An apparatus and a method for holding a wafer are provided in this disclosure. The wafer holding apparatus includes: an electrostatic chuck which has a plurality of zones arranged in a matrix; a plurality of power supply units, each of which is adapted to apply a voltage to the plurality... Agent:

20130100574 - Vacuum variable capacitor: A vacuum capacitor has at least two electrodes in a vacuum, the electrodes being manufactured from, or coated with, aluminium or an aluminium alloy; and the housing of the vacuum capacitor includes an insulating (e.g., ceramic) part and two or more conducting parts.... Agent: Comet Ag

20130100575 - Electrical components and circuits including said components: The invention provides an electric circuit device including a conductive element configured to provide an electrical input to an electrical component, the resistivity of the conductive element being variable based at least on the extent of deformation thereof, and a deformable body coupled directly or indirectly to, or integral with,... Agent: Auckland Uniservices Limited

20130100576 - Multilayer ceramic electronic component: There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more,... Agent: Samsung Electro-mechanics Co., Ltd.

20130100577 - Method for forming a mimcap structure and the mimcap structure thereof: A method for forming a Metal-Insulator-Metal Capacitor (MIMCAP) structure and the MIMCAP structure thereof are described. An example electronic device includes a first electrode, and a layer of a dielectric material including titanium oxide and a first dopant ion. The layer of the dielectric material is formed on the first... Agent: Imec

20130100579 - Multi-layer ceramic capacitor: An object of the present invention is to provide a multi-layer ceramic capacitor that includes a laminated block 4 formed by laminating ceramic dielectric layers 2 and internal electrodes 3 alternately, a pair of cover layers 5 laminated on top and bottom of the laminated block, a ceramic body 6... Agent: Taiyo Yuden Co., Ltd.

20130100578 - Multilayer ceramic electronic part: There is provided a multilayer ceramic electronic part, including: a ceramic body having a plurality of dielectric layers laminated therein; a plurality of inner electrode layers formed on at least one surface of each dielectric layer; and margin dielectric layers formed on a margin part of each dielectric layer, on... Agent: Samsung Electro-mechanics Co., Ltd.

20130100580 - Electric double layer capacitor: According to the present invention, the cathode current collector is formed to be relatively thin compared to the anode current collector so that an electrode structure has the two electrode current collectors with different thicknesses. Therefore, it is possible to minimize capacity reduction compared to conventional methods and improve energy... Agent: Samsung Electro-mechanics Co., Ltd.

20130100581 - Electric double layer capacitor: According to the present invention, resistance of the anode is reduced through a change of the electrode structure of the cathode and the anode by applying the conductive layer on the anode current collector and applying the anode active material on the conductive layer. Therefore, it is possible to minimize... Agent: Samsung Electro-mechanics Co., Ltd.

20130100582 - Electric double layer capacitor: The present invention relates to an electric double layer capacitor in which particle sizes of a cathode active material and an anode active material are different from each other, and a difference in the particle size between the cathode active material and the anode active material is 3 to 10... Agent:

20130100583 - Polarizable electrode material for electric double layer capacitor having improved withstand voltage and electric double layer capacitor using the same: e

20130100584 - Super capacitor with gel electrolyte of poly(ethylene glycol) blending poly(acrylonitrile) and manufacturing method thereof: Super capacitor including a gel electrolyte and manufacturing method thereof are provided. The gel electrolyte is one selected from a group consisting of a P(AN-EG-AN) copolymer, a P(AN-EG) copolymer, a P(EG-AN-EG) copolymer and a combination thereof.... Agent: Cheng Kung University

20130100585 - Electroconductive polymer suspension and method for producing the same, electroconductive polymer material, and solid electrolytic capacitor and method for producing the same: The present invention provides an electroconductive polymer suspension for providing an electroconductive polymer material with a high electroconductivity and a method for producing the same, and particularly provides a solid electrolytic capacitor with a low ESR and a method for producing the same. It includes a first step of carrying... Agent: Nec Tokin Corporation

20130100586 - Solid electrolyte capacitor and method for manufacturing the same: In a solid electrolytic capacitor, resistance welding is carried out to bond a valve metal substrate and a spacer together while controlling a welding current so that only a bonding material provided in spacers and having a relatively low melting point is melted. At least a portion of the bonding... Agent: Murata Manufacturing Co., Ltd.

20130100587 - Gas-insulated electric device: A gas-insulated electric device, by which a cross-sectional area of a central conductor can be reduced. The gas-insulated electric device includes an insulation tube that ranges to portions facing to ground potential portions for a central conductor and to upper-lower portions along the grounding potential portions, and is coaxially arranged... Agent: Mitsubishi Electric Corporation

20130100588 - Computer with fan speed control system for synchronizing speeds of system fan and power fan: A computer includes a power supply for providing electrical power, a system fan, a power fan for cooling the power supply, and a fan speed control system. The fan speed control system is configured to synchronize a rotation speed of the system fan and the power fan.... Agent: Hon Hai Precision Industry Co., Ltd.

20130100589 - Fuse cover: A connection apparatus includes a housing portion comprising a back panel and side panels, the back panel and side panels partially defining a cavity having an access orifice, the side panels partially defining an entry area to the access orifice, a fuse holder assembly disposed in the cavity, and a... Agent: General Electric Company

20130100591 - Buckling shock mounting: A buckling shock mounting and method related thereto are discussed herein. In one embodiment, the buckling shock mounting may take the form of a plurality of panels oriented uprightly within a plane to form at least one geometric shape. The plurality of panels are made of a uniform material and... Agent: Apple Inc.

20130100598 - Display device: Provided is a display device which can achieve a thickness reduction and allows a panel protection plate to be replaced with ease. The display device is provided with: a liquid crystal display panel (11) having a display surface (11a); and a case (13) having the liquid crystal display panel (11)... Agent: Sharp Kabushiki Kaisha

20130100595 - Electrical feedthrough assembly: A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit... Agent: Advanced Bionics Ag

20130100594 - Electronic device: An electronic device includes a bottom cover and a front panel. The bottom cover includes at least one first wall. The at least one first wall includes a locking portion set on an inner surface of the at least one first wall. The front panel defines at least one hole.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100593 - Electronic device having accessiable tray: An electronic device includes a chassis and a tray installed in the chassis. The tray includes a base plate which defines an opening. A limiting standoff protrudes from an inner surface of the chassis and extends through the opening of the base plate. A locking module includes a pivotable member... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100597 - Electronic device with adjustable kickstand: A programmer for an implantable medical device includes an adjustable kickstand. In one example, the kickstand is configured to combine with the base to support the programmer in an upright position when the kickstand is fully-collapsed to support the programmer in a reclined position when the kickstand is fully-extended. Further,... Agent: Medtronic, Inc.

20130100592 - Housing and electronic device using same: A housing for an electronic device comprises a main body and a number of prismatic-shaped protrusions formed on a surface of the main body. Each protrusion has a top surface slanted relative to the main body. Observing from the side of the housing, the top surfaces present different visual effects... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130100590 - Stacked power supplies for integrated circuit devices and methods of making same: Disclosed herein are integrated circuit devices having stacked power supplies and methods of making such integrated circuit devices. In one example, the device includes a first power supply structure, a second power supply structure electrically isolated from the first power supply structure, wherein at least a portion of the second... Agent: Globalfoundries Inc.

20130100596 - Television apparatus, electronic device, and slide support mechanism: According to one embodiment, a television apparatus includes a panel unit, a support base, and a plurality of slide support mechanisms. The panel unit includes a front panel arranged in front of a display panel. The support base supports the display panel. The slide support mechanisms are attached to the... Agent: Kabushiki Kaisha Toshiba

20130100599 - Electronic system, and preheating method and apparatus thereof: A method for preheating an electronic system when booting in an environment with low temperature and an apparatus using the same are provided. The electronic system includes at least a processor, at least a first controller, and at least a second controller. The method includes: the first controller checking whether... Agent: Getac Technology Corporation

20130100601 - Portable electronic device housing including hinge: A portable electronic device includes a hinge assembly comprising an axle, the hinge assembly coupling a first mating end of a first housing to a second mating end of a second housing, the second housing being movable relative to the first housing from an open position in which the axle... Agent: Research In Motion Limited

20130100602 - Server with improved layout: A server includes a chassis, a motherboard, a number of data storage devices, a number of system fans, and a power supply mounted in the chassis. The system fans generate an airflow flowing through the chassis, from a front portion of the chassis to a rear portion of the chassis.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100603 - Electronic device with multi-routes for interface: An electronic device includes a processing unit, a first connection element, a first interface group which includes at least one interface, a second connection element, and a second interface group which includes a number of interfaces. The first connection element is detachably connected between the processing unit and the first... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100604 - Suspended hard disk drive system for portable computers: An information handling system is disclosed. The information handling system may include a chassis and a storage resource assembly. The storage resource assembly may include a bezel coupled to the chassis by a first connector, the bezel configured to couple to a storage resource by a second connector and a... Agent: Dell Products L.p.

20130100605 - Apparatus for electrically connecting to a portable electronic device: An apparatus including a support configured to receive a portable electronic device including a door and a first electrical connector; and a member, moveable relative to the support and configured to provide force to the door to open the door and expose the first electrical connector, the apparatus defining a... Agent: Nokia Corporation

20130100606 - Method, circuit, and electronic device for controlling rotation speed of fan: The disclosure relates to a method, circuit, and electronic device for controlling a rotation speed of a fan. The method provides a multistage function curve associates temperatures with rotation speed values. The multistage function curve comprises a first steady-state function segment with slope of zero, a second steady-state function segment... Agent: Getac Technology Corporation

20130100600 - Computer system with airflow guiding duct: A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130100607 - Handheld computing device: A portable computing device is disclosed. The portable computing device can take many forms such as a laptop computer, a tablet computer, and so on. The portable computing device can include at least a single piece housing. The single piece housing including a plurality of steps. The plurality of mounting... Agent: Apple Inc.

20130100608 - Latching mechanism and electronic device: An electronic device includes a main body, a cover, and a latching mechanism latching the cover to the main body. The latching mechanism includes a latching assembly and a hook assembly secured to the cover. The latching assembly includes at least one latching member slidably received in the main body.... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130100609 - Container data center: A container data center includes a temperature control system to monitor a temperature of the container data center. The temperature control system includes a temperature sensor to sense the temperature of the container data center. The temperature control alarm system determines whether the sensed temperature is greater than first and... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100610 - Air duct arrangement for cooling a group of at least two heat producing modules: An air duct arrangement for cooling a group (1) of at least two heat producing modules is provided, said modules (2, 3) being arranged one after the other in the direction of an air flow through said group (1), said air duct arrangement comprising an air path (5, 6) for... Agent: Danfoss A/s

20130100611 - Heat sink cooling arrangement for multiple power electronic circuits: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path... Agent: Rockwell Automation Technologies, Inc.

20130100612 - Backlight module and ventilation component thereof: The present invention discloses a backlight module and a ventilation component thereof, and a back plate of the backlight module is provided with a plurality of the ventilation components. The ventilation component comprises: a tubular body, a ventilating filter, a filter washer, and a fixing ring. The tubular body is... Agent: Shenzhen China Star Optoelectronics Technology Co., Ltd.

20130100613 - Fan unit, electronic device, and method for manufacturing fan unit: Provided is a fan unit that includes: a plurality of fans (3) arrayed in a direction intersecting an air blowing direction; printed circuit board (4) to which the plurality of fans (3) are electrically connected; chassis (5) having back portion (5a) with which surfaces (3a) of the plurality of fans... Agent: Nec Corporation

20130100614 - Electronic device using fastener for fixing: An electronic device includes a circuit board, a communication chip, a ceramic heat sink and an elastic fastener. The circuit board has first and second fixing members. The communication chip is disposed on the circuit board. The ceramic heat sink disposed on the communication chip has first and second lateral... Agent: Sercomm Corporation

20130100615 - Tape substrate with chip on film structure for liquid crystal display panel: The present invention provides a tape substrate with COF structures for a liquid crystal display panel. A plurality of package units with the COF structures are arranged along a longitudinal direction of the tape substrate. Each of the package units includes input leads and output leads. In each of the... Agent: Shenzhen China Star Optoelectronics Technology Co. Ltd

20130100616 - Multiple die stacking for two or more die: A microelectronic package can include a substrate having first and second opposed surfaces, and first and second microelectronic elements having front surfaces facing the first surface. The substrate can have a plurality of substrate contacts at the first surface and a plurality of terminals at the second surface. Each microelectronic... Agent: Tessera, Inc.

20130100617 - Connector and wireless modem: The present invention discloses a connector and a wireless modem, and the present invention relates to the field of electronic products. The connector includes a printed circuit board (PCB). One surface of the PCB is disposed with USB pins, and the other surface is disposed with smart card pins. A... Agent: Huawei Device Co., Ltd.

20130100618 - Stretchable form of single crystal silicon for high performance electronics on rubber substrates: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant... Agent: The Board Of Trustees Of The University Of Illinoi

20130100619 - Bracing structure for expansion cards of different sizes and electronic device having the bracing structure: An exemplary bracing structure is provided for selectively securing either one expansion card or two expansion cards, all the expansion cards selected from a group consisting of differently sized expansion cards. The bracing structure includes a main body and a fixing frame. The main body has a fixing end. The... Agent: Hon Hai Precision Industry Co., Ltd.

20130100620 - Electrical assembly for a motor vehicle, suitable for contacting with a connector: The housing of the assembly has an inner chamber (1.5) and a contacting chamber (1.3) that is directed toward the connector area, wherein at least one inner wall (1.2, 2.1) is provided between the inner chamber (1.5) and the contacting chamber (1.3) in order to separate said chambers and the... Agent: Continental Automotive Gmbh

20130100621 - Semiconductor device package assembly, semiconductor device assembly, and method of manufacturing semiconductor device: A semiconductor device package assembly increased in production efficiency of semiconductor devices by enabling the number of semiconductor device packages held by a carrier to be increased. A predetermined area of a first housing molded of white-colored resin, which holds a plurality of bent contact, is covered by a second... Agent: Japan Aviation Electronics Industry, Limited

20130100622 - Electronic device and fastening structure for circuit board: A fastening structure for fastening a circuit board, includes a loading member, a holding member, and a fixing member. The loading member is positioned inside of an electronic device. The holding member protrudes from the loading member. The fixing member protrudes from the loading member. When the circuit board is... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130100623 - Electronic devices for rf front end signal processing: An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first... Agent: Mediatek Inc.

20130100624 - Circuit board contact pads: The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically... Agent:

20130100625 - Wiring board, semiconductor device and method for manufacturing wiring board: A wiring board includes a resin substrate in which reinforcement members are arranged horizontally, a through electrode filled in a through hole penetrating the substrate in a thickness direction, and wiring layers respectively formed on both surfaces of the substrate and electrically connected to each other via the through electrode.... Agent: Shinko Electric Industries Co., Ltd.

20130100626 - Wiring substrate and manufacturing method of the same: Embodiments of the present invention provide a wiring substrate having a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among a plurality of the projection electrodes is a variant projection electrode which has a recess portion... Agent: Ngk Spark Plug Co., Ltd.

20130100627 - Expansion card and motherboard for supporting the expansion card: A motherboard assembly includes a motherboard and an expansion card. The motherboard includes an expansion slot, a storage device interface, a power connector, and a central processing unit (CPU). The expansion slot includes a protrusion, first signal pins connected to the CPU, first power pins connected to the power connector.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd .

20130100628 - Printed circuit board and electronic device using printed circuit board: An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion... Agent: Hitachi Automotive System, Ltd.

20130100629 - Access plate adapter for electrical fixture: An electrical assembly, such as a lighting assembly, includes a housing adapted for mounting to a wall or ceiling. The housing has an outer wall for attaching to the wall or ceiling and an opening for wire connections between the housing and the power source. An access plate adapter is... Agent: Hubbell Incorporated

20130100630 - Electronic device with cable clamping apparatus: A cable clamping apparatus includes a bracket and a number of cable clamps connected to the bracket. Each cable clamp includes a fixing plate fixed to the bracket, and a clamping portion extending from the fixing plate for clamping a power cable together with the bracket.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100631 - Electronic device with supporting apparatus: A supporting apparatus for supporting a casing of an electronic device includes a supporting member and a locating member. The supporting member includes a supporting block supporting a bottom of the casing, and an extending block extending up from an end of the supporting block. The locating member is fixed... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130100632 - Power transducer: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the... Agent: Hitachi Industrial Equipment Systems Co., Ltd.

20130100633 - Connector mounting device and electronic device with connector mounting device: A connector mounting device includes a bracket for receiving an electronic module. The bracket includes a front plate; a limiting portion, a positioning piece and a blocking piece extend from the front plate. A sliding channel is defined between the limiting portion and the positioning piece and adapted for slidably... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20130100634 - Electric power supply: An electric power supply includes: a first board on which at least switching elements Q1 to Q3 (semiconductor elements) are disposed; a transformer; a filter device (a filter section and an output stabilizing section) that reduces alternating current components; and a case that houses therein the first board, the transformer,... Agent: Denso Corporation

20130094111 - Electrical surge protector and method of providing the same: Some embodiments include an electrical surge protector. Other embodiments of related systems and methods are also disclosed.... Agent: Belkin International, Inc.

20130094112 - Photovoltaic installation: A photovoltaic installation includes a photovoltaic generator, electrical connector lines, an enabling signal source, and an arc discharge detector. The generator is configured to generate a DC voltage when an enable signal is applied to the generator. The electrical connector lines connect the generator to a voltage converter for the... Agent: Kostal Industrie Elektrik Gmbh

20130094113 - Initial-on scr device for on-chip esd protection: A semiconductor device for electrostatic discharge (ESD) protection comprises a silicon controlled rectifier (SCR) including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, a first p-type region formed in the first well to serve as an anode, and a first n-type... Agent: Industrial Technology Research Institute

20130094114 - Control apparatus for switching device: A control apparatus for a switching device which suppresses surge voltages at the time of current shutoff of a switching device to protect from overcurrents although the switching device is not in an overcurrent state, including a current sensor, a comparator, a timer latch, a control circuit, and a transistor.... Agent: Fuji Electric Co., Ltd.

20130094115 - Method and apparatus for charging a battery: A method and apparatus for protecting against certain energy sources used to charge a battery is disclosed.... Agent: Fenix International Inc.

20130094116 - Conductive composite material with positive temperature coefficient of resistance and overcurrent protection component: m

20130094117 - Method and apparatus for demagnetizing generator components prior to electromagnetic core imperfection testing or el-cid testing: A method and apparatus for determining and for reducing magnetism in a generator stator core (20). The method includes extending one or more conductors (38) proximate the core, applying a polarity-reversing excitation voltage to the one or more conductors, and reducing an amplitude of the voltage over time, wherein the... Agent:

20130094119 - Multilayer ceramic capacitor: There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio... Agent: Samsung Electro-mechanics Co., Ltd.

20130094118 - Multilayered ceramic electronic component: There is provided multilayered ceramic electronic component having a 0603 size or less, the multilayered ceramic electronic component including: a ceramic body including a plurality of internal electrodes and dielectric layers disposed between the internal electrodes; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected... Agent: Samsung Electro-mechanics Co., Ltd.

20130094121 - Laminated ceramic electronic parts: A laminated ceramic electronic component 1 includes an inner layer portion that contains a plurality of dielectric layers 2a and internal electrode layers 3 comprising Ni as a main component that are laminated alternately, and a pair of dielectric outer layer portions 2b which sandwich the inner layer portions. And... Agent: Tdk Corporation

20130094120 - Thin-film capacitor: A thin-film capacitor 10 has an MIM structure in which a lower electrode 14, a dielectric layer 16, and an upper electrode 18 are formed in order on a substrate 12. Of the upper and lower electrodes 18 and 14, at least the upper electrode 18 is formed of a... Agent: Taiyo Yuden Co., Ltd.

20130094123 - Chip type laminated capacitor: There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner... Agent: Samsung Electro-mechanics Co., Ltd.

20130094122 - Low inductance capacitor module and power system with low inductance capacitor module: According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set... Agent: Infineon Technologies Ag

20130094124 - Combiner box: A combiner box includes a combiner module and an electrical connector unit disposed in a casing. The combiner module includes an insulating board, and plural first and second input electrodes disposed on opposite surfaces of the insulating board along a first direction and corresponding respectively to plural first and second... Agent:

20130094126 - Electronic devices having displays with openings: An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or more openings and may be mounted in a housing associated with the electronic device. An electronic component may be mounted in... Agent:

20130094125 - Electronic meter register and method having a bottom formed by sealing material: A sealed electronic meter register with no moving parts and no bottom wall or bottom cover includes a casing of plastic with an open bottom. A viewing window is snap fitted into a top wall of the casing. A gasket is placed on top of an electronic numerical display and... Agent:

20130094128 - Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending... Agent: Koninklijke Philips Electronics N.v.

20130094127 - Monitor fixing mechanism for fixing a monitor and display device therewith: A monitor fixing mechanism for fixing a monitor is disclosed. The monitor fixing structure includes a pivot plate and a support member. The pivot plate is detachably connected to the support plate so as to pivot the monitor relative to a stand. The support member includes a plate, at least... Agent:

20130094129 - Slide unit for electronic apparatus: The present invention relates to a slide unit for an electronic apparatus, including a base having a flat surface extending in front and rear directions and having a left end part and a right end part along the front and rear directions on both sides along a width direction perpendicular... Agent: Mitsubishi Steel Mfg. Co., Ltd.

20130094131 - Case for a tablet computer: A case for a tablet computer is disclosed. The case includes an upper portion having a body portion configured and arranged to secure a tablet computer therein. The body portion has a rim defining an opening into the body portion to access a touch screen of the tablet computer. The... Agent: Inmusic Brands, Inc.

20130094132 - Electronic devices and electronic systems: An electronic device is provided, including a printed circuit board, a male connector and a female connector. The printed circuit board has at least one functional circuit. The male connector is coupled to the printed circuit board. The female connector is coupled to the printed circuit board and mated with... Agent: Acer Incorporated

20130094130 - Mother board and fixing module thereof: A mother board comprises a circuit board, an electronic device, and a fixing module. The circuit board includes a first surface, a second surface, a plurality of first fixing holes, and a plurality of second fixing holes. The electronic device is disposed on the first surface. The fixing module includes... Agent: Asustek Computer Inc.

20130094134 - Protective hinge cover for a mobile computing device: Embodiments of the present invention disclose a protective hinge cover for a mobile computing device. According to one embodiment, the protective hinge cover includes an inner cavity area for receiving the mobile device along with a rotatable attachment member formed therein. In addition, a plurality of coupling features are utilized... Agent:

20130094135 - Data storage system, an energy module and a method of providing back-up power to a data storage system: The invention provides a data storage system for connection to a primary power source, the data storage system comprising: one or more data storage media; one or more interfaces, each interface able to connect to at least one of the data storage media so as to couple power from the... Agent: Xyratex Technology Limited

20130094136 - Flexible data center and methods for deployment: Flexible data center systems and methods of deployment are provided. A flexible data center (100, 200) including T rows of server racks (106, 206, 306) can be deployed by constructing a number B of blocks (101, 201). Constructing each block (101, 201) can include constructing from one to a number... Agent: Hewlett-packard Developement Company, L.p.

20130094137 - Data storage device: A data storage device includes a storage module, a casing, a sliding member, and an elastic member. The storage module has a plurality of pins and memory units electrically interconnected. The casing includes a base, three sidewall members, a support member, a first abutting portion, and an accommodating region defined... Agent: Lite-on Technology Corporation

20130094138 - Computer racks: Example computer racks to improve environmental sustainability in data centers are disclosed. An example computer rack includes a spine (125); a first set of support structures (500) and a second set of support structures (500) extending from the spine (125). Each of the support structures (500) is positioned to receive... Agent:

20130094133 - Input/output port systems and methods: Input/output (I/O) port systems and methods are provided. An I/O port system can include a housing having at least one exterior surface and a cover member. The cover member can obstruct at least a portion of an input/output port on the housing and not extend beyond the exterior surface of... Agent:

20130094139 - Combined power and cooling rack supporting an electronics rack(s): A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange... Agent: International Business Machines Corporation

20130094140 - Motherboard module and electronic apparatus using the same: The disclosure provides a motherboard module, which includes a motherboard, a cover, a plurality of raised posts and a plurality of plates. The cover covers the motherboard thereon and a first space is formed by the cover and the motherboard. The raised posts are disposed in the first space. The... Agent: Asustek Computer Inc.

20130094141 - Heat removal in compact computing systems: A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.... Agent: Apple Inc.

20130094142 - Electronic device and magnetic latching mechanism therefore: A magnetic latch for a display of a laptop computer uses magnetic attraction to maintain the display closed and uses magnetic repelling forces to pop-up the display when opened. The latch includes one or more magnetic elements in the body of the laptop and at least one magnetic element in... Agent: Apple Inc.

20130094143 - Cooling system for electronic device and electronic device having same: An electronic device includes a plurality of electronic components and a cooling system. The cooling system includes a chassis defining an airflow channel including an air inlet and an opposing air outlet, a fan assembly including a plurality of fans located at the air outlet, a valve assembly including a... Agent: Hon Hai Precision Industry Co., Ltd.

20130094144 - Heat dissipation structure and electronic apparatus: A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of... Agent: Sony Corporation

20130094146 - Liquid submersion cooled network electronics: A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The... Agent: Liquidcool Solutions, Inc.

20130094145 - Thermal expansion-enhanced heat sink for an electronic assembly: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate... Agent: International Business Machines Corporation

20130094147 - Stand for display device and display device including the same: A display device is disclosed. The disclosed display device has an excellent appearance through prevention of outward exposure of wirings. The display device is also configured to easily outwardly dissipate heat generated from various electronic elements included in the display device.... Agent: Lg Electronics Inc.

20130094148 - Integral heater assembly and method for carrier or host board of electronic package assembly: A multilayer printed circuit board has an embedded heater layer having at least one elongated heater element trace of copper which is densely arranged in a predetermined circuitous path over at least part of the area of the board. The heater element has inputs configured for connection to a standard... Agent: Integrated Microwave Corporation

20130094149 - Structure for mounting heat sink, and heat sink mounted using the structure: A new mounting structure is provided in which, when a heat sink is mounted (fixed) on a circuit board using a spring member, an anchor for fixing the spring member is formed in a very small size in plan view. In the present invention, at least one anchor for mounting... Agent:

20130094150 - Electric power conversion device: Semiconductor element groups constituting a unit are mounted on a cooler heat receiving part 1 on the same plane and are adapted to radiate heat by self-cooling or cooling by wind. First and fourth semiconductor elements Q1, Q4 are arranged on the lower side of the cooler heat receiving part,... Agent: Hitachi, Ltd.

20130094151 - Electrical insulator casing: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections... Agent: Solarbridge Technologies, Inc.

20130094152 - Electronic device and heat sink employing the same: A heat sink is used to cool electronic components, and includes a metal base portion, a motherboard and a heat conducting sheet. The motherboard and the heat conducting sheet are positioned on the metal base portion. The motherboard includes a copper foil. The electronic components are electrically connected on the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130094153 - Electromagnetic radiation shielding on a pci express card: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned... Agent: Finisar Corporation

20130094154 - Power supply device: A power supply device includes a power input module and a power functional module. The power input module has a power connecting unit and a power converting unit, which has a first connecting part. The power functional module comprises a functional unit or a plurality of functional units which connect... Agent:

20130094155 - Electronic device and electronic device assembly thereof: An electronic device assembly includes at least two electronic devices. Each electronic device has a body, two circuit boards and a flexible circuit board. A male connector and a female connector are installed at the positions corresponding to two ends of the body respectively, and the male and female connectors... Agent: Lintes Technology Co., Ltd

20130094156 - Power supply unit with latch: A power supply unit includes a sidewall, an end wall, a resilient latch, and a block. The end wall is connected to the sidewall. A stop plate extends outward from the end wall adjacent to the sidewall. A first end of the latch is connected to an inner surface of... Agent: Hon Hai Precision Industry Co., Ltd.

20130094158 - Card structure, socket structure, and assembly structure thereof: A card structure includes a first substrate, a second substrate, an intermediate unit, and a connector. The first substrate includes a base surface. The second substrate is disposed on the base surface of the first substrate and coupled to the first substrate. The connector is disposed on the base surface... Agent: Industrial Technology Research Institute

20130094157 - Power converters with integrated capacitors: An apparatus having a power converter circuit having a first active layer having a first set of active devices disposed on a face thereof, a first passive layer having first set of passive devices disposed on a face thereof, and interconnection to enable the active devices disposed on the face... Agent: Arctic Sand Technologies, Inc.

20130094160 - Display device: The present invention is a display device where it is possible to prevent, at a high level, an adhesive from protruding to the metal frame for supporting the display panel in the case where the front window is pasted to the display panel via the adhesive. Specifically, the present invention... Agent: Japan Display East Inc.

20130094161 - Mobile wireless device: A mobile wireless device includes a first housing, a second housing, a first hinge configured to freely openably and closably connect the first housing with the second housing, a first circuit board provided in the first housing, a second circuit board provided in the second housing, a signal cable configured... Agent: Panasonic Corporation

20130094159 - Storage device assembly: A storage device assembly includes a first securing tray, a first storage device received in the first securing tray, a second securing tray, a second storage device received in the second securing tray, a backplane, and a transferring board. The backplane is electronically connected to the first storage device and... Agent: Hon Hai Precision Industry Co., Ltd.

20130094162 - Chip card holding mechanism and portable electronic device: A chip card holding mechanism includes a bracket, an unlock member and a tray. The bracket defines a receiving chamber. The unlock member is assembled adjacent to the opening of the bracket. The movable tray is assembled to and received within the receiving chamber of the bracket by the unlock... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130094163 - Surface mount electronic component: A surface mount electronic component that includes a resin case, metal terminals, and a sealing metal plate that are molded integrally by insert molding. A hollow casing part and a through hole are formed in the case. The through hole leads from the hollow casing part to a surface of... Agent: Murata Manufacturing Co., Ltd.

20130094164 - Cable holder and electronic system: A cable holder includes: a pair of arm portions to form a holding space for holding a cable; and a guide portion, provided at an end portion of each of the pair of guide portions to block the holding space, to guide the cable into the holding space while elastically... Agent: Fujitsu Limited

20130094166 - Display apparatus: A plurality of display panels (10A and 10B) are provided on a single substrate (2). Data signal lines (11A), scanning signal lines (12A), a data signal line drive circuit (20A) for driving the data signal lines (11A), and a scanning signal line drive circuit (30A) for driving the scanning signal... Agent:

20130094165 - High-capacity module including the peripheral circuit using the circuit board and the circuit board concerned for peripheral circuits of a high-capacity module: [Solution Means] By preparing level difference(s) in the surface of the peripheral circuit board to more accurately align the electrode(s) of the peripheral circuit board and the terminal(s) of the power semiconductor element by contact of the level difference(s) and the lateral face(s) of the power semiconductor element at the... Agent: Ngk Insulators, Ltd.

20130094167 - Serial advanced technology attachment dual in-line memory module: A serial advanced technology attachment (SATA) dual-in-line memory module (DIMM) includes a circuit board. A control chip and a number of storage chips are arranged on the circuit board. First and second extending boards extend from an end of the circuit board and are coplanar with the circuit board. A... Agent: Hon Hai Precision Industry Co., Ltd.

20130094168 - Wall mounting for on-board entertainment control units: A standardized wall mounting is provided for mounting control units of system components in an aircraft cabin with a fastening unit and at least one plug unit. The fastening unit is designed for guiding the control unit during an installation movement of the control unit on the wall mounting. The... Agent: Airbus Operations Gmbh

20130094169 - Molded power supply system having a thermally insulated component: A molded system (100) has a plurality of components (110, 120, 130) attached to a carrier (101), one of the components being an object (110) of irregular thermal capacitance. For example, carrier (101) may be a QFN/SON-type leadframe and object (110) an inductor of high thermal capacitance. The surface of... Agent: Texas Instruments Incorporated

20130094170 - Electromagnetic interference shield: An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is... Agent: International Business Machines Corporation

20130094171 - Expansion card with cable management apparatus: An expansion card includes a card body and a cable management apparatus. The card body includes a number of connecters with a number of cables. The cable management apparatus includes a main body. A first side of the main body is fixed to the card body beside the connectors. A... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130094172 - Rotary connector device: A rotary connector device includes a stator and a rotator, which relatively rotate with respect to each other. An accommodating space for accommodating cables for electrically connecting the rotator and the stator in a state wound in a circle is formed inside the stator and the rotator is formed. A... Agent: