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Electricity: electrical systems and devices March listing by industry category 03/13

20130077194 - Protection of motor drive systems from current sensor faults: Methods and apparatus are provided for detecting a phase current sensor fault in a multi-phase electrical motor. The method comprises, receiving an input torque command T* and measuring a set of feedback signals of the motor including a phase current Ix for each of the phases of the motor, generating... Agent: Gm Global Technology Operations LLC

20130077195 - Electrostatic discharge protection circuit for an integrated circuit: An electrostatic discharge (ESD) protection circuit includes a clamping transistor and a trigger circuit. The clamping transistor is coupled between a first power supply voltage terminal and a second power supply voltage terminal. The trigger circuit includes a detection circuit, first and second transistors, and first, second, and third inverters.... Agent:

20130077197 - Esd clamp adjustment: Embodiments of this disclosure relate to electrostatic discharge (ESD) protection techniques. For example, some embodiments include a variable resistor that selectively shunts power of an incoming ESD pulse from a first circuit node to a second circuit node and away from a semiconductor device. A control voltage provided to the... Agent: Infineon Technologies Ag

20130077199 - Esd protection device: A highly reliable ESD protection device that prevents failure of discharge and variation of a discharge start voltage even when protection from static electricity is repeatedly performed includes a cavity provided in a ceramic multilayer substrate. First and second discharge electrodes are provided in the ceramic multilayer substrate and face... Agent: Murata Manufacturing Co., Ltd.

20130077196 - Esd robust level shifter: An inverter type level shifter includes a first power supply voltage and a first ground voltage. A first inverter operates on the first power supply voltage and the first ground voltage to generate a first inverter output. The first inverter includes a first PMOS transistor having a drain coupled to... Agent: Texas Instruments Incorporated

20130077198 - Voltage surge and overvoltage protection using prestored voltage-time profiles: Disclosed are various embodiments of voltage protectors that include a first voltage clamping device configured to clamp a voltage of an input power applied to an electrical load, and a second voltage clamping device configured to clamp the voltage applied to the electrical load. A series inductance separates the first... Agent: Georgia Tech Research Corporation

20130077200 - Overvoltage protection circuit: An overvoltage protection circuit protects a portable electronic device against overvoltage. The overvoltage protection circuit includes an input unit for receiving an input voltage supplied by a voltage source; a voltage-divider module for dividing the input voltage and outputting a divided voltage; a voltage-regulator module for comparing a comparison voltage... Agent: Askey Technology (jiangsu) Ltd.

20130077201 - Overvoltage protection using a link current sensor: An example overvoltage protection device includes a switch and a link current sensor that measures current through the switch. The overvoltage protection device is selectively activated by transitioning the switch between an off-state and an on-state. The switch is transitioned from the on-state to the off-state in response to a... Agent:

20130077203 - Overcharge prevention circuit and semiconductor device: Provided is an overcharge prevention circuit for clamping a voltage value of an electric power generation unit in an overcharged state to a constant value, in which the number of elements is small and which does not consume electric power unnecessarily. The overcharge prevention circuit includes: a backflow prevention diode;... Agent: Seiko Instruments Inc.

20130077202 - Shunt protection module and method for series connected devices: A shunt protection module and method for series connected devices use multiple shunt semiconductors and a control unit. The shunt semiconductors correspond respectively to multiple target devices. Each shunt semiconductor connects to a corresponding target device in parallel. The control unit connects to trigger terminals of the shunt semiconductors. Because... Agent: Silicon Touch Technology Inc.

20130077204 - Breaker failure protection of hvdc circuit breakers: A breaker failure protection system for a high voltage direct current, HVDC, circuit breaker is provided. The circuit breaker is arranged for interrupting a DC circuit upon reception of a trip signal. The protection system includes a current sensor, at least one inductor, and a breaker failure detection unit. The... Agent: Abb Research Ltd

20130077205 - Energy storage module: The energy storage module may consist of a plurality of capacitor units each including: one or more capacitor cells each having a cathode terminal and an anode terminal extended and formed at an upper part thereof; and a case having a positive (+) connection terminal and a negative (−) connection... Agent: Samsung Electro-mechanics Co., Ltd.

20130077206 - High voltage electro-chemical double layer capacitor: An electro-chemical double layer capacitor comprises positive and negative electrodes, where the carbon material that is incorporated into the positive electrode is halogenated carbon material, while the carbon material that is incorporated into the negative electrode is un-halogenated carbon material. Further, the carbon material incorporated into each respective electrode can... Agent:

20130077207 - Porous carbon with high volumetric capacity, for double-layer capacitors, and production method: An activated, porous carbon has a specific BET surface area of between 1400 and 1900 m2/g, with at least 80% of all of the pores, and preferably all of the pores, of the carbon having an average diameter of between 0.3 and 0.9 nm. The novel carbon is particularly suitable... Agent: Sgl Carbon Se

20130077208 - Locking structure for a truck of a switchgear drawout circuit breaker: A truck (12′) for mounting a circuit breaker (13) in a switchgear frame (14′) includes wheels (16), a racking screw (20), a nut (22) threaded with the racking screw. The nut floats linearly with respect to the truck. A spring (23) is provided between a portion of the truck and... Agent: Abb Technology Ag

20130077209 - Power supply structure of a multi-power-supply system: A power supply structure of a multi-power-supply system which is electrically connected to at least one power supply to get an output power provided by the power supply. The multi-power-supply system includes a power integration back panel and a casing. The power integration back panel is electrically connected to a... Agent:

20130077210 - Motor control center unit with multiple feeder configurations: A motor control center unit comprising multiple feeders is described. The unit may also contain a common breaker interlock release configured to lock out breakers for all of the feeders. The breakers of the multiple feeders and the breaker interlock release may be accessible and operable through an isolation cover... Agent:

20130077216 - Cover lifting structure and electronic system with cover lifting structure: A cover lifting structure is suitable for a body of an electronic device. The body has a recess. The cover lifting structure includes a first rotating member, a second rotating member, an elastic member and a pushing member. The first rotating member pivoted to the body with a first axis.... Agent: Asustek Computer Inc.

20130077212 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a first member, and a second member. The first member is supported by the first housing, the first member comprising a portion which is movable. The second member is supported by the first member in a... Agent: Kabushiki Kaisha Toshiba

20130077214 - Electronic apparatus: An electronic apparatus includes an electronic device, a column that supports the electronic device, a plate member connected to a lower end of the column, a support member that includes a lower plate segment disposed under the plate member and an upper plate segment disposed above the plate member and... Agent: Fujitsu Limited

20130077215 - Electronic equipment: An electronic equipment includes a housing in which an opening is formed, an electronic device unit in which an electronic device is provided at the opening of the housing, a device holder which is provided with a first sealing member around a periphery of the device holder, the device holder... Agent: Fujitsu Limited

20130077213 - Peripheral device for portable electronic device: A peripheral device includes a slide mechanism, and a first and second extension portions having a number of function modules. The first and second extension portions are fixed to the slide mechanism and slide relative to each other in an opened position or closed position driven by the slide mechanism.... Agent: Chi Mei Communication Systems, Inc.

20130077211 - Support stand and standable hand-held device: A support stand suitable for a hand-held device is provided. The support stand has a first support member and a second support member. The second support member slidably fits the first support member and could be temporarily fixed at different positions on the first support member to adjust the length... Agent: Htc Corporation

20130077219 - Cable management apparatus: A cable management apparatus includes a guide rail, a number of slide members slidably mounted to the guide rail, and a number of cable supports. Each of the cable supports includes two arms hinged to each other. Each of the arms forms a first end and a second end. The... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077218 - Electronic device with sliding apparatus: A sliding apparatus includes a sliding member fixed to a first end of a server module, an elongated sleeve shaped first slide rail, and an elongated pole shaped second slide rail. The sliding member includes a first holding portion and a second holding portion each defining a mounting hole. The... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077217 - High strength cosmetic logo construction: A cosmetic logo insert is adapted for fitting into an opening in the housing of an associated computing device, is formed from a single piece of metal, has a thickness less than about 0.8 mm, and provides by itself adequate shock impact and fire enclosure protection at the opening for... Agent: Apple Inc.

20130077220 - Module and port: A first module including a first port to connect to a second module including a second port. The first port including an attraction field to attract a second port if the second port was within the attraction field. A flexible member can be connected to the first port and a... Agent:

20130077224 - Information processing device: Provided is an information processing device that includes a first component, including a display unit and a first antenna of the information processing device; a second component, including an arithmetic unit and a radio frequency circuit; the arithmetic unit used for providing a display signal to the display unit; a... Agent: Lenovo (beijing) Co., Ltd.

20130077226 - Housing encasing a device having a switch: This disclosure relates generally to an apparatus and/or system for housing a device. The apparatus includes a housing that is configured such that a device may be fitted within the housing and thereby be protected, such as from shocks and/or liquid. The housing may include top and bottom members that... Agent: Treefrog Developments, Inc. Dba Lifeproof.

20130077225 - Window member for display screen of portable terminal and method for fabricating the window member: Provided are a window member for a display device of a portable terminal and a method for fabricating the window member. An inner surface of the window member is formed as a flat surface from a first end portion to a position adjacent to a second end portion, and an... Agent: Samsung Electronics Co., Ltd.

20130077227 - Display device and assembling method thereof: A display device is provided, which includes a back cover and a display module. The back cover has a positioning slot. The display module includes a first frame, a panel module and at least hinge bracket. The first frame is fixed to the back cover. The panel module is fixed... Agent: Compal Electronics, Inc.

20130077228 - Portable computer assembly: A portable computer having independently mounted screen sections, whereby the screen sections may be used to provide a larger overall screen, to provide screens mirroring each other for presentation and display, for use by different users, and the like. The screen sections are foldable and collapsible in to the main... Agent:

20130077221 - L bracket for handheld device activators: A housing for a handheld computing device can include an outer shell having a base and a sidewall connected to a periphery of the base, the sidewall having a port configured to receive a button and the outer shell having an inner surface and an outer surface and a backing... Agent: Z124

20130077229 - Card reader having communicating function: The present invention relates to a card reader having communicating function which includes: a top cover; a bottom cover having a first open slot at one side; a printed circuit board; a first memory insertion slot allowing a first removable memory card to be inserted; a processor for controlling the... Agent:

20130077231 - Front removable cold swap hard disk drive carrier with internal release: A connector for a disk drive unit includes a base, a curve portion, a tab, a support, a hook, and a first spring arm. The base has a left portion, a right portion, a bottom portion, and a top portion. The curve portion extends from a back of the top... Agent: Dell Products, Lp

20130077230 - Housing and disc drive including the housing: Provided is a housing for an optical disk drive that locks an upper cover and a lower cover without the use of a screw or bolt. The lower cover includes complementary projections that are formed on side plates and the upper cover includes hook-type projection openings that correspond to the... Agent:

20130077222 - Power semiconductor module with wireless saw temperature sensor: A power semiconductor module includes a housing, a base plate disposed in the housing, a plurality of substrates mounted to the base plate, a plurality of power transistor die mounted to the substrates and a plurality of terminals mounted to the substrates and protruding through the housing. The terminals are... Agent: Infineon Technologies Ag

20130077223 - Server: A server includes a case, a fan module, and a main board module unit. The fan module is disposed in the case and divides the case into first and second spaces. An air flow is sucked into and blown out of the fan module along a first direction. The main... Agent: Inventec Corporation

20130077232 - Thermal management infrastructure for it equipment in a cabinet: The present invention attempts to reduce the thermal resistance with the use of heat-transfer devices (e.g., vapor chambers) placed directly on the heat-generating components in IT equipment and the integration of a cold plate within the cabinet. In some embodiments, the present invention is a thermal management system comprising a... Agent: Panduit Corp.

20130077233 - Electronic device: An electronic device having a heat generating element and a housing is provided including a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element and a second layer provided on top of... Agent: Lenovo (beijing) Limited

20130077234 - Internal connection retention components for computing devices: A computing device includes a Mini DisplayPort or other standardized plug and port connection that is fully internalized within the full device housing. The port can be affixed or coupled to a printed circuit board, with a display cable having a mating plug that is plugged into the port. To... Agent: Apple Inc.

20130077235 - Intelligent casing for smart devices: The various embodiments herein provide an intelligent protective casing for smart devices. The casing comprises a frame to releasably engage and hold a tablet device. The frame comprises an opening provided on the center for exposing a display panel of the tablet device, a printed circuit board (PCB), a microcontroller... Agent: Bewo Technologies Pvt. Ltd

20130077236 - Magnetically securing two screens of a handheld communication device: A handheld communication device includes first and second screens, a hinge to rotate the first and second screens between open and closed positions, and a permanent magnet to maintain the first and second screens in the closed position.... Agent: Z124

20130077237 - Electronic device and imaging device: An electronic device includes a housing, a slide cover and a restricting member. The housing includes a plate-like member. The plate-like member has a guide member protruding from an outer face of the plate-like member. The slide cover is disposed on the outer face of the plate-like member. The slide... Agent: Panasonic Corporation

20130077238 - Liquid cooling system for modular electronic systems: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The... Agent: Mellanox Technologies Ltd.

20130077239 - Semiconductor module and module system having the same: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow... Agent: Samsung Electronics Co., Ltd.

20130077240 - Electronic device with expansion cards: An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077241 - Flow diversion apparatuses and methods: Flow diversion apparatuses and methods are provided. A flow diversion apparatus can include a vent configured to permit the flow of a fluid therethrough. The apparatus can also include an electronic device capable of a range of motion across at least a portion of the vent disposed proximate at least... Agent:

20130077242 - Fan structure and electronic device applied with the same: An electronic device comprises a back plate, a fan and a coupling element. The fan includes a supporting base, a cover and a fan blade. The cover is disposed on the supporting base to form a fan blade accommodating space, the fan blade is disposed inside the accommodating space and... Agent: Inventec Corporation

20130077243 - Controller: A control unit is proposed which makes it possible to prevent connection problems between a package box and a backboard and prevent damage to the connector of the backboard. The control unit comprises a unit cover in which a first package box, which comprises a predetermined function and on the... Agent: Hitachi, Ltd.

20130077244 - Arrangement of a power semiconductor circuit: The invention relates to a power electronic assembly (1, 2, 3) with a heat sink (2), a power semiconductor module (1) and a circuit arrangement (3) for controlling the power semiconductor module, wherein the heat sink (2) has at least two parallel channels through which a coolant can flow.... Agent: Aeg Power Solutions B.v.

20130077245 - Cooling module for cooling electronic components: A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one... Agent: Abb Research Ltd

20130077246 - Heat sink structure with a vapor-permeable membrane for two-phase cooling: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes... Agent: International Business Machines Corporation

20130077247 - Valve controlled, node-level vapor condensation for two-phase heat sink(s): A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The... Agent: International Business Machines Corporation

20130077248 - Electronic device with heat dissipating assembly: An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a... Agent: Hon Hai Precision Industry Co., Ltd.

20130077249 - Overmolded in-line photovoltaic current regulating and heat sink device: An overmolded in-line photovoltaic current regulating and heat sink device includes one or more diode elements connected at one or more leads to coils of electrically conductive material. The coils serve a dual purpose; they act as heat sinks to draw heat away from the diode and conduct it to... Agent: Amphenol Technical Products International

20130077250 - Dc-dc converter vertically integrated with load inductor structured as heat sink: A power supply converter (100) comprising a first FET (210) connected to ground (230), the first FET coupled to a second FET (220) tied to an input terminal (240), both FETs conductively attached side-by-side to a first surface of a metal carrier (120) and operating as a converter generating heat;... Agent: Texas Instruments Incorporated

20130077251 - Heat sink mounting device: A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077252 - Electrical connector assembly: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole.... Agent: Lotes Co., Ltd.

20130077254 - Communication module assembly with heat sink and methods of manufacture: A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end,... Agent: Finisar Corporation

20130077253 - Heat transfer using a durable low-friction interface: A system includes a removable module to process data when installed in the system, where the module includes a first surface via which heat, that is generated by the module, is transferred. The system also includes a port into which the module is installed; and a heat sink, associated with... Agent: Infinera Corporation

20130077255 - Semiconductor control device: A semiconductor control device is provided with: a plurality of semiconductor modules each having a cooling member and a semiconductor element; a circuit board mounted with a control element that controls the plurality of semiconductor modules; and a case in which the plurality of semiconductor modules and the circuit board... Agent: Keihin Corporation

20130077256 - Heat dissipation structure for electronic device: Disclosed is a heat dissipation structure of dissipating heat through a heat dissipation sheet disposed between a cover member and an IC chip, which is a heat-generating element, mounted on a substrate. Specifically disclosed is a heat dissipation structure of an electronic device that can ensure that the heat dissipation... Agent: Sharp Kabushiki Kaisha

20130077257 - Electronic device and image sensor heat dissipation structure: An electronic device including a main board, an image sensor heat dissipation structure and a lens module is provided. The image sensor heat dissipation structure includes a heat dissipation plate, a thermal interface layer, an image sensor package and a cover glass. The heat dissipation plate is fixed to the... Agent: Altek Corporation

20130077258 - Power safety assembly: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates... Agent: Panduit Corp.

20130077259 - Electronic device with double circuit boards: A double circuit board module includes a bracket, a pivot rack pivotably mounted to the bracket, a first circuit board fixed to the bracket, and a second circuit board fixed to the pivot rack. After the pivot rack is pivoted away from the bracket, the first circuit board is exposed.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077260 - Smartpad - notifications: A multi-display device is adapted to be dockable or otherwise associatable with an additional device. In accordance with one exemplary embodiment, the multi-display device is dockable with a smartpad. The exemplary smartpad can include a screen, a touch sensitive display, a configurable area, a gesture capture region(s) and a camera.... Agent: Z124

20130077261 - Electronic device with riser card: An electronic device includes a chassis, a mounting assembly, and an assisting member. The mounting assembly is secured to the chassis and includes a circuit board and a connector secured to the circuit board. The signal module is secured to the chassis and includes a signal card, and the signal... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077262 - Module board and manufacturing method thereof: In a method of manufacturing a module board, an electronic component is mounted on a first principal surface of a small board. A cavity defining a through hole is formed in a core board. The electronic component is housed in the cavity by mounting the small board on a surface... Agent: Murata Manufacturing Co., Ltd.

20130077263 - Electronic housing and sensor connection arrangement: A garment includes a fabric portion, an electrode fixedly connected to the fabric portion, a receptacle fixedly connected to the fabric portion, and an electronics module releasably positioned in the receptacle. The receptacle includes a receptacle housing, an electrode lead, and a receptacle contact. The electrode lead is attached to... Agent: Under Armour, Inc.

20130077264 - Sealed overmolded circuit board with sensor seal and edge connector seal and production method of the same: An electronic apparatus partially overmolded with a overmold sealing material that seals the circuit board, protects the electrical components on the circuit board and provides seals between the circuit board and mating devices is disclosed. The electronic apparatus may be an engine controller. The electrical components may be an electrical... Agent: Electrojet, Inc.

20130077266 - Connection method and connection structure of electronic component: A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component... Agent: Dexerials Corporation

20130077265 - Printed circuit board assembly: A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a... Agent: Samsung Electronics Co., Ltd.

20130077268 - Circuit board with air hole: A circuit board includes a first and second ground layer and a plurality of signal vias extending between the ground layers but not electrical contact therewith. Ground vias coupled to the first and second ground layers can be positioned adjacent signal vias and can include ground traces that extend between... Agent: Molex Incorporated

20130077270 - Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.... Agent:

20130077269 - Housing and electronic device using same: An electronic device includes a housing, a circuit board fixed to the housing, a connector fixed to the circuit board, and a resisting plate secured to the housing. The resisting plate abuts the circuit board for supporting the circuit board and preventing the connector from loosening.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130077267 - Power board, method of manufacturing the same and liquid crystal display apparatus having the same: A power board is provided. The power board includes a board housing; a board included in an inside of the board housing; a plurality of parts mounted in the board; and a supporting member configured to be mounted in the board and to support the board to prevent each of... Agent: Samsung Electronics Co., Ltd.

20130077271 - System for interconnecting electrical components: In one embodiment, an apparatus includes a housing with a conductive surface. A circuit board may be positioned within the housing. The circuit board includes a deflectable portion that may be movable relative to the housing. A conductive pad is positioned on the deflectable portion of the circuit board. A... Agent: Cisco Technology, Inc.

20130077272 - Structure design for 3dic testing: A work piece includes a first copper-containing pillar having a top surface and sidewalls, and a first protection layer on the sidewalls, and not over the top surface, of the first copper-containing pillar. A test pad includes a second copper-containing pillar having a top surface and sidewalls. The test pad... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20130077274 - Card structure, socket structure, and assembly structure thereof: A card structure for a socket structure provided with a plurality of first elastic plates and a plurality of second elastic plates is disclosed, and the card structure includes a body, a plurality of first pad portions, and a plurality of second pad portions. The body includes a outer surface.... Agent: Industrial Technology Research Institute

20130077273 - Printed circuit board for providing operation voltages: A printed circuit board (PCB) includes two power supply units, a central processing unit (CPU), two inductors and a temperature compensation resistor. One of the inductor is electrically connected between one power supply unit and the CPU, the other inductor is electrically connected between another power supply unit and the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130077275 - Electronic device, wiring substrate, and method for manufacturing electronic device: The electronic device includes: a wiring substrate having two or more first electrodes over one surface thereof; and an electronic component having, over one surface thereof, two or more second electrodes arranged corresponding to the two or more first electrodes, respectively. At least one of the first electrodes is a... Agent: Renesas Electronics Corporation

20130077276 - Compact isolated switching power converters: An isolated switching power converter includes a power isolation transformer having at least one primary winding, at least one secondary winding and a plurality of sides, a first power board mechanically coupled to a first side of the transformer, and a second power board mechanically coupled to a second side... Agent: Astec International Limited

20130077281 - Chip elements mounted on wires having an incipient breaking point: The invention relates to a chain including multiple microelectronic chip elements that are connected to a wire. The wire has notches that define preferred breaking points when the wire is subject to tensile stress. If the wire is conductive, the notches can be spread so that the length of the... Agent: Commissariat A L'energie Atomique Et Aux Energies Alternatives

20130077279 - Electrical devices module for an avionics bay: A module in the form of a pallet or a closed container includes a grouping together of the electrical devices in an avionics bay, in which the electrical devices are interconnected and attached so as to facilitate the mounting and thus limit the time it takes to mount the electrical... Agent: Airbus Operations (sas)

20130077280 - Electronic arrangement and method for producing an electronic arrangement: An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on... Agent: Osram Opto Semiconductors Gmbh

20130077278 - Viscoelastic material for shock protection in an electronic device: This invention is directed to reducing the effect of shocks on electronic device components. The electronic device component may be surrounded by a boundary element operative to deform in response to impacts. By deforming, the boundary element may be operative to absorb energy received by the shock or impact without... Agent: Apple Inc.

20130077277 - Water resistant electromechanical personal body-care device: A handheld, electromechanical device useful in mammalian body-care includes a one-piece housing, a unitary insert, and a removable cover. The one-piece housing has a single opening defined by a rim. The rim circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the... Agent:

20130077282 - Integrated thermal and emi shields and methods for making the same: Electronic devices having integrated thermal and EMI shields for providing thermal dissipation and EMI shielding of one or more circuitry components, and methods for making the same, are provided. The integrated shield combines both thermal and EMI shielding properties into a single layer material that saves space within the electronic... Agent: Apple Inc.

20130070372 - Protection circuit, resonant converter including the protection circuit, and protecting method of the resonant converter: The present invention relates to a protection circuit, a resonance converter having the same, and a protection method thereof. A resonance converter having high-side and low-side switches senses a current flowing through the low-side switch and determines a zero voltage switching failure by using a width of a current flowing... Agent: Fairchild Korea Semiconductor Ltd.

20130070373 - Method for compensating overload trip curve for ct error: A digital thermal model for compensating for error in a current transformer used in a solid-state overload relay. The thermal model implements a difference equation that determines using a low-pass filter two parameters corresponding to calibration points along an overload trip curve. The trip curve is adjusted at an ultimate... Agent: Schneider Electric Usa, Inc.

20130070374 - Electrical monitoring device and method for safeguarding the protective function of a type a residual current device (rcd): A monitoring device and a method safeguards the function of a type A residual current device (RCD) in a power supply system. The monitoring device includes a measuring current transformer circuit for detecting a DC fault current (IF), an evaluation unit for processing the current detected by the measuring current... Agent:

20130070375 - Electrical component and method for controlling an electrical component: An electrical component having a core and a first and second coil positioned around the core is controlled in such a manner, that in response to the second coil being switched off, the first coil is short-circuited via a quenching circuit to quench the inductive load of the second coil.... Agent:

20130070376 - Electrostatic discharge protection circuit and electrostatic discharge protection method: An ESD protection circuit and method for its use are provided. The circuit comprising: a discharge path formed by first and second NMOS transistors which are sequentially connected between a ground and a power supply; an ESD event detection unit; first and second drive units respectively connected between an output... Agent: Semiconductor Manufacturing International (beijing) Corporation

20130070377 - Redundant and fault-tolerant power distribution system having an integrated communication network: A power distribution and communication system includes nodes connected by power lines and communication links. The system receives power from one or more power sources. Each node contains at least one power port, data port and load port. Associated with each power port and load port is a port monitor... Agent: Applied Minds, LLC

20130070378 - Recloser device and method of operation: A device for interrupting the flow of electrical power in an electrical distribution system is provided. The device includes a sensor operably coupled to the electrical distribution system. A switching mechanism is coupled to the electrical distribution system, the switching mechanism movable between an open position and a closed position.... Agent:

20130070379 - Power regulator with over current protection and control circuit thereof and method of over current protection: The present invention discloses a power regulator with over current protection (OCP), a control circuit thereof, and a method of over current protection. The power regulator with OCP includes: a primary circuit, a transformer, and a secondary circuit. The power regulator receives AC power, and generates secondary current which is... Agent: Richtek Technology Corporation, R.o.c.

20130070380 - Over-current protection device: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 Ω-cm and 0.32 Ω-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 μm and... Agent: Polytronics Technology Corp.

20130070381 - Over-current protection device: An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same... Agent: Polytronics Technology Corp.

20130070382 - Universal thermal module wiring connector: A universal thermal wiring connector is configured for monitoring ambient and conducted temperatures on all wire and wire terminal connections external to a wiring device, including supply leads and non-metallic outlet box to insure they are operating within an acceptable temperature range. The device is configured to terminate/disconnect the supply... Agent:

20130070383 - Solid state protector module: A protector module for use with a communication system, such as a telephone system having a tip line and a ring line, includes a base member and a plurality of electrically conductive pins mounted on the base member. A first electrical contact is fixedly mounted on the top surface of... Agent: Tii Network Technologies, Inc.

20130070384 - High surface resistivity electrostatic chuck: In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck, the surface layer including a... Agent: Entegris, Inc.

20130070386 - Multilayer ceramic electronic component: There is provided a multilayer ceramic electronic component including a lamination main body including a plurality of inner electrodes. When T1 represents a distance between vertically adjacent inner electrodes in a central portion of the lamination main body, and T2 represents a distance between vertically adjacent inner electrodes at an... Agent: Samsung Electro-mechanics Co., Ltd.

20130070385 - Stacked structure and method of manufacturing the same: A stacked structure includes: first and second electrode parts, and a dielectric layer. The first electrode part has a first strip portion and a plurality of first plate portions extending from a side edge of the first strip portion. The second electrode part has a second strip portion and a... Agent: Sanyo Electric Co., Ltd.

20130070387 - Dual stage emi filter and offset highly efficient multi-polar active capacitor electrodes for an active implantable medical device: A multipolar feedthrough filter capacitor assembly for an active implantable medical device includes a feedthrough filter capacitor including a first active electrode plate, a second active electrode plate and a plurality of ground electrode plates. The plates are in spaced parallel relation disposed within a monolithic dielectric substrate where the... Agent: Greatbatch Ltd.

20130070388 - Capacitor element and capacitor device having the same: A capacitor forming unit includes a dielectric plate, a first conductor film formed on a plate upper surface region other than front and rear end portions, a first insulator film formed on the upper surface front end portion, a second insulator film formed on the upper surface rear end portion,... Agent: Taiyo Yuden Co., Ltd.

20130070389 - Electrode for energy storage and method for manufacturing the same: The present invention relates to an electrode for an energy storage and a method for manufacturing the same and provides a useful effect of improving resistance characteristics of an electrode for an energy storage by forming a trench of predetermined dimensions on a surface of a current collector, forming a... Agent: Samsung Electro-mechanics Co., Ltd.

20130070390 - Electrode active material, method for preparing the same, and electrochemical capacitor including the same: An electrode active material having a partially crystalline structure in a fine area (short range), a method for preparing the same, and an electrochemical capacitor including the same. The electrode active material having a partially crystalline structure in a fine area (short range) can be prepared by performing heat treatment... Agent: Samsung Electro-mechanics Co., Ltd.

20130070391 - High energy density electrochemical capacitors: Electrochemical capacitors and methods for producing such electrochemical capacitors. The electrochemical capacitor can have an initial charged state and a cycled charged state and can include an anode, a cathode, and an electrolyte. The anode can include a first mixture having a first plurality of electrically conductive carbon-comprising particles having... Agent:

20130070392 - Process for the production of electrolyte capacitors of high nominal voltage: The invention relates to a process for the production of electrolyte capacitors having a low equivalent series resistance and low residual current for high nominal voltages, electrolyte capacitors produced by this process and the use of such electrolyte capacitors.... Agent: Heraeus Precious Metals Gmbh & Co. Kg

20130070393 - Solid electrolytic capacitor: A solid electrolytic capacitor is impregnated with a conductive polymer dispersion solution comprising sorbitol. In the capacitor, the hydroxyl group of sorbitol acts as the oxygen source necessary for the anodic oxidation of anodic oxide film when voltage is applied to the solid electrolytic capacitor. Consequently, the oxide film is... Agent:

20130070394 - Transfer switch with neutral disconnect: A transfer switch panel including a bonded neutral connection to ground that allows the connection and disconnection of the utility neutral and an auxiliary power source neutral in one switching movement. The transfer switch panel includes a transfer switch connected to both a utility power source and an auxiliary power... Agent: Briggs & Stratton Corporation

20130070395 - Swing out mount: An electrical enclosure includes a housing, a moveable bracket, an electrical device, a lever, and a drive assembly. The housing has a door attached to a body. The moveable bracket couples the electrical device to the body. The lever is positioned outside of the housing and is configured to switch... Agent: Schneider Electric Usa, Inc.

20130070402 - Communication device and producing method for enclosure of the same: and an enclosure that contains the transmission section and the reception section. In the device, the enclosure of ODU (1) is made of a nonferrous metal and an outer surface of the nonferrous metal is coated with paint, but a concave and convex pattern of an impact mark of powder... Agent: Nec Corporation

20130070401 - Display arrangement and the mounting thereof: The invention relates to a display arrangement and the mounting thereof.... Agent:

20130070400 - Electronic device and rotating base driving method: An electronic device including a first body, a rotating base, and a rotating base driving system is provided. The rotating base is pivoted to the first body and suitable for rotating between a using position and a retracting position with respect to the first body. The rotating base driving system... Agent: Compal Electronics, Inc.

20130070399 - Fixing structure for fixing a display panel and display device therewith: A fixing structure for fixing a display panel is disclosed. The fixing structure includes a bezel and a cover. The bezel includes a frame, a first bending portion bent from a side of the frame, and a first hooking portion connected to an end of the first bending portion. The... Agent:

20130070396 - Hand-held deivce: A hand-held device includes a first body, a second body, a sliding module, and a guiding module. The sliding module is disposed between the first body and the second body, so that the second body is able to be slid on a two-dimensional plane relative to the first body. The... Agent: Htc Corporation

20130070398 - Hinge fixing structure for fixing a hinge and display device therewith: A hinge fixing structure includes a bezel whereon an opening is formed, and a cover whereon a slot is formed. The hinge fixing structure includes a hinge whereon a hole is formed, and a protrusion bolt. The protrusion bolt includes a fixing portion installed inside the slot on the cover... Agent:

20130070397 - Stylus ejector and portable electronic device: An ejector for stylus includes a housing, an ejecting module and an operating member. The housing defines a retaining slot for retaining the stylus. The ejecting module includes a pushing member and an elastic member retained in the retaining slot. The pushing member defines a latching slot. The operating member... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130070403 - Electronic device and information processing assembly comprising the same: An information processing assembly includes at least two electronic devices. A processing module is disposed in at least one electronic device. At least one male end connector and at least one female end connector are disposed on each electronic device. Specifications of the male end connector and those of the... Agent: Lintes Technology Co., Ltd.

20130070405 - Computer devices and methods of preventing damage to a display: Computer devices are described herein. The computer devices include a keyboard body including a keyboard and a display body including a display. The computer devices are foldable to a closed position. A display protector is attached to the keyboard body so as to protect the display by contact therewith. Further,... Agent:

20130070404 - Laptops and methods of protecting electronic components of a laptop: Laptops are described herein. The laptops include a display body and a keyboard body. The laptops further include a hinged cover. The hinged cover can be in a closed position for preventing access and/or protecting electronic components. Further, methods of protecting electronic components of a laptop are also described herein.... Agent:

20130070406 - Hinge assembly: Example embodiments disclosed herein relate to a hinge assembly. An example of the hinge assembly includes a pair of active hinges and a pair of passive hinges. The hinge assembly may be utilized in portable computing devices such as notebook computers and personal digital assistants (PDAs).... Agent:

20130070407 - Frame assembly for installing panel modules with different dimensions and panel device therewith: A frame assembly for installing panel modules with different dimensions is disclosed. The frame assembly includes a first frame and a second frame. The first frame has a first fixing structure formed thereon and a first sliding structure in an axis direction. The second frame has a second fixing structure... Agent:

20130070408 - Portable computer operation station: A portable computer operation station is adapted for supporting a portable computer, wherein the portable computer operation station includes an input device and a supporting frame foldably coupled with the input device to move between a folded position and an operation position. At the folded position, the supporting frame is... Agent:

20130070409 - Information handling system cooling system: An information handling system (IHS) cooling system includes an IHS chassis defining an IHS chassis air inlet. A cooling chassis supports the IHS chassis on a support base. An air supply duct extends from the cooling chassis such that an air supply duct outlet on the air supply duct is... Agent: Dell Products L.p.

20130070410 - Serial advanced technology attachment dual in-line memory module and computer system: A computer system includes a motherboard with first and second storage device interfaces and first to third memory slots, and first to third serial advanced technology attachment dual-in-line memory modules (SATA DIMMs). First and second extending boards are extended from two opposite ends of each SATA DIMM, arranged with first... Agent: Hon Hai Precision Industry Co., Ltd.

20130070411 - Serial advanced technology attachment dual in-line memory module assembly: A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130070412 - Expansion apparatus with serial advanced technology attachment dual in-line memory module: An expansion apparatus includes a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a first circuit board, an expansion card with a second circuit board, and a cable member. A first edge connector is set on a bottom edge of the first circuit board and includes a number... Agent: Hongfu Jin Precision Industry (shenzhen) Co., Ltd.

20130070414 - Data storage device cage: An exemplary data storage device cage includes a main body and an electrical connector positioned on the main body. The main body includes a rectangular flat plate and two side plates respectively extending upward from opposite edges of the flat plate. The flat plate has at least a pair of... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20130070413 - Mounting device for optical disk drive: A mounting device for fixing an optical disk drive (ODD) includes a latch and a rack including a bottom wall. Two pins extend out from opposite sides of the ODD. A first plate and a second plate extend up from the bottom wall to sandwich the ODD. a tab extends... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130070415 - Push-push eject disk drive chassis: A push-push eject disk drive chassis user-swappably accepts a disk drive, without tools or a caddy and is sufficiently narrow, such that two such chassis may be disposed side-by-side within a housing having a standard disk drive form factor and accept disk drives having smaller form factors. A data storage... Agent: Drobo, Inc.

20130070416 - Thermal management system: A thermal management system for an electronic equipment enclosure is provided. The thermal management system includes an intake duct for routing cold air in the front of the electronic equipment enclosure to the side of electronic equipment enclosure and one or more blanking panels for separating cold air in the... Agent: Panduit Corp.

20130070417 - Computer power supply: A computer power supply of the present disclosure comprises a housing, a circuit board disposed inside the housing and a fan assembly for dissipating heat from the circuit board, and the fan assembly is disposed obliquely with respect to a surface of the circuit board. With the aforesaid structure, the... Agent: Shenzhen Ocingtek Technology Co., Ltd.

20130070419 - Electronic device with heat dissipating module: An electronic device includes a circuit board and a heat dissipating module. The circuit board includes a body and a first heat generating part located on the body. The body defines a through hole close to the first heat generating part. The heat dissipating module includes a heat pipe, a... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130070420 - Flow boiling heat sink with vapor venting and condensing: A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s)... Agent: International Business Machines Corporation

20130070418 - Heat dissipation module: An electronic device includes printed circuit board having an electronic component and a heat dissipation module mounted the printed circuit board. The heat dissipation module includes a base with a heat absorbing plate and two elastic pieces extending from the heat absorbing plate. The heat absorbing plate thermally engages on... Agent: Foxconn Technology Co., Ltd.

20130070421 - Anti-sag apparatus for expansion cards: An anti-sag apparatus is mounted in a chassis for supporting an expansion card. The anti-sag apparatus includes a fixing bracket, a mounting member, and a supporting module. The mounting member defines a slide slot and a positioning hole communicating with the slide slot. The supporting module includes a supporting member,... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130070422 - Enclosure-integrated handle features for mounting storage devices: Systems and methods are hereby provided for enclosures having integrated handle features for storing one or more storage devices. The system includes a rigid frame and multiple bays. Each bay includes a body movably attached to the frame, wherein repositioning of the body with respect to the frame is restricted... Agent: Lsi Corporation

20130070423 - Compact connector assembly for implantable medical device: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive... Agent: Medtronic, Inc.

20130070424 - Molded can package: A molded can package includes a circuit board, a MEMS die and a can. The MEMS die is connected to the circuit board by a conductive wire. The can is mounted to the circuit board so as to isolate the MEMS die to form a MEMS die unit. A compound... Agent: Great Team Backend Foundry, Inc.

20130070425 - Combinative power device: The present invention provides a combinative power device. In one aspect, the combinative power device of the present invention includes an AC-to-DC module including a first joint portion; and a DC-to-DC module having a second joint portion and coupled to the AC-to-DC module by the second joint portion with the... Agent: Phihong Technology Co.,ltd.

20130070426 - Control device: The invention relates to a control device (10a), comprising a housing unit (12a) and a circuit module (14a) which is arranged in the housing unit (12a) and has a circuit carrier (16a), at least one electric/electronic circuit unit (18a) mounted on the circuit carrier (16a) and at least one contact... Agent: Robert Bosch Gmbh

20130070427 - Pre molded can package: A pre molded can package includes a circuit board, a MEMS die, a pre mold cavity and a can. The MEMS dies are connected to the circuit board by conductive wires and the MEMS dies are separated by the pre mold cavities. A cap is connected to the top of... Agent: Great Team Backend Foundry, Inc.

20130070428 - Method of sealing and contacting substrates using laser light and electronics module: The invention concerns a method of fusing and electrically contacting a first insulating substrate (28A) having at least one first conductive layer (29A) thereon with at least one second insulating substrate (28B) having at least one second conductive layer (29B) thereon, the method comprising: stacking the first and second substrates... Agent: Corelase Oy

20130070430 - Display device: A display device includes: circuit board 6 provided inside a display panel; flat cable 10 attached to connector 11 provided on the board 6; outlet section 10A which is provided in a position on the rotational axis side of the display panel at substantially the same height as that of... Agent: Mitsubishi Electric Corporation

20130070429 - Integrated voltage divider: A semiconductor structure including a high-voltage transistor; voltage dropping circuitry, at least part of which is overlapping the high-voltage transistor; at least one intermediate contact point to the voltage dropping circuitry, connected to at least one intermediate position between a first and a second end of the voltage dropping circuitry;... Agent: Stmicroelectronics S.r.i.

20130070431 - Display, electronic unit, and supporting substrate: There are provided a display and an electronic unit that realize excellent operability when display content is switched based on a user operation associated with a variation in a physical form, and a supporting substrate employed in such a display. The display includes: a supporting substrate having flexibility; and a... Agent: Sony Corporation

20130070433 - In-vehicle electronic device: An in-vehicle electronic device includes a circuit board in which a preamplifier circuit, and the like are provided, and a holding case, which stores the circuit board. The holding case is configured by combining a lower case which is fixed to a glass surface in which an antenna radiation conductor... Agent:

20130070432 - Seal structure for electronic control device: A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are... Agent: Hitachi Automotive Systems, Ltd.

20130070434 - Dye-based circuit mount testing: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to... Agent: International Business Machines Corporation

20130070435 - Power connector and motherboard using the same: A power connector for mounting on a circuit board is provided. The power connector includes a case and several sets of pins. A set of pins includes several pins. Each one of one set of pins includes an embedded end, a median portion, and a distal end, where the embedded... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130070436 - Systems and methods for high aspect ratio flip-chip interconnects: Interconnect and/or reflow methods of the present disclosure achieve high aspect ratio interconnects, for example interconnects having an aspect ratio as high as 4, in addition to wider interconnect height tolerances among interconnects (for example, interconnects having a height variability of up to about 30%) while still achieving reliable electrical... Agent: Arizona Board Of Regents, A Body Corporate For The State Of Arizona Acting For And On Behalf

20130070437 - Hybrid interposer: An interconnection component includes a low coefficient of thermal expansion (“CTE”) element having first and second surfaces defining a thickness, the element consisting essentially of a material having a first CTE of less than 10 parts per million per degree Celsius, the element having a plurality of contacts exposed at... Agent: Invensas Corp.

20130070438 - Integrated circuit packaging system with interposer and method of manufacture thereof: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an interposer having a top interposer surface over the substrate; attaching an interposer pad extension to the top interposer surface, the interposer pad extension having an extension contact surface and a lower contact surface, the... Agent:

20130063842 - Earth leakage detector with suffered current-blocking function: A leakage detector is provided with the addition of an output control circuit that monitors a circuit wire-to-ground voltage, which is at the root of a suffered operation and produced between a transformer B-class grounding phase of a monitored circuit and a D or C-class grounding electrode or a ground... Agent:

20130063846 - Esd protection device with reduced clamping voltage: Disclosed is an ESD protection circuit comprising a plurality of bipolar transistors, namely a plurality of ESD current conducting transistors (Q1, Q2, Q4) in a main ESD current conducting path between a first and a second terminal (T1, T2), and further comprises at least one driving transistor (Q3) connected in... Agent: Imec Vzw

20130063843 - Esd protection for 2.5d/3d integrated circuit systems: An integrated circuit structure includes first and second integrated circuit devices disposed on a interposer. Each integrated circuit device has electrostatic discharge (ESD) protection circuitry therein connected to an internal ESD bus. The first and second integrated circuit devices communicate with one another through the interposer. The interposer includes an... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.

20130063844 - Load switch with true reverse current blocking: Devices, systems and methods are provided for switching a load with true reverse current blocking (TRCB). The device may include an input port coupled to a supply voltage; an output port coupled to the load; a TRCB circuit coupled to the input port and the output port; and a switch... Agent: Fairchild Semiconductor Corporation

20130063845 - Overvoltage protection equipment: Overvoltage protection equipment may include: a first connection; a second connection; a first discharge path disposed between the first and the second connections, wherein the first discharge path comprises a spark gap; a second discharge path disposed between the first and the second connections, wherein the second discharge path comprises... Agent: Phoenix Contact Gmbh & Co. Kg

20130063847 - Fault protection circuit for iec 61158 fieldbus spur and method of using the same: A fault protection circuit for use on a spur of an IEC 61158 Fieldbus network comprising a fast acting current limiter adapted to limit the spur current to the level of a reference current when the spur current reaches said reference current, control means adapted to monitor the spur AC... Agent: Pepperl + Fuchs Gmbh

20130063848 - Safety shut-off device and method of use: A safety shut-off system and method for eliminating power to a load in the event of smoke detection. The system may comprise a device located at the appliance for detecting a signal from a smoke detector, and cutting power to the appliance only when the appliance is in use. The... Agent: Activefireprevention, LLC

20130063849 - Overvoltage protection circuit and portable electronic device having the same: An overvoltage protection circuit and a portable electronic device having the same are introduced. The overvoltage protection circuit provides overvoltage protection when an input voltage exceeds a rated voltage tolerable by an internal circuit unit in the portable electronic device. A reference voltage and a partial voltage are generated from... Agent: Askey Technology (jiangsu) Ltd.

20130063850 - Overcurrent protection circuit: An overcurrent protection circuit includes a load drive section driving a load, a wire coupled with the load and the load drive section, a current detection section detecting a load current value of an electric current that flows to the load, an addition and subtraction section determining an addition and... Agent: Denso Corporation

20130063851 - Appartus and method for protecting signal and communication lines from very high voltage and transient pulses: Apparatus for protecting a signal line bus driver from overvoltage faults may include a first solid-state switch configured to block current having a positive voltage when open and a second solid-state switch configured to block current having a negative voltage when open. A comparator circuit may produce a output signal... Agent: Honeywell International Inc.

20130063852 - Snubber circuit and method of using bipolar junction transistor in snubber circuit: A snubber circuit includes: at least one impedance component, a capacitor, and a Bipolar Junction Transistor (BJT). The snubber circuit is utilized for protecting electric/electronic components, reducing high frequency interference and spike voltage, and enhancing efficiency. In particular, the at least one impedance component in the snubber circuit can be... Agent: Fsp Technology Inc.

20130063853 - Snubber circuit and method of using bipolar junction transistor in snubber circuit: A snubber circuit includes: a capacitor including a first terminal and a second terminal, where the first terminal of the capacitor is electrically connected to a first terminal of the snubber circuit; and a Bipolar Junction Transistor (BJT), where one of the emitter and the collector of the BJT is... Agent:

20130063854 - 3-dimensional multi-layered modular computer architecture: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are... Agent:

20130063855 - Very fast transient suppressing device: The subject of the invention is a device for suppressing very fast transients (1, 1a, 1b), applicable in protecting electric and/or electric power equipment, and especially transformers operating in electric power substations and in wind power plants, connected in the supply network circuit downstream of the circuit breaker and upstream... Agent:

20130063856 - Electrostatic discharging apparatus and financial apparatus: Provided is an electrostatic discharging apparatus, which comprises a rotation shaft, a transfer roller, and an electrostatic discharging member. The rotation shaft transmits driving force. The transfer roller is disposed on the rotation shaft to transfer a medium. The electrostatic discharging member is disposed on the rotation shaft to rotate... Agent: Lg N-sys Inc.

20130063857 - Mems variable capacitor and method for driving the same: Disclosed herein is an MEMS variable capacitor and its driving method, the MEMS variable capacitor including, a first electrode, a second electrode floating over the first electrode upper part, a fixed electrode separated at the second electrode side surface, and a drifting electrode placed between the second electrode and the... Agent: Lg Innotek Co., Ltd.

20130063859 - Low inductance integral capacitor assembly: The invention provides an integral high-voltage capacitor assembly that yields very low self inductance and provides voltage and current multiplication. The capacitor assembly has two or four capacitors connected in series, with each capacitor made up of a stack of capacitor cells (40) also connected in series. Each of the... Agent: Specscan Sdn.bhd

20130063858 - Nanostructured dielectric materials for high energy density multilayer ceramic capacitors: A multilayer ceramic capacitor, having a plurality of electrode layers and a plurality of substantially titanium dioxide dielectric layers, wherein each respective titanium dioxide dielectric layer is substantially free of porosity, wherein each respective substantially titanium dioxide dielectric layer is positioned between two respective electrode layers, wherein each respective substantially... Agent:

20130063860 - Lead unit of energy storage device: m

20130063861 - Interdigitated capacitor having digits of varying width: An interdigitated capacitor having digits of varying width is disclosed. One embodiment of a capacitor includes a first plurality of conductive digits and a second plurality of conductive digits positioned in an interlocking manner with the first plurality of conductive digits, such that an interdigitated structure is formed. The first... Agent: Xilinx, Inc.

20130063862 - Multilayer ceramic electronic component and fabrication method thereof: There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average... Agent: Samsung Electro-mechanics Co., Ltd.

20130063863 - Insulator based upon one or more dielectric structures: A method and apparatus for a capacitor comprises a first plate and a second plate. An insulator between the first plate and the second plate includes a first dielectric layer and a second dielectric layer. At least one interface between the first dielectric layer and the second dielectric layer includes... Agent:

20130063864 - Multi-layer ceramic electronic component with solder blocking layer: A multi-layer ceramic electronic component includes a ceramic base, a pair of exterior electrodes located on two ends of the ceramic base, respectively, an inner electrode embedded in the ceramic base, and a solder blocking layer located between the pair of the exterior electrodes and projecting from an exterior surface... Agent: Ambit Microsystems (zhongshan) Ltd.

20130063865 - Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereof: There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20≦a≦60, 20≦b≦60,... Agent: Samsung Electro-mechanics Co., Ltd.

20130063866 - Energy storage device and method thereof: The present disclosure is related to hybrid capacitors specifically to PbO2/Activated Carbon hybrid capacitors. The hybrid super capacitor of the present disclosure is simple to assemble, bereft of impurities and can be fast charged/discharged with high faradiac-efficiency.... Agent:

20130063867 - Lithium titanate nanoparticles, composite of lithium titanate nanoparticles and carbon, method of production thereof, electrode material consisting of said composite, electrode, electrochemical element, and electrochemical capacitor employing said electro: A mixed solvent is prepared by dissolving acetic acid and lithium acetate in a mixture of isopropanol and water. This mixed solvent together with titanium alkoxide and carbon nanofiber (CNF) were introduced into a rotary reactor, the inner tube was rotated at a centrifugal force of 66,000 N (kgms−2) for... Agent:

20130063868 - Electrolytic solution for electrolytic capacitor: A hydrophobic film is formed on the electrode foil surface by adding a straight-chain saturated dicarboxylic acid represented by the general formula: HOOC(CH2)nCOOH (wherein n indicates an integer from 9 to 11) to the electrolytic solution for medium/high-voltage electrolytic capacitor. Addition of a large amount of water to the electrolytic... Agent:

20130063869 - Sealing assembly for a wet electrolytic capacitor: A wet electrolytic capacitor that contains an anode and a fluid electrolyte that are positioned within a casing is provided. The capacitor also contains a sealing assembly that employs a bushing having opposing inwardly facing, tapered surfaces between which an orifice is defined. To help inhibit leakage from the orifice,... Agent: Avx Corporation

20130063870 - Tantalum capacitor: There is provided a tantalum capacitor, including: a chip sintered body formed by sintering a tantalum powder; and an anode lead-out line formed of niobium (Nb) and having an insertion region positioned inside the chip sintered body and a non-insertion region positioned outside of the chip sintered body, and thus,... Agent:

20130063871 - Manually-controlled arc flash energy reduction system and method for circuit breaker trip units: A circuit protection system has a normal mode, and a maintenance mode with reduced potential arc flash energy. A downstream circuit breaker is mounted within a first enclosure comprising a first access panel. A locking mechanism locks the first access panel closed. An upstream breaker is mounted within a second... Agent:

20130063872 - Interlocking utility meter cover: A utility meter cover and complementary base are disclosed, the cover including a window section and a shroud. The shroud is for covering a complementary portion of a meter base, and includes: a radially extending base portion; an axial extension extending from the base portion, the axial extension for obstructing... Agent: General Electric Company

20130063879 - Electric apparatus: A support arm has an attachment hole formed thereon. The support arm has a first side wall and a second side wall both constituting edge of the attachment hole. An engaged convex portion is formed on the second side wall. The first side wall restricts a hook of the front... Agent: Sony Computer Entertainment Inc.

20130063878 - Electronic apparatus: An electronic apparatus includes a first sealing member, a second sealing member, and a main body. The first sealing member has conductivity. The second sealing member is formed of an elastic material. The main body includes a first conductive casing, a second conductive casing, and a joining portion. The joining... Agent: Sony Corporation

20130063880 - Electronic component casing: An electronic component casing includes: an inclined portion that projects from an upper surface so as to increase in height gradually from one side; a step portion that descends as a continuation of an upper end of the inclined portion or descends via a plane connected to the upper end;... Agent: Nissan Motor Co., Ltd.

20130063875 - Electronic device with quick-release supporting apparatus: An electronic device includes a main body, a base, a connecting member, a securing pole, a locking member, a sliding block. The main body includes a securing groove having a securing region, and a securing hole is defined on the bottom of the securing region. The connecting member is mounted... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130063873 - Integrated inductive charging in protective cover: Accurate and reliable techniques for wirelessly powering a tablet device are disclosed.... Agent: Apple Inc.

20130063874 - Mobile terminal and method for fabricating case thereof: In a mobile terminal having a case defining an appearance of the terminal, and a fabrication method for the case, the mobile terminal includes a plurality of pieces formed of zirconia or ceramic and each having a preset shape, and a frame recessed into one surface of the case to... Agent: Lg Electronics Inc.

20130063877 - Protective coverings and methods of making and using the same: Protective coverings suitable for protecting and housing electronic devices such as an APPLE™ iPAD™ tablet are disclosed. Methods of making and using protective coverings are also disclosed.... Agent:

20130063876 - Systems and methods for cover assembly retention of a portable electronic device: This is directed to systems and methods for cover assembly retention of a portable electronic device. In some embodiments, a cover assembly and/or housing of an electronic device can include one or more retention features such as detents, hooks, tabs, extensions, screw plates, screw holes, shuttles, latches, or any combination... Agent: Apple Inc.

20130063881 - Physical infrastructure management system: Systems and methods of the present invention allow for the discovery of physical location information about network assets and the delivery of that information to network administrators. In addition, environmental and other information about network asset locations can be provided to an administrator. Intelligent patch panels and power outlet units... Agent: Panduit Corp.

20130063882 - Portable electronic device with support function: A portable electronic device includes a lower cover, a keyboard disposed on the lower cover, an upper cover pivotally connected to a side of the lower cover, a support target member disposed on the upper cover, a support frame, and a first driving part. The support frame has at least... Agent:

20130063883 - Folding keyboard: A folding keyboard has two parts which are hinged together and form the whole keyboard. An interlocking device which comprises a sliding block and a sliding vane is provided at the bottom surface of one part. One end of the sliding block is provided with a raised tongue which fits... Agent: Jiaxing Shunon Electronics Technology Co., Ltd.

20130063884 - Configurable device supports: In embodiments of configurable device supports, a computing device includes a housing structure that supports an integrated display, and the housing structure is configurable in multiple positions to position the display for viewing. The computing device also includes configurable device supports that are integrated with the housing structure to support... Agent: Microsoft Corporation

20130063885 - Shock mounting cover glass in consumer electronic devices: Apparatus, systems and methods for shock mounting glass for an electronic device are disclosed. The glass for the electronic device can provide an outer surface for at least a portion of a housing for the electronic device. In one embodiment, the shock mounting can provide a compliant interface between the... Agent: Apple Inc.

20130063886 - Electronic device using heat dissipation assembly: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air... Agent: Hon Hai Precision Industry Co., Ltd.

20130063887 - Server rack: A server rack includes a rack body and fan modules. The rack body has front and back surfaces. Server units are disposed in the rack body. The fan modules are arranged on the back side along a vertical direction. Each fan module corresponds to several server units and includes a... Agent: Inventec Corporation

20130063888 - Server rack system: A server rack system including a rack is provided. The rack has a front end, a rear end, and a receiving portion. The bottom of the front end has an air inlet. The rear end has an air outlet. The receiving portion is disposed in the rack and is located... Agent: Inventec Corporation

20130063889 - System and method for cooling notebook computer surface: A system and method for cooling the underside surface of a portable computer device having a casing and at least one connector for releasable engagement with a portable computer device. The casing has an upper surface, a lower surface and space therebetween whereby so that the lower surface of the... Agent:

20130063890 - Electronic device: According to one embodiment, an electronic device includes a side wall, an interface component, a partition wall, and a protrusion. The side wall is formed on one of the bottom wall and the top wall of a housing to spatially separate the inside of the housing from the outside. The... Agent: Kabushiki Kaisha Toshiba

20130063891 - Reducing the border area of a device: A circuit panel of an electronic device is disclosed. The circuit panel includes a substantially flat surface including an active area of the electronic device; a bent border area contiguous with and extending from the active area of the substantially flat surface; and a plurality of traces coupled to the... Agent:

20130063892 - Portable electronic device: A portable electronic device comprises a first handheld device and a second handheld device, wherein the first handheld device and the second handheld device can be combined through the connection of a locking unit and a corresponding locking unit and the connection of an electrical-connecting unit and a corresponding electrical-connecting... Agent:

20130063893 - Energy repository discharge system for construction machinery: A discharge system of a stored energy for a construction machine is provided, which includes the energy storage, an electric discharge device discharging energy stored in the energy storage, and an energy cooling portion increasing the heat dissipation capacity of the electric discharge device by cooling heat generated in the... Agent: Volvo Construction Equipment Ab

20130063894 - Server: A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved... Agent: Inventec Corporation

20130063895 - Set-top box having dissipating thermal loads: A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement... Agent: Thomson Licensing

20130063896 - Heatsink apparatus and electronic device having same: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver, provided with a heat-generating body on an external wall, to transfer heat to an internal wall. The heatsink apparatus... Agent: Panasonic Corporation

20130063897 - Modular high-power drive stack cooled with vaporizable dielectric fluid: A high power drive stack system is provided which includes a cabinet having a vaporizable dielectric fluid cooling system and a plurality of receivers for accepting a plurality of modules containing power electronics. The modules are removably attachable to the receivers by at least two non-latching, dry-break connectors. Each of... Agent: Parker-hannifin Corporation

20130063898 - Heat-conducting system between two component parts and method for preparing a heat-conducting system: A heat-conducting system has a heat-generating first component part and a second component part for dissipating the heat of the first component part, the two component parts being situated in operative connection to each other using a heat-conducting medium. The heat-conducting medium includes metal constituents, particularly metal ions, which are... Agent:

20130063899 - Heat dissipating structure of electronic apparatus: Disclosed is a heat dissipation structure of an electronic device that has an IC chip that is a heat generating element mounted on a substrate and a heat dissipation sheet disposed between the IC chip and a cover member so as to dissipate heat. In such a heat dissipation structure,... Agent: Sharp Kabushiki Kaisha

20130063900 - Electrically connecting module: An electrically connecting module suitable for an electronic device is provided. The electronic device includes a chassis disposed in a rack. The rack has an electrically connecting terminal. The electrically connecting module includes a shell, an adjustable position-limiting element, a circuit board and a connector. The adjustable position-limiting element connects... Agent: Inventec Corporation

20130063901 - Electronic device: An electronic device includes a chassis, a main board module and an electrically connecting module. The chassis is slidably disposed in a rack. The rack has an electrically connecting terminal. The main board module is disposed in the chassis. The electrically connecting module includes a circuit board and a first... Agent: Inventec Corporation

20130063903 - Arrangement comprising an electric and/or electronic module and a circuit carrier: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least... Agent: Robert Bosch Gmbh

20130063902 - Power supply control circuit module: A power supply control IC is mounted on a surface of a multilayer body that defines a power supply control circuit module. A first inner-layer electrode connecting an inductor element and a switching regulator element for the power supply control IC, another first inner-layer electrode connecting the inductor element and... Agent: Murata Manufacturing Co., Ltd.

20130063905 - Circuit board sensor and method for producing the same: The invention relates to a circuit board sensor (1) for measuring physical variables, comprising a substrate board (2) and a second board (3) both made of glass, wherein at least the second board (3) is designed such that said board is elastically deformable, wherein the substrate board (2) and the... Agent:

20130063904 - Handheld device: A handheld device includes a body, a back cover and a latch mechanism. The body has a back portion. The back cover coves the back portion. The latch mechanism is disposed between the body and the back portion to lock the back portion to the body. Reliving the lock connection... Agent: Htc Corporation

20130063909 - Arrangement for mounting an electronic display: h

20130063906 - Circuit board assembly and electronic device with circuit board: An electronic device includes a chassis, a circuit board and the resilient piece. The chassis includes a bottom panel. The circuit board has a ground plane. The resilient piece includes a soldering portion and a resisting portion. The soldering portion is in electrical connection with the ground plane, and the... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20130063907 - Electronics apparatus and production method for an electronics apparatus: An electronics apparatus having a housing, an inverting device, a first circuit board connected to the inverting device via at least one line, and a second circuit board connected via a first galvanic connection to the first circuit board and connected via a second galvanic connection to at least component,... Agent:

20130063908 - Portable device: The present invention relates to improving input/output port configuration and structure of the portable device. According to at least one of embodiments of the present invention, a portable device an input/output port having a frame fixed to a PCB to form a space for enabling a plug to be externally... Agent: Lg Electronics Inc.

20130063910 - Card holding mechanism and electronic device: An electronic device includes a housing, and a card holding mechanism for holding an electronic card. The housing defines a through hole, and the card holding mechanism may be inserted into the housing via the through hole. The card holding mechanism includes a tray for receiving the electronic card, an... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130063911 - Electronic apparatus and cylindrical body: An electronic apparatus includes: a first housing including a first circuit board; a second housing including a second circuit board, the second housing being openable and closable using a hinge and the first housing; and a cable configured to couple the first circuit board to the second circuit board, wherein... Agent: Fujitsu Limited

20130063912 - Cof packaging method and structure for lcd driver chips: A COF packaging method and structure for LCD driver chips, the packaging structure comprises a substrate tape and a plurality of COF packaging units arranged consecutively along a direction the substrate tape is moved. Each of the packaging units includes a LCD driver chip, and a first lead and a... Agent:

20130063913 - Power source control circuit module: In a power source control circuit module, switching regulator devices and a linear regulator device are mounted on a surface of a laminated body so as to be spaced from each other. In an interface between dielectric layers of the laminated body, first to fifth internal ground electrodes separated by... Agent: Murata Manufacturing Co., Ltd.

20130063914 - Systems and methods for providing vias through a modular component: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can... Agent: Apple Inc.

20130063915 - Electronic device: An electronic device includes a printed circuit board that a substrate contact part acting as a point of contact with another component is formed on a board surface thereof, a conductive member that has a first contact portion in contact with the substrate contact part, a plate-like extending portion extending... Agent: Fujitsu Limited

20130063916 - Protection for circuit boards: A system has a circuit board, an integrated circuit being mounted on the circuit board by external contacts, and a cover irreversibly connected to the circuit board. The cover covers the external contacts so that external access to the external contacts is prohibited by the cover.... Agent: Infineon Technologies Ag

20130063917 - Printed circuit board including under-fill dam and fabrication method thereof: The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and... Agent: Lg Chem, Ltd.

20130063918 - Low cte interposer: An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of... Agent: Invensas Corp.

20130063919 - Liquid crystal display module and liquid crystal panel: Disclosed is a liquid crystal display module comprising a display panel, and a plurality of panel lands is positioned on the display panel, and lengths of the panel lands extend along a straight direction of wire directions, and the module further comprise a flexible circuit board, and the flexible circuit... Agent: Shenzhen China Star Optoelectronics Technology Co., Ltd.

20130063920 - Electronic device display alignment system: A display alignment system aligns an internal display device with an outer cover glass such that planes defined by both are substantially parallel. A subject electronic device includes an outer housing having a back portion and multiple mounting bosses, a transparent display cover coupled to the outer housing, a display... Agent: Apple Inc.

20130063922 - Portable electronic device sanitizer: A personal electronic device (PED) sanitization device comprises a compartment configured to receive a PED and a sanitization module configured to emit electro-optical (EO) radiation into the interior of the compartment. The compartment may comprise a support member configured to maintain the PED at a particular position and/or orientation. The... Agent: Phonesoap LLC

20130063921 - Semiconductor device: A spring washer sandwiched between flat washers is interposed between a land on one surface of a printed circuit board of a control board part and an attachment plate, and a screw is inserted from the other surface of the printed circuit board through a substrate through hole extending through... Agent: Mitsubishi Electric Corporation

20130063923 - Display device: Disclosed is a display device wherein moving of a display panel in the planar direction is suppressed, while reducing EMI. The liquid crystal display device is provided with the liquid crystal display panel, and a holding member, which holds the end portion of the liquid crystal display panel. The holding... Agent: Sharp Kabushiki Kaisha

20130057988 - Leakage current detector: An apparatus for detecting a leakage current flowing between at least one supply conductor of a multi-conductor electricity supply to load and non load currents carrying electrical conductor nominally insulated from the supply conductor. The apparatus includes a current transformer having a primary winding and a secondary winding. The primary... Agent: Atreus Enterprises Limited

20130057989 - Method for limiting the generator voltage of a photovoltaic installation in case of danger and photovoltaic installation: A protection system configured to couple between a generator that has a number of partial strings and an inverter includes a control device, and a series-connection switching device configured to selectively connect the partial strings together in series. The system also includes a parallel-connection switching device configured to selectively connect... Agent: Sma Solar Technology Ag

20130057990 - Electrical device with miswire protection and automated testing: The present invention is directed to an electrical wiring device that includes a plurality of line terminals configured to be coupled to a source of AC power, a plurality of feed-through load terminals, and at least one set of receptacle load terminals configured to provide the AC power to a... Agent: Pass & Seymour, Inc.

20130057994 - Electronic device and board usable in the electronic device: An electronic device includes an exterior portion of a conductive material, a circuit portion including circuit elements, and a protection circuit portion connected between the exterior portion and the circuit portion. The protection circuit portion includes a switching unit to intercept leakage current that flows from the circuit portion and... Agent: Samsung Electronics Co., Ltd

20130057992 - Esd protection circuit: An ESD protection circuit with leakage current reduction function includes a silicon controlled rectifier, a first CMOS inverter, a first transistor, a current mirror, a PMOS capacitor and a resistor. The first CMOS inverter electrically connects with the silicon controlled rectifier. The first transistor comprises a first end, a second... Agent: National Sun Yat-sen University

20130057993 - Semiconductor integrated circuit and protection circuit: Disclosed herein is a semiconductor integrated circuit including: a clamp MOS transistor having a drain region and a source region connected to a power source wiring and a grounding wiring, respectively, and causing a surge current to flow through a channel path and a bipolar path between the drain region... Agent: Sony Corporation

20130057991 - Silicon controlled rectifier structure with improved junction breakdown and leakage control: Device structures and design structures for a silicon controlled rectifier, as well as methods for fabricating a silicon controlled rectifier. The device structure includes first and second layers of different materials disposed on a top surface of a device region containing first and second p-n junctions of the silicon controlled... Agent: International Business Machines Corporation

20130057995 - Temperature evaluation circuit: An electronic circuit includes a temperature evaluation circuit. The temperature evaluation circuit includes a first sensor circuit with a first output terminal that is configured to sense a first temperature at a first position of the electronic circuit and to generate at the first output terminal a first output current... Agent: Infineon Technologies Austria Ag

20130057996 - Current generating device: Even when a large-current, high-voltage load is applied, damage is prevented. A current generating device (1) supplies a current simulating a current flowing when lightning occurs to a test piece (9) subjected to a lightning resistance test using power supplied from a power supply device (2). The current generating device... Agent:

20130057997 - Potential arc fault detection and suppression: In one implementation, the additional conductor allows the voltage drop across the power conductor to be measured and verified to be small and/or noise-free. In another implementation, the additional conductor is a redundant power conductor connected in parallel with the main power conductor, allowing verification that the current flow in... Agent: Koolbridge Inc.

20130057998 - Systems and methods for switching a relay at zero cross: Circuitry, systems and methods that address the need to coordinate relay switching with another event, such as a zero crossing of an alternating current (AC) voltage waveform are described. In some embodiments, the systems and methods continuously or periodically calibrate the timing of control signals to a relay, such that... Agent: Osram Sylvania Inc.

20130057999 - Low viscosity electrostatic discharge (esd) dissipating adhesive substantially free of agglomerates: A system, in one embodiment, includes an ESD adhesive operatively coupled to leads of an electronic device for providing ESD protection thereto, the ESD adhesive including a mixture of a polymeric thin film and electrically conductive fillers dispersed in the polymeric thin film, and has a structural characteristic of being... Agent: International Business Machines Corporation

20130058000 - System and method for deterring birds and small animals: A system for deterring birds, small animals or the like. The system comprises: a plurality of two-conductor or paired conductor modules or units with some modules being fully insulated and with other modules being partially un-insulated; wherein the birds, small animals or the like complete an electrical circuit with parts... Agent:

20130058001 - Electroadhesive gripping: An electroadhesive gripping device or system includes a plurality of electroadhesive gripping surfaces, each having electrode(s) and each configured to be placed against respective surface regions of a foreign object, such that one or more electroadhesive forces can be provided between the electroadhesive gripping surfaces and the foreign object. Such... Agent:

20130058002 - Package type multi layer thin film capacitor for high capacitance: Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block 110; a pair of clamp members 120 and 130 being installed on one side and another side of the capacitance block 110, respectively; a pair of lead members 140 and 150 being installed... Agent: Samhwa Capacitor Co., Ltd.

20130058003 - Feedthrough assembly including a capacitive filter array: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may... Agent: Medtronic, Inc.

20130058004 - Feedthrough assembly including underfill access channel and electrically insulating material: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and an electrically insulating material disposed between an externally-facing filter array side and an internally-facing feedthrough side.... Agent: Medtronic, Inc.

20130058005 - Package type multi layer thin film capacitor for high capacitance: Provided is a package type multi-layer thin film capacitor for large capacitance, including: a ceramic sintered body formed with slots on one side and another side thereof, respectively; a plurality of first internal electrode layers formed within the ceramic sintered body; a plurality of second internal electrode layers formed within... Agent: Samhwa Capacitor Co., Ltd.

20130058006 - Multilayer ceramic capacitor: There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including lead-out portions exposed to a first surface of the ceramic body and having an overlapping area, the overlapping area being exposed to the first surface of the... Agent: Samsung Electro-mechanics Co., Ltd.

20130058007 - Method for forming a capacitor dielectric and method for manufacturing a capacitor using the capacitor dielectric: A method for forming a capacitor dielectric includes depositing a zirconium oxide layer, performing a post-treatment on the zirconium oxide layer such that the zirconium oxide layer has a tetragonal phase, and depositing a tantalum oxide layer over the zirconium oxide layer such that the tantalum oxide layer has a... Agent: Hynix Semiconductor Inc.

20130058008 - Electrode active material composition and electrochemical capacitor including the same: An electrode active material composition, including: an electrode active material; a ketjen black subjected to hydrophilization treatment; and a water-based solvent, and an electrochemical capacitor including an electrode having a current collector coated with the composition. A hydrophilic group is attached on a surface of the ketjen black conducting powder... Agent: Samsung Electro-mechanics Co., Ltd.

20130058009 - Metal current collector, method for preparing the same, and electrochemical capacitors with same: The present invention relates to a metal current collector including a metal substrate having grooves on a surface thereof, a carbon buffer layer formed on the metal substrate, and a conductive layer formed on the carbon buffer layer, a method for preparing the same, and electrochemical capacitors comprising the same.... Agent: Samsung Electro-mechanics Co., Ltd.

20130058010 - Metal current collector, method for preparing the same, and electrochemical capacitors with same: A metal current collector including a metal substrate having grooves formed along a triple junction line of a surface thereof and a conductive layer formed on the metal substrate, a method for preparing the same, and electrochemical capacitors with same. A metal current collector including a metal substrate having grooves... Agent: Samsung Electro-mechanics Co., Ltd.

20130058011 - Device for distributing high-voltage power for vehicle: Provided is a device for distributing high-voltage power for a vehicle which supplies the main power of the vehicle to the electronic devices mounted in the vehicle. More specifically, a power distribution unit includes a plurality of first interlock connectors that connect distributed power to the electronic devices through cables,... Agent: Hyundai Motor Company

20130058012 - Electrical power and data distribution apparatus: An electrical power and data distribution apparatus comprises an enclosure having a rear connector configured to connect to a first cable including electrical power and data conductors, a front connector configured to connect to a second cable including electrical and data conductors, at least one electrical power outlet configured to... Agent: PotensIPHoldings LLC

20130058013 - Fuse isolation switch: An apparatus includes a housing portion comprising a back panel, side panels, and a front panel, the back panel and side panels partially defining a cavity having an access orifice, the side panels partially defining an entry area to the access orifice, the front panel arranged to at least partially... Agent: General Electric Company

20130058017 - Case for an audio device: A case for holding an audio device includes a cover having two sections that interconnect to encase an audio device. The case also includes a means for electrically connecting the cover to an audio device, and a contact pad mounted on the cover capable of electrically connecting the case with... Agent: Headlogic LLC

20130058023 - Charging docking system: Systems and methods provide power to a device via a dock. A mounting base may include a mounting component, including a receiving area configured to removably receive a mating device at a plurality of orientations within a plane, wherein the mounting component comprises one or more indexing members and the... Agent:

20130058016 - Cover assembly and portable electronic device using same: A cover assembly includes a cover, a grating and a pattern section. The grating is adhered to the cover. And the grating includes a first surface and a second surface opposite to the first surface. The first surface defines a granting surface. The pattern section is adhered on the second... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130058021 - Cradle apparatus: Disclosed herein is a cradle apparatus including: a cradle housing; a tray provided on the cradle housing and configured to receive an electronic apparatus placed thereon; a connector supporting portion provided for tilting motion on the tray; a connector supported on the connector supporting portion and configured to be electrically... Agent: Sony Corporation

20130058015 - Display device: A display device for enlarging or extending a view of a handheld electronic device includes a body, a displaying unit, a second transmitting unit, a carrying unit, and a fixing unit. The fixing unit fixes the handheld electronic device to the carrying unit regardless of the dimensions of the handheld... Agent: Askey Technology (jiangsu) Ltd.

20130058020 - Display device: Disclosed is a display device. The display device includes an upper substrate; a lower substrate having gate and data lines, with exposing a part of the lower surface of the upper substrate; a sealant for adhering the upper substrate to the lower substrate; a panel driver connected to the part... Agent:

20130058025 - Display device and manufacturing method thereof: According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening member. The circuit substrate includes a first side and a second side adjacent to the first side, and overlaps a second face of the display. The... Agent: Kabushiki Kaisha Toshiba

20130058022 - Dock for portable electronic devices: This document generally describes docking stations for portable computing devices with one or more of a variety of features, such as a near horizontal tray into which a portable computing device can be placed (e.g., a tray with an angle between 5-25 degrees from horizontal), embedded microphones and/or speakers, and/or... Agent:

20130058024 - Formed article, method for producing the same, electronic device member, and electronic device: Provided is a formed article comprising at least a gas barrier layer, the gas barrier layer being formed of a material that includes silicon atoms, oxygen atoms, and carbon atoms, a carbon atom content, a silicon atom content, and an oxygen atom content in a surface layer part of the... Agent: Lintec Corporation

20130058014 - Instrument panel assembly: A multimedia assembly and an instrument panel assembly for use in an automotive vehicle are provided. The multimedia assembly includes a multimedia device and an auxiliary device. The multimedia device has a faceplate which is disposed on the outer surface of the instrument panel so as to be exposed to... Agent: Toyota Motor Engineering & Manufacturing North America, Inc.

20130058019 - Mobile terminal and method for providing user interface thereof: The present disclosure relates to a mobile terminal capable of displaying a plurality of objects on a wallpaper, and a method for providing a user interface thereof. The mobile terminal includes a display unit to display a plurality of objects on a wallpaper, a sensing unit to detect a touch... Agent: Lg Electronics Inc.

20130058018 - Mobile terminal with waterproof sheet and manufacturing method: A mobile terminal has a waterproof sheet interposed between a first body portion and a second body portion. The waterproof sheet is formed with a curved shaped or step-like cross-section in consideration of characteristic of internal component or a battery arranged on the first body portion of the mobile terminal,... Agent: Pantech Co., Ltd.

20130058026 - Expansion device: An expansion device is disclosed which includes an input/output body, a connection part, a turning structure, and at least one slot. The input/output body at least includes a first and a second input/output module, where the first and the second input/output modules are respectively disposed on two opposite surfaces of... Agent: Inventec Appliances Corp.

20130058027 - Foldable electronic device: A foldable electronic device includes a first body and a second body, in which the second body is pivoted to the first body. The second body includes a display cover, a display module, at least one battery module and a pivot mechanism. The display cover has a display region and... Agent: Compal Electronics, Inc.

20130058029 - Modular data center: A data center is disclosed that includes a container; a server; a rack installed within the container and storing the server; and a curtain fixed to at least one point of the rack or the container and separating an internal space of the container between a cold side and a... Agent:

20130058028 - Server rack and power transmission assembly thereof: A server rack configured for a plurality of servers is disclosed, in which each of the servers has a power supply circuit board. The server rack includes: a case having a first face and a second face opposed to each other, the first face having an opening for the servers... Agent: Giga-byte Technology Co., Ltd.

20130058030 - External disk storage solution: A data storage solution for a computer having a computer stand or a computer display having an opening therein, comprising an external data storage medium and structure to mount the external data storage medium to the rear of the computer stand or computer display.... Agent:

20130058032 - Portable data storage devices and hosts compliant with multiple communications standards: Portable data storage devices can be provided that can include a substrate having a front surface on which a memory chip is mounted, first pads disposed on a back surface of the substrate opposite to the front surface, second pads disposed on the back surface of the substrate to be... Agent: Samsung Electronics Co., Ltd.

20130058031 - Presence detectable baffle for electrical components in a computing system: A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component.... Agent: International Business Machines Corporation

20130058033 - Retention device for data storage module: A retention device includes a holder and an extractable casing mounted to the holder. The retention device includes a base, a cover opposite to the base, and a lateral plate extending from the base and interconnecting the base and the cover. The base, the side plates, and the cover cooperatively... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130058034 - Disk unit and disk array apparatus: The disk unit comprises a hard disk drive comprising a drive mechanism which rotates and drives a plurality of disk media, an arm rotatably supported on a pivot and placed as movable in the rotation area of the disk media, and an actuator which performs positioning control of the magnetic... Agent: Hitachi, Ltd.

20130058035 - Electronic device enclosure with bracket for data storage device: An enclosure includes a chassis and a bracket. The chassis comprises a rear panel with a latch hole. The bracket comprises a first sidewall. A resilient piece and a sustaining piece are located on the first sidewall. The resilient piece is elastically deformable as the bracket is rotated relative to... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20130058036 - Adjustable docking apparatus: The present solution provides an adjustable docking apparatus configurable to accommodate a variety of mobile electronic devices. The adjustable docking apparatus is removably coupled to a base electronic device. The apparatus further includes an electrical connector movably and removably connected to the adjustable docking apparatus and electrically coupleable to the... Agent: Sdi Technologies, Inc.

20130058037 - Presence detectable baffle for electrical components in a computing system: A presence detectable baffle for electrical components in a computing system, including: a passive chassis having a form factor is consistent with an electrical component of the computing system; and a presence detectable pin set connected to the passive chassis, the pin set consistent with the electrical component.... Agent: International Business Machines Corporation

20130058038 - Thermal interposer liquid cooling system: A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact... Agent: Asetek A/s

20130058039 - Portable terminal with a cooling structure: A portable terminal includes a cooling structure configured to allow air flow into the portable terminal. A display support frame encompasses an opening and is arranged between the display and the main board including heat generating components of the portable terminal. The display support frame support's the display and a... Agent: Pantech Co., Ltd.

20130058040 - Communication apparatus and air-cooling method for the same: A communication apparatus and an air-cooling method for the same utilizes an air-cooling mode that can be easily changed to reduce the cost to increase the number of transceiver units and space for the housing. The communication apparatus includes transceiver units installed in a housing and attachable onto and detachable... Agent: Nec Corporation

20130058041 - Semiconductor module and cooler: A semiconductor module and a cooler capable of cooling a semiconductor element efficiently. The semiconductor module supplies a refrigerant to a water jacket configuring the cooler, to cool a circuit element part disposed on an outer surface of a fin base. This semiconductor module has: a fin connected thermally to... Agent: Fuji Electric Co., Ltd.

20130058042 - Laminated heat sinks: An apparatus includes a heat sink with a complex 3D structure. The heat sink includes a stack of metal layers. The metal layers are mechanically connected together and being separated by physical interface regions. The stack has array of channels for carrying fluid through the stack. Each channel of the... Agent:

20130058043 - Heat sink with a stack of metal layers having channels therein: An apparatus, comprising a heat sink located on a surface of an electronic device, the heat sink including a plurality of metal layers wherein: at least one exterior edge of the metal layers faces the surface, the metal layers form a stack running along the surface, and the metal layers... Agent: Alcatel-lucent, Usa Inc.

20130058044 - Electronic control device: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged... Agent: Hitachi Automotive Systems, Ltd.

20130058045 - Heatsink with substance embedded to suppress electromagnetic interference: A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A... Agent: International Business Machines Corporation

20130058046 - Printed circuit board assembly and manufacturing method thereof: A printed circuit board assembly and a manufacturing method thereof are provided. The method includes mounting an electrical component on a printed circuit board; depositing a curable gel on the electrical component by discharging the curable gel through a nozzle; and hardening the curable gel deposited on the electrical component... Agent: Samsung Electronics Co., Ltd.

20130058047 - Bezel assembly for electronic device: A bezel assembly includes a panel, a shielding member, and a securing member. The panel includes a main body. The main body includes a receiving portion and defines a through hole. The shielding member includes a mounting portion. The securing member includes a resilient arm abutting the receiving portion. The... Agent: Hon Hai Precision Industry Co., Ltd.

20130058048 - Electronic device having slide-tilt operation: An electronic device includes a first body and a second body that may be disposed in a first position in which the second body overlaps the first body, a second position in which the second body is slid from the first body, and a third position in which the second... Agent: Samsung Electronics Co., Ltd

20130058049 - Package systems including passive electrical components: A package system includes at least one active circuitry disposed over a substrate. A passivation structure is disposed over the at least one active circuitry. The passivation structure has at least one opening that is configured to expose at least one first electrical pad. At least one passive electrical component... Agent: Taiwan Semiconducotr Manufacturing Company, Ltd.

20130058050 - Slot and memory module for a slot standing interconnect: According to exemplary embodiments, a controlled-depth slot extending into a circuit board is provided. The controlled depth slot may be milled, and may comprise ½ radial plated through-holes to generate a solderable “D” interconnect feature. The slot may include interconnect features on one to five sides. According to another exemplary... Agent: Mercury Computer Systems, Inc.

20130058051 - Electrical box safety redesign: An electrical control system for fixtures, devices and appliances that safety isolates a power source using the features of the safety block, and consolidates multiple control points to remotely activate a combination of fixtures, devices and appliances using the features of the control module, thereby promoting safety and facilitating energy... Agent:

20130058052 - Tamper respondent module: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover... Agent: Dy 4 Systems Inc.

20130058054 - Fixing apparatus for expansion card: An apparatus for fixing an expansion card includes a circuit board, a fixing device, and a latching device. The expansion card includes a protrusion formed on a first end of the expansion card, and a positioning hole defined adjacent to a second end of the expansion card away from the... Agent: Hong Fu Jin Precision Industry(shenzhen) Co., Ltd.

20130058053 - Power conversion circuit and circuit board: An exemplary power conversion circuit is to convert a voltage from one voltage level to another. The circuit includes an input port, an output port, a main body circuit, a first solder bridge, and a second solder bridge. The input port of the power conversion circuit is an output port... Agent: Hon Hai Precision Industry Co., Ltd.

20130058055 - Substrate with built-in component: A substrate with a built-in component is constructed such that a resin reliably goes around a clearance provided in a lower portion of the component and is thus filled in without expansion of a clearance in a height direction when various components such as an LW reversal type chip component... Agent: Murata Manufacturing Co., Ltd.

20130058056 - Connecting module and mechanism using the same: A connecting module, disposed at a casing having a through hole, includes a door, a connecting port and an elastic member. The door is rotatably coupled to the casing so as to be located at a first position to cover the through hole or at a second position to open... Agent: Wistron Corporation

20130058057 - Terminal unit: The terminal unit includes a main board, electronic components implemented on the main board, a sub-board covering above the electronic components and a frame member so disposed between the main board and the sub-board as to surround the electronic components. A flexible printed circuit covers an outer side of a... Agent: Panasonic Corporation

20130058058 - Usb plug and usb modem: A USB plug includes: a USB terminal; a PCB connected to one end of the USB terminal; a cable connected to the PCB; a hinge coupling member including first and second through-holes allowing the cable to pass through; and a connection terminal disposed at the end of the cable extending... Agent: Pantech Co., Ltd.

20130058059 - Electromagnetic wave shielding case: Disclosed is an electromagnetic wave shielding case. More particularly, an electromagnetic wave shielding case for a circuit board provided with a connector includes an upper case configured to cover an upper portion of the circuit board, and a lower case configured to form an internal space when the upper case... Agent: Kia Motors Corporation

20130058060 - Control panel assembly and laundry treating apparatus having the same: A control panel assembly and a laundry treating apparatus having the same, the control panel assembly including a control panel, a Printed Circuit Board (PCB) provided at a rear side of the control panel, and a PCB housing configured to fix the PCB to the control panel, wherein the PCB... Agent: Samsung Electronics Co., Ltd.

20130058061 - Electronic component and method for producing same: This electronic component is provided with an inorganic substrate, a conductor film formed on a surface of the substrate, and bonding wires bonded to a part of said conductor film, and wire bonding sections are formed on at least a part of the electronic component. The part of the conductor... Agent: Tdk Corporation

20130058062 - Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor device: A method for manufacturing a base material having a gold-plated metal fine pattern is disclosed, comprising the steps of preparing a base material having a supporting surface made of a resin; forming a primer resin layer having surface roughness of 0.5 μm or less on the supporting surface, and forming... Agent: Sumitomo Bakelite Co., Ltd.

20130058065 - Docking station for television receiver, stand, and electronic device: According to one embodiment, a docking station for a television receiver includes a support, a first connector, and a protruding portion. The support is configured to be attachably and detachably connected to a television receiver comprising a housing in which a display device is housed, and to support the housing.... Agent: Kabushiki Kaisha Toshiba

20130058066 - Electronic device: An electronic device comprises two printer sections which are arranged in parallel and include a paper storage section and print onto a recording paper hold in the paper storage section and two display sections which are arranged at the position where the transfer of the recording paper into and from... Agent: Toshiba Tec Kabushiki Kaisha

20130058064 - Electronic device with cleaning mechanism capable of cleaning display panel thereof: An electronic device with a cleaning mechanism that is capable of cleaning a display panel thereof is provided. The electronic device includes a display panel, a main portion, a hinge structure, a sliding device, and a first spring. The hinge structure includes a fixing portion, a rotating portion having a... Agent:

20130058063 - Expandable mobile device: In embodiments of an expandable mobile device, the device includes first and second housing parts that slide-engage relative to each other to extend and retract the device. The expandable mobile device includes a flexible display that extends from an interior of the expandable mobile device as the second housing part... Agent: Microsoft Corporation

20130058068 - Power converter permitted to be reduced in size and manufactured at decreased cost: A power converter equipped with a semiconductor stack made up of semiconductor modules, bus bars coupled to power terminals of the semiconductor modules, a capacitor, and an input terminal table. The capacitor is disposed in alignment with a first direction in which the semiconductor modules are stacked. The capacitor has... Agent: Denso Corporation

20130058067 - System with a high power chip and a low power chip having low interconnect parasitics: An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form... Agent:

20130058069 - Flat cable and cable harness using the same: A flat cable includes a plurality of wires arranged in parallel, and a fibrous member woven into the plurality of wires in the arrangement direction of the plurality of wires. The fibrous member includes a polyurethane elastic fiber, and has an elongation of not less than 500% and not more... Agent: Hitachi Cable Fine-tech, Ltd.

20130058070 - Transformer chamber for a wind turbine, wind turbine structure component, wind turbine, and method for assembling a wind turbine: A transformer chamber for a wind turbine is described. The transformer chamber includes a liquid-tight tank for receiving a liquid-filled, in particular oil-filled, transformer, a wind turbine structure component includes a component bedframe adapted for receiving such a transformer chamber and a wind turbine includes such a transformer chamber and... Agent: