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Electricity: electrical systems and devices December patent applications/inventions, industry category 12/11

20110317315 - Driving device for semiconductor element: A driving device for driving a semiconductor element can include a plurality of protection circuits that detect information necessary for performing protection operation for semiconductor elements that include a power conversion apparatus, a pulse signal generation circuit that sets a pulse sequence signal with a pulse width differently for each... Agent: Fuji Electric Co., Ltd.

20110317314 - Short circuit protection circuit, short circuit protection method and power supply device thereof: A short circuit protection circuit for a power supply device includes a driving transistor, for controlling to output an input voltage to a load according to a first control voltage; a shutdown transistor, coupled with the driving transistor, for controlling a level of the first control voltage according to a... Agent:

20110317318 - Circuit elements comprising ferroic materials: Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various embodiments. A ferroic circuit element may be at least partially... Agent:

20110317319 - Electrostatic discharge protection circuit: An ESD (Electrostatic Discharge, ESD) protection circuit includes a voltage-divider generating circuit, a decision circuit, and a switching circuit. The voltage-divider generating circuit outputs a first voltage and a second voltage according to an input voltage. The decision circuit is coupled to the voltage-divider generating circuit and receives the first... Agent:

20110317317 - Method and device for delaying activation timing of output device: A delay method for determining an activation time of an output device in a circuit system is disclosed. The delay method includes determining resistance of an over-current flag pull-high resistor of the circuit system, generating a current according to the resistance of the over-current flag pull-high resistor and a voltage... Agent:

20110317316 - Method, apparatus, and system for protecting supply nodes from electrostatic discharge: Described herein are a method, apparatus, and system for electrostatic discharge protection of supplies. The apparatus comprises a timer unit having a node with a first supply signal and operable to generate a first timer signal based on the first supply signal; and a clamp unit, coupled to the timer... Agent:

20110317320 - Controller, controlling method, and solar cell: Disclosed is a controller for controlling short-circuit across positive and negative terminals of a dye sensitized solar cell for converting a light energy into an electrical energy. The controller includes: a voltage detecting section detecting a voltage developed across the positive and negative terminals of the cell; a current detecting... Agent: Sony Corporation

20110317321 - Short circuit protection device and switchgear assembly having such protection devices: A short-circuit protection device for limiting, preferably also deactivating, short-circuit currents in high energy direct current networks, in particular short-circuit currents of battery systems in submarine direct current networks. The device includes an electrical resistor, in particular an ohmic resistor, to conduct and limit the short-circuit current in the case... Agent: Siemens Aktiengesellschaft

20110317322 - Control circuit with protection circuit for power supply: A control circuit with protection circuit for power supply according to the present invention comprises a peak-detection circuit and a protection circuit. The peak-detection circuit detects an AC input voltage and generates a peak-detection signal. The protection circuit comprises an over-voltage protection circuit. The over-voltage protection circuit generates an over-voltage... Agent: System General Corp.

20110317323 - Control circuit and electronic device using the same: An electronic device connected to an external storage device and stores data transmitted from the storage device, the electronic device comprising a power supply, a control circuit and a storage unit. The power supply supplies a voltage to the storage unit via the control circuit. The control circuit generates a... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110317324 - Solar module with overheat protection: A photovoltaic module (10) with a plurality of solar cells (20) interconnected in serial and/or parallel arrangement within the module (10) is equipped with an overheat protection system (30) for suppressing damages of the photovoltaic module (10) due to defects of the solar cells (20). The overheat protection system (30)... Agent: International Business Machines Corporation

20110317325 - Electrodes to improve reliability of nanoelectromechanical systems: The present invention provides for replacement of conventionally-used metal electrodes in NEMS devices with electrodes that include non-metallic materials comprised of diamond-like carbon or a dielectric coated metallic film having greater electrical contact resistance and lower adhesion with a contacting nanostructure. This reduces Joule heating and stiction, improving device reliability.... Agent: Northwestern University

20110317326 - Discharge gap filling composition and electrostatic discharge protector: A discharge gap filling composition for an electrostatic discharge protector. The composition contains oxide film coated metal particles (A), a layered substance (B) and a binder component (C). Also disclosed is an electrostatic discharge protector including a discharge gap and a discharge gap filling material containing the discharge gap filling... Agent: Showa Denlo K.k.

20110317327 - Multi-layered ceramic capacitor: There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic body part in which cover layers are provided on both surfaces thereof as an outermost layer... Agent: Samsung Electro-mechanics Co., Ltd.

20110317328 - Ceramic electronic component and method for manufacturing the same: An array-type ceramic electronic component C1 includes a ceramic body 1 in which internal electrodes are buried and a plurality of terminal electrodes 11 to 16 formed on the ceramic body 1. The terminal electrodes 11 to 16 have electrode layers formed by baking a conductive green sheet.... Agent: Tdk Corporation

20110317329 - Capacitor and method of making same: A capacitor having a dielectric consisting of a glass layer with an alkali metal oxide content of at most 2 wt % and a thickness of at most 50 μm is provided. The capacitor includes at least two metal layers which are separated by the glass layer. The glass layer... Agent:

20110317331 - Electrochemical capacitor: The present invention provides an electrochemical capacitor, which includes: a cell electrode unit which includes cathodes, anodes, and separators interposed between the cathodes and the anodes which are alternately stacked in multiple layers; cathode terminals which are extended to one side of each of the cathodes and are stacked one... Agent: Samsung Electro-mechanics Co., Ltd.

20110317330 - Electrolyte solution composition and energy storage device with the same: Disclosed is an electrolyte solution composition including: a lithium salt including lithium ions; a non-lithium salt for reducing an amount of the lithium salt to be hydrolyzed; and a solvent for dissolving the lithium salt and the non-lithium salt.... Agent: Samsung Electro-mechanics Co., Ltd.

20110317332 - Super-capacitor electrode: A super-capacitor electrode is provided, which comprises a metal foil as a current collector, an active material, a conductive agent, and an organic adhesive agent. The metal foil is an uncorroded smooth metal foil. The super-capacitor electrode further comprises a silane coupling agent for binding the organic adhesive agent and... Agent:

20110317333 - Electrical energy storage device: Provided is an electrical energy storage device including an electrode winding body, which includes a positive electrode generating electrons by oxidation and reduction, a negative electrode for absorbing the generated electrons, and separation layers for physically separating the negative electrode from the positive electrode, which are sequentially wound around a... Agent: Nesscap Co., Ltd.

20110317335 - Solid electrolytic capacitor containing an improved manganese oxide electrolyte: A solid electrolytic capacitor that contains an anode body formed from an electrically conductive powder and a dielectric coating located over and/or within the anode body is provided. The powder has a high specific charge and in turn a relative dense packing configuration. Despite being formed from such a powder,... Agent: Avx Corporation

20110317334 - Solid electrolytic capacitor for use in high voltage applications: A solid electrolytic capacitor that contains an anode body formed from an electrically conductive powder and a dielectric coating located over and/or within the anode body is provided. The present inventors have discovered a technique that is believed to substantially improve the uniformity and consistency of the manganese oxide layer.... Agent: Avx Corporation

20110317336 - High voltage niobium oxides and capacitors containing same: Nb1-xTaxO powder wherein x is 0.1 to 0.5 is described. Further, this powder, as well as niobium suboxide powders, can be doped with at least one dopant oxide. Pressed bodies of the powder, sintered bodies, capacitor anodes, and capacitors are also described.... Agent: Cabot Corporation

20110317337 - Connection arrangement for a rack housing and rack housing: A connection arrangement for a rack housing with a plurality of load zones includes at least one internal connection device each having at least one phase conductor and one neutral conductor for each of the plurality of load zones, and a distributor device that electrically couples the internal connection devices... Agent: Fujitsu Technology Solutions Intellectual Property Gmbh

20110317350 - Device for eliminating standby power consumption of electronic appliance having infrared remote control switch capability: A device for eliminating standby power consumption of an electronic appliance having infrared remote control switch capability is provided, which includes: a control unit; an infrared remote control signal receiving unit connected thereto; an infrared remote control signal transmitting unit, connected to the control unit; a controlled electronic appliance power... Agent:

20110317344 - Display device, assembly method for the display device, assembly structure of two frames and assembly method for the assembly structure of two frames: A display device includes a first frame, a second frame, a backlight module and a display panel. The first frame has two plates separated with each other. Each plate includes a first bottom and a first side wall connected with the first bottom, wherein a first joint part is disposed... Agent: Au Optronics (suzhou) Corp., Ltd.

20110317347 - Handheld electronic device and operating method thereof: A handheld electronic device and an operating method thereof are provided. The handheld electronic device includes a first body, a second body, and a moving assembly. The moving assembly includes a sliding module and at least one rotating module. The sliding module is coupled to the second body, wherein the... Agent: Htc Corporation

20110317345 - Handle module and electronic device having the handle module: A handle module mounted in a case of an electronic device and including a handle-link assembly and a slide mechanism. The handle-link assembly includes a handle body having a gripping section and a first pivot connection portion formed thereon, and a slide link having a link body unit and a... Agent: Wistron Corporation

20110317338 - Hinge and an electronic device with the same: A hinge is mounted between a cover and a body of an electronic device and has an eccentric sleeve and a resisting assembly abutting against each other. When the cover is pivoted, the eccentric sleeve is rotated as well. Because the eccentric sleeve has sectors with varied radius, the resisting... Agent: Shin Zu Shing Co., Ltd.

20110317341 - Method for attaching a hand held electronic device to a soft object and coupling therefor: A coupling for attaching a hand held electronic device to a soft object includes a first connector for removable attaching the coupling to the hand held electronic device, and an opposite second connector for removably attaching the coupling to the soft object. In an embodiment the first connector is rotatable... Agent:

20110317343 - Mobile terminal case, mobile terminal having the same and method for manufacturing mobile terminal: Disclosed is a mobile terminal case, a mobile terminal having the same, and a method of manufacturing a mobile terminal case, and the mobile terminal may include a case forming an external shape with a curved surface, and a film member mounted on the case, wherein the film member may... Agent: Lg Electronics Inc.

20110317342 - Mounting apparatus for expansion card: A mounting apparatus includes a mounting bracket and a securing element. The mounting bracket is configured to mount an expansion card. The mounting bracket is mounted in a chassis. The securing element includes a positioning member mounted to the mounting bracket, a mounting member mounted in the positioning member, and... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110317349 - Portable terminal: A portable terminal is provided where the portable terminal has an upper body including an upper surface and a lower surface, a lower body having an upper surface, the upper body being slidably connected to the lower body for movement between a closed position and an open position to expose... Agent:

20110317339 - Protective cover and portable electronic device using the same: A protective cover used to install an electronic unit and a peripheral keyboard, includes a base, a first latching structure and a second latching structure, the base includes a first main section, a second main section and a bendable connecting section connecting the first main section to the second main... Agent: Fih (hong Kong) Limited

20110317340 - Selective nitriding on a 3d surface: Forming a 3D topology by forming a monolayer of nano-particles on a stainless steel surface, masking the stainless steel surface forming at least one unmasked regions, the unmasked region having an average density of nano-particles less than a critical average density, and introducing a plurality of exogenous atoms into the... Agent: Apple Inc.

20110317346 - Totally-enclosed integrative access system and power consumption reduction method thereof: The present invention provides a totally-enclosed integrative access system, the system adopts a die-cast case that consists of an upper cover and a lower cover, the joint face between the upper cover and the lower cover is sealed, and the peripheries of the upper cover and the lower cover are... Agent: Zte Corporation

20110317348 - Wall-mountable media converter: In one embodiment, a media converter comprises a power interface that extracts power from a communication medium coupled to the media converter for powering the media converter. In another embodiment, a connector comprises a first media attachment interface to physically attach a first communication medium to the connector and a... Agent: Adc Telecommunications, Inc.

20110317352 - Operating device for operating automation technology machinery: An operating device for operating automation technology machinery includes a transparent electrically non-conducting panel having an outer side and an inner side facing the interior of the operating device, and a membrane keyboard arranged on the outer side of the panel. The panel also includes channels extending through the panel... Agent: Siemens Aktiengesellschaft

20110317354 - External extension for holding a portable computer and computer system therewith: An external extension for holding a portable computer includes a base, a keyboard module disposed on a first area of the base, a pin set disposed on a third area of the base and electrically connected to the keyboard module, and a protecting cover disposed on the first area in... Agent:

20110317353 - Keyboard module: A keyboard module is disclosed, which comprises: a keyboard; a first connecting cable; a second connecting cable; and a switch unit; wherein, the first connecting cable is arranged extending out from the keyboard and is connected to a connector of the switch unit, while the second connecting cable is also... Agent: Inventec Corporation

20110317355 - memory device having wireless recognition function and a portable electronic apparatus integrating the same: A memory device having wireless recognition function provided inside a portable electronic apparatus includes a semiconductor package having a substrate, a semiconductor chip disposed on the substrate, an antenna disposed on the substrate and electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip; and a magnetic... Agent:

20110317356 - Memory system, memory module, and module socket: The present invention is adapted to a memory system that includes: a motherboard and a module board, wherein: the motherboard comprises a module socket mounted on the motherboard; and a plurality of pins two-dimensionally arranged on the module socket, and vertically erected with respect to the motherboard: and the module... Agent: Elpida Memory, Inc.

20110317351 - Server drawer: A server Input/Output (I/O) drawer for holding one or more communication cards and one or more I/O cards includes an outer housing, a back plane within the outer housing that divides the drawer into a front portion and back portion, the back plane including a front side and a backside... Agent: International Business Machines Corporation

20110317357 - Cooling system for information device: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers earch... Agent: Fujitsu Limited

20110317358 - Structural improvement of screwless fixing component: This invention provides a structural improvement for screwless fixing component that contains a positioning board installed in the long hole of side rack of host computer; a sliding base slotting through a positioning board, the sliding base includes bottom base and locking section; the symmetrical locking section is installed on... Agent:

20110317359 - Fan duct for electronic components of electronic device: A fan duct includes a top plate, two side plates extending downward from opposite sides of the top plate, and plural guiding plates extending downward from the top plate. The side plates and the top plates cooperatively define an air inlet and an air outlet. The air inlet and the... Agent: Hon Hai Precision Industry Co., Ltd.

20110317360 - Cooling structure for housing device: With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from... Agent: Fujitsu Limited

20110317361 - Mobile measurement device: A mobile measurement device, particularly for temporary use in or on vehicles, on stationary engines, or on test benches, consists of individual components (2) that might have different working temperatures, disposed in a common housing (1). Furthermore, at least one fan (6) is provided. In order to allow a very... Agent: Avl List Gmbh

20110317362 - Enclosure of electronic apparatus: An enclosure of an electronic apparatus, includes a chassis and a fan bracket assembly. The fan bracket assembly is mounted in the chassis. The fan bracket assembly includes a first fan bracket with a first fan mounted therein and a second fan bracket with a second fan mounted therein. The... Agent: Hon Hai Precision Industry Co., Ltd.

20110317363 - Enclosure of electronic device: An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110317364 - System and method for cooling an electronic device: An exemplary embodiment of the present invention provides a system for cooling an electronic device. The system includes a plenum disposed adjacent to an interior surface of a housing for the electronic device, wherein the plenum is placed between a heat generating component and the interior surface of the housing,... Agent:

20110317366 - Fixing structure and fixing method of circuit board with embedded electronic parts to cooler: In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base material includes embedding portions in which the... Agent: Denso Corporation

20110317365 - Liquid cooling system and electronic device incorporating the same: A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110317367 - Liquid-cooled electronics rack with immersion-cooled electronic subsystems: Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for... Agent: International Business Machines Corporation

20110317368 - Heat sinks with c-shaped manifolds and millichannel cooling: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid, and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines a tapered inlet distribution chamber configured... Agent: General Electric Company

20110317369 - Heat sinks with millichannel cooling: A heat sink for cooling at least one electronic device package includes a lower lid, an upper lid and a body formed of at least one thermally conductive material. The body is disposed between and sealed to the lower and upper lids and defines inlet manifolds configured to receive a... Agent: General Electric Company

20110317370 - electronic component mounted on a capacitor electrode: One example includes a capacitor case sealed to retain electrolyte, electrolyte disposed in the capacitor case, a capacitor electrode disposed in the capacitor case, an electronic component mounted to the capacitor electrode and disposed in the capacitor case, the electronic component including two contacts, with a first contact mounted onto... Agent:

20110317371 - Electronic component package and fabrication method thereof: An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic component package module is mounted on a surface of a packaging... Agent:

20110317372 - Semiconductor device: A device includes: a wiring board having first and second surfaces opposing each other; and a plurality of memory packages on the first surface. The wiring board includes: a first set of terminals on the first surface; a plurality of second sets of terminals on the first surface; and a... Agent: Elpida Memory, Inc.

20110317373 - Method and apparatus for interconnecting circuit boards: A method and apparatus are provided for the interconnection of multiple circuit boards within a device. A module is provided which comprises multiple circuit boards interconnected with a plurality of connectors. Modules may be interconnected to other modules using the same connectors. Circuit components are disposed on inner surfaces of... Agent:

20110317374 - Modular electrical card for power components: The electrical card has power modules constituted by power components and by control components that are carried by strips fastened on a support plate comprising an electrical ground plate. The power components are connected firstly to control buses, and secondly to power buses carried by the support plate and extending... Agent:

20110317375 - Alignment pin for retaining a module on a circuit board: An alignment pin is provided. The alignment pin includes an alignment member that is configured to extend from a surface of a circuit board. The alignment member has a flange that engages an electronic module. The flange aligns and retains the electronic module on the circuit board. A coupling member... Agent: Tyco Electronics Corporation

20110317377 - Apparatus: An apparatus includes: a circuit board which is disposed in a main unit of the apparatus; a shielding conductor which is placed outside the circuit board as viewed from the apparatus main unit; a covering member which covers an outer side face of the apparatus main unit; and an electrically... Agent:

20110317378 - Electronic device: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction... Agent:

20110317376 - Mounting device for printed circuit board: A mounting device for a printed circuit board includes a supporting board, a connecting piece and a mounting member. The supporting board includes non-metallic material. The connecting piece is configured to secures the supporting board to a chassis. The connecting piece has a connecting claw penetrating into the supporting board.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110317379 - Electronic device: An electronic device includes a chassis, a motherboard installed in the chassis, a fixing member, and a flexible printed circuit board electronically coupled to the motherboard. The chassis forms two hooks adjacent to the motherboard. The fixing member includes a plate resisting against the flexible printed circuit board, and two... Agent: Hon Hai Precision Industry Co., Ltd.

20110317380 - Printed circuit board and voltage/current measuring method using the same: A PCB includes an outer layer and an inner layer. An electronic component is mounted on the outer layer. The outer layer further defines a first pad, a second pad, a third pad, a fourth pad, and a number of via holes. The electrical performances of the first pad and... Agent: Hon Hai Precision Industry Co., Ltd.

20110317381 - Embedded chip-on-chip package and package-on-package comprising same: An embedded chip-on-chip package comprises a printed circuit board having a recessed semiconductor chip mounting unit, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit, and a second semiconductor chip mounted on the first semiconductor chip and the printed circuit board.... Agent: Samsung Electronics Co., Ltd.

20110317382 - Insulating resin composition and printed circuit substrate using the same: Disclosed herein are an insulating resin composition soluble fluorine-based resin, thermosetting resin; a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin, and a printed circuit substrate using the same.... Agent: Samsung Electro-mechanics Co., Ltd.

20110317383 - Mold compounds in improved embedded-die coreless substrates, and processes of forming same: An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral... Agent:

20110317384 - Printed board and semiconductor integrated circuit: An IC which includes a first circuit and a plurality of first paired terminals each including a first power supply terminal and a first GND terminal which are connected to the first circuit, and a second circuit and a plurality of second paired terminals each including a second power supply... Agent: Canon Kabushiki Kaisha

20110317385 - Wafer level package (wlp) device having bump assemblies including a barrier metal: WLP semiconductor devices include bump assemblies that have a barrier layer for inhibiting electromigration within the bump assemblies. In an implementation, the bump assemblies include copper posts formed on the integrated circuit chips of the WLP devices. Barrier layers formed of a metal such as nickel (Ni) are provided on... Agent: Maxim Integrated Products, Inc.

20110317386 - Connecting structure, circuit device and electronic apparatus: To provide a connecting structure which can effectively suppress the generation of a crack and an exfoliation of a terminal. The connecting structure includes a frame 31 which includes a first connection surface 31A to be connected to a connector board 20, a second connection surface 31B to be connected... Agent: Panasonic Corporation

20110317387 - Integrated voltage regulator with embedded passive device(s) for a stacked ic: A stacked integrated circuit includes a first tier IC and a second tier IC. Active faces of the first tier IC and the second tier IC face each other. An interconnect structure, such as microbumps, couples the first tier IC to the second tier IC. An active portion of a... Agent: Qualcomm Incorporated

20110317388 - Electronic device having a wiring substrate: A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side.... Agent: Nec Corporation

20110317389 - Sealed electronic control device and method of fabricating the same: Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate... Agent: Mitsubishi Electric Corporation

20110317390 - Electronics housing for an electronic device, and a device formed therewith: An electronics housing comprises a housing basic body having a cavity, especially a single cavity. The housing basic body includes a side wall laterally bordering the cavity, an open end and a rear wall bounding the cavity on an end lying opposite the open end and remote therefrom. Also included... Agent: Endress + Hauser Flowtec Ag

20110317391 - Building block: A building block includes a body. The external surfaces of the body are respectively formed with at least one active side and at least one passive side. The active side is formed with an active positive and an active negative that are magnetic. The passive side is formed with a... Agent:

20110317392 - Ceramic board, method manufacturing thereof, image sensor package and method of manufacturing the same: Disclosed herein is a ceramic board and the manufacturing method and an image sensor package and a manufacturing method thereof, the ceramic board including a ceramic body in which an upper surface is formed with a first groove, a second groove is formed in the first groove, and the second... Agent: Lg Innotek Co., Ltd.

20110317393 - Operating container for a magnetic resonance apparatus: An operating container for a magnetic resonance apparatus is proposed. The container has outer walls that enclose an interior space which is embodied for accommodating and operating a magnetic resonance apparatus. The container has a magnetic field shield arranged inside the outer walls. A latent heat storage material is arranged... Agent:

20110310514 - Electrostatic discharge protection circuit: An electrostatic discharge (ESD) protection circuit is coupled between a first terminal and a second terminal of an integrated circuit. The integrated circuit receives an input signal through the first terminal. The second terminal is coupled to a voltage source. The ESD protection circuit includes a PMOS transistor and a... Agent:

20110310516 - Esd protection in a standard cmos or bicmos ic process to enable high voltage input/outputs: The application relates to a method of ESD protecting high-voltage inputs of an integrated circuit fabricated in a standard CMOS IC process, the high-voltage inputs being expected to experience nominal voltage swings that are larger than the nominal maximum voltage swing of the standard CMOS IC process. The application further... Agent: Oticon A/s

20110310517 - Overvoltage protection magazine or plug and method for producing an overvoltage protection magazine or plug: The invention relates to an overvoltage protection magazine (1) or plug, comprising a housing, at least one surge arrester (35), line contacts (10a), at least one grounding contact (21) and a mount (30) for the surge arresters (35), the mount (30) being in the form of a plastic injection-molded part,... Agent: Adc Gmbh

20110310515 - Semiconductor integrated circuit including internal circuits and electrostatic discharge protection circuits: The disclosed invention reduces an increase in the number of electrostatic discharge protection circuits or the number of electrostatic discharge protection elements due to increases in the number of separations of power voltages and the number of separations of ground voltages. A semiconductor integrated circuit includes first, second, and third... Agent: Renesas Electronics Corporation

20110310518 - Multi-terminal power line protection relay system: A multi-terminal power line protective relay system is provided, which divides a power transmission line having four or more terminals into two or more power line sections composed of three adjacent terminals and portions of the power transmission line lying among the three adjacent terminals and one of the three... Agent: Hitachi, Ltd

20110310519 - Communication device, power supplying method therefor, and power supply system: A communication device that establishes a communication with another communication device and supplies electric power to the other communication device by way of a transmission channel, the device comprises a supply voltage generation section that generates a supply voltage, a first detection section that detects a connection of an electric... Agent: Panasonic Corporation

20110310520 - High voltage swing input/output enabled in a standard ic process using passive impedance transformation: The application relates to a method of enabling a high voltage input and/or output in a standard IC process, the high voltage being higher than specified for I/O transistors of the IC process. The application further relates to a transceiver IC and to an article of manufacture comprising a transceiver... Agent: Oticon A/s

20110310521 - Electric protective switch device having control electronics: An electric protective switching device is configured as a modular system and includes a switching device base module including first mechanical guide elements and an installation space with electric contacts. A control module including control electronics, first mechanical elements and electric counter-contact elements is installable into the installation space. A... Agent: Eaton Industries Gmbh

20110310522 - Temperature protection circuit: A temperature protection circuit includes a detection circuit, a comparison circuit, a switching circuit, and a control circuit. When the temperature of an electronic device is below a preset temperature, a detecting voltage signal exceeds a reference temperature signal, and the comparison circuit outputs a control signal to open the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110310523 - Electrical apparatus with electrostatic shield: An electrical apparatus, which is preferrably operated at voltages above 1 kV, comprises an electrostatic shield to reduce the electrical field strength outside of the apparatus. Advantageoulsy, the electrostatic shield is at least in part formed by a dielectric enclosure containing water.... Agent: Abb Technology Ag

20110310525 - System for securely dechucking wafers: A system for chucking and de-chucking a work piece comprises a wafer stage having a chuck support for supporting a chuck. The wafer stage further comprises a chuck mounted on the chuck support for receiving and attaching the work piece thereto; a support lift means for supporting the work piece;... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.

20110310524 - Wafer chuck for euv lithography: A wafer chuck (1b) having a substrate (2) and having, applied to the substrate (2), an electrically conductive coating (8) for fixing a wafer (6) by electrostatic attraction and preferably having a reflective coating (10) applied to the substrate (2). The coating (8; 10) has at least a first layer... Agent: Carl Zeiss Smt Gmbh

20110310526 - Capacitors with high energy storage density and low esr: Electrostatic capacitors with high capacitance density and high-energy storage are implemented over conventional electrolytic capacitor anode substrates using highly conformal contact layers deposited by atomic layer deposition. Capacitor films that are suitable for energy storage, electrical and electronics circuits, and for integration onto PC boards endure long lifetime and high-temperature... Agent: Sundew Technologies, LLC

20110310527 - Dielectric resin composition for film capacitor, method for producing the same, and film capacitor: To increase the heat resistance of a film capacitor, a cured article obtained by curing a mixed solution of a polyvinyl acetal having a hydroxyl group content of 10% to 38% by weight, the number of backbone carbon atoms of the polyvinyl acetal being 100 or more, and a polyisocyanate... Agent: Murata Manufacturing Co., Ltd.

20110310528 - Capacitor with three-dimensional high surface area electrode and methods of manufacture: A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the... Agent: Apricot Materials Technologies, LLC

20110310529 - Electrochemical capacitor and method for manufacturing the same: There are provided an electrochemical capacitor and a method for manufacturing the same. The electrochemical capacitor according to the present invention includes: a plurality of first and second electrodes disposed to be opposite to each other; a separator disposed between the first and second electrodes; wherein at least one of... Agent: Samsung Electro-mechanics Co., Ltd.

20110310530 - Sintered and nanopore electric capacitor, electrochemical capacitor and battery and method of making the same: The present invention relates generally to the field of sequential surface chemistry. More specifically, it relates to products and methods for manufacturing products using Atomic Layer Deposition (“ALD”) to depose one or more materials onto a surface. ALD has the capability for high-quality defect free film deposition with few molecular... Agent: Laor Consulting LLC

20110310531 - Solid electrolytic capacitor and method of manufacturing the same: A solid electrolytic capacitor includes a capacitor element, an anode terminal, and a cathode terminal. The capacitor element has an element body. An outer circumference of the element body is defined by first to fourth side surfaces. An exposed surface of a cathode layer is defined at least on the... Agent: Sanyo Electric Co., Ltd.

20110310532 - Outdoor power generating apparatus: An outdoor power generating apparatus includes a housing placed at an outside and including a power generation chamber, a power generation source accommodated in the power generation chamber and formed by either one of an engine and a fuel cell, an intake portion provided within the housing and positioned at... Agent: Aisin Seiki Kabushiki Kaisha

20110310533 - Panelboard enclosure with external power cutoff switch: An electrical panelboard enclosure includes a primary service panel configured to receive power from a main power source and an alternate power source, an alternate power source connector array, and a distribution panel that delivers main or alternate power to subsidiary load circuits. A service transfer switch unit includes a... Agent: Diversified Control, Inc.

20110310534 - Panelboard enclosure with installable panelboard assembly: An electrical panelboard enclosure includes a primary service panel configured to receive power from a main power source and an alternate power source, an alternate power source connector array, and a distribution panel that delivers main or alternate power to subsidiary load circuits. A service transfer switch unit includes a... Agent: Diversified Control, Inc.

20110310535 - Jean box: An apparatus for joining electric cables or telecommunication wires while concealing them from sight and deter tampering. Further the junction box may aid in the prevention electrical outages and fires.... Agent:

20110310544 - Coupling systems for removably coupling a support beam to an electronic device and methods of making and using the same: Coupling systems for removably coupling a support beam to an electronic device (e.g., cellular phone) are disclosed. Methods of making and using coupling systems for removably coupling a support beam to an electronic device are also disclosed.... Agent:

20110310536 - Device foot: A moveable device foot for an electronic device is described. The device foot can include a rigid weight bearing member and a flexible sealing member that is integrally formed with the weight bearing member. The device foot can be formed using a double-shot injection molding process. The weight bearing member... Agent: Apple Inc.

20110310545 - Display and damping member attached to display: A display wherein a damping member (50) disposed between the front surface of the periphery of a display panel and the rear surface of a bezel has elastic body parts (52) each made of an elastic body and a conductive covering part (54) that covers the elastic body parts (52)... Agent: Sharp Kabushiki Kaisha

20110310543 - Display panel and display device comprising the same: A display panel and a display device having the display panel are discussed. According to an embodiment, the display panel includes a lower substrate provided with a display area and a non-display area; a plurality of data pad portions formed at a side region of the non-display area; an upper... Agent:

20110310540 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a third housing between the first housing and the second housing, a holder, and a harness. The third housing is rotatable with respect to the first housing and the second housing. The holder is attached to... Agent: Kabushiki Kaisha Toshiba

20110310537 - Electronic device and computer program product: According to one embodiment, an electronic device includes a display module, at least one function button, an operation-mode identifying module, and a function switching module. The display module displays thereon display data processed by an application running on an operating system (OS) or display data based on received broadcast waves.... Agent: Kabushiki Kaisha Toshiba

20110310541 - Supporting structure module and electronic device using the same: This disclosure provides a supporting structure module and an electronic device using the same. The supporting structure module in the invention is used in the electronic device. The electronic device includes a first casing, a hinge, and a second casing rotatable relative to the first casing via the hinge. The... Agent:

20110310538 - Television apparatus and electronic device: According to one embodiment, a television apparatus includes a housing and a cover. The housing is provided with an opening for opening a housing portion to house an electronic component. The cover is attached to the housing. The cover is configured to cover the opening, and includes a honeycomb-like rib... Agent: Kabushiki Kaisha Toshiba

20110310542 - Vehicle mounted directionally focused tolling device enclosure: An enclosure for housing a radio frequency integrated device (RFID) transponder. The enclosure includes a front surface comprising a non-shielding material, a top surface, a bottom surface, a right-side surface, a left-side surface and a rear surface. The top surface, the bottom surface, the right-side surface, the left-side surface and... Agent:

20110310539 - Video display and car using the same: A video display includes a housing, a screen and a protective cover. The housing includes a first side and a second side opposite to the first side. The screen is disposed on the first side of the housing. The protective cover is rotatably connected to the housing and coverable on... Agent: Hon Hai Precision Industry Co., Ltd.

20110310546 - Emi shielding scheme using sandwiched sheet metal: A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/−0.1 mm) with spring... Agent:

20110310547 - Printed circuit boards having pads for solder balls and methods for the implementation thereof: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball... Agent:

20110310548 - Support assembly and computer device having the same: A support assembly which supports a computer device body having a display unit. The support assembly includes a base member which is supported on an installation plane, a shaft which extends in parallel to a plane of the base member, a first support member having one end portion joined to... Agent: Samsung Electronics Co., Ltd.

20110310549 - Mobile personal computer and electronic device: According to one embodiment, a mobile personal computer includes: a display panel with a display screen; a board assembly including a board and a component mounted on the board; and a housing including an outer housing constituting an outline and an inner housing arranged between the display panel and the... Agent: Kabushiki Kaisha Toshiba

20110310551 - Disk drive with automatically opening cover: A disk drive with automatically opening cover comprises a main body, a cover, a torsion spring, a buffering rod, and a buffering fork. Two connecting portions protrude from the cover, each passing through a corresponding through hole and a buffering rod protrudes from the vicinity thereof, perpendicular to the hinged... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110310550 - Rack server: A rack server including a cabinet, at least one case, at least one replaceable module, and at least one fan is provided. The case is disposed in the cabinet movably and has an opening and a plurality of vents. The replaceable module is moved in or out of the cabinet... Agent: Inventec Corporation

20110310552 - Dual-purpose external expansion hard drive: A dual-purpose external expansion hard drive provides functions of an external hard drive and a hot-plug hard drive. The external expansion hard drive has a hard-drive-carrying rotatory lid for slidingly receiving a hard drive and a socket case for accommodating the hard-drive-carrying rotatory lid. By closing or lifting the hard-drive-carrying... Agent:

20110310553 - Composite casing structure: A composite casing structure is applied to a housing of an electronic device. The composite casing structure includes a plastic frame and a metal plate. The plastic frame has a plurality of side walls surrounding four side edges thereof, and at least one open portion is formed by the side... Agent: Getac Technology Corporation

20110310554 - Panel fixing structure and information processor: A panel fixing structure, which removably fixes a panel to a square opening provided in a housing, so as to cover a circumference of one or a plurality of interface terminal portions provided inside the housing, includes a square panel surface having a terminal opening in accordance with a shape... Agent: Ricoh Company, Ltd.

20110310555 - Image displaying apparatus, holding member thereof, and image displaying system: An image displaying apparatus, which is excellent in heat radiation efficiency and has an excellent back design, comprises: a display panel for displaying an image; a heat generating member provided on a back side of the display panel; a cabinet for covering the display panel and the heat generating member... Agent: Canon Kabushiki Kaisha

20110310556 - Internal device arrangement for a passenger cabin: An internal device arrangement for a passenger cabin, for example of an aircraft, comprises an internal device element (15) which is selected from a group consisting of wall panelling, window panel, side panel, ceiling panelling and luggage compartment; an electrical apparatus (1) such as a lighting element, for example, which... Agent: Diehl Aircabin Gmbh

20110310557 - Display apparatus and electronic apparatus: According to one embodiment, a display apparatus is provided. The display apparatus includes: a display panel; a case including a cover portion provided with an air outlet and a first air inlet; a mask portion provided with an opening which is connected to the cover portion via the display panel... Agent:

20110310558 - Compact server power supply having high power density: The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and... Agent: Acbel Polytech Inc.

20110310560 - Electronic assembly and casing therefor: A secure control unit is provided with a completely sealed casing (22) of which at least one wall (24) forms a heat sink. The circuit board provided in the casing (22) is designed such that all of the heat generating components (16-20) which require cooling are located on the lower... Agent:

20110310559 - Heat dissipating assembly: A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit... Agent:

20110310561 - Television, radiating member, and electronic apparatus: According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to... Agent: Kabushiki Kaisha Toshiba

20110310563 - Clamp-type heat sink for memory: A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and... Agent: Celsia Technologies Taiwan, I

20110310562 - Thermal interface material assemblies, and related methods: A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and... Agent: Laird Technologies, Inc.

20110310564 - Image pickup apparatus and electronic device: An image pickup apparatus that does not give a user, who grips an apparatus body with his/her hand when he/she uses the imaging apparatus or the electronic device, a sense of discomfort due to a heat, and that can efficiently diffuse heat generated from a heat source inside the apparatus... Agent: Canon Kabushiki Kaisha

20110310565 - Heat sink for memory module: A heat sink for memory module includes two heat-sink plates and two fastening members. Each heat-sink plate defines two through holes. The through holes of one heat-sink plate are coaxial to the through holes of the other heat-sink plate. Each fastening member includes a first head portion and a second... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20110310566 - Flux-free detachable thermal interface between an intergrated circuit device and a heat sink: A thermal flow material-free thermally conductive interface between a mounted integrated circuit device and a heat sink that comprises a mounted integrated circuit device, a heat sink vertically disposed over the device, a vertically compressible thermally conductive member unattachably disposed between the device and the heat sink, and an unattached... Agent: International Business Machines Corporation

20110310567 - Heat sink and electronic device using the same: An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides... Agent: Hon Hai Precision Industry Co., Ltd.

20110310568 - Circuit arrangement with shunt resistor: A circuit arrangement has a populated circuit carrier and includes a flat insulation carrier having a top side and a patterned metallization layer on the top side and a first power semiconductor chip arranged on a first section of the metallization layer. The first power semiconductor chip has a first... Agent: Infineon Technologies Ag

20110310569 - Method and system for innovative substrate/package design for a high performance integrated circuit chipset: Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC power and a grounding function on a metal 2 substrate layer and utilizing all of a metal 3... Agent: Broadcom Corporation

20110310571 - Electronic apparatus: According to one embodiment, an electronic apparatus includes: a housing formed with an opening; a battery module including a connection portion and at least partly accommodated in the opening; a circuit board accommodated in the housing; a connector portion including: a terminal portion including a terminal connected to the connection... Agent:

20110310572 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a first housing, a second housing, a third housing between the first housing and the second housing, the third housing being rotatably connected to the first housing and the second housing, and an antenna in the third housing.... Agent: Kabushiki Kaisha Toshiba

20110310574 - Electronic control unit for vehicle: An electronic control unit includes: a box-shaped case having an opening face; a cover closing the opening face of the case; a board interposed between the case and the cover; and an electronic component mounted to the board. The board has corner portions respectively having mount holes passing through the... Agent: Denso Corporation

20110310573 - High frequency device and a printed board holding structure: A high frequency device includes a metal case; a printed board configured to be inserted in the case; a projecting part configured to project to an inside of the case; a solder guiding hole formed at the projecting part, the solder guiding hole being configured to guide solder from an... Agent: Mitsumi Electric Co., Ltd.

20110310570 - Low noise block down-converter with integrated feed: An LNBF is disclosed. The LNBF includes a housing, a spacer, down-converter circuit, and an F-connector. The spacer is disposed on the housing, wherein a hole is formed on the spacer. The down-converter circuit board is disposed between the housing and the spacer. The F-connector is disposed on the spacer... Agent:

20110310576 - Expansion card mounting apparatus: An expansion card mounting apparatus includes an enclosure, a slot cover of an expansion card, and a retaining member. The enclosure includes a side wall which defines an expansion card slot. A support plate is formed on the side wall and located above the slot. The slot cover includes a... Agent: Hon Hai Precision Industry Co., Ltd.

20110310575 - Mounting apparatus for expansion card: A mounting apparatus includes a chassis, a mounting tray accommodated in the chassis, a base portion configured for being attached to an expansion card, and a securing member. The mounting tray includes a front panel, the front panel defines a expansion slot. A supporting piece is located on the front... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110310577 - Electrical microfilament to circuit interface: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of... Agent:

20110310578 - Cut-edge positioning type soldering structure and method for preventing pin deviation: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at... Agent: Askey Computer Corp.

20110310579 - Inductive structure and method of forming the inductive structure with an attached core structure: An inductor is formed on a wafer by attaching a first core structure to the wafer with a pick and place operation, forming a coil with one or more thick metal layers over the first core structure, and then attaching a second core structure to the first core structure with... Agent:

20110310581 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a casing, a module unit, an installation portion, and a holding portion. The module unit includes an elastic cover member including a projection, and a module fitted in the cover member. The installation portion is provided inside the casing and configured to... Agent: Kabushiki Kaisha Toshiba

20110310582 - Information processing device: An information processing device includes: a housing provided with a front panel; an opening provided in the front panel; an opening and closing lid opening and closing the opening; a placing unit, by being provided in the opening and closing lid, being housed within the opening in a state in... Agent: Sony Corporation

20110310580 - Mobile device with a flip-around keyboard: A mobile device having a flip-around keyboard includes a housing, a display, and a keyboard rotatably coupled to the housing. The housing has a top end, a bottom end, a front surface, and a back surface. The display is located on the front surface of the housing. The keyboard is... Agent: Research In Motion Limited

20110310583 - Mounting apparatus for expansion card: A mounting apparatus includes a chassis, a mounting tray configured for being secured an expansion card, and an expansion piece configured for securing the expansion card. The chassis includes a front plate. The mounting tray includes a front panel secured to the front plate, and a side panel connected to... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20110310584 - Mounting apparatus for expansion card: A mounting apparatus includes a chassis, an expansion piece secured to a first end of an expansion card, a carrier and a supporting device configured to support a second end of the expansion card. The chassis includes a bottom plate, and the carrier is mounted on the bottom plate. The... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20110310585 - Power semiconductor device and power conversion device: A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor... Agent: Hitachi Automotive Systems, Ltd.

20110304940 - Protection circuit: A protection circuit includes a controllable discharge element having a load path coupled between a first second circuit nodes. The discharge element provides a discharge path between the first and the second circuit nodes when in an on state. A trigger circuit has a first connection coupled to the first... Agent: Infineon Technologies Ag

20110304941 - Switching device: A switching device is provided which includes a switching element, and a current limiting circuit which limits current passing through the switching element when the current passing through the switching element exceeds a short-circuit detection threshold. The current limiting circuit limits the current passing through the switching element, until the... Agent: Denso Corporation

20110304942 - Sspc with dual fault detectors: A solid state power controller (SSPC) for a direct current (DC) electrical system includes a high bandwidth fault detector, the high bandwidth fault detector configured to detect a possible fault and place a power switch of the SSPC in saturation at a predetermined current limit; and a low bandwidth fault... Agent: Hamilton Sundstrand Corporation

20110304943 - Relocatable surge suppression or surge protection device: A surge suppression or surge protection device for affording enhanced safety by disconnecting a protected device should a fault occur, and which is preferably formed as part of an electrical power strip, preferably includes a plurality of fuses with at least one fuse being a thermal fuse and a heating... Agent:

20110304944 - Apparatus and method for electronic systems reliability: Apparatuses and methods for protecting electronic circuits are disclosed. In one embodiment, an apparatus for providing protection from transient signals comprises an integrated circuit, a pad on a surface of the integrated circuit, and a configurable protection circuit within the integrated circuit. The configurable protection circuit is electrically connected to... Agent: Analog Devices, Inc.

20110304945 - Lightning arrester and a power transmission line provided with such an arrester: A lightning arrester for protecting elements of electrical facilities or a power transmission line comprises an insulating body which is made of a solid dielectric, preferably in the form of a bar, a strip or a cylinder, two main electrodes that are mechanically coupled to the insulating body and two... Agent: Otkrytoe Aktsionernoe Obschestvo "npo "streamer"

20110304946 - Surge absorbing element: A surge absorbing element has a first electrode, a second electrode, and a ceramic layer. The second electrode is opposed to the first electrode. The ceramic layer has a polycrystal structure including a plurality of crystal grains showing voltage nonlinearity, and is at least partially brought into contact with the... Agent:

20110304947 - Electromagnetic switch: An electromagnetic switch is provided which includes: a coil generating magnetomotive force; a frame accommodating the coil and generating a flux path; a resin cover covering an opening of the frame; and a current-supply terminal member energizing the coil. The current-supply terminal member includes: a blade-shaped terminal whose end is... Agent: Denso Corporation

20110304948 - Capacitor for inverter of vehicle: The present invention provides a capacitor for an inverter of a vehicle comprising a case; a plurality of capacitor unit modules; positive and negative bus plates that are disposed in the case to be connected to the capacitor unit modules; and a power module corresponding to the unit modules, wherein... Agent: Hyundai Motor Company

20110304949 - Capacitive-stemmed capacitor: A capacitor having a stem that is designed to be inserted into a single, large-diameter via hole drilled in a printed circuit board is provided, wherein the stem may have conductive rings for making the positive and negative connections to the printed circuit board power distribution planes. Inside the capacitive... Agent:

20110304950 - Electric double layer capacitor: An electric double layer capacitor includes a pair of collectors, a separator, a conductive coating film, a polarizable electrode, and an electrolyte solution. The separator is arranged between the collectors. The conductive coating film covers a surface of at least one of the collectors facing the separator. The polarizable electrode... Agent: Daikin Industries, Ltd.

20110304951 - Ultracapacitor and method of manufacturing the same: A method for producing an ultracapacitor comprises the steps of: providing a negative porous electrode in contact with a negative conducting plate; providing a positive porous electrode in contact with a positive conducting plate; providing an ultracapacitor separator being a microporous material that separates the negative porous electrode from the... Agent:

20110304952 - Electrolyte for lithium ion capacitor and lithium ion capacitor including the same: There are provided an electrolyte for a lithium ion capacitor and a lithium ion capacitor including the same. The electrolyte for a lithium ion capacitor according to the present invention includes: a lithium salt; and a mixing solvent including i) two or more compounds selected from a group consisting of... Agent: Samsung Electro-mechanics Co., Ltd.

20110304953 - Nanostructured thin-film electrochemical capacitors: An asymmetric electrochemical capacitor including an anode, a cathode, and an electrolyte between the anode and the cathode. The anode includes manganese dioxide (MnO2) nanowires and single-walled carbon nanotubes. The cathode includes indium oxide (In2O3) nanowires and single-walled carbon nanotubes. The asymmetrical electrochemical capacitor can be fabricated by forming a... Agent: University Of Southern California

20110304954 - Solid electrolytic capacitor and power circuit: A solid electrolytic capacitor includes a capacitor element having two opposite cathode surfaces, a cathode terminal metal plate having a first cathode connecting portion electrically connected to one of the two opposite cathode surfaces, and an auxiliary cathode metal plate having a second cathode connecting portion electrically connected to the... Agent: Fujitsu Limited

20110304955 - Fabrication of electrochemical capacitors based on inkjet printing: An electrochemical capacitor includes a first electrode including a first flexible substrate, a second electrode including a second flexible substrate, and an electrolyte. The first electrode includes a first layer of single-walled carbon nanotubes inkjetted on the first flexible substrate and a layer of first nanowires disposed on the first... Agent: University Of Southern California

20110304956 - Switchgear for underground electric power distribution line: A switchgear for a ground distribution line includes a base frame, vacuum switch units each installed on the base frame and configured by laying a first vacuum interrupter and a second vacuum interrupter within an epoxy resin mold, the first vacuum interrupter opening or closing a main circuit between a... Agent: Lsis Co., Ltd.

20110304957 - Apparatus for electric power distribution: An apparatus, such as a metering panel, for electric power distribution. An enclosure having an access opening defining an interior space, at least two electrical components for separate phases of electricity. The two components located within the enclosure and spaced laterally apart, at least one electrically insulating barrier panel, movable... Agent:

20110304958 - High density power/lighting panelboard: A panelboard supplies electricity to multiple loads, such as lighting fixtures and/or other electrical devices via one or more high-amperage circuit breakers and one or more low-amperage circuit breakers. The panelboard includes one or more vertical busbars and one or more horizontal busbars coupled together in a single housing. The... Agent: Schneider Electric Usa, Inc.

20110304964 - Electrical devices containing carbon nanotube-infused fibers and methods for production thereof: Electrical devices having a plurality of stacked electrode layers are described. At least one of the electrode layers contains continuous fibers that are infused with carbon nanotubes. The continuous fibers can be disposed upon an electrically conductive base plate. The electrical devices can further contain an electrolyte contacting each electrode... Agent: Applied Nanostructured Solutions, LLC

20110304959 - Electronic device: An electronic device includes a first part, a second part, and a connecting mechanism configured to connect the first part with the second part. The connecting mechanism includes a connecting element installed on the first part, a movable element installed on the second part, and a drive element installed on... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20110304963 - Electronic device holder, especially for a mobile phone, for use in a mechanical vehicle: The holder for an electronic device, especially for a mobile phone, for use in a mechanical vehicle, which can also accommodate various replaceable electronic modules, especially a GPS module, or a GPS supporting module, including at least a holding unit 1, which accommodates an electronic device, and an additional replaceable... Agent: Bury Sp Z O.o.

20110304962 - Package structure: A package structure for packaging a portable electronic device is provided. The package structure includes a base portion, a supporting portion and a connector. The supporting portion is connected to the base portion. The supporting portion includes a first fixing element and a second fixing element, wherein when the package... Agent:

20110304960 - Retaining apparatus for data storage device: A retaining apparatus used for a data storage device includes a tray and a retaining device. The tray is for receiving the data storage device. The retaining device includes a base member, an arm member and a locking member. The base member attaches to the tray. The arm member pivotally... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20110304961 - Touch control panel securing device and electronic apparatus having the touch control panel securing device: A touch control panel securing device is used for fixing a touch control panel. The touch control panel includes a housing formed with an opening, the touch control panel being mounted within the housing and being registered with the opening; at least one pressing member for pressing the touch control... Agent:

20110304965 - Bag computer system and bag apparatus: Disclosed is a system comprised of a bag and computer combination which allows the bag wearer to quickly access and use a computer while mobile. The system can be in three forms and all three are used in the same way: a pivoting cover is moved out of the way... Agent:

20110304967 - Computer system and base thereof: A base which allows a portable electronic device to be attached thereto is provided. The base includes a first member, a second member and a pivot element. The first member includes an external connection port. The second member includes a socket. The pivot element is connected to the first member... Agent:

20110304969 - Flat panel display apparatus, mother substrate for flat panel display apparatuses, method of manufacturing the flat panel display apparatus, and method of manufacturing the mother substrate: A flat panel display apparatus includes a substrate; a display unit disposed on the substrate; a sealing substrate disposed to face the display unit; a sealing member disposed between the substrate and the sealing substrate to surround the display unit; a wiring unit disposed between the substrate and the sealing... Agent:

20110304970 - Bag computer system and bag apparatus: Disclosed is a system comprised of a bag and computer combination which allows the bag wearer to quickly access and use a computer while mobile. The system can be in three forms and all three are used in the same way: a pivoting cover is moved out of the way... Agent:

20110304971 - Portable keepsake storage device with a pivoting sleeve and usb flash drive: A portable keepsake storage device has a housing with an interior chamber for storing a keepsake, and a USB data storage device held by a pivoting sleeve attached to the housing. The sleeve and USB data storage device can be pivoted between a closed position in which the USB data... Agent:

20110304973 - Silicone barrier for drive window: An optical drive dust guard can include an elongated strip of silicone having a front surface, a back surface and an adhesive along one of the surfaces, an elongated slit formed along and through a center portion of the elongated strip, and one or more elongated notches formed along the... Agent: Apple Inc.

20110304972 - Small form factor desk top computer: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having... Agent: Apple Inc.

20110304974 - Removable hard drive in a small form factor desk top computer: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having... Agent: Apple Inc.

20110304966 - Power routing device for expansion slot of computer system: A power routing device includes one or more mounting portions and one or more power routing portions. At least one of the mounting portions can be mounted in an expansion slot of a circuit board assembly. The power routing portion can route electrical power to the circuit board assembly. In... Agent:

20110304975 - Computer system and base thereof: A base for allowing a portable electronic device to be attached thereto is provided. The base includes a first member, and a second member. The first member includes a first connecting portion and an external connection port. The second member includes a second connecting portion and a socket, wherein the... Agent:

20110304979 - Cooling apparatus: A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate,... Agent:

20110304976 - Cooling arrangement for small form factor desktop computer: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed... Agent: Apple Inc.

20110304977 - Electronic device enclosure with anti-emi holes: An electronic device enclosure for suppressing Electro-Magnetic Interference (EMI) includes a first plate defined on a first plane, a second plate defined on a second plane and a number of polygonal holes defined in the first plate at an angle of orientation. The second plane is substantially perpendicular to the... Agent: Hon Hai Precision Industry Co., Ltd.

20110304978 - Enclosure of electronic device: An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110304980 - Ruggedized computer capable of operating in high temperature environments: Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for... Agent: Intergraph Technologies Company

20110304981 - Computer server system and computer server thereof: An exemplary computer server system includes a cabinet and a server mounted in the cabinet. The servers includes a casing, an electronic component mounted in the casing, a heat dissipation device for dissipating heat generated by the electronic component, and a fan module. The heat dissipation device includes a heat... Agent: Hon Hai Precision Industry Co., Ltd.

20110304982 - Self-cleaning computer: An exemplary self-cleaning computer includes an enclosure defining an air inlet therein, a control processing unit (CPU) received in the enclosure, a vibration element mounted on the enclosure, and a control device electrically connected between the CPU and the vibration element. The control device is configured to direct the vibration... Agent: Hon Hai Precision Industry Co., Ltd.

20110304983 - Track guided hinge for a portable electronic device: Embodiments of the present invention disclose a track guided hinge assembly for a portable electronic device. According to one embodiment, the portable electronic device includes a base housing and a panel configured to cover a top surface of the base housing. A first mounting bracket having a first guide track... Agent:

20110304984 - Battery assembly for battery powered portable devices: A battery assembly includes at least a plurality of battery cells that includes at least a first and a second battery cell each attached to a distributed battery monitoring unit, the second battery cell being associated with an external circuit, the second battery cell connected to a battery management unit... Agent: Apple Inc.

20110304968 - Internal electronics of a small form factor desk top computer: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having... Agent: Apple Inc.

20110304985 - Electrical or electronic composite component and method for producing an electrical or electronic composite component: An electrical or electronic composite component is described as having a first joining partner and at least one second joining partner. According to the present system, it is provided that a sintered compact having open porosity is accommodated between the first and the second joining partner, the sintered compact is... Agent:

20110304986 - Power supply assembly: A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply unit, and a positioning element. The enclosure body includes a bottom panel, a rear panel, and a side panel. The power supply unit is mounted in the enclosure body and is... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110304987 - Device for cooling integrated circuits: The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3′) which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes... Agent: Imec

20110304988 - Carriage chassis with a tri-lobed torsion stop: Carriage chassis for installation of a component assembly in a support structure. The support structure includes a power connector in a connector housing. The carriage chassis includes: rails adapted to receive a component assembly and a safety cover. One of the rails includes a tri-lobed torsion stop that includes a... Agent: International Business Machines Corporation

20110304989 - Substrate unit and electronic device: According to one embodiment, a substrate unit includes an electronic circuit substrate which includes a first width dimension portion, and a second width dimension portion continuous with the front direction side of the first width dimension portion. A first concave portion is formed on the first direction side of the... Agent:

20110304990 - Heat-radiating substrate and method of manufacturing the same: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed... Agent: Samsung Electro-mechanics Co., Ltd.

20110304991 - Thermally enhanced electronic package: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is... Agent: Chipmos Technologies Inc.

20110304992 - Heat dissipation device: A heat dissipation device is used to cool a storage device. The heat dissipation device includes a heat sink and two parallel conduction boards. The heat sink includes a base and a number of fins extending from a first side of the base. A guiding channel is defined between every... Agent: Hon Hai Precision Industry Co., Ltd.

20110304993 - Circuit module: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in... Agent: Murata Manufacturing Co., Ltd.

20110304994 - Conductive via structures for routing porosity and low via resistance, and processes of making: An integrated circuit structure includes a first conductive layer (MET4) including a first forked conductive structure (310), an insulating layer (320, ILD45) substantially disposed over the first forked conductive structure (310), a plurality of conductive vias (331-334) through the insulating layer (ILD45) and electrically connecting with the first forked conductive... Agent: Texas Instruments Incorporated

20110304995 - Television apparatus and electronic device: According to one embodiment, a television apparatus includes a flexible printed wiring board on which a screw hole is provided, and a reinforcing plate which is adhered to the flexible printed wiring board and provided with an opening. The television apparatus includes an indication, and the indication is provided on... Agent: Kabushiki Kaisha Toshiba

20110304996 - Electronic module with improved printed circuit board to maximize width thereof: An electronic module (100) comprises a base portion (1) having a receiving space (110), a panel portion (2) defining a pair of flange members (211, 212), a printed circuit board (3) disposed in the base portion and an actuator mechanism assembled to the base portion. The base portion defines a... Agent: Hon Hai Precision Industry Co., Ltd.

20110304997 - Printed wiring board, electronic device, and printed wiring board manufacturing method: A printed wiring board includes an insulating resinous substrate having an aperture unit, a first terminal unit and a second terminal unit consisting of a conductor and formed on top of the resinous substrate, and a fuse unit that electrically couples the first terminal unit and the second terminal unit... Agent: Ibiden Co., Ltd.

20110304999 - Interposer-on-glass package structures: A device includes an interposer including a substrate, and a first through-substrate via (TSV) penetrating through the substrate. A glass substrate is bonded to the interposer through a fusion bonding. The glass substrate includes a second TSV therein and electrically coupled to the first TSV.... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20110304998 - Package substrate: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail.... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20110299199 - Device and a method for protecting a link in a medium, high, or very high voltage electrical network: A device and method of protecting a link in a medium, high, or very high voltage power network, with current and voltage transformers and trip circuits being disposed on the link. The protection device includes a mechanism to directly connect to a power supply, to the current and voltage transformers,... Agent: Alstom Grid Protection & Controle Sas

20110299200 - Arc flash detection apparatus and electrical system including the same: An electrical system includes first, second and third power busses; a first interrupter electrically connected between the first and second power busses; a second interrupter electrically connected between the second and third power busses; at least one of a shorting apparatus operatively associated with the second power bus, and the... Agent:

20110299201 - Sspc for parallel arc fault detection in dc power system: A solid state power controller (SSPC) for detecting a parallel arc fault in a direct current (DC) power distribution system includes an input, the input being connected to a DC power source; a power switch connected to the input; an output connected to the power switch, the output being connected... Agent: Hamilton Sundstrand Corporation

20110299202 - nmos-based feedback power-clamp for on-chip esd protection: A power-to-ground clamp transistor provides electrostatic discharge (ESD) protection. A filter capacitor and resistor generate a filter voltage that is buffered by three stages to drive the gate of the clamp transistor. The filter capacitor is about twenty times smaller than in a conventional clamp circuit. Feedback in the circuit... Agent: Hong Kong Applied Science & Technology Research Institute Company Limited

20110299204 - Anti-lightning protection for telephone connection: A structure for protecting a circuit connected to first and second rails of a telephone connection against overvoltages, including: first and second diodes in anti-series between the first and second rails; a first capacitor in parallel with a first resistor between a first node common to the first and second... Agent: Stmicroelectronics (tours) Sas

20110299203 - Clamping control circuit for hybrid surge protection devices: A hybrid surge protection device (SPD) having a clamping voltage that is controlled by precisely limiting the overshoot voltage of a gas discharge tube (GDT) in a hybrid suppression network. The suppression network is conventionally connected between a protected line carrying current from a power source to a load and... Agent: Schneider Electric Usa, Inc.

20110299205 - Voltage protecting circuit for electronic device: A voltage protecting circuit includes a switch unit, an upper limited voltage detecting unit, a lower limited voltage detecting unit, and a logic control unit. When a voltage output from a voltage input interface is less than the lower limited voltage or greater than the upper limited voltage, the logic... Agent: Hon Hai Precision Industry Co., Ltd.

20110299206 - Battery state monitoring circuit and battery device: Provided is a battery state monitoring circuit which detects that a voltage of a secondary battery has decreased abruptly because of an overcurrent, thereby being capable of protecting a battery device from an abrupt decrease in voltage of the secondary battery caused by the overcurrent. The battery state monitoring circuit... Agent:

20110299207 - High speed digital-to-analog converter with low voltage device protection: A digital-to-analog converter (DAC) includes a first DAC core, a second DAC core, and a butterfly switch. The first DAC core generates a first output. The second DAC core generates a second output. The butterfly switch includes at least one of switch transistors and cascode transistors. The butterfly switch selectively... Agent: Maxim Integrated Products, Inc.

20110299208 - Power supply apparatus: Included are: a circuit-specific printed circuit board to be a circuit board that generates a power supply voltage; a first diode that is connected in antiparallel with the transistor and is configured so as to be capable of passing a current through a path to circumvent the transistor; a second... Agent: Mitsubishi Electric Corporation

20110299209 - Battery protection module: A battery protection module has a battery protection IC that is formed on a substrate, switching elements that are formed on the substrate and controlled by the battery protection IC, battery connecting terminals that are formed on the substrate, and a wire fuse that is disposed on a path on... Agent:

20110299210 - Serially connected surge suppression optimization device: A serially connected surge suppression optimization device has an input terminal, an output terminal, a plurality of surge suppression units. The surge suppression units are serially mounted between the input terminal and the output terminal. Each surge suppression unit has at least one pair of parallel inductors and a plurality... Agent: Anmax Lightning Technology Corp.

20110299211 - Surge arrester having a short-circuit device: A surge arrester includes a short-circuit device. The short-circuit device includes at least one first base element. The first base element is rigidly connected in an electrically conducting and mechanical manner to a first electrode of the surge arrester. The short-circuit device also includes at least one spring arm arranged... Agent: Epcos Ag

20110299212 - Relay drive circuit: A relay drive circuit electrically connects to an alternating current power source for driving a relay includes a zero crossing test circuit, a logic control circuit, and a switch. The zero crossing test circuit is electrically connected to the alternating current power source and is for obtaining zero crossing regions... Agent: Hon Hai Precision Industry Co., Ltd.

20110299213 - Varistor ceramic, multilayer component comprising the varistor ceramic, and production method for the varistor ceramic: A varistor ceramic includes Zn as the main component and Pr in a proportion of 0.1 to 3 atom %.... Agent: Epcos Ag

20110299214 - Low maintenance ac gas flow driven static neutralizer and method: A low maintenance AC gas-flow driven static neutralizer, comprising at least one emitter and at least one reference electrode; a power supply having an output electrically coupled to the emitter(s) and a reference terminal electrically coupled to the reference electrode(s) with the power supply disposed to produce an output waveform... Agent:

20110299215 - Anti-esd elastic plate and device: The present invention provides an anti-ESD elastic plate comprising a first conducting part, and a pair of second conducting part. The first conducting part has at least one projection structure. The two second conducting parts are connected respectively to the two lateral sides of the first conducting part. Each of... Agent: Inventec Corporation

20110299216 - Disabling a target using electrical energy: One system described herein provides electrical energy by means of a Tesla coil that generates a strong electric field in the vicinity of an electrical target. An energy booster provides additional electrical energy to increase the probability of disabling and/or disrupting the electrical target. For example, an electrode may be... Agent:

20110299218 - Heated annulus chuck: A clamping device and method is provided for securing first and second workpieces having different sizes to a clamping device and providing thermal conditioning thereto. An electrostatic clamping plate having a diameter associated with the first workpiece surrounds a central portion of the clamp. A non-electrostatic central portion provides a... Agent: Axcelis Technologies, Inc.

20110299217 - Heated electrostatic chuck including mechanical clamp capability at high temperature: An electrostatic clamp is provided, having a clamping plate, wherein a clamping surface of the clamping plate is configured to contact the workpiece. A voltage applied to one or more electrodes selectively electrostatically attracts the workpiece to the clamping surface. One or more auxiliary clamping members are further provided wherein... Agent: Axcelis Technologies, Inc.

20110299219 - Energy storage device product: A compressible and deformable layer is densified and laminated to a layer of a material that is relatively resistant to stretching. The densification and bonding take place in a single step. As used in fabrication of electrodes, for example, electrodes for double layer capacitors, a deformable and compressible active electrode... Agent: Maxwell Technologies, Inc.

20110299220 - Electrical multi-layered component and circuit arrangement comprising the same: An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered... Agent: Epcos Ag

20110299221 - Chip-type electronic component: A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode... Agent: Murata Manufacturing Co., Ltd.

20110299222 - Method for manufacturing resin film for thin film-capacitor and the film therefor: The present invention provides a method for manufacturing a film for a film capacitor in which a film can be prepared by melt extrusion molding in a thin film having a thickness of 10 μm or less and in which a cost can be cut by simplifying a manufacturing step... Agent: Shin-etsu Polymer Co., Ltd.

20110299223 - Hybrid super capacitor using composite electrode: Provided is a hybrid super capacitor using a composite electrode that may enhance equivalent series resistance (ESR) using a carbon nanotube chain. The hybrid super capacitor includes: an anode 11 including an anode oxide layer 11a and an activated carbon layer applied 11b on the anode oxide layer 11a; and... Agent: Samhwa Capacitor Co., Ltd.

20110299224 - Electrolyte solution and electrochemical capacitor using same: (wherein Q is a group 13 or group 15 element in the periodic table, Rf is a perfluoro alkyl group (CnF2n+1), n is a natural number, 1≦y<6, 1≦z<6, MX+ is a cation of Xth valence, and X is a natural number from 1 to 3). Thereby, since excessive electric potential... Agent:

20110299225 - Multi-coated electrode and method of making: Various embodiments provide an electrode comprising a conductive substrate, a first layer of a mixture comprising iridium oxide in a crystalline phase and tantalum oxide in an amorphous phase on a portion of an outer surface of the conductive substrate, and a second layer of the mixture comprising iridium oxide... Agent: Freeport-mcmoran Corporation

20110299226 - Front accessible switchgear assembly: A front accessible metal clad switchgear assembly comprising multiple compartments defined within an electrical enclosure is provided. The compartments interchangeably accommodate electrical components, for example, current transformers, a circuit breaker, a control power transformer, an epoxy encapsulated potential transformer, etc., and bus bars in predetermined positions for allowing front access... Agent: Abd El & Larson Holdings LLC

20110299227 - Gas insulated switchgear: A gas insulated switchgear includes: a center conductor that is arranged to extend horizontally in a tank; a cylindrical member that is arranged in the tank to surround a center conductor, and formed by curving a metal plate-like member into a cylindrical shape and then joining circumferentially opposed both ends... Agent: Mitsubishi Electric Corporation

20110299228 - Multi-access switchgear assembly: A metal clad switchgear assembly comprising multiple compartments defined within an electrical enclosure is provided. The compartments interchangeably accommodate electrical components, for example, current transformers, a circuit breaker, a control power transformer, an epoxy encapsulated potential transformer, etc., electrical cables, and bus bars in predetermined positions for allowing front access... Agent: Abd El & Larson Holdings LLC

20110299229 - Electrical distribution center: An electrical distribution center includes a housing composed of a first material having a first melting point, an electrical bus disposed in the housing, a removable electrical/electronic component electrically connected to the electrical bus and which produces a predetermined temperature in operation higher than the first melting point, an opening... Agent: Delphi Technologies, Inc.

20110299233 - Latch system: A latch system employs momentum exchange impact damping. A latch is slicleably arranged within a housing so that the latch can slide between a latch position and a release position. A damper spring urges a damper against a wedge of the latch. When a mechanical impact urges said latch toward... Agent: Hewlett-packard Development Company, L.p.

20110299234 - Portable digital graphical display system which can be dismantled: The present invention lies in the field of devices or systems for disclosing information. Specifically, the present invention relates to a digital system for graphically displaying information with various applications such as, inter alia, advertising, commercial information, signposts, instructions, said system being able to be dismantled and being lightweight and... Agent: Globotech Displays De Colombia S.a.

20110299230 - Relative movement urging device and electronic device using the relative movement urging device: The relative movement urging device urges the relative movement of the first member and the second member which are connected in a relatively movable manner. The relative movement urging device includes a first connecting member connected to the first member, a second connecting member which is movable in the departing... Agent:

20110299231 - Rotatable cases for electronic devices: Embodiments of cases for electronic devices include a shell that includes a display opening and a handle coupled to the shell. The shell is adapted to at least partially surround the electronic device. The handle is adapted to rotate relative to the shell about an axis of rotation. The handle... Agent:

20110299232 - Surface-mountable apparatus: A surface-mountable device (100) is specified, comprising a mounting side (101), a top side (102) lying opposite the mounting side (101), an electrically insulating carrier plate (1), an electrical component (2) and a housing (3). The carrier plate (1) terminates the device (100) toward the mounting side (101). Furthermore, the... Agent: Osram Opto Semiconductors Gmbh

20110299235 - Fully extendable dual-segmented housing assembly for mobile computing device: A mobile computing device formed from at least two housing segments that can be moved between positions, including an open position that fully exposes a display surface or façade of each of the housing segments, and a closed position in which at least one of the facades or display surfaces... Agent:

20110299236 - Fixing apparatus for hard disk drive: A fixing apparatus includes a fixing member and a shockproof casing. The fixing member includes a first side plate, a second side plate, and a gate. Each of the first side plate and the second side plate defines a rail on corresponding inner sides for receiving a hard disk drive.... Agent: Hon Hai Precision Industry Co., Ltd.

20110299237 - Multi-level hard drive enclosure: The hard drive enclosure contains a casing member where a first rack at a first lateral side has a number of partition plates, each having a number of through holes allowing a rod to pass through. A number of covers laterally arranged in parallel on a front side of the... Agent:

20110299238 - Audio input and output dock for a tablet computer: An audio input and output dock for a tablet computer is disclosed. The dock includes a housing having a cradle configured and arranged to receive a tablet computer docked therein. A number of audio output and input connectors are configured and arranged to connect to the tablet computer when docked... Agent: Alesis, L.p.

20110299239 - Computer case with upwardly oriented add-on cards and vertical airflow: Embodiments of the disclosed technology comprise a method of dissipating heat from within a case of a computer, and a computer case designed therefor, which functions by placing add-on cards into the computer housing or case. In this manner, convection aids in cooling off the interior of the computer as... Agent: Ez-tech Corp (d/b/a Maingear)

20110299240 - Operation processor: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake... Agent: Hitachi, Ltd

20110299241 - Stylus receiving mechanism and portable computer therewith: A stylus receiving mechanism includes a handle whereon a first opening and a second opening are formed on two ends. A chamber is formed inside the handle for receiving a stylus. The stylus receiving mechanism further includes a fastening part installed on an inner wall of the handle and disposed... Agent:

20110299242 - Method and apparatus for installation and removal of overhead cooling equipment: Disclosed is a data center comprising a first row of equipment racks, a second row of equipment racks, a hot aisle defined by a space between the first row of equipment racks and the second row of equipment racks, and a track system above the hot aisle of the data... Agent:

20110299243 - Power conversion apparatus: A power conversion apparatus is provided which includes a semiconductor module which include a switching element, a cooler which cools the semiconductor module, and has a pair of cylindrical pipes which introduce a cooling medium to a channel therein or discharge the cooling medium, a frame which holds the cooler,... Agent: Denso Corporation

20110299244 - Cooling member for heat containing device: A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can... Agent: Toyota Motor Engineering & Manufacturing

20110299245 - Fan assembly and electronic device incorporating the same: An exemplary fan assembly includes a fan and a muffler. The fan includes an air outlet. The muffler is disposed at the air outlet of the fan. The muffler includes a base plate. The base plate defines vents therein and blades thereon corresponding to the air outlet of the fan.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110299246 - Modular electronics housing: A housing for protectively enclosing a printed circuit board, including a base, and a pair of parallel spaced vertical housing side walls extending upwardly from the base to define a chamber that receives the central portion of the printed circuit board, whereby the vertical edge portions of the board extend... Agent: Weidmueller Interface Gmbh & Co., Kg

20110299248 - Cooling device for cooling electronic components: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20110299247 - System and method for regulating motor rotation speed: The present invention relates to a system and method controlling motor rotation speed and provides a cooling system and method configured to control a temperature associated with an integrated circuit. The cooling system includes a brushless motor, a temperature monitoring input, a clock input, and a motor controller. The motor... Agent:

20110299249 - Heat sink mounting frame applicable to a variety of circuit boards: An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm includes a fixing bracket connected to... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110299251 - Lightweight audio system for automotive applications and method: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical... Agent:

20110299250 - Wiring substrate and manufacturing method thereof: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from... Agent: Yazaki Corporation

20110299252 - Expansion card assembly and heat sink thereof: An expansion card assembly includes an expansion card and a heat sink. The expansion card includes a board and an electronic component mounted on the board. The board has a component side on which the electronic component is mounted and an opposite solder side. The heat sink includes a U-shaped... Agent: Hon Hai Precision Industry Co., Ltd.

20110299253 - Electrical power module and method for connecting an electrical power module to a printed circuit board and a heat sink: An electrical power module (2) to be mounted on a printed circuit board (1), comprising a first side (21) to be mounted on a surface of a heat sink (3), wherein, in a mounted position of the electrical power module (2) on the heat sink (3), the first side (21)... Agent: Vincotech Holdings S.a.r.l.

20110299254 - Screw-less fixing assembly for interface card: A screw-less fixing assembly for an interface card having a fixing support includes a frame, a movable cover module and an elastic member. The frame has an I/O opening. One side of the I/O opening is provided with an accommodating space. A long plate of the fixing support is positioned... Agent: Super Micro Computer Inc.

20110299255 - Semiconductor device, method of manufacturing the same, electronic device, and electronic component: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board... Agent: Fujitsu Limited

20110299257 - Insertional buffering structure of substrate unit: A lever member of a lever assisted insertion device engages with a front frame of a shelf before a fully inserted position of a substrate unit to form a leverage fulcrum on the front frame. A force that an operator applies to the lever member is transmitted to the substrate... Agent: Fujitsu Limited

20110299258 - Mount structure for electrical board, and image forming apparatus having the same: A mount structure includes: a plurality of metal frames over which the respective electrical boards disposing an electronic component are removably mounted; stacks and mounts the frames. An uppermost frame is an N-th frame (N is an integer of 2 or larger) and a frame disposed under the N-th frame... Agent: Kyocera Mita Corporation

20110299256 - Packaging for a millimeter wave radio-frequency integrated circuit (rfic): Millimeter wave radio-frequency integrated circuit device comprises a housing and a millimeter wave radio frequency integrated circuit, the housing comprising a plurality of layers laminated together and two cavities defined by apertures within the layers which are positioned to correspond as the layers are laminated together. The radio frequency integrated... Agent: Siklu Communication Ltd.

20110299259 - Circuit board with conductor post structure: Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit... Agent:

20110299260 - Electronic device enclosure and power supply thereof: An electrical device enclosure includes a front panel, a power supply and a switch assembly mounted on the front panel. The power supply includes an alternating current (AC) plug and a power circuit. The AC plug is used to receive an AC voltage. The power circuit is used to convert... Agent: Hon Fu Jin Precision Industry(shenzhen) Co., Ltd.

20110299261 - Lightweight audio system for automotive applications and method: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical... Agent:

20110299262 - Board level electromagnetic interference (emi) shields with through hole latching mechanisms: Disclosed herein are exemplary embodiments of EMI shielding apparatus (e.g., one-piece shields, multi-piece shields, frames, etc.) having one or more latching members insertable into openings or holes in a substrate (e.g., printed circuit board, etc.) and engagable to the substrate. The engagement of the latching members with the substrate mechanically... Agent: Laird Technologies, Inc.

20110299264 - Emi noise shield board including electromagnetic bandgap structure: a second board portion located on a lower surface of the first board portion, an electromagnetic bandgap structure being inserted into the second board portion, the electromagnetic bandgap structure having a band stop frequency property in such a way that an EMI noise transferred from the first board portion can... Agent: Samsung Electro-mechanics Co., Ltd.

20110299263 - Enclosure of electronic device: An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of... Agent: Hon Hai Precision Industry Co., Ltd.

20110299265 - Power module, power converter device, and electrically powered vehicle: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in... Agent:

20110299266 - Aggregator for a switch rack system: An aggregator for interconnecting a hydra with an breakout box, said aggregator comprising: (a) a bottom wall, two sides walls, and at least one faceplate; (b) adapters for multi-conductor connectors arranged in at least one column on said faceplate; and (c) wherein at least two adapters of each column are... Agent: Tyco Electronics Corporation

20110292551 - Arc extinguishing hybrid transfer switch and switching method: The present invention discloses an arc extinguishing hybrid transfer switch, including a mechanical switch and a first thyristor branch connected in parallel with the first contact branch of the mechanical switch, wherein the first thyristor branch includes a first thyristor, a second thyristor, a first polarized capacitor and a second... Agent: Asco Power Technologies, L.p.

20110292553 - Integrated circuit device and electrostatic discharge protecting circuit thereof: Integrated circuit devices and electrostatic discharge (ESD) protection circuits thereof. An integrated circuit device may include an input/output pad, an internal circuit, and a transistor connected between the input/output pad and the internal circuit configured to perform a switch operation between the input/output pad and the internal circuit in response... Agent: Samsung Electronics Co., Ltd.

20110292552 - Over-voltage protection device: An exemplary over-voltage protection device used in an electronic device includes a housing capable of being grounded, a circuit board, a connecting member detachably attached to the circuit board and the housing to electrically connect the circuit board with the housing, and a protection member connected to the circuit board... Agent: Hon Hai Precision Industry Co., Ltd.

20110292554 - Protection circuit for radio frequency power amplifier: Embodiments of circuits, apparatuses, and systems for a protection circuit to protect against overdrive or overvoltage conditions. Other embodiments may be described and claimed.... Agent: Triquint Semiconductor, Inc.

20110292555 - Measuring transient electrical activity in aircraft power distribution systems: An electrical power distribution system for an aircraft comprises a power source electrically connected to an electrical load and at least one circuit interruption device for interrupting current in the power distribution system. A distinguishing device is connected to the system for distinguishing a transient electrical event in the system... Agent:

20110292556 - Protection circuit and method for electronic devices: A circuit for protecting an electronic device from excessive voltages applied to an input or output terminal includes a solid state relay coupling the electronic device to the terminal. The solid state relay may include an opto-transistor coupled between the electronic device and the terminal and a light emitting diode... Agent: Fluke Corporation

20110292557 - Dc block rf coaxial devices: A DC block RF device includes a housing defining a cavity having a central axis, an input conductor disposed in the cavity of the housing and extending substantially along the central axis of the cavity and an output conductor disposed in the cavity of the housing and extending substantially along... Agent:

20110292558 - Driving circuit for ac contactor: Disclosed is driving circuit for AC contactor for driving a AC contactor, including a first switch connected in series with a winding of the AC contactor, a first diode reversely connected in parallel with the winding of the AC contactor for providing a discharging path for the winding, a DC... Agent: Delta Electronics, Inc.

20110292559 - In-line gas ionizer with static dissipative material and counterelectrode: An in-line gas ionizer has a gas inlet, an ionizing chamber, and a gas outlet, wherein at least one of the gas outlet and the ionizing chamber comprises static dissipative material which may be connected to ground.... Agent: Illinois Tool Works Inc.

20110292560 - Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions... Agent:

20110292562 - Matched coefficient of thermal expansion for an electrostatic chuck: An apparatus and method are provided for selecting materials for forming an electrostatic clamp. The electrostatic clamp has a backing plate having a first coefficient of thermal expansion, wherein the backing plate provides structural support and rigidity to the electrostatic clamp. The electrostatic clamp further has a clamping plate having... Agent: Axcelis Technologies, Inc.

20110292561 - Tray for transporting wafers and method for fixing wafers onto the tray: A tray for transporting a wafer is herein provided, which can control the temperature of the wafer upon the processing thereof, and which can easily fix the wafer without reducing the effective area on the surface of the wafer and without requiring much time for the adhesion of the wafer... Agent: Ulvac, Inc.

20110292563 - Transformer assembly and methods of use: A transformer assembly is described. Embodiments of the transformer assembly are adapted to facile disconnection and removal of a transformer from the transformer assembly without disconnecting service lines from the transformer assembly. Moreover, embodiments of the transformer assembly are adapted to de-energize the transformer without interrupting primary power to downstream... Agent:

20110292565 - Capacitor structure: A capacitor structure includes a plurality of conductive line levels located over the substrate. Each of the conductive line levels includes a first conductive line and a second conductive line. The first conductive lines in the conductive line levels form a first conductive line co-plane and the second conductive lines... Agent: United Microelectronics Corp.

20110292564 - Power storage device and method for manufacturing the same: To provide a method for forming an electrode for a storage battery, including the step of: forming a metal layer which is over a current collector and has an edge portion; and forming a crystalline silicon layer, which is over the etched metal layer and includes a silicon whisker, as... Agent: Semiconductor Energy Laboratory Co., Ltd.

20110292566 - Cyanoresin polymer for dielectric film, process of making and associated article: A cyanoresin polymer is described, wherein about 10 percent to about 60 percent of the side chains on the polymer include a cyano group; and substantially all of the remaining polymer side chains include a hydroxyl group. A method of forming such a cyanoresin polymer is described. A capacitor having... Agent: General Electric Company

20110292567 - Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal... Agent: Kemet Electronics Corporation

20110292568 - Electrode film, electrode, method for manufacturing the electrode, and electrical storage device: Provided is an electrode film comprising an active material having an average particle diameter being equal to or more than 2 μm and equal to or less than 50 μm and inorganic particles containing a conductive ion and having an average diameter being equal to or more than 1 nm... Agent: Sumitomo Chemical Company, Limited

20110292571 - Halogenated activated carbon materials for high energy density ultracapacitors: A method for producing a halogenated activated carbon material includes heating a natural, non-lignocellulosic carbon precursor in an inert or reducing atmosphere to form a first carbon material, mixing the first carbon material with an inorganic compound to form a mixture, heating the mixture in an inert or reducing atmosphere... Agent:

20110292569 - Multi-layered electrode for ultracapacitors: A multi-layer electrode includes a current collector having opposing first and second major surfaces, a fused carbon layer formed over one or both of the major surfaces, a conductive adhesion layer formed over each fused carbon layer, and an activated carbon layer formed over each conductive adhesive layer. The multi-layer... Agent:

20110292570 - Process for encapsulating metals and metal oxides with graphene and the use of these materials: m

20110292574 - High density capacitor: A high density capacitor 12, a method of manufacturing it, and applications of it are described. The capacitor 12 is an electrochemical capacitor using a metal ion accepting cathode 22 and a metal ion accepting anode 26 and a amorphous solid electrolyte 24 between. The cathode and anode may be... Agent: Nxp B.v.

20110292572 - Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable... Agent: Kemet Electronics Corporation

20110292573 - Solid electrolytic capacitor: A solid electrolytic capacitor capable of assuredly connecting a lead terminal and a lead wire while increasing a capacity of a capacitor element is provided. The present invention is directed to a solid electrolytic capacitor in which a capacitor element 1 having a positive electrode lead wire 12 protruded from... Agent: Showa Denko K.k.

20110292575 - Electric switchgear panel with improved arc protection assembly: A switchgear panel comprises an enclosure having an internal volume suitable to accommodate corresponding electrical or electronic equipment, and an arc protection assembly which is operatively associated to a wall of the enclosure. The arc assembly comprises at least a first barrier element having a first surface which is provided... Agent: Abb Technology Ag

20110292577 - Front panel apparatus: A front panel apparatus improves aesthetic qualities while avoiding interference between a display panel and a surrounding member. The front panel apparatus includes a display panel capable of pivoting in opening and closing directions, power transmission mechanisms that operate in tandem with the opening and closing operations of the display... Agent: Alpine Electronics, Inc.

20110292579 - Keyboard module and electronic apparatus: According to one embodiment, an electronic apparatus includes a casing, a keyboard unit and a spacer. The casing includes a first face exposed to an outside region, a second face opposed to the first face and a plurality of hole sections penetrating from the first face to the second face.... Agent: Kabushiki Kaisha Toshiba

20110292578 - Mobile terminal: Disclosed is a mobile terminal capable of being slid in two directions. The mobile terminal includes a front body, a rear body, and a slide module configured to allow the front body to be slid along a lengthwise direction and widthwise direction with respect to the rear body. The slide... Agent:

20110292576 - Portable electronic device with rotatable cover: A portable electronic device includes a base, a cove, a first plate, a second plate, a first post, a second post, and an adjusting mechanism. The first plate is secured to the cover. A guiding slot and a receiving hole are defined in the first plate. The second plate is... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20110292581 - Positioning rack module and an electronic device assembly incorporatiing the same: A positioning rack module for supporting a computer at a backside of a display device includes a movable frame. The movable frame includes a movable frame body to be disposed at the backside of the display device, and a first receiving portion formed in the movable frame body for receiving... Agent: Aopen Inc.

20110292582 - Desktop computer with monitor mount: A desktop computer includes a monitor defining a number of screw holes in the backside and a chassis defining a number of fixing holes. A number of screws extending through the fixing holes of the chassis and mounts into the corresponding screw holes of the monitor, to mount the monitor... Agent: Hon Hai Precision Industry Co., Ltd.

20110292584 - Docking station and electronic apparatus using the same: A docking station and an electronic apparatus using the same are provided. The electronic apparatus includes a portable computer and a docking station. The docking station includes a body, a base and a connecter, and the portable computer is detachably connected to the docking station. The base is movably connected... Agent: Asustek Computer Inc.

20110292583 - Portable electronic device: A portable electronic device includes a host, a display unit pivotably connected to the host, and a projecting unit received in the display unit. The projecting unit is configured for receiving video signals from the host and projecting corresponding image on the display unit.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110292585 - Portable folding electronic device: A portable folding electronic device has a base with a longer length dimension and a shorter width dimension and a user interface on one surface. The user interface may be oriented for use when the base has a portrait orientation. The device also has a screen unit with a longer... Agent: Research In Motion Limited

20110292586 - Data storage device: A data storage device comprises a storage device and a carrier, allows the storage device's metal contacts and electronic device(s) to be respectively installed on a substrate's outer surface and inner surface, and embodies metal contacts on the storage device constantly and not perfectly or horizontally plugged into or unplugged... Agent: Walton Advanced Engineering Inc.

20110292587 - Server system: A server system includes at least one motherboard, a control board, and a power module. The control board is connected electronically to each motherboard. The control board includes an I/O module for connecting at least one external device and a switching module for switching each motherboard to connect electronically to... Agent: Wistron Corporation

20110292589 - High-density computer system: A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a... Agent: Caswell Inc.

20110292590 - Mounting element for an expansion card as well as corresponding arrangement of a mounting element with an expansion card in a computer system: A mounting element for an expansion card in a computer system includes a bracket-like construction and at least two retaining arms that at least partially encompass an expansion card held in the mounting element, wherein the mounting element can be locked on a retaining element of a module carrier, and... Agent: Fujitsu Technology Solutions Intellectual Property Gmbh

20110292588 - Planar information device: An substantially planar information device is provided comprising: a memory module including a memory device and an electrical interface to connect the memory device to a complementary interface of a computing device; and a housing including a recess in which the memory module can be removably received, a receptacle to... Agent: 2082053 Ontario Limited

20110292591 - Expanding functionality of one or more hard drive bays in a computing system: Methods, apparatus, and product are disclosed for expanding functionality of hard drive bays in a computing system that include: providing, by a connector in a hard drive bay, access to two or more data communication busses of different type; receiving, by the connector of the hard drive bay, a device... Agent: International Business Machines Corporation

20110292592 - Thermal management systems and methods: A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces.... Agent: Hewlett-packard Development Company, L.p.

20110292593 - Independently operable ionic air moving devices for zonal control of air flow through a chassis: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction... Agent: International Business Machines Corporation

20110292594 - Scalable space-optimized and energy-efficient computing system: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the... Agent: International Business Machines Corporation

20110292580 - Airflow duct: An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20110292595 - Liquid cooling system for stackable modules in energy-efficient computing systems: A computing system is provided. In the computing system, a plurality of modules physically arranged in a three dimensional hexadron configuration. In the computing system, the at least one module is either a liquid-tight module filled with a non-conductive liquid coolant or a module cooled with a liquid coolant circulating... Agent: International Business Machines Corporation

20110292596 - Heatsink allowing in-situ maintenance in a stackable module: A modular processing module allowing in-situ maintenance is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors, and a plurality of processing nodes. Each processing module side couples to another processing module side using at... Agent: International Business Machines Corporation

20110292597 - Stackable module for energy-efficient computing systems: A modular processing module is provided. The modular processing module comprises a set of processing module sides. Each processing module side comprises a circuit board, a plurality of connectors coupled to the circuit board, and a plurality of processing nodes coupled to the circuit board. Each processing module side in... Agent: International Business Machines Corporation

20110292598 - Integrated embedded battery: A portable power source assembly including a plurality of battery cells that are directly attached to a housing used to enclose and support operational components of a portable computing device. A flexible interconnect component is used for electrically interconnecting the battery cells. Protective structures can be provided in discrete locations... Agent: Apple Inc.

20110292599 - Server enclosure and connection element thereof: A server enclosure includes a power input terminal to receive power signals, a number of connection elements, a number of lead terminals, and a number of power output terminals. Each connection element includes a connection portion and two fixing arms extending from opposite ends of the connection portion. The connection... Agent: Hon Hai Precision Industry Co., Ltd.

20110292601 - Dehumidifying and re-humidifying apparatus and method for an electronics rack: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes a dehumidifying air-to-liquid heat exchanger disposed at an air inlet side of the rack and a re-humidifying structure disposed at an air outlet side of the rack. The dehumidifying air-to-liquid heat exchanger is in... Agent: International Business Machines Corporation

20110292600 - Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack: Dehumidifying and re-humidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet side of the rack, wherein air flows through the rack from the air inlet side to an air outlet side. The heat exchanger, which is... Agent: International Business Machines Corporation

20110292602 - Cooling arrangement for a rack mounted processing device: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air... Agent:

20110292603 - Airflow control apparatus: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed.... Agent: International Business Machines Corporation

20110292604 - Air cooling of medium voltage drive components: A parallel redundant fan system includes at least first and second fans located adjacent each other. Each fan includes: (i) a fan housing defining a fan chamber in which an impeller is supported for rotation about an axis of rotation; (ii) a first chamber outlet in communication with the fan... Agent: Rockwell Automation Technologies, Inc.

20110292606 - Electronic device with fixing members: An electronic device includes a fan including a frame, an enclosure, and many fixing members engaged with the enclosure to fix the fan in the enclosure. The frame includes many mounting holes positioned in corners of the frame, respectively. The enclosure includes many sidewalls and many fixing members corresponding to... Agent: Ambit Microsystems (shanghai) Ltd.

20110292605 - Heat-dissipating hinge and a portable electronic device with the same: A portable electronic device has a cover, a base and a heat-dissipating hinge. The heat-dissipating hinge has a cam and a foot. The cam is attached to the cover. The foot abuts the cam and protrudes out of the base. When the cover is opened, the cam is rotated to... Agent:

20110292607 - Semiconductor package having a cooling fan and method of fabricating the same: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the... Agent: Amtek Semiconductors Co., Ltd.

20110292608 - Heat dissipation device: An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink.... Agent: Hon Hai Precision Industry Co., Ltd.

20110292609 - Lightweight audio system for automotive applications and method: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical... Agent:

20110292610 - Heat sink and electronic apparatus using the same: A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from an end of... Agent: Hon Hai Precision Industry Co., Ltd.

20110292611 - Semiconductor-device cooling structure and power converter: A power converter includes a plurality of semiconductor modules each including a semiconductor device that generates heat and a cooler that includes a first cooling element, on which the semiconductor device is directly mounted through a connecting member, and a second cooling element having a higher heat capacity than the... Agent: Kabushiki Kaisha Yaskawa Denki

20110292612 - Electronic device having electrically grounded heat sink and method of manufacturing the same: An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide... Agent: Lsi Corporation

20110292614 - Cooling module assembly method: A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with... Agent:

20110292613 - Locking device and method for making the same: A locking device providing thermal management for an electrical assembly board is described and includes a fluid-permeable member saturated with a fluid and disposed between the electrical assembly board and a heat sink; a pair of locking device substrates substantially orthogonal to the electrical assembly board and the heat sink;... Agent: General Electric Company

20110292615 - Printed circuit board system for automotive power converter: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold... Agent: Lear Corporation

20110292616 - Lightweight audio system for automotive applications and method: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical... Agent:

20110292617 - Power module with current sensing: A power module operable to sense current, such as but not limited to a power module operable within a vehicle to sense current while rectifying an AC input to a DC output. The power module may include a shunt disposed relative an output of the power module to facilitate the... Agent: Lear Corporation

20110292618 - Apparatus, add-on module, and a system comprising a host apparatus and an add-on module: An apparatus (102) comprises a mechanical interface configured to mechanically receive a module (101) into an assembled configuration. Within said mechanical interface, the apparatus comprises a first connector configured to receive a first matching counterpart in a first insertion direction (103), and a second connector configured to receive a second... Agent: Nokia Corporation

20110292620 - Circuit board packaging structure: The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating... Agent: Hitachi, Ltd.

20110292619 - Electronic component and method for producing such an electronic component: An electronic component having electrically conductive contacts and a printed circuit board enclosed by a sheathing made from a first plastic, and a method for manufacturing the electronic component. Such electronic components are used in oil pans of a transmission. The electrically conductive contacts are enclosed by a frame made... Agent:

20110292621 - Grounded lid for micro-electronic assemblies: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically... Agent: International Business Machines Corporation

20110292622 - Method for electric circuit deposition: (c) depositing by means of an electroless process a layer of a second metal or alloy thereof on the exposed part of the first metal or alloy thereof present in the substrate as obtained in step (b), whereby inhibiting material that is still present on the substrate after step (b)... Agent: Nederlandse Organisatie Voor Toegepast- -natuurwetenschappelijk Onderzoek Tno

20110292624 - Electronic control unit: An electronic control unit includes an electronic circuit board mounted with a plurality of electronic components disposed in a scattered manner on one or both surfaces of the board and at least one connector, and the electronic circuit board is housed in an enclosure made up of enclosure members including... Agent: Mitsubishi Electric Corporation

20110292623 - Methods for assembling electronic devices by internally curing light-sensitive adhesive: Assemblies of structures such as electronic device assemblies may be connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light sources such as ultraviolet-light light-emitting diodes may be mounted to a substrate such as a printed circuit board substrate. The substrate may be mounted to an assembly formed from a... Agent:

20110292625 - Bonding pad structure: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding... Agent: Wintek Corporation

20110292626 - Lower-face electrode type solid electrolytic multilayer capacitor and mounting member having the same: In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an... Agent: Nec Tokin Corporation

20110292627 - Stacked inductive device assemblies and methods: Improved inductive electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises an inductive device module comprising N inductors and N+1 core elements. The core elements comprise ferrite core pieces that are optionally identical to one another. These core elements are stacked (e.g., in a... Agent:

20110292628 - Anti-ultraviolet memory device and fabrication method thereof: The invention provides an anti-UV electronic device and fabrication method thereof. The anti-ultraviolet (anti-UV) electronic device includes an integrated circuit die, wherein the integrated circuit die has an ultraviolet (UV) light erasable memory; and an anti-UV light layer is formed on and covers the ultraviolet (UV) light erasable memory.... Agent:

20110292629 - Receiving apparatus: A receiving apparatus includes two electronic boards having flat surfaces that are disposed substantially-parallel to each other and that at least partially overlap each other, and an antenna that is mounted on the two electronic boards. The antenna includes a first metal line that is mounted along the flat surface... Agent: Fujitsu Ten Limited

20110292630 - Device for acquiring information regarding the inside of a tire: A tire inside information acquiring device (100) attached inside a tire-wheel assembly, includes a housing body (10) configured to house a receiving antenna for receiving a radio signal and an electronic circuit unit connected to the receiving antenna, the electronic circuit unit constitutes the tire inside information acquiring device (100),... Agent: Bridgestone Corporation

20110292631 - Aperture edge emission suppression using ferrite: An electronic device is within a housing that has an aperture through an enclosure surface of the housing. A ferrite block is attached to an edge of the aperture, thus transforming electromagnetically-induced current next to the aperture into heat in order to reduce a voltage across the aperture, thereby suppressing... Agent: International Business Machines Corporation

20110292632 - Method for manufacturing a semiconductor component and structure therefor: A semiconductor component and a method of manufacturing the semiconductor component that reduces parasitic elements. A semiconductor chip is coupled to a semiconductor chip receiving area of a support structure. The semiconductor chip has at least two power semiconductor devices. A drain contact of a first power semiconductor device is... Agent:

20110292633 - Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending... Agent: Koninklijke Philips Electronics N.v.