Electricity: electrical systems and devices inventions 10/09

20090244794 - Switching circuit: A switching circuit, e.g. an RCD, comprises a pair of mechanical contacts (M) in an alternating current electricity supply (N, L) and circuit means (SCR) for opening the contacts to cut off the supply in response to a switching signal (S). The switching circuit includes further circuit means (Rs, Cs,... Agent: The Nath Law Group

20090244795 - Device for a remote monitoring the state of at least a single-pole surge protection: The invention relates to a device for a remote monitoring the state of at least a single-pole surge protection which consists of a bracket (1) and at least one slide-in protective member (2) whereas the bracket (1) and also the slide-in protective members (2) are fitted with mechanical devices for... Agent: Dority & Manning, P.A.

20090244796 - Electrostatic discharge protection circuit including ovonic threshold switches: An electrostatic discharge protection circuit may include ovonic threshold switches that have a holding voltage greater than an input voltage normally received from a pad. As a result, the ovonic threshold switches provide a low resistance state to shunt current from the pad when an electrostatic discharge protection event occurs... Agent: Trop, Pruner & Hu, P.C.

20090244797 - Protection circuit: A protection circuit according to an embodiment of the present invention is provided between a first terminal and a second terminal and includes: a capacitor element having one end connected to the second terminal; and a multi-cathode thyristor formed on a semiconductor substrate, and including an anode connected to the... Agent: Young & Thompson

20090244798 - Power status notification method and power status notification circuit: A power status notification method notifying a first device that a second power supply of a second device different from a first power supply of the first device is turned off, where a source voltage of the first power supply is different from a source voltage of the second power... Agent: Staas & Halsey LLP

20090244799 - Latch-up protection circuit for lcd driver ic: A latch-up protection circuit for LCD driver is provided. The latch-up protection circuit for LCD driver comprises an NMOS, a switch and a capacitor. The NMOS comprises a drain electrically connected to a ground; a source electrically connected to a negative voltage source; and a gate. The switch is electrically... Agent: Hayes Soloway P.C.

20090244800 - Surge protection apparatus and methods: Improved over-voltage protection apparatus and associated methods useful in e.g., telecommunications applications. In one embodiment, the over voltage protection apparatus comprises a gas discharge tube, common mode inductor, coupled inductor, secondary over-voltage protection device, filter circuitry, coupled inductor and common mode inductor. In one embodiment the over voltage protection apparatus... Agent: Gazdzinski & Associates

20090244801 - Operative control circuit of multiple electromagnetic actuating devices in series and parallel connection: An operative control circuit of multiple electromagnetic actuating devices in series and parallel connections, wherein individually installed driving coils of two or more than two electromagnetic actuating devices being operatively controlled by a switching device to appear lower impedance in parallel connection or series and parallel connection for electrification thereby... Agent: Bacon & Thomas, PLLC

20090244802 - Ignition device: The ignition device is comprised of a center electrode, an insulator having a tubular shape for covering the center electrode, and a ground electrode having an open portion communicating with an open portion of the insulator, the ground electrode covers the insulator The center electrode, the insulator and the ground... Agent: Nixon & Vanderhye, PC

20090244804 - C0g multi-layered ceramic capacitor: e

20090244805 - Dielectric ceramic a nd multilayer ceramic capacitor: Provided is a dielectric ceramic in which, while achieving a dielectric constant ε of 500 or more, a breakdown voltage higher than 90 kV/mm can be obtained and which is suitable for constituting dielectric ceramic layers of a multilayer ceramic capacitor for medium-to-high voltage application. As the dielectric ceramic constituting... Agent: Dickstein Shapiro LLP

20090244803 - Multilayer chip capacitor: A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side... Agent: Mcdermott Will & Emery LLP

20090244806 - Capacitors and methods of forming capacitors: A method of forming a capacitor includes forming a conductive first capacitor electrode material comprising TiN over a substrate. TiN of the TiN-comprising material is oxidized effective to form conductive TiOxNy having resistivity no greater than 1 ohm·cm over the TiN-comprising material where x is greater than 0 and y... Agent: Wells St. John P.s.

20090244807 - Multilayer chip capacitor, motherboard apparatus having the same, and power distribution network: There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged in a laminated direction; and first to fourth outer electrodes formed on side surfaces of the capacitor body, respectively, wherein the first capacitor unit includes first and second inner electrodes of different... Agent: Mcdermott Will & Emery LLP

20090244808 - Thin-film capacitor: An object of the present invention is to restrain warpage in a thin-film trench capacitor. A thin-film capacitor includes a substrate, a dielectric film, and a pair of electrodes, and the dielectric film is provided along a concave-convex surface on which are formed a plurality of convex portions extending away... Agent: Oliff & Berridge, PLC

20090244809 - Thin-film device and method of manufacturing same: A thin-film device includes a substrate, and a capacitor provided on the substrate. The capacitor incorporates a lower conductor layer having a top surface and a side surface; a flattening film disposed to cover the top and side surfaces of the lower conductor layer; a dielectric film disposed on the... Agent: Oliff & Berridge, PLC

20090244810 - Electrochemical capacitor: An electroactive material for charge storage and transport in an electrochemical capacitor. The material is formed of a plurality of nanocomponents including nanoparticles, in turn formed of conductive carbon-based clusters bound together by a conductive carbon-based cluster binder including nanoclusters and nanocluster binders, all having high densities of mobile charge... Agent: David E. Lovejoy, Reg. No. 22,748

20090244811 - Electrolytic capacitor assembly containing a resettable fuse: A fused electrolytic capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the fused electrolytic capacitor assembly contains an electrolytic capacitor element and a resettable fuse contained within a case. The capacitor assembly also contains a stress absorbing material that is positioned... Agent: Dority & Manning, P.A.

20090244812 - Hermetically sealed capacitor assembly: A capacitor assembly that includes a conductive polymer electrolytic capacitor that is enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas is provided. Without intending to be limited by theory, the present inventors believe that the ceramic housing is capable of limiting the amount... Agent: Dority & Manning, P.A.

20090244813 - Methods of making a niobium metal oxide and oxygen reduced niobium oxides: Methods to at least partially reduce a niobium oxide are described wherein the process includes mixing the niobium oxide and niobium powder to form a powder mixture that is then heat treated to form heat treated particles which then undergo reacting in an atmosphere which permits the transfer of oxygen... Agent: Kilyk & Bowersox, P.l.l.c.

20090244814 - Solid electrolytic capacitor device and manufacturing method of the same: A method for manufacturing a solid electrolytic capacitor device is disclosed. The solid electrolytic capacitor device comprises a package substrate and a capacitor element which is mounted on the package substrate. The package substrate comprises an outer anode electrode, an outer cathode electrode, an inner anode electrode and an inner... Agent: Frishauf, Holtz, Goodman & Chick, PC

20090244815 - Modular electrical bus system with built in ground circuit: A modular electrical bus system has a grounding circuit through a plurality of modular I/O units with each unit being both electrically and mechanically connectable together via a bridge member connecting adjacent units and the main communication module. The bridge member and modular I/O units are grounded together with a... Agent: Reising Ethington P.C.

20090244816 - Generator ready load center: The present invention relates generally to a load center. More particularly, the invention encompasses a generator ready load center (GRLC). The present invention is also directed to a novel generator ready load center (GRLC) that operates as a standard load center but is ready to accommodate an automatic transfer switch... Agent: Siemens Corporation Intellectual Property Department

20090244817 - Electrical distribution system: An electrical distribution system includes a primary distribution panel connectable to a main power line; a plurality of primary circuit breakers located in the primary distribution panel; a plurality of primary electrical lines electrically connected to the primary circuit breakers; at least one secondary distribution panel electrically connected to the... Agent: The Webb Law Firm, P.C.

20090244818 - Tamper resistant meter cover: An electrical meter is provided that includes a cover configured for securement onto a base. The meter includes features that resist meter tampering, and features that provide evidence of meter tampering.... Agent: Woodcock Washburn LLP

20090244821 - Electro-optic apparatus and electronic instrument: An electro-optic apparatus includes: an electro-optic panel; and a holding member configured to hold at least the electro-optic panel, in which the holding member includes a shoulder configured to support at least part of a peripheral edge of the electro-optic panel, and the shoulder does not support the electro-optic panel... Agent: Harness, Dickey & Pierce, P.L.C

20090244819 - Housing assembly for electronic device: A housing assembly (10) and a portable electronic device (100) using the housing assembly is provided. The housing assembly includes a main body (12), a first decorative member (14), and a second decorative (16). The first decorative member has a first appearance, and the first decorative member (14) is mounted... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244822 - Touch control pen for a portable electronic device: A touch control pen for a portable electronic device includes a resilient positioning sleeve sleeved sealingly on an elongate main body and disposed adjacent to a head end of the main body. When the touch control pen is inserted into a slot defined by a looped surrounding wall of a... Agent: Haynes And Boone, LLPIPSection

20090244824 - Modular keyfob with pivoting armatures: In at least one embodiment, a keyfob assembly comprising a housing and a battery chamber is provided. The housing includes a plurality of electrical components positioned therein for transmitting radio frequency (RF) signals to a vehicle. The battery chamber is positioned within the housing and includes at least one removable... Agent: Brooks Kushman P.C. / Lear Corporation

20090244820 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a functional component contained in a first housing and a camera module contained in a second housing. The second housing is swingable with respect to the first housing. The second housing includes an opening part through which a display screen is exposed... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090244825 - Electronic apparatus and panel: An electronic apparatus has a panel that includes: a decorative plate which forms an outer surface; and a panel main body having an upright wall provided upright along the side surface of the decorative plate and surrounding the whole circumference of the decorative plate and having a depressed section surrounded... Agent: Staas & Halsey LLP

20090244823 - Heart shaped structure with altering appearance: The present invention discloses a heart shaped structure with altering appearance comprising: a right base with an accommodating cavity; a left base flippable and pivot-jointed to the accommodating cavity of right base; a right upper cover pivot-jointed to the side of right base, with a fingerprint recognition device and a... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090244826 - Airflow management apparatus for computer cabinets and associated methods: Airflow management apparatuses for computer cabinets and associated methods are disclosed herein. The computer cabinets include a plurality of computer modules positioned between an air inlet and an air outlet and an air mover configured to move a flow of cooling air from the air inlet, past the plurality of... Agent: Perkins Coie LLP Patent-sea

20090244829 - Heat removal system for computer rooms: According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a... Agent: Baker Botts LLP

20090244827 - System and method for portable information handling system thermal shield: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier... Agent: Hamilton & Terrile, LLP

20090244828 - System unit of a computer: The invention relates to a system unit of a computer. The system unit has a plug-in card populated with components and a fan which supplies an air flow to an air ducting body arranged in the system unit. The air flow is provided for cooling the plug-in card which is... Agent: Siemens Corporation Intellectual Property Department

20090244830 - Systems and methods for cooling a computing component in a computing rack: According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a... Agent: Baker Botts LLP

20090244831 - Computer with simplified layout, designed for aviation: The present invention belongs to the field of reduced-dimension computers of the ARINC 600 computer type of small and medium dimensions. The advantage of the invention is that it allows optimization of use of the volume of the computers. The surface area for accommodating electronic components on one board is... Agent: Lowe Hauptman & Berner, LLP

20090244833 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a cabinet having an outer surface and an inner surface, a plurality of operation button display portions formed on the outer surface of the cabinet, a touchpad which is provided on the inner surface of the cabinet in confrontation with the operation... Agent: Knobbe Martens Olson & Bear LLP

20090244834 - Mobile terminal device: A mobile terminal device including a movable side housing having a movable side rear case, a fixed side housing connected to the movable side housing with a connection part. An emitting member is provided to the movable side rear case, and a curved panel that covers the emitting member is... Agent: Staas & Halsey LLP

20090244835 - Mobile terminal device: A mobile terminal device includes a movable side housing, a fixed side housing connected to the movable side housing with a hinge part and a thin-wire cable as an electrical current flow passage electrically connected between the movable side housing and the fixed side housing. A cable mount cover member... Agent: Staas & Halsey LLP

20090244832 - Portable computer with multiple display configurations: A portable computer that is configurable between a plurality of display modes including a laptop mode (in which the portable computer has a conventional laptop appearance) and an easel mode in which the base of the computer and its display component stand vertically forming an inverted “V.” The portable computer... Agent: Lando & Anastasi, LLP

20090244836 - Attach a mobile mouse to your laptop: A docking system which can be used with any laptop, and can allow a mouse or other peripheral device to attach to the back surface of the laptop screen, such as the top of the display when closed. A docking piece is attached to the flat surface of the laptop... Agent: Townsend And Townsend And Crew, LLP

20090244837 - Heat-dissipating module: A heat-dissipating module includes a heat-dissipating member and at least one heat pipe. The heat-dissipating member includes a pillared convexity and an annular groove formed on and surrounding the heat-dissipating member. The at least one heat pipe passes through the annular groove, partially surrounding the convexity and stopped against the... Agent: Bacon & Thomas, PLLC

20090244838 - Housing for an electronic unit: An electronic unit housing includes (i) a receiving space for receiving a printed circuit board, (ii) at least one foot, which is designed to fasten the electronic unit housing onto a base, and is disposed to the side of the receiving space relative to a projection of the receiving space... Agent: Kramer Levin Naftalis & Frankel LLP Intellectual Property Department

20090244842 - Cooling device for acommodated printed circuit board in a chassis: A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space,... Agent: Staas & Halsey LLP

20090244839 - Electronic device: An electronic device that includes a cabinet having a top face, an undersurface, and a side that completely surrounds the top face and the undersurface by connecting the outer edge of the top face and the outer edge of the undersurface together; and an electronic part disposed inside the cabinet,... Agent: Staas & Halsey LLP

20090244840 - Electronic device: An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second component is heated with the heating part... Agent: Staas & Halsey LLP

20090244841 - In-vehicle apparatus: An audio-integrated apparatus has a body casing attached in an instrument panel of a vehicle. The body casing contains a media reader, a circuit board having a CPU, a CPU fan for cooling the CPU, and an exhaust fan. A media loading slot is in a front face of the... Agent: Posz Law Group, PLC

20090244843 - Cooling device and electronic apparatus having the cooling device: A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being... Agent: Turocy & Watson, LLP

20090244844 - Heat-dissipating module: A heat-dissipating module includes a heat sink, a plurality of fixtures, and a plurality of fasteners. The heat sink includes a plurality of fins and a plurality of hollowed portions located at a periphery thereof. Each of the fixtures includes a support portion and two lap joint portions. Each of... Agent: Bacon & Thomas, PLLC

20090244845 - Motor controller: A motor controller capable of relaxing the temperature of a heat source which generates heat by driving the motor controller, and capable of realizing miniaturization and low price is provided. In a motor controller in which a power semiconductor module (2) which closely contact a heat sink (1) is mounted... Agent: Sughrue-265550

20090244846 - Electronic device, cooling device and loop heat pipe: According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path.... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090244847 - Mounting device for chips: A mounting device for chips has a heat sink and at least one clamp. The heat sink has at least one conductive side, two ends, multiple chip units and two connecting bases. The chip units are arranged on the at least one conductive side. The connecting bases are formed on... Agent: Pai Patent & Trademark Law Firm

20090244848 - Power device substrates and power device packages including the same: Provided are power device substrates that comprise thermally conductive plastic materials, and power device packages including the same. An exemplary power device package includes a power device substrate that comprises a thermally conductive plastic material, and has a first principal plane that provides an electrically insulating surface and a second... Agent: Townsend And Townsend And Crew, LLP

20090244849 - Heat dissipation device: A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244851 - Mounting device for mounting heat sink onto electronic component: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244850 - Thermal interface material for combined reflow: A combined thermal interface material and second layer interconnect reflow material and method are disclosed.... Agent: Cool Patent, P.C. C/o Cpa Global

20090244852 - Heat radiator: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates;... Agent: Staas & Halsey LLP

20090244853 - Mobile terminal device equipped with display: An organic EL display formed by welding a lid body and a substrate is arranged in a recessed surface of a cabinet; and at least two cushions are arranged between a bottom surface of the recessed surface and the substrate, the cushions being spaced apart from each other along a... Agent: Procopio, Cory, Hargreaves & Savitch LLP

20090244855 - Data processing modules and systems: Data processing modules including a housing and connectors carried by the housing, and systems including the same.... Agent: Hewlett Packard Company

20090244854 - Integrated-inverter electric compressor and inverter device: The invention provides an integrated-inverter electric compressor and an inverter device thereof which allow handling of the inverter device by neither touching nor holding a CPU substrate. An integrated-inverter electric compressor includes an inverter module integrating a power-related metal substrate on which a power semiconductor switching device is mounted and... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090244856 - Retracting lock mechanism for an electronics device: A retractable locking mechanism comprising: a lever having a handle end opposite a rotation end and a pivot point positioned between the handle end and the rotation end such that the lever pivots about an axis of rotation of the lever; a first cam positioned on the rotation end of... Agent: Greenberg Traurig, LLP

20090244857 - Circuit device: a circuit device includes a dielectric substrate including a first face and a second face opposite side of the first face; a coplanar line including a first line, a second line and ground electrodes, the first line and the second line being decupled mutually, the ground electrodes formed around the... Agent: Staas & Halsey LLP

20090244858 - Ic card having improved electrical contacts: An IC Card includes a microchip having memory portions storing programs and a plurality of electrical contacts including a first set of electrical contacts connected to the microchip for supporting respective and predetermined functions, according to a predetermined ISO 7816 standard that reserves a second set of the electrical contacts... Agent: Allen, Dyer, Doppelt, Milbrath & Gilchrist P.A.

20090244859 - Flexible printed circuit board and electronic apparatus: According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the... Agent: Knobbe Martens Olson & Bear LLP

20090244860 - Mounting structure of semiconductor device and electronic apparatus using thereof: A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of... Agent: Sughrue Mion, PLLC

20090244861 - Server enclosure with transfer card module: The invention relates to a server enclosure with a transfer card module with a chassis having a side, a mounting bracket attached to the side of the chassis, and a transfer card secured to the mounting bracket. The mounting bracket includes a first sidewall and an opposite second sidewall. A... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244862 - Computer enclosure: The invention is related to a computer enclosure. The computer enclosure includes a chassis, an expansion card, and a rotating member. The expansion card includes a shield plate which has a bent end formed thereon. The chassis includes a sidewall. A slot is defined in the sidewall. The sidewall forms... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244863 - Mounting device for mounting heat sink onto electronic component: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244864 - Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof: Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which... Agent: Staas & Halsey LLP

20090244865 - Method for manufacturing multilayer printed wiring board: A method for manufacturing a multilayer printed wiring board having an electronic component housed therein includes forming a first conductor circuit on a first surface of a substrate. A first alignment mark is formed on the first surface of the substrate separate from the conductor circuit and forming a through... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090244866 - Circuit device: The circuit device includes a first transmitting inductor, a first insulating layer, a first receiving inductor, and a second receiving inductor. The first transmitting inductor is constituted of a helical conductive pattern and receives a transmitted signal. The first receiving inductor is located in a region overlapping the first transmitting... Agent: Mcginn Intellectual Property Law Group, PLLC

20090244867 - Methods of fabricating multichip packages and structures formed thereby: Methods and associated structures of forming a discontinuous sealant on a substrate, wherein an opening is formed at an integrated heat spreader gap region, wherein the substrate comprises a portion of a multi chip microelectronic package. A thermal interface material is placed on a top surface of a high power... Agent: Intel Corporation C/o Cpa Global

20090244868 - Semiconductor device and bonding material: The present invention is directed to enhancing the bonding reliability of a bonding portion between an Al electrode of a semiconductor device and a bonding material having metal particles as a main bonding agent. In the semiconductor device, a semiconductor element and an Al electrode are connected to each other... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090244869 - Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring: A semiconductor device has a wiring board having a wiring, a semiconductor chip that is mounted on the wiring board, and an electric conductor reference plane provided in the inside of the wiring board, in which in top view. The wiring includes a first region that overlaps the electric conductor... Agent: Mcginn Intellectual Property Law Group, PLLC

20090244870 - Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system: In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, the each semiconductor chip has a heat sink has heat sink spring-loaded against the semiconductor chips. Posts coupled... Agent: Texas Instruments Incorporated

20090244871 - Structured light-emitting module for lighting apparatus: A light-emitting module for a lighting apparatus comprises at least two substrates, each provided with a printed circuit having an LED, and plural matching terminal blocks and buckles so that the substrates can be structured into a planar light-emitting module having a relatively large area by assembly of the terminal... Agent: Birch Stewart Kolasch & Birch

20090244872 - Supporting mechanism and portable electronic device using same: A portable electronic device (100) is described including a housing (10) and a supporting mechanism (30) supporting the housing. The supporting mechanism includes a shaft (32) secured relative to the housing, a gear (34) rotatably secured with the shaft, a supporting rod (36) secured with the gear, and a rack... Agent: PCe Industry, Inc. Att. Steven Reiss

20090244873 - Optical package: A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering... Agent: Pearl Cohen Zedek Latzer, LLP

20090244874 - Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same: A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the... Agent: Intel Corporation C/o Cpa Global

20090244875 - Lead frame module for manufacturing light emitting diodes: A lead frame module integrally formed from a single thin metal sheet includes: parallel first and second rails extending in a first direction; and first and second lead frame sets connected to the first and second rails, respectively. The first and second lead frame sets respectively include a plurality of... Agent: Rosenberg, Klein & Lee

20090244878 - Conforming, electro-magnetic interference reducing cover for circuit components: An electronic circuit component is provided with shielding for electro-magnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is... Agent: Ropes & Gray LLP

20090244876 - Multi-cavity electromagnetic shielding device: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and... Agent: Vedder Price P.C.

20090244877 - Pcb layout structrue for suppressing emi and method thereof: A PCB layout structure for suppressing EMI and a method thereof is disclosed. The PCB layout structure for suppressing EMI includes a multi-layer PCB, a plurality of electric grids, and a plurality of conductive vias. The multi-layer PCB has a plurality of signal layers and a grounding layer. Each of... Agent: Rosenberg, Klein & Lee