SEARCH:      Monitor Keywords |  Custom RSS

Electricity: electrical systems and devices June invention type 06/09

20090161270 - Industrial arc fault circuit interrupter and method of detecting arcing conditions: A method of detecting arcing conditions includes sensing current and HF signals therefrom; bandpass filtering the HF signals and providing filtered signals; detecting peak signals and envelopes from the filtered signals; counting occurrences of the envelopes exceeding a first value; maintaining temporary values corresponding to the peak signals; determining a... Agent: Martin J. Moran

20090161271 - Novel circuit interrupting device with interconnecting reset and test buttons: The present invention provides a novel circuit interrupting device, preferably a ground fault circuit interrupter, which contains a reset button that is capable of interacting with a test button to perform an end-of-life-component test on the circuit interrupting device. The circuit interrupting device also contains a reset switch coupled to... Agent: Andrews Kurth LLP

20090161272 - Arc detection system and method: A system for identifying an arcing event in electrical distribution systems is provided. The system comprises a sensor configured to detect ultraviolet light and to generate a signal indicative of the arcing event propagating from the electrical distribution system. A processor coupled to the sensor and configured to analyze an... Agent: General Electric Company Global Research

20090161274 - Electrostatic discharge prevention circuits: An ESD prevention circuit is provided. The ESD prevention circuit comprises a voltage source, a charge-blocking unit, a first PMOS transistor, a first NMOS transistor, a second NMOS transistor, and an output unit. The charge-blocking unit is coupled to the voltage source and provides a reverse voltage to control the... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090161276 - Esd configuration for low parasitic capacitance i/o: An integrated circuit can include an I/O pad, an internal circuit, an inductor, an electrostatic discharge (ESD) protection circuit, and an ESD clamp. The internal circuit can be biased with a first voltage supply and a second voltage supply, where the internal circuit is connected to the I/O pad at... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20090161273 - High voltage tolerant electrostatic discharge protection circuit: An electrostatic discharge (ESD) protection circuit includes an NPN transistor having a collector terminal connected to a voltage source and an emitter terminal connected to the ground via a diode. The NPN transistor includes a base terminal for receiving a base current to turn on the NPN transistor to allow... Agent: Storm LLP

20090161275 - Integrated controlling chip: An integrated controlling chip includes a signal processing unit, a resistance unit and an electrostatic discharge protection circuit. The signal processing unit includes an input port. The resistance unit includes a first node coupled to a signal pin of the integrated controlling chip, and includes a second node coupled to... Agent: North America Intellectual Property Corporation

20090161277 - Method and device for preventing damage to a semiconductor switch circuit during a failure: A device includes at least one semiconductor switching circuit connected to a power source and a load and at least one breaker switch integrated with the at least one semiconductor switching circuit. The breaker circuit may be connected in series with the at least one semiconductor switching circuit and the... Agent: General Electric Company Ge Global Patent Operation

20090161278 - Short-circuit protection circuit: A short-circuit protection circuit includes a power supply, a first resistor, and an optocoupler. The optocoupler includes a light-emitting diode and a phototransistor, one end of the first resistor is connected to the anode of the power supply and the other end of the first resistor is connected to the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161279 - Output circuits: An output circuit preventing damage by electrostatic discharge current is provided, comprising a voltage source, a power-clamp ESD circuit, a PMOS transistor, an NMOS transistor, and a diode. The voltage source provides a voltage. The power-clamp ESD circuit is coupled to the voltage source and directs the electrostatic current to... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090161280 - Thermally protected metal oxide varistor having pin-type disengaging mechanism: A thermally protected metal oxide varistor having a pin-type disengaging mechanism includes a varistor body having two metal electrodes coated thereon, an insulating layer enclosing the varistor, a first lead, a second lead, a third lead, a solder, and an elastic member. The first lead and the third lead are... Agent: Rabin & Berdo, PC

20090161281 - Capacitor sharing surge protection circuit: A capacitor sharing surge protection circuit for protecting multiple ports from harmful energy surges, such as electrostatic discharge (ESD) and cable discharge events (CDE), is provided. The protection circuit includes a plurality of diodes with respective cathodes and anodes. Each anode of the plurality of diodes is coupled to one... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20090161282 - Transient protection at a line interface: A protection circuit provides transient protection to a solid state circuit of a line interface for wired telecommunications media at a voltage level below the power supply of the solid state circuit and prevents transient currents from entering the power supply distribution where they might cause damage to the protected... Agent: Rg And Associates

20090161283 - Arrangements for energy conditioning: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.... Agent: NeifeldIPLaw, PC

20090161284 - Method and apparatus for controlling a lifting magnet supplied with an ac source: A magnet controller supplied by an AC source controls a lifting magnet. Two bridges allow DC current to flow in both directions in the lifting magnet. During “Lift”, relatively high voltage is applied to the lifting magnet until it reaches its cold current. Then voltage is lowered. After a desired... Agent: Knobbe Martens Olson & Bear LLP

20090161285 - Electrostatic chuck and method of forming: An electrostatic chuck includes an insulating layer, a conductive layer overlying the insulating layer, a dielectric layer overlying the conductive layer, the dielectric layer having pores forming interconnected porosity, and a cured polymer infiltrant residing in the pores of the dielectric layer.... Agent: Larson Newman Abel & Polansky, LLP

20090161286 - Electrostatic chuck support assembly: A method of tuning the thermal conductivity of an electrostatic chuck (ESC) support assembly comprises measuring the temperature at a plurality of sites on a support assembly surface in which each site is associated with a given cell, determining from the measurements any fractional reduction in area suggested for each... Agent: Buchanan, Ingersoll & Rooney PC

20090161287 - Electronic device operable to protect a power transistor when used in conjunction with a transformer: An electronic device can be used with a system, such as an ignition system, that operates a relatively high voltage. The device can include a signal clamping control module that can include a signal reference module and a feedback control module. The signal reference module is operable to provide a... Agent: Larson Newman Abel & Polansky, LLP

20090161289 - Feedthrough multilayer capacitor mounting structure: A feedthrough multilayer capacitor mounting structure including a capacitor body, at least two each of first and second signal terminal electrodes, and at least one each of first and second grounding terminal electrodes. The capacitor body has a plurality of insulator layers laminated, a first signal inner electrode connected to... Agent: Oliff & Berridge, PLC

20090161288 - Multilayer capacitor array: Among a plurality of first inner electrodes, at least one first inner and a second inner electrode are arranged as opposed with at least one of the dielectric layers in between. Third and fourth inner electrodes are arranged as opposed with at least one of the dielectric layers in between.... Agent: Oliff & Berridge, PLC

20090161291 - Capacitor for semiconductor device and method of manufacturing the same: Provided is a capacitor for a semiconductor device. The capacitor comprises a bottom electrode, a dielectric pattern, and a top electrode. The bottom electrode has an uneven surface. The dielectric pattern is on the bottom electrode, and the top electrode is on the dielectric pattern. The bottom electrode has a... Agent: The Law Offices Of Andrew D. Fortney, Ph.d., P.C.

20090161290 - Polysilicon structures resistant to laser anneal lightpipe waveguide effects: Laser scan annealing of integrated circuits offers advantages compared to rapid thermal annealing and furnace annealing, but can induce overheating in regions of components with polysilicon layers. Segmented polysilicon elements to reduce overheating is disclosed, as well as a method of forming components with segments polysilicon elements.... Agent: Texas Instruments Incorporated

20090161292 - Laminated ceramic capacitor: A laminated ceramic capacitor includes a ceramic body having a structure in which a plurality of dielectric sheets are laminated; a first external electrode formed outside the ceramic body; at least two second external electrodes formed outside the ceramic body, separated from the first external electrode and having a polarity... Agent: Mcdermott Will & Emery LLP

20090161293 - Multilayer ceramic electronic component and manufacturing method thereof: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base... Agent: Dickstein Shapiro LLP

20090161294 - Multi-band front end module: A multi-band front end module and a method of manufacturing the multi-band front end module. The method may include forming a first circuit pattern on one side of an insulation layer, stacking a dielectric layer over the one side of the insulation layer, and forming a second circuit pattern on... Agent: Staas & Halsey LLP

20090161295 - Electrolysis solution and electrolytic capacitor using the same: m

20090161296 - Lithium ion capacitor: A lithium ion capacitor includes a positive electrode, a negative electrode, and a non-protonic organic solvent electrolytic solution of a lithium salt. A positive electrode active material is a material capable of reversibly doping a lithium ion and/or an anion. A negative electrode active material is a material capable of... Agent: Osha Liang L.L.P.

20090161297 - Solid electrolytic capacitor and method for manufacturing the same: Solid electrolytic capacitors are provided with decreased equivalent series resistance (ESR). The solid electrolytic capacitors include: an anode containing a valve metal or an alloy that is mainly made of a valve metal; a dielectric layer formed on a surface of the anode; an electrolyte layer formed on the dielectric... Agent: Mots Law, PLLC

20090161298 - Hybrid capacitor: A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The... Agent: Jianq Chyun Intellectual Property Office

20090161299 - Solid electrolytic capacitor: A solid electrolytic capacitor including an anode body, a dielectric layer arranged on the anode body, a conductive polymer layer arranged on the dielectric layer, and a cathode layer including a carbon layer arranged on the conductive polymer layer and a silver layer arranged on the carbon layer. The conductive... Agent: Mots Law, PLLC

20090161300 - Circuit board with heat dissipation function: A circuit board for direct dissipation of heat energy from the installed electronic devices to facilitate the fabrication of a light-weight design of electronic product is disclosed to include a heat sink, a first insulating layer and a circuit layout. The heat sink has a working fluid contained in an... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090161301 - Busbar assembly with integrated cooling: A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of... Agent: Ingrassia Fisher & Lorenz, P.C. (gm)

20090161302 - Deployable display apparatus for vehicle: A vehicle has a personnel compartment including a necessary driving volume. A deployable display apparatus provides a plurality of visual display units to a vehicle. The vehicle has a personnel compartment including a necessary driving volume. At least one display housing is provided. Each display housing is configured to support... Agent: Tarolli, Sundheim, Covell & Tummino L.L.P.

20090161303 - Docking station of electronic apparatus: According to one embodiment, a docking station for docking therewith a portable computer through connectors includes a docker side control apparatus for energizing an electromagnet to bring a securing mechanism of a PC into a state where the lock of the securing mechanism can be released, and an authentication control... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090161304 - Frame for flat panel display: A flat panel display includes a screen, a printed circuit board, a signal cable, and a frame. The frame includes a lower case, an upper case, and two fastening arms. The upper case cooperatively joins with the lower case to receive the screen, the printed circuit board, and the signal... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161305 - Keyboard module and electronic device having the same: An electronic device including a housing, a keyboard module, and a limiting plate is provided. The housing has an accommodation slot including a carrying portion, at least one opening penetrating the carrying portion, and a wedging portion located on the edge of the opening. The keyboard module includes a keyboard... Agent: Jianq Chyun Intellectual Property Office

20090161306 - Computer monitor protector: The protector is made up by means of the functional combination of two elements, one consisting of a front chassis (1) and another consisting of a rear chassis (2), joined together, the front chassis (1) having a window (4) for the screen (5) of the monitor (3), while the rear... Agent: Sughrue Mion, PLLC

20090161307 - Display device: A cabinet-fixing locking nail and a locking stopper are formed at a fixing unit which is integrally attached to a button portion. The button portion is fixed to a back cabinet through the fixing unit, by locking the cabinet-fixing locking nail and the locking stopper to the back cabinet. A... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090161308 - Mounting device for disk drive: A mounting device for a disk drive includes a bracket for receiving the disk drive, and a securing member for mounting the disk drive in the bracket. The bracket includes a pair of side panels for receiving the disk drive therebetween. A cutout is defined in each side panel in... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161309 - Removable hard drive casing: A removable hard drive casing for rapidly integrating a hard drive into a computer case, comprising a fixing frame, a hard drive tray and a protective cover. The fixing frame comprises an opening and a receiving space. The hard drive tray can hold the hard drive therein and be inserted... Agent: Raymond Sun

20090161310 - Server chassis with access flap: A server chassis includes a base defining an opening, a rotating plate, a sliding plate, and first and second elastic members. The base includes a middle plate opposite to the opening and defines a space communicating with the opening. The rotating plate defines a plurality of first air holes. The... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161312 - Liquid cooling systems for server applications: Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090161311 - Top mount surface airflow heatsink and top mount heatsink component device: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρumd)/μ≧2,500; with ρ being... Agent: Wang, Hartmann & Gibbs

20090161313 - Heat dissipating structure: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090161314 - Heat dissipation device having a fan holder for attachment of a fan: A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161315 - Heat dissipating apparatus with heat pipe: A heat dissipating apparatus includes a heat spreader (20) for thermally connecting with a heat generating electronic component, a heat sink (10) thermally connected with the heat spreader, and a heat pipe (30) thermally connecting the heat sink with the heat spreader for transferring heat from the heat spreader to... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161316 - Heat dissipation device with fan holder: A heat dissipation device includes a heat sink assembly, a fan holder and a fan mounted in the fan holder. The heat sink assembly includes a heat spreader for contacting with a heat-generating electronic component, and two fin assemblies thermally connecting with the heat spreader and sandwiching the fan therebetween.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161317 - Portable hand held multi-source power inverter with pass through device: A portable hand held power inverter/converter having a pass through device for simultaneously sourcing A.C. and multiple voltage D.C. power consuming devices through a single D.C. power source connection. Inverter and converter circuitry is provided to invert and convert D.C. voltage to an A.C. voltage source and a lower DC... Agent: Berenato, White & Stavish, LLC

20090161319 - Electronic circuit arrangement and method for producing an electronic circuit arrangement: An electronic circuit arrangement includes a heat sink and a first circuit carrier which is thermally coupled to the heat sink, lies flat on the latter and is intended to wire electronic components of the circuit arrangement. Provided for at least one electronic component is a special arrangement which is... Agent: Lerner Greenberg Stemer LLP

20090161318 - Thermal management systems and methods: Thermal management systems and methods for electronics. A printed circuit board assembly may include a soldered-in heat sink in communication with inner layers of a printed circuit board for cooling. The heat sink may include a plurality of leads received by plated through-holes in the printed circuit board. The heat... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20090161320 - Electronic circuit apparatus for compressor: An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat... Agent: Ratnerprestia

20090161321 - Mounting apparatus for securing heat dissipation module to circuit board: A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat dissipation module, and a plurality of support devices. Each support device comprises an enlarged flange portion, a support portion... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161322 - Front access enclosure: An enclosure and method of construction for use with electronic devices such as computers, amplifiers, switching systems, receivers, video monitors, and televisions, allows a user to access virtually all connector ports on a given piece of equipment from the front of the equipment by displacing a moveable front accessible control... Agent: Robert M. Hughes

20090161323 - Computer enclosure: A computer enclosure includes a main body having several walls and an opening defined in a side thereof, a detachable wall slidably mounted on the main body for shielding the opening, and a locking member pivotably attached to the detachable wall. An engaging portion is disposed in the main body.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090161324 - Shielding case, wiring board and electronic module: A shielding case for accommodating a wiring board includes a board mounting member with a fitting member formed at an outer frame thereof so that the wiring board is fixed and held to the board mounting member through fitting of the fitting member into a through hole formed at the... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090161325 - Capacitive user-interface switches: An electronic device including a housing having an outer surface, at least one printed circuit board located within the housing and having at least one edge located in propinquity to at least one corresponding edge region of the outer surface, at least one capacitance sensor located at the at least... Agent: Darby & Darby P.C.

20090161326 - Power supply apparatus having dc-dc converter module mounted on individual printed circuit board: This invention provides a power supply comprising a mother board, a first socket, and a DC-DC converter module. The mother board comprises a transformer operative for transforming an input power into a first AC output power and a filter operative for receiving the first AC output power and filtering the... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090161327 - Expansion card: An expansion card including a board is provided. The board has a chip module and a notch that is breakable. The notch divides the board into a first region and a second region, and the chip module is located in the first region.... Agent: Jianq Chyun Intellectual Property Office

20090161328 - Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic components mounted structure: In an electronic components mounted structure 10, a first circuit board 11 and a second circuit board 13 are bonded to each other with an electronic components mounting adhesive 20. The electronic components mounting adhesive 20 is such that solder particles 22 are dispersed in a thermosetting resin 21. The... Agent: Pearne & Gordon LLP

20090161329 - Semiconductor device: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate.... Agent: Mattingly & Malur, P.C.

20090161330 - Chip carrier and fabrication method: A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive... Agent: Law Offices Of Mikio Ishimaru

20090161331 - Circuit board device, wiring board connecting method, and circuit board module device: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring... Agent: Mcginn Intellectual Property Law Group, PLLC

20090161332 - Socket with power supply: The present invention discloses a socket with power supply, comprising a housing having a upper cover and a lower cover which are connected together to form a receiving space; a transformer connected with an alternate current source through a plug protruding out of the first opening; at least a socket... Agent: Guice Patents PLLC

20090161333 - Auto-cling leads of electric device: Automatic clinging leads of an electric device are provided for an unassisted mounting on thru-holes of a printed circuit board. Each of the leads of the device has three continuous right-angled sections including a longitudinal proximal end section extending from the terminal region of the electric element, a latitudinal distal... Agent: Law Offices Of Clement Cheng

20090161335 - Housing of a power filter: A housing adapted for a power filter and a power filter comprising the housing are provided. The power filter further comprises a filter element, a protection ring, and a connection line. The housing comprises a bottom wall, a sidewall, and an opening. The sidewall is disposed adjacent to the bottom... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC

20090161334 - Wireless communication module: A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the... Agent: Bliss Mcglynn, P.C.

20090161336 - Two-beam semiconductor laser apparatus: A two-beam semiconductor laser device 10 includes: a two-beam semiconductor element LDC having a first and a second semiconductor laser elements LD1 and LD2 that can be driven independently and that are formed integrally on a substrate; and a submount 63 having, mounted on a front part thereof, the two-beam... Agent: Mcdermott Will & Emery LLP

20090154033 - Electrical arc fault circuit interrupter apparatus and method: In all electrical circuits, various arcing conditions can arise, however, there are primary ones are series arcing (low current arcing), and, parallel arcing (high current arcing). An arc fault circuit interrupter (“AFCI”) that protects for both series and parallel arcing is called a combination type. An AFCI is a device... Agent: The Miller Law Offices, PLC

20090154037 - Design structures for electrostatic discharge protection for bipolar semiconductor circuitry: A design structure for electrostatic discharge protection comprises a first data representing a first electrostatic discharge (ESD) protection circuit and a second data representing a second ESD protection circuit. A parallel connection of two ESD protection units, each providing a discharge path for electrical charges of opposite types, provides ESD... Agent: Scully, Scott, Murphy & Presser, P.C.

20090154036 - Electrostatic discharge circuit: The invention discloses an electrostatic discharge circuit. The spirit of the invention is that the electrostatic common portion in the conventional integrated circuit is divided into at least two sets corresponding to at least two internal common voltages, separately. In addition, the electrostatic common portions use serily connected diode rings.... Agent: Joe Mckinney Muncy

20090154035 - Esd protection circuit: A circuit arrangement includes an ESD protection circuit for protecting a circuit node of the circuit arrangement against electrostatic discharge. The circuit arrangement includes a control circuit configured to deactivate the ESD protection circuit in response to a state signal representing a state of operation of the circuit arrangement.... Agent: Slater & Matsil LLP

20090154038 - Impedance compensated esd circuit for protection for high-speed interfaces and method of using the same: The embodiments of the apparatus and method described herein provide an integrated ESD/EOS protection solution which simplifies system PCB design for signal integrity compliance. As part of providing this solution, it is also desired to implement improved ESD/EOS protection and improved PCB routing.... Agent: Pillsbury Winthrop Shaw Pittman LLP

20090154040 - Memory card with electrostatic discharge protection and manufacturing method thereof: A memory card with electrostatic discharge (ESD) protection and a manufacturing method thereof are provided. The memory card includes a circuit board, a set of contacts, at least one chip and an ESD protection path. The signal paths of the board is not exposed at the edge of the circuit... Agent: J C Patents, Inc.

20090154034 - Motor drive with low leakage surge protection: A motor drive employs a combination of gas discharge tubes and metal oxide varistors to create precisely tailored surge protection that has a low leakage current minimizing the triggering of ground fault detection circuitry when multiple motor drives are attached to a single line source.... Agent: Rockwell Automation, Inc./bf

20090154039 - Overvoltage protection circuit and electronic device comprising the same: An overvoltage protection circuit prevents a voltage higher than an allowable voltage value from being supplied to a predetermined to-be-protected circuit. A voltage is applied from outside to an input end 11. A cathode terminal of a zener diode 13 is connected to the input end 11. A first resistance... Agent: Nixon & Vanderhye, P.C.

20090154041 - Load driving device: A load driving device according to an aspect of the present invention may includes an output transistor and a load connected in series between first and second power supply lines, a protection transistor connected between a gate of the output transistor and the second power supply line, the protection transistor... Agent: Mcginn Intellectual Property Law Group, PLLC

20090154042 - Over current protection method and device: An over current protection system, the system includes: a sampling rate unit, adapted to determine a sampling rate of at least one alternating input current in response to an alternating input current cycle duration; and a controller, adapted to receive samples of the at least one alternating input current and... Agent: Pearl Cohen Zedek Latzer, LLP

20090154043 - Backlight unit having protection circuit using center-tap: There is provided a backlight unit having a protection circuit using a center-tap, the backlight unit including: a current balancing unit including a plurality of primary coils individually transmitting the lamp driving power from an inverter unit to the lamps, and a plurality of secondary coils each formed of one... Agent: Lowe Hauptman Ham & Berner, LLP

20090154044 - Surge protector device with simultaneously-triggered spark gaps in parallel: e

20090154045 - Power supply system and method: A power supply system S comprising a power processor 1, having a power input 2 and an AC power output 3 with a nominal voltage VN and a nominal current IN, and a power supply safety circuit 6 connected in parallel to said power processor 1 between said power input... Agent: Ladas & Parry LLP

20090154046 - Trip unit and electrical switching apparatus including a movable indicator to indicate selection of an arc reduction maintenance system current condition: A trip unit includes a housing having a first opening and a second opening. A sensor senses a current flowing in an electrical circuit and provides a signal representative of the current. A selector switch is disposed proximate the first opening and selects one of predetermined instantaneous current conditions and... Agent: Martin J. Moran

20090154047 - Power node switching center: A circuit fault detector and interrupter which consists of parallel current conduction paths, including a path through a mechanical contactor and a path through a power electronics switch. A fault can be detected by a fault detection circuit within 50 microseconds of the occurrence of the fault, causing the mechanical... Agent: Fox Rothschild, LLP Pittsburgh

20090154048 - Protective circuit board and battery pack using the same: A protective circuit board and a battery pack using the same that broadens a mount region of a device and improves operability and proccessability thereof. The battery back comprises: a bare cell including a cap plate and an electrode terminal; and a protective circuit board positioned at the outside of... Agent: Stein Mcewen, LLP

20090154049 - Network equipment system providing surge protection and dc blocking bypass functionalities: A network equipment system comprises a communication apparatus, an equipment protector block connected between the communication apparatus and a subscriber premise DSL network termination device (NTD), and a protection module mounted on the equipment protector block. The protection module includes circuitry configured for providing surge protection functionality, for providing AC... Agent: Alcatel-lucent

20090154050 - Spark gap apparatus and method for electrostatic discharge protection: An apparatus for providing electrostatic discharge protection includes a plurality of conductive circumferential extensions defined by overlapping circular voids between a first conductor surface and a second conductor surface.... Agent: Patent Group 2n Jones Day

20090154051 - Device for connecting two points in an electric circuit: Device for connecting two points in an electrical circuit. The device acts externally like an individual relay, but includes a first micro electro-mechanical systems (“MEMS”) relay and at least a second MEMS relay. Each relay has four condenser plates and a conducting element movably housed inside the relay, opening and... Agent: Staas & Halsey LLP

20090154052 - Composite electronic device: A composite electronic device includes: a coil conductor arranged on at least one of a plurality of insulating layers; a drawing conductor arranged on another insulating layer and partially facing the coil conductor and having one end electrically connected to one end of the coil conductor so as to constitute... Agent: Wenderoth, Lind & Ponack L.L.P.

20090154053 - Electroactive polymer transducers: Dielectric elastomer or electroactive polymer film transducers configured to minimize high electrical field gradients that can lead to partial discharge and corona.... Agent: Levine Bagade Han LLP

20090154054 - Capacitor and method of manufacturing the same: A capacitor includes a dielectric material that is formed of anodic metal oxide; a pair of substantially comb-shaped surface electrodes formed on the same principal surface of the dielectric material; and plural substantially columnar internal electrodes whose one ends are connected to the respective comb-shaped portions of the pair of... Agent: Law Office Of Katsuhiro Arai

20090154055 - Multilayer capacitor: In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090154056 - Low inductance capacitor and method of manufacturing same: A film capacitor includes metallization that is sectionalized, patterned and configured to provide interconnections on only one face of a rolled or stacked film capacitor.... Agent: General Electric Company Global Research

20090154057 - High capacitance film capacitor system and method for manufacturing the same: A film capacitor including a pair of electrodes having multiple pores is provided. The film capacitor includes a polymer film deposited upon each of the pair of electrodes to form a dielectric layer.... Agent: General Electric Company Global Research

20090154058 - Polymer based solid state capacitors and a method of manufacturing them: The present invention relates to a solid state capacitor having a conductive polymer cathode layer counter electrode comprising acrylate binder and a method for its manufacture. In particular the present invention relates to a solid state capacitor comprising: providing a porous anode body of valve action material; forming a dielectric... Agent: Dority & Manning, P.A.

20090154059 - Composition comprising a conductive polymer in colloidal form and carbon: The present invention relates to compositions capable of forming a coating and comprising a mixture of a conductive polymer in colloidal form and carbon, methods for their manufacture and use for high-capacity electrical double layer capacitors to be utilized in various electronic apparatuses, power supplies and the like.... Agent: Swanson & Bratschun, L.L.C.

20090154061 - Electric double layer capacitor: An electric double layer capacitor comprising: activated carbon electrode layers comprising an activated carbon, conductive adhesive layers, a separator, and electrolytic solution comprising non-aqueous solvent and electrolyte between a top vessel and a bottom vessel; in which the top vessel and the bottom vessel are sealed by being caulked with... Agent: Sughrue Mion, PLLC

20090154062 - Electric double layer capacitor: An electric double layer capacitor includes a positive electrode, a negative electrode which faces the positive electrode and is isolated therefrom, and an electrolyte solution. The positive electrode includes a first current collector of a metal foil and a first polarizable electrode layer on the first current collector, the first... Agent: Pearne & Gordon LLP

20090154060 - Nanoporous insulating oxide electrolyte membrane ultracapacitor, button cell, stacked cell and coiled cell and methods of manufacture and use thereof: A nanoporous insulating oxide composite electrode and ultracapacitor device, method of manufacture and method of use thereof. The composite electrode being constructed from a conductive backing electrode and an composite layer. Preferably, the ultracapacitor device is configured in a stacked, coiled or button cell configurations and includes composite electrodes. The... Agent: Quarles & Brady LLP

20090154063 - Non-aqueous electrolytic solution for electric double layer capacitor and electric double layer capacitor using the same: n

20090154064 - Lithium ion capacitor: A lithium ion capacitor including a positive electrode, a negative electrode, and an aprotic organic solvent solution of a lithium salt as an electrolytic solution. The positive electrode active material is capable of reversibly supporting lithium ions and/or anions, the negative electrode active material is capable of reversibly supporting lithium... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090154067 - Chip-type filter: A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second... Agent: Wenderoth, Lind & Ponack L.L.P.

20090154065 - Solid electrolytic capacitor and method of manufacturing the same: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive... Agent: Mcdermott Will & Emery LLP

20090154066 - Solid electrolytic capacitor and method of manufacturing the same: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire inserted and connected to a lower portion of the capacitor element; a cathode extraction layer formed on the capacitor element; an anode lead frame provided on one side of the lower surface of... Agent: Mcdermott Will & Emery LLP

20090154068 - Solid electrolytic capacitor and method of manufacturing the same: Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one side is inserted into the capacitor element and the other side projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive... Agent: Mcdermott Will & Emery LLP

20090154069 - Gas-insulated power apparatus: A gas-insulated power apparatus comprising a vertically arranged gas-insulated circuit breaker included in a vertically arranged gas-insulated main tank, a first gas-insulated branch pipe connected to one side of an upper portion of the gas-insulated main tank substantially orthogonal to a direction of extending the gas-insulated main tank and leading... Agent: Buchanan, Ingersoll & Rooney PC

20090154070 - Modular power distribution system and method: A modular power distribution system comprises a chassis and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) a circuit protection device; and... Agent: Merchant & Gould PC

20090154071 - Current inputs interface for an electrical device: According to an aspect of the present disclosure, an electrical power meter, is disclosed. The electrical power meter includes a housing for containing electrical circuitry therein, the housing including at least one of voltage and current inputs, the housing including passages extending entirely therethrough, wherein the passages are configured to... Agent: Casella & Hespos

20090154072 - Watthour meter box flange and method for installation of same: The present disclosure relates to an apparatus and methods for securing a box cover to a watt-hour meter box base. In certain embodiments, the apparatus consists of a unitary member incorporating a plurality of flange members adapted for securing at least a portion of a top of a watthour meter... Agent: Dewalch Technologies, Inc.

20090154075 - Flip-type electronic apparatus: An exemplary electronic apparatus (100) includes a main body (10), a lid (20) connecting with and rotating with respect to the main body between an opened position and a closed position, and a sliding bar (35) located in the main body. The main body defines a fastening hole (137), and... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154076 - Image display apparatus: An image display apparatus includes a display for outputting an image, a supporting device supporting the display, the supporting device contacting directly on an installing surface and extending upward, the supporting device being provided with an inner hollow portion, and a light emission unit emitting light reflecting from the inner... Agent: Ked & Associates, LLP

20090154077 - Image display apparatus: An image display apparatus is provided to achieve both of position shift prevention between substrates and suppression of distortion generated in the substrates. An image display apparatus has an envelope including a first substrate provided with an image display unit, a second substrate placed in opposition to the first substrate,... Agent: Fitzpatrick Cella Harper & Scinto

20090154074 - Insertion slot shielding mechanism for an electronic device: An insertion slot shielding mechanism for an electronic device is used to shield an insertion slot provided in an opening of a casing of an electronic device. The insertion slot shielding mechanism includes a shielding means and an elastic pushing piece. The shielding means corresponds to the opening and is... Agent: Rosenberg, Klein & Lee

20090154078 - Modular apparatus holder with multipurpose intermediate support member for supporting minicomputers, cell phones and similar apparatus: In a modular holder for supporting an apparatus or instrument such as a minicomputer or a cell phone, comprising a support member with a support head and an apparatus holder supported thereby, an intermediate function box is releasably mounted with one side thereof by an engagement structure onto the support... Agent: Klaus J. Bach

20090154073 - Protecting casing for transducer: A protecting casing for a transducer has an outer casing, an inner casing, a circuit board and a connector. The inner casing is detachably mounted in the outer casing and has a mounting hole and a cap detachably mounted on the inner casing to cover the mounting hole in a... Agent: Rabin & Berdo, P.C.

20090154080 - Computer front bezel: A computer front bezel includes a main body, a sliding cover, and two elastic members. The main body defines two substantially opposite sliding grooves. The sliding cover includes two posts slidably received in the sliding grooves of the main body respectively. The two elastic members are connected to the sliding... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154081 - Electronic apparatus: An electronic apparatus has a first housing having a first side portion and a second side portion having a width smaller than a width of the first side portion; a second housing having a third side portion having the same width as the first side portion, a fourth side portion... Agent: Fujitsu Patent Center C/o Cpa Global

20090154079 - Laptop table: Disclosed herein is a laptop table including a laptop station, on which a laptop computer is disposed. The laptop station has a connection port set and a power supply unit integrally mounted therein. The connection port set and the power supply unit of the laptop station is connected to an... Agent: Cantor Colburn, LLP

20090154083 - Hinge device of plane display: [Solution] The structure includes a mechanism for supporting a plane display in lower part, and rotating it manually in lateral horizontal direction, a mechanism for tilting manually in longitudinal direction, and a mechanism for elevating manually in vertical direction, in which the rotary mechanism in lateral horizontal direction includes horizontal... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090154085 - Electronic apparatus: An electronic apparatus has a first housing including a front edge portion and a rear edge portion, the front edge portion having a recess in a top surface thereof, the recess being recessed with respect to a reference surface of the top surface; a second housing including a front edge... Agent: Fujitsu Patent Center C/o Cpa Global

20090154084 - Electronic device: An electronic device includes: a first housing that includes an inlet and an outlet on one end; a second housing; and a linkage section that links the second housing to the first housing such that the second housing can be opened and closed. The device is configured such that the... Agent: Staas & Halsey LLP

20090154086 - Casing structure and electronic device: The casing structure includes a first frame having a top surface section; a second frame having a top surface section and a bent section that is bent on the top surface section at a location where the the second frame abuts the first frame; and a hinge mounted over the... Agent: Staas & Halsey LLP

20090154087 - Display apparatus and electronic apparatus: A display apparatus including a rectangular display panel and a housing including a front face portion, sidewall portions, and a back face portion and containing the display panel, a screen of the display panel being exposed at the front face portion, the sidewall portions continuing from opposite sides of the... Agent: Fujitsu Patent Center C/o Cpa Global

20090154082 - Electronic device, computer porgram product and control method: There is provided an electronic device comprising: a body, a slidable element connected to the body, a display connected to the body for displaying application views, and a processing unit for controlling functions of the electronic device, wherein the slidable element is slidable between a closed position and an open... Agent: Hollingsworth & Funk, LLC

20090154088 - Storage device backplane and identification circuit: A storage device backplane and an identification circuit for identifying using situations of the storage device backplane are provided. The storage device backplane possesses a first connection interface and a second connection interface, for being used as a first backplane supporting a motherboard, or a second backplane cascaded to the... Agent: J C Patents, Inc.

20090154089 - Coolor for notebook computer: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and... Agent: Jason Y. Pahng And Associates, LLC

20090154091 - Cooling systems and heat exchangers for cooling computer components: Computer systems having heat exchangers for cooling computer components are disclosed herein. The computer systems include a computer cabinet having an air inlet, an air outlet spaced apart from the air inlet, and a plurality of computer module compartments positioned between the air inlet and the air outlet. The air... Agent: Perkins Coie LLP Patent-sea

20090154090 - Heat dissipating structure of 1u power supply: A heat dissipating structure of a 1 U power supply is installed in an industrial computer host system of a universal standard specification 1 U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat... Agent: Joe Mckinney Muncy

20090154092 - Wind direction-adjustable heat-dissipation fan module: The present invention discloses a wind direction-adjustable heat-dissipation fan module, which is arranged inside a computer and provides heat-dissipation air current for electronic devices inside the computer. The wind direction-adjustable heat-dissipation fan module of the present invention comprises a support unit arranged inside the computer. An electric fan is pivotally... Agent: Joe Mckinney Muncy

20090154093 - Composition and methods for managing heat within an information handling system: An information handling system including a heat generating component positioned within the information handling system, a heat transfer surface in thermal communication with the heat generating component and a medium comprising water and gold thiolate nanoparticles, wherein the medium is in thermal communication with the heat transfer surface.... Agent: Andrea E. Tran Pramudji Wendt & Tran, LLP

20090154094 - Electronic apparatus: An electronic apparatus has a trapezoidally shaped first housing having a first side portion, a second side portion, slanted side portions, a bottom surface portion, and a top surface portion, the second side portion having a width smaller than a width of the first side portion and being parallel to... Agent: Fujitsu Patent Center C/o Cpa Global

20090154095 - Case battery with storage device: A case battery with storage device is provided. The case battery comprises first and second holding portions, a charging portion, and storage devices. The first holding portion is configured to hold a first part of the personal electronic device. The second holding portion is configured to hold a second part.... Agent: Park Law Firm

20090154096 - Apparatus and method for facilitating cooling of an electronics system: Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and... Agent: Heslin Rothenberg Farley & Mesiti P.C.

20090154097 - Heat-dissipating device having air-guiding cover: A heat-dissipating device having an air-guiding cover includes a heat-dissipating body, an air-guiding cover, a plurality of heat pipes, a fixing base and a fan. The heat-dissipating body is constituted of a plurality of heat-dissipating pieces that are stacked up at intervals. On the heat-dissipating body, venting channels and a... Agent: Hdls Patent & Trademark Services

20090154098 - Single fan tray in a midplane architecture: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front... Agent: Harrity & Harrity, LLP

20090154100 - Heat dissipating assembly: A heat dissipating assembly for dissipating heat from a plurality of electronic components, including a heat sink (10) mounted on an electronic component, a fan (40), a first holder (50), and a second holder (60). The fan has a part secured on the heat sink by the first holder that... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154099 - Heat dissipating assembly having a fan duct: A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver (30), includes a heat sink (10) for contacting the graphic card and a fan duct (20) fixed on the heat sink. The fan duct is made by bending a planar metal plate and has... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154101 - Liquid-cooled inverter assembly: An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a direct current (DC) path. A plurality of inverter switches is mounted on the substrate and electrically coupled to... Agent: Ingrassia Fisher & Lorenz, P.C. (gm)

20090154104 - Cooling device and electronic apparatus using the same: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090154102 - Heat dissipation device: A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154103 - Heat dissipation device: A heat dissipation device includes a base, a first heat sink located on the base, a second heat sink located on the first heat sink, and a heat pipe contacting with the base and the first and second heat sink. The first heat sink includes a heat spreader and a... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154105 - Heat dissipation device and a method for manufacturing the same: A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls slantwise... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154106 - Double bonded heat dissipation: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.... Agent: Dorsey & Whitney LLP Intellectual Property Department

20090154107 - One-dimensional hierarchical nested channel design for continuous feed manufacturing processes: A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface... Agent: Ryan, Mason & Lewis, LLP

20090154108 - Clip and heat dissipation assembly using the same: A clip (50) for securing a heat dissipating device to a heat source comprises a spring arm (510) and an ear (530). The spring arm comprises two wires (512) substantially parallel to each other, a hook (514) formed at one end of the spring arm to connect ends of the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154109 - Heat sink assembly: A heat sink assembly includes a heat sink and a clip for securing the heat sink to a circuit board with a pair of securing members mounted thereon. The clip is a bent resilient wire including a positioning portion disposed on the heat sink and a pair of arms extending... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154110 - Heat sink assembly for multiple electronic components: A heat sink assembly for removing heat from a plurality arrays of heat generating-components mounted on a printed circuit board includes a fist and a second heat sink, a plurality of fastening assemblies. Each of the first and second heat sinks comprises an elongated base and a plurality of fins... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154112 - Packaging structure of power module: A power module includes a substrate, a power converter and a plurality of bond pads. The substrate includes a top surface and a bottom surface. The power converter is disposed on the substrate and includes at lease one semiconductor chip package. The semiconductor chip package is disposed on the top... Agent: Kirton And Mcconkie

20090154111 - Reticulated heat dissipation: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.... Agent: Dorsey & Whitney LLP Intellectual Property Department

20090154113 - Thermal energy storage for mobile computing thermal management: In some embodiments, a device includes power source circuitry, a circuit board supporting electrical components to receive electrical power from the power source circuitry. The device further includes a housing forming a cavity including the circuit board, and thermal energy storage material held in the cavity, wherein the thermal energy... Agent: Alan K. Aldous Intel Corporation

20090154114 - Air flap mechanism for server chassis: An air flap mechanism is installed in a server chassis with an opening. A functional module is capable of being inserted into the server chassis from the opening. The air flap mechanism includes an air flap pivotably installed in the server chassis for shielding the opening of the server chassis... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154115 - Electronic device enclosure: The invention related to an electronic device enclosure that includes a chassis and a cover. The chassis includes a bottom wall, an opening and a circuit board mounted on the bottom wall. The cover is mounted on the chassis and is adapted to cover the opening of the chassis. A... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154116 - Expansion system for portable electronic devices: An expansion system for portable electronic devices is provided. A portable electronic device includes: a main logic board; an expansion device for expanding functionality of the portable electronic device; a flexible interconnection for logically connecting the expansion device to the main logic board; and a package for enclosing the main... Agent: Pearne & Gordon LLP

20090154117 - Electronic device having elastic grounding clip: An elastic grounding clip, set between a PCB and a housing of an electronic device, includes two first main pieces, a first connection piece connected between the two first main pieces, a second main piece adjacent one of the first main pieces, and a second connection piece connected between the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154118 - Mounting apparatus for mounting circuit board: A mounting apparatus includes a bottom plate, a bracket fixed to the bottom plate, and a clamp rotatably mounted to the bottom plate. The bracket includes a first and a second mounting piece. The second mounting piece defines a mounting groove for receiving an edge of a circuit board. The... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154119 - Retaining device for pci card: A retaining device for a PCI card (30) includes a chassis (50), a retaining plate (20) configured for retaining the PCI card, and a mounting apparatus (10). The chassis has a rear wall (52). The rear wall has two clipping portions (526) and a perpendicular portion (52). The retaining plate... Agent: PCe Industry, Inc. Att. Steven Reiss

20090154120 - Electronic component and circuit board: An electronic component, including: a first terminal group including a plurality of functional terminals provided along a first side of the electronic component; a second terminal group including a plurality of functional terminals provided along a second side of the electronic component opposing the first side; and an element that... Agent: Mcdermott Will & Emery LLP

20090154121 - Clock generator: A clock generator includes a printed circuit board, a resonant circuit and a pair of compensating capacitors. The resonant circuit is disposed on the printed circuit board. The compensating capacitors are embedded in the printed circuit board and electrically connected to both terminals of the resonant circuit respectively.... Agent: Joe Mckinney Muncy

20090154122 - Mechanical component-containing board and method of manufacturing same: A mechanical component-containing board includes a board body and a mechanical component having a part thereof built in and integrated with the board body.... Agent: Staas & Halsey LLP

20090154123 - Systems and methods for providing a grounded card in an information handling system: An information handling system includes a chassis having a guide slot and a printed circuit board placed in guide slot of the chassis. The guide slot includes at least two opposing channels aligned adjacent the printed circuit board with a guide tab formed in one of the opposing channels. A... Agent: Baker Botts L.L.P.

20090154124 - Microwave chip supporting structure: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side extending towards said outer limit. The microwave chip supporting structure further comprises... Agent: Ericsson Inc.

20090154125 - Semiconductor device and method of forming the same: A semiconductor device includes: a wiring substrate including multiple connection pads provided on a top surface thereof and multiple lands that are provided on a bottom surface thereof and electrically connected to the corresponding connection pads; a semiconductor chip mounted on the top surface of the wiring substrate and electrically... Agent: Young & Thompson

20090154126 - Semiconductor device and method for manufacturing the same: A wiring board includes a first bonding wiring array that is formed by extending conductor wirings, and that extends from an external side of a semiconductor element region and is bonded individually to a first element electrode array of a semiconductor element, and a second bonding wiring array that extends... Agent: Hamre, Schumann, Mueller & Larson P.C.

20090154127 - Pcb embedded electronic elements structure and method thereof: Structure of embedded electronic elements in a PCB (printed circuit board) and the method for embedding the structure include assembling the electronic elements (such as a capacitor, a resistor, a diode) on the PCB, and then laminating other circuit layers. A group of electrodes of the electronic elements are aligned... Agent: Lin & Associates Intellectual Property, Inc.

20090154128 - Wiring substrate and semiconductor device: A wiring substrate 11 includes a wiring substrate main body 31 having a semiconductor element mounting area A, a wiring pattern 33 provided on an upper surface 31A of the wiring substrate main body 31 at a portion corresponding to the semiconductor element mounting area A, a solder resist 35... Agent: Rankin, Hill & Clark LLP

20090154129 - Patch panel chassis: A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis.... Agent: Merchant & Gould PC

20090154131 - Conductive connecting pin and package substrate: A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090154130 - Micro-sensor and manufacturing method thereof: The micro-sensor includes a first circuit substrate and a second circuit substrate. One surface of the first circuit substrate has an image sensing device electrically connected to main printed wires formed by a first wire group and a second wire group. On the other surface of the first circuit substrate... Agent: Rabin & Berdo, PC

20090154132 - Printed wiring board and method for manufacturing printed wiring board: e

20090154133 - Unified control switch module for vehicles: A unified control switch module includes a printed circuit board, a waterproof pad, and one or more knobs. The printed circuit board includes switches and light-emitting elements mounted thereon. The waterproof pad is coupled to the printed circuit board, and is provided with first protrusions, which are formed at respective... Agent: Edwards Angell Palmer & Dodge LLP

20090154134 - Lightweight electronic device for automotive applications and method: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical... Agent: Delphi Technologies, Inc.

20090147411 - Thyristor controlled series capacitor module: A thyristor controlled series capacitor module including a capacitor connectable in series with a power line, a thyristor valve connected in parallel with the capacitor, a breaker connected in parallel with the thyristor valve, and an inductor. By providing a simplified breaker arrangement, the number of components is reduced.... Agent: Venable LLP

20090147412 - Transformer inrush current detector: A differential protection system for power transformers using Rogowski coils as current sensors can support an inrush current detection method based on sensing lows in the derivative of the sensed current. Effective detection of power transformer inrush conditions can enable blocking of a protection relay during inrush where the differential... Agent: King & Spalding

20090147413 - Electric appliance and heating cooking device: An electric appliance comprises: an appliance main body (1) for employing an AC power supply, and a power supply unit (6) to which the AC power supply provided in the appliance main body (1) is connected as an input power supply, which outputs a DC voltage and an AC voltage... Agent: Pearne & Gordon LLP

20090147417 - Gfci with miswire protection having unitary receptacle and load conductors after proper installation: An improved GFCI device prevents miswiring. Load conductors are electrically isolated from receptacle conductors. Normally closed contacts are held open by a miswire prevention mechanism, such that if power is connected to the load contacts, power cannot be delivered to the GFCI device, the receptacle conductors or the line conductors.... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20090147416 - Ground fault circuit interrupter: A ground fault circuit interrupter which comprises a main body structure, a low friction mechanical means, an electrical circuit, a low current utilizing solenoid, all of which are located in the main body structure for (1) interrupting the flow of electrical current in the interrupter when current flows from a... Agent: Brian D. Smith, P.C.

20090147415 - Ground fault detection and localization in an ungrounded or floating dc electrical system: An ungrounded or floating DC electrical power distribution system may experience a single line to ground fault. Such a fault may not disrupt operation of the system, but its presence may raise a risk of additional problems if left uncorrected. A system for progressively grounding the ungrounded system may be... Agent: Honeywell International Inc.

20090147414 - Ground fault detection in an ungrounded electrical system: An ungrounded electrical power distribution system may experience a single line to ground fault. Such a fault may not disrupt operation of the system, but its presence may raise a risk of additional problems if left uncorrected. A system for progressively grounding the ungrounded system may be initiated when a... Agent: Honeywell International Inc.

20090147418 - Ground-fault circuit interrupter with circuit condition detection function: A GFCI device with circuit condition detection function includes a leakage current detection circuit, a disconnect mechanism, a reset mechanism, a circuit condition detection and control circuit, and a selection switch. The disconnect mechanism includes a first SCR controlled by the leakage current detection circuit. The circuit condition detection and... Agent: Ying Chen Chen Yoshimura LLP

20090147420 - Circuit arrangement with an overcurrent fuse: A circuit arrangement includes a semiconductor switch having a control terminal and a load path. A drive circuit is coupled to the control terminal of the semiconductor switch. The drive circuit has a current measuring arrangement for determining a load current flowing through the load path and is designed to... Agent: Slater & Matsil LLP

20090147419 - Power interface circuit and electronic device using the same: An electronic device includes an integrated circuit, a power interface, and an interface circuit connected between the integrated circuit and the power interface for protecting the integrated circuit from being damaged by electrostatic discharge. The interface circuit includes a current limit unit connected between the power interface and the integrated... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147421 - Current-limiting circuit with at least two voltage taps: A current-limiting circuit, which limits an electrical current from a voltage source to a consumer to a predetermined maximum current. At least one measuring resistor (110) is connected in a current lead (14) between a circuit input (12) and a circuit output (16). At least two current control elements (100,... Agent: Sughrue Mion, PLLC

20090147422 - Power supply control circuit: A power supply control circuit includes a control circuit that controls an output transistor to be rendered conductive by forming a second electrical path between a second power supply line and a control terminal of the output transistor when a power supply voltage is applied in a reverse direction between... Agent: Young & Thompson

20090147423 - System and method for overvoltage protection: An overvoltage protection system and method including a control circuit and a bank of resistors to absorb the energy from a transient voltage without exceeding an allowed temperature for the resistors. The resistors in the bank are independently switched and configured such that upon detection of an overvoltage condition a... Agent: Dickinson Wright PLLC

20090147424 - Circuit breakers with automatic breaker rating: An electronic control for a circuit breaker with automatic breaker rating is disclosed. The electronic control includes a memory to store circuit breaker ratings, a breaker rating switch to select circuit breaker ratings, and a microprocessor operatively coupled to the breaker rating switch and the memory. The microprocessor is configured... Agent: Cantor Colburn, LLP

20090147426 - Current-limiting circuit with additional current path: A current-limiting circuit (100), which limits an electrical current from a voltage source to a consumer to a predetermined maximum current. A measuring resistor (110) is coupled into a current lead (103) between a circuit input (102) and a circuit output (104). A transistor (106) of the circuit is coupled... Agent: Sughrue Mion, PLLC

20090147425 - Overcurrent protection circuit when setting current using a package control pin: An overcurrent protection circuit for a current setting circuit is disclosed herein that prevents a user-selectable current from exceeding a current limit when an incorrect current selecting component (or current selecting circuit) is connected to an external control pin of a package by the user, or when the control pin... Agent: Patent Law Group LLP

20090147427 - Battery disconnect device: A battery disconnect device for a motor vehicle and the like includes a housing with a monitor circuit and a sealed relay. The monitoring circuit senses various conditions, such as current drawn from the battery, drop in the battery voltage, engine starting, engine running, and the like and in response... Agent: Gottlieb Rackman & Reisman PC

20090147428 - Metal case and unit cell for preventing electrostatic discharge and method of forming the same: A metal case for preventing electrostatic discharge includes an electromagnetic bandgap restricting current generated by electrostatic discharge and formed by arrangement of unit cells. Further, a method of forming a metal case preventing an electrostatic discharge includes forming an electromagnetic bandgap by arranging a plurality of unit cells; and forming... Agent: Cantor Colburn, LLP

20090147429 - Integrated protective device against electrical discharges in fixing elements: The invention relates to an integrated device (1) for the protection against electrical discharges of conductive fixing elements (2) between one another or of a fixing element and another conductive element of aircraft, comprising a cap (3) and an o-ring gasket (4) made of non-conductive insulating material, the mentioned integrated... Agent: Ladas & Parry LLP

20090147430 - Electrostatic discharging overshoe: An electrostatic discharging, detachable, overshoe, includes an electrically conductive flexible skeleton with oversized heel and toe regions for placing over footwear, and a conductive element situated to facilitate conducting static electricity between a body of a wearer of the footwear and the overshoe. The overshoe can be worn over a... Agent: Strategic Patents P.C..

20090147431 - Assembling stacked substrates that can form cylindrical inductors and adjustable transformers: A system is described that can assemble substrates over one another to form a stacked substrate. The various layers of the stacked substrate can be separated from each other by using Coulomb forces. In addition, a beam substrate can be used to increase the separation. The instructions for assembly and... Agent: Thaddeus Gabara

20090147432 - Forming large planar structures from substrates using edge coulomb forces: A movable substrate is placed over a bottom substrate where both substrates contain Coulomb islands. The Coulomb islands can be adjusted in charge and are used to develop a force between two opposing Coulomb islands. Information from sensors is applied to a control unit to control the movement of the... Agent: Thaddeus Gabara

20090147433 - Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire: At least one non-volatile device is coupled to a first Coulomb island. The floating gates of these non-volatile devices are connected to the island and can charge the Coulomb islands. One device can charge the island positively while a second device can be used to charge the island negatively. The... Agent: Thaddeus Gabara

20090147435 - Particle trap: An apparatus and method for trapping particles in a housing is disclosed. A high voltage terminal/structure is situated within a housing. A conductive material, having a plurality of holes, such as a mesh, is disposed a distance away from an interior surface of the housing, such as the floor of... Agent: Nields, Lemack & Frame, LLC

20090147434 - Using multiple coulomb islands to reduce voltage stress: A substrate is levitated a first distance over a mother substrate when a first group of Coulomb islands are charged. A second group of Coulomb islands are charged and increase a separation to a second distance. When the magnitude of the potential of all Coulomb islands is decreased, the separation... Agent: Thaddeus Gabara

20090147436 - Air variable capacitor comprising an interdigital mobile comb and fixed comb, accelerometer and gyrometer comprising such a capacitor: The invention relates to an air variable capacitor including a mobile comb and a fixed comb. Each of the combs include a body and teeth each having an end fixed to the body and free end. The teeth of the mobile and fixed combs being interdigital and an the air-gap... Agent: Marjama Muldoon Blasiak & Sullivan LLP

20090147437 - Coulomb island and faraday shield used to create adjustable coulomb forces: A first insulated planar metallic surface is formed under a surface of a substrate which is orientated a first way to an edge of the substrate. A Faraday shield is formed when a second insulated planar metallic surface is juxtaposed to and segregates the first insulated planar metallic surface from... Agent: Thaddeus Gabara

20090147438 - Semiconductor device and method of manufacturing the semiconductor device: An MIM capacitance element (capacitance lower electrode, capacitance insulation film and capacitance upper electrode) is provided on a first insulation film on a semiconductor substrate. An interlayer insulation film is provided so as to cover the MIM capacitance element and flattened. The interlayer insulation film is provided with a first... Agent: Mcdermott Will & Emery LLP

20090147440 - Low inductance, high rating capacitor devices: Methodologies and structures are disclosed for providing multilayer electronic devices having low inductance and high ratings, such as for capacitor devices for uses involving faster pulsing and higher currents. Plural layer devices are constructed for relatively lowered inductance by relatively altering typical orientation of capacitors such that their electrodes are... Agent: Dority & Manning, P.A.

20090147439 - Multilayer capacitor array: At least one of a plurality of first internal electrodes and a second internal electrode are arranged as opposed with at least one of the dielectric layers in between. Third and fourth internal electrodes are arranged as opposed with at least one of the dielectric layers in between. The first... Agent: Oliff & Berridge, PLC

20090147441 - Closed-type capacitor: A closed type capacitor (1) includes: an external container (10) which cuts off gas; a pair of polarized electrodes contained in the external container (10); a separator arranged between the electrodes; and a non-aqueous electrolytic liquid containing electrolyte and a non-aqueous organic solvent if necessary. The external container (10) has... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090147442 - Electric double-layer capacitor and method of producing same: The present invention relates to an electric double-layer capacitor and a method for producing same capable of evenly and rapidly doping a negative electrode layer with lithium ions. The electric double-layer capacitor comprises: a positive electrode including a positive electrode layer formed on one surface of a positive electrode current... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090147443 - Electrolytic solution and electrolytic capacitor using the same: e

20090147444 - Electrolytic solution for electrolytic capacitor and electrolytic capacitor using the same: An electrolytic solution for an electrolytic capacitor includes a solvent and an electrolyte dissolved in the solvent. This electrolyte includes at least one of a carboxylic acid and a salt of the carboxylic acid. The carboxylic acid has a carboxyl group and at least one or more of substituents bonded... Agent: Pearne & Gordon LLP

20090147445 - Micropowder of nb compound and process for production thereof: The powder of an Nb compound has a composition represented by NbxOy, NbxNz or NbxOyNz. The powder of the Nb compound has an electric conductivity which is not less than 1/10 of that of Nb. A porous sintered body used for manufacturing a solid electrolytic capacitor is formed using the... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20090147446 - Solid electrolytic capacitor and manufacturing method thereof: The present invention provides a solid electrolytic capacitor having sufficiently low impedance at high frequencies in which a conductive polymer formed on a dielectric oxide film has good adherence to the dielectric oxide film, and a manufacturing method of the solid electrolytic capacitor. The solid electrolytic capacitor of the present... Agent: Oliff & Berridge, PLC

20090147447 - Solid electrolytic capacitor: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion. The rising portion is formed integral with the anode terminal portion, extends from the anode terminal... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090147448 - Solid electrolytic capacitor: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion. The rising portion is formed integral with the anode terminal portion, and extends from the anode... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090147449 - Solid electrolytic capacitor: A solid electrolytic capacitor includes a capacitor element, an anode lead frame, a cathode lead frame, and a mold resin portion. The anode lead frame includes an anode terminal portion and a rising portion, and the anode terminal portion is exposed at the bottom surface of the mold resin portion.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090147450 - Case body and electric apparatus: An attachment section 215A is approximately vertically cut and raised in a tongue-shape on a lateral section 212 of a lower casing 210 provided by press working of a steel plate in a manner that an outer side of the lateral section 212 becomes an upper side of the attachment... Agent: Kratz, Quintos & Hanson, LLP

20090147451 - Electronic device and sliding mechanism thereof: A sliding mechanism is provided for movably connecting a display module and an input module of an electronic device. The sliding mechanism includes a first member and a second member reciprocally movable with respect to each other. The first member has a longitudinal slot, and the second member has a... Agent: Birch Stewart Kolasch & Birch

20090147453 - Electronic device and sliding mechanism thereof: A sliding mechanism is disclosed, wherein the sliding mechanism movably connects to a display module and an input module of an electronic device. The sliding mechanism includes a first member, a second member, a connection member, and a cover movably disposed on the first member. The first member is movable... Agent: Birch Stewart Kolasch & Birch

20090147452 - Server chassis with air flap apparatus: A server chassis is provided for receiving a functional module therein. The server chassis includes a base with an opening defined in an end thereof for the functional module inserted therethrough, and an air flap apparatus engaging with the base. The air flap apparatus includes a shielding panel pivotably attached... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147455 - Information handling systems having coatings with porous particles and processes of forming the same: Particles having a relatively high porosity can be used in an information handling system or other information handling system. In one aspect, a portable information handling system can include an electrical circuit that can generate thermal energy during normal operation of the electrical circuit. The portable information handling system can... Agent: Larson Newman Abel & Polansky, LLP

20090147457 - Display apparatus and method for positioning a display panel: A display apparatus including a stand, a display panel, a location adjusting mechanism, a power switch and a biometric verification device is provided. The display panel is disposed on the stand. The location adjusting mechanism is disposed on the stand or the display panel and capable of adjusting relative positions... Agent: Jianq Chyun Intellectual Property Office

20090147456 - Printed circuit board with multi layer ceramic capacitor and flat panel display device using the same: A printed circuit board has an opening, and a multi-layer ceramic capacitor is disposed inside the opening and is coupled to the printed circuit board. The multi layer ceramic capacitor is coupled to the printed circuit board in a manner that a center of gravity of the multi-layer ceramic capacitor... Agent: Robert E. Bushnell & Law Firm

20090147458 - Double hinge assembly and electronic device using the same: An exemplary double hinge assembly (30) includes a first hinge subassembly (31), a second hinge subassembly (32), a first bracket (35), a second bracket (36) and a connecting member. The first hinge subassembly (31) includes a first rotatable pivot shaft (311). The second hinge subassembly (32) includes a second rotatable... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147462 - Device for enclosing a flash memory module: A device (100) for enclosing a flash memory module includes a first shell (1) having a groove (13), and an outer wall (14) covering the groove and having an reduced opening (142) communicating with the groove. An attachment mechanism (4) coupled to the first shell comprises a retaining member (42)... Agent: Wei Te Chung Foxconn International, Inc.

20090147461 - Electronic data storage device structure: An electronic data storage device structure comprises a casing, at least one electronic data storage device, and a cap. The casing has a receiving space and at least one opening, the electronic data storage device is plugged into the opening, the cap is coupled with the casing, and the cap... Agent: Rosenberg, Klein & Lee

20090147459 - Modular power supply for computer servers: A system, in certain embodiments, may include a server power supply having a modular chassis having dimensions standardized across a plurality of different servers. The dimensions may be configured to fit the modular chassis uniformly within receptacles of the plurality of different servers. A method of manufacture, in certain embodiments,... Agent: Hewlett Packard Company

20090147460 - Portable storage device: A portable storage device comprises a protecting housing, a casing, a keystroke, a circuit board, and an electrical plug. There is an orientating hole which comprises the first fixing portion formed on the protecting housing. The casing slides in the interior of the protecting housing, and comprises a flexible arm... Agent: Rosenberg, Klein & Lee

20090147463 - Receiver apparatus: There is provided a digital broadcasting receiver apparatus in which a temperature in the area surrounding a removable HDD does not become a high temperature during an operation regardless of whether it is disposed horizontally or vertically. A component with a large heat generating quantity and a component with a... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090147465 - Computer: A computer storing an operating system therein and including a first case, a second case, a driving mechanism and a starting unit is provided. The driving mechanism is connected between the first case and the second case. The starting unit is disposed at the first case, electrically connected to the... Agent: Jianq Chyun Intellectual Property Office

20090147464 - Ventilation assembly for computer hardware systems: An assembly for dissipating heat generated by electronic components which include a ventilating panel having a plurality of vent holes arranged thereon. More specifically, the perforation pattern of vent holes is staggered to provide adjacent larger and smaller vent holes in at least two rows of vent holes. A second... Agent: Ibm-rochester C/o Toler Law Group

20090147466 - Fixing device and computer: The fixing device of the invention comprises a fan containing portion and at least one interface card fixing element wherein the fan containing portion can be connected to the fan, the interface fixing element comprising a first guiding portion, a second guiding portion and an against element, the first guiding... Agent: Bacon & Thomas, PLLC

20090147454 - Heat dissipation module: A heat dissipation module is used to cool a microprocessor. The heat dissipation module includes a base, a diversion pipeline, a plurality of heat conductive pieces and a fan. The base is assembled on the microprocessor. The diversion pipeline is connected to the base, provides a diversion direction, and has... Agent: Bacon & Thomas, PLLC

20090147470 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a housing including an opening; a first button provided for the opening; a second button provided for the opening; a first switch provided in the housing and opposed to the first button; and a second switch provided in the housing and opposed... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090147467 - Electronic device: An electronic device includes a main body, a lid body, a hinge, a notch, and a cable. The main body includes a connecting side where the lid body is pivotally mounted to the main body. The hinge is disposed on the connecting side for mounting the lid body to the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147469 - Foldable electronic apparatus with an enhanced pivotal mechanism: A portable electronic apparatus includes a first casing, a second casing, and an enhanced pivotal mechanism for folding/unfolding the second casing with respect to the first casing. The pivotal mechanism further includes a main pivot to pivot the first casing and the second casing; a combination constructed on the first... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090147468 - Portable apparatus incorporating a sound output device: A portable apparatus includes a display housing, a main housing, and a sound output device. The display housing has a pivot side. The main housing includes a pivot portion that defines a pivot axis, and that is coupled to the pivot side of the display housing such that the display... Agent: Townsend And Townsend And Crew, LLP

20090147471 - Slider assembly for a housing of a mobile computing device: A mobile computing device is provided that includes a front housing segment and a back housing segment. The front housing segment includes a first front slot and a first front securement feature or cleat. The back housing segment includes a first back slot and a first securement feature or cleat.... Agent: Shemwell Mahamedi LLP

20090147472 - Means to utilize conduction-cooled electronics modules in an air cooled system: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. The convection bridge is clamped between the VME... Agent: Honeywell International Inc.

20090147474 - Apparatus for preventing refluence of air in an electronic device: An apparatus including a base plate, and a plurality of diaphragms is provided for preventing refluence of air in an electronic device. Each diaphragm includes a hollow main body, and a plurality of movable petaline portions extending out from an end of the main body. Difference in air pressure may... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147473 - Fan suspension for reduction of noise: The electronic system has a chassis having a base and a set of flanges extending from the base. The electronic system has electronic circuitry housed within the chassis. The electronic system has a fan assembly having a fan arranged to generate an air stream suitable for cooling the electronic circuitry,... Agent: Bainwood Huang & Associates LLC

20090147476 - Circuit board apparatus with induced air flow for heat dissipation: A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion... Agent: Ipxlaw Group LLP

20090147477 - Electronic device: An electronic device includes a housing, a plurality of heat-dissipating fins, and a heat-dissipating fan. The housing defines a receiving space, and an opening communicating the receiving space with the outside environment. The housing includes a power socket disposed in the receiving space. The heat-dissipating fins are disposed in the... Agent: Zaretsky Patent Group PC

20090147475 - Heat dissipation device having a fan mounted thereon: A heat dissipation device for dissipating heat from a heat-generating electronic element includes a heat sink for contacting with the heat-generating electronic element, a fan placed on the heat sink for providing an airflow through the heat sink and two wire clips. The fan comprises a frame. Each wire clip... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147478 - Heat sink fan: A heat sink fan of the present invention includes a heat sink and a fan. The heat sink includes a base having a center axis and a plurality of fins extending radially outwardly from an outer circumference of the base and disposed in a circumferential direction. The fan includes an... Agent: Volentine & Whitt PLLC

20090147479 - Heat dissipation apparatus: A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090147480 - Heat sink and electronic apparatus using the same: A heat sink and an electronic apparatus using the same are disclosed. The heat sink comprises a fin structure and a fastening assembly; the fastening assembly comprises an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin... Agent: Bacon & Thomas, PLLC

20090147481 - Electronic device: The electronic device 10 is constituted such that a circuit board 12 having electronic parts 11 packaged thereon is housed in a casing 13, such that projections 15 and pits 16 are relatively formed in the outer face 13A of the casing 13, and such that the projections 15 are... Agent: Pearne & Gordon LLP

20090147482 - Electric control device and manufacturing method thereof: An electric component is mounted on a circuit board, and a pre-foamed heat radiating member is applied on the electric component. The circuit board is inserted into a chassis having a box shape with an opening in one side toward an opposite side of the opening. A thickness of the... Agent: Posz Law Group, PLC

20090147483 - Slipover distribution cabinet: Replacing, and in particular extending, the body of an outdoor distributor cabinet includes removing the body of the old distributor cabinet, slipping a new hollow base over the old assembly frame and the old base. A new body, which has at least the same inner capacity as the old body,... Agent: Merchant & Gould PC

20090147484 - Handheld electronic device: A handheld electronic device including a first body, a second body, a flexible electrical connecting means and a cover is provided. The second body is slidely coupled to the first body. The flexible electrical connecting means is electrically connected between the first body and the second body and the cover... Agent: Jianq Chyun Intellectual Property Office

20090147485 - Sliding mechanism for portable electronic device: A sliding mechanism includes: a slidable intermediate member having first and second guide holes; a first shaft that is slidably inserted into the first guide hole, the first shaft having first and second end portions; a first spring member that is interposed between the first end portion of the first... Agent: Frishauf, Holtz, Goodman & Chick, PC

20090147486 - Mounting apparatus for expansion cards: A mounting apparatus is configured for fixing an expansion card. The mounting apparatus includes a support fixed to an enclosure, a fastening member, and a latching member pivotably coupled to the fastening member. One end of the fastening member is fixed to the support, and the other end of the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090147487 - Cable routing structure: A cable routing structure includes a flexible flat cable and a wiring board. The wiring board has a first side and a second side that is opposite the first side. The wiring board includes a cable attachment component, a first access component and a second access component. The cable attachment... Agent: GlobalIPCounselors, LLP

20090147488 - Printed circuit board having chip package mounted thereon and method of fabricating same: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB... Agent: Darby & Darby P.C.

20090147489 - Structure for mounting feedthrough capacitors: In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial regions, and a current in the partial... Agent: Oliff & Berridge, PLC

20090147490 - Substrate for wiring, semiconductor device for stacking using the same, and stacked semiconductor module: In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved.... Agent: Steptoe & Johnson LLP

20090147492 - Data processing system: The invention relates to a data processing system with a main board, in which main board has at least one multipoint connector, in which at least one riser card is accommodated, and a first daughter card is accommodated in first riser card in such a manner that first daughter card... Agent: Hayes Soloway P.C.

20090147491 - Receiving apparatus and board installation member: e

20090147494 - Electronic device and slot: An electronic device includes a casing having an opening, a cover that covers the opening, a slot connector provided on a board arranged in the casing, and a conducting member that is provided at the slot and that electrically connects the printed circuit board to the cover.... Agent: Staas & Halsey LLP

20090147493 - Electronic module with seamless anti-emi device: An electronic module (10) includes a housing having outer surface, a metal gasket (5) attached to the housing and covering the outer surface. The gasket (5) has a set of first detents (53) and a set of second detents (52). The set of first detents (53) are spaced apart from... Agent: Wei Te Chung Foxconn International, Inc.

20090147495 - Assembly device for line and plug connector elements: The invention relates to a mounting apparatus for electrical line and plug-in connecting elements for telecommunications and data technology, having at least one front panel (5), which has a supporting structure (12) with side supporting elements (14) and at least one panel (11) with a plurality of receptacles (10) for... Agent: Merchant & Gould PC

20090141411 - Voltage regulator module control circuit: An exemplary voltage regulator module (VRM) control circuit includes a VRM providing a plurality of phases, each of the phases connected to a control terminal of a corresponding electric switch; a comparator comprising a non-inverting terminal connected to a first power source and grounded via the electric switches respectively, an... Agent: PCe Industry, Inc. Att. Steven Reiss

20090141412 - Electrical interface system: An interface system may be used to connect an electrical device to an electrical bus. The interface system may include a first end and a second end in electrical communication with the first end. Where the interface system is used to connect an electrical device to an electrical bus, the... Agent: Caterpillar Inc. Intellectual Property Dept.

20090141415 - Electrostatic discharge circuit: An electrostatic discharge circuit includes a trigger section configured to detect voltage drops occurring by an electrostatic current transmitted to first and second voltage lines, and to provide pull-up and pull-down detection voltages, an auxiliary discharge section configured to operate by the pull-up and pull-down detection voltages, and to discharge... Agent: Baker & Mckenzie LLP Patent Department

20090141413 - Integrated electrostatic discharge (esd) protection circuitry for signal electrode: An integrated electrostatic discharge (ESD) protection circuitry for a signal electrode. Coupled in shunt between the signal electrode and the positive and negative power supply electrodes are opposing sets of multiple diodes coupled in series. Each set includes a diode across which is applied a nominal reverse bias voltage These... Agent: Vedder Price/nsc

20090141414 - Protection circuit for electric power of a car: A protection circuit for power of a car is located between an output terminal of a car power and a car's electronic device input terminal. The protection circuit includes a transient voltage suppressing diode, a diode, and a filtering circuit. The two terminals of the transient voltage suppressing diode are... Agent: Rosenberg, Klein & Lee

20090141416 - Device for short-circuiting power semiconductor modules: An apparatus has power semiconductor modules, which are connected to one another via connection devices so as to form a series circuit. A short-circuiting device for short-circuiting the respective power semiconductor module is assigned to each power semiconductor module. The apparatus has a reliable and at the same time cost-effective... Agent: Lerner Greenberg Stemer LLP

20090141417 - Power supply control apparatus having a function supplying power supply voltage: A microprocessor commonly receives at an A/D port the potentials of the power supplies output from a plurality of types of power supplies (a power supply for HDMI, a power supply for LSI, a power supply for an audio driver IC, and a power supply for a tuner). The A/D... Agent: Osha Liang L.L.P.

20090141418 - Electrostatic chuck and apparatus having the same: An electrostatic chuck and an apparatus having the electrostatic chuck are provided. The electrostatic chuck may attract a substrate during a substrate assembling process for manufacturing a flat display panel. An elastic layer made of an elastic material may be provided in a base part of the electrostatic chuck, thus... Agent: Ked & Associates, LLP

20090141419 - System and method of film capacitor cooling: Film capacitor assembly has a plurality of film capacitive layers for storing an electric charge. The plurality of film capacitive layers have a first metal contact and a second metal contact. A heat sink removes heat from the plurality of film capacitive layers. The heat sink is in thermal conductive... Agent: Carlson, Gaskey & Olds, P.C.

20090141420 - Packaged capacitive device and methods of making the same: Packaged capacitive devices are described having electrical interconnects of electrodes which possess efficient electrical contact between current collectors, electrical isolation of electrodes, and/or electrochemical stability, while minimizing the mechanical stress and strain applied to the electrodes, in part, due to the use of a compliant layer. The packaged capacitive devices... Agent: Corning Incorporated

20090141421 - Feedthrough capacitor mounted structure: A feedthrough capacitor having a pair of first terminal electrodes and a second terminal electrode is mounted on a mounting surface of a substrate. The substrate is an insulating substrate internally having first and second conductor portions isolated from each other, and has a plurality of first via holes, a... Agent: Oliff & Berridge, PLC

20090141422 - Capacitive device: Capacitive devices are described having electrical interconnects of electrodes which possess efficient electrical contact between current collectors, electrical isolation of electrodes, and/or electrochemical stability, while minimizing the mechanical stress and strain applied to the electrodes. The capacitive devices are adaptable to a wide range of electrode diameters and electrode stack... Agent: Corning Incorporated

20090141423 - Parallel plate magnetic capacitor and electric energy storage device: A parallel plate magnetic capacitor (Mcap) includes two first pillar electrodes, two second pillar electrodes and a dielectric layer. The two first pillar electrodes electro-connect with each other and are located at right corner of a first plane and left corner of a second plane respectively. The two second pillar... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090141424 - Semiconductor devices and methods of manufacture thereof: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of... Agent: Slater & Matsil LLP

20090141425 - Screen-printable encapsulants based on soluble polybenzoxazoles: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20090141426 - Thin film multi-layered ceramic capacitor and method of fabricating the same: Provided are a thin film multi-layered ceramic capacitor and a method of fabricating the same. The thin film multi-layered ceramic capacitor includes a multi-layered structure including at least two capacitor layers stacked on top of each other. Each capacitor layer includes a substrate comprising a top surface comprising a plurality... Agent: Ladas & Parry LLP

20090141427 - Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.... Agent: Mcdermott Will & Emery LLP

20090141428 - Electrical isolator for capacitive device: Capacitive devices are described having electrical isolators for electrodes which possess efficient electrical contact between current collectors, electrical isolation of electrodes, and/or electrochemical stability, while minimizing the mechanical stress and strain applied to the electrodes. The capacitive devices are adaptable to a wide range of electrode diameters and electrode stack... Agent: Corning Incorporated

20090141429 - Capacitor and method for manufacturing the same: A capacitor electrode includes a first surface and a second surface which are arranged opposite each other. The capacitor electrode contains an oxygen atom and a nitrogen atom. The capacitor electrode includes a position A where the oxygen atom exhibits a largest concentration value, between the first surface and the... Agent: Young & Thompson

20090141430 - Gas-insulated switchpanel of a medium-voltage switchgear assembly: A gas-insulated switchpanel of a medium-voltage switchgear assembly includes busbar connection and cable outlet regions with a manually actuable switch arrangement having a contact position, with a conductive connection from the busbar connection region to the cable outlet region via the switch arrangement and a vacuum contactor, driven by a... Agent: Lerner Greenberg Stemer LLP

20090141431 - Power distribution panel with modular elements: A power distribution panel having circuit elements such as KTK and GMT fuses removably mounted to a unit housing by means of module members, thereby allowing for ease of customization of the circuit elements of the power distribution panel.... Agent: Merchant & Gould PC

20090141432 - Rapid cooling of exhaust from arc resistant electrical equipment: A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an enclosure, an exhaust duct coupled to the enclosure, and a phase change material disposed... Agent: Fletcher Yoder Law (for Rockwell Automation)

20090141433 - Sensor assembly for a power bus: A sensor assembly is provided for a power bus. The power bus exhibits a number of characteristics, such as a temperature. The sensor assembly includes an enclosure having a housing and a base. At least one sensor such as, for example, a temperature sensor, is housed within the enclosure. The... Agent: Martin J. Moran

20090141434 - Computer memory socket particulate management system and method: A cover for memory sockets of a computer memory module includes a face panel spaced away from the memory sockets. The cover is held in place via latches associated with the memory sockets. Tabs are spaced along opposite sides of the cover to define openings for the memory sockets. Members... Agent: Brooks Kushman P.C. / Sun / Stk

20090141436 - Trim element for housing of computing device: A trim element is provided for a housing assembly of a computing device. The trim element may be molded and shaped to circumvent a front facade of the housing assembly to form a perimeter trim... Agent: Shemwell Mahamedi LLP

20090141438 - Circuit component, electrode connection structure and display device including the same: An electrode connection structure including a first circuit component including a resin plate, a barrier film stacked on a surface of the resin plate, a circuit section formed on the barrier film and a first electrode provided on the surface of the resin plate on which the barrier film is... Agent: Sharp Kabushiki Kaisha C/o Keating & Bennett, LLP

20090141437 - System and method to attach bezel to display panel: There is provided a system and method for securing a display to a display bezel. One or more display fasteners snap with mating snap features on the display bezel. One or more mating snap features of the display in turn snap with the display fasteners, thereby securing the display bezel... Agent: Hewlett Packard Company

20090141439 - Portable computer with reconfigurable display: A portable computer system is provided having a base unit and a detachable display unit. The display unit can be attached to and supported by the base unit in a landscape orientation or a portrait orientation via one or more connectors provided on two different sides of the display unit.... Agent: Wood, Phillips, Katz, Clark & Mortimer

20090141441 - Air baffle with integrated tool-less expansion card attachment: An air baffle with an integrated expansion card attachment is disposed in a computer for receiving an expansion card having a handle attached thereto. The air baffle includes a first wall including a first guide and a second guide projecting from a side surface of the first wall. The first... Agent: Osha Liang L.L.P./sun

20090141440 - Portable storage device: A portable storage device which is used by being connected to terminals of an external apparatus, comprises a main body of a rectangular cover case, in which an opening is formed at a front and a fit opening is formed in a wall; a rectangular terminal enclosure supported inside said... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090141435 - Containers for transporting data from a first physical location to a second physical location: Containers provide for the retrieval of data from a data source at a first location and for transport to a second location where the data may be uploaded to a backup system. The containers may include multiple components such as a transfer housing that has a physical connection to a... Agent: At&t Legal Department - Wk Attn: Patent Docketing

20090141442 - Removable cooling duct with interlocking dovetail connections for an air tight thermal seal: A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed portion and a removable portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The... Agent: International Business Machines Corporation

20090141444 - Apparatus for air cooling of an electronic device: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be... Agent: Beyer Law Group LLP/apple Inc.

20090141443 - Low airflow impedance pcba handling device: A computer server includes a printed circuit board and a fan. The printed circuit board includes electronic components and a handling device mounted thereon. The fan is arranged to blow air across the electronic components mounted on the printed circuit board. The handling device is disposed in a path of... Agent: Osha Liang L.L.P./sun

20090141446 - Bag computer assembly with exposable control surface: The Bag Computer Assembly with Exposable Control Surface is a panel-like computer with mounting attachments to allow it to be pivotally attached to a bag so that it may be stored flat against the bag front or pivoted out on one computer edge so that the display on the computer's... Agent: Charles A. Daley Iii

20090141445 - Chip card catching mechanism and portable electronic device using the same: A chip card catching mechanism installed in a body of a portable electronic device for receiving and securing a chip card is provided. The chip card catching mechanism includes a base, a housing, and a hatch. The base includes a connector arranged thereon for electrically connecting to the chip card.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090141447 - Power supply unit: A cooling device includes a cooling fan placed in a power storage device, an exhaust port placed in a battery, and a cooling wind flow path for allowing cooling wind taken in from the cooling fan to flow therethrough. In the power storage device and the battery, communication between a... Agent: Oliff & Berridge, PLC

20090141448 - Low-cost, self-aligning, blind mating, tool-less fan module: A fan module, including a housing for receiving a fan, a connector configured to mate with a connector housing, and a vibration pad configured to isolate vibrations of the fan from transferring through the fan module, wherein the fan module is configured to receive an alignment attachment standoff.... Agent: Osha Liang L.L.P./sun

20090141449 - Mounting apparatus for fan: A mounting apparatus is used to mount a fan having a bottom panel with a mounting hole defined therein. The mounting apparatus is configured to support the bottom panel on a top side thereof. The board forms a clip on the top side of the board, and defines a through... Agent: PCe Industry, Inc. Att. Steven Reiss

20090141450 - Heat dissipating structure for electronic component and display device: A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090141451 - Heat dissipation apparatus: A heat dissipation apparatus including an insulation substrate, a heat sink, and a stress reduction member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. The heat sink is thermally coupled to the second surface of... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090141452 - Apparatus for directing heat to a heat spreader: An apparatus for dissipating heat from a device is provided. The apparatus includes a heat sink having an elongated shape and defining a groove. A heat spreader composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the... Agent: Fogg & Powers LLC

20090141453 - Heat dissipation device having a clip assembly: A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink and a clip attaching the heat sink onto the printed circuit board. The heat sink has a rectangular base and a plurality of fins extending upwardly from the base.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090141454 - Heat dissipating module: A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting... Agent: Jianq Chyun Intellectual Property Office

20090141455 - Circuit arrangement for electrically controlling power and cooling arrangement: The disclosure relates to a circuit arrangement for electrically controlling power, comprising at least one power control device and at least one heat extraction device. The at least one extraction device is in thermal contact with the at least one power control device. The heat extraction device is arranged such... Agent: Buchanan, Ingersoll & Rooney PC

20090141456 - Multilayer, thermally-stabilized substrate structures: A multilayer, thermally-stabilized substrate, including: a thermally-conductive core structure, including a central section located horizontally between two edge sections; a top multilayer circuit board connected to the top surface of the central portion of the core structure; and a bottom multilayer circuit board connected to the bottom surface of the... Agent: Ratnerprestia

20090141457 - Rail coupling member, unit support mechanism and electronic device: A disclosed rail coupling member couples a pair of rail members to be attached to lateral sides of a unit that is detachably supported in an electronic device. The rail coupling member is a flexible and discrete unit, and is not part of the rail members. The rail coupling member... Agent: Staas & Halsey LLP

20090141458 - Expansion module and system thereof: An expansion module includes a housing, at least one first wedging device, a connecting device, and a module socket. At one side of the housing, there is at least one plugging pin. The first wedging device is located in the housing. The first wedging device corresponds to the plugging pin.... Agent: Rosenberg, Klein & Lee

20090141459 - Methods and apparatus for providing holes through portions of a housing of an electronic device: Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through an extruded portion of the housing.... Agent: Kramer Levin Naftalis & Frankel LLP

20090141460 - Ceramic multilayer component, method for the production thereof and retaining device: An electrical component includes a sintered ceramic and electrodes inside the sintered ceramic. The sintered ceramic and the electrodes together form a stack having a first surface and a second surface. The electrodes include a first electrode and a second electrode. The first electrode extends to the first surface but... Agent: Fish & Richardson PC

20090141461 - Circuit board position structure: A positioning structure is applied to an electrode device, which includes a movable component and an elastic element. The movable component is moved towards the joining direction for the circuit board and a case to press the elastic element, so as to deform the elastic element. A stopper is against... Agent: Rabin & Berdo, PC

20090141462 - Plasma display device: A PDP (600) is attached to an electrically conductive board (31) with a heat dissipation sheet (60) sandwiched therebetween. A first driving circuit board (32) is fixed on the electrically conductive board (31) by a plurality of electrically conductive supports (34). On one surface, which faces the electrically conductive board... Agent: Greenblum & Bernstein, P.L.C

20090141463 - Screw-less latching system for securing load boards: A screw-less latching system for securing load boards comprises a frame and a backer plate. The frame includes a loading site for a device under test. The loading site includes a first tee clamp disposed along a first longitudinal axis and a second tee clamp disposed along a second longitudinal... Agent: Fay Kaplun & Marcin, LLP

20090141464 - Wiring board and electronic component device: A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of... Agent: Kratz, Quintos & Hanson, LLP

20090141465 - Electronic apparatus and circuit board: According to one embodiment, a circuit board carries thereon a connection pattern for the connection of a PC card receptacle selectively mounted in a mounting area, a connection pattern for the connection of an Express card receptacle, and a connection pattern for the connection of a smartcard receptacle. An end... Agent: Knobbe Martens Olson & Bear LLP

20090141466 - Patch panel: An exemplary patch panel includes a printed circuit board having a plurality of input terminals and output terminals. An amount of the input terminals is equal to an amount of the output terminals. The input terminals are connected to the output terminals respectively. The printed circuit board further includes a... Agent: PCe Industry, Inc. Att. Steven Reiss

20090141468 - Light emitting assembly and method for assembling the same: A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert... Agent: Banner & Witcoff, Ltd.

20090141467 - Method and system for enabling multiple vga cards to process image data: A method and system for enabling multiple video graphics array (VGA) cards to process image data are disclosed. Specifically, one embodiment of a graphics system includes a first video graphics array (VGA) card having a first and a second connection ports, a second VGA card having a first and a... Agent: Patterson & Sheridan, L.L.P.

20090141469 - Method and a system having a flexible gasket and a gliding connector aligner: A system for protecting electronic components to be disposed inside a computer housing comprising a gliding connector aligner for disposing inside the housing. The aligner has a central flat surface to be disposed over electronic components and a plurality of appendages with at least one nub each disposed at an... Agent: International Business Machines Corporation

20090141470 - Shield structure for electronic device: The present invention provides a shield structure for an electronic device allowing conductive members to be connected electrically to each other at low impedance while preventing the leakage of electromagnetic waves effectively. The first conductive member and the second conductive member for enclosing the electronic device respectively have laid portions... Agent: Hamre, Schumann, Mueller & Larson P.C.

20090141471 - Collapsible emc gasket: A method and associated assembly is provided for a collapsible EMC gasket is provided. In one embodiment, the gasket comprises a flexible conductive sheet disposed between corner of a first and a second surface of a computer frame capable of housing electronic components. The sheet is larger in area than... Agent: International Business Machines Corporation

20090141472 - Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methods: An adhesive film for semiconductor assembly includes a binder portion 1, a sub-binder portion, and a cured portion, wherein the binder portion 1 and the sub-binder portion co-exist in a co-continuous phase structure after curing begins.... Agent: Lee & Morse, P.C.