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USPTO Class 361 | Browse by Industry: Previous - Next | All 05/2009 | Recent | 09: Oct | Sept | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 08: Dec | Nov | Oct | Sp | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 07: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 06: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Electricity: electrical systems and devices inventions 05/09Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 05/28/2009 > patent applications in patent subcategories. 20090135531 - Overcurrent protection circuit, load driving device, motor driving device, electric appliance, power supply device: In an overcurrent protection circuit 23 according to the present invention, a timer circuit TMR that generates an overcurrent protection signal EN according to the results of comparison between a detection voltage Va (Vb) and VrefL and VrefH is configured as follows. When Va (Vb) has reached VrefL, the timer... Agent: Fish & Richardson P.C. 20090135535 - Electrostatic discharge device with metal option ensuring a pin capacitance: The present invention discloses an electrostatic discharge device for ensuring a pin capacitance using a metal option. The electrostatic discharge device includes an electrostatic discharging unit formed between a power source voltage line and a ground voltage line to discharge static electricity input from a pad. A MOS capacitor of... Agent: Ladas & Parry LLP 20090135532 - Electrostatic discharge protection circuits: An electrostatic discharge (ESD) protection circuit is provided. A transistor is coupled between a node and a ground, and has a gate coupled to the ground. A diode chain is coupled between the node and a pad, and comprises a plurality of first diodes connected in series, wherein the first... Agent: Quintero Law Office, PC 20090135533 - Power-rail esd protection circuit with ultra low gate leakage: An ESD protection circuit including a clamping module and a detecting module is provided. The clamping module is coupled between a positive power line and a negative power line. The detecting module includes a triggering unit, a resistor, and a MOS capacitor. An output terminal of the triggering unit is... Agent: Reed Smith LLP 20090135534 - Semiconductor integrated circuit: A semiconductor integrated circuit includes a first and second power supply domain circuits having a first and second power supply terminals, respectively. An internal signal propagation line propagates a signal from a circuit of the first power supply domain circuit to that of the second power supply domain circuit. A... Agent: Amin, Turocy & Calvin, LLP 20090135536 - Over-current protection in linear regulators: An integrated circuit radio transceiver and method therefor includes a linear regulator an output transistor for producing a current into an output node of the regulator wherein an amplification block is operable to produce a bias signal to a gate terminal of the output transistor to operably bias the output... Agent: Garlick Harrison & Markison 20090135538 - Piezoelectric transformer type ionizer and neutralization method: With a piezoelectric transformer formed of a ferroelectric element which generates a high voltage in a secondary section upon application of an AC voltage to a primary section, ground electrodes are attached to upper and lower surfaces of the secondary section of the piezoelectric transformer via a dielectric sheet for... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090135537 - Wire electrode type ionizer: An ionizer includes positive and negative wire electrodes each formed of a conductive wire with a circular cross section. The wire electrodes are arranged in parallel with each other, each having circumferential surfaces serving as a discharge surface on which a corona discharge occurs upon application of positive and negative... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090135539 - Electrostatically atomizing device: The electrostatically atomizing device in this invention comprises an emitter electrode, a water supply means, a high voltage source, and an atomization detecting means and further comprises a controller. The water supply means is configured to supply water to the emitter electrode. The high voltage source is configured to apply... Agent: Cheng Law Group, PLLC 20090135540 - Electrostatic holding apparatus and electrostatic tweezers using the same: To provide an electrostatic holding apparatus which is capable of performing handling for a long period of time even when a direct current high-voltage power supply is separated from the electrostatic holding apparatus. The electrostatic holding apparatus holds a workpiece to be held with an electrostatic force by applying prescribed... Agent: Oliff & Berridge, PLC 20090135541 - Actuator and electronic circuit based thereon: An actuator includes a substrate, a fixed electrode provided on a major surface of the substrate, a movable beam opposed to the major surface and held above the substrate with a gap thereto, and a dielectric film provided between the fixed electrode and the movable beam. The dielectric film is... Agent: Amin, Turocy & Calvin, LLP 20090135542 - Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same: Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition... Agent: Mcdermott Will & Emery LLP 20090135544 - High q and low stress capacitor electrode array: An embodiment of the present invention provides a method, comprising breaking an electrode into subsections with signal bus lines connecting said subsections and a solid electrode to improve Q.... Agent: James S. Finn C/o William Tucker 20090135543 - Multilayer capacitor: A multilayer capacitor has a first inner electrode connected to a first terminal electrode, a second inner electrode connected to a second terminal electrode, and third and fourth inner electrodes connected to third and fourth terminal electrodes. The first and second inner electrodes have no overlapping area therebetween when seen... Agent: Drinker Biddle & Reath (dc) 20090135545 - Capacitors having a high energy density: m 20090135546 - Nano complex oxide doped dielectric ceramic material, preparation method thereof and multilayer ceramic capacitors made from the same: The present invention provides a nano complex oxide doped dielectric ceramic material used for a multilayer ceramic capacitor using a base metal as a material of internal electrodes. The doped dielectric ceramic material comprises barium titanate and a nano complex oxide dopant, wherein the molar ratio of the barium titanate... Agent: Connolly Bove Lodge & Hutz, LLP 20090135547 - Electric double-layered capacitor: The invention relates to a coin-type electric double-layered capacitor, including activated carbon electrode layers, an electrolytic solution, and a separator between a metal-made top vessel and a metal-made bottom vessel, and obtained by caulking and sealing the top vessel and the bottom vessel with a gasket and a sealing agent,... Agent: Sughrue Mion, PLLC 20090135548 - Positive electrode for electric double layer capacitors, and electric double layer capacitors: The present invention provides a positive electrode for electric double layer capacitors which can improve basic characteristics, such as energy density, of electric double layer capacitors and also can improve electric double layer capacitors in useful life and stability under high temperatures. Provided is a positive electrode for electric double... Agent: Harness, Dickey & Pierce, P.L.C 20090135549 - Lithium ion capacitor: A lithium ion capacitor includes a positive electrode including a positive electrode active material capable of reversibly doping either one or both of a lithium ion and an anion, a negative electrode including a negative electrode active material capable of reversibly doping a lithium ion, and a non-protonic organic solvent... Agent: Osha Liang L.L.P. 20090135550 - Solid electrolytic capacitor: An aspect of the present invention provides a solid electrolytic capacitor that comprises: an anode mainly formed of a valve metal or an alloy thereof; an anode lead terminal a part of which is buried in a side surface of the anode; a dielectric layer formed on surfaces of the... Agent: Mots Law, PLLC 20090135551 - Solid electrolytic capacitor and method for manufacturing the same: A method for manufacturing a solid electrolytic capacitor that prevents leakage current from increasing. The method includes preparing a capacitor element including an anode body, which has an anode lead, and a cathode layer; preparing a lead terminal including an anode terminal, a cathode terminal, and a first insulative member... Agent: Mots Law, PLLC 20090135552 - Heat dissipating device and heat sink fastener: A heat dissipating device is disclosed. The heat dissipating device comprises a heat dissipating base, a frame and at least one resilient member. The heat dissipating base has a plate, and at least one hole is formed on the plate. The frame has at least one protruding column, and at... Agent: Morris Manning Martin LLP 20090135554 - Keyboard: A keyboard includes a first housing having a plurality of first magnetic elements, a keystroke module having a key portion disposed on the first housing, a second housing combining with the first housing and has an opening, and an actuating assembly. The keystroke module is disposed corresponding to the opening.... Agent: Muncy, Geissler, Olds & Lowe, PLLC 20090135555 - Portable terminal: A portable terminal includes a first casing having a first wiring board, a first operation portion, and an accommodating portion opened in its peripheral surface, and a second casing configured to be accommodated in the accommodating portion through the opening and having a second wiring board and a second operation... Agent: Frishauf, Holtz, Goodman & Chick, PC 20090135556 - Hdd anti-shock and anti-vibration device: A Hard Disk Drive anti-shock and anti-vibration device and a Data Storage Device consisting of a HDD and the HDD anti-shock and anti-vibration device are described. The HDD anti-shock and anti-vibration device includes a packaging paper and foam. The foam is adhered on the packaging paper. When this packaging paper,... Agent: Saile Ackerman LLC 20090135553 - Computer enclosure: An exemplary computer enclosure for detachably coupling an external device to the computer enclosure by a cable includes a receiving cavity, a interface device, and a cable guide member. The receiving cavity is configured for receiving a portion of the cable. The interface device is movably received in the receiving... Agent: PCe Industry, Inc. Att. Steven Reiss 20090135557 - Portable computer apparatus with thermal enhancements and multiple modes of operation: A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode. When the portable computer... Agent: Thomas A. Beck, Esq. 20090135558 - Airflow module, data storage device enclosure and method of cooling electronics module: An airflow module for being received in a module bay of a data storage device enclosure is disclosed. The airflow module comprises a body having: a first face having a first opening therein; a second face having a second opening therein, the first face being adjacent to the second face;... Agent: Pillsbury Winthrop Shaw Pittman, LLP 20090135559 - Network cabinet with thermal air flow management system: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first... Agent: Panduit Corp. 20090135560 - High efficiency fluid movers: Fluid movers produce at least predominantly laminar flow internally in an axial or a radial direction in a rotor. A fluid mover rotor comprises a matrix of passages of appropriate size to produce at least predominantly laminar flow spaced circumferentially around the rotor. The passages may provide axial, radial or... Agent: Knobbe Martens Olson & Bear LLP 20090135561 - Electronic device with airflow field: An electronic device with airflow field is disclosed, which comprises a housing, several heat sources, a plurality of openings, an air inlet and an air outlet module. By the use of sealed structure of electronic device, the airflow field can be formed inside the housing to direct the airflow for... Agent: Rosenberg, Klein & Lee 20090135562 - Heat dissipation device: A heat dissipation device includes a base, a heat-dissipation portion attached to the base, at least one heat pipe connecting the base and the heat-dissipation portion and a fan directly secured to the heat-dissipation portion. The heat-dissipation portion comprises a square, tubular housing having opposite front and rear end portions... Agent: PCe Industry, Inc. Att. Steven Reiss 20090135563 - Heat radiation structure of electronic component and display device: A heat radiation structure of an electronic component of the present invention includes a main board mounted with electronic components, an upper side heat sink disposed opposite to a top face of the main board, a lower side heat sink disposed opposite to a second face of the main board,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090135564 - Digital micromirror device module: A digital micromirror device (DMD) module includes a circuit board, a DMD element, a soft elastic pad, a heat dissipation pad and a heat sink. The circuit board includes a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface. The... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP 20090135565 - Assembly device and assembly method for a cooling element: A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted... Agent: Slater & Matsil, L.L.P. 20090135566 - Printed circuit board assembly and liquid crystal display having the same: A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring can prevent the board from sagging.... Agent: Cantor Colburn, LLP 20090135567 - Metal thermal interface material and thermal module and packaged microelectronic component containing the material: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component.... Agent: Quintero Law Office, PC 20090135568 - Plasma display device: A plasma display device is disclosed. In one embodiment, the plasma display device includes a plasma display panel, a chassis base, a printed circuit board assembly, and a flexible printed circuit. The chassis base supports the plasma display panel. The printed circuit board assembly is disposed at one side of... Agent: Knobbe Martens Olson & Bear LLP 20090135569 - Electronic component with wire bonds in low modulus fill encapsulant: An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous... Agent: Silverbrook Research Pty Ltd 20090135570 - Method for improving ebg structures and multi-layer board applying the same: A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a... Agent: Jianq Chyun Intellectual Property Office 20090135571 - Circuit module and circuit board assembly having surface-mount connector: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a... Agent: Kirton And Mcconkie 20090135573 - Circuit board device, wiring board interconnection method, and circuit board module device: A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one... Agent: Mcginn Intellectual Property Law Group, PLLC 20090135572 - Circuit device and method of manufacturing the same: Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface... Agent: Watchstone P+d, PLLC 20090135575 - Semiconductor apparatus: A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of... Agent: Drinker Biddle & Reath (dc) 20090135574 - Wiring board, semiconductor device having wiring board, and method of manufacturing wiring board: The present disclosure relates to a method of manufacturing a wiring board. The method includes: (a) preparing a first board having a pad; (b) providing an insulating member on the first board, wherein a size of the insulating member is larger than that of the first board, when viewed from... Agent: Drinker Biddle & Reath (dc) 20090135578 - Magnetic shielding for high field magnet: Magnetic shielding for surrounding a magnet generating a magnetic field of maximum magnetic flux density substantially in excess of 5 Gauss, so as to reduce the magnetic flux density outside the shielding to no more than 5 Gauss wherein at least part of the shielding is composed of sheets of... Agent: Schiff Hardin, LLP Patent Department 20090135577 - Plasma display device: A plasma display device is disclosed. In one embodiment, the plasma display device includes a plasma display panel (PDP), a chassis base having one side for supporting the PDP, and a printed circuit board assembly (PBA) mounted on another side of the chassis base. The chassis base includes a main... Agent: Knobbe Martens Olson & Bear LLP 20090135576 - Stacking structure of printed circuit board: A stacking structure (20) of printed circuit board is provided. The stacking structure includes a first printed circuit board (22), a second printed circuit board (24), and at least one electronic component. The first printed circuit board has a first shielding frame (262) arranged thereon, and the second printed circuit... Agent: PCe Industry, Inc. Att. Steven Reiss 20090135579 - Touch pad having electromagnetic interference shielding plate: A touch pad including an ElectroMagnetic Interference (EMI) shielding plate and method for detecting a touch on the touch pad is provided. The touch pad includes a touch plate for generating, when a touch is generated on a surface of the touch plate, a change of a physical property, a... Agent: JeffersonIPLaw, LLP 05/21/2009 > patent applications in patent subcategories.20090128969 - Adaptive electrostatic discharge (esd) protection of device interface for local interconnect network (lin) bus and the like: Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant... Agent: Philippe Deval 20090128970 - Adaptive electrostatic discharge (esd) protection of device interface for local interconnect network (lin) bus and the like: Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant... Agent: Baker Botts L.L.P. One Shell Plaza 20090128971 - Semiconductor integrated circuit: The invention provides a semiconductor integrated circuit preventing an electrostatic breakdown due to a surge voltage applied to a power supply wiring or a ground wiring and preventing noise interference between a digital circuit and an analog circuit. By providing a first electrostatic breakdown protection diode and a first electrostatic... Agent: Morrison & Foerster LLP 20090128967 - Semiconductor integrated circuit device: A semiconductor integrated circuit device comprises a first terminal (denoted by VCC) connected to a power supply in a normally mounted state, a second terminal (denoted by SB) connected to a signal line in the normally mounted state and to a power supply in a reversely mounted state, a third... Agent: Fish & Richardson P.C. 20090128968 - Stacked-die package for battery power management: A stacked-die package for battery protection is disclosed. The battery protection package includes a power control integrated circuit (IC) stacked on top of integrated dual common-drain metal oxide semiconductor field effect transistors (MOSFETs) or two discrete MOSFETs. The power control IC is either stacked on top of one MOSFET or... Agent: Joshua D. Isenberg Jdi Patent 20090128972 - Three-phase detection module: An apparatus includes a first optocoupler and a control module. The first optocoupler selectively allows a first current to flow from a first one of a first pair of N power supply lines to a second one of the first pair. N is an integer greater than two. The N... Agent: Harness, Dickey & Pierce, P.L.C 20090128973 - Power supply control circuit including overvoltage protection circuit: A protection ability of a power supply control circuit is improved so as to protect an output transistor against a back electromotive voltage from a load, a dump surge voltage, and a positive spike surge voltage which has a smaller energy but is higher than the dump surge voltage. The... Agent: Mcginn Intellectual Property Law Group, PLLC 20090128974 - Drive circuit for switching device: A drive circuit that controls a switching device ON/OFF and a soft cutoff command circuit that gradually decreases the gate terminal voltage of the switching device when short circuit of the switching device is detected. Additionally, an ON-pulse retention command circuit retains the output of the drive circuit ON when... Agent: Crowell & Moring LLP Intellectual Property Group 20090128975 - Integrated circuit protected against short circuits and operating errors following the passage on an ionizing radiation: An integrated circuit chip comprising a number of semiconductor components exhibiting parasitic components through which a short-circuit between the circuit supply voltage and ground could occur, wherein said semiconductor components are distributed in elementary blocks, each elementary block being independently connected, for its power supply, to the supply or ground... Agent: HowardIPLaw Group 20090128976 - Energy pathway arrangements for energy conditioning: The system of an energy conditioner comprising: a conductive shield structure comprising a first conductive shield layer, a second conductive shield layer, and a third conductive shield layer; wherein said first conductive shield layer is above said second conductive shield layer, and said second conductive shield layer is above said... Agent: NeifeldIPLaw, PC 20090128977 - Method to protect ethernet connected products: The present invention relates to a method for protecting electronic products, which electronic product comprises an Ethernet connector, where the Ethernet connector comprises a protection circuit, which circuit comprises at least one capacitor and at least one resister, where the Ethernet connector is used to protect against high energy transients,... Agent: James C. Wray 20090128978 - Hybrid surge protector for a network interface device: A hybrid surge protector for a network interface device (NID) is disclosed. The hybrid surge protector includes a fail-safe spring connected to the ground electrode of a three-electrode gas tube. Tabs on the fail-safe spring are held away from the gas-tube end electrodes by a fusible element. The hybrid surge... Agent: Corning Incorporated 20090128979 - System and method for protecting a coil structure in a controlled switch: A system and method for protecting a coil structure in a controlled switch. In one embodiment, the invention relates to a circuit including at least one load switch connectable between a power source and a load and at least one auxiliary switch, each switch actuable between a default position and... Agent: Christie, Parker & Hale, LLP 20090128980 - Circuit arrangement for controlling electromagnetic valves and valve device with a controllable valve: A circuit arrangement for controlling electromagnetic valves, has a control unit that issues control signals for controlling the angular position of an electromagnetic valve and receives a reply signal regarding the value. The circuit arrangement receives the control signals of the control unit and issues the reply signal to it.... Agent: Ronald E. Greigg Greigg & Greigg P.l.l.c. 20090128981 - Multiple-axis control apparatus for ionization systems: A bipolar ionization apparatus includes a positive high voltage power supply having an output with at least one positive ion emitting electrode connected thereto and configured to generate positive ions. A negative high voltage power supply has an output with at least one negative ion emitting electrode connected thereto and... Agent: Panitch Schwarze Belisario & Nadel LLP 20090128982 - Static electricity eliminating apparatus and electronic apparatus: A static electricity eliminating apparatus for eliminating static electricity which has built up on a medium, e.g., card-shaped that may be inserted into and removed from an opening of a card loading body is provided. The static electricity eliminating apparatus includes a housing having an opening through which the medium... Agent: Staas & Halsey LLP 20090128983 - Protection device against electrical discharges in fixing elements with high charges: The invention relates to a device (12) for protecting a conductive fixing element (5) of an aircraft subjected to high charges against electrical discharges, the device (12) comprising a cap (6) made of non-conductive material, a washer (7) made of conductive metal material and an o-ring gasket (8) made of... Agent: Ladas & Parry LLP 20090128984 - Maintenance-free static eliminator: A static eliminator comprises at least one discharge needle for generating ions to eliminate static charge. A first hollow cylinder includes at least one opening for ions generated by the discharge needle to be emitted outside and provided with brushes for cleaning the discharge needle. A second hollow cylinder is... Agent: Leighton K. Chong Patent Attorney 20090128985 - Multilayer capacitor: A first internal electrode includes a first lead portion and a second lead portion. A second internal electrode includes a third lead portion and a fourth lead portion. A third internal electrode includes a main electrode portion and a fifth lead portion. A fourth internal electrode includes a main electrode... Agent: Oliff & Berridge, PLC 20090128986 - Hybrid discoidal/tubular capacitor: A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second... Agent: Kelly Lowry & Kelley, LLP 20090128987 - Filtering capacitor feedthrough assembly: A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture, the capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture... Agent: Campbell Nelson Whipps, LLC 20090128988 - Dielectric ceramic composition for low-temperature sintering and hot insulation resistance and multilayer ceramic capacitor using the same: A dielectric ceramic composition for low-temperature sintering and hot insulation resistance (hot IR) is capable of carrying out low-temperature sintering, improving a hot IR characteristic, and meeting X5R characteristics, and a multilayer ceramic capacitor makes use of the dielectric ceramic composition. The dielectric ceramic composition includes a main component BaTiO3,... Agent: Mcdermott Will & Emery LLP 20090128989 - Dielectric ceramic, ceramic electronic element, and multilayer ceramic capacitor: A dielectric ceramic including a perovskite compound represented by the general formula {(Ba1-x-yCaxSny)m(Ti1-zZrz)O3} as a primary component in which the x, y, z, and m satisfy 0.02≦x≦0.20, 0.02≦y≦0.20, 0≦z≦0.05, and 0.99≦m≦1.1 and is processed by a thermal treatment at a low oxygen partial pressure of 1.0×10−10 to 1.0×10−12 MPa. Accordingly,... Agent: Dickstein Shapiro LLP 20090128990 - Dielectric ceramic, method of producing the same, and monolithic ceramic capacitor: A dielectric ceramic contains a barium titanate compound oxide as a main component; at least one rare earth element R selected from Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; Mg; and Ni, such that a crystalline compound oxide containing the rare... Agent: Dickstein Shapiro LLP 20090128991 - Methods and apparatuses for stacked capacitors for image sensors: Capacitive circuits and methods of forming capacitive circuits including a first capacitor and a second capacitor connected in parallel to the first capacitor, wherein the first capacitor is positioned at least partially above the second capacitor.... Agent: Dickstein Shapiro LLP 20090128992 - Mos capacitor structure and linearization method for reduced variation of the capacitance: A highly linearized capacitor structure is formed by a first capacitor, that is coupled between a first terminal and a common node, combine with a second capacitor, that is coupled between a second terminal and the common node. When a bias voltage is applied, the capacitance values of the first... Agent: Garlick Harrison & Markison 20090128993 - Multi-tier capacitor structure, fabrication method thereof and semiconductor substrate employing the same: A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in response to different current frequency; in other words, different inductor is... Agent: Jianq Chyun Intellectual Property Office 20090128994 - Capacitor and manufacturing method thereof: A capacitor comprising an electrode made from an electroconductive material and activated carbon in combination with quaternary ammonium tosylate, and a method for manufacturing the same. The method enables the preparation of a high capacitance electrode without special facilities. The capacitor exhibits high specific capacitance and a high energy density.... Agent: D. Peter Hochberg Co. L.p.a. 20090128996 - Solid electrolytic capacitor: A solid electrolytic capacitor that prevents leakage current from increasing. The solid electrolytic capacitor includes an anode, a cathode, and a dielectric layer arranged between the anode and the cathode in contact with the cathode. The dielectric layer includes a plurality of recesses arranged in the surface of the dielectric... Agent: Mots Law, PLLC 20090128995 - Solid electrolytic capacitor and method of fabricating the same: A solid electrolytic capacitor comprising an anode body, a dielectric layer placed on the surface of the anode body, a conductive polymer layer placed on the surface of the dielectric layer, and a housing accommodating at least the anode body, the dielectric layer and the conductive polymer layer, wherein a... Agent: Mots Law, PLLC 20090128997 - Solid electrolytic capacitor: An aspect of the invention provides a solid electrolytic capacitor that comprises: an anode formed of a valve metal or an alloy mainly made of a valve metal; a dielectric layer formed on a surface of the anode; a first conducting polymer layer formed on the dielectric layer, the first... Agent: Mots Law, PLLC 20090128998 - Solid electrolytic capacitor: A solid electrolytic capacitor comprising a capacitor element having an anode member and a cathode member, an anode terminal electrically connected with the anode member, a cathode terminal electrically connected with the cathode member, and a mold resin portion covering the capacitor element; wherein the cathode terminal has an upper... Agent: Amin, Turocy & Calvin, LLP 20090128999 - Closing apparatus for a withdrawable-part rack: At least one embodiment of the invention provides that, for a closing apparatus for a part rack withdrawable via V-shaped rod assemblies, the closing apparatus includes at least one pin formed on rod assemblies or as part of them, each pin engaging in a slot in an actuating element. Owing... Agent: Harness, Dickey & Pierce, P.L.C 20090129000 - Inter-rack airflow arresting apparatus and method for facilitating cooling of an electronics rack of a data center: An airflow arrester is provided and configured to reside between electronics racks disposed in a row within a data center. The airflow arrester includes a panel, which when operatively disposed, has a first vertical end, a second vertical end, and a central vertical hinge located intermediate the first and second... Agent: Heslin Rothenberg Farley & Mesiti P.C. 20090129001 - Computer host having two layers inside: A computer host having two layers inside includes a chassis, a partition, a first circuit board, a second circuit board, and an electrical connecting device. The partition divides the interior of the chassis into a first accommodation space and a second accommodation space. The first circuit board and the second... Agent: Morris Manning Martin LLP 20090129004 - Electrically conducting and optically transparent nanowire networks: A network of nanowires has a plurality of interconnected nanowires. Each interconnected nanowire includes a metal in its composition. The network of nanowires is electrically conducting and substantially transparent to visible light. An electronic or electro-optic device has a network of nanowires. The network of nanowires has a plurality of... Agent: Venable LLP 20090129005 - Display device, manufacturing method of the display device, and portable computer having the display device: A display device includes a display panel, and a chassis supporting the display panel, and including a conductive material. The display device includes a circuit board including a signal wiring connected to the display panel to apply a driving signal to the display panel, and a grounding wiring for grounding.... Agent: Frank Chau, Esq. F. Chau & Associates, LLC 20090129007 - Personal computer: A personal computer, provided with a housing comprising at least a battery power supply, a processor and a memory, wherein the housing is divided into a first housing part and a second housing part that is hingingly coupled with the first housing part, and wherein the first housing part comprises... Agent: Peacock Myers, P.C. 20090129006 - Portable media player and method for controlling display mode thereof: An exemplary portable media player includes a main body and a cover. The portable media player further includes a main display unit, an auxiliary display unit, a control device, and a power management unit. The control device provides a first control signal when the cover is detected to be in... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129008 - Optical disk drive with sliding bar: An optical disk drive includes a main body defining a receiving space and a pivotable cover. A latching mechanism that contacts the cover at two points distributes stresses better than where the latching mechanism only contacts the cover at one point.... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129009 - Fixing apparatus for hard disk drive: An exemplary fixing apparatus is for mounting a hard disk drive having a plurality of holes in sidewalls thereof. The fixing apparatus includes a first side plate, a bracket, a locking tab, and a transverse bar. The bracket includes an end plate, and a second side plate perpendicular to the... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129002 - Computer enclosure adapted for mounting different types of transfer cards: A computer enclosure includes a chassis having a rear wall, a transfer card, a mounting bracket, and a PCI card. An expansion slot is defined in the rear wall of the chassis. A detachable shielding cover is formed on the rear wall adjacent to the expansion slot. The transfer card... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129003 - Operator control unit: A mobile operator control unit for remotely controlling a robot includes a housing with a reconfigurable user interface with multiple sockets. A plurality of control modules are each removably received in a socket and include one or more switches. A module interface is connected to the one or more switches.... Agent: David W. Poirier Iandiorio Teska & Coleman 20090129010 - Cradle for a portable terminal: A cradle for a portable terminal is provided. The cradle includes a base, an inclined support installed on the base, and a connector. The inclined support supports the portable terminal when the portable terminal is mounted in the cradle. The connector has a protruding portion that protrudes toward one surface... Agent: H.c. Park & Associates, PLC 20090129011 - Liquid cooled module: A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from... Agent: Stetina Brunda Garred & Brucker 20090129013 - Electronic equipment enclosure with exhaust air duct and adjustable filler panel assemblies: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same... Agent: Tillman Wright, PLLC 20090129012 - Method and apparatus for heat transfer: A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal communication with the channel to engage with the heat spreader.... Agent: Patterson & Sheridan, LLP Gero Mcclellan / Qimonda 20090129015 - Acoustically absorptive anti-recirculation panel for one or more electronics racks of a data center: An acoustically absorptive panel is provided configured to reside above multiple electronics racks disposed in a row within a data center. The acoustically absorptive panel is configured to extend a height above the multiple electronics racks sufficient to at least partially block hot air recirculation from one or more air... Agent: Heslin Rothenberg Farley & Mesiti P.C. 20090129014 - Equipment rack and associated ventilation system: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of... Agent: Mccarter & English, LLP Stamford 20090129016 - Airflow arresting apparatus and method for facilitating cooling of an electronics rack of a data center: An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics... Agent: Heslin Rothenberg Farley & Mesiti P.C. 20090129017 - Blower and electric device with such blower mounted thereon: A supply current control circuit controls the voltage of a low-voltage direct-current power source so that the average current of an inverter circuit detected by a current detecting circuit becomes constant at a specified current value. Accordingly, characteristics that are little in the amount of change of air volume are... Agent: Ratnerprestia 20090129020 - Electronic apparatus: According to one embodiment, an electronic apparatus includes an heat producing component mounted on a first surface of a circuit board, a second heat producing component mounted on a second surface of the circuit board, a cooling fan overlapping the circuit board, a first heat radiating member located between the... Agent: Knobbe Martens Olson & Bear LLP 20090129018 - Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board: A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30)... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129019 - Heat dissipation device with fan holder: A heat dissipation device includes a heat sink attached to an electronic component, a fan and a fan holder mounting the fan onto the heat sink. The heat sink includes a plurality of fins. The fan holder includes a plurality of walls connecting with each other. A pair of tabs... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129021 - Gas station television: Preferred embodiments relates to a cooling system and a method for cooling an electronic display. Embodiments include a transparent liquid cooling chamber, a reservoir tank, and a pump. The components in the system are preferably housed within the electronic display housing. The cooling chamber defines a fluid compartment that is... Agent: Standley Law Group LLP 20090129022 - Micro-chimney and thermosiphon die-level cooling: A method and arrangement for dissipating heat from a localized area within a semiconductor die is presented. A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is... Agent: Pillsbury Winthrop Shaw Pittman LLP 20090129023 - Thermal module allowing adjustment in the height of heat sink relative to fixing rack: A thermal module includes a fixing rack and a heat sink fitted in the fixing rack. The fixing rack is provided at an inner side with a plurality of stoppers and a plurality of projected portions located adjacent to the stoppers with a height difference existed between them. The heat... Agent: Nikolai & Mersereau, P.A. 20090129025 - Illumination device comprising a substrate plate and a heat sink: The invention relates to an illumination device (1) comprising at least one preferably ceramic substrate plate (2), at least one luminous element (3) arranged on a front side (A) of the substrate plate (2) in particular at least one light emitting diode (LED) (3), and at least one preferably metallic... Agent: Frishauf, Holtz, Goodman & Chick, PC 20090129024 - Inverted through circuit board mounting with heat sink: The apparatus contains a printed circuit board in which a heat sink is mounted adjacent to one side of the printed circuit board in contact with a heat generating device mounted to the circuit board and positioned at least in part within an aperture in the circuit board.... Agent: Hayes Soloway P.C. 20090129026 - Heat sink for semiconductor device and semiconductor module assembly including the heat sink: Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a... Agent: Harness, Dickey & Pierce, P.L.C 20090129027 - integrated non-isolated vrm and microprocessor assembly: The present invention provides one single chip solution for a non-isolated DC-DC regulator. The advantage is high reliability, lower cost and smaller space on the motherboard. This integrated solution opens the door for a distributed architecture with few millimeter high 1″×1″ regulator. Such regulators could be populated as QFP ICs... Agent: Hoffman Warnick LLC 20090129028 - Power module and method of fabricating the same: Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a... Agent: Townsend And Townsend And Crew, LLP 20090129029 - Method for manufacturing an integrated circuit: A method for manufacturing an integrated circuit is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board.... Agent: Dicke, Billig & Czaja 20090129030 - Arrester block module assembly and method: An electrical surge arrester includes an arrester block stack with a plurality of cylindrical surge arrester components arranged substantially coaxially to form a cylindrical stack of components having a longitudinal axis. First and second electrical conductive terminals are disposed at each end of the block stack and electrically coupled to... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P. 20090129031 - Planar element module, manufacturing method of planar element module, and planar element device: A flat pressure sensor of the invention is prepared by processing a thin film of a polymer material to have plurality of substantially square openings 24. A planar member 22 of the flat pressure sensor thus obtained has a net-like structure including multiple element formation areas 26 and multiple bridging... Agent: Oliff & Berridge, PLC 20090129032 - Modular system controlled according to power requirements: The invention relates to a modular system comprising a primary module, several individual modules that can be connected to said primary module and a power supply unit that is connected to the primary module and supplies the connected individual modules with a voltage. According to the invention, the system is... Agent: Patterson, Thuente, Skaar & Christensen, P.A. 20090129033 - Sliding adapter panel with living hinge and forward/rearward locking: An adapter panel including a chassis and a plurality of sliding adapter packs that define a front adapter field of the adapter panel. The sliding adapter packs includes a frame assembly having a living hinge and a lever arm. The living hinge locks the sliding adapter packs into both a... Agent: Merchant & Gould PC 20090129034 - Imaging device: An imaging device includes a lens module and a printed circuit board. The lens module includes a substrate with a lens unit and an imaging sensor mounted on a same side thereof. The substrate defines a groove therein. The printed circuit board defines a recessed portion accommodating the substrate therein,... Agent: PCe Industry, Inc. Att. Steven Reiss 20090129035 - Electronic control apparatus: In an electronic control apparatus, a connector mounted on a circuit board accommodated in a casing body constructed with top and bottom casings is partially exposed outside the casing body to be mated with an external connector. A sealant is interposed between the top and bottom casings, between the top... Agent: Posz Law Group, PLC 20090129036 - Semiconductor device and electronic device: A semiconductor device includes: a wiring substrate that includes multiple connection pads provided on a top surface thereof and multiple lands provided on a bottom surface thereof and electrically connected to the connection pads, respectively; a semiconductor chip that is mounted on the top surface of the wiring substrate; multiple... Agent: Young & Thompson 20090129037 - Printed wiring board with built-in semiconductor element, and process for producing the same: The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090129038 - Circuit device and method of manufacturing the same: Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of... Agent: Watchstone P+d, PLLC 20090129039 - Multilayer printed wiring board: A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C. 20090129040 - Circuit board having power source: A circuit board having a power source is provided, including: a carrier board having a first dielectric layer disposed on at least a surface thereof and a first circuit layer disposed on the first dielectric layer, wherein the first circuit layer has at least an electrode pad; a first electrode... Agent: Edwards Angell Palmer & Dodge LLP 20090129041 - Stacked semiconductor module, method of fabricating the same, and electronic system using the same: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted... Agent: Harness, Dickey & Pierce, P.L.C 20090129043 - Emi shielding and environmental seal device: An EMI shield for a movable component such as an antenna of an electronic device includes a microfiber ring of densely packed microfibers extending from an EMI shielding housing across the space defined by an opening in the housing for the movable component. Multiple microfiber rings can be used separated... Agent: Taylor & Aust, P.C. Illinois Tool Works Inc. 20090129042 - Modular emi waveguide suppression for openings in electrical enclosures: A method for suppression of EMI emissions around an opening of an electronic enclosure that holds a physical layer switch. Fiber optic cables are installed on a plurality of ports attached to the switch such that the cables pass through the opening in the cabinet. The cables are divided into... Agent: Morgan, Lewis & Bockius, LLP. (pa) 20090129045 - Fiber containment system: The present invention relates to a telecommunications termination panel with a housing including a front opening and a rear opening. Pivotably mounted within the housing is a tray within the front opening, pivoting about a vertical axis located adjacent a first side of the housing. A cable path is defined... Agent: Merchant & Gould PC 20090129044 - Harness routing structure: A harness routing structure comprises: a battery case that defines an internal space which houses a battery and an electric appliance on a hybrid motor vehicle, and that is formed of a first member; a reinforcement that is provided in the battery case, and that is formed of a second... Agent: Kenyon & Kenyon LLP 05/14/2009 > patent applications in patent subcategories.20090122451 - Esd protection circuit device: The present invention discloses an ESD (ELECTRO-STATIC DISCHARGE) protection circuit device, the ESD (ELECTRO-STATIC DISCHARGE) protection circuit device includes a first switching device having a first terminal coupled to a first signal; a first control device coupled to the first signal for generating a first control signal according to the... Agent: North America Intellectual Property Corporation 20090122452 - Semiconductor integrated circuit: A semiconductor integrated circuit includes: an output pad from which an output signal is outputted; an output signal line connected with the output pad; a first pad configured to function as a ground terminal or a power supply terminal; a first wiring connected with the first pad; an output driver... Agent: Mcginn Intellectual Property Law Group, PLLC 20090122453 - Universal rating plug for electronic trip unit: A rating plug for an electronic trip unit is disclosed. The rating plug has a housing with a plurality of switches disposed within the housing, each of the switches positionable in one of two positions. The settings of the switches establish a digital signature associated with the rating plug, providing... Agent: General Electric Company Ge Global Patent Operation 20090122454 - Augmentation of ambient temperature and free convection effects in thermal circuit breaker trip curve approximations: An electrical overload protection system may be based on a solid state control system. A solid state switch may open responsively to commands for a solid-state controller. The controller may perform calculations to determine accumulated energy in a protected conductor. The calculations may be based, in part, on samplings of... Agent: Honeywell International Inc. 20090122455 - Ptc device, protective circuit module including the same, and secondary battery including the protective circuit module: A Positive Temperature Coefficient (PTC) device, a Protective Circuit Module (PCM) including the PTC device, and a secondary battery including the Protective Circuit Module (PCM) are provided. A support portion is formed at one end of a conductive plate of the PTC device, a conductive layer disposed on the upper... Agent: Stein, Mcewen & Bui, LLP 20090122456 - Common gate connected high voltage transient blocking unit: When a series protective element such as a transient blocking unit (TBU) is used in combination with a shunt protective element such as a gas discharge tube (GDT), firing of the GDT can cause a transient having the potential to damage the TBU. This problem can be alleviated by placing... Agent: Lumen Patent Firm 20090122457 - Insulated metal grounding bracelet: There is provided an electrically conductive bracelet including an electrically conductive clasp member that is connectable to an electrical ground. A conductive metal band is connected to the clasp member to define a bracelet inner diameter. The conductive metal band includes a plurality of bar members. Each bar member includes... Agent: Stetina Brunda Garred & Brucker 20090122459 - Electrostatic chuck device: An electrostatic chuck device provided with a dielectric plate with a surface embossed to give it a plurality of projections, an electrode, and an external power source, wherein substrate supporting surfaces of the plurality of projections are covered by conductor wiring and the conductor wiring electrically connects the substrate supporting... Agent: Oliff & Berridge, PLC 20090122458 - Embossed electrostatic chuck: An electrostatic chuck includes a layer having a plurality of protrusions to support a workpiece, wherein at least a portion of the layer has a first plurality of the plurality of protrusions. The first plurality of protrusions is spaced to geometrically form a pattern of hexagons. The first plurality of... Agent: Varian Semiconductor Equipment Assc., Inc. 20090122460 - Semiconductor device and method for producing the same: A semiconductor device includes a semiconductor layer with a first electrode formed by a sintered, conductive, porous granulate and formed in or on the semiconductor layer or in or on at least one insulating layer arranged on the semiconductor layer; furthermore dielectric material covering the surface of the sintered, conductive,... Agent: Slater & Matsil LLP 20090122461 - Capacitor for a semiconductor device and manufacturing method thereof: Disclosed is a capacitor for a semiconductor device, comprising: a lower electrode formed over a predetermined lower structure on a semiconductor substrate; an aluminum oxynitride film formed over the lower electrode and having a low leakage current characteristic; a yttrium oxynitride film formed over the aluminum oxynitride film and having... Agent: Townsend And Townsend And Crew, LLP 20090122462 - Electronic device, multilayer ceramic capacitor and the production method thereof: An electronic device, such as a multilayer ceramic capacitor, and a method for producing the electronic device having an internal electrode layer and a dielectric layer, comprising a step of forming a pre-fired internal electrode thin film including a conductive component and a dielectric component, a step of stacking green... Agent: Oliff & Berridge, PLC 20090122464 - Surface modified nickel nanoparticle, and conductive paste and multi-layer capacitor comprising the same: A method for surface treatment of nickel nanoparticles using an organic solution, including dispersing nickel nanoparticles in a reductive organic solvent to obtain homogeneity; heating the dispersion of nickel nanoparticles; and separating the solution after treatment, washing and drying. Nickel nanoparticles treated by this method are preferably substantially free of... Agent: Buchanan, Ingersoll & Rooney PC 20090122463 - Top to bottom electrode connection on single layer ceramic capacitors: Disclosed are methodology and corresponding device subject matters for providing single layer ceramic capacitors through the use of significantly reduced numbers of processing steps. An aspect of present methodology resides in the early introduction of a plurality of selectively spaced through holes in an unfired ceramic wafer. Such holes provide... Agent: Dority & Manning, P.A. 20090122465 - Electrolyte transistor and method of fabricating the same: Electrolyte transistor including a gate structure, two sources/drains, an electrolyte layer and a buried conductive layer is provided. The gate structure including a gate dielectric layer and a gate is located above a substrate. The two sources/drains are separated from each other and located above the substrate on each side... Agent: Jianq Chyun Intellectual Property Office 20090122467 - Electric double-layer capacitor and method for manufacturing the same: In an electric double-layer capacitor, resistance of a polarizable electrode layer is reduced and gas generation inside a case is suppressed in an attempt to improve reliability. On that account, an electric double-layer capacitor is provided, which is obtained by housing in a case, together with a driving electrolyte, a... Agent: Pearne & Gordon LLP 20090122466 - Electrochemical capacitors: The present invention relates to the field of capacitors, and in particular electrochemical double layer capacitors which include separators comprising a porous layer of polymeric nanofibers and an antioxidant.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center 20090122468 - Capacitor and method for manufacturing same: A capacitor includes a metal case having an opening, a capacitor element accommodated in the metal case, an electrolyte accommodated in the metal case, and a sealing rubber sealing the opening of the metal case. The sealing rubber seals the opening of the metal case while the sealing rubber is... Agent: Mcdermott Will & Emery LLP 20090122469 - Electrochemical capacitor and electrode material for use therein: c 20090122470 - Solid electrolytic capacitor: A solid electrolytic capacitor according to the present invention has: a capacitor element (30) having an anode terminal (31) protruding; a resin sheath (6) that covers the capacitor element (30); an anode lead frame (1) having an anode-side terminal surface (10) that is connected to a tip section of the... Agent: Westerman, Hattori, Daniels & Adrian, LLP 20090122472 - Multimedia device: The present invention discloses a multimedia device, which comprises: a body, a sliding member, which is movably disposed on the body, and a screen, which is rotatable for being disposed on the sliding member, wherein while the sliding member is moved correspondingly to the body, the screen is rotated relatively... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP 20090122471 - Panel and housing assembly that is assembled and disassembled easily and quickly: A panel and housing assembly includes a housing provided with a locking slot, a panel provided with a receiving space, and a locking tenon mounted between the housing and the panel and having a first end provided with an elastic portion received in the receiving space of the panel and... Agent: Kamrath & Associates P.A. 20090122473 - Frame with a mounting ear, display device using the frame and a method of manufacturing the same: A frame with a mounting ear, a display device using the frame and a method of manufacture thereof are provided. The frame includes a frame body and a mounting ear. The frame body has a top frame and a sidewall extending from an edge of the frame top frame. A... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP 20090122474 - Secondary computing device display: A secondary computing device display system includes a removable attachment mechanism operable to removably attach a secondary computing device display to a primary computing device display. The removable attachment mechanism comprises a first attachment member, operable to lockably attach to the secondary computing device display, and a second attachment member,... Agent: Dorsey & Whitney, LLP Intellectual Property Department 20090122475 - Display apparatus and method for assembling the same: In a display apparatus and a method for assembling the display apparatus, the display apparatus includes for an embodiment a backlight assembly, a lower receiving member, a display panel and an upper receiving member. The backlight assembly provides light. The lower receiving member receives the backlight assembly. The display panel... Agent: Haynes And Boone, LLPIPSection 20090122476 - Display device and information processing device having the same: A display device including a display module and an information processing device having the same is described herein. The display device includes a display module, a supporting frame, and a fixing frame. The supporting frame supports a rear face of the display module corresponding to a peripheral area, a side... Agent: Haynes And Boone, LLPIPSection 20090122477 - Portable terminal device: A portable telephone 1 is a portable terminal device in which a telephone receiving housing 2 is coupled to a telephone transmitting housing 3 by a coupling portion 4 such that they can be opened and closed. In the telephone receiving housing 2, a projecting portion 21 is formed on... Agent: Hogan & Hartson L.L.P. 20090122479 - Flash media reading devices with integrated storage compartments: A memory card interface apparatus including a bay to receive a memory card for accessing data stored on the card, and a separate storage cavity configured to store a memory card. In one embodiment, the cavity includes an aperture providing access to remove a card from the storage cavity. In... Agent: Greenberg Traurig, LLP (onspec/tpl) 20090122478 - Flash memory disk with rotatable and telescopic protection structure and method using the same: A flash memory disk includes a holder, a plug, a housing and a pulling ring. The plug is joined with the holder and exposed out of the holder. The housing has a containing space for accommodating the holder and the plug, wherein two sides opposite to each other respectively have... Agent: J C Patents, Inc. 20090122480 - Heat dissipation assembly for graphics card and blade server using the same: A heat dissipation assembly mounted to a main board in a blade server includes a graphics card, a heat sink, and a thermal board. The graphics card includes a GPU and a plurality of first graphics memory chips mounted on a top thereof, and a plurality of second graphics memory... Agent: PCe Industry, Inc. Att. Steven Reiss 20090122481 - Memory heat sink device provided with extra heat sink area: A memory heat sink device provided with an extra heat sink area includes two cooling fins that are respectively attached to the front and back sides of a memory. A plurality of raised dots that protrude toward the front side are formed on the cooling fin attached to the front... Agent: Chih-i Chang 20090122482 - Portable computer docking system: A portable computer docking station comprises a cradle coupled to a docking base where the cradle is adapted to receive a portable computer. The docking station also comprises a wireless receiver adapted to communicate a wireless input signal received by the docking station to the portable computer.... Agent: Hewlett Packard Company 20090122483 - Water-assisted air cooling for a row of cabinets: A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end... Agent: Scully, Scott, Murphy & Presser, P.C. 20090122484 - Cooling system: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the... Agent: Panduit Corp. 20090122485 - Fixing frame: A fixing frame is used to fix at least one heat sink fan on a case of an electronic device. The fixing frame includes a cradle and at least one fastener. The cradle has two oppositely disposed plates, and the two plates respectively have a combining portion and a latching... Agent: Morris Manning Martin LLP 20090122486 - Semiconductor packages: The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also includes methods of cooling a semiconductor die in which coolant is forced through grooves in a backside... Agent: Wells St. John P.s. 20090122487 - System of facilitating cooling of electronics racks of a data center employing multiple cooling stations: A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air... Agent: Heslin Rothenberg Farley & Mesiti P.C. 20090122488 - Apparatus for facilitating cooling of an electronics rack through the use of an air-to-liquid heat exchanger: An apparatus for facilitating cooling of an electronics rack is provided. The apparatus includes an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to a door of an electronics rack. The inlet and outlet plenums are in fluid communication with the heat exchanger and respectively include a... Agent: Heslin Rothenberg Farley & Mesiti P.C. 20090122489 - Electronic control device and method of manufacturing electronic control device: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5);... Agent: Sughrue Mion, PLLC 20090122490 - Heat sink having enhanced heat dissipation capacity: A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source... Agent: Kamrath & Associates P.A. 20090122491 - Universal patterned metal thermal interface: The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned... Agent: Patterson & Sheridan, LLP 20090122492 - Junction box to protect individual solar panels from overheating: The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are pressed against the housing (1) or into recesses (3)... Agent: Bohan Mathers 20090122493 - Optoelectronic subassembly with integral thermoelectric cooler driver: Optical subassemblies including optical transmit and receive subassemblies. The optical subassemblies comprise a housing; a substrate mounted within the housing; a thermoelectric cooler (TEC) thermally coupled to the substrate, the TEC being mounted within the housing; an optical component structurally mounted on the substrate, wherein the optical component is thermally... Agent: Workman Nydegger 1000 Eagle Gate Tower 20090122494 - Cooling device for printed circuit board and method for the prosecution thereof: Disclosed is a cooling device (1) for a printed circuit board (2) which is disposed in a housing (3) and can be connected in a locking manner to a metal cooling element (4) that is formed as a cover of said housing (3).... Agent: Continental Teves, Inc. 20090122495 - Device mounting structure and device mounting method: The present invention provides a device mounting structure and a device mounting method in which the short circuit can be prevented between a device lead part and a device ground part when the reflow process is executed. Thus, in the device mounting structure of the present invention, the device is... Agent: Scully Scott Murphy & Presser, PC 20090122496 - Electronic module and electronic device: An electronic module includes a board unit having a handle and a module housing. The handle includes a grip portion and a pair of leg portions. The leg portions have engagement convex portions extending from portions serving as rotary pivots, of the leg portions. The module housing includes an engagement... Agent: Morgan Lewis & Bockius LLP 20090122497 - Magnetically attachable accessories for a mobile unit: A mobile unit comprises a housing and a processor. The housing includes a frame configured to magnetically couple with an accessory. When the frame and the accessory are magnetically coupled, data signals and power are exchanged between the mobile unit and the accessory via a wireless communication where the wireless... Agent: Fay Kaplun & Marcin, LLP/ Motorola 20090122498 - Circuit board and conductive through hole structure thereof: A circuit board having at least one through hole and including a first and a second wiring layer, an insulation layer, and a conductive through hole structure is provided. The insulation layer is disposed between the first and second wiring layers. The through hole located in the insulation layer extends... Agent: J C Patents, Inc. 20090122499 - Electric equipment assembly and outdoor unit of air conditioner provided with the same: An electric equipment assembly is sized and configured to be disposed in a machine chamber of an outdoor unit. Reduction in size of the electric equipment assembly is achieved and simultaneously visibility and serviceability of a highly frequently accessed element are ensured, while employing a structure in which a control... Agent: GlobalIPCounselors, LLP 20090122500 - Card level enclosure system having enhanced thermal transfer and improved emi characteristics: An enclosure or containment system for expansion cards includes first and second sub-enclosures that interengage to form an enclosure assembly that substantially surrounds the major surface areas of the expansion card while providing support along some of the edges thereof to provide a protected volume that physically protects and shields... Agent: Wallace G. Walter 20090122501 - Control device: The invention relates to a control device in a fluid environment with a housing, comprising a housing lid (1) for accommodating sensors and a housing shell (2) for receiving at least one control unit (3). The inventive control device further comprises at least one device (4) for electrically connecting the... Agent: Fasse Patent Attorneys, P.A. 20090122502 - Drive modularity: A modular industrial drive system includes a base that receives one or more control modules as a face template. The control modules provide a set of functionalities to the drive system, and the face template serves as a user interface to the drive system. The drive system can include a... Agent: Amin Turocy & Calvin, LLP Attention: Heather Holmes 20090122503 - Base element, base system and method for manufacturing another base system: A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal... Agent: Kenyon & Kenyon LLP 20090122504 - Electronic device capable of displaying digital image information on a removable sheet of electronic paper: An electronic device includes a housing having a side surface formed with a receiving groove, a driving electrode layer mounted fixedly in the receiving groove and including a plurality of electrodes, a control module disposed in the housing, connected electrically to the driving electrode layer, and operable so as to... Agent: Mcnees Wallace & Nurick LLC 20090122505 - Printed circuit board assembly with shock absorbing structure: An exemplary printed circuit board assembly includes a printed circuit board, four supporting members, four shock-absorption members, and four fixing members. The printed circuit board defines a plurality of cutouts therein. Each supporting member defines a positioning hole therein. The shock-absorption members are snapped in the cutouts, and each has... Agent: PCe Industry, Inc. Att. Steven Reiss 20090122506 - Glass ceramic composition, glass ceramic sintered body, and monolithic ceramic electronic component: A glass ceramic composition includes a SrZrO3 ceramic and a Li2O—MgO—ZnO—B2O3—SiO2-based glass, wherein the Li2O—MgO—ZnO—B2O3—SiO2-based glass accounts for about 1 to about 12 weight percent of the total and includes Li2O in an amount in the range of about 3.5 to about 15 weight percent, MgO in an amount in... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP 20090122507 - Conductive elastomeric shielding device and method of forming same: A conductive elastomeric shielding device (400) for use with an electronic device includes a raised surface (401) and a sidewall (405) formed with the raised surface (401). A turret section (406) is formed with the sidewall (405) where an engagement member (407) projects from the turret section (406) for frictional... Agent: Delphi Technologies, Inc. 20090122508 - Systems, methods, and apparatus for combined superconducting magnetic shielding and radiation shielding: A device is at least partially contained within a shielded enclosure formed by a first material that has a high thermal conductivity and plated with a second material that is superconductive below a critical temperature. An exterior of the shielded enclosure is at least partially wound by a compensation coil... Agent: Seed Intellectual Property Law Group PLLC 20090122509 - Wiring system with integrated electronics: Wiring system which comprises: a flexible printed circuit board (1) with a surface (2) in turn comprising one or more electrical circuits formed by conductive strips (4) and a plurality of electronic components (5) connected to said conductive strips (4) and with at least one extension or branch (6) extending... Agent: Sughrue Mion, PLLC 20090122510 - In cable micro input devices: The present description is directed to small form-factor input devices operative to be coupled to an electronic device using a cable. For example, in some embodiments, an input device is described for providing one or more inputs to an electrical device, wherein the input device comprises a circuit board having... Agent: Kramer Levin Naftalis & Frankel LLP 20090122511 - Switch mounting mechanism in fluid pressure device: The present invention provides a switch mounting mechanism that can be adopted with ease in conjunction with a compact fluid pressure device. A space (31), to be used to absorb elastic deformation of a holding arm (33) occurring as a switch holder (24) is inserted through a groove opening (22A)... Agent: Yokoi & Company U.s.a., Inc. 05/07/2009 > patent applications in patent subcategories.20090116154 - Discharging control apparatus of switching device for inverter: Disclosed is a discharging control apparatus of a switching device for an inverter capable of reducing a spike voltage when the switching device is turned off and reducing a turn-off time of the switching device, the apparatus comprising, a fast discharge circuit section configured to provide a discharging path through... Agent: Greenblum & Bernstein, P.L.C 20090116153 - Power conversion system and over-load protection device thereof: A power conversion system and over-load protection device thereof includes a first detection circuit, a charging/discharging circuit, and a second detection circuit. The discharging/charging circuit charges based on a feedback signal relative to output of the power conversion system. A switching-disabling control signal is produced based on the charge of... Agent: North America Intellectual Property Corporation 20090116155 - Automated anti-explosion system and method for integrated-drive-generator: A system for automatically cutting off the energy from, and shutting down an electric generator positioned inside an aircraft engine and supplying electrical power to the aircraft. The system comprising an electric generator, a control panel and driving cabin. The generator having a sensor positioned inside the generator sensing the... Agent: Dunlap Codding, P.C. 20090116157 - Electrostatic discharge protection apparatus and method therefor: An electrostatic discharge protection apparatus comprises a stack arrangement having a first electrostatic discharge protection element and a second electrostatic discharge protection element. The stack arrangement is arranged to provide a bias potential between the first and second electrostatic discharge protection elements. In one embodiment, the bias potential can be... Agent: Freescale Semiconductor, Inc. Law Department 20090116156 - Portable electronic device: In the portable electronic device of the present invention, charging electrodes exposed to the exterior of a casing are electrically connected to a pair of charging terminals mounted upright on the printed circuit board, and a charging terminal (negative electrode, or ground) that is one of the pair of charging... Agent: Sughrue Mion, PLLC 20090116158 - Methods and apparatus for over-voltage protection of device inputs: Methods and apparatus for over-voltage protection of device inputs are disclosed. An example apparatus to protect a device from an over-voltage condition disclosed herein comprises a switch coupled between a device input and at least one component of the device, and a voltage compensator to pull a control input of... Agent: Texas Instruments Incorporated 20090116159 - Output voltage independent overvoltage protection: One embodiment of the invention includes a power regulation system. The system comprises a power regulator configured to periodically generate a switch signal that regulates a current flow through an inductor to set a magnitude of an output voltage. The system further comprises an overvoltage protection circuit configured to monitor... Agent: Texas Instruments Incorporated 20090116160 - Arrangement and method for an integrated protection for a power system: For protecting a power system, two or three of over current, thermal and under voltage protection circuits are integrated as one protection circuit but operate independently, and one or more protection points thereof are adjusted dynamically in response to detected condition of the power system. Specifically, using voltage and current... Agent: Rosenberg, Klein & Lee 20090116161 - Power supply controller and threshold adjustment method thereof: An inrush current higher than a second anomaly threshold current ILfc passes through a power MOSFET 14, when a control signal S1 of low level is applied to a gate driver 28 so that the power MOSFET 14 and the like turn to a conductive state. A first forcing shutoff... Agent: Oliff & Berridge, PLC 20090116162 - Static eliminator and electric discharge module: This static eliminator is used for eliminating static electricity from an object by ionizing the air to be blown to a charged object, and has a case 12 body provided with an air blow duct 15 for blowing out an ionized air, and an electric discharge module 27 being mounted... Agent: Mccormick, Paulding & Huber LLP 20090116163 - Process and system for discharging a test mass free-floating in a satellite: In a process for discharging a test mass that is free-floating in a surrounding electrode casing on board a satellite, the electrode casing is enclosed by a vacuum tank, and has one or more first electrodes for the application of electrostatic forces and/or moments to the test mass. In addition,... Agent: Crowell & Moring LLP Intellectual Property Group 20090116164 - Lighting device having electrostatic discharge unit: A lighting device having an electrostatic discharge unit is provided. The lighting device having the electrostatic discharge unit comprises a lighting unit and the electrostatic discharge unit. The lighting unit comprises a first metal shell, wherein the first metal shell comprises a first opening. The electrostatic discharge unit is installed... Agent: Reed Smith LLP 20090116165 - Static electricity countermeasure component: A static electricity countermeasure component comprising; a ceramic substrate; at least two extractor electrodes opposingly disposed and mutually separated on the ceramic substrate; an over-voltage protective material layer disposed to cover a portion of each extractor electrode and a gap between the extractor electrodes, containing a metal powder and a... Agent: Wenderoth, Lind & Ponack L.L.P. 20090116166 - Apparatus and method for generating atmospheric-pressure plasma: An apparatus for generating atmospheric-pressure plasma includes: a substrate; an antenna arranged on the substrate; a discharge tube arranged in the vicinity of the antenna; a high-frequency power supply for supplying VHF band high-frequency power to the antenna; and a matching circuit for receiving a high frequency from the high-frequency... Agent: Greenblum & Bernstein, P.L.C 20090116167 - Passive electronic network components designed for direct body fluid exposure: An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal... Agent: Kelly Lowry & Kelley, LLP 20090116168 - Electric multilayer component and method for the production of a multilayer component: An electrical multiple-layer component is described herein. The component includes a base body having dielectric layers and internal electrodes. The internal electrodes are of connected to each other electrically between the dielectric layers via at least one external electrode on side surfaces of the base body. The component also includes... Agent: Fish & Richardson PC 20090116169 - Alpha tantalum capacitor plate: A method for forming an alpha-tantalum layer comprising disposing a nitrogen containing base layer on a semiconductor substrate, bombarding the nitrogen containing base layer with a bombarding element, thereby forming an alpha-tantalum seed layer, and sputtering a layer of tantalum on the alpha-tantalum seed layer, thereby forming a surface layer... Agent: Slater & Matsil, L.L.P. 20090116170 - Electrochemical capacitor with carbon nanotubes: An electrolytic capacitor includes a first electrode, a second electrode opposite to the first electrode, a separator sandwiched between the first electrode and the second electrode, a cell accommodating the first electrode, the second electrode and the separator, and an electrolytic solution filled into the inner space of the cell,... Agent: PCe Industry, Inc. Att. Steven Reiss 20090116171 - Electrochemical capacitor with carbon nanotubes: An electrolytic capacitor includes a first electrode, a second electrode opposite to the first electrode, a separator sandwiched between the first electrode and the second electrode, a cell accommodating the first electrode, the second electrode and the separator, and an electrolytic solution filled into the inner space of the cell,... Agent: PCe Industry, Inc. Att. Steven Reiss 20090116172 - Solid electrolytic capacitor with small leakage current and method of manufacturing the same: A solid electrolytic capacitor manufacturing method includes a process of removing a roughened surface layer (10a′) from a distal portion (13) of a metal member (10) and from part of an intermediate portion (12) adjacent to the distal portion (13), a process of forming a resist (40) on the distal... Agent: Frishauf, Holtz, Goodman & Chick, PC 20090116173 - Solid electrolytic capacitor: A solid electrolytic capacitor according to this invention includes a capacitor element with a drawn-out anode lead, a conversion substrate mounted with the capacitor element, and a casing resin covering the capacitor element mounted on the conversion substrate. The conversion substrate has, on one surface thereof, a connection pattern composed... Agent: Frishauf, Holtz, Goodman & Chick, PC 20090116175 - Electrical enclosure and support assembly therefor: A support assembly is provided for an electrical enclosure including a housing having first and second opposing sides, electrical bus members, and at least one electrical switching apparatus, such as a circuit breaker. Each of the electrical bus members is electrically connectable to a corresponding one of the circuit breakers.... Agent: Martin J. Moran 20090116174 - Switchgear cabinet assembly or rack assembly: A switchgear cabinet assembly or rack assembly including an electric supply device that can be or is connected to a primary power supply. Equipment that is housed in at least one switchgear cabinet or rack on the user side, or equipment that is to be supplied with electricity can be... Agent: Pauley Petersen & Erickson 20090116176 - Gas-insulated electric power apparatus: The present invention provides a gas-insulated electric apparatus which includes: a vertically-arranged gas insulation main tank; a first gas insulation branch pipe connected to and making right angle with the gas insulation main tank; a second gas insulation branch pipe connected to and making right angle with the gas insulation... Agent: Buchanan, Ingersoll & Rooney PC 20090116177 - Electrical enclosure and electrical bus assembly therefor: An electrical bus assembly for an electrical enclosure includes a single branch circuit with a plurality of branch circuit buses. First electrical bus members include first ends electrically connected to corresponding branch circuit buses, and second ends electrically connected to a first circuit breaker. Second electrical bus members include first... Agent: Martin J. Moran 20090116178 - Data communications and power distribution in a computer equipment rack: Methods and computer equipment racks configured for data communications and power distribution are disclosed that include a plurality of servers mounted horizontally, each server having a power distribution connection and one or more switch connections; one or more power distribution units (‘PDUs’) mounted vertically; and one or more network switches... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP 20090116179 - Display device module and method of handling the same: A display device module includes a display panel having a first side and a second side, a first receiving container having a first side and a second side, the first side receiving the first side of the display panel, and a grip protrusion formed on the second side of the... Agent: F. Chau & Associates, LLC 20090116180 - Keyboard and keyboard assembling method: The invention discloses a keyboard and keyboard assembling method, and the keyboard is assembled by welding. The keyboard has a first casing, a second casing, and a plurality of key switches. The first casing comprises a plurality of openings; the second casing comprises a plurality of welding portions; and the... Agent: Morris Manning Martin LLP 20090116181 - Electronic devices with surface features: Electronic devices with surface features are disclosed. The electronic devices includes a processor and a display operatively coupled to the processor for presenting outputs to a user. The electronic devices also includes a housing having a first portion and a second portion coupled to the first portion to form an... Agent: Perkins Coie LLP Patent-sea 20090116182 - Attachment unit for information storage device, and electronic apparatus: An attachment unit for an information storage device includes a casing that houses the information storage device and a fixed base on which the casing is detachably mounted. The casing includes a casing body, a pair of rotation supporting shaft portions, a pair of first engagement portions, and a latch... Agent: Morgan Lewis & Bockius LLP 20090116183 - Gas assisted thixotropic molded chassis for cooling a computer chassis: A housing including a housing portion having a reinforcing rib including a cylindrical cross-section. The rib provides reinforcing for the housing and may simultaneously provide a cooling passage for the housing. A cooling path is defined through the housing by the cylindrical cross-section of the rib.... Agent: Haynes And Boone, LLPIPSection 20090116184 - Exclusive protection device for pcmcia card/express card: An exclusive protection device for a PCMCIA card/express card, includes a shell, a liquid crystal display and a control unit. The inner surface of the shell defines a slot and the outer surface defines a chamber. The slot is disposed to receive a PCMCIA card or an express card. The... Agent: Birch Stewart Kolasch & Birch 20090116185 - Small form-factor pluggable transceiver module housing: A small form-factor pluggable transceiver module housing includes a metallic casing and a plurality of reinforcing ribs. The metallic casing has a top plate, two side walls, a bottom plate, a plurality of connecting legs, a plurality of locking legs and a plurality of supporting portions. The connecting legs and... Agent: Rosenberg, Klein & Lee 20090116186 - Cooling unit and electronic apparatus: According to an aspect of an embodiment, a cooling unit includes a first heat dissipating fin member including first heat dissipating fins extending along parallel planes, respectively, the first heat dissipating fins coupled to one another through a first heat conductive member, and a second heat dissipating fin member including... Agent: Staas & Halsey LLP 20090116187 - Opacity enclosure for fips 140-2: In one embodiment, an opaque enclosure for an electronics module includes an inner barrier having downward-facing louvers for allowing air flow and a cover having vent holes. The vent holes and downward-facing louvers are oriented so that the interior of the electronics module is not visible through the vent holes... Agent: Law Office Of Charles E. Krueger 20090116191 - Board card and electrical fan thereof: A board card having a control circuit includes a first substrate and an electrical fan. The first substrate has a heat source and the electrical fan is disposed on the first substrate. The electrical fan includes a revolving spindle, a plurality of blades and a LED module. The revolving spindle... Agent: Jianq Chyun Intellectual Property Office 20090116190 - Controlling airflow in a computer chassis: Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP 20090116189 - Cooling system for a computer power supply unit: A cooling system for a computer power supply unit includes: a housing; a plurality of cooling fans; a temperature controller; at least one temperature sensor coupled electrically to the temperature controller; and a plurality of fan-driving circuits coupled electrically and respectively to the cooling fans and controlled by the temperature... Agent: Mcdermott Will & Emery LLP 20090116188 - Liquid resistant a/c adaptor: An external AC power adapter. The adapter includes a housing which, in one embodiment, defines an air inlet compartment, an air outlet compartment and a partially sealed electronics compartment containing electrical components for converting an AC input to a DC output. A blower generates an airflow within the electronics compartment... Agent: Vierra Magen/microsoft Corporation 20090116192 - Method and system for removing heat: A system and method for removing heat, in particular for removing heat from a multi-chip module or integrated circuit. The system is a closed system and includes a sealed container, and an evaporator, housed within the sealed container. The evaporator is in thermal communication with a heat source, and includes... Agent: Kathleen M. Lynch Moore & Van Allen PLLC 20090116193 - Structure and manufacturing method of substrate board: A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively... Agent: Rosenberg, Klein & Lee 20090116194 - Circuit module and manufacturing method thereof: A circuit module includes: a thermally conductive board forming a part of a housing; a circuit board disposed above the thermally conductive board; a semiconductor chip connected to a plurality of electrode pads on a upper surface of the circuit board through solder; a heat sink connected to a upper... Agent: Ibm Corporation RochesterIPLaw Dept. 917 20090116195 - Heat sink for dissipating heat and apparatus having the same: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate... Agent: Stanzione & Kim, LLP 20090116196 - Water cooled heat dissipation module for electronic device: A heat dissipation module for an electronic device includes a base disk, a suction disk, a water guide and a cover. The base has a containing space and a plurality of cooling strips. The suction base is attached to the base disk and further invludes a water chamber for receiving... Agent: G. Link Co., Ltd. 20090116197 - Method for power semiconductor module fabrication, its apparatus, power semiconductor module and its junction method: A power semiconductor module includes first and second insulating substrates, a power semiconductor device joined directly or through another element to opposite sides of the first and second insulating substrates and first and second heat spreaders joined with joining material having fluidity upon joining so as to put the first... Agent: Antonelli, Terry, Stout & Kraus, LLP 20090116198 - Structure and method to form a heat sink: The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit... Agent: Bae Systems 20090116199 - Heat dissipating device: A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base forms a protrusion. The block defines a first recess and a second recess in two opposite surfaces of... Agent: PCe Industry, Inc. Att. Steven Reiss 20090116200 - Electronic device: An electronic device comprises a first module, a second module, a flexible printed circuit board, a first protecting cover and a second protecting cover. The first module comprises a bottom plate. The second module is disposed below the first module and comprises a top plate. The flexible printed circuit board... Agent: Birch Stewart Kolasch & Birch 20090116201 - Circuit board module and method for reinforcing structure thereof: A circuit board module includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element. A method for reinforcing the structure of... Agent: Muncy, Geissler, Olds & Lowe, PLLC 20090116202 - Mobile terminal: A mobile terminal includes a frame having a front side and a rear side, the rear side having a first receiving space and a second receiving space located beside one another, a front cover disposed to at least partially cover the front side of the frame, the front cover having... Agent: Birch Stewart Kolasch & Birch 20090116203 - Mounting structure: A mounting structure is provided that can suppress flux from spreading, secure a connecting strength between a circuit board and an electronic component with underfill, and achieve a stable electrical connection between lands and terminals. The mounting structure is configured with a flat electronic component and a circuit board, and... Agent: Mcdermott Will & Emery LLP 20090116204 - Capacitor assembly of electrical circuit system: This invention is about the capacitor assembly improvement of electrical circuit system, including a central partitioning board, its surface has connecting hole installed through conductive component, both sides are distributed with insertion slots; first base board installed with sleeve hole connecting to one end of conductive component and an insertion... Agent: Birch Stewart Kolasch & Birch 20090116205 - Mounted structure: A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of... Agent: Steptoe & Johnson LLP 20090116206 - Portable electronic device: A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main... Agent: Mcnees Wallace & Nurick LLC 20090116207 - Method for micro component self-assembly: A method for micro-component self-assembly is disclosed. An embodiment self-assembly method provides a substrate with an interconnect, and a micro-device having a corresponding interconnect that is arranged for engagement with the interconnect of the substrate during the self-assembly process. A method for fabricating a micro-device for micro-component self-assembly with a... Agent: Jacobson Holman PLLC 20090116208 - Electronic device electrical shielding: Disclosed herein is a shield for electrically shielding an electronic device. The shield includes a molded base and a first coating layer. The molded base includes a first portion and a second portion. The second portion comprises a resilient material connected to the first portion by being molded or extruded... Agent: Harrington & Smith, PC 20090116209 - Housing for an optoelectronic component emitting electromagnetic radiation, component emitting electromagnetic radiation, and method for the production of a housing or a component: A housing for an electromagnetic-radiation-emitting optoelectronic component. Exterior side faces of the housing are at least partly provided with a screening layer suitable for screening an electromagnetic radiation. A lateral emission of electromagnetic radiation from the housing, which is disadvantageous for many applications, is thereby intended to be avoided. An... Agent: Cohen, Pontani, Lieberman & Pavane LLP Previous industry: Dynamic magnetic information storage or retrievalNext industry: Illumination ###### RSS FEED for 20091112: Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates. 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