Electricity: electrical systems and devices inventions 12/08

20080316658 - Aircraft applicable circuit imbalance detection and circuit interrupter and packaging thereof: The aircraft applicable current imbalance detection and circuit interrupter interrupts an electrical circuit when a current imbalance is sensed. The current imbalance detection and circuit interrupter includes a housing, power supplies, a sensor system for sensing a current imbalance at the line side of the electrical circuit, a logic controller... Agent: Fulwider Patton LLP

20080316660 - Electrostatic discharge avoiding circuit: An electrostatic discharge (ESD) avoiding circuit comprises an ESD detecting unit and a switch unit. The ESD detecting unit is coupled to a first conductive path for detecting whether the ESD happened or not. The switch unit is coupled between the first conductive path and a core circuit for switching... Agent: J C Patents, Inc.

20080316661 - Electrostatic discharge immunizing circuit without area penalty: A chip includes a core circuit, a main electrostatic discharge immunizing circuit, and a secondary electrostatic discharge immunizing circuit. The secondary electrostatic discharge immunizing circuit is disposed beneath a core power ring formed between the core circuit and the main electrostatic discharge immunizing circuit for reaching the aim of protecting... Agent: North America Intellectual Property Corporation

20080316663 - Esd protection for pass-transistors in a voltage regulator: Present invention relates to an electrostatic discharge protection circuit for a transistor circuit having electrostatic discharge protection circuits coupled to an input and to an output terminal. The protection circuits comprise delay means having a predetermined delay time and switchable connecting means connected between said input terminal and a control... Agent: Nxp, B.v. Nxp Intellectual Property Department

20080316659 - High voltage esd protection featuring pnp bipolar junction transistor: A protection circuit is disclosed that protects a semiconductor device from damage due to an electrostatic discharge. One such protection circuit comprises a vertical pnp hetero-junction bipolar transistor (HBT) connected between terminals such as supply terminals of the device, configured to conduct during an electrostatic discharge. The protection circuit also... Agent: Texas Instruments Incorporated

20080316662 - Reducing input capacitance for high speed integrated circuits: An integrated circuit with reduced pad capacitance, having a trench formed in the silicon substrate below the pad to reduce the pad capacitance. In another embodiment, an encapsulated air cavity if formed underneath the pad. Other embodiments are described and claimed.... Agent: Seth Kalson C/o Intellevate, LLC

20080316664 - Resettable mems micro-switch array based on current limiting apparatus: The present invention comprises a method for over-current protection. The method comprising monitoring a load current value of a load current passing through a plurality of micro-electromechanical switching system devices, determining if the monitored load current value varies from a predetermined load current value, and generating a fault signal in... Agent: Cantor Colburn, LLP

20080316665 - Delay time control circuit in a battery protector to reduce delay time: A battery protection IC using charging control pin, Cout, so as to reduce delay time during CP test or FT test for is disclosed. The battery protection IC has a delay time control circuit including a comparator and a delay signal selector. The comparator has a negative input terminal connected... Agent: Chih Feng Yeh

20080316666 - Flyback voltage detecting circuit and apparatus and method for inductive load: An inductive load is connected between an output node and a first power supply which supplies a first power supply voltage. An inductive load driving apparatus includes a flyback voltage generation control circuit connected in series with the inductive load through the output node between the first power supply voltage... Agent: Sughrue Mion, PLLC

20080316667 - Electronic system and cell module thereof: An electronic system and a cell module thereof are provided. The electronic system includes an electronic device and a cell module. The cell module includes a cell, a discharge switching circuit, and a surge current suppressed and controlled circuit. The discharge switching circuit is coupled to the cell. The surge... Agent: Bacon & Thomas, PLLC

20080316668 - Methods and apparatuses for performing common mode pulse compensation in an opto-isolator: In an opto-isolator, common mode pulses that occur are compensated for by either adding current to the electrical-to-optical converter (EOC) drive current to compensate for a decrease in the EOC drive current caused by the occurrence of a common mode pulse or by pulling some of the drive current away... Agent: Kathy Manke Avago Technologies Limited

20080316669 - Method and an array for magnetizing a magnetizable object: Described is a method and array for magnetizing a magnetizable object. The method includes the steps of (a) applying a first degaussing signal to the magnetizable object to degauss the magnetizable object and the first degaussing signal is an alternating electrical signal having a first frequency and a first amplitude;... Agent: Fay Kaplun & Marcin, LLP

20080316670 - Voltage generator: A voltage generator used to generate a voltage for driving a vehicle fuel injector includes a microcomputer, a coil, and a capacitor. The microcomputer calculates an interval at which the fuel injector is driven. When the interval is less than or equal to a predetermined time period, the microcomputer causes... Agent: Nixon & Vanderhye, PC

20080316671 - Piezoelectric actuator driving device and method: A driving device for a piezoelectric actuator supplies charges and discharges the piezoelectric actuator through a charging switch and a discharging switch, respectively. The charging switch is repeatedly turned on and off thereby to charge and expand the piezoelectric actuator. The discharging switch is repeatedly turned on and off thereby... Agent: Nixon & Vanderhye, PC

20080316672 - Dc type of self-discharged fiber-like static eliminator: There is provided a static eliminator which comprises an ion generating portion in the form of tape. There is also provided a self-discharged static eliminator comprising an conductor provided with discharge whiskers in which the conductor is applied with a predetermined voltage. There is also provided a DC type of... Agent: Leighton K. Chong

20080316673 - Moisture sensor: A moisture sensor includes interdigitated first and second electrodes formed in trenches 26. A porous low-k dielectric 20 is provided between the electrodes. The electrodes are of Cu 30 surrounded by a barrier layer 28,32 to protect the Cu from corrosion. TiN may be used as barrier layer 28 and... Agent: Nxp, B.v. Nxp Intellectual Property Department

20080316674 - Capacitors and methods for fabricating the same: Capacitors and methods for fabricating the same are provided. An exemplary embodiment of a capacitor comprises a dielectric layer and a first conductive layer thereover. A supporting rib is embedded in the first conductive layer and extends along a first direction. A second conductive layer is embedded in the first... Agent: Birch Stewart Kolasch & Birch

20080316675 - Method for producing a dielectric interlayer and storage capacitor with such a dielectric interlayer: A dielectric interlayer, especially for a storage capacitor, is formed from a layer sequence subjected to a temperature process, wherein the layer sequence has at least a first metal oxide layer and a second metal oxide layer formed by completely oxidizing a metal nitride layer to higher valency.... Agent: Gero G. Mcclellan / Infineon Technologies

20080316676 - Ceramic capacitor and method for manufacturing same: Material powder having a tetragonal perovskite crystal structure essentially containing BaTiO3 is provided. The material powder has a c-axis/a-axis ratio ranging from 1.009 to 1.011 and an average particle diameter not larger than 0.5 μm. A dielectric layer is provided by mixing the material powder with additive. The dielectric layer... Agent: Ratnerprestia

20080316677 - Ultracapacitors comprised of mineral microtubules: Disclosed is an ultracapacitor having electrodes containing mineral microtubules, an electrolyte between the electrodes, and a separator in the electrolyte to provide electrical insulation between the electrodes, while allowing ion flow within the electrolyte. The electrodes may be formed from a paste containing microtubules, a conductive polymer containing mineral microtubules,... Agent: Basch & Nickerson LLP

20080316678 - Nanoparticle ultracapacitor: Particular aspects provide capacitors, and particularly ultracapacitors, comprising molecules suitable to substantially increasing the capacitance of the capacitor, and methods for making same Particular aspects provide ultracapacitors that include nanoparticles optionally coated with molecules, such as polymer electrolytes. Certain aspects provide an energy storage device or capacitor, comprising at least... Agent: Davis Wright Tremaine, LLP/seattle

20080316679 - Electrolytic solution for electrolytic capacitor, and electrolytic capacitor using the same: It is provided the electrolytic solution for use in the electrolytic capacitor including a capacitor element and a casing containing said capacitor element, said capacitor element including a pair of electrodes, and a conductive separator (E) which is formed with a conductive polymer layer (F) containing a dopant agent (H)... Agent: Wenderoth, Lind & Ponack L.L.P.

20080316680 - Solid electrolytic capacitor and method for producing the same: The present invention is to provide a solid electrolytic capacitor having a small equivalent series resistance. In this solid electrolytic capacitor, a capacitor element is buried inside of an outer package of an epoxy resin or the like, the capacitor element including an anode in which a part of an... Agent: Ditthavong Mori & Steiner, P.C.

20080316681 - Capacitor and method for manufacturing same: The present invention relates to a capacitor having high capacitance, low ESR (equivalent series resistance) in a high-frequency region and low leakage current, comprising a composite oxide film obtained by reaction of an oxide film obtained by subjecting the surface of the substrate comprising valve-acting metal element with a solution... Agent: Sughrue Mion, PLLC

20080316682 - Electronic device chassis and canister: In the invention, a finger board is bent like a “letter V”, and a thickness adjustment plate is provided between the finger boards of modules to be able to move, thereby being able to adjust the height of a finger. Such a configuration enables to increase the contact pressure of... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080316683 - Case for containing a portable media player: There is provided a case for containing a portable media player, the case including: a frame for placement of the media player; and a speaker driver mounted in a cabinet, the speaker driver connectable to an audio output of the media player. The media player may be either permanently located... Agent: Creative Labs, Inc. Legal Department

20080316686 - Electronic apparatus: According to one embodiment, an electronic apparatus includes: a main body that has a bearing hole having a first retaining portion and a second retaining portion; a sub module that has a shaft rotatably coupling with the bearing hole so that the sub module moves between a first position and... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080316685 - Electronic casing and method of manufacturing the same: An electronic casing and a method of manufacturing the same are provided. The method includes the following steps. Step (a): a metal laminate and a die of a predetermined shape are provided. The metal laminate comprises a metal top layer and a metal bottom layer that are bonded by interface... Agent: Volentine & Whitt PLLC

20080316684 - Electronic device component eject mechanism: Disclosed herein is a portable electronic device component eject mechanism. The portable electronic device component eject mechanism includes a first member and a second member. The first member is configured to contact a first portable electronic device component. The second member is movably connected to the first member. The second... Agent: Harrington & Smith, PC

20080316689 - Computer display screen system and adjustable screen mount, and swinging screens therefor: A computer system is described herein. In addition to a base structure for resting on a support surface, the system includes a first display panel coupled to the base structure, and a second display panel. The system further includes a hinge mechanism that couples a side edge of the first... Agent: Mass Engineered Design Inc.

20080316688 - Electronic apparatus: According to one embodiment, an electronic apparatus includes: a case having an upper wall and a lower wall; a connector housed in the case; a duct portion having a first opening that opens in the upper wall, the duct portion protruding from a peripheral edge of the first opening and... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080316687 - Protective enclosure for an electronic device: Disclosed is a three-layer protective enclosure that provides resistance to water, dust, dirt, and bump protection for sensitive electronic devices. In one embodiment, an inner membrane layer is provided, which is a thin, flexible layer that protects portions of the electronic device and allows the user to interact with keyboards,... Agent: Cochran Freund & Young LLC

20080316691 - Configurable computer system and methods of use: Methods and devices are provided that allow for a configurable computer system comprised of a common electronic base used in conjunction with interchangeable user interface system housings having a tablet display, a notebook display, or convertible display. The user interface systems comprise an upper housing that interfaces with the common... Agent: HoustonIPDepartment Jackson Walker L.L.P.

20080316690 - Display device: A display device includes: a display unit which displays an image; a casing which supports the display unit; a pair of supporting members which are respectively combined at peripheral areas of a backside of the display unit and are supported by the casing; and a connecting member which has higher... Agent: Sughrue Mion, PLLC

20080316695 - Electronic enclosure fastening belt: Enclosures for laptops, notebooks, tablets, or other portable computers are provided, the enclosures comprising a first case having a first edge defined thereon, a second case having a second edge defined thereon, wherein said first edge of said first case and said second edge of said second case abut one... Agent: HoustonIPDepartment Jackson Walker L.L.P.

20080316693 - Housing with rotatable cover assembly: A housing assembly includes a housing (3), a pair of connecting arms (51), and a cover (1). The housing includes a front opening, a side wall (31), a top wall and a bottom wall positioning at opposite sides of the side wall. The top wall and bottom wall each has... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080316694 - Latching mechanism and base casing of notebook computer using the same: A latching mechanism for being mounted between a housing and a cover of an electronic device includes a sliding member, a first latching portion, a second latching portion and an elastic member. The sliding member is slidably disposed on the cover and has a pushed portion located at a side... Agent: Jianq Chyun Intellectual Property Office

20080316692 - Moveable platform for a laptop computer: A moveable platform for a laptop computer has an angled support base to angle the laptop keyboard and elevate the laptop display monitor. The angled support base forms an airgap between the moveable platform and the desktop to dissipate the heat from the laptop computer. A separate cooling fan system... Agent: William Propp, Esq.

20080316697 - Flash memory device with improved light-guiding member and cover thereof: A flash memory device includes a bottom shell, a PCB mounted on the bottom shell, a connector interface electrically connecting the PCB, a movable cover covering the PCB and a light-guiding member set on the cover. The PCB includes a LED light. The light-guiding member absorbs the light of the... Agent: Wei Te Chung Foxconn International, Inc.

20080316696 - Semiconductor memory device and semiconductor memory card using the same: A semiconductor memory device is provided with a wiring board which includes an element mounting portion and connection pads. Plural semiconductor memory elements are stacked on the element mounting portion of the wiring board. The semiconductor memory element of a lower side has a thickness greater than that of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080316698 - Damping structure for electronic devices: A damping structure for electronic devices has a holding rack mounted onto a chassis to hold an electronic device. The holding rack has two ends extended towards the chassis to form respectively a step portion and a first coupling section extended from the step portion. The holding rack has two... Agent: Joe Mckinney Muncy

20080316700 - One-touch release apparatus: An apparatus controlled by one touch operation for releasing and propping components is disclosed. The apparatus includes a base, a prop device with a resilient piece and an ejecting pin, a reciprocating device located between the base and the prop device, and a stabilizing device fixed on the base. The... Agent: Sutherland Asbill & Brennan LLP

20080316699 - Plate combination type computer housing: A plate combination type computer housing comprises a bottom plate, a first plate, a second plate, a third plate, a fourth plate, a upper plate and four fixing rods. Whereby, the number of molds for manufacturing the housing can be reduced so as to save the production cost, and it... Agent: Bruce H. Troxell

20080316701 - Gaming device cooling system: A gaming device has a housing with at least one air inlet vent and at least one air exhaust vent. In one aspect of the invention, the vents are configured with a duct or flange having at least one upwardly sloping portion configured to prevent the entry of contaminants such... Agent: Weide & Miller, Ltd.

20080316702 - Exhaust air duct with adjustable filler panel assemblies: An adjustable filler panel assembly, configured for use in an electronic equipment enclosure, includes a first panel and a second panel, each adapted to block airflow. The first panel has pairs of horizontally aligned adjustment openings formed therein, and the second panel has a pair of horizontally aligned attachment members... Agent: Tillman Wright, PLLC

20080316704 - Air manifold for electronic module enclosure: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic... Agent: Hewlett Packard Company

20080316703 - Electronic equipment enclosure with exhaust air duct and adjustable filler panel assemblies: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and a plurality of adjustable filler panel assemblies. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same... Agent: Tillman Wright, PLLC

20080316705 - Heat dissipation device having a fan mounted thereon: A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080316706 - Heat dissipation structure for electronic devices: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening... Agent: Joe Mckinney Muncy

20080316707 - Heat dissipation device with heat pipes: A heat dissipation device includes a base (14) for absorbing heat from an electronic device and a plurality of fins (20) arranged on the base. A heat pipe (32) thermally contacts the fins and the base for transferring heat from the base to the fins. The heat pipe includes a... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080316708 - Low cost cold plate with film adhesive: An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may... Agent: Honeywell International Inc.

20080316710 - Power converter device: A power module having three unit power modules and a control circuit board including a gate drive circuit are set up side by side and mounted on a heat exchanger. A pair of positive and negative direct current terminals for connecting the smoothing capacitor and a plurality of alternating current... Agent: Crowell & Moring LLP Intellectual Property Group

20080316709 - Thermally conductive electrical structure and method: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a plurality of electrical components, a first thermally conductive film layer formed over and in contact with a first electrical component of the plurality of electrical components, a first thermally conductive structure in mechanical contact... Agent: Schmeiser, Olsen & Watts

20080316711 - Vlsi hot-spot minimization using nanotubes: The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the... Agent: The Law Offices Of Robert J. Eichelburg

20080316712 - High density module having at least two substrates and at least one thermally conductive layer therebetween: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first... Agent: Knobbe Martens Olson & Bear LLP

20080316714 - Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system: Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer is disposed over the front surface of the multichip layer and... Agent: Heslin Rothenberg Farley & Mesiti PC

20080316713 - Power supply and speakerphone for handheld devices: The invention claimed herein and depicted in FIGS. 1 through 4 presents a combined alternate power source and speakerphone device for handheld devices such as cellular telephones. Housing 2 contains battery compartment 28 that accepts batteries such as “AA” or “AAA” cells, which are installed by opening sliding cover 4.... Agent: Karen A. Boyd

20080316715 - Coated copper, method for inhibiting generation of whisker, printed wiring board and semiconductor device: A coated copper is provided which inhibits the growth of whiskers and is composed of a copper substrate or a copper alloy substrate, a copper-diffused tin layer formed on the surface of the substrate, and a pure tin layer formed on the surface of the copper-diffused tin layer. The thickness... Agent: The Webb Law Firm, P.C.

20080316716 - Frame for a packaging method using flexible printed circuit boards and method thereof: A frame for a packaging method using flexible printed circuit boards is provided. Before chips are bonded onto the at least one flexible printed circuit board, the frame is bonded to the at least one flexible printed circuit board to increase strength and weight of the at least one printed... Agent: Jackson Walker, L.L.P.

20080316717 - Sim card handle: An improved smart card is provided, which is adapted for easy extraction from a smart card socket, or example, in a mobile telephone. Facilitating the easy extraction is a structural deviation in the plane of at least one of the sides of the smart card to enable an increase of... Agent: Mark M. Friedman

20080316718 - Injection/ejection mechanism: An injection/ejection mechanism is provided for mounting and dismounting of a unit in a chassis. The mechanism includes a drive screw that cooperates with a threaded barrel, the threaded barrel being rotatable for engagement and disengagement with at least one chassis component. The drive screw can be rotated in a... Agent: Pvf -- Sun Microsystems Inc. C/o Park, Vaughan & Fleming LLP

20080316719 - Function expansion datacard: A function expansion datacard including a main board, a connector, a housing and a holder is provided. Several chips and the connector are disposed on a surface of the main board. The connector is situated near the edge of the main board. The housing disposed on the main board covers... Agent: Bacon & Thomas, PLLC

20080316720 - Electronic components: Electronic components include a case, a circuit board, electronic parts, a plate-like electrode terminal, a metal cover, a stepped portion, a connecting terminal, and a fastening member. The case includes a connector portion and an opening. The connector portion has an external terminal. The circuit board mounting the electronic parts... Agent: Morgan & Finnegan, L.L.P.

20080316721 - Electrode structure body and method of forming the same, electronic component, and mounting substrate: An electrode structure body of the present invention is composed of a metal electrode, and a solder alloy layer (a tin/nickel alloy layer) formed on a surface of the metal electrode. The solder alloy layer is obtained by reflow-heating the solder layer formed on the metal electrode and then removing... Agent: Kratz, Quintos & Hanson, LLP

20080316722 - Wiring board and method for making the same: A wiring board includes a substrate having an adhesive surface, a first wiring, and a second wiring. The adhesive surface is in contact with the first wiring and the second wiring. The first wiring has a penetrating hole extending in a direction perpendicular to the adhesive surface. The second wiring... Agent: Fitzpatrick Cella Harper & Scinto

20080316723 - Methods for integration of thin-film capacitors into the build-up layers of a printed wiring board: Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The singulated capacitors have a pitch that allows each power... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080316725 - Connector, printed circuit board, connecting device connecting them, and method of testing electronic part, using them: The invention has an object of providing a connector for connecting between a printed circuit board and a test device, capable of easily attaching and detaching the connector at low cost. The connector includes at least one conducting pin 28 that is protruded from a connector body, and at least... Agent: Kratz, Quintos & Hanson, LLP

20080316724 - Universal solder pad: A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically... Agent: Kirton And Mcconkie

20080316726 - Multi-layer substrate and manufacture method thereof: Disclosed are a multi-layer substrate and a manufacture method thereof. The multi-layer substrate of the present invention comprises a surface dielectric layer and at least one bond pad layer. The surface dielectric layer is located at a surface of the multi-layer substrate. The bond pad layer is embedded in the... Agent: Madson & Austin

20080316727 - 3d electronic module: The invention relates to a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conductive protrusions (41), and the second slice (30) comprising at... Agent: Lowe Hauptman & Berner, LLP

20080316728 - Metal core foldover package structures: Chip-scale packages and assemblies thereof are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from... Agent: Trask Britt, P.C./ Micron Technology

20080316729 - Skew controlled leadframe for a contact module assembly: A leadframe for a contact module assembly includes a terminal set having first, second and third terminals configured to operate in one of a signal-signal-ground pattern and a ground-signal-signal pattern. Each of the terminals have a length that extends between a mating end and a mounting end, wherein a difference... Agent: Robert J. Kapalka Tyco Electronics Corporation

20080310056 - Remote-operable micro-electromechanical system based over-current protection apparatus: The present invention provides a remote operable over-current protection apparatus. The apparatus includes control circuitry integrally arranged on a current path and a micro electromechanical system (MEMS) switch disposed on the current path, the MEMS switch responsive to the control circuitry to facilitate the interruption of an electrical current passing... Agent: Cantor Colburn, LLP

20080310057 - Mems based motor starter with motor failure detection: A motor starter is disclosed. The motor starter includes control circuitry integrally arranged with at least one current path and a processor included in the control circuitry. The motor starter further includes at least one processor algorithm residing on the processor, the at least one processor algorithm containing instructions to... Agent: Cantor Colburn, LLP

20080310058 - Mems micro-switch array based current limiting arc-flash eliminator: The present invention comprises MEMS enabled apparatus for the detection of arc-faults and the elimination of arc-flash conditions. The apparatus comprises an arc-flash detection component and a current limiting component. The current limiting component comprises a logic circuit in communication with the user interface, an MEMS protection circuit in communication... Agent: Cantor Colburn, LLP

20080310059 - Esd protection design method and related circuit thereof: The invention discloses a method for electrostatic discharge (ESD) protection design. The method includes: placing a first input/output cell (I/O cell) and a second input/output cell at a side of a chip, wherein a routing area exists at the side of the chip and is positioned between the first input/output... Agent: North America Intellectual Property Corporation

20080310060 - Overvoltage protection module and an assembly of at least one telecommunications module and at least one overvoltage protection module: An overvoltage protection module can be fitted to a telecommunications module having telecommunications contacts, to which telecommunications lines are connectable, and has at least two overvoltage protectors, at least one ground contact, and at least two pairs of protection module contacts for contacting the telecommunications contacts at contact points, so... Agent: 3m Innovative Properties Company

20080310061 - Transistor with eos protection and esd protection circuit including the same: A transistor with an electrical overstress (EOS) protection may include an active region, a plurality of impurity regions and a conduction pattern. The active region may be formed in a substrate. The impurity regions may be formed in the active region and arranged at a predetermined or given distance with... Agent: Harness, Dickey & Pierce, P.L.C

20080310062 - Micro-electromechanical system based selectively coordinated protection systems and methods for electrical distribution: Electrical distribution systems implementing micro-electromechanical system based switching devices. Exemplary embodiments include a method in an electrical distribution system, the method including determining if there is a fault condition in a branch of the electrical distribution system, the branch having a plurality of micro electromechanical system (MEMS) switches, re-closing a... Agent: Cantor Colburn, LLP

20080310063 - Voltage detecting apparatus: The present invention is to provide a voltage detecting apparatus, which can downsize a circuit, reduce costs and detect a voltage with high accuracy, the voltage detecting apparatus to detect a voltage by using a flying capacitor. Furthermore, the voltage detecting apparatus does not halt whole functions. The first zener... Agent: Kratz, Quintos & Hanson, LLP

20080310064 - Protection circuit: A protection circuit comprising: a second circuit to be connected to a first circuit, the first circuit including: a first reference voltage generating circuit configured to generate a first reference voltage; a first comparing voltage generating circuit configured to generate a first comparing voltage a first comparator configured to output... Agent: SocalIPLaw Group LLP

20080310065 - Methods of achieving linear capacitance in symmetrical and asymmetrical emi filters with tvs: A transient voltage suppressing (TVS) circuit with uni-directional blocking and symmetric bi-directional blocking capabilities integrated with an electromagnetic interference (EMI) filter supported on a semiconductor substrate of a first conductivity type. The TVS circuit integrated with the EMI filter further includes a ground terminal disposed on the surface for the... Agent: Bo-in Lin

20080310066 - Methods of achieving linear capacitance in symmetrcial and asymmetrical emi filters with tvs: A transient voltage suppressing (TVS) circuit with uni-directional blocking and symmetric bi-directional blocking capabilities integrated with an electromagnetic interference (EMI) filter supported on a semiconductor substrate of a first conductivity type. The TVS circuit integrated with the EMI filter further includes a ground terminal disposed on the surface for the... Agent: Bo-in Lin

20080310068 - Control circuit of semiconductor device having over-heat protecting function: A control circuit of a semiconductor device includes: a semiconductor element which supplies an electric power to a load; an over-heat protecting unit having: a temperature detecting section which detects a rise in temperature; a latch section which holds an output of the temperature detecting section; and a gate interrupting... Agent: Morgan Lewis & Bockius LLP

20080310067 - System and method for using a phy to locate a thermal signature in a cable plant for diagnostic, enhanced, and higher power applications: A system and method for using a physical layer device to locate a thermal signature in a cable plant for diagnostic, enhanced, and higher power applications. Cable heating in specific sections of a network cable is detected through an automatic identification of a thermal signature in electrical measurements of a... Agent: Law Office Of Duane S. Kobayashi

20080310069 - Systems and methods for distributed series compensation of power lines using passive devices: Systems and methods for implementing line overload control via providing distributed series impedance are disclosed. One system, amongst others, comprises at least one distributed series reactor (DSR). Each DSR comprises a single turn transformer (SST) comprising two split-core sections (132), a winding (120), and an air-gap (138), the air-gap designed... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080310070 - Systems and methods for protecting device from change due to quality of replaceable components: A device protection system for a device that operates using a replaceable component provided with a replaceable component, component monitor, and a means for disabling the replaceable component. The component monitor is provided with a storage unit, a sensing unit, a determination unit and a control unit that engages a... Agent: Oliff & Berridge, PLC.

20080310072 - Spark gap protection device: A spark gap protection device is provided. The device comprises a plurality of spark gaps and a plurality of windings. Each spark gap is connected to at least one winding which is inductively coupled to an associated winding connected to another spark gap so that, in use, a surge current... Agent: Lahive & Cockfield, LLP Floor 30, Suite 3000

20080310071 - Structure for installing lightning arrester for electric pole: A structure for installing a lightning arrester between the cross arm mounted to the upper end of an electric pole and a power line is disclosed. A dead end clamp, the lightning arrester and an insulation reinforcing insulator are connected in series, an end of the insulation reinforcing insulator is... Agent: Lowe Hauptman Ham & Berner, LLP

20080310073 - Method for forming oxide dielectric layer, and capacitor layer forming material provided with oxide dielectric layer obtained by the forming method: The present invention has an object to provide a method for forming an oxide dielectric layer, which dielectric layer is formed by applying the sol-gel method, and is hardly damaged by an etching solution and excellent in dielectric characteristics such as a large electric capacitance. To achieve the object, the... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20080310074 - Multilayer capacitor: A multilayer capacitor comprises a capacitor body, first and second inner electrodes, and first and second terminal electrodes. A first terminal electrode is arranged on a first surface of the capacitor body which is parallel to a first direction, and connected to the first inner electrode. A second terminal electrode... Agent: Oliff & Berridge, PLC

20080310075 - Metalized film capacitor, case mold type capacitor using the same, inverter circuit, and vehicle drive motor drive circuit: A metalized film capacitor capable of exhibiting stable performance in a wide temperature range is provided. The metalized film capacitor has an elliptical cross sectional shape having a major axis of 60 mm or above. In this capacitor, offset for shifting in the width direction of a pair of metalized... Agent: Pearne & Gordon LLP

20080310076 - Controlled esr decoupling capacitor: Disclosed are apparatus and methodology for providing controlled equivalent series resistance (ESR) decoupling capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide characteristics for use in decoupling applications involving both signal level and power level environments. Controlled equivalent series resistance (ESR) is provided by... Agent: Dority & Manning, P.A.

20080310078 - Method of implementing low esl and controlled esr of multilayer capacitor: Disclosed is a method of implementing controlled equivalent series resistance (ESR) having low equivalent series inductance (ESL) of a multi-layer chip capacitor which includes a plurality of internal electrodes each having first polarity or second polarity which is opposite to the first polarity, and dielectric layers each disposed between the... Agent: Mcdermott Will & Emery LLP

20080310077 - Monolithic ceramic capacitor: In a monolithic ceramic capacitor, the size of end surfaces of a capacitor body in a two-dimensional surface in which ceramic layers extend is greater than the size of side surfaces in the two-dimensional surface in which the ceramic layers extend. External terminal electrodes include a resistive component. In each... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080310079 - Electrolytic capacitor comprising means for the sorption of harmful substances: An electrolytic capacitor is provided having an airtight casing, electrodes immersed in an electrolytic solution, electrical contacts connected to the electrodes, and a means (10, 43) for sorption of harmful substances. The means for sorption of harmful substances includes a polymeric housing (11, 12) permeable to the harmful substances but... Agent: Panitch Schwarze Belisario & Nadel LLP

20080310080 - Solid state capacitors and method of manufacturing them: The present invention concerns the field of solid state capacitors and is directed more particularly to a method for manufacturing solid state electrolytic capacitors formed from porous conductive metal oxide anode bodies and having a cathode layer of conducting polymer, and capacitors thereby formed. There is disclosed a solid state... Agent: Dority & Manning, P.A.

20080310081 - Solid electrolytic capacitor and method of manufacturing the same: A solid electrolytic capacitor includes a porous sintered body made of a valve-acting metal and embedded with part of an anode lead having a protruding portion, a solid electrolyte layer formed in contact with a dielectric layer formed in the porous sintered body, a mounting anode terminal member, a mounting... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080310082 - Electronic device: An entertainment device or other electronic device having an outward shape improved in functionality compared with that in the related art are provided. The electronic device includes a main housing that is formed in an approximately elliptical cylinder form, and disposed in a such a manner that a longitudinal direction... Agent: Kaplan Gilman Gibson & Dernier L.L.P.

20080310086 - Enclosure for a connector: The enclosure includes two or more enclosure parts, each having a joint such that the enclosure parts are fit together to constitute the enclosure. The joint may have a continuation of linear segments to form a shape like mountains, wherein the length of each segment is smaller than a wavelength... Agent: Staas & Halsey LLP

20080310085 - Hinge mounting apparatus: A hinge mounting apparatus (100) for mounting a hinge (80) of a portable electronic device is provided. The portable electronic device includes an accommodating cavity (904). The hinge mounting apparatus includes a base (10), a hinge tube (50), an actuator (30), and a positioning member (60). The hinge tube is... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080310087 - Media playing device: A media playing device is provided. In an exemplary form, the media playing device includes a housing having a cylindrical end with an opening. The media playing device also includes a hollow turning knob. The knob has two protrusions on its inside surface. The media playing device additionally includes a... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080310084 - Portable electronic device having writing mechanism: A portable electronic device (30) includes a first body (32), a second body (34), and a writing board (3222). The first body has a surface (322). The second body is movably mounted to the first body and covers the surface of the first body. The writing board is formed on... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080310083 - Unique mounting for computer equipment in frames: A mounting assembly is provided for mounting equipment on a frame including a front pair of vertical rails and a back pair of vertical rails. The mounting assembly includes a bracket for attaching a front side of the equipment to one of the front rails and a hinge for attaching... Agent: Alcatel Lucent Intellectual Property & Standards

20080310089 - Housing assembly for portable electronic device: A housing assembly (22) for use in a portable electronic device (20), includes a keypad board (221), a circuit board (223), and a main body (224). The keypad board has at least one key (2211) formed at a top surface thereof and at least one mounting pin (2224) formed at... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080310088 - Portable computer with a hidden keyboard: The present invention discloses a portable computer with a hidden keyboard, which includes a main system having a display device on one side and a support board pivotally connected to the main system, so that the support board can be turned to integrate with the main system or support the... Agent: Bacon & Thomas, PLLC

20080310091 - Display apparatus: A display apparatus includes a backlight assembly, a display assembly and a board combining member. The backlight assembly includes a light source generating light and a container receiving the light source. The display assembly includes a display panel received in the container and displaying an image, a driving printed circuit... Agent: Cantor Colburn, LLP

20080310090 - Display module: Provided is a display module. The display module includes a panel, a printed circuit board (PCB), a flexible printed circuit board (FPCB), and a support member. The panel displays images. The PCB supplies driving signals to the panel. The FPCB electrically connects the PCB to the panel. The support member... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association

20080310092 - Flat panel display apparatus: A flat panel display apparatus includes a display panel, a chassis configured to support a backside of the display panel, and a flexible circuit board on which a driving circuit for driving the display panel is mounted. The chassis includes a first flat plate bonded to the display panel on... Agent: Canon U.s.a. Inc. Intellectual Property Division

20080310094 - Attachable device accessory case cover with interchangeable components: One embodiment of case (10) is a thin flexible presentation panel (18a) approximately the size of device (17a) having tabs which wrap over and around device (17a) and attach using hook-and-loop fasteners. A second embodiment is a case body comprising interchangeable components including a case utility panel (24) to which... Agent: James A. Burns

20080310093 - System for protecting a portable computing device: The invention relates to a system for protecting a portable computing device wherein the system comprises a device housing adapted to protectively encase a portable computing device, a protectively hardened user input device in communication with the device housing, and a protectively hardened display in communication with the device housing.... Agent: Nixon Peabody, LLP

20080310096 - Invention that protects digital data stored on a computer system from fire and water: The invention herein protects digital computer data from physical natural disasters such as fire and flood. While most methods of data backup to combat these threats rely on physical separation of the data and main computer system, this invention can be used inside the main physical computer and thus provide... Agent: The Law Office Of Joseph H. Marman Suite #145

20080310095 - Multi-stack storage module board assembly: A multi-stack storage module board assembly includes a host board having an electric connector, multiple brackets mounted on the host board and fastened to one another in a stack, multiple multimedia storage devices respectively mounted in the brackets, and adapter modules mounted on support arms in the brackets to electrically... Agent: Bacon & Thomas, PLLC

20080310097 - Blade device enclosure: A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the... Agent: Hewlett Packard Company

20080310098 - Circuit board: A circuit board is used in common for the first electronic apparatus as the first configuration and for the second electronic apparatus as the second configuration, and the circuit board includes an area which is used in common for installing the first electronic device in installing the circuit board into... Agent: Arent Fox LLP

20080310100 - Airflow adjustment in an electronic module enclosure: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.... Agent: Hewlett Packard Company

20080310099 - Microarchitecture controller for thin-film thermoelectric cooling: A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC... Agent: Trop, Pruner & Hu, P.C.

20080310101 - Double-walled enclosure with improved cooling: In one embodiment, an enclosure for housing electrical components, such as circuit boards or the like, has one or more double-walled sides that distribute a cooling fluid to the electrical components. Each of the double-walled sides has a cavity and the cavities may be coupled together along the sides where... Agent: Mendelsohn & Associates, P.C.

20080310102 - Methods and apparatus for compact active cooling: Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in... Agent: The Noblitt Group, PLLC

20080310103 - Air backflow prevention in an enclosure: An air backflow prevention member includes a frame assembly including a plurality of vanes and a plurality of stops. The plurality of vanes are rotatable between an open position, wherein the plurality of vanes are oriented oblique to a direction of airflow and in contact with the plurality of stops,... Agent: Hewlett Packard Company

20080310104 - Liquid-based cooling apparatus for an electronics rack: A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack.... Agent: Heslin Rothenberg Farley & Mesiti P.C.

20080310107 - Airflow path within an electronic module enclosure: An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear... Agent: Hewlett Packard Company

20080310105 - Heat dissipating apparatus and water cooling system having the same: A heat dissipating apparatus for a water cooling system includes a heat conducting base, a heat dissipating structure and a water block. The heat dissipating structure includes a heat pipe and a plurality of fins, the heat pipe has a first end and a second end, and the first end... Agent: Hdsl

20080310106 - Multi compartment green shelter: A multi compartment green shelter is disclosed. The multi compartment green shelter comprises a main housing divided into a plurality of chambers. Separators are provided in the chambers to divide the chambers into compartments. At least one cooling unit is provided in middle chamber to provide cooling effect to all... Agent: Sughrue Mion, PLLC

20080310109 - Cooling structure for high voltage electrical parts of a hybrid electric vehicle: The present invention provides a cooling structure for high voltage electrical parts of a HEV in which a plurality of high voltage electrical parts are fixedly arranged in parallel on a cross section of a cooling passage in a case where the plurality of the high voltage electrical parts are... Agent: Edwards Angell Palmer & Dodge LLP

20080310108 - External heat sink for electronic device: An external heat sink device that can be attached to an electronic device during periods of excess heat generation, such as during a gaming session, for example. The external heat sink device can be removed from the electronic device during times of relatively lower heat generation. Other external accessories can... Agent: Warren A. Sklar (soer) Renner, Otto, Boisselle & Sklar, LLP

20080310110 - System and method for mounting a cooling device and method of fabrication: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.... Agent: General Electric Company Global Research

20080310111 - Transpiration cooling for passive cooled ultra mobile personal computer: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and... Agent: Intel Corporation C/o Intellevate, LLC

20080310112 - System and method for providing dewpoint control in an electrical enclosure: A system and method is provided for an electrical component enclosure that controls the temperature of the coolant in the internal coolant loop through the enclosure to prevent the formation of condensation on the coolant tubes. Warm coolant is diverted from a heat exchanger to a mixing valve where it... Agent: Mcnees Wallace & Nurick LLC

20080310113 - Electronics rack and lithographic apparatus comprising such electronics rack: A lithographic apparatus having an electronics module and an electronics rack in which the electronics module is operationally housed is disclosed. The electronics rack includes an electrical connector to establish an electrical connection to a mating electrical connector of the electronics module and a cooling fluid connector to establish a... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20080310114 - Heat-transfer device for an electromagnetic interference (emi) shield using conductive bristles: In one embodiment, an apparatus for electronic equipment has a bristle pad having an anchor end and a free end, wherein the bristle pad has a plurality of flexible bristles each having an anchor end corresponding to the anchor end of the bristle pad and a free end corresponding to... Agent: Mendelsohn & Associates, P.C.

20080310115 - Metal screen and adhesive composite thermal interface: An improved thermal interface material for conducting heat away from an integrated circuit device into a heat sink is a composite material including a metal screen defining openings and a hardened structural bonding agent incorporated into the openings of the metal screen. The improved composite thermal interface material achieves outstanding... Agent: Delphi Technologies, Inc.

20080310116 - Heatsink having an internal plenum: A heatsink for conducting heat away from an electric module in thermal contact with the heatsink includes at least a first heatsink member joined to at least a second heatsink member by a weld joint to define a heatsink having an internal plenum. By replacing conventional adhesive and fastening means... Agent: Delphi Technologies, Inc.

20080310117 - Method and structure to improve thermal dissipation from semiconductor devices: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one... Agent: Cantor Colburn LLP - IBM Fishkill

20080310119 - Clip on heat sink: A heat sink according to an embodiment of the present invention can be attached to any device without printed circuit board (PCB) modification. The heat sink may clamp on device edges, which does not stress solder balls between the device and heat sink. The heat sink may be configured to... Agent: Hamilton, Brook, Smith & Reynolds, P.C.

20080310118 - Cpu heat sink mounting method and apparatus: The disclosure also provides a system for mounting an electronic component and associated heat sink to a board, including a support bracket operable to retain an electronic component and provide at least one electrical connection between a board and the electronic component, a support bracket connector configured to releasably connect... Agent: Baker Botts, LLP

20080310120 - Electric sub-assembly: An electric sub-assembly has an integrated circuit, which contains at least one power semi-conductor component and additional electronic components, the latter being interconnected and linked to connections by the conductors of a lead frame (1, 2, 3). The lead frame (1, 2, 3) has at least one cooling surface (3),... Agent: Baker Botts L.L.P. Patent Department

20080310121 - Electrical junction box: The present invention improves heat dissipation of an electrical junction box. An electrical junction box includes a housing which houses a control circuit board disposed perpendicular to a power distribution board. The control circuit board includes a control circuit constructed on one side of an insulating substrate, electrical components mounted... Agent: Oliff & Berridge, PLC

20080310122 - Thermal dissipating device: An exemplary thermal dissipating device is for cooling an electronic component of a circuit board. The thermal dissipating device includes a heat conductive plate with a first side and a second side opposite to the first side, a plurality of heat pipes, and a plurality of fin arrays. The heat... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080310123 - Toolless configuration of a computer enclosure: Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments... Agent: Hewlett Packard Company

20080310124 - Coupling arrangement for electronic device to a vehicle body: An electronic control module mounted to an adaptive vehicle mount or directly onto a car body. The control module includes a casing which may have at least one leverage tab integral with the casing. The casing also includes an integral fastening tab, and may act as a lever such that... Agent: Daimlerchrysler Intellectual Capital Corporation Cims 483-02-19

20080310125 - Method and apparatus for aligning and installing flexible circuit interconnects: A method and apparatus for aligning components on a module. A flexible circuit may be attached to a module in which a tooling apparatus is attached to the module. A plurality of circuit pads on a functional section of the flexible circuit is aligned by a first alignment structure located... Agent: Duke W. Yee

20080310126 - Blanking panel: A blanking panel includes a main body extending from a first end to a second end and adapted to cover a rack having at least two posts, a fastener portion at the end of each of the first and the second ends, and an alignment member at the end of... Agent: Schwegman, Lundberg & Woessner, P.A.

20080310127 - Enhanced packaging for pc security: A socket for coupling signals between an electrical component and a circuit board or equivalent has a mechanism that, when activated, attaches the electrical component to the socket so that it is not possible to remove the electrical component without damaging it. The mechanism may include a clamshell lid with... Agent: Marshall, Gerstein & Borun LLP (microsoft)

20080310128 - Variable height plug-in pads and equalizers: The electronic component mounts the circuitry and connector pins at the bottom of a substrate. The upper portion of the substrate has one or more weakened horizontal lines allowing the user to break off part of the upper portion of the substrate. Doing so allows a technician to shorten the... Agent: SocalIPLaw Group LLP

20080310129 - Structure of tag integrated circuit flexible board: A structure of a tag integrated circuit flexible board includes a base material, one surface thereof having an adhesive layer; and a plurality of integrated circuit flexible boards that are arranged adjacent to one another and adhered on the adhesive layer of the base material. The integrated circuit flexible board... Agent: Hdsl

20080310130 - Electronic apparatus: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080310131 - Electronic control unit with expanded blocks: An electronic control unit presenting: a printed circuit board, which supports an electric circuit, a plurality of electric/electronic components electrically connected to the electric circuit, and at least one connector electrically connected to the electrical circuit; a housing, which accommodates therein the printed circuit board and comprises a base which... Agent: Ostrolenk Faber Gerb & Soffen

20080310132 - Printed circuit board and manufacturing method thereof: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can... Agent: Staas & Halsey LLP

20080310133 - Printed wiring board: The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is... Agent: Edwards Angell Palmer & Dodge LLP

20080310134 - Method and apparatus for routing and distributing signals: A method and apparatus are disclosed for distributing multiple signals having audio and/or video components for processing by an audio and/or video processor, including a chassis having a midplane connection and number of slots for receiving plural circuit boards, where at least one of the circuit boards receives a combination... Agent: Buchanan, Ingersoll & Rooney PC

20080310135 - Shielded circuit assembly and method: A shielded circuit assembly includes first and second circuit support structure, e.g. circuit boards having electrical or electronic components thereon, flexible connection between the circuit support structures, e.g., a flexible printed circuit (FPC), flat flexible cable (FFC), or other connection, the first and second circuit support structures adapted for positioning... Agent: Warren A. Sklar (soer) Renner, Otto, Boisselle & Sklar, LLP

20080310136 - Optical transceiving module: A pulling structure for an optical transceiving module is disclosed. The pulling structure includes a latch base, a latch, a linking member, and a pulling rod. The latch base is mounted on the optical transceiving module. The latch is mounted in the latch base. The linking member is coupled to... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080310137 - Function element, method for manufacturing the function element, electronic device equipped with the function element, and method for manufacturing the electronic device: In the present invention, a microphone body 20 has recesses 20b. Bases 22 included in terminal portions are embedded in the recesses so that element-side terminals 23 fixed to the bases are electrically connected to the microphone body 20. The element-side terminals 23 are resiliently deformable terminals. Thus, the element-side... Agent: Brinks Hofer Gilson & Lione

20080310138 - Electronic enclosure having elastomeric circuit board standoffs: Electronic enclosures, enclosed circuit board assemblies, and computers having elastomeric truncated standoffs are provided. More particularly, systems and devices may comprise a computer case in which a plurality of elastomeric standoffs are mounted so as to support one or more circuit boards. The case may be formed of a first... Agent: HoustonIPDepartment Jackson Walker L.L.P.

20080310139 - Electromagnetic interference shielding apparatus: A shielding apparatus is disclosed suitable for use in providing electromagnetic interference shielding for an electrical component on a substrate. The shielding apparatus includes a frame that is at least partially drawn in construction and is configured for installation to the substrate. Side walls of the frame generally surround the... Agent: Harness, Dickey, & Pierce, P.l.c

20080304187 - Fault condition protection: A power converter controller circuit is disclosed. In one aspect, a power converter controller circuit includes a control circuit to generate a switching signal to be coupled to a power switch to control power delivered to an output of a power converter. A timing circuit is to be coupled to... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080304188 - Wind power generation system and control method thereof: In a wind power generation system, an energy consuming unit is connected to a DC part of a generator-side converter. A shunt circuit is connected between the generator-side converter and a rotor of an AC-excited power generator. In the event of system failure, the switching operation of the converter is... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080304189 - Protection for permanent magnet motor control circuits: Methods and apparatus are provided for protecting a motor control circuit in a permanent magnet electric motor system. The permanent magnet electric motor system includes a permanent magnet electric motor having a predetermined number of windings corresponding to the phases of the permanent magnet electric motor and a direct current... Agent: General Motors Corporation Legal Staff

20080304190 - Aircraft applicable circuit imbalance detection and circuit interrupter and packaging thereof: The aircraft applicable current imbalance detection and circuit interrupter interrupts an electrical circuit when a current imbalance is sensed. The current imbalance detection and circuit interrupter includes a housing, power supplies, a sensor system for sensing a current imbalance at the line side of the electrical circuit, a logic controller... Agent: Fulwider Patton LLP

20080304191 - Threshold voltage method and apparatus for esd protection: An electrostatic discharge protection circuit comprises a comparator coupled between a power supply terminal and ground. The comparator responds to an electrostatic discharge event producing a trigger signal at a comparator output. The comparator comprises a first and second current mirror. The first and second current mirrors each comprise a... Agent: Schwegman, Lundberg & Woessner / Atmel

20080304192 - Low voltage head room detection for reliable start-up of self-biased analog circuits: A method and structure for preventing operation of a circuit in a high current operating region by disabling a start-up circuit until a power supply headroom is detected at a predetermined voltage level.... Agent: Andrew M. Calderon Greenblum & Bernstein, P.L.C

20080304193 - Voltage input circuit: The present invention is to provide a voltage input circuit applied to a notebook computer, which includes a first voltage terminal for receiving and outputting voltage, a first protection loop connected to the first voltage terminal and a second voltage terminal, a second protection loop connected between the first protection... Agent: Bacon & Thomas, PLLC

20080304194 - Power supply control apparatus having a function supplying power supply voltage: A microprocessor commonly receives at an A/D port the potentials of the power supplies output from a plurality of types of power supplies (a power supply for HDMI, a power supply for LSI, a power supply for an audio driver IC, and a power supply for a tuner). The A/D... Agent: Osha Liang L.L.P.

20080304195 - Power abnormal protection circuit: A power abnormal protection circuit includes a power detection unit, a voltage drop correction unit, a drop out detection unit, a delay unit and a delay masking unit. By detecting an input power average value of a power supply occurring of a brown out condition can be determined. The power... Agent: Joe Mckinney Muncy

20080304196 - Electrical circuit with incendive arc prevention means: An electrical circuit comprising a power supply, a load and an incendive arc prevention means comprising a monitoring means and an isolation means, in which the monitoring means monitors the electrical circuit by means of a reactor means, in which if a short circuit with the potential to cause an... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20080304197 - Drive circuit of voltage driven element: A protection circuit is installed between a gate terminal (a control terminal) and an emitter terminal (a ground terminal) of a voltage driven element generally called a power device. The protection circuit is structured as a duplex protection system in which a first discharge circuit is configured to perform a... Agent: Young & Basile, P.C.

20080304198 - Power supply apparatus, power supply apparatus control method: A power supply apparatus comprises a current limiting unit connected in series between a power source and a power supply circuit that limits output current of the power source; a first switch connected in series with the current limiting unit; a second switch connected in parallel with the current limiting... Agent: Cowan Liebowitz & Latman P.C. John J Torrente

20080304199 - Software-implemented overcurrent protection embedded in a battery pack: An overcurrent protection mechanism is provided for a battery pack that removably attaches to a power tool. The mechanism includes: one or more battery cells disposed in a battery pack; a current sensor configured to sense current supplied by the battery; a switch in a circuit path with the battery... Agent: Harness Dickey & Pierce, P.L.C

20080304200 - Insulated surge suppression circuit: A potted electrical circuit is enclosed within a housing and has a first and second fiberglass layer that is laid upon a top surface of the potted electrical circuit. A lid of the housing seals the electrical circuit there within and an opening formed in a side wall allows circuitry... Agent: Larson And Larson

20080304201 - Voltage signal converter circuit and motor: In a voltage signal converter circuit, a peak hold circuit, which is configured with an operational amplifier, a diode, and a capacitor, receives a sensor voltage signal and outputs a peak voltage signal. A bottom hold circuit, which is configured with an operational amplifier, a diode, and a capacitor, receives... Agent: Nidec Corporation C/o Keating & Bennett, LLP

20080304202 - Multi-layer capacitor and integrated circuit module: It is intended to provide a multi-layer capacitor capable of obtaining good noise suppression characteristic at a high frequency band. The multi-layer capacitor has a structure that: a first conductor layer having a first extraction part connected to the first external electrode and a second extraction part connected to the... Agent: Knobbe Martens Olson & Bear LLP

20080304203 - High capacitance density vertical natural capacitors: Disclosed are embodiments of a capacitor with inter-digitated vertical plates and a method of forming the capacitor such that the effective gap distance between plates is reduced. This gap width reduction significantly increases the capacitance density of the capacitor. Gap width reduction is accomplished during back end of the line... Agent: Frederick W. Gibb, Iii Gibb & Rahman, LLC

20080304204 - Multi-layered ceramic electronic component: In a sintered ceramic body including side gap portions arranged between sides of first and second internal electrodes and first and second side surfaces of the sintered ceramic body and between sides of the effective layer portion and the first and second side surfaces of the sintered ceramic body, regions... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080304205 - Intertwined finger capacitors: Capacitive structures in integrated circuits are disclosed. The capacitive structures are formed on a substrate. Each capacitive structure includes a first conductive finger and a second conductive finger. The first and second conductive fingers are arranged in parallel with each other and separated from each other by a dielectric material.... Agent: Qualcomm Incorporated

20080304207 - Low temperature double-layer capacitors: Double-layer capacitors capable of operating at extremely low temperatures (e.g., as low as −75° C.) are disclosed. Electrolyte solutions combining a base solvent (e.g., acetonitrile) and a cosolvent are employed to lower the melting point of the base electrolyte. Example cosolvents include methyl formate, ethyl acetate, methyl acetate, propionitrile, butyronitrile,... Agent: Canady & Lortz LLP

20080304206 - Raw oil composition for carbon material for electric double layer capacitor electrode: The present invention provides a raw oil composition for manufacturing a carbon material for electric double layer capacitor electrodes, characterized in that the raw oil composition comprises 25 wt % or more of a saturated component and 16 wt % or less of an asphaltene component among the saturated component,... Agent: Knobbe Martens Olson & Bear LLP

20080304208 - Electrolytic capacitor and electrolyte thereof: The present invention provides means for forming an oxide film on a metal surface, means for repairing a defect of an oxide film, a high-performance electrolytic capacitor using the means, and an electrolyte of the capacitor. Namely, the prevent invention provides a method for easily forming an oxide film on... Agent: Brinks Hofer Gilson & Lione

20080304209 - Capacitor liner: A capacitor is presented that includes a housing, an electrode assembly, a liner, and a fill port. The liner is located between the housing and the electrode assembly. The liner includes a recessed portion. A fill port extends through the housing across from the recessed portion in the liner. A... Agent: Medtronic, Inc.

20080304210 - Solid-state electrolytic capacitor: A solid-state electrolytic capacitor including a stacked body of a solid-state electrolytic capacitor element unit and an electrode conversion board. The unit includes two kinds of solid-state electrolytic capacitor elements. Each of first kind of solid-state electrolytic capacitor elements uses an anode body having a total thickness of an aluminum... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080304211 - Electronic component housing unit: To perform the temporary mounting of an electronic component housing unit, a clamp is inserted into a clamp hole formed in the load bearing face of a vehicle body. Then, a screw through hole in a grounding terminal is aligned with a screw hole formed in the load bearing face,... Agent: Sughrue-265550

20080304212 - System and method of enabling power output from a power pedestal: A system enables power output from a power pedestal. The system includes a number of power pedestals, a card reader structured to receive credit or debit card information from a credit or debit card, and a first interface to another system structured to approve a transaction based upon the credit... Agent: Martin J. Moran Eaton Electrical, Inc.

20080304213 - Process for manufacturing a cover: A process of manufacturing a cover for an electronic device, the process comprising forming the cover for the device, incorporating electrical circuitry into the cover during the formation, and providing on the cover an integral connector structure for connecting the electrical circuitry to an electronic component.... Agent: Harrington & Smith, PC

20080304214 - Electronic apparatus: An electronic apparatus is provided with a housing including a top wall and a side portion extending from an edge of the top wall, a keyboard, and a keyboard placing portion on which the keyboard is placed, the keyboard placing portion including a bottom surface provided in the top wall.... Agent: Knobbe Martens Olson & Bear LLP

20080304215 - Communication device with stickup structure: The present invention provides a communication device comprising an upper panel having a display unit disposed thereon, and a lower panel having a plurality of keys disposed thereon; and a stickup structure having a first rail disposed on the lower surface of the upper panel and a second rail disposed... Agent: Birch Stewart Kolasch & Birch

20080304221 - Display unit: A display unit comprises a display unit body, a display part displaying information, a first button so provided as to protrude from the bottom surface of display unit body and a second button provided on the upper surface of display unit body. A first function is realized by pressing a... Agent: Olson & Cepuritis, Ltd.

20080304220 - Inverter comprising a casing: The invention is directed to an inverter including a casing (1) with at least two chambers (2, 3), the one chamber (3) comprising the display (11) of a communication unit, said display (11) being pivotally disposed in the chamber (3).... Agent: Pyle & Piontek Attn: Thomas R. Vigil

20080304219 - Light emitting diode display: An LED display includes a fixing frame and a plurality of LED modules. The fixing frame has at least one rotating shaft. The LED modules are correspondingly pivoted on the rotating shaft, and each of the LED modules is adapted to rotate around the corresponding rotating shaft. The LED modules... Agent: Jianq Chyun Intellectual Property Office

20080304217 - Portable electronic device: A portable electronic device includes a first body, a second body and a guiding assembly. The first body is disposed adjacently to the second body. The second body has a groove with a positioning portion. The guiding assembly has a guiding part fixed at the first body. The guiding part... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080304216 - Portable electronic device with single printed circuit board: A portable electronic device (100) includes an upper housing (40), a circuit board (10), a display (12), a battery (14), and a lower housing (20). The upper housing defines a display section (424) therein. The circuit board has a top surface (11) and a bottom surface (13) at an opposite... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080304218 - Sliding module having locking function in portable electronic device: A sliding module includes a main housing; a sliding housing on the main housing, a push rod interposed between the main housing and the sliding housing to provide an elastic force to slide the sliding housing, a support member mounted on the main housing and rotatably or slidably coupled with... Agent: H.c. Park & Associates, PLC

20080304223 - Adaptable plug-in mezzanine card for blade servers: A computer system is provided that includes a chassis, a system board coupled to the chassis, and a first connector extending from the system board at a first height and configured to receive a first printed circuit board, wherein the first printed circuit board is configured to be parallel to... Agent: Hewlett Packard Company

20080304224 - Apparatus and methods for automatically positioning an interface module in a rack system: Apparatus and methods for automatically positioning an interface module in a rack system are disclosed. An exemplary method includes biasing the interface module in a predetermined position. The method also includes automatically moving the interface module from the predetermined position when accessing removable blade enclosures in the rack system. The... Agent: Hewlett Packard Company

20080304222 - Portable computer: The present invention discloses a portable computer that includes a main body substantially in the form of a panel and a supporting base separately disposed on both sides of the main body and pivotally coupled to a position proximate to the bottom of the main body, such that the main... Agent: Bacon & Thomas, PLLC

20080304225 - Thumb drive with retractable usb connector: A thumb drive has an elongated housing enclosing an assembly of a coupled memory and male USB connector constrained on a translation mechanism in the direction of the long dimension of the housing, with an opening at a first end of the housing through which the male USB connector may... Agent: Central Coast Patent Agency, Inc

20080304226 - Hard disk securing mechanism: A hard disk securing mechanism is disclosed. The securing mechanism comprises a securing seat for mounting to the housing of the computer; a plurality of holding members for locking the lateral sides of the hard disk to the securing seat to prevent vibration of the hard disk in operation; and... Agent: Leong C Lei

20080304227 - Mounting apparatus for data storage device: A mounting apparatus is provided to readily fix a data storage device defining at least one hole in place. The mounting apparatus includes a bracket fastened to a computer enclosure, and the bracket includes a side panel and at least one elastic tab formed at or attached to the side... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080304228 - Multi-purpose structural support i/o member for a server: The teachings of the present disclosure provide a housing for a modular component of an information handling system. The housing may include a wall member generally defining a first plane, one or more holes formed in the wall member, and one or more structural support members adjacent to the one... Agent: Baker Botts, LLP

20080304229 - Air-pressure-dependent control of cooling systems using a shared air pressure sensor: Systems and methods provide altitude-dependent fan control for a plurality of electronic subsystems using a shared air pressure sensor. Each server or multi-server chassis of a rack system is a subsystem of the rack system. Each subsystem receives its own on-board fan or blower module. The shared air pressure sensor... Agent: Ibm Corporation (ss/nc) C/o Streets & Steele

20080304230 - Heat-sink structure with small fin gap area: A heat-sink structure includes a base and fins, the latter defining gaps with a cross-sectional area less than 24 mm2.... Agent: Hewlett Packard Company

20080304232 - Method for controlling system temperature: A computer-implemented method for cooling a modular computer system having multiple cooling devices and multiple heat-generating modules is disclosed. The method includes the steps of determining the number of cooling device installed in the system; determining the positions of the installed cooling devices; applying predefined cooling device placement rules and... Agent: Hewlett Packard Company

20080304233 - Method for monitoring temperature of computer components to determine ambient chassis temperature: A computer-implemented method for monitoring temperature of a blade server to determine ambient temperature includes the steps of determining temperatures of each of any installed processing components, and determining a temperature of an administrator component. If there are no processing components installed in the computer chassis, the method reports the... Agent: Hewlett Packard Company

20080304231 - Portable computer: A portable computer having a decorative cover is disclosed. The portable computer includes a main housing and a display side housing. The display side housing is openably and closably attached to the main housing. Several apertures for forced air cooling are formed in a bottom and a side of the... Agent: Dillon & Yudell LLP

20080304234 - Fan module latching device: A fan module latching device includes a bezel, a base adapted for enclosing a fan, and a handle assembly rotatably retained between the bezel and the base. The handle assembly has a rearwardly depending cam member and a frontwardly extending handle for actuating the handle assembly between a neutral position... Agent: Hewlett Packard Company

20080304235 - Electronic module configured for air flow therethrough and system including same: An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The capacitors are positioned within the chassis, and at least... Agent: Elsa Keller

20080304236 - Maintaining cooling system air above condensation point: A cooling system cools air that flows through an electronic system to cool heat generating components. The cooling system maintains a temperature of the air near a set point above a condensation point.... Agent: Hewlett Packard Company

20080304237 - Electronic component built-in module and method for manufacturing the same: On a first component built-in substrate having built-in electronic components, a second component built-in substrate having built-in electronic components is stacked, and further on the second component built-in substrate, a radiator is attached. The second component built-in substrate includes a wiring layer with electronic components mounted on a main surface... Agent: Mcdermott Will & Emery LLP

20080304238 - Electronic device having passive heat-dissipating mechanism: The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of... Agent: Madson & Austin

20080304239 - Electrical card connector: An electrical card connector (100) includes a connector body (1) mounted a plurality of terminals (11) therein. A pair of guiding arms (21) are arranged on opposite sides of the connector body (1) and defines a receiving space between the connector body (1) and the guiding arms (21). An ejector... Agent: Wei Te Chung Foxconn International, Inc.

20080304240 - Received information transferring apparatus, receiving apparatus and received information transferring system: In order to maintain stability when connected, a cradle 27 includes an engagement part 33 for engaging with regard to a unit connection part which allows an antenna unit having at least a receiving antenna to be detachably connected to a receiving unit constituting a receiving apparatus together with the... Agent: Ostrolenk Faber Gerb & Soffen

20080304241 - Electronic device, a housing part, and a method of manufacturing a housing part: The present invention relates to an electronic device (1) which comprises a modular housing (2) comprising a plurality of stacked housing parts (4, 6) that are mechanically interconnected by connection means (8, 10), and which comprises electronic parts (16, 26) having contact portions (30, 32) for providing electrical contact between... Agent: Philips Intellectual Property & Standards

20080304242 - Stack module, card including the stack module, and system including the stack module: Provided are a high reliability stack module fabricated at low cost by using simplified processes, a card using the stack module, and a system using the stack module. In the stack module, unit substrates are stacked with respect to each other and each unit substrate includes a selection terminal. First... Agent: Marger Johnson & Mccollom, P.C.

20080304243 - Circuit board: A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers,... Agent: Birch Stewart Kolasch & Birch

20080304244 - Electrical connector having improved housing: An electrical connector (1) is adapted for electrically connecting an electronic package (3) to a circuit board (4). The electrical connector includes a housing (5) having a number of contacts retained therein, a number of hook portions (24) rising from the housing and resisting against an upper surface of the... Agent: Wei Te Chung Foxconn International, Inc.

20080304245 - Semiconductor package and method for discharging electronic devices on a substrate: A method for discharging an electronic device on a substrate is provided. A metal pin mounted on a wire bonder is used to touch with a specific finger disposed on the substrate which is in electrical connection with the electronic device. As a result, the electric charge previously stored in... Agent: Lowe Hauptman Ham & Berner, LLP

20080304247 - Boss structure and casing of electronic device using the same: A boss structure including a boss and a metal layer is provided. The boss has a flat surface located on a top end of the boss and a chamfer connected to the flat surface. The metal layer wholly covers an exposed surface of the boss. Since the boss has the... Agent: J C Patents, Inc.

20080304246 - Emi shielding of digital x-ray detectors with non-metallic enclosures: An imaging system is provided having an EMI shield configured to shield one or more imaging components. The EMI shield includes a first material having a first plurality of conductive elements integrally formed within a first nonconductive material and also includes a generally nonconductive exterior. A method is provided for... Agent: Ge Healthcare C/o Fletcher Yoder, PC

20080297956 - Electronic ballast protection: A method of electronic ballast protection including providing an electronic ballast having an AC/DC converter 104 with an electronic ballast input and a mains voltage connection 103 connectable to a mains voltage 102, an inverter 120 operably connected to the AC/DC converter 104 and having an electronic ballast output 125... Agent: Philips Intellectual Property & Standards

20080297957 - System and method for programming and controlling over current trip point limits in voltage regulators: A system and method for controlling an over current protection trip point for a voltage regulator includes an input for receiving a monitored operating parameter of the voltage regulator. Control logic responsive to this input generates a digital current control signal. A digital to analog controller converts the digital current... Agent: Howison & Arnott, L.l.p

20080297958 - Motor controller and electric power steering apparatus: When a failure of an electric current flow occurs in any one of phases, a microcomputer calculates a d-axis current command value that changes along a tangent curve with predetermined rotation angles as asymptotic lines. The microcomputer continuously outputs a motor control signal using two phases other than the phase... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080297959 - Motor driving circuit: A motor driving circuit comprising: a synchronous rectification driving circuit to carry out synchronous rectification, to energize a driving coil connected between a first connection point at which a first source and first sink side transistors are connected in series and a second connection point at which a second source... Agent: SocalIPLaw Group LLP

20080297960 - Integrated circuit and electrostatic discharge protection circuit: An integrated circuit and a protection circuit capable of protecting electrostatic discharge (ESD) damage. The integrated circuit comprises a first pad, a ground pad, a second pad, a device circuitry, a discharging unit, and a discharging controller. The discharging unit comprises first and second transistors in series. The discharging controller... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080297961 - Systems, circuits, chips and methods with protection at power island boundaries: Integrated circuits where the standard isolation cell, at power island boundaries, also includes a protection device, which clamps transient voltages.... Agent: Brinks Hofer Gilson & Lione/sandisk

20080297962 - Bus interface and method for short-circuit detection: Embodiments of bus interface circuitry and methods for short circuit detection are generally described herein. Other embodiments may be described and claimed. In some embodiments, the bus interface circuitry comprises logic circuitry to compare a driver stage output signal at a bond pad to internal reference voltages to generate control... Agent: Lee & Hayes, PLLC

20080297963 - Adjustable over current protection circuit with low power loss: Disclosed is an adjustable over current protection circuit which advances the timing of enabling an over current protection mechanism according to an input voltage, therefore the delay problem resulting from the non-instant response of the over current protection circuit is compensated with a low power loss. The over current protection... Agent: North America Intellectual Property Corporation

20080297964 - Drive device driving a plurality of semiconductor elements having respective reference potential electrodes coupled via a main electrode unit and alternating current power supply device provided with the drive device: A first bypass circuit has first and second nodes. The first load circuit is connected between the first node and a signal input terminal of the second drive circuit. The second load circuit has substantially the same impedance as the first load circuit, and is connected between the second node... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080297965 - Control system and method with constant maximum current for power converter protection: System and method for protecting a power converter. The system includes a first comparator configured to receive a threshold signal and a first signal and to generate a comparison signal. The first signal is a sum of a second signal and a third signal, and the third signal is associated... Agent: Jones Day

20080297966 - Control and protection system for an output of automation equipment: The invention relates to an electronic control and protection system for an output channel of automation equipment. It comprises: i) a device for switching (10) an electrical load (C) comprising an MOS switching transistor (T5), the source of which is connected to a positive voltage terminal (P) via a resistor... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080297967 - Lightning protection system for an aircraft composite structure: An apparatus comprises a wall, an internal structure, and a fastener. The wall has a conductive surface and a countersunk hole. The countersunk hole passes through the internal structure. The fastener has an interference fit within the countersunk hole.... Agent: Duke W. Yee

20080297968 - Surge discharging device: A surge discharging device for releasing electric surge due to high voltage so as to avoid destroy of an electric apparatus having the device, the surge discharging device comprises a body having a hollow space; a channel connected between the hollow space and an exterior of the body; two terminals... Agent: Ohara Takeyoshi

20080297969 - Resistive films for electrode peak-field suppression: The present invention relates to an arrangement comprising at least one high potential electrode with a high potential in terms of absolute value, e.g. comprising substantially sharp edges and which may be exposed to a high electrostatic field or a high potential. It comprises at least one low potential electrode... Agent: Ericsson Inc.

20080297970 - Electronic disabling device having adjustable output pulse power: An electronic disabling device with multiple adjustable power levels and a method of providing the same. The electronic disabling device includes an initial step-up voltage circuit coupled to receive an initial power from a battery and a final step-up transformer (e.g., a plain transformer, an autoformer, etc.) adapted to provide... Agent: Christie, Parker & Hale, LLP

20080297971 - Plasma processing system esc high voltage control: A plasma processing system is disclosed. The plasma processing system may include an electrostatic chuck (ESC) positioned inside a plasma processing chamber and configured to support a wafer. The ESC may include a positive terminal (+ESC) for providing a first force to the wafer and a negative terminal (−ESC) for... Agent: Ipsg, P.C.

20080297972 - Capacitor structure with variable capacitance, and use of said capacitor structure: A capacitor structure with variable capacitance, has at least one capacitor. More specifically, the structure has a capacitor electrode, a capacitor counter-electrode arranged opposite said capacitor electrodes at a variable capacitor electrode distance in relation hereto and at least one actuator for varying the capacitor electrode distance, and an actuator... Agent: Staas & Halsey LLP

20080297973 - Varactors including interconnect layers: In an embodiment of the present invention is provided a varactor comprising a substrate, a bottom electrode positioned on a surface of the substrate, a tunable dielectric material positioned adjacent to and extending over the bottom electrode forming a step and in contact with a top electrode, and an interconnect... Agent: Law Office Of William J. Tucker

20080297974 - Method of manufacturing capacitive elements for a capacitive device: A method of manufacturing capacitive elements for a capacitive device which comprises one or more layers is provided. At least one layer is etched from a first surface to a second surface thereof to form two sections of the layer, such that the sections are movable relative to one another,... Agent: Edell, Shapiro & Finnan, LLC

20080297975 - Vertical parallel plate capacitor structures: Vertical parallel plate (VPP) capacitor structures that utilize different spacings between conductive plates in different levels of the capacitor stack. The non-even spacings of the conductive plates in the capacitor stack decrease the susceptibility of the capacitor stack of the VPP capacitor to ESD-promoted failures. The non-even spacings may be... Agent: Wood, Herron & Evans, LLP (ibm-bur)

20080297976 - Multilayer capacitor: A first terminal electrode has a first electrode portion disposed on a first face and connected to a first internal electrode, and a second electrode portion disposed on a third face and connected to the first electrode portion. A second terminal electrode has a first electrode portion disposed on a... Agent: Oliff & Berridge, PLC

20080297977 - Multilayer capacitor: A first terminal electrode has a first electrode portion disposed on a first face and connected to a first internal electrode, and a second electrode portion disposed on a third face and connected to the first electrode portion. A second terminal electrode has a first electrode portion disposed on a... Agent: Oliff & Berridge, PLC

20080297978 - Method for adjusting capacitance value of built-in capacitor in multilayer ceramic substrate, and multilayer ceramic substrate and method for manufacturing the same: In a multilayer ceramic substrate having a built-in capacitor provided in a ceramic laminate including a plurality of ceramic layers laminated to each other, the built-in capacitor being formed of a first capacitor electrode, a second capacitor electrode, and one of the dielectric glass ceramic layers, the capacitance value of... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080297979 - Dielectric ceramic composition and electronic device: A dielectric ceramic composition comprising BamTiO2+m (note that “m” satisfies 0.99≦m≦1.01) and BanZrO2+n (note that “n” satisfies 0.99≦n≦1.01), an oxide of Mg, an oxide of R (note that R is at least one selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm,... Agent: Oliff & Berridge, PLC

20080297981 - Capacitor: The present invention is characterized by obtaining a high charge/discharge capacity upon high rate charging/discharging in a hybrid capacitor having characteristics of both an electric double layer capacitor and a lithium-ion secondary battery. Specifically, the present invention is a capacitor comprising: a positive electrode 1 composed of a polarizable electrode... Agent: Masuvalley & Partners

20080297980 - Layered carbon electrodes useful in electric double layer capacitors and capacitive deionization and methods of making the same: Carbon electrodes for use in, for example, Capacitive Deionization (CDI) of a fluid stream or, for example, an electric double layer capacitor (EDCL). Methods of making the carbon electrodes are also described. The carbon electrode comprises an electrically conductive porous carbon support and a carbon cover layer comprising carbon particles... Agent: Corning Incorporated

20080297982 - Solid electrolytic capacitor and method of manufacturing the same: One aspect of the embodiment provides a solid electrolytic capacitor that comprises: an anode; a dielectric layer formed on the surface of this anode; an electrically-conductive polymer layer formed on the dielectric layer; and a cathode layer formed on this electrically-conductive polymer layer. At least manganese is contained in the... Agent: Mots Law, PLLC

20080297983 - Electrode sheet for capacitors, method for manufacturing the same, and electrolytic capacitor: A method for manufacturing an electrode sheet for capacitors includes the step of thermally spraying mixed powder 6 in which intermetallic compound powder of Al and valve action metal other than Al, such as Ti, Zr, Nb, Ta and Hf, and Al powder are mixed, onto a surface of an... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080297984 - Conductive paste for solid electorlytic capacitor electrode and process for producing solid electolytic capacitor electrode using the same: A conductive paste for a solid electrolytic capacitor electrode contains an electroconductive powder having a mean particle size of no more than 1 μm and at least 90% thereof having a particle size of at least 0.3 μm; an organic binder; and a solvent.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080297985 - Electronic assemblies without solder and methods for their manufacture: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The... Agent: The Tpl Group

20080297986 - Magnetic latch for a voice coil actuator: Magnetically latching and releasing a voice coil actuator for controlling electrical switchgear. The voice coil actuator includes a voice coil magnet disposed on a common longitudinal axis with respect to a voice coil assembly. A coil of the voice coil assembly exerts a magnetic force on the voice coil assembly,... Agent: King & Spalding LLP

20080297987 - Intuitive labeling schemes for structured cabling solutions: Structured cabling solutions may include techniques and systems usable to route, organize, and otherwise manager wires, optical fibers, and other cables. Structured cabling solutions may include one or more chassis coupled to and movable relative to a frame to provide access to signal connectors on the chassis. Structured cabling solutions... Agent: Lee & Hayes, PLLC

20080297990 - Electronic apparatus: According to one embodiment, an electronic apparatus includes: a main body including a housing; a wiring connection port which is provided in the housing of the main body and which has an insertion passage into which a wiring connection plug is to be inserted; one lock section whose portion protrudes... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080297993 - Electronic device mounting structure: An electronic device mounting structure for fitting an ECU (electronic device) in an open space formed in a device mounting housing and for holding the ECU fitted in the open space by a holding finger formed on the device mounting housing, includes a stopper formed in the device mounting housing... Agent: Kanesaka Berner And Partners LLP

20080297991 - Electronic device with protection cover: An electronic device including a main body, a cap body, a flexible printed circuit board and a protection cover is provided. The cap body disposed on the main body is capable of moving between a first position and a second position on the main body and rotating with respect to... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080297992 - Hollow sealing structure and manufacturing method for hollow sealing structure: A hollow sealing structure includes, a substrate, a functional element portion disposed on a principal surface of the substrate, and a covering portion disposed over the principal surface of the substrate to form a hollow portion in which the covering portion covers the functional element portion, the covering portion including... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080297989 - Housing for electronic device and method of making the same: A housing (100) for an electronic device includes an opaque base (10). The base has a plurality of blind holes (120) and a number of through holes (140) defined therein. Each through hole communicates with a corresponding blind hole. The through holes are arrayed in a determined pattern.... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080297988 - Interconnect module with integrated signal and power delivery: An electrical connector assembly includes a first connector including a housing holding at least one power contact and at least one signal contact. The housing includes a guide post. The at least one signal contact includes an IDC terminating end for direct termination of a ribbon cable to the first... Agent: Robert J. Kapalka Tyco Electronics Corporation

20080297994 - Keypad assembly and portable electronic device using the same: A keypad assembly (15) applied to a portable electronic device and mounted in a shell of the portable electronic device is provided. The keypad assembly comprises a keypad cover (151) and a printed circuit board (152). The keypad cover is provided with at least one contact portion (1516) thereon. The... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080297995 - Portable electronic device: A portable electronic device includes a first body, a second body, a guiding assembly, a first elastic element and a connecting part. The first body has a track portion and a protrudent block, and the second body has a fastening part. The guiding assembly has a sliding rod and a... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080297998 - Display apparatus: A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is... Agent: Ked & Associates, LLP

20080297999 - Display apparatus: A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is... Agent: Ked & Associates, LLP

20080298000 - Display apparatus: A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is... Agent: Ked & Associates, LLP

20080298001 - Display apparatus: A display apparatus is provided. A frame is fixed and supported at the rear of a front panel forming the front portion of the display apparatus, and a separate bracket member is not mounted on the edges of the front panel. Thus, the front exterior of the display apparatus is... Agent: Ked & Associates, LLP

20080297997 - Display apparatus and system for sporting and entertainment venues: A display apparatus for mounting to a back surface of a seating structure consisting of a housing formed with a rear wall for mounting to the back surface of the seating structure, a pair of side walls extending from the rear wall to a front wall, and a top wall... Agent: Ralph A. Dowell Of Dowell & Dowell P.C.

20080297996 - Filter frame and display head assembly: A filter frame is provided suitable for use in conjunction with a light filter and a display head assembly including a display head and a bezel. The filter frame comprises frame member configured to removably hold the light filter between the display head and the bezel. At least one guide... Agent: Honeywell International Inc.

20080298003 - Plasma display apparatus: A plasma display apparatus includes a front case coupled to a rear case, the front and rear cases facing each other, a plasma display panel between the front and rear cases, and a chassis attached to the front case, the chassis being between the plasma display panel and the rear... Agent: Lee & Morse, P.C.

20080298002 - Portable electronic apparatus: A portable electronic apparatus including a host and a display unit pivotally connected to the host is provided. The display unit includes a panel module, a first plate having a plate body and a plurality of positioning structures provided on the plate body, and a second plate. The panel module... Agent: Jianq Chyun Intellectual Property Office

20080298004 - Multi-stage alignment guidepin: An alignment guidepin comprises a pre-alignment portion, an alignment portion, and a release portion. The pre-alignment portion provides gross alignment for a connection between a connecting module of a server and a connector of a computer server chassis. The alignment portion is connected to the pre-alignment portion having a first... Agent: Larson Newman Abel Polansky & White, LLP

20080298005 - Mounting apparatus for storage device: A mounting apparatus includes a bracket, a frame for receiving a storage device, and a fixing member mounted on the frame for fixing the storage device to the frame. The bracket includes two sidewalls each forming two inward bent sliding rails. The frame includes two elastic arms, and each of... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298006 - Mounting socket for memory card and sim card having integrated sensing switch: A mounting socket includes an insulating socket body provided with a subscriber identification module card insertion recess and a memory card insertion recess. A metal housing coupled to an upper surface of the socket body defines the subscriber identification module card insertion recess. A lower metal plate coupled to a... Agent: Barley Snyder, LLC

20080298007 - Bracket structure: A bracket structure is utilized to assemble an electronic device into a case. The bracket structure includes a main bracket, a side bracket, a pin, and a guiding groove. The main bracket has a chassis and a bracket wall. The electronic device would be assembled on the chassis. The side... Agent: Rabin & Berdo, PC

20080298008 - Computer enclosure with disk drive bracket: A computer enclosure comprising a chassis (3) and a disk drive bracket (1). The chassis comprising a bottom panel (32), at least one protrusion (321) disposed on the bottom panel, the protrusion comprising a neck portion (323) and an expanded head portion (325), which having a top surface (327). The... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298009 - Removable hard disk module: A removable hard disk module is provided which is mainly applicable to a server system. The removable hard disk module includes a server rack and a hard disk removable enclosure which is detachable form the server rack. The server rack has at least one pair of accommodation slots with threads... Agent: Volentine & Whitt PLLC

20080298010 - Card holder and bracket in computer system: In a computer system, a card holder is removably attached to a bracket to hold an add-in card in an I/O connector. The card holder is capable of being slid onto the bracket and a side edge of the add-in card.... Agent: Hewlett Packard Company

20080298011 - Electronic apparatus and cooling unit: According to one embodiment, an electronic apparatus includes a first heat receiving plate opposed to one side of a circuit board and an exothermic component mounted on the circuit board, and thermally connected to the exothermic component, a second heat receiving plate opposed to another side of the circuit board,... Agent: Knobbe Martens Olson & Bear LLP

20080298012 - Holding base for a radiator assembly: A holding base for a radiator assembly includes a frame, at least a secure part and at least a threaded part. The frame is attached to a circuit board and provides a space for receiving a heat generating component on the circuit board. The secure part provides an elongated projection... Agent: G. Link Co., Ltd.

20080298014 - Modular electronic enclosure: A modular electronic enclosure having a maximum height of 1 U and a width adapted to fit between the rails of a 19 inch rack is adapted to receive up to ten single-width Advanced Mezzanine Cards (AMCs) installed horizontally in the enclosure. Some modules that are not compliant with AMC... Agent: Phillip M. Wagner

20080298013 - Resilient fastener and heat dissipation apparatus incorporating the same: A heat dissipation apparatus includes a retention module (10), a heat sink (20) disposed on the retention module, a fastening cover (23) covering the heat sink, and a plurality of fasteners (30) connected with the retention module and the fastening cover for mounting the heat sink onto a heat generating... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298015 - Auxiliary cooling device for memory chips: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the... Agent: Wei-hau Chen

20080298016 - Cooling an electronic device utilizing spring elements with fins: A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form... Agent: Michael Buchenhorner, P.A.

20080298017 - Counterflow microchannel cooler for integrated circuits: A plurality of channels are formed in a base, e.g., a substrate of an integrated circuit, each channel extending between edges of the base. Two pairs of manifolds are provided, the first pair communicating with a first group of channels and the second pair communicating with a second group of... Agent: Zagorin O'brien Graham LLP

20080298018 - Heat sink and laser diode: The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in... Agent: Sonnenschein Nath & Rosenthal LLP

20080298019 - Cooling system and method of use: A system of cooling and method of use that includes a connector having a data reader capable of reading a wireless identifier and/or a breaker box capable of routing liquid cooling to at least one server. In a preferred embodiment, both the quick connector and the breaker box are used... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20080298020 - Heat dissipation device having holes: An exemplary heat dissipation device (20) includes a base (21) and heat dissipation fins (22) extending from the base. Each heat dissipation fin has ventholes (23) formed therein. An area of an inner surface of each venthole is greater than twice an area of a transverse cross-section of the venthole.... Agent: Wei Te Chung Foxconn International, Inc.

20080298021 - Notebook computer with hybrid diamond heat spreader: Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon... Agent: Pvf -- Apple Inc. C/o Park, Vaughan & Fleming LLP

20080298022 - Heat sink assembly having a locking device assembly: A heat sink assembly comprises a heat sink (20) and a locking device assembly (30) for mounting the heat sink to an electronic component (44) of a printed circuit board (40). A channel (25) is defined in the heat sink. The locking device assembly comprises a pressing member (31) and... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298023 - Electronic component-containing module and manufacturing method thereof: An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the... Agent: Ratnerprestia

20080298024 - Heat spreader and method for manufacturing the same, and semiconductor device: On a connection surface 2 of a base substrate 1 composed of a material including Cu, a heat spreader includes a Ni plating layer 3 having a high Cu region 5 where the content of Cu is not less than 1% by mass, in a range of not more than... Agent: Rabin & Berdo, PC

20080298025 - Sliding cover mechanism of portable electronic device: A sliding cover mechanism (100) includes a static member (10), a sliding member (20) and a flexible circuit board (60). The static member includes a receiving portion (101). The sliding member is movably mounted on the static member. One end of the flexible circuit board is mounted on the static... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298027 - Dial module and process for manufacturing the same, led display element, display module, movement module, connector module and meter employing the same: The dial module includes: a sheet-shaped dial having a design part on a surface of the dial; a sheet-shaped light source fixed to a back surface of the dial for illuminating the design part; and a flexible printed circuit fixed to a back surface of the light source. The dial... Agent: Kratz, Quintos & Hanson, LLP

20080298026 - Holder for electronic device: A holder for a portable electronic device is provided. The holder includes a anchoring portion and two latches to define a clamping area. The anchoring portion and the two latches are respectively disposed at each end of the holder. Each latch has a bent elastic arm and a hook extending... Agent: Workman Nydegger

20080298028 - Amc carrier faceplates: A faceplate for AMC carriers is fabricated from extruded aluminum using a combination of extruded cross-sectional features and machined features to achieve the structural and functional characteristics of an AdvancedTCA faceplate. The extruded aluminum faceplate significantly improves on sheet-metal alternatives while substantially conforming to the AdvancedTCA specification.... Agent: Strategic Patents P.C..

20080298029 - Printed circuit board having air vent for molding and package using the same: Provided is a printed circuit board having air vents and a semiconductor package that uses the printed circuit board having the air vents. The printed circuit board includes a substrate layer having a circuit pattern and a protection layer formed on the substrate layer, a molding region on which at... Agent: Marger Johnson & Mccollom, P.C.

20080298030 - Computer system with riser card: A computer system includes a chassis (10) having a bottom plate (12), a drive bracket (20) for securing at least one data storage device therein, a motherboard (40), and a riser card (30). The drive bracket is secured in the chassis above the bottom plate, and has a sidewall (203)... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298031 - Shaped integrated passives: Shaped integrated passive devices and corresponding methodologies relate to construction and mounting of shaped passive devices on substrates so as to provide both mechanical and electrical connection. Certain components and component assemblies are associated with the implementation of surface mountable devices. Specially shaped integrated passive device are capable of providing... Agent: Dority & Manning, P.A.

20080298032 - Electronic device assembly with transfer card: An electronic device assembly includes an electronic device, a transfer card configured for connecting the electronic device to another electronic device, and a fixing board for mounting the transfer card to the electronic device. The electronic device includes a front wall defining a port. The transfer card is coupled to... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298033 - Power supply platform and electronic component: An electric power supply platform (1) made up of an upper conductive layer (2), a lower conductive layer (3), and a non-conductive insulating layer (4) sandwiched between the conductive layers (2), (3). Specially designed light emitting diodes (LEDs) (9) and a variety of other electronic components, each having one short... Agent: Edward M. Livingston, Pa

20080298034 - Printed circuit board and semiconductor module having the same: A printed circuit board (PCB) includes a substrate having a first group of at least two via holes and a second group of at least two via holes formed therein, a first pad set of terminal pads and a second pad set of terminal pads formed on the substrate, and... Agent: F. Chau & Associates, LLC

20080298035 - Printed circuit board unit: A second printed wiring board is opposed to a surface of the first printed wiring board. A support member supports the first and second printed wiring boards. A first connector is mounted on the first printed wiring board. A second connector is mounted on the second printed wiring board. A... Agent: Staas & Halsey LLP

20080298036 - Printed circuit board and fuel cell: An FPC board includes a base insulating layer made of polyimide, for example. A conductor layer made of copper, for example, is formed on one surface of the base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and extraction conductor portions extending in long-sized... Agent: Panitch Schwarze Belisario & Nadel LLP

20080298037 - Mounting panel arrangement: A mounting panel arrangement having a plurality of mounting panels for optoelectronic components. Two adjacent mounting panels (1, 2) are connected to one another, in a mechanically stable manner, a connection body (3). Each of the two mounting panels has a connection area (110, 210), each of which is associated... Agent: Cohen Pontani Lieberman & Pavane LLP Suite 1210

20080298038 - Wiring board and its fabricating method: A wiring board has predetermined numbers of wiring layers and insulating layers among the respective wiring layers. The wiring board has an external connecting pad and a surface plating layer for connecting to an external circuit is arranged on the external connecting pad. An area of an external connecting pad... Agent: Rankin, Hill & Clark LLP

20080298039 - Electron device having metallic connecting structure and method for making the same: An exemplary electronic device having a metallic connecting structure includes a metallic housing, at least one bonding film and at least one metallic clip. The at least one metallic clip includes a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080298040 - Latch for interface card: A structure of a latch for an interface card is disclosed. The latch includes a positioning set and a board. The positioning set has a pillar formed at a bottom portion thereof, a protruded frontage with a protruded jointing portion and a connecting portion connected to a limiter, wherein the... Agent: T-conn Precision Corp.

20080298041 - Electromagnetic radiation shield for an optical subassembly: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and... Agent: Workman Nydegger

20080298042 - Apparatus and method for providing an insulated support rack: A system and method are disclosed for providing an improved rack arm system wherein insulating material is utilized to guard against stray voltage. The system and method entail providing insulated rack arm systems for installation in new locations as well as a snap-on insulating piece for utilization with existing rack... Agent: Noam J. Kritzer, Esq. / Bakos & Kritzer