Electricity: electrical systems and devices inventions 11/08

20080291587 - Electronic appliance: An electronic appliance having a plurality of components is equipped with: a first component whose failure is directly coupled to a risk with respect to a safe aspect of the electronic appliance; a second component by which even when the second component fails, although the failure of the second component... Agent: Mcdermott Will & Emery LLP

20080291588 - Motor control microcomputer and control method for the same: An object of the present invention is to improve safety of a motor by instantaneously detecting the abnormality of a PWM signal. To achieve the object, provided is a motor control microcomputer for outputting PWM signals to a motor drive circuit driving a motor, which includes an abnormal signal detection... Agent: Mcginn Intellectual Property Law Group, PLLC

20080291589 - Motor drive apparatus and motor drive control method: A protection circuit is configured to change control modes in a drive control process of a drive circuit for a motor when overvoltage is applied to a power source line while the motor is driven. With overvoltage applied, the control process is changed to a control mode to perform forced... Agent: Posz Law Group, PLC

20080291590 - Arc detection circuit: An arc detector comprising a voltage generator for detecting a voltage and an integrator for integrating said voltage with respect to time and generating an output signal corresponding to said integration. The arc detector also includes a discharge controller for controlling said output signal of said integrator, an amplifier for... Agent: Hayes Soloway P.C.

20080291591 - Radio-frequency apparatus with electrostatic discharge protection: A radio-frequency apparatus with electrostatic discharge (ESD) protection is provided. The radio-frequency apparatus including an antenna, an inductor, a capacitor and a radio-frequency circuit receives a radio-frequency signal by the antenna. When the radio-frequency signal is transmitted to the radio-frequency apparatus, an electrostatic signal may invade into the radio-frequency apparatus... Agent: Jianq Chyun Intellectual Property Office

20080291592 - Circuit breaker system: A circuit breaker system has a switch, in particular in the form of a controllable power semiconductor, which is connected between a voltage input and a load output for the purpose of switching a load within a current path. The circuit breaker system further includes a circuit breaker, which can... Agent: Lerner Greenberg Stemer LLP

20080291593 - Device protection using temperature compensation: Device protection using temperature compensation. A logic module associated with groups of capacitors adjusts complex impedance planes associated with the capacitor groups to account for ambient temperature variations. In particular, the logic module is configured to adjust a center of a circle of each complex impedance plane based on an... Agent: King & Spalding LLP

20080291594 - Electrical circuit protection arrangement: For an electrical circuit (10), having a load (20) such as an illuminated display that includes at least one semiconductor junction device (22) supplied with operating current at a voltage sufficient to bias the semiconductor junction device into conduction and control means (30) to provide or inhibit supply of power... Agent: James D. Stevens Reising, Ethington, Barnes, Kisselle, P.C.

20080291595 - Protection unit for an ac/dc low-voltage power supply line: Protection unit for an AC or DC low-voltage power supply line, comprising means for detecting the current circulating in one or more power supply line conductor(s) and at least first electronic protection means operatively coupled to a circuit breaker with at least one pole for inserting along said conductor, characterized... Agent: Connolly Bove Lodge & Hutz LLP

20080291596 - Surge arrester: A surge arrester has a discharge current path. The discharge current path is surrounded by an insulating sleeve. The insulating sleeve has at least one area that is optically transparent.... Agent: Lerner Greenberg Stemer LLP

20080291597 - Scanning beam device having different image acquisition modes: A method of one aspect may include monitoring movement of a scanning beam image acquisition device. Images may be acquired with the scanning beam image acquisition device using a first image acquisition mode when the monitoring indicates that the scanning beam image acquisition device is moving. Images may be acquired... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080291598 - Output stage and related logic control method applied to source driver/chip: Output stage and related method applied to source driver/chip of LCD panel. While performing dot polarization inversion for even/odd channels of LCD panel, n-channel and p-channel MOS transistors of symmetric layout are respectively adopted for alternately transmitting a positive polarization signal of higher swing range and a negative polarization signal... Agent: Wpat, PC

20080291599 - Ignition device and method of controlling the same: An ignition device includes a semiconductor switching element, a constant-current circuit, and a control section. The semiconductor switching element has a gate, a collector and an emitter, and is coupled with a primary winding of an ignition coil. The semiconductor switching element is configured to control a gate voltage and... Agent: Nixon & Vanderhye, PC

20080291600 - Monolithic ceramic capacitor: A multi-terminal monolithic ceramic capacitor arranged to reduce an equivalent series inductance and having an array structure is provided. A first same-polarity-connection conductor and a second same-polarity-connection conductor are provided inside a capacitor body so as to extend over at least two capacitors. The first same-polarity-connection conductor is electrically connected... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080291601 - Integrated capacitor arrangement for ultrahigh capacitance values: The present invention relates to an electronic device (300) comprising at least one trench capacitor (302) that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence (308) of at least two dielectric layers (312, 316) and at least two electrically conductive layers (314,... Agent: Nxp, B.v. Nxp Intellectual Property Department

20080291602 - Stacked multilayer capacitor: A capacitor device, which is mountable on a substrate, has an electrically conductive bottom lead frame with a bottom plate mountable substantially parallel to, and in contact with, the substrate and an electrically conductive top lead frame having a top plate spaced apart from the bottom plate and a first... Agent: Wood, Herron & Evans, LLP

20080291603 - Trench capacitor device suitable for decoupling applications in high-frequency operation: The present invention relates to a capacitor device (500), an electronic circuit comprising a capacitor device, to an electronic component, and to a method of forming a capacitor device. In the capacitor device of the invention, a current-path region (530) extends from one of two trench capacitor electrodes to a... Agent: Nxp, B.v. Nxp Intellectual Property Department

20080291604 - Electrolytic capacitor: An electrolytic capacitor (A1) of the present invention includes an anode (2), a cathode (3) and an electrolyte (4) intervening between the anode (2) and the cathode (3). The anode (2) includes a porous sintered body (21) made of valve metal and having a surface on which an oxide film... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20080291605 - Niobium suboxide powder: A niobium suboxide powder comprising 100 to 600 ppm of magnesium is described. The niobium suboxide powder may (alternatively or in addition to 100 to 600 ppm of magnesium) further include 50 to 400 ppm of molybdenum and/or tungsten. The niobium suboxide powder is suitable for the production of: capacitors... Agent: Connolly Bove Lodge & Hutz LLP

20080291606 - Thin solid electrolytic capacitor having high resistance to thermal stress: In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080291607 - Modular power distribution and control system:

20080291608 - Auxiliary pad for notebook pc: An auxiliary pad for notebook PC is provided, including a retractable pad, a connection arm, and an engaging plate. The connection arm is connected to the side of the retractable pad. The engaging plate can be engaged and disengaged from the tip of the connection arm. The retractable pad can... Agent: Lin & Associates Intellectual Property, Inc.

20080291610 - Electronic device holder: An apparatus that can secure an electronic device and be inserted into a conventional cup holder is described. The cup holder, for example, is inside of an automobile. The electronic device being held can be a variety of devices that include a digital music player. One embodiment of the invention... Agent: Beyer Law Group LLP/apple Inc.

20080291609 - Inverter: The subject matter of the invention is an inverter including a casing (1), said casing (1) including at least two casing chambers (2, 3) that are each closable through a separate cover (2a, 3a).... Agent: Pyle & Piontek Attn: Thomas R. Vigil

20080291613 - Display device: A display device includes a display panel; a substrate arranged at a lower part of a rear surface of the display panel, and mounted with an electronic component for functioning the display panel; hinge plates, arranged at a rear surface of the substrate so as to cover at least one... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080291614 - Display device: A display device of the present invention is a display device including a body unit; a display unit; and a supporting unit, arranged upright from the body unit, for supporting the display unit; the display device including a circuit substrate arranged inside the body unit and mounted with an electronic... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080291615 - Display device: A display device includes a body unit; a display panel of flat plate shape arranged with a display screen; at least one hinge plate connected to a rear surface of the display panel; shafts arranged extending along a lower end of the display panel, and turnably attached with the hinge... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080291611 - Flat display and flat display apparatus having the same: A flat display including a display main body to receive a display panel to display an image and a receiving member which is formed with receiving holes disposed at opposite lateral sides of the display main body.... Agent: Stanzione & Kim, LLP

20080291612 - Organic light emitting display device: An organic light emitting display device includes an organic light emitting display panel; a bezel frame comprising a lower surface and side walls and receiving the display panel; a bezel receiving the bezel frame; and a connecting system connecting the bezel frame and the bezel.... Agent: Knobbe Martens Olson & Bear LLP

20080291616 - Information processing apparatus: An information processing apparatus configured to have: a display section (2) pivotally provided with respect to an apparatus main body (3) with a pair of hinges (9a, 9b) so as to pivot between a close position to close the apparatus main body and an open position to open the apparatus... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080291618 - Anti-vibration and anti-electromagnetic-interfering frame for hard disk: An anti-vibration and anti-EMI frame includes an electrically conductive casing having a plurality of side panels, a front opening and a rear opening for receiving a hard disk drive therein before being fixed in an electronic device. The casing is integrally formed on the side panels with a plurality of... Agent: Rosenberg, Klein & Lee

20080291619 - Computer drive cage with integrated biasing elements: A computer drive cage (10) includes a pair of side support panels (14) that are separated by a space (38) to accommodate receipt of one or more computer drives (86). At least one of these support panels (14) includes a computer drive installation slot (46). One or more contacts (62)... Agent: Marsh, Fischmann & Breyfogle LLP

20080291617 - Electronic device with a metal-ceramic composite component: An electronic device is disclosed. The electronic device may include a first component. The electronic device may also include a metal-ceramic composite component coupled to the first component and configured to reinforce at least a portion of the first component in a first direction.... Agent: Ipsg, P.C.

20080291620 - Electronic device with a ceramic component: An electronic device is disclosed. The electronic device may include a component made of a ceramic material. The electronic device may also include circuitry configured to transmit signals. The signals may pertain to input received through the component.... Agent: Ipsg, P.C.

20080291621 - System and method for information handling system adaptive venting and cooling: An information handling system cooling system operates according to a thermal profile selected by a thermal profile manager based upon venting detected as available through a chassis wall. Venting through the chassis is provided, in part, by vent openings formed in a blank coupled to the chassis. A first thermal... Agent: Hamilton & Terrile, LLP

20080291622 - Electrical connector assembly having heat sink: An electrical connector assembly is provided for connecting an IC chip (2) to a printed circuit board (3). The electrical connector assembly includes a housing (1) engaging with the IC chip, a heat sink (6), a loading plate (4) and a number of first connecting portions (5). The loading plate... Agent: Wei Te Chung Foxconn International, Inc.

20080291623 - Electronics package for a battery: An electronics package for a battery (1) comprises connectors (14) providing connection to internal components of the battery, an interface connector (15) with an external application, and a charging circuit (20) for the battery. The charging circuit and connectors are integrated into a same package (10) designed to be fixed... Agent: Sughrue Mion, PLLC

20080291624 - Apparatus for extending an operator panel: An apparatus for extending an operator panel away from an electronic device. An opening in a side of a housing for the electronic device is covered with an air intake grill to provide airflow for cooling at least one electronic component within the electronic device. The operator panel that controls... Agent: Duke W. Yee Yee & Associates, P.C.

20080291625 - Direct cooling system: A direct cooling system is used for cooling one or more heat sources, such as electronic components within an enclosure. A supply air duct is coupled to an existing HVAC register and directed to the enclosure. A vented duct within the enclosure is coupled to the supply air duct and... Agent: Raman N. Dewan Jackson Walker, L.L.P.

20080291626 - Method and apparatus for cooling electronic equipment: A method for cooling electronic equipment. The method including propagating air through a first electronic component of the electronic equipment into a first enclosed area, where propagating the air through the first electronic component cools the first electronic component, circulating a refrigerant in a cooling loop, where the cooling loop... Agent: Osha Liang L.L.P./sun

20080291627 - Apparatus for enclosing electronic components used in telecommunication systems: An apparatus for enclosing electronic components such as used in telecommunication systems is disclosed. The apparatus includes a housing defining a chamber, with the housing comprising a front wall having an outer surface and a length dimension greater than a width dimension. A pair of opposing side walls are each... Agent: Fogg & Powers LLC

20080291628 - Semiconductor module and inverter device: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow... Agent: Oliff & Berridge, PLC

20080291629 - Liquid-cooled portable computer: Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature.... Agent: Pvf -- Apple Inc. C/o Park, Vaughan & Fleming LLP

20080291630 - Method and apparatus for cooling computer memory: A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat... Agent: Hartman & Hartman, P.C.

20080291631 - Illumination unit: There is described an illumination unit with a planar carrier part having a plurality of light-emitting semiconductor components, in particular high-power light-emitting diodes, arranged on both sides of a main surface. On each side of the carrier part a heat sink is provided in each case. Each of the semiconductor... Agent: Siemens Corporation Intellectual Property Department

20080291632 - Inverter casing: The invention relates to an inverter casing, said inverter casing (1) comprising in the bottom at least one depression (5) for receiving heat dissipating electric components, coils in particular.... Agent: Pyle & Piontek Attn: Thomas R. Vigil

20080291633 - Package assembly with heat dissipating structure: A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal... Agent: Joe Mckinney Muncy

20080291634 - Thermal interconnect and interface materials, methods of production and uses thereof: Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination... Agent: Honeywell International Inc.

20080291635 - Heat dissipative structure, optical pickup apparatus, and optical recording/reproducing apparatus: A heat dissipative structure that offers high heat dissipation effect with a simple configuration, an optical pickup apparatus having the same, and an optical recording/reproducing apparatus are provided. A heat-dissipating component is provided for a heat-producing component. Heat generated in the heat-producing component can be transferred to the heat-dissipating component... Agent: Morrison & Foerster LLP

20080291636 - Semiconductor device: The semiconductor device includes a circuit board. The circuit board has an insulating substrate, a metal circuit fixed on a first side of the insulating substrate, and a metal plate fixed on a second side of the insulating substrate. The semiconductor device further has a semiconductor element mounted on the... Agent: Morgan & Finnegan, L.L.P.

20080291637 - Small-sized communication module package: A small-sized communication module package mountable on a main board is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further includes a chip electrically bonded to the substrate,... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20080291639 - Communication module package assembly: A communication module package assembly includes a main board having grounding pads, a communication module package electrically bonded on the main board and having notches corresponding in location to the grounding pads respectively, and a metal cover covering the communication module package and having mounting legs passing through the notches... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20080291638 - Electrical connector with clip mechanism: Provided a clip set (50) for pressing a CPU toward LGA contacts of a CPU socket comprises, a rigid body having an elongate base (501) with upper and lower edges. A set of first pressing finger (502) extends from the upper edge traversally and away from the base. Each of... Agent: Wei Te Chung Foxconn International, Inc.

20080291640 - Electronic device with a base plate: A base plate for a heat sink comprises a cooling plate and spacer elements, which are arranged on the surface of the cooling plate. The spacer elements and the cooling plate are made as one piece and the material in the surface region of the cooling plate and of the... Agent: Buchanan, Ingersoll & Rooney PC

20080291641 - Lockable door assembly of an electronic device: A lockable door assembly of an electronic device is used to cover and seal an opening of a housing of the electronic device. The lockable door assembly includes a door, a first sliding member, and a second sliding member. The door is pivoted to the housing to cover the opening.... Agent: Morris Manning Martin LLP

20080291642 - Electronic circuit module including chip mounted to multi-layer wiring plate in flip chip manner: In an electronic circuit module according to an embodiment of the invention, a chip including bumps with a height of d is mounted to a multi-layer wiring plate including surface electrodes and internal electrodes in a flip chip manner. In the multi-layer wiring plate, when the minimum thickness of the... Agent: Beyer Law Group LLP

20080291643 - Apparatus and methods for mounting and retaining power monitoring systems: A system for mounting and retaining an electronic device in an opening in a door or panel comprises a power monitoring device for monitoring characteristics of the power transmitted through one or more power lines. An apparatus is coupled to the power monitoring device and is adapted to secure the... Agent: Schneider Electric / Square D Company Legal Dept. - I.p. Group (np)

20080291644 - Fastening of a built-in unit on a switchboard and fitting method for fastening a built-in unit: At least one embodiment of the invention relates to the fastening and fitting of a built-in unit on a switchboard, which has a through-opening for this purpose, a collar, which is arranged on the built-in, limiting the action of plugging through the built-in unit, and at least one fixing and... Agent: Harness, Dickey & Pierce, P.L.C

20080291645 - Interface retention and support apparatus and method of use: An interface retention and support apparatus and method of use is disclosed. In one form, an extension apparatus can include a first coupling interface operable to be coupled to an first expansion terminal of a printed circuit board. The apparatus can also include a retention mechanism aligned to a surface... Agent: Larson Newman Abel Polansky & White, LLP

20080291646 - Electronic control unit with a central elastic element: An electronic control unit presenting: a printed circuit board, which supports an electric circuit, a plurality of electric/electronic components electrically connected to the electric circuit, and at least one connector electrically connected to the electrical circuit; a housing, which accommodates therein the printed circuit board and comprises a base which... Agent: Ostrolenk Faber Gerb & Soffen

20080291647 - Portable electronic device: A portable electronic device includes a case, a circuit board in the case, an electronic component in the case. The electronic component includes a connection terminal and a portion facing a side surface of the circuit board. The portable electronic device also includes a terminal member for connecting the circuit... Agent: Procopio, Cory, Hargreaves & Savitch LLP

20080291648 - Substrate attachment structure: A substrate attachment structure includes a chassis, a substrate and an attachment screw. The chassis includes a hook piece with an engagement prong arranged to face the chassis, and a threaded hole. The substrate includes a screw insertion hole, and a latching hole with a continuous periphery that receives the... Agent: GlobalIPCounselors, LLP

20080291649 - Capacitor built-in substrate and method of manufacturing the same and electronic component device: A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are passed through the base resin layer, each of the capacitors constructed by a first electrode provided to pass... Agent: Kratz, Quintos & Hanson, LLP

20080291650 - Arrangement having an electric motor and a main printed circuit board, and an assembly method: A device provided with an electric motor (7) and a main printed circuit card (8) has contact points (12), wherein the electric motor has a housing and connecting contacts (6) which are conductively connected to the contact points (12), the housing has a first face and a second face opposite... Agent: Baker Botts L.L.P. Patent Department

20080291651 - Passive alterable electrical component: A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the... Agent: Hiscock & Barclay, LLP

20080291652 - Semiconductor package and method of forming the same, printed circuit board, and electronic device: Provided are a semiconductor package and a method for forming the same, and a PCB (printed circuit board). The semiconductor package comprises: a PCB including a slit at a substantially central portion thereof, the PCB including an upper surface and a lower surface; a semiconductor chip mounted on the upper... Agent: Marger Johnson & Mccollom, P.C.

20080291653 - Stand-off mounting apparatus for discrete electrical components: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the... Agent: Delphi Technologies, Inc.

20080291654 - Wireless communication nodule assembly: A wireless communication module assembly includes a main board having a top surface on which a plurality of grounding pads are provided, a circuit board unit, and a metal cap. The circuit board unit has a bottom surface electrically mounted on the top surface of the main board, a top... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20080291655 - Wiring substrate, semiconductor device package including the wiring substrate and methods of fabricating the same: Provided is a wiring substrate, a semiconductor device package including the wiring substrate, and methods of fabricating the same. The semiconductor device package may include a wiring substrate which may include a base film. The base film may include a mounting region and a non-mounting region. The wiring substrate may... Agent: Harness, Dickey & Pierce, P.L.C

20080291656 - Cable management system with inspection window: A cable management system with an inspection window allows a technician to see available ports in a telecommunications module. The cable management systems inspection window is substantially transparent to permit visual access to underlying ports and associated electrical connectors. The inspection window is solid to prevent physical access to the... Agent: Raman N. Dewan Jackson Walker, L.L.P.

20080285184 - Power converters with operating efficiency monitoring for fault detection: A power converter includes a controller and at least one output terminal for providing an output voltage and an output current to a load. The controller is configured for monitoring the output voltage and the output current and calculating an efficiency of the power converter based on the monitored output... Agent: Harness, Dickey, & Pierce, P.l.c

20080285185 - Semiconductor integrated circuit: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for... Agent: Miles & Stockbridge PC

20080285187 - Cdm esd protection for integrated circuits: The present invention provides a charged-device model (CDM) electrostatic discharge (ESD) protection circuit for an integrated circuit (IC). The ESD protection circuit comprises a substrate of first conductivity type; a MOS component of second conductivity type formed on a first well on the substrate, and coupled to a pad; an... Agent: Patent Docket Administrator Lowenstein Sandler P.C.

20080285188 - Composite integrated semiconductor device: A composite integrated semiconductor device. In one embodiment, an input surge/noise absorbing circuit absorbs surge from an input signal, an attenuating circuit attenuates the input signal, and an electrical signal converting circuit converts the input signal to an output signal. The input surge/noise absorbing circuit, the attenuating circuit, and the... Agent: Staas & Halsey LLP

20080285189 - Electrostatic discharge protection device for an optical disc drive: An electrostatic discharge protection device for an optical disc drive is provided. A rail disposed on the casing of the disc drive has an opening. A guide bar is slidable disposed on the rail. A conductive elastic plate is fixed around the opening on the rail. The elastic plate has... Agent: Bacon & Thomas, PLLC

20080285190 - Electrostatic protection circuit:

20080285186 - Intrinsically safe ethernet-based communication: An intrinsically safe network switch (200) includes five electronically isolated ports, four for connections in hazardous areas (206-1, 206-2, 206-3, 206-4) and one for receiving an unsafe Ethernet input (204). The device may use 10/100 mbps Ethernet cables and connectors and provides speed and activity LED indicators for each port.... Agent: Ip Authority, LLC Ramraj Soundararajan

20080285191 - Backflow preventing circuit capable of preventing reverse current efficiently: This patent specification describes a backflow prevention circuit which includes a first switch configured to conduct or to shut down a current path from an input terminal to an output terminal, a logic circuit configured to binarize an input voltage at the input terminal based on an output voltage at... Agent: Cooper & Dunham, LLP

20080285192 - Power converters with rate of change monitoring for fault prediction and/or detection: A power converter includes a controller having at least one input for monitoring a rate of change of an operating parameter of the power converter. The controller is configured for comparing the monitored rate of change of the operating parameter with an allowable rate of change for the operating parameter,... Agent: Harness, Dickey, & Pierce, P.l.c

20080285193 - Power supply apparatus: A power supply apparatus includes: a plurality of batteries; a changeover portion switching the connection between the plurality of batteries; a short-circuit battery detection portion, if an internal short-circuit is produced in any of the plurality of batteries, detecting this internal short-circuit battery; and a changeover control portion, if the... Agent: Mcdermott Will & Emery LLP

20080285194 - High voltage disconnecting switch control: A system for controlling a high voltage switch having at least one connect/disconnect arm, the system comprising: actuating means for displacing the at least one connect/disconnect arm; an optical position sensor for determining a position of the at least one connect/disconnect arm; and a control module operatively connected to the... Agent: Ogilvy Renault LLP

20080285195 - Integrated circuit with protection against electrostatic damage: s

20080285196 - Over-voltage indicator and related circuit and method: Over-voltage indicator and related circuit and method. The over-voltage indicator can work with an I/O circuit of a chip for detecting over-voltage in an I/O pad and providing an indication signal accordingly. When over-voltage does not happen, the over-voltage indicator continues to detect a signal level of the I/O pad... Agent: Wpat, PC

20080285197 - Protection device for load circuits: When a current flowing into a load 4 is increasing, a temperature of a wire is estimated by different estimation depending on whether the current is a normal current or the over-current. When the current flowing into the load 4 is decreasing, the temperature of the wire is estimated by... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080285198 - Over-current protection circuit: An over-current protection circuit for use with a constant voltage circuit that converts an input voltage to a predetermined output voltage and that outputs the predetermined output voltage. The over-current protection circuit includes an output current detecting circuit configured to output an output current detecting voltage proportional to an output... Agent: Dickstein Shapiro LLP

20080285199 - Circuit arrangement and method for protecting an integrated semiconductor circuit: What are proposed are a circuit arrangement and a method for protecting an integrated semiconductor circuit containing a protection circuit having a thyristor structure (SCR) and also a control circuit (TC; C1, R1, I1 to I3) for driving the protection circuit, which are both connected between an element (PV, LV)... Agent: Fish & Richardson PC

20080285200 - System and method for forming and controlling electric arcs: A system and method for growing and controlling an electric arc from an electro-magnetic field generator is described. The arc may be formed substantially straight by growing from successively generated electric fields from electro-magnetic generator, such as a waveform-controlled solid state Tesla coil. The growth and direction of the arc... Agent: Milbank, Tweed, Hadley & Mccloy

20080285201 - Solid state tesla coil suit: A wearable suit apparatus incorporating one or more user-operated solid state tesla coils includes a full body clothing article constructed of integrated, conductive shielding material. An on board power supply such as a battery pack powers the one or more solid state tesla coils, which are connected to the suit... Agent: Milbank, Tweed, Hadley & Mccloy

20080285204 - Electrostatic chuck structure for semiconductor manufacturing apparatus: An electrostatic chuck structure according to example embodiments of the present invention may include at least one specific region of a conductor having a thickness relatively smaller than those of other regions, at least one specific region of a dielectric having a thickness relatively larger than those of other regions,... Agent: Workman Nydegger

20080285202 - In situ monitoring of wafer charge distribution in plasma processing: A processing system and method. The processing system includes a processing tool, an electrostatic chuck (ESC) arranged within the processing tool, and a system that at least one of detects at least one of an ESC bias spike and an ESC current spike of the ESC and determines when an... Agent: Greenblum & Bernstein, P.L.C

20080285203 - Substrate hold apparatus and method for judging substrate push-up state: A substrate hold apparatus is provided an electrostatic chuck for electrostatically attracting and holding a substrate thereon, a push-up member contactable with a position of vicinity of an edge of the substrate on the electrostatic chuck from below for pushing up the substrate, a drive apparatus for driving at least... Agent: Osha Liang L.L.P.

20080285205 - Integrated inductor and capacitor components and methods of manufacture: An integrated inductor and capacitor component is provided and includes a number of tapered conductors. Neighboring ones of the tapered conductors are separated by a gap extending along a length of the component. A first one of the tapered conductors is characterized by a first width w1 that is larger... Agent: General Electric Company Global Research

20080285206 - Vaux box: This invention uses the new concept of converting RCA or YCbCr to your computer monitor (SCSI). Although all computers are different, the connection for the computer monitor may differ depending on the computer brand.... Agent: Kelsey Brown

20080285208 - Electric double-layer capacitor: Provided is an electric double-layer capacitor. The electric double-layer capacitor comprises an electrode portion composed of an anode and a cathode; a separator for providing electrical isolation between the anode and cathode; and an electrolyte solution which is filled in a space between the anode and cathode so as to... Agent: Seyfarth Shaw LLP

20080285207 - Supercapacitor cover with integrated center: The invention relates to an electric energy storage component comprising a coil winding and at least one connector (100, 200) including a plate (100) which is in contact with a plurality of said coils, wherein the plate of the connector has a surface which is provided with a terminal (200)... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080285209 - Solid electrolytic capacitor: The present invention provides a solid electrolytic capacitor including an anode lead frame and/or a cathode lead frame which are/is bent to be located along a side surface and a bottom surface of a resin package, wherein each of the anode lead frame and the cathode lead frame has a... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080285210 - Metal capacitor and manufacturing method thereof: A metal capacitor in which an electric conductivity is significantly improved by applying a metal material, instead of a solid electrolyte and electrolyte of an aluminum electrolytic capacitor, and a manufacturing method thereof is provided. A metal capacitor 10 includes a metal member 11 including a plurality of grooves 11a... Agent: Rosenberg, Klein & Lee

20080285211 - Li4ti5o12,li(4-alpha)zalphati5o12 or li4zbetati(5-beta)o12 particles processes for obtaining same and use as electrochemical generators: Synthesis process for new particles of Li4Ti5O12, Li(4-α)ZαTi5O12 or Li4ZβTi(5-β)O12, preferably having a spinel structure, wherein β is greater than 0 and less than or equal to 0.5 (preferably having a spinel structure), α representing a number greater than zero and less than or equal to 0.33, Z representing a... Agent: Buchanan, Ingersoll & Rooney PC

20080285214 - Electronic apparatus: According to one embodiment, an electronic apparatus is provided with a keyboard section provided on a main body unit, a display unit, and a hinge section for rotatably coupling the display unit to the main body unit. The keyboard section includes a plurality of keys to which inputting functions different... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080285217 - Electronic apparatus: An electronic apparatus is provided with a housing including a top wall and a side portion extending from an edge of the top wall, a keyboard, and a keyboard placing portion on which the keyboard is placed, the keyboard placing portion including a bottom surface provided in the top wall.... Agent: Knobbe Martens Olson & Bear LLP

20080285218 - Electronic device: The present relates to an electronic device represented by, for example, a personal computer and aims to reinforce a connector as well as suppress the increase in the number of parts. The electronic device includes: a motherboard 29; a USB connector 23 whose one side is secured to the motherboard... Agent: Staas & Halsey LLP

20080285216 - Keyboard connection configuration and electronic device: An electronic device includes a device main frame portion, a display portion supported by the device main frame portion, a keyboard, and a casing on which the keyboard is disposed. The keyboard includes a plurality of operating keys, a placement base in which the plurality of operating keys are disposed,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080285213 - Keyboard with media device docking station: Method and system are disclosed for a keyboard (200) having a built-in docking station (204) for a handheld media device. The built-in docking station allows the handheld media device to be accessed from the computer and also recharged in some cases without requiring any additional setup or adding clutter to... Agent: Andrew G. Dinovo Dinovo Price Ellwanger & Hardy LLP

20080285215 - Multimedia portable electronic device: Disclosed is a multimedia portable electronic device including a first housing, a second housing coupled to the first housing so as to rotate about a first hinge axis, a third housing adapted to slide while facing the first housing, a fourth housing connected to the third housing so as to... Agent: H.c. Park & Associates, PLC

20080285212 - Thin-client terminal and client/server-system having such a terminal: A thin-client terminal (1, 1′) according to the invention serves for use in a potentially explosive area (ExB) and has at least the following components: an EDP device (11, 11′), which can be programmed using software, has graphics capabilities, has its own storage and computation capacity, is connected, via at... Agent: Horst M. Kasper, Ph. D.

20080285222 - Chassis base assembly and display device including the same: A display device includes a panel assembly and a chassis base attached to the panel assembly. A circuit board include a plurality of circuit elements is attached to the chassis base to form a space between the circuit board and the chassis base. A shield case for covering the circuit... Agent: Christie, Parker & Hale, LLP

20080285223 - Display: A display includes: a display panel including a display surface; a frame including a cover part which partially faces the display surface; and a film whose fixing area is fixed to the cover part and which is arranged between the display surface and the cover part. The cover part includes... Agent: Mcginn Intellectual Property Law Group, PLLC

20080285220 - Display device having transparent protection structure: An exemplary display device (10) includes a display module (11), a transparent protection structure (12), and a magnetic latch (13). The display module includes a housing (113) and a display panel (115) mounted in the housing. The housing defines a mounting hole (118). The transparent protection structure is detachably attached... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080285219 - Light film device: A light film apparatus having an illuminated graphics panel with at least two segments that can be individually powered. A controller manages a power which is delivered from a power supply to each of the segments, so that each of the segments is either powered on, powered off or powered... Agent: Douglas H. Pauley Pauley Petersen & Erickson

20080285221 - Portable computer with space efficient cubic configuration: A space efficient, portable computer unit has been developed. The computer unit includes a unit case that is generally cubic shaped and a cooling system. The cooling system includes multiple exhaust fan mounted on the rear of the unit case and a filter mounted on the front of the unit... Agent: Bradley Arant Rose & White LLP

20080285224 - Information processing apparatus: An information processing apparatus having improved cooling efficiency is disclosed. The information processing apparatus includes a first chassis and a second chassis separated from each other at a prescribed distance, the first chassis accommodating a substrate on which high heat generating parts such as a CPU and a chipset are... Agent: Cooper & Dunham, LLP

20080285226 - Electronic device: The present invention relates to an electronic device represented by, for example, a personal computer and aims to dispose an IC card in a suitable position. The electronic device includes: a main unit 20 in the shape of a small board equipped with a keyboard 21 disposed at a rearward... Agent: Staas & Halsey LLP

20080285225 - Systems and methods for mounting components of an information handling system: Systems and methods for mounting components of an information handling system such as a desktop computer or other desktop information handling system. The supported components may be motorized or other vibration-producing components that are supported and mounted directly or indirectly to a mounting structure of an information handling system using... Agent: O'keefe, Egan, Peterman & Enders LLP

20080285227 - Modular small size computer system: A modular small size computer system is disclosed that may be used in a very limited workspace environment in the close proximity of other people without the ability of such people being able to view the information on the display screen. The modular small size computer system includes four main... Agent: Wayne M. Kennard

20080285228 - Arrangement for cooling electronic modular units in equipment and network cabinets: The invention relates to an arrangement for cooling equipment and network cabinets, particularly server cabinets, in which the fans are integrated into a door. The resulting fan door, in the closed position, covers an access area of the rear of the cabinet and longitudinally adjacent to the fan door is... Agent: Harness, Dickey & Pierce, P.L.C

20080285229 - Heat dissipating member, heat dissipating mechanism, and information processing apparatus: A heat dissipating member, a heat dissipating mechanism, and an information processing apparatus capable of improving the cooling efficiency without increasing the size of the apparatus are disclosed. In the information processing apparatus, it becomes possible to effectively transfer heat from a unit such as a memory disposed in an... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080285230 - Electronic unit with sealed coolant passage: To improve coolant sealing or reduce the risks in the event of leakage for an electronic unit, e.g. an engine control unit, containing electric and/or electronic components which are disposed on an upper side of a thermally conductive electronic base plate and thermally coupled to the base plate, the base... Agent: Lerner Greenberg Stemer LLP

20080285231 - Apparatus for enclosing electronic components: An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are... Agent: Fogg & Powers LLC

20080285232 - Techniques for data center cooling: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of... Agent: Michael J. Chang, LLC

20080285233 - Skewed cardcage orientation for increasing cooling in a chassis: A chassis (300) for housing at least one cardcage (302) is disclosed. The chassis includes a first portion (420) of a chassis housing (300) through a sixth portion (460) thereof. The first through sixth portions forming a boundary around a storage region of the chassis housing (300). The chassis (300)... Agent: Motorola, Inc.

20080285234 - Thermal module and electronic apparatus using the same: A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the... Agent: Jianq Chyun Intellectual Property Office

20080285235 - System for thermal conduction interfacing: A system is disclosed for thermal conduction interfacing. The system for thermal conduction interfacing is provided with a first layer formed substantially of a pliable thermally conductive material. The system includes a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first... Agent: Kunzler & Associates

20080285236 - Heat transfer system for a receptacle assembly: A receptacle assembly includes a housing that is configured to hold an electrical module. An energy transfer element, which is held by the housing, is positioned to directly engage the electrical module. The transfer element absorbs thermal energy produced by the electrical module. The receptacle assembly also includes a heat... Agent: Robert J. Kapalka Tyco Electronics Corporation

20080285237 - Finned heat sink, particularly for a thermoelectric module: The heat sink, particularly for a thermoelectric module, is of the kind formed of a plurality of first fin plates and second spacer plates, alternately disposed side by side and in contact with one another, and comprises fastening members which extend through the first and second plates for fastening one... Agent: Lucas & Mercanti, LLP

20080285238 - Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB.... Agent: Ibm Corporation RochesterIPLaw Dept. 917

20080285239 - Ic holder: Provided is an integrated circuit (IC) holder that includes: a case into which an IC package is inserted; a fastening unit for fastening the case to a printed circuit board (PCB); and a heat-dissipation unit for transferring heat generated from the IC package to the case, so that the IC... Agent: Cantor Colburn, LLP

20080285240 - Terminal module with integrated functions: The invention relates to a terminal module (1) with integrated functions, comprising a housing (2), at least one terminal strip (14-16) for connecting wire strands, and at least one circuit board (20) which is disposed in the housing (2) and on which functional elements are arranged that are electrically placed... Agent: Merchant & Gould PC

20080285241 - Flexible printed circuit board: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080285242 - Isolating stress on a printed circuit board: Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed circuit board, which can have deleterious effects on electrical components thereon. Slots are provided on the PCB to enable the portion of the... Agent: Allen, Dyer, Doppelt, Milbrath & Gilchrist P.A.

20080285243 - Storage apparatus and flexible printed board unit: A storage apparatus includes an enclosure that has an opening in a bottom, and a carriage block. A flexible printed board has an upper part and a lower part, and a connector attached on an opposed surface of the lower part to a bottom plate of the enclosure inserted through... Agent: Greer, Burns & Crain

20080285244 - Temporary chip attach carrier: A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second array of interconnects disposed on a top surface of the substrate, corresponding interconnects of the first and... Agent: Schmeiser, Olsen & Watts

20080285245 - Embedded passive device structure and manufacturing method thereof: Embedded passive device structure and its manufacturing method for mainly embedding the passive device structure in the printed circuit board are presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground... Agent: Lin & Associates Intellectual Property, Inc.

20080285246 - Component fixing method: A resist 7 of a predetermined thickness is formed on a printed circuit board 1 except electrode-opposing portions 1a (FIG. 1A), and a silk screen printed layer 9 of a predetermined thickness is formed on the resist 7 (FIG. 1B). Thereafter, a concave portion 2b of a film capacitor 2... Agent: Sughrue-265550

20080285247 - Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”),... Agent: Loctite Corporation

20080285248 - High-speed router with backplane using tuned-impedance thru-holes and vias: A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different... Agent: James E. Harris

20080285249 - Retention device for interface card cradle: A retention device for an interface card cradle is provided for retaining an interface card cradle in a case of a computer. The retention device includes a guiding seat fixed to the case, a guided member, and a latching member. The guided member is connected to the interface card cradle... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080285250 - Packaging assembly for an optical chip in a gyroscopic unit: A structural packaging assembly to support a multi-function optic chip or the like is mountable in a gyroscopic unit. An example assembly includes a housing mounted to a mounting plate. The chip is located in the housing, which in turn is coupled to a mounting plate. The housing may have... Agent: Honeywell International Inc. Patent Services Ab-2b

20080285251 - Packaging substrate with flat bumps for electronic devices and method of manufacturing the same: A packaging substrate with fiat bumps for an electronic device and a method of manufacturing the same relate to the production of the packaging substrate for an electronic device, which comprises base islands and pins structurally and wherein the base islands and pins which all exhibit flat bump shape distribute... Agent: Heslin Rothenberg Farley & Mesiti PC

20080285252 - Cable management rack for telecommunication cross-connect systems: The present disclosure relates to a rack for telecommunications equipment. The rack includes a frame defining a bay opening sized and shaped for receiving a plurality of jack modules. The rack also includes a first set of cable management brackets that define a first vertical channel arranged and configured for... Agent: Merchant & Gould PC

20080285253 - Thermal assembly coupled with an appliance: An appliance assembly includes an appliance and an appliance member. The appliance includes a wall defining a plurality of holes. The appliance member is carried by the appliance. The appliance member includes a housing which includes a snap-fit arrangement coupled with the appliance. The snap-fit arrangement includes a first plurality... Agent: Taylor & Aust, P.C.

20080278868 - Overheat protection circuit: An overheat protection circuit of a semiconductor apparatus has an output current detecting circuit for detecting an output current of a constant voltage circuit; a temperature detector for detecting a temperature of the apparatus; an output current control circuit for controlling the output current in accordance with output of the... Agent: Dickstein Shapiro LLP

20080278869 - Electric machine control system: A drive system for an electrical machine is provided. The system includes a control unit and a monitoring unit, which is independent of the control unit. The control unit includes a device that converts one or more incoming operating parameters of the electrical machine to an output value. The monitoring... Agent: Crowell & Moring LLP Intellectual Property Group

20080278870 - Over current detection circuits for motor driver: A motor driver having over current detection circuitry includes an H-bridge having a first differential input, a second differential input, and a differential output; a sensing circuit coupled to the differential output of the H-bridge; a comparison and logic circuit coupled to the sensing circuit; a pair of pre-driver circuits... Agent: Stmicroelectronics, Inc.

20080278871 - Method of detecting a ground fault and electrical switching apparatus employing the same: A circuit breaker includes for each neutral and phase power conductor, a current sensor sensing an alternating current flowing in a corresponding power conductor, a comparator determining whether the sensed alternating current is positive or negative, a rectifier rectifying the sensed alternating current to provide a rectified current value, and... Agent: Martin J. Moran Eaton Electrical, Inc.

20080278874 - Electrostatic discharge (esd) protection structure and a circuit using the same: An electrostatic discharge (ESD) protection structure is disclosed. The ESD protection structure includes an active device. The active device includes a plurality of drains. Each of the drains has a contact row and at least one body contact row. The at least one body contact row is located on the... Agent: Schwegman, Lundberg & Woessner / Atmel

20080278872 - Electrostatic discharge protection circuit: Techniques pertaining to designs of ElectroStatic Discharge (ESD) protection circuits are disclosed. In one embodiment, an ESD protection circuit combines a substrate-driving technique with a gate-driving technique to ease the ESD design and save the silicon area. In another embodiment, an ESD protection circuit is based on a Positive Metal... Agent: Silicon Valley Patent Agency

20080278873 - In package esd protections of ic using a thin film polymer: A packaged semiconductor device (200) with a substrate (220) having, sandwiched in an insulator (221), a flat sheet-like sieve member (240) made of a non-linear material switching from insulator to conductor mode at a preset voltage. Both member surfaces are free of indentations; the member is perforated by through-holes, which... Agent: Texas Instruments Incorporated

20080278875 - Safety switching apparatus for a failsafe disconnection of an electrical load: A safety switching apparatus for failsafe disconnection of an electrical load has a first and a second connecting terminal for connecting a first signaling switch and a third and a fourth connecting terminal for connecting a second signaling switch. It also has a first and a second output switching element,... Agent: Harness, Dickey & Pierce, P.L.C

20080278876 - Method for diagnosing a control circuit: A method for diagnosing control circuits having at least one actuator, in particular of a fuel injection device, is provided. Before operation of a given control circuit, this control circuit and the at least one actuator are tested for short-circuits, and an error response is initiated if a short-circuit is... Agent: Kenyon & Kenyon LLP

20080278877 - Overvoltage protective device and method of overvoltage protection: Problems can be solved about reducing the maximum voltage, reducing the size and cost, and so on. According to the invention, three or more discharge units are connected in series between two conductors. Two or more clamping type overvoltage protective units (hereinafter referred to as “clamping units”) are connected in... Agent: Gallagher & Lathrop, A Professional Corporation

20080278878 - Electronic switch for voltage stabilization and power consumption minimization: An electronic switch employing two input lines, but overcoming the problem in installation of the conventional 3-line electronic switch and the problem in power consumption and power stability of the conventional 2-line electronic switch. The switch comprises a) a power supply including a pair of diodes, each of which is... Agent: Thelen LLP

20080278880 - Remover of static charges on surfaces of substrates of semiconductors and liquid crystals in the processes of their manufacture: A portion 1 for generating purified air that comprises a cylindrical filter 5, a portion 2 for irradiation of soft X-rays 19, and a portion 3 for blowing out the ionized purified air, are arranged in the direction of the air flow in a guiding vessel 4. Also, a shield... Agent: Bromberg & Sunstein LLP

20080278879 - Static electricity eliminator, particularly for the treatment of polymers: A static electricity eliminator including at least one nozzle having a body defining a supersonic tuyere for pressure reduction of a compressed gas, a corona tip located close to the neck of the tuyere, and an electric supply circuit connected to the tip of the corona. The tip includes a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080278881 - Ion generator: In an ion generator, a high-voltage electrode with a contact portion is disposed on a first main surface of an insulating substrate and is connected to a wire electrode, and a ground electrode covered with an insulating film is disposed on a second main surface of the insulating substrate. The... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080278882 - Electric disabling device with controlled immobilizing pulse widths: A capacitive discharge stun-gun uses a flyback output circuit in which a semiconductor switch operates under control of a controller or suitable logic circuitry. The flyback circuit can deliver 50-65 kV pulses to a pair of electrodes in order to ionize air adjacent a target in order to initiate good... Agent: David Kiewit

20080278883 - Electrostatic chuck and method of manufacturing the same: In a method of manufacturing an electrostatic chuck, the method includes: a step of providing an electrostatic chucking portion including an electrode to which a voltage is applied and a film-like insulating layer covering the electrode; a step of bonding an elastomer layer onto the electrostatic chucking portion; a step... Agent: Drinker Biddle & Reath (dc)

20080278884 - Method and apparatus to reduce ring out in an ignition coil to allow for ion sense processing: An ignition apparatus includes a transformer having a central core, a primary winding disposed thereabout, a secondary winding disposed outwardly of the primary winding, and an outer core or shield disposed outwardly of the secondary winding. The central and outer cores and the primary and secondary windings define a magnetic... Agent: Delphi Technologies, Inc.

20080278885 - Placement configuration of mim type capacitance element: A placement configuration of MIM type capacitance elements comprises a group of first capacitance elements in which the first capacitance elements as the MIM type capacitance elements are placed in tandem and a group of second capacitance elements in which the second capacitance elements as the MIM type capacitance elements... Agent: Mcdermott Will & Emery LLP

20080278886 - Increasing the capacitance of a capacitive device by micromasking: Capacitive coupling devices and methods of fabricating a capacitive coupling device are disclosed. The coupling device could include a stack of layers forming electrodes and at least one insulator. The insulator could include a a region of doped silicon. The silicon could be doped with a species selected from Ce,... Agent: Docket Clerk

20080278887 - Systems and methods for a thin film capacitor having a composite high-k thin film stack: Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrate material using a metal organic deposition or chemical solution deposition process, depositing a... Agent: Patent Group 2n Jones Day

20080278888 - Metallized plastic film and film capacitor: A metallized plastic film is formed by winding two sheets of film vapor-deposited with an electrode metal as one group and a film capacitor, comprising; three individual splittings of electrode metal by predetermined width and length and then adjoining of splitting parts. Accordingly, self-heating of the film capacitor can be... Agent: Schmeiser Olsen & Watts

20080278889 - Modular ups: A modular UPS system is provided wherein UPS systems may be constructed using a number of different frame components. In one example, a core UPS frame is provided that can accept different combinations of power and battery modules, and an extension frame is provided that can be combined with the... Agent: Lowrie, Lando & Anastasi, LLP A2000

20080278890 - Power distribution panel with selectable output voltages: An electric power distribution panel includes a plurality of slots for supplying power to circuit breakers, a first input bus for coupling to a first power source, a second input bus for coupling to a second power source, and a plurality of circuit breaker carriers. Each carrier is positioned in... Agent: Harness, Dickey, & Pierce, P.l.c

20080278892 - Case assembly structure of electronic device: The present invention relates to a case assembly structure. The case assembly structure includes a first case and a second case. The first case has a first connection portion including a first protrusion, a first trench and a second protrusion from an external side to an internal side thereof. The... Agent: Kirton And Mcconkie

20080278891 - Monolithic sensor arrangement and method for controlling a monolithic sensor arrangement: A monolithic sensor arrangement includes a housing, a sensor integrated in the housing, and two or three connecting contacts deployed on the housing so as to provide a contact with the sensor. The housing also includes an integrated digital circuit includes a freely programmable digital processor, a program memory and... Agent: Maginot, Moore & Beck

20080278893 - Information processing apparatus: According to one embodiment, an information processing apparatus includes an apparatus body having a top wall, a keyboard disposed on the top wall of the apparatus body, a display unit connected to the apparatus body and movable between a closed position such as to cover the top wall and an... Agent: Patterson & Sheridan, L.L.P.

20080278896 - Display device: A liquid crystal display according to this invention includes a liquid crystal display panel, a frame assembly accommodating the liquid crystal display panel and being provided with a space adjacent to an end of the accommodated liquid crystal display panel, and a designed package covering the frame assembly. There is... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080278894 - Docking station for projection display applications: A projection docking station includes a docking port configured to communicate with a portable device and a projection unit configured to perform a projection process for an image. The projection docking station also includes a communication interface configured to provide communications between the docking port and the projection unit and... Agent: Townsend And Townsend And Crew, LLP

20080278897 - Portable electronic device: Disclosed is a portable electronic device adapted to be used and watched conveniently. The device includes a first housing having a keypad, a second housing having a display device; and a connection unit to rotatably couple the first and second housings so that the second housing can be rotated about... Agent: H.c. Park & Associates, PLC

20080278895 - Receiving module for a display device, display device including the same, and method thereof: A receiving module for a display device includes a receiving frame and a receiving container. The receiving frame includes a bottom part and a plurality of side parts extending from a peripheral portion of the bottom part creating a receiving space. The receiving container includes a bottom plate and a... Agent: Cantor Colburn, LLP

20080278900 - Computer case fixing mechanism and computer case utilizing said mechanism: A case fixing mechanism includes: a fixing device, located on a first case part; an assembling part, for containing the fixing device; a combination device, provided on the second case part; and a control device, for controlling the combination device to be in a first location or a second location.... Agent: North America Intellectual Property Corporation

20080278898 - Connecting modular structure for dc output of power supply: The present invention discloses a connecting modular structure for DC output of power supply. The power supply installed in electronic equipment has a housing and the housing has a mainboard installed that is connected to the external input power, and the mainboard has more than one DC output conducting contact... Agent: Bacon & Thomas, PLLC

20080278899 - Methods and apparatuses for docking a portable electronic device that has a planar like configuration and that operates in multiple orientations: A docking system is disclosed. The docking system includes a portable electronic device capable of operating in multiple orientations including vertical and horizontal. The docking system also includes a docking station configured to mechanically accept and operatively interface with the portable electronic device in any of its multiple orientations including... Agent: Townsend And Townsend And Crew, LLP

20080278903 - Package and manufacturing method for multi-level cell multi-media card: d

20080278902 - Universal serial bus (usb) flash drive with swivel cap functionalities with two locking positions: A Universal Serial Bus (USB) flash drive includes a slim USB device having an end used to couple the USB flash drive to a host and an opposite end, and a swivel “strap shaped” metal cap having a circle cut out disposed on both cap legs. The snap coupling circle... Agent: Law Offices Of Imam

20080278901 - Memory module system and method: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may... Agent: Fish & Richardson P.C.

20080278904 - Component bay: A component bay system includes a first component bay having a first bay chassis coupling member and first bay stacking member. The system also includes a second component bay having a second bay chassis coupling member. The first bay chassis coupling member is operable to couple to a chassis by... Agent: Haynes And Boone, LLP

20080278906 - Computer device fixing apparatus and computer case utilizing said apparatus: A computer device fixing apparatus includes: a main body part, having a containing part; an adjusting mechanism; and a connection mechanism, by which the main body part is connected with the adjusting mechanism revolvably; wherein the computer device fixing apparatus is for fixing a computer device of a first size... Agent: North America Intellectual Property Corporation

20080278905 - Information handling systems including fan control modules and methods of using the systems: An information handling system can include a fan control module operable to be control a fan to cool components within a housing. The fan control module can include a communication module operable to receive configuration information associated with components disposed within a housing of an information handling system. The fan... Agent: Larson Newman Abel Polansky & White, LLP

20080278907 - Fastening apparatus: A fastening apparatus for fastening at least an interface card includes a fixed support frame and at least a movable fastening structure. Additionally, the fastening structure can be utilized to perform a fastening or un-fastening operation with high speed on a plurality of interface cards simultaneously in the computer chassis... Agent: North America Intellectual Property Corporation

20080278908 - Image setting device: An image setting device for sensing whether an image of a rotatable image capturing device needs to be set is disclosed. The rotatable capturing device has a photographic element and is capable of rotating in an electronic device. The image setting device includes a one-way magnetism sensor having a sensing... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080278909 - Computer accessory device having recess for airflow: An accessory device comprising an accessory device housing having a surface that is adapted to be adjacent a computer housing when the accessory device and computer housings are attached together. The accessory device also comprises an electrical connector provided on the surface of the accessory device housing. The electrical connector... Agent: Hewlett Packard Company

20080278910 - Electronic component unit and electronic apparatus: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring... Agent: Kratz, Quintos & Hanson, LLP

20080278911 - Cooling fan and dynamic pressure bearing structure: A cooling fan and dynamic pressure bearing structure is disclosed. The cooling fan includes a base portion, a bearing portion, a dynamic pressure bearing, a coil assembly, and an impeller assembly. The dynamic pressure bearing is received in the bearing portion. A plurality of pressure collecting grooves is arranged in... Agent: Rosenberg, Klein & Lee

20080278912 - Thermal management systems and methods for electronic components in a sealed enclosure: Systems and methods for thermal management for electronic components in a sealed enclosure are provided. In one embodiment, a thermal management system for electronic components in a sealed enclosure comprises: an enclosure for housing electronic components, the enclosure sealed from an external environment; a card cage housed within the enclosure;... Agent: Fogg & Powers LLC

20080278913 - Cooling apparatus and cooled electronic module with a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled: A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled,... Agent: Heslin Rothenberg Farley & Mesiti P.C.

20080278914 - Connector with a heat sink: A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit... Agent: Birch Stewart Kolasch & Birch

20080278915 - Chassis mounted heat sink system: A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second... Agent: Fogg & Powers LLC

20080278916 - Memory module assembly and heat sink thereof: A memory module assembly includes a plurality of memory modules and a heat sink assembly. Each of the memory modules includes at least one heat source. The heat sink assembly includes a heat dissipating plate and a plurality of heat transfer mediums. Each of the heat transfer mediums includes a... Agent: Hdsl

20080278917 - Heat dissipation module and method for fabricating the same: A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole corresponding to the positioning part. The... Agent: Jianq Chyun Intellectual Property Office

20080278918 - Electronic control apparatus: An electronic control apparatus can be reduced in size and cost by removing a metal substrate part. The apparatus includes a housing having a pair of opening portions at its opposite sides, a heat sink attached to one of the opening portions of the housing, a pair of semiconductor switching... Agent: Sughrue Mion, PLLC

20080278919 - Socket for electric component: The present invention provides a socket for an electric component having: a socket main body; a plurality of contact pins disposed within the socket main body; a socket cover; a slide plate disposed inside the socket main body to be movable up and down; and drive levers which are provided... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080278920 - Hybrid integrated circuit device and method for manufacturing same: A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns;... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20080278921 - Semiconductor package and method of forming the same, and printed circuit board: Provided are a semiconductor package, a method of forming the semiconductor package, and a printed circuit board (PCB). The semiconductor package includes: a PCB including at least two parts divided by an isolation region; a semiconductor chip mounted on the PCB; and a molding layer disposed in the isolation region.... Agent: Marger Johnson & Mccollom, P.C.

20080278922 - Hardware protection system for sensitive electronic-data modules protecting against external manipulations: A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech printed circuit board technology and can be equipped with and... Agent: Staas & Halsey LLP

20080278924 - Die module system: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is... Agent: Fish & Richardson P.C.

20080278923 - Multi chip electronic system: An electronic system adapted to perform a corresponding function and including at least a first subsystem and a second subsystem, the first subsystem and the second subsystem being operatively couplable to each other through a plurality of electric connections to perform the function of the system, in which the first... Agent: Stmicroelectronics Inc. C/o Wolf, Greenfield & Sacks, P.C.

20080273280 - Carbon nanotube diodes and electrostatic discharge circuits and methods: Diodes and method of fabricating diodes. A diode includes: an p-type single wall carbon nanotube; an n-type single wall carbon nanotube, the p-type single wall carbon nanotube in physical and electrical contact with the n-type single wall carbon nanotube; and a first metal pad in physical and electrical contact with... Agent: Schmeiser, Olsen & Watts

20080273281 - Liquid switch: An apparatus comprising a liquid switch. The liquid switch comprises a substrate having a surface with first and second regions thereon and a fluid configured to contact both of the regions. The regions each comprise electrically connected fluid-support-structures, wherein each of the fluid-support-structures have at least one dimension of about... Agent: Hitt Gaines, PC Alcatel-lucent

20080273282 - Dbd plasma discharged static eliminator: A plasma discharged static eliminator comprises a plasma discharging electrode body for generating plasma as a source of ions. The plasma discharging electrode body includes two electrodes between which alternate voltage is applied, and a dielectric covering the electrodes. The plasma discharged static eliminator further comprises an inner grid electrode... Agent: Leighton K. Chong

20080273283 - Low voltage modular room ionization system: An ionization system for a predefined area includes a plurality of emitter modules spaced around the area, a system controller for individually addressing and monitoring the emitter modules and communication lines for electrically connecting the plurality of emitter modules with the system controller. Each emitter module has an individual address... Agent: Panitch Schwarze Belisario & Nadel LLP

20080273284 - Electrostatic chuck: The present invention provides an electrostatic chuck, which has high plasma resistance and high capability of cooling a material to be clamped. As for the basic structure of the electrostatic chuck, an insulating film is formed on a surface of a metal plate by flame spraying, and a dielectric substrate... Agent: Carrier Blackman And Associates

20080273285 - Precision laser adjustable thin film capacitors: Disclosed are apparatus and methodology for providing a precision laser adjustable (e.g., trimmable) thin film capacitor array. A plurality of individual capacitors are formed on a common substrate and connected together in parallel by way of fusible links. The individual capacitors are provided as laddered capacitance value capacitors such that... Agent: Dority & Manning, P.A.

20080273286 - Guard ring device receiving different voltages for forming decoupling capacitor and semiconductor device having the same: A semiconductor device in which a decoupling capacitor is formed by supplying different power levels to a guard ring device is disclosed. The semiconductor device includes a guard ring, having conductive rings, which surrounds a memory chip. The conductive rings are stacked in a multiplayer structure, and insulation layers are... Agent: Ladas & Parry LLP

20080273287 - Filtering capacitor feedthrough assembly: A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture defined by an inner capacitor surface. The capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A... Agent: Campbell Nelson Whipps, LLC

20080273288 - Capacitors, couplers, devices including same and methods of manufacturing same: Capacitors are provided comprising a first plate, a second plate spaced from the first plate and a dielectric between the first and second plates. In certain embodiments the plates are arranged generally opposite each other and each is shaped in a periodically repeating pattern that is spatially out of phase... Agent: Patent Docket Clerk Cowan, Liebowitz & Latman, P.C.

20080273289 - Film capacitor and method of manufacturing same: A film capacitor suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic is provided. The film capacitor comprises a film capacitor element, a bus bar as metal terminal connected to electrode of this film... Agent: Mcdermott Will & Emery LLP

20080273290 - Electrochemical double-layer capacitor using organosilicon electrolytes: Disclosed are supercapacitors having organosilicon electrolytes, high surface area/porous electrodes, and optionally organosilicon separators. Electrodes are formed from high surface area material (such as porous carbon nanotubes or carbon nanofibers), which has been impregnated with the electrolyte. These type devices appear particularly suitable for use in electric and hybrid electric... Agent: Quarles & Brady LLP

20080273291 - Channel method for forming a capacitor: s

20080273292 - Tantalum powder and solid electrolyte capacitor including the same: In a hydrogen-containing tantalum powder of the present invention, a value obtained by dividing the hydrogen content (ppm) by the specific surface area (m2/g) is in the range of 10 to 100. This tantalum powder has a large specific surface area, and when the tantalum powder is used as an... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080273293 - Removable racking system for an electrical switching apparatus: A modular racking system for an electrical switching apparatus is provided. The modular racking system includes a carriage assembly structured to support electrical switching apparatus and at least one cam follower structured to be removably coupled to the electrical switching apparatus.... Agent: Martin J. Moran Eaton Electrical, Inc.,

20080273296 - Portable electronic device: A portable electronic device includes a cover (10), a container (20) and a heater (40). The container is provided on the cover. The heater includes some exothermic materials. The heater is received in the container.... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080273294 - Protective case for a multi-media device: A protective case for a multi-media device includes a transparent body and a supporting strip. The transparent body is composed of a main base, a decorative strip with colored streaks and a cover coated with a layer of pearl silver color. The supporting strip is threadably combined with the underside... Agent: Li-min Tseng

20080273295 - Support frame for electrical apparatuses: The present invention refers to a support frame (1) for wall-mounting one or more electrical apparatuses, the frame comprising a frame body (2) that can be fixed to a wall and extending around an opening (5) defining a mounting seat suitable for receiving and holding one or more electrical apparatuses.... Agent: Hogan & Hartson LLP

20080273297 - Portable computing, communication and entertainment device with central processor carried in a detachable portable device: A docking display unit for physically engaging a portable computing unit and a combination of the same. The display unit may include or exclude a central processing unit and includes a housing with a hinged first and second region. The first region includes a display screen and the second region... Agent: Sand & Sebolt

20080273298 - Bag computer display panel: Disclosed is a panel-like display meant for pivotally mounting near the top front corner of a matching bag by one edge so it can be pivoted into the line of sight of the bag wearer. It may electrically connect to the bags interior or may include its own computing unit.... Agent: Charles A. Daley Iii

20080273299 - Memory card and method for fabricating the same: A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface... Agent: Edwards Angell Palmer & Dodge LLP

20080273300 - Slot assembly of hard disk tower: The present invention is to provide a slot assembly of hard disk tower, wherein the slot assembly disposed at one end of the hard disk tower comprises an upper slot assembly cover at the top of the hard disk tower having a plurality of upper directing slots; a lower slot... Agent: Bacon & Thomas, PLLC

20080273302 - Retaining device for a heat sink: A retaining device for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation... Agent: G. Link Co., Ltd.

20080273301 - Secure device for a heat sink and cpu: A secure device for a heat sink and CPU includes a main support arm and an operation handler. The main support arm has a first hook section at one end thereof and provides a contact face and a movable second hook section at another end thereof. The operation handle further... Agent: G. Link Co., Ltd.

20080273303 - Electronic circuit modules cooling: A cooling structure for electrical circuit devices having a pair of cooling ducts, each having a coolant passageway therein, and an electrical circuit device housing formed by a pair of spaced apart heat transfer plates each joined to a housing side to provide a sealed housing space. An electrical circuit... Agent: Kinney & Lange, P.A.

20080273305 - Fan airflow-guiding device: A fan airflow-guiding device matches a cooling fan. One side of the cooling fan has an outlet. The fan airflow-guiding device includes a frame and a plurality of airflow-guiding boards. The frame is assembled on one side of the cooling fan. The airflow-guiding boards are disposed on an outlet of... Agent: Rosenberg, Klein & Lee

20080273304 - Fan fastening structure for computer housing: A fan fastening structure for a computer housing includes a computer housing, an air-guiding mask, and a cooling fan. The computer housing has a front board and a backboard. An opening is located outside of the backboard that links into the interior of the computer housing. One front end of... Agent: Rosenberg, Klein & Lee

20080273306 - System and method of facilitating cooling of electronics racks of a data center employing multiple cooling stations: A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air... Agent: Heslin Rothenberg Farley & Mesiti P.C.

20080273307 - Liquid-based cooling system for cooling a multi-component electronics system: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a... Agent: Heslin Rothenberg Farley & Mesiti P.C.

20080273308 - Magnetically coupled cooling block: A cooling mechanism comprises a first cooling block and a second cooling block. At least one of the first and second cooling blocks comprises a magnet to retain at least one of the blocks in place when cooling a heat-producing component.... Agent: Hewlett Packard Company

20080273309 - Retaining tool for a heat sink: A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation... Agent: G. Link Co., Ltd.

20080273310 - Holding device for a heat sink: A holding device for a heat sink being attached to a circuit board includes a back plate and a frame member. The back plate provides a plurality of fixing posts with a free end of the respective fixing post having a neck recess piecing the circuit board and each of... Agent: G. Link Co., Ltd.

20080273311 - Enhanced localized distributive capacitance for circuit boards: A multi-layered circuit board is provided having a buried capacitive layer and a device-specific embedded, localized, non-discrete, and distributive capacitive element. A printed circuit board is provided including (1) a first dielectric layer, (2) a first conductive layer coupled to a first surface of the first dielectric layer, (3) a... Agent: Loza & Loza

20080273312 - Integrated circuit package system with interference-fit feature: An integrated circuit package system is provided including forming an integrated circuit die, forming an interference-fit feature in the integrated circuit die, fitting a support element within the interference-fit feature, connecting an external interconnect and the integrated circuit die, and encapsulating the integrated circuit die.... Agent: Law Offices Of Mikio Ishimaru

20080273313 - Carrier with embedded component and method for fabricating the same: A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through... Agent: Troxell Law Office PLLC

20080273314 - Pcb having embedded ic and method for manufacturing the same: A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to allow electrical connection through the contact-holes; a first integrated circuit arranged in a first insulating layer as one of the insulating... Agent: Cha & Reiter, LLC

20080273316 - Lightweight rigid case for electronic apparatus: The field of the invention is that of electronic apparatus cases and more particularly electronic apparatus cases with which carriers, especially aircraft, are equipped. The electronic apparatus case comprises metal walls (101), (102), (103), (104) that are mounted on reinforcements, the reinforcements comprising two frames (111), (112) and four cross-members... Agent: Lowe Hauptman & Berner, LLP

20080273315 - Rack interface plate: A rack mounting system having an interface plate for electrically connecting components within the rack mounting system to communication media. The interface plate is located within an upper and rear portion of the rack mounting system. The interface plate is of a length slightly smaller than a width of the... Agent: Werner & Axenfeld, LLP