Electricity: electrical systems and devices inventions 05/08

20080123225 - Motor drive apparatus: A motor drive apparatus used for an industrial machine, comprising a converter (4) for converting an AC voltage supplied from an external power source to DC voltage, a capacitor bank (7) connected to the output of the converter (4), and a control apparatus (8) stopping the functions of the capacitor... Agent: Lowe Hauptman Ham & Berner, LLP

20080123226 - Ground fault detector interrupter: A ground fault detector interrupter (GFDI) is described. The GFDI configured for use with a DC power supply and comprises the following elements. A ground current path is provided for coupling a ground terminal of the DC power supply and a system ground. A grounding switch is placed in the... Agent: Jonathan Pollack Gowling Lafleur Henderson LLP

20080123227 - Circuit interrupter with live ground detector: A ground detector circuit in the form of a live ground detector circuit. This live ground detector circuit can be combined with a circuit interrupting device. The circuit interrupting device can have a grounding conductive path, and a set of contacts which are configured to break an electrical connection between... Agent: Collard & Roe, P.C./leviton

20080123232 - Bi-directional transient blocking unit having a dual-gate transistor: An improved bi-directional transient blocking unit (TBU) is provided having a dual-gate central transistor. The gates of the central transistor are connected to the rest of the TBU such that high voltages can only appear between a gate and the central transistor terminal further from that gate. In this manner,... Agent: Lumen Patent Firm, Inc.

20080123231 - Circuit for discharging static electricity: The present invention relates to a semiconductor circuit, and more particularly, to a circuit for discharging static electricity, which is connected between an internal circuit and an input/output pad to provide a charge device model (CDM) discharging path. The circuit includes a plurality of input/output pads; a plurality of switching... Agent: Ladas & Parry LLP

20080123229 - Device for discharging static electricity: A device for discharaging static electricity protects an internal circuit against an electrostatic current. The device includes a discharge part which is connected between an input/output pad and a ground voltage line to form a discharge path discharging an electrostatic current introduced from an input/output pad; and an amplification circuit... Agent: Ladas & Parry LLP

20080123230 - Electrostatic discharge circuit: An electrostatic discharge (ESD) circuit protects an internal circuit against an electrostatic current. The ESD circuit includes a transfer element connected between the input/output pad and any one of voltage lines. A detector detects a voltage caused by the electrostatic current. A transfer unit transfers the electrostatic current to any... Agent: Ladas & Parry LLP

20080123228 - Electrostatic discharge protection circuit for output buffer: An electrostatic discharge protection circuit for an electronic device includes an output buffer including a transistor having a gate configured to receive a control signal, a source connected to a voltage supply terminal, and a drain connected to a pad; and an ESD trigger circuit configured to produce a first... Agent: Xin Wen

20080123234 - Switchgear control apparatus: A switchgear control apparatus includes a zero point interval detecting circuit, an interruption time judgment circuit and a reclosing time decision circuit. The zero point interval detecting circuit detects time intervals between successive zero points of a main circuit current. The interruption time judgment circuit judges that interruption time of... Agent: Buchanan, Ingersoll & Rooney PC

20080123233 - System restart circuit and system restart method thereof: Disclosed are a system restart circuit and system restart method thereof. The system restart circuit includes a capacitive element, a first end of which is coupled to a first voltage level; a restart switch for coupling a second end of the capacitive element to the first voltage level selectively; a... Agent: North America Intellectual Property Corporation

20080123235 - Short circuit protection with reduced offset voltage: Described herein is technology for, among other things, short-circuit protection. The technology involves sensing a current that is based on an output current and generating a current sense signal in response. The technology further involves buffering the current sense signal. The technology further involves limiting the output current when it... Agent: Wagner, Murabito & Hao LLP

20080123236 - Computer apparatus with over-voltage protection function: The present invention discloses a computer apparatus with over-voltage protection function, wherein the over-voltage protection device is electrically connected between the central processing unit (CPU) and the power supply to protect the CPU from damage under the condition of over-voltage failure. The over-voltage protection device comprises a first voltage comparison... Agent: G. Link Co., Ltd.

20080123237 - Method and circuit for amplifying the input signals of an electronic overcurrent release of low-voltage circuit breakers with a selectable amplification factor: A method and a circuit are disclosed for amplifying the input signals of an electronic overcurrent release of low-voltage circuit breakers with a selectable amplification factor. The electronic overcurrent release includes at least one integrating condenser on the input side, and at least one pre-amplifier and a microprocessor. According to... Agent: Harness, Dickey & Pierce, P.L.C

20080123238 - Multiple sensor thermal management for electronic devices: A device includes a current source circuit to separately provide a first current and a second current and a thermal detection device coupleable to the output of the current source circuit. The device further includes a voltage detection circuit to provide a first indicator of a first voltage representative of... Agent: Larson Newman Abel Polansky & White, LLP

20080123239 - Transient voltage surge suppressor: A transient voltage surge suppressor (TVSS) system includes a gas tube connected in series with a clamping component between a first terminal and a second terminal. A voltage sense circuit is connected between the first and second terminals. The voltage sense circuit triggers the gas tube to conduct in response... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20080123240 - Systems and methods for immobilization with repetition rate control: An apparatus impedes locomotion by a human or animal target by conducting a current through the target. The apparatus includes a battery, a circuit, and a processor. The circuit charges a capacitance to a predetermined voltage and discharges the capacitance to provide a pulse of the current. Charging occupies a... Agent: Taser International, Inc.

20080123241 - Mobile electrostatic carrier wafer with electrically isolated charge storage: According to the invention, it is characterized in that in at least one region on which the at least one electrode is arranged, the first layer sequence exhibits at least one tunnel window, and that an electrical voltage can be applied to the substrate in such a way that the... Agent: Barnes & Thornburg LLP

20080123242 - Monolithic capacitive transducer: A capacitive transducer includes a substrate having a first surface and a second surface. The first surface of the substrate defines a first plane. The substrate has a cavity with an interior peripheral edge. The cavity extends between the first surface and the second surface. A body is provided that... Agent: Davis Bujold & Daniels, P.l.l.c.

20080123243 - Ferroelectric capacitor: A ferroelectric capacitor includes: an electrode including a platinum film; a seed layer that is formed above the electrode and is composed of oxide having a perovskite structure expressed by a general formula, A(B1-xCx)O3; and a ferroelectric layer formed above the seed layer, wherein A is composed of at least... Agent: Harness, Dickey & Pierce, P.L.C

20080123244 - Capacitor structure and method of manufacturing the same: In a capacitor structure and a method of manufacturing the capacitor structure, first and second conductive patterns are formed on a substrate. The first and second conductive patterns extend in a first direction. The first and second conductive patterns are alternately arranged to be spaced apart from one another in... Agent: Mills & Onello LLP

20080123245 - Capacitor structure: A capacitor structure includes an insulating layer, first conductive patterns, second conductive patterns, an insulating interlayer, third conductive patterns, and fourth conductive patterns. The first and second conductive patterns are alternately arranged on the insulating layer to be spaced apart from one another. The first and second conductive patterns have... Agent: Mills & Onello LLP

20080123246 - Semiconductor device and method for fabricating the same: A semiconductor device having a metal/insulator/metal (MIM) structure and a method for fabricating the same are provided. The semiconductor device includes a lower structure layer including a metal wiring; and an MIM stack on the lower structure layer; wherein the MIM stack includes a lower metal electrode film formed on... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080123247 - Interposer decoupling array having reduced electrical shorts: A capacitor array with a multiplicity of capacitors with terminations of alternating polarity wherein the terminations are arranged in M columns and N rows. A circuit is provided with terminations in a grid of L columns and K rows wherein the terminations are of alternating polarity with the proviso that... Agent: Nexsen Pruet, LLC

20080123248 - Laminated electronic component and method for manufacturing the same: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080123249 - Laminated electronic component and method for manufacturing the same: A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080123250 - High energy density capacitors and methods of manufacture: A capacitor is provided. The capacitor includes a dielectric polymer film comprising a cyanoresin and at least one electrode coupled to the dielectric polymer film. The capacitor has an energy density of at least about 5 J/cc. A method of making a capacitor is provided. The method includes dissolving a... Agent: General Electric Company Global Research

20080123251 - Capacitor device: A process for forming a capacitive couple. The process includes forming a highly porous body of a conducting material with interior struts and voids in electrical contact. A dielectric layer is formed in the voids on the struts with a material having a dielectric constant above 100. An insulating layer... Agent: Nexsen Pruet, LLC

20080123252 - Solid electrolytic capacitor and forming method for the same: A solid electrolytic capacitor comprising: a valve metal formed with an anodized film; an inner conductive polymer film formed on the anodized film; and an outer conductive polymer film formed on the inner conductive polymer film. The outer conductive polymer film is obtained by: preparing a first polymer solution (PEDOT/PSSA);... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080123253 - Surface-mount type electrolytic capacitor and method of producing the same: An exterior case for a surface-mount type electrolytic capacitor has a box type resin case and an exterior case cover. The resin case incorporates anode terminals and a cathode terminal at the bottom portion and is open upward. The exterior cover covers the top and an outer surface of a... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080123254 - Protection of electrical power transmission systems: A method and apparatus for protecting electrical power transmissions systems that may or may not be energized. A protector and method for protecting a component of an electrical power transmission system. A dielectric cover is molded to fit around the component. The dielectric cover has a peripheral edge including portions... Agent: Lambert Intellectual Property Law

20080123255 - Power distribution apparatus and method: Aspects of the inventive technology may relate to a physical enclosure designed to house electrical componentry inside. More specifically, the inventive technology may relate to a physical enclosure that is designed to allow for the enclosure, perhaps within the same, unitary structure, of conductors (wires) as they enter the ground... Agent: Santangelo Law Offices, P.C.

20080123256 - Busbar assembly: Busbar assemblies are disclosed. The busbar assemblies allow electric current to be distributed through electrically conductive cables that are held in contact with a substantially solid conductive bar by a cable retention system that does not require through-holes in the conductive bar and which decrease the bar's current carrying capacity.... Agent: Tyco Technology Resources

20080123260 - Electronic device: An electronic device including a first housing, a first lock mechanism disposed in the first housing, a second housing, and a second lock mechanism disposed at the second housing is provided. The first housing has a first surface. The second housing pivoted to the first housing is suitable for rotating... Agent: Jianq Chyun Intellectual Property Office

20080123257 - Electronic transmission port cover assembly: An electronic transmission port cover assembly has a body, a sliding bracket and a cover. The body is mounted securely in an electronic device adjacent to an electronic transmission port. The sliding bracket is mounted slidably on the body. The cover is attached pivotally to the sliding bracket and has... Agent: Patenttm.us

20080123259 - Housing with display - and/or operating-element: An economically producible pressure-resistant housing with a display element and/or operating element for use in potentially explosive areas, comprising an inner space which serves to accommodate electronics, and a recess on the outside, inside of which a display and/or operating element is placed whose connecting lines extend into the inner... Agent: Bacon & Thomas, PLLC

20080123261 - Resin molded component fitted with a metal plate and molding method therefor: A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by... Agent: Casella & Hespos

20080123258 - Retainer on a hand-held, portable electronic device to removably hold an attachable audiophone: A retainer assembly is provided for removably retaining an attachable audiophone including a headphone and/or a microphone on a hand-held, portable electronic device that includes device body and device housing with a surface. For removably receiving the audiophone over the device body with an associated flexible audio cord, at least... Agent: Sanjeev Kumar Singh

20080123263 - Electronic device: According to one embodiment, an electronic device is provided with a heat transfer unit and a pressing member. The heat transfer unit includes a heat receiving portion thermally connected to a heat generating component, a heat radiating section thermally connected to a heat radiating part, and a plurality of passages... Agent: Blakely Sokoloff Taylor & Zafman

20080123262 - Portable data terminal and battery therefore: A portable data terminal including an elongated housing and a vertical grip. The housing has a battery well that extends traverse to a longitudinal axis of the housing. A battery pack has a longitudinal axis that, when seated in the battery well, extends traverse to a longitudinal axis of the... Agent: Hand Held Products, Inc.

20080123265 - Device for reproducing information for entertaining or data processing: A device for reproducing information includes an adjustable display unit, which is disposed on a vertical support column in a laterally projecting and height-adjustable manner via a horizontal arm that is connected to the support column and projects laterally therefrom, and an input device. The support column is mounted in... Agent: Foley & Lardner LLP

20080123266 - Display device having a housing with an optical reflecting mirror disposed thereon: A display device is disclosed. The display device includes a bottom base, a housing, a display unit, and an optical reflecting mirror. The housing is connected to the bottom base in a position-adjustable manner. The display unit is disposed on a first side of the housing for displaying an image... Agent: North America Intellectual Property Corporation

20080123269 - Flat panel display having holding structure for thin insertions: An exemplary flat panel display (1) includes a main body (10) and a transparent holding structure (12) fixed to the main body. The holding structure is configured to hold one or more thin insertions by itself at a side thereof and or by cooperation with the main body wherein one... Agent: Wei Te Chung Foxconn International, Inc.

20080123271 - Flat panel display with sandwiched grounding member: An exemplary flat panel display (1) includes a top bezel (10), a display module (12), a bottom tray (14), and a grounding member (16). The top bezel includes a first protrusion (105). The bottom tray is engaged to the top bezel, and includes a second protrusion corresponding to the first... Agent: Wei Te Chung Foxconn International, Inc.

20080123270 - Plasma display device: A plasma display device is constructed with a plasma display panel for visually displaying an image by using a gas discharge, a chassis base coupled to the plasma display panel to support the plasma display panel, a driving board including a board and a circuit device and applying a driving... Agent: Robert E. Bushnell

20080123272 - Plasma display device: A plasma display device includes a plasma display panel having a front panel, a rear panel, and a plurality of address electrodes therebetween, a chassis base affixed to the rear panel of the plasma display panel, a plurality of printed circuit boards which on the chassis base, each printed circuit... Agent: Lee & Morse, P.C.

20080123264 - Surgical machine with stowable display: A surgical machine has a surgical console, a display, and a cover. The surgical console has a cavity that receives the display. The display is connected to the surgical console and communicates with it. The cover is connected to the console and protects the display when the display is stowed... Agent: Alcon

20080123267 - Switch assembly and associated handheld electronic device: An improved switch assembly for use in a handheld electronic device comprises a capacitive sensing system employing a capacitive slider input device to detect navigational inputs, and further provides a pair of switches mounted to the slider on an underside thereof to provide selection or escape inputs as desired.... Agent: Eckert Seamans Cherin & Mellott

20080123268 - Television mount: A mounting assembly for a flat panel display comprising a base panel, a bracket, and a cleat. The bracket connects the display to the base panel at approximately a right angle relative to the base panel. The cleat is in receipt of the base panel to secure the base panel... Agent: Harness, Dickey & Pierce, P.L.C

20080123274 - Cartridge for space-restricted installation in rack-mounted computer system: A computer device includes a chassis, a card connector, and a cartridge. The card connector is attached to the chassis and is adapted to receive a card. The cartridge includes a guide plate, a card holder, and an actuator. The guide plate is removably engaged to the chassis. The card... Agent: Carey, Rodriguez, Greenberg & Paul, LLP Steven M. Greenberg

20080123273 - Circuit board including stubless signal paths and method of making same: A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC C/o Portfolio Ip

20080123276 - Sliding cover faceplate and electronic device using the same: A sliding cover faceplate and an electronic device using the same are provided. The sliding cover faceplate includes a sliding cover, a cover plate, and a sliding structure. The cover plate is provided on the electronic device, and the sliding cover is disposed on one side of the cover plate.... Agent: Rabin & Berdo, PC

20080123275 - Stand for supporting computer: A stand for supporting a computer includes a first receiving space configured for retaining a computer enclosure of the computer, and a second receiving space formed in the vicinity of the first retainer configured for retaining a power supply of the computer.... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080123277 - Internal ufd: The present invention discloses a system including: (a) a host device including: (i) a cavity; and (ii) a socket, recessed in the cavity; and (b) a UFD configured to be reversibly operationally connected to the host device via the socket, wherein the UFD is configured to physically reside substantially in... Agent: Mark M. Friedman

20080123281 - Cable connection apparatus: An exemplary embodiment provides for a cable connection apparatus wherein a connector is mounted on a disk drive chassis, or a sub-assembly attachable to a chassis, such that a cable that connects to the connector will do so along an axis parallel to the chassis or subassembly that the connector... Agent: Law Office Of Mark J. Spolyar

20080123280 - Mounting apparatus for securing data storage device: A mounting apparatus is provided for securing a data storage device. The data storage device has two opposite side walls. Each side wall forms a pair of posts. The mounting apparatus includes a chassis, a bracket mounted in the chassis for accommodating the data storage device, and a latch member... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080123278 - Slot availability indication system and method for indicating slot availability: Disclosed is a slot availability indication system including a RAID, at least one disk tray defining a first slot, second slot, and third slot, the first, second, and third slots being configured to contain a drive and being associated with the RAID, a RAID light indicator, a first, second, and... Agent: Cantor Colburn LLP - IBM Tuscon Division

20080123279 - Storage device: A storage device includes a housing with an opening at the front end for receiving at least one storage container pushed in which can store a storage element, one end of the storage container being provided with a positioning portion; at least one engaging member being jointed rotatably at the... Agent: Troxell Law Office PLLC

20080123287 - Casings for hand-held electronic devices: Two-part casings are described which have the dual function of enclosing and protecting a hand-held electronic device, for example a music player in one portion of the casing and an accessory to the device such as a battery pack or loudspeaker system. The overall assembled casing is still a hand-held... Agent: Breiner & Breiner, L.L.C.

20080123286 - Electronic device: A clamshell type electronic device includes: a first case; a second case; a hinge portion that rotatably couples the first case and the second case to be foldable; a battery chamber that is provided in the hinge portion for accommodating a battery; a battery cover that covers the battery chamber;... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080123283 - Electronic device accessory: An electronic device accessory includes a housing containing electronic circuitry. A plug extends from the housing and the plug is configured to connect to a receptacle of the electronic device. A member is attached to the housing and is moveable with respect to the housing so as to physically interfere... Agent: Warren A. Sklar (soer) Renner, Otto, Boisselle & Sklar, LLP

20080123282 - Expresscard solid-state storage device: An ExpressCard solid-state storage device is disclosed herein, which receives an access command coming from a computational device and accesses data accordingly. The ExpressCard solid-state storage device includes a circuit board, an ExpressCard interface, a flash memory, and a controller. When the ExpressCard interface of the storage device is inserted... Agent: Lin & Associates Intellectual Property, Inc.

20080123285 - Media player system: A media player system is disclosed. One aspect of the media player system pertains to a docking station that allows a media player to communicate with other media devices. Another aspect of the media player system pertains to a wireless media player system that includes a hand held media player... Agent: Townsend And Townsend And Crew, LLP

20080123284 - Server rack door mounted display assembly: A server rack system includes a server rack, a server, a door, and a sub-panel. The server can be generally located within the server rack, and a door is mounted on the front of the server rack. Also, the door is constructed with an opening inside it, and has a... Agent: Larson Newman Abel Polansky & White, LLP

20080123290 - Heat conduction bus, particularly for a microprocessor-based computation unit: A heat conduction bus, particularly for a microprocessor-based computation unit, includes a single starting end, a heat-conducting strip (1) provided with a plurality of tabs (7-12) for solder-connecting to the connection terminals of electronic components likely to become hot, and a collector (4) joined to the strip (1) and arranged... Agent: Young & Thompson

20080123289 - Heat dissipation device: An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080123288 - Operation ready transportable data center in a shipping container: A movable data center is disclosed that comprises a portable container in which an operable computer system is assembled. A data link, power supply link and cooling system are provided through ports on the exterior of the container. The computer system is assembled to a rack that is secured to... Agent: Brooks Kushman P.C. / Sun / Stk

20080123291 - Heat-dissipation apparatus for hard disk: A heat-dissipation apparatus for a hard disk is provided, which is adapted for being configured on a hard disk or in a hard disk slot, and includes a heat-conducting layer and at least one heat-conducting pad disposed on a surface of the heat-conducting layer corresponding to the hard disk. The... Agent: J C Patents, Inc.

20080123294 - Cooling apparatus for memory modules: A cooling apparatus for memory modules includes a pair of heat sinks each has at least one surface forming an air passage to direct airflow. The air passage has at least one inlet and one outlet. An air fan is provided close to the inlet. The heat sinks are bonded... Agent: Troxell Law Office PLLC

20080123293 - Heat dissipation device having a fan holder for attachment of a fan: A heat dissipation device comprises a heat sink, a fan, and a fan holder. The heat sink includes a base and a plurality of fins arranged on the base. The fan includes a frame having an engaging flange at each corner thereof. The fan holder configured for attaching the fan... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080123292 - Reinforced air shroud: An air shroud apparatus includes a base wall. A plurality of support walls extend from the base wall in a spaced apart orientation from each other. A component housing is defined between the support walls and the base wall. A reinforced section is located on the base wall and includes... Agent: Haynes And Boone, LLP

20080123295 - Heat sink backplate module, circuit board, and electronic apparatus having the same: An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source.... Agent: Jianq Chyun Intellectual Property Office

20080123296 - Heat dissipation system: A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the electronic device therein, the enclosure having a base plate on which the printed circuit board is mounted. A spreader... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080123297 - Hybrid clamshell blade system: A hybrid clamshell system encapsulates two of the six sides of an electronic circuit board to provide a high heat density solution and environmental protection. The clamshell enclosures seal to both sides of the PCB and contain fluid shut-off couplings. A two-phase cooling system directs a coolant via a supply... Agent: Dale Mohlenhoff

20080123298 - Electronic apparatus: According to one embodiment, an electronic apparatus has a housing, a first heat emitter and a second heat emitter which are accommodated in the housing, and a cooling device accommodated in the housing. The cooling device includes a heat sink to cool the first heat emitter, a first heat pipe... Agent: Blakely Sokoloff Taylor & Zafman

20080123299 - Circuit device and manufacturing method of the same: A circuit device exhibiting excellent heat radiation properties and a manufacturing method thereof are hereby provided. A circuit device comprises a circuit board, an insulating layer formed on the circuit board, a conductive pattern formed on the insulating layer, a circuit element electrically connected to the conductive pattern, wherein a... Agent: Fish & Richardson P.C.

20080123300 - Folded-sheet-metal heatsinks for closely packaged heat-producing devices: A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes... Agent: Cantor Colburn LLP-ibm Yorktown

20080123301 - Bend radius post: A cable manager is mounted to vertical rails of an enclosure. The cable manager includes a plurality of bend radius posts individually mounted to the enclosure. Each bend radius post includes a shaft and at least one removable retention tab positioned at one end of the shaft. The opposite end... Agent: Panduit Corp.

20080123302 - Circuit module and power line communication apparatus: A circuit module is mounted with an IC that modulates and demodulates a multicarrier signal. The circuit module has a laminated board, which is provided internally with a plurality of conductive layers laminated having insulating layers in between, and an IC, which is provided with a plurality of ground terminals... Agent: Greenblum & Bernstein, P.L.C

20080123303 - Memory module: A memory module includes a memory chip MC1 disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC3 disposed at a position not opposite to the memory buffer via the module substrate, and a memory chip MC11 disposed at a position opposite to... Agent: Mcginn Intellectual Property Law Group, PLLC

20080123304 - Method and/or apparatus for locking circuit packs in a rack: A piece of telecommunications equipment (A) includes: a plurality of circuit packs (20), each circuit pack (20) including a circuit arranged thereon and a first connector (24) in communication with the circuit; a rack (10) including a plurality of slots (12), each slot (12) including a second connector (14) and... Agent: Fay Sharpe/lucent

20080123305 - Multi-channel memory modules for computing devices: A dual-channel memory module for use in computing devices is disclosed. The memory module can include a substrate having a base portion, a first connector portion, and a second connector portion spaced apart and electrically insulated from the first connector portion. A first set of memory devices is disposed on... Agent: Perkins Coie LLP Patent-sea

20080123306 - Circuit board back plate: A back plate can be connected to a circuit board, and the back plate comprises a plastic member with metal elements fixed onto it, and the metal elements have threaded holes for fixing the plastic member onto the circuit board. Compared to the prior art, the back plate has metal... Agent: Rosenberg, Klein & Lee

20080123307 - Printed circuit board, printed circuit board assembly, electronic device, manufacturing method of printed circuit board, and warpage correcting method of printed circuit board: A printed circuit board for mounting an electronic part includes a mounting surface configured so that the electronic part is mounted. A warpage correcting metal pattern is provided on a back surface of the printed circuit board opposite to the mounting surface. The warpage correcting metal pattern may be formed... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080123308 - Printed circuit board including embedded passive component and method of fabricating same: Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminals is vertically formed through the... Agent: Darby & Darby P.C.

20080123309 - Slim design main board: A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess.... Agent: Cha & Reiter, LLC

20080123310 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080123311 - Ic chip package having force-adjustable member between stiffener and printed circuit board: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip carrier by a land grid array (LGA) connector; a metal stiffener including at least one force-adjustable member contacting an underside of the PCB; and at least... Agent: Hoffman, Warnick & D'alessandro LLC

20080123312 - Multiple-board power converter: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted... Agent: Carstens & Cahoon, LLP

20080123313 - Semiconductor mount: A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A... Agent: Haverstock & Owens LLP

20080123314 - Electronic device: An electronic device includes a housing, a first connecting element, a second connecting element, and a lens module. In this case, the first connecting element pivots on the housing, and deflects relative to the housing in a first swing direction. The second connecting element pivots on the first connecting element,... Agent: Birch Stewart Kolasch & Birch

20080123315 - Display filter, method of manufacturing display filter, and plasma display apparatus using the display filter: A plasma display apparatus comprises plasma display panel and a display filter. The plasma display panel that receives a driving voltage through a scan electrode, a sustain electrode, and data electrodes to emit light. The display filter provided over the plasma display panel. The display filter comprises a base layer... Agent: Fish & Richardson P.C.

20080123316 - Electromagnetic interference shielding apparatus for signal transceiver: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an... Agent: Oliff & Berridge, PLC

20080123317 - Flat panel display having shield cover for electromagnetic interference protection: An exemplary flat panel display (200) includes a display module (210), a printed circuit board (220), and a shield member (230). The display module includes a rear surface (212) and a side surface 214 adjacent to the rear surface. The printed circuit board is electrically coupled to the display module.... Agent: Wei Te Chung Foxconn International, Inc.

20080123318 - Multi-component electronic package with planarized embedded-components substrate: An electronic multi-component package is assembled by placing multiple electronic components within multiple openings of a package substrate, then depositing and curing adhesive filler in gaps between the components and the inner peripheries of the openings. Circuit features, including conductive interconnects, are formed by thin-film photolithography over both front and... Agent: Schneck & Schneck

20080123320 - Card connector with ejector: A card connector adapted for receiving a card, comprises an insulating housing defining a card insertion/ejection direction; a plurality of contacts received in the insulating housing, a shell and an ejector. The shell covers the insulating housing and is formed with a receiving portion. The receiving portion comprises an upper... Agent: Wei Te Chung Foxconn International, Inc.

20080123319 - Memory card connector: A memory card connector has an insulative housing, a power switch and a plurality of conductive terminals. The power switch is mounted in the insulative housing, to detect a memory card and has a first detecting terminal and a second detecting terminal. The first and second detecting terminals are mounted... Agent: Birch Stewart Kolasch & Birch

20080117555 - Anti-arcing system for power surge protectors: A surge suppression unit includes a circuit board containing electrical surge suppression components configured to redirect power surges. Anti-arcing separator walls are vertically aligned in between at least some of the electrical components for reducing electrical arcing. An epoxy may be spread in between the surge suppression components to both... Agent: Marger Johnson & Mccollom, P.c.

20080117557 - Power semiconductor device: A power semiconductor device includes a power semiconductor element, a protection circuit, an inspection terminal, and an electrical conductor. The protection circuit includes multiple zener diodes connected in series between a gate and an emitter of the power semiconductor element. The protection circuit limits a voltage between the gate and... Agent: Posz Law Group, Plc

20080117556 - Suppression circuit with high voltage isolation and surge suppression: A suppression circuit with high voltage isolation and surge suppression, which utilizes a safety capacitor to replace the surge protector and the capacitor in a conventional circuit, is provided. Therefore, the cost is greatly reduced. Via the characteristic of the safety capacitor, the suppression circuit can simultaneously meet the requirements... Agent: Dr. Banger Shia

20080117558 - System having electrostatic discharge protection structure and method for manufacturing the same: A system having an electrostatic discharge protection structure and a method for manufacturing the structure are provided. The structure comprises a conducting layer, a material layer and a bridging layer wherein the conducting layer is divided into a first conducting portion and a second conducting portion to form a gap... Agent: Patterson, Thuente, Skaar & Christensen, P.a.

20080117559 - Automatic output mode select for an actuator controller: Methods and systems are disclosed for automatically controlling the mode of an output that can be coupled to one of several types of actuators or the like. In one illustrative embodiment, an actuator controller is provided that can automatically detect what controlled mode an output of the controller should be... Agent: Honeywell International Inc.

20080117560 - Minimal capacitance adjustable capacitor: A pair of conductors, spaced apart on the same first surface, form stators of a pair of series connected capacitors in combination with a floating moveable conductor disposed on a parallel second surface with a dielectric in the space between first and second surfaces. The floating conductor has sufficient area... Agent: Varian Inc. Legal Department

20080117561 - Monolithic semiconductor ceramic capacitor having varistor function and method for manufacturing monolithic semiconductor ceramic capacitor: A monolithic semiconductor ceramic capacitor includes semiconductor ceramic layers made of a semiconductor ceramic having a Sr site and a Ti site. The semiconductor ceramic satisfies the inequality 1.000<m≦1.020, wherein m represents the molar ratio of the Sr site to the Ti site. The semiconductor ceramic contains crystal grains and... Agent: Dickstein Shapiro LLP

20080117563 - All-solid-state electric double layer capacitor: Disclosed is an all-solid-state electric double layer capacitor comprising a solid electrolyte and a current collector, wherein the solid electrolyte is an inorganic solid electrolyte. Such a capacitor has high capacity and is free from any fear of leakage of an electrolytic solution, and also ensures high heat resistance and... Agent: Mcdermott Will & Emery LLP

20080117562 - Electrode for capacitor and electric double layer capacitor using the same: An electrode for an electric double layer capacitor including a current collector electrode and an active substance carried on the current collector electrode, wherein the active substance is composed of a carbon-based fiber and a conductive polymer fiber formed by the electrospinning method, whereby a high capacity capacitor electrode having... Agent: Connolly Bove Lodge & Hutz LLP

20080117564 - Dry particle based energy storage device product: An inexpensive and reliable dry process based capacitor and method for making a self-supporting dry electrode film for use therein is disclosed. Also disclosed is an exemplary process for manufacturing an electrode for use in an energy storage device product, the process comprising: supplying dry carbon particles; supplying dry binder;... Agent: Maxwell Technologies, Inc.

20080117565 - Dry particle based energy storage device product: An inexpensive and reliable dry process based capacitor and method for making a self-supporting dry electrode film for use therein is disclosed. Also disclosed is an exemplary process for manufacturing an electrode for use in an energy storage device product, the process comprising: supplying dry carbon particles; supplying dry binder;... Agent: Maxwell Technologies, Inc.

20080117566 - Electrolytic capacitor: An electrolytic capacitor comprises two lead tab terminals and a sealing rubber packing. Each of the lead tab terminals includes a boss member, a rib member and a flat member. The boss member comprises a coupling member and a large member. The diameter of the coupling member is the same... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080117567 - Chip-type aluminum electrolytic capacitor: A chip-type aluminum electrolytic capacitor is provided that allows a lead wire exposed from an insulated terminal plate to have an increased temperature sooner than the other parts to provide highly-reliable soldering in a relatively-easy reflow atmosphere environment and that has a superior vibration resistance. The capacitor includes an insulated... Agent: Wenderoth, Lind & Ponack L.l.p.

20080117568 - Multiple fused junction with blown fuse indication: A multiple fused junction with blown fuse indication which generally includes a main body, a fuse connected to the main body and a switch disposed within the main body. The main body has multiple cable ports extending outwardly therefrom. At least one of the ports is adapted for electrical connection... Agent: Hoffman & Baron, LLP

20080117569 - Power-supplying device: A power-supplying device includes a casing, a power-supplying unit, and a fan. The casing has a set of exhausting holes. An arrangement hole forms on an upper surface of the casing. The power-supplying unit is received in the casing. The fan corresponds to the arrangement hole and is obliquely disposed... Agent: Rosenberg, Klein & Lee

20080117572 - Foldable electronic device: The invention relates to a foldable electronic device comprising a casing (1) with a top cover (2) and a base cover (3), a display (5) and a keyboard (8) with a plurality of keycaps. To provide a foldable electronic device which is more comfortable to use and which does not... Agent: Ware Fressola Van Der Sluys & Adolphson, LLP

20080117571 - Foldable keyboard: A foldable keyboard applicable in a notebook computer is provided. The notebook computer includes a body provided with a keyboard accommodation groove for accommodating and holding the foldable keyboard. Furthermore, the foldable keyboard includes at least one separating segment and a fixed body connected with the separating segment by an... Agent: Birch Stewart Kolasch & Birch

20080117573 - Slide type portable terminal: A slide type portable terminal can include a main unit including separated first and second key sections and a first plate coupled to a surface of the main unit and a display unit with a display screen on a front surface and a second plate. The second plate can slide... Agent: Lee, Hong, Degerman, Kang & Schmadeka

20080117570 - Support structure for portable electronic device: Disclosed herein are structures for supporting a clamshell- or slider-type portable electronic device such as a notebook computer; personal digital assistant; or wireless telephone. The clamshell- and slider-type portable electronic devices typically have at least two assemblies—a first housing assembly, and a second housing assembly containing at least a keyboard.... Agent: Harrington & Smith, Pc

20080117577 - Chassis, backlight unit, liquid crystal display having the same, and method thereof: Disclosed are a chassis, and a backlight unit and a liquid crystal display including the chassis. The chassis includes a first chassis member that includes a first base plate, a first wall extending from the first base plate in a first direction, and a first cover plate extending from the... Agent: Cantor Colburn, LLP

20080117575 - Display device with improved heat dissipation: A display device comprising a display panel for displaying an image, a chassis base coupled to the display panel to support the display panel, the chassis base having at least one chassis base hole, and at least one reinforcing member formed on the chassis base such that the at least... Agent: Christie, Parker & Hale, LLP

20080117579 - Flat panel display with detachable base: An exemplary flat panel display includes a display body, a neck pivotally engaged to the display body, and a base supporting the neck. The neck includes an inner screw thread. The base includes a screw bolt threadingly coupled to the screw thread of the neck such that the neck is... Agent: Wei Te Chung Foxconn International, Inc.

20080117576 - Mobile device housing with a display unit, and method for making the mobile device housing: A housing assembly (100), used, e.g., in a mobile device (300), includes a housing body (10) and a display unit (20). The housing body a view opening (110). The display unit is received in the view opening and is configured for providing information and/or graphics. The housing body moldingly receives... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117578 - Multi-monitor support structure: Described herein is a multi-monitor support structure having a first monitor, a second monitor, a column, an arm coupled to the column for supporting the first monitor and the second monitor, a first coupling unit for coupling the first monitor to the arm, and a second coupling unit for coupling... Agent: Mass Engineered Design Inc.

20080117574 - Thin-type display: A thin-type display including: a panel main body having a panel, a frame for accommodating the panel and a transmission interface for receiving signals; a movable bracket having a connecting section fixedly connectable to the back of the panel main body and a fixing section pivotally connected with the connecting... Agent: Troxell Law Office Pllc Suite 1404

20080117580 - Self-balancing adjustable flat panel mounting system: A self-balanced adjustable mounting system for a flat panel display. A display interface having a hollow, semi-spherical shell portion is attached to the flat panel display. The semi-spherical shell is formed with a generally constant radius of curvature. The center of the radius of curvature is disposed proximate the center... Agent: Patterson, Thuente, Skaar & Christensen, P.a.

20080117581 - Laptop computer with replaceable camera module: A laptop computer is disclosed. The laptop computer comprises a processor, a memory, a graphics controller, a display panel and a display housing. The display housing is for holding the display panel. The display housing has an opening for fixing a replaceable camera module or a replaceable cover module selectively.... Agent: Law Offices Of Lai And Associates, P.c.

20080117582 - Stand for supporting computer: A stand for supporting a computer enclosure includes a bracket, a support member, and a securing member. The bracket includes a first fixing portion and a second fixing portion at opposite ends thereof. The first fixing portion includes a first sidewall extending up and located at a side of the... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117583 - Information handling system utilizing circuitized substrate with split conductive layer: An information handling system, e.g., a mainframe computer, which includes as part thereof a housing having therein an electrical assembly including a circuitized substrate which in turn includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP

20080117584 - Latching mechanism: A latch mechanism comprising a frame having an insertion axis therethrough. A first latch spring is disposed on the frame and is biased to an extended position. A handle is connected to the frame and is movable along the insertion axis between a first position and a second position. A... Agent: Hewlett Packard Company

20080117585 - Accessible electronic storage apparatus: A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080117586 - Accessible electronic storage apparatus: A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080117587 - Computer enclosure with disk drive bracket: A computer enclosure includes a disk drive bracket (10) and a chassis (20). The disk drive bracket includes a bottom wall (12), at least a fixing hole (121) is defined in the bottom wall of the disk drive bracket, a plurality of parallel slideways (123) extend from the bottom wall... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117588 - Extended input/output card capacity computer system: In one embodiment, a computer system comprises at least one input/output device, and a motherboard designed in compliance with an ATX form factor standard and comprising eight slots to receive input/output cards.... Agent: Hewlett Packard Company

20080117589 - Self adjusting air directing baffle: An air directing apparatus includes a base defining a component housing. A baffle member is moveably coupled to the base and operable to move into and out of the component housing such that the baffle member may engage a component located in the component housing. An air directing member is... Agent: Haynes And Boone, LLP

20080117590 - System and method for cooling electronic systems: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in... Agent: Cantor Colburn, LLP

20080117591 - Electric connection box: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case vertically housing the circuit board, an air ventilation path extending between the non-mounting surface of the... Agent: Oliff & Berridge, Plc

20080117592 - Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region: An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow... Agent: Heslin Rothenberg Farley & Mesiti P.c.

20080117595 - Operating housing: An operating housing including four lateral walls, a front wall, and a rear wall, and a cooling device for carrying off dissipated heat from integrated electronic components. This invention provides an operating housing which has a compact structure and efficiently cools electronic components. Thus, the cooling device has a cooling... Agent: Pauley Petersen & Erickson

20080117594 - Thermal module with centrifugal blower and electronic assembly incorporating the same: An electronic assembly includes an enclosure including a top cover and a bottom cover, and a thermal module arranged between the top cover and the bottom cover of the enclosure. The thermal module includes a centrifugal blower and a fin assembly arranged in an air outlet of the centrifugal blower.... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117593 - Variable mount voltage regulator: Various integrated circuit voltage regulation apparatus and methods of assembling the same are provided. In one aspect, an apparatus is provided that has a stack that includes a heat sink and a semiconductor chip. The semiconductor chip has a conductive heat transfer pathway to the heat sink. A voltage regulator... Agent: Timothy M Honeycutt Attorney At Law

20080117596 - Axial-flow fan unit and heat-emitting element cooling: An axial-flow fan unit that produces less noise is provided. Blades 19 are exposed from a venturi 29. The shape of each of the blades 19 is so defined that a space formed between at least an inner surface 28a of each of web leg sections 28A to 28C and... Agent: Rankin, Hill & Clark LLP

20080117597 - Light emitting diode module having a thermal management element: An LED module includes an LED, a heat spreader contacting the LED, a heat-dissipating unit remote from the LED and a heat transfer member. The heat transfer member thermally connects the heat spreader and the heat-dissipating unit and transfers heat from the heat spreader to the heat-dissipating unit.... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117598 - Thermal management module and electronic assembly using the same: A thermal management module includes a heat absorber, a fixing element, an elastic element and a confining structure is provided. The heat absorber has a through hole. The through hole has a first end, a second end, and a shoulder. The shoulder is located between the first end and the... Agent: Jianq Chyun Intellectual Property Office

20080117599 - Portable electronic device: A portable electronic device includes a heat source which generates heat in association with generating, charging, or consuming electric power. A housing base member is disposed in proximity to the heat source, and a radiation film is disposed on at least a portion of an external surface of the housing... Agent: Frishauf, Holtz, Goodman & Chick, Pc

20080117600 - Clamping system for areas with limited accessibility: A clamping system is disclosed that includes at least one rigid clamp member. The rigid clamp member has an angled surface operable to hold a structure against a mounting surface, and the rigid clamp member is configured to be attached to the mounting surface. The clamping system also includes at... Agent: Fogg & Powers Llc

20080117601 - Combination assembly of led and liquid-vapor thermally dissipating device: An LED and liquid-vapor heat-dissipating device assembly is composed of a liquid-vapor heat-dissipating device and at least one LED unit. The liquid-vapor heat-dissipating device includes a metal housing, a predetermined amount of liquid, and a capillary member. The LED unit includes an LED chip mounted to and electrically connected with... Agent: Bacon & Thomas, Pllc

20080117602 - Power inverter having liquid cooled capacitor and low inductance bus structure: A power inverter is provided. The power inverter includes a housing having first and second openings therein and at least partially defining a cavity and a fluid passageway on first and second sides of the cavity. First and second power modules are connected to the housing on the respective first... Agent: General Motors Corporation Legal Staff

20080117603 - Installation mechanism: An apparatus for installing a module in a computer system. In one embodiment, the apparatus includes a sliding member movably coupled to a base of a module, where the sliding member includes a handle that allows a user to move the sliding member. The apparatus also includes one or more... Agent: Sawyer Law Group LLP

20080117604 - Mounting apparatus for motherboard: A mounting apparatus for fixing a motherboard having a plurality of fixing holes defined therein. The motherboard includes a first face and a second face; the mounting apparatus includes a supporting stage and a plurality of fixing poles. The supporting stage includes a first supporting surface and a second supporting... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117605 - Electronic device having holding members: An electronic device, comprises a cage (10) and a peripheral component (20). The cage comprises an inner sidewall (14), and an external sidewall (12) parallel to the inner sidewall, a receiving slot (15) formed between the inner sidewall and the external sidewall, and a shaft (152) formed at an end... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080117607 - Electronic component and method for manufacturing the same: A method of manufacturing an electronic component includes the steps of a) forming a plurality of wiring boards that include first through holes penetrating through a semiconductor substrate and conductive material buried in the first through holes; b) providing conductive projections on the conductive material of any of the plurality... Agent: Rankin, Hill & Clark LLP

20080117606 - Printed circuit board with embedded circuit component: In one embodiment, a printed circuit board includes a plurality of insulating layers in which an aperture is formed through some of the layers. A resistive plug at least partially fills the aperture and contacts respective conductive members at each end of the resistive plug to form a resistive via... Agent: Warren A. Sklar (soer) Renner, Otto, Boisselle & Sklar, LLP

20080117609 - Multi-layer electronic part built-in board: A versatile multi-layer electronic part built-in board compatible with different external circuits to be connected thereto is provided. Sensors are connected to a connector through connection lines that are connected to electronic parts. The electronic parts are directly connected to the connector and can be mounted on the top layer,... Agent: Posz Law Group, Plc

20080117608 - Printed circuit board and fabricating method thereof: Disclosed are a multi-layer PCB and a fabricating method thereof. The multi-layer PCB includes: a core; a plurality of insulation layers and a plurality of conductive pattern layers alternatively stacked on both sides of the core; and a plurality of via holes formed through the core and the insulation layers.... Agent: Cha & Reiter, Llc

20080117610 - Electronic device mounting apparatus: The present invention relates to the mounting of electronic display devices with portals for attaching various other electronic devices using cables in a streamlined, versatile fashion. More specifically, the present system relates to an apparatus that provides cable management for electronic devices such as audio speakers, LCD projectors, electronic text... Agent: Klauber & Jackson

20080117611 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080117612 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080117613 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080117614 - Microphonics suppression in high-speed communications systems: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the... Agent: Thelen Reid Brown Raysman & Steiner LLP

20080117615 - Plasma display device: A Plasma Display Device having a chassis base which absorbs vibration and noise includes: a Plasma Display Panel (PDP) on which images are displayed; circuit board assemblies to control the PDP; and a chassis base having the PDP and the circuit board assemblies attached thereto, the chassis base including: a... Agent: Robert E. Bushnell

20080117616 - Means for mechanical registration and mechanical-electrical coupling of a faraday shield to a photodetector and an electrical circuit: A spectrophotometric sensor is provided that includes a mating surface upon which electrical and optical components may be secured and a Faraday shield assembly secured to the mating surface enclosing a photodetector. The Faraday shield assembly includes alignment features that may be employed to provide mechanical registration and/or electrical coupling... Agent: Nellcor Puritan Bennett Llc Attn: Ip Legal

20080112097 - Arc suppression circuit using a semi-conductor switch: An arc suppression circuit in a protection relay having trip contacts is used to turn off a battery-powered solenoid and trip an AC power circuit breaker. The arc suppression circuit uses a switch-control circuit to control the turning off of a semi-conductor switch so that the semi-conductor switch provides a... Agent: Abb Inc. Legal Department-4u6

20080112099 - ground-fault circuit interrupter: An improved ground-fault circuit interrupter (GFCI) device has a moveable lock plate controlled by a relay to block a hole under the reset guiding member to prevent reset of the device. The moveable lock plate blocks the hole and prevents reset when the relay is not energized, and expose the... Agent: Ying Chen Chen Yoshimura LLP

20080112098 - Separate box assembly for voltage surge protection: A separate box assembly for protecting telecommunications related equipment and associated sensitive electrical loads connected to AC electrical power lines components from AC transient voltage surges includes a circuit breaker panel disposed in an electrical power distribution network for receiving incoming power lines. Distinct branch circuits are coupled through household... Agent: Illinois Tool Works Inc.

20080112100 - Digital electric leakage detecting and monitoring device: A digital electric leakage detecting and monitoring device includes a leakage current detection element connected to an AC power supply loop. When an outgoing current supplied from an AC line source to a load is not equal to a backflow current flowed from the load back to the AC line... Agent: Rosenberg, Klein & Lee

20080112101 - Transmission line filter for esd protection: An integrated circuit chip has on-chip millimeter wave (mmW) circuitry. An on-chip electro static discharge, ESD, protection network couples a signal pad of the chip to the mmW circuitry. The ESD protection network has a shorted stub being a low impedance path to ground for ESD events. Other embodiments are... Agent: Blakely Sokoloff Taylor & Zafman

20080112103 - Constant voltage output circuit: A constant voltage output circuit has an output power transistor supplied with electric power form a first input power source and a control circuit supplied with electric power from a second input power source. Here, when the voltage from the first input power source is equal to or higher than... Agent: Nixon & Vanderhye, Pc

20080112102 - Sampling frequency control method and protective relay: A sampling frequency control method includes a difference calculating step ST1 of calculating the difference between sampled values obtained through sampling of an AC quantity of electricity of a power system at time points that are separated by a prescribed time period of the AC quantity of electricity; an effective... Agent: Buchanan, Ingersoll & Rooney Pc

20080112104 - Grounding device for automated guided vehicles: A device and method is provided for use in connection with electrically grounding an automated guided vehicle. A grounding strap is suspended from the automated vehicle for contacting an electrical conductive ground device mounted to a floor along a travel path of the automated guided vehicle. In operation, the grounding... Agent: Dickinson Wright Pllc

20080112105 - Static electricity dissipation device for vehicles: Apparatus and methodology for discharging static electricity from a vehicle which uses a discharge mechanism that does not contact the roadway (Earth) when the vehicle is in forward motion to reduce, or completely avoid, frictional wear on the discharge mechanism. In one embodiment, the displacement between the discharge mechanism and... Agent: Verizon Patent Management Group

20080112106 - Photomultiplier tube circuit: A photomultiplier tube circuit with reduced power consumption comprising a photomultiplier tube having a plurality of dynodes, charging circuitry for providing charge to the plurality of dynodes and an oscillator for providing a high voltage supply to the charging circuitry characterised in that the photomultiplier tube circuit further comprises means... Agent: Nixon & Vanderhye, Pc

20080112107 - Method for controlling an electrical discharge using electrically conductive fluid materials: The method of this invention uses selected conductive fluid substances such as common saltwater, suspensions, colloids, and gases to electrically connect electrically charged electrodes and pass electricity through the selected substance thereby discharging some or all of the electrical charge accumulated in a power system without the need for complex... Agent: Walter W. Stumberger

20080112108 - Method for forming mim in semiconductor device: The present invention relates to a semiconductor device, and more particularly to a method for forming a metal/insulator/metal (MIM). The method comprises the steps of: forming a metal wiring surrounded by the inter-metal dielectric film; forming a plurality of insulating film on the metal wiring in sequence; and forming a... Agent: Sherr & Nourse, Pllc

20080112109 - Dielectric ceramic and multilayer ceramic capacitor: A dielectric ceramic includes a compound represented by the general formula: (Ba1-tCat)m(Ti1-u-xZruCux)O3 (where 0.96≦m≦1.02, 0.001≦x≦0.03, 0≦t≦0.1, and 0≦u≦0.06) as a primary component, a rare earth element Re such as Dy, a metal element M such as Mn, Mg, and Si. In the dielectric ceramic, the Cu is uniformly and dispersedly... Agent: Dickstein Shapiro LLP

20080112110 - Method of making thin-film capacitors on metal foil using thick top electrodes: Methods of making thin film capacitors formed on foil by forming onto a thin film dielectric in a single deposition event an integrally complete top electrode having a minimum thickness of at least 1 micron.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080112111 - Generation of multipolar electromagnetic energy: A method and system of generating multipolar electromagnetic energy from bipolar electromagnetic energy, comprising supplying bipolar electromagnetic energy to plural cascades in a bipolar electromagnetic circuit such that at least a portion of said bipolar energy is converted into multipolar energy therein and separating said multipolar energy from other forms... Agent: Miles & Stockbridge Pc

20080112112 - Electric double-layer capacitor: An electric double-layer capacitor includes: a positive electrode containing a carbon material; a negative electrode containing a carbon material and a titanium oxide; and an electrolytic solution containing an ammonium salt. A weight ratio of the titanium oxide to the carbon material contained in the negative electrode is 2% by... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080112114 - Portable electronic device: A portable electronic device includes a casing, an active function area, a passive function area and at least a heat pipe is provided. The active function area is provided inside the casing. The active function area has at least one processor, at least one input device and at least one... Agent: Jianq Chyun Intellectual Property Office

20080112113 - Portable electronic device including hinge assembly with user interface element: A portable electronic device, for example, a cellular telephone, (100) including a hinge assembly (106) interconnecting first and second housing portions, wherein the housing portions are pivotal about respective non-collinear pivot axes, and a user-interface element, for example, an image capture or a display device, disposed on the hinge assembly.... Agent: Motorola Inc

20080112119 - Flat panel display having button device integrated with front bezel: An exemplary flat panel display (2) includes a front bezel (21), a back cover (22), a display panel (23), and a button circuit board (28). The front bezel and the back cover cooperatively define a space for accommodating the display panel and the button circuit board. The front bezel includes... Agent: Wei Te Chung Foxconn International, Inc.

20080112115 - Packaging structure for flat panel display: The present invention discloses a packaging structure, which includes an external box, a lower box and cushions, for packing a display panel and a base of a flat panel display simultaneously, wherein the bottom of the lower box is provided for wrapping the top of the display panel, and the... Agent: Bacon & Thomas, Pllc

20080112117 - Plasma display device: A display device is provided including a display panel for displaying an image, the display panel having substrates and electrodes located between the substrates. The display device also includes a chassis base supporting the display panel and a plurality of printed circuit board assemblies mounted in the chassis base for... Agent: Christie, Parker & Hale, LLP

20080112116 - Portable display device: A portable display device includes a display panel, a light source supplying light to the display panel, a mold frame supporting the display panel and surrounding at least two sides of the light source, and a relief unit between the mold frame and the light source.... Agent: Lee & Morse, P.c.

20080112118 - Function expanding method for small-sized display device: The function expanding method for a display device comprises: a step of preparing a plurality of types of function expanding modules; a step of selecting a function expanding module or modules from the plurality of types of function expanding modules; and a step of stacking the selected single or plurality... Agent: Mcdermott Will & Emery LLP

20080112122 - Mobile storage device mounting structure: A mobile storage device mounting structure in which two positioning strips respectively fastened to the two opposite lateral sides of a mobile storage device by forcing the positioning pins of the positioning strips into the respective pin holes, and then the positioning strips are inserted with the mobile storage device... Agent: Troxell Law Office Pllc

20080112120 - Notebook computer with replaceable battery holder module: A notebook computer with a replaceable battery holder module is provided, which comprises a notebook computer system and a replaceable battery holder module. With the setting of the replaceable battery holder module, when the original standard-equipped rechargeable battery or backup battery is running low, an ordinary long-life alkaline battery or... Agent: Harness, Dickey & Pierce, P.L.C

20080112121 - Power supply device mounting structure and its mounting procedure: A power supply device mounting structure includes a circuit board, which has two rows of pins arranged in parallel at the top side for power input and a bottom power connector connectable to a power connector on a motherboard for power output, and A DC-to-DC Power Module, which is connected... Agent: Rosenberg, Klein & Lee

20080112124 - Flush form factor for usb storage device: A solid-state non-volatile storage device may be configured such that, when plugged into a computer system, the storage device is approximately flush with the side of the computer system, with the storage device's smallest overall dimension approximately perpendicular to the side of the computer system.... Agent: Intel Corporation C/o Intellevate, Llc

20080112123 - Housing of an electrical card: The invention provides a housing for an electrical card, which is an RSMMC memory card. The housing includes a metal cover and a frame integrally formed at a periphery of the metal cover by way of injection molding. A long frame is formed with a long slot for accommodating a... Agent: Nikolai & Mersereau, P.a.

20080112125 - Portable hard drive with axis specific shock absorption: A portable hard disk drive includes a housing, a hard drive assembly disposed within the housing, and isolation material coupled to the hard drive assembly. The housing forms an enclosure defined by opposing first and second ends, opposing sides extending between the opposing first and second ends, and a top... Agent: Attn: Eric D. Levinson Imation Corp.

20080112126 - Releasing device for releasing hard disk drive: A releasing device for releasing the hard disk drive is provided. The releasing device includes a housing, a first releasing component, a second releasing component and a third releasing component. The housing is used to contain the hard disk drive therein. The first releasing component is mounted on the housing... Agent: Haverstock & Owens LLP

20080112128 - Cooling methods and apparatus: Computer cooling equipment for computer equipment comprises: a primary heat transfer circuit; a secondary heat transfer circuit containing a secondary heat transfer fluid, a secondary condenser cooled by the primary heat transfer circuit and a secondary evaporator for cooling the computer equipment; and is characterised in that the secondary heat... Agent: Harness, Dickey & Pierce, P.L.C

20080112127 - Cooling system with angled blower housing and centrifugal, frusto-conical impeller: An improved cooling system for a computer is disclosed. In one embodiment, the improved cooling system includes an angled blower housing and a frusto-conical, centrifugal impeller. The computer chassis has a chassis air inlet and a chassis air outlet. A blower housing is disposed in the computer chassis. The blower... Agent: Ibm Corporation (ss/nc) C/o Streets & Steele

20080112129 - Enclosure for electrical system: An enclosure for electrical system includes a side plate and an adjusting piece movably attached to the side plate. The side plate includes a heat dissipating part in which a plurality of heat dissipating holes is defined. The adjusting piece is movable with respect to the heat dissipating part for... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080112130 - Housing temperature suppressing structure in electronic device and portable computer: The present invention provides a portable computer in which an increase in temperature of a housing is suppressed. In the present invention, a guide plate is provided to suppress an increase in temperature of a bottom surface. When a cooling fan device operates, outside air taken in from inlet openings... Agent: Kunzler & Mckenzie

20080112131 - Current sensing temperature control circuit and methods for maintaining operating temperatures within information handling systems: An information handling system including a system fan control is disclosed. The information handling system can include a power trace operable to produce a temperature differential in response to a current change within the reduced trace width region. A thermistor may be provided in close proximity to the reduced trace... Agent: Larson Newman Abel Polansky & White, LLP

20080112132 - Electric power module: The present invention relates to an electric power module for assembly on a printed circuit board (46), comprising a circuit carrier (212) and a housing (214) for assembly of a heat sink (45), wherein the circuit carrier (212) is arranged on the printed circuit board (46) so as to be... Agent: Barley Snyder, Llc

20080112133 - Switch chassis: A switch chassis includes a plane having pass-through vias. An array of connector pairs is provided. A connector pair includes a first multi-path connector on first side of the plane and a second multi-path connector on the second side of the plane interconnected through the pass-through vias in the plane.... Agent: Sun Microsystems Inc. C/o Park, Vaughan & Fleming LLP

20080112134 - Dust accumulation resistant heat sink: A heat sink configured for cooling an integrated circuit comprises a plurality of fins arranged in substantially parallel planes and separated by a plurality of gaps. The parallel planes are adapted for usage in an arrangement parallel to an airflow direction and having a leading edge with respect to the... Agent: Hewlett Packard Company

20080112135 - Outdoor medium voltage drive: A heat-dissipating cabinet structure may use a heat exchanger mounted at a boundary between an interior cabinet portion and an exterior portion, and heat-generating devices medium-voltage devices (such as high isolation IGBT or diode devices) may be mounted on the interior portion of the heat exchanger. The IGBT or diode... Agent: Banner & Witcoff, Ltd.

20080112136 - Circuit board adapted to fan and fan structure: A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and... Agent: Pai Patent & Trademark Law Firm

20080112137 - Cooling device for inverter and ldc elements for hev: The present invention relates to a cooling device for inverter and DC/DC converter (LDC) elements for hybrid electric vehicle (HEV) and, more particularly, to a cooling device for inverter and LDC elements for HEV that enhances the cooling efficiency by applying a cooling device that uses a heat pipe principle... Agent: Morgan, Lewis & Bockius LLP (sf)

20080112138 - Fastener and heat dissipation module having the same: A fastener including a body, multiple hooks, a pressing structure, and a connecting rod is provided. The body has a first end, a second end, and a through hole passing through from the first end to the second end. The hooks are provided in the first end, and the pressing... Agent: J C Patents, Inc.

20080112139 - Power converter package and thermal management: Power conversion apparatus can include a circuit board with power conversion circuitry and a package. The package may be formed by encapsulating areas of the circuit board assembly either before or after the interface contacts are attached to the circuit board. A method for encapsulating two sides of a substrate... Agent: Fish & Richardson P.c.

20080112140 - I/o module with configurable asics that include a matrix switch: An I/O module for use with I/O devices such as pumps, valves, thermocouples, and mass flow controllers includes an application-specific integrated circuit (ASIC) associated with each electrical signal interface to an I/O device. Additionally, a matrix switch is incorporated into each of the ASICs in order to enable electrical signals... Agent: Kathy Manke Avago Technologies Limited

20080112141 - Module with carrier element: The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a... Agent: Patterson & Sheridan, LLP Gero Mcclellan / Qimonda

20080112142 - Memory module comprising memory devices: A memory module comprises a printed circuit board with a main surface bounded by a first side and a second side, the first side being longer than the second side, a first and a second generally rectangular memory device each having a long side and a short side, the first... Agent: Patterson & Sheridan, LLP Gero Mcclellan / Qimonda

20080112143 - Integrated circuit packages including damming and charge protection cover for harsh environments: An electronic assembly for use in a downhole tool includes a damming boot deployed about at least one integrated circuit component on a circuit board. The boot is disposed to house the integrated circuit leads and solder joints in a substantially sealed cavity between the circuit board, the integrated circuit... Agent: W-h Energy Services, Inc.

20080112144 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080112145 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080112146 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080112147 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080112148 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080112149 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080112150 - Radiation-shielded semiconductor assembly: A radiation-shielded semiconductor assembly includes at least one radiation-shielding lamina within the package. In some embodiments, a semiconductor assembly includes a microelectronic component, and at least one radiation-shielding layer affixed to a surface of the component.... Agent: Haynes Beffel & Wolfeld LLP

20080112151 - Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components: An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied.... Agent: Farjami & Farjami LLP

20080112152 - Cable management system: A cable management system provides cable management for a switch chassis configured to receive a plurality of line card units. The cable management system comprises a cable guide arrangement configured to guide each of a plurality of cables from a line card such that the cables extend out from the... Agent: Sun Microsystems Inc. C/o Park, Vaughan & Fleming LLP

20080106829 - Alternator control device for vehicle: A vehicle alternator control device in which, when a signal detection portion detects a determined input signal, an operating mode of an overvoltage warning portion is switched to a detection operating mode by an overvoltage warning operating mode switching portion. In the detection operating mode, the overvoltage warning portion is... Agent: Sughrue Mion, PLLC

20080106830 - Ac melt to bushing current detector: An AC melt to bushing current detector (FIG. 4) for a channel induction furnace (FIG. 1) which can detect when molten metal from the loop (122) in a saturated inductor (FIG. 5) has come in contact with the metal bushing (236) whereupon the power to the induction coil (234) is... Agent: John P. Richardson

20080106831 - Methods and apparatus for continuous ground fault self test: Methods and apparatus for continuous ground fault self-test are disclosed. An example ground fault detection device includes a sense coil to detect current in a line conductor and a neutral conductor, the sense coil comprising a winding influenced by a current difference between the line conductor and the neutral conductor.... Agent: Texas Instruments Incorporated

20080106833 - Methods and apparatus to facilitate ground fault protection and self test with a single switch: Methods and apparatus to facilitate ground fault protection and self test with a single switch are disclosed. An example ground fault detection device includes a ground fault detector to receive a signal indicative of current in a line conductor and a neutral conductor, and a single switch to simulate a... Agent: Texas Instruments Incorporated

20080106834 - electrostatic discharge protection circuit: An electrostatic discharge protection circuit includes a first inverter, a first transistor having a gate connected with the output of the first inverter and a drain connected with the input of the first inverter, a second transistor having a gate connected with the output of the first inverter and a... Agent: Xin Wen

20080106835 - Active device array substrate having electrostatic discharge protection capability: An active device array substrate includes pixel units, scan lines, data lines, electrostatic discharge (ESD) protection elements, a short ring and an ESD biased generator. Each pixel unit is electrically connected to the corresponding scan line and data line. Each ESD protection element has a first connection terminal, a second... Agent: Jianq Chyun Intellectual Property Office

20080106837 - Hybrid protection circuit for electrostatic discharge and electrical over-stress: A hybrid protection circuit may include a stress detection circuit, a clamp device, and an on-time adjustment circuit. The stress detection circuit may output a detection signal that may be activated when a positive ESD event or a positive EOS event occurs. The on-time adjustment circuit may receive a detection... Agent: Harness, Dickey & Pierce, P.L.C

20080106832 - Systems and methods for arc fault detection: In accordance with one aspect the present disclosure is directed toward a method for detecting arc faults on a power line. The method may include monitoring power signals associated with a power line and filtering the power signals to produce a high frequency signal and a low frequency signal. A... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080106836 - Io clamping circuit method utilizing output driver transistors: Systems and methods are disclosed for a clamping circuit for protecting against voltage overstresses. One embodiment of the system comprises a first voltage comparator adapted to detect when a selected voltage exceeds a first predetermined voltage and a second voltage comparator adapted to detect when the selected voltage falls below... Agent: Mcandrews Held & Malloy, Ltd

20080106838 - Centrally controlled protection systems having reduced energy let-through mode: A centrally controlled protection system is provided. The system includes a plurality of circuit breakers, a plurality of modules, and a central computer. Each of the plurality of breakers are in electrical communication with a respective one of the plurality of modules. The central computer is in communication with each... Agent: Paul D. Greeley Ohlandt, Greeley, Ruggiero & Perle, L.L.P.

20080106839 - Printed circuit board having lightning protection device: An exemplary printed circuit board (2) includes a substrate (21) and a printed circuit (20) formed on the substrate. The printed circuit includes a first input wire (210) and a ground wire (230). The first input wire includes at least one tip and the ground wire includes at least one... Agent: Wei Te Chung Foxconn International, Inc.

20080106840 - Multichannel spark-gap with multiple intervals and pulsed high-power generator: A multichannel spark-gap with multiple intervals for use in pulsed high-power generators of the LTD family. The spark-gap includes a sealed chamber, two discharge electrodes connected to electrical connecting elements, and a number of intermediate electrodes arranged uniformly inside the sealed chamber. One of the intermediate electrodes is called triggering... Agent: Young & Thompson

20080106841 - Systems and methods for immobilization with variation of output signal power: Locomotion by a target is inhibited by passing a current through the target according to various aspects of the present invention. For instance, a circuit having a processor and a signal generator controlled by the processor to provide the current may perform a method that includes: (a) providing the current... Agent: Taser International, Inc.

20080106842 - Mounting device, plasma processing apparatus and plasma processing method: A mounting device includes a mounting body for sustaining a target object to be processed thereon; an electrostatic chuck disposed on the mounting body and having an electrode layer interposed between insulating layers, and the electrostatic chuck serving to electrostatically attract and hold the target object on a surface of... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080106843 - Rotary variable capacitance element and rotary variable capacitance device: A variable capacitance element of the invention includes: a columnar vibrator formed inside a cylindrical hole of a supporting wall; a first circular driving electrode disposed above the columnar vibrator; a first circular capacitive electrode disposed in the middle of the columnar vibrator; a second circular driving electrode disposed on... Agent: Beyer Weaver LLP

20080106845 - Capacitor and method for producing the same: A low-profile capacitor that can be bent and that has excellent interlayer adhesion strength. The capacitor includes a dielectric layer, a first capacitor electrode formed on a first main surface of the dielectric layer, a second capacitor electrode formed on a second main surface of the dielectric layer, and a... Agent: Dickstein Shapiro LLP

20080106844 - Itfc with optimized c(t): A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of... Agent: Intel/blakely

20080106846 - Electrode for thin film capacitor devices: A method of forming a conductor on a substrate including steps of depositing tantalum on a glass layer of the substrate; oxidizing the tantalum; and depositing a noble metal on the oxidized tantalum to form the conductor. The method can be used to form a ferroelectric capacitor or other thin... Agent: Raytheon Company Intellectual Property

20080106847 - Multilayer capacitor: A multi-terminal multilayer capacitor reducing an equivalent series inductance (ESL), whose design flexibility is high, in which cost of electrode material is low, and in which a structural defect hardly occurs includes lead portions of first and second internal electrodes and lead portions of third and fourth internal electrodes that... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080106848 - Itfc with optimized c(t): A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of... Agent: Intel/blakely

20080106849 - Modular energy storage device and method of making the same: An exemplary method for producing the modular energy storage device comprises the steps of generating a standardized energy storage device, receiving a customer-defined parameter, and modifying the standardized energy storage device according to the customer-defined parameter. The step of modifying the standardized energy storage device comprises the steps of modifying... Agent: Harry Silver

20080106850 - Electrochemical double layer capacitor: Active electrode material, such as fibrillized blend of activated carbon, polymer, and conductive carbon, is pretreated by immersion in a sealing coating. After the active electrode material is dried, the coating seals micropores of the activated carbon or another porous material, thus preventing exposure of water molecules or other impurities... Agent: Maxwell Technologies, Inc.

20080106851 - Capacitor: t

20080106852 - Porous anode body for solid electrolytic capacitor, production method thereof and solid electrolytic capacitor: The invention provides a method of manufacturing a porous anode for a solid electrolytic capacitor, comprising a step of subjecting a molded body containing powder of at least one material selected from oxygen-containing niobium material and oxygen-containing tantalum material and a pore-forming agent which is solid at reduction temperature to... Agent: Sughrue Mion, PLLC

20080106853 - Process for producing porous sintered metal: The present invention provides a process for producing a porous sintered metal, in which the pore diameter distribution of porous sintered metal can be easily controlled. The present invention also provides a process including: forming a molding containing a metal powder, a pore forming material, and a binder resin: heating... Agent: Darby & Darby P.c.

20080106854 - Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method: In a lead frame for use in fabricating a face-down terminal solid electrolytic capacitor having a capacitor element an anode terminal, and a cathode terminal, a frame body has a connecting portion for being connected to the capacitor element. The connecting portion extends from a cathode terminal forming portion in... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080106855 - Solid state electrolyte capacitor and manufacturing method thereof: The invention provides a solid electrolytic capacitor, comprising a stack of solid electrolytic capacitor elements each having an anode part and a cathode part, wherein the stacked structure is such that cathode parts of solid electrolytic capacitor elements are stacked one on another to have some misalignment between the stacked... Agent: Sughrue Mion, PLLC

20080106856 - Sliding mechanism and portable electronic device using the same: A sliding mechanism (100) for use in a portable electronic device (500) is provided. The sliding mechanism includes a first plate (10), a second plate (20), a plurality of limiting structure (17), and a linkage module (30). The second plate is longitudinally slidably connected with the first plate. The plurality... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080106857 - Housing of portable electronic devices and method for manufacturing the same: A housing (100) of portable electronic devices includes a main body (10) and a decorative layer (16). The main body defines a through groove (12) therein and a recessed portion (14) sunken from an outer surface thereof. The groove is formed adjacent to the recessed portion. The decorative layer is... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080106858 - Unit for accomodating electronic component: The present invention provides an electronic control unit which is capable of suppressing harmful effects caused by liquid while suppressing increase in the size thereof. The electronic control unit includes an electronic component in which a circuit element coated with an anti-splash agent is implemented, a casing, and a liquid... Agent: Harness, Dickey & Pierce, P.L.C

20080106859 - Electronic apparatus: There are provided a display panel mounted in a tiltable manner on the front face portion of a main body portion, an operation panel to be mounted in a tiltable manner on the display panel, a tilt control part for controlling to tilt the display panel in response to a... Agent: Oliff & Berridge, PLC

20080106860 - Multi-configuration processor-memory substrate device: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports... Agent: Murabito Hao & Barnes LLP

20080106861 - Multi-configuration processor-memory substrate device: A Multi-configuration Processor-Memory device for coupling to a PCB (printed circuit board) interface. The device comprises a substrate that supports multiple configurations of memory components and a processor while having a single, common interface with a PCB interface of a printed circuit board. In a first configuration, the substrate supports... Agent: Nvidia C/o Murabito, Hao & Barnes LLP

20080106862 - Server wherein an interior of which is connected with five expansion boards: A server wherein an interior of which is connected with five expansion boards is composed of a server at a height of 1 U, an interior of which is fixed with a circuit motherboard on which is welded with expansion slots; a first riser card which is inserted into the... Agent: Troxell Law Office PLLC

20080106863 - Heat dissipation assembly for computing devices: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to... Agent: Dergosits & Noah LLP

20080106864 - Method and apparatus for acoustic noise reduction in a computer system having a vented door including a pivotable vented base and a pivotable outer door: A vented door for a computer system includes a vented base and an outer door. The vented base and the outer door are separately pivotable. The vented base is pivotably attached to the computer system's enclosure for movement between a closed configuration where the vented base abuts against a panel... Agent: Ibm Corporation RochesterIPLaw Dept. 917

20080106865 - Computer module: A computer module includes a housing having a cover defining a condenser chamber, and a heat-absorbing unit having at least one cavity body adapted to contact a heat source, and a working fluid received in the cavity body. A tubing unit is connected fluidly to the condenser chamber and the... Agent: Birch Stewart Kolasch & Birch

20080106866 - Electronic appliance: In an electronic appliance, a base is thermally fused by a heat generating component. On the base, a heat dissipating fin group including heat dissipating fins each extending in a Y direction is arranged in spaced relation in an X direction. An exhaust fan and a partition between which the... Agent: Nixon & Vanderhye, P.c.

20080106867 - Fan motor device and electronic apparatus: A fan motor device includes a multi-blade portion that rotates together with a rotor portion of a motor so as to take in air in an axial direction of the motor and discharge the air in a centrifugal direction, and a rib that supportively connects the multi-blade portion to the... Agent: Sonnenschein Nath & Rosenthal LLP

20080106869 - Heat dissipation device: A heat dissipation device includes a retention module (40) and a heat sink (10) both mounted on the printed circuit board (50). The retention module forms a pair of opposite fixture blocks (44) thereon. The heat sink received in the retention module has protective hollow sleeves (28) positioned corresponding to... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080106868 - Thermal interface material volume between thermal conducting members: A heat dissipation apparatus includes a first thermal conducting member including a first thermal transfer surface. A second thermal conducting member including a second thermal transfer surface that is located adjacent the first thermal transfer surface. A thermal interface material engages the first thermal transfer surface and the second thermal... Agent: Haynes And Boone, LLP

20080106870 - Apparatus and method for storing and regulating access to portable electronic devices: A storage unit and associated methods of use enable clinicians to store portable electronic devices in a centralized location while ensuring that proper authorization is needed to access the devices. The storage unit is formed with an enclosure for housing portable electronic devices. A plurality of shelves are disposed within... Agent: Shook, Hardy & Bacon L.L.P. Intellectual Property Department

20080106871 - Slide and tilt mechanism for a telecommunications panel: A mechanism that provides access to a rear termination area of a telecommunications panel. The mechanism including a slide bar that permits the panel to laterally slide, and a tilt element the permits the panel to tilt. The slide bar and tilt element positioning the tilted termination panel over lower... Agent: Merchant & Gould PC

20080106872 - High density integrated circuit apparatus, test probe and methods of use thereof: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an... Agent: Ibm Corporation, T.j. Watson Research Center

20080106873 - Mounting structure: According to an aspect of the present invention, a mounting structure includes a housing, an electronic component mounted at the housing, a pin-shaped terminal arranged upright at the housing, a circuit board having a mounting through-hole into which the in-shaped terminal is inserted, and a mounting support member positioned between... Agent: Buchanan, Ingersoll & Rooney PC

20080106874 - Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus: Disclosed herein is an electro-optical device including a substrate for the electro-optical device connected with a flexible circuit board, wherein the flexible circuit board partially faces one surface of the substrate for the electro-optical device, is folded to face the other surface of the substrate for the electro-optical device at... Agent: Harness, Dickey & Pierce, P.L.C

20080106875 - Circuit device and method of manufacturing the same: Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements... Agent: Fish & Richardson P.c. Citigroup Center

20080106876 - Semiconductor memory module with reverse mounted chip resistor: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection... Agent: Marger Johnson & Mccollom, P.c.

20080106877 - System and method for manufacturing c-shaped leads: A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality of interposing strips, masking lateral sides and a center of the plurality of interposing strips, covering the exposed surface with a... Agent: Steptoe & Johnson LLP

20080106878 - Circuit configuration having a number of electrical components: s

20080106879 - Printed circuit board including embedded chips and method of fabricating the same: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having... Agent: Darby & Darby P.c.

20080106880 - Wiring board and method of manufacturing the same: A wiring board according to the present invention includes a wiring part formed of one or more layers, a first terminal area disposed on one side of the wiring part in a projecting manner, and a second terminal area disposed on the other side of the wiring part. A resist... Agent: Oliff & Berridge, PLC

20080106881 - Active signal cross-connect system: A telecommunications system includes a chassis having a front side and a rear side and a plurality of jacks mounted to the chassis. Each jack includes an IN port, an OUT port and a MONITOR port. A cross-connect panel including an array of cross-connect connection locations is accessible from the... Agent: Merchant & Gould PC

20080106883 - Radio frequency unit: The invention provides a radio frequency unit including a box-shaped chassis into which an insulating board loaded with electronic components is housed, and two connectors attached to a front plate of the chassis with a space therebetween. A supporting member protruding into the chassis is provided in a position between... Agent: Beyer Weaver LLP

20080106882 - Wireless network card covering structure: A wireless network card covering structure to couple an upper metal cover and a lower metal cover of a wireless network card is disclosed. The wireless network card covering structure includes a contact structure and a coupling structure. The contact structure includes an upper metal cover wall and a lower... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080106884 - Snap install emi shields with protrusions and electrically-conductive members for attachment to substrates: Various embodiments provide EMI shields for substrates having at least one electrical component disposed thereon. In one embodiment, an EMI shield generally includes a cover having first and second protrusions and at least one electrically-conductive member disposed along an inner side of the cover. The electrically-conductive member may be compressed... Agent: Harness, Dickey, & Pierce, P.l.c

20080106885 - Apparatus and method for mounting audio-visual components: A bracket or support bar system is for installing one or more audio-visual (“A/V”) components or modules and generally overcomes the need for external cables and wiring connections. Every A/V component of the A/V system is attached to a wall bracket or support bar that enables the transfer of power... Agent: Fitch Even Tabin & Flannery

20080100972 - Device for preventing the explosion of an element of an electrical transformer: A device for preventing the explosion of an element of an electrical transformer provided with a tank containing a combustible cooling fluid, comprising a pressure release element for decompressing the tank, and a bag placed downstream of the pressure release element and configured to pass from a flat state to... Agent: Eric B. Meyertons Meyertons, Hood, Kivlin,kowert & Goetzel, P.C.

20080100973 - Electrostatic discharge (esd) protection arrangement and esd protection method: AN ESD protection arrangement is provided which comprises an ESD protection device coupled between a terminal pad of an integrated semiconductor circuit and a supply voltage rail and a compensation loop provided between the terminal pad and an intermediate circuit node of the ESD protection device. The compensation loop comprises... Agent: Maginot, Moore & Beck

20080100975 - Distribution automation system: A distribution automation system is disclosed. The system includes a switch for detecting a voltage/current status of electric power equipment to output the resulting detect signal, and supplying or cutting off power to the power equipment, and a control box including a control unit for converting the detect signal from... Agent: Morgan & Finnegan, L.L.P.

20080100977 - System for overvoltage suppression for construction equipment: An overvoltage suppression system is disclosed, such as for construction equipment, for protecting the construction equipment from overvoltages that may occur in day to day operations. An overvoltage suppression system for construction equipment may have a communication network that includes nodes. A data line may be used to electrically connect... Agent: Brinks Hofer Gilson & Lione

20080100978 - Switching element overcurrent protection circuit which operates within a high-voltage system that incorporates the switching element: A circuit for detecting excessive current flow through a switching element derives an electrical quantity relating to a condition of the switching element and correlated with the current level, and compares the magnitude of that electrical condition quantity with a threshold value corresponding to the maximum allowable level of current.... Agent: Nixon & Vanderhye, PC

20080100974 - Electrical current limiter: An electrical current limiter 1 is provided in which an enclosure 3 combination incorporates an electrical conductor 2 held in effective thermal isolation within an housing 4 having a vacuum 11. In such circumstances known electrical resistivity response of the conductor 2 can be utilised when an electrical fault occurs... Agent: Oliff & Berridge, PLC

20080100976 - Limiting energy in wiring faults combined upstream and downstream protection: An intrinsically safe system in a hazardous atmosphere includes a power supply. The system includes a plurality of load devices. The system includes wiring in communication with the power supply and the load devices that is located in the hazardous atmosphere. The system includes a protector connected to the wiring... Agent: Ansel M. Schwartz Attorney At Law

20080100979 - High voltage over-current protection device: A high voltage over-current protection device includes a positive temperature coefficient (PTC) electrically conductive heat-dissipation layer and two metal electrodes. The PTC electrically conductive heat-dissipation layer includes at least one polymer, an electrically conductive filler, and a heat conductive filler. Due to the high thermal conductivity of the heat conductive... Agent: Seyfarth Shaw LLP

20080100980 - Removable seat sensing system: The present invention relates to removable seating systems of the type wherein all or part of a seat may be removed or otherwise disengaged from a secure connection location, such as but not limited to vehicle seats that me be removed or disengage for folding from a vehicle mounted seat... Agent: Brooks Kushman P.C. / Lear Corporation

20080100981 - Over-current and over-voltage protection assembly apparatus: An over-current and over-voltage protection assembly apparatus including an over-current protection (OCP) device and an over-voltage protection (OVP) device is provided. One end of the OCP device is electrically connected to a first connection point, and the other end is electrically connected to a second connection point. One end of... Agent: Seyfarth Shaw LLP

20080100982 - System and method for dissipating static electricity in an electronic sheet material dispenser: An electronic dispenser for dispensing a measured sheet from a roll of web material includes an antenna in conductive communication with at least one component of the dispenser that stores static charge generated by operation of the dispenser. The antenna is disposed so as to dissipate the static charge through... Agent: Dority & Manning, P.A.

20080100985 - Electrostatic chuck and manufacturing method thereof: An electrostatic chuck includes a base, and includes an electrode embedded in the base in parallel to a substrate mounting surface of the base. A terminal loaded into a terminal hole drilled into a back surface of the base toward the electrode is bonded to the electrode having a protruded... Agent: Burr & Brown

20080100984 - Low-cost electrostatic clamp with fast de-clamp time: A method for manufacturing a semiconductor wafer electrostatic clamp, comprising providing a mounting plate, forming an insulative layer on an insulating portion of the mounting plate, forming a first electrode on a first portion of the mounting plate, forming a second electrode on a second portion of the mounting plate,... Agent: Thomas G. Eschweiler Eschweiler & Associates, LLC

20080100983 - Sliding wafer release gripper / wafer peeling gripper: The present invention is directed to a system and a method for peeling a wafer off of an electrostatic clamp (ESC). The ESC removal system comprises a electrostatic clamp and a wafer electrically coupled and physically in contact with each other. A plurality of grippers or pins are arranged with... Agent: Eschweiler & Associates, LLC National City Bank Building

20080100986 - Capacitor embedded printed circuit board and manufacturing method thereof: Provided is a method of manufacturing a capacitor embedded printed circuit board. In the method, a laminated body is prepared, including a laminated plate having first and second copper films on both sides thereof, where at least one bottom electrode is provided on at least one side. A dielectric layer... Agent: Mcdermott Will & Emery LLP

20080100987 - Multilayer capacitor, manufacturing method thereof: A multilayer capacitor 10 comprising a dielectric body 12 formed by stacking a plurality of dielectric layers 12a and 12b having an approximately rectangular parallelepiped shape; an internal layer portion 17 in which pluralities of first internal conductor layers 21 and second internal conductor layers 22 to be set at... Agent: Oliff & Berridge, PLC

20080100988 - Multilayer capacitor: A multilayer capacitor has a capacitor element body of a nearly rectangular parallelepiped shape in which a signal electrode layer and a GND electrode layer are laminated with a dielectric layer in between, and signal terminal electrodes and GND terminal electrodes each set of which is provided on either of... Agent: Oliff & Berridge, PLC

20080100989 - Layout for capacitor pair with high capacitance matching: An integrated circuit device includes a capacitor array, which includes unit capacitors arranged in rows and columns, wherein each unit capacitor is formed of two electrically insulated capacitor plates. The unit capacitors include at least one first unit capacitor in each row and in each column of the capacitor array;... Agent: Slater & Matsil, L.L.P.

20080100990 - Cell assemby for an energy storage device using ptfe binder in activated carbon electrodes: A hybrid supercapacitor energy storage device comprises at least one lead electrode, at least one carbon electrode, a separator, a casing, and an acid electrolyte. The lead electrode is enveloped in a common glass mat separator known in the lead-acid battery industry. The carbon electrode comprises a highly conductive current... Agent: Cahn & Samuels LLP

20080100991 - First-wall component for a fusion reactor with a heat sink of a copper alloy: A first-wall component of a fusion reactor has a heat shield and a heat sink. The heat shield is formed of a material from the group of graphite material, carbidic material, tungsten and tungsten alloy. The heat sink is formed of a spray-compacted copper alloy.... Agent: Lerner Greenberg Stemer LLP

20080100992 - User interface module for a computing device: A device that may include a server chassis and a user interface module moveably coupled to the server chassis. In some embodiments, the user interface module is configured to move to a first position that allows access to a first server component and to a second position that allows access... Agent: Hewlett Packard Company

20080100993 - Support platform for electrical components, and module comprising said support platform: A module connects a network having a power mains to a housing. The module includes a platform for holding electrical components. The platform includes a body made of a fiber-composite material and reinforcing glass fibers, a busbar in the body, and a contact element associated with the busbar for making... Agent: Fish & Richardson PC

20080100994 - Bracket assembly for expansion cards: A bracket assembly includes a first expansion card (30), a second expansion card (26), a riser card (20) for horizontally receiving the second expansion card, and a retaining bracket (10) configured for securing to a computer chassis which provides connectors for the first expansion card and the riser card. The... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080100995 - Electronic device docking system: An electronic device docking system comprises a docking station configured to receive docking of an electronic device with an external battery coupled thereto, the docking station comprising at least one mechanism actuatable to cause detachment of the electronic device from both the external battery and the docking station.... Agent: Hewlett Packard Company

20080101001 - Display device: A display device includes a display panel; a backlight unit disposed behind the display panel; a panel supporting part; and a first cover. The first cover includes a first cover part disposed along a non-display region of the display panel. The display device further includes a plurality of second cover... Agent: Cantor Colburn, LLP

20080100999 - Engagement member for display device: In an engagement member 2 comprising a main body part 3 and an engagement part 4, the main body part 3 is separately formed from the engagement part 4A. A screw passage hole 3c is formed in the main body part 3. A screw hole 4a is formed in the... Agent: Osha Liang L.L.P.

20080101000 - Information processing apparatus: An information processing apparatus includes a display section and a main body section. The display section is disposed on a first surface and has a display panel and a display panel case. The display panel case houses the display panel such that the display panel can display an image. The... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080100997 - Monitor turnning device: A monitor turning device includes a base with a box connected thereon and a gear unit is received in the box and driven by a driving member. The gear unit includes a pivotable output gear which has two output members. A disk unit includes a first disk located on a... Agent: Hwa-lo Chen

20080101002 - Plasma display device: A plasma display device includes a plasma display panel (PDP) having electrodes between front and rear substrates, a chassis base on an outer surface of the PDP, a printed circuit board assembly (PBA) on the chassis base, a flexible printed circuit (FPC) connecting the PBA to the electrodes of the... Agent: Lee & Morse, P.C.

20080100996 - Shrinkable & adjustable multi-functional tv: A shrinkable and adjustable multi-functional TV includes a display, a support device, a shrinkable and angle adjusting device. The display has a mirror on its rear side, and an LCD screen on a front side, pivotally received in an interior of a U-shaped frame of the support device and by... Agent: Bruce H. Troxell

20080100998 - Waterproof screen cover: A touch screen cover or overlay for use in association with a user input device having a touch screen disposed within a housing, comprises a membrane (2) of a size sufficient to cover the touch screen. The membrane (2) is formed of a flexible material, and includes means (3) for... Agent: Kennedy Covington Lobdell & Hickman, LLP

20080101003 - Electronic apparatus: An electronic apparatus comprising a base, a first body, a second body and at least an adjusting apparatus is provided. The first body and the second body disposed respectively at two ends of the base are rotatable relative to the base. The adjusting apparatus is coupled to the first body... Agent: Rabin & Berdo, PC

20080101004 - Memory card connector with improved foldable baffler: A memory card connector includes a metal cover defining a receiving space in which two different types of memory cards are insertable in an insertion direction through an insert opening generally at a rear end of the metal cover to respectively correspondingly connect with contacts mounted in a connector housing... Agent: Wei Te Chung Foxconn International, Inc.

20080101009 - Assembly structure for power supply circuit unit of electric device: A wiring substrate has a front face and a rear face opposed the front face. An electric component is mounted on the front face and is electrically connected to the wiring substrate at the rear face. A protection cover is comprised of a resin material and includes an upper plate,... Agent: Morgan Lewis & Bockius LLP

20080101005 - Flexible docking bay: A flexible docking bay is disclosed. The flexible docking bay comprises a body having a cartridge-receiving portion defining a front region that defines an opening and a rear region that defines a rear bounding wall. A cartridge-encasing wall extends from the opening to the rear bounding wall. The flexible docking... Agent: Hewlett Packard Company

20080101008 - Hard drive cartridge protection: According to the invention, a removable rotational disk storage cartridge for storing computer readable data is disclosed. The cartridge may include a chassis, a shock absorption media and a rotational storage disk. The chassis may define an interior space and may be configured to be detachably and mechanically coupled with... Agent: Townsend And Townsend And Crew, LLP

20080101006 - Hard drive deck: A hard drive deck is described. A base portion comprises three support legs and a first fastening portion, wherein each of the three support legs has an opening to be fastened to a computer housing by a screw. A hard drive housing is secured on the base portion. The hard... Agent: Rabin & Berdo, PC

20080101007 - Hard drive deck: A hard drive deck is described. A base portion comprises a first fastening portion, a second fastening portion and a support leg. The support leg has a positioning hole and the first fastening portion has a plurality of slots such that the base portion is fastened to a computer housing.... Agent: Rabin & Berdo, PC

20080101010 - Digital storage element mechanical shock isolation arrangement in a host device and method: A digital storage arrangement is interfaceable with a host device which defines a cavity. The digital storage arrangement includes a housing receivable in the cavity, with a movement margin between the housing and host device, while a resilient support arrangement is provided for fixed engagement with the host device and... Agent: Workman Nydegger

20080101011 - Riser retention system: A riser retention apparatus includes a board. A component connector is mounted to the board. A support frame is coupled to the board adjacent the component connector and extends from the board. A riser guide is located on the support frame and operable to engage a riser and guide a... Agent: Haynes And Boone, LLP

20080101012 - Heat dissipation assembly for computing devices: Computing devices, including laptop computers, desk top computers, servers and video game terminals employ microprocessors which generate considerable heat. In fact, the heat generated from microprocessors is generally considered the limiting factor in computing speed. A heat sink is provided in thermal contact with a microprocessor whereby a water barrier... Agent: Dergosits & Noah LLP

20080101014 - Miniature cooling device: A method for regulating temperature in an enclosure is disclosed. The method involves monitoring a component temperature inside the enclosure. When the component temperature reaches a threshold, the method injects a coolant into the enclosure. The method further involves regulating a flow rate of the coolant by actuating a miniature... Agent: Honeywell International Inc.

20080101013 - Power module having self-contained cooling system: A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly... Agent: General Motors Corporation Legal Staff

20080101015 - Air flow regulation devices: In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second... Agent: Hewlett Packard Company

20080101016 - Airflow baffle for a computer system: An airflow baffle apparatus for a forced-air cooled computer system is comprised of a linearly inflating airflow baffle bladder with a fixable surface and a topologically self-adjusting compliant surface. The linearly inflating airflow baffle bladder is couplable with the computer system. The fixable surface of the linearly inflating airflow baffle... Agent: Hewlett Packard Company

20080101017 - Cooling device and electronic device: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the... Agent: Blakely Sokoloff Taylor & Zafman

20080101020 - Computer system having multi-direction blower: A computer system comprises a chassis and first and second electronic components disposed within the chassis. The computer system also comprises a multi-direction blower module having a blower housing connected to the chassis The blower housing comprises an inlet, a first outlet, and a second outlet. A centrifugal blower is... Agent: Hewlett Packard Company

20080101021 - Fan housing apparatus: A fan housing apparatus includes a shroud defining an air passageway. A housing member is located adjacent the air passageway and moveably coupled to the shroud such that the housing member is moveable relative to the shroud between an operating position and a service position. A fan housing is defined... Agent: Haynes And Boone, LLP

20080101019 - Fan module: A fan module includes a fan (10), a bracket (20), and a locking member (30). The fan includes a pair of parallel side walls (12) each defining through holes (122) therein. The bracket includes a pair of parallel side plates (26) for securing the fan therebetween. The side plates are... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101018 - Heat dissipation device: A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101022 - Micro-fluidic cooling apparatus with phase change: A cooling apparatus (100) for transferring heat away from a hot system (30) includes: a frame (125) having a plurality of channels (102) formed therein, the frame (125) extending between a thermally conductive hot element (105) and a thermally conductive cooling element (107); and a liquid coolant (113) contained within... Agent: Kurt Luther Honeywell International Inc.

20080101024 - Micro-spray cooling system: A micro-spray cooling system for a plurality of heat sources includes an evaporator contacting the heat sources and comprising a plurality of actuators corresponding to the heat sources, a condenser connected to the evaporator, and at least one driving circuit connected to the actuators to drive some or all of... Agent: Quintero Law Office, PC

20080101023 - Negative pressure pump device: A negative pressure pump device includes a water tank installed with a pump having an entrance connector extended out of the water tank. The water tank has an exit connector and a valve set on its topside. The entrance connector and the exit connector are respectively connected with a connecting... Agent: Bruce H. Troxell

20080101025 - Multi-chip module with power system: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the... Agent: Hewlett Packard Company

20080101026 - Thin, passive cooling system: A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an... Agent: Apple Computer, Inc. C/o Park, Vaughan & Fleming LLP

20080101027 - Heat dissipation device: A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101028 - Heat sink: A heat sink (100) includes a plurality of metal fins (10) interlocked with each other by interlocking units (11) formed between them. The interlocking units each include a protruding finger (122), a hole (114) and a controlling member (116, 117). The protruding finger, the hole and the controlling member are... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101029 - Clip for heat sink: A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of the two arms... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101032 - Base plate for a power semiconductor module: A power semiconductor module is to be pressed to a heat sink with a first surface of a first side of a base plate. To reduce the heat transfer resistance between the base plate and the heat sink, the first surface has, at least in a state, when the power... Agent: Coats & Bennett/infineon Technologies

20080101033 - Component retention with distributed compression: A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.... Agent: Hewlett Packard Company

20080101030 - Heat sink assembly: A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) is defined therein. The clip includes... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang J

20080101034 - High-contrast laser mark on substrate surfaces: As part of a first configured laser operation, a smooth, more reflective marking area is formed at a surface of a substrate (e.g., integral heat spreader, or IHS). In a second configured laser operation, a mark is formed at the surface of the substrate within the marking area. The mark... Agent: Intel Corporation C/o Intellevate, LLC

20080101031 - Wedge lock: Various apparatus and methods are disclosed wherein a wedge member and a support engage one another to lock a first structure and a second structure to one another along an axis.... Agent: Hewlett Packard Company

20080101038 - Embedded thermal-electric cooling modules for surface spreading of heat: A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that... Agent: Apple Computer, Inc. C/o Park, Vaughan & Fleming LLP

20080101035 - Heat-dissipating assembly structure: A heat-dissipating assembly structure includes a first heat dissipating sheet attached to one side of a memory module and having first hooks at one long side, a second heat dissipating sheet attached to the opposite side of the memory module and having second hooks at one long side respectively hooked... Agent: Birch Stewart Kolasch & Birch

20080101036 - Heat-dissipating assembly structure: A heat-dissipating assembly structure is disclosed that includes a first and a second thermally conductive sheets, each of which includes a plurality of spaced fastening sections including a projection on its outer surface and two parallel guides with the projection disposed there-between; and a plurality of U-shaped clamps including two... Agent: Birch Stewart Kolasch & Birch

20080101039 - Passive heat-dissipating type power supply apparatus for increasing heat-dissipating efficiency and fabricating process thereof: The present invention relates to a power supply apparatus having a passive heat-dissipating mechanism. The power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a closed receptacle therein and includes a first edge, a second edge and a... Agent: Madson & Austin

20080101037 - Securing object relative to pc board using retention device attached to surface-mounted attachment mechanisms: Attachment mechanisms are surface-mounted to a PC board. An object is secured relative to said PC board by a retention device attached to the attachment mechanisms.... Agent: Hewlett Packard Company

20080101040 - Automatic positioning of power supply module handle: Embodiments of the invention automatically rotate a handle of the component from an open position to a closed position when the module is inserted into the chassis by pushing on a bezel of the module. Embodiments of the invention move the module into a seated position within the chassis when... Agent: Hewlett Packard Company

20080101041 - Electronic device having water-repellent structure and draining structure: An electronic device includes a housing, a water-repellent structure and a draining structure. The housing has at least a first air port. The water-repellent structure is connected to the housing and includes at least one draining port. The water-repellent structure and the housing cooperatively define a water-repellent chamber. The draining... Agent: Madson & Austin

20080101042 - Expansion card: An expansion card has a terminal block, a top metal sheet, bottom metal sheet and a plastic seat. Two step retainers are formed respectively on two short edges of the terminal block. Two pairs of hooks are formed on the two long edges adjacent respectively to front and rear ends... Agent: Cooper & Dunham, LLP

20080101043 - Gauge circuit board holding device: A meter spacer unit includes a dial spacer, a lateral spacer flexibly connected to the dial spacer by a joint, and a rear connecting member flexibly connected to the lateral spacer by a joint. The lateral spacer includes a connection member adapted to connect to a printed circuit board.... Agent: Nixon Peabody, LLP

20080101045 - Circuit board and manufacturing method thereof: A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming... Agent: Staas & Halsey LLP

20080101044 - Laminated bond of multilayer circuit board having embedded chips: A multilayer circuit board has a bottom and an upper multilayer circuit boards, a glue layer, multiple outer contact vias and two insulating lacquer layers. The bottom and the upper multilayer circuit boards respectively have multiple conductive wires, an insulating layer, a frame, multiple chips, a press laminate, a patterned... Agent: Birch Stewart Kolasch & Birch

20080101046 - Motherboard: A motherboard for computer is disclosed. The motherboard includes a printed circuit board (PCB), a first slot, a second slot, and a control unit. The first slot, the second slot, and the control unit are disposed on the PCB. The first slot is for receiving-a first double data rate (DDR)... Agent: Bacon & Thomas, PLLC

20080101047 - Socket connector terminals: A socket connector terminal (1) adapted for connecting an IC package to a PCB includes a base portion (10) for retaining, a pair of contacting portion (113) for connecting with the IC package, a pair of resilient arm (11) respectively connecting with the base portion and the contacting portions and... Agent: Wei Te Chung Foxconn International, Inc.

20080101048 - Method of making assembly module and board module and electronic apparatus: A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the... Agent: Staas & Halsey LLP

20080101049 - Systems and methods for electrically connecting circuit board based electronic devices: In one exemplary embodiment, a system for supplying electrical connectivity to one or more circuit board based devices includes a backplane and at least one module. The backplane includes a mounting surface having a plurality of modular power connectors. The at least one module includes an interface portion, a power... Agent: Calfee Halter & Griswold, LLP

20080101050 - layout geometry for printed circuit boards with adaptive antipads: A method of creating a layout geometry for a multilayer printed circuit board is described. The method involves identifying a signal trace connected to a connector pin via. A antipad is selected for use in conjunction with the connector pin via, where the antipad is of a size selected to... Agent: Hewlett Packard Company

20080101051 - Alignment and support apparatus for component and card coupling: A component and card coupling alignment and support apparatus includes a card. A primary component connector is mounted to the card. A primary component including a connection edge engages the primary component connector. A secondary component extends from the primary component. An alignment and support member is included on the... Agent: Haynes And Boone, LLP

20080101052 - Hinge assembly and wireless mobile terminal having the same: A hinge assembly is provided that reduces the SAR value and improves the radiating performance of an antenna for wireless mobile terminals, and a wireless mobile terminal having the hinge assembly is provided. The hinge assembly includes a conductive hinge, and contact connectors for selectively electrically connecting opposite ends of... Agent: The Farrell Law Firm, P.C.