Electricity: conductors and insulators patents - Monitor Patents
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Electricity: conductors and insulators

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
10/02/2014 > 47 patent applications in 27 patent subcategories.

20140290975 - Service cable box: Cables boxes and cable distribution systems securely store and route network cables of different types and/or security classifications. More specifically, a service cable box can include one or more chambers that can secure secondary network cables of one or more types and/or classifications. The service cable box can have secure... Agent:

20140291015 - Transmission line for wired pipe: The transmission line for wired pipe applications includes an inner conductor, an insulating material surrounding the inner conductor, the insulating material having an initial outer diameter, and a wire channel surrounding the insulating material and the inner conductor for at least a portion of a length of the transmission line.... Agent: Baker Hughes Incorporated

20140291016 - Wire harness and method for producing wire harness: An object is to achieve excellent wear resistance in a case where a flexible portion is partially formed in a protection member formed by hot-pressing a nonwoven fabric. A wire harness has a wire harness main body including at least one electric wire and a protection member. The protection member... Agent: Sumitomo Wiring Systems, Ltd.

20140291017 - Connector and wire harness: A connector includes a first terminal housing for housing first connecting terminals, a second terminal housing for housing second connecting terminals, insulating members aligned and housed in the second terminal housing, a connecting member for rotating a cam in a tightening direction and thereby pressing each contact point, a first... Agent: Hitachi Metals, Ltd.

20140291019 - Coated electric cable for use in a welding device: An electric cable includes at least one power line having first and second ends, including multiple cores. Each core has a core insulation. All core insulations are enclosed by a common sheath surrounded by an oversheath that includes a material selected from silicones, perfluorocarbons, mica, glass fibers, metal fibers, ceramic... Agent: Balluff Gmbh

20140291020 - Conductive elements in cable jackets and separators: A cable, of the twisted pair or fiber optic type, includes conductors for permitting patch cord tracing between ports. In the case of a twisted pair cable, the conductors may be embedded within, or attached to a surface of, a separator. Alternatively, in the case of a twisted pair cable,... Agent:

20140291018 - Electric cable for use in a welding device: An electric cable includes at least one power line having first and second ends, including multiple cores. Each core has a core insulation. All core insulations are enclosed by a common sheath. The core insulations and the sheath each include a material which is selected, independently of one another, from... Agent: Balluff Gmbh

20140291021 - Junction structure for an electronic device and electronic device: A junction structure for electronic device having an excellent bonding strength is provided. A junction structure for electronic device in accordance with one aspect of the present invention includes a first metal layer containing nickel and a second metal layer containing gold, tin, and nickel, while the second metal layer... Agent: Tdk Corporation

20140290976 - Halogen-free extra-high-voltage cable for railway rolling stock: A halogen-free extra-high-voltage cable for railway rolling stock includes a stranded conductor, an inner semi-conducting layer covering the stranded conductor, an outer semi-conducting layer provided on an outer periphery of the inner semi-conducting layer via an insulation layer, and a sheath layer on an outer periphery of the outer semi-conducting... Agent: Hitachi Metals, Ltd.

20140290977 - Semi-finished product in the form of a conductive strip that can be embedded in a composite material, and method for manufacturing such a strip: A strip of a semi-finished product (101, 102), suitable for being deposited by lay-up, for the constitution of a laminated composite material, includes, according to a cross-section and over all its length: a first conductive layer (105, 106), made of an electric conductive material; two electric insulating layers (121, 122),... Agent: European Aeronautic Defence And Space Company Eads France

20140290978 - Insulation structure of lead wire, transformer having the same, and method for insulating lead wire: A lead wire for a stationary induction apparatus includes a conductor, a covering insulating layer provided on an outer periphery of the conductor, and an insulating sheet provided on the covering insulating layer. The insulating sheet includes base paper having a prescribed width, and insulating spacers disposed to protrude from... Agent: Mitsubishi Electric Corporation

20140290979 - Method of manufacturing a patterned transparent conductor: Method of manufacturing patterned conductor is provided, comprising: providing a conductivised substrate, wherein the conductivised substrate comprises a substrate and an electrically conductive layer; providing an electrically conductive layer etchant; providing a spinning material; providing a masking fiber solvent; forming a plurality of masking fibers and depositing the plurality of... Agent:

20140290981 - Printed circuit board: A printed circuit board includes a board body, a signal transmission line laid in the board body, and a metal bracket attached to the board body. The metal bracket tightly abuts side surfaces of the board body and shields electromagnetic interference of the signal transmission line when the signal transmission... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20140290982 - Printed circuit board and method for manufacturing the same: Disclosed herein is a printed circuit board including: an insulating layer having first and second surfaces; a first circuit layer formed on the first surface of the insulating layer and including at least one first circuit pattern; a second circuit layer formed on the first circuit layer and including at... Agent: Samsung Electro-mechanics Co., Ltd.

20140290980 - Touch screen and method of producing the same: A touch screen comprises a glass substrate, a first conductive layer, an insulating adhesive layer and a second conductive layer. The first conductive layer is directly formed on the glass substrate and comprises first conductive pattern areas; the insulating adhesive layer is attached to the glass substrate, and one side... Agent: Shenzhen O-film Tech Co., Ltd

20140290985 - Embedded metal structures in ceramic substrates: The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and... Agent:

20140290983 - Stacked multilayer structure: Disclosed is a stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first... Agent: Kinsus Interconnect Technology Corp.

20140290984 - Transparent conductive film: A transparent conductive film includes a substrate, a transparent conductive layer, a lead electrode, and a first connecting wire, the substrate includes a first region and a second region located on the edge of the substrate; the transparent conductive layer is embedded in the first region, the lead electrode is... Agent:

20140290986 - Epoxy resin compound and radiant heat circuit board using the same: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that... Agent: Lg Innotek Co., Ltd.

20140290987 - Solution processed nanoparticle-nanowire composite film as a transparent conductor for opto-electronic devices: An electro-optic device includes a substructure, a layer of nanowires deposited on the substructure so as to form a network of nanowires having electrically connected junctions at overlapping nanowire portions and defining spaces void of the nanowires, and a plurality of electrically conducting and optically transparent nanoparticles disposed to at... Agent: The Regents Of The University Of California

20140290988 - Patterned conductive polymer with dielectric patch: A patterned conductive structure includes a transparent substrate having a substrate surface. A conductive polymer layer is formed on the substrate surface. The conductive polymer layer has electrically conductive areas and deactivated areas that are less electrically conductive than the conductive areas. The conductive areas and the deactivated areas form... Agent:

20140290989 - Structure of via hole of electrical circuit board and manufacturing method thereof: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor... Agent:

20140290990 - Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film: A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene... Agent: Talyo Ink Mfg. Co., Ltd.

20140290992 - Conductive film, method for manufacturing the same, and electronic device including the same: A conductive film may be provided that includes a base film, a primer layer formed on the base film, the primer layer having voids, and a conductive layer formed on the primer layer. The conductive layer may include a conductor that contains a nano-material forming a network structure.... Agent:

20140290991 - Gold finger and touch screen: A gold finger, includes a substrate, an embossable adhesive layer and a plurality of wires. The gold finger is achieved through adhering an embossable adhesive layer to a side of the substrate, providing grid-shaped grooves on a side of the embossable adhesive layer away from the substrate, embedding conductive grids... Agent: Shenzhen O-film Tech Co., Ltd.

20140290996 - Epoxy resin compound and radiant heat circuit board using the same: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the... Agent: Lg Innotek Co., Ltd.

20140290993 - Multilayer ceramic capacitor, manufacturing method thereof, and circuit board for mounting electronic component: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers laminated therein; an active part including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, and forming capacitance;... Agent:

20140290997 - Multilayer wiring substrate and manufacturing method thereof: The multilayer wiring board has a multilayered build-up construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately laminated. The resin insulating layers are formed of the lower insulating layer and the upper insulating layer disposed on the lower insulating layer. The conductor layer... Agent:

20140290994 - Surface-modified inorganic filler, method of preparing the same, buildup film composition for multilayer printed wiring board, and the multilayer printed wiring board including the same: Disclosed herein is a method of preparing a surface-modified inorganic filler, comprising the steps of: drying an inorganic filler; treating the inorganic filler with fluorine-containing gas to bond fluorine (F) to a part of the surface of the inorganic filler; and bonding a functional group-bonded silane coupling agent to another... Agent: Samsung Electro-mechanics Co., Ltd.

20140290995 - Transparent conductive film and preparation method thereof: A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is patterned to define a meshed trench, the meshed trench is filled with a conductive material to form a sending area, a periphery of the sensing area... Agent:

20140291000 - Ceramic electronic component and wiring board having built-in ceramic electronic component: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer... Agent: Murata Manufacturing Co., Ltd.

20140290998 - Multilayer ceramic capacitor and mounting board for multilayer ceramic capacitor: There is provided multilayer ceramic capacitor including, a ceramic body including a plurality of dielectric layers laminated therein, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, with the dielectric layers interposed therebetween, and having capacitance formed... Agent: Samsung Electro-mechanics Co., Ltd.

20140290999 - Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having... Agent: Samsung Electronics Co., Ltd.

20140291004 - Carrier tape for tab-package and manufacturing method thereof: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a... Agent:

20140291003 - Connecting element for a multi-chip module and multi-chip module: A connecting element can be used for a multi-chip module. The connecting element is provided for establishing an electrical connection between two elements and has a carrier and a first electrically conductive connecting structure on a first main surface of the carrier. The first connecting structure is designed in such... Agent: Osram Gmbh

20140291001 - Method of making hybrid wiring board with built-in stiffener and interposer and hybrid wiring board manufactured thereby: The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier... Agent: Bridge Semiconductor Corporation

20140291002 - Printed circuit board module: A printed circuit board module includes a first printed circuit board defining a plurality of front conductive pads formed on a top surface thereof and arranged along a transversal direction, and a second printed circuit board located on and welded to the first printed circuit board, the second printed board... Agent: Hon Hai Precision Industry Co., Ltd.

20140291005 - Wiring board: A wiring board includes a core substrate having a number of through-holes, and buildup insulating layers and buildup wiring layers alternately laminated on upper and lower surfaces of the core substrate, in which a first through-hole group is arranged in a first region in the core board at a first... Agent: Kyocera Slc Technologies Corporation

20140291006 - Printed circuit board solder mounting method and solder mount structure: A printed circuit board solder mounting method of solder-jointing a first-land formed on a first-printed-circuit-board and a second-land formed on a second-printed-circuit-board together, includes: filling a solder-filling-hole with cream solder, the solder-filling-hole provided so as to be open in a planar region of the first-land; arranging a solder-drawing-hole so that... Agent: Fujitsu Limited

20140291007 - Stacked electromagnetic bandgap structure: An EBG (electromagnetic bandgap) device with a stacked structure includes a first ground plane, a first power plane, a via, a second power plane, a second ground plane; a third power plane, and several ground vias. The first ground plane, the second power plane, and the second ground plane are... Agent: Hon Hai Precision Industry Co., Ltd.

20140291008 - Electrode pattern and touchscreen using the same: A touchscreen electrode pattern constituted by wavy conductive lines, each wavy conductive line includes multiple troughs of wave and multiple crests of waves, wherein an interval between adjacent troughs of waves in each wavy conductive line is larger than 1.5 times of a predetermined value, and an amplitude difference between... Agent:

20140291009 - Insulating body with a cruciform shield: The invention discloses an insulating body (1) which is provided for receiving and/or electrically contacting at least one conductor of a cable to be connected or for fitting onto a printed circuit board, the insulating body (1) being adapted to be introduced into a dedicated chamber of a plug connector... Agent: Harting Electronics Gmbh

20140291010 - Package, electronic device, method of manufacturing electronic device, electronic apparatus, and moving object: A package includes a base portion, and a lid which is placed on the base portion to define an inner space with the base portion and has a metal plate layer and a brazing material layer that is laminated on the metal plate layer, in which the base portion has... Agent: Seiko Epson Corporation

20140291012 - Electronic device: An electronic device is disclosed having a housing with a single opening, and an inner space accessible solely through the opening. A covering plate is positioned within the opening. An electrically conductive contact pin extends through the covering plate and into the inner space.... Agent: Tyco Electronics Amp Gmbh

20140291011 - Electronic device and method for fabricating the same: An electronic device includes a substrate and a lid bonded on the substrate with a resin layer to seal an inside of the lid. The resin layer is formed at a part of the substrate to which the lid is mounted. A part where the lid is bonded on the... Agent: Nihon Dempa Kogyo Co., Ltd.

20140291013 - Electrical connection box: According to one embodiment, an electrical connection box includes: a base unit including a common circuit to be used in common to multiple vehicle models or grades; multiple kinds of option units respectively including an addition circuit selectively usable according to vehicle models or grades and, wherein: the common circuit... Agent: Sumitomo Wiring Systems, Ltd.

20140291014 - Protection member for cable: A protection member for protecting cables extending through an installing hole of a board includes a plate defining a through hole, and a flange portion extending out from a sidewall bounding the through hole. A number of resilient portions are extended from the flange portion. The flange portion is extended... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd .

  
09/25/2014 > 32 patent applications in 25 patent subcategories.

20140284071 - Housing and method for manufacturing the same: A permanently-effective element for discharging any accumulation of static electrical charges from the housing of an electronic device includes a main body with an anodized layer formed on the main body. The main body defines a plurality of blind holes of varying shapes and sizes, topped with a layer of... Agent:

20140284099 - Water stopping structure of core wires and water stopping method of core wires: A water stopping structure includes a covered electric having a plurality of core wires covered with an insulation cover, and a core wire welding portion provided in a part of the covered electric wire where the insulation cover is removed and the core wires are exposed to the outside. In... Agent: Yazaki Corporation

20140284100 - Wire harness: A wire harness capable of improving manufacturability and handleability is provided. A wire harness 9 is means for electrically connecting a front inverter unit 4 to a battery 5, and is configured to include two high-voltage electric wires, and a shielding member 20 with which the two high-voltage electric wires... Agent: Yazaki Corporation

20140284101 - Low leakage electrical joints and wire harnesses, and method of making the same: Low leakage electrical joints and wire harnesses for simplifying the electrical infrastructure associated with solar energy utilities are disclosed. The low leakage electrical joints include fused wires that have been sealed, encased and configured to plug into other joints to form wire harnesses. The wire harnesses are particularly well suited... Agent:

20140284102 - Wire harness intermediate member, and wire harness: An intermediate member that enables enhancement of ease of fabrication of a wire harness and a wire harness including such an intermediate member are provided. A wire harness is divided into an intermediate member placed in an intermediate portion of the wire harness and two terminal members placed at respective... Agent:

20140284072 - Chain extended foam insulation coaxial cable and method of manufacture: A method for manufacturing a coaxial cable werein a polymer is irradiated and extruded around a metallic inner conductor and the polymer is then surrounded with a metallic outer conductor. The irradiated polymer may be irradiated, for example, via electron beam, for example, between 0.25 and 4 MRad.... Agent: Andrew LLC

20140284073 - Cable including reinforcement elements: The present invention relates to a cable including reinforcement elements. The cable according to the present invention includes at least one power conductors, at least one ground conductors, a semi-conducting layer configure to surround at least part of the power conductors and the ground conductors, and at least one ground... Agent: Ls Cable & System Ltd.

20140284074 - Electric wire and coil: A electric wire includes a central conductor 1 made of aluminum or an aluminum alloy, a cover layer 2 made of copper and covering the central conductor 1, and a ferromagnetic layer 3 covering the cover layer 2 and blocking the external magnetic field. The thickness of the ferromagnetic layer... Agent:

20140284075 - Thermally conductive self-supporting sheet: The present invention relates to a thermally conductive, self-supporting, electrically insulating, flexible sheet, which is advantageously useful for the insulation of electrical machines or devices, to a process for the manufacture as well as to the use thereof.... Agent: Merck Patent Gmbh

20140284076 - Low cost electrical terminals manufactured from conductive loaded resin-based materials: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is... Agent: Integral Technologies, Inc.

20140284077 - Bus bar, electronic component, and manufacturing method of electronic component: According to one embodiment, a manufacturing method of an electronic component comprises laminating aluminum plates via a nickel member in at least a part thereof; forming a bus bar having welded portions and non-welded portions by welding part of the laminated aluminum plates and the nickel member at positions; and... Agent: Kabushiki Kaisha Toshiba

20140284078 - Electrode loop structure of touch panel: An electrode loop structure of a touch panel mainly extends from I-shaped electrode elements serving as a base, and utilizes the annular conducting chain and gradient chain regularly cascaded together. A discontinuous resistor chain is disposed between the conducting chain and the gradient chain, wherein the conducting chain changes, by... Agent: Miracletouch Technology Inc.

20140284079 - Conductive layer of touch screen: A conductive layer of a touch screen is disclosed including a mesh made of metal wire. The conductive layer includes a sensing area and a wiring area electrically connected to the sensing area, the sensing area includes at least one of the first sensing patterns and at least one of... Agent: Nanchang O-film Tech. Co., Ltd.

20140284080 - Printed circuit board and method of mounting integrated circuit packaging component on the same: A printed circuit board and a method of mounting an integrated circuit packaging component on the same are provided. The printed circuit board includes a substrate and a plurality of conductive contacts arranged on a surface of the substrate. Each of the conductive contacts has a soldering material layer formed... Agent: Quanta Computer Inc.

20140284081 - Wiring substrate: A wiring board includes a substrate layer, an insulating layer laminated on the substrate layer and a connection terminal exposed from the insulating layer. The insulating layer has a first surface formed with an opening, a second surface located inside the opening and recessed toward the substrate layer and a... Agent:

20140284083 - Patterned transparent conductors and related manufacturing methods: A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions.... Agent:

20140284082 - Touchscreen and conductive layer thereof: The present invention relates to a conductive layer of a touch screen, the conductive layer is a mesh composed of metal wires, the mesh comprises a plurality of mesh cells, the mesh cell comprises a plurality of mesh edges and nodes formed by connecting two adjacent edges, the conductive layer... Agent:

20140284084 - Optically diffuse micro-channel: An embossed micro-channel structure includes a substrate having a substrate surface. A cured layer having a cured-layer surface is formed on the substrate surface. One or more embossed micro-channels is formed in the cured layer extending from the cured-layer surface into the cured layer toward the substrate. Each micro-channel has... Agent:

20140284085 - Wholly aromatic polyester amide copolymer resin, polymer film including the wholly aromatic polyester amide copolymer resin, flexible metal-clad laminate including the polymer film, and flexible printed circuit board including the flexible metal-clad lami: Provided are a wholly aromatic polyester amide copolymer resin, a polymer film containing the wholly aromatic polyester amide copolymer resin, a flexible metal clad laminate containing the polymer film, and a flexible printed circuit board employing the flexible metal clad laminate. The disclosed wholly aromatic polyester amide copolymer resin includes... Agent: Samsung Fine Chemicals Co., Ltd.

20140284087 - Circuit board made of ain with copper structures: Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or... Agent: Ceramtec Gmbh

20140284086 - Vibration-proof material, vibration-proof structure, and vibration-proof method: A vibration-proof material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. The content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less and the vibration-proof material has a Young's modulus at 23°... Agent: Nitto Denko Corporation

20140284088 - Circuit board and electronic apparatus provided with same: A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a... Agent:

20140284089 - Electronic component and electronic component package: An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces... Agent: Murata Manufacturing Co., Ltd.

20140284090 - Thin film substrate and method for manufacturing the same: The invention provides a method for manufacturing a thin film substrate. The method comprises steps of: providing a substrate having at least one through hole; forming a first metallic layer on a surface of the substrate and the through holes; forming a resist layer and a first opening on the... Agent: Ecocera Optronics Co., Ltd.

20140284091 - Laminated electronic component and mounting structure thereof: A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one... Agent: Murata Manufacturing Co., Ltd.

20140284092 - Split pad for circuit board: An electronic device such as a circuit board has a contact pad for connection to a contact of a component, and a pad portion interconnection. The contact pad has physically separate pad portions. The pad portion interconnection electrically connects the pad portions of the contact pad, independently of any mounted... Agent:

20140284093 - Support apparatus, via adding method, and printed circuit board: A design support apparatus includes: an area identifying unit configured to identify a target area where a via is to be added in a printed circuit board; a determining unit configured to determine a starting point for starting a search for a location of the via in the target area;... Agent: Fujitsu Limited

20140284094 - Apparatus for an emp shield for portable devices: An apparatus comprises an electrically conductive sheet material having a transparency. The sheet material being flexible to fold to form a pouch configured to enclose a portable computing device. The sheet material is configured to seal side edges of the pouch with edges of the sheet being in electrical engagement.... Agent:

20140284095 - Device for eliminating cell phone tracking: A shielding system includes a resealable enclosure configured to receive a handheld device. An electroconductive layer is configured to magnetically and/or electrically shield the handheld device.... Agent:

20140284096 - Casing of electronic device and method of manufacturing the same: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the... Agent: Htc Corporation

20140284097 - Field device: A field device with a housing for accommodating an electronics unit. The housing is pot shaped and composed of a non-conductive material, wherein at least one line guide passageway with a screw thread is provided on the housing, wherein the line guide passageway is provided with a conductive coating in... Agent: Endress + Hause Gmbh + Co. Kg

20140284098 - Wire lead-in device: A wire lead-in device for leading wires into a building from the upper side of a roofing material laid on a roof structural member includes a main body having a transversely long plate-like base part that is mounted on the roofing material, an insertion hole that penetrates through the base... Agent: Yanegijutsukenkyujo Co., Ltd.

  
09/18/2014 > 92 patent applications in 54 patent subcategories.

20140262410 - Portable lightning protection system: A portable lightning protection system is described for placement adjacent structures requiring lightning protection. The system includes a base mast section with an upper end and a plurality of radially extending, axially aligned ribs; a top mast section; preferably at least one intermediate mast section attachable to the upper end... Agent:

20140262485 - Movably adjustable cover for conductors and insulators: A cover apparatus is provided for covering an electrical insulator and a conductor. The cover apparatus includes a first cover portion extending along a first axis. The first cover portion comprises a first segment covering a first portion of the electrical insulator and a second segment coupled to the first... Agent: Preformed Line Products

20140262411 - Extended curl s-shield: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. One or more S-shaped separators are disposed amongst the twisted pairs. The S-Shaped separators may be formed with two layers or three layers, wherein at least one layer is conductive. Where two S-shaped separators... Agent: Commscope, Inc. Of North Carolina

20140262412 - Overhead electrical grounding mesh and mechanical grid structure: An overhead electrical grounding mesh and mechanical grid structure for a data center includes a plurality of orthogonally arranged grid beams. Each of the grid beams is a rigid and electrically conductive grid beam to provide an overhead structure configured to be positioned over electronic equipment in the data center.... Agent: Leviton Manufacturing Co., Inc.

20140262413 - Impedance controlled subsea ethernet oil filled hose: One or more insulated conductive wire assemblies are incorporated in a pressure balanced, oil-filled (PBOF) hose. Each conductive wire assembly has a pair of conductive wires each having an insulation layer, an insulating material surrounding the insulated wires, and an outer insulating layer surrounding the insulating material. The insulating material... Agent: Teledyne Instruments, Inc.

20140262414 - Resin additive, polyphenylene sulfide resin composition, and electronic device: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group,... Agent: Denso Corporation

20140262416 - Electrical box: An electrical box suitable for safely and efficiently housing an electrical connection. The electrical box includes a bottom and a plurality of adjacent side walls, each side wall being at least partially joined to the bottom and to each adjacent side wall to form an open box. Each side wall... Agent:

20140262415 - System for controlling power in a junction box: A system for controlling power in a junction box is described. The system comprises a junction box adapter having a plurality of flanges for coupling to a junction box of an electrical network, and a plurality of connector elements; and an electrical component, which enables the control of power, inserted... Agent:

20140262417 - Electrical box cover assembly: An electrical box cover assembly includes a base having a central opening and a collar encircling the central opening. A sleeve slides through the collar and is adjusted to a selected position by manually moving the sleeve and then locking the sleeve in place by a locking device. An expandable... Agent:

20140262420 - Floor box cover assembly: A cover assembly for a floor box includes a base with a central opening and a cover pivotally connected to the base by a hinge member. The hinge member has a hinge body with a first end pivotally connected to the base for pivoting with respect to the base and... Agent:

20140262419 - Wall mounted electrical device cover plate assembly: A cover plate assembly is provided with a cover plate with a substrate adapted to be mounted upon a substrate of a subplate mounted to an electrical device for enclosing the electrical device. A rim extends from a periphery of the cover plate substrate. The fastener is engaged with the... Agent: Liberty Hardware Mfg. Corp.

20140262418 - While in use weatherproof cover for an electrical box: A weatherproof cover assembly for an electrical device such as an electrical outlet has a base and hinged cover that encloses the base when a cord or plug is connected to the electrical outlet. The base has a cord access opening to allow the cord to pass between the base... Agent: Hubbell Incorporated

20140262421 - Tubular cable protection and guide device: A tubular cable protection and guide device is provided. The tubular cable protection and cable device includes an elastomer resin sheet that has: an outer circumference wall forming portion, a pair of sidewall forming portions on the left and right sides, and a pair of inner circumference wall forming portions... Agent: Tsubakimoto Chain Co.

20140262495 - Wire harness with metal pipe and cap: A wire harness includes conducting paths, a metal pipe into which the conducting paths are inserted, and a conducting path protective cap which includes a through hole for the conducting paths, and an engaging part which is engaged with a terminal part of the metal pipe. The terminal part of... Agent: Yazaki Corporation

20140262496 - Electrical connection and termination assemblies: An electrical cable termination assembly includes a crimp body configured for electrically connecting a conductive core of an electrical cable to a conductive pin. The crimp body is further configured to receive the conductive core at a first end thereof and the conductive pin at a second end thereof. The... Agent:

20140262497 - Controlled compression tube: An electrical connector for a composite core conductor and a method of controlling crimping thereof includes a coupling portion and a tubular portion extending from the coupling portion. A conductor has a non-metallic core surrounded by electrically conductive strands and has a connecting portion of the core extending axially beyond... Agent:

20140262500 - Cover assemblies and methods for covering electrical cables and connections: A method for protecting a cable splice connection including a cable, the cable including an electrical conductor surrounded by a cable insulation layer, includes providing a splice body assembly including: an electrically insulative, elastomeric splice body having an interior surface defining an interior passage; and a layer of a conformable... Agent: Tyco Electronics Corporation

20140262498 - Interconnect device and assemblies made therewith: An interconnect device forms an electrical and mechanical connection between electrical connections pads on an integrated circuit and those on a printed circuit board. The device is a coil with a first portion of its turns at one axial end of the coil having at least two turns in axial... Agent: U.s.a. As Represented By The Administrator Of The National Aeronautics And Space Administration

20140262499 - Methods and apparatus for optimizing electrically inoperative zones on laminated composite assemblies: In some embodiments, a system includes a first portion, a second portion, and a third portion of an electrical conductor. Each portion is electrically coupled to the other two portions. The first, second, and third portions are configured such that substantially no current induced in and/or supplied to the first... Agent: Boulder Wind Power, Inc.

20140262501 - Durable copper to aluminum welded connection: A welded electrical connection includes an aluminum electrical conductor welded to a copper electrical conductor. The copper electrical conductor and the aluminum electrical conductor form a butt joint, A ferrule is over the butt joint and attached to the copper electrical conductor and the aluminum electrical conductor. The ferrule is... Agent:

20140262422 - Low static discharge lan twisted pair cable: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. One or more separators may optionally be disposed amongst the twisted pairs. The cable may optionally include a nonconductive core wrap, and/or the cable may optionally include an outer conductive shielding layer wrap. One... Agent: Commscope, Inc. Of North Carolina

20140262423 - Class i and class ii modular wiring system: A modular wiring system carries different types or classes of wiring in a single cable. The modular wiring system includes two conduits, one inside the other. The outer conduit is a Class I conduit and the inner conduit is a Class II conduit. The Class II wiring is carried in... Agent: AblIPHolding LLC

20140262424 - Shielded twisted pair cable: A wire cable capable of transmitting digital signals with a data rate of at least 5 Gigabits per second (Gb/s). The wire cable includes an insulated twisted pair of conductors and an inner conductive shield enclosing the conductors. The insulation of the twisted pair is bonded to provide consistent spacing... Agent: Delphi Technologies, Inc.

20140262425 - Shielded cable with utp pair environment: A cable includes a spacer surrounding a cable core. The cable core includes four twisted pairs. A separator is disposed amongst the twisted pairs. The separator may be formed with three layers, wherein a middle layer is conductive and outer layers are nonconductive. A jacket surrounds the spacer, and a... Agent: Commscope, Inc. Of North Carolina

20140262426 - Controlled peel laminate adhesive films: Disclosed is a multilayer adhesive film comprising surface adhesive layers, an internal Controlled Bond Layer (“CBL”) comprising a propylene-based polymer strippably adhered to an adjacent layer; an internal Strong Bond Layer (“SBL”) different than the CBL having a facial surface in adhering contact to the CBL and; optionally, one or... Agent: Dow Global Technologies LLC

20140262427 - Foamed polymer separator for cabling: A cable separator comprising a preshaped article having a longitudinal length, wherein said preshaped article is substantially entirely formed of a foamed polymer material having a glass transition temperature greater than 160° C. and being halogen-free is provided. A data communications cable comprising a plurality of conductors and the cable... Agent: General Cable Technologies Corporation

20140262428 - High strength tether for transmitting power and communications signals: An electro-optical-mechanical tether is presented. The tether is designed to be strong and lightweight, and to transmit both optical signals and electricity. The proposed use relates to airborne devices, in which the tether may transmit electrical power to or from the device as well as enabling communications between the device... Agent:

20140262430 - Flexible flat cable and method of manufacturing the same: A flexible flat cable includes an insulating layer disposed through extrusion in vicinity of a plurality of conductors arrayed in parallel with each other. The insulating layer is composed of a vinyl chloride-based resin composition having a die swell ratio of 1.1 or more at a molding temperature during the... Agent: Yazaki Corporation

20140262429 - Multiple-conductor flat cable: A multiple-conductor flat cable includes: an analog cable portion formed such that ground signal lines and analog signal lines are alternately arranged side by side across a signal transmission direction and each adjacent pair of the ground signal lines and the analog signal lines are joined while being electrically insulated... Agent: Ricoh Company, Ltd.

20140262431 - Multi-cable breakout assembly: A multi-cable breakout assembly includes: a plurality of cables arranged in a rectangular array of M rows×N columns, wherein M and N are positive whole numbers greater than one; a first sleeve that encircles the plurality of cables; first and second ribbon members, the first ribbon member being threaded through... Agent: Commscope, Inc. Of North Carolina

20140262432 - High voltage high current transmission line: A high voltage high current transmission line for transmitting high voltage high current energy in the 10 kV and 200,000 A range from a power source to an end item to which the power is delivered. The high voltage high current transmission line includes two generally parallel configured conductive plates... Agent:

20140262433 - Nano electrode and manufacturing method thereof: A nano electrode according to the present invention includes a main body having a protruded probe, a nano wire attached to the probe, and an insulating film including an opening unit which surrounds the nano wire and makes an upper surface of the nano wire to be visible.... Agent:

20140262434 - Adjustable cover for conductors and insulators: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes one or more leg sections for covering a portion of the electrical conductor. The cover apparatus includes a cover section coupled to the one or more leg sections and covering a portion of the... Agent: Preformed Line Products

20140262435 - Dimensionally adjustable cover for conductors and insulators: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes a leg section that covers a portion of the electrical conductor. A cover section covers a portion of the electrical insulator. The cover section can include a body portion that is coupled to the... Agent: Preformed Line Products

20140262436 - Electrical equipment clip: An electrical equipment clip for use with electrical cables is provided herein. Embodiments include clips in a plurality of sizes for attaching to electrical cables, deadbreak elbows, and loadbreak elbows. The electrical equipment clip has markings on detachably attached information tabs that allow linesmen to quickly and easily determine the... Agent:

20140262437 - Wire compression connector: A compression connector for connecting two wires is disclosed. The compression connector is made of either a single bifurcated connector body or two individual connector components that are slidably coupled and then crimped. As the compression connector is crimped, structural features on the connector components are pushed into a locked... Agent: Thomas & Betts International, LLC

20140262438 - Mold for impregnating a prefabricated condenser core of a high-voltage bushing and device for forming a condenser core of a high-voltage bushing: An exemplary mold is disclosed for impregnating a prefabricated condenser core (C) of a high voltage bushing with a liquid resin and includes two mold modules movable against each other and shaped to form an axially symmetric mold cavity. The mold forms a column of cylindrical design, in which the... Agent: Abb Technology Ag

20140262441 - Circuit board with signal routing layer having uniform impedance: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes connector traces, chip traces, and signal traces connecting the two. A width of the signal traces is greater than a width of the chip traces, which is less than... Agent: Hon Hai Precision Industry Co., Ltd.

20140262443 - Hybrid patterned nanostructure transparent conductors: Disclosed herein are nanostructure patterned transparent conductors and methods of forming such transparent conductors including using a deposition method to form an active area and peripheral area and patterning method to pattern the active area.... Agent: Cambrios Technologies Corporation

20140262439 - Method of manufacturing electrical circuit traces: A method of manufacturing an electrical trace includes forming a continuous electrical trace strip having a plurality of electrical trace elements, stamping one or more electrical trace isolators onto the continuous electrical trace strip across select ones of the plurality of electrical trace members forming one or more electrical trace... Agent: Gm Global Technology Operations LLC

20140262442 - Module and method of manufacturing the same: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and... Agent: Murata Manufacturing Co., Ltd.

20140262440 - Multi-layer core organic package substrate: A multi-layer core organic package substrate includes: a multi-layer core comprising at least two organic core layers, wherein two of the at least two organic core layers are separated by a core metal layer; a first plurality of build-up layers formed on top of the multi-core layer; and a second... Agent: Xilinx, Inc.

20140262444 - Circuitry with high aspect ratio traces: Imprinting tools and processes for making such tools, circuitry that includes narrow, high aspect ratio traces having reduced parasitic capacitance to adjacent circuit features and processes for making such circuitry using the imprinting tools are described.... Agent:

20140262448 - High-frequency signal line, method for producing same, and electronic device: A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground... Agent: Murata Manufacturing Co., Ltd.

20140262445 - Methods and circuit structures for mitigating voltage stresses on printed circuit board (pcb) in high voltage devices: A method for mitigating voltage stress on a PCB includes applying AC voltage to a multi-terminal condenser structure of a multi-layered PCB. The terminal condenser structure is formed by overlapping a plurality of conductive traces between board layers of the multi-layered PCB. A corresponding dielectric layer is disposed between the... Agent: Doble Engineering Company

20140262447 - Multilayer printed wiring board for mounting semiconductor element: A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second... Agent: Ibiden Co., Ltd.

20140262446 - Systems and methods for providing surface connectivity of oriented conductive channels: An electrically conductive composite is disclosed that includes a dielectric material having a first side and a second side, conductive particles within the dielectric material layer, and a discontinuous layer of a conductive material on a first side of the dielectric layer. The conductive particles are aligned to form a... Agent: Flexcon Company, Inc.

20140262449 - Apparatus and method for a back plate for heat sink mounting: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at... Agent: Futurewei Technologies, Inc.

20140262450 - Multilayer printed circuit board structure: A multilayer printed circuit board structure is formed by stacking an aluminum foil substrate, a first pre-impregnated body, an aluminum foil middle layer, a second pre-impregnated body and a copper foil surface layer sequentially. Both the first pre-impregnated body and the second pre-impregnated body are composed by a fiber cloth... Agent:

20140262451 - Wiring substrate and manufacturing method thereof: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed... Agent: Yazaki Corporation

20140262452 - Embossed micro-structure with cured transfer material method: A method of making an embossed micro-structure includes providing a transfer substrate, an emboss substrate, and an embossing stamp having one or more stamp structures. Transfer material is coated on the transfer substrate. The transfer material on the transfer substrate is contacted with the stamp structures to adhere transfer material... Agent:

20140262453 - Transparent conductive electrodes and their structure design, and method of making the same: A transparent conductive electrode comprising a single transparent conductive layer comprising a network of nanowires of different diameters and a diffused conductive material wrapping around the nanowires is disclosed. The transparent conductive electrode has a thickness of 200 nm or less, and exhibits >90% transparency in wavelength between 400-1000 nm... Agent: Nuovo Film, Inc.

20140262456 - High aspect ratio traces, circuits, and methods for manufacturing and using the same: High aspect ratio trace circuits and methods of manufacture and use are provided herein. A method may include obtaining a substrate, the substrate having a reservoir for receiving a conductive ink and a plurality of trace voids that are arranged in a pattern, the plurality of trace voids each having... Agent:

20140262455 - Simultaneous and selective wide gap partitioning of via structures using plating resist: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first... Agent: Sanmina Corporation

20140262454 - Stabilization agents for silver nanowire based transparent conductive films: Zinc salts have been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such salts may be incorporated into one of more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers.... Agent:

20140262460 - Connection component with posts and pads: A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads... Agent: Tessera, Inc.

20140262462 - Depositing bulk or micro-scale electrodes: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating... Agent:

20140262457 - Porous alumina templates for electronic packages: Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a... Agent: Invensas Corporation

20140262461 - Process for forming self-assembled monolayer on metal surface and printed circuit board comprising self-assembled monolayer: The present invention provides a printed circuit board comprising a metal surface, such as a final finish, that has been coated with a self-assembled monolayer. The self-assembled monolayer forms a coating on the metal surface that is resistant to corrosion, thus preserving the solderability of the metal surface. The present... Agent: Omg Electronic Chemicals, Inc.

20140262458 - Under ball metallurgy (ubm) for improved electromigration: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact... Agent: International Business Machines Corporation

20140262459 - Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same: A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The... Agent: Apaq Technology Co., Ltd.

20140262463 - Embedded multilayer ceramic electronic component and printed circuit board having the same: There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 μm or less, first and second internal electrodes alternately exposed to... Agent: Samsung Electro-mechanics Co., Ltd.

20140262467 - Contact surface for a pin hole: The present invention relates to an improved contact surface of pin hole (e.g, a ground pin hole, screw fastening hole, or the like), which is adopted on a substrate, the substrate is formed with at least a pin hole (e.g, a ground pin hole, screw fastening hole, or the like)... Agent: Lantek Electronics Inc.

20140262464 - Laterally coupled isolator devices: A laterally coupled isolator includes a pair of isolator traces provided in a common dielectric layer and separated by a distance that defines the isolation strength of the system. Circuit designers can vary the lateral distance to tailor isolation rating to suit individual design needs. A second embodiment includes a... Agent: Analog Devices, Inc.

20140262466 - Lowering the sheet resistance of a conductive layer: An electronic device can include a substrate and a conductive layer. The conductive layer can be disposed over at least a portion of the substrate and a patterned conductive material can be disposed over at least a portion of the conductive layer. Alternatively, the patterned conductive layer can be disposed... Agent: Apple Inc.

20140262465 - Wiring substrate and method of manufacturing the same: A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first... Agent: Shinko Electric Industries Co., Ltd.

20140262469 - Radio frequency feedthrough: A radio frequency feedthrough for optoelectronic housings is provided that includes a multilayer ceramic body and a signal conductor that extends through the ceramic layers in an S-shape. In an upper region of the multilayer ceramic body, a ground layer is recessed in a V-shape, and in a central region... Agent: Schott Ag

20140262468 - System and method for an improved interconnect structure: Presented herein are an interconnect structure and method for forming the same. The interconnect structure comprises a contact pad disposed over a substrate and a connector disposed over the substrate and spaced apart from the contact pad. A passivation layer is disposed over the contact pad and over connector, the... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20140262470 - Metal post bonding using pre-fabricated metal posts: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each... Agent:

20140262471 - Selectively conductive emi gaskets: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.... Agent: Laird Technologies, Inc.

20140262472 - Integrated grounded grommet: The embodiments disclose an integrated grounded grommet for anchoring a cable using a bulkhead opening, including a customized grommet mechanically bonded onto a cable creating a pressure seal, a customized grommet extended boss insertion guiding feature, a grounding path electrically bonded through the grommet to a cable shield, and a... Agent:

20140262473 - Electromagnetic interference shielding (emi) apparatus including a frame with drawn latching features: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more... Agent: Laird Technologies, Inc.

20140262474 - Rf shielding for mobile devices: An RF shielding device for mobile devices includes a conductive grid having horizontal and vertical wire traces in electrical contact with each other; a conductive trace disposed around the perimeter of the conductive grid, the conductive trace being in electrical contact with both ends of each of the horizontal and... Agent: Continental Accessory Corp.

20140262475 - 3d shielding case and methods for forming the same: A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a... Agent:

20140262476 - Self-wrapping emi shielding textile sleeve and method of construction thereof: A self-wrapping, textile sleeve for routing and protecting elongate members from electromagnetic interference and a method of construction thereof is provided. The sleeve has an elongate wall constructed from interlaced yarns. At least one of the yarns is provided as heat-settable polymeric yarn that is heat-set to bias the wall... Agent: Federal-mogul Powertrain, Inc.

20140262477 - Method and apparatus pertaining to a cavity-bearing printed circuit board: A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured,... Agent: Research In Motion Limited

20140262478 - Emi shielding textile fabric, wrappable sleeve constructed therefrom and method of construction thereof: A textile fabric, sleeve formed therefrom, and methods of construction thereof are provided. The fabric forms an elongate wall constructed from lengthwise extending warp yarns woven with widthwise extending weft yarns. At least some of the warp yarns are electrically conductive and have a first diameter. The weft yarns have... Agent: Federal-mogul Powertrain, Inc.

20140262480 - Method and apparatus for an electrical box block bracket with tabs: An electrical box block bracket can include a face place and a rotatable members extending from each of two opposing edges of the face plate. The face plate can also include a aperture providing a passageway through the face plate and sized and shaped to receive a mud ring and/or... Agent:

20140262481 - Self-aligning back plate for an electronic device: An illustrative electronic assembly includes a housing and a wall plate, where the wall plate is releasably connectable to the housing. The housing and the wall plate may be configured such that the housing and the wall plate may be able to initially engage each other with the wall plate... Agent:

20140262482 - Self-aligning back plate for an electronic device: An illustrative electronic assembly includes a housing and a wall plate, where the wall plate is releasably connectable to the housing. The housing and the wall plate may be configured such that the housing and the wall plate may be able to initially engage each other with the wall plate... Agent:

20140262479 - Strap for positioning wires/cables: An illustrative embodiment of the present invention relates to a strap for maintaining the position of wires/cables within a wall frame. The strap has an elongate flexible strip which includes a first plurality of apertures between a first end and a second opposite end of the strip. The strap also... Agent:

20140262484 - Battery holder for an electronic device: A heating, ventilation, and air conditioning (HVAC) controller may include a housing and a printed circuit board (PCB) situated within the housing. The PCB may include a battery seat region and electrical terminals for electrically connecting a battery to the PCB when the battery is positioned at the battery seat... Agent:

20140262483 - Bracket and assembly for electrical devices: The present disclosure is directed to a bracket and electrical assembly including such bracket for mounting or securing to a concrete masonry unit (CMU).... Agent: Cablofil, Inc.

20140262486 - Push-in cable connector and electrical box assembly: A cable connector is provided for coupling to and mounted within the internal cavity of an electrical box for securing an electrical cable passing through an opening in the electrical box. The cable connector includes a body having a first end positioned next to or adjacent the cable opening in... Agent:

20140262488 - Cable connector and electrical box assembly: A cable connector is provided for coupling to and mounted within the internal cavity of an electrical box for securing an electrical cable passing through an opening in the electrical box. The cable connector includes a body having a first end positioned next to or adjacent the cable opening in... Agent:

20140262487 - Patch panel assembly: A cable guide for guidance of at least one cable through a patch panel system, including a housing having front, back, left, and right sides, and at least one patch panel device including a tray and one or more adapters, the cable guide comprising an advancing member having a first... Agent: Go!foton Holdings, Inc.

20140262489 - Electrical enclosure with improved mechanical arrangement: the functional assembly comprising at least one support (41) fixed in independent manner onto an upright or a cross-member of the inner frame and a connector (40) arranged on said support (41), said support being positioned on the upright or fixing cross-member so as to enable the connector (40) to... Agent: Schneider Electric Industries Sas

20140262490 - Terminal assembly for an electronic device: A terminal assembly for use with an electronic device may include a first portion for secure a wire and a second portion for receiving a pin of an electronic device. The first portion and the second portion may be configured to electrically connect the pin to the wire.... Agent:

20140262491 - Electrical enclosure expandable in the z direction: An expandable electrical enclosure system is presented where expansion collars can be serially added to an existing base box to increase the dimension of the enclosure in only the Z direction. A removable cover can be disconnected and connected as each expansion collar is added.... Agent: Asco Power Technologies, L.p.

20140262492 - High voltage busing for cryogenics applications: An electrical bushing is disclosed for use in high voltage cryogenic applications. The bushing including first and second bushing portions and an electrical conductor disposed longitudinally within the portions. The electrical conductor has a first terminal extending from the first bushing portion and a second terminal extending from the second... Agent: Varian Semiconductor Equipment Associates, Inc.

20140262493 - Laser welding a feedthrough: One aspect is a method of coupling an insulator to a surrounding ferrule in an implantable medical device. An insulator is provided having a plurality of conducting elements extending therethrough. The insulator is placed with conducting elements within a ferrule having a frame-like shape surrounding the insulator along an interface.... Agent: Heraeus Precious Metals Gmbh & Co. Kg

20140262494 - Head part for an implantable medical device: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal... Agent: Heraeus Precious Metals Gmbh & Co. Kg

  
09/11/2014 > 70 patent applications in 18 patent subcategories.

20140251654 - Direct current (dc) transmission system comprising a thickness controlled laminated insulation layer and method of manufacturing: A direct current transmission system and a method for preparation including an electrical conductor layer, an inner semiconductive layer covering the conductor layer, an insulation layer provided on the semi-conductive layer including laminated polymer material and impregnated with a high viscosity fluid, and including an inner part, a middle part,... Agent:

20140251651 - Braided-shielded cable: A braided-shielded cable includes a braided shield including a shield wire braided. The shield wire includes a twisted wire including seven or nineteen wires twisted together.... Agent:

20140251682 - High voltage conductive wire and wire harness: A high voltage conductive wire includes a first conductor, configured to perform as one of a plus pole and a minus pole, a first insulator, provided outside of the first conductor, a second conductor, configured to perform as the other of the plus pole and the minus pole, provided outside... Agent: Yazaki Corporation

20140251683 - Wire harness with clip and wire harness having the same: There is provided a wire harness with clip in which a clip for fixing a protect tube without winding tape is integrally molded, and a wire harness having the wire harness with clip. The wire harness with clip is provided with a clip to be latched into an attaching hole... Agent: Yazaki Corporation

20140251681 - Wire harness with exterior member: A wire harness includes one or more conducting paths, and a pipe-like exterior member which accommodates the one or more conducting paths. The exterior member is formed of a shrinkable tube having a bent part formed in conformity with a wiring path of the one or more conducting paths during... Agent: Yazaki Corporation

20140251684 - Electrical power transmission system and method: A power carrier transmits an electrical current to and from a load. The carrier has a set of wires carrying electricity in parallel to the load and another set of wires carrying the electricity back in parallel from the load. The wires are organized with equal numbers of wires form... Agent:

20140251685 - Guarded coaxial cable assembly: A guarded coaxial cable assembly including a micro-coaxial cable and at least one rail.... Agent:

20140251652 - Communication cable: Cables including central insulators and/or center separators. Each of at least some of the central insulators includes a first wire channel configured to receive a first wire of a wire pair, a second wire channel configured to receive a second wire of the wire pair, and an intermediate portion positioned... Agent: Leviton Manufacturing Co., Inc.

20140251653 - Hybrid conductor core: An electric conductor may be provided. The electric conductor may comprise a conductor core and a plurality of conductor strands wrapped around the conductor core. The conductor core may comprise a plurality of core strands comprising an overall number of strands. The plurality of core strands may comprise a first... Agent: Southwire Company, LLC

20140251657 - Printed circuit board and method of manufacturing the same: Embodiments of the invention provide a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the... Agent: Samsung Electro-mechanics Co., Ltd.

20140251655 - Stabilization agents for silver nanowire based transparent conductive films: Boric acid has been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such compounds may be incorporated into one or more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers.... Agent:

20140251656 - Wiring board and method for manufacturing the same: A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive... Agent: Ibiden Co., Ltd.

20140251659 - Circuit board, and manufacturing method for circuit board: A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in... Agent: Kabushiki Kaisha Toyota Jidoshokki

20140251658 - Thermally enhanced wiring board with built-in heat sink and build-up circuitry: A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up circuitry. The build-up circuitry covers the heat sink and the stiffener and provides signal routing for the stiffener.... Agent: Bridge Semiconductor Corporation

20140251661 - Micro-channel structure with variable depths: A micro-channel structure having variable depths includes a substrate and a cured layer formed on the substrate. At least first and second micro-channels are embossed in the cured layer. The first micro-channel has a bottom surface defining a first depth and the second micro-channel has a bottom surface defining a... Agent:

20140251662 - Optically clear conductive adhesive and articles therefrom: The present invention provides an electrically conductive, optically clear adhesive including an optically clear adhesive layer and an interconnected, electrically conductive network layer positioned over the optically clear adhesive layer. The electrically conductive, optically clear adhesive has a conductivity of between about 0.5 and about 1000 ohm/sq, haze of less... Agent: 3mm Innovative Properties Company

20140251660 - Variable-depth micro-channel structure: A variable-depth micro-channel structure includes a substrate. A cured layer is formed on the substrate. A micro-channel embossed in the cured layer has a bottom surface defining two or more different micro-channel depths of the micro-channel. A cured electrical conductor forms a micro-wire in the micro-channel over the bottom surface... Agent:

20140251664 - Circuit substrate: In a ceramics substrate comprising a surface layer conductor having a sufficient thickness for a flow of a large current, wherein the conductor is buried in a surface region of the substrate, a crack caused by a temperature change of the substrate is effectively suppressed. In the ceramics substrate comprising... Agent: Ngk Insulators, Ltd.

20140251663 - Simultaneous and selective wide gap partitioning of via structures using plating resist: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first... Agent: Sanmina Corporation

20140251667 - Conductive networks on patterned substrates: Among other things, self-assembled conductive networks are formed on a surface of substrate containing through holes. The conductive network having a pattern is formed such that at least some of the conductive material in the conductive network reaches into the holes and, sometimes, even the opposite surface of the substrate... Agent: Cima Nanotech Israel Ltd.

20140251665 - Device for storing electromagnetic energy: A device for storing electromagnetic energy and signals, for example from biological systems and, possibly modifying, and emitting them again is provided with a planar substrate, having a first side and a second side, at least one first arrangement being provided on the first side, which has at least one... Agent:

20140251666 - Laminated body and manufacturing process therefor: Disclosed is a laminated body including a substrate having an unevenness with an aspect ratio of 1.5 to 100 in the surface thereof, and a conductive film that is laminated in an approximately uniform thickness on a bottom, side wall surfaces, and an apex of the unevenness, the conductive film... Agent: Nippon Soda Co., Ltd.

20140251668 - Automatic manufacturing process for providing buffer pads for a pcb and pcb structure using the same: An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d)... Agent: Delta Electronics, Inc.

20140251670 - Module, method for manufacturing the module, and electronic apparatus including the module: A module includes a wiring board; a component mounted on the wiring board; a columnar conductor for external connection, the columnar conductor being connected at one end thereof to the wiring board; and a resin layer disposed on the wiring board and configured to cover the columnar conductor and the... Agent: Murata Manufacturing Co., Ltd.

20140251669 - Suspended inductor microelectronic structures: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the... Agent:

20140251674 - Bridge structure in conductive mesh and method for manufacturing the same: A bridge structure for electrically connecting to a second direction meshed conductive trace disposed on a substrate surface, where a first direction meshed conductive trace disposed on the same surface, which includes a first bridging wire, a second bridging wire, an insulating layer, and a conductive bridge. The first bridging... Agent: Nanchang O-film Tech. Co., Ltd.

20140251673 - Micro-channel connection method: A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer... Agent:

20140251672 - Micro-channel connection pad: A connection-pad structure includes a substrate and a cured layer formed in the substrate. A group of intersecting micro-channels is embossed in the cured layer opposite the substrate. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate; the intersecting micro-channels form a connection pad. An... Agent:

20140251671 - Micro-channel with conductive particle: A micro-channel structure includes a substrate and a cured layer formed on the substrate. One or more micro-channels are embossed in the cured layer on a cured-layer surface opposite the substrate and define a bottom surface. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate.... Agent:

20140251675 - High speed printed circuit board with uniform via inside diameter: A printed circuit board, and method of manufacture, for high speed signals. The printed circuit board has small diameter vias of uniform inside diameter when plated. The uniformity of the inside diameter, at least over the region in which a press fit segment is inserted, is sufficient to make a... Agent: Amphenol Corporation

20140251676 - Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing... Agent: Hitachi Chemical Company, Ltd.

20140251678 - Electronic device enclosure: An electronic device enclosure includes a chassis defining an space, and a cover module. The chassis includes two opposite sidewalls locating at two sides of the space. The cover module includes a cover and a latching apparatus mounted to the cover. A first end of the cover is rotatably connected... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140251677 - Insulator protection: Insulating materials disposed within the housing are protected through the use of removable protective layers, which can be fit over the insulating components. In some embodiments, these removable protective layers are dimensioned so as to fit over the insulating components without the use of any fasteners. In other embodiments, a... Agent: Varian Semiconductor Equipment Associates, Inc.

20140251680 - Cathodic protection system for multiple structures using shunt modules: A shunt module for use in an impressed current cathodic protection system includes a rail mounting mechanism, an electrically insulating strip carrier mounted to the rail mounting mechanism, and a shunt. The shunt includes a conductive strip or wire having contacts at opposing ends. The shunt is coupled to the... Agent:

20140251679 - Feedthrough assembly for electrically conductive winding: A well-logging tool for geological formation has a borehole. A housing that is to be positioned within the borehole includes an opening. An electrically conductive winding is carried by the housing. A feedthrough assembly includes an elongate electrical conductor having opposing first and second ends and a medial portion extending... Agent: Schlumberger Technology Corporation

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