|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulatorsBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 03/06/2014 > 57 patent applications in 35 patent subcategories.
20140060873 - Active cooling of medium voltage power umbilicals: An umbilical comprises an outer sheath defining an interior void; one or more power cores; and one or more forced convection cooling circuits disposed within the interior void proximate the power cores, typically at least one forced convection cooling circuit paired with each power core. The forced convection cooling circuit... Agent: Oceaneering International, Inc.
20140060874 - Housing of electronic device and manufacturing method thereof: The present disclosure discloses a housing of an electronic device which includes a composite stack plate. The composite stack plate includes a resin layer and a plurality of fibered fabrics. The fibered fabrics are arranged at intervals, layered with each other and embedded in the resin layer. Each fibered fabric... Agent: Quanta Computer Inc.
20140060875 - Hermetic housing arrangement: The present disclosure relates to a housing arrangement, in particular to a hermetic housing arrangement, having at least one housing for connecting a plug-in connector, wherein the housing arrangement has at least one seal. The housing arrangement in accordance with the present disclosure is characterized in that the at least... Agent:
20140060877 - Electrical junction box: An electrical junction box includes a frame, a bus bar and a relay to be mounted to the frame, a junction terminal interconnecting a plate-like terminal portion of the bus bar and a plate-like terminal portion of the relay. The junction terminal includes a tubular portion having a pair of... Agent: Yazaki Corporation
20140060876 - Terminal connector for a wall mounted device: A wall mounted device includes a housing having a rear surface that is intended to face a wall to which the device is to be mounted. The housing also has an interior portion and an opening formed therein to allow wires from the wall to pass therethrough for communication with... Agent: Allure Energy, Inc.
20140060878 - Screwless and seamless cover plate and cover plate assemblies for electrical fixtures: Cover plates are provided for electrical fixtures including a screwless cover plate and/or cover plate assembly for electrical devices that cover the outlets but provide holes for plugs, light switches, audio, data, or video connectors, and the like, and that do not show screw or attachment holes and where the... Agent:
20140060880 - Protector of electric wire for allowing movement of fixation object: There is provided a protector to be assembled and fixed to a given position of a fixation object. The protector includes an accommodating space and an opening consecutive to the accommodating space which an electric wire or a bundle of electric wires is adapted to be passed through and accommodated... Agent: Yazaki Corporation
20140060879 - Systems and methods for storing a cable: Systems and methods for storing a cable are provided. The casing may be configured to naturally coil and to uncoil when one or more forces are applied to the casing. The casing may include an opening that may lead to a channel that may run longitudinally through a length of... Agent: Apple Inc.
20140060881 - Extendable-length encapsulating housing arrangement for an encapsulated electrical energy transmission device: A variable length encapsulation housing configuration for an encapsulated electrical energy transmission device has a first encapsulation housing with a sliding surface and a second encapsulation housing supported in a sliding manner on the sliding surface of the first encapsulation housing. The first encapsulation housing has a supporting body on... Agent: Siemens Aktiengesellschaft
20140060921 - Flat-conductor connection element for an antenna structure: A flat-conductor connection element for an antenna structure is described. The flat-conductor connection element, is arranged in or on a pane and has: a flat conductor with a base layer, a conductor track, a first dielectric layer, a shield, and a second dielectric layer and a metal frame.... Agent:
20140060922 - Fastening device for a line and method for fastening a line: A fastening device, e.g., for an electrical cable in a vehicle, has a sleeve which is lockable in a holder and which encloses the line. The sleeve has at least two sleeve subareas which are at least partially separable from one another in such a way that in a preinstalled... Agent:
20140060924 - Connector and wire harness: A connector includes a terminal including a connecting portion that is connected to a plate portion formed at an end of another terminal by a fitting, and an elastic member having a lower rigidity than the plate portion and the connecting portion. The connecting portion includes a bottom portion to... Agent: Hitachi Metals, Ltd.
20140060925 - Covering material for electric wire, insulated electric wire, and wiring harness: A covering material for electric wire, and an insulated electric wire and a wiring harness including the same, wherein the wire including the covering material has a reduced diameter, is inserted into a connector. The covering material containing a polyvinyl chloride comprises, with respect to 100 parts by mass of... Agent:
20140060923 - Protector: A protector includes a bottom plate part on which a plurality of electric wires is placed on the same plane, a pair of side parts that is provided to erect from the bottom plate part so that the electric wires is interposed between the pair of the side parts, a... Agent: Yazaki Corporation
20140060926 - Contact element and method for manufacturing same: A contact element for contacting a contact point formed on a body includes: an element section on the contact point side for a force-locking connection to the contact point, an element section on the connection side for connection to an electrical connection conductor, and an intermediate section which connects the... Agent:
20140060927 - Hook-thread component and wiring element fastening device having the hook-thread component: A wiring element fastening device is provided to fasten a wiring element to a wiring element connector. The wiring element connector includes an engaging part that is electrically engageable with a terminal of the wiring element. The wiring element fastening device includes: a hook-thread component having a base part engaged... Agent: Avc Industrial Corp.
20140060928 - Molded testable long term subsea abandonment cap for electrical cables and method of manufacture: An umbilical cable assembly is created by a process which, in an embodiment, fits an abandonment cap onto an end of an electrically conductive cable as well as a polyethylene disc into which a set of connection pins have been pre-molded. The abandonment cap is injection molded onto the end... Agent: Oceaneering International, Inc.
20140060882 - Communication cable having at least one insulated conductor: A communication cable including a cable jacket having a jacket end and a shielding layer having an electrically conductive exterior surface. The exterior surface extends along a length of the communication cable and interfaces with the cable jacket. The exterior surface has an exposed section that extends beyond the jacket... Agent: Tyco Electronics Corporation
20140060929 - Surface mount connector for electrically isolating two insulated conductors: A surface mount connector includes a pair of electrical contacts spaced from each other a predetermined distance. Each contact includes a substantially flat base portion having upper and lower surfaces, the lower surface being suitable for soldering to a pad or land on a printed circuit board (PCB). Each contact... Agent: Zierick Manufacturing Corporation
20140060883 - Horizontal cabling system for in-building applications: An adhesive-backed duct has a main body having a conduit portion with a cavity formed longitudinally therethrough and a flange portion having an adhesive backing layer to mount the duct to a mounting surface. A septum is disposed within the cavity portion and defines at least two bore potions.... Agent:
20140060884 - Subsea cables: Herein described is a cable from transmitting electricity, which is particularly useful for subsea applications. A method of manufacturing the cable and a method of transmitting electricity with the cable is also described.... Agent:
20140060885 - Cable structures and systems and methods for making the same: Cable structures can be formed for cables and other components that include non-cable components such as jacks and headphones. The cable structure includes an inner wrap that is formed from a metallic doped fabric that can be spiral wound around a conductive bundle such that it essentially completely encapsulates the... Agent: Apple Inc.
20140060886 - Spacer for use in a flat cable: This is directed to a cable for use with an electronic device. The cable can be substantially flat, such that all of the conductive wires of the cable are substantially in the same plane. A spacer can be placed between the wires to ensure that wires conducting signals remain a... Agent: Apple Inc.
20140060887 - Transparent electric conductor: i
20140060888 - Paneling apparatus for a ceiling or a wall of a room: A paneling apparatus for a ceiling or a wall of a room is provided, which may include: two electrically conductive conduction layers, arranged to overlap. First layers between which at least one insulation layer, which electrically insulates the conduction layers from one another, is arranged with, at least one contact-making... Agent: Osram Gmbh
20140060889 - Removable protective terminal shield: A removable protective terminal shield is a snap-off or breakaway cap that is molded into the plastic enclosure of a lighting control device that covers the neutral wire input hole and, if desired, the head of the terminal screw used to tighten the terminal to the wire after it is... Agent:
20140060890 - Modular insulator for busbar support and method of assembling: A modular insulator for an electrical conductor is provided. The modular insulator includes a first end member configured to couple to a support rail of an electrical power distribution system and a second end member configured to couple to the support rail. The modular insulator further includes at least one... Agent:
20140060891 - Standoff device and method of installation of harness: A device connects a wire harness to a structure. A fixation portion of the device is secured to the structure. A spacing portion is connected to the fixation portion and to a connector portion. A retaining clip on the connector portion deforms when a wire harness connector component moves axially... Agent: Bombardier Inc.
20140060892 - Printed circuit board: A printed circuit board is designed to meet the following requirements. A front-back copper foil residual rate difference a−b falls within a range of −10% to 10%, where the insulative board is divided into a plurality of divisions, in which front and back surface copper foil residual rates of each... Agent: Yazaki Corporation
20140060893 - Printed circuit board and method for manufacturing the same: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top... Agent: Lg Innotek Co., Ltd.
20140060897 - Chip resistor with outrigger heat sink: A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on... Agent: Smiths Interconnect Microwave Components, Inc.
20140060894 - Clip assembly and heat dissipation device incorporating the same: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes two wire clips and two fasteners engaging with the wire clips, respectively. The wire clip includes two opposite engaging arms, and an engaging section interconnecting the two engaging arms.... Agent: Champ Tech Optical (foshan) Corporation
20140060895 - Clip assembly and heat dissipation device incorporating the same: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes a wire clip and two fasteners engaging with the wire clip. The wire clip includes a main body and two engaging arms extending outwardly from two ends of the... Agent: Champ Tech Optical (foshan) Corporation
20140060896 - Printed circuit board: Disclosed herein is a printed circuit board, including: an insulating layer; a circuit layer formed on one surface of the insulating layer; and a via electrode penetrating through the insulating layer and being connected with the circuit layer, wherein the circuit layer is formed in a structure where different kinds... Agent: Samsung Electro-mechanics Co., Ltd.
20140060900 - Anchor group for monolayers of organic compounds on metal and component produced therewith by means of organic electronics: An anchor group anchors organic dielectric compounds used in the production of organically based capacitors. The capacitors referred to are those that can be produced in a parallel process on a prepeg or other common printed circuit board substrate without additional metallisation on copper. The pre-fabricated capacitor layer can then... Agent: Siemens Aktiengesellschaft
20140060899 - Prepreg, copper clad laminate, and printed circuit board: Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of... Agent: Samsung Electro-mechanics Co., Ltd.
20140060898 - Thermally-conductive particles in printed wiring boards: A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or... Agent: Lockheed Martin Corporation
20140060903 - Conductive ink composition, formation of conductive circuit, and conductive circuit: A conductive circuit is formed by printing a conductive ink composition to form a pattern and heat curing the pattern, the ink composition comprising an addition type silicone rubber precursor, a curing catalyst, conductive particles having a density of up to 2.75 g/cm3, and a thixotropic agent, typically carbon black... Agent: Shin-etsu Chemical Co., Ltd.
20140060906 - Light emitting system: A light emitting system is provided. An exemplary embodiment of a light emitting system comprising at least a light emitting module comprises a substrate, and light emitting rows supported by the substrate, wherein each light emitting row has unpackaged light emitting chips, surrounded by a reflective structure, and a transparent... Agent: Hong-yuan Technology Co., Ltd.
20140060907 - Mitigation and elimination of tin whiskers: A method includes providing an electronic assembly, where the electronic assembly has at least one electrical connection that includes at least a surface that is substantially pure tin metal and the pure tin metal has tin whiskers formed thereon and the pure tin metal has a thickness. The method includes... Agent: International Business Machines Corporation
20140060902 - Printed circuit baord and method for manufacturing same: A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a... Agent: Zhen Ding Technology Co., Ltd.
20140060908 - Printed circuit board and the method for manufacturing the same: A printed circuit board includes a first insulating layer, a second insulating layer on the first insulating layer, and at least one via formed through the first and second insulating layers in a layered structure. The via includes a first via layer formed through the first insulating layer, a second... Agent: Lg Innotek Co., Ltd.
20140060904 - Printed wiring board and method for manufacturing printed wiring board: A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and the conductive pattern and having an opening portion exposing a portion of the conductive pattern and a portion of the interlayer insulation... Agent: Ibiden Co., Ltd.
20140060905 - Printed wiring board and method for manufacturing printed wiring board: A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and conductive pattern and having opening exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the... Agent: Ibiden Co., Ltd.
20140060901 - Touch panel: Disclosed herein is a touch panel including: an electrode pattern configured of a combination of rectangular patterns of which first and second internal angles facing each other are the same as each other and remaining third and fourth internal angles facing each other except for the first and second internal... Agent: Samsung Electro-mechanics Co., Ltd.
20140060909 - Layered body, production method and use thereof: The invention relates to a layered body, in particular one with two sheets of electric functional layers, as well as a use of this layered body for example in a touch screen with improved resolution. By changing the grid structure at the intersection areas a moiré effect can be avoided... Agent: Polylc/gmbh & Co. Kg
20140060910 - Connecting apparatus and printed circuit board thereof: A connecting apparatus for connecting a first electronic device and a second electronic device together comprises a first port, a second port electronically connected to the first port, and a printed circuit board (PCB). The PCB comprises a first grounded region, a second grounded region, and a first electronic element.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd .
20140060911 - Method and system for reducing audible and/or electrical noise from electrically or mechanically excited capacitors: Devices and methods are disclosed for reducing vibration and noise from capacitor devices. The device includes a circuit board, and first and second capacitor structures. The second capacitor structure has substantially the same properties as the first and is coupled to the opposite face of a supporting structure substantially opposite... Agent:
20140060912 - Package substrate and electronic device: In a package substrate, adjacent bumps in a first array of bumps being an outermost array arranged along a first side of the package substrate are arranged being shifted in a first axial direction that is a normal direction of the first side and in a second axial direction that... Agent:
20140060913 - S-shield twisted pair cable design for multi-ghz performance: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. An S-shaped separator separates two of the twisted pairs from the other two twisted pairs. The S-Shaped separator may be formed with two layers or three layers, wherein at least one layer is conductive.... Agent:
20140060914 - Enclosure with shield apparatus: An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield... Agent: Hon Hai Precision Industry Co., Ltd.
20140060919 - Attachment structure of electrical equipment accommodation box: There is provided an attachment structure of an electrical equipment accommodation box in which an electrical equipment accommodation box accommodating therein an electrical component is attached to a wall surface of a vehicle body-side by a bracket. The bracket has a receptacle shape in which a bottom part is formed... Agent: Suzuki Motor Corporation
20140060917 - Combined audio jack and mobile electronic device enclosure: Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection... Agent: Apple Inc.
20140060916 - Electronic apparatus and electronic component housing case: A slit opening 8 is formed on a lower principal surface 6a of a hard disk case 6, in the vicinity of the inner side of an angle part formed by a lower left lateral wall 6e and an opposing lower lateral wall 6c. A hard disk drive 7 is... Agent: Panasonic Corporation
20140060918 - Housing of electronic device: There is provided an electrical device's casing capable of reducing vibration generated by the electrical device while the device is operating. A converter case (10) encasing a reactor which generates vibration while operating includes: a plate-shaped base (12) having a front surface and a rear surface, the reactor being to... Agent: Toyota Jidosha Kabushiki Kaisha
20140060915 - Server cabinet: A server cabinet includes a rack and a power distribution unit (PDU). The rack includes a top plate, a bottom plate, and a side plate connected between sides of the top plate and the bottom plate. A through hole is defined in the top plate, near a front end of... Agent:
20140060920 - Inlet box mounting structure of car: A mounting structure of an inlet box (20) of a car which includes an outer panel (2) of the car having a hole (2j), an inlet box inserted in the hole (2j), a flange (21f) provided around the opening (22) of the inlet box (20) and an engaging claw (220)... Agent: Toyota Shatai Kabushiki Kaisha02/27/2014 > 28 patent applications in 22 patent subcategories.
20140054058 - Handheld device enclosure: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front... Agent: Apple Inc.
20140054059 - Active cover plates: In one example, an active cover plate includes a faceplate, a load and a spring clip adjustable in at least one of a horizontal direction and a vertical direction with respect to the faceplate to electrically interface with a receptacle body and extract electrical power from the receptacle body to... Agent: Snaprays LLC
20140054060 - Modified electrical devices: In one example, a modified electrical device includes a body and at least one connector on the body to make power and control connections with an active cover plate. A system includes an active cover plate comprising low voltage circuitry and a first interface and a modified electrical device. The... Agent: Snaprays LLC
20140054061 - Multi-drive common control bus connector system: An electrical bus assembly includes a frame and a plurality of bus bar carriers connected to the frame. The bus bars are supported by the bus bar carriers in parallel spaced-apart relation. A first retainer cap is secured to a first one of the plurality of bus bar carriers located... Agent: Rockwell Automation Technologies, Inc.
20140054085 - Cable assembly comprising a flexible support made from a textile material: A cable assembly is provided that includes a plurality of conductor strands and a flexible support having a textile material into which the plurality of conductor strands are integrated and secured.... Agent: Tyco Electronics Nederland Bv
20140054062 - Insulating varnish and insulated electrical wire using same: An insulating varnish forms an insulating coating film having a shape that corresponds to the shape of an opening of a die, having a uniform thickness. The insulating varnish is applied onto a surface of a conductor, subsequently passes through a die to remove the excess applied insulating varnish, and... Agent: Sumitomo Electric Industries, Ltd.
20140054063 - Method of manufacturing a composite insulator using a resin with high thermal performance: The method of fabricating a very high, high, or medium voltage composite insulator (1) comprises an insulating core (2) made of glass fiber reinforced synthetic material based on a mixture of a resin having epoxy groups, and a covering (3) made of an elastomer material surrounding said core (2), said... Agent: Sediver Societe Europeenne D'isolateurs En Verre Et Composite
20140054064 - Grommet assembly: A grommet assembly that has a retainer and a grommet that is coupled to the retainer. The retainer includes first and second body portions that are connected via a hinge that permits the first and second body portions to be spread apart into an open condition to receive a wire... Agent:
20140054066 - Circuit layout method and associated printed circuit board: A circuit layout method for a printed circuit board (PCB) is provided. The method includes forming a pair of signal traces on the PCB, and disposing a ground trace between the pair of signal traces. The pair of signal traces and the ground trace are located at a same layer... Agent: Mstar Semiconductor, Inc.
20140054065 - Electrical circuit trace manufacturing for electro-chemical sensors: A method for manufacturing electrical circuit traces for use in electro-chemical sensors is disclosed, as well as electro-chemical sensors made from that method. The method includes providing a web, with a substrate and a thin, electrically conductive portion on the substrate. The web is positioned with a mask between it... Agent:
20140054067 - Pressure reconfigured electromagnetic devices: A reconfigurable electromagnetic device includes a first and second planar layer having facing surfaces. One of the surfaces includes one or more micro-trenches. The area between the two surfaces is filled with an electro-fluid, such as a liquid metal and a second immiscible fluid, such as an inert gas. When... Agent:
20140054069 - Printed circuit board and method for manufacturing the same: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top... Agent: Lg Innotek Co., Ltd.
20140054068 - Printed wiring board and method for manufacturing the same: A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite... Agent: Ibiden Co., Ltd.
20140054070 - Electroconductive sheet and touch panel: An electroconductive sheet and a touch panel, wherein the electroconductive sheet has a first electroconductive section and a second electroconductive section; the first electroconductive section has a plurality of first electroconductive patterns arrayed in one direction and to which a plurality of first electrodes, respectively, are connected; the second electroconductive... Agent: Fujifilm Corporation
20140054071 - Flexible printed circuit board and touch panel having the same: Disclosed herein are a flexible printed circuit board and a touch panel having the same. The touch panel includes a transparent substrate, a first electrode, a first wiring that is connected to the first electrode, a second electrode, a second wiring that is connected to the second electrode, and a... Agent: Samsung Electro-mechanics Co., Ltd.
20140054072 - Printed circuit board and method for manufacturing the same: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate; an Insulating layer formed on one surface or both surfaces of the base substrate; an electrode layer formed on a top surface of the insulating layer; and an... Agent: Samsung Electro-mechanics Co., Ltd.
20140054073 - Method for forming solder resist and substrate for package: The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and... Agent: Samsung Electro-mechannics Co., Ltd
20140054076 - Conductive component and preparation method thereof: A conductive component is disclosed in the present invention, which includes an insulating layer and a metal mesh arranged on the insulating layer, the metal mesh defines a plurality of voids arranged in array, the aperture ratio K of the voids of the metal mesh and the optical transmittance T1... Agent: Shenzhen O-film Tech Co., Ltd.
20140054075 - Printed circuit baord and method for manufacturing same: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed... Agent: Zhen Ding Technology Co., Ltd.
20140054074 - Printed circuit board and method for manufacturing same: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first... Agent: Fukui Precision Component (shenzhen) Co., Ltd.
20140054077 - Electrical component resin, semiconductor device, and substrate: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect... Agent: Panasonic Corporation
20140054078 - Lead frame base plate for light emitting device and manufacturing method of light emitting device using the same: Disclosed is a lead frame base plate for a light emitting device, the base plate including: one or more lead frame areas respectively including a plurality of lead frames repeated in a first direction, the lead frame areas being arranged in parallel to be spaced apart from each other in... Agent: Wooree E&l Co., Ltd.
20140054079 - Multilayer flexible printed circuit board and method for manufacturing same: A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second... Agent: Fukui Precision Component (shenzhen) Co., Ltd.
20140054080 - Wiring board and manufacturing method of wiring board: There is provided a wiring board including a stiffener bonded to a circuit board, and a laminate formed by laminating a plurality of insulating layers and a plurality of wiring layers on a face of the stiffener opposite to a face bonded to the circuit board. On both faces of... Agent: Sony Corporation
20140054081 - Novel flexible printed circuit integrated with conductive layer: A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film on the electromagnetic-shielding conductive film (A); and (C) a wiring-pattern-equipped film on the insulator film (B), the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.... Agent: Kaneka Corporation
20140054082 - Implementing press-lock emc gasket with absorber: A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th... Agent: International Business Machines Corporation
20140054083 - Weatherproof corner box: An electrical box may include a housing body, enclosing a cavity, which includes an access opening extending across a first plane of the housing body, and which includes a plurality of mounting outlets configured to enable electrical devices to be mounted to the housing body to face a plurality of... Agent: Thomas & Betts International, Inc.
20140054084 - Case for housing and protecting an electronic device: A case for housing and protecting an electronic device against moisture damage and contaminants is disclosed. The case comprises a first member having a first plainer section and a first perimetric wall formed thereon, and a second member having a second planer section and a second perimetric wall formed thereon.... Agent:02/20/2014 > 29 patent applications in 23 patent subcategories.
20140048302 - Differential signal transmission cable and multi-core cable: A differential signal transmission cable includes a pair of center conductors for transmitting a differential signal, an insulator covering peripheries of the center conductors, a shield tape longitudinally wrapped around the insulator, an insulating tape including an adhesive surface and spirally wrapped around the shield tape while the adhesive surface... Agent: Hitachi Cable, Ltd.
20140048303 - Magnetic wall cover system: A magnetic wall cover system that includes an inner cover made at least partially of a ferrous material. The inner cover has an outer alignment surface. The magnetic wall cover system also has an outer cover that has an inner alignment surface. The outer cover is adapted to be removably... Agent: Belwith Products, LLC
20140048329 - External part mounted electric wire, wiring harness including the same external part mounted electric wire, and method for fabricating the same wiring harness: An external part mounted electric wire 1 includes an external part 3 which is mounted on an electric wire 2 so as to be brought into engagement with a hole in a panel on which a wiring harness 25 is laid. The external part 3 is made of a resin... Agent:
20140048330 - Highly integrated data bus automatic fire extinguishing system: A wiring harness for a fire extinguishing system including a connector that has a pair of power leads and a pair of command leads. At least one zone identification element is in communication with the connector and is configured to provide a zone location assignment to the connector.... Agent: Hamilton Sundstrand Corporation
20140048304 - Leaky coaxial cable: A leaky coaxial cable includes an inner conductor member extending in axis direction, to propagate signal; an insulator member covering the inner conductor member; a first outer conductor member having conductor wires on circumference surface of the insulator member with shielding density so as to leak a part of the... Agent: Fujikura Ltd.
20140048305 - Switching arrangement: An interconnection for connecting a switched mode inverter to a load, the interconnection comprising: a plurality of insulated conductors (311-313, 321-323); sleeving means (351) sleeving the insulated conductors together; and at least one lossy toroidal inductor core (352) concentric with and partially surrounding the sleeving means to hold the plurality... Agent: E2v Technologies (uk) Limited
20140048306 - Apparatus for patterning ribbon, string tabbing method and solar cell module using the same: An apparatus for patterning a ribbon includes a holding device, a heating device, and an embossing device. The holding device is utilized for positioning the ribbon on a surface of a solar cell. The first solder layer contacts the solar cell. The heating device is utilized for melting the ribbon... Agent: Au Optronics Corporation
20140048307 - Cable-termination device: A cable-termination device has a housing and an introduction opening for a cable, in order to terminate the cable end such that it is safe from contact. The housing includes a termination cap and a screw-connection unit interacting therewith. The introduction opening is provided in the screw-connection unit in a... Agent: Phoenix Contact Gmbh & Co. Kg
20140048308 - Cable-support arrangement: Cable-support arrangement with cable-supporting units 3, 5 which can be arranged above one another. The cable-supporting units can be aligned to different rotation positions with reference to axis A. The cable-support arrangement 1, comprises at least one cable-supporting unit consisting of a base part 3B, 5B and at least one... Agent:
20140048309 - Three-dimensionally shaped electrically insulating product and electrically insulating sheet material: The present invention aims to provide a three-dimensionally shaped electrically insulating product having excellent formability in the process of three-dimensional formation and electrical insulation properties that are suppressed from deteriorating. Provided is a three-dimensionally shaped electrically insulating product formed by subjecting a sheet material having electrical insulation properties at least... Agent: Nitto Denko Corporation
20140048310 - Printed circuit solder connections: Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder... Agent: Apple Inc.
20140048312 - Signal line and circuit substrate: A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the... Agent: Murata Manufacturing Co., Ltd.
20140048311 - Wired circuit board: A wired circuit board includes a first insulating layer, a conductive pattern formed on its surface at one side in a thickness direction, and a second insulating layer formed on the surface of the first insulating layer at the one side in the thickness direction so as to cover the... Agent:
20140048313 - Thermally enhanced wiring board with thermal pad and electrical post: A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are... Agent: Bridge Semiconductor Corporation
20140048314 - Flexible printed circuit integrated with reinforcing plate: A stiffener-integrated flexible printed circuit board includes: (A) a stiffener; (B) a thermosetting adhesive on the stiffener (A); (C) an insulator film on the thermosetting adhesive (B); and (D) a wiring-pattern-equipped film on the insulator film (C), the insulator film (C) containing at least (a) a binder polymer and (b)... Agent: Kaneka Corporation
20140048316 - Epoxy resin compound and radiant heat circuit board using the same: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the... Agent: Lg Innotek Co., Ltd.
20140048317 - Meltable paint films and fabrics and methods of manufacturing thereof: A fabric which is formed of fibers joined together by at least one of knitting, weaving and felting techniques, which is characterized by having a first non-adhesive solid state and a second adhesive solid state, which occurs subsequent to having passed through an adhesive non-solid state.... Agent: White Innovation Ltd.
20140048315 - Touch panel: Disclosed herein is a touch panel including: a transparent substrate; conductive patterns formed on the transparent substrate such that wavy lines thereof are spaced apart from each other and arranged in parallel with each other, each of the wavy lines having a sine wave form where first peaks and second... Agent: Samsung Electro-mechanics Co., Ltd.
20140048318 - Composition, anti-oxide film including the same, electronic component including the anti-oxide film, and methods for forming the anti-oxide film and electronic component: Disclosed herein is a composition, including a fluorine-based polymer or a perfluoropolyether (PFPE) derivative and a PFPE-miscible polymer, an anti-oxide film and electronic component including the same, and methods of forming an anti-oxide film and an electronic component. Use of the composition may achieve formation of an anti-oxide film through... Agent: Samsung Electronics Co., Ltd.
20140048319 - Wiring board with hybrid core and dual build-up circuitries: A wiring board with built-in metal slugs includes a dielectric hybrid core and build-up circuitries. The metal slugs extend into apertures of a stiffener of the hybrid core and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slugs and the stiffener and provides signal routing.... Agent: Bridge Semiconductor Corporation
20140048320 - Printed circuit board and method for manufacturing the same: Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed between a circuit pattern and an insulating layer above a substrate, the AP film containing any one of a first polymer,... Agent: Samsung Electro-mechanics Co., Ltd.
20140048322 - Electronic apparatus and insulation structure thereof: An electronic apparatus and an insulation structure thereof are provided. The electronic apparatus comprises a circuit board, an insulation structure and a transformer. The circuit board has a top surface, a bottom surface and an opening extending across the top surface and the bottom surface. The insulation structure has a... Agent: Power Mate Technology Co., Ltd.
20140048321 - Substrate with built-in electronic component: Provided is a substrate with a built-in electronic component that can minimize an occurrence of a deformation such as warping or distortion of the substrate with a built-in electronic component, which is caused by a difference in rigidity between a region of low rigidity and a region of high rigidity... Agent: Taiyo Yuden Co., Ltd.
20140048323 - Wiring board: A wiring board including an insulating board formed such that an inner insulating layer is laminated under a front insulating layer, a pair of semiconductor element connection pads for a signal, formed on the front insulating layer, and a pair of strip-shaped wiring conductors formed on the inner insulating layer,... Agent: Kyocera Slc Technologies Corporation
20140048325 - Contact surface arranged on a carrier for connecting to a counter contact surface arranged on a further carrier, and device comprising a contact surface and a counter contact surface connected thereto: A contact area is provided on a carrier for connection to a mating contact area on a further carrier using an adhesive containing conductive particles. The contact area includes at least one recess forming a drain channel for the adhesive, extending from one edge of the contact area to an... Agent: Continential Automotive Gmbh
20140048324 - Hybrid wiring board with built-in stopper, interposer and build-up circuitry: A hybrid wiring board includes an interposer, a stopper, a stiffener and a build-up circuitry. The stopper is laterally aligned with and laterally extends beyond peripheral edges of the interposer in lateral directions. The interposer extends into an aperture of the stiffener and is electrically connected to the build-up circuitry.... Agent:
20140048326 - Multi-cavity wiring board for semiconductor assembly with internal electromagnetic shielding: A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The... Agent: Bridge Semiconductor Corporation
20140048327 - Detachable junction box base: A detachable solar junction box base is disclosed, having a junction box, whose left and right sides being respectively installed with a pivotal connection button, and the bottom side thereof being installed with at least an elastic snap tab, two elastic clip tabs, a first connection port and a second... Agent: T-conn Precision Corporation
20140048328 - Waveguide tube and method of use thereof: A waveguide tube includes a penetration tube and a shielding pipe. The penetration tube extends from an anechoic chamber. The shielding pipe is connected to a distal end of the penetration tube. The penetration tube and the shielding pipe are made of metal and metallic powders are poured into the... Agent:02/13/2014 > 50 patent applications in 33 patent subcategories.
20140041890 - Rf coaxial transmission line for a wellbore including dual-wall outer conductor and related methods: A radio frequency (RF) coaxial transmission line to be positioned within a wellbore in a subterranean formation may include a series of coaxial sections coupled together in end-to-end relation. Each coaxial section may include an inner conductor, a dual-wall outer conductor surrounding the inner conductor, and a dielectric therebetween. Each... Agent: Harris Corporation
20140041925 - Surface modified overhead conductor: The present invention relates to a surface modified overhead conductor with a coating that allows the conductor to operate at lower temperatures. The coating is an inorganic, non-white coating having durable heat and wet aging characteristics. The coating preferably contains a heat radiating agent with desirable properties, and an appropriate... Agent: General Cabletechnologies Corporation
20140041926 - Transmission line autotensioner: Various systems and methods are provided for autotensioning conductors of transmission lines. In one embodiment, among others, an autotensioner system includes tensioning assemblies coupled between a structure and corresponding conductors and a tension controller that controls a tensioning assembly to adjust a tension of the corresponding conductor to within a... Agent: Southern Company Services, Inc.
20140041891 - Electric box for vehicle: Disclosed herein is an electric box for a vehicle including a box body and a cover wherein the box includes a storage space and cover is coupled to the box body to seal the storage space. The box body further includes a wire insertion passageway through which the wire is... Agent: Hyundai Motor Company
20140041892 - Electrical appliance housing: An electrical appliance housing including a hard plastic housing body defining a switch-actuating aperture. The aperture is sealed with a soft plastic membrane. An actuating button is fastened to a hard plastic base that is bonded to the membrane.... Agent: Braun Gmbh
20140041893 - Hybrid thermoplastic gels and their methods of making: Methods, compositions, apparatuses, and systems are provided for a hybrid thermoplastic gel or sealant. The methods comprise providing (a) a base polymer having at least one functional group capable of crosslinking, (b) a functionalized extender, and (c) heat, and reacting the base polymer and functionalized extender in the presence of... Agent: Tyco Electronics Corporation
20140041894 - Extension wire socket assembled structure having safety see-saw switch disposed from inside out: The invention relates to an extension wire socket assembled structure, and more particularly to a safety see-saw switch with an embedded electrical connection device for the extension wire socket having safety see-saw switch disposed from inside out. The present invention is a two-in-one molded structure. An end of a positive... Agent:
20140041933 - Electrical connectivity within architectural glazing frame systems: A system for providing an electrical interface across a sealed boundary may include a frame in sealed engagement with at least a portion of a substrate. The substrate may be in communication with an electrochromic device. The system may further include first and second conduits. The first conduit may be... Agent: Sage Electrochromics, Inc.
20140041934 - Low leakage electrical joints and wire harnesses, and method of making the same: Low leakage electrical joints and wire harnesses for simplifying the electrical infrastructure associated with solar energy utilities are disclosed. The low leakage electrical joints include fused wires that have been sealed, encased and configured to plug into other joints to form wire harnesses. The wire harnesses are particularly well suited... Agent:
20140041935 - Low leakage electrical joints and wire harnesses, and method of making the same: Low leakage electrical joints and wire harnesses for simplifying the electrical infrastructure associated with solar energy utilities are disclosed. The low leakage electrical joints include fused wires that have been sealed, encased and configured to plug into other joints to form wire harnesses. The wire harnesses are particularly well suited... Agent:
20140041936 - Hand grip connector for cable protectors: A cable protector includes a base member, at least one channel, and at least one connector. The at least one channel extend between opposing first and second ends of the base member and is structured to house at least one cable. The at least one connector extends from a first... Agent: Checkers Industrial Products, LLC
20140041937 - High speed bypass cable assembly: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted... Agent:
20140041938 - Universal ground adapter for marine cables: An adapter is provided for electrically connecting an interior surface of a conduit and an external surface of a cable. The adapter includes a flat strip extending longitudinally from first to second ends with first and second transverse edges and composed of an electrically conductive and mechanically flexible material. The... Agent: United States Government, As Represented By The Secretary Of The Navy
20140041939 - Connector apparatus with shielding contact: A connector apparatus having a PG screw thread in a first end section and a first traversing bore, in which a first axial clamping surface is embodied. A grounding assembly has an electrically conducting, iris spring, is arranged in the first traversing bore and lies against the first axial clamping... Agent: Endress + Hauser Gmbh + Co.kg
20140041895 - Finger friendly twist-on wire connector: A finger friendly twist-on wire connector having a spiral coil and an open end rigid shell secured to the spiral coil with the rigid shell having an outer surface with a circumferential band and a closed end supporting a finger cushion material integral to at least a portion of the... Agent:
20140041896 - Medium processing device and flexible cable: A medium processing device may include a head which reads or writes data to a recording medium; and a flexible cable which is connected with head. The flexible cable may be formed in a multilayer structure including a data signal layer formed with a data signal pattern and disconnection detecting... Agent: Nidec Sankyo Corporation
20140041897 - Cable having reduced tangle ability: Provided is a cable having reduced tangle ability. The cable includes a metal core for transmitting an electrical signal, an insulating coating surrounding the metal core, the insulating coating having flexibility, and a coating layer adhering cured to surround the insulating coating, the coating layer having flexibility and elasticity. The... Agent: Joinset Co., Ltd.
20140041898 - Article for securing and ordering cables leading away from a key switch: An article for securing and ordering cables leading away from a key switch comprises an annular fastening section with an opening, wherein a lock cylinder of the key switch extends through the opening. The article further comprises a plastically deformable cable receiving section which is connected with the fastening section... Agent:
20140041899 - Harness covers for vehicle doors: A harness cover covering a wiring harness between a vehicle body and a door and having a cylindrical shape that is configured to accommodate the wiring harness on an inner circumferential side thereof may include a door-side grommet attached to one end thereof and capable of being connected to a... Agent: Furukawa Electric Co., Ltd.
20140041900 - Circuit pattern with high aspect ratio and method of manufacturing the same: A method of manufacturing a circuit pattern with high aspect ratio is disclosed. A plurality of parallel lines and supporting lines intersecting the parallel lines are formed. Supporting isolation structures are then formed in the space between the parallel lines and the supporting line for supporting the parallel lines in... Agent:
20140041901 - Partition board, and method of restraining electrical storage elements: A partition board that is arranged between two electrical storage elements that are arranged adjacent to each other in a predetermined direction (X direction) includes a guide portion, a first pin and a second pin. The guide portion is used to cause the partition board to move in the predetermined... Agent: Toyota Jidosha Kabushiki Kaisha
20140041904 - Method for making a two-layer capacitive touch sensor panel: A method of fabricating a two-layer capacitive touch sensor panel comprising the following steps: a) depositing a first transparent electrically conductive layer on a transparent cover sheet; b) forming a pattern in the transparent electrically conductive layer to create a first set of discrete electrode structures; c) depositing a transparent... Agent: M-solv Limited
20140041902 - Printed circuit board and method of manufacturing the same: Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein... Agent: Samsung Electro-mechanics Co., Ltd.
20140041903 - Printed circuit board structure: A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit... Agent: Quanta Computer Inc.
20140041905 - Surfaces having particles and related methods: Provided are surfaces comprising particles, which particles may possess, for example, antimicrobial or biosensing properties. Also provided are related methods for fabrication of the inventive articles. Also provided are systems and methods for treating fluids, objects, and targets with the inventive surfaces.... Agent: Innova Dynamics, Inc.
20140041907 - Core substrate and printed circuit board using the same: Disclosed herein is a core substrate including at least one connection member formed therein; heat radiation members positioned to be adjacent to the connection member and divided in plural; and insulation members formed between the heat radiation members divided in plural and between the connection member and the heat radiation... Agent: Samsung Electro-mechanics Co., Ltd.
20140041906 - Metal heat radiation substrate and manufacturing method thereof: Disclosed herein are a metal heat radiation substrate and a manufacturing method thereof. The metal heat radiation substrate includes: a metal substrate having a through-hole formed therein; a heat resistant insulating material filled in the through-hole and having a via hole formed at a filled portion; a metal oxide film... Agent: Samsung Electro-mechanics Co., Ltd.
20140041908 - Flame retardant fillers prepared from bridged polysilsesquioxanes: A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having... Agent: International Business Machines Corporation
20140041909 - Ceramic substrate and method for reducing surface roughness of metal filled via holes thereon: A method for reducing roughens of the metals on a ceramic substrate having metal filled via holes, comprising forming via holes, a seed layer, and through film coating, exposure and development process followed by multiple steps of DC electroplating to achieve copper circuit with desired surface roughness.... Agent:
20140041910 - Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil: Metal foil provided with an electrically resistive layer, characterized in that an alloy (in particular, a NiCrAlSi alloy) resistive layer containing 1 to 6 mass % of Si is formed on the metal foil controlled to have a ten-point average roughness Rz, which was measured by an optical method, of... Agent: Jx Nippon Mining & Metals Corporation
20140041911 - Flat dam and method for manufacturing chip package using the same: Disclosed herein is a flat dam formed in a package region of an insulation layer provided on a board to limit movement of an underfill and made of the hydrophobic material including any one of or at least two of perfluorooctyl acrylate (PFAC), polypropylene, polytetrafluoroethylene (PTFE), and fluorine compound.... Agent: Samsung Electro-mechanics Co., Ltd.
20140041912 - Method for manufacturing multilayer ceramic substrate and composite sheet: A high-quality resistor pattern and conductor pattern is formed on an external surface of a multilayer ceramic substrate by an ink jet method. A composite sheet including a first ceramic green layer and a shrinkage-retardant layer is formed, and a resistor pattern and a conductor pattern are formed on the... Agent: Murata Manufacturing Co., Ltd.
20140041917 - Display panel: The embodiments of the present invention relate to a display panel comprising an array substrate, wherein the array substrate comprises: gate lines connected to a gate driving module and data lines connected to a data driving module; gate line redundancy lines, corresponding to the gate lines one by one and... Agent:
20140041913 - Electronic circuit module component: One aspect of an electronic circuit module component is an electronic circuit module component formed by joining a board and an electronic component comprising an element body having a mounting surface and a plurality of side faces to each other with solder; the electronic component comprising a first terminal electrode... Agent:
20140041916 - Methods of making packages using thin cu foil supported by carrier cu foil: In an embodiment, there is provided a method of creating a package, the method comprising: providing an initial substrate, wherein the initial substrate comprises a carrier foil, a functional copper foil, and an interface release layer between the carrier foil and the functional copper foil; building up copper portions on... Agent: Marvell World Trade Ltd.
20140041915 - Monolithic capacitor mounting structure and monolithic capacitor: In a monolithic capacitor mounting structure, assuming that a portion of a first outer electrode joined with a first bonding material is a first bonding portion and a portion of a second outer electrode joined with a second bonding material is a second bonding portion, a length of each of... Agent: Murata Manufacturing Co., Ltd.
20140041914 - Mounting land structure and mounting structure for laminated capacitor: A mounting land structure and a mounting structure include land patterns to be bonded to outer electrodes of a laminated ceramic capacitor. Each of the land patterns includes a first conductor pattern and a second conductor pattern separated from each other in a width direction and a third conductor pattern... Agent: Murata Manufacturing Co., Ltd.
20140041919 - Circuit structure and manufacturing method thereof: A circuit structure includes an inner circuit layer, a first and a second dielectric layers, a first and a second conductive material layers, and a second and a third conductive layers. The first dielectric layer covers a first conductive layer of the inner circuit layer and has a first surface... Agent: Unimicron Technology Corp.
20140041918 - Looped interconnect structure: Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140041920 - Printed circuit board: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side... Agent: Canon Kabushiki Kaisha
20140041921 - Conformal 3d non-planar multi-layer circuitry: A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The... Agent: Lockheed Martin Corporation
20140041922 - Package carrier and manufacturing method thereof: A manufacturing method of a package carrier is provided. An insulation substrate having an upper surface, a lower surface, plural cavities located at the lower surface and plural through holes passing through the insulation substrate and respectively communicating with the cavities is provided. Plural vias is defined by the cavities... Agent: Subtron Technology Co., Ltd.
20140041923 - Wiring board and method for manufacturing the same: A wiring board includes a board including a core, a conductive layer on the core, and a laminated structure over the core and conductive layer, and a stacked structure formed in the board and including a through-hole conductor through the core and a via conductor in the laminated structure. The... Agent: Ibiden Co., Ltd.
20140041924 - Micro-wire electrode pattern: A micro-wire electrode includes a substrate and an anisotropically conductive electrode extending in a length direction formed over the substrate. The electrode includes a plurality of electrically connected micro-wires formed in a micro-pattern over the substrate. The micro-pattern includes a plurality of substantially parallel and straight micro-wires extending substantially in... Agent:
20140041927 - Electrical outlet box acoustic seal: An electrical outlet box acoustic seal includes a seal body formed from a flexible sound suppressing material. The seal body has a front side, a rear side, and a peripheral edge. A seal rear projection extends from the seal rear side. The seal rear projection is configured to wrap around... Agent: Stc Architectural Products, LLC
20140041928 - Electrical junction box: An electrical junction box includes: a case main body provided with a wire receiver for receiving an end of an electric wire at a lower surface side; and a lower cover for covering the lower surface. Further, the electric wire is routed in between the lower surface of the case... Agent:
20140041929 - Multi-position input cord assembly for a power distribution unit: Apparatuses and devices are provided that allow for a power input cord to be placed in two or more different orientations relative to a power distribution unit. A power distribution unit may be provided with one or more input cord assemblies that allow an input cord to be swiveled such... Agent: Server Technology, Inc.
20140041931 - Electric ceramic component with electric shielding: The electric ceramic component has a main part (9) made of a dielectric material, an active region (3) being disposed in said main part. At least one outer contact (1, 1′) is arranged on the main part. A feed line region (2, 2′) connects the outer contact to the active... Agent: Epcos Ag
20140041930 - Electronic component: One aspect of an electronic component is an electronic component comprising an element body having a mounting surface and a plurality of side faces, the electronic component further comprising a first terminal electrode formed on the mounting surface and one of the plurality of side faces, a second terminal electrode... Agent:
20140041932 - Cable holder devices, systems, and methods: Devices, systems, and methods for protecting a cable from damage and holding the cable in position with respect to an opening in a machine deck can include a first body portion with a first channel portion configured to receive a cable, a second body portion with a second channel portion... Agent:Previous industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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