|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulatorsBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 05/21/2015 > 51 patent applications in 29 patent subcategories.
20150136470 - Selection method for strong wind region composite insulator based on structure parameters, and composite insulator: A selection method for a strong wind region composite insulator based on structure parameters, and a composite insulator are disclosed. When a selection is made among a plurality of composite insulators according to the selection method, structure parameters of the composite insulators are measured first, and then the selection is... Agent:
20150136435 - Cable for down hole pump: A cable is provided for suspending a down hole pump that has a core with at least one tube for the transport of fluid and at least one conductor covered with an insulation layer made of a high temperature resistant insulating material. The core is covered by a steel tape... Agent:
20150136436 - Securing mechanism and electronic device case comprising the same: A securing mechanism includes a first securing unit fixedly disposed on a first component of an electronic device case, and a second securing unit fixedly disposed on a second component for securing the second component to the first component in a first direction. The first securing unit includes a fixture... Agent: Wistron Corporation
20150136437 - Efficient installation electrical hardware system and method of use: An improved installation system for electrical hardware, such as power outlets, electrical switches, light fittings, ceiling fans and the like, whereby the cutting of their installation access holes in drywall panels is accomplished much faster than prior art methods and with a high degree of accuracy by the use of... Agent:
20150136438 - Electrical device with a busbar assembly having a frame providing access for laser welding: An electrical device having an electrical component, which has an electric terminal, and a busbar assembly having a busbar and a frame. The busbar is formed of a strip of conductive material and has first and second busbar sides that are opposite from one another. The frame has a busbar... Agent:
20150136476 - Electrical device having busbar with flexible weld crimp: An electrical device according to the principles of the present disclosure includes a frame, a conductor having a conductive element and an electrically insulating cover disposed about at least a portion of the conductive element, and a busbar mounted to the frame. The busbar includes a busbar body and a... Agent:
20150136477 - Electrical-wire-protecting member: An electrical wire cover (11) has a corrugated tube fixing portion (29) and engagement projection strips which are integral parts of a cover body (27) which surrounds electrical wires (19) to be cabled, an electrical wire tie (43) which fixes, that is, tightly fastens, a corrugated tube (31), and tying... Agent:
20150136478 - Current return connecting loom and method for mounting on a composite fuselage frame: A connecting loom (30) of this type is suitable for connecting structural metal pieces in an available volume between a protection structure and a transverse frame made of composite carbon material or a cabin lining. In one embodiment, it comprises conductors (51) arranged parallel side by side which form a... Agent: Labinal Power Systems
20150136480 - Protector: Projection strips are formed on the inner surface of a bottom wall between a pair of side walls. Of boundary portions between each projection strip and the two respective side walls, a boundary wall located lower in the vertical direction when a protector is attached to a vehicle is formed... Agent: Yazaki Corporation
20150136484 - Wire harness combination structure: Each of wire harnesses includes a conductive path, an exterior member which covers the conductive path, a base portion which is retrofitted to or integrally formed with the exterior member, and a combination structure portion which is integrally formed with the base portion. The combination structure portion includes a combining... Agent: Yazaki Corporation
20150136481 - Wire harness exterior member and wire harness: An exterior member has a straight tube body to be arranged at a vehicle underfloor portion of a vehicle and at least one rigidity adding portion to add rigidity to the straight tube body.... Agent: Yazaki Corporation
20150136483 - Wire harness exterior member and wire harness: A wire harness exterior member has a plurality of specified sections set along a tubular body longitudinal direction of a body portion, and the body portion has, for each specified section, a resin characterized portion molded using a resin material having characteristics adapted to the corresponding specified section.... Agent: Yazaki Corporation
20150136479 - Wire harness with fixing members: A wire harness wiring structure includes a wire harness and three fixing members. A first fixing member, is provided at the wire harness, and is fixed to a vibration transmitting source. A second fixing member is provided at the wire harness, and is fixed to a vibration non-transmitting object. A... Agent: Yazaki Corporation
20150136482 - Wire-harness packaging member and wire harness: A wire-harness packaging member covering a conductive path includes a setting portion which is provided on an outer surface of the wire-harness packaging member so as to set an attachment position of a post-fitted part attached to the wire-harness packaging member. The wire-harness packaging member is a tube body which... Agent: Yazaki Corporation
20150136485 - Ignition coil assembly with terminals connecting insert: An ignition system comprises an ignition coil assembly (100) that supplies a high voltage electric current to a resistor-type spark plug (20). The ignition coil assembly (100) includes an ignition coil (140), a high voltage coil terminal (120), a terminals connecting insert (30) and an insulator (40). The terminals connecting... Agent:
20150136439 - Sealing cover boot and cover and interconnection junctions protected thereby: A hollow cover boot formed of an elastomeric material includes, in merging succession, a cable collar, a main section, a transition section, and an interconnection section, wherein the main section has a diameter greater than the cable collar and the interconnection section, and the transition section tapers between the main... Agent: Andrew LLC
20150136440 - Cable and method of making the same: A cable that has a cable core with a first armor wire layer and a second armor wire layer. The second armor wire layer is segregated from the first armor wire layer, and an outer jacket is disposed about the second armor wire layer.... Agent:
20150136441 - Communication cable with improved crosstalk attenuation: Methods and apparatus directed towards communication cables and barrier tapes for use in communication cables are disclosed herein. In an embodiment, the present invention employs conductive segments within the communication cables and/or on the barrier tape.... Agent: Panduit Corp.
20150136442 - Booster cable for motor vehicle: A new booster cable for motor vehicle includes a first cable body. The first cable body includes a first insulation and a first conductor located inside the first insulation. A first temperature warning color strip is embedded on the first insulation. The first temperature warning color strip contacts with the... Agent: Shanghai Guangwei Electric & Tools Co., Ltd
20150136443 - Cable with multiple conductors each having a concentric insulation layer: An electrical transmission cable has at least two wires joined in side-by-side relationship by a web. Each wire has a central conductor surrounded by a single layer of insulation that has an outer surface. A majority of the outer surface of the insulation layer is concentric with the conductor. The... Agent: Paige Electric Company, Lp
20150136444 - Corona-free cap assembly: Disclosed is a corona-free cap assembly for achieving uniform electrical stress distribution around an electrical device having a cylindrical end, the corona-free cap assembly comprising: a clamping member configured for clamping on the cylindrical end along circumferential direction of the cylindrical end; and a corona-free cap comprising a grading chamber... Agent:
20150136445 - Non-conductive wire splice connector: A non-conductive wire splice apparatus having a connector configured to be coupled between a first wire and a second wire. The connector having a non-conductor coupled between a first sleeve and a second sleeve. The first sleeve being attachable to the first wire. The second sleeve being attachable to the... Agent:
20150136448 - Flexible printed wiring board and electronic apparatus: According to one embodiment, a flexible printed wiring board includes a first conductor layer formed on the first surface of an insulation base, a second conductor layer formed on the second surface of the insulation base, a first insulation layer covering the first conductor layer, and a second insulation layer... Agent:
20150136447 - Multilayer wiring board: A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground... Agent:
20150136449 - Multilayered wiring substrate: [Means for Solution] A multilayer wiring substrate 10 includes a sheetlike capacitor element 101, a resin filler 92, and via conductors 43 and 47. A sheetlike capacitor element 101 has an element main-surface 102 and an element back-surface 103, is configured such that a dielectric layer 107 is sandwiched directly... Agent:
20150136446 - Printed circuit board: Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board.... Agent: Samsung Electro-mechanics Co., Ltd.
20150136453 - Combined wiring board and method for manufacturing the same: A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate... Agent: Ibiden Co., Ltd.
20150136454 - Combined wiring board and method for manufacturing the same: A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards,... Agent: Ibiden Co., Ltd.
20150136451 - Electronic component module: There is provided an electronic component module including: a substrate on which an electronic component is mounted; at least one insulating member coupled to the substrate and having a surface on which a plating layer is formed; and a molded portion covering the electronic component and the at least one... Agent: Samsung Electro-mechanics Co., Ltd.
20150136452 - High-withstanding-voltage alumina sintered compact and high-withstanding-voltage member: The high-withstanding-voltage member includes an alumina sintered compact containing alumina as a main crystal. Furthermore, the alumina sintered compact exhibits a peak intensity of 5000 or less at a wavelength of about 330 nm when measured by a cathode luminescence method.... Agent:
20150136455 - Shape forming process and application thereof for creating structural elements and designed objects: A tool provided that individually creates three-dimensional structural elements which are sequentially positioned into formation of a shaped object.... Agent:
20150136450 - Touch panel and method of manufacturing the same: There are provided a touch panel and a method of manufacturing the same. The touch panel includes: a substrate; and a plurality of fine conductive lines, each of the fine conductive lines including a first black layer formed to have a predetermined pattern, a metal layer formed in accordance with... Agent: Samsung Electro-mechanics Co., Ltd.
20150136456 - Coating process and coating for press-fit contact: A process is disclosed for coating a substrate. The process includes providing a substrate having at least one free surface; depositing a first layer of a first material on the free surface of the substrate; depositing a second layer of a second material, different from the first material, on the... Agent: Tyco Electronics France Sas
20150136460 - Enhanced bus bar system for aircraft transparencies: A transparency having a bus bar system includes a non-conductive substrate having a major surface. At least one conductive coating is located over at least a portion of the major surface. An electrically conductive adhesive, such as an isotropically conductive tape or film, is located over at least a portion... Agent:
20150136457 - Interposer and method for manufacturing same: t
20150136458 - Printed circuit board and method of manufacturing the same: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied... Agent: Samsung Electro-mechanics Co., Ltd.
20150136459 - Printed wiring board and method for manufacturing printed wiring board: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and... Agent: Ibiden Co., Ltd.
20150136461 - Solder alloy, solder paste, and electronic circuit board: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is... Agent:
20150136464 - Electronic device: According to one embodiment, an electronic device includes a printed circuit board on which mounted is a multilayer ceramic capacitor includes a rectangular parallelepiped capacitor main body in which a pair of external electrodes are formed on both ends in a shorter side. The electronic device has a mount structure... Agent:
20150136465 - Metal oxide varistor design and assembly: A stacked arrangement of metal oxide varistors includes a plurality of metal oxide varistors with each metal oxide varistor of the plurality of metal oxide varistors having a first lead on a first surface and a second lead on a second surface, the first surface and the second surface being... Agent:
20150136462 - Multilayer ceramic electronic component and board having the same mounted thereon: There is provided a multilayer ceramic electronic component including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed in the ceramic body, having at least one of the dielectric layers interposed therebetween, wherein when a distance between a widthwise end of an internal electrode disposed at... Agent: Samsung Electro-mechanics Co., Ltd.
20150136463 - Multilayer ceramic electronic component and board having the same mounted thereon: A multilayer ceramic electronic component is provided including a ceramic body having dielectric layers and a plurality of internal electrodes disposed in the ceramic body. The internal electrodes have exposed portions exposed to the exterior of the ceramic body. An electrode layer is disposed on an outer surface of the... Agent: Samsung Electro-mechanics Co., Ltd.
20150136467 - High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly: A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral... Agent:
20150136466 - Printed circuit board and method for manufacturing the same: Disclosed herein are a printed circuit board and a method for manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer having a connection pad; and a resist layer formed on the insulating layer and provided with an opening so... Agent: Samsung Electro-mechanics Co., Ltd.
20150136468 - Micro vias in printed circuit boards: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns.... Agent:
20150136469 - High-frequency signals double-layer flat cable adapter card: A high-frequency signal double-layer flat cable adapter card that is capable of eliminating transmission disorder of a double-layer cable caused by paralleling and overlap of high-frequency signals and a direct current power supply loop. The high-frequency double-layer flat cable adapter card comprises a first connecting end, a second connecting end... Agent:
20150136471 - Single wire seal for sealing an electric cable in an aperture of a terminal: A single wire seal for sealing an electric cable in an aperture of a terminal or a connector housing is provided. The single wire seal is provided with an essentially cylindrical shape and a through hole for the electric cable. The single wire seal further comprises a crimping portion for... Agent:
20150136472 - Wire seal assembly: In at least some implementations, a seal for a wire includes a body having at least one opening adapted to receive at least one wire therethrough, and an axially extending engagement surface disposed around at least a portion of each of said at least one openings. The engagement surface has... Agent:
20150136473 - Electrical connector with release and fit buttons: The present invention is a connector for connecting an electrical cable to an aperture in an electrical panel. The assembled connector has a spring ring, a shell, and a block along a longitudinal axis. The spring ring has a base from which two insertion tabs extend coaxial with the axis.... Agent:
20150136474 - Quick lock tube securing system: A connecting system for quickly securing a hollow tube to a structure or another hollow tube using a connector that has housing with a tapered interior edge that operably engages a tapered locking wedge received therein. When the tube is inserted into the tapered locking wedge, the locking wedge therein... Agent:
20150136475 - Electrical feedthrough for housing of active implantable medical device: A housing of an active medical device includes a metal wall having at least one feedthrough for an electrical connection through the wall. In the area of the feedthrough, the housing wall includes a contour groove extending through the thickness of wall, defining a metal islet electrically and physically isolated... Agent:05/14/2015 > 32 patent applications in 24 patent subcategories.
20150129274 - By-pass system for overhead power lines: A by-pass system for overhead power lines may include: a housing; a bearing frame in the housing; an outdoor termination linked to the bearing frame; and/or an electrical cable electrically connected to the outdoor termination. The bearing frame may be configured to move between a stand-by position of the outdoor... Agent: Prysmian S.p.a.
20150129275 - High-voltage wire wiring structure in vehicle: A high-voltage wiring structure in a vehicle includes an extending member extending in an extending direction which is a longitudinal direction or a width direction of the vehicle, a plurality of bulkheads respectively provided at a plurality of portions of the extending member in the extending direction, a high-voltage wire... Agent: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
20150129276 - Deformable elastomeric conductors and differential electronic signal transmission: This application generally relates to deformable elastomeric conductors and differential signaling transmission techniques. According to one embodiment, a deformable elastomeric conductor is configured to transmit electrical signals. It comprises: an elastomeric polymer matrix; and conductive filler material uniformly dispersed in the elastomeric polymer matrix sufficient to render the material electrically... Agent: U.s. Army Research Laboratory Attn: Rdrl-loc-i
20150129301 - High capacity power distribution panel for a modular data center: A power distribution network includes a first busway, a second busway situated between the first busway and a load, a first bus plug, and a second bus plug. The first and second bus plugs are configured to span across the first busway and the second busway. The first bus plug... Agent: Dell Products, Lp
20150129302 - Thermally tuned coaxial cable for microwave antennas: A coaxial cable, including an inner conductor and an outer conductor surrounding the inner conductor and a thermally responsive material positioned between the outer conductor and the inner conductor. The outer conductor is in a generally concentric relationship to the inner conductor and the inner and outer conductors are adapted... Agent:
20150129303 - Grommet and wire harness with grommet: A grommet includes a wire harness insertion portion, and an annular projecting portion that is made of an elastic material and projects outward from the wire harness insertion portion, the annular projecting portion being provided with an annular locking recess arranged at an outer circumferential portion of the annular projecting... Agent: Sumitomo Wiring Systems, Ltd.
20150129304 - Wiring harness assembly for vehicle including source splice overlay: A wiring harness assembly for a vehicle includes wiring harness assembly for a vehicle including a plurality of overlay wiring harnesses, each of the overlay wiring harnesses including a first harness connector with a plurality of first wires, a source splice overlay adapted to be coupled to a source of... Agent:
20150129305 - Shield connector: A first shield connector (20) includes a first housing 21 made of resin, wires (40), a shield member (50) to be mounted on the wires (40), and two brackets (61, 62) including a plate-like first shield member connecting portion (64) to be crimped to a peripheral edge of the shield... Agent:
20150129277 - Data cables having an intumescent tape: A data cable can include a plurality of insulated conductors twisted into pairs, an intumescent tape surrounding one or more of the insulated conductors, and a jacket. Each of the plurality of insulated conductors includes a conductor and an insulation layer. Data cables being fluoropolymer-free or halogen free are also... Agent:
20150129278 - Round cable: A round cable includes a first flat cable, a shielding layer enclosing on the first flat cable, an insulative outer jacket wrapped on the shielding layer, and an axis extending along a length direction of the round cable. The first flat cable is wound around the axis in a spiral... Agent:
20150129279 - Acetylated polyol hydroxystearate plasticizers and plasticized polymeric compositions: Plasticizers comprising an acetylated polyol hydroxystearate and plasticized polymeric compositions comprising such plasticizers. Such plasticized polymeric compositions can be employed in forming various articles of manufacture, such as coated conductors.... Agent: Dow Global Technologies LLC
20150129280 - Structure including molecular monolayer and graphene electrode, flexible electronic device, and method of producing the same: A structure including a graphene electrode and a molecular monolayer, a flexible electronic device, and a method of production thereof are provided. The structure includes a first graphene electrode and a molecular monolayer disposed on the first graphene electrode and chemically or physically bound to the first graphene electrode.... Agent: Research & Business Foundation Sungkyunkwan University
20150129281 - Wire holder: A wire holder which is configured to hold an electric wire that is to be passed through a housing, includes: a resin-made holder body which is inserted into the housing, and in which a wire passing hole through which the electric wire is to be passed is formed; and annular... Agent: Yazaki Corporation
20150129282 - Electrical wire connector: An electrical wire connector is configured to secure at least two electrical wires partially covered in sheaths. The electrical wire connector includes a body further comprising a cavity with a port configured to receive the at least two electrical wires twisted to form an electrical wire connection. Teeth are on... Agent:
20150129283 - Properties of printed conductive tracks: A process for improving a property of a conductive ink track on a substrate involves applying heat and pressure above a glass transition temperature of the binder to a conductive ink track deposited on a first surface of a substrate, while maintaining a second surface of the substrate at a... Agent: National Research Council Of Canada
20150129285 - Packaging substrate having embedded through-via interposer: A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with... Agent:
20150129284 - Shaped intneral leads for a printed circuit substrate: A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with... Agent: Seagate Technology LLC
20150129286 - Patterned transparent conductors and related manufacturing methods: A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within... Agent: Innova Dynamics, Inc.
20150129287 - Cable backplane system having stiffeners: A cable backplane system includes a backplane having board areas surrounding a connector opening with holes in the board areas along the connector opening. Stiffeners are coupled to corresponding board areas along a front of the backplane. The stiffeners have bores aligned with corresponding holes in the backplane. A cable... Agent: Tyco Electronics Corporation
20150129288 - Circuit substrate and method for making the same: A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the... Agent: Taiwan Green Point Enterprises Co., Ltd.
20150129289 - Printed circuit board and method of manufacturing the same: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer... Agent: Samsung Electro-mechanics Co., Ltd.
20150129290 - Base material for forming conductive pattern and conductive pattern formed using same: The present invention relates to an adhesive substrate for forming a conductive pattern, which includes an adhesive substrate, and a precursor pattern of a conductive pattern, or a conductive pattern, provided on one side of the adhesive substrate, a method for preparing a conductive pattern using the adhesive substrate, a... Agent:
20150129291 - Printed circuit board and method of manufacturing printed circuit board: Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other... Agent: Samsung Electro-mechanics Co., Ltd.
20150129293 - Printed circuit board and method of manufacturing the same: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.... Agent: Samsung Electro-mechanics Co., Ltd.
20150129292 - Process for producing a printed circuit board: A process is provided for producing a printed circuit board comprising at least two elementary circuit boards drilled with metallized holes the mouth of which is covered with a first metal, and at least one first intermediate layer, made of a compressible material, drilled with holes facing the elementary circuit... Agent:
20150129295 - Double-shot injection molding formed led lead frame structure: A double-shot injection molding formed LED lead frame structure includes an inner base having an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner... Agent: I-chiun Precision Industry Co., Ltd.
20150129294 - Electric wiring seat and assembly thereof: A wiring seat includes an insulative base and a connecting member. The insulative base has a fixing hole and an engagement hole or a through hole beside the fixing hole. The connecting member has a conductive body. The conductive body is bendingly extended with a positioning sheet engaging with the... Agent:
20150129296 - Flexible, total coverage electromagnetic wave shielding system: The present invention relates to a shielding system for conductor cables as well as to a method for producing said shielding system. The system is characterized in that it comprises a corrugated tube (20) coated with one or more thin films of high electrical conductivity material (30) which are reversibly... Agent:
20150129298 - Electrical box, integrated flange and cover mechanisms: A “no profile” electrical box, integrated flange/protective assembly and interchangeable cover that obscures standard electrical outlets such that a wall surface appears nearly continuous, uninterrupted by the outlet or cover when in use or not in use. The profile of the combined unit equals only the thickness of the material... Agent:
20150129299 - Electrical connection box: An object of the present invention is to provide an electrical connection box in which reduction in weight can be achieved by simplification of the construction, while preventing short-circuiting of a positive electrode side busbar and a negative electrode side busbar. An electrical connection box includes: a positive electrode side... Agent: Yazaki Corporation
20150129300 - Flameproof electrical feed-through: A flameproof feed-through (200) includes a feed-through element (210) comprising a substantially planar shape, a first interface region (211), and a second interface region (212), wherein one or more conductors (217) extend between the first interface region (211) and the second interface region (212). The flameproof feed-through (200) further includes... Agent: Micro Motion, Inc.05/07/2015 > 20 patent applications in 14 patent subcategories.
20150122527 - Bipolar lightning rod apparatus: A bipolar lightning rod apparatus includes a fixation plate, a rod member configured to have one end connected to the fixation plate in a length direction thereof and charged with the electric charges of a ground, at least two insulators installed in the length direction, an electrification plate installed between... Agent: Omni Lps. Co., Ltd.
20150122538 - Supporting apparatus for conductors: A supporting apparatus for a conductor, comprising a helical rod having a plurality of turns. The pitch between the turns varies along the length of the helical rod, from a region of longer pitch at an end of the helical rod to a region of shorter pitch along the rod.... Agent:
20150122528 - Safety channel for breaker boxes: A breaker box suitable for safely housing an electrical connection. The electrical connection can be made between at least two electrical conductors. The breaker box includes a bottom and a plurality of adjacent side walls, each the side wall being at least partially joined to the bottom and to each... Agent:
20150122542 - Communication cables with illumination: Methods and systems are provided for designing, implementing, and/or using communication cables comprising a leaky feeder structure, which may be configurable for homogeneous distribution of data signals. An example communication cable may comprise a core conductor, an insulation shield surrounding the core conductor, an outer conductor around the insulation shield... Agent:
20150122541 - Conductor component: A conductor having a first half and a second half. The first half has a first solid conductor. A first insulating layer is disposed about the first solid conductor. The second half has a second solid conductor. A second insulating layer is disposed about the second solid conductor. The first... Agent: Schlumberger Technology Corporation
20150122544 - Water-stop structure for wire harness: A water-stop structure including a water-stop tube is provided in which the water-stop tube can be brought into intimate contact with a water-stop region in a wire harness having a steep thickness gradient and thus water-stop performance is improved. The wire harness includes a first portion and a second portion... Agent: Sumitomo Wiring Systems, Ltd.
20150122545 - Wire harness: The wire harness according to the present invention comprises electric wires each including a conductor. The electric wire is configured of a low-current electric wire used for a power source circuit, a high-current/ground electric wire used for a high-current power source circuit or a ground circuit and allowing a larger... Agent:
20150122543 - Wiring harness: A wiring harness (1) includes a housing (2) for holding protected parts each including a connected part of an insulated wire (90) and a terminal fitting (91) in a plurality of terminal-provided wires (9) at intervals inside. The housing (2) has a double structure including an inner wire protecting member... Agent:
20150122546 - Device comprising a space charge trapping layer: The present invention relates to a device comprising at least one electrical cable (10a, 10b, and 10c) for transporting DC current, said electrical cable comprising an elongate electrical conductor (11a, 11b, and 11c) surrounded by at least one first semiconducting layer (12c), an electrically insulating layer (13a, 13b and 13c)... Agent: Nexans
20150122529 - Polymeric coatings for coated conductors: Coated conductors comprising a conductive core at least partially surrounded by a polymeric coating. The polymeric coating comprises an α-olefin based polymer and an α-olefin block composite. The α-olefin block composite comprises block copolymers having hard segments and soft segments.... Agent:
20150122530 - Printed wiring board: A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface... Agent: Ibiden Co., Ltd.
20150122531 - Strain gauge: An article comprising a conductive film comprising conductive structures, and a first resistive element patterned into a first portion of the conductive film. In at least some cases, the conductive structures may comprise nanostructures, such as, for example, nanowires. Silver nanowires are exemplary conductive structures. In some useful applications, the... Agent:
20150122532 - High temperature multilayer flexible printed wiring board: In various embodiments, high temperature printed circuit boards are disclosed. In one embodiment, a high temperature printed circuit board (PCB) comprises a first reinforced pre-impregnated layer and a second reinforced pre-impregnated layer. The first reinforced pre-impregnated layer and the second reinforced pre-impregnated layer comprise a plurality of glass fibers having... Agent:
20150122533 - Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and... Agent: Industrial Technology Research Institute
20150122537 - Capacitor, capacitor mounting structure, and taped electronic component series: In a capacitor main body, a dimension along the thickness direction of a first region where a first inner electrode and a second inner electrode are provided is t1, a dimension along the thickness direction of a second region that is positioned on the side of a first main surface... Agent:
20150122536 - Low temperature co-fired ceramic substrate with embeded capacitors: The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of... Agent: Samsung Electro-mechanics Co., Ltd.
20150122534 - Multilayer ceramic electronic component and board having the same mounted thereon: There is provided a multilayer ceramic electronic component including: a multilayer ceramic capacitor including first and second external electrodes formed of a conductive paste on both ends of a ceramic body; and an interposer substrate attached to a mounting surface of the multilayer ceramic capacitor and including first and second... Agent: Samsung Electro-mechanics Co., Ltd.
20150122535 - Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein: There is provided a multilayer ceramic electronic component to be embedded in a board including: a ceramic body including dielectric layers and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; first and... Agent: Samsung Electro-mechanics Co., Ltd.
20150122539 - Mounting structure for keypads: An improved mounting structure for keypads is provided. The mounting structure can include first and second frame members and first and second spring-loaded members. Respective first and second ends of the first spring-loaded member can couple a first end of the first frame member to a first end of the... Agent: Honeywell International Inc.
20150122540 - High tolerance connection between elements: An electronic device may include a ring-shaped housing member defining an interior volume. The ring-shaped housing member may be configured to receive electronic device components. The ring-shaped housing member may include a first element comprising an angled region, and a second element comprising an angled region. A first intermediate element... Agent:04/30/2015 > 38 patent applications in 22 patent subcategories.
20150114676 - Conductor bar with multi-strand conductor element: A conductor bar including a plurality of Roebel-transposed conductor elements is disclosed. At least one of the conductor elements possesses a plurality of conductive strands stacked relative to each other. The strands used to form the at least one conductor element follow a common path within the conductor bar. An... Agent: Alstom Technology Ltd.
20150114679 - Cover: A cover covers a fuse unit to which a terminal is fixed in a manner such that a nut is fastened onto a bolt placed with the tip thereof facing outward. The cover is provided, on the inner surface thereof in a position corresponding to the nut, with a protrusion... Agent:
20150114678 - Insulator cover for electrical distribution systems: A dielectric cover system for an insulator supporting a high voltage conductor is molded to fit over the insulator to cover at least a top portion of the insulator and the conductor in contact with the insulator. A bolt through the cover is inserted to a depth to engage a... Agent: Eco Electrical Systems
20150114711 - Method for splicing shielded wire cables and cables made by same: A method of splicing shielded wire cables includes the steps of providing a first, second, and third shielded wire cable each having a core conductor axially surrounded by a shield conductor which is axially surrounded by an insulative jacket, providing a flexible insulation layer, a flexible conductive layer, and a... Agent: Delphi Technologies, Inc.
20150114710 - Organizing device for cable and wire: An organizing device includes a cylindrical retainer member made of a resilient material and having one or more longitudinal grooves and spaced from each other for forming one or more partitions between the grooves of the cylindrical retainer member, and having one or more slots formed in an outer peripheral... Agent: Wanho T Manufacturing Co., Ltd.
20150114712 - Electrical connector and manufacturing method thereof: An electrical connector and a manufacturing method. The electrical connector is used for electrically connecting a first electronic element having protruding conductive portions in the bottom thereof to a second electronic element, includes an insulating body located below the first and above the second electronic element, a conductor, a conducting... Agent:
20150114713 - Lateral edge water-resistance structure for flexible circuit cable: Disclosed is a lateral edge water-resistance structure for a flexible circuit cable. The flexible circuit cable includes a water resistant section formed thereon. The flexible circuit cable has two lateral edges in the water resistant section and a roughness structure is formed in at least one of the lateral edges... Agent: Advanced Flexible Circuits Co., Ltd.
20150114680 - Wire harness exterior member and wire harness: A wire harness exterior member includes a flexible tube portion, an inflexible tube portion, and a post-attached part attached to a boundary between the flexible tube portion and the inflexible tube portion. The post-attached part is attached such that at least a portion of an attaching surface of a rigid... Agent: Yazaki Corporation
20150114681 - Coiled cable: Provided is an electrical coiled cable that has excellent durability, a small outer diameter, is light in weight, has low conductor resistance, and has excellent flexibility. A coiled cable (10) has a conductor coil (12) formed into a coil shape having a coil average diameter (D) by winding four conductor... Agent:
20150114682 - Cable and cable pulling method: The cable (1) includes a cable outer sheath (12) surrounding a cable core (11) and at least a ring (21, 23, 25, 28, 30) surrounding partly the cable outer sheath (12) so that the ring (21, 23, 25, 28, 30) presses the cable outer sheath (12) on the cable core... Agent:
20150114683 - Electrical cable support arrangement: An electric cable saddle, or support, arrangement includes a housing having an upper recessed portion adapted to receive and support one or more electrical cables in a fixed, stable manner. Plural apertures disposed on upper portions of the housing on opposed sides of the cable(s) and aligned generally transverse to... Agent: Electrical Materials Company
20150114684 - Support insulator arrangement: A support insulator assembly has an electrically insulating body, a first support region and a second support region. The two support regions are spaced apart relative to one another by way of the insulator body. The first support region has an armature body, which is at least partially embedded in... Agent:
20150114685 - Releaseable probe connection: A test and measurement probe connection system including an interposer, at least one probe tab connected to the interposer, and a connector that is releasably connectable to the at least one probe tab to measure signals from the interposer.... Agent: Tektronix, Inc.
20150114691 - Core substrate and method for manufacturing the same: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded... Agent: Samsung Electro-mechanics Co., Ltd.
20150114689 - Flex-rigid wiring board and method for manufacturing flex-rigid wiring board: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the... Agent: Ibiden Co., Ltd.
20150114690 - Flex-rigid wiring board and method for manufacturing flex-rigid wiring board: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the... Agent: Ibiden Co., Ltd.
20150114687 - Pcb trace connection of ion smoke sensor: Embodiments are directed to a method for manufacturing a smoke detector, comprising: manufacturing a substrate that comprises a guard ring configured to surround an ion chamber collector plate pin connection point, a surface mount component connection point, and a trace coupling the ion chamber collector plate pin connection point and... Agent:
20150114686 - Printed circuit board: A printed circuit board includes a first dielectric layer, a first ground layer, a second dielectric layer, a first power layer, a first via hole, and a first ground hole. A first signal line is laid on the first dielectric layer. A third signal line is laid on the second... Agent:
20150114688 - Printed circuit board: Disclosed herein is a printed circuit board having an improved structure of a dummy part to improve warpage strength of the printed circuit board, the printed circuit board including: a plurality of insulating layers built-up therein, the plurality of insulating layers including copper clad layers; and a product zone and... Agent: Samsung Electro-mechanics Co., Ltd.
20150114692 - Locking of an electronic board: An electronic board comprises a plane printed circuit, a thermal drain and an expandable locking means positioned along one edge of the printed circuit comprising a part for transmission of movement and a part mobile in translation along an axis including a component perpendicular to the printed circuit. The part... Agent:
20150114694 - Assembly of a circuit board and a flexible flat cable, circuit board, and assembling method for a flexible flat cable: An assembly includes a circuit board and a flexible flat cable. The circuit board includes a board body having top, bottom and side faces, and a connection module. The board body is formed with a positioning slot that is formed through the top and bottom faces and that has a... Agent: Wistron Corporation
20150114697 - Ceramic capacitors with improved lead designs: An electronic component is provided with improved thermal stability. The electronic component comprises at least one capacitive element wherein the capacitive element comprises internal electrodes of alternating polarity separated by a dielectric. External terminations with a first external termination of the external terminations are in electrical contact with internal electrodes... Agent: Kemet Electronics Corporation
20150114696 - Core substrate and method for manufacturing the same: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded... Agent: Samsung Electro-mechanics Co., Ltd.
20150114695 - Electronic component package, electronic component series, and carrier tape: An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward... Agent:
20150114693 - Insulating resin composition for printed circuit board and products manufactured by using the same: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion,... Agent: Samsung Electro-mechanics Co., Ltd.
20150114698 - Substrate structure and manufacturing method thereof: A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The... Agent: Subtron Technology Co., Ltd.
20150114699 - Insulation material, printed circuit board using the same and method of manufacturing the same: There are provided an insulation material, a printed circuit board using the same, and a method of manufacturing the same. The insulation material includes a via region in which a via is to be formed; and a reinforcement material, wherein the via region and the reinforcement material are formed to... Agent: Samsung Electro-mechanics Co., Ltd.
20150114700 - Multilayer ceramic capacitor: There is provided a multilayer ceramic capacitor including: a ceramic body having a plurality of dielectric layers stacked in a width direction; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body,... Agent: Samsung Electro-mechanics Co., Ltd.
20150114702 - Multilayer ceramic capacitor and board for mounting thereof: A multilayer ceramic capacitor may include a ceramic body and an active layer. The ceramic body includes three external electrodes disposed on amounting surface thereof so as to be spaced apart from each other, and first, second, and third lead parts extending from first and second internal electrodes of the... Agent:
20150114704 - Multilayer ceramic capacitor and board having the same: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a length of the ceramic body is defined as L, and a width of an active region including a plurality of internal electrodes disposed... Agent:
20150114705 - Multilayer ceramic capacitor and board having the same: There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between... Agent: Samsung Electro-mechanics Co., Ltd.
20150114701 - Multilayer ceramic capacitor and board with the same mounted thereon: A multilayer ceramic capacitor may include a ceramic body including dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other, the dielectric layer being interposed between the first and second internal electrodes, and first and second external electrodes covering both end surfaces of the... Agent: Samsung Electro-mechanics Co., Ltd.
20150114703 - Multilayer ceramic electronic component, series of electronic components stored in a tape, and method of manufacturing multilayer ceramic electronic component: In a multilayer ceramic electronic component, a size of a step portion on a first main surface and a size of a step portion on a second main surface are different from each other. A first outer electrode includes a plating film containing Cu. A length of a portion of... Agent:
20150114706 - Circuit board via configurations for high frequency signaling: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the... Agent:
20150114707 - Nano-copper solder for filling thermal vias: A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can... Agent: Flextronics Ap, LLC
20150114708 - Cabled backplane system having an electromagnetic radiation absorber: A cable backplane system includes a tray having a frame with side walls surrounding a raceway. The side walls extend to a front edge of the frame. The tray includes spacers coupled to the tray located proximate to the front edge. Cable connectors are held by corresponding spacers in position... Agent: Tyco Electronics Corporation
20150114709 - Server cabinet: A cabinet includes a board defining a through hole, a number of cables extending through the through hole, and a seal device. The seal device includes a limiting member mounted on the board, a sliding member slidably mounted to the board, and a fixing member. The limiting member defines a... Agent: Hon Hai Precision Industry Co., Ltd.Previous industry: Tool driving or impacting
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