Electricity: conductors and insulators patents - Monitor Patents
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Electricity: conductors and insulators

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
09/18/2014 > 92 patent applications in 54 patent subcategories.

20140262410 - Portable lightning protection system: A portable lightning protection system is described for placement adjacent structures requiring lightning protection. The system includes a base mast section with an upper end and a plurality of radially extending, axially aligned ribs; a top mast section; preferably at least one intermediate mast section attachable to the upper end... Agent:

20140262485 - Movably adjustable cover for conductors and insulators: A cover apparatus is provided for covering an electrical insulator and a conductor. The cover apparatus includes a first cover portion extending along a first axis. The first cover portion comprises a first segment covering a first portion of the electrical insulator and a second segment coupled to the first... Agent: Preformed Line Products

20140262411 - Extended curl s-shield: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. One or more S-shaped separators are disposed amongst the twisted pairs. The S-Shaped separators may be formed with two layers or three layers, wherein at least one layer is conductive. Where two S-shaped separators... Agent: Commscope, Inc. Of North Carolina

20140262412 - Overhead electrical grounding mesh and mechanical grid structure: An overhead electrical grounding mesh and mechanical grid structure for a data center includes a plurality of orthogonally arranged grid beams. Each of the grid beams is a rigid and electrically conductive grid beam to provide an overhead structure configured to be positioned over electronic equipment in the data center.... Agent: Leviton Manufacturing Co., Inc.

20140262413 - Impedance controlled subsea ethernet oil filled hose: One or more insulated conductive wire assemblies are incorporated in a pressure balanced, oil-filled (PBOF) hose. Each conductive wire assembly has a pair of conductive wires each having an insulation layer, an insulating material surrounding the insulated wires, and an outer insulating layer surrounding the insulating material. The insulating material... Agent: Teledyne Instruments, Inc.

20140262414 - Resin additive, polyphenylene sulfide resin composition, and electronic device: A resin additive for a polyphenylene sulfide includes a diamine compound expressed by a following general chemical formula (1), in which A is an oxygen atom or a sulfur atom, X is a hydrogen atom, an alkyl group with a carbon number of six or less, or an aryl group,... Agent: Denso Corporation

20140262416 - Electrical box: An electrical box suitable for safely and efficiently housing an electrical connection. The electrical box includes a bottom and a plurality of adjacent side walls, each side wall being at least partially joined to the bottom and to each adjacent side wall to form an open box. Each side wall... Agent:

20140262415 - System for controlling power in a junction box: A system for controlling power in a junction box is described. The system comprises a junction box adapter having a plurality of flanges for coupling to a junction box of an electrical network, and a plurality of connector elements; and an electrical component, which enables the control of power, inserted... Agent:

20140262417 - Electrical box cover assembly: An electrical box cover assembly includes a base having a central opening and a collar encircling the central opening. A sleeve slides through the collar and is adjusted to a selected position by manually moving the sleeve and then locking the sleeve in place by a locking device. An expandable... Agent:

20140262420 - Floor box cover assembly: A cover assembly for a floor box includes a base with a central opening and a cover pivotally connected to the base by a hinge member. The hinge member has a hinge body with a first end pivotally connected to the base for pivoting with respect to the base and... Agent:

20140262419 - Wall mounted electrical device cover plate assembly: A cover plate assembly is provided with a cover plate with a substrate adapted to be mounted upon a substrate of a subplate mounted to an electrical device for enclosing the electrical device. A rim extends from a periphery of the cover plate substrate. The fastener is engaged with the... Agent: Liberty Hardware Mfg. Corp.

20140262418 - While in use weatherproof cover for an electrical box: A weatherproof cover assembly for an electrical device such as an electrical outlet has a base and hinged cover that encloses the base when a cord or plug is connected to the electrical outlet. The base has a cord access opening to allow the cord to pass between the base... Agent: Hubbell Incorporated

20140262421 - Tubular cable protection and guide device: A tubular cable protection and guide device is provided. The tubular cable protection and cable device includes an elastomer resin sheet that has: an outer circumference wall forming portion, a pair of sidewall forming portions on the left and right sides, and a pair of inner circumference wall forming portions... Agent: Tsubakimoto Chain Co.

20140262495 - Wire harness with metal pipe and cap: A wire harness includes conducting paths, a metal pipe into which the conducting paths are inserted, and a conducting path protective cap which includes a through hole for the conducting paths, and an engaging part which is engaged with a terminal part of the metal pipe. The terminal part of... Agent: Yazaki Corporation

20140262496 - Electrical connection and termination assemblies: An electrical cable termination assembly includes a crimp body configured for electrically connecting a conductive core of an electrical cable to a conductive pin. The crimp body is further configured to receive the conductive core at a first end thereof and the conductive pin at a second end thereof. The... Agent:

20140262497 - Controlled compression tube: An electrical connector for a composite core conductor and a method of controlling crimping thereof includes a coupling portion and a tubular portion extending from the coupling portion. A conductor has a non-metallic core surrounded by electrically conductive strands and has a connecting portion of the core extending axially beyond... Agent:

20140262500 - Cover assemblies and methods for covering electrical cables and connections: A method for protecting a cable splice connection including a cable, the cable including an electrical conductor surrounded by a cable insulation layer, includes providing a splice body assembly including: an electrically insulative, elastomeric splice body having an interior surface defining an interior passage; and a layer of a conformable... Agent: Tyco Electronics Corporation

20140262498 - Interconnect device and assemblies made therewith: An interconnect device forms an electrical and mechanical connection between electrical connections pads on an integrated circuit and those on a printed circuit board. The device is a coil with a first portion of its turns at one axial end of the coil having at least two turns in axial... Agent: U.s.a. As Represented By The Administrator Of The National Aeronautics And Space Administration

20140262499 - Methods and apparatus for optimizing electrically inoperative zones on laminated composite assemblies: In some embodiments, a system includes a first portion, a second portion, and a third portion of an electrical conductor. Each portion is electrically coupled to the other two portions. The first, second, and third portions are configured such that substantially no current induced in and/or supplied to the first... Agent: Boulder Wind Power, Inc.

20140262501 - Durable copper to aluminum welded connection: A welded electrical connection includes an aluminum electrical conductor welded to a copper electrical conductor. The copper electrical conductor and the aluminum electrical conductor form a butt joint, A ferrule is over the butt joint and attached to the copper electrical conductor and the aluminum electrical conductor. The ferrule is... Agent:

20140262422 - Low static discharge lan twisted pair cable: A cable includes a jacket surrounding a cable core. The cable core includes four twisted pairs. One or more separators may optionally be disposed amongst the twisted pairs. The cable may optionally include a nonconductive core wrap, and/or the cable may optionally include an outer conductive shielding layer wrap. One... Agent: Commscope, Inc. Of North Carolina

20140262423 - Class i and class ii modular wiring system: A modular wiring system carries different types or classes of wiring in a single cable. The modular wiring system includes two conduits, one inside the other. The outer conduit is a Class I conduit and the inner conduit is a Class II conduit. The Class II wiring is carried in... Agent: AblIPHolding LLC

20140262424 - Shielded twisted pair cable: A wire cable capable of transmitting digital signals with a data rate of at least 5 Gigabits per second (Gb/s). The wire cable includes an insulated twisted pair of conductors and an inner conductive shield enclosing the conductors. The insulation of the twisted pair is bonded to provide consistent spacing... Agent: Delphi Technologies, Inc.

20140262425 - Shielded cable with utp pair environment: A cable includes a spacer surrounding a cable core. The cable core includes four twisted pairs. A separator is disposed amongst the twisted pairs. The separator may be formed with three layers, wherein a middle layer is conductive and outer layers are nonconductive. A jacket surrounds the spacer, and a... Agent: Commscope, Inc. Of North Carolina

20140262426 - Controlled peel laminate adhesive films: Disclosed is a multilayer adhesive film comprising surface adhesive layers, an internal Controlled Bond Layer (“CBL”) comprising a propylene-based polymer strippably adhered to an adjacent layer; an internal Strong Bond Layer (“SBL”) different than the CBL having a facial surface in adhering contact to the CBL and; optionally, one or... Agent: Dow Global Technologies LLC

20140262427 - Foamed polymer separator for cabling: A cable separator comprising a preshaped article having a longitudinal length, wherein said preshaped article is substantially entirely formed of a foamed polymer material having a glass transition temperature greater than 160° C. and being halogen-free is provided. A data communications cable comprising a plurality of conductors and the cable... Agent: General Cable Technologies Corporation

20140262428 - High strength tether for transmitting power and communications signals: An electro-optical-mechanical tether is presented. The tether is designed to be strong and lightweight, and to transmit both optical signals and electricity. The proposed use relates to airborne devices, in which the tether may transmit electrical power to or from the device as well as enabling communications between the device... Agent:

20140262430 - Flexible flat cable and method of manufacturing the same: A flexible flat cable includes an insulating layer disposed through extrusion in vicinity of a plurality of conductors arrayed in parallel with each other. The insulating layer is composed of a vinyl chloride-based resin composition having a die swell ratio of 1.1 or more at a molding temperature during the... Agent: Yazaki Corporation

20140262429 - Multiple-conductor flat cable: A multiple-conductor flat cable includes: an analog cable portion formed such that ground signal lines and analog signal lines are alternately arranged side by side across a signal transmission direction and each adjacent pair of the ground signal lines and the analog signal lines are joined while being electrically insulated... Agent: Ricoh Company, Ltd.

20140262431 - Multi-cable breakout assembly: A multi-cable breakout assembly includes: a plurality of cables arranged in a rectangular array of M rows×N columns, wherein M and N are positive whole numbers greater than one; a first sleeve that encircles the plurality of cables; first and second ribbon members, the first ribbon member being threaded through... Agent: Commscope, Inc. Of North Carolina

20140262432 - High voltage high current transmission line: A high voltage high current transmission line for transmitting high voltage high current energy in the 10 kV and 200,000 A range from a power source to an end item to which the power is delivered. The high voltage high current transmission line includes two generally parallel configured conductive plates... Agent:

20140262433 - Nano electrode and manufacturing method thereof: A nano electrode according to the present invention includes a main body having a protruded probe, a nano wire attached to the probe, and an insulating film including an opening unit which surrounds the nano wire and makes an upper surface of the nano wire to be visible.... Agent:

20140262434 - Adjustable cover for conductors and insulators: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes one or more leg sections for covering a portion of the electrical conductor. The cover apparatus includes a cover section coupled to the one or more leg sections and covering a portion of the... Agent: Preformed Line Products

20140262435 - Dimensionally adjustable cover for conductors and insulators: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes a leg section that covers a portion of the electrical conductor. A cover section covers a portion of the electrical insulator. The cover section can include a body portion that is coupled to the... Agent: Preformed Line Products

20140262436 - Electrical equipment clip: An electrical equipment clip for use with electrical cables is provided herein. Embodiments include clips in a plurality of sizes for attaching to electrical cables, deadbreak elbows, and loadbreak elbows. The electrical equipment clip has markings on detachably attached information tabs that allow linesmen to quickly and easily determine the... Agent:

20140262437 - Wire compression connector: A compression connector for connecting two wires is disclosed. The compression connector is made of either a single bifurcated connector body or two individual connector components that are slidably coupled and then crimped. As the compression connector is crimped, structural features on the connector components are pushed into a locked... Agent: Thomas & Betts International, LLC

20140262438 - Mold for impregnating a prefabricated condenser core of a high-voltage bushing and device for forming a condenser core of a high-voltage bushing: An exemplary mold is disclosed for impregnating a prefabricated condenser core (C) of a high voltage bushing with a liquid resin and includes two mold modules movable against each other and shaped to form an axially symmetric mold cavity. The mold forms a column of cylindrical design, in which the... Agent: Abb Technology Ag

20140262441 - Circuit board with signal routing layer having uniform impedance: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes connector traces, chip traces, and signal traces connecting the two. A width of the signal traces is greater than a width of the chip traces, which is less than... Agent: Hon Hai Precision Industry Co., Ltd.

20140262443 - Hybrid patterned nanostructure transparent conductors: Disclosed herein are nanostructure patterned transparent conductors and methods of forming such transparent conductors including using a deposition method to form an active area and peripheral area and patterning method to pattern the active area.... Agent: Cambrios Technologies Corporation

20140262439 - Method of manufacturing electrical circuit traces: A method of manufacturing an electrical trace includes forming a continuous electrical trace strip having a plurality of electrical trace elements, stamping one or more electrical trace isolators onto the continuous electrical trace strip across select ones of the plurality of electrical trace members forming one or more electrical trace... Agent: Gm Global Technology Operations LLC

20140262442 - Module and method of manufacturing the same: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and... Agent: Murata Manufacturing Co., Ltd.

20140262440 - Multi-layer core organic package substrate: A multi-layer core organic package substrate includes: a multi-layer core comprising at least two organic core layers, wherein two of the at least two organic core layers are separated by a core metal layer; a first plurality of build-up layers formed on top of the multi-core layer; and a second... Agent: Xilinx, Inc.

20140262444 - Circuitry with high aspect ratio traces: Imprinting tools and processes for making such tools, circuitry that includes narrow, high aspect ratio traces having reduced parasitic capacitance to adjacent circuit features and processes for making such circuitry using the imprinting tools are described.... Agent:

20140262448 - High-frequency signal line, method for producing same, and electronic device: A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground... Agent: Murata Manufacturing Co., Ltd.

20140262445 - Methods and circuit structures for mitigating voltage stresses on printed circuit board (pcb) in high voltage devices: A method for mitigating voltage stress on a PCB includes applying AC voltage to a multi-terminal condenser structure of a multi-layered PCB. The terminal condenser structure is formed by overlapping a plurality of conductive traces between board layers of the multi-layered PCB. A corresponding dielectric layer is disposed between the... Agent: Doble Engineering Company

20140262447 - Multilayer printed wiring board for mounting semiconductor element: A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second... Agent: Ibiden Co., Ltd.

20140262446 - Systems and methods for providing surface connectivity of oriented conductive channels: An electrically conductive composite is disclosed that includes a dielectric material having a first side and a second side, conductive particles within the dielectric material layer, and a discontinuous layer of a conductive material on a first side of the dielectric layer. The conductive particles are aligned to form a... Agent: Flexcon Company, Inc.

20140262449 - Apparatus and method for a back plate for heat sink mounting: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at... Agent: Futurewei Technologies, Inc.

20140262450 - Multilayer printed circuit board structure: A multilayer printed circuit board structure is formed by stacking an aluminum foil substrate, a first pre-impregnated body, an aluminum foil middle layer, a second pre-impregnated body and a copper foil surface layer sequentially. Both the first pre-impregnated body and the second pre-impregnated body are composed by a fiber cloth... Agent:

20140262451 - Wiring substrate and manufacturing method thereof: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed... Agent: Yazaki Corporation

20140262452 - Embossed micro-structure with cured transfer material method: A method of making an embossed micro-structure includes providing a transfer substrate, an emboss substrate, and an embossing stamp having one or more stamp structures. Transfer material is coated on the transfer substrate. The transfer material on the transfer substrate is contacted with the stamp structures to adhere transfer material... Agent:

20140262453 - Transparent conductive electrodes and their structure design, and method of making the same: A transparent conductive electrode comprising a single transparent conductive layer comprising a network of nanowires of different diameters and a diffused conductive material wrapping around the nanowires is disclosed. The transparent conductive electrode has a thickness of 200 nm or less, and exhibits >90% transparency in wavelength between 400-1000 nm... Agent: Nuovo Film, Inc.

20140262456 - High aspect ratio traces, circuits, and methods for manufacturing and using the same: High aspect ratio trace circuits and methods of manufacture and use are provided herein. A method may include obtaining a substrate, the substrate having a reservoir for receiving a conductive ink and a plurality of trace voids that are arranged in a pattern, the plurality of trace voids each having... Agent:

20140262455 - Simultaneous and selective wide gap partitioning of via structures using plating resist: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first... Agent: Sanmina Corporation

20140262454 - Stabilization agents for silver nanowire based transparent conductive films: Zinc salts have been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such salts may be incorporated into one of more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers.... Agent:

20140262460 - Connection component with posts and pads: A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads... Agent: Tessera, Inc.

20140262462 - Depositing bulk or micro-scale electrodes: Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating... Agent:

20140262457 - Porous alumina templates for electronic packages: Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a... Agent: Invensas Corporation

20140262461 - Process for forming self-assembled monolayer on metal surface and printed circuit board comprising self-assembled monolayer: The present invention provides a printed circuit board comprising a metal surface, such as a final finish, that has been coated with a self-assembled monolayer. The self-assembled monolayer forms a coating on the metal surface that is resistant to corrosion, thus preserving the solderability of the metal surface. The present... Agent: Omg Electronic Chemicals, Inc.

20140262458 - Under ball metallurgy (ubm) for improved electromigration: An interconnect structure that includes a substrate having an electrical component present therein, and a under-bump metallurgy (UBM) stack that is present in contact with a contact pad to the electrical component that is present in the substrate. The UBM stack includes a metallic adhesion layer that is direct contact... Agent: International Business Machines Corporation

20140262459 - Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same: A winding-type solid electrolytic capacitor package structure includes a substrate body, a winding capacitor, a package body and an electrode unit. The winding capacitor has a winding body, a positive conductive lead pin having a positive end surface, and a negative conductive lead pin having a negative end surface. The... Agent: Apaq Technology Co., Ltd.

20140262463 - Embedded multilayer ceramic electronic component and printed circuit board having the same: There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 μm or less, first and second internal electrodes alternately exposed to... Agent: Samsung Electro-mechanics Co., Ltd.

20140262467 - Contact surface for a pin hole: The present invention relates to an improved contact surface of pin hole (e.g, a ground pin hole, screw fastening hole, or the like), which is adopted on a substrate, the substrate is formed with at least a pin hole (e.g, a ground pin hole, screw fastening hole, or the like)... Agent: Lantek Electronics Inc.

20140262464 - Laterally coupled isolator devices: A laterally coupled isolator includes a pair of isolator traces provided in a common dielectric layer and separated by a distance that defines the isolation strength of the system. Circuit designers can vary the lateral distance to tailor isolation rating to suit individual design needs. A second embodiment includes a... Agent: Analog Devices, Inc.

20140262466 - Lowering the sheet resistance of a conductive layer: An electronic device can include a substrate and a conductive layer. The conductive layer can be disposed over at least a portion of the substrate and a patterned conductive material can be disposed over at least a portion of the conductive layer. Alternatively, the patterned conductive layer can be disposed... Agent: Apple Inc.

20140262465 - Wiring substrate and method of manufacturing the same: A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first... Agent: Shinko Electric Industries Co., Ltd.

20140262469 - Radio frequency feedthrough: A radio frequency feedthrough for optoelectronic housings is provided that includes a multilayer ceramic body and a signal conductor that extends through the ceramic layers in an S-shape. In an upper region of the multilayer ceramic body, a ground layer is recessed in a V-shape, and in a central region... Agent: Schott Ag

20140262468 - System and method for an improved interconnect structure: Presented herein are an interconnect structure and method for forming the same. The interconnect structure comprises a contact pad disposed over a substrate and a connector disposed over the substrate and spaced apart from the contact pad. A passivation layer is disposed over the contact pad and over connector, the... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.

20140262470 - Metal post bonding using pre-fabricated metal posts: A method includes forming a plurality of metal posts. The plurality of metal posts is interconnected to form a metal-post row by weak portions between neighboring ones of the plurality of metal posts. The weak portions include a same metal as the plurality of metal posts. A majority of each... Agent:

20140262471 - Selectively conductive emi gaskets: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.... Agent: Laird Technologies, Inc.

20140262472 - Integrated grounded grommet: The embodiments disclose an integrated grounded grommet for anchoring a cable using a bulkhead opening, including a customized grommet mechanically bonded onto a cable creating a pressure seal, a customized grommet extended boss insertion guiding feature, a grounding path electrically bonded through the grommet to a cable shield, and a... Agent:

20140262473 - Electromagnetic interference shielding (emi) apparatus including a frame with drawn latching features: Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for removably attaching a cover to the frame. In an exemplary embodiment, there is a shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more... Agent: Laird Technologies, Inc.

20140262474 - Rf shielding for mobile devices: An RF shielding device for mobile devices includes a conductive grid having horizontal and vertical wire traces in electrical contact with each other; a conductive trace disposed around the perimeter of the conductive grid, the conductive trace being in electrical contact with both ends of each of the horizontal and... Agent: Continental Accessory Corp.

20140262475 - 3d shielding case and methods for forming the same: A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a... Agent:

20140262476 - Self-wrapping emi shielding textile sleeve and method of construction thereof: A self-wrapping, textile sleeve for routing and protecting elongate members from electromagnetic interference and a method of construction thereof is provided. The sleeve has an elongate wall constructed from interlaced yarns. At least one of the yarns is provided as heat-settable polymeric yarn that is heat-set to bias the wall... Agent: Federal-mogul Powertrain, Inc.

20140262477 - Method and apparatus pertaining to a cavity-bearing printed circuit board: A printed circuit board has a cavity formed in at least one side thereof and an electronic component disposed at least partially within that cavity. Electromagnetic interference (EMI)-shielding material is disposed between the electronic component and at least one of the side walls and bottom of this cavity. So configured,... Agent: Research In Motion Limited

20140262478 - Emi shielding textile fabric, wrappable sleeve constructed therefrom and method of construction thereof: A textile fabric, sleeve formed therefrom, and methods of construction thereof are provided. The fabric forms an elongate wall constructed from lengthwise extending warp yarns woven with widthwise extending weft yarns. At least some of the warp yarns are electrically conductive and have a first diameter. The weft yarns have... Agent: Federal-mogul Powertrain, Inc.

20140262480 - Method and apparatus for an electrical box block bracket with tabs: An electrical box block bracket can include a face place and a rotatable members extending from each of two opposing edges of the face plate. The face plate can also include a aperture providing a passageway through the face plate and sized and shaped to receive a mud ring and/or... Agent:

20140262481 - Self-aligning back plate for an electronic device: An illustrative electronic assembly includes a housing and a wall plate, where the wall plate is releasably connectable to the housing. The housing and the wall plate may be configured such that the housing and the wall plate may be able to initially engage each other with the wall plate... Agent:

20140262482 - Self-aligning back plate for an electronic device: An illustrative electronic assembly includes a housing and a wall plate, where the wall plate is releasably connectable to the housing. The housing and the wall plate may be configured such that the housing and the wall plate may be able to initially engage each other with the wall plate... Agent:

20140262479 - Strap for positioning wires/cables: An illustrative embodiment of the present invention relates to a strap for maintaining the position of wires/cables within a wall frame. The strap has an elongate flexible strip which includes a first plurality of apertures between a first end and a second opposite end of the strip. The strap also... Agent:

20140262484 - Battery holder for an electronic device: A heating, ventilation, and air conditioning (HVAC) controller may include a housing and a printed circuit board (PCB) situated within the housing. The PCB may include a battery seat region and electrical terminals for electrically connecting a battery to the PCB when the battery is positioned at the battery seat... Agent:

20140262483 - Bracket and assembly for electrical devices: The present disclosure is directed to a bracket and electrical assembly including such bracket for mounting or securing to a concrete masonry unit (CMU).... Agent: Cablofil, Inc.

20140262486 - Push-in cable connector and electrical box assembly: A cable connector is provided for coupling to and mounted within the internal cavity of an electrical box for securing an electrical cable passing through an opening in the electrical box. The cable connector includes a body having a first end positioned next to or adjacent the cable opening in... Agent:

20140262488 - Cable connector and electrical box assembly: A cable connector is provided for coupling to and mounted within the internal cavity of an electrical box for securing an electrical cable passing through an opening in the electrical box. The cable connector includes a body having a first end positioned next to or adjacent the cable opening in... Agent:

20140262487 - Patch panel assembly: A cable guide for guidance of at least one cable through a patch panel system, including a housing having front, back, left, and right sides, and at least one patch panel device including a tray and one or more adapters, the cable guide comprising an advancing member having a first... Agent: Go!foton Holdings, Inc.

20140262489 - Electrical enclosure with improved mechanical arrangement: the functional assembly comprising at least one support (41) fixed in independent manner onto an upright or a cross-member of the inner frame and a connector (40) arranged on said support (41), said support being positioned on the upright or fixing cross-member so as to enable the connector (40) to... Agent: Schneider Electric Industries Sas

20140262490 - Terminal assembly for an electronic device: A terminal assembly for use with an electronic device may include a first portion for secure a wire and a second portion for receiving a pin of an electronic device. The first portion and the second portion may be configured to electrically connect the pin to the wire.... Agent:

20140262491 - Electrical enclosure expandable in the z direction: An expandable electrical enclosure system is presented where expansion collars can be serially added to an existing base box to increase the dimension of the enclosure in only the Z direction. A removable cover can be disconnected and connected as each expansion collar is added.... Agent: Asco Power Technologies, L.p.

20140262492 - High voltage busing for cryogenics applications: An electrical bushing is disclosed for use in high voltage cryogenic applications. The bushing including first and second bushing portions and an electrical conductor disposed longitudinally within the portions. The electrical conductor has a first terminal extending from the first bushing portion and a second terminal extending from the second... Agent: Varian Semiconductor Equipment Associates, Inc.

20140262493 - Laser welding a feedthrough: One aspect is a method of coupling an insulator to a surrounding ferrule in an implantable medical device. An insulator is provided having a plurality of conducting elements extending therethrough. The insulator is placed with conducting elements within a ferrule having a frame-like shape surrounding the insulator along an interface.... Agent: Heraeus Precious Metals Gmbh & Co. Kg

20140262494 - Head part for an implantable medical device: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal... Agent: Heraeus Precious Metals Gmbh & Co. Kg

09/11/2014 > 70 patent applications in 18 patent subcategories.

20140251654 - Direct current (dc) transmission system comprising a thickness controlled laminated insulation layer and method of manufacturing: A direct current transmission system and a method for preparation including an electrical conductor layer, an inner semiconductive layer covering the conductor layer, an insulation layer provided on the semi-conductive layer including laminated polymer material and impregnated with a high viscosity fluid, and including an inner part, a middle part,... Agent:

20140251651 - Braided-shielded cable: A braided-shielded cable includes a braided shield including a shield wire braided. The shield wire includes a twisted wire including seven or nineteen wires twisted together.... Agent:

20140251682 - High voltage conductive wire and wire harness: A high voltage conductive wire includes a first conductor, configured to perform as one of a plus pole and a minus pole, a first insulator, provided outside of the first conductor, a second conductor, configured to perform as the other of the plus pole and the minus pole, provided outside... Agent: Yazaki Corporation

20140251683 - Wire harness with clip and wire harness having the same: There is provided a wire harness with clip in which a clip for fixing a protect tube without winding tape is integrally molded, and a wire harness having the wire harness with clip. The wire harness with clip is provided with a clip to be latched into an attaching hole... Agent: Yazaki Corporation

20140251681 - Wire harness with exterior member: A wire harness includes one or more conducting paths, and a pipe-like exterior member which accommodates the one or more conducting paths. The exterior member is formed of a shrinkable tube having a bent part formed in conformity with a wiring path of the one or more conducting paths during... Agent: Yazaki Corporation

20140251684 - Electrical power transmission system and method: A power carrier transmits an electrical current to and from a load. The carrier has a set of wires carrying electricity in parallel to the load and another set of wires carrying the electricity back in parallel from the load. The wires are organized with equal numbers of wires form... Agent:

20140251685 - Guarded coaxial cable assembly: A guarded coaxial cable assembly including a micro-coaxial cable and at least one rail.... Agent:

20140251652 - Communication cable: Cables including central insulators and/or center separators. Each of at least some of the central insulators includes a first wire channel configured to receive a first wire of a wire pair, a second wire channel configured to receive a second wire of the wire pair, and an intermediate portion positioned... Agent: Leviton Manufacturing Co., Inc.

20140251653 - Hybrid conductor core: An electric conductor may be provided. The electric conductor may comprise a conductor core and a plurality of conductor strands wrapped around the conductor core. The conductor core may comprise a plurality of core strands comprising an overall number of strands. The plurality of core strands may comprise a first... Agent: Southwire Company, LLC

20140251657 - Printed circuit board and method of manufacturing the same: Embodiments of the invention provide a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the... Agent: Samsung Electro-mechanics Co., Ltd.

20140251655 - Stabilization agents for silver nanowire based transparent conductive films: Boric acid has been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such compounds may be incorporated into one or more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers.... Agent:

20140251656 - Wiring board and method for manufacturing the same: A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive... Agent: Ibiden Co., Ltd.

20140251659 - Circuit board, and manufacturing method for circuit board: A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in... Agent: Kabushiki Kaisha Toyota Jidoshokki

20140251658 - Thermally enhanced wiring board with built-in heat sink and build-up circuitry: A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up circuitry. The build-up circuitry covers the heat sink and the stiffener and provides signal routing for the stiffener.... Agent: Bridge Semiconductor Corporation

20140251661 - Micro-channel structure with variable depths: A micro-channel structure having variable depths includes a substrate and a cured layer formed on the substrate. At least first and second micro-channels are embossed in the cured layer. The first micro-channel has a bottom surface defining a first depth and the second micro-channel has a bottom surface defining a... Agent:

20140251662 - Optically clear conductive adhesive and articles therefrom: The present invention provides an electrically conductive, optically clear adhesive including an optically clear adhesive layer and an interconnected, electrically conductive network layer positioned over the optically clear adhesive layer. The electrically conductive, optically clear adhesive has a conductivity of between about 0.5 and about 1000 ohm/sq, haze of less... Agent: 3mm Innovative Properties Company

20140251660 - Variable-depth micro-channel structure: A variable-depth micro-channel structure includes a substrate. A cured layer is formed on the substrate. A micro-channel embossed in the cured layer has a bottom surface defining two or more different micro-channel depths of the micro-channel. A cured electrical conductor forms a micro-wire in the micro-channel over the bottom surface... Agent:

20140251664 - Circuit substrate: In a ceramics substrate comprising a surface layer conductor having a sufficient thickness for a flow of a large current, wherein the conductor is buried in a surface region of the substrate, a crack caused by a temperature change of the substrate is effectively suppressed. In the ceramics substrate comprising... Agent: Ngk Insulators, Ltd.

20140251663 - Simultaneous and selective wide gap partitioning of via structures using plating resist: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first... Agent: Sanmina Corporation

20140251667 - Conductive networks on patterned substrates: Among other things, self-assembled conductive networks are formed on a surface of substrate containing through holes. The conductive network having a pattern is formed such that at least some of the conductive material in the conductive network reaches into the holes and, sometimes, even the opposite surface of the substrate... Agent: Cima Nanotech Israel Ltd.

20140251665 - Device for storing electromagnetic energy: A device for storing electromagnetic energy and signals, for example from biological systems and, possibly modifying, and emitting them again is provided with a planar substrate, having a first side and a second side, at least one first arrangement being provided on the first side, which has at least one... Agent:

20140251666 - Laminated body and manufacturing process therefor: Disclosed is a laminated body including a substrate having an unevenness with an aspect ratio of 1.5 to 100 in the surface thereof, and a conductive film that is laminated in an approximately uniform thickness on a bottom, side wall surfaces, and an apex of the unevenness, the conductive film... Agent: Nippon Soda Co., Ltd.

20140251668 - Automatic manufacturing process for providing buffer pads for a pcb and pcb structure using the same: An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d)... Agent: Delta Electronics, Inc.

20140251670 - Module, method for manufacturing the module, and electronic apparatus including the module: A module includes a wiring board; a component mounted on the wiring board; a columnar conductor for external connection, the columnar conductor being connected at one end thereof to the wiring board; and a resin layer disposed on the wiring board and configured to cover the columnar conductor and the... Agent: Murata Manufacturing Co., Ltd.

20140251669 - Suspended inductor microelectronic structures: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the... Agent:

20140251674 - Bridge structure in conductive mesh and method for manufacturing the same: A bridge structure for electrically connecting to a second direction meshed conductive trace disposed on a substrate surface, where a first direction meshed conductive trace disposed on the same surface, which includes a first bridging wire, a second bridging wire, an insulating layer, and a conductive bridge. The first bridging... Agent: Nanchang O-film Tech. Co., Ltd.

20140251673 - Micro-channel connection method: A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer... Agent:

20140251672 - Micro-channel connection pad: A connection-pad structure includes a substrate and a cured layer formed in the substrate. A group of intersecting micro-channels is embossed in the cured layer opposite the substrate. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate; the intersecting micro-channels form a connection pad. An... Agent:

20140251671 - Micro-channel with conductive particle: A micro-channel structure includes a substrate and a cured layer formed on the substrate. One or more micro-channels are embossed in the cured layer on a cured-layer surface opposite the substrate and define a bottom surface. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate.... Agent:

20140251675 - High speed printed circuit board with uniform via inside diameter: A printed circuit board, and method of manufacture, for high speed signals. The printed circuit board has small diameter vias of uniform inside diameter when plated. The uniformity of the inside diameter, at least over the region in which a press fit segment is inserted, is sufficient to make a... Agent: Amphenol Corporation

20140251676 - Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing... Agent: Hitachi Chemical Company, Ltd.

20140251678 - Electronic device enclosure: An electronic device enclosure includes a chassis defining an space, and a cover module. The chassis includes two opposite sidewalls locating at two sides of the space. The cover module includes a cover and a latching apparatus mounted to the cover. A first end of the cover is rotatably connected... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140251677 - Insulator protection: Insulating materials disposed within the housing are protected through the use of removable protective layers, which can be fit over the insulating components. In some embodiments, these removable protective layers are dimensioned so as to fit over the insulating components without the use of any fasteners. In other embodiments, a... Agent: Varian Semiconductor Equipment Associates, Inc.

20140251680 - Cathodic protection system for multiple structures using shunt modules: A shunt module for use in an impressed current cathodic protection system includes a rail mounting mechanism, an electrically insulating strip carrier mounted to the rail mounting mechanism, and a shunt. The shunt includes a conductive strip or wire having contacts at opposing ends. The shunt is coupled to the... Agent:

20140251679 - Feedthrough assembly for electrically conductive winding: A well-logging tool for geological formation has a borehole. A housing that is to be positioned within the borehole includes an opening. An electrically conductive winding is carried by the housing. A feedthrough assembly includes an elongate electrical conductor having opposing first and second ends and a medial portion extending... Agent: Schlumberger Technology Corporation

09/04/2014 > 19 patent applications in 17 patent subcategories.
08/28/2014 > 26 patent applications in 22 patent subcategories.

20140238716 - Underwater connection assembly: An underwater connection assembly comprises an underwater device and an optical cable segment. The optical cable segment is configured to be coupled to a first sea earth by means of a first sea earthing electrode and the underwater device is configured to be coupled to a second sea earth by... Agent: Alcatel Lucent

20140238717 - Mounting brace assembly for mounting an electrical box: A brace assembly is provided having a brace for mounting to a support and a hanger member. The hanger member is coupled to the brace by a bar positioned in a longitudinal slot in the bottom side of the brace. The bar enables the hanger member to slide along the... Agent: Hubbell Incorporated

20140238740 - Sliding door wire harness routine structure: A wire harness (5) to be bridged between a slide door (3) and a vehicle body (BO) is inserted into a harness guide (6). The harness guide (6) is coupled by a multitude of stepped links (10). Each link (10) is composed of a first coupling portion (11) and a... Agent: Sumitomo Wiring Systems, Ltd.

20140238741 - Hermetically sealed wire connector assembly and method of making same: A wire connector assembly configured to provide a hermetic seal between two distinct environments and a method of constructing same is presented. The assembly includes insulated wire cables having ends that are spaced apart and joined by a wire splice element within a connector body, thereby interrupting a fluid leak... Agent: Delphi Technologies, Inc.

20140238718 - Protective armor for cabling: A protective armor layer that comprises a plurality of overlapping reinforcement strips. Each reinforcement strip includes a first end that has a substantially semi-circular profile, a second end opposite the first end that has a linear angular extension, and a substantially flat segment between the first and second ends. The... Agent: General Cable Technologies Corporation

20140238719 - High voltage wire harness for use in automobile: A high voltage wire harness for use in an automobile includes one or a plurality of high voltage conductive paths, a metallic tubular body and a high voltage recognition component. The high voltage conductive paths are routed in an automobile. The metallic tubular body is adapted to serve as an... Agent: Yazaki Corporation

20140238720 - Discontinuous shielding tapes for data communications cable: The present arrangement provides a communication cable having a plurality of twisted pair communication elements, a jacket surrounding the twisted pairs and a shield element disposed between the pairs and the jacket. The shield element is constructed as a tape substrate with a plurality of foil shielding elements disposed thereon,... Agent:

20140238721 - Separator tape for twisted pair in lan cable: A cable includes a jacket surrounding first and second insulated conductors and a first dielectric tape, wherein the first insulated conductor is twisted with the second insulated conductor with the first dielectric tape residing therebetween to form a first twisted pair. The cable's jacket may also surround additional twisted pairs,... Agent: Commscope, Inc. Of North Carolina

20140238722 - Multi-core cable and its manufacturing method: One embodiment provides a multi-core cable including: first insulated wires; second insulated wires; coaxial wire pairs; and a sheath. The second insulated wires are smaller in diameter than the first insulated wires. The coaxial wire pairs are provided in an even number of pairs. The first insulated wires and the... Agent: Sumitomo Electric Industries, Ltd.

20140238723 - Bus bar module accommodating part structure: A synthetic resin plate (1) includes a plurality of accommodating parts (2) which accommodate at least one of bus bars, terminals, and electric wires which are connected to the terminals, hinges (7) which make first accommodating parts and second accommodating parts of the accommodating parts (2) connected and relatively movable,... Agent: Yazaki Corporation

20140238724 - Fabrication of three-dimensional printed circuit board structures: A method of fabricating components for a three-dimensional circuit structure includes providing a printed circuit board (PCB) having a top surface, an opposing bottom surface, and an end section. A first angled channel is formed in the top surface at the end section, with the first angled channel extending to... Agent: Honeywell International Inc.

20140238726 - External moisture barrier package for circuit board electrical component: Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical component in an enclosure defined by the cover and the base. The base may include patterned metallizations using circuit board... Agent:

20140238725 - Method of flattening surface of conductive structure and conductive structure with flattened surface: A method of flattening surface of conductive structure including a substrate, a dielectric layer on the substrate, and a conductive line formed in the dielectric layer is provided. A surface of the conductive line has a recess. A cover layer is formed on the substrate. A mechanical polishing process is... Agent: Industrial Technology Research Institute

20140238728 - Plastic film having lines for a multi-modal input device and method for producing: A plastic film for a multi-modal input device has conductors that link a touch module and an operating element. Such input devices, for example, are in central consoles of motor vehicles, dishwashers, washing machines, telephones, or the like. Touch modules and operating element modules are interconnected by the layout of... Agent: Polyic Gmbh & Co. Kg

20140238727 - Transparent conductive multilayer electrode and associated manufacturing process: p

20140238729 - Printed circuit board structure with heat dissipation function: A printed circuit board (PCB) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of... Agent: Mediatek Inc.

20140238730 - Electroconductive sheet and touch panel: The present invention provides an electroconductive sheet and a touch panel which do not impair visibility in a vicinity of an electrode terminal in a sensing region. In an electroconductive sheet which has an electrode pattern constructed of a metal thin wire and an electrode terminal that is electrically connected... Agent: Fujifilm Corporation

20140238731 - Film constructions for interdigitated electrodes with bus bars and methods of making same: An interdigitated electrode film co-extruded with bus bars for thin film electronics or other devices. First electrode layers are located between first and second major surfaces of the film with a first bus bar electrically connecting and integrated with the first electrode layers. Second electrode layers are located between the... Agent: 3m Innovative Properties Company

20140238732 - Electronic part and electronic control unit: A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a normal terminal and a fuse terminal, each of which extends from lands formed in a printed board so as to hold the main body at a position above and... Agent: Denso Corporation

20140238733 - Systems and methods for frequency shifting resonance of an unused via in a printed circuit board: In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically... Agent: Dell Products L.p.

20140238734 - Electromagnetic cloak using metal lens: A cloak is provided for concealing an object to an electromagnetic field. A first vane encloses the object and a second vane encloses the first vane. The distance between the first and second vanes varies relative to the object, so as to conceal the object to the electromagnetic field.... Agent: United States Government, As Represented By The Secretary Of The Navy

20140238735 - Shielding construction and wiring harness: Edge portions are formed on a shell fixing portion, disposed in upper and lower positions on the shell fixing portion and formed extending horizontally. Crimp pieces are continuously formed on the edge portions, and the crimp pieces are folded back at the edge portions therealong so as to extend towards... Agent: Yazaki Corporation

20140238736 - Thermoplastic resin composition with emi shielding properties: A thermoplastic resin composition that can have excellent EMI shielding and injection-molding processability includes (A) a thermoplastic resin, (B) carbon fibers, and (C) filler comprising nano metal particles surface coated with graphite crystalline nano carbon particles, composite fillers which are carbon nanotubes coated with nano metal particles, composite fillers which... Agent: Cheil Industries Inc.

20140238737 - Reducing inductive heating: An audio transducer apparatus including a component having a first material; and a heating reduction system configured to reduce induced heating in the component. The heating reduction system includes a member at least partially surrounding the component. The member includes a material which has an electrical conductivity that is higher... Agent: Nokia Corporation

20140238738 - Electrical box extension assembly: An electrical box extension includes a base, a movable ring and an extension ring. The base has an inwardly extending flange for coupling the base to the open end of an electrical box. The movable ring slides within the base and is captured by a screw that draws the movable... Agent: Hubbell Incorporated

20140238739 - Locking utility pull box lid: A locking utility pull box lid device is provided. The device includes a lid and two locking members that are rotatably coupled to a bottom surface of the lid. An actuator bolt extends through each lid aperture and each bolt engages an engagement plate of one locking member. The rotation... Agent:

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