Electricity: conductors and insulators patents - Monitor Patents
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Electricity: conductors and insulators

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
07/10/2014 > 26 patent applications in 23 patent subcategories.

20140190726 - Mixture of decafluoro-2-methylbutan-3-one and a carrier gas as a medium for electrical insulation and/or for electric arc extinction in medium-voltage: P

20140190720 - Corrosion resistant emi shielding assembly for a stuffing tube and a method for making a gasket for use therewith: An elongated, flexible composite gasket member having a knitted wire mesh rope at least partly impregnated with a soft, tacky, flowable, pre-cured polyurethane gel for use in a stuffing tube assembly. The stuffing tube assembly is used in a deck or bulkhead of a ship. The stuffing tube comprises a... Agent: Aviation Devices & Electronic Components, L.L.C.

20140190721 - Horizontal cable manager: A cable manager includes a trough, defining a footprint, and a door. At least one side of the trough is formed from a plurality of finger-like projections extending forwardly from a support member. At least two of the projections include a hinge boss disposed at an outer end thereof and... Agent: Chatsworth Products, Inc.

20140190740 - Electrical cable fitted with a theft deterrence means: The invention relates to an electrical cable (1, 10) comprising at least two conducting strands (2, 3) and theft deterrence means in the form of a marking (8). The main characteristic of an electrical cable (1, 10) according to the invention is that the marking consists of a series of... Agent: Nexans

20140190741 - Composite cable for a vehicle: A composite cable for a vehicle is configured to connect between a wheel-side device which is fixed on a wheel side via a suspension device with respect to a body of the vehicle and a body-side device disposed on a body side. The composite cable includes wires, each of which... Agent: Hitachi Metals, Ltd.

20140190742 - Wire harness and method for producing wire harness: An objective is to achieve a configuration for mounting a wire harness in a vehicle to protect the wire harness and regulate a path in a simpler manner with fewer components. A wire harness has a wire harness main body including at least one wire, and a protection member protecting... Agent: Sumitomo Wiring Systems, Ltd.

20140190743 - Structure of connection between coaxial cable and shield terminal, and method of connection therebetween: A structure of connection between a coaxial cable and a shield terminal includes the coaxial cable configured to have at least one core wire part made of a conductor, an insulating coating part with which said core wire part is coated, a braided shield with which an outer peripheral surface... Agent: Yazaki Corporation

20140190744 - Terminal waterproofing structure of wire harness: A terminal waterproofing structure for a wire harness is provided, including a front end side of a tubular braided shielding member covering the wire harness overlaid on a tubular part of a shield shell, and fixed by crimping with a first crimp ring, and a tubular grommet made from an... Agent: Sumitomo Wiring Systems, Ltd.

20140190745 - Conductor track unit for a motor vehicle: The invention relates to a conductor track unit, in particular for a motor vehicle. The conductor track unit is provided with conductor tracks which are embedded in an electrically insulating material. The conductor tracks are, in particular completely, surrounded by the electrically insulating material and are therefore not accessible from... Agent: Kierkert Aktiengesellschaft

20140190722 - Inconspicuous power conduit: An inconspicuous power conduit that is substantially transparent or translucent may be used to provide power to an electronic device mounted on a transparent or translucent wall, such as a glass wall of a conference room. The longitudinal power conduit may be inconspicuous when mounted on a glass wall in... Agent: Monster Route Inc.

20140190723 - Power cable comprising polypropylene: Power cable comprising a conductor surrounded by at least one layer comprising a polypropylene, wherein the polypropylene comprises nanosized catalyst fragments being evenly distributed in said polypropylene.... Agent: Borealis Ag

20140190724 - Multi-layer insulated conductor having improved scrape abrasion resistance: An insulated conductor and method for making it are disclosed. The insulated conductor includes an elongate conductor and a multi-layer insulation system. The multi-layer insulation system has a first insulating layer including an aromatic thermoplastic material overlying the elongate conductor and a second insulating layer including a perfluoropolymer adjacent the... Agent: Tyco Electronics Corporation

20140190725 - Dual wall slit-less dashboard grommet for vehicles: A grommet mounted on an opening through an interface within a vehicle. The interface separates a source side compartment from a receiving side compartment of the vehicle. The grommet has a first portion mounted in the surface of the interface facing the receiving side compartment. The first portion has a... Agent: Ford Global Technologies, LLC

20140190728 - Circuit board and method for manufacturing the same: The invention provides a method for manufacturing a circuit board comprising the steps of: (a) forming a through hole in a substrate; (b) providing a photo resist to cover a predetermined area adjacent to the through hole on a first surface and a second surface opposite to the first surface... Agent: Ecocera Optronics Co., Ltd.

20140190727 - Method of fabricating flexible metal core printed circuit board: A flexible metal core printed circuit board assembly comprises a flexible printed circuit board structure. The flexible printed circuit board structure includes a flexible substrate, a conductive layer on the flexible substrate and a space formed in the flexible printed circuit board structure. The space extends through the flexible printed... Agent: Starlite Led Usa

20140190729 - Flexible printed circuit: A flexible printed circuit includes a first insulating substrate layer and a first electrically conductive layer located adjacent to a first side of the insulating substrate layer. The first conductive layer has a first portion that is substantially solid and a second portion having a multiplicity of voids in the... Agent:

20140190730 - Conducting polymer nanofibers, methods of making and using same, and uses thereof: Provided are conducting polymer nanofibers, methods of making conducting polymer nanofibers, and uses thereof. The conducting polymer nanofibers can be formed by, for example, electrospinning, force spinning, and centrifugal spinning using a spinning dope. The conducting polymer nanofibers can be used in devices, such as a radiation detecting device.... Agent:

20140190731 - Quickly-mounted capacitor: A quickly-mounted capacitor consists of a capacitor (1) and a plug piece (10). The quickly-mounted capacitor is characterized in that a fixation mounting rod (22) or a screw (21) is extended from a lower end of a housing of the capacitor (1); the plug piece (10) comprises an insulating sheet... Agent: Shanghai Haoye Electric Co., Ltd.

20140190732 - Carrier device, electrical device having a carrier device and method for producing same: A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least... Agent: Osram Gmbh

20140190733 - Printed circuit board and fabricating method thereof: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in... Agent: Chongqing Founder Hi-tech Electronic Inc.

20140190734 - Shielded wireway systems: Certain embodiments of the present invention provide a duct for a shielded wireway system. The duct includes a bottom wall, two sidewalls extending from the bottom wall, and a plurality of fingers extending from each of the sidewalls. Adjacent fingers are connected by at least one bridging component. The bottom... Agent: Panduit Corp.

20140190735 - Window compatible electrical power device: A device that supplies electrical current to various outdoor locations via through-hole areas of building structures, such as window frames, door openings, etc. which includes a flatten portion with a male electrical outlet plug coupled to one end and one or more female electrical outlet(s) coupled to the other end.... Agent:

20140190736 - Radiation-curable rubber adhesive/sealant: A radiation-curable adhesive/sealant composition comprises a radiation-curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.... Agent:

20140190737 - Remote controller casing: A remote controller casing includes a front shell; a rear shell, which has an assembly means with the front shell, wherein the assembly means is coupled and fixed for the rear shell and the frond shell to develop an accommodating space to hold a printed circuit board, and the rear... Agent: Advance Security Inc

20140190738 - Electronic substrate and an electronic apparatus: An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of... Agent: Nec Corporation

20140190739 - Housing and electronic device using the housing: A housing includes a substrate made of aluminum or aluminum alloy, an anodic oxide film disposed on the substrate, and an abrasion resisting layer disposed on the anodic oxide film. The abrasion resisting layer is an alkylate silicon dioxide layer containing nano aluminum oxide powder. An electronic device using the... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

  
07/03/2014 > 58 patent applications in 32 patent subcategories.

20140182875 - Case for an electronic device: A case for a computing device and method for generating the case are described. The method includes heating a sheet above a melting temperature of a polymer. The sheet includes composite strands impregnated with a polymer. The sheet and a multi-layer film are inserted in a mold. The sheet and... Agent:

20140182876 - Screwless and seamless cover plates, receptacles, and cover plate assemblies for electrical fixtures with one or more components that attach independent of the wall finish or wallboard or optionally provide an ac or dc power conserving switch: Cover plates, receptacles, and cover plate assemblies are provided for electrical fixtures including a screwless cover plate, receptable, and/or cover plate assembly for electrical devices, wherein one or more components of the assembly (e.g, but not limited to the cover plate, mounting or strapping plate, and/or receptacle box) are provided... Agent:

20140182877 - While-in-use cover with splash guards: A while-in-use electrical box cover is provided which comprises at least one integral splash guard that covers at least one cord exit aperture for a power cord which is plugged into an electrical outlet on which the WIU electrical box cover is mounted when the WIU cover is in the... Agent: Thomas & Betts International LLC

20140182878 - Termination for electrical cables and method for manufacturing such a termination: A termination for electrical cables may include: an outer insulation tubular body having a longitudinal axis; a conductive rod within the body; an elastomeric sleeve within the body and extending about an end portion of the rod; a connecting device within the sleeve, wherein the device is mechanically and electrically... Agent: Prysmian S.p.a.

20140182931 - Connection structure for shield wire: In a connection structure for a shield wire, a shield conductor of the shield wire is fastened tightly by a shield fastening portion for a connection thereto. The shield fastening portion is provided with a plurality of holes. A wire contact surface of the shield fastening portion has: at least... Agent: Yazaki Corporation

20140182932 - Disk having an electric connecting element: A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of... Agent: Saint-gobain Glass France

20140182879 - Electrode arrangement for a dielectrically limited gas discharge: The invention relates to a flexible flat electrode arrangement for a dielectrically limited gas discharge, comprising a central region (3), an edge region, and a flat electrode (14) which conducts a high-voltage potential and which is embedded in a flat dielectric that forms an upper face (10) and a contact... Agent: Cinogy Gmbh

20140182880 - High voltage transmission line cable based on textile composite material: An electric transmission cable having a current conductive element comprising a braided core formed of a plurality of high modulus synthetic armored yarns, each yarn being of at least 53.6 tex and having a tensile strength of at least 200 cN/tex (centiNewton/tex), and the core being of a diameter in... Agent:

20140182881 - Shielded cable: A shielded cable includes a twisted cable including a plurality of electric wires each including a conductor covered with an insulation therearound, and an electrically conductive wire twisted together with the plurality of electric wires, and a strip-like member including a conductive layer and an insulating layer. The strip-like member... Agent: Hitachi Cable, Ltd

20140182882 - Thiobis phenolic antioxidant/polyethylene glycol blends: Thiobis phenolic antioxidants are efficiently dry or melt blended with a tree-resistant, crosslinkable polyethylene by first forming a blend, preferably a dry blend, of the antioxidant with a polyalkylene glycol (PAG), and then mixing the blend with the polyethylene. The incorporation of thiobis phenolic antioxidant and PAG blend into polyethylene... Agent:

20140182884 - Cable: A cable wherein it is possible to prevent a pair of conductors from coming into contact with one another by disposing an inner insulator between the pair of conductors, and to prevent damages to a power source circuit and such caused by the flow of overcurrent. A cable (100) is... Agent: Panasonic Corporation

20140182883 - Crosslinked resin compound and wire and cable using the same: A crosslinked resin compound includes a resin compound including 0.1 to 20 parts by mass of one material selected from the group consisting of monomer having an epoxy group, acid anhydride and silane coupling agent with respect to 100 parts by mass of ethylene-based copolymer, and the resin compound is... Agent: Hitachi Metals, Ltd.

20140182885 - Electrical cable assembly: In accordance with an embodiment, an electrical cable can be configured to electrically connect to contact pads that are carried by a substrate. The electrical cable can include at least one, such as a pair, of electrical signal conductors and at least one, for instance a pair, of electrically conductive... Agent:

20140182886 - Field grading layer:

20140182887 - Three-dimensional structure for wiring formation: One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring... Agent: Panasonic Corporation

20140182897 - Circuit board and method of manufacturing the same: A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on... Agent: Samsung Electro-mechanics Co., Ltd.

20140182890 - Electrical cable assembly: In accordance with an embodiment, an electrical cable can be configured to electrically connect to contact pads that are carried by a substrate. The electrical cable can include at least one, such as a pair, of electrical signal conductors and at least one, for instance a pair, of electrically conductive... Agent:

20140182891 - Geometrics for improving performance of connector footprints: In accordance with the various embodiments disclosed herein, an improved electrical connector footprint, such as on printed circuit boards (PCB), is described. For example, antipads can have a variety of sizes and pairs of differential signal traces can define centerlines that are spaced apart from each other.... Agent:

20140182889 - Multilayered substrate: Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the... Agent: Samsung Electro-mechanics Co., Ltd.

20140182895 - Multilayered substrate and method of manufacturing the same: A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending... Agent: Samsung Electro-mechanics Co., Ltd.

20140182893 - Printed circuit board: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by... Agent: Hon Hai Precision Industry Co., Ltd.

20140182892 - Printed circuit board with embedded component and method for manufactruing same: A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of... Agent: Zhen Ding Technology Co., Ltd.

20140182896 - Substrate having electronic component embedded therein and method of manufacturing the same: A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up... Agent: Samsung, Electro-mechanics Co., Ltd.

20140182888 - Touch panel: A touch panel has a substrate on which a first conductive layer, an insulating layer, a second conductive layer and a protective layer are formed in order. The second conductive layer and the first conductive layer form a touch-sensing area. The protective layer and the substrate have the same refractive... Agent: Hannstouch Solution Incorporated

20140182894 - Touch panel and manufacturing method thereof: A touch panel is partitioned into a sensing region and a circuit region and the circuit region is positioned around the edges of the sensing region. The touch panel comprises an electrode layer, a first wire layer, a second wire layer and an insulating layer. The electrode layer is disposed... Agent: Tpk Touch Solutions Inc.

20140182898 - Printed circuit board and control device for a vehicle transmission comprising the printed circuit board: The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer... Agent: Zf Friedrichshafen Ag

20140182900 - Rigid-flex printed circuit board and method for making same: An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.... Agent: Fukui Precision Component (shenzhen) Co., Ltd.

20140182899 - Rigid-flexible printed circuit board and method for manufacturing same: A rigid-flexible printed circuit board includes a first circuit substrate, a third circuit substrate, and an adhesive sheet sandwiched between the first circuit substrate and the third circuit substrate. The first circuit substrate is a rigid circuit substrate. The third circuit substrate is a flexible circuit substrate, and includes an... Agent: Fukui Precision Component (shenzhen) Co., Ltd.

20140182901 - Room temperature low contact pressure method: In one or more aspects of the present disclosure, a method is disclosed for fabricating a rigid flex cable assembly. The method includes arranging one or more layers of a polyimide film having an electrically-conductive surface into a stack; applying an adhesive to the one or more layers of polyimide... Agent: Raytheon Company

20140182902 - Circuit board with signal routing layer having uniform impedance: A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first... Agent: Hon Hai Precision Industry Co., Ltd.

20140182903 - Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board: An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene... Agent: Panasonic Corporation

20140182904 - Printed circuit board and method for manufacturing the same: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board including an adhesive promoter interposed between an insulating layer and a circuit layer on a substrate in order to improve adhesion therebetween; and a first metal layer formed between the adhesive promoter... Agent:

20140182905 - Printed circuit board and surface treatment method of printed circuit board: According to the present invention, the surface treatment of the package board or interposer board having an ultra-fine pitch (300 μm or less) may be easily implemented by a cheap process. In addition, the surface treatment of the printed circuit board may be eco-friendly performed by using the Pb-free solder,... Agent: Samsung Electro-mechanics Co., Ltd.

20140182907 - Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another... Agent: Samsung Electro-mechanics Co., Ltd.

20140182908 - Epoxy resin composition for insulating film, insulating film, and printed circuit board having the same: This invention relates to an epoxy resin composition for an insulating film, an insulating film, and a printed circuit board including the same. Particularly in a printed circuit board using a build-up process, a skin layer and a roughness are formed on the surface of the insulating film using different... Agent: Samsung Electro-mechanics Co., Ltd.

20140182906 - Interposer and packaging substrate having the interposer: An interposer is provided, including a composite body and a plurality of conductive through vias penetrating the composite body. The composite body includes at least a main layer and at least a combining layer stacked on one another. The combining layer prevents the main layer from being cracked. The combining... Agent:

20140182909 - Heat transfer device for wave soldering: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to... Agent: International Business Machines Corporation

20140182910 - Multilayer ceramic capacitor and mounting board therefor: There is provided a multilayer ceramic capacitor including: a ceramic body having dielectric layers laminated in a width direction thereof; an active region in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body while having the dielectric layer interposed... Agent: Samsung Electro-mechanics Co., Ltd.

20140182911 - Printed circuit board including embedded electronic component and method for manufacturing the same: Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a... Agent: Samsung Electro-mechancis Co., Ltd.

20140182912 - Packaging substrate: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a... Agent: Unimicron Technology Corporation

20140182913 - Packaging substrate and method of fabricating the same: A packaging substrate is provided, including a substrate body and conductive pillars. The substrate body has a first surface and a second surface opposite to the first surface. The first surface has a plurality of first conductive pads, and the second surface has a die attach area and a peripheral... Agent: Unimicron Technology Corp.

20140182915 - Circuit board and method for manufacturing the same: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer... Agent: Samsung Electro-mechanics Co., Ltd.

20140182916 - Circuit board and method of manufacturing the same: The present invention relates to a circuit board, which can miniaturize a conductor pattern formed around a via and improve current pass characteristics of the via at the same time by including a via passing through an insulating layer to be in contact with an upper conductor pattern and a... Agent: Samsung Electro-mechanics Co., Ltd.

20140182917 - Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit board: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such... Agent: Ibiden Co., Ltd.

20140182918 - Method of manufacturing module and terminal assembly: A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of... Agent: Murata Manufacturing Co., Ltd.

20140182914 - Universal serial bus hybrid footprint design: A universal serial bus hybrid footprint design is described herein. The design includes an outer row of one or more surface mount technology (SMT) contacts and an inner row of one or more printed through holes (PTH). The hybrid footprint design enables a data through put of at least 10... Agent:

20140182919 - Printed circuit board and method for manufacturing the same: Disclosed herein is a printed circuit board, including: a base substrate; a first insulating layer formed on the base substrate; a first via formed on the base substrate and formed to penetrate through the first insulating layer; a first plating layer formed to surround an upper part of the first... Agent: Samsung Electro-mechanics Co., Ltd.

20140182920 - Wiring substrate: A wiring substrate includes a first wiring layer with a wiring pattern and a metal foil. A first insulating layer includes a first through hole having a first end facing the metal foil and a second end. A second wiring layer includes a first opening having a diameter smaller than... Agent:

20140182921 - Wire harness: A wire harness includes an electric wire, a braided shield covering the electric wire, an annular electromagnetic wave absorption component that includes a through-hole for inserting electric wire and absorbs electromagnetic wave emitted from the electric wire, and a movement-restricting member for restricting the electromagnetic wave absorption component from moving... Agent: Hitachi Metals, Ltd.

20140182922 - Wire harness: A wire harness includes a plurality of electric wires, a first wire holding portion for holding one of both end portions of the plurality of electric wires, a second wire holding portion for holding another of the both end portions, and an annular electromagnetic wave absorption component arranged between the... Agent: Hitachi Metals, Ltd.

20140182923 - Multiple-layered electromagnetic shielding: An apparatus for electromagnetic compatibility (EMC) shielding, the apparatus comprising a first EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. A second EMC shield with a plurality of substantially parallel interconnected finger elements spaced apart from one another. The first EMC shield... Agent: International Business Machines Corporation

20140182924 - Thermally conductive emi suppression compositions: An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic... Agent: The Bergquist Company

20140182925 - Shield-can and jig for manufacturing shield-can: There is provided a shield-can, including a plate including a circular through-hole formed therein for exposing a lens part, a plurality of side walls extended from edges of the plate and forming an inner space together with the plate, an anti-reflection layer stacked on an upper surface of the plate,... Agent: Samsung Electro-mechanics Co., Ltd.

20140182926 - Electronic device: There is provided an electronic device includes a casing; a substrate which is arranged inside the casing, and provided with a fixation hole; a fixation member which is integrally formed with the casing, and inserted into the fixation hole of the casing, and positioned therein so that an outer periphery... Agent: Panasonic Corporation

20140182927 - Electronic device with indicating device: An electronic device includes a mounting plate, a front panel, and an identifier film. A mounting bracket is mounted on the mounting plate. An indicating device is secured in the mounting bracket. The front panel is secured on the mounting plate. The front panel defines a light emitting hole aligned... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20140182928 - Sealing element and connecting housing having a sealing element: A sealing element for sealing a cable inserted into a connecting housing, having a passage opening for the cable to pass through, is disk-shaped having at least one first disk having substantially u-shaped circumference, and a second disk having a substantially u-shaped circumference and resting on the first disk. The... Agent: Phoenix Contact Gmbh & Co. Kg

20140182929 - Cable management apparatus: A cable management apparatus includes a plate and a cable management clip. The plate defines an opening for a plurality of cables extending therethrough. The cable management clip is connected to an edge of the opening. The cable management clip includes a blocking piece. A width of blocking piece is... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20140182930 - Switchgear bus support bushing structure: A bushing structure for switchgear includes first and second separate support structures (30, 32) each having surfaces defining at least one opening (48). The support structures are coupled together so that the openings define a passage (49) through the bushing structure and so that a slot (50) is defined between... Agent: Abb Technology Ag

  
06/26/2014 > 44 patent applications in 31 patent subcategories.

20140174780 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a first wall, a second wall, a moving portion, a flexible cable, and a first contact portion. The moving portion is located between the first wall and the second wall. The cable comprises a curving portion between the first wall and the... Agent: Kabushiki Kaisha Toshiba

20140174781 - Electrical junction box: A convenient electrical juncture box will be used to repairing a broken household electrical wire, or to connect new wires to multiple locations. It provides all components that need for repairing job in a package. The package will include a conductor unit installed on a base structure, a cover box... Agent:

20140174782 - Press-fit busbar and busway employing same: A busbar for use in a busbar assembly, the busbar having an elongate body portion structured to be generally disposed about, an in contact with an elongate inner component, the body portion being formed from a conductive material.... Agent: Universal Electric Corporation

20140174783 - Cable protection and guide device: A cable protection and guide device, which prevents abrasion of the cable skin of a cable or the like and holds the position of a multi-joint link with high precision, is provided. The multi-joint link includes a link member and a holding member attached to the link member for holding... Agent: Tsubakimoto Chain Co.

20140174784 - Wire harness: A wire harness for which an exterior member can be maintained in a desired shape is provided. A flexible, tubular corrugated tube (16) which covers electric wires (18) and a route keeping tape (17) which is more difficult to extend or buckle in the widthwise direction than the corrugated tube... Agent: Yazaki Corporation

20140174819 - Cable assembly: A cable assembly helps organize and consolidate a plurality of cables, adapters, and connectors, which transmit power. The plurality of cables includes insulated conductors used to carry electricity. Each cable includes an associated terminal end for joining the cable to a device or to another cable assembly. A pair of... Agent:

20140174820 - Connecting structure of pressure attaching terminal to electric wire and connecting method of pressure attaching terminal to electric wire: In a connecting method of a pressure attaching terminal to an electric wire, the pressure attaching terminal includes first and second electric wire connecting parts having U shapes and having a bottom plate part and one pairs of electric wire caulking pieces. When the electric wire is a single core... Agent: Yazaki Corporation

20140174821 - Method of retaining a solder material to a solder terminal and the solder assembly formed thereby: The instant disclosure relates to a method of retaining a solder material onto a solder terminal comprising: a solder terminal and a solder material. The solder terminal includes a first surface, a second surface and a side, and is formed with a retaining hole. The solder material includes a winding... Agent: Chief Land Electronic Co., Ltd.

20140174822 - Waterproof seal for electrical assemblies: A waterproof seal for electrical assemblies having conductive wires attached to a metal contact and inserted into a connector body. The conductive wires and metal contact are coated with solder to fill the gaps. The space between the soldered wires and the connector body are filled with an epoxy. The... Agent: Dsm&t Company, Inc.

20140174823 - Method for sleeve retaining a solder material onto a terminal unit: The present disclosure relates to a method of sleeve retaining a solder material onto a terminal unit comprises of steps. In order to achieve the steps, a structure is also disclosed which comprises: a terminal unit and a solder material wherein the terminal unit possess a fixing portion while the... Agent: Chief Land Electronic Co., Ltd.

20140174785 - Rov cable insulation system: A ROV cable insulation system is provided having insulated electric conductors, sheathed drain wires, screen tape, and outer protection. The screen tape includes a polymeric semiconductive tape.... Agent:

20140174786 - Injection molding device for wrapping wires with three-color spiral insulation layers and three-color wires: The present invention discloses an injection molding device for wrapping wires with three-color spiral insulation layers and three-color wires. The injection molding device comprises: a spinning block, a fixed mould, and a handpiece that are coaxially mounted. Each of the axes of these three components is provided with a center... Agent: Lorom Precision Industry (shen Zhen) Co., Ltd.

20140174787 - Insulator for high-voltage gas insulated switch gear: An insulator for a gas insulated device and method of making and/or producing the insulator are disclosed. The insulator includes an injection molded insulator disc and a conductor. The insulator disc includes a center opening encompassed by an inner bead inside which the conductor is arranged. The insulator disc includes,... Agent: Abb Research Ltd

20140174788 - Sensing electrode structure and touch panel employing the same: An embodiment of the present disclosure provides a sensing electrode structure comprising a plurality of first axial electrodes and a plurality of second axial electrodes. The second axial electrodes and the first axial electrodes are formed on same side of a substrate and are electrically insulated from each other. Each... Agent:

20140174789 - Touch panel and fabrication method thereof: The present disclosure relates to a touch panel, and more particularly, to a kind of touch panel which actualizes various touch response functions on a same surface and a fabrication method thereof. The touch panel includes an upper cover substrate, a first electrode array, a patterned mask layer, and at... Agent:

20140174790 - Wiring substrate: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and... Agent: Yazaki Corporation

20140174791 - Circuit board and manufacturing method thereof: A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the... Agent: Unimicron Technology Corp.

20140174794 - Heat radiating substrate and manufacturing method thereof: A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation... Agent: Samsung Electro-mechanics Co., Ltd.

20140174792 - Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the same: This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a... Agent: Samsung Electro-mechanics Co., Ltd.

20140174793 - Printed circuit board and method for manufacturing the same: Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the... Agent: Samsung Electro-mechanics Co., Ltd.

20140174795 - Printed wiring board, printed circuit board, and method for manufacturing printed circuit board: A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed... Agent: Canon Kabushiki Kaisha

20140174796 - Flexible printed circuit board and electronic device: A flexible printed circuit board having a copper foil character with good visibility and without copper foil pattern peeling. The flexible printed circuit board has a base material having optical transparency, a wiring pattern formed on one surface of the base material; a first opaque cover lay film covering a... Agent: Canon Kabushiki Kaisha

20140174797 - Build-up film structure, circuit board manufactured using the same, and method for manufacturing circuit board using the same: Disclosed herein is a build-up film structure including: a core layer containing a resin and an inorganic filler; a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer; and a second adhesive layer covering... Agent: Samsung Electro-mechanics Co., Ltd.

20140174798 - Metal core substrate and method of manufacturing the same: Disclosed herein are a metal core substrate and a method of manufacturing the same. The method of manufacturing a metal core substrate includes: forming a metal layer into which connection bridges are inserted; laminating an insulating layer and a copper foil on an upper surface and a lower surface of... Agent: Samsung Electro-mechanics Co., Ltd.,

20140174801 - Conductive material and process: A conductive ink comprises nanosilver particles, and adhesion promoters, in which no binders, such as polymers or resins, are used in the compositions. In one embodiment the adhesion promoters are oxydianiline and 4,4-(1,3-phenylenedioxy)dianiline.... Agent: HenkelIP& Holding Gmbh

20140174800 - Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component: There is provided an embedded multilayer ceramic electronic component, including a ceramic body including dielectric layers, first internal electrodes and second internal electrodes disposed to face each other with the dielectric layers interposed therebetween, a first external electrode electrically connected to the first internal electrodes and a second external electrode... Agent: Samsung Electro-mechanics Co., Ltd.

20140174799 - Touch electrode device: A touch electrode device includes first electrode lines and second electrode lines formed on a transparent substrate. An insulating block is disposed at a junction between a first conductive connecting portion of the first electrode line and a second conductive connecting portion of the second electrode line. At least one... Agent: Henghao Technology Co. Ltd

20140174802 - Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same: A halogen-free resin composition includes (A) 100 parts by weight of naphthalene epoxy resin; (B) 10 to 100 parts by weight of styrene maleic anhydride copolymer; and (C) 30 to 70 parts by weight of DOPO-containing bisphenol F novolac resin. The halogen-free resin composition includes specific ingredients, and is characterized... Agent: Elite Electronic Material (kunshan) Co., Ltd

20140174803 - Wiring substrate and multi-piece wiring substrate: A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of... Agent:

20140174804 - Electrical device package structure and method of fabricating the same: A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical... Agent: Unimicron Technology Corp.

20140174806 - Multilayer ceramic capacitor and board for mounting the same: There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of electrodes formed to be alternately exposed to both end surfaces of the ceramic body; an upper cover layer; a lower cover layer having a thickness greater than that of the upper cover... Agent: Samsung Electro-mechanics Co., Ltd.

20140174805 - Printed circuit board and method of manufacturing the same: Disclosed herein is a printed circuit board, including: a base substrate; a non-photosensitive insulating layer formed on the base substrate; a circuit pattern formed on the base substrate and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer; and a dam made of a photosensitive... Agent: Samsung Electro-mechanics Co., Ltd.

20140174807 - High density organic bridge device and method: Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal... Agent:

20140174808 - Reduced capacitance land pad: A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may... Agent:

20140174809 - Circuit board and method of manufacturing the same: Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and... Agent: Samsung Electro-mechanics Co., Ltd.

20140174810 - Printed circuit board and method of manufacturing the same: Disclosed herein are a printed circuit board (PCB) and a method of manufacturing the same. The PCB includes a core layer, metal bumps embedded in the core layer, one surface of the metal bumps being opened to the outside, and a solder resist layer including an opening is manufactured by... Agent: Samsung Electro-mechanics Co., Ltd.

20140174811 - Printed circuit board and manufacturing method thereof: Disclosed herein are a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board according to an exemplary embodiment of the present invention includes forming an insulating layer for a circuit pattern protection on a base substrate having a predetermined circuit pattern on at... Agent: Samsung Electro-mechanics Co., Ltd.

20140174812 - Method and apparatus for far end crosstalk reduction in single ended signaling: A method of reducing crosstalk. The method may include forming a first contact over a first vertical conductor. The method may include forming a second contact over a second vertical conductor. The method may include forming a third contact over a third vertical conductor. The method may include forming a... Agent:

20140174813 - Noise dampening energy efficient tape and gasket material: A noise dampening tape and gasket material for reducing or preventing unwanted electromagnetic interference from escaping or entering an enclosure. The noise dampening gasket includes an inner core section, a carbon material layer surrounding the inner core section, an insulating layer surrounding the carbon material layer, and a metal shield... Agent: Tangitek, LLC

20140174814 - Electromagnetic interference shield and electronic device using the same: An electromagnetic interference shield includes a shell body and a magnetic material layer formed on the shell body. A number of holes are defined in the shell body. A number of through holes are defined in the magnetic material layer aligned with the holes. An electronic device having the electromagnetic... Agent: Hon Hai Precision Industry Co., Ltd.

20140174815 - Cable assembly having quick-locking connector and premise wiring systems utilizing same: Embodiments of the present invention generally relate to a cable assembly for adapting to a premise wiring system, whereby the cables utilized therewith comprise quick-locking connectors thereon. In one embodiment of the present invention, a cable assembly comprises a first cable having a cable portion and a connector on a... Agent:

20140174816 - In-wall extension apparatus: Various embodiments of the apparatus and/or methods are described for routing power to a wall-mounted appliance, particularly for routing electrical wiring and audio/video cabling up through a wall to power and communicate with a wall-mounted presentation device. The apparatus and systems include input and output enclosures with wiring therebetween and... Agent: Dish Network L.L.C.

20140174817 - Electronic box, particularly for internet access and/or for video decoding: r

20140174818 - Connector member including a locking element: A connector member includes a coupler portion having a wall including a first end that extends to a second end that defines a connection zone. The wall includes an outer surface. A mounting portion is provided at the first end. The mounting portion includes one or more cantilevered beam elements... Agent: Remy Technologies, L.L.C.

  
06/19/2014 > 32 patent applications in 24 patent subcategories.

20140166328 - Communication wire: The present invention relates to an improved insulated conductor with a low dielectric constant and reduced materials costs. The conductor (12) extends along a longitudinal axis and an insulation (14, 14<1>) surrounds the conductor (12). At least on channel (16, 16<1>) in the insulation (14, 14<1>) extends generally along the... Agent: Adc Telecommunications, Inc.

20140166329 - Dry-type transformer arc resistant enclosure having pressure relief structure: An enclosure for a dry-type transformer includes a bottom wall, a plurality of sidewalls coupled to and extending from the bottom wall, and a top wall coupled to the sidewalls so as to be spaced from the bottom wall. The top wall includes an opening therein. The bottom wall, sidewalls... Agent: Abb Technology Ag

20140166330 - Temporary fixation boss and electrical junction box: A temporary fixation boss includes: a shaft portion; a flared portion; and claw portions. The shaft portion has a diameter smaller than a diameter of an insertion hole. The flared portion is provided at one end of the shaft portion in a manner to be flared in multi steps from... Agent: Yazaki Corporation

20140166331 - Electronics module: An electronics module includes a module housing having a base structure and a plurality of side walls. A module cover contacts the side walls and is connected to the module housing via at least one fastener. The module housing includes at least one fastener boss for receiving the at least... Agent: Continental Automotive Systems Us, Inc.

20140166332 - Housing element for a control device housing: This invention relates to a housing element (10) for a control unit housing (1) comprising one or more first edge sections (11) for contact with a second edge section (21) of a second housing element (20) allocated to the control unit housing (1) with the intermediate layer of the sealant... Agent: Zf Friedrichshafen Ag

20140166333 - Multifunctional and configurable wall plates: Multifunctional and configurable wall plate systems are provided and has a vertical base panel for a first utility, the vertical base panel operable for (i) releasably attaching to a wall surface, and (ii) positioning parallel, or substantially parallel, to the wall surface during a use of the wall plate. The... Agent: Upwell Products, LLC

20140166358 - Wire harness: A wire harness includes a wire harness main body having at least one electric wire and a protective member formed by formed by hot pressing a non-woven member in a state where the non-woven member covers at least a portion of the wire harness main body. The protective member includes... Agent: Sumitomo Wiring Systems, Ltd.

20140166359 - Method and device for coating the junction area betwen at least two elongated elements, in particular between electric cables: A method of coating the junction area between elongated elements, in particular between electric cables. This method includes the steps of: arranging a rigid tubular support having two axially separable tubular halves; mounting an elastic tubular sleeve in an elastically radially expanded condition on an outer surface of the support;... Agent: Pirelli Cavi E Sistemi Energia S.r.l.

20140166334 - Coaxial cable and method of construction thereof: A coaxial cable and method of construction thereof are provided. The coaxial cable includes an elongate central conductive member; a dielectric insulative layer encasing the central conductive member; an outer protective sheath, and a braided EMI shield layer including hybrid yarn sandwiched between the dielectric insulative layer and the outer... Agent:

20140166335 - Undersea cable, multilayer tape for water shielding layer of undersea cable, and method for improving fatigue characteristics of undersea cable: A power line core in an undersea cable includes a conducting member, an insulating member, a shield layer, a water shielding layer, an anticorrosion layer and the like. The insulating member is provided on an outer periphery portion of the conducting member. The insulating member is made of, for example,... Agent: Furukawa Electric Co., Ltd.

20140166336 - Armored cable with integral support: A system for providing cable support may be provided. The system may comprise a conductor core, a filler that may provide integral core support, and armor. The conductor core may comprise at least one conductor. The filler may be applied around at least a portion of the conductor core. The... Agent: Southwire Company, LLC

20140166337 - Insulating film-coated metal foil: An insulating film-coated metal foil having on one or both surfaces thereof an organic-inorganic hybrid layer containing dimethylsiloxane and a metalloxane comprising a metal other than Si. Relative to the concentration [Si]1/4t of the Si at a depth of ¼t from the surface of the organic-inorganic hybrid layer in the... Agent: Nippon Steel & Sumikin Materials Co., Ltd.

20140166338 - Fire and water resistant cable cover: The present invention relates to cable covering compositions (insulation or jacket) for wires and cables that are fire and water resistant. Significantly, the composition contains no significant amount of lead, halogen, and antimony; and is flame retardant (UL 1685 Cable Tray bum test); and has excellent mechanical and water resistance... Agent: General Cabletechnologies Corporation

20140166339 - Fire and water resistant cable: The present invention relates to lead-free, halogen-free, and antimony-free cables containing insulations made of (a) a polyolefin; (b) a maleic anhydride modified polyolefin; (c) a butadiene-styrene copolymer; (d) a non-halogen flame retardant; and (e) a silane compound. The cable contains a fire retardant tape between the conductor and the insulation... Agent: General Cable Technologies Corporation

20140166340 - Holdout devices and cover assemblies and methods incorporating the same: A cover assembly for covering an elongate substrate includes a resilient, elastically expandable sleeve member and a holdout device. The sleeve member defines an axially extending inner sleeve passage. The holdout device includes a generally tubular core mounted in the inner sleeve passage. The core defines axially opposed end openings... Agent: Tyco Electronics Corporation

20140166341 - Dust tight and water tight seal for conduit/junction box connection: A gasket system is described for use with a conduit and junction box dust-tight seal assembly. The seal assembly includes a two-piece split clamp, each clamp having a shaft portion, a flange portion, a locknut cavity portion and lip portion. The gasket system includes one or more of a shaft... Agent: Vsp Technologies, Inc.

20140166342 - Sealing device for feeding through filaments: Sealing device (100) for feeding through at least one filament (600), the sealing device (100) comprising a housing (200), said housing (200) comprises a seal block compartment (300) being laterally bounded by a front wall (310) and a back wall (320) being spaced apart and opposite to each other, and... Agent: Tyco Electronics Raychem Bvba

20140166343 - Electronic component embedded substrate and method of manufacturing electronic component embedded substrate: An electronic component embedded substrate and a method of manufacturing an electronic component embedded substrate, The substrate includes a first via passing through a part of an insulating portion of the substrate to an electrode of the electronic component, and a second via passing through a part of the insulating... Agent: Samsung Electro-mechanics Co., Ltd.

20140166344 - Multilayer substrate: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side... Agent: Murata Manufacturing Co., Ltd.

20140166346 - Ceramic substrate, and method of manufacturing the same: A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer... Agent: Ngk Spark Plug Co., Ltd.

20140166345 - Transparent conducting glass and method of manufacturing same: A transparent conducting glass includes a glass substrate and a conducting glue. The glass substrate includes a first surface and a second surface opposite to the first surface, and defines a number of strip recesses on the first surface according to a circuit route. The conducting glue is infilled into... Agent: Hon Hai Precision Industry Co., Ltd.

20140166349 - Ceramic substrate and method of manufacturing the same: A ceramic substrate is provided that includes a ceramic substrate main body having a principal surface, and a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder. The connecting terminal portion includes a copper... Agent: Ngk Spark Plug Co., Ltd.

20140166348 - Printed circuit board: Disclosed herein is a printed circuit board capable of suppressing warpage due to a difference in thermal expansion coefficients with circuit patterns in the same layer by way of forming a filling material having a thermal expansion coefficient similar to that of the circuit pattern between the circuit patterns and... Agent: Samsung Electro-mechanics Co., Ltd.

20140166347 - Printed circuit board and method for manufacturing the same: Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof.... Agent: Samsung Electro-mechanics Co., Ltd.

20140166352 - Hollow sealing structure: A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged... Agent: Nec Corporation

20140166350 - Methods for forming metallized dielectric structures: An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and... Agent: Apple Inc.

20140166351 - Multilayer ceramic capacitor and circuit board for mounting the same: A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and... Agent: Samsung Electro-mechanics Co., Ltd.

20140166353 - Electrical interconnect formed through buildup process: This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the... Agent:

20140166354 - Circuit board and manufacturing method thereof: A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer... Agent: Wistron Corporation

20140166355 - Method of manufacturing printed circuit board: Disclosed herein is a method of manufacturing a printed circuit board, the method including: (a) performing a hole processing process on one surface of a core layer to process a first via hole having a predetermined height hl; (b) performing a plating process on one surface of the core layer... Agent: Samsung Electro-mechanics Co., Ltd.

20140166356 - Bracket for connection of a junction box to photovoltaic panels: A device for attaching a junction box to a photovoltaic. The photovoltaic panel has a photovoltaic side and a non-photovoltaic side. The device includes a bracket with a first side attachable to the junction box and a second side attachable to the non-photovoltaic surface of the photovoltaic panel. A central... Agent: Solaredge Technologies Ltd.

20140166357 - Current-conducting pin for hermetic terminal: A current-conducting pin for a hermetic terminal is disclosed. A bimetallic pin includes an exterior jacket of a first metal material and an interior core of a second material. A recess is formed in at least one of the opposite ends of the pin and a sealing material is disposed... Agent: Emerson Electric Co.

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