Electricity: conductors and insulators patents - Monitor Patents
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Electricity: conductors and insulators

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
08/07/2014 > 37 patent applications in 27 patent subcategories.

20140216808 - Aerial conductor wire suspension clamp: A clamp for suspending a conductor wire with a textured surface from a transmission tower includes a restraining sleeve, a housing, and a mounting tab. The restraining sleeve is made of upper and lower sleeve pieces that define a sleeve cavity to encase the conductor wire. The sleeve cavity has... Agent:

20140216778 - Holdout devices and cover assemblies and methods incorporating the same: A cover assembly for covering an elongate substrate includes a holdout device and a resilient, elastically radially expanded sleeve member. The holdout device includes a core having an axially extending slit defined therein and defining a core passage to receive the substrate, and a designated target region. The sleeve member... Agent: Tyco Electronics Corporation

20140216812 - Wire harness with protective member: A wire harness includes one or more conducting paths, a protective member that is formed in a pipe shape, and accommodates the one or more conducting paths in the protective member to shield a electromagnetic wave emitted from the one or more conducting paths. The protective member is formed of... Agent: Yazaki Corporation

20140216813 - Conductive interface for a light adjustment sheet: Embodiments of an apparatus for connection to a light adjustment sheet and conductive interfaces for connection to a light adjustment sheet are described. In one embodiment, an apparatus for connection to a light adjustment sheet include a power source interface configured to be connected to a power source and a... Agent:

20140216779 - Charging cable accommodation device and vehicle: A charging stand includes: a charging cable provided with a connector connected to a vehicle; a holding unit to hold the connector; and a reel to wind the charging cable automatically when the connector is placed on the holding unit. A vehicle includes: a charging cable provided with a plug... Agent: Toyota Jidosha Kabushiki Kaisha

20140216814 - Swaging structure for metallic members and bus bar using the same: A swaging structure for metallic members includes a metallic plate having a hole portion, and a disc-shaped conductive member which is fitted in the hole portion and fixed to the metallic plate by swaging a circumference of the hole portion. The metallic plate includes a groove portion provided in at... Agent:

20140216780 - Multiple electrical source housing: A busway is described herein that is configured for receipt of plural power sources. The busway device comprises a first plurality of busbars in a spaced apart relationship, with the width, thickness, and spacing of the busbars configured for receipt of a first power source. The first plurality of busbars... Agent:

20140216781 - Signal transmission line and cable: A cable and a signal transmission line applied to Universal Serial Bus (USB) are provided. The cable includes a host connector, a device connector and the signal transmission line. The host connector is selectively electrically coupled to a host. The device connector is selectively electrically coupled to a device. The... Agent: Sercomm Corporation

20140216782 - Headline sonar cable: The structure (34, 134) of the cable (20, 120) retains conductivity upon stretching of the jacket layer (52) surrounding the structure (34, 134) that lengthens the cable (20, 120). For one embodiment of the method a conductor (20) wrapped around a rod (24) and enclosed within a sheath layer (32)... Agent:

20140216783 - Micro-wire pattern with offset intersections: A pattern of electrically connected micro-wires comprises a plurality of micro-wires arranged in an intersecting pattern forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion is non-visually resolvable by the human... Agent:

20140216786 - Lead electrode and preparation method thereof: A lead electrode and a preparation method thereof are provided. The lead electrode includes an inner terminal, a lead, and an outer terminal, which are sequentially connected. The lead includes: an insulating substrate; an adhesive material coated on the insulating substrate, the adhesive material defining a trenched mesh; and a... Agent: Nanchang O-film Tech. Co., Ltd

20140216784 - Making a conductive article having micro-channels: A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 μm. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in... Agent:

20140216785 - Patterned transparent conductive film: A patterned transparent conductive film is disclosed in the present invention, which includes a substrate, a first conductive layer, a second conductive layer, both the conductive layer includes a conductive area and an insulating area, the conductive area includes a metal mesh formed by a plurality of metal lines; the... Agent: Nanchang O-film Tech. Co., Ltd.

20140216787 - Printed circuit board and fabrication method thereof: A method for forming a printed circuit board is disclosed. A substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region is provided. A first circuit is formed on the substrate. An insulating layer is... Agent:

20140216788 - Double-layered transparent conductive film and manufacturing method thereof: A double-layered transparent conductive film includes: a first substrate; a first imprint adhesive layer formed on the first substrate, the first imprint adhesive layer defining a first mesh-shaped groove, the first mesh-shaped groove forming a first mesh; a first conductive layer including conductive material filled in the first mesh-shaped groove;... Agent: Nanchang O-film Tech. Co., Ltd.

20140216789 - Substrate structure: A substrate structure includes a heat dissipating plate and a wiring board. The heat dissipating plate includes at least two inward gaps which are symmetrical to each other and disposed at corners of the heat dissipating plate. The wiring board includes a conduction sheet and an insulation sheet. The conduction... Agent:

20140216790 - Conductive micro-wire structure with offset intersections: A conductive micro-wire structure includes a substrate and a plurality of micro-wires formed on or in the substrate in an intersecting pattern and forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident... Agent:

20140216793 - Method of manufacturing a printed circuit board or a sub-assembly thereof as well as printed circuit board or a sub-assembly thereof and use thereof: c

20140216792 - Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereof:

20140216791 - Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate: An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active... Agent: Thin Film Electronics Asa

20140216795 - Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method: In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11)... Agent: At & S Austria Technologie & Systemtechnik Aktiengesellschaft

20140216796 - Multilayer wiring substrate: To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a... Agent: Ngk Spark Plug Co., Ltd.

20140216794 - Printed wiring board and method for manufacturing printed wiring board: A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor... Agent: Ibiden Co., Ltd.

20140216797 - Conductive article having micro-channels: A conductive article includes a substrate having a micro-channel. A metal nanoparticle composition is formed in the micro-channel. The metal nanoparticle composition includes silver nanoparticles and a polymer having both carboxylic acid and sulfonic acid groups.... Agent:

20140216799 - Conductive film forming method, copper particulate dispersion and circuit board: An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film... Agent: Ishihara Chemical Co., Ltd.

20140216798 - Copper particulate dispersion, conductive film forming method and circuit board: The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more... Agent: Ishihara Chemical Co., Ltd.

20140216800 - Wiring board with built-in electronic component: A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the... Agent: Ibiden Co., Ltd.

20140216801 - Method of manufacturing component-embedded substrate and component-embedded substrate manufactured by the same: A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body... Agent: Meiko Electronics Co., Ltd.

20140216802 - Substrate structure and the process manufacturing the same: The present invention discloses a package substrate layout design to achieve multiple substrate functions for engineering development and verification. The substrate layout contains a connection structure to connect to a plurality of power/ground domains on the package substrate. With different combination of the cutting lines on the package substrate, the... Agent:

20140216803 - Conductive component and preparation method thereof: A conductive component is disclosed in the present invention, which includes an insulating layer and a metal mesh laid on the insulating layer, the metal mesh defines a plurality of voids arranged in array, a relationship of the aperture ratio K of the voids of the metal mesh, the optical... Agent: Shenzhen O-film Tech Co., Ltd.

20140216804 - Transparent conductive film: A transparent conductive film includes a substrate defining a mesh-shaped groove, which forms a mesh; and a conductive layer formed by conductive material filled in the mesh. An edge line of the mesh-shaped grooves is a curve or a polyline which increases a contact area between the conductive material and... Agent: Nanchang O-film Tech. Co., Ltd.

20140216805 - Braid and wire harness: A braid for a wire harness includes a plurality of element wire bundles, each of which is formed of a plurality of element wires, and the plurality of element wire bundles being braided into a tubular shape. Each of the plurality of element wire bundles includes a metal element wire... Agent: Yazaki Corporation

20140216806 - Emi gaskets with perforations: According to various aspects, exemplary embodiments are disclosed of EMI shields, such as EMI gaskets. In an exemplary embodiment, the gasket includes a body of indefinite length. The gasket also includes a base with a generally flat outer surface, an upright portion extending generally upwardly away from the base, and... Agent: Laird Technologies, Inc

20140216807 - Electromagnetic shielding gasket and manufacture method thereof: The present invention provides an electromagnetic shielding gasket and a method for making the same, wherein good electrical conductivity and magnetic diffusivity are achieved by electroplating a layer of Co/Ni alloy according to an appropriate ratio on an open-cell foam, and the gasket can accomplish shielding function for electrical field... Agent: 3m Innovative Properties Company

20140216809 - Side wall bracket for cable tray: A cable tray and at least one side wall bracket secured to the cable tray is disclosed. The cable tray has a plurality of transverse and longitudinal wires. The side wall bracket has an upper loop with a first end and a second end. Curved portions extend from the first... Agent: Panduit Corp.

20140216810 - Motor vehicle door lock housing: A motor vehicle door lock housing comprising at least one outwardly facing recess (2) for receiving electric strip conductors (3) and with passages (4) in the recess (2) for connecting the strip conductors (3) to the housing interior, wherein the strip conductors (3) together with at least one strip conductor... Agent: Kiekert Aktiengesellschaft

20140216811 - Low-profile strain relief and cable retention: A strain relief and cable retention assembly for retaining a cable to a casing includes an anchor made of a flexible material. An internal bore along an axis of the anchor is sized to fit an outer jacket of the cable. Tabs extend away from the bore along axes perpendicular... Agent:

07/31/2014 > 37 patent applications in 27 patent subcategories.
07/24/2014 > 40 patent applications in 26 patent subcategories.

20140202726 - Power supply enclosure and method of manufacturing the same: In a power supply enclosure and a method of manufacturing the same, the power supply enclosure is divided into an independent top cover, an independent bottom base, as well as two independent side panels. The top cover, the bottom base, and the side panels are formed by blanking After extruded... Agent: Chicony Power Technology Co., Ltd.

20140202727 - Devices with selectable mounting and related assemblies and kits: A power conditioner assembly includes: first and second brackets and a power conditioner. Each bracket includes a rear portion adapted to attach to a rear portion of an equipment rack and a front portion that extends frontwardly. The power conditioner includes a housing having a rear panel, a first side... Agent: Wirepath Home Systems, LLC D/b/a Snapav

20140202763 - Shielding structure and wire harness: A shielding structure includes a conductive resin molded product, and a non-metallic fiber braid which is formed in a tubular shape by using multiple ultrathin strands made of conductive non-metallic fibers. A distal end of the non-metallic fiber braid is welded to the conductive resin molded product in the shielding... Agent: Yazaki Corporation

20140202762 - Wire harness: A wire harness includes one or a plurality of electrically conducting paths and a tubular braided wire which is made from a plurality of fine element wires and which covers the one or plurality of electrically conducting paths. The element wires are conductive and made of non-metallic fibers. Terminals of... Agent: Yazaki Corporation

20140202764 - Thermally isolating hermetic electrical feed-through: A moisture-sealing and thermally-isolating miniature implement for terminating a mineral-insulated and metal-sheathed cable and connecting it to a power source, includes a hollow contact prong protruding from one axial end of a metallic heat-sink barrel penetrated from an opposite end by the steel sheath of a heating element cable. The... Agent:

20140202765 - Underground modular high-voltage direct current electric power transmission system: High capacity (10 GW, for example) passively cooled non-superconducting underground high voltage direct current electric power transmission lines (100) of very low loss (1% per 1,000 km, for example) and competitive cost. The transmission lines (100) include segment modules (101) linked together with compliant splice modules (102) between the segments... Agent:

20140202728 - Ground connection structure for shield wire: There are provided: a shield projecting portion (4A) being a part of a shield layer (4) of a shield wire (1) projected outside of an exterior covering (5) to be exposed; an annular member for grounding (10, 10A, 10B) disposed in a position surrounding an outer circumference of the shield... Agent: Yazaki Corporation

20140202729 - Multi-core cable: A multi-core cable 1 includes plural shielded electric wires 10 for signal transmission. The plural shielded electric wires 10 are bundled so as to make contact with the adjacent shielded electric wires 10, and sheaths 14 of the plural shielded electric wires 10 are respectively removed at the same position... Agent: Sumitomo Electric Industries, Ltd.

20140202731 - Enameled flat wire: There is provided an enameled flat wire, in which a flat wire conductor having a rectangular cross section composed of four flat surfaces and four rounded corners has an enamel coating with a predetermined thickness for electrical insulation. In the enameled flat wire, a difference in a thickness of the... Agent: Hitachi Metals, Ltd.

20140202730 - Soft dilute-copper alloy insulated twisted wire and coil: A soft dilute-copper alloy insulated twisted wire includes a plurality of insulated wires twisted together and each including a conductor and an insulating cover layer thereon. The conductor includes a soft dilute-copper alloy wire including a soft dilute-copper alloy material including an additional element selected from the group consisting of... Agent: Hitachi Metals, Ltd.

20140202732 - Power cable design: Through the use of a multi-ply insulation layer, the resulting power cable retains the water tree or electrical tree resistance of generally-used tree-retardant power cables even though a conventional polymer insulation composition substantially replaces the tree-retardant polymer composition. An improved process that takes advantages of the multi-ply system is also... Agent:

20140202733 - Method of manufacturing non-firing type electrode: A method of manufacturing a non-firing type electrode comprising steps of: (A) applying a conductive paste on a substrate; (B) heating the applied conductive paste at 50 to 350° C. to form an electrode; and (C) pressing the electrode at 10 to 1000 kN/m2 of plane surface pressure or at... Agent: E I Du Pont De Nemours And Company

20140202734 - Transparent conductive film, method of manufacturing the same, and touch panel having the same: Provided are a transparent conductive film, a method of manufacturing the same, and a touch panel having the same, the transparent conductive film including: a transparent film; and a conductive layer formed on one surface of the transparent film, wherein the conductive layer includes a linear interconnecting structure layer and... Agent: Lg Innotek Co., Ltd.

20140202736 - Lead frame and a method of fabrication thereof: Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar... Agent:

20140202735 - Method of manufacturing non-firing type electrode: A method of manufacturing a non-firing type electrode comprising steps of: (A) applying on a substrate a conductive paste comprising, (a) a conductive powder comprising, (i) a first conductive powder having Young's modulus of 60×109 Pa or higher; and (ii) a second conductive powder having Young's modulus of 5×109 to... Agent: Ei Du Pont De Nemours And Company

20140202737 - Adhesive varnish, adhesive film and wiring film: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate... Agent: Hitachi Metals, Ltd.

20140202740 - Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are... Agent: Ngk Spark Plug Co., Ltd.

20140202738 - Nanostructure transparent conductors having high thermal stability for esd protection: Disclosed herein are transparent conductors having high thermal capacity and improved protection against electrostatic discharge.... Agent: Cambrios Technologies Corporation

20140202739 - Printed wiring board having metal layers producing eutectic reaction: A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer.... Agent: Fujitsu Limited

20140202741 - Component built-in board and method of manufacturing the same: A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface... Agent: Fujikura Ltd.

20140202742 - Two-sided laser patterning on thin film substrates: Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.... Agent: Cambrios Technologies Corporation

20140202744 - Conductive composition and conductive film: Provided is a conductive film having a high conductivity in which electric resistance is less likely to increase, and a conductive composition for forming the same. The conductive composition includes an elastomer component, a fibrous carbon material having a fiber diameter of less than 30 nm, and a flake-like carbon... Agent: Tokai Rubber Industries, Ltd.

20140202745 - Conductive composition and conductive film: Provided is a conductive composition that has a high conductivity and from which a coating can be formed easily. Also provided is a conductive film that has a high conductivity and in which electric resistance is less likely to increase even during expansion. A conductive composition is prepared by including... Agent: Tokai Rubber Industries, Ltd.

20140202743 - Printed circuit board and method for manufacturing the same: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of... Agent: Lg Innotek Co., Ltd.

20140202746 - Composite copper wire interconnect structures and methods of forming: Various embodiments include interconnect structures and methods of forming such structures. The interconnect structures can include a composite copper wire which includes at least two distinct copper sections. The uppermost copper section can have a thickness of approximately 1 micrometer or less, which inhibits surface roughening in that uppermost section,... Agent:

20140202747 - Circuit board and manufacturing method thereof: A circuit board and a manufacturing method thereof are provided. The manufacturing method includes the following steps. A substrate having a first surface and a second surface opposite to each other is provided. A first circuit layer is formed on the first surface. A stress is applied to the first... Agent: Elites Electronics Corp.

20140202748 - Printed circuit board having metal bumps: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer... Agent: Samsung Electro-mechanics Co., Ltd.

20140202749 - Resin composition for forming ink-receiving layer and ink-receiving base, printed matter and conductive pattern produced by using the resin composition: An object of the present invention is to provide a resin composition for forming an ink-receiving layer that is capable of forming a printed image having excellent printing properties and water resistance, both in the case of use of a water-based ink and in the case of use of a... Agent: Dic Corporation

20140202750 - Multilayer substrate module: A multilayer substrate module includes a multilayer circuit substrate, a mounting land, and an input/output terminal. Inside the multilayer circuit substrate, a wiring line that connects the mounting land and the input/output terminal to each other, an inductor that defines a portion of the wiring line, a first ground conductor... Agent: Murata Manufacturing Co., Ltd.

20140202751 - Paddle card with improved performance: A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair... Agent: Molex Incorporated

20140202752 - Wiring board and design method for wiring board: A wiring board includes a first wiring line and a second wiring line formed on a substrate, a first land and a second land respectively formed at a connection portion of the first wiring line and the second wiring line. A second wiring line has a longer wiring length than... Agent: Fujitsu Limited

20140202753 - Z-directed delay line components for printed circuit boards: A Z-directed signal delay line component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed delay line component is housed within the thickness of the PCB allowing other components to be mounted over it. The... Agent: Lexmark International, Inc.

20140202754 - Micro electronic component structure: A micro electronic component structure includes an insulating body, at least one conductive through hole, at least one conductive material, and at least one micro terminal. The insulating body has a top surface and a bottom surface. The conductive through hole penetrates the top surface and the bottom surface. The... Agent: Dawning Leading Technology Inc.

20140202755 - Receptacle cage, receptacle assembly, and transceiver module assembly: In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an... Agent: Yamaichi Electronics Co., Ltd.

20140202756 - Braid and wire harness: A braid having a function as an exterior member as well as an electromagnetic shielding function is provided. Also, a wire harness including such a braid in a configuration is provided. A braid is used for a wire harness cabled to a hybrid vehicle. Also, the braid is formed by... Agent: Yazaki Corporation

20140202757 - Electrical shielding material composed of metallized stainless steel monofilament yarn: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical... Agent: Micrometal Technologies, Inc.

20140202758 - Adjustable ring for junction boxes: An adjustment device to accommodate different wall thicknesses for use with a junction box having a front face with an opening therein comprises an assembly and a sleeve. The assembly comprises a plate, a collar extending forwardly from the front face of the plate, and a releasable retainer supported by... Agent:

20140202759 - Protection for implanted gold surfaces: An implantable device includes an exterior gold surface and a thin film disposed on the exterior gold surface and forming a barrier between the exterior gold surface and an implanted environment, in which the thin film includes molecules with a head portion, the head portion attached to the exterior gold... Agent: Advanced Bionics Ag

20140202761 - Cable restrain device with dual-material double wedge chuck: A chuck for a cable fitting includes multiple segments substantially forming a ring shape. Each segment of the multiple segments includes a first tapered surface on a distal end, wherein the first tapered surface slopes from the distal end away from a central axis of the ring, and a second... Agent: Thomas & Betts International, LLC

20140202760 - Electrical cable restrain device using a double wedge chuck: A cable fitting includes a gland nut, a body, and a chuck. The gland nut includes first threads, an axial gland bore, and a first sloped surface along a portion of the axial gland bore. The body includes second threads to receive the first threads, an axial body bore, and... Agent: Thomas & Betts International, Inc.

07/17/2014 > 24 patent applications in 21 patent subcategories.

20140196932 - Use of a mixture comprising a hydrofluoroolefin as a medium-voltage arc-extinguishing and/or insulating gas and medium-voltage electrical device comprising same: P

20140196924 - Dielectric element for a high-voltage insulator with great traction strength: A dielectric element (2) for a high-voltage insulator (1) of very great traction strength, greater than 700 kN, of the type comprising a toughened glass body of revolution about a longitudinal axis (A) having a hollow head (6) extended by a ribbed shed (7). It has a profile that defines... Agent:

20140196926 - Metallic floor box with non -metallic riser with flange: An in-floor electrical floor-box assembly includes a rectangular metallic housing and a non-metallic riser with integral flange assembly having a rectangular flange that mates with the rectangular housing and an integral cylindrical riser for providing access to the electrical components through a round cover and finish flange. A low-voltage divider... Agent: Hubbell Incorporated

20140196925 - Power distribution box having interlocking support modules: A power distribution box may include a first support module having interconnectable elements provided on a plurality of sides thereof, and a second support module having interconnectable elements provided on a plurality of sides thereof. An interconnectable element on the first support module may be interconnected with an interconnectable element... Agent: Lear Corporation

20140196927 - Bus bar insulator: An assembly through which at least one bus bar extends includes bus bar-mounting openings. Insulators are positioned at each of the insulator-mounting openings. Each insulator includes a mounting member having contoured edges. A bus bar holding opening extends through the mounting member. Mounting openings are provided on the mounting member.... Agent: Tyco Electronics Corporation

20140196929 - Corrugated tube provided with passage maintenance member, and wire harness: A passage restricting member is attached to a corrugated tube. This corrugated tube includes a corrugated tube, a passage maintenance member, and an attachment member. The passage maintenance member is die-molded so as to maintain a shape in which at least a portion is curved in the longitudinal direction, and... Agent: Sumitomo Wiring Systems, Ltd.

20140196928 - Wiring distribution system and apparatus: A system and apparatus for the distribution of wiring is provided. The present invention includes an anchor that may be attached to a wall, ceiling or floor. A routing channel connected to the anchor may route wiring from a power source to at least one conduit extension. The conduit extensions... Agent:

20140196947 - Glazing: A glazing is provided comprising at least one ply of glass having an electrically conductive component connected to an electrical connector by a soldered joint. The solder has a composition comprising tin and silver, preferably 98Sn2Ag. The solder is lead-free. The connector is nickel plated and comprises copper, preferably 99... Agent: Pikington Group Limited

20140196930 - High temperature wire insulation: An insulated wire for high temperature applications features a conductor and a protective outer shell layer. A bonding layer is positioned between the conductor and the protective outer shell layer. The bonding layer secures the protective outer shell layer to the conductor.... Agent: Harbour Industries LLC

20140196931 - Grommet: A grommet includes a resin inner assembled to a grommet main body composed of a rubber or elastomer, a seal lip provided in the grommet main body to press against an outer surface of a body panel, and an engagement tab provided in the resin inner to engage with a... Agent: Sumitomo Wiring Systems, Ltd.

20140196933 - Method for fabricating thin sheets of glass: Fabrication of thin sheets of glass or other substrate material for use in devices such as touch sensor panels is disclosed. A pair of thick glass sheets, typically with thicknesses of 0.5 mm or greater each, may each be patterned with thin film on a surface, sealed together to form... Agent: Apple Inc.

20140196934 - Wiring substrate and electronic device: A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat dissipation member disposed in the insulating base, the heat dissipation member partially exposed from the insulating base,... Agent: Kyocera Corporation

20140196935 - Ceramic substrate and process for producing same: A ceramic substrate includes a substrate body formed of ceramic and having a pair of surfaces each assuming a rectangular shape as viewed in plane, and a metallization layer formed on the surface of the substrate body and adapted to braze a metal frame thereon. A composite material layer is... Agent:

20140196936 - Multilayer ceramic capacitor, mounting board therefor, and manufacturing method thereof: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic... Agent: Samsung Electro-mechanics Co., Ltd.

20140196937 - Multi-layered capacitor and circuit board mounted with multi-layered capacitor: Disclosed herein is a multi-layered capacitor, including: an element formed by alternately multi-layering a dielectric layer and an internal electrode; and external terminals disposed at both ends of the element, wherein the dielectric layer disposed at an upper end U and a lower end L of the element is formed... Agent: Samsung Electro-mechanics Co., Ltd.

20140196938 - Lead frame: A lead frame includes a plurality of unit lead frames arranged in a matrix. Leads of adjacent ones of the unit lead frames are connected via a connecting bar, in which a longitudinal connecting bar and a transverse connecting bar are crossed at a crossing part. The lead frame further... Agent: Mitsui High-tec , Inc.

20140196939 - Wiring board: To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a... Agent:

20140196940 - Through mold via relief gutter on molded laser package (mlp) packages: Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets... Agent: Qualcomm Incorporated

20140196941 - Optimized via cutouts with ground references: The present disclosure relates to a method of optimizing via cutouts, including selecting a geometry of a via cutout on a first ground reference layer adjacent to a first differential trace, the geometry selected to provide an extension region extending in the direction of the first differential trace. Additionally, the... Agent: Fujitsu Limited

20140196942 - Electromagnetic wave shielding member: An electromagnetic wave shielding member includes a dielectric layer, first conductor plates arranged on one surface of the dielectric layer, and second conductor plates arranged opposed to the first conductor plates on the other surface of the dielectric layer, wherein the first and second conductor plates are arranged at regular... Agent: Panasonic Corporation

20140196943 - Resilient adherent emi shielding member: In order to prevent EMI leakage from various openings formed in module-receiving receptacles, a flexible, conductive shield member is provided. The shield member may have multiple layers but includes at least a conductive layer and an adhesive layer. The adhesive layer permits the shield member to be applied to an... Agent: Molex Incorporated

20140196944 - Method for producing a receptacle for a sensor element: A method for producing a receptacle for a sensor element, such as a combustion chamber pressure sensor, includes introducing a first amount of a pre-ceramic substance into an injection mold, forming a base layer of the receptacle by molding the pre-ceramic substance in the mold, and applying at least one... Agent: Robert Bosch Gmbh

20140196945 - Terminal box, solar cell module with terminal box, and method for manufacturing solar cell module with terminal box: A terminal box includes a terminal box main body (M), a terminal plate (3) to which a lead wire (2) introduced in the terminal box main body (M) is coupled, and a fixed portion (4) that secures at least the terminal plate (3) to the terminal box main body (M).... Agent: Sharp Kabushiki Kaisha

20140196946 - Module for a braking system, such as a coil box module comprising a housing and a connector: The present invention relates to a braking system module, such as a coilbox, comprising a housing and a connector. The connector includes a connector body and contact elements defining a connection interface for electrically connecting the braking module with a plug connector. The present invention provides a braking module that... Agent: Tyco Electronics Belgium Ec Bvba

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