|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulatorsBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/05/2015 > 29 patent applications in 22 patent subcategories.
20150034354 - Wiring harness: A wiring harness includes a conduit member which accommodates therein one or a plurality of conductor lines, and an identifying portion colored in a predetermined color and given a predetermined thickness and a non-identifying portion defined as a portion where the identifying portion is not provided circumferentially, the identifying portion... Agent: Yazaki Corporation
20150034381 - Hybrid cable with flat power conductors: A cable reduces loop inductance by changing the cross-sectional shape of the conductive elements of power supply and return conductors to something other than the traditional circular cross sectional shape, e.g., to a thin generally rectangular shape. The power supply and return conductors are also controlled in placement along the... Agent: Andrew LLC
20150034382 - Wiring harness: A wiring harness includes one or a plurality of conductor lines and a conduit member which accommodates therein the conductor line or lines, an identification in a predetermined color being applied to an outer surface of the conduit member. A resin identifying portion is formed on the outer surface of... Agent: Yazaki Corporation
20150034355 - Method and apparatus for mounting solar panels: Solar panel array with a plurality of solar panels on support system attached at corners or off such corners for foundation structure needs and irregularities secured to roof by lag bolt with mount channel and flashing pre-assembled into mount by crimp for positive seal and mount riser height adjustable can... Agent: J2l Consulting, LLC
20150034356 - Spacer assemblies for a cable backplane system: A cable backplane system includes a backplane having a plurality of openings and mounting locations with guide holes and a datum surface. A cable rack is coupled to the backplane. The cable rack includes a tray having a frame and spacer assemblies coupled to the tray. The spacer assemblies are... Agent: Tyco Electronics Corporation
20150034357 - Enclosure for a cable connection: The present invention is directed to an enclosure for protecting a cable connection. The enclosure includes a sealing member contained within an inner shell. The sealing member is secured around the cable connection by slideably engaging a rigid outer shell over the inner shell. The inner shell has an external... Agent:
20150034358 - Data cable: A data cable with at least two conductors for a differential transmission of data signals as well as a casing which surrounds the conductors. Each of the conductors has a conductor shield. The invention further relates to a use of such a data cable, wherein asymmetrical data signals are also... Agent: Rosenberger Hochfrequenztechnik Gmbh & Co. Kg
20150034359 - Electric insulation cable with shield: There is provided an electric insulation cable with shield, including: conductors; an insulating layer provided on an outer periphery of the conductors; a braided shield provided on an outer periphery of the insulating layer; and a sheath provided on an outer periphery of the braided shield, wherein the sheath is... Agent: Hitachi Metals, Ltd.
20150034361 - Crosslinkable thermoplastic polyurethane: The TPU of this invention contains unsaturation in its polymeric backbone. The unsaturation can be present in the soft segment or in the hard segment or in both the soft and hard segments of the TPU. The TPU can be molded like a thermoplastic, and can be subsequently crosslinked by... Agent:
20150034360 - Insulated wire, electrical equipment, and method of producing an insulated wire: An insulated wire, containing: a conductor; a foamed insulating layer; and an unfoamed filled layer on the outer circumference of the foamed insulating layer, in which the filled layer contains a partial discharge resistant material, which insulated wire has all of high partial discharge inception voltage, resistance to partial discharge,... Agent:
20150034362 - Grounding electrical connector: An electrical connector includes a base member and first and second legs extending outwardly from the base member. A first recess is defined by the first and second legs for receiving a support. Second recesses extend inwardly from second sides of the first and second legs. A plurality of pairs... Agent:
20150034363 - Slot design for flexible and expandable system architecture: An apparatus includes a printed circuit board including a connector footprint comprising a first footprint portion operative to receive a first connector portion and a second footprint portion operative to receive a second connector portion. The first footprint portion is compliant with a first communications link type and the first... Agent:
20150034366 - Circuit board: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface... Agent:
20150034364 - Flexible printed circuit board and method for making same: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening... Agent: Fukui Precision Component (shenzhen) Co., Ltd.
20150034365 - Method for manufacturing wiring board and wiring board: A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer is covering the conductive pattern and exposing a conductive pad portion of the conductive pattern, applying microwave plasma on the wiring... Agent: Ibiden Co., Ltd.
20150034367 - Power module substrate, power module substrate with heat sink, and power module: A power module substrate including an insulating substrate, a circuit layer formed on one surface of the insulating substrate, and a metal layer formed on the other surface of the insulating substrate, wherein the circuit layer is composed of copper or a copper alloy, one surface of this circuit layer... Agent:
20150034368 - Electrode element using silver nano-wire and manufacturing method thereof: An electrode element using a silver nano-wire and a manufacturing method thereof are provided, according to which the electrode element has reinforced bonding of wire unit structures with low-temperature heat treatment and easily applicable as a polymer substrate, while improving haze phenomenon, deteriorating adhesion force of silver nano-wire layer, surface... Agent: Korea Advanced Institute Of Science And Technology
20150034369 - Resin composition for printed wiring boards: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a... Agent: Mitsubishi Gas Chemical Company, Inc.
20150034371 - Structure for microelectronic packaging with bond elements to encapsulation surface: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond... Agent: Invensas Corporation
20150034370 - White color coating layer-formed touch screen panel and white color coating layer vacuum coating method of touch screen panel: Disclosed is a white costing layer-formed touch screen panel. The coating layer includes a glass substrate, a white coating layers selectively formed on an edge portion of the glass substrate, a black color coating layer selectively formed on an edge portion, and a transparent conductive layer formed on the glass... Agent:
20150034372 - Circuit board: A circuit board for preventing pins of inserting components from being short-circuited during the welding process welding is provided. The circuit board includes an insulating base board comprising a base plate and at least one column of via set on the insulating base board. A plurality of copper foil rings... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd
20150034374 - Printed wiring board and method for manufacturing printed wiring board: A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite... Agent: Ibiden Co., Ltd.
20150034373 - Wiring structure and manufacturing method thereof: A wiring structure includes a substrate, a convexoconcave absorption layer including a convexoconcave portion on the substrate, a conductive layer pattern on at least a concave portion of the convexoconcave absorption layer, and an insulating layer pattern over the conductive layer pattern and the convexoconcave absorption layer, on at least... Agent: Nec Corporation
20150034375 - Circuit board assembly with pads and connection lines having same resistance value as the pads and impedance matching method: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same... Agent:
20150034376 - Printed circuit board structure: A printed circuit board (PCB) structure comprises two signal layers with and a ground layer sandwiched between the two signal layers, and at least two adjacent vias. Each of the signal layers comprises a plurality of signal traces. The via through the PCB structure is used for connecting signal traces... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd
20150034377 - Glass core substrate and method for manufacturing the same: Disclosed herein are a glass core substrate and a method for manufacturing the same. According to an embodiment of the present invention, there is provided the glass core substrate including: a glass core laminate including a glass layer and insulating layers which are stacked on upper and lower portions of... Agent: Samsung Electro-mechanics Co., Ltd.
20150034378 - Printed wiring board: A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate on the opposite side, and a through-hole conductor formed in the penetrating hole and connecting... Agent: Ibiden Co., Ltd.
20150034379 - Cable magnet ring: A cable magnet ring of adjustable length and able to include anti-EMI magnets of different strengths includes a bracket and a number of pairs of magnetic blocks. The bracket includes a first connecting member and a second connecting member detachably mounted to the first connecting member. The magnetic blocks are... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20150034380 - Housing wall screw connection for an electrical plug-in connector: A sealing wall grommet for a wall of an electrical device, comprising a flange-like installation sleeve for receiving a plug part having electrical contacts, to which there can be connected in a plug-in manner a mating plug part which has a securing screw-in sleeve that can be screwed to the... Agent:01/29/2015 > 33 patent applications in 21 patent subcategories.
20150027773 - Electric power transmission cable particularly for an overhead line: The invention concerns an electric power transmission cable, particularly for an overhead power line, comprising at least one central composite ring (1) formed of fibres impregnated by a matrix, of which the specific breaking strength is greater than 0.4 MPa·m3/kg and at least one layer of conductive wires (3) nested... Agent:
20150027776 - Electric wire holding structure: An electric wire holding structure includes an electric wire holder, an electric wire holder attached portion, and an engaging portion. The electric wire holder holds and arranges a part of a plurality of electric wire and includes a rotation shaft at one end in a direction perpendicular to an extending... Agent: Yazaki Corporation
20150027778 - Method for producing wire harness, and wire harness: A method for producing a wire harness includes hot pressing a first portion including an edge portion of a nonwoven material, and curing the first portion of the nonwoven material, and thereafter partially overlapping the first portion and a second portion that is softer than the first portion and is... Agent: Sumitomo Wiring Systems, Ltd.
20150027777 - Method of connecting an electrical terminal to an electrical wire cable and a wire harness assembly manufactured according to said method: A method of connecting an electrical wire cable having a plurality of uninsulated wire strands to an electrical terminal is presented. The method includes the steps of crimping an electrical wire cable within a crimping feature of an electrical terminal having wire strands protruding from the crimping feature and fusing... Agent:
20150027746 - Shielded electrical cable: A shielded electrical cable is disclosed. The cable includes a plurality of conductor sets that extend along the length of the cable and are spaced apart from each other along the width of the cable. Each conductor set includes one or more insulated conductors, and first and second shielding films... Agent:
20150027747 - Foam insulated conductors: An electrical cable comprising a conductor and a foamed insulation surrounding the conductor is disclosed. The foamed insulation has a uniform void size and an improved adhesion to the conductor. Electrical cables having a conductor thickness less than 22 mil are also disclosed.... Agent: E I Du Pont De Nemours And Company
20150027748 - Inverter surge-resistant insulated wire and method of producing the same: An inverter surge-resistant insulated wire, having at least one baked enamel layer around the outer periphery of a conductor having a rectangular cross-section, at least one extrusion-coated resin layer around the outer side thereof, and an adhesive layer having a thickness of 2 to 20 μm between the baked enamel... Agent: Furukawa Magnet Wire Co., Ltd.
20150027749 - Apparatus and method for a conductive elastomer on a coaxial cable or a microcable to improve signal integrity probing: A method and structure for improving signal integrity probing. A coaxial or a microcoaxial cable is threaded through an optional alignment substrate where the cable is used to support or align the cable or an array of cables. A conductive elastomer is placed on a cable or a microcoaxial cable... Agent: R&d Sockets, Inc.
20150027750 - Wiring board: To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring... Agent:
20150027751 - Flexible circuit board with planarized cover layer structure: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal... Agent: Advanced Flexible Circuits Co., Ltd.
20150027753 - Panel structure: A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the... Agent: Wintek Corporation
20150027752 - Printed circuit board and method of manufacturing same: A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A... Agent:
20150027754 - Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90°... Agent: Asahi Kasei E-materials Corporation
20150027755 - Transparent conductive film, substrate carrying transparent conductive film, and production method thereof: Provided is a transparent conductive film wherein an electrically conductive region is converted to an electrically insulating region more readily and rapidly than traditional conductive films and the level difference between the electrically conductive region and the electrically insulating region is smaller. The transparent conductive film has an electrically conductive... Agent: Panasonic Corporation
20150027756 - Circuit board structure for high frequency signals: A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part... Agent: Kinsus Interconnect Technology Corp.
20150027759 - Conductive element and method of manufacturing the same, wiring element, and master copy: (where Am1 is an average width of vibrations of the first wavy surface, Am2 is an average width of vibrations of the second wavy surface, Am3 is an average width of vibrations of the third wavy surface, λm1 is an average wavelength of the first wavy surface, λm2 is an... Agent:
20150027758 - Multilayer wiring substrate and manufacturing method therefor: To provide a multilayer wiring substrate which can reliably prevent removal of a via conductor and which exhibits excellent connection reliability. A multilayer wiring substrate 10 has a multilayer build-up structure in which a plurality of resin insulation layers 33 and a plurality of conductor layers 42 are alternately stacked.... Agent:
20150027757 - Pcb having glass core: Disclosed herein is a printed circuit board (PCB) including a glass core for maintaining sufficient rigidity while maintaining a thin thickness to minimize warpage. The PCB includes a glass core having upper and lower surfaces in which pattern formation grooves and through via holes are formed, a plating layer filled... Agent: Samsung Electro-mechanics Co., Ltd.
20150027762 - Printed circuit board: Disclosed herein is a printed circuit board capable of increasing reliability by decreasing stress between an insulating layer and solder balls. The printed circuit board includes: an insulating layer part including circuit patterns and connecting lands having solder balls seated thereon and including a plurality of insulating layers; a plurality... Agent: Samsung Electro-mechanics Co., Ltd.
20150027760 - Printed circuit board and manufacturing method thereof: A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the... Agent: Samsung Electro-mechanics., Ltd.
20150027761 - Printed circuit board and method of manufacturing the same: A printed circuit board includes a first seed layer, a second seed layer, and a metal layer. The first and second seed layers are disposed on a base substrate and spaced apart from each other. The metal layer covers the first and second seed layers except a first side of... Agent:
20150027763 - Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the same: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.... Agent: Samsung Electro-mechanics Co., Ltd.
20150027764 - Multilayer ceramic capacitor, method of manufacturing the same, and board having the same mounted thereon: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed within the ceramic body, having the dielectric layer interposed therebetween, wherein, on a cross section of the ceramic body in a width-thickness direction thereof, when a distance between an... Agent: Samsung Electro-mechanics Co., Ltd.
20150027765 - Nickel powder for internal electrodes, multilayer ceramic capacitor including the same, and circuit board having electronic component mounted thereon: There is provided a nickel powder for internal electrodes satisfying the following equation: 0.8≦b*D*ρ/6≦1.0 wherein a specific surface area of the nickel powder is defined as b, an average particle size of the nickel powder is defined as D, and a density of the nickel powder is defined as ρ.... Agent: Samsung Electro-mechanics Co., Ltd.
20150027766 - Printed circuit board and image forming apparatus: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be... Agent:
20150027768 - Resin composition for solder bump formation, solder bump formation method, and member having solder bumps: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at... Agent:
20150027767 - System and method for lead frame package degating: A method of forming an electronic component includes masking a lead frame to form a mask defining an exposed area, oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area, and removing the mask from the lead frame following oxidizing. A lead frame... Agent: Freescale Semiconductor, Inc.
20150027769 - Deposition by spin coating of a patterned thin layer on a substrate: m
20150027770 - Leadframe and the method to fabricate thereof: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar... Agent:
20150027771 - Composite electromagnetic-wave-absorbing sheet: A composite electromagnetic-wave-absorbing sheet comprising (a) a first electromagnetic-wave-absorbing film 10a comprising a plastic film 11, and a single- or multi-layer thin metal film formed on at least one surface of the plastic film 12, the thin metal film 12 being provided with large numbers of substantially parallel, intermittent, linear... Agent:
20150027772 - Electromagnetic shielding tool and wire harness: An electromagnetic shielding tool that includes a metallic cloth and two bracket body portions. The two bracket body portions each include two elongated portions and a coupling portion, and respectively hold a first outer edge portion and a second outer edge portion on the side opposite to the first outer... Agent: Sumitomo Electric Industries, Ltd.
20150027774 - Manual underground laying type electric equipment container system: Provided is an underground laid electric equipment container system including: a box that is laid underground in the form of an opened manhole; a box holder that comprises a horizontal frame that is coupled to an upper surface of the buried box in an sealed state and an inner vertical... Agent: Eun-jin Kang
20150027775 - Plug and socket pure gas insulated wall bushing for hvdc and uhv: The invention relates to the domains of power electronics and electric power transmission systems and concerns a new structure for wall bushings for High and Ultra High Voltage AC or DC applications. The wall bushing is remarkable as it can be assembled as a kit of two replaceable modules: a... Agent: Alstom Technology Ltd.01/22/2015 > 29 patent applications in 16 patent subcategories.
20150021063 - Differential transmission cable and multipair differential transmission cable: A differential transmission cable includes a pair of inner conductors; an insulator that separately or integrally covers the pair of inner conductors; an outer conductor disposed around the insulator; a wrapping tape wound around the outer conductor; and a drain wire disposed outside of the wrapping tape, the drain wire... Agent:
20150021085 - Cable routing assembly: The assembly includes an openworked cable raceway (11) having a base (15) and side walls (16), the assembly (10) being provided for installing along a ceiling, and including at least one curved elongated panel (12), the concave surface of which faces towards the cable raceway (11), which curved elongated panel... Agent: Legrand France
20150021086 - Methods for dulling metallic surfaces and related products: Various dulling processes for dulling metallic surfaces are disclosed to produce or render galvanized metallic surfaces less shiny. Particular embodiments of dulling galvanized metallic surfaces, such as galvanized steel, iron, and aluminum surfaces, and processes are disclosed to treat galvanized objects for color variation or enhancement while still maintaining protection... Agent: San Diego Gas & Electric Company
20150021064 - Metallic housing of electronic device and manufacturing method thereof: A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting.... Agent: Fu Zhun Precision Industry (shen Zhen) Co., Ltd.
20150021065 - Metallic housing of electronic device and manufacturing method thereof: A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks.... Agent: Fu Zhun Precision Industry (shen Zhen) Co., Ltd.
20150021066 - Housing for electronic components: The invention relates to a housing for electronic components with the housing comprising at least a front housing part and a rear housing part. The front housing part and the rear housing part are arranged to be sealed by means of a sealing gasket upon attaching the front housing part... Agent: Telefonaktiebolaget L M Ericsson (publ)
20150021090 - Terminal-attached electric wire: A terminal-attached electric wire of the invention includes an electric wire having a conductor and an electric wire cover member covering the conductor, and a crimping terminal connected to the conductor of the electric wire. The terminal-attached electric wire further includes a corrosion resistant member integrally formed with a peripheral... Agent: Yazaki Corporation
20150021089 - Wiring harness protection material and wiring harness: It is aimed to provide a wiring harness protection material utilized as a wiring harness protection member and having protection performance in a high-temperature and high-humidity environment and a wiring harness. A wiring harness 1 is formed by molding wiring harness protection materials 1 using a thermally moldable nonwoven fabric... Agent:
20150021091 - Molded splitter structures and methods for making the same: Molded splitter structures and systems and methods for manufacturing molded splitter structures are disclosed.... Agent:
20150021067 - Inverter surge-resistant insulated wire: An inverter surge-resistant insulated wire, having at least one baked enamel layer around the outer periphery of a conductor, and an extrusion-coated resin layer at the outside of the baked enamel layer, wherein a total thickness of the baked enamel layer and the extrusion-coated resin layer is 50 μm or... Agent: Furukawa Electric Co., Ltd.
20150021068 - Multi-conductor cables with spacers for conductors: Multi-conductor cables for telecommunication systems are disclosed. One multi-conductor cable may include a plurality of fiber-optic conductors and/or power conductors extending within an outer jacket in a main body portion of the cable, and extending outside of the outer jacket in a break-out portion of the cable. A break-out boot... Agent: Radio Frequency Systems, Inc.
20150021071 - Circuit board, conductive film forming method and adhesiveness improver: In a conductive film formed by photo sintering of a film composed of copper particulates, adhesiveness to a base material of the conductive film is improved. A circuit board includes a circuit including a conductive film, and a substrate. The circuit board further includes a resin layer between the substrate... Agent: Ishihara Chemical Co., Ltd.
20150021072 - Printed circuit board and manufacture method thereof: A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned... Agent: Tyco Electronics Amp Korea Ltd.
20150021069 - Printed circuit board precursor and method of manufacturing the same and flexible printed circuit board: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal... Agent: Ichia Technologies,inc.
20150021070 - Wiring board and method for manufacturing wiring board: A wiring board includes an insulation layer, and a conductive pattern formed on the insulation layer having a repaired disconnected portion. The repaired disconnected portion has a first conductive layer connecting disconnected edges of the conductive pattern and a second conductive layer covering the first conductive layer, the first conductive... Agent: Ibiden Co., Ltd.
20150021073 - Multilayer ceramic capacitor and board having the same mounted thereon: A multilayer ceramic capacitor may include: a ceramic body in which dielectric layers having an average thickness of 0.2 μm to 2.0 μm are stacked; an active layer configured to form capacitance by including first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having... Agent: Samsung Electro-mechanics Co., Ltd.
20150021074 - Printed circuit board and manufacture method thereof: Disclosed herein is a printed circuit board capable of implementing slimness by decreasing the number of entire layers through an asymmetrical build-up structure in which an electric device is embedded, the printed circuit board including: a core layer including a cavity formed therein so that an electric device is embedded... Agent:
20150021075 - Surface-mounting substrate: A surface mounting substrate for surface mounting an electronic part using a lead-free solder includes a joint portion of the substrate to which the electronic parts is joined; and a stress relaxation portion formed in a vicinity of the joint portion of the substrate.... Agent:
20150021076 - Array-type multilayer ceramic electronic component, board for mounting the same, and method of manufacturing the same: There is provided an array type multilayer ceramic electronic component including a ceramic body having a plurality of dielectric layers stacked in a length direction, a first capacitor part including a plurality of first and second internal electrodes alternately exposed through both side surfaces of the ceramic body, a second... Agent: Samsung Electro-mechanics Co., Ltd.
20150021083 - Electronic device and manufacturing method thereof: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the... Agent:
20150021082 - Multilayer ceramic capacitor and board having the same: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the... Agent:
20150021078 - Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein: There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the... Agent: Samsung Electro-mechanics Co., Ltd.
20150021079 - Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active... Agent: Samsung Electro-mechanics Co., Ltd.
20150021077 - Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein: There is provided a multilayer ceramic electronic part to be embedded in a board, including: a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; first and... Agent: Samsung Electro-mechanics Co., Ltd.
20150021080 - Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein: There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second... Agent: Samsung Electro-mechanics Co., Ltd.
20150021081 - Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the... Agent:
20150021084 - Copper clad laminate, printed circuit board, and method of manufacturing the same: Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the... Agent: Samsung Electro-mechanics Co., Ltd.
20150021087 - Self contained pre-wired device: A self contained prewired device includes a housing, at least one input port, and at least one access port. The housing is provided with a mounting plate, a lateral wall, and an insertion wall. The mounting plate and the insertion wall are connected with the lateral wall from each extremity,... Agent:
20150021088 - Connection box: A connection box for a photovoltaic module is provided and includes a housing, a diode, and a pair of connection terminals. The pair of connection terminals are electrically connected to each other through the diode, and each of the pair of connection terminals includes a base, first connection portion, and... Agent: Tyco Electronics (shanghai) Co. Ltd.,01/15/2015 > 41 patent applications in 24 patent subcategories.
20150014015 - Universal, point-mounting apparatus and method: An anchor for lightning protection systems includes a base and pad that extend over a sufficient area and a sufficient bearing length to hold in shear and in tension against the weight, shear force, and moment of cables, points, and other components of a lightning protection systems. A universal point... Agent:
20150014050 - Space dampers for four-conductors bundles: A space damper for 4-cable bundles of overhead power transmission lines is disclosed, comprising a framework (10) where—from four support arms (20a-20b) depart, at the distal ends of which there are provided clamps for fastening electric cables, said arms (20a-20c) being constrained to the framework (10) through respective dampening hinges... Agent:
20150014016 - Electric component connection unit and electric connection box: Block positioning means is provided at an insertion permission frame and a component mounting block, the block positioning means being for positioning the component mounting block with respect to an insertion permission section in a crossing direction crossing an insertion direction in which the component mounting block to which an... Agent: Furukawa Electric Co., Ltd.
20150014017 - Harness exterior protector: A harness exterior protector basically includes: a synthetic-resin-made flat bellows tube portion; and a flat straight tube portion integrally continued to the flat bellows tube portion. A round bellows tube portion may be provided instead of the flat bellows tube portion. A round straight tube portion may be provided instead... Agent:
20150014052 - Wire harness and method for manufacturing wire harness: A wire harness has a wire bundle and a covering member formed of a hot-pressed nonwoven member and covering the wire bundle. The covering member has a plurality of first portions extending in an extending direction of the wire bundle and at least one second portion extending in the extending... Agent:
20150014054 - Filler assembly for cable gland: A dispenser apparatus for a curable liquid material is disclosed. The apparatus comprises a flexible bag defining a first compartment for accommodating a first component of a curable liquid material, and a second compartment for accommodating a second component of the curable liquid material and adapted to communicate with the... Agent: Cmp Products Limited
20150014053 - Termination sleeve-equipped mi cable that does not disturb and is not affected by magnetic field: The materials used for a termination sleeve-equipped MI cable according to the present invention, including bonded portions formed with silver solder, are all non-magnetic substances, and therefore, there will be no disturbance of an external magnetic field due to the presence of a magnetic substance. Furthermore, a pair or a... Agent: Okazaki Manufacturing Company
20150014055 - Electrical grounding and structural device for dissimilar metal components: In one exemplary embodiment of the invention, an electrical grounding device for dissimilar metals is provided. The device includes a body comprising adjacent first and second plate portions, the body including a first surface formed from a first metal and an opposite second surface formed from a second metal. The... Agent:
20150014018 - Flexible flat cable for low voltage differential signaling: Disclosed is a flexible flat cable including an incision section including a cutting line, a connection section including a conductive line exposure end portion, and a transition section to connect the incision section with the connection section. Plural conductive lines are arranged with a pitch interval of 0.5 mm to... Agent:
20150014019 - 3-coaxial superconducting power cable and cable's structure: Provided are a three-phase coaxial superconducting power cable and a structure thereof. A certain space is formed between adjacent superconducting wires of a superconducting layer (disposed at an outer portion) having more superconducting wires among a plurality of superconducting layers, and another wire is disposed in the space, or the... Agent:
20150014021 - Printed circuit board: A printed circuit board comprised of a plurality of interconnected elements, wherein at least two elements to be connected of the printed circuit board are mechanically connected, particularly bonded or glued, with one another on at least one peripheral region thereof, while keeping a distance and being supported on a... Agent:
20150014020 - Wiring substrate and method for manufacturing the same: A wiring substrate includes an insulating layer, a first pad, and a solder resist layer. The first pad is embedded in the insulating layer. The solder resist layer is provided on an upper surface of the insulating layer. The solder resist layer is formed with an opening portion through which... Agent:
20150014023 - Conductive film and touch panel including the same: A conductive film may be provided that includes a base member, a first hard coating layer formed on a surface of the base member, and a conductive layer formed on the first hard coating layer. The conductive layer may include conductors composed of a nano-material forming a network structure.... Agent: Lg Electronics Inc.
20150014022 - Device components with surface-embedded additives and related manufacturing methods: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing... Agent:
20150014024 - Jumper fin: A jumper fin has a substrate and an electronic component emitting heat. The electronic component is mounted to the substrate. A first fin is in the shape of a first jumper. The first jumper is mounted to the substrate at a first pair of jumper openings. The first jumper passes... Agent:
20150014025 - Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region having a network of metal nanowires; and a second region, having a metal/metal oxide nanowire in a core shell structure.... Agent: Nuovo Film, Inc.
20150014026 - Printed circuit board and manufacturing method thereof: Disclosed herein are a printed circuit board and a manufacturing method thereof. The printed circuit board includes a rigid substrate having a solder resist applied thereon and a flexible substrate connected to the rigid substrate in order to increase productivity by simplifying a process of manufacturing the printed circuit board.... Agent: Samsung Electro-mechanics Co., Ltd.
20150014027 - Wiring board and method for manufacturing the same: A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that... Agent:
20150014030 - Composition for forming silver ion diffusion-suppressing layer, film for silver ion diffusion-suppressing layer, circuit board, electronic device, conductive film laminate, and touch panel: A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the... Agent: Fujifilm Corporation
20150014028 - Insulating film for printed circuit board and product manufactured by using the same: Disclosed herein are an insulating film for a printed circuit board, a resin coated copper (RCC), a flexible copper clad laminate (FCCL), and a printed circuit board manufactured by using the same. More specifically, the RCC, the FCCL, and the printed circuit board manufactured by using the insulating film for... Agent: Samsung Electro-mechanics Co., Ltd.
20150014029 - Photosensitive composition, hardened coating films therefrom, and printed wiring boards using same: Provided is a photosensitive composition, which comprises a carboxyl group-containing resin, a photopolymerization initiator, a photosensitive acrylate compound and a filler, wherein the filler has a refractive index of 1.5 to 1.6 and a dry coating film of the photosensitive composition shows an absorbance of at least either 0.01 to... Agent: Taiyo Ink Mfg. Co. Ltd
20150014031 - Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate having a flip region with a through-opening and bonding to a Non-conductive Film to bond to a carrier board in order to form a compound carrier board structure. Therefore, when a die is planted... Agent:
20150014032 - Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same: A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient... Agent:
20150014041 - Envelope tracking power amplifier with low impedance supply feed: There is disclosed a supply feed network for an envelope tracking power amplifier arrangement comprising a power amplifier and a voltage modulator for providing a supply voltage to the power amplifier, the supply feed network comprising: a power distribution plane arranged to connect the supply voltage from the voltage modulator... Agent: Nujira Limited
20150014039 - Insulating material, passive element, circuit board, and method of manufacturing an insulating sheet: Disclosed are an insulating material (high-k layer) which includes a fiber assembly mainly composed of a cellulose nanofiber, and an electroconductive metal material supported by the fiber assembly; and a passive element (capacitor) which includes a high-k layer which is composed of the insulating material, and an electroconductive part stacked... Agent: Osaka University
20150014040 - Multilayer ceramic capacitor and board for mounting of the same: A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and... Agent:
20150014033 - Multilayer ceramic capacitor and board for mounting the same: There is provided a multilayer ceramic capacitor includes a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other; a capacitor part formed in the ceramic body and... Agent: Samsung Electro-mechanics Co., Ltd.
20150014036 - Multilayer ceramic capacitor and board for mounting the same: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, a capacitor part formed in the ceramic body and including a first internal electrode exposed... Agent: Samsung Electro-mechanics Co., Ltd.
20150014037 - Multilayer ceramic capacitor and board for mounting the same: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers stacked in a width direction, a plurality of first and second internal electrodes, first and second lead parts having at least one space part and extended from the first internal electrode to be... Agent: Samsung Electro-mechanics Co., Ltd.
20150014035 - Multilayer ceramic capacitor and mounting circuit board therefor: There is provided a multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second external electrodes formed on end surfaces of the ceramic body; first and second terminal electrodes formed on side surfaces of the ceramic body; an active layer including a first internal electrode simultaneously connected... Agent: Samsung Electro-mechanics Co., Ltd.
20150014038 - Multilayer ceramic capacitor and mounting circuit board therefor: There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes disposed to face each other within a ceramic body, and having respective lead portions exposed to an upper surface of the ceramic body; first and second external electrodes formed on the upper surface of... Agent: Samsung Electro-mechanics Co., Ltd.
20150014034 - Printed circuit board having embedded electronic device and method of manufacturing the same: Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a... Agent: Samsung Electro-mechanics Co., Ltd.
20150014042 - Laminated electronic component: A laminated electronic component is configured such that insulator layers and conductor patterns are laminated and a coil is formed in a laminate of the insulator layers and the conductor patterns by connecting the conductor patterns among the insulator layers, where the coil includes conductor pattern pairs each composed of... Agent:
20150014043 - Printed wiring board and electric tool switch provided therewith: A printed wiring board including a connection part that is connected to a projecting portion of an external member by soldering, the connection part including a first hole in which the projecting portion is inserted, a main land to which the projecting portion is soldered, a metallic pattern that is... Agent:
20150014044 - High speed via: A method is used for designing a multilayered circuit substrate that generates a physical design layout. The physical design layout represents of at least one electrical circuit passing through a plurality of layers. Based on performance requirements of the electrical circuit, a maximum allowable stub length of a via in... Agent:
20150014046 - Multilayer circuit board: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first... Agent: Mpi Corporation
20150014045 - Sleeved coaxial printed circuit board vias: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive... Agent:
20150014047 - Method and apparatus for electromagnetic interference protection: A method and apparatus for EMI protection is disclosed. Particularly, the present invention is directed to an article of manufacture for electromagnetic interference shielding comprising a cylindrically-shaped sleeve constructed of a conductive fabric adapted to provide electromagnetic interference shielding by conducting at least a portion of electromagnetic radiation, wherein the... Agent:
20150014048 - Satellite surveilance insulation: An electromagnetic interference shield used in room construction materials for the protection from satellite surveillance that has a first surface, a second surface where the first surface and the second surface are configured to attach to each other and where the first surface and the second surface are separable from... Agent:
20150014049 - Shielding apparatus: A shielding apparatus is provided. The apparatus includes a printed circuit board including a plurality of catching parts, a shield member configured to cover the printed circuit board, and at least one shield fastening part provided in the shield member and configured to be one of fastened to and separated... Agent:
20150014051 - Electronic device: An electronic device includes a Printed Circuit Board (PCB), a housing, an inner cover, and an outer cover. The PCB mounts a first socket and a second socket thereon. The housing includes a first slot disposed to correspond to the first socket and a second slot disposed to correspond to... Agent:Previous industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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