Electricity: conductors and insulators inventions

20090277661 - Control box arrangement: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on... Agent: Pauley Petersen & Erickson

20090277662 - Electrical device, band structure and methods for sealing at least one portion of an electrical device or a circuit board hermetically: An electrical device is provided. The electrical device comprises a circuit board and a waterproof layer. The waterproof layer substantially seals at least one portion of the circuit board to prevent the short circuit after water infiltrating. Thereby, this particular structure provides superior waterproof protection for the electrical device. This... Agent: Patterson, Thuente, Skaar & Christensen, P.A.

20090277685 - Apparatus for a junction point between two electrical high-voltage cables: An apparatus is specified for a junction point between two electrical high-voltage cables which each have an electrical conductor (1, 2), an inner conductive layer which rests thereon, insulation (5, 6) which surrounds the conductive layer, and an outer conductive layer (7, 8) which rests on the insulation, as well... Agent: Sofer & Haroun LLP.

20090277663 - Insulation of conductors with improved separability from processed broken stone: The invention deals with insulation with improved separability from the processed broken stone designed as single-layer or multi-layer insulation surrounding an electric conductor where the principle is that at least one layer of the insulation is made of magnetic material and at the same time at least one layer is... Agent: Notaro & Michalos P.C.

20090277665 - Connector and cable connector for balanced transmission: A connector for balanced transmission includes a block member having input and output contact pairs formed on front and back surfaces thereof, and a relay wiring substrate having front and back surfaces with a ground layer in between, on which surfaces input contact connecting pads, output contact connecting pads, input... Agent: Ipusa, P.l.l.c

20090277664 - Transmission line with high flexibility and characteristic impedance: The present invention discloses a transmission line including a flexible flat cable, an insulating layer and a metal layer, and the insulating layer and the metal layer are formed sequentially on a surface of the flexible flat cable to change the thickness of the insulating layer, so as to change... Agent: Troxell Law Office PLLC

20090277666 - Heat-resistant resin varnish, heat-resistant resin films, heat-resistant resin composites, and insulated wire: A heat-resistant resin varnish characterized by comprising a polyamideimide resin whose terminal isocyanate group is blocked with a blocking agent and a polyamic acid, which is freed from viscosity increase even without employing any complicated step such as heating or cooling and which is easily applicable to a substrate and... Agent: Mcdermott Will & Emery LLP

20090277667 - Printed circuit board and method of manufacturing the same: A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region... Agent: Panitch Schwarze Belisario & Nadel LLP

20090277669 - Flexible printed circuitboard with anti-solder crack structure: A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and... Agent: Wpat, PC

20090277668 - Infrared emitter with flexible circuit board: An apparatus for coupling to an appliance includes an infrared emitter, and a flexible printed circuit board coupled to the emitter. The circuit board includes a first surface and a generally opposing second surface. At least a portion of the circuit board is flexible. The apparatus also includes a pair... Agent: Michael Ries

20090277670 - High density printed circuit board interconnect and method of assembly: A printed circuit board assembly having an edge joined first and second sub-circuit board is provided. The first sub-circuit board includes an edge with a stair-step profile interconnection wherein each of the stairs on the profile exposes an area of a signal layer. Each exposed portion of the signal layer... Agent: Cantor Colburn LLP - IBM Rochester Division

20090277671 - Glass pane having soldered electrical terminal connections: A glass pane having at least one electrical functional element is provided. The functional element comprises at least one electrical conductor and at least one terminal area located at an end of the electrical conductor, wherein the electrical conductor and the terminal area are formed from an electrically conductive layer... Agent: Buchanan, Ingersoll & Rooney PC

20090277672 - Method for forming metal pattern, metal pattern and printed wiring board: The present invention provides a method for forming a metal pattern comprising a step of forming a polymer layer on a substrate; (a2) a step of applying a metal ion or the like to the polymer layer; (a3) a step of forming a conductive layer by reducing the metal ion... Agent: Sughrue Mion, PLLC

20090277673 - Pcb having electronic components embedded therein and method of manufacturing the same: Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the... Agent: Staas & Halsey LLP

20090277674 - Printed circuit board and manufacturing method thereof: A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern... Agent: Staas & Halsey LLP

20090277677 - Electronic assemblies without solder and method for their design, prototyping, and manufacture: A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into... Agent: The Tpl Group

20090277676 - In-mold decoration device and manufacturing method thereof: An in-mold decoration (IMD) device and a manufacturing method thereof are provided. The manufacturing method of the IMD device includes following steps. First, a patterned film is formed. The patterned film includes a pattern layer and a film layer located below the pattern layer. A conductive layer is then formed... Agent: Jianq Chyun Intellectual Property Office

20090277675 - Substrate for mounting electronic component and electronic apparatus including the substrate: A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base 2 having groove-shaped recesses (6) in the periphery, and groove-shaped recesses (6a and 6b) in the corner and... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20090277678 - Surface mount adhesive, mounting structure including the same, and method for producing mounting structure: A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler.... Agent: Mcdermott Will & Emery LLP

20090277679 - Method of manufacturing pcb and pcb manufactured by the same: Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole;... Agent: Staas & Halsey LLP

20090277680 - Insulating film, printed circuit board substrate and printed circuit board including same: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090277681 - Expansion cross-connect enclosure: An expansion cross-connect enclosure is disclosed. The expansion cross-connect enclosure includes a housing having a front, a rear, a top, a bottom, and left and right sides, the housing having a doorway at the front. The expansion cross-connect enclosure also includes a cross-connect panel detachably connected within the housing at... Agent: Merchant & Gould PC

20090277682 - Protective structure for a circuit board and method for fabricating the same: In a protective structure for a circuit board (1) that includes a casing (3) for receiving the circuit board, the casing is provided with a recess (11) for receiving a large component part protruding from the circuit board therein, and potting material (6) is filled in a space defined between... Agent: Arent Fox LLP

20090277683 - Crash survivable memory unit: A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing. A sacrificial material is disposed... Agent: Darby & Darby P.C.

20090277684 - Mounting structure and method for mounting electronic component onto circuit board: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the... Agent: Cantor Colburn, LLP

20090272557 - Earthing system for a wind turbine connected to a utility grid and for a wind turbine park: The invention relates to an earthing system for a wind turbine connected to a utility grid. The wind turbine comprises at least one electric system such as low or high voltage power systems and cables (16), at least one control system such as a SCADA system and control cables (18),... Agent: St. Onge Steward Johnston & Reens, LLC

20090272558 - Temporary protective cover for an electrical box: A temporary protective cover for an electrical box having an open front end. In some embodiments of the invention, the cover is constructed for attachment directly to a circular type electrical box and includes a circular plate of plastic having a pair of flexible wings for use in securing the... Agent: Kriegsman & Kriegsman

20090272559 - Connection box for solar panel: A box for connecting a ribbon output conductor of a solar panel with a feed cable has a base mountable on the solar panel and formed with a first hole for the ribbon output conductor and a second hole for the feed cable, a removable cover fittable with the base... Agent: K.f. Ross P.C.

20090272576 - Vehicle high power cable fastening system and method: A cable fastening system for high power cables that operates within a heavy duty vehicle is described. The cable fastening system comprises at least three conductive high-power cables and a cable spacer. The high-power cables include a cable cross-sectional center, and a cross-sectional diameter that is similar for each cable.... Agent: Procopio, Cory, Hargreaves & Savitch LLP

20090272577 - Clad material for wiring connection and wiring connection member processed from the clad material: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder... Agent: Neomax Materials Co., Ltd. C/o Keating & Bennett, LLP

20090272560 - Conductive film and method of producing thereof: A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature... Agent: Young & Thompson

20090272561 - protective casing for a high voltage cable: A protective casing for a joint, termination or cross-connection of at least one high voltage cable. The protective casing includes a first material portion of a first metal material having good strength properties. The protective casing includes a second material portion of a second metal material which is fixedly attached... Agent: Venable LLP

20090272562 - Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method: The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness... Agent: Greenblum & Bernstein, P.L.C

20090272563 - Electronic carrier board: An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with... Agent: Edwards Angell Palmer & Dodge LLP

20090272564 - Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method: The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness... Agent: Greenblum & Bernstein, P.L.C

20090272565 - Control of carbon nanostructure growth in an interconnect structure: An interconnect structure on a substrate is provided. The interconnect structure comprises electrically conductive interconnect elements on at least two interconnect levels on or above a substrate level. In the interconnect structure of the invention, at least one electrically conductive via connects a first interconnect element on one interconnect level... Agent: Nxp, B.v. Nxp Intellectual Property & Licensing

20090272566 - Electrically conductive paste and multilayer ceramic substrate: An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range, in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit,... Agent: Dickstein Shapiro LLP

20090272567 - Electronic device and method for making the same: An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts of the first and second electronic parts, respectively. The first and second electronic parts are connected detachably and coupled electrically... Agent: Ladas & Parry

20090272568 - Microwave chip supporting structure: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises... Agent: Ericsson Inc.

20090272569 - Component assembly: A component assembly includes an electric component with a body and a carrier substrate on which the component is fixed by means of a conductive adhesive layer. External electrical contacts that have a planar surface are arranged on the lower side of the body. The conductive adhesive acts upon the... Agent: Slater & Matsil, L.L.P.

20090272570 - Protective sleeve fabricated with hybrid yarn, hybrid yarn, and methods of construction thereof: A hybrid yarn filament used in construction of a sleeve for protecting elongate members against at least one of EMI, RFI or ESD, and methods of construction of the hybrid yarn filament. The hybrid yarn filament has a non-conductive filament and at least one conductive wire filament overlying an outer... Agent: Robert L. Stearns Dickinson Wright PLLC

20090272571 - Cabling having shielding separators: Cabling is provided including a jacket surrounding a core, and a separator positioned in the core. The separator has at least one shield segment defining walls separating the core into a plurality of chambers each configured to receive a plurality of twisted wire pairs. Each shield segment includes a metallic... Agent: Robert J. Kapalka Tyco Technology Resources

20090272572 - Mounting plate and cover assembly for electrical devices: Combination mounting plate and cover assemblies for mounting an electrical outlet box on one side of a stud in a wall are provided. The mounting plate and cover assemblies are configured to receive an additional bracket and/or outlet box on an opposite side of the stud. The combination mounting plate... Agent: King & Spalding, LLP

20090272573 - Connection box for solar panel: A box for connecting an output conductor of a solar panel with a feed cable has a base mountable on the solar panel and having a generally planar floor from whose outer periphery a side wall projects perpendicularly. A cover engageable with the side wall forms with the floor and... Agent: K.f. Ross P.C.

20090272574 - Connection box for solar panel: A box for connecting an output conductor from a solar panel with a feed cable has a base mountable on the solar panel and formed with a first hole for the panel-output conductor and a second hole for the feed cable, a removable cover fittable with the base in a... Agent: K.f. Ross P.C.

20090272575 - Cable coupler for connection of armored cable having armor layer and method of holding the armor layer: Disclosed herein is a cable coupler for the connection of an armored cable having an armor layer. The cable coupler of the present invention includes a sleeve, which has an inclined surface, which is brought into contact with the armor layer of the armored cable, and a fastening ring and... Agent: Kratz, Quintos & Hanson, LLP

20090266605 - High voltage valve group with increased breakdown strength: A high voltage assembly including a valve group and a shield connected to the valve group. A resistor is connected between the shield and the valve group The assembly provides an increased breakdown strength and DC withstand level.... Agent: Venable LLP

20090266600 - High voltage dc bushing and device comprising such high voltage bushing: A high voltage DC bushing including a fluid duct with non-constant width (Δr) along the axial direction of the bushing.... Agent: Venable LLP

20090266573 - Assembly method for implantable medical device: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case.... Agent: Medtronic, Inc.

20090266574 - Safety guard apparatus for an electrical outlet: Safety guard apparatus for an electrical outlet having one or more electrical receptacles for restricting access to the receptacles by a young child. The apparatus includes a base plate having one or more openings for registry with the electrical receptacles. The base plate is mounted to the electrical outlet in... Agent: Maxey Law Offices, PLLC

20090266607 - Cable management system: A cable management system for cable management in an equipment rack includes a support bracket having a body extending between a mounting end and a distal end. The mounting end is configured to attach to the equipment rack, and the body has a tie down slot configured to receive a... Agent: Robert J. Kapalka Tyco Technology Resources

20090266575 - Electric wire for automobile: An electric wire for an automobile has a core wire section and an outer circumferential wire section. The core wire section is formed by spirally winding six element wires around one element wire, where each element wire is made of stainless steel having elongation of 30% or more and tensile... Agent: Casella & Hespos

20090266576 - Abrasion resistant electrical wire: An electrical wire having a conductor and a covering disposed over the conductor wherein the covering is made from a thermoplastic composition. The thermoplastic composition has a poly(arylene ether); a polyolefin, a block copolymer; and flame retardant. The thermoplastic composition demonstrates desirable abrasion resistance, as well as desirable tensile elongation,... Agent: General Electric Company Ge Global Patent Operation

20090266577 - Cable with offset filler: The present invention relates to cables made of twisted conductor pairs. More specifically, the present invention relates to twisted pair communication cables for high-speed data communications applications. A twisted pair including at least two conductors extends along a generally longitudinal axis, with an insulation surrounding each of the conductors. The... Agent: Merchant & Gould PC

20090266578 - Flex cable with biased neutral axis: Systems and methods for biasing a neutral axis of a flex cable in a hard drive are discussed. The hard drive comprises a flex cable, a read/write head, and a control card. The flex cable comprises a base film, adhesives, a conductive trace, a cover film, and a neutral axis.... Agent: Hitachi C/o Wagner Blecher LLP

20090266579 - Interconnector: The present invention provides a solar module with inter-connectors with improved flexibility. The flexibility is achieved by placing a fabric between the solar elements. The fabric is conductive and may be soldered or welded to the solar elements.... Agent: Birch Stewart Kolasch & Birch

20090266580 - Method for manufacturing a transparent conductive electrode using carbon nanotube films: The present invention relates to a method for preparing a transparent electrode using a carbon nanotube(CNT) film, and more particularly, to a method for preparing a transparent electrode, the method comprising the steps of forming a CNT film on a desired substrate using a dispersed solution of CNT and then... Agent: Moore & Van Allen PLLC

20090266581 - Decorative cords and cables: A cord and/or cable structure for electrical cords, extension cords, communication cables and other electrical power and/or signal carrying cords and cables that includes an outmost sheath formed with multiple integral anchoring fixtures that provide a point of connection between the cord or cable and the multiple decorative elements (such... Agent: Ober. Kaler. Grimes & Shriver Royal W. Craig

20090266583 - Photosensitive resin composition, laminate, method of producing metal plated material, metal plated material, method of producing metal pattern material, metal pattern material and wiring substrate: The invention provides a photosensitive resin composition comprising: a polymer comprising a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof so as to form a coordination bond; and at least one selected from the group consisting of a synthetic rubber, an epoxy... Agent: Moss & Burke, PLLC

20090266582 - Three-dimensional circuit board and its manufacturing method: A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode... Agent: Mcdermott Will & Emery LLP

20090266584 - Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipiating wiring board: It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having... Agent: Steptoe & Johnson LLP

20090266585 - Flame-retardant composition for solder resist and cured product thereof: There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble... Agent: Sughrue Mion, PLLC

20090266587 - Flexible printed circuit board and method of forming fine pitch therein: Provided is a method of forming a fine pitch in a flexible printed circuit board (FPCB) having an increased adhesive property of wirings and an improved insulating property between the wirings. The method includes etching regions where wirings are to be formed on a base substrate; forming conductive layers on... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.

20090266586 - Printed circuit board and semiconductor package: An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed... Agent: Sughrue Mion, PLLC

20090266588 - Multilayer printed wiring board: A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive layers include a conductive layer formed on the core substrate, and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090266589 - Process for producing metal wiring board: Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and... Agent: Knobbe Martens Olson & Bear LLP

20090266590 - Interconnect structure and method for fabricating the same: An interconnect structure includes: an interlayer insulating film formed on a lower metal layer; a contact hole formed in the interlayer insulating film to expose the lower metal layer; a plurality of carbon nanotubes formed on a bottom of the contact hole; an wiring metal filled in the contact hole... Agent: Mcdermott Will & Emery LLP

20090266591 - Prepreg and printed wiring board using thin quartz glass cloth: It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090266592 - Circuit board and method for jointing circuit board: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a... Agent: Steptoe & Johnson LLP

20090266595 - Electronic device: An electronic device has a multilayer capacitor and a circuit board on which the capacitor is mounted. The capacitor is formed in a nearly rectangular parallelepiped shape and has a first terminal electrode and a second terminal electrode arranged at respective ends thereof. On the circuit board there are a... Agent: Oliff & Berridge, PLC

20090266596 - Printed circuit board with embedded electronic components and methods for the same: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic... Agent: Snell & Wilmer L.L.P. (main)

20090266593 - Surface-mountable electronic device: A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion. The outline of this rectangular portion corresponds to a connection surface of the JEDEC Standard MO-236 or of any other... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20090266594 - Wiring substrate and method of manufacturing the same: A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090266597 - Printed circuit board preform with test facilitating means: An exemplary printed circuit board preform (20) includes at least two printed circuit board units (211), at least one boundary (201, 202) formed on the junction of the at least two printed circuit board units, and at least one conductor (206, 208) configured on a surface of the printed circuit... Agent: PCe Industry, Inc. Att. Steven Reiss

20090266598 - Wiring board: A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situated in substantially the same plane as a first surface of the resin... Agent: Ipusa, P.l.l.c

20090266599 - Circuit board with high thermal conductivity and method for manufacturing the same: A circuit board having high thermal conductivity comprises a substrate, a plurality of thermal conductive insulating layers, a patterned electrical conductive layer, a plurality of through-holes and a soldering layer. The substrate has an upper surface and a lower surface; the thermal conductive insulating layers are respectively formed on the... Agent: Bacon & Thomas, PLLC

20090266602 - Electromagnetic interference shield: This present invention is an electromagnetic interference shield, comprising a shielding cap, an insulator, and an electric conductive paste, wherein protruding edges of the shielding cap are mounted with electric conductive paste on a PCB and the insulator is placed between the shielding cap and the PCB to keep them... Agent: Pai Patent & Trademark Law Firm

20090266603 - Electromagnetic shielding device: An electromagnetic shielding device suitable for a PCB includes a cover and a conductive rubber frame. The cover is made of a conductive material and has a through hole and a containing space. The conductive rubber frame is contacted with the through hole of the cover. The conductive rubber frame... Agent: Jianq Chyun Intellectual Property Office

20090266601 - Protective cover for prevention of electromagnetism interference: A protective cover for prevention of electromagnetism interference includes a shell and a metal cladding layer. The shell is comprised of a plastic material, and includes a base plate. An edge of the base plate bends upwardly with respect to the base plate and forms an enclosure plate. At least... Agent: Hdls Patent & Trademark Services

20090266604 - Resin composition: Disclosed is a resin composition containing a hexagonal ferrite and a resin, which is characterized in that the hexagonal ferrite is contained in an amount of 50-98 parts by weight per 100 parts by weight of the total of the resin composition.... Agent: Birch Stewart Kolasch & Birch

20090266606 - Electric apparatus module: The invention provides an electric apparatus unit which can be easily assembled. The electric apparatus module includes an upper case, a lower case assembled with the upper case and having an opening, an electric apparatus unit accommodated in the upper case and the lower case, a connection unit including a... Agent: Sughrue-265550

20090260843 - High voltage bushing: A high voltage bushing including a metal part provided with a resistive layer.... Agent: Venable LLP

20090260845 - Display device, vent tube with glass ring, phosphate glass ring, and method of producing the same: The present invention reduces the amount of lead used in a display device and improves its long-term moisture resistance. This display device includes: a panel (1b) provided with a hole (11) formed therein; a phosphate glass member (13); and a tube (12) mounted on the panel (1b) via the glass... Agent: Hamre, Schumann, Mueller & Larson P.C.

20090260844 - Waterproof casing: A waterproof casing is adapted for enclosing an electronic device therein. The electronic device includes at least one operating portion. The waterproof casing includes a casing unit and at least one pliable transparent film. The casing unit includes first and second casing halves that are coupled together and that cooperatively... Agent: Choate, Hall & Stewart LLP

20090260875 - Multi-port compression connector with single tap wire access port: A compression connector is provided for securing wires electrically together but mechanically separated upon completion of a crimping operation applied to the compression connector. The compression connector includes a body portion having a first hook and a first ramp extending from the body portion, the first hook and first ramp... Agent: Panduit Corp.

20090260846 - Cable protector with removable dividers: A cable protector includes a channel recessed into, and extending along the upper surface of a base. A number of dividers can be removably inserted into the channel from above to divide the channel into a plurality of tracks for carrying cables that can be inserted from above. Alternatively, a... Agent: Dorr, Carson & Birney, P.C. One Cherry Center

20090260847 - Data transmission cable and method for producing a data transmission cable: A data transmission cable (2) comprises at least one pair of wires (4) comprising two wires (6) lying parallel to each other, each with an electrical conductor (8) surrounded by an insulation (10). The pair of wires (4) is sheathed over its length by a foil (12) with an electrically... Agent: Lerner Greenberg Stemer LLP

20090260848 - Microwires, methods for their production, and products made using them: Insulated electrically conductive continuous fibers or microwires of sizes on the order of 1 mil (25 microns) diameter, so as to be suitable for processing into yarns or multi-microwire bundles, for example, for incorporation into conformable fabric products or for use as wearable electronic circuitry are made by coprocessing a... Agent: Michael De Angeli

20090260849 - Electrical conductor and cable utilizing same: In general, a conductor is provided. A conductor includes a central element having a length, a plurality of insulated strands disposed about the central element in at least first and second concentric layers, a layer of a dielectric material having a velocity of propagation disposed around the plurality of insulated... Agent: Dorsey & Whitney LLP US Bank Center

20090260850 - Flexible flat cable assembly with improved grounding structure: A cable connector assembly includes a housing, a flexible substrate, at least one matching stratum attached on the flexible substrate for regulating the impedance of flexible substrate and a shell. The housing includes a receiving space. The flexible substrate is received in the receiving space of the housing and includes... Agent: Wei Te Chung Foxconn International, Inc.

20090260851 - Superconductive thin film material and method of manufacturing the same: A superconductive thin film material which achieves good superconductivity by preventing an element diffusion reaction and a manufacturing method of the superconductive thin film material are provided. A superconductive thin film material is provided with a substrate, an intermediate layer with one layer or at least two layers formed on... Agent: Drinker Biddle & Reath (dc)

20090260852 - Alternating core composite wire: A wire having an outer shell and a core, the core including at least a first plurality of core segments that may be made of a first core material and a second plurality of core segments that may be made of a second core material different from the first core... Agent: Baker & Daniels LLP 111 E. Wayne Street

20090260854 - Electronic circuit board: A resist opening 5a not covered with resist 4 around a through hole 2 provided through a board 1 is shaped so as to have a shape elongated in the direction of flow in flow soldering such that the surface tension acting on solder 6 upon the soldering is reduced.... Agent: Birch Stewart Kolasch & Birch

20090260856 - Electronic component module: An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plurality of bonding material applying lands includes... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090260855 - Wired circuit board assembly sheet: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating... Agent: Akerman Senterfitt

20090260853 - Wiring substrate and method for manufacturing the same: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090260857 - Heat resistant substrate incorporated circuit wiring board: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090260858 - Multi-layer circuit substrate and motor drive circuit substrate: Conducting layers and resin-made insulating layers are alternately laminated to form a laminated circuit portion, and a metal substrate is installed so as to be in contact with an insulating layer, which is the lowermost layer. The conducting layers, the insulating layers, and the metal substrate are thermal compression bonded.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090260859 - Flexible printed circuit board: A flexible printed circuit board (FPCB) includes a signal layer comprising a differential pair, a ground layer comprising a grounded sheet made of conductive material, and a dielectric layer located between the signal layer and the ground layer. A void is located on the two opposite sides of the grounded... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260860 - Flexible printed circuit board: An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260861 - Polycrystalline, magnetic ceramic material, microwave magnetic device, and non-reciprocal circuit device comprising such microwave magnetic device: A polycrystalline, magnetic ceramic material having a basic composition represented by the general formula of (Y3-x-y-zBiXCayGdz)(Fe5-α-β-γ-εInαAlβVγZrε)O12, wherein 0.4<x≦1.5, 0.5≦y≦1, 0≦z≦0.5, y+z<1.3, 0≦α≦0.6, 0≦β≦0.45, 0.25≦γ≦0.5, 0≦ε≦0.25, and 0.15 ≦α+β≦0.75 each by an atomic ratio, which is predominantly composed of a phase having a garnet structure, and sinterable at a temperature of... Agent: Sughrue Mion, PLLC

20090260862 - Circuit modification device for printed circuit boards: An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and... Agent: Schneck & Schneck

20090260864 - Circuit board and semiconductor integrated circuit module including the same: A circuit board includes a plurality of differential signal line pairs, and a plurality of electromagnetic bandgap (EBG) patterns, each configured to be disposed to overlap the plurality of differential signal line pairs, wherein the EBG patterns are electrically insulated from the differential signal line pairs.... Agent: Baker & Mckenzie LLP Patent Department

20090260865 - Micro-electromechanical system: A micro-electromechanical system (MEMS) includes a micro-electromechanical chip, a printed circuit board and a metal wire. The metal wire electrically connects the micro-electromechanical chip and the printed circuit board. A connection distance and a connection angle are defined between the micro-electromechanical chip and the printed circuit board.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260863 - Parallel test fixture for mixed signal integrated circuits: The present invention provides a parallel test fixture for mixed signal integrated circuits (ICs). The fixture includes a multi-layer printed circuit board (PCB). The fixture comprises: a test area, which is disposed on a central area of the multi-layer PCB and includes several test regions for a plurality of mixed... Agent: Squire, Sanders & Dempsey L.L.P.

20090260866 - Wiring board and method for manufacturing the same: A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in... Agent: Merchant & Gould PC

20090260867 - Printed circuit board substrate and method for manufacturing printed circuit boards using same: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260868 - Printed circuit board and method of manufacturing the same: The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the... Agent: Staas & Halsey LLP

20090260869 - High frequency digital a/v cable assembly: A high frequency digital A/V cable assembly includes a high frequency digital A/V cable, which comprises a plurality of core wires arranged in a parallel array, an insulation layer surrounding each core wire, a shielding layer surrounding the insulation layer at each core wire for isolating electromagnetic interference and an... Agent: Sure-fire Electrical Corporation

20090260870 - Adapter card electromagnetic compatibility shielding: An electromagnetic shield comprising an electrically conductive frame for establishing electrical contact between a chassis wall and an expansion card mounting bracket. The frame has a plurality of spring fingers interconnected about a perimeter of a central opening in the frame, wherein each spring finger defines a central axis that... Agent: Ibm Corporation (ss/nc) C/o Streets & Steele

20090260871 - Perforated substrates for forming housings: A housing for an electronic device as well as methods for forming the housing are disclosed. The housing can be formed from a substrate having perforations to assist in adhering components internal to the housing. The substrate is typically a multi-layer substrate having at least two layers. In one embodiment,... Agent: Technology & Innovation Law Group, PC

20090260872 - Module for packaging electronic components by using a cap: A module for packaging electronic components includes a carrier, at least one electronic component and a cap. The carrier has a first region and a second region. The electronic component is disposed on the first region of the carrier. The cap is mounted on the second region, and includes an... Agent: Lowe Hauptman Ham & Berner, LLP

20090260873 - Casing of electronic device: A casing of an electronic device has a base member, a cover, a bracket and a fastener. The base member made of a bent metal plate has a base and at least three base side walls extending upward from sides of the base. The cover is made of a bent... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090260874 - Biased air baffle for computer rack: One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle... Agent: Ibm Corporation (ss/nc) C/o Streets & Steele