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Electricity: conductors and insulators

20130112454 - Electronic device housing: A housing of an electronic device comprises an upper cover and a front panel secured to the upper cover. The upper cover includes a locking portion. The front panel includes a limiting portion corresponding to the locking portion. The locking portion includes at least one locking plate. The limiting portion... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130112453 - Structural improvement of a filter casing: The present invention relates to a structural improvement of a filter casing comprising a base and a cover. The base contains an accommodating space to install a filter module, wherein two edges of the accommodating space are respectively integrated with at least two or more fasteners that extend by leaning... Agent: Yunpen Electronic Co., Ltd.

20130112455 - Port member of superconducting accelerating cavity: Provided is a port member of a superconducting accelerating cavity, the entire size of which is reduced and which has enhanced working efficiency to achieve a lower manufacturing cost. In a pickup port (23) of a superconducting accelerating cavity, one end is joined by welding to a port portion (27)... Agent: Mitsubishi Heavy Industries, Ltd.

20130112456 - Electrical outlet cover: An electrical outlet cover that is safe, accessible/removable and aesthetically pleasing in design can be used to cover outlets in older homes that may not be up to today's electrical codes, thus improving the safety of the home. The electrical outlet cover can also prevent children or pets from accessing... Agent:

20130112457 - Wire guide member: Forward and backward movement of a wire guide member in an axial direction of the wire guide member is restricted, by the wire guide member abuts on a distal end portion holding member and a proximal end portion holding member. The wire guide member is held by an intermediate holding... Agent: Olympus Corporation

20130112474 - Electrical harness: A gas turbine engine has an electrical harness formed from a flexible printed circuit board which provides a plurality of spaced conductive tracks. The conductive tracks are grouped into plural layers of tracks, the track layers being spaced apart and extending substantially parallel to each other. The tracks of each... Agent: Rolls-royce PLC

20130112475 - Explosion-proof electrical fitting: A fitting, for terminating an electrical cable having two or more conductors, includes a substantially tubular body having a central bore configured to receive the electrical cable therethrough. A substantially tubular sealing sleeve is configured to engage a forward end of the body during assembly of the fitting to receive... Agent: Thomas & Betts International, Inc.

20130112476 - Terminal connection structure and method of manufacturing the same: A wire crimping section (11) of a terminal (10) comprises a base section (13) upon which a conductor (1) of a wire (W) is arranged; and a pair of caulking sections (14) that is formed in extension from the base section (13), and that is caulked so as to crimp... Agent: Yazaki Corporation

20130112477 - Coaxial conductor structure: The invention is a coaxial conductor structure for fault-free transmission of a TEM Mode of a HF signal wave within at least one band of frequency bands forming in the context of a dispersion relation. An inner conductor and an outer conductor are spaced radially apart from the inner conductor... Agent:

20130112458 - Device for protection of a live element mounted on a support in an electrical box: Device for protection of a live element mounted on a support in an electrical distribution box, comprising an insulative cap adapted to cover the live element and retaining means adapted to retain the protection device fixed to the support. The protection device comprises an articulated junction adapted to couple the... Agent:

20130112461 - Ceramic substrate and method of manufacturing the same: A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second... Agent: Ngk Spark Plug Co., Ltd.

20130112459 - Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate: A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing... Agent: Hitachi Chemical Company, Ltd.

20130112460 - Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate: A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire... Agent: Hitachi Chemical Company, Ltd

20130112464 - Conformal reference planes in substrates: Methods, systems, and apparatuses for circuit boards are provided herein. An electrically insulating material is formed over one or more traces on a circuit board. One or more further electrically conductive features are present on the circuit board. A layer of an electrically conductive material is formed over the one... Agent: Broadcom Corporation

20130112462 - Metal alloy cap integration: A metal interconnect structure, which includes metal alloy capping layers, and a method of manufacturing the same. The originally deposited alloy capping layer element within the interconnect features will diffuse into and segregate onto top surface of the metal interconnect. The metal alloy capping material is deposited on a reflowed... Agent: International Business Machines Corporation

20130112463 - Printed circuit board and manufacturing method thereof: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c)... Agent: Lg Innotek Co., Ltd.

20130112466 - Electronic component and method for manufacturing the same: An electronic component in which a direction identification mark can be easily formed includes a laminate including a plurality of laminated insulating material layers and a mounting surface parallel or substantially parallel to a z-axis direction. A directional coupler including a main line and a sub-line is included in the... Agent: Murata Manufacturing Co., Ltd.

20130112465 - Printed circuit boards with embedded electro-optical passive element for higher bandwidth transmission: A printed circuit board (PCB) is provided comprising a plurality of non-conductive layers with conductive or signal layers in between. The PCB includes a first conductive via traversing the plurality of non-conductive and conductive or signal layers as well as a second conductive via traversing the plurality of non-conductive layers... Agent: Sanmina-sci Corporation

20130112467 - System and method for controlling radio frequency transmissions from an electronic device: The disclosure relates to a printed circuit board (PCB) for an electronic circuit for a power amplifier of a wireless communication device. The PCB comprises: a substrate; a ground reference in the substrate; first through fourth locations and first and second pads in the substrate; and first and second electrical... Agent: Research In Motion Limited

20130112468 - Midplane especially applicable to an orthogonal architecture electronic system: A midplane has a first side to which contact ends of a first differential connector are connected and a second side opposite the first side to which contact ends of a second differential connector are connected. The midplane includes a plurality of vias extending from the first side to the... Agent:

20130112469 - Multilayer printed wiring board and manufacturing method of multilayer printed wiring board: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as... Agent: Ibiden Co., Ltd.

20130112470 - Circuit boards with vias exhibiting reduced via capacitance: The present invention relates to circuit boards and, more specifically, circuit boards with vias (i.e. via holes) exhibiting reduced via capacitance. In one embodiment, the present invention provides a circuit board comprising a first electrically conductive trace, a second electrically conductive trace, a via hole including electrically conductive material thereon,... Agent: International Business Machines Corporation

20130112471 - Printed circuit board and method of manufacturing the same: Disclosed herein is a printed circuit board and a method of manufacturing the same. The printed circuit board includes preparing a base substrate; forming a pattern layer for forming via holes on the base substrate by printing ink for forming via holes; forming an insulating layer on the base substrate... Agent: Samsung Electro-mechanics Co., Ltd.

20130112472 - Method and apparatus for reducing interference: A method and apparatus is provided for reducing interference in circuits. A management strategy is provided to reduce reference spurs and interference in circuits. The management strategy uses a combination of one or more techniques which reduce the digital current, minimize mutual inductance, utilize field cancellation, prevent leakage current, and/or... Agent: Silicon Laboratories Inc.

20130112473 - Shield member, wire harness, and method of manufacturing wire harness: A shield member includes a metal foil layer and a base layer which have flexibility and are sheet-like or band-like, a bonding layer which bonds the metal foil layer and the base layer, and a cylindrical portion and an overlapping portion which are made by winding and folding the metal... Agent: Yazaki Corporation

20130105190 - Multilayer lightning strike protection material: The present invention provides a multilayer lightning strike protection material that, owing to the most optimum arrangement of layers of components having different properties, decreases the probability of a lightning strike to the object to be protected and ensures a high lightning resistance; decreases the possibility of electrical breakdown in... Agent:

20130105191 - Electronic device: An electronic device comprises a first portion, a second portion, and a rotating mechanism. The first portion covers on the second portion. The rotating mechanism is disposed in the second portion and is used for rotatably connecting the first portion and the second portion. The first portion is rotatable relative... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130105192 - Protective cover mechanism and electronic device using same: A cover mechanism for an electronic device includes a protective cover and a support member. The support member is latched to the electronic device, and defines two slots. A plurality of projections formed in each slot. The protective cover includes a cover portion, and two axles. The axles are rotatably... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130105193 - Flexible and moldable materials with bi-conductive surfaces: A flexible, moldable material is provided with bi-conductive surfaces that can be fabricated using simple, cost-effective, and scalable deposition processes. The material is a composite structure composed of two conductive or semi-conductive sheets sandwiching a thin polymer insulator, all bonded together at their interfaces. The two functionalized sheets are made... Agent: The Regents Of The University Of California

20130105217 - Electrical harness equipped with a device to space its electrical conductors at the level of a partition passage: The object of the invention is an electrical harness having a plurality of electrically conductive elements held one against another in a braided sheath obtained by braiding strands around the electrical conductor elements, the strands being joined and forming a web around the electrical conductor elements when held against each... Agent: Airbus Operations Sas

20130105218 - Wire harness, method for transporting wire harness with device, and method for connecting devices with wire harness: When bus bars are covered with covering parts and high-voltage conducting paths are formed and further the ends of the high-voltage conducting paths are provided with a motor side connector and an inverter side connector, formation of a wire harness is completed. Since the wire harness has a shape holding... Agent: Yazaki Corporation

20130105219 - Seal member and a charging connector provided therewith: A seal member (50) is to be mounted on an end of a multi-core cable (40), in which a plurality of wires (41) are bundled together and covered with an outer sheath (42). The seal member (50) is to be accommodated into a rear housing (21) of a charging connector... Agent: Sumitomo Wiring Systems, Ltd.

20130105194 - Shielded electric wire: Herein provided is a shielded electric wire that prevents deterioration of a shielding characteristic with reduction of material costs and mass of the electric wire even when the electric wire assumes a horizontally long cross sectional wire profile. A flat shielded electric wire 11 has a plurality of sheathed core... Agent: Yazaki Corporation

20130105195 - Carbon nanotube enhanced conductors for communications cables and related communications cables and methods: A conductor for a communications cable includes an elongated metal wire and a metal sheet that includes a plurality of carbon nanotubes that at least partially surrounds the elongated metal wire. The metal wire may include copper, and the metal sheet may likewise include copper and may be welded to... Agent: Commscope Inc.

20130105196 - Edge insulation structure for electrical cable: An edge insulated electrical cable includes an electrical cable and an edge insulation structure applied to the electrical cable at the location. An apparatus for applying edge coating to a film is also disclosed.... Agent: 3m Innovative Properties Company

20130105197 - Automotive wire: The present invention is an automotive wire provided with a conductor including at least one solid wire composed of a core and a metal film that covers the surface of the core, and an insulator that covers the conductor, wherein the core is composed of carbon steel, and the metal... Agent: Fujikura Ltd.

20130105198 - Conductive rubber component and method for mounting same: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting... Agent: Fuji Polymer Industries Co., Ltd.

20130105199 - Tower for a wind turbine: The invention relates to a tower for a wind turbine and to a cable guide therefor, wherein a nacelle for the wind turbine is arranged on the tower such that it can rotate by means of the azimuth bearing about a vertical axis which runs in the longitudinal direction of... Agent: Suzlon Energy Gmbh

20130105200 - Prepreg, wiring board, and semiconductor device: An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one... Agent: Sumitomo Bakelite Co., Ltd.

20130105202 - Circuit board structure: A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.... Agent: Unimicron Technology Corp.

20130105201 - Electronic component-embedded printed circuit board and method of manufacturing the same: An electronic component-embedded printed circuit board and a method of manufacturing the same. The printed circuit board includes a base substrate including a hollow electronic component case, an electronic component inserted into the electronic component case, circuit pattern layers formed on upper and lower surfaces of the base substrate, and... Agent: Samsung Electro-mechanics Co., Ltd.

20130105203 - Flexible electronic device, method for manufacturing same, and a flexible substrate: The present invention relates to resolving issues concerning deterioration in the performance and yield of a flexible electronic device, caused by low manufacturing temperatures, high degrees of surface roughness, a high thermal expansion coefficients, and bad handling characteristics of typical flexible substrates. The method for manufacturing a flexible electronic device... Agent: Posco

20130105204 - Circuit board and method for manufacturing the same: A circuit board and a method for manufacturing the same are disclosed. The circuit board of the present invention comprises: a carrier board, wherein a first circuit layer is disposed on at least one surface of the carrier board, and the first circuit layer comprises plural conductive pads; a protein... Agent: National Tsing Hua University

20130105205 - Joined structural body of members, joining method of members, and package for containing an electronic component: According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member... Agent: Kabushiki Kaisha Toshiba

20130105207 - Transparent conductive film: There is provided a transparent conductive film which comprises: a first transparent film; a plurality of transparent electrode patterns; a transparent adhesive layer; and a second transparent film. The first transparent film and the second transparent film are laminated with the transparent adhesive layer interposed therebetween. The first transparent film... Agent: Nitto Denko Corporation

20130105206 - Transparent panel and method of manufacturing the same: There are provided a transparent panel and a method of manufacturing the same. The transparent panel includes: a transparent substrate; a conductive polymer layer formed over the entirety of a surface of the transparent substrate; and a refractive index matching layer formed in at least some regions of the conductive... Agent: Samsung Electro-mechanics Co., Ltd.

20130105209 - Inorganic filler and electric material containing the same: An inorganic filler containing (1) from 50 to 60 parts by weight of SiO2; (2) from 5 to 20 parts by weight of Al2O3; (3) from 0 to 10 parts by weight of CaO; (4) from 15 to 30 parts by weight of B2O3; (5) from 0 to 5 parts... Agent: Elite Electronic Material (kunshan) Co., Ltd.

20130105208 - Wired circuit board: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive layer, a second insulating layer, and a ground layer. The first opening of the first insulating layer is surrounded by the second opening of the second insulating layer when projected in the thickness direction, and... Agent: Nitto Denko Corporation

20130105210 - Capacitor module: A capacitor body is laterally contained in a lower holder, to be then pressed by an upper holder. A lead wire is led from the capacitor body in an axial direction, and then, bent toward a wiring board, thereby forming a leg soldered to the wiring board. The lower holder... Agent: Panasonic Corporation

20130105211 - Low cost and high performance bonding of wafer to interposer & method of forming vias and circuits: A low cost and high performance method for bonding a wafer to an interposer is provided. The technology provides designs and metallization techniques for through via glass applications that is thermal coefficient expansion matched to the glass or synthetic fused quartz substrates. An off-the-shelf glass, such as borosilicate based or... Agent:

20130105212 - Multilayer insulating substrate and method for manufacturing the same: A multilayer insulating substrate with excellent electrical characteristics and a method for manufacturing the multilayer insulating substrate. A multilayer insulating substrate is composed of a first insulating layer including first central conductor regions to constitute through electrodes and first outer conductor regions surrounding the first central conductor regions, and a... Agent: Japan Electronic Materials Corp.

20130105214 - Method for manufacturing circuit board provided with metal posts and circuit board manufactured by the method: Provided is a method for manufacturing a circuit board provided with metal posts formed on at least one surface of the circuit board, the method including preparing a substrate made of a conductive material, performing a first selective etching a first surface of the substrate in regions corresponding to insulating... Agent: Samsung Techwin Co., Ltd.

20130105213 - Packaging substrate having embedded through-via interposer and method of fabricating the same: A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with... Agent: Unimicron Technology Corporation

20130105215 - Electromagnetic shielded sleeve: An electromagnetic shielded sleeve containing a multilayer composite material formed in such a way as to define at least one longitudinal channel configured to enclose and carry a cable. The multilayer composite material contains a first textile, an electromagnetic shielding material, and a second textile, where the electromagnetic shielding material... Agent:

20130105216 - Mounting member for an electrical box assembly: An electrical assembly includes a wiring device and an insert clip or attachment member that can be preassembled to provide quick connection to an electrical box, mud ring or other support structure having an aperture with a dimension to receive the clip member. The clip member couples to the mounting... Agent: Hubbell Incorporated

20130098651 - Lightning protection structure of blade for wind power generation: A blade for wind power generation includes a lightning receptor configured to form a part of the surface of the blade, and a lightning receiving protrusion that protrudes outward from the surface of the lightning receptor. The lightning receiving protrusion is provided to a surface boundary between the blade and... Agent: The Japan Steel Works, Ltd.

20130098652 - Device housing and method for making the same: A device housing includes a main body, and a display window mounted on the main body. A mounting gap is defined between the main body and the display window. The device housing further includes a decorative member jointing with the main body and the display window and covering the mounting... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.

20130098653 - Gangable electrical box extender: An electrical box extender includes a rectangular tube having a first pair of opposing sides and a second pair of opposing sides. The first pair of opposing sides and the second pair of opposing sides form a perimeter configured to fit within a single-gang electrical box. The electrical box extender... Agent: Thomas & Betts International, Inc.

20130098654 - Base of surface-mount electronic component package, and surface-mount electronic component package: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal... Agent: Daishinku Corporation

20130098655 - New free electron wire: This invention relates to New Free Electrons Wire (4a, b), which will enable the use of electrical energy and also energy in various other forms in a loss free way at room temperature. Free Electrons confined in vacuum (4a1) at the order of 10−4 torr or more, at the core... Agent:

20130098679 - Anticorrosive polyamide resin composition, and electric wire with terminal: Provided is an anticorrosive polyamide resin composition having excellent anticorrosive capability by possessing excellent adhesive strength to a polyolefin resin and a metal and excellent elongation. The anticorrosive polyamide resin composition contains a resin component that contains 70 to 90 mass % of a polyamide resin, and 30 to 10... Agent: Sumitomo Wiring Systems, Limited

20130098680 - Earth cable connecting structure of shielded electric wire: There is provided an earth cable connecting structure of a shielded electric wire for connecting a shield layer of the shielded electric wire to an earth cable. The shielded electric wire includes an inner insulating layer covering a core wire, the shield layer provided in an outer periphery of the... Agent: Yazaki Corporation

20130098656 - Polyimide resin varnish, and insulated wire, electrical coil, and motor using same: e

20130098657 - Composite cable and method of manufacturing composite cable: A composite cable that includes plural cables connectable to respective connection portions arranged on a substrate, and an outer coat that covers the cables, the composite cable including: a position fixation portion, in which the cables are fixed in positions so as to be parallel to one another in a... Agent: Olympus Corporation

20130098658 - Electrode apparatus and method of manufacturing electrodes: A method is provided for creating an electrode node array device. First and second conductors are stamped from a stock sheet. Each of the conductors has a plurality of raised protrusions. The protrusions are interleaved in a manner in which in both directions of the array, a raised protrusion of... Agent: Neuro Resource Group, Inc.

20130098659 - Pre-plated lead frame for copper wire bonding: A pre-plated lead frame comprises a substrate comprising copper or a copper alloy which has a first side and a second side opposite to the first side. A first plating layer comprising nickel is plated on the first and second sides of the substrate and a second plating layer comprising... Agent:

20130098660 - Electric wire protection structure and method for manufacturing electric wire protection structure: An electric wire protection structure has a structure in which a branch portion of an electric wire bundle is protected. In the electric wire protection structure, a protection portion covers the branch portion of the electric wire bundle, the protection portion being formed by heating and compressing a thermoplastic material... Agent: Sumitomo Wiring Systems, Ltd.

20130098661 - Printed circuit board and layout method thereof: A printed circuit board includes a signal layer having a pair of differential transmission lines thereon. An eye width and an eye height of an eye diagram obtained at output terminals of the pair of differential transmission lines are variable according to a distance between the pair of differential transmission... Agent: Hon Hai Precision Industry Co., Ltd.

20130098662 - Method of manufacturing multi-layer circuit board, and multi-layer circuit board: A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit... Agent: Fujikura Ltd.

20130098663 - Touch panel sensor: A capacitive touch panel sensor in which waviness generated in a film furnished with a transparent electrode pattern can be small. The touch panel sensor according to the present invention includes a first film, a first transparent electrode pattern formed on the first film, a first adhesive layer laminated on... Agent: Nitto Denko Corporation

20130098665 - Flexible printed circuit board and production method of same: The present invention is a flexible printed circuit board provided with an insulating substrate and a wiring circuit provided on at least one main surface side of the insulating substrate, wherein the wiring circuit has a laminate having a first metal layer that contains first metallic crystal grains and a... Agent:

20130098664 - Resolution-adjustable touch panel and manufacturing method thereof: A resolution-adjustable touch panel and a manufacturing method thereof. The resolution-adjustable touch panel includes a substrate, a plurality of first, second, third and fourth sensor strings, and a flexible printed circuit. The flexible printed circuit board includes a plurality of first, second, third and fourth pins. The first and third... Agent: Hannstar Display Corp.

20130098666 - Resin composition for printed circuit board and printed circuit board including the same: There is provided a resin composition for a printed circuit board, including 100 parts by weight of a liquid crystal oligomer shown in a predetermined Formula; and 10 to 40 parts by weight of a rubber-modified epoxy resin.... Agent: Samsung Elelctro-mechanics Co., Ltd.

20130098668 - Conductive subtrate and method of manufacturing the same: Disclosed herein is a method of manufacturing a conductive substrate, the method including: a first electrode applying operation of applying first electrodes on a substrate; a first electrode forming operation of forming the first electrodes of fine lines by partly removing the first electrodes; and a second electrode forming operation... Agent: Samsung Electro-mechanics Co., Ltd.

20130098667 - Embedded printed circuit board and manufacturing method thereof: s

20130098669 - Wiring substrate and manufacturing method for wiring substrate: A wiring substrate includes: a plate-like base material containing carbon fibers; a wiring layer formed on a surface of the base material; a first via including a first through hole penetrating through the base material, a first resin layer formed on an inner wall of the first through hole and... Agent: Fujitsu Limited

20130098670 - Wiring substrate and manufacturing method of the same: Embodiments of the present invention provide a wiring substrate that includes a structure where a plurality of projection electrodes are arranged within an electrode formation region on a substrate main surface. At least one among the plurality of projection electrodes has a larger outer diameter than an outer diameter of... Agent: Ngk Spark Plug Co., Ltd.

20130098671 - Multiple layer printed circuit board: A printed circuit board (PCB) stack-up has a signal via configured to transmit a signal through at least two different layers of the PCB stack-up, a reference structure that is at least a portion of a return path for the signal; and an unplated via disposed in an area surrounding... Agent:

20130098672 - Safety net system: A safety net system for blocking electromagnetic field (EMF) exposure from electronic devices is provided. The safety net system comprises a hair net for covering at least a portion of a head and a body net having a back portion for covering an upper back and shoulders, a first front... Agent:

20130098673 - Metamaterial for deflecting an electromagnetic wave: A metamaterial for deflecting an electromagnetic wave is disclosed, which comprises a functional layer. The functional layer comprises a plurality of sheet layers parallel to each other, and each of the sheet layers comprises a sheet-like substrate and a plurality of man-made microstructures arranged in an array on the sheet-like... Agent:

20130098674 - Adhesive backed cabling system for in-building wireless applications: An adhesive-backed multi-channel RF signal cable comprises a main body having at least one conduit portion with a bore formed throughout and containing one or more RF signal channels, and a flange portion having an adhesive backing layer to mount the cable to a mounting surface. The adhesive-backed cabling provides... Agent: 3m Innovative Properties Company

20130098676 - Chemical vapor resistant epoxy composition: A two part, curable, epoxy composition useful for potting or sealing electrical devices for use in hazardous locations. Cured reaction products of the epoxy composition meet most or all UL 674 requirements and are useful to seal apertures in electrical equipment. Equipment sealed with the disclosed compositions can meet the... Agent: Henkel Corporation

20130098675 - Method and apparatus for application of anti-stiction coating: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an... Agent: Qualcomm Mems Technologies, Inc.

20130098677 - Distribution cabinet for optical fibre cables: The invention relates to a box (1) for accommodating and laying optical waveguides and/or copper conductors, with the box (1) comprising at least one housing (10) and at least one cover (20), with the cover (20) being attached to the housing (10) such that it can pivot, with the cover... Agent: Tyco Electronics Services Gmbh

20130098678 - Systems and methods for making and using a side-loading operating room cable of an electrical stimulation system: An operating room cable for electrically coupling a lead to a trial stimulator includes a trial stimulator connector electrically coupleable with the trial stimulator and a lead connector for receiving the lead. The lead connector includes a housing. A first lead aperture is defined in a second end of the... Agent: Boston Scientific Neuromodulation Corporation

20130092410 - Encapsulated expanded crimped metal mesh for sealing, emi shielding and lightning strike applications: A composite gasket for sealing, lightning strike protection and EMI shielding is provided. The gasket has a resilient conductive mesh sheet embedded with an elastomer gel layer. The conductive mesh is corrugated to provide a series of repeating waveforms, providing the gasket with a lower deflection force, better corrosion resistance,... Agent:

20130092411 - Receptacle for transformer: A receptacle includes an electrically insulative bottom wall, and an electrically insulative upright wall upwardly extended from the border of the bottom wall, the upright wall having a back wall portion corresponding to the rear side of the bottom wall. The bottom wall is adapted for mounting at a circuit... Agent:

20130092432 - In-situ moisture sensor and/or sensing cable for the monitoring and management of grain and other dry flowable materials: The present invention relates to an apparatus and method that permits a user to detect and report conditions within a column (or “quantity” which allows for vertical or non-vertical application of sensor cables) of dry, flowable, bulk materials within a storage facility.... Agent: Opisystems Inc.

20130092433 - Underwater apparatus: There is provided an underwater apparatus that includes a housing including a certain device, a pair of cable couplings including gimbals through which tail cables extends from the device to the outside of the housing pass, and the pair of cable couplings that connect the tail cables passing through the... Agent: Fujitsu Limited

20130092434 - Integrated shielding protector and wire harness: An integrated shielding protector and a wire harness are provided so that the man-hours concerning the wiring operation can be reduced, and the number of components also can be reduced. A conductive integrated shielding protector, including a first high voltage accommodating part, a second high voltage accommodating part and a... Agent: Yazaki Corporation

20130092435 - Electrode assembly with cooling passageway: An electrode assembly with a cooling passageway for improving electrode life expectancy and better weld quality. The electrode assembly includes an electrode body, and an electrode cap detachably coupled to the electrode body. A cooling passageway passes through the electrode assembly for carrying a cooling agent. The cooling agent enters... Agent: Ford Global Technologies, LLC

20130092436 - Method and apparatus for communicating between a cab and chassis of a truck: An apparatus for communicating between a cab and a chassis of a truck comprises a multi-conductor cable having a plurality of circuits. The multi-conductor cable is of a length to extend substantially the length of the chassis, to carry various communication functions between the cab and a distal end of... Agent:

20130092437 - Electrical wire and electrical wire with terminal: The invention relates to an electrical wire and an electrical wire with a terminal capable of diminishing the adjustment of a crimping height. There is provided an electrical wire 1 including a conductor part 11 that is made of a precipitation strengthened copper alloy having a cross-sectional area of 0.13... Agent: Yazaki Corporation

20130092412 - Connection structure of braided wire: There is provided a ground structure of a braided wire having reduced the number of parts and the number of assembling processes and having improved a shield capability. A cylindrical part that is made to stand upright from a periphery of an insertion hole toward an outside of a device... Agent: Yazaki Corporation

20130092413 - Current lead with a configuration to reduce heat load transfer in an alternating electrical current environment: A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the... Agent: Varian Semiconductor Equipment Associates, Inc.

20130092414 - Connecting structure and connecting method of insulated wires: A connecting structure includes a sheathing connecting section in which sheathed sections of a plurality of electric wires, which are sections at both sides of exposed conductor sections, are bundled together in a state of being superimposed with each other; and a conductor connecting section in which the conductor sections... Agent: Yazaki Corporation

20130092415 - Cable, method of manufacturing the same, and apparatus for depositing dielectric layer: The inventive concept provides cables, methods of manufacturing the same, and apparatuses for depositing a dielectric layer. The cable may include a first electrode, a second electrode spaced apart from the first electrode, and a dielectric layer disposed between the first and second electrodes and including a polymer having xylene... Agent: Electronics And Telecommunications Research Institute

20130092416 - Cable for high-voltage electronic devices: A cable for high-voltage electronic devices including an inner semiconductive layer, a high-voltage insulator, an outer semiconductive layer, a shielding layer, and a sheath which are provided on an outer periphery of a cable core part in the order mentioned, wherein the high-voltage insulator is made of an insulating composition... Agent: Swcc Showa Cable Systems Co., Ltd.

20130092417 - Protective sleeve for electrical components: A sleeve structure includes an electrically insulating protective sleeve having clips that retain and capture component pins and regulate a mounting distance of the electrical component from a wiring structure. A method of component wiring assembly is also included.... Agent: General Electric Corporation

20130092418 - Chip-on-film panel structure: The present invention relates to a chip-on-film panel structure, which has a panel body and fan-out leads, first metal sheets, array leads and second metal leads thereon. The array leads are disposed at two sides of the fan-out leads, the second metal sheets are disposed at two sides of the... Agent: Shenzhen China Star Optoelectronics Technology Co., Ltd.

20130092419 - Electronic component including multilayer substrate: The multilayer substrate includes: a plurality of dielectric layers stacked on one another; a first conductor pattern 20 which is disposed along a principal surface 12a of a dielectric layer 12 and which is electrically connected to a ground; and second conductor patterns 22 and 24 which are disposed along... Agent: Murata Manufacturing Co., Ltd.

20130092420 - Embedded multilayer printed circuit board and method: e

20130092421 - Flexible circuit board: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted... Agent: Nippon Mektron, Ltd.

20130092426 - Anisotropic conductive film and fabrication method thereof: An embodiment of the disclosure provides an anisotropic conductive film including an insulating substrate and a plurality of conductive polymer pillars. The insulating substrate has a first surface and a second surface. Each of the conductive polymer pillars passes through the insulating substrate and is exposed at the first surface... Agent: Industrial Technology Research Institute

20130092422 - Circuit board structure and manufacturing method thereof: A circuit board structure includes a core circuit structure, a first and a second dielectric layers, a first and a second conductive blind via structures, a third and a fourth patterned circuit layers, and a first and a second surface passivation layers. The first and the second dielectric layers have... Agent: Subtron Technology Co., Ltd.

20130092423 - Method for forming conductive circuit: A conductive circuit is formed by printing a pattern using a conductive ink composition and heat curing the pattern. A thixotropic agent, typically carbon black is added to the solvent-free ink composition comprising an addition type silicone resin precursor, a curing catalyst, and conductive particles. The ink composition has such... Agent:

20130092424 - Stress buffer layer and method for producing same: A stress buffer sheet 10 is constituted by arranging external conductive layers 16A and 16B on the front and rear main surfaces of a through electrode layer 13 in which a resin 12 is filled between many columnar internal electrodes (metal pillars) 14. The columnar internal electrodes 14 are formed... Agent: Taiyo Yuden Co., Ltd.

20130092425 - Transparent conductive film: A transparent conductive film which comprises: a transparent adhesive layer; a first polycycloolefin film laminated on one surface of the transparent adhesive layer; a second polycycloolefin film laminated on the other surface of the transparent adhesive layer; a plurality of first transparent electrode patterns formed on the first polycycloolefin film;... Agent: Nitto Denko Corporation

20130092427 - Printed circuit board capable of limiting electromagnetic interference: A printed circuit board (PCB) includes a first wiring layer, a second wring layer, a power layer, a grounded layer, dielectric layers between every two active layers, a capacitor, and two through holes. A first portion of the power layer corresponding to the electromagnetic interference source is isolated from the... Agent: Hon Hai Precision Industry Co., Ltd.

20130092428 - Printed wiring board and method of manufacture thereof: A printed wiring board, including a printed wiring member which respectively has object conductor that is subjected to electromagnetic wave shielding on at least one surface of an insulating layer; and an electromagnetic wave shielding member which has an electromagnetic wave shielding layer composed of a low-resistance section and a... Agent:

20130092429 - Cross talk reduction for high-speed electrical connectors: An electrical connector includes a printed circuit board that includes a body that carries a plurality of ground conductors that define respective ground contact pads, and a plurality of signal conductors that define respective signal contact pads. The contact pads are configured to mate with electrical contacts of a complementary... Agent:

20130092430 - Shielding of high voltage cables: A magnetically shielded cable arrangement, comprising at least two AC cables (201-203) comprising a spaced portion extending between two close portions of parallel cables, such spaced portion sequentially including a diverging portion, a widely spaced portion and a converging portion, and an EMF shielding system (1) laid over said at... Agent: Prysmian S.p.a.

20130092431 - Enclosure: The invention relates to an enclosure 12. The enclosure 12 disclosed herein is arranged to house a heat generating component and comprises a top face, a rear face and a first side face. At least one of the first side face or the rear face comprises a substantially continuous portion... Agent: Control Techniques Limited