Electricity: conductors and insulators patents - Monitor Patents
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Electricity: conductors and insulators

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
04/16/2015 > 26 patent applications in 18 patent subcategories.

20150101840 - Cast one-piece outlet box: In an example an integral wiring box comprises: a circular base having a base wire access point; a side wall extended from a perimeter edge of the base forming a cavity having an internal surface and an external surface and a side wall wire access point; a base conduit extending... Agent:

20150101839 - Electrical connection box: An electrical connection box has a first case, a second case, a drain hole, an upward-protruding outer wall, and a downward-protruding inner wall. The second case is assembled beneath the first case. The drain hole is formed in an overlap surface of the second case overlapping the first case, the... Agent:

20150101837 - Enclosure for an electrical wire connection in an appliance: An enclosure for a wire connection includes a base and a cover. The base includes a bottom and a pair of longitudinal sidewalls disposed between the first and second ends. The cover includes a main body and a first wire securing member. According to one aspect, the cover further includes... Agent: A. Raymond Et Cie

20150101838 - Housings with embedded bus bars and standoffs: Housing for electrical components includes a housing body, an insulating body and a bus bar. The insulating body is disposed within the housing body and is integral with the housing body. The bus bar is disposed within the within the housing body and embedded in the insulating body. The insulating... Agent: Hamilton Sundstrand Corporation

20150101841 - Hermetic conductive feedthroughs for a semiconductor wafer: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface... Agent: Medtronic, Inc.

20150101842 - Waterproof cover: A waterproof cover can prevent substantial deformation thereof and maintain high waterproof performance even when temperature inside the waterproof cover changes. The waterproof cover has a peripheral wall composed of a rubber or elastomer. Two end portions of the peripheral wall are connected to an attachment member. The peripheral wall... Agent: Sumitomo Wiring Systems, Ltd.

20150101843 - Water barrier for submarine power cable: An cable that is flexible and watertight by means of a metallic water resistant barrier has at least two protective layers 20, 30 of metal tape wound to a cable core 10 with small gaps 50 between each turn of the tape, and where each layer is displaced 50% relative... Agent:

20150101844 - Low noise oximetry cable including conductive cords: In an embodiment, one or more conductive cable cords are twisted with the sensitive signal carrying cables. The cords may advantageously comprise dummy wires, or very flexible hollow cables without an inner conductor. As the conductive cords do not carry and inner conductor, the conductive cords are individually flexible and... Agent:

20150101845 - Insulation systems with improved resistance to partial discharge, production method for this: An insulating system having improved partial discharge resistance includes an insulating tape around a conductor. The tape is a mica tape joined to a carrier. The tape is impregnated with a synthetic resin, and is interspersed with a nanoparticulate filler, present bimodally, in the form of two fractions of the... Agent: Siemens Aktiengesellschaft

20150101846 - Printed circuit board and method of manufacturing the same: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to the present invention may include: a plurality of circuit layers; and a plurality of insulating layers interposed between the plurality of circuit layers, wherein two adjacent insulating layers of the... Agent: Samsung Electro-mechanics Co., Ltd.

20150101847 - Rigid-flexible printed circuit board,method for manufacturing same,and printed circuit board module: A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a... Agent:

20150101848 - Surface-treated copper foil and copper-clad laminate plate including the same, printed curcuit board using the same, and method for manufacturing the same: Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on... Agent: Samsung Electro-mechanics Co., Ltd.

20150101850 - Electronic part manufacturing method and electronic part manufactured by the method: The present invention provides a new method for manufacturing an electronic part, which is capable of reducing the number of steps of superpose-printing, achieving positional accuracy (alignment accuracy) of precise superposed patterns, and layering with substantially no difference in level, thereby improving productivity and dimensional accuracy and eliminating defects. The... Agent: Dic Corporation

20150101849 - Temperature-resistant, transparent electrical conductor, method for the production thereof, and use thereof: A transparent electrical conductor with a transparent substrate and an electrically conductive layer on the substrate are provided. The conductive layer has a plurality of electrically conductive nanoscale additives. The additives are in electrically conductive contact with one another, in order to form the electrically conductive layer. The substrate is... Agent:

20150101851 - Printed circuit board and method of manufacturing the same: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes an insulating layer including a glass core and a tempering treatment layer formed on one surface of the glass core, such that... Agent: Samsung Electro-mechanics Co., Ltd.

20150101852 - Printed circuit board and method of manufacturing the same: The printed circuit board according to a preferred embodiment of the present invention may include: an insulating layer; a first via depressed from one surface of the insulating layer; a second via depressed from the other surface of the insulating layer; and a circuit pattern formed in the insulating layer... Agent: Samsung Electro-mechanics Co., Ltd.

20150101853 - Touch sensor: Embodiments of the invention provide a touch sensor including a window substrate and a bezel layer formed on outer edges of one surface of the window substrate, wherein the bezel layer includes a printed layer formed on the window substrate, a medium layer formed on the printed layer and having... Agent: Samsung Electro-mechanics Co., Ltd.

20150101854 - Miniature planar transformer: An inductive device may include a pair of half-shell magnetically-conductive housings joined together and defining an enclosed cavity between them. The inductive device may also include primary and secondary windings provided spatially within the cavity providing magnetic coupling between them. The windings may be electrically insulated from each other and... Agent: Analog Devices, Inc.

20150101855 - Flat cable assembly and method of assembling the same: A flat cable assembly comprises: a flat cable; a PCB electrically connected to the flat cable; and a retainer formed on the joint of the flat cable and the PCB. The flat cable defines a metallic shielding layer having extension portions formed at two sides of the flat cable, the... Agent:

20150101858 - Cavities containing multi-wiring structures and devices: A method is disclosed for making an interconnection component. The steps include forming a mask layer covering a first opening in a sheet-like element that has first and second opposed surfaces; forming a plurality of mask openings in the mask layer, wherein the first opening and a portion of the... Agent:

20150101856 - Eliminating poor reveal of through silicon vias: A method and structure for eliminating through silicon via poor reveal is disclosed. In one embodiment, the method includes obtaining a wafer having a front side, a back side and partially etched and metalized through silicon vias each extending from a portion of the front side through a portion of... Agent: International Business Machines Corporation

20150101857 - Printed circuit board and method for manufacturing the same: There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating... Agent: Samsung Electro-mechanics Co., Ltd.

20150101859 - Sealing assembly system and method: An assembly (500) is provided including: a first component (10) having a first outer surface (15) defining an opening therein; a second component (30) having second surface (60); and a sealing system (100). The sealing system includes a sealing member (200) and a support member (300). The sealing member is... Agent: Isreal Aerospace Industries Ltd

20150101860 - Electronic device protection: A method includes permitting a first signal having a first electromagnetic waveform to pass through an apparatus. The method further includes blocking a second signal having a second electromagnetic waveform at the apparatus, wherein the second electromagnetic waveform is different than the first electromagnetic waveform. The apparatus includes a non-conductive... Agent:

20150101861 - Cable fixing device: A cable is drawn through a first opening of a cable holder from a rear side to a front side, and drawn back through a second opening to the rear side, and drawn again through a third opening to the front side. The cable holder on which the cable is... Agent:

20150101862 - Electrical connection box: An electrical connection box assembled by a lock structure has a first case, a second case, a plurality of lock pieces, an engagement protrusion, a plurality of lock recesses, and an engagement part. The plurality of lock pieces are provided to a peripheral wall of the first case and are... Agent:

  
04/09/2015 > 25 patent applications in 20 patent subcategories.

20150096779 - Wire harness protector: A wire harness protector includes a resin plate. A plurality of excavated portions are recessed into a panel surface of the plate, the excavated portions having a circular shape in plan view and being aligned at intervals in an X axis direction and a Y axis direction orthogonal to the... Agent: Sumitomo Wiring Systems, Ltd.

20150096780 - Bracket and assembly for electrical devices: The present disclosure is directed to a bracket and electrical assembly including such bracket for mounting or securing to a concrete masonry unit (CMU).... Agent:

20150096802 - Wire harness: A wire harness includes first, second and third power cables, first, second and third conductive electromagnetic shielding members, and an intermediate short-circuit member. The power cables are arranged to conduct symmetrical three-phase AC electricity. The conductive electromagnetic shielding members are arranged in parallel to each other and spaced apart from... Agent:

20150096803 - Cable repair splice: A splice kit is provided for repairing a cable having a central conductor, an insulator surrounding the central conductor, an outer conductive sheath surrounding the insulator, and a jacket surrounding the outer conductive sheath. The splice kit includes a central conductor joint that is electrically conductive and is configured to... Agent: Tyco Electronics Corporation

20150096782 - Cable having electrical shielding and seal: The invention relates to a cable (1) having at least one electrical line (2), the electrical line (2) being surrounded by an electrically conductive sheath (5), the sheath (5) being formed from an electrically conductive and resilient sealing material.... Agent:

20150096781 - Method for producing a stranded inner conductor for coaxial cable, and coaxial cable: The invention relates to a method for producing a stranded inner conductor (1), and to a coaxial cable (9). In a first step, a stranded inner conductor (2) is provided, which consists of several wires (3) twisted together. Then the stranded inner conductor (1) is rotary swaged by means of... Agent:

20150096783 - Electric cable, in particular a data transmission cable, equipped with multi-layer strip-type screening sheet: e

20150096784 - Vinyl chloride resin composition, electric wire and cable: A vinyl chloride resin composition includes 55 to 70 parts by mass of a plasticizer, 20 to 65 parts by mass of a metal hydrate and 0.3 to 3 parts by mass of a polytetrafluoroethylene per 100 parts by mass of a vinyl chloride resin. The polytetrafluoroethylene includes a fibril-forming... Agent:

20150096785 - Multicore cable: One embodiment provides a multicore cable in which plural coaxial cable pairs are collected. Each coaxial cable pair is formed by twisting together or arranging in parallel two coaxial cables. Each coaxial cable includes a center conductor and an insulator covering the center conductor. The center conductor is a strand... Agent:

20150096786 - Insulation waterproof member and insulation waterproofing method: An insulating waterproof member for insulating and waterproofing a connector of a cable, the insulating waterproof member including: a sealing material for covering the connector, and a protective sheet for covering the connecting portion with the sealing material interposed therebetween, the protective sheet having an adhesive layer on a surface... Agent:

20150096787 - Stand-off block: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be... Agent: Cisco Technology, Inc.

20150096788 - Ecological method for constructing circuit boards: A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected... Agent: The Boeing Company

20150096789 - Electronic component embedded printed circuit board and method for manufacturing the same: An electronic component embedded printed circuit board of the present invention includes a core having a cavity therein and internal circuit layers on upper and lower surfaces thereof; an electronic component inserted in the cavity and having an elastic body on an outer peripheral surface thereof; insulating layers laminated on... Agent: Samsung Electro-mechanics Co., Ltd.

20150096790 - Method for preparing low cost substrates: A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned... Agent: Invensas Corporation

20150096791 - Ceramic multilayer substrate: In a ceramic multilayer substrate formed by stacking and firing a plurality of insulating layers, the insulating layer in an uppermost surface layer includes a ceramic layer, a contraction suppression layer stacked on the ceramic layer, and a surface-layer via conductor penetrating through the ceramic layer and the contraction suppression... Agent:

20150096792 - Electronic component unit and manufacturing method therefor: An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the... Agent:

20150096793 - Method for forming graphene circuit pattern and product with graphene circuit pattern: A method for forming a graphene circuit pattern on an object includes the following steps of: forming a patterned graphene layer on a surface of a film so as to form a laminate; and covering an object with the laminate so as to attach the patterned graphene layer to the... Agent:

20150096796 - Circuit board: A circuit board comprises one or more first electrical conductors (102-107) in a first portion of the thickness of the circuit board, one or more second electrical conductors (108, 109) in a second portion of the circuit board, at least one via-conductor (112) providing a galvanic current path between the... Agent: Tellabs Oy

20150096794 - Electronic device and electronic component thereof: An electronic device and an electronic component thereof include a main body and several pins. One side of the main body has several recesses. Each of the recesses has a first inner width along a first direction. The first direction is substantially parallel to a long side of the main... Agent: Inventec (pudong) Technology Corporation

20150096795 - Multilayer ceramic capacitor and board having the same mounted thereon: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; and first and second external electrodes formed to end surfaces of the ceramic body. The ceramic body may includes an active layer, a capacitance formation portion, and a... Agent: Samsung Electro-mechanics Co., Ltd.

20150096797 - Package board and method of manufacturing the same: Disclosed herein are a package board and a method of manufacturing the same. The package board includes: an insulating layer; and a ground layer formed in the insulating layer, wherein one side of the ground layer is formed so that a plurality of pattern parts having a plurality of diameters... Agent: Samsung Electro-mechanics Co., Ltd.

20150096798 - Interconnections for a substrate associated with a backside reveal: An apparatus relating generally to a substrate is disclosed. In this apparatus, a post extends from the substrate. The post includes a conductor member. An upper portion of the post extends above an upper surface of the substrate. An exterior surface of the post associated with the upper portion is... Agent: Invensas Corporation

20150096799 - Device for attenuating propagation of electromagnetic emissions from an enclosure: A first planar prong adjacent to and parallel with, an exterior of the side of the enclosure. A second planar prong parallel to and spaced from an interior of the side of the enclosure and compress a first compressible gasket against the side of the enclosure. Furthermore, the second planar... Agent: International Business Machines Corporation

20150096800 - Electronic module for operation in a transmission: An electronic module for a vehicle includes a can housing and a circuit carrier having at least one connecting element. The circuit carrier is positioned in the can housing, and is cast with a cast material. The at least one connecting element protrudes from the cast material and is configured... Agent: Robert Bosch Gmbh

20150096801 - Connector: A connector includes a cylindrical-shaped housing inserting therein a wire, a shield shell disposed on an outer side of the housing, and a mounting member assembled with the housing and the shield shell. The mounting member includes a tubular portion inserted into a gap between the housing and the shield... Agent: Yazaki Corporation

  
04/02/2015 > 21 patent applications in 17 patent subcategories.

20150090487 - Cable for powering of mast mounted radio equipment: A cable for powering of radio equipment mounted on a mast for carrying the radio equipment is disclosed. The cable comprises a first conductor for feeding a current to the radio equipment, a return and shielding conductor for feeding a return current from the radio equipment and for shielding of... Agent:

20150090489 - Cable clamp and harness: A cable clamp is configured to fix an electric cable including an electric wire section and an outer layer section covering the electric wire section to a fixed member. The cable clamp includes a first cylindrical portion for the electric wire section to be inserted therein, and a second cylindrical... Agent:

20150090490 - Waterproof structure of wire harness with connector: A waterproof structure of a wire harness with a connector in which crimp terminals are housed and held in a plurality of cavities respectively in the connector, the crimp terminals being crimped to electric wire terminals of a plurality of electric wires included in the wire harness. The waterproof structure... Agent: Sumitomo Wiring Systems, Ltd.

20150090491 - Electrical cable assembly having an electrical shield: An electrical cable assembly includes an electrical cable extending a length from a first cable end to an opposite second cable end. The electrical cable includes at least one electrical wire. A first electrical connector is terminated to the first cable end of the electrical cable. A second electrical connector... Agent: Tyco Electronics Corporation

20150090492 - Mains power wire connection assembly and connection method: A mains power wire connection assembly (100) using a button to push a first wire and a second wire to move toward the direction of clamping slots, and the inner walls of the clamping slots puncture the first and second wires and clamp same. The button and the insulation doby... Agent:

20150090493 - Busbar adapter: The present invention relates to a busbar adapter having a lower deck and an upper deck that can be interconnected releasably. The deck elements comprise projections and openings that can be brought into engagement with each other, the busbar adapter further comprises a locking device.... Agent:

20150090473 - Manufacturing a conductor part: A method for manufacturing a conductor part for a connector unit is provided. The conductor part includes a conductive core, an insulating sleeve, and at least a first conductive layer arranged between the conductive core and the insulating sleeve. The method includes equipping at least one section of a radially... Agent:

20150090474 - Electric cable: An electric cable includes a wire section that includes an electric wire including a conductor and a braided shield layer covering an outer periphery of the conductor and including a plurality of metal wires braided, and a cylindrical outer layer section covering an outer periphery of the wire section and... Agent: Hitachi Metals, Ltd.

20150090475 - Cables having an antimicrobial coating: A cable having one or more conductors with a polymeric covering layer and a non-extruded coating layer formed of a material based on a liquid composition including a polymer resin and an antimicrobial additive. Methods of forming cables are also provided.... Agent:

20150090477 - Multilayer structure, fingerprint identification device and manufacturing method thereof: A multilayer structure comprises an insulation material, a conductive layer and a protective film. The conductive layer is disposed on the insulation material. The protective film is disposed on the surface of the conductive layer, and the surface area of the protective film is less than that of the conductive... Agent:

20150090476 - Package carrier and manufacturing method thereof: A manufacturing method of a package carrier includes the following steps. Two base metal layers are bonded together. Two supporting layers are laminated onto the base metal layers respectively. Two release metal films are disposed on the supporting layers respectively. Each release metal film includes a first metal film and... Agent: Subtron Technology Co., Ltd.

20150090478 - Silver thick film paste hermetically sealed by surface thin film multilayer: A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms... Agent:

20150090479 - Method for producing a flexible transparent electrode using cesium and a flexible transparent electrode produced thereby: An method for preparing a flexible transparent electrode film that has a high transmittance and low sheet resistance without having to go through a separate heating process by using cesium, and a flexible transparent electrode film prepared thereby, the method including: applying a nanowire transparent conductive film on a high... Agent: Research & Business Foundation Sungkyunkwan University

20150090480 - Electronic component package and method for forming same: An electronic component package includes a substrate and dielectric structure. The dielectric structure includes a top surface having a protrusion portion and a lower portion. The protrusion portion is located at first height that is greater than a second height of the lower portion. A conductive bond pad is located... Agent:

20150090481 - Package carrier and manufacturing method thereof: A manufacturing method of a package carrier includes the following steps. Firstly, two base metal layers are bonded together. Then, two supporting layers are laminated onto the base metal layers respectively. Next, two release metal films are disposed on the supporting layers respectively, wherein each of the release metal films... Agent: Subtron Technology Co., Ltd.

20150090482 - Curable composition for printed circuit board, cured coating film using the same, and printed circuit board: By the present invention, a curable composition for a printed circuit board comprising (A) a compound having a triazine ring, (B) a (meth)acrylate compound having a hydroxyl group and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist... Agent: Taiyo Ink Mfg. Co., Ltd.

20150090484 - Capacitor-mounted structure and capacitor: A monolithic-capacitor-mounted structure satisfies Lc>Wc and Lx/Wx<Lc/Wc, where Lx denotes a distance between a first-lengthwise outermost portion of a first-lengthwise outermost one of first through fourth pads and a second-lengthwise outermost portion of a second-lengthwise outermost one of the pads; Wx denotes a distance between a first-widthwise outermost portion of... Agent:

20150090485 - Multilayer ceramic capacitor and board having the same: A multilayer ceramic capacitor may include: three external electrodes disposed on amounting surface of a ceramic body to be spaced apart from one another. When a thickness of an active layer including a plurality of first and second internal electrodes disposed therein is defined as AT, and a gap between... Agent: Samsung Electro-mechanics Co., Ltd.

20150090483 - Multilayer ceramic capacitor, manufacturing method thereof, and board having the same mounted thereon: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; an electrode layer disposed on an outer surface of the ceramic body and electrically connected to the internal electrodes; a first composite resin layer disposed on the electrode layer and including a first... Agent: Samsung Electro-mechanics Co., Ltd.

20150090486 - Selectively conductive emi gaskets: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.... Agent:

20150090488 - Wire connector: An improved wire connector is provided that allows for securing one, two, or more cables in an electrical box knockout hole. The wire connector body interior includes a central tab with a hinge for exerting pressure against at least a first/tab cable. The central tab also has a gripping portion... Agent: Thomas & Betts International LLC

  
03/26/2015 > 38 patent applications in 24 patent subcategories.

20150083453 - Device for grounding: A device for establishing grounding of an installation of different types includes one or more cables, wherein a ground rail or a ground conductor, ground rails or ground conductors, or a ground point or ground points are grounded by the one or more cables including a combination of electrically conductive... Agent:

20150083483 - High-capacity/efficiency transmission line design: A transmission tower structure for suspending from an arched crossarm a three phased circuit arranged in a compact delta configuration that improves the surge impedance loading (SIL) of a transmission line, reduces its series impedance, lowers both resistive and corona losses, and moderates electromagnetic fields and audible noise effects at... Agent: Aep Transmission Holding Company, LLC

20150083454 - Electrical outlet wall plate configured for cable retention: An electrical outlet wall plate is configured for cable retention and the wall plate includes: a front and back side; one or more openings having a shape configured to receive an outlet socket protrusion; one or more holes having a shape configured to receive a fastener; and one or more... Agent: Michaelis Industries Ltd. Co.

20150083488 - Electrical harness connector: A connector is provided for joining two electrical harnesses. Each harness is formed from a flexible printed circuit board which provides a plurality of conductive tracks, and each harness has a substantially planar terminating region at which the conductive tracks of the harness fan out. One or more receiving holes... Agent: Rolls-royce PLC,

20150083456 - Conductive, vibration dampening isolator: The present invention is a conductive isolator including a damping structure, a conductive bridge component positioned within the damping structure, axial contact points between the damping structure and the conductive bridge component and radial contact points between the damping structure and the conductive bridge component.... Agent:

20150083455 - Patch cords for reduced-pair ethernet applications having strain relief units that resist rotational loads and related strain relief units and connectors: Reduced-pair Ethernet patch cords include a twisted pair cable that has a pair of insulated conductors that are contained within a cable jacket. A connector is mounted on a first end of the cable. The connector includes a connector housing and a strain relief unit that is mounted on the... Agent:

20150083489 - Power-supply cable and apparatus for manufacturing electric wire used for said power-supply cable: It is an objective of the invention to provide a high-power supply cable characterized in that even when mounted in a narrow space where the cable undergoes a repetitive bending motion, any undesirable deformation out of the bending plane is small. There is provided a power-supply cable including: an electric... Agent:

20150083490 - Cable structures with localized foam strain reliefs and systems and methods for making the same: Cable structures with localized foam strain reliefs and systems and methods for making the same are provided. In some embodiments, at least one localized foam strain relief may be incorporated into or positioned underneath a cover of a cable structure. For example, the ratio of base material to foam material... Agent: Apple Inc.

20150083457 - Coaxial cable: A coaxial cable includes a central conductor, a fluororesin insulation, and outer conductor and a jacket covering the outer conductor. The central conductor has three single element twisted wires. The central conductor has an outer diameter and the three single element twisted wires having a predetermined twist pitch. The fluororesin... Agent:

20150083458 - Multi-core cable: In a multi-core cable 10, plural electric wire units 12 made of stranded plural small-diameter electric wires 11 are bundled to form an electric wire assembly 14 and a shielding layer 15 made of braided a conducting wire 15a is arranged on an outer periphery of the electric wire assembly... Agent:

20150083459 - Multi-layer coaxial cable: A multilayer coaxial cable includes high-voltage circuits that are coaxially disposed with each other. The high-voltage circuits include high-voltage conductors and high-voltage insulators that are disposed on the outside of the high-voltage conductors. In addition, the multilayer coaxial cable includes a conductive shield member that is coaxially disposed on the... Agent: Yazaki Corporation

20150083460 - Shielded electrical cable: A shielded electrical cable includes conductor sets extending along a length of the cable and spaced apart from each other along a width of the cable. First and second shielding films are disposed on opposite sides of the cable and include cover portions and pinched portions arranged such that, in... Agent:

20150083461 - Ultra-thin azo with nano-layer alumina passivation: An electrical conductor includes an ultra-thin layer of aluminum-doped zinc-oxide and a nano-layer of alumina in contact and conformal with a surface of the ultra-thin aluminum-doped zinc-oxide layer.... Agent:

20150083462 - Structure for mounting retrofit part to cladding member: To provide a structure for mounting a retrofit part to a cladding member that can prevent the retrofit part from causing a turn or positional displacement. A clamp includes a clamp base and a clamp cover continuous to the clamp base by a hinge. The clamp has spike-shaped portions. The... Agent: Yazaki Corporation

20150083463 - Cable clamp: A cable clamping unit for clamping an electrical cable including first and second mating units for clamping around the cable, each of the mating units including a soft sleeve for engaging the cable, the sleeves being at least semi permanently attached to a corresponding mating unit. A cable clamp includes... Agent:

20150083464 - Transparent body for use in a touch screen panel manufacturing method and system: A process for manufacturing a transparent body for use in a touch screen panel is provided. The process includes: depositing a first transparent layer stack over a transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second... Agent: Applied Materials, Inc.

20150083465 - Transparent conductive substrate, and method for manufacturing same: A transparent or conductive substrate and its manufacturing method are provided. The transparent or conductive substrate comprises a base substrate capable of light transmission; a transparent electroconductive layer formed by depositing a transparent electroconductive material; and an anti-reflection layer, wherein the anti-reflection layer is formed by using a dry etching... Agent: Korea Institute Of Machinery & Materials

20150083466 - Method for the functionalisation of metal nanowires and the production of electrodes: The invention relates to a method for the functionalisation of metal nanowires and the use of said nanowires. The functionalisation method of the invention includes a step comprising the formation of a self-assembled monolayer on at least part of the external surface of metal nanowires, using a compound of formula... Agent: Commissariat A L'energie Atomique Et Aux Energies Alternatives

20150083467 - Method of forming upper electrode of nanowire array and nanowire array with upper electrode formed: Provided are a method of forming an upper electrode of a nanowire array and a nanowire array having an upper electrode formed thereon. The method includes a step of placing a polymeric thin film layer, a step of pressing, a step of treating a mixed solution, a step of etching,... Agent: Korea Research Institute Of Standards And Science

20150083471 - Combined wiring board and method for manufacturing the same: A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the... Agent: Ibiden Co., Ltd.

20150083472 - Metal core substrate, method for producing the same, and core plate usable for the same: A metal core substrate is obtained as a result of outline shaping performed on a substrate including a core plate and an insulating layer provided on each of two surfaces of the core plate. At least a part of an outer circumferential edge of the metal core substrate has an... Agent: Furukawa Automotive Systems Inc.

20150083468 - Textured glass substrate having enhanced optical properties for an optoelectronic device: The invention relates to a glass substrate having enhanced optical properties for optoelectronic devices, wherein said substrate is totally or partially textured, by means of a chemical attack, on at least one of the surfaces thereof with a set of geometric patterns such that the arctangent of the ratio of... Agent: Agc Glass Europe

20150083469 - Wiring board: A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and including a first metal layer formed on a part of an inner side surface of the through hole... Agent:

20150083470 - Wiring substrate and manufacturing method thereof: A wiring substrate is provided with a support substrate (31), an insulating layer (32), and a wiring layer (33). The support substrate (31) is formed with a hole (34) including an opening portion in one surface of the support substrate (31). The insulating layer (32) is formed on a surface... Agent:

20150083474 - Electroconductive ink composition: An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100... Agent:

20150083473 - Flexible electronic fiber-reinforced composite materials: Flexible electronic substrate systems relating to providing a system for dimensionally-stable substrate systems to support electronic systems is provided.... Agent: Cubic Tech Corporation

20150083476 - Device embedded printed circuit board and method of manufacturing the same: Disclosed herein is a device embedded printed circuit board, including: a first core layer having a first via and having a via land for a first connection pad disposed on a lower surface thereof; a build-up layer formed on the first core layer and having a plurality of circuit layers... Agent: Samsung Electro-mechanics Co., Ltd.

20150083477 - Multilayer ceramic capacitor and board for mounting of the same: A multilayer ceramic capacitor may include a ceramic body including a plurality of dielectric layers; a first internal electrode disposed in the ceramic body and exposed to a first side surface in a width direction of the ceramic body and a second internal electrode disposed in the ceramic body and... Agent:

20150083475 - Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein: There are provided a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof, and particularly, a multilayer ceramic electronic component to be embedded in a board, in which a thickness of a ceramic body in an entire chip is increased by not allowing for... Agent: Samsung Electro-mechanics Co., Ltd.

20150083479 - Capacitance touch panel module and fabrication method thereof: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the... Agent:

20150083478 - Electric part soldered onto printed circuit board: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface,... Agent:

20150083480 - Interposer board and method of manufacturing the same: Disclosed herein are an interposer board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the interposer substrate may include: a base substrate; a circuit pattern formed on the base substrate; and a through via formed to penetrate through the base substrate and... Agent: Samsung Electro-mechanics Co., Ltd.

20150083481 - Spring assemblies with spring energized seal members and related methods: Seal assemblies in which a seal member having an energizer located in a seal body groove is positioned inside a housing cavity of a housing are disclosed. The sealing member and the energizer, which can be an O-ring or a spring energizer, can be retained inside the housing cavity by... Agent:

20150083482 - Electric cable: An electric cable includes a conductor core including conductors each covered with an insulation layer, and a braided layer formed on an outer periphery of the conductor core. The braided layer includes a braid of a first line group and a second line group. The first line group includes first... Agent: Hitachi Metals, Ltd.

20150083484 - Housing with air chamber for battery monitor system and method for manufacturing same: A housing is described that may include a main portion having at least one wall defining an opening that may have a perimeter. The at least one wall may have a rib and an inner wall extending therefrom about the perimeter of the opening. The inner wall may have an... Agent:

20150083485 - While-in-use outdoor cover with recessed electrical device: A while-in-use cover assembly includes a hood and a base connected to the hood. The base includes a first side wall and a first back wall forming a first cavity with a first opening opposite the first back wall. The hood covers the first opening, the first side wall includes... Agent:

20150083486 - Threaded sleeve compressed split cable gland: The present invention is directed to a split cable gland with a first body member and a second body member. The first and second body members each have a main section and a threaded shaft extending from the main section. The inner surface of each main section has vertical slots.... Agent: Panduit Corp.

20150083487 - Gtms connector for oil and gas market: A feed-through element for harsh environments is provided that includes a support body with at least one access opening, in which at least one functional element is arranged in an electrically insulating fixing material. The electrically insulating fixing material contains a glass or a glass ceramic with a volume resistivity... Agent: Schott Corporation

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