Electricity: conductors and insulators inventions

20090266605 - High voltage valve group with increased breakdown strength: A high voltage assembly including a valve group and a shield connected to the valve group. A resistor is connected between the shield and the valve group The assembly provides an increased breakdown strength and DC withstand level.... Agent: Venable LLP

20090266600 - High voltage dc bushing and device comprising such high voltage bushing: A high voltage DC bushing including a fluid duct with non-constant width (Δr) along the axial direction of the bushing.... Agent: Venable LLP

20090266573 - Assembly method for implantable medical device: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case.... Agent: Medtronic, Inc.

20090266574 - Safety guard apparatus for an electrical outlet: Safety guard apparatus for an electrical outlet having one or more electrical receptacles for restricting access to the receptacles by a young child. The apparatus includes a base plate having one or more openings for registry with the electrical receptacles. The base plate is mounted to the electrical outlet in... Agent: Maxey Law Offices, PLLC

20090266607 - Cable management system: A cable management system for cable management in an equipment rack includes a support bracket having a body extending between a mounting end and a distal end. The mounting end is configured to attach to the equipment rack, and the body has a tie down slot configured to receive a... Agent: Robert J. Kapalka Tyco Technology Resources

20090266575 - Electric wire for automobile: An electric wire for an automobile has a core wire section and an outer circumferential wire section. The core wire section is formed by spirally winding six element wires around one element wire, where each element wire is made of stainless steel having elongation of 30% or more and tensile... Agent: Casella & Hespos

20090266576 - Abrasion resistant electrical wire: An electrical wire having a conductor and a covering disposed over the conductor wherein the covering is made from a thermoplastic composition. The thermoplastic composition has a poly(arylene ether); a polyolefin, a block copolymer; and flame retardant. The thermoplastic composition demonstrates desirable abrasion resistance, as well as desirable tensile elongation,... Agent: General Electric Company Ge Global Patent Operation

20090266577 - Cable with offset filler: The present invention relates to cables made of twisted conductor pairs. More specifically, the present invention relates to twisted pair communication cables for high-speed data communications applications. A twisted pair including at least two conductors extends along a generally longitudinal axis, with an insulation surrounding each of the conductors. The... Agent: Merchant & Gould PC

20090266578 - Flex cable with biased neutral axis: Systems and methods for biasing a neutral axis of a flex cable in a hard drive are discussed. The hard drive comprises a flex cable, a read/write head, and a control card. The flex cable comprises a base film, adhesives, a conductive trace, a cover film, and a neutral axis.... Agent: Hitachi C/o Wagner Blecher LLP

20090266579 - Interconnector: The present invention provides a solar module with inter-connectors with improved flexibility. The flexibility is achieved by placing a fabric between the solar elements. The fabric is conductive and may be soldered or welded to the solar elements.... Agent: Birch Stewart Kolasch & Birch

20090266580 - Method for manufacturing a transparent conductive electrode using carbon nanotube films: The present invention relates to a method for preparing a transparent electrode using a carbon nanotube(CNT) film, and more particularly, to a method for preparing a transparent electrode, the method comprising the steps of forming a CNT film on a desired substrate using a dispersed solution of CNT and then... Agent: Moore & Van Allen PLLC

20090266581 - Decorative cords and cables: A cord and/or cable structure for electrical cords, extension cords, communication cables and other electrical power and/or signal carrying cords and cables that includes an outmost sheath formed with multiple integral anchoring fixtures that provide a point of connection between the cord or cable and the multiple decorative elements (such... Agent: Ober. Kaler. Grimes & Shriver Royal W. Craig

20090266583 - Photosensitive resin composition, laminate, method of producing metal plated material, metal plated material, method of producing metal pattern material, metal pattern material and wiring substrate: The invention provides a photosensitive resin composition comprising: a polymer comprising a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof so as to form a coordination bond; and at least one selected from the group consisting of a synthetic rubber, an epoxy... Agent: Moss & Burke, PLLC

20090266582 - Three-dimensional circuit board and its manufacturing method: A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode... Agent: Mcdermott Will & Emery LLP

20090266584 - Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipiating wiring board: It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead frame partially having... Agent: Steptoe & Johnson LLP

20090266585 - Flame-retardant composition for solder resist and cured product thereof: There is provided a flame retardant composition for a solder resist which is halogen-free and has a high level of flame retardance and flexibility, while exhibiting excellent heat resistance, moisture resistance and high-temperature reliability. The flame retardant composition for a solder resist according to the invention comprises (A) an alkali-soluble... Agent: Sughrue Mion, PLLC

20090266587 - Flexible printed circuit board and method of forming fine pitch therein: Provided is a method of forming a fine pitch in a flexible printed circuit board (FPCB) having an increased adhesive property of wirings and an improved insulating property between the wirings. The method includes etching regions where wirings are to be formed on a base substrate; forming conductive layers on... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.

20090266586 - Printed circuit board and semiconductor package: An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed... Agent: Sughrue Mion, PLLC

20090266588 - Multilayer printed wiring board: A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive layers include a conductive layer formed on the core substrate, and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090266589 - Process for producing metal wiring board: Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and... Agent: Knobbe Martens Olson & Bear LLP

20090266590 - Interconnect structure and method for fabricating the same: An interconnect structure includes: an interlayer insulating film formed on a lower metal layer; a contact hole formed in the interlayer insulating film to expose the lower metal layer; a plurality of carbon nanotubes formed on a bottom of the contact hole; an wiring metal filled in the contact hole... Agent: Mcdermott Will & Emery LLP

20090266591 - Prepreg and printed wiring board using thin quartz glass cloth: It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090266592 - Circuit board and method for jointing circuit board: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a... Agent: Steptoe & Johnson LLP

20090266595 - Electronic device: An electronic device has a multilayer capacitor and a circuit board on which the capacitor is mounted. The capacitor is formed in a nearly rectangular parallelepiped shape and has a first terminal electrode and a second terminal electrode arranged at respective ends thereof. On the circuit board there are a... Agent: Oliff & Berridge, PLC

20090266596 - Printed circuit board with embedded electronic components and methods for the same: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic... Agent: Snell & Wilmer L.L.P. (main)

20090266593 - Surface-mountable electronic device: A surface-mountable electronic device free of leads has a plurality of solderable connection surfaces at its lower side, with at least one of the connection surfaces having a rectangular portion. The outline of this rectangular portion corresponds to a connection surface of the JEDEC Standard MO-236 or of any other... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20090266594 - Wiring substrate and method of manufacturing the same: A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090266597 - Printed circuit board preform with test facilitating means: An exemplary printed circuit board preform (20) includes at least two printed circuit board units (211), at least one boundary (201, 202) formed on the junction of the at least two printed circuit board units, and at least one conductor (206, 208) configured on a surface of the printed circuit... Agent: PCe Industry, Inc. Att. Steven Reiss

20090266598 - Wiring board: A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situated in substantially the same plane as a first surface of the resin... Agent: Ipusa, P.l.l.c

20090266599 - Circuit board with high thermal conductivity and method for manufacturing the same: A circuit board having high thermal conductivity comprises a substrate, a plurality of thermal conductive insulating layers, a patterned electrical conductive layer, a plurality of through-holes and a soldering layer. The substrate has an upper surface and a lower surface; the thermal conductive insulating layers are respectively formed on the... Agent: Bacon & Thomas, PLLC

20090266602 - Electromagnetic interference shield: This present invention is an electromagnetic interference shield, comprising a shielding cap, an insulator, and an electric conductive paste, wherein protruding edges of the shielding cap are mounted with electric conductive paste on a PCB and the insulator is placed between the shielding cap and the PCB to keep them... Agent: Pai Patent & Trademark Law Firm

20090266603 - Electromagnetic shielding device: An electromagnetic shielding device suitable for a PCB includes a cover and a conductive rubber frame. The cover is made of a conductive material and has a through hole and a containing space. The conductive rubber frame is contacted with the through hole of the cover. The conductive rubber frame... Agent: Jianq Chyun Intellectual Property Office

20090266601 - Protective cover for prevention of electromagnetism interference: A protective cover for prevention of electromagnetism interference includes a shell and a metal cladding layer. The shell is comprised of a plastic material, and includes a base plate. An edge of the base plate bends upwardly with respect to the base plate and forms an enclosure plate. At least... Agent: Hdls Patent & Trademark Services

20090266604 - Resin composition: Disclosed is a resin composition containing a hexagonal ferrite and a resin, which is characterized in that the hexagonal ferrite is contained in an amount of 50-98 parts by weight per 100 parts by weight of the total of the resin composition.... Agent: Birch Stewart Kolasch & Birch

20090266606 - Electric apparatus module: The invention provides an electric apparatus unit which can be easily assembled. The electric apparatus module includes an upper case, a lower case assembled with the upper case and having an opening, an electric apparatus unit accommodated in the upper case and the lower case, a connection unit including a... Agent: Sughrue-265550

20090260843 - High voltage bushing: A high voltage bushing including a metal part provided with a resistive layer.... Agent: Venable LLP

20090260845 - Display device, vent tube with glass ring, phosphate glass ring, and method of producing the same: The present invention reduces the amount of lead used in a display device and improves its long-term moisture resistance. This display device includes: a panel (1b) provided with a hole (11) formed therein; a phosphate glass member (13); and a tube (12) mounted on the panel (1b) via the glass... Agent: Hamre, Schumann, Mueller & Larson P.C.

20090260844 - Waterproof casing: A waterproof casing is adapted for enclosing an electronic device therein. The electronic device includes at least one operating portion. The waterproof casing includes a casing unit and at least one pliable transparent film. The casing unit includes first and second casing halves that are coupled together and that cooperatively... Agent: Choate, Hall & Stewart LLP

20090260875 - Multi-port compression connector with single tap wire access port: A compression connector is provided for securing wires electrically together but mechanically separated upon completion of a crimping operation applied to the compression connector. The compression connector includes a body portion having a first hook and a first ramp extending from the body portion, the first hook and first ramp... Agent: Panduit Corp.

20090260846 - Cable protector with removable dividers: A cable protector includes a channel recessed into, and extending along the upper surface of a base. A number of dividers can be removably inserted into the channel from above to divide the channel into a plurality of tracks for carrying cables that can be inserted from above. Alternatively, a... Agent: Dorr, Carson & Birney, P.C. One Cherry Center

20090260847 - Data transmission cable and method for producing a data transmission cable: A data transmission cable (2) comprises at least one pair of wires (4) comprising two wires (6) lying parallel to each other, each with an electrical conductor (8) surrounded by an insulation (10). The pair of wires (4) is sheathed over its length by a foil (12) with an electrically... Agent: Lerner Greenberg Stemer LLP

20090260848 - Microwires, methods for their production, and products made using them: Insulated electrically conductive continuous fibers or microwires of sizes on the order of 1 mil (25 microns) diameter, so as to be suitable for processing into yarns or multi-microwire bundles, for example, for incorporation into conformable fabric products or for use as wearable electronic circuitry are made by coprocessing a... Agent: Michael De Angeli

20090260849 - Electrical conductor and cable utilizing same: In general, a conductor is provided. A conductor includes a central element having a length, a plurality of insulated strands disposed about the central element in at least first and second concentric layers, a layer of a dielectric material having a velocity of propagation disposed around the plurality of insulated... Agent: Dorsey & Whitney LLP US Bank Center

20090260850 - Flexible flat cable assembly with improved grounding structure: A cable connector assembly includes a housing, a flexible substrate, at least one matching stratum attached on the flexible substrate for regulating the impedance of flexible substrate and a shell. The housing includes a receiving space. The flexible substrate is received in the receiving space of the housing and includes... Agent: Wei Te Chung Foxconn International, Inc.

20090260851 - Superconductive thin film material and method of manufacturing the same: A superconductive thin film material which achieves good superconductivity by preventing an element diffusion reaction and a manufacturing method of the superconductive thin film material are provided. A superconductive thin film material is provided with a substrate, an intermediate layer with one layer or at least two layers formed on... Agent: Drinker Biddle & Reath (dc)

20090260852 - Alternating core composite wire: A wire having an outer shell and a core, the core including at least a first plurality of core segments that may be made of a first core material and a second plurality of core segments that may be made of a second core material different from the first core... Agent: Baker & Daniels LLP 111 E. Wayne Street

20090260854 - Electronic circuit board: A resist opening 5a not covered with resist 4 around a through hole 2 provided through a board 1 is shaped so as to have a shape elongated in the direction of flow in flow soldering such that the surface tension acting on solder 6 upon the soldering is reduced.... Agent: Birch Stewart Kolasch & Birch

20090260856 - Electronic component module: An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plurality of bonding material applying lands includes... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090260855 - Wired circuit board assembly sheet: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating... Agent: Akerman Senterfitt

20090260853 - Wiring substrate and method for manufacturing the same: A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the circuit pattern and on the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090260857 - Heat resistant substrate incorporated circuit wiring board: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090260858 - Multi-layer circuit substrate and motor drive circuit substrate: Conducting layers and resin-made insulating layers are alternately laminated to form a laminated circuit portion, and a metal substrate is installed so as to be in contact with an insulating layer, which is the lowermost layer. The conducting layers, the insulating layers, and the metal substrate are thermal compression bonded.... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090260859 - Flexible printed circuit board: A flexible printed circuit board (FPCB) includes a signal layer comprising a differential pair, a ground layer comprising a grounded sheet made of conductive material, and a dielectric layer located between the signal layer and the ground layer. A void is located on the two opposite sides of the grounded... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260860 - Flexible printed circuit board: An exemplary FPCB includes two or more dielectric layers. Each dielectric layer is located between a signal layer and a ground layer. A differential pair including two transmission lines is arranged in each signal layer. Each ground layer includes one or more voids defined therein. Each void is opposite and... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260861 - Polycrystalline, magnetic ceramic material, microwave magnetic device, and non-reciprocal circuit device comprising such microwave magnetic device: A polycrystalline, magnetic ceramic material having a basic composition represented by the general formula of (Y3-x-y-zBiXCayGdz)(Fe5-α-β-γ-εInαAlβVγZrε)O12, wherein 0.4<x≦1.5, 0.5≦y≦1, 0≦z≦0.5, y+z<1.3, 0≦α≦0.6, 0≦β≦0.45, 0.25≦γ≦0.5, 0≦ε≦0.25, and 0.15 ≦α+β≦0.75 each by an atomic ratio, which is predominantly composed of a phase having a garnet structure, and sinterable at a temperature of... Agent: Sughrue Mion, PLLC

20090260862 - Circuit modification device for printed circuit boards: An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and... Agent: Schneck & Schneck

20090260864 - Circuit board and semiconductor integrated circuit module including the same: A circuit board includes a plurality of differential signal line pairs, and a plurality of electromagnetic bandgap (EBG) patterns, each configured to be disposed to overlap the plurality of differential signal line pairs, wherein the EBG patterns are electrically insulated from the differential signal line pairs.... Agent: Baker & Mckenzie LLP Patent Department

20090260865 - Micro-electromechanical system: A micro-electromechanical system (MEMS) includes a micro-electromechanical chip, a printed circuit board and a metal wire. The metal wire electrically connects the micro-electromechanical chip and the printed circuit board. A connection distance and a connection angle are defined between the micro-electromechanical chip and the printed circuit board.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260863 - Parallel test fixture for mixed signal integrated circuits: The present invention provides a parallel test fixture for mixed signal integrated circuits (ICs). The fixture includes a multi-layer printed circuit board (PCB). The fixture comprises: a test area, which is disposed on a central area of the multi-layer PCB and includes several test regions for a plurality of mixed... Agent: Squire, Sanders & Dempsey L.L.P.

20090260866 - Wiring board and method for manufacturing the same: A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in... Agent: Merchant & Gould PC

20090260867 - Printed circuit board substrate and method for manufacturing printed circuit boards using same: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090260868 - Printed circuit board and method of manufacturing the same: The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the... Agent: Staas & Halsey LLP

20090260869 - High frequency digital a/v cable assembly: A high frequency digital A/V cable assembly includes a high frequency digital A/V cable, which comprises a plurality of core wires arranged in a parallel array, an insulation layer surrounding each core wire, a shielding layer surrounding the insulation layer at each core wire for isolating electromagnetic interference and an... Agent: Sure-fire Electrical Corporation

20090260870 - Adapter card electromagnetic compatibility shielding: An electromagnetic shield comprising an electrically conductive frame for establishing electrical contact between a chassis wall and an expansion card mounting bracket. The frame has a plurality of spring fingers interconnected about a perimeter of a central opening in the frame, wherein each spring finger defines a central axis that... Agent: Ibm Corporation (ss/nc) C/o Streets & Steele

20090260871 - Perforated substrates for forming housings: A housing for an electronic device as well as methods for forming the housing are disclosed. The housing can be formed from a substrate having perforations to assist in adhering components internal to the housing. The substrate is typically a multi-layer substrate having at least two layers. In one embodiment,... Agent: Technology & Innovation Law Group, PC

20090260872 - Module for packaging electronic components by using a cap: A module for packaging electronic components includes a carrier, at least one electronic component and a cap. The carrier has a first region and a second region. The electronic component is disposed on the first region of the carrier. The cap is mounted on the second region, and includes an... Agent: Lowe Hauptman Ham & Berner, LLP

20090260873 - Casing of electronic device: A casing of an electronic device has a base member, a cover, a bracket and a fastener. The base member made of a bent metal plate has a base and at least three base side walls extending upward from sides of the base. The cover is made of a bent... Agent: Locke Lord Bissell & Liddell LLP Attn:IPDocketing

20090260874 - Biased air baffle for computer rack: One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle... Agent: Ibm Corporation (ss/nc) C/o Streets & Steele

20090255702 - Organizing and wire management system: An organizer and/or wire management apparatus generally comprises an elongate support member having a resilient coaxial strip. The support can additionally have holder attachments from one to a plurality according to user needs or desires. The holder attachments can be permanently joined or mutually engaged and disengaged with the use... Agent: Chad Mitchell

20090255703 - Lift cover and gasket assembly: An electrical box assembly includes a cover assembly, a gasket and an electrical box coupled together by mounting screws. The cover includes a base with a plurality of screw holes for receiving the mounting screws. A support member having an axial passage extends from the bottom face of the cover... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20090255704 - Busbar connection structure and inverter-integrated electric compressor: An object of the present invention is to facilitate welding connection of an enameled wire to a busbar to increase accuracy and reliability of the welding, and provide a high quality and highly reliable busbar connection structure and inverter-integrated electric compressor by reducing processes of welding operation. In a busbar... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090255727 - High-voltage vehicle component connection method and apparatus: A method and apparatus provide an electrical splice between different high-voltage components in a high-voltage propelled vehicle (HVPV), which enables a daisy-chain or series connection of the components. The method includes connecting a first end of a cable to a first component, a second end of the cable to a... Agent: Quinn Law Group, PLLC

20090255705 - Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking: A method if provided for forming a die stack. The method includes forming a plurality of through-wafer vias and a first plurality of alignment features in a first die. A second plurality of alignment features is formed in a second die, and the first die is stacked on the second... Agent: Fletcher Yoder (micron Technology, Inc.)

20090255706 - Coaxial cable: A coaxial cable includes a core, an insulating layer, a shielding layer, and a sheathing layer. The core includes a carbon nanotube wire-like structure and at least one conductive material layer is disposed on the outside surface of the carbon nanotube wire-like structure. The carbon nanotube wire-like structure includes a... Agent: PCe Industry, Inc. Att. Steven Reiss

20090255707 - Flame-retardant resin compostion, and insulated wire, insulated shielded wire, insulated cable and insulation tube using the same: A flame-retardant resin composition including a resin component containing (A) 30 to 90 parts by weight of a thermoplastic polyurethane elastomer having, as measured according to JIS K 7311, a JIS hardness of A98 or less, (B) 70 to 10 parts by weight of an ethylene-vinyl acetate copolymer having a... Agent: Mcdermott Will & Emery LLP

20090255708 - Insulated wire and a wiring harness: An insulated wire possessing preferable flame retardancy, water resistance and wear resistance. The insulated wire including an insulator layer made from a composition including 96 to 44 parts by weight of (A) a polyester type resin, 4 to 56 parts by weight of (B) a polyphenylene ether type resin, 1... Agent: Oliff & Berridge, PLC

20090255709 - Interconnect structure including hybrid frame panel: An electronic component includes a base insulative layer having a first surface and a second surface; at least one electronic device having a first surface and a second surface, wherein the electronic device is secured to the base insulative layer; at least one I/O contact located on the first surface... Agent: General Electric Company Global Research

20090255710 - Solar cell lead wire and production method therefor and solar cell using same: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.... Agent: Mcginn Intellectual Property Law Group, PLLC

20090255711 - Apparatus for controlling cable of robot: The cable control apparatus includes a body disposed above the arm and a fixing ring having a through-hole fixed in the conveying hole; a conveying ring; a cable tube for integrally housing a plurality of control cables and including one end connected to the conveying ring with being inserted into... Agent: The Nath Law Group

20090255712 - Tapered transition ramp for cable protector: An exemplary ramp structure capable of being positioned over at least a portion of a cable protection system comprises a center portion, a first side ramp portion adjacent a side of the center portion, and a first tapered portion adjacent an end of the first side ramp portion. The first... Agent: Holland & Hart LLP

20090255713 - Controlling impedance and thickness variations for multilayer electronic structures: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into PCB cross sections. These thickness variations between... Agent: Matthew C. Zehrer IBM Corporation, Dept. 917

20090255714 - Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement... Agent: Staas & Halsey LLP

20090255715 - Controlling impedance and thickness variations for multilayer electronic structures: Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between... Agent: Matthew C. Zehrer IBM Corporation

20090255716 - Heat resistant substrate incorporated circuit wiring board: A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090255717 - Suspension board with circuit and production method thereof: A suspension board with circuit includes an insulating layer formed with a first opening, a conductive layer formed on the insulating layer so as to fill the first opening, a metal thin film formed so as to cover a surface of the conductive layer exposed from the first opening, and... Agent: Akerman Senterfitt

20090255718 - Printed circuit board: A printed circuit board includes a signal layer and a voltage source layer. The signal layer includes a connecting area. The voltage source layer includes an isolation area corresponding to the connecting area. The isolation area is used for preventing interference caused by a pulsing current in the connecting area... Agent: PCe Industry, Inc. Att. Steven Reiss

20090255719 - Wiring board and ceramic chip to be embedded: A wiring board includes a substrate core and a ceramic chip to be embedded therein. The substrate core has a housing opening portion opening at a core main surface. The ceramic chip is accommodated in the housing opening portion so that the core main surface and a chip first main... Agent: Stites & Harbison PLLC

20090255720 - Ground-plane slotted type signal transmission circuit board: A ground-plane slotted type signal transmission circuit board is proposed, which is designed for use with a high-speed digital signal processing system for providing a low-loss signal transmission function. The proposed circuit board structure is characterized by the formation of a slotted structure (i.e., elongated cutaway portion) in the ground... Agent: Edwards Angell Palmer & Dodge LLP

20090255721 - Circuit board assembly: A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and... Agent: Morgan Lewis & Bockius LLP

20090255722 - Printed circuit board having landless via hole and method of manufacturing the same: This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of... Agent: Staas & Halsey LLP

20090255723 - Printed circuit board with ground grid: A printed circuit board with ground grid includes a first insulating plate, a plurality of first metal lines formed on the first insulating plate, a sub-circuit board above the plurality of first metal lines, a second insulating plate above the sub-circuit board, a plurality of second metal lines formed on... Agent: Hdls Patent & Trademark Services

20090255724 - Sealed housing, a kit of parts including at least one housing, a combination including the housing or a kit of parts and a use of a friction enhancing element: A sealed housing (10) accommodates at least one electric or electronic component (12, 14), and has a portion (20) extending through the mounting surface, as well as a rotation preventor (16, 28) preventing rotation of the housing (10) relative to the mounting surface. A kit of parts includes at least... Agent: 3m Innovative Properties Company

20090255725 - Integrated wi-fi service enclosure: An in-wall enclosure for housing a wireless network device and broadband connectivity equipment together. The enclosure is attached to a wall stud in a location pre-determined to be the optimum place to maximize wireless coverage within the structure. An electrical outlet is wired to the enclosure to provide power. Cables... Agent: Raymon L. Fasnacht

20090255726 - Cushioning member and electronic device with such cushioning member: A cushioning member for use in a circuit board includes an elastic main body and a fixing element. The fixing element is coupled with the elastic main body and aligned with a perforation of the circuit board. The fixing element includes an extension part and a fastening part. The extension... Agent: Austin Rapp & Hardman

20090250235 - Shielded electric cable assembly: An electric cable assembly may include an electric cable and a conductive contact. The electric cable has a conductive core, an inner insulation jacket surrounding the conductive core, a conductive layer surrounding the inner insulation jacket, and an outer insulation jacket surrounding the conductive layer. The conductive contact is injection... Agent: Delphi Technologies, Inc.

20090250236 - Flexible mechanical packaging form factor for rack mounted computing devices: The present invention comprises a dual-use form factor for rack mounting equipment. In particular, the form-factor is configured so that it can be both rack-mounted directly or installed within a chassis. In addition, the form-factor may comprise one or more blind-mate connector systems that are suitable for blunt-type connectors, such... Agent: Knobbe Martens Olson & Bear LLP

20090250237 - Bus bar mounting assembly: The present invention is intended to provide a novel assembly for properly or accurately mounting the terminal portion of the bus bar on the terminal-accommodating portion of a body for an electric junction box without doing any harm to an electrical conduit(s) which is disposed within the electric junction box.... Agent: Edwards Angell Palmer & Dodge LLP

20090250238 - Metal sheathed cable assembly: A Metal-Clad cable that includes at least two conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective layer... Agent: Tyco International Management Corp.

20090250239 - Metal sheathed cable assembly: An AC cable that includes at a plurality of conductor assemblies within a metal armored sheath. Each conductor assembly has an electrical conductor, an insulation layer extending around and along the length of each of the electrical conductors, a jacket layer disposed around the insulating layer and a polymeric protective... Agent: Tyco International Management Corp.

20090250240 - Easily strippable electric cable: The present invention relates to an electric cable comprising one or more insulated electrical conductors forming a set of insulating conductors extending longitudinally inside a protective sheath, the inside surface of said protective sheath having at least two longitudinal grooves for the purpose of enabling the protective sheath to be... Agent: Sofer & Haroun LLP.

20090250241 - Cable and process for manufacturing the same: A cable for applications which entails heavy mechanical stresses and/or harsh environmental conditions includes at least one core having at least one transmissive element and an outer sheath disposed in radially external position with respect to the core. The outer sheath includes a reinforcing layer including a fibril reinforced polymeric... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090250242 - Tinsel wire: A tinsel wire is provided, which has a high mechanical strength as an electric power supplying conductor wire, hardly breaks with respect to a vibration of the diaphragm, has small dynamic resistance even in a vibrating atmosphere, has excellent flexing characteristics, thereby improving quality and reliability as a product, enables... Agent: Kratz, Quintos & Hanson, LLP

20090250243 - Arc resistant and smooth wire: A wire is constructed having a conductor, a primary insulation layer and a secondary insulation layer. A third insulation layer is applied over the second insulation layer, where the third insulation layer includes the only marking additives used in the three insulation layers of the wire.... Agent: Sofer & Haroun LLP.

20090250244 - Transparent conductive film, display device, and manufacturing method thereof: A transparent conductive film having a multilayer film of two or more layers (a pixel electrode, a gate terminal pad, and a source terminal pad) includes a first transparent conductive film having an amorphous structure, and a second transparent conductive film, formed over the first transparent conductive film, and having... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090250245 - Cable holding and positioning device: A cable holding and positioning device is enclosed that comprises a tubular member having a first end and second end disposed opposite the first end and a cover disposed over the second end of the tubular member that includes a slit with an aperture. The cover secures one or more... Agent: Marshall, Gerstein & Borun LLP

20090250247 - Circuit board and manufacturing method thereof: A circuit board including a first dielectric layer having a first surface and a second surface, a first circuit layer, a second dielectric layer, and a second circuit layer is provided. At least one trench is formed on the first surface, and the first circuit layer is formed on an... Agent: J C Patents, Inc.

20090250246 - Solder by numbers, a method and system for populating printed circuit boards: An electronic circuit assembly comprises a printed circuit board including a plurality of electrically-conductive traces disposed on at least one face of the printed circuit board and a circuit schematic layout. The plurality of electrically-conductive traces is configured to mount and electrically couple a plurality of types of electronic devices.... Agent: Schneck & Schneck

20090250249 - Interposers, electronic modules, and methods for forming the same: Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.... Agent: Goodwin Procter LLP Patent Administrator

20090250248 - Support substrate structure for supporting electronic component thereon and method for fabricating the same: A support substrate structure for supporting an electronic component thereon comprises a thermal conductive substrate, a first ceramic layer, an insulating thermal conductive layer and a conductive pattern. The thermal conductive substrate has an upper surface and a lower surface; the first ceramic layer is disposed on the upper surface... Agent: Bacon & Thomas, PLLC

20090250250 - Electro-optical device and electronic apparatus: An electro-optical device includes an electro-optical panel, a first wiring board and a second wiring board. The first wiring board having a one-side first connection terminal electrically connected to the panel-side connection terminal at one end of a first wiring forming surface and having an other-side first connection terminal at... Agent: Advantedge Law Group, LLC

20090250251 - Circuit device and method for manufacturing the circuit device: A circuit device (10) has a structure where a wiring layer (20), an insulating resin layer (30) and a circuit element (40) are stacked in this order by a pressure bonding. The wiring layer (20) is provided with bump electrodes (22) in positions that correspond respectively to element electrodes of... Agent: Mcdermott Will & Emery LLP

20090250252 - Printed circuit board: A first insulating layer is formed on a suspension body and a wiring trace is formed on the first insulating layer. In addition, a ground trace is formed on the first insulating layer so as to extend along the wiring trace on one side of the wiring trace with a... Agent: Panitch Schwarze Belisario & Nadel LLP

20090250253 - Printed circuit board and manufacturing method thereof: Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes: providing a first resin layer having a first pattern on one surface thereof; forming a conductive bump, which is electrically connected... Agent: Staas & Halsey LLP

20090250255 - Connections for electronic devices on double-sided circuit board: In the present electronic structure, a substrate is provided in the form of a circuit board. First and second electronic devices are positioned on opposite sides of the circuit board, each having a plurality of contacts connected to the circuit board. Each of the contacts of the first device is... Agent: Paul J. Winters

20090250257 - Electronic parts packaging structure and method of manufacturing the same: An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess... Agent: Kratz, Quintos & Hanson, LLP

20090250254 - Methods for configurable manufacturing and apparatus: A method of manufacturing industrial controls includes partially assembling a pre-product at a first stage in manufacturing, including at least partially populating a printed circuit board with generic components and/or laser trimmable components, storing the pre-product for later manufacturing stages. The method further includes populating the printed circuit board with... Agent: Rockwell Automation, Inc. Attention: Susan M. Donahue

20090250256 - Socket contact terminal and semiconductor device: A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having... Agent: Sughrue Mion, PLLC

20090250258 - Wiring substrate, semiconductor package, electronic instrument, and wiring substrate manufacturing method: One embodiment of the invention is a wiring substrate including an insulating base material layer, a metal layer on the insulating base material layer, and a solder resist laminated to the most superficial surface of the wiring substrate above the insulating base material layer, wherein the metal layer has a... Agent: Squire, Sanders & Dempsey L.L.P.

20090250259 - Multilayered printed circuit board and method of manufacturing the same: Disclosed herein is a multilayered printed circuit board, including: a build-up layer including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer, including bumps, formed on the outermost circuit layer of one side of the build-up layer; and a solder resist layer formed on... Agent: Staas & Halsey LLP

20090250260 - High density circuit board and manufacturing method thereof: In accordance with the present invention, a high density circuit board includes a substrate with fine circuit patterns impregnated inside top and bottom parts; a via formed inside the substrate to electrically conduct the fine circuit patterns of the top and bottom parts of the substrate each other; pads formed... Agent: Staas & Halsey LLP

20090250261 - Seal structure: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing,... Agent: Harness, Dickey & Pierce, P.L.C

20090250262 - Inductor with patterned ground plane: An inductor with patterned ground plane is described. In one design, the inductor includes a conductor formed on a first layer and a patterned ground plane formed on a second layer under the conductor. The patterned ground plane has an open center area and a shape matching the shape of... Agent: Qualcomm Incorporated