Electricity: conductors and insulators patents - Monitor Patents
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Electricity: conductors and insulators

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
12/18/2014 > 30 patent applications in 20 patent subcategories.

20140367135 - Pressurized electromechanical cable: An inventive pressurized cable is provided that simultaneously provides electrical connections and a supply of air, gas, or vacuum to an electromechanical device utilizing an existing connection on the device. The use of an existing cable connection for the supply of air or gas to provide positive pressure or a... Agent:

20140367136 - Screwless and seamless cover plates, receptacles, and cover plate assemblies for electrical fixtures with one or more components that attach independently of the wall finish or wallboard or optionally provide an ac or dc power conserving switch and/or adj: Cover plates, receptacles, and cover plate assemblies are provided for electrical fixtures including a screwless cover plate, receptacle, and/or cover plate assembly for electrical devices, wherein one or more components of the assembly are provided with replaceable movement or attachment to one or more other parts of the cover plate... Agent:

20140367137 - Arm assembly for holding an electronic device: An articulated arm assembly for holding an electronic device includes a base having an enclosing housing defining a first channel, and an extension having a proximal end rotatably coupled with the base. The extension has an enclosing housing defining a second channel in communication with the first channel A forearm... Agent: Master Group Asia Ltd.

20140367138 - Power adapter: A cable holder unit can include an equipment power cable that includes an equipment plug end, a cable reel for storage of the equipment power cable, an electrical connector electrically coupled to the equipment power cable, and a coupling mechanism. Such a cable holder unit may optionally couple to a... Agent:

20140367163 - Conductor spool and optical fiber / electrical composite cable with conductor spool assembly: A conductor spool with a frame is provided with a plurality of first fingers, the first fingers and the frame defining a first spool surface. The frame is provided with an entry slot and an exit slot, a retainer gasket coupled to the frame proximate each of the entry slot... Agent:

20140367139 - Cable collector: The present invention relates to a cable collector (1; 101; 201; 301) for collecting and managing a cable (8), for connecting an audio device (20) to user equipment, by means of a connection plug (9) fixed to one end of the cable. The cable collector comprises: a) a main body... Agent: Zound Industries International Ab

20140367164 - Joint including two sections of a power cable and a method for joining two sections of a power cable: A joint including two sections of an electric power cable, each cable section including at least one core member surrounded by a first armouring layer for protecting the core member from tensile forces acting on the cable, the first armoring layer including a plurality of armoring wires arranged along the... Agent:

20140367140 - Coaxial cable: A coaxial cable includes a center conductor, an insulating foam provided to cover an outer periphery of the center conductor, and a protruding portion provided around an outer surface of the insulating foam to absorb stress. The protruding portion has a waved shape that oscillates in a circumferential direction of... Agent:

20140367141 - Electric cable: An electric cable for improving flexibility of an insulating resin portion of the electric cable expressed by a secant modulus value is provided. In an electric cable 10a in which an outer periphery of a conductor 11 made of wires with diameters from 0.15 to 0.5 mm and having a... Agent:

20140367143 - Coaxial cable: A coaxial cable includes a center conductor, an insulating layer including a foam layer covering an outer periphery of the center conductor and a solid layer covering an outer periphery of the foam layer, and a protruding portion provided around an interface between the foam layer and the solid layer... Agent: Hitachi Metals, Ltd.

20140367142 - Method for manufacturing a reinforced overhead multipurpose cable for outside telecommunication: The invention relates to a method for manufacturing reinforced overhead multipurpose cable for outside telecommunications of Voice, Video, and Data Distribution (VVDD) type. The reinforced overhead multipurpose cable comprises a dry and multipair construction core, electromagnetic shielding elements and external protection thermoplastic cover, characterized because it includes one or several... Agent: Servicios Condumex

20140367144 - Halogen-free flame-retardant resin composition, and wire and cable using the same: A halogen-free flame-retardant resin composition includes a base polymer including not less than 5 mass % of an ethylene-α-olefin block copolymer having a melting point of not less than 118° C. and a glass transition temperature (Tg) of not more than −40° C., and a metal hydroxide added in an... Agent:

20140367145 - Method of manufacturing an elongated electrically conducting element: A method of manufacturing an elongated electrically conducting element having functionalized carbon nanotubes and at least one metal, includes the steps of mixing functionalized carbon nanotubes with at least one metal, to obtain a composite mixture, and forming a solid mass from the composite mixture from step (i). A solid... Agent:

20140367146 - Apparatus and method for forming wire: An apparatus and method for forming a single strand wire with improved flexibility and a stranded cable from a single strand wire. In one embodiment, the flexible single strand wire has a solid, single strand wire body and at least one helical groove formed on an outer circumferential surface of... Agent:

20140367147 - Insulating resin composition for printed circuit board, insulating film, prepreg and printed circuit board: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so... Agent: Samsung Electro-mechanics Co., Ltd.

20140367148 - Touch panel and manufacturing method thereof: Disclosed are an optical member, a display device including the optical member and a method of fabricating the optical member. The display device includes a light source; a wavelength conversion member into which light generated from the light source is incident; and a display panel into which light is incident... Agent:

20140367150 - Prepreg, metal-clad laminate, and printed wiring board: s

20140367149 - Resin composition for printed circuit board, build-up film, prepreg and printed circuit board: Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film prepared by using a resin composition containing a cage type silsesquioxane instead of the epoxy resin, and a multilayer printed... Agent: Samsung Electro-mechanics Co., Ltd.

20140367151 - Transparent electrode: Disclosed herein is a transparent electrode, including: a colorless transparent polyimide film substrate; and a conductive layer formed on the substrate and including a conductive material containing carbon nanotubes, wherein the conductive layer includes a polymer binder. The transparent electrode is advantageous in that carbon nanotubes strongly adhere to a... Agent: Kolon Industries, Inc.

20140367154 - Capacitor arrangement structure and method of mounting capacitor: A capacitor arrangement structure includes: a first wiring pattern; a second wiring pattern; a first electrode pattern that protrudes from the first wiring pattern toward the second wiring pattern; a second electrode pattern that protrudes from the second wiring pattern toward the first wiring pattern so as to run in... Agent:

20140367153 - Chip resistor and mounting structure thereof: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from... Agent: Rohm Co., Ltd.

20140367155 - Component-embedded printed circuit board and method of forming the same: c

20140367156 - Electronic component mounting structure: An electronic component mounting structure includes a three-dimensional substrate having a three-dimensional shape and including a hollow portion formed on at least one of side surfaces of the three-dimensional substrate, and an electronic component mounted on a bottom face of the hollow portion. The three-dimensional substrate includes an opening portion... Agent: Olympus Corporation

20140367152 - Multilayer ceramic capacitor and board having the same mounted thereon: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and... Agent: Samsung Electro-mechanics Co., Ltd.

20140367158 - Electromagnetic protection device able to protect a microwave connection between a connector and a microwave element: In the field of wideband microwave circuits placed in a housing, an electromagnetic protection device able to protect a microwave connection between a coaxial microwave connector placed on a housing and at least one element of a microwave circuit contained in said housing is provided. The device is formed by... Agent:

20140367157 - Shield shell and shield connector: The present invention concerns a shield shell (70) to be connected to a case made of metal and including a shell main body (71) with a case connecting portion (74) to be connected to the case, a single collective shield connecting portion (72) provided on the shell main body (71)... Agent:

20140367159 - Substrate structure: A substrate structure includes: a first substrate; a second substrate including a front face disposed so as to face a front face of the first substrate, a substrate spacing holding member provided between the front faces of the substrates facing each other, and holds a spacing between the two substrates... Agent: Olympus Medical Systems Corp.

20140367160 - Electric magnetic shielding structure in packages: A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of... Agent:

20140367161 - Cable management in rack systems: A rack system includes one or more racks each configured to receive at least one distribution module. Each rack includes management sections located at the front of the rack; troughs located at the rear of the rack; horizontal channels extending between the management sections and the trough; a storage area... Agent:

20140367162 - Universal box system: A universal electrical box which includes a body having at least one opening for receiving an electrical device. The device can also include at least one mounting bracket coupled to the body, and at least one frame configured to be coupled to the at least one body. In addition there... Agent: Leviton Manufacturing Co., Inc.

  
12/11/2014 > 31 patent applications in 21 patent subcategories.

20140360773 - Electrically insulated screen and method of erecting an electrically insulated screen: A method of erecting an electrically insulated screen for a metal scaffold in a defined area with live electrical cables, the method comprising the steps of: erecting a first portion of the screen to a first screen height along a first screen length in the defined area; affixing the first... Agent: Synergy Scaffolding Holdings Pty Ltd.

20140360747 - Shield grounding device: A shield grounding device includes: a grounding angle steel (1); a flat iron (9) mounted on a top portion of the shield grounding device; and a laminated board (5) connected to overground wires; wherein two shield connection boards (2) vertical to each other are respectively connected to two external surfaces... Agent:

20140360748 - Feedthrough assembly including a capacitive filter array: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may... Agent:

20140360750 - Busbar: A bus bar including a bus bar pin that is mounted onto a circuit board, the bus bar including a base part that is disposed along the circuit board and supports the bus bar pin, and a pair of support columns that are formed at both ends of the base... Agent: Kayabad Industry Co., Ltd

20140360749 - Spring plate for attaching bus bar to a printed circuit board: Bus bar or power connector connections that are reliable and provide a reduced connection impedance. One example may provide a reliable connection by providing a spring plate. The spring plate may be arranged to hold a bus bar or other power conductor to a printed circuit board. The spring plate... Agent:

20140360751 - Support frame for structured cabling system: A support frame (10) for a cabling trunk assembly (1) is disclosed. In one embodiment, the support frame (10) has a main body (11) defining a mounting surface (41), and a first extension leg (50) extending along a first side edge (42) of the main body (11) and away from... Agent:

20140360752 - Cable backplane system: A cable backplane system includes a backplane having a plurality of openings therethrough and a cable rack coupled to a rear of the backplane. The cable rack includes a tray having a frame surrounding a raceway and a brick held by the tray. The brick has side spacers at opposite... Agent:

20140360753 - Guide features for a cable backplane system: A cable backplane system includes a backplane having a plurality of openings therethrough. A cable rack is coupled to a rear of the backplane, which includes a tray and spacers coupled to the tray that have guide pins. Cable connector assemblies are held by the tray. Removable dust caps are... Agent:

20140360754 - Environmentally robust pivot joint adaptor: An environmentally robust pivot joint adaptor for use in a pivoting pole assembly comprising a lower pole section and an upper pole section. The pivot joint adaptor includes a lower adaptor comprising a lower pivot member defining a first central wiring passage and an upper adaptor comprising an upper pivot... Agent:

20140360755 - Connector arrangements for shielded electrical cables: Various high speed shielded cables are used in combination with a connector assembly. The connector assembly includes a plurality of electrical terminations in electrical contact with the conductor sets of the cable at a first end of the cable, the electrical terminations configured to make electrical contact with corresponding mating... Agent:

20140360756 - Electrically insulated wire: An electrically insulated wire includes a rectangular conductor having a substantially rectangular cross section with corners shaped in a circular arc, and an electrical insulating coating formed by heating an electrical insulating varnish applied to coat an outer periphery of the rectangular conductor. The electrical insulating coating includes a thickest... Agent: Hitachi Metals, Ltd.

20140360758 - Photosensitive resin composition, cured product thereof, and printed wiring board: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent,... Agent: Taiyo Holdings Co., Ltd.

20140360757 - Transparent conductive film having anisotropic electrical conductivity: A transparent conductive film module is provided which includes a first transparent conductive film and a second transparent conductive film, which are transparent conductive films with metal embedded grids and have grid-like grooves evenly filled with conductive material. The slope of the grid metal lines in the first transparent conductive... Agent: Nanchang O-film Tech. Co., Ltd.

20140360761 - Printed circuit board and method of manufacturing the same: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns... Agent:

20140360759 - Wiring board and method for manufacturing the same: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second... Agent: Ibiden Co., Ltd.

20140360760 - Wiring substrate and manufacturing method of wiring substrate: A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of... Agent: Shinko Electric Industries Co., Ltd.

20140360763 - Conductive paste and method for producing conductive pattern: A conductive paste includes: composite particles (A) formed by coating a surface of a core material composed of an inorganic material with an antimony-containing compound; a compound (B) having an acid value of 30 to 250 mg KOH/g; and a conductive filler (C).... Agent: Toray Industries, Inc.

20140360762 - Metal precursor powder, method of manufactuirng conductive metal layer or pattern, and device including the same: A metal precursor powder, a method of manufacturing a conductive metal layer or pattern, and an electronic device including the same, are provided, and in the metal precursor powder, the Gibbs free energy change of hydrogen removal at a temperature range of −25° C. to 25° C. is −100 kJ/mol... Agent: Korea Institute Of Machinery & Materials

20140360764 - Multilayer ceramic capacitor and board for mounting the same: A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrode groups disposed to be misaligned by a predetermined interval in the length direction, having the dielectric layers interposed therebetween; first and second external electrodes extended from at least one of the first and second... Agent: Samsung Electro-mechanics Co., Ltd.

20140360765 - Wiring substrate and manufacturing method of wiring substrate: A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially... Agent: Shinko Electric Industries Co., Ltd.

20140360769 - Arrangement for connecting a pluggable transceiver: An apparatus including a socket forming at least one compartment together with a printed circuit board assembly. The compartment including a first side wall, a second side wall, a ceiling, and an opening for receiving one pluggable transceiver, such that when the pluggable transceiver is inserted into the opening, a... Agent: Telefonaktiebolaget L M Ericsson (publ)

20140360766 - Package for multiple light emitting diodes: Substrates and packages for LED-based light devices can significantly improve thermal performance and provide separate electrical and thermal paths through the substrate. One substrate includes multiple electrically insulating base layers. On a top one of these layers are disposed top-side electrical contacts, including light device pads to accommodate a plurality... Agent: Ledengin, Inc.

20140360768 - Semiconductor package board and method for manufacturing the same: Disclosed herein are a semiconductor package board and a method for manufacturing the same. The semiconductor package board according to a preferred embodiment of the present invention includes an insulating layer; a first circuit layer formed on one surface of the insulating layer and including a bump pad; a post... Agent: Samsung Electro-mechanics Co., Ltd.

20140360767 - Wiring board and method for manufacturing the same: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second... Agent: Ibiden Co., Ltd.

20140360770 - Printed circuit board: An exemplary printed circuit board includes a planar base, a first signal via defined in the base, a second signal via defined in the base, a first ground via defined in the base adjacent to the first signal via, a second ground via defined in the base adjacent to the... Agent:

20140360771 - Magnetic shielding device and wire harness: An electromagnetic shielding device includes a conductive sheet that is a sheet-shaped flexible conductive member that can be deformed into a tube shape, and an outer edge portion coupling member that keeps the conductive sheet in a tube shape in a state in which a first outer edge portion and... Agent:

20140360772 - Deflectable conductive gasket with environmental seal: A deflectable gasket assembly for EMI shielding and environmental sealing is described. The gasket assembly is formed from an electrically-conductive mesh sheet positioned between adjacent conductive surfaces. A gasket is provided at the outer boundaries of the mesh sheet for environmental protection. The edge of the gasket has a branched... Agent: Parker-hannifin Corporation

20140360774 - Wire protection structure: A wire protection structure includes a housing, a holder that is received in the housing through an opening of the housing, a cover that covers at least a part of the opening of the housing to define a wire-drawn port with the holder being received in the housing, and an... Agent: Yazaki Corporation

20140360775 - Cable protective bushing for terminal display stand: Disclosed herein is a cable protective bushing for a terminal display stand which is configured such that an antitheft cable connected to a terminal can be prevented from being damaged by being scraped on a corner or an edge of the display stand while the cable is repeatedly extracted from... Agent:

20140360776 - Conduit connectors and methods for making and using the same: In one embodiment, the conduit connector can comprise: a body comprising an open side, wherein the body is capable of receiving a conduit in a receiving end, wherein the open side extends from a receiving end to a connecting end; a back component configured to engage and close a portion... Agent:

20140360777 - Network interface device conduit fitting: A conduit fitting for connecting a conduit to a NID. The fitting includes a tube with an inner diameter and an outer diameter, and a flange at one end of the tube. The inner diameter is configured to provide a tight fit over a piping and the outer diameter is... Agent: Afl Telecommunications LLC

  
12/04/2014 > 34 patent applications in 21 patent subcategories.

20140352998 - Generator connection box for photovoltaic installations: A generator junction box for a photovoltaic generator is presented, which has a junction box housing with a back wall and a surrounding side wall, and input modules, each with an integrated quick connector for connecting a generator string line to the associated input module, wherein the input modules are... Agent:

20140352999 - Iron bus bar having copper layer, and method for manufacturing same: The present invention related to an iron bus bar coated with copper and a method of manufacturing the same. The present invention provides an iron bus bar including an iron core and a copper layer applied on the iron core, and a method of manufacturing the same. According to the... Agent: Korea Institute Of Industrial Technology

20140353029 - Harness: A harness including a twisted wire pair that can reduce noise and has an excellent assembly performance is provided. A harness includes a connector and two twisted wire pairs in which terminals for connection to the connector are crimped to the end portions. The twisted wire pairs are untwisted from... Agent: Sumitomo Wiring Systems, Ltd.

20140353030 - Composite wire and contact element: The invention relates, in particular, to a composite wire which according to the invention has a structure having a core made of steel or a steel alloy and a copper alloy layer surrounding the core.... Agent: Feindrahtwerk Adolf Edelhoff Gmbh & Co. Kg

20140353031 - Method of assembling a transducer assembly: A method of assembling a transducer assembly comprising a transducer and a conductor element, where one of the transducer and the conductor element includes holes and conducting parts, each conducting part being exposed in or at a hole and the other of the transducer and the conductor element includes elevated,... Agent: Sonion Nederland Bv

20140353000 - Electrical insulation system: A system and a method are presented. The system includes an electrically conducting material and an electrical insulation system. The electrical insulation system includes a layered insulation tape that has a first layer and a second layer. The first layer includes a mica paper and a binder resin in a... Agent:

20140353001 - Leads containing segmented electrodes with non-perpendicular legs and methods of making and using: A method of making an electrical stimulation lead method includes attaching a pre-electrode to a lead body. The pre-electrode is a single, unitary, undifferentiated construct with a ring-shaped exterior. The method further includes attaching a plurality of conductor wires to the pre-electrode; and, after coupling to the lead body, removing... Agent: Boston Scientific Neuromodulation Corporation

20140353002 - Electrically conductive wire and method of its production: An electrically conductive wire (D) is provided which is constructed on the basis of copper and which includes a core (1) as well as a layer (2) metallically connected to the layer (2), while the layer (2) has a proportion of the wire cross section which is between 20% and... Agent:

20140353004 - Insulation resin composition for printed circuit board having improved thermal conductivity and electrical properties, insulating film, prepreg and printed circuit board: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.... Agent: Samsung Electro-mechanics Co., Ltd.

20140353005 - Method of making microwave and millimeterwave electronic circuits by laser patterning of unfired low temperature co-fired ceramic (ltcc) substrates: Disclosed are methods of using a laser to pattern unfired, screen printed metallization on unfired (green) LTCC tape material by a subtractive process especially on the internal layers of an LTCC circuit.... Agent: E I Du Pont De Nemours And Company

20140353003 - Touch-screen conductive film and manufacturing method thereof: A touch-screen conductive film includes a transparent substrate, a conductive layer and a lead electrode. The transparent substrate includes a first area, and a second area disposed surrounding the first area; the conductive layer is disposed on the first area of the transparent substrate; the lead electrode is disposed on... Agent: Shenzhen O-film Tech Co., Ltd.

20140353006 - Multilayer circuit board and method for manufacturing same: A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a... Agent: Zhen Ding Technology Co., Ltd.

20140353007 - Wired circuit board: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side... Agent: Nitto Denko Corporation

20140353008 - Assembling structure of heat dissipation device: An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member.... Agent: Asia Vital Components Co., Ltd.

20140353009 - Transparent conductive film: A transparent conductive film, includes: a transparent substrate, wherein a transparent substrate includes a body and a flexible board, a width of flexible board is less than that of the body, and the body includes a sensing area and a border area located at an edge of the sensing area;... Agent: Suzhou O-film Tech Co., Ltd.

20140353014 - Combined circuit board and method of manufacturing the same: A combined circuit board including a flexible circuit board (FCB), a rigid circuit board (RCB), and first and second conductive vias (CVs) is provided. The FCB includes a flexible dielectric layer (DL) and a circuit layer (CL) disposed thereon. The RCB includes a rigid DL and a CL including a... Agent: Mutual-tek Industries Co., Ltd.

20140353010 - Electronic component and method of manufacturing the electronic component: An electronic component includes a flexible printed circuit board which has a main body, a fixing portion and a connecting portion, and an insulating portion integrally molded to the fixing portion. In the process of the insulating portion being molded to the fixing portion, a filling mold fixture is sleeved... Agent: Cheng Uei Precision Industry Co., Ltd.

20140353011 - Flexible circuit connecting device: A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like structure and formed on the first surface and/or the second surface. The conductive traces of the above flexible circuit connecting device are nearly aligned with... Agent: Suzhou O-film Tech Co., Ltd.

20140353012 - Transparent conductive film: A transparent conductive film includes: a transparent substrate, a conduction line, a first conductive layer, a first matrix layer, and a second conductive layer. The transparent substrate includes a body and a flexible board, and the body includes a sensing area and a border area; the first conductive layer is... Agent: Suzhou O-film Tech Co., Ltd.

20140353013 - Transparent conductive film: A transparent conductive film, including: a transparent substrate, including a body and a flexible connecting component extending from a side of the body, where a width of the flexible connecting component is less than a width of the side of the body from which the flexible connecting component extends, a... Agent: Shenzhen O-film Tech Co., Ltd.

20140353016 - Circuit substrate and method of forming circuit pattern: With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having... Agent: Toray Engineering Co., Ltd.

20140353015 - Solder joint for an electrical conductor and a window pane including same: A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint... Agent:

20140353018 - Interlayer connection substrate and its manufacturing method: An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate... Agent: Hitachi, Ltd.

20140353017 - Printed wiring board and method for manufacturing the same: A wiring board includes a core substrate including an insulative substrate and a first inner conductive-circuit layer formed on first surface of the insulative substrate, an electronic component positioned in a penetrating hole formed in the insulative substrate and having a positive electrode terminal on first end portion and a... Agent: Ibiden Co., Ltd.

20140353019 - Formation of dielectric with smooth surface: Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface,... Agent:

20140353020 - Touch panel: A touch panel defines a touch region and a routing region. The touch panel includes a substrate, a transparent conductive layer, at least one electrode and at least one lead wire. The substrate has a surface and includes a planar part and a folded part extending from the planar part.... Agent:

20140353021 - Wiring board and method of manufacturing the same: A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1... Agent: Kyocera Slc Technologies Corporation

20140353022 - Wiring board: A wiring board includes a substrate having a laminated-inductor forming portion and including multiple first insulation layers and a second insulation layer formed on a first side of the first insulation layers such that the first insulation layers have the laminated-inductor forming portion, and a planar conductor formed on the... Agent: Ibiden Co., Ltd.

20140353023 - Printed circuit board: A printed circuit board (PCB) includes a board body including a top layer, a bottom layer, and a number of reference layers arranged between the top layer and the bottom layer. First and second pads are arranged on the top layer and connected to signal transmission lines of the top... Agent:

20140353024 - Wiring board unit, manufacturing method thereof, and manufacturing method of wiring board with lead: A wiring board unit includes: a polygonal wiring board having three or more sides in top view, a product insulating part comprising a plurality of external terminals, and a dummy insulating part at an outer edge of one of the at least three sides; and a lead frame including a... Agent: Ngk Spark Plug Co., Ltd.

20140353025 - Printed circuit board: A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a via hole formed in the second insulating layer. The pad has a surface that is non-planar.... Agent: Samsung Electro-mechanics Co., Ltd.

20140353026 - Wiring board: A wiring board according to the present invention includes an insulating layer 3, a semiconductor element mounting portion 1a, semiconductor element connection pads 11, via holes 8, and via conductors 10. The semiconductor element connection pads 11 aligned on the semiconductor element mounting portion 1a include first semiconductor element connection... Agent: Kyocera Slc Technologies Corporation

20140353027 - Printed wiring board and method for manufacturing printed wiring board: A printed wiring board includes an insulative substrate having a penetrating hole, a first conductive layer formed on a first surface of the insulative substrate, a second conductive layer formed on a second surface of the insulative substrate, and a through-hole conductor formed in the penetrating hole through the insulative... Agent: Ibiden Co., Ltd.

20140353028 - Alternative manufacturing processes for aluminum enclosures: Methods for forming aluminum enclosures for consumer products are described. Included are methods for forming features, such as brackets or supports for supporting one or more internal components of the consumer product. In some embodiments, methods involve shaping integral features into the aluminum enclosures. In some embodiments, methods involve molding... Agent: Apple Inc.

  
11/27/2014 > 41 patent applications in 23 patent subcategories.

20140345899 - Water resistant structure and electronic apparatus: A water resistant structure includes a first member having a stepped portion at an opening thereof; a second member having a rib protruding from a back surface thereof; and a water-stop member having an elastically deformable water-stop portion at a tip of a second plate portion that extends upward from... Agent: Fujitsu Limited

20140345900 - Electric wire holding structure: An electric wire holding structure includes a wiring passage in a shape of a groove in which an electric wire is arranged, and a lock part which is formed at a midstream of the wiring passage and which holds the electric wire in the wiring passage. The lock part has... Agent: Yazaki Corporation

20140345935 - Ground structure of controller mounted in construction machine: A ground structure of a controller that is mounted in a construction machine such as a dump truck and has a case having an upper surface on which a connector receiver hole for a receptacle connector to be received is provided includes: a cable harness that is provided by a... Agent: Komatsu Ltd.

20140345936 - Wiring harness and relay harness: A relay harness (30) connects a first harness (10) and a second harness (20). The relay harness (30) includes relay wires (31) and first and second housings (36, 37) connected to ends of the relay wires (31). Each relay wire (31) has a third conductor (32) surrounded by a third... Agent: Sumitomo Electric Industries, Ltd.

20140345937 - Cable connector assembly: A cable connector assembly (100) includes a connector (1), a cable (2) connected to the connector, a magnetic element (3) encircling the cable, and a housing (4) covering the magnetic element. The housing includes a front wall (40) adjacent to the connector, a rear wall (41) away from the connector,... Agent: Hon Hai Precision Industry Co., Ltd.

20140345938 - High voltage electrical connector: An electrical connector for connecting a conductor with three fixations and particularly suitable for medium and high voltage applications. The connector body includes a body part with an inner profile adapted to receive the conductor and a cover part provided with two keepers that are fastened to the body part... Agent: Tyco Electronics Simel Sas

20140345939 - Joining method, method for producing electronic device and electronic part: In joining a first metal member composed of a first metal to a second metal member composed of a second metal with a joining material interposed therebetween, the joining material including a low melting point metal having a lower melting point than the first metal and/or the second metal, the... Agent:

20140345901 - Wiring support structure: Configured is a wiring support structure provided with a column portion fixed to or provided integrally with an installation object in which wiring is installed, and provided so as to project from the installation object, a wiring support portion having a wiring arrangement portion that is arrangeable so as to... Agent: Nabtesco Corporation

20140345902 - Shielded electrical cable: A shielded electrical cable includes a conductor set and two generally parallel shielding films disposed around the conductor set. The conductor set includes one or more substantially parallel longitudinal insulated conductors. The shielding films include a parallel portion wherein the shielding films are substantially parallel. The parallel portion is configured... Agent:

20140345903 - High density shielded electrical cable and other shielded cables, systems, and methods: A shielded electrical ribbon cable includes conductor sets each including one or more insulated conductors, and a first and second shielding film on opposite sides of the cable. In transverse cross section, cover portions of the shielding films substantially surround each conductor set, and pinched portions of the films form... Agent:

20140345904 - Wiring structure of electric wire and electric wire with exterior member: Disclosed is a wiring structure of an electric wire and an electric wire with an exterior member improving degree of degree of freedom for wiring pathways, downsizing wiring space, and streamlining wiring workability. In An electric wire with exterior member provided with an electric wire and an exterior member, the... Agent:

20140345905 - Electrical cable comprising at least one electrically insulating layer: An electrical cable has an elongate electrical conductor having, in cross section, a plurality of mutually electrically insulated segments having a plurality of metallic wires, at least one of the metallic wires in at least one of the segments being covered by at least one electrically insulating layer. The electrically... Agent:

20140345906 - Insulated composite power cable and method of making and using same: An insulated composite power cable having a wire core defining a common longitudinal axis, a multiplicity of composite wires around the wire core, and an insulative sheath surrounding the composite wires. In some embodiments, a first multiplicity of composite wires is helically stranded around the wire core in a first... Agent:

20140345907 - Electrical conduction device, overhang corona shielding arrangement and method for producing an overhang corona shielding: An electrical conduction device is provided having an electrically conductive conduction element and an electrically insulating sheathing surrounding said conduction element at least in regions. An overhang corona shielding in the form of a coating composed of a material having a resistivity that increases towards an end of the sheathing... Agent: Siemens Aktiengesellschaft

20140345908 - Device for reducing the corona effect: The invention relates to a device for reducing the corona effect, which is applicable in particular to connection nodes between conductor tubes of a power substation, which includes an electrically conductive primary filamentous element wound onto itself forming an enveloping figure.... Agent: Sbi Connectors Espana, S.a.

20140345912 - Electric multilayer printed circuit board: The invention relates to an electric multilayer printed circuit board which satisfies the PICMG specification EXP.O, comprising a first signal layer and a second signal layer. The first signal layer comprises at least one first conductive path (33) and a first shielding region. The second signal layer comprises at least... Agent: Erni Production Gmbh & Co. Kg

20140345913 - Method and device of manufacturing printed circuit board: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer... Agent:

20140345910 - Method of forming conductive line, and device comprising the same: The present invention relates to a method for forming a conductive line, and a device comprising the conductive line. The method for forming a conductive line comprises: (A) providing a metal oxide composition which comprises a metal oxide, and a reducing agent; (B) applying the metal oxide composition on a... Agent: Innolux Corporation

20140345909 - Printed circuit board structure: A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20140345911 - Rigid flexible printed circuit board and method of manufacturing the same: A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay... Agent: Samsung Electro-mechanics Co., Ltd.

20140345915 - High pin count, small son/qfn packages: A plastic SON/QFN package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle.... Agent:

20140345914 - Metal-ceramic substrate and method for producing such a metal-ceramic substrate: A metal-ceramic substrate and to a method for the production thereof. The metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side... Agent:

20140345918 - Connection board, optoelectronic component arrangement and illumination device: A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through... Agent:

20140345917 - Double-sided transparent conductive film and touch panel: Provided are a double-sided transparent conductive film which is good in appearance even when its transparent conductive layers are patterned, and has anti-blocking property, thereby being producible at low costs; a wound body thereof; and a touch panel. The double-sided transparent conductive film includes a base material film, and a... Agent: Nitto Denko Corporation

20140345916 - Printed circuit board and method of manufacturing the same: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the... Agent: Samsung Electro-mechanics Co., Ltd.

20140345922 - Inkjet printed electronic device: A printed electronic device and a coating composition for forming a printed electronic device comprising an ink jet-receptive coating on a paper substrate.... Agent: Newpage Corporation

20140345921 - Nano wire composition and method for fabrication transparent electrode: Disclosed are a nanowire composition and a method of fabricating a transparent electrode. The nanowire composition includes a metallic nanowire, an organic binder, a surfactant, and a solvent. The metallic nanowire has a diameter of 30 nm to 50 nm, and a length of 15 μm to 40 μm, and... Agent:

20140345920 - Suspension board with circuit and method of manufacturing the same: Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection... Agent: Nitto Denko Corporation

20140345919 - Transparent conductor, method of manufacturing the same, and electronic device including the transparent conductor: A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture comprising the metallic glass; and firing the metallic glass or the mixture comprising the metallic glass at a predetermined temperature higher than a glass transition temperature of... Agent: Samsung Electronics Co., Ltd.

20140345923 - Reducing dielectric loss in solder masks: A circuit board may include a substrate, an interconnected structure associated with the substrate, and a solder mask associated with the interconnected structure and the substrate. The solder mask may be based on a mixture that includes epoxy and a powder. The powder may be hollow glass micro-balloons.... Agent:

20140345924 - Apparatus and associated methods: A substrate including a fluid reservoir and a connected fluid channel, the fluid reservoir positioned away from a component region of the substrate, the fluid channel configured to extend from the fluid reservoir to guide an electrically conductive fluid from the fluid reservoir at a reservoir end of the fluid... Agent: Nokia Corporation

20140345927 - Ceramic electronic component: A ceramic electronic component includes an electronic component body and a pair of metal terminals. The electronic component body includes a ceramic element assembly and outer electrodes. The pair of metal terminals are connected to the outer electrodes by a bonding member. Each of the pair of metal terminals includes... Agent: Murata Manufacturing Co., Ltd.

20140345929 - Electronic component housing package and electronic apparatus: While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric... Agent:

20140345928 - Electronic part, electronic apparatus, and moving object: An electronic part includes amount substrate, a circuit substrate, a pad disposed on the circuit substrate, a bump that connects the mount substrate and the pad to each other, and a surface protection film that extends from a surface of the pad via an outer circumferential edge of the pad... Agent: Seiko Epson Corporation

20140345925 - Multilayer ceramic capacitor and mounting board therefor: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and satisfying T/W>1.1 when a width thereof is defined as W and a thickness thereof is defined as T; first internal electrodes each having a first lead part exposed to at least one side surface of... Agent: Samsung Electro-mechanics Co., Ltd.

20140345926 - Multilayered ceramic capacitor and board for mounting the same: There is provided a multilayered ceramic capacitor including a ceramic body including a dielectric layer and having first and second main surfaces, first and second end surfaces, and first and second side surfaces; a first internal electrode having a first lead part; a second internal electrode having a second lead... Agent: Samsung Electro-mechanics Co., Ltd.

20140345930 - Packaging substrate having a passive element embedded therein: A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in... Agent:

20140345931 - Dual layered lead frame: A dual layered lead frame is provided with a die bonding layer and a solder layer. The dual layered lead frame has single lead frames arranged into a matrix layout with a cell gap formed between dual layered lead frame cells. Each dual layered lead frame cell includes a die... Agent:

20140345932 - Multi-layer printed circuit board and method for fabricating multi-layer printed circuit board: Embodiments of the present disclosure relate to the field of electronics and, in particular, to a multi-layer printed circuit board and a method for fabricating the same. The circuit board is able to avoid the problem that signal transmission performance is affected by a plated hole. The multi-layer printed circuit... Agent:

20140345933 - Adjustable plaster ring cover: A power distribution system has an electrical box configured to attach a power cable, a plaster ring releasably mounted to the box and one or more electrical devices installed into the ring. A pre-wired ground extends from a first end physically and electrically connected to a ground terminal on the... Agent: Protectconnect, Inc.

20140345934 - Laser braze ceramic to an implantable medical device housing: One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between... Agent:

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