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Electricity: conductors and insulators February patent applications/inventions, industry category 02/13

20130048331 - Lightning strike protection system: A protective system is provided including a material comprising a first and second surface opposite one another and a thickness, and where the first surface has a low-electrical resistance and the second surface has a high-electrical resistance that is higher than the electrical resistance of the low-electrical resistance surface, and... Agent:

20130048333 - Protective housing for electronic device: A protective housing for an electronic device includes a main body, a protective cover, and a connecting mechanism. The protective cover is rotatably and detachably mounted to the main body by the connecting mechanism. The connecting mechanism includes a first magnetic assembly, a second magnetic assembly, and a mounting base.... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.

20130048332 - Socket box: A socket box, equipped with means allowing it to be fixed to a circular opening made in the wall of a block of a building's wall upon an expansion effect of the socket box's structure, whose structure portions are displaced by using expansion screws, which, when turned, cause the socket... Agent: Torniplast Artefatos Plasticos Ltda

20130048334 - Junction box: A junction box for electrically connecting a photovoltaic (PV) module to a power distribution system having a mating conductor. The junction box includes a housing configured to be mounted on the PV module, the housing comprising a mating interface and an opening formed in the housing for engaging foil of... Agent: Tyco Electronics Corporation

20130048335 - Applying compression to busbars in a busway assembly: Electrical busway assemblies and methods and devices for applying compressive forces to a busbar stack in an electrical busway assembly are disclosed herein. Electrical busway assemblies for distributing electricity are presented. The busway assembly includes a stack of electrically conductive busbars with one or more duct sides each disposed on... Agent: Schneider Electric Usa, Inc.

20130048336 - Polymeric coated busbar tape for photovoltaic systems: A tape is disclosed. The tape includes a metallic foil, an adhesive layer laminated on one surface of the metallic foil and a protective polymeric coating laminated on an opposing second surface of the metallic foil. The protective coating comprises an anti-corrosion agent. The protective coating shields the metallic foil... Agent: Adhesives Research, Inc.

20130048372 - Hdmi-muxed debug cable methods and apparatuses: The HDMI debug cable methods and apparatuses are directed toward a means for pulling up a hot plug detect line to a power line. The debug cable methods and apparatuses also include means for providing an extended display identification data (EDID) code indicating a debug cable or debug host device.... Agent: Nvidia Corporation

20130048373 - Umbilical: An umbilical for use in the offshore production of hydrocarbons, and in particular a power umbilical for use in deep water applications, is described comprising a plurality of longitudinal strength members, wherein at least one longitudinal strength member comprises rope comprising high strength organic fibres having a tensile modulus >100... Agent:

20130048374 - Electrical connector: An electrical connector for connecting the conductors of two cables together includes a longitudinally extending triangular-shaped inner body and three A-shaped outer body members with one of the body members' integral with an outer end of each of the radially extending walls. The connector also includes an outer tubular housing... Agent:

20130048337 - Carbon-based substrates with organometallic fillers: A cable includes a jacket surrounding a core and a carbon-based substrate (CBS) conductor in the core. The CBS conductor includes a CBS network and an organometallic filler, wherein the organometallic filler combines with the CBS network to form a composite conductor having a higher conductivity than the CBS network.... Agent: Tyco Electronics Corporation

20130048338 - Coated wire and method of manufacturing the same: A coated wire includes a core wire, one or more grooved insulation layer coating the core wire, the grooved insulation layer including a silane-crosslinked insulating resin composition and a groove on an outer surface thereof, and a sheath layer coating an outermost layer of the grooved insulation layer.... Agent: Hitachi Cable, Ltd.

20130048339 - Transparent electrodes based on graphene and grid hybrid structures: In some embodiments, the present invention provides transparent electrodes that comprise: (1) a grid structure; and (2) a graphene film associated with the grid structure. In additional embodiments, the transparent electrodes of the present invention further comprise a substrate, such as glass. Additional embodiments of the present invention pertain to... Agent: William Marsh Rice University

20130048340 - Electrode and method of manufacturing the same: An electrode includes: an electrode plate; a conductive layer formed on the electrode plate; and an active material layer formed continuously on the electrode plate and on the conductive layer, and the electrode plate includes an uncoated region where a surface of the electrode plate is exposed.... Agent: Gs Yuasa International Ltd.

20130048341 - Magnetic cable management system: The module may be attached to a ferromagnetic surface or, in other embodiments, the module may be attached to a second module, such as magnetically through a piece of clothing. A fashion accessory may be magnetically attached to the module to enhance the user's appearance. A plurality of modules may... Agent:

20130048342 - Circuit board: A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer... Agent: Tyco Electronics Corporation

20130048343 - Circuit board with handles: The circuit board includes a main body, at least one handle, and at least one connecting element. The main body defines at least one through hole. One end of each of the at least one handle defines a positioning portion. The positioning portion of each of the at least one... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd

20130048344 - High frequency circuit board: In one embodiment of the present invention, a high frequency circuit board includes a laminate having a top surface with a groove; a semi-rigid cable positioned in the groove of the laminate; and a passivation layer filling the groove; wherein the semi-rigid cable is configured to transmit a high frequency... Agent: Star Technologies Inc.

20130048345 - Multilayer board: In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an... Agent: Denso Corporation

20130048346 - Wiring board having an engineered metallization layer: The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. 1, and to the resulting PWB. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layer 2 metallization of the... Agent:

20130048347 - Laminated flex circuit layers for electronic device components: An electronic device may have a housing in which an antenna and a proximity sensor formed from flex circuit structures are mounted. The flex circuit structures may include first and second flex circuit layers. The first and second flex circuit layers may include metal antenna structures and metal proximity sensor... Agent:

20130048348 - Transparent conductive film and manufacturing method therefor: The present invention is a transparent conductive film having a flexible transparent base and a transparent conductive layer made of a crystalline conductive metal oxide that is formed on one surface of the flexible transparent base, in which the thickness of the flexible transparent base is 80 μm or less,... Agent: Nitto Denko Corporation

20130048350 - Base member: A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of... Agent: Shinko Electric Industries Co., Ltd.

20130048349 - Transparent conductive film and touch panel using the same: A transparent conductive film includes at least one continuous transparent conductive layer and a number of transparent conductive stripes spaced from each other and extending substantially along a low impedance direction. The transparent conductive stripes are disposed on and electrically contact a surface of the at least one transparent conductive... Agent: Shih Hua Technology Ltd.

20130048351 - Electronic package structure and method for manufacturing same: An exemplary electronic package structure includes a substrate configured with a solder pad, a metal support element, an electronic component connected to the solder pad, and an encapsulation body. The metal support element is located between the solder pad and the electronic component. As a result, a gap is defined... Agent: Ambit Microsystems (zhongshan) Ltd.

20130048356 - Mitigation and elimination of tin whiskers: A method of mitigating tin whisker formation on electronic assemblies includes exposing tin metal in the electronic assembly to a mitigating agent that interacts with the tin metal to produce a product that is resistant to forming tin whiskers.... Agent: International Business Machines Corporation

20130048352 - Printed circuit board: A printed circuit board includes a signal layer and a reference layer. The signal layer is covered with copper foil. A circuit topology for multiple loads is set on the signal layer. The circuit topology includes a driving terminal, a first signal receiving terminal, and a second signal receiving terminal.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130048355 - Printed wiring board: A printed wiring board has a core substrate including an insulative base material and having a penetrating hole, a first conductive circuit formed on a first surface of the substrate, a second conductive circuit formed on a second surface of the substrate, and a through-hole conductor including a copper-plated film... Agent: Ibiden Co., Ltd.

20130048353 - Transparent conductive film and touch panel using the same: A transparent conductive film a number of first transparent conductive stripes and a number of transparent conductive stripes electrically connected with each other. The first conductive stripes are spaced from each other and extend substantially along a first direction, and the second transparent conductive stripes are spaced from each other... Agent: Shih Hua Technology Ltd.

20130048354 - Transparent conductive film and touch panel using the same: A transparent conductive film includes a number of first transparent conductive stripes extending along a first direction and a number of second transparent conductive stripes extending along a second direction and intersecting the number of first transparent conductive stripes. The first conductive stripes are spaced from each other and extend... Agent: Shih Hua Technology Ltd.

20130048357 - Photosensitive resin composition, cured product thereof, and printed wiring board: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent,... Agent: Taiyo Holdings Co., Ltd.

20130048359 - Substrate with spring terminal and method of manufacturing the same: A substrate with spring terminals includes a substrate including a connection pad, a spring terminal whose connection portion is connected to the connection pad by a solder layer, and a resin portion formed to cover a side surface of the solder layer, thereby the failure that the spring terminal falls... Agent: Shinko Electric Industries Co., Ltd.

20130048358 - Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof: A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing... Agent: Fujitsu Limited

20130048361 - Component-incorporated wiring substrate and method of manufacturing the same: A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main... Agent: Ngk Spark Plug Co., Ltd.

20130048360 - System in package, printed circuit board provided with such system in package: Method for providing a printed circuit board (16) with an electronic device (1), wherein the electronic device (1) having at least one external soldering pad (11) having a predetermined size for heat dissipation is soldered with the soldering pad (11) onto a printed circuit board substrate of the printed circuit... Agent: Option

20130048362 - Wiring structure, display panel, and display device: Provided is a wiring structure that can prevent circuit elements from breaking due to static electricity. The disclosed wiring structure includes: a transparent substrate 11; wiring lines 14 that are formed on the transparent substrate 11; and dummy wiring lines 17 that are formed on the transparent substrate 11 and... Agent: Sharp Kabushiki Kaisha

20130048364 - Ball grid array formed on printed circuit board: A ball grid array formed on a printed circuit board is provided. The ball grid array includes a first bailout module and a second bailout module. The first bailout module includes a plurality of first solder balls arranged as an array. Two of the first solder balls are grounded, and... Agent: Mstar Semiconductor, Inc.

20130048363 - Circuit board: A circuit board includes a board, a first signal trace and a second signal trace on the board, a first solder pad formed on the board and connected to a terminal of the first signal trace near to one end of the second signal trace, and a second pad formed... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20130048365 - Electromagnetic interference noise reduction package board: An EMI noise reduction package board, having a top layer and a bottom layer, one of which having a semiconductor device mounted thereon, can include: a first area having a signal layer arranged on one surface thereof; and a second area placed on a lateral side of the first area... Agent: Samsung Electro-mechanics Co., Ltd.

20130048366 - Split line and low voltage wire conduit and transformer box: Disclosed is a split conduit for separating line and low voltage wiring, wherein two wire or cable types are supported and do not interfere with one another along the conduit length. The conduit comprises a rounded outer wall forming an enclosed cross section, wherein a partition is provided within the... Agent:

20130048367 - Emi shielding members for connector cage: An EMI member for a cage assembly that comprises a first half that includes a plurality of spring contact fingers, a second half that includes a spring member that has a plurality of spaced slots therein, and a folded end joining the first and second halves. The folded end defines... Agent:

20130048368 - Systems of an electronic device and methods for manufacturing the same: Various systems of an electronic device and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield an electronic component or secure an electronic component to the circuit board.... Agent: Apple Inc.

20130048369 - Systems and methods for shielding circuitry from interference with a removable shield assembly: This is directed to systems and methods for shielding a circuitry region of an electronic device from interference (e.g., EMI) with a removable shield assembly.... Agent: Apple Inc.

20130048370 - Electromagnetic protection cloth: An article for providing protection from electromagnetic energy, and an associated method for provision of such. The article includes conductive fibers extending within the article, varistor material dispersed and secured within the article, and ferrite material dispersed and secured within the article.... Agent: Bha Group

20130048371 - Implementing adjustable size ferrite core for emi cable noise suppression: A method and structures for implementing an adjustable size ferrite core for electromagnetic interference (EMI) cable noise suppression. A plurality of ferrite core segments are mated together defining an adjustable size cable receiving cavity. Each of the ferrite core segments includes an inner wall portion with mating fingers extending along... Agent: International Business Machines Corporation

20130043054 - Device housing and manufacturing method: A housing includes a transparent panel and a housing body. The housing body includes a main body and a flange portion extending from the main body. The filler is formed between the transparent panel and the housing body. The filler includes a first connecting portion, a second connecting portion, and... Agent: Fih (hong Kong) Limited

20130043055 - Junction box: A junction box for a photovoltaic module is provided. The junction includes a housing and a base. The housing is prepared from a first material. The base is provided in the housing and configured to mount an electronic device. The base is prepared from a second material. With the housing... Agent:

20130043071 - Thermal energy management component and system incorporating the same: An apparatus is provided that includes a heat pipe and a heat sink that includes a foam (e.g., a metal foam, a carbon foam, and/or a graphite foam) and is configured to exchange thermal energy with the heat pipe. For example, the heat pipe can include a thermal energy receiving... Agent: General Electric Company

20130043072 - Full tension swaged acsr connector: An improved connector for ACSR cable includes a connector core having an axial bore dimensioned to receive the steel core of the cable. A connector body has a substantially cylindrical outer surface and a substantially cylindrical cavity. A distal portion of the cavity having a first substantially cylindrical inner surface... Agent: Dmc Power, Inc.

20130043073 - Full tension swaged connector for reinforced cable: An improved cable connector includes a connector insert having an axial bore dimensioned to receive the core of a reinforced cable. A connector body has a substantially cylindrical outer surface and a substantially cylindrical cavity. A distal portion of the cavity is dimensioned to receive the connector insert. A second... Agent: Dmc Power, Inc.

20130043056 - Three-dimensional crossbar array: A three-dimensional crossbar array may include a metal layer, and an insulator layer disposed adjacent the metal layer. A trench may be formed in the metal layer to create sections in the metal layer, and a portion of the trench may include an insulator. A hole may be formed in... Agent:

20130043057 - Electrode for power storage device and power storage device: An electrode for a power storage device with good cycle characteristics and high charge/discharge capacity is provided. In addition, a power storage device including the electrode is provided. The electrode for the power storage device includes a conductive layer and an active material layer provided over the conductive layer, the... Agent: Semiconductor Energy Laboratory Co., Ltd.

20130043058 - Adhesive film and flat cable: An adhesive film includes an insulation film, an adhesive layer formed on the insulation film and including a copolyamide resin being soluble in a solvent at a room temperature (25° C.) and having a melting point of not less than 100° C. and not more than 150° C., a halogen-free... Agent: Hitachi Cable, Ltd.

20130043059 - Grommet: When a grommet provided with a wire insertion tubular portion is mounted in a through-hole of a vehicle body panel by engaging a vehicle body engagement recess on an outer periphery of the grommet with a peripheral edge of the through-hole, the present invention prevents the wire insertion tubular portion... Agent: Sumitomo Wiring Systems, Ltd.

20130043061 - Circuit structure of electronic device and its manufacturing method: The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the... Agent:

20130043060 - Method for forming coreless flip chip ball grid array (fcbga) substrates and such substrates formed by the method: A method for forming coreless flip chip ball grid array (FCBGA) substrates comprising the steps of sequentially depositing a pair of laminates, each having a plurality of insulated metallization layers simultaneously respectively on each side of a temporary carrier substrate, and then removing the temporary carrier to separate the pair... Agent: International Business Machines Corporation

20130043062 - Method of forming a conductive image on a non-conductive surface: The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal... Agent: Earthone Circuit Technologies Corporation

20130043063 - Method of producing printed circuit board, and printed board produced by the method: A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating... Agent:

20130043064 - Ceramic elements module: A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and... Agent: Samsung Electro-mechanics Co., Ltd.

20130043065 - Flexible substrates and method of manufacturing the same: A flexible substrate includes a flexible mother substrate and a planarization layer on the flexible mother substrate. Here, the flexible mother substrate includes a transparent textile and a resin layer. The transparent textile includes a plurality of first transparent fibers and a plurality of second transparent fibers crossing the plurality... Agent:

20130043066 - Disc comprising an electrical connection element: f

20130043067 - Wire substrate structure: [SOLUTION] A circuit board 3 comprises a plurality of first inorganic insulating particles 13a which are connected to each other via first neck structures 17a and have a particle size of 3 nm or more and 110 nm or less and a resin (third filling portions 19c) arranged in first... Agent: Kyocera Corporation

20130043068 - Touch panel and manufacturing method thereof: The present disclosure provides a manufacturing method for a touch panel comprising: disposing an electrode layer extending from touch area of a substrate to periphery area of the substrate, wherein the periphery area surrounds the periphery of the touch area. The method further includes disposing an insulation layer in the... Agent:

20130043069 - Cable holding structure: A cable holding structure includes a shielded cable that includes a center conductor and a shield conductor on an outer periphery of the center conductor, and a holding portion being electrically conductive, provided on a flat plate portion and configured to hold the shielded cable. The holding portion includes a... Agent: Hitachi Cable, Ltd.

20130043070 - Fluid-tight cable bushing for ribbon cable: A fluid-tight cable bushing for a ribbon cable has two profile supports. The ribbon cable extends through an opening in a penetration element, such as a housing for a switch or meter. The bushing has two profile supports each with a first flange having snap-on elements and a second flange.... Agent:

20130037294 - Breakaway fuse holder: A device for holding an electric fuse assembly having a fuse carried by a first end fuse holder and a second end fuse holder. The assembly includes a first housing section having a cavity formed therein for receiving the first end fuse holder and a second housing section having a... Agent: Ideal Industries, Inc.

20130037296 - Contact-making and connection arrangement on the basis of film conductors introduced in a housing: The invention relates to a contact-making and connection arrangement on the basis of film conductors introduced in a housing, wherein ends of the film conductors have a contact-making section and at least partly lie one above another. According to the invention, a double-sided self-adhesive or adhesive-coated conductive nonwoven material is... Agent: Few Fahrzeugelektrikwerk Gmbh & Co. Kg

20130037295 - Fastening mechanism and electronic device having the same: A fastening mechanism for an electronic device, which has a shell body and a cover having a first fastening structure, includes a press portion adapted to be exposed from the shell body and pressable to extend resiliently into the shell body, and a second fastening structure adapted to engage to... Agent:

20130037297 - Supply line apparatus: A supply line apparatus for an electrical connection of a gradient coil unit in a magnetic resonance device includes a first supply line unit and a second supply line unit. The second supply unit is disposed at least partially coaxially to the first supply line unit. The first supply line... Agent:

20130037298 - Power data housing: A power data housing includes a channel which receives electrical receptacle housings. The housings have side latch tabs which releasably lock receptacles to the receptacle housings. The receptacle housings are received within a continuum of the channel.... Agent:

20130037320 - Hybrid stripline rf coaxial cable: A hybrid stripline RF transmission cable has a generally flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. Additional conductors may be applied within the dielectric layer and/or within a jacket surrounding the outer conductor. The additional conductors may be, for example, power, data... Agent: Andrew LLC

20130037321 - Wire harness manufacturing method: A method for manufacturing a wire harness includes holding a predetermined part of electric wires (91) with first and second molded bodies (931, 932). The first and second molded bodies (931, 932) are placed on a lower holding tool (11a) and are pressurized with lower and upper molds (21a, 22a)... Agent: Sumitomo Wiring Systems, Ltd.

20130037322 - Tapered transition ramp for cable protector with offset center sections: An exemplary ramp structure capable of being positioned over at least a portion of a cable protection system comprises first and second center portions, a first side ramp portion adjacent a side of each center portion, and a first tapered portion adjacent an end of the first side ramp portion.... Agent: Checkers Industrial Products, LLC

20130037323 - Electroluminescent systems: This application pertains to electroluminescent systems, and more particularly, but not exclusively, to innovative configurations of EL-wires and EL-cables. A central axis can extend longitudinally of an EL-cable: An electrically conductive core defines a longitudinal axis being substantially coextensive with the central axis of the cable. An electroluminescent material electrically... Agent:

20130037300 - Low attenuation stripline rf transmission cable: A stripline RF transmission cable has a flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. The outer conductor has a top section and a bottom section which transition to a pair of edge sections that interconnect the top section with the bottom section.... Agent: Andrew LLC

20130037301 - Multi-conductor stripline rf transmission cable: A stripline RF transmission cable has a plurality of generally planar inner conductors surrounded by a dielectric layer that is surrounded by an outer conductor. The inner conductors may be aligned coplanar, inner conductor edge to inner conductor edge, separated by the dielectric layer. Alternatively, the inner conductors may be... Agent: Andrew LLC

20130037299 - Stripline rf transmission cable: A stripline RF transmission cable has a flat inner conductor surrounded by a dielectric layer that is surrounded by an outer conductor. The outer conductor has a flat top section and a flat bottom section which transition to a pair of edge sections that interconnect the top section with the... Agent: Andrew LLC

20130037302 - Lan cable with pei cross-filler: A communications cable has a jacket, a plurality of twisted pairs, each twisted pair having two insulated conductors twisted around one another. A cross-filler is arranged between the twisted pairs where the cross-filler is constructed of PEI (polyetherimide).... Agent:

20130037303 - Flexible flat cable: A flexible flat cable, including a plurality of preprocess conductors and a insulating layer, wherein the insulating layer includes upper and lower insulating layers, each of the preprocess conductors has upper and lower faces and an original width, and the upper and lower faces are being flat and attached tightly... Agent: P-two Industries Inc.

20130037304 - Insulated wire: f

20130037305 - Electrical conductor coated in a bonding layer, and a method of manufacturing such an electrical conductor: The invention relates to an electrical conductor coated in an insulating layer itself coated in a bonding layer, the conductor being characterized in that said bonding layer is obtained from a composition comprising a thermoplastics polymer and a settable resin. The invention also applies to a method of manufacturing such... Agent:

20130037306 - Multilayer elastic tube having electric properties and method for manufacturing the same: A multilayer elastic tube having electric property, the multilayer elastic tube including: an elastic core having a tube shape; and an elastic rubber coating layer adhering to an inner surface of the core, the elastic rubber coating layer having at least one electric property of electric conductivity, piezoelectricity, and electric... Agent: Joinset Co., Ltd

20130037307 - Electric conduction through supramolecular assemblies of triarylamines: m

20130037308 - Reinforced glass cell and method for fabricating the same and cover glass having the reinforced glass cell: A method of fabricating a reinforced glass cell including the following steps is provided. First, a mother glass having a plurality of glass cell predetermined regions is provided. A portion of the mother glass disposed on the outer edge of each glass cell predetermined region is removed, so as to... Agent: Dongguan Masstop Liquid Crystal Display Co., Ltd.

20130037310 - Epoxy resin composition for circuit board, prepreg, laminate, resin sheet, laminated base material for printed wiring board, printed wiring board, and semiconductor device: Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds.... Agent: Sumitomo Bakelite Co., Ltd.

20130037309 - Terminal-integrated metal base package module and terminal-integrated metal base packaging method: The terminal-integrated package method for the metal base package module includes: preparing a metal substrate formed with a conductive metal material; forming an oxide layer by oxidizing one side of the metal substrate to a predetermined depth; forming an insulation groove by partially eliminating the metal substrate to the oxide... Agent: Wavenics Inc.

20130037311 - Functionalization of thermal management materials: A base material or composite material such as graphite, may be combined with another material, such as aluminum oxide or polyimide, to produce a new insulating thermal management material. The base material may be impregnated with another metal to create a composite base material.... Agent: Applied Nanotech Holdings, Inc.

20130037312 - High density trace formation method by laser ablation: A method for making a microelectronic substrate includes forming a pattern of a selected metallic layer of an in-process unit using laser ablation such that the pattern corresponds to desired locations for conductive features. Conductive material is than added to the in-process unit by a process that uses the pattern... Agent: Invensas Corporation

20130037313 - Liquid composition and metal-based circuit board: A liquid composition containing a liquid crystalline polyester, a solvent, and a boron nitride having a volume average particle diameter of not less than 10 μm and not more than 80 μm, wherein the amount of the boron nitride is 30 to 90% by volume based on the total amount... Agent: Sumitomo Chemical Company, Limited

20130037314 - Bonding material, bonded portion and circuit board: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further... Agent:

20130037315 - Delay line structure: A delay line structure disposed on a substrate having a dielectric base layer formed with a via, a layout layer and a grounding layer with a grounding circuit, includes two parallel spiral delay lines having a first outer straight section, a first outer bent section, an inner spiral region, a... Agent: Chung Yuan Christian University

20130037316 - Structure and circuit board: A structure (10) includes a conductor (151), conductors (111, 131) that are located on the same side with respect to the conductor (151), that are opposed to at least a part of the conductor (151), and that overlap each other when seen in a plan view, a connection member (101)... Agent: Nec Corporation

20130037317 - Assembly structure of electrical junction box: Provided is an assembly structure of an electrical junction box which makes it possible to fit an electrical component attachment block into an insulation case without provision of a lock mechanism. Included are a housing (15) provided in an insulation case (5) and configured to house an electrical component attachment... Agent: Yazaki Corporation

20130037318 - Methods and apparatus for providing holes through portions of a housing: Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through a portion of the housing and then the housing portion may be anodized. The anodization process may increase or decrease the geometries of each hole. The holes may be formed through... Agent: Apple Inc.

20130037319 - Bi-directional cable guide: A cabling and wire guiding structural building device, including a body defined by a substantially flat surface extending about a longitudinal axis, the body connected to at least one second surface with the intersection of the body and the second surface parallel to the longitudinal axis. The substantially flat surface... Agent:

20130032371 - Waterproof box and electrical junction box having the same: The waterproof box includes a body case and a cover mounted to the body case by making a hook portion at one end of the cover engaged with a projection at one end of the body case and rotatably moving the cover around the hook portion. The one end of... Agent: Yazaki Corporation

20130032372 - Shallow electric box: A shallow electric box has a back wall, and top, bottom, and opposite side walls perpendicularly connected to said back wall to thereby form a box shape. A wire connector connected to an interior surface of each of the side wall, and at least two tab members that are adapted... Agent:

20130032373 - Grounding rope guide for a dynamo-electric machine: A shaft grounding apparatus including a grounding rope in electrical contact with ground, and an adjustable rope guide configured to guide the grounding rope on an electrically conductive surface of a rotating shaft of an electric machine. The adjustable rope guide includes a plurality of articulating segments configured to provide... Agent: Cutsforth Products, Inc.

20130032393 - Wiring harness: The invention relates to a wiring harness having a plurality of electrical wires and a tubular shielding member capable of accommodating the plurality of electrical wires as a whole therein. The wiring harness includes a plurality of electrical wires; and a tubular shielding member configured to receive the plurality of... Agent: Yazaki Corporation

20130032394 - Anticorrosive, coated electric wire with terminal, and wiring harness: An anticorrosive that is capable of delivering high anticorrosive capability. The anticorrosive mainly contains an epoxy resin, and has a viscosity within a range of 1000 to 30000 mPa·s at 25 degrees C., which is measured in accordance with the JIS Z8803. The anticorrosive can be favorably applied to an... Agent: Sumitomo Wiring Systems, Ltd.

20130032395 - Wire connector assembly including splice elements for fluid environments and methods of making same: A wire connector assembly includes a connector body and at least one wire arrangement that communicates with the connector body. The wire arrangement includes at least one electrically-conductive element formed of a continuous solid mass of material throughout. The at least one solid mass element defines a plurality of bores... Agent: Delphi Technologies, Inc.

20130032374 - Polyamide-imide resin insulating varnish and method of manufacturing the same, insulated wire and coil: w

20130032375 - Brominated epoxy flame retardant plasticizer: There is provided, herein a wire and/or cable comprising (a) a conductor and (b) a covering comprising a brominated epoxy oligomer; and, a phosphate ester.... Agent: Icl-ip America Inc.

20130032376 - Semiconductive polymer composition comprising polar copolymer: The present invention relates to a semiconductive polymer composition comprising:—an ethylene copolymer (A) comprising methyl(meth)acrylate co-monomer units, wherein the ethylene copolymer (A) has a melt temperature of 80 ° C. or below, and—carbon black, wherein the ethylene copolymer (A) is produced in a autoclave high pressure reactor or in a... Agent: Borealis Ag

20130032377 - Insulated wire and method of manufacturing the same: An insulated wire includes a conductor, and an insulation covering layer around the conductor. The insulation covering layer includes a resin composition containing a resin (A) including at least one of a polyphenylene sulfide resin and a polyetheretherketone resin and a resin (B) containing a polyethylene. The resin composition has... Agent: Hitachi Cable, Ltd.

20130032378 - Hermetic feedthrough: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture... Agent:

20130032379 - Integrated clamp insulators: An electrical insulator (12) comprising an insulator body (14) and a clamp (16) formed as an integral piece, wherein the insulator body has a base fitting for attachment to a support structure at one end with the clamp (16) being formed at the other end, said clamp having a body... Agent:

20130032380 - Electronic apparatus: An electronic apparatus 1 includes a flat cable 70, an end 70a of which is bonded to the front surface of a sub-board 30 through an anisotropic conductive film 79, engaged portions 74A and 74B formed in the flat cable 70, and an intermediate frame 40 that engages with the... Agent: Sony Computer Entertainment Inc.

20130032381 - Flexible wiring module and flexible wiring device: According to one embodiment, a flexible wiring module includes a flexible wiring board which comprises electric wiring lines and an insulating layer that covers the surfaces of the electric wiring lines and which has a pair of end areas separate from each other in a wiring length direction and a... Agent: Kabushiki Kaisha Toshiba

20130032382 - Hermetic feedthrough: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina.... Agent: Kyocera Corporation

20130032383 - Thin film electrode ceramic substrate and method for manufacturing the same: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers;... Agent: Samsung Electro-mechanics Co., Ltd.

20130032384 - Thin film electrode ceramic substrate and method for manufacturing the same: Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating... Agent: Samsung Electro-mechanics Co., Ltd.

20130032386 - Electrical device including a functional element in a cavity: A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is... Agent:

20130032385 - Metal thin shield on electrical device: This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin... Agent: Qualcomm Mems Technologies, Inc.

20130032387 - Microelectronic package with terminals on dielectric mass: A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to... Agent: Tessera, Inc.

20130032388 - Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby: The present invention relates to a method of making a cavity substrate. The method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier, an adhesive and an electrical pad, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a coreless build-up circuitry on the supporting... Agent:

20130032389 - Connection substrate: A connection substrate 13 includes a base material 130 formed by stacking a plurality of dielectric layers 130a to 130f and a plurality of through conductors 20 provided penetrating through the dielectric layers 130c to 130f adjacent to each other. A plurality of radiation shielding films 21 a to 23... Agent:

20130032390 - Packaging substrate having embedded interposer and fabrication method thereof: A packaging substrate includes a carrier and an interposer. The carrier has opposite top and bottom surfaces. A recess is formed on the top surface and a plurality of first conductive terminals are formed on the recess. Further, a plurality of second conductive terminals are formed on the bottom surface... Agent: Unimicron Technology Corporation

20130032391 - Feedthrough configured for interconnect: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to... Agent: Kyocera Corporation

20130032392 - Insulator for a feedthrough: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit... Agent: Kyocera Corporation Medtronic Inc.