|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators February patent applications/inventions, industry category 02/12Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/23/2012 > 29 patent applications in 17 patent subcategories. patent applications/inventions, industry category
20120043104 - Electric junction box: The present invention is to provide an electric junction box which can minimize a case by reducing the capacity of a cover without damage of electric wires. A wiring harness L2 guided from a power integration 3 arranged at a position nearest a guide portion is guided to a guide... Agent: Yazaki Corporation
20120043103 - Splice enclosure: A splice enclosure having a first casing, a second casing and a cable splice receiving chamber for receiving a cable splice or joint. The first casing includes a first engagement portion, while the second casing includes a second engagement portion. The cable splice receiving chamber is formed by the first... Agent:
20120043105 - Sealed circuit breaker: A sealed electrical enclosure used in hazardous locations for enclosing circuit breakers having a bottom housing and a removable top housing with a labyrinth joint or serrated joint formed therebetween, the bottom housing adapted to receive one or more circuit breakers, a first metal bus extending from a point internal... Agent: Egs Electrical Group, LLC.
20120043106 - Junction box with spacer: A junction box, in particular for a solar module, the junction box including a housing with functional components arranged therein for connecting with solar module connecting contacts, wherein the housing of the junction box includes a spacer configured to fixate an additional junction box at a distance from the junction... Agent:
20120043107 - Flat wire shielded pair and cable: Novel shielded flat wire pair and cable implement flat, smooth conductors coated with insulation bonded together, providing rectangular cross-sections and equidistant, smooth surfaces for high frequency signal current flow. Flat wire pairs with conductive covers and symmetrically placed shield conductors in grooves between flat wires minimize intra-pair signal flow skew.... Agent:
20120043108 - High voltage dc tether: A high voltage direct current (DC) tether for an airborne wind turbine has a reduced weight compared to conventional tethers. The weight reduction is achieved by using one conductor in the center of the feeder and the shielding of the feeder as a second conductor. A mechanical strength element is... Agent: Honeywell International Inc.
20120043109 - Insulating coating composition and an insulated wire, and a coil formed using the same: An insulating coating composition that improves lubricity without reduction of the varnish adhesion strength and an insulated wire using the insulating coating composition, and a coil using the insulated wire are provided. An insulating coating composition comprises a polyamide-imide resin, which is obtained through a synthetic reaction of isocyanate component... Agent: Hitachi Magnet Wire Corp.
20120043110 - Conductor insulation arrangement for an electric machine: An electric machine includes a core with a plurality of slots. Electric conductors are positioned within the slots with connection ends extending from the in-slot portions. A plurality of insulation sleeves separate the plurality of electric conductors. Each insulation sleeve substantially covers one entire conductor, including the in-slot portions and... Agent: Remy International, Inc.
20120043111 - Long body unit with slider: The present disclosure provides a long body unit with slider, including, a first long body, a second long body, and a slider provided for the first long body and the second long body, the slider including, a connection section by which the first long body and the second long body... Agent: Sony Corporation
20120043112 - Support bracket: A support bracket for supporting insulating rods inside an insulator tube of a hollow core insulator. The support bracket includes a cylindrical ring with an outer surface for abutting against the inner surface of an insulator tube, an inner surface for supporting an insulating rod and two opposing end sides,... Agent:
20120043113 - Printed circuit board: A printed circuit board (PCB) includes a ground layer, a number of conductive mount holes extending through the PCB, and a number of electromagnetic wave absorption elements located on a top surface of the PCB and aligning with corresponding mount holes. Each mount hole is lined with a conductive material... Agent: Hon Hai Precision Industry Co., Ltd.
20120043114 - Device-embedded flexible printed circuit board and manufacturing method thereof: A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a... Agent: Samsung Techwin Co., Ltd.
20120043118 - Adhesive resin composition, and laminate and flexible printed wiring board using the same: Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing... Agent: Sumitomo Electric Industries, Ltd.
20120043119 - Composite polymer-metal electrical contacts: An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base layer. Conductive plating is applied to the metalized layer... Agent: Hsio Technologies, LLC
20120043115 - Flexible circuit structure with stretchability and method of manufacturing the same: In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.... Agent: Industrial Technology Research Institute
20120043116 - Interconnection structure of interposer with low cte and packaging component having the same: Disclosed herein are printed circuit board assemblies made of a brittle material such as silicon, glass or ceramic and provided with a connector to electrically connect the same to an external connection member, and a method for molding the printed circuit board assembly wherein the printed circuit board assembly is... Agent: Samsung Electronics Co., Ltd.
20120043117 - Signal transmission line and circuit board: A signal line and a circuit board that can be easily bent in a U shape and prevent unwanted emission include a line portion includes a plurality of laminated line portion sheets made of a flexible material. Signal lines extend within the line portion in an x-axis direction. Ground lines... Agent: Murata Manufacturing Co., Ltd.
20120043122 - Board with fine pitch bump and method of manufacturing the same: Disclosed herein are a board with a fine pitch bump and a method of manufacturing the same. The method of manufacturing a board with a fine pitch bump includes: forming a solder resist layer by stacking a solder resist on a core layer having a circuit pattern formed thereon; forming... Agent: Samsung Electro-mechanics Co., Ltd.
20120043120 - Dual-layer method of fabricating ultracapacitor current collectors: A method of making a multi-layer current collector comprises forming a first layer from a first formulation over each major surface of a current collector substrate, and forming a second layer from a second formulation over each of the first layers, wherein one of the first formulation and second formulation... Agent:
20120043121 - Printed circuit board and method of manufacturing the same: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer and embedded in one... Agent: Samsung Electro-mechanics Co., Ltd.
20120043124 - Electrical device: The present invention relates to an electrical device comprising a substrate, a pair of electrodes arranged on the substrate and a functional layer arranged between the pair of electrodes, said functional layer comprising a functional domain being capable of transforming an external stimulus into an electrical signal or vice versa.... Agent: Eth Zurich
20120043123 - Printed wiring board and a method of manufacturing a printed wiring board: [Solution(s)] To lower the thermal expansion coefficient (CTE) to 20˜40 ppm, inorganic particles are added to core substrate 30 formed by impregnating glass-cloth core material with glass-epoxy resin. Furthermore, thickness (a) of core substrate 30 is set at 0.2 mm, thickness (b) of upper-surface-side first interlayer insulation layer (50A) at... Agent: Ibiden Co., Ltd.
20120043125 - Circuit boards, methods of forming the same and semiconductor packages including the same: Provided is a method of forming a circuit board including an adhesion portion. The method may include forming a mask pattern including an opening on a board; performing a surface treatment process at a bottom of the opening; combining a linker with the surface on which a surface treatment process... Agent:
20120043126 - Printed circuit board and method of manufacturing the same: Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover... Agent: Samsung Electro-mechanics Co., Ltd.
20120043129 - Circuit board and method for manufacturing the same: In a circuit board, a laminate includes a plurality of laminated insulating material layers made of a flexible material. First external electrodes are provided on an upper surface of the laminate, and an electronic component is mounted thereon. Second external electrodes are provided on a lower surface of the laminate... Agent: Murata Manufacturing Co., Ltd.
20120043127 - Printed circuit board and method for fabricating the same: The invention provides a printed circuit board and a method for fabricating the same. The printed circuit board includes a core substrate having a first surface and an opposite second surface. A first through hole and a second through hole are formed through a portion of the core substrate, respectively... Agent: Nan Ya PCb Corp.
20120043128 - Printed circuit board and method of manufacturing the same: The present invention provides a multilayer printed circuit board and a method for manufacturing the same. The printed circuit board includes: an inner circuit layer which is disposed on a first insulating layer; a via land which is disposed on the first insulating layer to be spaced apart from the... Agent: Samsung Electro-mechanics Co., Ltd.
20120043130 - Resilient conductive electrical interconnect: An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact... Agent: Hsio Technologies, LLC
20120043131 - Method for producing a sensor with seamless extrusion coating of a sensor element: A method for producing a sensor with seamless extrusion coating of a sensor element and a sensor produced by said method. The sensor element is enclosed in as sealed a manner as possible by the extrusion mass, thus permanently preventing the ingress of water, acids, oils or other aggressive materials... Agent:02/16/2012 > 28 patent applications in 20 patent subcategories. patent applications/inventions, industry category
20120037393 - Device for grounding: Device for establishing an efficient grounding of an installation of different types includes one or more cables, wherein the ground rail or ground conductor, ground rails or ground conductors or ground point or ground points of the installation being grounded by the one or more cables including a combination of... Agent:
20120037420 - Electronic device protection: Apparatus, systems and methods for electronic device protection are provided. A particular apparatus includes a non-conductive substrate and a plurality of cells including conductive members coupled to the non-conductive substrate. The conductive members are arranged to form a first discontinuous mesh, where each conductive member of a cell is separated... Agent: The Boeing Company
20120037394 - Micro coaxial cable and laser beam shielding resin composition: An micro coaxial cable is disclosed, which includes: a center conductor (3) that enables transfer of a signal; an insulator (5) that covers a periphery of the center conductor (3); an external conductor (8) as a shield that covers a periphery of the insulator (5); and a jacket (8) that... Agent: Fujikura Ltd.
20120037395 - Encapsulation housing reducing piece: An encapsulation housing reducing piece has a first flange and a second flange. The second flange has a reduced cross-section compared to the first flange. An encapsulation housing shell extends between the two flanges. The encapsulation housing shell has a plurality of even zones. Rotation symmetrical shell surface sections are... Agent: Siemens Aktiengesellschaft
20120037418 - Mounting arrangement for mounting systems and aircraft or spacecraft: The present invention provides a mounting arrangement for mounting at least one electrical line on a structure, in particular of an aircraft or spacecraft, said mounting arrangement comprising: at least one module which comprises at least one terminal for connecting the electrical line; and a substantially U-shaped holder which comprises... Agent:
20120037419 - Cable termination apparatus and related methods: In one embodiment, the termination apparatus provides a means for terminating certain elongate heat tracing products that have corrugated metal sheaths as outer covering for those elongate heaters. The heat tracing products may include oval corrugated metal sheaths as outer covering. Terminating other types of cables, including cables which provide... Agent: Dexran Energy Systems Inc.
20120037396 - Flame retardant thermoplastic elastomers: A flame-retardant thermoplastic elastomer compound is disclosed having polyphenylene ether, a hydrogenated styrene block copolymer, at least one solid non-halogenated phosphorus containing flame retardant, and a nucleated olefinic polymer. The compound has a before-aging tensile elongation of >200% and an after-aging tensile elongation residual of at least 75%, according to... Agent: Polyone Corporation
20120037398 - Ethylene/tetrafluoroethylene copolymer, electrical wire, and fluorine resin powder for rotational molding: The present invention provides an ethylene/tetrafluoroethylene copolymer showing good heat resistance and good crack resistance even in a high temperature environment. The present invention is an ethylene/tetrafluoroethylene copolymer, comprising: copolymerization units derived from ethylene; tetrafluoroethylene; and a fluorine-containing vinyl monomer represented by general formula: CH2=CH−Rf in the formula, Rf representing... Agent: Daikin Industries Ltd.
20120037397 - Polymer compositions and their use as cable coverings: The present invention relates to a crosslinked polymer containing polyphenylene sulfide (PSS) and an impact modifier, and its use as cable coverings, such as jacket or insulation. The composition contains a crosslinked polymer containing of polyphenylene sulfide (PPS) and an impact modifier. Preferably, the impact modifier is present at about... Agent: General Cable Technologies Corporation
20120037399 - Anisotropic conductive film and method of fabricating the same: A method of fabricating anisotropic conductive film comprises the steps of: mixing conductive particles, a resin material and a solvent to form slurry; and providing a separate means for progressively distributing the conductive particles on one side of the resin material when forming the anisotropic conductive film from slurry. The... Agent: Core Precision Material Corporation
20120037400 - Electrically isolating polymer composition: A composition that includes at least one crosslinkable monomer; at least one hydrophobic monomer; and at least one dielectric constant enhancing agent selected from dielectric enhancing monomers, ferroelectric particulates, and electroactive polymers. Coatings including the polymer of compositions, and articles including electrically isolating layers are also disclosed.... Agent:
20120037402 - Electric wire holder: An object of the invention is to provide an electric wire holder capable of facilitating an end treatment of a wiring harness to reduce the fabrication cost of the wiring harness and of increasing the reliability in the insulation displacement connection at the end portion of the wiring harness. In... Agent: Yazaki Corporation
20120037401 - Wall mounted television cable and cord organizing apparatus: A home theatre cable and cord organizing apparatus comprising essentially of a cable and cord storage compartment having a mounting flange, a power strip receiving port, a removably attachable access plate composed of a material to which paint will adhere, and a plurality of mounting clips. The mounting flange in... Agent:
20120037403 - Method for electrically conductively connecting conductor tracks in conductor carriers and system comprising such conductor carriers: A method for electrically conductively connecting conductor tracks in conductor carriers, preferably printed circuit boards or conductor foils is disclosed. A first and second conductor carrier are provided, into which a respective conductor track is embedded, which are exposed at a contact region. For the purpose of fusing the material... Agent: Robert Bosch Gmbh
20120037404 - Packaging substrate having a passive element embedded therein and method of fabricating the same: A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in... Agent: Unimicron Technology Corporation
20120037405 - Flexible circuit board and method for manufacturing same: An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating... Agent: Arakawa Chemical Industries, Ltd.
20120037406 - Method and apparatus for using flex circuit technology to create an electrode: A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The method may also include... Agent: Edwards Lifesciences Corporation
20120037407 - Electronic apparatus and method of manufacturing the same: It has been found out that, among transparent conductive layers, a zinc oxide layer has a function of preventing diffusion of sodium. An electronic apparatus is obtained which uses the zinc oxide layer as an electrode of the electronic apparatus and also as a diffusion preventing layer for preventing diffusion... Agent:
20120037409 - Method of manufacturing multilayer printed wiring board and multilayer wiring board obtained thereby: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper... Agent:
20120037408 - Method of repairing probe board and probe board using the same: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first... Agent: Samsung Electro-mechanics Co., Ltd.
20120037410 - Thermoplastic resin composition, adhesive film and wiring film using the same: A thermoplastic resin composition including a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a... Agent: Hitachi Cable, Ltd.
20120037412 - Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough: A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to the back side of the substrate, forming a... Agent:
20120037414 - Multilayer printed wiring board and method of manufacturing the same: A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the... Agent: Ibiden Co., Ltd
20120037411 - Packaging substrate having embedded passive component and fabrication method thereof: A packaging substrate includes: a core board with at least a cavity; a dielectric layer unit having upper and lower surfaces and encapsulating the core board and filling the cavity; a plurality of positioning pads embedded in the lower surface of the dielectric layer unit; at least a passive component... Agent: Unimicron Technology Corporation
20120037413 - Printed wiring board fabrication method, printed wiring board, multilayer printed wiring board, and semiconductor package: An object of the invention is to provide a method for fabricating a printed wiring board that can suppress warping of the printed wiring board and can improve the yield of semiconductor chip mounting and enhance the reliability of a semiconductor package. The printed wiring board fabrication method according to... Agent:
20120037415 - Carrier for a control unit of a motor vehicle, control unit and motor vehicle: A carrier is provided for a control unit of a motor vehicle. The carrier includes, but is not limited to at least one material section for fastening to the body of a motor vehicle. It is provided that the carrier is designed for receiving at least two control units, which... Agent: Gm Global Technology Operations LLC
20120037416 - Double-packing cable and flexible conduit gland: A double-packing cable and flexible conduit gland for securing a cable and a flexible conduit to a box member, including a casing having a tapered inner surface portion and a first outer thread, a packing member inserted into the casing and defining a first packing segment compressible to clamp on... Agent:
20120037417 - Removable push electrical fitting for electrical metallic tubing or emt: An electrical fitting having a gripping device with a plurality of gripping tabs forming a helix or spiral. The electrical fitting permits electrical metallic tubing or EMT to be quickly attached to and removed from the electrical fitting without disassembling the fitting or cutting the tubing. A body with a... Agent: Bridgeport Fittings, Inc.02/09/2012 > 29 patent applications in 22 patent subcategories. patent applications/inventions, industry category
20120031640 - Universal cover plate assembly: A cover plate assembly and an electrical box are provided for mounting one or more electrical wiring devices. The cover plate assembly can be modified to provide a single gang, double gang or triple gang assembly for mounting the wiring devices. The cover plate assembly includes a collar forming a... Agent: Hubbell Incorporated
20120031668 - Press-contact connection apparatus and illumination apparatus: There is provided a press-contact connection apparatus, including: a base part; press-contact terminals which are fixed to the base part; and an electric wire holder which holds a plurality of electric wires to be press-contacted with the respective press-contact terminals. The base part includes a support which supports the electric... Agent: Yazaki Corporation
20120031641 - Medium-voltage cable: A cable for transmitting electrical power at a voltage between 5 and 49 kV includes a conductive cable core and an insulation layer for insulating the cable core, the insulation layer including from 50 to 99.9% of cross linked polyethylene, and from 0.1 to 50% of ethylene-alkyl(meth)acrylate and/or ethylene vinyl... Agent: Trelleborg Forsheda Building Ab
20120031642 - Method of manufacturing electrical cable, and resulting product, with reduced required installation pulling force: Disclosed is type THHN cable having a reduced surface coefficient of friction, and the method of manufacture thereof, in which the central conductor core and insulating layer are surrounded by a nylon sheath. A high viscosity, high molecular weight silicone based pulling lubricant for THHN cable, or alternatively, erucamide or... Agent: Southwire Company
20120031643 - Cable with twisted pairs of insulated conductors and filler elements: A cable includes twisted pairs of insulated conductors. Each twisted pair includes two insulated conductors twisted together in a helical manner. The twisted pairs are grouped together to define a central core of the cable. An inner filler element is wrapped helically around the twisted pairs of the central core.... Agent: Tyco Electronics Corporation
20120031644 - Ultraconducting articles: Ultraconducting devices and methods of making thereof, said ultraconducting devices comprising continuous, aligned carbon nanotubes and a metallic matrix which substantially surrounds the carbon nanotubes.... Agent: Los Alamos National Security, LLC
20120031645 - System, method and apparatus for connecting battery cells: An application for a battery terminal strip for connecting to a terminal of at least one battery cell describes a battery terminal strip that is a strip of metal that has at least one weld point formed in the strip of metal. Each of the weld points having a protrusion... Agent:
20120031646 - Spacer device: A spacer device includes an elongate spacing member extending a longitudinal axis for securing to electrical transmission lines, and has a minimum thickness dm. At least one thickened portion having a thickness Tt and length dt is positioned intermediate along the spacing member to form at least two column lengths... Agent:
20120031647 - Conductive pattern and manufacturing method thereof: The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching... Agent: Lg Chem, Ltd.
20120031648 - Wiring circuit board: A wiring circuit board is provided, in which a circuit wiring is substantially free from a softening phenomenon which may otherwise occur due to heat over time, and is highly durable, less brittle and substantially free from cracking. The wiring circuit board includes a substrate comprising an insulative layer, and... Agent: Nitto Denko Corporation
20120031649 - Coreless layer buildup structure with lga and joining layer: A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid... Agent: Endicott Interconnect Technologies, Inc.
20120031650 - Semiconductor device manufacturing method and semiconductor device manufacturing apparatus: A method for manufacturing a semiconductor device that improves the reliability of a metal cap layer and productivity. The method includes an insulation layer step of superimposing an insulation layer(11) on a semiconductor substrate (2) including an element region (2b), a recess step of forming a recess (12) in the... Agent: Ulvac, Inc.
20120031651 - Circuit board: A circuit board including a circuit layer, a thermally conductive substrate, an insulation layer, and at least one thermally conductive material is provided. The thermally conductive substrate has a plane. The insulation layer is disposed between the circuit layer and the plane and partially covers the plane. The thermally conductive... Agent: Unimicron Technology Corp.
20120031652 - Circuit board and manufacturing method thereof: A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal pattern layer and the plane and partially covers the plane. The... Agent: Unimicron Technology Corp.
20120031654 - Capacitor structure with raised resonance frequency: A dual-port capacitor structure includes a first electrode plate having a first opening; a second electrode plate having a second opening; and a third electrode plate, disposed in the first opening of the first electrode plate and the second opening of the second electrode plate. The first electrode plate, the... Agent: Industrial Technology Research Institute
20120031653 - Printed circuit board made from a composite material: Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.... Agent:
20120031655 - Multi-layer circuit assembly and process for preparing the same: A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto... Agent: Ppg Industries Ohio, Inc.
20120031656 - Substrate for printed wiring board, printed wiring board, and methods for producing same: Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently... Agent:
20120031657 - Electronic device mounting structure and electronic device mounting method: An electronic device mounting structure including: a supporting member that includes a supporting substrate, and a through electrode that penetrates the supporting substrate from a first principal surface that is one principal surface of the supporting substrate to a second principal surface that is the other principal surface, and that... Agent: Fujikura Ltd.
20120031658 - Printed circuit board and method for manufacturing the same: A printed circuit board and a method for manufacturing a printed circuit board are disclosed. The printed circuit board in accordance with an embodiment of the present invention includes: a substrate; a first pad and a second pad, formed on one surface of the substrate and separated from each other;... Agent: Samsung Electro-mechanics Co., Ltd.
20120031659 - Printed wiring board and a method of manufacturing a printed wiring board: A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding... Agent: Ibiden Co., Ltd
20120031660 - Method of manufacturing circuit board and circuit board: A circuit board having a plurality of first holes formed in a semiconductor substrate to extend therethrough; insulating layers formed on a back surface of the semiconductor substrate in the plurality of first holes, the insulating layers between the back surface and the first holes being differed in thickness; second... Agent: Sony Corporation
20120031661 - Electromagnetic shielding device: A shielding device includes a frame, a shielding enclosure and a shaft. The frame includes sidewalls and at least one hinged portion. The shielding enclosure includes a cover and flanges extending therefrom for engagement with the sidewalls of the frame. A barrel portion is formed on the shielding enclosure and... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.
20120031662 - Sensor module having an electromagnetically shielded electrical component: In a module having an electrical component, which is situated between two ground planes for electromagnetic shielding, a trough-shaped composite component is provided between an inner and an outer housing, into which the rear side of the inner housing is inserted, the composite component having an insulator trough and, on... Agent:
20120031663 - Helical fine structure, method for producing the same, and electric-wave shield or absorber using the helical fine structure: A helical fine structure of the present invention is characterized by including: a phytoplankton having a helical shape and selected from a group of cyanobacteria called Spirulina; and a surface modification layer formed on the phytoplankton. The surface modification layer includes at least one metal plating layer. Thereby, the helical... Agent:
20120031664 - Window compatible electrical power device: A device that supplies electrical current to various outdoor locations via through-hole areas of building structures, such as window frames, door openings, etc. which includes a flatten portion with a male electrical outlet plug coupled to one end and one or more female electrical outlet(s) coupled to the other end.... Agent:
20120031665 - Electronic device housing: An electronic device housing includes a first housing and a second housing. The first housing forms a welding portion. The second housing defines a receiving groove in the periphery for receiving the welding portion. The welding portion is welded to an inner wall of the receiving groove of the second... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.
20120031666 - Electronic device housing: An electronic device housing includes a first housing, a second housing, and a plurality of frames. The first housing comprises a bottom plate and a side plate extending from an edge of the bottom plate. The side plate of the first housing is welded to the second housing. The frames... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.
20120031667 - Electronic device housing: An electronic device housing includes a first housing, a second housing, a plurality of frames, and a plurality of fixing members. The first housing includes a bottom plate and a side plate extending from an edge of the bottom plate. The side plate is welded to the second housing. The... Agent: Fu Tai Hua Industry (shenzhen) Co., Ltd.02/02/2012 > 42 patent applications in 30 patent subcategories. patent applications/inventions, industry category
20120024560 - Case for enclosing and remaining attached to a mobile communication device with applied fabric: Cases for enclosing and remaining attached to a mobile communications device may include a semi-rigid shell and a fabric covering attached thereto. The cases may include a semi-rigid shell with a recessed portion for accepting a fabric covering and the fabric covering.... Agent:
20120024559 - Electric connection box: For an object of providing an electric connection box which can maintain waterproof when a car is washed by high-pressure water, the electric connection box includes a box main body having a groove recessed from an outer wall and extending straight; and a side cover slid along a lengthwise direction... Agent: Yazaki Corporation
20120024561 - Electrical wire routing device: An electrical wire routing device for routing an electric wire between a floor in an automobile and a seat includes a case following parallel to a support rail to which a support body supporting the seat is slidably attached. The case includes a tubelar movement section attaching the electric wire... Agent: Yazaki Corporation
20120024558 - Junction box: A junction box includes a base, a cover snap-fitted into the base and a ventilation valve on the cover. The ventilation valve includes a first hollow cylinder that has a first inner bore having a first thread and a bottom having an open area that includes an annular flange; a... Agent:
20120024562 - Electical panel for a desktop vacuum chamber assembly: A method for establishing a communication path between connectors on opposite sides of a PCB mounted to a vacuum chamber with an O-ring seal includes the steps (a) providing a plurality of vias through the PCB in the form of a connector pin pattern within the O-ring seal area to... Agent:
20120024563 - Integral ac module grounding system: A photovoltaic (PV) ac-module grounding system includes a plurality of PV dc-voltage modules. Each PV dc-voltage module is integrated with a corresponding dc-ac micro-inverter to provide a corresponding PV ac-voltage module. Each PV ac-voltage module includes an ac-voltage plug and play connector that includes a dc ground conductor. Each dc-ac... Agent: General Electric Company
20120024564 - Harness wiring apparatus: A harness wiring apparatus wires a harness between a floor of a car and a seat, which is supported by a supporting member mounted at a long-tube-shaped support rail fixed at the floor. The harness wiring apparatus 1A includes a slider 10 holding the harness 4, which is led through... Agent: Yazaki Corporation
20120024598 - Cable routing structure for vehicle: A cable routing structure for vehicle can reliably prevent a cable from being broken or damaged, and can reduce manufacturing cost. A cable is routed along a lower surface of a floor panel and connects a power generating motor installed in a vehicle front portion and a battery installed in... Agent: Suzuki Motor Corporation
20120024599 - Oil-cooled equipment harness: An oil-cooled equipment harness includes a shielded wire including a conductor, a shielding layer on a periphery of the conductor, and a flexibility, a terminal fitting enclosing a front end part of the shielded wire, a housing enclosing a periphery of the shielded wire a predetermined distance away from the... Agent: Hitachi Cable Ltd.
20120024565 - Submarine electric power transmission cable armour transition: An electric power transmission cable includes at least one first section provided with cable armour made of a first metallic material, and at least one second section provided with a cable armour made of a second metallic material, wherein the second metallic material has ferromagnetic properties substantially lower than those... Agent: Prysmian S.p.a.
20120024566 - High-speed differential cable: A high-speed differential cable (1) comprises two-core signal lines in each of which a first dielectric layer (12) is provided around the perimeter of an internal conductor (11), which are arranged so that the cores thereof are in parallel, a second dielectric layer (13) provided around the perimeter of the... Agent:
20120024567 - Cross-linkable polymer mixture for casings of cables and lines: The invention provides a polymer mixture which is cross-linkable and halogen-free. The polymer mixture is particularly suitable as casing for cables or lines and is distinguished by a high cold strength and resistance to oils.... Agent:
20120024568 - Cable assembly: An object of the present invention is to provide a cable assembly excellent in water-tightness. A cable assembly 100 includes a plurality of cables 10 and a sealing part 30 holding the plurality of cables 10 side by side. In the cable assembly 100, each of the cables 10 includes... Agent: Fujikura Ltd.
20120024569 - Fep modification using titanium dioxide to reduce skew in data communications cables: A cable is provided with a first twisted pair of insulated conductors having a first lay length and a first insulation resulting in a first signal propagation rate and a second twisted pair of insulated conductors having a second lay length and a second insulation resulting in a second signal... Agent:
20120024570 - Zero halogen cable: A cable that comprises a cable core that includes a plurality of insulated pairs of twisted conductors wherein, the insulation of at least one pair of the plurality of insulated pairs of twisted conductors is formed of a zero halogen material that is substantially flame retardant, and the insulation of... Agent: General Cable Technologies Corporation
20120024572 - Conductive composition, transparent conductor using the same, and touch panel containing the transparent conductor: A conductive composition including metal nanowires having an average minor axis diameter of 5 nm to 45 nm, and a water-insoluble polymer containing at least one ethylenically unsaturated group selected from an acryloyl group and a methacryloyl group.... Agent: Fujifilm Corporation
20120024571 - Electrode assembly: The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip... Agent: Nanoflex Limited
20120024573 - Printed circuit board and manufacturing method thereof: There are provided a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: preparing a substrate having active regions and non-active regions, the non-active regions being formed on edges thereof; printing resists on dummy portions corresponding to the non-active regions of the... Agent: Samsung Electro-mechanics Co., Ltd.
20120024574 - Printed circuit board and method of manufacturing the same: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the... Agent: Nitto Denko Corporation
20120024575 - Thermal pad and method of forming the same: A thermal pad (602, 612, 622, 702, 712) formed on a Printed Circuit Board and a method (900) of formed the thermal pad (602, 612, 622, 702, 712) are provided. The thermal pad (602, 612, 622, 702, 712) comprises in its interior one or more coins (604, 614, 624, 704,... Agent: Telefonaktiebolaget Lm Ericsson (publ)
20120024576 - Bundled flexible circuit board based flat cable with water resistant section: A flat cable includes an enclosure sleeve that encloses a selected section of a cluster section of a flexible substrate. The enclosure sleeve has opposite ends respectively coupled to a first water resistant member and a second water resistant member. Each of the water resistant members includes a base forming... Agent: Advanced Flexible Circuits Co., Ltd.
20120024577 - Polyamide films for flexible printed circuit boards: The invention relates to a polymer film made of a polyamide composition comprising at least 80 weight percentage (wt. %) of a semi-crystalline semi-aromatic polyamide with a melting temperature (Tm) of at least 270° C., wherein the wt. % is relative to the total weight of the polymer composition, wherein... Agent:
20120024578 - Organic-inorganic nanocomposite materials and methods of making and using the same: The present invention relates to materials comprising organic-inorganic polymeric networks. In some embodiments, the present invention provides an organic-inorganic composite material comprising an inorganic metal oxide matrix interpenetrating with a polymeric phase. Additionally, the present invention provides methods of producing organic-inorganic composite materials.... Agent: Ppg Industries Ohio, Inc.
20120024579 - Bendable circuit structure for led mounting and interconnection: This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.... Agent: E. I. Du Pont De Nemours And Company
20120024580 - Epoxy resin composition, and prepreg and printed circuit board using the same: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant;... Agent:
20120024582 - Multilayer wiring substrate: A multilayer wiring substrate includes a laminate structure in which resin insulation layers and conductor layers are alternately laminated. The resin insulation layers include first-type resin insulation layers, and second-type resin insulation layers, each of which contains an inorganic material in a larger amount and is smaller in thermal expansion... Agent: Ngk Spark Plug Co., Ltd.
20120024581 - Printed circuit board and method of manufacturing the same: A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE... Agent: Nitto Denko Corporation
20120024583 - Multilayer laminate package and method of manufacturing the same: A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a metalized blind via. The cavity layer includes a first adhesive layer and two first circuit layers, which are stacked with the... Agent: Samsung Electronics Co., Ltd.
20120024584 - Connector and manufacturing method thereof: A method of manufacturing a connector is provided. Firstly, a substrate having a first surface, a second surface opposite to the first surface and a through hole is provided. Next, a first conductive layer covering the inside wall of the through hole is formed on the substrate. Then, a filler... Agent: Unimicron Technology Corp.
20120024585 - Electrical connector, electrical connection system and lithographic apparatus: An electrical connector comprises a high voltage pad and a high voltage plate. When connected to another electrical connector, the two plates, which are at the same voltage as the pads, form a region of high voltage in which the field is low. The pads are positioned in that region.... Agent: Asml Netherlands B.v.
20120024586 - Printed wiring board, method for manufacturing the same, and electronic equipment: A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the substrate to a surface on a back side of the substrate, the wiring through-hole portions being made using a dielectric material... Agent: Fujitsu Limited
20120024588 - Methods and apparatus for shielding circuitry from interference: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam.... Agent: Apple Inc.
20120024587 - Radiation amount reducing device: There is provided a radiation amount reducing device including a plurality of slit formed to a band-shape in a cover region, which is set in a plane of a metal plate capable of entirely covering at least one surface of an electromagnetic wave generation source, and spaced apart from each... Agent: Sony Corporation
20120024589 - Shielding case: A shielding case includes a frame, a cover, and a connector. The frame is provided on two lateral top edges with two guide rails, which are provided at respective one end with a limiting section. The frame is also provided on bottom edges with a plurality of spaced pins, and... Agent: Primecon Technology Ltd.
20120024590 - Cable and flexible conduit gland: A cable and flexible conduit gland for securing a cable and a flexible conduit to a box member is disclosed to include a casing having a middle stop flange extending around the periphery thereof, a first fastening member and a second fastening member formed integral with the periphery thereof and... Agent:
20120024592 - Crushable connector interface: A connector is disclosed. The connector includes a conductive housing. The conductive housing includes a wall region enclosing a space for receiving an adapter. The conductive housing also includes an annular end piece extending radially inward from a first end of the wall region and terminating the space. The annular... Agent:
20120024593 - Printed circuit board unit, method for manufacturing printed circuit board unit, and electric apparatus: A printed circuit board unit includes a first substrate, a second substrate, and a spacer. The second substrate is coupled to the first substrate via a solder material. The second substrate has different coefficient of thermal expansion from the first substrate. The spacer is disposed between the first substrate and... Agent: Fujitsu Limited
20120024591 - Server enclosure: A server enclosure includes a housing, at least one cable, a partition board, and a sealing member. The partition board is securely received in the housing and defines a through hole through which the at least one cable passes. The sealing member plugs the through hole. The sealing member is... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd
20120024594 - Electronic device enclosure: An electronic device enclosure includes a side panel defining a number of vents. Each vent is sandwiched by two adjacent partition members for preventing moisture penetrating the enclosure. Each of the partition members includes a plate, a first block perpendicularly extending from a first end of the plate, and a... Agent: Hon Hai Precision Industry Co., Ltd.
20120024595 - Attachment system for cables, in particular for wind turbines: An attachment system for cables (7), in particular for wind turbines, having a base body (1, 3) which can be secured to a support structure and which forms cable bushings (5) which have an opening for the insertion of cables (7) and which can be closed by a cover means... Agent:
20120024596 - Plastic cable clamps designs in steel outlet boxes: A cable clamp for securing a wire or cable in an electrical outlet box having an interior, an exterior and one or more openings therebetween is provided. The cable clamp includes a body and one or more retaining devices that define one or more apertures. The body is adapted to... Agent: Thomas & Betts International, Inc.
20120024597 - Spring lock electrical fitting: A fitting that anchors electrical wiring to a junction box or electrical panel includes gripping members which can releasably hold electrical wiring, in or out of armored conduit, and interference members which allow the fitting to be inserted through knock out apertures and, when in place, extend to prevent withdrawal... Agent: Keemeya LLC D/b/a NeeksonPrevious industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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