|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators January recently filed with US Patent Office 01/12Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 01/26/2012 > 34 patent applications in 24 patent subcategories. recently filed with US Patent Office
20120018184 - Compensating conductive circuit: A audio, video, and digital signal compensating conductive circuit consisting of one or more main electric conductor(s) and one or more non-terminated compensating conductor(s) to enhance transmission performance of an electrical signal. One embodiment is an electric cable comprising a one or more of said compensating conductive circuits. Another embodiment... Agent:
20120018212 - Power cord integrated hanger system for suspending a lighting fixture: A power cord integrated hanger system for suspending a lighting fixture has a flexible load bearing inner suspension part and a flexible non-load bearing outer conductor part that acts as the “power cord” for the suspended lighting fixture. The flexible outer conductor part has an internal passageway for the inner... Agent:
20120018213 - Electric energy distribution pole with incorporated ground system: The present invention is oriented to solving existing problems in the ground systems of aerial networks of electric energy distribution, providing a pole with an incorporated ground system. Said pole has a ground lead embedded in its structure, and two connection terminal boards fitted in the upper and lower sections.... Agent: Codensa S.a. Esp
20120018186 - Case structure having film type electronic circuit and method of manufacturing the same: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first... Agent: Samsung Electronics Co., Ltd.
20120018187 - Conductor grid for electronic housings and manufacturing method: With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing... Agent: Tyco Electronics Amp Gmbh
20120018185 - Electric junction box: There is provided an electric junction box 1 for ensuring a watertight performance even when a harness with various thickness is applied, including a box body 2, a tubelar guide portion 6 projecting from the box body 2 and guiding a harness 7 out of the box body 2, wherein... Agent: Yazaki Corporation
20120018188 - Temporary mounting device for an electrical junction box: An electrical junction box for use with carrying a load from a joist. The junction box includes a pancake housing and an upright side box compartment. The pancake housing is attached to the upright side box compartment to form an L-shaped configuration. The pancake housing also has an aperture for... Agent:
20120018189 - Flexible flame retardant insulated wires for use in electronic equipment: The invention relates to an insulated wire for use in electronic equipment, comprising an electrically conductive core and an insulating layer and/or an insulating jacket consisting of a flame retardant elastomeric composition surrounding the electrically conductive core, wherein the flame retardant elastomeric composition comprises a elastomeric polymer selected from the... Agent: DsmIPAssets B.v.
20120018190 - Cable with high level of breakdown strength after ageing: The present invention relates to a cable comprising at least one semiconductive layer and at least one insulation layer, wherein: —the semiconductive layer consists of a composition (A) comprising a polar copolymer (a) and carbon black, and—the insulation layer consists of a composition (B) comprising a polar copolymer (b2), and... Agent:
20120018191 - Coating and electronic component: The present invention provides a coating 10 provided on a conductor 20, the coating 10 has a first layer 12 containing palladium and a second layer 14 containing gold from the conductor 20 side, the first layer 12 has a first region 31 on the conductor 20 side and a... Agent: Tdk Corporation
20120018192 - Conductor of an electrical wire for wiring, method of producing a conductor of an electrical wire for wiring, electrical wire for wiring, and copper alloy solid wire: A conductor of an electrical wire for wiring, which is obtained by stranding a plurality of copper alloy wire materials each having a composition containing 0.3 to 1.5 mass % of Cr, with the balance being Cu and inevitable impurities, and which has a tensile strength of 400 MPa or... Agent: Furukawa Electric Co., Ltd.
20120018193 - Multi layer circuit board and method of manufacturing the same: There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein... Agent: Samsung Electro-mechanics Co., Ltd.
20120018194 - Multilayer wiring board and manufacturing method thereof: Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic filler and having an outer surface defining a chip mounting area to which an electronic chip is mounted with... Agent: Ngk Spark Plug Co., Ltd.
20120018195 - Printed circuit board: A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to... Agent: Samsung Electro-mechanics Co., Ltd.
20120018196 - Flexible printed circuit board with waterproof structure: Disclosed is a flexible printed circuit board with waterproof structure, including a flexible substrate that has a first surface on which a first metal layer is bonded. The first metal layer has an upper surface forming a covered area and at least one mounting zone and the metal layer forms... Agent: Advanced Flexible Circuits Co., Ltd.
20120018197 - Novel ductile metal foil laminate and method for producing the same: Provided are a flexible metal clad laminate including: (a) a first conductive metal foil in which a first polyimide layer is formed on a surface thereof; and (b) a second conductive metal foil in which a second polyimide layer is formed on a surface thereof, wherein the first polyimide layer... Agent: Doosan Corporation
20120018198 - Electronic component and printed wiring board: An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer formed on the lower electrode,... Agent: Ibiden Co., Ltd.
20120018199 - Printed circuit board: A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by... Agent: Hon Hai Precision Industry Co., Ltd.
20120018200 - Transparent conductive film for touch panel and method for manufacturing the same: Disclosed herein are a transparent conductive film for a touch panel and a method for manufacturing the same. A transparent conductive film 100 for a touch panel according to the present invention includes a transparent substrate 110: a plurality of silver nanowires 120 formed on the transparent substrate 110 to... Agent: Samsung Electro-mechanics Co., Ltd.
20120018201 - Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer: Provided are a circuit board easy to process by laser and a manufacturing method thereof A circuit board of the present invention includes a substrate, an insulating layer covering an upper surface of the substrate, and a conductive pattern of a predetermined shape formed on an upper surface of the... Agent: On Semiconductor Trading, Ltd.
20120018202 - Circuit device: In a circuit device of the present invention, the lower surface side of a circuit board is covered with a second resin encapsulant, and the upper surface side and the like of the circuit board are covered with a first resin encapsulant. Since heat dissipation to the outside of the... Agent: On Semiconductor Trading, Ltd.
20120018204 - Ceramic electronic component and wiring board: A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a... Agent: Murata Manufacturing Co., Ltd.
20120018203 - Electronic module with embedded jumper conductor: The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the... Agent: Imbera Electronics Oy
20120018205 - Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive... Agent: Murata Manufacturing Co., Ltd.
20120018206 - Solid electrolytic capacitor: There are prepared two capacitor element pieces 121 where both ends of an anode body of each of the capacitor element pieces form anode lead-out portions 122 and 122 and both surfaces of a middle portion of the anode body form cathode lead-out portions 123. The two capacitor element pieces... Agent: Nippon Chem-con Corporation
20120018207 - Circuit substrate and fabricating process of circuit substrate: A circuit substrate includes a base layer, a first patterned conductive layer, a dielectric layer, a conductive block and a second patterned conductive layer. The first patterned conductive layer is disposed on the base layer and has a first pad. The dielectric layer is disposed on the base layer and... Agent: Via Technologies, Inc.
20120018208 - Coupler apparatus: According to one embodiment, a coupler apparatus includes a coupling element and a ground plane. The coupling element comprises a conductive material and configured to be subjected to power feeding to a feeding point. The ground plane comprises a conductive material and faces the coupling element. The coupling element has... Agent: Kabushiki Kaisha Toshiba
20120018209 - Printed circuit board: A printed circuit board defines a groove used to engage with an electronic element. The groove defines a plurality of side walls. The PCB further defines a plurality of via holes at junctions between each two neighboring side walls. The via holes are communicate with the groove and have a... Agent: Hon Hai Precision Industry Co., Ltd.
20120018210 - Printed circuit board: A printed circuit board includes a reference layer configured to connect to a power or a ground and a dielectric layer stacked on the reference layer. The dielectric layer includes a component surface opposing the reference layer. The component surface forms a differential pairs, a protection runner, and a power... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd
20120018211 - Conductive grounding pad: p
20120018214 - Printed circuit board assembly: A mounting apparatus for a printed circuit board includes an enclosure and a tray. The enclosure includes a bottom wall and a side wall extending from the bottom wall. The side wall is substantially perpendicular to the bottom wall. The tray includes a bottom panel substantially parallel to the bottom... Agent: Hon Hai Precision Industry Co., Ltd.
20120018215 - Housing and electronic device using the same: A housing for an electronic device includes a main body and a ventilated member fixed on the main body. The main body includes a heat dissipating zone. The heat dissipating defines a plurality of heat dissipating holes. The ventilated member defines a heat dissipating chamber communicating with the heat dissipating... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20120018216 - High-pressure-resistant hermetic seal terminal and method of manufacturing the same: A high-pressure-resistant hermetic seal terminal includes an eyelet which has a through hole and a lead which is electrically insulated and hermetically sealed via a glass material in the through hole. The glass material is welded in a manner to extend on a lower surface of the eyelet from an... Agent: Nec Schott Components Corporation
20120018217 - Rotatable feedthru insert: An electrical connector feedthru insert assembly may include a connector body having a first leg projecting from the body in a first direction and second and third legs projecting from the body in a second direction substantially opposing the first direction. The first leg may be configured for insertion into... Agent: Thomas & Betts International, Inc.01/19/2012 > 35 patent applications in 24 patent subcategories. recently filed with US Patent Office
20120012355 - Shell of electronic device: A shell of an electronic device includes an inner surface and an outer surface opposite to the inner surface. The inner surface defines at least one recessed portion. The at least one recessed portion includes a bottom surface and a transition surface connecting the bottom surface with the inner surface.... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20120012356 - Package member assembly, method for manufacturing the package member assembly, package member, and method for manufacturing piezoelectric resonator device using the package member: [Solving means] In a package member assembly, a plurality of package members are integrally formed. The package member assembly includes a plurality of bottomed holes provided on a front main face and a back main face of a wafer made of glass, and external terminals connected to side-face conductors attached... Agent: Daishinku Corporation
20120012386 - Laying network cables in water supply pipes: A network and method of laying network cables in water supply pipes is disclosed. A building is situated near a roadway along which is laid a trunk cable. A water supply pipe branches off the water main to enter the building. A water supply pipe is provided at the time... Agent: I3 Group Limited
20120012389 - High speed data cable including a boost device for generating a differential signal: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI), and includes a raw cable and a boost device. Each of four high speed video signals is carried on the inner conductors of a pair of coaxial lines in the raw cable. The boost device receives... Agent: Redmere Technology Ltd.
20120012387 - Low impedance boosted high speed data cable: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI) or DisplayPort standards, and includes a raw cable and a boost device. The raw cable includes coaxial lines of a characteristic cable impedance lower than the impedance implied in the standards. The correct impedance is observed... Agent:
20120012388 - Reduced wire count high speed data cable: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI) or DisplayPort standards, and includes a raw cable and a boost device. The raw cable is exclusively constructed with either Shielded Twisted Pairs (STP) or coaxial lines which to carry all signals on either shielded wires... Agent:
20120012357 - Economical boosted high speed data cable: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI), and includes a raw cable and a boost device. Each of four high speed video signals is carried on the inner conductors of a pair of coaxial lines in the raw cable. Lower speed signals are... Agent: Redmere Technology Ltd.
20120012360 - High speed data cable using an outer braid to carry a signal: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI), and includes a raw cable and may include a boost device. The raw cable includes coaxial lines which are covered by an outer metallic braid. Each of four high speed video signals is carried on the... Agent: Redmere Technology Ltd.
20120012358 - High speed data cable with impedance correction: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI) or DisplayPort standards, and includes a raw cable and may include a boost device. The raw cable includes coaxial lines of a characteristic cable impedance higher than the impedance implied in the standards. The correct impedance... Agent: Redmere Technology Ltd.
20120012359 - Low cost high speed data cable: A high speed video cable carries signals according to the High-Definition Multimedia Interface (HDMI) or DisplayPort standards, and includes a raw cable. The raw cable is constructed with either Shielded Twisted Pairs (STP) or coaxial lines which carry all signals on either shielded conductors or their shields. Some auxiliary signals... Agent: Redmere Technology Ltd.
20120012361 - Electrical wire and method of fabricating the electrical wire: An electrical wire includes a plurality of first conductors. The plurality of first conductors includes at least one electrifiable conductor for delivering electrical power and at least one signal conductor for delivering a communications signal. Second and third conductors are respectively formed on opposing sides of the plurality of first... Agent: Newire Inc.
20120012362 - Dc power cable with space charge reducing effect: Provided is a DC power cable including a conductor, an inner semiconductive layer, an insulation and an outer semiconductive layer. In particular, the inner semiconductive layer or the outer semiconductive layer may be formed from a semiconductive composition containing a polypropylene base resin or a low-density polyethylene base resin and... Agent: Ls Cable Ltd.
20120012363 - Uncrosslinked polyethylene composition for power cable: Disclosed is uncrosslinked linear medium-density polyethylene resin composition for a power cable, which is applicable to an insulating layer, a semi-conducting layer or a sheath layer. Specifically, the uncrosslinked polyethylene composition includes: 100 parts by weight of a polymer comprising a linear medium-density polyethylene resin comprising an α-olefin having 4... Agent: Sk Innovation Co., Ltd.
20120012364 - Cross-linked polyolefin material blend molded electrical transmission insulating products: A new cross linked polyolefin material combination that is designed to replace current high-density polyethylene (“HDPE”) materials for use with molded or over-molded electrical transmission products. Such molded or over-molded electrical transmission products include, for example, vise-top pin insulators, line post insulators, F-neck, C-neck, and J-neck pin insulators of classes... Agent: Marmon Utility LLC
20120012365 - Thermal flex contact carriers #2: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable... Agent:
20120012366 - Polyamic acid, polyimide, photosensitive resin composition comprising the same, and dry film manufactured from the same: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and... Agent: Lg Chem, Ltd.
20120012369 - Circuit board: A circuit board includes a laminated body including a laminate of a plurality of insulating-material layers made of a flexible material. External electrodes are provided on the top surface of the laminated body. An electronic component is mounted on the external electrodes. A plurality of internal conductors, when viewed in... Agent: Murata Manufacturing Co., Ltd.
20120012367 - Flexible laminate and flexible electronic circuit board formed by using the same: An adhesive-free flexible laminate formed from a polyimide film in which at least one surface has been plasma treated, a tie-coat layer formed on the surface of the plasma-treated polyimide film, a metal seed layer made of either copper or copper alloy and which is formed on the tie-coat layer,... Agent: Jx Nippon Mining & Metals Corporation
20120012368 - Multilayer wiring board and method for manufacturing the same: A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible... Agent: Ibiden Co., Ltd.
20120012371 - Manufacturing method for circuit board, and circuit board: A method of manufacturing circuit boards includes the steps of forming an upper board having an opening, and provided with a circuit and an insulating film layer formed on a surface thereof, forming a lower board provided with a circuit and an insulating film layer formed on a surface thereof,... Agent: Panasonic Corporation
20120012370 - Transparent conductive laminate and touch panel therewith: A transparent conductive laminate comprising a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate; and a transparent base substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween. The transparent conductive laminate has... Agent: Nitto Denko Corporation
20120012372 - Method and structure to improve the conductivity of narrow copper filled vias: Techniques for improving the conductivity of copper (Cu)-filled vias are provided. In one aspect, a method of fabricating a Cu-filled via is provided. The method includes the following steps. A via is etched in a dielectric. The via is lined with a diffusion barrier. A thin ruthenium (Ru) layer is... Agent: International Business Machines Corporation
20120012373 - Submount and method of manufacturing the same: A submount with an electrode layer having excellent wettability in soldering and method of manufacturing the same are disclosed. A submount (1) for having a semiconductor device mounted thereon comprises a submount substrate (2), a substrate protective layer (3) formed on a surface of the submount substrate (2), an electrode... Agent: Dowa Electronics Materials Co., Ltd.
20120012374 - Electrical feedthrough assembly: An electrical feedthrough includes a ceramic body and a ribbon via extending through the ceramic body, an interface between the ribbon via and the ceramic body being sealed using partial transient liquid phase bonding. The ribbon via extends out of the ceramic body and makes an electrical connection with an... Agent: Advanced Bionics LLC
20120012375 - Insulating material and printed circuit board having the same: An insulating material formed by impregnating a base material with a liquid composition and curing the liquid composition, the liquid composition being 20 to 50 parts by weight of a PMDA-ODA mixture, the PMDA-ODA mixture including pyromellitic dianhydride (PMDA) and oxydianiline (ODA) mixed in a weight ratio of 40:60 to... Agent: Samsung Electro-mechanics Co., Ltd.
20120012376 - Assembly, and associated method, for forming a solder connection: An assembly, and an associated method, facilitates egress of gasses generated during a solder process, thereby reducing the occurrence of voids in the resultant solder connection. A channel is formed to extend part way through a solder pad. The channel defines a path by which to facilitate the egress of... Agent: Research In Motion Limited
20120012377 - Printed circuit board: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20120012379 - Printed circuit board: A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via... Agent: Samsung Electro-mechanics Co., Ltd.
20120012378 - Printed circuit board and method of manufacturing the same: Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed... Agent: Samsung Electro-mechanics Co., Ltd.
20120012380 - Back drill verification feature: A back drill verification feature is provided on a layer of a circuit board. Before a back drill operation is performed, an electrical connection exists between conductive material in a via hole and the back drill verification feature. After the back drill operation, the electrical connection is severed.... Agent:
20120012381 - Shielding assembly: A shielding assembly includes a frame including a catch protruding near one end thereof; and a cover including a main body. The main body is punched to form an opening and a latching portion protruding from the main body and aligned with the opening; the latching portion latches with the... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.
20120012382 - Conductive films for emi shielding applications: According to various aspects, exemplary embodiments are provided of EMI shielding materials. In one exemplary embodiment, an EMI shielding material generally includes a conductive metal layer disposed on a thin carrier film. The EMI shielding material may be sufficiently compliant such that the conductive metal layer and thin carrier film... Agent: Laird Technologies, Inc.
20120012383 - Photovoltaic battery module and junction box assembly therein: Disclosed are a photovoltaic battery module and a junction box assembly. The junction box assembly comprises a junction box and a base plate assembled with the junction box. The junction box comprises an insulated housing, the conductive terminals and the water-resistant members. The bottom of the junction box disposes the... Agent:
20120012384 - Mounting device for electronic component and electronic apparatus using the same: A mounting device includes a mounting plate and a mounting frame. The mounting plate defines a plurality of mounting grooves and a latching hole therein. Each of the mounting grooves includes a receiving hole and a sliding slot communicating with each other. The mounting frame includes a plurality of hooks... Agent: Hon Hai Precision Industry Co., Ltd.
20120012385 - Switch engagement assembly for an automobile door panel: A switch engagement assembly includes a base component including a plurality of mating devices and a switch box configured to couple to the base component, the switch box including a plurality of complementary mating receptacles, each mating receptacle configured to receive a respective mating device. Also described herein is a... Agent: Illinois Tool Works Inc.01/12/2012 > 21 patent applications in 17 patent subcategories. recently filed with US Patent Office
20120006576 - Feedthrough assembly for an implantable device: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.... Agent:
20120006577 - Device for securing household systems from young children: A device for securing indoor electrical outlets, light switches, telephone jacks, computer network outlets, etc., from the reach of a young child is provided. The device can be easily installed over any standard outlet or switch. The device comprises a two-piece structure: the first piece includes a plate and a... Agent:
20120006595 - Bus bar module: A bus bar module, which is electrically connected to a power terminal of an at least one semiconductor module having a semiconductor element, includes at least one bus bar made of a conductor, and a sealing member made of resin which seals part of the bus bar. The bus bar... Agent: Denso Corporation
20120006578 - Wind energy plant having a twistable nacelle cable guide: A wind energy installation includes a tower and a nacelle arranged at the top of the tower such that it can swivel in the azimuth direction. The installation also includes a plurality of cables which are guided via a loop from the tower into the nacelle, the cables being held... Agent: Repower Systems Ag
20120006596 - Crimp terminal, crimp structure of crimp terminal, and crimping method of crimp terminal: An object is to provide a crimp terminal which can increase contact pressure at both sides of a conductor press-clamping portion by reducing difficulty with which an original crimped shape is restored after a thermal shock test by realizing an increase in rigidity at root portions of conductor clamping pieces.... Agent: Yazaki Corporation
20120006579 - Method of fabricating an electric wire having a ptfe-based sheath, said electric wire, and a corresponding lubricant evaporation and sintering line: An electric wire comprises a non-oxidized conductor of copper alloy having no outer coating and in direct contact with a PTFE-based sheath. It is fabricated as follows: providing a copper alloy conductor without an outer coating; forming a sheath of a PTFE-based material around the conductor; and heating the wire... Agent: Axon'cable
20120006580 - Electrically conductive laminate structures, electrical interconnects, and methods of forming electrical interconnects: Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure,... Agent:
20120006581 - Cable organiser: The present invention relates to a cable organiser, in particular to a cable organiser used to secure headphones for use with an electronic device. In one aspect the invention relates to a cable organiser for use with an electronic device, the electronic device including a jack socket for receiving a... Agent: Biralee Investments Pty Limited
20120006582 - Flexible board for transmitting signals: Provided is a flexible board for transmitting signals which includes: a dielectric on which different signal lines are respectively disposed on independent separation regions on opposite surfaces of opposite sides thereof; a metallic shielding portion that is spaced apart from each other at intervals at a boundary between the separation... Agent:
20120006587 - Multilayered printed circuit board and method for manufacturing the same: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that... Agent: Ibiden Co., Ltd.
20120006586 - Suspension substrate, suspension, head suspension, and hard disk drive: A suspension substrate according to the present invention includes an insulating layer and a metallic support layer provided on the actuator element's side of the insulating layer. On the other side of the insulating layer, a wiring layer is provided. This wiring layer includes a plurality of wirings and a... Agent: Dai Nippon Printing Co., Ltd.
20120006585 - Touch panel: A touch panel includes first and second substrates, and first insulating layer disposed therebetween. The first substrate has, on its bottom surface, a first conductive layer having opposing first and second sides; a first electrode along the first side; and a second electrode along the second side. The second substrate... Agent: Panasonic Corporation
20120006584 - Wiring board and liquid crystal display device: A wiring board of the present invention (1) is arranged so that: pads (30) arranged in a plurality of rows include: first-row pads (30a) connected to first metal wires (10a) among metal wires (10); and second-row pads (30b) connected to second metal wires (10b) among the metal wires (10), the... Agent:
20120006588 - Epoxy resin composition, prepreg, resin-coated metal foil, resin sheet, laminate and multilayer board: The epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2)... Agent:
20120006589 - Electronic assemblies without solder and methods for their manufacture: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The... Agent: Occam Portfolio LLC
20120006590 - Printed circuit board: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd .
20120006591 - Wiring substrate and method for manufacturing wiring substrate: A wiring substrate that prevents the occurrence of delamination near an interface between an insulation layer and an electrode pad, which is formed in a recess of the insulation layer. An adjustment layer is formed in an opening in a resist, which is applied to a support body, to adjust... Agent:
20120006592 - Wiring board and method for manufacturing the same: A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed... Agent: Ibiden Co., Ltd
20120006593 - Electromagnetic interference (emi) diverter: An external EMI diverting structure to electrically shield an electronic device from EMI is presented. The electronic device is physically isolated from the case ground which interrupts the EMI or lightning fault path. This shield provides a return path to ground for the EMI away from the electronic device and... Agent: Honeywell International Inc.
20120006594 - Connector cover and junction box unit provided with the same: There is provided a junction box unit that comprises a body to which a power integration unit is attached and a connector cover that positions a connector of a wiring harness with respect to the body. The connector cover comprises a holding portion holding the connector, a mounting portion attached... Agent: Yazaki Corporation01/05/2012 > 21 patent applications in 18 patent subcategories. recently filed with US Patent Office
20120000686 - Electric junction box: An electric junction box 1 includes: a box main body 2; and a tubular guide portion 6 projecting from the box main body 2 and guiding a plurality of electric wires 7 to an outside of the box main body 2. While the electric wires 7 are passed through the... Agent: Yazaki Corporation
20120000687 - Waterproof structure and electronic equipment: With a waterproof structure for the space between a first case and a diaphragm doubling as a display panel provided facing the first case, a first resilient member is integrally formed at a surface of the diaphragm facing the first case, and the first resilient member is press-fitted into a... Agent: Casio Hitachi Mobile Communications Co., Ltd.
20120000688 - Cable routing device and unit for telecommunication and data technology: The invention relates to a cable routing device and a unit for telecommunication and data technology, comprising a housing, wherein terminals or circuit board plug-in connectors (2) are disposed on at least one side of the housing, wherein a cable routing device (10) is disposed on the housing, the cable... Agent: Adc Gmbh
20120000689 - Junction box for solar battery: A junction box for a solar battery comprises a box body in which a plurality of connector bases are fixed, and a plurality of connection assemblies detachably connected with respective ones of the plurality of connector bases. Each connection assembly comprises a bracket and elastic member. The bracket is detachably... Agent: Byd Company Limited
20120000703 - High-speed connector inserts and cables: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from... Agent: Apple Inc.
20120000704 - Wire harness wiring unit and wire harness wiring assembly having the same: There is provided a wire harness wiring unit provided to a base plate and a wire harness wiring assembly having the same which can regulate a direction of a curve of a wire harness. The wire harness wiring unit includes the wire harness having a distal and a proximal end... Agent: Yazaki Corporation
20120000705 - Circuitry for active cable: Circuits, methods, and apparatus that allow signals that are compliant with multiple standards to share a common connector on an electronic device. An exemplary embodiment of the present invention provides a connector that provides signals compatible with a legacy standard in one mode and a newer standard in another mode.... Agent: Apple Inc.
20120000706 - Device for transmitting electromagnetic signals: An RF transmission line device with high performance, wide band characteristics includes an inner conductor for transmitting communication signals of a desired frequency band and a grounded outer conductor electrically insulated from the inner conductor by at least one dielectric material. A tap conductor is connected to the inner conductor... Agent:
20120000691 - Cnt-infused fiber as a self shielding wire for enhanced power transmission line: A wire includes a plurality of carbon nanotube infused fibers in which the infused carbon nanotubes are aligned parallel to the fiber axes. An electromagnetic shield for a wire includes a plurality of carbon nanotube infused fibers, in which the infused carbon nanotubes are aligned radially about the fiber axes.... Agent: Applied Nanostructured Solutions, LLC
20120000690 - Data cable with free stripping water blocking material: A data cable with free stripping water blocking material includes a first conductor substantially surrounded by a first foam, a second conductor longitudinally adjacent the first conductor and substantially surrounded by a second foam, a solid coat substantially surrounding the first foam of the first conductor, a filler material, a... Agent: General Cable Technologies Corporation
20120000692 - Shielded cable connecting structure and shielded cable connecting method: There is provided a shielded cable connecting structure comprising a shielding layer removed portion where a plurality of covered wires are exposed for connection of connecting terminals to a shield connector and a conductive heat-shrinkable tube which is fittingly mounted on an end portion of an electromagnetic shielding layer which... Agent: Yazaki Corporation
20120000693 - Electric coil: Provided is an electric coil including a wire coated with enamel and spirally wound a predetermined number of times, an insulating member, and an installation member made of plastic, wherein the wire is an aluminum wire coated with enamel and a copper wire is connected to both ends of the... Agent: Spg Ltd
20120000694 - Insulation material composition for dc power cable and the dc power cable using the same: An insulation material composition for a direct current (DC) power cable and the DC power cable using the same are provided. A direct current (DC) power cable insulation material composition includes 0.5 to 5 parts by weight of surface-modified nano-sized cubic magnesium oxide, per 100 parts by weight of a... Agent: Ls Cable & System Ltd.
20120000695 - Resin circuit board: A resin circuit board includes a layered structure of resin layers and conductor layers, has significantly reduced and minimized warping and distortion, and has a precise shape. A second conductor layer is disposed between a resin layer and a first conductor layer made of a metal. The resin layer and... Agent: Murata Manufacturing Co., Ltd.
20120000696 - Liquid coverlays for flexible printed circuit boards: The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal... Agent: Sun Chemical B.v.
20120000697 - Printed circuit board and method of manufacturing the same: Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of... Agent: Samsung Electro-mechanics Co., Ltd.
20120000698 - Substrate for suspension, and production process thereof: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic... Agent: Dai Nippon Printing Co., Ltd.
20120000699 - Circuit module: A circuit module includes: a circuit board having a first surface and a second surface opposite to the first surface; two or more electronic components mounted on the first surface; a molding resin layer which seals the first surface and the electronic components; and a conductive resin layer formed by... Agent: Panasonic Corporation
20120000700 - Printed circuit board: A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape... Agent: Hon Hai Precision Industry Co., Ltd.
20120000701 - Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has... Agent: Amphenol Corporation
20120000702 - Two-side cable-arrangement structure and electronic apparatus therewith: A two-side cable-arrangement structure is disclosed. The two-side cable-arrangement structure includes a plate, a first cable-arrangement structure, and a second cable-arrangement structure. The first cable-arrangement structure and the second cable-arrangement structure are respectively disposed on two sides of the plate. A cable is fixed on the two sides of the... Agent:Previous industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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