|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators December patent applications/inventions, industry category 12/11Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 12/29/2011 > 25 patent applications in 22 patent subcategories. patent applications/inventions, industry category
20110315419 - Cable assembly for communicating signals over multiple conductors: A cable assembly includes elongated conductors, primary dielectric layers, a secondary dielectric layer, a conductive shield layer and a drain wire. The conductors communicate a signal. The primary dielectric layer is circumferentially disposed around each of the conductors. The secondary dielectric layer surrounds the primary dielectric layers. The conductive shield... Agent: Tyco Electronics Corporation
20110315441 - Break-away hook assembly: A break-away hook assembly is adapted for installation for use with a low-voltage residential communication cable. A pair of members is coupled. One of the members has a connector with a terminal portion which receives a terminus of the other member. The connector breaks to release the second member from... Agent:
20110315420 - Cable boot and clamp cable mounting system: A soft cable boot is snapped on or molded around a cable or cable harness. The cable boot has a three dimensional interlock structure on its circumference via which it interlocks with an interlock teeth profile of a boot clamp. While the boot clamp is mounted and tied down, the... Agent:
20110315421 - Housing and method for making the same: A housing includes a first base layer and a second base layer integrally combining with the first base layer. The first base layer is formed by a first injection mold, the first base layer has a first combining surface arranged with ribs. The second base layer combines with the first... Agent: Shenzhen Futaihong Precision Industry Co., Ltd.
20110315422 - Splice restraint and mating indicator: The present invention relates to a splice restraint for use with sleeves that attach to joints. The splice restraint includes a first securing member constructed and arranged to be received in a groove of a first sleeve that is installable on a first leg of a joint, a second securing... Agent:
20110315443 - High performance data cable: A high performance data cable which has an interior support or star separator. The star separator or interior support extends along the longitudinal length of the data cable. The star separator or interior support has a central region. A plurality of prongs or splines extend outward from the central region... Agent: Belden Inc.
20110315423 - Abrasion resistant and flame retardant thermoplastic vulcanizate compositions: The present invention relates to flame retardant thermoplastic vulcanizate compositions having improved abrasion resistance and strip force. In addition, the invention relates to wire and cable coated with these compositions. The flame retardant thermoplastic vulcanizate compositions comprise a thermoplastic vulcanizate composition, at least one halogen-free flame retardant and an ultra-high... Agent: E.i. Du Pont De Nemours And Company
20110315424 - Polymer composition: The invention relates to a method for modifying a polymer composition, to modified polymer compositions, to an article, preferably wire or cable, comprising said modified polymer composition, to a process for preparing an article, preferably a wire or cable, to the use of said modified polymer in one or more... Agent: Borealis Ag
20110315425 - Resin composition for heat-resistant electrical wire, and heat-resistant electrical wire: Provided is a resin composition for heat-resistant electrical wires which has high heat resistance and flame retardancy and combines excellent heat aging resistance and compatibility with PVC. The resin composition for heat-resistant electrical wires is configured of 100 parts by weight of base resin ingredients and 5-20 parts by weight... Agent: Yazaki Corporation
20110315427 - Communication wire: The present invention relates to an improved isolated core or insulated conductor with a low dielectric constant and reduced materials costs. Apparatuses and methods of manufacturing the improved isolated core or insulated conductor are also disclosed.... Agent: Adc Telecommunications, Inc.
20110315426 - Low noise ecg cable and electrical assembly: An electrocardiography (ECG) electrical cable, that includes a plurality of insulated conductors, a conductive shield surrounding the plurality of insulated conductors and an insulating jacket surrounding the plurality of insulated conductors and the conductive shield. Also, each of the plurality of insulated conductors includes a low noise coating and the... Agent:
20110315428 - Gas insulated apparatus: When electric discharging occurs inside a gas insulated apparatus in which sulfur hexafluoride is filled, hydrogen-fluoride gas is generated, which abrades a part formed of glass fiber reinforced plastics included in the apparatus. Previously, resin for preventing the abrasion has been coated on the surface of the part; however, a... Agent: Mitsubishi Electric Corporation
20110315429 - Metal coating for indium bump bonding: A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of <100° C.), a metal or alloy layer is deposited on the indium bump surface. Preferably,... Agent:
20110315430 - Cable management system for cable and wire storage: A cable management system for use in storing loose or dangling cables and wires of electronic devices behind a stand. A flexible storage receptacle affixed to a stable surface via suspension cables and fasteners. Cables and wires may be places within the receptacle so that they are not exposed to... Agent:
20110315431 - Terminal cover: A terminal cover (A) includes an escaping portion (20) formed by cutting off a part of a peripheral wall portion forming a first accommodating portion (11) to allow an internal space of the first accommodating portion (11) to communicate with a second accommodating portion (12), thereby avoiding interference with a... Agent: Sumitomo Wiring Systems, Ltd.
20110315432 - Method for manufacturing transparent electrode pattern and method for manufacturing electro-optic device having the transparent electrode pattern: Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for manufacturing the transparent electrode pattern includes forming a transparent electrode on a light-transmissive substrate, patterning the transparent electrode by removing a portion of the... Agent: Jusung Engineering Co., Ltd
20110315433 - Meth0d and system for connecting a plurality of printed circuit boards to at least one frame or carrier element and printed circuit board and frame or carrier element: at least one frame or carrier element (5) for coupling to a plurality of printed circuit boards (1) using coupling elements (6) that in each case complement at least one coupling element (4) of the printed circuit boards (1), wherein the printed circuit boards (1) can be coupled to the... Agent:
20110315434 - Fine aluminum hydroxide powder for filling in resin and method for producing the same: The object of the present invention is to provide an aluminum hydroxide powder for filling in resin, which is excellent fillability in resin. Provided is an aluminum hydroxide powder forfilling in resin, being characterized in that it comprises a gibbsite crystal structure.... Agent: Sumitomo Chemical Company, Limited
20110315435 - Acid anhydride curable thermosetting resin composition: The present invention provides a resin composition suitable for printed circuit boards, the composition includes one epoxy resin or the mixture thereof, curing agent, promoting agents and additives, wherein the ratio of curing agent to epoxy resin is 1.55˜2.5, in which epoxy resin consists of at least one of phenol-formaldehyde... Agent:
20110315436 - Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition: The present invention provides a metal ink composition, which includes 20 to 80 parts by weight of cupper nano-particle; 10 to 70 parts by weight of non-aqueous organic solvent; and 2 to 20 parts by weight of additive used for adjustment of the dry speed of coated metal ink when... Agent: Samsung Electro-mechanics Co., Ltd.
20110315437 - Printed circuit board with reinforced thermoplastic resin layer: A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement... Agent: Samsung Electro-mechanics Co., Ltd.
20110315439 - Multiple patterning wiring board, wiring board wiring board and electronic apparatus: A multiple patterning wiring board includes a base substrate including a plurality of wiring board regions arranged in rows and columns, the wiring board regions each including an electronic component mounting region in a center portion thereof, a dividing groove at borders between wiring board regions in one main face... Agent: Kyocera Corporation
20110315440 - Electromagnetic bandgap structure and printed circuit board: An electromagnetic bandgap structure and a printed circuit board that have a mushroom type structure. The electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, layer-built on the first metal layer; a mushroom type structure having a metal plate layer-built on the first dielectric layer and a... Agent: Samsung Electro-mechanics Co., Ltd.
20110315442 - Fixing device for fixing a cable at a housing feed-through: Fixing device for cables which have at least one conductor (2) which is provided with at least one insulation (3), on a housing feed-through (4) of a housing (5), where the fixing device (1) has a locking ring (13) with a cable feed-through channel, which locking ring can be axially... Agent: Weidmueller Interface Gmbh & Co. Kg12/22/2011 > 26 patent applications in 21 patent subcategories. patent applications/inventions, industry category
20110308832 - Cable entry device for wiring boxes: Disclosed herein are embodiments of a wiring box. The wiring box can comprise: a cavity formed by walls having an internal surface inside the cavity and an external surface; and a cable entry device disposed through a hole in a first wall of the walls. The cable entry device can... Agent: Sigma Electric Manufacturing Corporation
20110308833 - Photovoltaic string sub-combiner: An improved method of collecting DC power in solar photovoltaic systems is disclosed where series string overcurrent protection is provided at distributed series string terminus locations and a tap connection is made to higher current conductors carrying the combined currents of a number of series strings. A number of related... Agent: Renewable Power Conversion, Inc.
20110308834 - Laminated bus bar: A laminated bus bar is applied to a main wiring circuit of an electric power converter and connected to a semiconductor module. The laminated bus bar includes insulator plates laminated together, and conductors interposed between the insulator plates. Each conductor includes a connection terminal section led out in accordance with... Agent: Fuji Electric Holdings Co., Ltd.
20110308835 - Self-coiling apparatus: A self coiling apparatus includes an article having a length and capable of being wound or coiled. At least one filament is formed of shape changing material and is wound about the article along its length. An actuation source is connected to the at least one filament and the at... Agent:
20110308853 - Harness retaining means and harness wiring structure: There is disclosed a harness retaining device for retaining a harness and causing the harness together with a connection element for an electric/electronic circuit to be supported with respect to a portion of a frame of a vehicle seat. The harness retaining device includes a support arm having first and... Agent:
20110308854 - Planar electrode system: Planar electrode system and method of manufacturing same, comprising at least one foil-type, electrically conductive planar electrode, a connection for connecting it to an external operating apparatus/control apparatus, and also at least one substrate layer, protective layer and/or insulation layer arranged on the surface of the planar electrode, which system... Agent:
20110308855 - Shielding braid termination for a shielded electrical connector: The present invention relates to shielded electrical cables and shielded electrical connectors to be affixed thereto, and in particular to the termination of the shielding braid provided at the electrical cable. According to the present invention, a shielding termination structure for engaging a shielding (104) of a shielded cable (100)... Agent: Tyco Electronics Uk Ltd.
20110308856 - Connecting tab of battery pack, coupling structure between the connecting tab and wire, and coupling method thereof: Embodiments of the present invention provide a connecting tab of a battery pack, which allows a wire to be firmly coupled to a battery cell or a protective circuit module, a coupling structure between the connecting tab and a wire, and coupling method thereof. In one embodiment of the present... Agent: Samsung Sdi Co., Ltd.
20110308857 - Insulated multi-wire electrical connector: A multi-wire connector crimps a number of distributor wires to connect with a power wire to serve multiple electrical uses. Interior malleable electrically conductive material may comprise a conductive metal including copper, nickel plated metal, aluminum or other conductive metal which crimps easily over existing wire ends inserted in the... Agent:
20110308836 - Insulation containing styrene copolymers: The invention relates to cover compositions for electric power cables having a polyolefin and a styrene copolymer. The styrene copolymer 1) has a styrene content of 55 percent (by weight base on the total styrene copolymer) or greater; 2) contains a random arrangement of styrene and at least one other... Agent: General Cable Technologies Corporation
20110308837 - Communication wire: The present invention relates to an improved isolated core or insulated conductor with a low dielectric constant and reduced materials costs. Apparatuses and methods of manufacturing the improved isolated core or insulated conductor are also disclosed.... Agent: Adc Telecommunications, Inc.
20110308838 - Communication wire: The present invention relates to an improved isolated core or insulated conductor with a low dielectric constant and reduced materials costs. Apparatuses and methods of manufacturing the improved isolated core or insulated conductor are also disclosed.... Agent: Adc Telecommunications, Inc.
20110308839 - Printed circuit board module: As a base, a side wall, and a top board are integrated by integral molding in a printed circuit board module, the printed circuit board module is structured in a simple manner. Further, conductive terminals are used for fitting a printed circuit board. The printed circuit board is securely held... Agent: Fujitsu Limited
20110308840 - Wiring substrate: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed... Agent: Fujitsu Limited
20110308841 - Coverlay film, method for manufacturing coverlay film, and flexible printed wiring board: Provided are: a cover-lay film which has an electromagnetic wave shielding function and excellent flexibility, enables a reduction in the thickness of a flexible printed wiring board, and eliminates the necessity of connecting a layer for shielding electromagnetic noise, to the ground circuit of the flexible printed wiring board; a... Agent:
20110308842 - Wiring substrate and method for manufacturing the wiring substrate: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the... Agent: Fujitsu Limited
20110308843 - Transparent thin plate: Provided is a transparent thin plate including a transparent substrate in a sheet form, a mesh layer formed on a surface of the transparent substrate and made of an opaque material having a structure wherein an outline of meshes is made of bands that are very thin and have a... Agent:
20110308844 - Conductive electrode pattern and solar cell with the same: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag)... Agent: Samsung Electro-mechanics Co., Ltd.
20110308846 - Conductive film and method for producing the same: A conductive film has a transparent support, a first conductive silver image disposed on one main surface of the transparent support, and a second conductive silver image disposed on the other main surface of the transparent support. The first and second conductive silver images are obtained by forming at least... Agent: Fujifilm Corporation
20110308845 - Printed circuit board and method of manufacturing the same: The present invention provides a printed circuit board including: an insulating member having a through via hole; a circuit pattern disposed on the insulating member; a solder resist disposed on the insulating member while exposing a portion of the circuit pattern; a via plating pad connected to the circuit pattern,... Agent: Samsung Electro-mechanics Co., Ltd.
20110308847 - Method for high-temperature circuit board assembly: The creation of a circuit board which contains electrical interconnections between the circuit board traces and electronic devices mounted on the circuit board where the circuit board assembly can be operated at temperatures of 600° C. or greater. This invention allows for solder connections to be formed using solder paste... Agent:
20110308848 - Resin composition for wiring board, resin sheet for wiring board, composite body, method for producing composite body, and semiconductor device: The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer... Agent: Sumitomo Bakelite Company, Ltd.
20110308849 - Wiring substrate and method of manufacturing the same: A wiring substrate includes a first insulating layer formed as an outermost layer on one surface side, and exhibiting a black color or a gray color, a first connection pad formed to expose from the first insulating layer, a second insulating layer formed as an outermost layer on another surface... Agent: Shinko Electric Industries Co. Ltd.
20110308850 - Notch positioning type soldering structure and method for preventing pin deviation: A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at... Agent: Askey Computer Corp.
20110308851 - Circuit substrate and light emitting diode package: A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at... Agent: Everlight Yi-guang Technology (shanghai) Ltd.
20110308852 - Cable storage structure of slide components, slide unit, electronic device, and cable storage method: A slide groove (27) is formed between opposed surfaces of an operation component case (11) and a display component case (12) coupled to each other so as to be slidable relative to each other. The slide groove (27) extends in single-layer space parallel to the opposed surfaces and is capable... Agent:12/15/2011 > 27 patent applications in 18 patent subcategories. patent applications/inventions, industry category
20110303433 - Gfi and switch plate utility hanger for keys, blow dryer and curling irons: A balanced coverplate for an electrical or communication junction box including an upper portion and a substantially aligned lower portion for storage of items on holding means such as hooks, pegs or magnets. The upper portion of the coverplate may conveniently supplant a standard wall outlet/receptacle cover plate or switch... Agent:
20110303434 - Wireway for conveyor: The present invention is a wireway for a conveyor system which is integrally molded into the sideguard of the conveyor system. The sidewall, or sideguard, has both an inner wall and an outer wall, and there is an intermediate wall connected to both the inner wall and outer wall. The... Agent: Glidepath
20110303459 - Battery connecting tabs: The invention relates to a battery connecting tabs for electrically connecting a plurality of batteries. The battery connecting tabs include a first layer and a second layer adhered to the first layer. The second layer is physically and electrically connected to the first layer, and the second layer has a... Agent:
20110303435 - Aluminum alloy conductor cable and method for manufacturing the same: Optimum compositional elements and contents (wt %) of an aluminum alloy conductor cable are newly established to enhance rigidity against vibration and electrical conductivity of the aluminum alloy conductor cable. Further, a process for the aluminum alloy conductor cable is presented to provide an aluminum alloy conductor cable having satisfactory... Agent: Ls Cable Ltd.
20110303436 - Electric fence converter: A device for converting a standard fence into an electric fence is disclosed. The electric fence converter has a top end which partly covers an existing fence post, already secured into the ground. The bottom end and mid section of the electric fence converter have a cut-out portion exposing a... Agent:
20110303437 - Heat-radiating substrate and method of manufacturing the same: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed... Agent: Samsung Electro-mechanics Co., Ltd.
20110303439 - Adhesive resin compositions, and laminates and flexible printed wiring boards using same: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame... Agent:
20110303441 - Board reinforcing structure, board assembly, and electronic device: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to... Agent: Fujitsu Limited
20110303440 - Hybrid heat-radiating substrate and method of manufacturing the same: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating... Agent: Samsung Electro-mechanics Co., Ltd.
20110303442 - Substrate strip with wiring and method of manufacturing the same: A substrate strip with wiring is provided. The substrate strip includes a plurality of wiring blocks, a carrying substrate, and an adhesive layer. Each of the wiring blocks includes at least one wiring board unit, and each of the wiring board unit includes an insulating layer and a wiring layer... Agent: Unimicron Technology Corp.
20110303444 - Laminated circuit board, bonding sheet, laminated-circuit-board producing method, and bonding -sheet producing method: A laminated circuit board includes a first wiring board including a first land formed thereon; a second wiring board including a second land formed thereon; and a bonding layer interposed between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land to... Agent: Fujitsu Limited
20110303443 - Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unit: A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving... Agent: Fujitsu Limited
20110303446 - Epoxy resin composition, and prepreg and printed circuit board using the same: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.... Agent:
20110303445 - Printed circuit board with reduced dielectric loss: A printed circuit board (‘PCB’) with reduced dielectric loss, including conductive traces disposed upon layers of dielectric material, the layers of dielectric material including core layers and prepreg layers, one or more of the layers of dielectric material including pockets of air that reduce an overall relative dielectric constant of... Agent: International Business Machines Corporation
20110303447 - Low profile tape structures: Electronic devices may include electronic device structures such substrates, structures with cavities, and housing structures. Tape may be used to seal components to the surface of a substrate or within a cavity. The tape may have a nonstick polymer layer such as a layer of parylene and one or two... Agent:
20110303448 - Pb-free sn-ag-cu-al or sn-cu-al solder: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.... Agent: Iowa State University Research Foundation, Inc.
20110303450 - Mounting structure, electronic component, circuit board, board assembly, electronic device, and stress relaxation member: Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to... Agent: Fujitsu Limited
20110303451 - Multilayer printed wiring board: A multilayer printed wiring board including a core substrate, a first conductor layer on a first surface of the substrate, a second conductor layer on a second surface of the substrate, a third conductor layer inside the substrate between the first and second conductor layers, a conductive post connecting the... Agent: Ibiden Co., Ltd.
20110303449 - Packaging structure, printed circuit board assembly and fixing method: A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of... Agent: Fujitsu Limited
20110303452 - Electromagnetic bandgap structure and printed circuit board: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal... Agent: Samsung Electro-mechanics Co., Ltd.
20110303453 - Laminated circuit board and board producing method: A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is laid between the first wiring board and the second wiring board and... Agent: Fujitsu Limited
20110303454 - Laminated circuit board and board producing method: A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board... Agent: Fujitsu Limited
20110303455 - Antenna universal mount joint connectors: An antenna mount assembly is disclosed. The antenna mount assembly includes an output contact and an antenna mount body. The antenna mount body includes an output portion, a shielding compartment for housing and electromagnetically shielding a connection between a coaxial cable and the output contact, and an access port to... Agent: Laird Technologies, Inc.
20110303456 - Modular conduit retention system: A conduit retention system comprises a base and a plurality of polygonal elements which can snap-fit together.... Agent: Airbus Operations Limited
20110303457 - Electronic device, resonator, oscillator and method for manufacturing electronic device: An electronic device includes a substrate, a functional structural body formed on the substrate and a covering structure for defining a cavity part having the functional structural body disposed therein, wherein the covering structure is provided with a side wall provided on the substrate and comprising an interlayer insulating layer... Agent: Seiko Epson Corporation
20110303458 - Coating of non-solderable base metal for soldering application in medical device component: Terminal pins comprising a core of a first electrically conductive material selectively coated with a layer of a second electrically conductive material for incorporated into feedthrough filter capacitor assemblies are described. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter... Agent: Greatbatch Ltd.12/08/2011 > 30 patent applications in 23 patent subcategories. patent applications/inventions, industry category
20110297414 - Electronic device enclosure: An electronic device enclosure includes an enclosure body, a bezel, a resilient locking clip, and an unlocking clip. An opening is defined in the enclosure body. The bezel assembly is mounted to the enclosure body and covers the opening. The resilient locking clip is attached to the enclosure body. A... Agent: Hong Fu Jin Precision Industry (shenzhen) Co. Ltd.
20110297413 - Enclosure of electronic device: An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with... Agent: Hon Hai Precision Industry Co., Ltd.
20110297415 - Wire harness: In a double-layered construction corrugated tube 23 of a wire harness 21 which are provided on an outer side of a high voltage cable 22, an outer corrugated tube 26 is formed without a slit. In addition, an inner corrugated tube 27 is formed so as to be inserted from... Agent: Yazaki Corporation
20110297416 - Connecting member: A connecting member includes an elastic element and a cable assembly. The cable assembly includes a flexible cable. The flexible cable is attached to the elastic element along an extension direction of the elastic element. The elastic element is elastically deformable between an original state and an extended state. In... Agent: Hon Hai Precision Industry Co., Ltd.
20110297440 - Cable assembly with protector, and accompanying method: An improved cable assembly includes at least a first elongated signal-carrying cable and a protector that comprises an elongated covering apparatus that is connected with the signal-carrying cable. The covering apparatus comprises a resilient portion having a number of corrugations. The signal-carrying cable is received within the covering apparatus, and... Agent:
20110297441 - Implosive joint and dead-end apparatus and method: A method of fusing cables and a dead end assembly and a cable are provided. A joint assembly for fusing cables and a dead end fusing assembly for fusing a cable and a forge assembly are provided. The method includes cutting back strands of a cable, exposing the core; inserting... Agent: Afl Telecommunications LLC.
20110297442 - Cable connecting device: A cable connecting device has a housing and an electrically conductive bypass element; a first electrical line, which has an internal current-carrying core and an insulating covering, is routable through the housing of the cable connecting device via the bypass element in that the line can be inserted into at... Agent:
20110297417 - Lead sheath: A lead sheath, including an upper jaw, and a lower jaw, the upper jaw and the lower jaw are buckled with each other. A wire outlet hole is formed at the outside of the connection between the upper jaw and the lower jaw. A wire inlet hole is formed at... Agent: Zhongshan Broad-ocean Motor Manufacturing Co., Ltd
20110297418 - Flexible cable with structurally enhanced conductors: In an electrical cable of the type having an outer sheath enclosing a conductor assembly comprising a plurality of insulated conductors disposed within a binder, the binder having a crush resistance for protecting the insulated conductors, an improvement in which a strength enhancer is mixed within the conductor insulation such... Agent:
20110297419 - Electrode for electricity storage device and manufacturing the same: An electrode for an electricity storage device (10) of the present invention includes a porous layer (1) having either fibers or whiskers (1a) containing tungsten oxide. A valence band photoelectron spectrum of the fibers or whiskers (1a) obtained by an X-ray photoelectron spectroscopic analysis has a peak within 1 eV... Agent: Nissan Motor Co., Ltd.
20110297420 - High performance redox capacitors using materials possessing non-stoichiometry and defect chemical equilibrium: A pseudocapacitor employs plates having an active material of a nanoparticles sized ceramic mixed ionic-electronic conductor such as may have the nominal formula of ABO3, A2BO4, AB2O4, and AO2, where A and B are metals. The active material may be prepared to promote sublattice vacancies to provide for the storage... Agent:
20110297421 - Cassu-guard: The Cassu-guard is electrical safety apparatus that is created to prevent electrical shortage, shock & movement of broken wires and eliminate the use of electrical tape in insulating socket outlets and light switches when installing these devices in metallic boxes.... Agent:
20110297422 - Circuit board and apparatus for processing defect in circuit board: Provided are a circuit board and an apparatus for processing a defect in a circuit board. The circuit board includes at least one non-defective cell including a non-defective circuit pattern, at least one defective cell including a defective circuit pattern, and a short line printed on the circuit pattern of... Agent: Samsung Electro-mechanics Co., Ltd.
20110297423 - Printed circuit board and method of manufacturing the same: Disclosed is a printed circuit board, including a base substrate, a first bump including a first metal layer formed on the base substrate and a second metal layer formed on the first metal layer, and a second bump including a third metal layer formed on the base substrate, in which... Agent: Samsung Electro-mechanics Co., Ltd.
20110297424 - Wiring board, electronic device package, and methods of production of the same: A wiring board which uses both conductor patterns and reflection members provided at gaps therebetween to suppress unevenness in the reflection rate so as to raise the overall reflection rate and provide a reflection function on the surface of the wiring board at the side where an electronic device is... Agent:
20110297425 - Wiring substrate and manufacturing method thereof: A wiring substrate includes a plurality of insulating layers; and a plurality of wiring layers being alternately laminated, wherein an opening portion is formed in an outermost insulating layer to expose a part of the outermost wiring layer to an outside, a cross-sectional shape of a sidewall of the opening... Agent: Shinko Electric Industries Co., Ltd.
20110297426 - Wiring substrate and manufacturing method thereof: A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an... Agent: Shinko Electric Industries Co., Ltd.
20110297427 - Printed circuit board and a method of manufacturing the same: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a metal layer divided into a plurality of regions; a build-up layer formed on at least one surface of the metal layer; and a penetrating part penetrating through the metal layer... Agent: Samsung Electro-mechanics Co., Ltd.
20110297428 - Flexible flat cable: The present invention provides a flexible flat cable which utilizes a first metal plate disposed on the lower surface of at least one end of a first metal shielding layer to achieve the functions of grounding and a reinforcement plate. Besides, since a metal connecting part can be plugged directly... Agent:
20110297429 - Sliding contact assembly: A sliding contact assembly includes a printed circuit board having a substrate on which is arranged at least one contact pad. The at least one contact pad is made of several layers including a thin external layer essentially made of gold. The gold layer is deposited on the at least... Agent:
20110297430 - Wiring substrate and manufacturing method thereof: A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an... Agent: Shinko Electric Industriesco., Ltd.
20110297431 - Connection structure: A connection structure includes a circuit board and a terminal. The circuit board includes an insulation base member containing thermoplastic resin, and a wiring portion arranged in the insulation base member. The wiring portion has a conductor pattern and an interlayer connector electrically connected to the conductor pattern. The terminal... Agent: Denso Corporation
20110297432 - Printed circuit board: A printed circuit board includes signal layers, ground layers, and a power layer, which are superposed. A closed trace is set along edges of each of the signal layers and the power layers. A number of vias are defined in each trace at intervals. Each via extends through the signal... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd
20110297433 - Solder bump formation on a circuit board using a transfer sheet: A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing... Agent: Senju Metal Industry Co., Ltd.
20110297434 - Vacuum hermetic organic packaging carrier: A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first... Agent: Industrial Technology Research Institute
20110297435 - Enclosure of electronic device: An enclosure includes a ventilation plate. The ventilation plate defines a number of through holes. Two hollow bulges extend from an edge bounding each of the through holes at two opposite sides of the plate. A top of each of the bulges defines an opening. The openings of the two... Agent: Hon Hai Precision Industry Co., Ltd.
20110297436 - Net-like metal fine particle multilayer film and method for producing same: A network-like fine metal particle multilayer film has a network-like fine metal particle layer at least on one surface of a film substrate, which has an average total light transmittance of 70% or more, a total light transmittance variation of 5% or less, and a length of 2 m or... Agent: Toray Industries, Inc.
20110297437 - Electronic component device and connector assembly having same: An electronic component device for electrically and mechanically connecting to a lead wire includes a base and a cover. The base includes a receiving body, at least one electronic component, and two spaced stripping connectors. The receiving body defining an installation groove. The at least one electronic component and the... Agent: Fukui Precision Component (shenzhen) Co., Ltd.
20110297438 - Enclosure of electronic device: An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes.... Agent: Hon Hai Precision Industry Co., Ltd.
20110297439 - Full perimeter laser beam button weld of dissimilar materials: Terminal pins comprising a refractory metal forming a full perimeter weld connected to a terminal block comprising a dissimilar metal incorporated into feedthrough filter capacitor assemblies are discussed. The feedthrough filter capacitor assemblies are particularly useful for incorporation into implantable medical devices such as cardiac pacemakers, cardioverter defibrillators, and the... Agent: Greatbatch Ltd.12/01/2011 > 41 patent applications in 30 patent subcategories. patent applications/inventions, industry category
20110290518 - Electrical junction box: An electrical junction box adapted for mounting on a drywall without attachment to a stud. The junction box carries four tabs that pivotally move between a retracted position inside the junction box and an extended position extending through respective slots formed in the junction body sidewalls. The tabs are turned... Agent:
20110290519 - Electronic device enclosure: An electronic device enclosure includes an enclosure body, a bezel and a connecting assembly. The enclosure body includes a front panel. The front panel includes metal. The bezel includes bamboo and covers the front panel. The connecting assembly includes a fastener and a retaining clip engaged with the fastener. The... Agent: Hon Hai Precision Industry Co., Ltd.
20110290520 - Sealing structure for wire lead-out hole: A sealing structure for wire lead-out hole is provided with a wire lead-out hole (11) formed in a case (10), a resilient seal (20) to be mounted into the wire lead-out hole (11), and a bracket (40) for retaining the resilient seal (20) in the wire lead-out hole (11) by... Agent: Sumitomo Wiring Systems, Ltd.
20110290521 - Universal cable adapter: According to the invention, a system for interconnecting communication cables is disclosed. The system may include an input cable, an output cable, and a cable adapter. The input cable may include a plurality of input wires, each of the plurality of input wires communicatively connected to an input port. The... Agent: Qwest Communications International Inc.
20110290523 - Raceway for instrumentation lines: A kit for forming a raceway assembly including a plurality of members can include a plurality of portions including channel portions and coupling portions, each of the portions extending in an axial direction and having a plurality of walls defining a generally U-shaped cross-section. Each channel portion may have at... Agent: Technical Specialties, Inc.
20110290522 - Sliding device: A sliding device 1 for routing an electric wire 5 between a vehicle floor and a seat includes: a rail 9 having a supporting rail 7 to which a supporting body 11 of the seat is attached, and a receiving part 8 extended along the supporting rail 7; a corrugate... Agent:
20110290555 - Cable harness: A cable harness has a cable main body including a wire group made of a plurality of electric wires and a braid sleeve collectively covering an outer periphery of the wire group, and connecting terminals connected to both ends of the cable main body. The braid sleeve is formed by... Agent: Hitachi Cable Fine-tech, Ltd.
20110290556 - Electric cable shield structure: A metal sheet tape including magnesium as a major component thereof having high electro-magnetic shield performance, high vibration absorption performance as well as high heat conductivity being wound spirally on an outer circumference of the electric cable may provide a high performance shield layer. Furthermore in an AV cable, original... Agent:
20110290557 - Wire harness installation structure: A purpose of the invention is to improve a bending durability of a slip-like plate spring arranged along a wire harness by preventing the slip-like plate spring from being corroded, and to provide a wire harness installation structure in which a conductor in electric wires is not liable to be... Agent: Yazaki Corporation
20110290558 - Hinged busway: A busway section with an electrically conductive housing is described. The busway section includes a lid connected with the housing through a hinging mechanism. Internal slots are also present, along which bus bars can be located. Possible applications of the busway section are feeder sections and plug-in sections.... Agent:
20110290524 - Cable for high speed data communications: A cable for high speed data communications that includes a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer, the inner conductors and the dielectric layers disposed within the cable in parallel with a longitudinal axis of the cable;... Agent: International Business Machines Corporation
20110290525 - Fluorine-containing elastomer covered electric wire, and method for making same: A fluorine-containing elastomer covered electric wire includes a conductor, and a covering layer on a periphery of the conductor. The covering layer includes a composition including 100 parts by weight of a tetrafluoroethylene-propylene system copolymer and 0.1 to 10 parts by weight of a fatty acid amide.... Agent: Hitachi Cable, Ltd.
20110290526 - Flat cable and method for fabricating the same: A flat cable has a plurality of electric wires disposed in parallel, and a fiber member woven to thread through each of the electric wires along a juxtapositional direction of the electric wires. The fiber member is made of a fiber having an elastic recovery rate after elongation of 80%... Agent: Hitachi Cable Fine-tech, Ltd.
20110290527 - Halogen-free flame retardant polyolefin: The present invention relates to halogen-free compositions containing an additive of bohmite, nanoclay, microcrystalline talc, zinc hydroxystannate, and a polyolefin oil. The composition is useful as a covering material (e.g. insulation or jacket) for electrical cables with excellent flame resistance and mechanical properties, such as cold bend and thermomechanical properties.... Agent: General Cable Technologies Corporation
20110290528 - Insulating varnish and insulated wire formed by using the same: An insulating varnish includes a polyamide-imide resin varnish including a solvent and a polyamide-imide resin, and an organosol. The polyamide-imide resin varnish is obtained by a synthesis reaction between a resin component (X) and an isocyanate component (Y). The resin component (X) is obtained by a synthesis reaction between a... Agent: Hitachi Cable, Ltd.
20110290529 - Cable and polymer composition comprising a multimodal ethylene copolymer: The present invention relates to a cable comprising a conductor surrounded by one or more layers, wherein at least one layer comprises a polymer composition comprising a multimodal copolymer of ethylene with one or more comonomers, to a process for producing the cable and to a polymer composition suitable as... Agent: Borealis Ag
20110290530 - Ribbon for photovoltaic module: A ribbon for a photovoltaic module includes a plurality of first interconnection ribbons connected to one solar battery cell, a plurality of second interconnection ribbons connected to another solar battery cell, and a bus ribbon through which the first and second interconnection ribbons are connected. In the ribbon, the bus... Agent: Lsis Co., Ltd.
20110290531 - Wire electrode for electrical discharge cutting: The invention relates to a wire electrode (1, 1′) for electric discharge cutting processes and a method for the production thereof. The wire electrode (1, 1′) has a core (2) containing a metal or a metal alloy, and a coating (3, 4; 3, 4, 5) that surrounds the core (2)... Agent: Berkenhoff Gmbh
20110290532 - Headphone cord sleeve: A headphone cord sleeve includes: a flexible tubular sleeve including an opening at each of a first end and a second end; a reinforced section of the tubular sleeve adjacent the first end reducing the flexibility of the tubular sleeve over the length of the reinforced section; and a loop... Agent:
20110290533 - Insulator: An insulator including an upper electrode and a lower electrode with an upper barrier and a lower barrier disposed outside respectively. The barriers can prevent moving charge from moving from one area to another and modify the electric field distribution within a concentrated area. Meanwhile, they also help to largely... Agent:
20110290534 - Printed circuit board: A printed circuit board includes a mounting area. The mounting area includes a first mounting portion and a second mounting portion. The first and second mounting portions partially overlap. The first mounting portion includes a number of first holes, a number of second holes, and a third hole. The first... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd
20110290535 - Wiring substrate and method for manufacturing wiring substrate: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and... Agent: Yazaki Corporation
20110290537 - Multilayer circuit substrate: A multilayer circuit substrate includes a substrate body in turn including a plurality of conductor layers and a plurality of insulating layers that are laminated alternately. The plurality of conductor layers include an uppermost conductor layer that includes a plurality of conductor patterns and a lowermost conductor layer that includes... Agent: Jtekt Corporation
20110290536 - Wiring substrate: A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue.... Agent: Shinko Electric Industries Co., Ltd.
20110290538 - Connecting structure and adhesion method of pcb using anisotropic conductive film, and method for evaluating connecting condition using the same: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of... Agent: Lg Innotek Co. Ltd.
20110290540 - Embedded printed circuit board and method of manufacturing the same: Disclosed herein are an embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer, wherein the insulating layer is... Agent: Samsung Electro-mechanics Co., Ltd.
20110290539 - Pressure sensor: A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support... Agent:
20110290542 - Ceramic electronic component and method for manufacturing the same: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu... Agent: Murata Manufacturing Co., Ltd.
20110290541 - Flexible flat cable: A flexible flat cable includes a first insulating layer, a conductive wire layer, a second insulating layer, a metal layer and at least one grounding element. The conductive wire layer includes a plurality metal wires arranged with interspace and disposed on the first insulating layer, wherein the plurality of metal... Agent:
20110290543 - Method for producing wiring board and wiring board: The present invention provides a wiring board giving good heat dissipation over a long period of use. The present invention also provides a method for producing board, including coating a surface of a metal substrate, which is made of an aluminium plate, with a composition containing a substance having a... Agent: Ain Co., Ltd.
20110290544 - Printed wiring board and manufacturing method of printed wiring board: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the... Agent: Ibiden Co., Ltd.
20110290545 - Through wiring board and method of manufacturing the same: A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension wiring provided in the through hole and extending on one side of the through wiring board up to a position... Agent: Fujikura Ltd.
20110290546 - Printed circuit board having electronic component and method for manufacturing thereof: Disclosed herein are a printed circuit board having an electronic component and a manufacturing method thereof. The printed circuit board having an electronic component may include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the electrode... Agent: Samsung Electro-mechanics Co., Ltd.
20110290547 - Electrode structure of multiple dielectric island layer and manufacturing method thereof: An electrode structure of multiple dielectric island layer and manufacturing method thereof are described. The electrode structure includes a substrate, an electrode bridge structure, a dielectric layer and a conducting pattern. The dielectric layer is formed on the substrate and the electrode bridge structure and has a plurality of dielectric... Agent: Chimei Innolux Corporation
20110290548 - Method for manufacturing insulated conductive pattern and laminate: The present invention provides: a method for manufacturing an insulated conductive pattern, wherein a conductive film and an insulation layer pattern are formed on a substrate, and the insulation layer pattern is reformed to cover a conductive pattern after formation of the conductive pattern by etching the conductive film using... Agent: Lg Chem, Ltd.
20110290549 - Wiring board, wiring board manufacturing method, and via paste: A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin,... Agent:
20110290550 - Electrical snap-in connector: By providing an electrical connector which comprises a single component capable of being inserted into the knockout hole of a housing of any electrical junction box, outlet box, meter box, or similar enclosure from the interior of the housing and securely affixed thereto, an efficient, easily manufactured and installed electrical... Agent:
20110290551 - Protective structure enclosing device on flexible substrate: A structure for protecting a device includes a first layer, one or more first microstructures on the first layer, and a second layer disposed on the first layer. The second layer is disposed on a surface of the first layer on which one or more microstructures are provided. The microstructure... Agent: Synos Technology, Inc.
20110290552 - Method and system for packaging mems devices with incorporated getter: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an... Agent: Qualcomm Mems Technologies, Inc.
20110290554 - Apparatus for adjusting environmental conditions for an electrical component: An apparatus for adjusting substantially constant environmental conditions for an electrical component, which conducts and/or stores current. The electrical component is surrounded by a housing, which has an opening to obtain a connection to the external environment of the housing. The housing has means, which protect the electrical component substantially... Agent: Schaeffler Technologies Gmbh & Co. Kg
20110290553 - Magnetic filler panel for use in airflow control system in electronic equipment enclosure: An electronic equipment enclosure system with an airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a magnetic filler panel.... Agent:Previous industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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