|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators June invention type 06/11Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 06/30/2011 > 53 patent applications in 33 patent subcategories. invention type
20110155408 - Connecting member: A connecting member includes a cable, an enclosure, a shaft assembly member and an elastic member. The cable surrounds the shaft assembly member. The shaft assembly member is rotatablely mounted in the enclosure. The elastic member includes a first end and a second end. The first end is secured to... Agent: Hon Hai Precision Industry Co., Ltd.
20110155409 - Electronic device housing: An electronic device housing is provided. The electronic device housing includes a substrate, a metallic-appearing coating formed on the substrate, and a top coating formed on the metallic-appearing coating. The top coating contains nano-titanium dioxide powder and fluorocarbon resin. The electronic device housing has self-cleaning and anti-fingerprint properties.... Agent: Fih (hong Kong) Limited
20110155410 - Waterproof case for electronic device: A waterproof case for an electronic device includes a case portion configured to house an electronic device including a touch panel display, and an operation mechanism provided to the case portion and configured to operate the touch panel display of the electronic device, which is housed in the case portion,... Agent: Sony Corporation
20110155411 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a casing, an attachment portion, a first projecting portion, a second projecting portion and a conductive member. The casing has an outer wall, an inner surface of which is provided with a first conductive layer. The attachment portion is provided on the... Agent: Kabushiki Kaisha Toshiba
20110155412 - Electrical interface assembly: An electrical interface assembly configured to be supported within a wall of a mobile structure. The electrical interface assembly includes a frame having spaced apart inner and outer supports. Panels including electrical connectors are removably supported by the inner and outer supports.... Agent:
20110155413 - Electrical outlet cover plate: The present disclosure describes a plate assembly for an electrical outlet. In some embodiments, the plate assembly includes a strapping plate that is attachable to the electrical outlet, and a cover plate sub-assembly that is selectively attachable to the strapping plate. In some embodiments, the cover plate sub-assembly includes a... Agent: 360 Electrical, LLC
20110155414 - Actuator control device, and method of manufacturing circuit device in actuator control device: An actuator control device includes a circuit device that is resin-molded by a plurality of metal molds including at least one movable metal mold to include a first bus bar and a second bus bar. The first bus bar and the second bus bar each include a flat plate-like portion... Agent: Hitachi Automotive Systems, Ltd.
20110155458 - Vehicle electrical conduction path: A vehicle electrical conduction path includes plural power cables, a braided shield which bundles and shields the plural power cables, a control cable, a metallic pipe which accommodates the control cable separately from the plural power cables, and a flexible resin tube which covers a periphery of the metallic pipe... Agent: Hitachi Cable, Ltd.
20110155459 - Connection system and method for subsea cables in severe environments: A technique facilitates the reliable connection of cables in subsea environments. A cablehead system is designed to reliably connect cables to subsea components while providing long term protection of the connection in potentially harsh, subsea environments. The cablehead system comprises a cable clamp housing which may be coupled to a... Agent: Schlumberger Technology Corporation
20110155460 - Substrate and substrate bonding device using the same: A substrate and a substrate bonding device using the same are provided. The substrate includes a base, upper and lower metal layers, and upper and lower covering layers. The base has an upper surface, a lower surface and a through-hole passing there through, wherein the upper and lower covering layers... Agent: Au Optronics Corp.
20110155415 - Longitudinal water barrier for electrical conductors: s
20110155416 - Tree resistant insulation compositions: Insulation compositions for electric power cables having a polyolefin base polymer and an additive comprising either low molecular weight wax or polyethylene glycol (PEG) and optionally further comprising one or more hindered amine light stabilizers, amine antioxidants and other antioxidant blends are disclosed. Also disclosed are insulation compositions comprising a... Agent: General Cable Technologies Corporation
20110155417 - Conducting wire structure and method of manufacturing a conducting wire core: A conducting wire structure and a method of manufacturing a conducting wire core, the conducting wire comprises at least one core and an insulation skin encasing the core. The core is formed by stacking a plurality of flattened conductors with flattened cross sections interposed by an insulation layer. The insulation... Agent:
20110155418 - Mitigation of whiskers in sn-films: An electronic device includes a metallic conducting lead having a surface. A pre-solder coating over the surface consists essentially of tin and one or more dopants selected from Al or a rare earth element.... Agent: Agere Systems Inc.
20110155419 - Enhanced data cable with cross-twist cabled core profile: A cable exhibiting reduced crosstalk between transmission media includes a core having a profile with a shape which defines spaces or channels to maintain a spacing between transmission media in a finished cable. The core is formed of a conductive material to further reduce crosstalk. A method of producing a... Agent: Cable Design Technologies Inc. Dba Mohawk/cdt
20110155420 - Arrangement for cable guiding and a wind turbine using such arrangement: The present invention relates to an arrangement (1) for cable guiding, comprising a first guide member (40) adapted to enclose a first cable (10) along at least a part of the length of said first cable. The first guide member (40) has an outside surface adapted to form at least... Agent: Vestas Wind Systems A/s
20110155423 - Circuit board, image forming apparatus, thermal head, and image sensor: The invention relates to a circuit board, and an image forming apparatus, a thermal head and an image sensor that employ the circuit board. A circuit board includes a substrate, a conductor which is situated on the substrate and has a groove formed on its surface, and a wire connected... Agent: Kyocera Corporation
20110155424 - Producing electrical circuit patterns using multi-population transformation: A method for producing an electrical circuit includes providing a substrate having a first pattern of features and defining a second pattern comprising a net of interconnected circuit elements. Different respective transformation rules are specified for different ones of the circuit elements. The second pattern is modified by applying the... Agent: Orbotech Ltd.
20110155422 - Wire insulating terminal and circuit board module employing same: There is disclosed a wire insulating terminal which includes a wire insulating terminal member having an inner insulating wall and an outer insulating wall, and at least one conducting wire having a bared wire end. The inner insulating wall forms a perforation channel with a first opening and a second... Agent: Delta Electronics, Inc.
20110155421 - Wired circuit board assembly sheet: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating... Agent: Nitto Denko Corporation
20110155425 - Underfill film having thermally conductive sheet: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the... Agent:
20110155426 - Embedded circuit board and manufacturing method thereof: An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with... Agent: Samsung Electronics Co., Ltd.
20110155430 - Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same: An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.... Agent:
20110155429 - Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof: Disclosed are a carrier substrate including an insulating base material with a copper foil layer formed on at least one surface thereof, a metal layer formed on the cooper layer and having a length shorter than that of the copper foil layer, and an insulating layer formed on the metal... Agent: Samsung Electro-mechanics Co., Ltd.
20110155428 - Circuit board and manufacturing method thereof: A circuit board includes a circuit substrate, a dielectric layer, and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via extending from the second surface to... Agent: Unimicron Technology Corp.
20110155427 - Circuit substrate and manufacturing method thereof: A manufacturing method of a circuit substrate includes the following steps. A dielectric layer is formed on at least one surface of a substrate. An insulating layer is formed on the dielectric layer. A portion of the insulating layer and a portion of the dielectric layer are removed, so as... Agent: Unimicron Technology Corp.
20110155432 - Metallic copper dispersion, process for producing the metallic copper dispersion, electrode, wiring pattern, and coating film formed using the metallic copper dispersion, decorative article and antimicrobial article with the coating film formed thereon, a: Disclosed is a dispersion comprising at least metallic copper particles with gelatin provided on the surface thereof, a polymeric dispersant, and an organic solvent. The dispersion is produced by reducing copper oxide in an aqueous solvent in the presence of gelatin having an amine number and an acid number such... Agent:
20110155431 - Mixed-metal system conductors for ltcc (low-temperature co-fired ceramic): A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt %... Agent: E.i. Du Pont De Nemours And Company
20110155433 - Wiring board capable of containing functional element and method for manufacturing same: A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating resin layer, wherein the boundary surface between the metal via and the insulating resin layer has a concavo-convex... Agent:
20110155434 - Bga footprint pattern for increasing number of routing channels per pcb layer: A printed circuit board (PCB) includes a ball grid array (BGA). The PCB further includes a first BGA pad having a circular shape, and a first via having a circular shape, where the circular shape of the first via overlaps a portion of the circular shape of the first BGA... Agent: Juniper Networks Inc.
20110155436 - Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same: A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other... Agent: Harvatek Corporation
20110155435 - Method to form lateral pad on edge of wafer: Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount devices to be bonded vertically (i.e. on their side) using standard semiconductor assembly processes.... Agent:
20110155438 - Multilayer wiring substrate: A multilayer wiring substrate has a multilayer wiring laminate portion in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately. A plurality of first-main-surface-side connection terminals are disposed on one side of the laminate structure... Agent: Ngk Spark Plug Co., Ltd.
20110155437 - Printed circuit board: A printed circuit board includes a signal trace, capable of transmitting signal, and a pad. The pad is electronically connected to the signal trace. The pad is placed on an external surface of the printed circuit board. The pad includes a body and an extending portion extending from the body.... Agent: Hon Hai Precision Industry Co., Ltd.
20110155439 - Multilayer wiring substrate and method of manufacturing the same: The multilayer wiring substrate includes: a first insulating layer comprising a first surface and a second surface opposite to the first surface; a second insulating layer on the first surface of the first insulating layer; a first wiring pattern on the second surface of the first insulating layer; a second... Agent: Shinko Electric Industries Co., Ltd.
20110155441 - Circuit board and process for fabricating the same: A process for fabricating a circuit board is provided. A circuit substrate having a first surface and a first circuit layer is provided. A first dielectric layer having a second surface is formed on the circuit substrate and covers the first surface and the first circuit layer. An antagonistic activation... Agent: Unimicron Technology Corp.
20110155440 - Circuit board and process for manufacturing the same: A circuit board including a circuit substrate, a dielectric layer, a first conductive layer and a second conductive layer is provided. The circuit substrate has a first surface and a first circuit layer. The dielectric layer is disposed on the circuit substrate and covers the first surface and the first... Agent: Unimicron Technology Corp.
20110155442 - Multilayer wiring board: A multilayer wiring board has a structure in which vias are formed on an inner wiring layer in directions toward both surfaces of the inner wiring layer, respectively, and lands are each defined in the inner wiring layer at a position to be connected to one of the vias, each... Agent: Shinko Electric Industries Co., Ltd.
20110155443 - Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are... Agent: Ngk Spark Plug Co., Ltd.
20110155444 - Electroless method for in-line metallization of substrates by spraying them, with prior surface treatment and device for implementing the method: A method of metallizing the surface of a substrate electrolessly, by spraying one or more oxidation-reduction solutions thereonto. The steps of this method include: a) physical or chemical treatment to reduce the surface tension of the substrate before metallization; b) electroless metallization of the surface of the substrate treated in... Agent:
20110155445 - Shield can of mobile terminal: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield... Agent: Samsung Electronics Co. Ltd.
20110155447 - Cover detaching and attaching structure and electronic device using the same: According to one embodiment, a cover detaching and attaching structure may allow a cover including a through part, through which a power cord connected to a connection part passes, to be integrally engaged with a main body including the connection part for the power cord and to be arbitrarily removed... Agent: Toshiba Tec Kabushiki Kaisha
20110155448 - Electronic device: According to one embodiment, an electronic device includes a housing, an outer wall, a rib, a cable, and a stopper. The housing houses at least part of an electronic component. The outer wall constitutes at least part of an outer contour of the housing. The rib is located between the... Agent: Kabushiki Kaisha Toshiba
20110155450 - Printed circuit board and electronic apparatus: According to one embodiment, a printed circuit board is provided. The printed circuit board includes a wiring board, an insertion mount device having lead terminals, and a flexible insulator. The wiring board has a first surface, a second surface on a side opposite the first surface, and through holes. The... Agent:
20110155446 - Protective members for an electrical interface assembly: A signal interface includes a support structure having a pivotally supported cover and side wings. A latching mechanism is provided to secure the cover to the side wings in both stowed and deployed positions.... Agent:
20110155449 - Securing mechanism and electronic device enclosure using the same: A securing mechanism for a component in an electronic device enclosure includes a bracket, a restriction member, and a resilient member. The bracket defines three guide slits on each side along which protrusions of the component slide. The restriction member forms two slide-rails oblique to the guide slits and two... Agent: Hon Hai Precision Industry Co., Ltd.
20110155452 - Device housing and method for making same: A device housing for an electronic device is provided. The device housing includes a substrate and assembling members protruding from the substrate. The substrate includes a fiber member, a metal member embedded within the fiber member, and a transparent resin layer formed on the fiber member. The fiber member defines... Agent: Fih (hong Kong) Limited
20110155451 - Electronic device: According to one embodiment, an electronic device includes a cable, a protrusion, and a recessed portion. The cable is routed along a surface of a wall in a housing. The protrusion protrudes on the surface of the wall, and includes a first protrusion and a second protrusion that elastically hold... Agent: Kabushiki Kaisha Toshiba
20110155453 - Electronic apparatus: A video camera according to an embodiment of this invention includes a chassis that is fixed within a casing, a CMOS image sensor that is installed in the chassis, and a heat releasing member that releases heat generated from the CMOS image sensor to outside the casing. The heat releasing... Agent: Sanyo Electric Co., Ltd.
20110155454 - Network communication component: A network communication component includes a case, a plurality of channels and at least one shielding. The channels are formed in the case. The shielding is disposed between two adjacent channels. Through the shielding between the channels, mutual interferences between the channels are avoided to enhance the signal communication quality.... Agent:
20110155455 - Two-way wiring device: The configurations of a two way wiring device are provided in the present invention. The proposed .device includes a case having a first side, a second side opposite to the first side, a third side formed between the first side and the second side and an open bottom passing therethrough... Agent: Delta Electronics, Inc.
20110155456 - Junction box for solar panel: A junction box for use in establishing electric connection between an electric cable and output terminals of a solar panel is provided. The junction box includes an elongate plastic housing and a metal frame. The elongate plastic housing is disposed along and sandwiches an edge of the solar panel, from... Agent: Du Pont Apollo Limited
20110155457 - Terminal supporting device: The present invention has an object of providing a terminal supporting device which can perform a fixing operation of a cable terminal quickly and easily with a simple configuration. The terminal supporting device of the invention comprises a main body 10, a socket 20, a biasing member 30, a stopper... Agent: Hi-lex Corporation06/23/2011 > 49 patent applications in 29 patent subcategories. invention type
20110147033 - Communication cable comprising electrically discontinuous shield having nonmetallic appearance: A tape can comprise a dielectric film that has a pattern of electrically conductive areas adhering thereto. The conductive areas can be electrically isolated from one another. The tape can utilize means to obscure the metallic finish and can contain indicators to deter installers from grounding the tape at either... Agent: Superior Essex Communications Lp
20110147034 - Locking device and electronic enclosure using the same: An electronic enclosure includes a base, a cover mounted on the base, a first locking module engaged on the cover, a second locking module, and a locking structure. The base defines a number of supporting recesses defined therein. The cover includes a number of barbs for matching with the supporting... Agent: Hon Hai Precision Industry Co., Ltd.
20110147035 - Old construction box: An old construction box that is combined with an adapter clip to securely anchor the construction box with an opening provided in a finished wall surface.... Agent:
20110147036 - Concealable connector and electronic device having the concealable connector: A concealable connector disposed in a housing of an electronic device includes two upright sidewalls, a guiding groove, a guiding rod, and a sliding module. The upright sidewalls are spaced apart from each other and are disposed in the housing. The guiding groove is formed in the housing and is... Agent:
20110147037 - Interchangeable decorative bezel for wiring device: A wiring device capable of changing an aesthetic feature via a removable frame. The wiring device includes a front facing perimeter base having at least one opening. The wiring device also includes a removable bezel having a front face and a back face, the back face of the removable bezel... Agent: Leviton Manufacturing Co., Inc.
20110147078 - Wire harness installation structure: There is provided a wire harness structure which prevents an extraordinary displacement of a wire harness, and immediately discharges water from the wire harness when the water such as rain water splashes on the wire harness so that the freezing of the residing water and undesirable cutting of wires due... Agent: Yazaki Corporation
20110147079 - Tension-resistant electrical conductor: A tension-resistant electrical conductor includes a central core wire and at least a first inner wire layer and a second outer wire layer arranged over the central core wire. The central core wire is made of copper or a copper alloy. The first inner wire layer includes, in the circumferential... Agent:
20110147081 - Cable gland: The present invention relates to a cable gland for an electronics housing (6) of an electric motor, comprising a cable adapter (1) and a screw-on connecting stub (2), which can be screwed to a housing, for attachment of a cable connection. Fixing means (3, 2.8) which are arranged on the... Agent:
20110147080 - Joined dissimilar materials: A wire includes a first wire segment having an end portion and a second wire segment having an end portion. A coupling segment is adjacent the end portions of the first and second wire segments. The coupling segment is configured with a plurality of indents penetrating into at least one... Agent: Heraeus Medical Components, LLC
20110147038 - Oxidation-resistant high temperature wires and methods for the making thereof: Embodiments of an oxidation-resistant high temperature wire are provided. In one embodiment, the oxidation-resistant high temperature wire includes an elongated core formed from a first material, an electrically conductive sheathing disposed around the elongated core and formed from a second material, and a high temperature dielectric coating formed around the... Agent: Honeywell International Inc.
20110147039 - Communication cable comprising electrically discontinuous shield having nonmetallic appearance: A tape can comprise a dielectric film that has a pattern of electrically conductive areas adhering thereto. The conductive areas can be electrically isolated from one another. The tape can utilize means to obscure the metallic finish and can contain indicators to deter installers from grounding the tape at either... Agent: Superior Essex Communications Lp
20110147040 - Electrically insulating coating and method of formation thereof: A method of fabricating a structure comprising the steps of: providing an electrical conductor; providing a layer of a flexible insulating material on the electrical conductor, the material comprising: a first organo-alkoxide 1RxSi(O1R′)4-x and a second organo-alkoxide 2RxSi(O2R′)4-x, where 1R is a non-hydrolysable organic moiety thermally stable to a temperature... Agent:
20110147041 - Medium voltage cable insulation: m
20110147042 - Electrical cable and insulating composition polyethylene based resistant to tracking: An insulating composition resistant to tracking for an electrical cable, wherein the insulating composition comprises a polymer matrix based on polyethylene or its copolymers, with a density of at least 0.94 g/cm3, and including no more than 0.25% by weight of silicone oil respect to the total weight of said... Agent: Conductores Monterrey, S.a. De C. V.
20110147043 - Self-healing insulation for magnet wire: A process for remediating the insulating properties of magnet wire insulation is described. Magnet wire, used in electric motors and other electrical devices, comprises an electrically-conductive core covered by a thin insulating layer. The insulating layer may be damaged or compromised during manufacture or service. A process for incorporating polymerizable... Agent: Gm Global Technology Operations, Inc.
20110147045 - Composite material, a structural element comprised of the composite material, an airplane wing spar and their methods of production: Disclosed is to a composite material, a structural element comprised of the composite material, an airplane wing spar and their methods of production. Some embodiments of the present invention include composite materials comprised of multiple layers of arrays of metallic bodies separated by layers of non-metallic material, wherein the orientation... Agent:
20110147048 - Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an... Agent:
20110147047 - Power umbilical: An umbilical for use, for example, in deep water applications includes a plurality of power cables and may include other elements bundled together and within a sheath. An end termination at each of the power cables or at a plurality of the power cables includes a resin ferrule around the... Agent:
20110147046 - Self expanding electrode cuff: An electrode lead assembly is described. The lead assembly includes an expandable cuff electrode that includes a series of spaced apart electrode elements and a substantially re-closable opening.... Agent: Medtronic, Inc.
20110147044 - System to improve coreless package connections and associated methods: A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some... Agent: International Business Machines Corporation
20110147049 - Modular polymeric insulator for installation along an overhead power distribution network: A modular polymeric insulator for overhead power distribution networks. The insulator includes a first insulating module adjacent to a supporting element; at least one further insulating module superimposed to the first insulating module and a non-metallic pin extending through the first insulating module and the at least one further insulating... Agent:
20110147050 - Printed wiring board and method for manufacturing printed wiring board: A printed wiring board (1) includes a substrate (11). A groove (111) extending in a direction perpendicular to the thickness direction of the substrate (11) is formed in the substrate (11), and a wiring (12) is provided to fill the groove (111).... Agent:
20110147051 - Capacitive switch sensors on decorative in-mold films background: This invention is related to process for the production of a interior trim piece, comprising the steps of: —providing a film layer—applying conductive ink/paint to the back surface of the film layer to provide a circuit path and—attaching a substrate on the back surface of the film layer. This invention... Agent: Johnson Controls Technology Company
20110147054 - Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate: A photosensitive conductive film 10 according to the invention includes a support film 1, a conductive layer 2 containing conductive fiber formed on the support film 1, and a photosensitive resin layer 3 formed on the conductive layer 2.... Agent:
20110147052 - Polyimide film: Disclosed is a polyimide film for insulating material prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a... Agent: Kolon Industries, Inc.
20110147053 - Printed wiring board: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated... Agent: Shin-etsu Polymer Co., Ltd.
20110147055 - Glass core substrate for integrated circuit devices and methods of making the same: Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may... Agent:
20110147056 - Circuit board and process for fabricating the same: A circuit board including a circuit substrate, a first dielectric layer, an antagonistic activation layer, a first conductive layer, a second conductive layer and a second dielectric layer is provided. The circuit substrate has a first surface and a first circuit layer. The first dielectric layer is disposed on the... Agent: Unimicron Technology Corp.
20110147058 - Electronic device and method of manufacturing electronic device: A multilayer wiring substrate has a configuration in which a first wiring layer including a plurality of first conductive members formed in a first insulating film, and formed to be exposed at a second surface side, and a second wiring layer including a plurality of second conductive members formed in... Agent: Renesas Electronics Corporation
20110147057 - Printed wiring board and method for manufacturing printed wiring board: A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from... Agent: Ibiden Co., Ltd.
20110147060 - Dielectric film, dielectric element, and process for producing the dielectric element: A monolayer or a multilayer of niobic acid nanosheets is attached to form a dielectric film, and other electrode is arranged on the surface of the dielectric film to construct a dielectric element, and the dielectric element thus provided realizes both high permittivity and good insulating properties even in a... Agent:
20110147059 - Substrate for integrated circuit devices including multi-layer glass core and methods of making the same: Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also... Agent:
20110147064 - Boron nitride agglomerated powder: Novel boron nitride agglomerated powders are provided having controlled density and fracture strength features. In addition methods for producing same are provided. One method calls for providing a feedstock powder including boron nitride agglomerates, and heat treating the feedstock powder to form a heat treated boron nitride agglomerated powder. In... Agent: Saint-gobain Ceramics & Plastics, Inc.
20110147061 - Circuit board with via trace connection and method of making the same: Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via... Agent:
20110147062 - Feedthrough flat-through capacitor: A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed... Agent: Greatbatch Ltd.
20110147065 - Integrated circuit with adjusting elements and method for its manufacture: An integrated circuit is disclosed with adjusting elements, which in a first manufacturing stage are connected via tracks to terminal pads lying outside the integrated circuit. At least one of the tracks of the integrated circuit lies on a surface of a region, which includes semiconductor material and in a... Agent:
20110147063 - Multilayer board for suppressing unwanted electromagnetic waves and noise: A multilayer board for suppressing unwanted electromagnetic waves and noise includes: a power plane and a ground plane constituting a power distribution network; an electromagnetic wave suppression structure placed on the power plane or the ground plane; and a decoupling capacitor placed on the power plane or the ground plane,... Agent: Electronics And Telecommunications Research Institute
20110147066 - Substrate metallization and ball attach metallurgy with a novel dopant element: Surface-active dopants are added to a portion of a circuit package before a reflow process to promote wetting and reduce the formation of solder bump bridges. The circuit package has a solder element that electrically connects the circuit package to a substrate. A reflow process is performed to attach the... Agent:
20110147067 - Method and apparatus for optically transparent via filling: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of... Agent: Electro Scientific Industries, Inc.
20110147070 - Method and apparatus for reducing signal noise: A printed circuit board having at least two spaced apart conductive planes. A plurality of vias extend between the two spaced apart conductive planes with the vias being electrically connected to a selected one of the two conductive planes in an alternating pattern. A differential electrical signal is connectable to... Agent: Trw Automotive U.s. LLC
20110147069 - Multi-tiered circuit board and method of manufacture: The present invention provides a printed circuit board assembly that includes a first printed circuit board portion having a first thickness and including at least one plated through hole selectively electrically interconnecting electrically conductive layers of the printed circuit board assembly. A second printed circuit board portion is also provided... Agent: International Business Machines Corporation
20110147068 - Structure for enhancing reference return current conduction: An apparatus is provided that comprises a plurality of signaling planes providing signal pathways and at least one internal reference plane providing either a voltage or a ground connection. The at least one internal reference plane are provided between at least two of the signaling planes. The apparatus further comprises... Agent: International Business Machines Corporation
20110147071 - Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof: An apparatus, a method, a planar insulating substrate and a chipset have been presented, comprising at least one module configured to establish a predefined pattern on a planar insulating substrate so that conductive particles can gather according to the predefined pattern. At least one another module is configured to transfer... Agent: Stora Enso Oyj
20110147072 - Method for surface treatment of copper and copper: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper... Agent:
20110147073 - Electromagnetic radiation absorber and method for absorbing electromagnetic radiation: An electromagnetic radiation absorber is made up of a composite of base material and filler. The base material is formed of high permittivity dielectric material and formed in a cubic shape. The filler is formed of high magnetic permeability material and fills in long holes formed inside the base material... Agent: Nitto Denko Corporation
20110147074 - Fixing rack for telecommunication apparatus and mounting method thereof: A fixing rack for a telecommunication apparatus allows the easy mounting, heat dissipation and maintenance of the telecommunication apparatus. A frame of the fixing rack is configured with a second hanging portion, a second joint portion and a fixing portion, wherein the fixing portion fixes the fixing rack on the... Agent: Askey Computer Corp.
20110147075 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of... Agent:
20110147076 - Solar photovoltaic junction box assembly: The invention discloses a solar photovoltaic junction box assembly having a housing having a housing body and a housing cover, a cable extending into the housing body and joined to the housing body, and an electrical connector disposed in the housing body and including at least a metal piece electrically... Agent:
20110147077 - Terminal box for the electric connection to an electric motor: A terminal box (45) for electrical connection to an electric motor (32), in particular of a circulation pump (10), includes at least one wall (215) and at least one circuit board (145), wherein the terminal box (45) on the wall (215) includes at least one electrical contact (220) for connection... Agent: Grundfos Management A/s06/16/2011 > 25 patent applications in 17 patent subcategories. invention type
20110139503 - Cementitious fibre reinforced composite cross arm: A cross arm is provided, for use in a support structure for conductors within an electrical grid. The cross arm is made of a cementitious composite and has a rough “C” cross sectional shape. Pairs of the cross arms are attached to utility poles in a parallel position on opposite... Agent: Lafarge Canada Inc.
20110139481 - Brick box: Embodiments of the present disclosure generally provide an electrical connection box for use in structures with a brick or stone veneer along a frame.... Agent:
20110139483 - Connector for solar module: A box for connecting a solar panel to a cable has a generally planar flat base securable to a solar panel, forming a transversely open cavity for connection of elements of the solar panel with the cable, and formed with a laterally open aperture. A flat cover fittable transversely with... Agent:
20110139482 - Electrical junction box: An electrical junction box includes a junction-box body having at least an outlet for discharging a liquid inside thereof to an outside thereof; and a bracket provided between the junction-box body and a vehicle-body panel. The bracket is adapted to attach the junction-box body to the vehicle-body panel such that... Agent: Yazaki Corporation
20110139480 - Media distribution hub and protection case: A media distribution hub including a housing including a first housing member and a second housing member configured for releasable sealing engagement with one another. A sleeve is disposed about the housing, and is configured to lock the first housing member and the second housing member together and to provide... Agent: Verizon Patent And Licensing Inc.
20110139484 - Hermetic electrical feedthrough: A method for fabricating a hermetic electrical feedthrough includes engraving a circuitous groove into a surface of an electrically conductive monolithic slab so that the interior of the circuitous groove forms a pin. A dielectric material is formed in the circuitous groove. The pin is then electrically isolated from the... Agent: Advanced Bionics, LLC
20110139504 - Relay terminal member, circuit structure including the same, and electronic unit: A terminal relay member includes a plurality of relay terminals, each of which has a body section in which an opening is formed so as to penetrate the body section, and a terminal section to be connected to the circuit board; and a covering section for covering the body sections.... Agent: Mitsubishi Cable Industries, Ltd.
20110139485 - Multi-core cable: A multi-core cable in which skew occurs less and attenuation characteristics of all core cables are uniform comprises: a core unit; an insulation tape spirally wrapped around the outer circumference of the core unit; and a metal coated resin tape wrapped over the insulation tape, wherein a plurality of core... Agent: Sumitomo Electric Industries, Ltd.
20110139486 - Electrical insulating coating and method for harsh environment: A thin electrical insulating coating and method for application is provided for a copper surface. The electrical insulating coating includes a bond coat layer of titanium, nickel, or NiCrAlY forming a metallurgical bond with the copper surface and an insulating layer of alumina or tantala applied to the bond coat... Agent: General Electric Company
20110139487 - Wire construction for cables having insulation and functionality applying in case of fire: A wire for use in electric cables, has a fire-resistant insulation based on cross-linkable polymers including ceramic-forming additives. The insulation surrounds a conductor, wherein the insulation has a first layer of a first composition, and a second layer of a second composition surrounding the outside of the first layer, the... Agent:
20110139488 - Metamaterial and method for manufacturing same: A metamaterial that includes a metallic wire and a supporting member. The metallic wire has a length of substantially half the wavelength of electromagnetic waves, and is coiled in the shape of a spring. The supporting member fixes the metallic wire such that the central axis of the metallic wire... Agent: Murata Manufacturing Co., Ltd.
20110139489 - Printed circuit board: A printed circuit board is disclosed. The printed circuit board in accordance with an embodiment of the present invention can include an insulation substrate, a first ground, which is formed on one surface of the insulation substrate and connected to a first power source, a second ground, which is formed... Agent: Samsung Electro-mechanics Co., Ltd.
20110139490 - Wired circuit board assembly sheet: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating... Agent: Nitto Denko Corporation
20110139491 - Electrode of biosensor, manufacturing method thereof, and biosensor thereof: The present invention discloses an electrode of a biosensor, a manufacturing method thereof, and a biosensor thereof. The electrode of the biosensor comprises a flexible insulation layer, a resin layer, a first metal layer, a second metal layer, a third metal layer and a fourth metal layer. The resin layer... Agent: Biosensors Electrode Technology Co., Ltd.
20110139493 - Flexible substrate and electric circuit structure: Provided is a flexible substrate wherein a connection portion between the flexible substrate and an electric circuit board meets requirements of narrow wiring pitch and low resistance at the connection portion. An electric circuit structure, which has the flexible substrate and the electric circuit board to which the flexible substrate... Agent:
20110139492 - Multilayer flexible printed wiring board and electronic apparatus: A multilayer flexible printed circuit board includes a core material made of an insulating material having bendability. A solid layer is provided on one surface of the core material. The solid layer is made of an electrically conductive material to form a ground plane. A wiring layer is provided on... Agent: Fujitsu Limited
20110139495 - Circuit board including mask for controlling flow of solder: A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board.... Agent: General Electric Company
20110139494 - Embedded wiring board and method for manufacturing the same: A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed, in which the activating insulation layer includes a plurality of catalyst particles, and covers a first wiring layer. An intaglio pattern and at least one blind via partially exposing the first wiring layer are... Agent: Unimicron Technology Corp.
20110139496 - Resin composition: A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin... Agent: Ajinomoto Co., Inc.
20110139498 - Printed wiring board and method for manufacturing the same: A printed wiring board including an insulation layer made of a resin material and having first and second surfaces, the insulation layer having an opening portion opened on the second surface, a conductive circuit having first and second surfaces, the conductive circuit being embedded in the insulation layer such that... Agent: Ibiden Co., Ltd.
20110139497 - Via structure integrated in electronic substrate: A system of via structures disposed in a substrate. The system includes a first via structure that comprises an outer conductive layer, an inner insulating layer, and an inner conductive layer disposed in the substrate. The outer conductive layer separates the inner insulating layer and the substrate and the inner... Agent: Qualcomm Incorporated
20110139499 - Printed circuit board and manufacturing method of the same: A printed circuit board the includes: an insulation layer; a first circuit pattern including a first electrode pad buried in the insulation layer such that a portion of the first circuit pattern is exposed at a surface of the insulation layer; an inner substrate having the insulation layer stacked therein... Agent: Samsung Electro-mechanics Co., Ltd.
20110139500 - Electrical connecting method and electrically connected connection structure: A method of connecting a flexible flat cable and a board is provided, which includes the steps of preparing the flexible flat cable having a first connection terminal composed of a plurality of exposed flat type conductors; preparing the board having a second connection terminal composed of a plurality of... Agent:
20110139501 - Electronic chip and substrate with shaped conductor: An electronic chip including a plurality of conducting pins is provided. The conducting pins are located on an exterior surface of the electronic chip and provides via a conductive adhesive a plurality of electrical connections between the electronic chip and an external circuit. Among the conducting pins, a first conducting... Agent:
20110139502 - Wiring board manufacturing method, semiconductor device manufacturing method and wiring board: A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and has a structure in which... Agent: Shinko Electric Industries Co., Ltd.06/09/2011 > 31 patent applications in 23 patent subcategories. invention type
20110132631 - Fault current limiting hts cable and method of configuring same: A cryogenically-cooled HTS cable is configured to be included within a utility power grid having a maximum fault current that would occur in the absence of the cryogenically-cooled HTS cable. The cryogenically-cooled HTS cable includes a continuous liquid cryogen coolant path for circulating a liquid cryogen. A continuously flexible arrangement... Agent: American Superconductor Corporation
20110132632 - Gas insulated device: According to one embodiment, the gas insulated device has a grounded metal container that covers a high-voltage conductor with a space interposed between itself and the high-voltage conductor; and an insulating spacer that is held and fixed between an end flanges on its outer side and supports the high-voltage conductor... Agent: Kabushiki Kaisha Toshiba
20110132633 - Protective jacket in a coaxial cable: A protective jacket in a coaxial cable. In one example embodiment, a coaxial cable includes two or more internal components and a jacket surrounding the internal components. The internal components include an electrical conductor configured to propagate a signal and an outer conductor surrounding the electrical conductor. The jacket includes... Agent: John Mezzalingua Associates, Inc.
20110132634 - Outlet cover with integral support structure: An outlet cover may comprise a plate member adapted to cover and be secured to a power outlet, the plate portion including at least one fastener aperture and at least one outlet aperture; and at least one supporting structure extending from the plate portion, the supporting structure selected from the... Agent:
20110132635 - Nesting dielectric insulators: A bus assembly and bus assembly connector include one or more insulated members that have axial sleeves that fit within one another during assembly to form a nesting arrangement. The nesting arrangement of the axial sleeves allow reduction of the overall size of the bus assembly connector while satisfying power... Agent: Square D Company
20110132658 - Using surface wave propagation to communicate an information-bearing signal through a barrier: The RF signal generated by a ZigBee radio on the outside of a building structure is conveyed to the interior of the building by guiding it along an electric cable bundle that passes through the building's wall to supply domestic electric power to the interior of the structure. The RF... Agent: At&t Intellectual Property I L.p.
20110132659 - Aluminum alloy wire: Provided are an aluminum alloy having high toughness and high electric conductivity, an aluminum alloy wire, an aluminum alloy stranded wire, a covered electric wire, a wire harness, and a process for production of an aluminum alloy wire. The aluminum alloy wire contains by mass 0.2 to 1.0% of Mg,... Agent:
20110132660 - Cable with electrical conductor included therein: The invention is directed to a braided chemical fibre cable in which at least one electric conductor is contained, in which the cable is thermally stretched together with the conductor contained therein.... Agent: Helikabel Gmbh
20110132661 - Parallelogram coupling joint for coupling insulated conductors: A fitting for coupling ends of insulated conductors includes a sleeve to couple an end of a jacket of a first insulated conductor to an end of a jacket of a second insulated conductor. The sleeve is located between end portions of the insulated conductors. At least one of the... Agent:
20110132636 - Double water-tight structure protecting device for electric charging part of pole: Disclosed therein is a double water-tight structure protecting device for an electric charging part of an electric facility. The double water-tight structure protecting device includes: an insulator (300) attached on the outer peripheral surface of the electric charging part of the electric facility; a first tube-shaped protective cover (100) located... Agent:
20110132637 - Conductive resin composition and chip-type electronic component: A conductive resin composition which allows a resin electrode which is favorable in terms of shape and adhesion to a ceramic device to be formed reliably, and a chip-type electronic component including resin electrodes formed with the conductive resin component are described. The conductive resin composition contains a linear bifunctional... Agent: Murata Manufacturing Co., Ltd.
20110132638 - Protector and wire harness: [Means for Solving Problem] A drainage hole 46 is formed as a portion so as to discharge water collecting in an electrical wire receiving portion 45 into an outside. The drainage hole 46 is formed so as to penetrate through the electrical wire receiving portion 45 and toward the rear... Agent: Yazaki Corporation
20110132639 - Printed wiring board and method for producing the same: A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method... Agent: San-ei Kagaku Co., Ltd.
20110132640 - Printed wiring board and method of suprressing power supply noise thereof: Disclosed is a printed wiring board having signal layers each interposed between a power supply layer and a ground layer, wherein the signal layer includes at least one of a wiring region for a ground potential and a wiring region for a power supply potential.... Agent:
20110132641 - Flexible cable and methods of manufacturing same: A flexible cable for carrying RF signals and method of manufacturing same. The cable includes an elongate base substrate including a dielectric layer with an upper metal layer deposited on one side and a lower metal layer deposited on its other side. It further includes two parallel spaced-apart series of... Agent:
20110132643 - Flexible circuit board and method for producing same and bend structure of flexible circuit board: Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is... Agent:
20110132642 - Flexible wiring substrate: A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode... Agent: Hosiden Corporation
20110132644 - Metal base circuit board: A metal base circuit board, having an insulating layer with a linear expansion coefficient of 60 ppm per degree C. or higher and 120 ppm per degree C. or lower, a metal foil provided on one side of the insulating layer, comprising a metal material with a linear expansion coefficient... Agent:
20110132645 - Granular varistor and applications for use thereof: Embodiments described include a non-polymeric voltage switchable dielectric (VSD) material comprising substantially of a grain structure formed from only a single compound, processes for making same, and applications for using such non-polymeric VSD materials.... Agent:
20110132646 - Flame retardant epoxy resin composition, prepreg and laminate thereof: There is provided herein a curable epoxy resin composition comprising at least one brominated epoxy resin, at least one flame retardant curing agent, and at least one curing catalyst.... Agent: Icl-ip America Inc.
20110132647 - Substrates having voltage switchable dielectric materials: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects... Agent:
20110132649 - 1-d tire patch apparatus and methodology: Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate... Agent: Michelin Recherche Et Technique S.a.
20110132648 - Channel performance of electrical lines: A first via and a second via pass through a layer of a multi-layered circuit board. A first set of electrical transmission line segments, each having a first thickness, is aligned at a first area on the layer between the first and second vias. A second set of electrical transmission... Agent: International Business Machines Corporation
20110132650 - High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost: A multi-layered ceramic package comprises: a signal layer with identified chip/device area(s)/site(s) that require a supply of power; and a voltage power (Vdd) layer and a ground (Gnd) layer disposed on opposite sides directly above or below (adjacent to) the signal layer and providing a first reference mesh plane and... Agent: Ibm Corporation
20110132651 - Circuit board and method of manufacturing the same: A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed... Agent: Samsung Techwin Co., Ltd.
20110132652 - Structure of very high insertion loss of the substrate noise decoupling: A structure includes a substrate comprising a region having a circuit or device which is sensitive to electrical noise. Additionally, the structure includes a first isolation structure extending through an entire thickness of the substrate and surrounding the region and a second isolation structure extending through the entire thickness of... Agent: International Business Machines Corporation
20110132653 - Coaxial cable shielding: Coaxial cable shielding. In one example embodiment, a coaxial cable includes a center conductor surrounded by a dielectric, a conductive tape surrounding the dielectric, and a jacket surrounding the conductive tape. The conductive tape includes a conductive layer and a bonding agent layer immediately adjacent to the conductive layer. The... Agent: John Mezzalingua Associates, Inc.
20110132655 - Electronic component device and method for manufacturing the same: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, both of which are composed of a Ni film. A bonding section bonds the first sealing frame to the second sealing frame. For example, a Bi... Agent: Murata Manufacturing Co., Ltd.
20110132656 - Electronic component device and method for manufacturing the same: An electronic component device having a first sealing frame formed on a main substrate and a second sealing frame formed on a cover substrate, the first and second sealing frames being composed of a Ni film. A bonding section constituted by a Ni—Bi alloy is formed between the first and... Agent: Murata Manufacturing, Co., Ltd.
20110132657 - Junction box: A junction box for electrical cables comprising a main body comprising a base, an accepting wall with means for accepting cables through the wall, two walls substantially adjacent to the accepting wall and substantially opposite one another, and an electrical connector within the walls, wherein the means for accepting cables... Agent:
20110132654 - Multilayer printed circuit board, method for manufacturing the same, and electronic apparatus: A method for manufacturing a multilayer printed circuit board, and a printed circuit board manufactured according to the method, includes laterally-aligning a first inner substrate in which first insulation layers and first conductor layers are alternately laminated and a second inner substrate in which second insulation layers and second conductor... Agent: Fujitsu Limited06/02/2011 > 25 patent applications in 20 patent subcategories. invention type
20110127060 - Faceplate with high binding capability: A faceplate with high binding capability comprises a flexible outer layer, a metal plate, and a connection element. The internal surface of the flexible outer layer is correspondingly adhered to the external surface of the metal plate via an adhesive layer. The metal plate is provided with at least a... Agent:
20110127061 - Structure of bus bar assembly: A bus bar assembly used for establish electric connections with semiconductor modules of an electric power converter. The bus bar assembly includes a resinous body, a first and a second bus bar to which terminals of the semiconductor modules are to be connected. Each of the first and second bus... Agent: Denso Corporation
20110127083 - Cable protection device for an industrial robot and industrial robot with such a cable protection device: The invention relates to a conducting line protection device for an industrial robot having at least one power line, having a basic ring section, a hollow cylinder section whose diameter is matched to an inside diameter of a pipe component of the industrial robot that rotates relative to the conducting... Agent: Kuka Roboter Gmbh
20110127084 - Wire harness: [Means for Solving Problem] A wire harness 21 is provided with a plurality of high-voltage electrical wires 22, a protection member 23 which protects the high-voltage electrical wires 22, fixed members 24, 25 which fix the wire harness in a vehicle, and a low-voltage electrical wire 26. The protection member... Agent: Yazaki Corporation
20110127062 - Cable for high speed data communications: A cables for high speed data communications, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The first inner conductor is substantially parallel to the second inner conductor and to a longitudinal axis. The cable... Agent: International Business Machines Corporation
20110127063 - Cable structure: The present invention relates to a cable structure, comprises a cable having a first, a second and a third conductive wires made of metal wire material, the third conductive wire is covered by a third insulation layer, the first conductive wire is interlaced on the third insulation layer and is... Agent:
20110127064 - Communication cable: A signal transmission cable including a center core (10) of twisted pairs (10B) of insulated wires (10A). Then, a first layer of foamed polyolefin tape (11), which protects the core insulation from erosion by the shield materials, and distances them from the core so that the shield materials are more... Agent:
20110127065 - Electric cable for nuclear power plants with improved durability and fabrication method thereof: Disclosed is a method for fabricating an electric cable for nuclear power plants, comprising: pre-heating a conductor wire; melting a PEEK (poly ether ether ketone) material and extruding the PEEK material in the direction of the conductor wire, to form an insulator such that the insulator coats the surface of... Agent:
20110127066 - Heat stabilizers containing hydrotalcite particles with specific zeta potentials that demonstrate improved processing and performance in molded vinyl compounds: Particulate solid heat stabilizer compositions for vinyl halide polymers are provided having about 30% to 90% by weight hydrotalcite particles represented by a sigmoidal curve on a cartesian coordinate plot of zeta potential (mV) versus pH. The curve has negative zeta potential values balanced against positive zeta potential values over... Agent: Chemson Polymer Additives Ag
20110127067 - Insulated wire: where R indicates a divalent aromatic diamine including three or more aromatic rings. The insulating coatings are formed by applying and baking the polyamide-imide resin insulating material, and the polyamide-imide resin insulating material is obtained by reacting an imide group containing dicarboxylic acid with a diisocyanate, the imide group containing... Agent: Hitachi Magnet Wire Corp.
20110127068 - Polymer particle, conductive particle, anisotropic conductive material and connection structure: In the formula (1), n represents an integer within the range of 4 to 10. In the formula (2), R11 represents a hydrogen atom or a C1-4 alkyl group, R12, R13 and R14 each represent a C1-4 alkylene group, and R15, R16 and R17 each represent a hydrogen atom or... Agent:
20110127070 - Embedded printed circuit board, multi-layer printed circuit board and manufacturing method thereof: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the... Agent: Lg Innotek Co., Ltd.
20110127069 - Printed circuit board and layout method thereof: A printed circuit board layout method includes the following steps. A printed circuit board with a signal layer, and a pair of differential transmission lines positioned on the signal layer is provided. A first distance is determined, when the distance between the pair of differential transmission lines is greater or... Agent: Hon Hai Precision Industry Co., Ltd.
20110127071 - Flexible pcb of spindle motor: Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through... Agent:
20110127072 - Supporting frame for circuit board: A circuit board includes a substrate and a supporting frame fixed to, and supporting, the substrate. The supporting frame includes a main body, a pressing supporting portion, two pulling supporting portions and two fixing portions. The main body includes a first arm and a second arm connected to the first... Agent: Hon Hai Precision Industry Co., Ltd.
20110127074 - Method for roughening treatment of copper foil and copper foil for printed wiring boards obtained using the method for roughening treatment: An object of the present invention is to provide a technology for forming a roughened surface of a copper foil which is laminated with an insulating resin substrate having a low dielectric constant, on which a fine-pitch wiring can be formed. To achieve the object, a method for roughening a... Agent: Mitsui Mining & Smelting Co., Ltd.
20110127073 - Printed circuit board and manufacturing method thereof: A printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a metal core having Invar layers formed on either surface of a copper layer, an insulation layer, which is formed on one surface of the... Agent: Samsung Electro-mechanics Co., Ltd.
20110127077 - Block copolymerized polyimide ink composition for printing: The object is to provide a polyimide ink composition having good printing properties and good continuous priming properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low... Agent:
20110127076 - Electronic component-embedded printed circuit board and method of manufacturing the same: Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate;... Agent:
20110127075 - Interlayer insulating film, wiring structure, and methods of manufacturing the same: An insulative coat film comprising one or two or more kinds of oxides having a dielectric constant (k) of 2.5 or smaller and expressed by a general formula of ((CH3)nSiO2-n/2)x(SiO2)1-x (where n=1 to 3, x≦1) is used to form an interlayer insulation film. The insulative coat film applied by spin-coating... Agent: Ube-nitto Kasei Co., Ltd.
20110127079 - Electronic circuit module and method of connecting coaxial cable: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire... Agent: Olympus Corporation
20110127078 - Manufacturing method of plate-like member assembly and transparent substrate-including electronic member: A manufacturing method of a plate-like member assembly includes the steps of: preparing a first plate-like member including a projecting region, projecting from one surface of the first plate-like member along a thickness direction thereof, on the one surface; forming a light transmitting film, having a light transmitting property, in... Agent: Casio Computer Co., Ltd.
20110127080 - Electronic assemblies without solder and methods for their manufacture: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly... Agent: Occam Portfolio LLC
20110127081 - Electromagnetic limiter and a use of an electromagnetic limiter: The invention relates to an electromagnetic limiter. The limiter comprises a multilayer having an electrically conducting pattern superposed on a dielectric structure. Further, the multilayer is provided with at least one electromagnetically transparent aperture that is electromagnetically transparent for plane wave incidence. In addition, the limiter comprises a non-controlled non-linear... Agent: Nederlandse Organisatie Voortoegepast Natuurwetenschappelkjik Onderzoek Tno
20110127082 - Electronic device with a fixing member: An electronic device includes an enclosure and a fixing member to secure the enclosure to a fastener. The receiving member defines a first receiving portion and a second receiving portion in communication with the first receiving portion. The fixing member includes a control portion received in the receiving member and... Agent: Hon Hai Precision Industry Co., Ltd.Previous industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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