SEARCH:      Monitor Keywords |  Custom RSS

Electricity: conductors and insulators March listing by industry category 03/11

20110073345 - Busbar and electrical junction box incorporating the same: A busbar includes a first busbar component as a busbar body and a second busbar component connected thereto. The first busbar component is made of an electrically-conductive metal material having superior spring property. The first busbar component includes a male-terminal-connecting portion for clamping a male terminal of a device and... Agent: Yazaki Corporation

20110073344 - Gasket containing carbon nanotubes: A composition for forming a gasket comprises a curable elastomer material and 0.1-20 weight % (e.g., 4-10 weight %) carbon nanotubes dispersed throughout the elastomer material. A dispensed bead of elastomer material exhibits a Slump ratio of at least 0.7. The composition provides the correct balance of rheology/dispensing characteristics, seal... Agent: Hyperion Catalysis International, Inc.

20110073346 - Grounding mechanism for foldable electronic devices: A grounding mechanism is used for a foldable electronic device including a barrel and an audio component. The grounding mechanism includes a connecting element and an elastic member. The connecting element is received in the barrel. The elastic member is attached to the audio component. One portion of the elastic... Agent: Fih (hong Kong) Limited

20110073347 - Electrical cover: Disclosed is a cover for an electrical interface. The electrical interface may be a rocker type switch located within a hole in a wall. The cover is sized to cover the hole in the wall and has an aperture therethrough sized to surround the rocker type switch. The cover further... Agent:

20110073365 - Press-clamping structure for press-clamping aluminum electric wire to terminal: A press-clamping structure includes: an aluminum electric wire having a conductor portion in which strands of aluminum or aluminum alloy are twisted; and a terminal which includes a bottom plate portion for placing the conductor portion thereon, and a pair of conductor caulking pieces which are provided consecutively to the... Agent: Yazaki Corporation

20110073366 - Flexible conduit coupling connector: A connector is provided for coupling a first conduit to a second conduit. The connector includes a first hub configured to connect to the first conduit and a second hub configured to connect to the second conduit. A flexible body is configured to sealingly connect to the first hub and... Agent: Thomas & Betts International, Inc.

20110073348 - Coaxial cable: A coaxial cable includes a central conductor made of cylindrical conductive material with conductivity greater than 100% and smaller than 104%, the central conductor having a thickness greater than 0.1 mm and smaller than 0.5 mm; a dielectric layer surrounding the central conductor and made of insulating material; an outer... Agent:

20110073349 - Device for preventing the establishment of an electric arc between two conductive elements: The invention concerns a device for preventing the establishment of an electric arc between adjacent portions (9) having no electrical insulation of at least two electrically conductive elements (7). According to the invention, the device comprises at least one separating partition (13) made of dielectric material inserted between said adjacent... Agent:

20110073350 - Grommet: Even if a wire harness that passes a grommet is bent sharply, a vehicle body latch recess of the grommet is not deformed, thereby enhancing a sealing function. A grommet includes: an inner tube having a smaller diameter and passing electrical cables in a wire harness in a close contact... Agent: Sumitomo Wiring Systems, Ltd.

20110073351 - Grommet: Even if a wire harness that passes a grommet is bent sharply, a vehicle body latch recess of the grommet is not deformed, thereby enhancing a sealing function. A grommet includes an inner tube through which electrical cables in a wire harness pass in a close contact manner, and an... Agent: Sumitomo Wiring Systems, Ltd.

20110073352 - Paired low-characteristic impedance power line and ground line structure: Disclosed is a paired low-characteristic impedance power line and ground line structure in which loop inductance is substantially 0. The paired low-characteristic impedance power line and ground line structure includes a laminated sheet in which a metal wiring layer having a power line and a ground line is provided on... Agent:

20110073353 - Conductive fabric and method for forming the same: A conductive fabric and a method for forming the same are provided. The conductive fabric comprises a first layer and a second layer. The first layer has at least one first conductive thread and a plurality of first non-conductive threads. The at least one first conductive thread is woven within... Agent: King's Metal Fiber Technologies Co., Ltd.

20110073355 - Interposer and electronic device: An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.... Agent: Fujitsu Limited

20110073354 - Printed board and method of manufacturing printed board: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and... Agent: Fujitsu Limited

20110073356 - Digital manufacture of an electrical circuit: The electrographic printing of one or more multi-channeled layers having a particular pattern by electrographic techniques that produces a specialty item electrographically. Such electrographic printing comprises the steps of forming a desired print image, electrographically, on a receiver member utilizing predetermined sized marking particles; and, where desired, forming one or... Agent:

20110073357 - Electronic device and method of manufacturing an electronic device: Electronic device comprising an integrated circuit (1) embedded into a substrate, wherein the substrate has at least a first (3) and a second (9) conductive structure arranged on opposite sides of the integrated circuit (1) and the electrical connections (10,11,12,13) between the first (3) and the second (9) conductive structure... Agent: Nxp B.v.

20110073358 - Circuit substrate, laminated board and laminated sheet: A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.... Agent: Kyocera Corporation

20110073359 - Through-hole-vias in multi-layer printed circuit boards: Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and... Agent: International Business Machines Corporation

20110073360 - Shielding enclosures: Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending... Agent: Laird Technologies, Inc.

20110073361 - Methods and apparel for attenuating electromagnetic fields emanating from a person in or on a body of water: Attenuating, while in or on a body of water, one's own emanated electromagnetic field by wearing apparel that includes an electromagnetically shielding fabric. The shielding fabric comprises a substantially continuous system of conductive fibers combined with non-conductive fabric. Or attenuating, while a person is in or on a body of... Agent:

20110073362 - Terminal box and solar cell module: According to one embodiment, a terminal box includes a box case placed on and fixed to a back film of a solar cell string and a terminal panel formed on the box case. The box case includes a case main body placed on and fixed to the back film of... Agent:

20110073363 - Circuit module and electric vehicle including the same: A circuit board is accommodated in an internal space of a main body casing, and a bus bar electrically connected to the circuit board is drawn out of the main body casing. The bus bar is held in an internal region of a terminal holder positioned outside the main body... Agent: Sanyo Electric Co., Ltd.

20110073364 - Lead-through terminal: A lead-through terminal for leading an electric line through a wall, having a first terminal housing and a second terminal housing, at least one first conductor connection member in the first terminal housing and at least one conductor connection member in the second terminal housing, and a bus bar electrically... Agent: Phoenix Contact Gmbh & Co. Kg

20110067896 - System for adjustably mounting an electrical device: An adjustably mountable electrical device with one or more yokes coupled to the electrical device, at least one electrically conductive strap, and an electrical device face, wherein a distance between the electrical device face and at least one of the yoke, the strap and an electrical box mounting screw aperture... Agent:

20110067897 - Electrical and data outlet decommissioning arrangement: A temporary electrical or data outlet decommissioning arrangement comprising: a generally rectangularly shaped receiving baseplate for exchange with a cover plate on an electrical outlet box; a cover plate having a plurality of receiving baseplate engagement tabs thereon, wherein the baseplate has two side walls and two transverse end walls... Agent:

20110067919 - Device-cable assembly integrally molded with resin: A device-cable assembly integrally molded with a resin according to the present invention comprises: the electric/electronic device; the cable including: a cable sheath which is the outermost layer of the cable, the cable sheath being made of a mixture of a fluorocarbon-based polymer and a polyolefin-based copolymer, and fine silica... Agent: Hitachi Cable, Ltd.

20110067921 - Flame-retardant composition, covered electric wire, and wiring harness: A flame-retardant composition that is not colored during compounding and molding, and a covered electric wire using the same. The flame-retardant composition contains at least a matrix polymer such as an olefin resin, a phenolic antioxidant having tert-butyl groups in positions 2 and 6 of a hydroxyl group, and a... Agent: Sumitomo Electric Industries, Ltd.

20110067920 - Wiring harness having protection member: A wiring harness is arranged at a predetermined location in a vehicle such as an automobile. The wiring harness comprises a plurality of electrical wires and a protection member in which to-be-protected portion of the electrical wires is inserted en bloc to be protected thereby. The protection member includes a... Agent: Yazaki Corporation

20110067922 - Modular power connector: A modular power connector includes an insulation main body, at least one conducting element, at least one electricity-delivering element, and at least one engaging element. The conducting element is partially accommodated within the insulation main body, and includes a perforation. The electricity-delivering element has a bare part at an end... Agent: Delta Electronics, Inc.

20110067898 - curable composition for medium and high voltage power cables: An electric cable, has an electrical conductor surrounded by a cured electrically-insulating layer obtained from a curable composition with a polymer matrix, the polymer matrix having one or more polyolefins and a polyvinyl acetal as agent for reducing the formation of water treeing, the quantity of PVA being no more... Agent:

20110067899 - Lead pin for package substrate: A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing... Agent: Samsung Electro-mechanics Co., Ltd.

20110067900 - Carbon fiber electrical contacts formed of composite carbon fiber material: A nonmetallic electrical contact or wiper composed of a composite carbon fiber material through which an electrical signal is terminated. The carbon fibers are arranged in and bonded into a multi-layer structure used to conduct a primary electrical signal. A nonwoven carbon fiber mat is used as one or more... Agent:

20110067901 - Package substrate: Disclosed is a package substrate, in which the plating area of a first plating layer formed on a layer which is to be connected to a motherboard is larger than the plating area of a second plating layer formed on a layer which is to be connected to an electronic... Agent:

20110067902 - Heat dissipating circuit board and method of manufacturing the same: Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer... Agent:

20110067903 - Bundled flexible flat circuit cable: A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first... Agent: Advanced Flexible Circuits Co., Ltd.

20110067904 - Flex-rigid wiring board and method for manufacturing the same: A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate,... Agent: Ibiden Co., Ltd

20110067905 - Flexible printed circuit board and method for forming monitor: The disclosure relates to a flexible printed circuit board and a method for manufacturing a monitor. The flexible printed circuit board is disposed on a portion of an upper surface of a substrate and is folded to a sidewall and a lower surface of the substrate. The flexible printed circuit... Agent: Chimei Innolux Corporation

20110067906 - Power module substrate, power module, and method for manufacturing power module substrate: A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint... Agent: Mitsubishi Materials Corporation

20110067907 - Low temperature curable photosensitive resin composition and dry film manufactured by using the same: The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be... Agent: Lg Chem, Ltd.

20110067909 - Embedded circuit board structure and fabrication process thereof: An embedded circuit board structure and a fabricating process thereof are disclosed. The embedded circuit board structure comprises a dielectric layer and a metal layer. The dielectric layer comprises an indentation; the indentation is formed by a plurality of pits, and the pits are substantially perpendicular to the surface of... Agent:

20110067908 - Method for producing a printed circuit board and use and printed circuit board: The invention relates to a method for fixing a component (6) to or in a printed circuit board (1) and/or for connecting individual elements of a printed circuit board, wherein regions of a component (6) and/or of a printed circuit board (1) to be interconnected or to be fixed to... Agent:

20110067910 - Component securing system and associated method: A system to secure a component to a circuit board may include a printed circuit board, a surface mounted component, and a lead carried by the surface mounted component. The system may also include a stencil adhered between at least one of the printed circuit board and the surface mounted... Agent: International Business Machines Corporation

20110067912 - Electroconductive bonding material and electronic apparatus: An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or lower than the thermosetting temperature of... Agent: Murata Manufacturing Co., Ltd.

20110067911 - Method of bonding parts to substrate using solder paste: In this method of bonding a part to a substrate using a solder paste, the solder paste is mounted or applied between a metallization layer formed on the substrate and a metallization layer formed on the part, and the part is bonded to the substrate by performing a reflow process... Agent: Mitsubishi Materials Corporation

20110067913 - Printed wiring board and method for manufacturing the same: A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor... Agent: Ibiden Co., Ltd.

20110067915 - Electromagnetic interference noise reduction board using electromagnetic bandgap structure: An EMI noise reduction board is disclosed. The electromagnetic interference (EMI) noise reduction board having an electromagnetic bandgap structure for shielding a noise includes: a first area having a ground layer and a power layer; a second area placed in a side portion of the first area having an electromagnetic... Agent: Samsung Electro-mechanics Co., Ltd.

20110067914 - Printed circuit board having electromagnetic bandgap structure: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a... Agent: Samsung Electro-mechanics Co., Ltd.

20110067916 - Printed circuit board having electromagnetic bandgap structure: Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive... Agent: Samsung Electro-mechanics Co., Ltd.

20110067917 - Printed circuit board having electromagnetic bandgap structure: Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive... Agent: Samsung Electro-mechanics Co., Ltd.

20110067918 - Emi shielding materials: Corrosion-resistant electromagnetic interference (“EMI”) shielding material. The material is provided as an admixture of an elastomeric polymeric component and a filler component. The filler component is provided as glass or aluminum particles which are electrolessly-plated with a plating of a nickel-phosphorous alloy.... Agent:

20110061884 - Laser assisted system and method for bonding of surfaces; microcavity for packaging mems devices: The present application relates to a system (51) and method for bonding surfaces that allows the production of microcavities suitable for accommodating MEMs devices or other devices that require cavity encapsulation or sealing. Laser directing means (55) are used to selectively direct a laser beam (53) onto an area of... Agent:

20110061885 - Snap-on one-piece screwless cover plate for electrical fixtures: A snap-on, one-piece screwless cover plate for electrical fixtures is disclosed. The cover plate assembly includes a snap-on, one piece, screwless cover plate for an electrical receptacle box that is capable of being installed directly to an electrical device that is installed in the receptacle box. In various embodiments, the... Agent:

20110061886 - Electrical outlet covering accessory movable between positions concealing and allowing access to the outlet: An improved electrical outlet access control accessory mounts in a wall to provide access to and concealment for an outlet mounted in aligned juxtaposition thereto. The accessory has a cover that can be manually rotated between closed and open positions, providing respectively concealment for or access to an outlet within.... Agent:

20110061932 - Wire harness and method of installation thereof: A wire harness includes a cable and a clamp. The cable has an end portion at which a connection terminal is provided. The connection terminal is electrically connected to a connecting portion. The clamp is attached with the cable so as to be movable with respect to the cable in... Agent: Suzuki Motor Corporation

20110061933 - Flat cable for use with an electronic device: This is directed to a cable for use with an electric device in which the conductive medium used to conduct electrical signals is a flex instead of distinct wires. The flex can include any suitable number of conductive traces connecting connectors integrated in or coupled to the ends of the... Agent: Apple Inc.

20110061887 - Corrosion resistant coaxial cable: Corrosion resistant coaxial cable. In one example embodiment, a method for manufacturing a coaxial cable includes various steps. First, a dielectric is extruded around a center conductor. Next, the dielectric is surrounded with an outer conductor. Then, a corrosion-inhibiting composition is applied to the outer conductor. Finally, the outer conductor... Agent: John Mezzalingua Associates, Inc.

20110061888 - Semi-bonded shielding in a coaxial cable: Semi-bonded shielding in a coaxial cable. In one example embodiment, a coaxial cable includes a center conductor surrounded by a dielectric, an inner conductive tape surrounding the dielectric, a conductive braid surrounding the inner conductive tape, an outer conductive tape surrounding the conductive braid, and a jacket surrounding the outer... Agent: John Mezzalingua Associates, Inc.

20110061889 - Braided cable: A cable including a number of cords of wires. The cords of wires are braided together in a predetermined braiding pattern. Each cord of wires includes a number of wires. The wires of each cord of wires are braided together in a predetermined braiding pattern. The cable further includes a... Agent: Razer (asia-pacific) Pte Ltd

20110061890 - Shielding seam location in a coaxial cable: Shielding seam location in a coaxial cable. In one example embodiment, a coaxial cable includes a center conductor surrounded by a dielectric, an inner conductive tape surrounding the dielectric, a conductive braid surrounding the inner conductive tape, an outer conductive tape surrounding the conductive braid, and a jacket surrounding the... Agent: John Mezzalingua Associates, Inc.

20110061891 - Diblock copolymer modified nanoparticle-polymer nanocomposites for electrical insulation: The invention relates to an electric insulation material including modified nanoparticles, a porous substrate and polymer matrix, wherein the modified nanoparticles include a nanoparticle and a diblock copolymer covalently attached to the nanoparticle, the diblock copolymer including a first block polymer of molecular weight greater than 1000 and a glass... Agent: Rensselaer Polytechnic Institute

20110061892 - Cable with current leakage detection function: A cable having a current leakage detection function includes three current-carrying core wires. Each current-carrying core wire is wrapped by an insulating layer, so that the current-carrying core wires are electrically insulated from one another. The insulating layer of at least one of the current-carrying core wires is wrapped by... Agent: General Protecht Group, Inc.

20110061893 - Water tree retarding composition: The present invention relates to a crosslinkable polymer composition, comprising (i) an unsaturated polyolefin having a total amount of carbon-carbon double bonds/1000 carbon atoms of more than 0.37, and (ii) at least one ether and/or ester group containing additive selected from the group consisting of polyethylene glycol, a glycerol ester... Agent: Borealis Technology Oy

20110061894 - Apparatus and method for forming wire: An apparatus and method for forming a single strand wire with improved flexibility and a stranded cable from a single strand wire. In one embodiment, the flexible single strand wire has a solid, single strand wire body and at least one helical groove formed on an outer circumferential surface of... Agent:

20110061895 - Arm structure: An arm structure includes a first arm pivotally supported on a body, and a second arm pivotally supported on the first arm at an axis portion formed s on a distal end side of the first arm. A wire harness fixing portion for fixing a wire harness is provided at... Agent: Aisin Seiki Kabushiki Kaisha

20110061896 - Electrical power connection device: A power connection device, in particular for power connections of safety containers, is provided. To improve the operational safety, the power connection device includes two cascaded current feedthroughs, whereby the electrical connections between the conductors of the feedthrough are arranged in conduits of reduced volume so that the interstices between... Agent: Schott Ag

20110061897 - Grommet: To provide a grommet of which a vehicle body latch recess is not deformed, thereby maintaining a good sealing function, even if a wire harness that passes the grommet is bent sharply. The grommet includes: an inner tube for passing electrical cables in the wire harness in a close contact... Agent: Sumitomo Wiring Systems, Ltd.

20110061899 - Pixel array: A pixel array including first signal lines, second signal lines, switch devices, and pixel units coupling to the first signal lines and the second signal lines through the switch devices is provided. The first signal lines and the second signal lines are formed on different films. Each of the pixel... Agent: Chunghwa Picture Tubes, Ltd.

20110061898 - Reducing cross-talk in high speed ceramic packages using selectively-widened mesh: One embodiment of the invention provides a multi-layered ceramic package. The ceramic package includes a signal layer having a plurality of signal lines and a mesh reference layer parallel to the signal layer. The mesh reference layer includes a plurality of intersecting reference lines of varying reference-line width in the... Agent: International Business Machines Corporation

20110061900 - Wired-circuit-board assembly sheet and producing method thereof: A wired-circuit-board-assembly sheet includes a plurality of wired circuit boards arranged in parallel in one direction, which are regularly omitted at given intervals, and a plurality of units defined by margin portions where the wired circuit boards are omitted.... Agent: Nitto Denko Corporation

20110061902 - Circuit board and method of manufacturing the same: w

20110061901 - Heat-dissipating substrate and fabricating method thereof: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position... Agent:

20110061903 - Multilayered printed wiring board and method for manufacturing the same: A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the... Agent: Dai Nippon Printing Co., Ltd.

20110061904 - Display array substrate and method of manufacturing display substrate: A display array substrate according to an aspect of the invention may include: a substrate wafer having cutting grooves curved inward; and a transparent electrode coated over one surface of the substrate wafer, wherein shock, occurring when cutting the substrate wafer, is prevented from being transmitted to the transparent electrode... Agent: Samsung Electro Mechanics Co., Ltd.

20110061905 - Printed circuit board and method of manufacturing the same: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a... Agent: Samsung Electro-mechanics Co., Ltd.

20110061909 - Circuit module and method of manufacturing the same: Manufacturing method and circuit module, which comprises an insulator layer (1) and, inside the insulator layer (1), at least one component (6), which comprises contact areas (7), the material of which contains a first metal. On the surface of the insulator layer (1) are conductors (22), which comprise at least... Agent: Imbera Electronics Oy

20110061908 - Pattern electrode manufacturing method and pattern electrode: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing... Agent: Konica Minolta Holdings, Inc.

20110061906 - Printed circuit board and fabrication method thereof: A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different... Agent: Samsung Electro-mechanics Co., Ltd.

20110061907 - Printed circuit board and method of manufacturing the same: A printed circuit board according to an aspect of the invention may include: a board portion having an electrode portion provided on a surface thereof; a solder resist layer provided on the surface of the board portion and having an opening therein to expose the electrode portion to the outside;... Agent: Samsung Electro-mechanics Co., Ltd.

20110061911 - Interposer and method for manufacturing the same: An interposer includes: an insulation plate where a via is formed, the insulation plate including a resin or a ceramic; a first upper redistribution layer electrically connected to the via along a circuit pattern designed on the top surface of the insulation plate; a first upper protection layer laminated to... Agent: Samsung Electro-mechanics Co. Ltd.

20110061913 - Method of manufacturing mounting structure and mounting structure: A method of manufacturing a mounting structure includes: an insulating resin arranging step of forming, on a circuit board, two kinds of insulating resin including first insulating resin cured at first curing temperature and second insulating resin cured at second curing temperature higher than the first curing temperature; a mounting... Agent: Panasonic Corporation

20110061910 - Multi-layer ceramic circuit board, method of manufacturing the same, and electric device module using the same: There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the... Agent: Samsung Electro-mechanics Co., Ltd.

20110061914 - Novel polyimide precursor composition, use of the same, and production method of the same: An object of the present invention is to provide (i) a polyimide precursor composition which is curable at a low temperature (not more than 250° C.) and which has a low viscosity despite having a high concentration, and a production method thereof, (ii) a polyimide coating film obtained from the... Agent: Kaneka Corporation

20110061915 - Novel resin composition and use thereof: An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating... Agent: Kaneka Corporation

20110061912 - Printed circuit board and manufacturing method thereof: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern... Agent: Samsung Electro-mechanics Co., Ltd.

20110061916 - Wiring board and manufacturing method thereof: A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided... Agent: Shinko Electric Industries Co., Ltd.

20110061918 - Backboard assembly and electronic device having the same: A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the... Agent: Foxconn Technology Co., Ltd.

20110061919 - Backboard assembly and electronic device having the same: A low temperature ceramics substrate, a low temperature ceramics assembling system, and a method thereof in which a fixing member is formed on the bottom of an LTCC substrate, an insertion hole is formed at a coupled portion on a fixing member of the LTCC substrate coupled onto the heat... Agent: Samsung Electro-mechanics Co., Ltd.

20110061920 - Circuit module: An electronic component includes a component body including a mounting surface facing a circuit substrate, and a plurality of first external electrodes arranged on the mounting surface so as to extend between a first side and a second side of the mounting surface substantially parallel with each other and so... Agent: Murata Manufacturing Co., Ltd.

20110061917 - Laminated substrate for an integrated circuit bga package and printed circuit boards: A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.... Agent: St-ericsson Sa

20110061921 - Wiring board with built-in capacitor: A wiring board with built-in capacitors includes a core substrate, and a high dielectric sheet including a lower electrode layer, an upper electrode layer and a dielectric layer, the dielectric layer made of a sintered ceramic body and sandwiched between the lower electrode layer and the upper electrode layer, the... Agent: Ibiden Co., Ltd.

20110061922 - Package substrate and method of fabricating the same: Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate.... Agent:

20110061923 - Double-sided pressure-sensitive adhesive tape and wiring circuit board: A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of... Agent: Nitto Denko Corporation

20110061924 - Communication channels with suppression cores: Alien crosstalk suppression cores are used to decrease alien crosstalk in communications channels. Electrical communication cables may be provided with alien crosstalk suppression cores. The alien crosstalk suppression cores, which may be ferrite suppression cores, are placed separately on some or all of the twisted pairs within a communication cable.... Agent: Panduit Corp.

20110061925 - Printed circuit board having electromagnetic bandgap structure: Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that... Agent: Samsung Electro-mechanics Co., Ltd.

20110061926 - Junction box: A junction box for electrically connecting insulated conductors of a first cable to corresponding insulated conductors of a second cable, including a terminal housing; a plurality of electrically conductive contacts extending through the terminal housing, each contact of said contacts including first and second insulation displacement contacts (IDCs) opening into... Agent: Adc Gmbh

20110061927 - Housing component for door latch assembly and method of making: A component for a vehicle latch assembly is provided, the component having: an electrical sub-system having a plurality of circuit paths each being electrically connected to a common ground, the electrical sub-system being molded into a pre-mold by a first molding process, the pre-mold comprising an encapsulation layer molded around... Agent:

20110061928 - Flexible printed wiring board and electronic apparatus having flexible printed wiring board: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring... Agent: Kabushiki Kaisha Toshiba

20110061929 - Optimized power package for electrical device: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate... Agent: Samsung Electro-mechanics Co., Ltd.

20110061930 - Junction box: A junction box, comprising a multi-layer circuit board, wherein the circuit board (6) comprises: a plurality of dielectric layers, each having conducting track on a side and arranged one on top of another to form the multi-layered circuit board; power circuitry (4) mounted on the circuit board; signal processing circuitry... Agent:

20110061931 - Structure for wire outlet covers: An improved structure for a wire outlet cover, arranged at a sidewall of a carton receiving a network wire, includes a body and a collar. The body has a hollow cylindrical shape and includes an inlet end and an outlet end, wherein the body is, at the outlet end, provided... Agent: Tatung Company

20110056718 - Anti-lightning system and aircraft comprising such a system: An anti-lightning system for a composite structure having an external surface liable to be subjected to an air flow, the aforementioned system including at least one electrically conducting strip and fasteners fastening the aforementioned strip to the structure, the aforementioned strip being electrically connected to an electrical earth for removing... Agent: Airbus Operations (s.a.s)

20110056719 - Electricity transmission device at high current and high frequency: The electricity transmission device comprises prolonged rigid conductors made of copper (18), and also a connector (17) comprising a network of flexible elements (23), such as brazed tubes with cooling channels (20, 22) for the conductors (18), that enables angular displacements between the successive segments (15, 16) and therefore gives... Agent: Commissariat A L'energie Atomique

20110056720 - Wall plate devices and systems: A wall plate configured to at least partially cover and/or connect to a standardized electrical box and/or components stored therein. In one implementation, the wall plate may comprise a substantially planar body having a front and a back. In particular, the body may be configured to at least partially cover... Agent:

20110056721 - Headphone tangle prevention apparatus: A method and apparatus for keeping headphone and earpiece cables from tangling is disclosed. The apparatus may include a flexible sleeve capable of moving relative to a headphone cord to restrict the movement of earpiece cables associated with the headphone cord.... Agent:

20110056722 - Wiring duct cover with foam insert: A wiring duct includes a base and a snap-on or hinged cover. The base has a bottom wall and two sidewalls extending perpendicularly from the bottom wall. Each sidewall may include a projection to receive a snap-on cover. The snap-on or hinged cover includes a foam insert attached to the... Agent: Panduit Corp.

20110056746 - Electric field modification about a conductive structure: An apparatus includes a conductive structure and an insulated conductor disposed proximate an exterior portion of the conductive structure to modify an electric field about the conductive structure. The insulated conductor has an insulator with a dielectric strength greater than 75 kilovolts (kV)/inch disposed about a conductor.... Agent: Varian Semiconductor Equipment Associates, Inc.

20110056723 - Electrical cable with strength member: A cord assembly for an electronic device includes a cord having an insulation layer with a first end and an exterior surface, as well as at least one electrical conductor extending within the insulation layer. A strength member also extends within the insulation layer and includes a first end extending... Agent: Vocollect, Inc.

20110056747 - Terminal structure for plate-shaped member having conducting function, and plate-shaped member having conducting function: Disclosed is a terminal structure, which suppresses the increase in the thickness size of a plate-shaped member disposed movably in the direction of main surfaces (14 and 15) so that it can be easily positioned and connected, and which is used in an automotive window glass pane (11) having a... Agent:

20110056724 - Method of producing hollow core for coaxial cable, hollow core for coaxial cable, and coaxial cable: To produce a hollow core for a coaxial cable having high hollow rate and stable electric characteristics in its longitudinal direction. A producing method of a hollow core for a coaxial cable, the hollow core comprising: an inner conductor; and an insulating coating body including an inner annular portion for... Agent: Ube-nitto Kasei Co., Ltd.

20110056727 - Core cable: A transmission cable comprises a conductive strand surrounded by an insulating casing. The conductive strand includes an inner core of a ferromagnetic material, a highly conductive metal skin disposed about the inner core, and a tinning disposed there between the highly conductive metal and the inner core.... Agent:

20110056726 - Insulated conductive element having a substantially continuous barrier layer formed through multiple coatings: Coating an elongate, uncoated conductive element with a substantially continuous barrier layer. The substantially continuous barrier layer is formed through relative movement of the conductive element to a frame between sequential coatings of a barrier material.... Agent: Ip Department/cochlear Limited

20110056725 - Insulated conductive element having a substantially continuous barrier layer formed via relative motion during deposition: Coating an elongate, uncoated conductive element with a substantially continuous barrier layer. An uncoated conductive element is around a frame comprising spaced supports. During deposition, the relative position of the conductive element to the frame is adjusted so that all sections of the conductive element are physically separated from the... Agent: Ip Department/cochlear Limited

20110056728 - Flame-retardant composition and insulated wire, and method for producing flame-retardant composition: A flame-retardant composition that is more excellent in heat resistance than a conventional flame-retardant composition. The flame-retardant composition contains silane-crosslinked polyolefin, polyolefin, a metallic hydrate, a phenolic antioxidant, a sulfurous antioxidant, a metallic oxide, and a copper inhibitor. The sulfurous antioxidant is preferably a benzimidazole compound, and the metallic oxide... Agent: Sumitomo Electric Industries Ltd

20110056729 - Insulated conductive element having a substantially continuous barrier layer formed through continuous vapor deposition: A continuous vapor deposition system for coating an elongate, uncoated conductive element with a substantially continuous barrier layer. The system comprises an internal deposition chamber configured to have a section of the conductive element extend there through; a vapor supply system connected to the internal deposition chamber configured to provide... Agent: Cochlear Limited

20110056730 - Wiring harness installation structure for vehicle: A wiring harness installation structure is provided which can reduce the installing cost of a wiring harness by omitting an operation of injecting a water stop agent into an interior of a grommet. A grommet 21 which is fittingly mounted in a harness through hole in a body panel 7... Agent: Yazaki Corporation

20110056731 - Solid core glass bead seal with stiffening rib: A hermetic feed-through includes a housing body defining a hollow space, a plurality of conductive pins and a seal structure. The plurality of conductive pins extend through the hollow space. The seal structure is provided in the hollow space and includes a single-piece glass component. The single-piece glass component hermetically... Agent: Emerson Electric Co.

20110056732 - Flex-rigid wiring board and method for manufacturing the same: Provided are a flex-rigid wiring board in which resin that is easily affected by chemicals can be protected reliably without any increase in the number of manufacturing process steps, and a method for manufacturing the flex-rigid wiring board. The flex-rigid wiring board consists of a flexible section (A) and a... Agent:

20110056733 - Surface mount component having magnetic layer thereon and method of forming same: A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component... Agent: Intel Corporation

20110056737 - Electrochemical device: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each... Agent: Taiyo Yuden Co., Ltd.

20110056734 - Electronic device submounts with thermally conductive vias and light emitting devices including the same: A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate... Agent:

20110056736 - Fabrication method of circuit board, circuit board, and chip package structure: A circuit board, a chip package structure and a fabrication method of the circuit board are provided. By applying the fabrication method, a plurality of conductive channels can be formed in a single through hole of the circuit substrate. Unlike the conductive channels respectively formed in the through holes according... Agent: Advanced Semiconductor Engineering, Inc.

20110056735 - Multilayer chip capacitor and circuit board device: There are provided a multilayer chip capacitor and a circuit board device. The multilayer chip capacitor includes a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes formed on an outer surface of the capacitor body and having opposite polarity, first and second... Agent: Samsung Electro-mechanics Co., Ltd.

20110056738 - Package substrate and manufacturing method thereof: A package substrate and a manufacturing method thereof are provided, including: forming a solder mask on a package substrate body having a plurality of conductive pads; forming a plurality of first-step openings in the solder mask by exposure and development; forming a plurality of second-step openings in the solder mask... Agent: Phoenix Precision Technology Corporation

20110056739 - Substrate structure and method for manufacturing the same: A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at... Agent:

20110056740 - Through-hole electrode substrate and manufacturing method thereof: A through-hole electrode substrate includes a substrate including a plurality of through-holes, a plurality of through-hole electrodes arranged within each of the plurality of through-holes, and a first insulation layer arranged on one surface of the substrate, wherein the first insulation layer includes a plurality of first openings which expose... Agent: Dai Nippon Printing Co., Ltd.

20110056741 - Stack structure of circuit board: A stack structure of a circuit board includes a first substrate, a second substrate and a fixing element. The first substrate has a first component area, a plurality of supporting solder elements, and a plurality of signal solder elements, wherein the plurality of signal elements is disposed in the first... Agent: Compal Electronics, Inc.

20110056742 - Emi shields and methods of manufacturing the same: An electromagnetic interference (EMI) shielding apparatus generally includes a lid and a framework. The lid includes a top portion having at least one projection joining part thereon. The at least one projection joining part has a peripheral contour. The framework includes a top portion and a lateral side extending downward... Agent: Laird Technologies, Inc.

20110056743 - Flush mount electrical plate and method for installing same: A mounting tray for a supporting and electrical component relative to an opening in a wall can include a rear wall that defines an opening. A sidewall can extend outwardly from the rear wall and collectively define a pocket with the rear wall. The sidewall can have an outer lip.... Agent:

20110056744 - Terminal structure, printed wiring board, module substrate, and electronic device: The present invention provides a terminal structure 14 including a terminal 12 having a conductor 40 containing at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor 40, and a second layer having a nickel/phosphorus... Agent: Tdk Corporation

20110056745 - Feedthru including a ceramic based coating and a method of applying a ceramic based coating to a feedthru: The present invention relates to a feedthru (210, 210′) provided with a ceramic based coating (260) and a method of providing a feedthru (210, 210′) with a ceramic based coating (260). The feedthru (210, 210′) includes at least one conductive pin (220) that extends through a header (217) and includes... Agent: Micro Motion, Inc.

20110048800 - Systems and methods for storing and/or transmitting electrical energy: According to some embodiments, systems and or methods may be provided to transport electrical energy from a first location having an electrical energy source to a second location, remote from the first location and having a load to accept electrical energy. A first pipeline between the first and second locations... Agent:

20110048754 - Housing for electronic device and method for making the same: A housing for electronic device, comprising: a substrate, the substrate having an outer surface; a metallic coating formed on at least the outer surface of the substrate, the metallic coating defining a plurality of grooves thereon and forming a pattern; and a metal pattern layer formed in the grooves. A... Agent:

20110048755 - Housing for electronic device and method for making the same: A housing for electronic device, comprising: a metal substrate, the substrate having a bonding surface, a peripheral edge, and a ridge protruding from the peripheral edge and surrounding the bonding surface; a soft layer soft to the touch, the soft layer having an edge; and an adhesive layer located between... Agent:

20110048756 - Security protection device and method: A security protection device includes a cover circuit board, at least one inner wiring layer being included within the cover circuit board. The device also includes a base circuit board, at least one inner wiring layer being included within the base circuit board. The device further includes a security frame... Agent:

20110048757 - Hermetic sealing cap: A more thinnable hermetic sealing cap can be provided. This hermetic sealing cap (10) is employed for an electronic component housing package (100) housing an electronic component (40) and includes a cap body portion (1) mainly composed of Ti.... Agent:

20110048758 - Flat panel mounting interface element, system and method: This interface system for use in facilitating the mounting of flat panels for electronic media junctures/connectors uses an interface element intermediate the flat panel for electronic connectors, which would typically be mounted directly to an ambient surface such as a wall (or to an electrical box in the wall), and... Agent:

20110048759 - Mounting assembly for electrical fixture: A mounting assembly and method are provided for mounting an electrical fixture to a ceiling structure. The mounting assembly includes a mounting plate and a cover plate overlying the mounting plate. The mounting plate includes a plurality of strengthening ribs and a plurality of fastener holes for receiving fasteners to... Agent:

20110048760 - Outlet or switch panel: A panel for mounting to a power outlet or switch comprises a panel holder configured to secure to the power outlet or switch. A slide lock is configured to clip onto the panel holder in a sliding way. A panel case is configured to clip to the slide lock. The... Agent:

20110048761 - Wire cabling device and method for manufacturing the same: This object aims to provide a wire cabling device which a case can be shared among a plurality of devices for cabling electric wires to a plurality of sliders provided on the right and left sides of an automobile. A wire cabling device (1) comprises electric wires (50) for connecting... Agent:

20110048799 - Microstructure and process for its assembly: In a process for assembling a microstructure (1), provision is made of a first microstructure piece (2) having a receiving recess (3) in its surface and a second microstructure piece (5) having a connecting region (6) fitting into the receiving recess (3) and on which is arranged at least one... Agent:

20110048762 - Waterproofing method for wire and wire having waterproof part formed by the waterproofing method: A waterproofing method is provided for a wire to be arranged in a water susceptible area of a vehicle. An insulating coating layer is removed in a lengthwise intermediate part of the wire to expose a core. A heat shrinkable tube with an inner layer made of a hot-melt waterproofing... Agent:

20110048763 - Torsional ultrasonic welding: Connection of an aluminium stranded lead 2 to a connection part 10, comprising a stripped end 4 of the aluminium stranded lead 2 and a metal connection part 10 which is materially connected to the stripped end 4 of the aluminium stranded lead 2. An inexpensive welded connection can be... Agent:

20110048764 - High frequency extrafine pair cable and method for manufacturing the same: The present invention is directed to a high frequency extrafine pair cable, wherein a pair cable is accommodated in a shield tube assuming the form of a hollow cylinder, the pair cable comprising two insulation coated wires each comprising an inner conductor and an insulator layer formed on an outer... Agent:

20110048765 - Fatique resistat metallic moisture barrier in submarine power cable: A submarine power cable (10) has an electrical conductor (1) surrounded by an insulation (2,3,4), said insulation being surrounded by a metallic moisture barrier (5) characterized in that the cable (10) further comprises a semi-conductive adhesive layer (6) surrounding said metallic moisture barrier (5), and a semi-conductive polymeric jacket (7)... Agent:

20110048766 - Polyamide-imide resin based insulating varnish and insulated wire covered with same: There is provided an insulated wire including: a conductor wire; and a polyamide-imide insulation coating formed around the conductor wire, the polyamide-imide insulation coating being made from a polyamide-imide resin based insulating varnish, the varnish being synthesized by reaction of an isocyanate constituent and an acid constituent in a solvent,... Agent:

20110048767 - Twisted pairs cable with tape arrangement: A multi-pair cable having a plurality of twisted conductor pairs and a tape arrangement. The tape arrangement providing a dielectric barrier between the twisted conductor pairs and a jacket of the multi-pair cable. The tape arrangement further defining at least two separate twisted pair regions in which the twisted conductor... Agent:

20110048768 - Power cable: A power cable (10) is disclosed comprising a metal conductor encased in a first outer sheath (11), and further encased, partially along the length of the cable, in a second outer sheath (12, 13, 14) which influences the pattern of deformation of the cable under mechanical stress.... Agent:

20110048769 - Insulating film, method of manufacturing the same, and semiconductor device: An exemplary aspect of the invention provides an insulating film which has a high dielectric constant and has small leakage current even when it is sandwiched between electrodes. The insulating film comprises two zirconium oxide layers in crystallized state; and an intergranular isolating layer composed of an amorphous material having... Agent:

20110048770 - Injection molded ferrule for cofired feedthroughs: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an... Agent:

20110048771 - Electronic apparatus and flexible substrate wiring method: An electronic apparatus includes: a flexible substrate including, a first portion having a first wiring pattern, and a second portion connected to the first portion and having a second wiring pattern whose pattern width is wider than a pattern width of the first wiring pattern, wherein the second portion is... Agent:

20110048772 - Conducting polymer ink: Disclosed are conductive polymer inks and methods for forming the inks. The disclosed inks include a dispersion of conductive core/shell nanoparticles. The core/shell nanoparticles include a polymeric core and a shell formed of a conducting polymer. The inks can include a dispersion of the core/shell nanoparticles in a liquid carrier,... Agent:

20110048774 - Plating film, printed wiring board, and module substrate: The present invention provides a plating film 50 including a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3×σ×100)/X is 10 or less, where X... Agent:

20110048773 - Printed wiring board and method for manufacturing the same: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of... Agent:

20110048775 - Printed wiring board and method for manufacturing the same: A printed wiring board includes a substrate having a first surface and a second surface on the opposite side of the first surface and multiple first penetrating holes, a first conductive portion formed on the first surface of the substrate and made of a first plated cover layer, a second... Agent:

20110048776 - Thermosetting resin compositions and articles: The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in... Agent:

20110048778 - Circuit board, semiconductor package and method of manufacturing the same: A circuit board includes a board part including a pattern portion on one surface thereof, the pattern portion being electrically connected to a semiconductor chip, and an under-fill layer disposed on the board part and exposing the pattern portion to the outside, the under-fill layer flowing to cover the pattern... Agent:

20110048777 - Component-embedded printed circuit board: A component-embedded printed circuit board includes: a carrier plate having a metalized layer disposed thereon, an electronic component disposed on the metalized layer of the carrier plate, and a metal layer laminated onto the metalized layer having the electronic component disposed thereon by a dielectric film. The carrier plate is... Agent:

20110048780 - Method of processing cavity of core substrate: A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being... Agent:

20110048781 - Printed circuit board with integrated thin film battery: The present invention relates to, for example, printed circuit boards having a thin film battery or other electrochemical cell between or within its layer or layers. The present invention also relates to, for example, electrochemical cells within a layer stack of a printed circuit board.... Agent:

20110048779 - Resin sheet for circuit boards, sheet for circuit boards and circuit board for displays: A resin sheet for circuit boards (2) obtained from a macromolecular material of the energy ray curable type and used for embedding circuit chips, which has a double bond concentration of 4.5 to 25 mmol/g before being cured by irradiation with an energy ray; a sheet for circuit boards including... Agent:

20110048783 - Embedded wiring board and a manufacturing method thereof: An embedded wiring board includes an upper wiring layer, a lower wiring layer, an insulation layer, a first conductive pillar and a second conductive pillar. The upper wiring layer contains an upper pad, the lower wiring layer contains a lower pad, and the insulation layer contains an upper surface and... Agent:

20110048786 - Printed circuit board having a bump and a method of manufacturing the same: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening... Agent:

20110048784 - Printed circuit board strip and panel: A printed circuit board strip and a printed circuit board panel are disclosed. In accordance with an embodiment of the present invention, the printed circuit board strip includes an unit area, a plating lead-in wire, which is for plating the unit area, and a mold gate, which is disposed on... Agent:

20110048782 - Solder pad structure with high bondability to solder ball: A solder pad structure with a high bondability to a solder ball is provided. The present invention provides a larger contact area with the solder ball so as to increase the bondability according to the principle that the bondability is positive proportional with the contact area therebetween. The solder pad... Agent:

20110048785 - Wired circuit board and producing method thereof: A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the... Agent:

20110048789 - Electronic component and method for manufacturing the same: An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a... Agent:

20110048788 - Method for forming a via in a substrate and substrate with a via: The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method includes the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a groove that has a side wall and a bottom... Agent:

20110048787 - Photo-patternable dielectric materials and formulations and methods of use: Silsesquioxane polymers, silsesquioxane polymers in negative tone photo-patternable dielectric formulations, methods of forming structures using negative tone photo-patternable dielectric formulations containing silsesquioxane polymers, and structures made from silsesquioxane polymers.... Agent:

20110048790 - Chip carriers with side terminals: An electrically insulating substrate is provided. The electrically insulating substrate includes a set of areas to be formed into a set of printed circuit boards. Each of the set of areas is separated from others of the set of areas by a dicing channel. A set of signal wiring conductors... Agent:

20110048791 - Printed circuit board and method of manufacturing the same: A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead... Agent:

20110048792 - Wiring holding member, electronic device and image forming apparatus: A wiring holding member includes a holding portion and a wiring holding space. The holding portion is formed in a laying direction of a wiring including a linear wiring and a band-shaped wiring, and holds the band-shaped wiring. The wiring holding space is formed by the band-shaped wiring held in... Agent:

20110048793 - Ceiling suspension assembly: A ceiling suspension assembly for suspending an object in a cable, cord or string (51) from a ceiling comprises a ceiling fitting, cover or casing (25) and a suspension device (1). The suspension device is adapted to be attached to the ceiling such as fastened to a hook, ring or... Agent:

20110048794 - Electronic part housing box: In an electronic part housing box 1 which includes a capacitor 2 having lead wires 2b protruded from the capacitor main body 2a, a base member 10 having a part housing chamber 11 for housing the capacitor main body 2a, a part housing cover 20 attached to the base member... Agent:

20110048795 - Electronic package and process: An electronic package has a cover or lid mounted onto a substrate to enclose an electronic device, and a liquid thermal interface material is subsequently inserted (through dispensing, injection molding or printing through apertures in the cover or lid) between the surface of the electronic device and the cover, and... Agent:

20110048796 - Connector, package using the same and electronic device: A connector which can be made compact is provided. A package and an electronic device which can be made compact by using the connector are also provided. The connector has a first conductor and a second conductor for connecting an internal circuit formed in a frame-shaped container and an external... Agent:

20110048797 - Surface mounted electronic component: A surface mounted electronic component is provided. The surface mounted electronic component includes a main body, a circuit element, a conductive electrode, and a virtual electrode. The circuit element is arranged in the main body. The conductive electrode is disposed on an outer surface of the main body, wherein the... Agent:

20110048798 - Collar for maintaining electric cables: The invention relates to a collar (20) for maintaining electric cables, including an annular sleeve (22) which may be crossed by the electric cables (14a) and having two axial ends around which protective sheaths of the electric cables are intended to be mounted, an annular attachment flange (26) capable of... Agent: