|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators January recently filed with US Patent Office 01/11Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 01/27/2011 > 26 patent applications in 23 patent subcategories. recently filed with US Patent Office
20110017485 - Metallic floor box with non-metallic riser and flange: An in-floor electrical floor-box assembly includes a rectangular or nearly square metallic housing and a non-metallic riser with integral flange assembly having a rectangular flange that mates with the rectangular housing and an integral cylindrical riser for providing access to the electrical components through a round cover and finish flange.... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.
20110017486 - Universal wall plate thermometer: A universal light switch cover assembly with swivel thermometer is disclosed.... Agent: P. Jeff Martin Of The Mcgougan Law Firm, LLC
20110017487 - Enhanced bus bar system for aircraft transparencies: A bus bar system includes a non-conductive substrate having a major surface. At least one conductive bus bar is formed over at least a portion of the major surface. A conductive coating is formed over at least a portion of the bus bar and the major surface. An electrically conductive... Agent: Ppg Industries Inc Intellectual Property Dept
20110017488 - Field-controlled composite insulator and method for producing the composite insulator: A field-controlled composite insulator uses materials which are greatly stressed by an inhomogeneous distribution of an electrical field across a surface thereof. One of the causes thereof is the structural configuration of the insulator. The field strength changes particularly in a region of fittings due to a transition from insulating... Agent: Lerner Greenberg Stemer LLP
20110017509 - Electric article comprising at least one element made from a semiconductive polymeric material and semiconductive polymeric composition: An electric article, particularly an electric cable or an accessory thereof, such as a cable joint or a cable termination, includes at least one element made from a semiconductive polymeric material, wherein the at least one element is obtained by crosslinking a semiconductive polymeric composition including: (a) at least one... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20110017510 - Heater cable to pump cable connector and method of installation: A connector arrangement to attach an electrical submersible pump (ESP) cable to a resistance heater cable for use in oil and gas wells is accomplished by connecting a heater cable specially fabricated having a mineral insulation around an electrical conductor generating heat in a splice to a standard ESP cable.... Agent: The Dickinson Law Offices Attn: David Dickinson
20110017489 - Electrical cable with foraminous label: Embodiments provided herein include an electrical cable of the type that is of the type to have a connector member coupled thereto. The electrical cable includes a conductive outer sheath and a label disposed on the conductive outer sheath, the label having information about the cable and having at least... Agent: Gardere Wynne Sewell LLP Intellectual Property Section
20110017490 - Cable for use in a condensing photovoltaic apparatus: There is disclosed a cable for use in a condensing photovoltaic apparatus. The cable includes a core and sheath. The core is made of a conductive material. The sheath is provided around the core and made of white Teflon. Therefore, the sheath absorbs less heat than a sheath made of... Agent: Jackson Intellectual Property Group PLLC
20110017491 - Hdmi connector assembly system for field termination and factory assembly: The invention provides a system of components, methods for assembly, and a hand tool, for adding a male connector to a standard and modified ribbon high definition multimedia (HDMI) cable for field termination or factory installation. The invention also provides a locking plug which can mate with female HDMI connectors... Agent: Claypool Intellectual Property
20110017492 - Separator structure for cat 6 cable: The utility model relates to a separator structure for Cat 6 cable, comprising a core (2); a shield layer (1) between the core (2) and a jacket, or a jacket (1); four conductor sets (3) each consisting of a pair of conductors (21), and insulating layers (22) covering the conductors... Agent: Sofer & Haroun LLP.
20110017493 - Carbon microbeads with hierarchical structure: The preset invention is a hierarchically-structured carbon microbead and method for forming the microbead utilizing hydrothermal carbonization of a biomass/catalyst mixture to produce partially carbonized amorphous microspheres, wherein the biomass is an inexpensive material containing a high oxygen content component (e.g., sugar, starch, alcohol), and the catalyst is a metal... Agent: Boyle Fredrickson S.c.
20110017494 - Insulating compositions and devices incorporating the same: Provided are compositions that include a dielectric matrix material defining multiple voids of substantially uniform respective dimension and configured as a substantially uniform array. The voids may be configured such that charges that accumulate at surfaces of at least some of the voids when the composition is immersed in a... Agent: General Electric Company Global Research
20110017495 - Method for preparing a patterned electric circuit: The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically... Agent: Renner Otto Boisselle & Sklar, LLP
20110017496 - Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrate: A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer,... Agent: Edwards Angell Palmer & Dodge LLP
20110017497 - Electric device: An electric device, in particular a mechatronic gear, motor, or brake control device in a motor vehicle, includes an electronic component having at least one electric contact surface for electrically contacting the component. A flexible circuit board with a conduction path structure includes at least one contact pad and conduction... Agent: Lerner Greenberg Stemer LLP
20110017498 - Photosensitive dielectric film: A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured... Agent: Mark Levy Hinman, Howard & Kattell, LLP
20110017499 - Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application: An interconnect structure including an alloy liner positioned directly between a diffusion barrier and a Cu alloy seed layer as well as methods for forming such an interconnect structure are provided. The alloy liner of the present invention is formed by thermally reacting a previously deposited diffusion barrier metal alloy... Agent: Scully, Scott, Murphy & Presser, P.C.
20110017501 - Composite material and manufacturing method thereof: This invention provides a composite material useful for size reduction of electronic components and circuit boards mounted on electronic equipment and exhibiting a low magnetic loss (tan δ), and a manufacturing method thereof. The composite material contains an insulating material and particulates dispersed in this insulating material, the particulates being... Agent: Morgan Lewis & Bockius LLP
20110017500 - Printed wiring board, electronic device and manufacturing method of the printed wiring board: A printed wiring board is formed by performing cutting in a rectangular region having sides which are oblique to sides of a rectangular sheet material from the rectangular sheet material formed from glass cloth fibers. In the printed wiring board, at least one corner is cut out in a state... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20110017503 - Z-directed capacitor components for printed circuit boards: A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the... Agent: Lexmark International, Inc. Intellectual Property Law Department
20110017502 - Z-directed components for printed circuit boards: A design for a Z-directed component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is mounted within the thickness of the PCB allowing other components to be mounted over it. The body may... Agent: Lexmark International, Inc. Intellectual Property Law Department
20110017505 - Z-directed connector components for printed circuit boards: A Z-directed connector component for insertion into a printed circuit board and providing electrical connections to internal conductive planes contained with the PCB and/or to external conductive traces on the surface of the PCB.. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other... Agent: Lexmark International, Inc. Intellectual Property Law Department
20110017504 - Z-directed ferrite bead components for printed circuit boards: A Z-directed ferrite bead component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. In one embodiment the Z-directed component is housed within the thickness of the PCB allowing other components to be mounted over it. Signal and dual conductor... Agent: Lexmark International, Inc. Intellectual Property Law Department
20110017506 - Modular over-mold harness: An over-molded harness including a plurality of bundled flexible electric wires, an electrical or electronic element electrically connected between at least two of the wires, and at least a portion of the bundled electrical wires having an over-molded insulative covering, whereby the electrical or electronic element is unsupported by other... Agent: Sheldon Mak & Anderson PC
20110017507 - Z-directed variable value components for printed circuit boards: A Z-directed variable value component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained with the PCB. The Z-directed variable value component mounts in a printed circuit board (PCB) having a mounting hole having a depth D therein and a plurality of conductive... Agent: Lexmark International, Inc. Intellectual Property Law Department
20110017508 - Pressurized rotary machine with hermetically sealed connections: Pressurized rotary machine comprising a canned or sleeved assembly of which the electrical connections are connected to the outside of the machine by an electric supply duct, the electrical connections passing from the canned or sleeved assembly to the outside via the electric supply duct by passing in succession through... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP01/20/2011 > 32 patent applications in 25 patent subcategories. recently filed with US Patent Office
20110011611 - Polarized lightning arrestors: Systems and methods for dynamically defending a site from lightning strikes are provided. The systems and methods involve dynamically altering electrostatic fields above the site and/or dynamically intervening in lightning discharges processes in the vicinity of the site.... Agent: The Invention Science Fund Clarence T. Tegreene
20110011612 - Twist-in latching arrangement for cable management structure: A cable management system includes a panel with a plurality of openings, each opening defining a similar configuration, each opening defining a first dimension and a second dimension, the first dimension being longer than the second dimension. A cable management structure is removably coupled to the panel, the cable management... Agent: Merchant & Gould PC
20110011613 - Treated electrical conduit: An improved electrical conduit having a protective material thereon for anti-microbial and antifungal prevention. The metallic conduit includes a metal armor defining an outer surface and an interior hollow area within which electrical conductors are disposed. A first polymeric layer is formed over the outer surface of the metal armor.... Agent: Tyco International Management Corp.
20110011642 - Low leakage electrical joints and wire harnesses, and method of making the same: Low leakage electrical joints and wire harnesses for simplifying the electrical infrastructure associated with solar energy utilities are disclosed. The low leakage electrical joints include fused wires that have been sealed, encased and configured to plug into other joints to form wire harnesses. The wire harnesses are particularly well suited... Agent: Carla L. Gannon
20110011614 - Treated electrical cable: Improved electrical cables employ a protective material thereon for antimicrobial prevention. The electrical cable is formed by a metallic strip helically wound with interlocking edges to define an armor having an inner hollow area within which is housed a plurality of electrical conductors. The armor is treated with a coating... Agent: Tyco International Management Corp.
20110011615 - Thermoplastic polyurethane material with enhanced fluid immersion and water absorption capabilities: The present invention relates to compositions for use as cable coverings, e.g. insulation or jacket, that meets industry requirements (especially Mil-PRF-85045F) for low water absorption, and high tensile strength and elongation retention properties upon fluid immersion. The compositions contain a base polymer having (a) a thermoplastic polyurethane (TPU); (b) a... Agent: Blank Rome LLP
20110011616 - Flame-retardant polyolefin/thermoplastic polyurethane composition: The present invention is a flame-retardant polyolefin/thermoplastic polyurethane formulation made from or containing a polyolefin, a thermoplastic polyurethane, and an intumescent, polyphosphate flame retardant composition. The invented system achieves elongations>400% and tensile strengths>1500 psi while the same polyolefin only achieved 100% elongation and<1000 psi tensile strength. Also, the present invention... Agent: The Dow Chemical Company
20110011617 - Flat power cable: A flat power cable includes at least two cores of which at least two cores include a power transmissive insulated element and a protective sheath disposed in a radially external position with respect to the power transmissive insulated element. The cores are disposed on a common transversal axis and an... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20110011618 - Copper alloy bonding wire for semiconductor device: The present invention provides a semiconductor-device copper-alloy bonding wire which has an inexpensive material cost, ensures a superior ball joining shape, wire joining characteristic, and the like, and a good loop formation characteristic, and a superior mass productivity. The semiconductor-device copper-alloy bonding wire contains at least one of Mg and... Agent: Mcdermott Will & Emery LLP
20110011619 - Bonding wire for semiconductor devices: It is an object of the present invention to provide a highly-functional bonding wire which can reduce damages at a neck part, has good linearity of loops, stability of loop heights, and stability of bonded shape of a bonding wire, and can cope with semiconductor packaging techniques, such as low... Agent: Darby & Darby P.C.
20110011620 - Electrical conductor: An electrical conductor includes a primary electrical contact, at least one secondary electrical contact, and a connection element. The connection element electrically connects the first and the at least one secondary electrical contacts, and includes at least one plate-like region. Each plate-like region includes at least one deflection component with... Agent: Buchanan, Ingersoll & Rooney PC
20110011622 - Maintaining insulators in power transmission systems: An electrical power transmission system includes electrical insulators arranged to electrically isolate live power lines. Surface reconditioning units are incorporated or integrated in the insulator structures. A sensor arrangement determines surface conditions of the electrical insulators in use to isolate live power lines. In response, the surface reconditioning units automatically... Agent: The Invention Science Fund Clarence T. Tegreene
20110011621 - Smart link coupled to power line: A smart link in a power delivery system includes an insulator, which electrically isolates a power line, and a switchable conductance placed in parallel with the insulator. The switchable conductance includes switchgear for sourcing, sinking, and/or dispatching real and/or reactive power on the power line to dynamically in response to... Agent: The Invention Science Fund Clarence T. Tegreene
20110011623 - Smart link coupled to power line: A smart link in a power delivery system includes an insulator, which electrically isolates a power line, and a switchable conductance placed in parallel with the insulator. The switchable conductance includes switchgear for sourcing, sinking, and/or dispatching real and/or reactive power on the power line to dynamically in response to... Agent: The Invention Science Fund Clarence T. Tegreene
20110011624 - Smart link coupled to power line: A smart link in a power delivery system includes an insulator, which electrically isolates a power line, and a switchable conductance placed in parallel with the insulator. The switchable conductance includes switchgear for sourcing, sinking, and/or dispatching real and/or reactive power on the power line to dynamically in response to... Agent: The Invention Science Fund Clarence T. Tegreene
20110011625 - Grommet: A grommet includes a small diameter tubular section and a large diameter tubular section contiguous with the small diameter tubular section. Both of the sections are attached to a wire harness for a motor vehicle by threading the wire harness through both of the sections. The small diameter tubular section... Agent: Greenblum & Bernstein, P.L.C
20110011626 - Printed circuit board and method of manufacturing the same: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A... Agent: Panitch Schwarze Belisario & Nadel LLP
20110011627 - Parts made of electrostructural composite material: A rigid structural part made of laminated composite material incorporates electrically conducting cables, the structural part includes at least two structural layers including fibers held in place by a thermosetting or thermoplastic matrix, at least one conducting network layer located between two of the at least two structural layers, the... Agent: Ratnerprestia
20110011628 - Highly thermal conductive circuit board: A highly thermal conductive circuit board includes a composite substrate, and a metal layer, an insulating layer, and a conductor layer sequentially disposed on the composite substrate. When at least one electronic element is electrically disposed on the conductor layer of the highly thermal conductive circuit board, heat produced by... Agent: Morris Manning Martin LLP
20110011629 - Electrodynamic arrays having nanomaterial electrodes: An electrodynamic array of conductive nanomaterial electrodes and a method of making such an electrodynamic array. In one embodiment, a liquid solution containing nanomaterials is deposited as an array of conductive electrodes on a substrate, including rigid or flexible substrates such as fabrics, and opaque or transparent substrates. The nanomaterial... Agent: Wright, Lindsey & Jennings LLP
20110011630 - Semiconductor device and method of manufacturing the same: A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and... Agent: Harness, Dickey & Pierce, P.L.C
20110011631 - Ceramic substrate and method of manufacturing the same: The present invention relates to a ceramic substrate and a method of manufacturing the same. The ceramic substrate includes: a ceramic base; an electrode pattern formed on at least one surface of the ceramic base at predetermined internal and external depths; and electrode material filled in the inside of the... Agent: Staas & Halsey LLP
20110011632 - Electric conductor and process for its production: An electric conductor comprising a substrate 10 and at least two layers formed on the substrate, each being a layer (Z) made of titanium oxide doped with at least one dopant selected from the group consisting of Nb, Ta, Mo, As, Sb, W, N, F, S, Se, Te, Cr, Ni,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20110011633 - Multilayer circuit board and motor drive circuit board: A multilayer circuit board in which wirings are arranged so that the inductance thereof is reduced. A ground wiring and a power source wiring which are provided in a multilayer circuit board are arranged so that most of the wirings are superposed vertically along a direction of a longer side... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20110011634 - Circuit package with integrated direct-current (dc) blocking capacitor: A circuit package includes a substrate formed using a plurality of layers, the substrate having a first surface and a second surface, at least some of the plurality of layers being electrically interconnected by a via; and at least one standard surface-mount capacitive element electrically coupled to at least one... Agent: Kathy Manke Avago Technologies Limited
20110011635 - Method for arranging a component on a circuit board: A method for arranging a component on a circuit board, a circuit board, and a mobile device comprising a circuit board are described.... Agent: Mcdonnell Boehnen Hulbert & Berghoff LLP/semc
20110011636 - Multilayer wiring board and method of manufacturing the same: There are provided a multilayer wiring board and a method of manufacturing the same. The multilayer wiring board according to an aspect of the invention may include: a main body having a plurality of insulting layers stacked upon each other, including a first layer provided as an inner layer and... Agent: Staas & Halsey LLP
20110011637 - Multilayer printed circuit board: A multilayer printed circuit board, including: a signal interconnection which transmits and receives an electrical signal between electronic components; a ground interconnection connected to a ground of a circuit; a power interconnection connected to a power layer to supply power to electronic components; at least one ground layer installed in... Agent: Sughrue Mion, PLLC
20110011638 - Shielding tape with edge indicator: The present invention comprises a shielding tape comprising at least one shielding layer, at least one separator layer, a first (inner) edge, and a second (outer) edge. The shielding tape further includes an indicator extending along at least a portion of the outer edge. The indicator is for identifying the... Agent: Squire Sanders & Dempsey LLP
20110011639 - Shielding tape with multiple foil layers: A coaxial cable of the present invention comprises a center conductor, a dielectric surrounding the center conductor, a shielding tape surrounding the dielectric, a braided metal surrounding the shielding tape, and an outer jacket surrounding the braided metal. The shielding tape comprises: (i) a first shielding layer bonded to a... Agent: Squire Sanders & Dempsey LLP
20110011640 - Insulating medium and its use in high voltage devices: An insulating composition for use in high voltage devices is formed from a soft dielectric casting compound, such as a silicone gel, comprising ferroelectric particles such as barium titanate dispersed within it. Low levels of particles, from 1% to 20% by volume of the insulating composition, are highly effective yet... Agent: Ip Patent Docketing K&l Gates LLP
20110011641 - Junction box for solar modules: The invention relates to a junction box which safely dissipates heat produced by electrical/electronic components assembled in the box. The junction box has a housing with cover and at least one component chamber that juts out from a side wall of the housing. The component chamber has cooling fins. An... Agent: Bohan Mathers01/13/2011 > 38 patent applications in 27 patent subcategories. recently filed with US Patent Office
20110005794 - In-water discharging apparatus: An in-water discharging apparatus is provided. The in-water discharging apparatus can be manufactured with a high voltage electrode (12) formed in one piece with a corresponding electrode (15), thus facilitating installation and enabling the apparatus to be miniaturized.... Agent: Ked & Associates, LLP
20110005795 - Umbilical: An umbilical for use in the offshore production of hydrocarbons comprising an assembly of functional elements wherein at least one of the functional elements comprises an electrical cable, and wherein said electrical cable is enclosed within a tube, said tube being adapted to apply a radial compressive force on the... Agent: Ostrolenk Faber Gerb & Soffen
20110005797 - Device housing and method for making device housing: A method for making a device housing comprises: providing a metal substrate; providing a transparent or translucent film, the film being formed with a pattern coating on one surface thereof; forming a bonding coating on the metal substrate; and heat pressing the film and the metal substrate into a whole... Agent: Altis Law Group, Inc. Attn: Steven Reiss
20110005796 - Housing and method for making the same: A method for making a housing comprising: providing a metal layer, a decorative layer, and an adhesive layer; attaching adhesive layer to the decorative layer to form a preformed soft layer; cutting the preformed soft layer to form a soft layer having a configuration the same as that of the... Agent: Altis Law Group, Inc. Attn: Steven Reiss
20110005798 - Locking mechanism for a cover for a housing of an electronic device: The disclosure relates to a housing for an electronic device. The housing comprises: a back housing defining an interior compartment of the device; a receptacle to receive a first locking feature from a cover for the electronic device; and at least one moveable second locking feature in the receptacle to... Agent: Mccarthy Tetrault (research In Motion Matters)
20110005799 - Dual voltage electrical floor box: An outlet box assembly for separating and insulating higher voltage power conductors from lower voltage data conductors. The assembly includes a housing, a housing divider and a bracket. The housing including at least one vertically extending side wall defining an interior space therein. The housing divider disposed within the housing... Agent: Hoffmann & Baron, LLP
20110005800 - Protective cover: An assembly includes a mud ring and a detachable cover. The mud ring includes a planar surface including slots for mounting the mud ring to a utility box. The mud ring also includes a raised portion comprising side walls and end walls, the raised portion being elevated with respect to... Agent: Snyder, Clark, Lesch And Chung, LLP
20110005828 - Method and terminal device for implementing audio connector interface conversion: A method for implementing audio connector interface conversion is provided in an embodiment of the present invention. The method includes installing a 4-pin jack of an audio connector inside a terminal device, and connecting the power end, signal end, and grounding end of an infrared interface on the terminal service... Agent: Staas & Halsey LLP
20110005801 - Ocean bottom cable and sensor unit: An underwater ocean bottom cable constructed of a series of axially aligned cable segments alternately arranged with sensor units. The sensor units include an outer housing with an interior cavity in which a sensor module is suspended by a cradle. Vanes on the sensor module protrude through axially elongated openings... Agent: Laitram, L.L.C. Legal Department
20110005829 - Method for fabricating a neurostimulation lead contact array: A lead includes a lead body defining a lumen extending through the lead body; a conductor disposed in the lumen; a slit extending from an exterior of the lead body through at least a portion of the lead body to the lumen; and a contact strip. A portion of the... Agent: Boston Scientific Neuromodulation Corp. C/o Frommer Lawrence & Haug LLP
20110005831 - Connection pin and electrical connection: A hookup stem (48; 70) to implement an electric hookup (50; 60) of an electric heater of an injection molding nozzle (30), the hookup stem (48; 70) being designed in a manner that it can be affixed by means of at least one electrically conducting adhesion layer (52; 62; 64;... Agent: Clark & Brody
20110005830 - Connector for establishing an electrical connection with conductive tape: Provided is a connector (200; 700) for establishing an electrical connection with a conductive tape (100). The conductive tape comprises at least a first conducting layer (104) and an insulating layer (102). The connector comprises a first conductive region (204; 710) and a first connection region (712). The first connection... Agent: Philips Intellectual Property & Standards
20110005802 - Toneable conduit with heat treated tone wire: A toneable conduit includes an elongate polymeric tube having a sidewall with an interior surface and an exterior surface. The interior surface defines a main channel for holding communication or power cables. A sub-channel extends longitudinally between the exterior and interior surfaces of the tube. An electrically continuous, toning signal... Agent: Muncy, Geissler, Olds & Lowe, PLLC
20110005804 - Internally serrated insulation for electrical wire and cable: A coaxial cable has a conducting shield covered by a jacket. The jacket defies spaced apart, axially extending voids adjacent to the shield. The voids separate axially extending contact regions of the jacket which extend axially and in contact with the shield. The voids and the contact regions are linked... Agent: Honeywell/husch Patent Services
20110005803 - Wire or cable: A wire or cable comprising a conductor or wire core and a coating layer on the exterior of the conductor or wire core which is formed from a rubber or plastic composition containing a rubber or plastic and an inorganic filler having high moisture resistance is provided. The inorganic filler... Agent: Birch Stewart Kolasch & Birch
20110005805 - Cable: A cable includes an inclusion containing stranded wire conductor that includes a plurality of stranded wires formed by twisting a plurality of conductor wires, and a plurality of thin diameter inclusions having an external diameter thinner than that of each of the stranded wires. The inclusion containing stranded wire conductor... Agent: Foley And Lardner LLP Suite 500
20110005806 - High performance telecommunications cable: A telecommunications cable comprising four twisted pairs of conductors and a separator spline comprised of a principal dividing strip and a first subsidiary dividing strip attached longitudinally along a first side of the principal dividing strip and a second dividing strip attached longitudinally along a second side of the principal... Agent: Lando & Anastasi, LLP
20110005807 - Protective device, particularly for connection element: A protective device includes a mechanical protective sheath (20) and a thermal protective nozzle (30) mounted at one end (21) of the mechanical protective sheath (20), the mechanical protective sheath (20) including a tubular textile structure that is deformable by compression in the longitudinal direction of the mechanical protective sheath... Agent: Young & Thompson
20110005808 - Hybrid conductors and method of making same: Hybrid conductors capable of achieving enhanced conductivity and current capacity over a wide range of frequencies are disclosed. The hybrid conductors may be used in electrical or thermal applications, or combinations of both. One method of fabricating such hybrid conductors includes complexing conductive metal elements (e.g., silver, gold, copper), transition... Agent: Greenberg Traurig, LLP
20110005809 - Insulation spacer for a gas insulated device and method of producing same: An insulation spacer for a gas insulated device includes an insulator disc and an armature extending around an outer periphery of the insulator disc and holding the same. The armature is ring-shaped defining a ring axis and includes two ring base surfaces extending substantially perpendicularly to the ring axis; and... Agent: Buchanan, Ingersoll & Rooney PC
20110005810 - Insulating substrate and method for producing the same: An insulating substrate 1 includes an electrically insulative layer 2, a wiring layer 3 formed on one side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an electrically conductive material powder, and a stress relaxation layer 4 formed on the other side of... Agent: Edwards Angell Palmer & Dodge LLP
20110005811 - Method of manufacturing rigid-flex circuit board, and the rigid-flex circuit board: A method of manufacturing a rigid-flex circuit board includes preparing a first and a second coverlay film (200, 250), and a first and a second circuit substrate (100, 150) having a first and a second circuit (103, 153) formed thereon, and a first interlayer adhesive sheet (300); Stacking the first... Agent: Ditthavong Mori & Steiner, P.C.
20110005812 - Metal foil laminated polyimide resin substrate: the surface of the metal foil to be bonded to the polyimide resin substrate has a surface roughness (Rzjis) of 3.0 μm or less; a surface area ratio (B) of 1.25 to 2.50, in which the surface area ratio (B) is calculated as a ratio [A/6550] of a surface area... Agent: Knobbe Martens Olson & Bear LLP
20110005817 - Capacitor-forming material and printed wiring board provided with capacitor: An object of the present invention is to provide a capacitor-forming material having a stable adhesion between a dielectric layer and an electrode-forming layer. To achieve the object, the capacitor-forming material in which an oxides dielectric layer is provided between a top-electrode-forming layer and a bottom-electrode-forming layer, wherein at least... Agent: Greenblum & Bernstein, P.L.C
20110005814 - Circuit board via structure and method forming the same: A printed circuit board (“PCB”) (100) includes a first routing layer (110), a second routing layer (120) and a via hole structure (150) electrically connecting the two routing layers. The via hole structure (150) includes a connecting hole (158) extending between the first routing layer (110) and the second routing... Agent: Mcdermott Will & Emery LLP
20110005815 - Conductive plate and touch panel including the same: The disclosure discloses a conductive plate includes a substrate and a patterned conductive film bonded to the substrate through an adhesive layer. The patterned conductive film includes a pattern of conductive traces. A touch panel is also disclosed and includes first and second conductive plates, each of which includes a... Agent: Altis Law Group, Inc. Attn: Steven Reiss
20110005816 - Method for making a conductive film exhibiting electric anisotropy, conductive plate and method for making the same: A method for making a conductive film exhibiting electric anisotropy comprises forming a nanomaterial on a substrate, the nanomaterial having a cluster of interconnected nanounits, each of which being substantially transverse to the substrate and having one end bonded to the substrate. The method further includes stretching the nanounits along... Agent: Altis Law Group, Inc. Attn: Steven Reiss
20110005813 - Ribbon connecting electrical components: Articles and methods of manufacture are provided for using laser energy in an automated bonding machine to effect laser welding of ribbons to electronic components, particularly conductive ribbons comprising titanium for microelectronic circuits. Bonding and connection of microelectronic circuits with discrete heating avoids heat damage to peripheral microelectronic components. Bonding... Agent: Harness, Dickey & Pierce, P.L.C
20110005819 - Conductive plate and method for making the same: A method for making a conductive plate comprises providing a conductive film exhibiting electric anisotropy, and bonding the conductive film to a substrate through an adhesive.... Agent: Altis Law Group, Inc. Attn: Steven Reiss
20110005820 - Full perimeter chemical strengthening of substrates: Methods and apparatus for protecting the thin films during chemical and/or thermal edge strengthening treatment. In one embodiment, a portion of each individual sheet is laminated. Pairs of sheets are then sealed together such that the thin film sides face inward to form a thin film sandwich. In some embodiments,... Agent: Apple C/o Mofo La
20110005821 - Method for manufacturing laminated circuit board: iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer... Agent: Ostrolenk Faber Gerb & Soffen
20110005818 - Projected capacitive touch panel and fabricating method thereof: A touch panel and a fabricating method thereof are provided. The touch panel includes: a substrate; a first conductive layer configured on the substrate and having a first and a second portions; an insulating layer covering the first portion; and a second conductive layer having a third portion configured on... Agent: Volpe And Koenig, P.C.
20110005823 - Printed circuit board having electro component and manufacturing method thereof: An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering... Agent: Mcdermott Will & Emery LLP
20110005822 - Structure of a package for electronic devices and method for manufacturing the package: A package structure for an electronic device having an electronic device mounted on a substrate; the electronic device including an external electrode; the substrate including an interconnection and an electrode pad for mounting the electronic device thereon. Part or entire of the interconnection and part or entire of the electrode... Agent: Mr. Jackson Chen
20110005824 - Printed circuit board and method of manufacturing the same: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.... Agent: Blakely Sokoloff Taylor & Zafman LLP
20110005825 - Cable assembly wth emi protection: A cable assembly comprises a housing defining a body portion with a front face, a pair of upper and lower tongue portions respectively extending forwardly from a top and bottom sides of the front face. The housing is configured by a metallic lower cover, a metallic upper cover assembled to... Agent: Wei Te Chung Foxconn International, Inc.
20110005826 - Electric connection box: An electric junction box having a casing and a circuit structure accommodated in the casing. The circuit structure includes a plurality of first bus bars arranged at intervals and synthetic resin members disposed between the adjacent first bus bars and firmly attached to the first bus bars. The synthetic resin... Agent: Oliff & Berridge, PLC
20110005827 - Electronic apparatus: According to one embodiment, an electronic apparatus includes a first case, a second case, a cover, and a securing member. The first case includes an opening, a first through-hole, and a first edge that defines a periphery of the first through-hole. The second case faces the first case and includes... Agent: Blakely Sokoloff Taylor & Zafman LLP01/06/2011 > 16 patent applications in 14 patent subcategories. recently filed with US Patent Office
20110000697 - Gas insulated electric apparatus: A foreign matters trap in which a metallic corrugated plate is arranged in a ground tank so that a line connecting portions of the corrugated plate having the same height is made parallel to a central axis of the ground tank, a metallic round rod is mounted to an corrugated... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20110000698 - Nano-sized ultrathin-film dielectric, process for producing the same and nano-sized ultrathin film dielectric device: A nano-sized ultrathin film dielectric composed mainly of either a single nanosheet of titanium oxide obtained by exfoliating layer titanium oxide or a laminate thereof. Thus, there can be accomplished low-temperature production of a dielectric device that simultaneously realizes high dielectric constant and excellent insulating performance in nanoregions and reduces... Agent: Wenderoth, Lind & Ponack, L.L.P.
20110000699 - Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same: A hermetic interconnect for medical devices is disclosed. In one embodiment, the interconnect includes platinum leads co-fired between alumina substrates to form a monolithic composite that is subsequently bonded into a titanium alloy flange. Both methodology for forming these interconnects as well as specific geometries and compositions are disclosed. Interconnects... Agent: John S. Pratt, Esq Kilpatrick Stockton, LLP
20110000700 - Method of connecting circuit boards and connected structure: A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second... Agent: 3m Innovative Properties Company
20110000701 - Ceramic elements module and manufacturing method thereof: The present invention relates to a ceramic elements module and a manufacturing method thereof. There is provided a ceramic elements module, including: a ceramic elements that has a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat... Agent: Staas & Halsey LLP
20110000702 - Circuit board: e
20110000703 - Carbon nanotube supporting body and process for producing the carbon nanotube supporting body: Disclosed is a CNT nanodevice using small-diameter CNT having a monolayer, two-layer or other structure produced by virtue of strong CNT fastening treatment under high vacuum of an environment having a very low residual hydrocarbon content. Also disclosed are a CNT supporting body such as a CNT holding body necessary... Agent: Quinn Emanuel Urquhart & Sullivan, LLP
20110000705 - Display device substrate, method for manufacturing the same, display device, method for forming multi-layer wiring, and multi-layer wiring substrate: The present invention provides a display device substrate that enables microfabrication of lines and is capable of reducing faulty connection and enhancing the reliability of display devices including the display device substrate, a method for producing the display device substrate, a display device, a method for forming a multilayer wiring... Agent: Birch Stewart Kolasch & Birch
20110000704 - Printed circuit board and method of manufacturing the same: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association
20110000706 - Multilayer wiring substrate: A multilayer wiring substrate includes a center wiring layer arranged in a center of the substrate in a thickness direction, and wiring layers stacked on one side of the center wiring layer and the other side of the center wiring layer via an insulating layer. The wiring layers on one... Agent: Rankin, Hill & Clark LLP
20110000707 - Electronic circuit unit: An electronic circuit unit includes a multi-layer substrate in which high frequency circuits are provided on two different layers and a ground layer is formed between the two layers, and grounding lands connected to peripheral conductive members through connection bars formed on a plurality of layers of the multi-layer substrate.... Agent: Brinks Hofer Gilson & Lione
20110000708 - Wiring substrate and method for manufacturing wiring substrate: [Solution(s)] Aluminum oxide insulative portion 24 is formed on aluminum plate 20 as shown in FIG. 1(A) through anodic oxidation (FIG. 1(C)). Then, holes (nano-holes) (24h) in aluminum oxide 24 are filled with resin 30 (FIG. 1(E)). Accordingly, the rigidity (strength) of insulative portion 24 will be enhanced and cracking... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20110000709 - Junction box for connecting a solar cell, electrical diode, guiding element and fixing means: A junction box for connecting a solar cell to a housing. The junction box includes a diode and an electrical contact formed of a conductive foil strip.... Agent: Barley Snyder, LLC
20110000710 - In-ceiling zone cabling enclosure: An in-ceiling cabling enclosure for supporting communications network equipment and cables interconnecting the network equipment including a front wall, a rear wall, and two side walls extending between the front wall and the rear wall creating a volume inside the enclosure. An access door assembly is pivotally connected to either... Agent: Panduit Corp.
20110000711 - Power supply assembly:
20110000712 - Seal structure, method of forming seal structure, wire body, and electronic apparatus: A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structure 15 for sealing through holes 33,... Agent: Mcdermott Will & Emery LLPPrevious industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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