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Electricity: conductors and insulators September class, title,number 09/10

20100243287 - Microwave cable cooling: A cable cooling apparatus, for dissipating heat generated by a cable, includes a housing disposed on a portion of a cable and defining a fluid-tight cavity therewithin. The housing is configured to cool at least a portion of the cable. The housing also includes one or more inlets, configured to... Agent: Tyco Healthcare Group Lp Attn:IPLegal

20100243288 - High voltage bushing, a method of cooling a conductor thereof, and an electric power distribution system comprising such a bushing: A high voltage bushing including an elongated electric conductor, a tubular insulator surrounding the conductor, and cooling mechanism for cooling the conductor. The cooling mechanism includes at least one cooling element extending along a fraction of the length of the conductor and in thermal connection with the conductor.... Agent: St. Onge Steward Johnston & Reens, LLC

20100243289 - Umbilical: An umbilical for transfer of fluids and electric current/signals between the sea surface and equipment deployed on the sea bed, in particular in deep waters, is disclosed. The umbilical comprises a number of pipes and electric conductors/wires collected in a bundle, a filler material lying at least partly around and... Agent: Birch Stewart Kolasch & Birch

20100243290 - Electric device: A cover (5) includes a first bent portion (5b) and a second bent portion (5c) which are provided in series to be continuous with a lid portion (5a). A casing (2) includes a hole (8) through which the cover is allowed to be inserted/removed and movably inserted into/removed from the... Agent: Frost Brown Todd, LLC

20100243316 - Composite cable: The present invention relates to methods for manufacturing a composite cable, cables resulting from the manufacturing process and use of a composite cable in a well. According to the invention there are several elements to enhance a composite cable, where among a preheating process of conductors before joining them with... Agent: Henry C. Query Jr.

20100243318 - Power supply apparatus for slidable structure: The present invention provides a power supply apparatus for a slidable structure which extends longitudinally, comprising: a pivotably-supported ring arm; a wiring harness having one end portion fixed to a tip portion of the ring arm and the other end portion fixed to a stationary structure; and an elastic member... Agent: Sughrue Mion, PLLC

20100243317 - Power supplying system for a sliding structure: A link arm is rotatably supported by a rotating shaft along a protector base, and urged in a harness-slack-absorbing direction by a torsion coil spring. A wiring harness is fixed to a harness-holding member at a tip end of the link arm and to a harness-fixing portion of the protector... Agent: Sughrue Mion, PLLC

20100243319 - Power supplying system for a sliding structure: A power-supplying system for a sliding structure includes: a protector cover having a base plate and a flange-shaped peripheral wall; a link arm rotatably supported along the base plate in the protector cover, and supporting a wiring harness at a top end side of a rotation; and an elastic member... Agent: Sughrue Mion, PLLC

20100243320 - Collet-type splice and dead end for use with an aluminum conductor composite core reinforced cable: This invention relates to collet-type splices and collet-type dead ends and methods for splicing together two electricity transmission cables or terminating one electricity transmission cable, the cables comprising a composite core surrounded by a conductor. The collet-type fittings use a collet inside a collet housing to hold the composite cores... Agent: March Fischmann & Breyfogle LLP

20100243321 - Motor cable assembly and method of manufacturing cable main body of the same: A motor cable assembly connecting a motor and an inverter includes a cable main body, which can move flexibly. The cable main body is manufactured and formed into a flat shape by arranging a plurality of cables in parallel in a row, covering an outer surface of the arranged cables... Agent: Edwards Angell Palmer & Dodge LLP

20100243322 - Electrical connection terminal: The disclosure concerns an electrical connection assembly comprising: a conductive plate with a drillhole, a first column with a hole passing axially through it and comprising a shoulder to abut against one of the faces of the conductive plate, and a second column with a hole passing axially through it... Agent: Baker & Daniels LLP

20100243291 - High performance communications cables supporting low voltage and wireless fidelity applications providing reduced smoke and flame spread: The present invention provides conductive and/or insulative compositions comprising polymer blends that include olefin and/or fluoropolymer and/or chlorofluoropolymer based resins with and without inorganic additives. These compositions reduce flammability and smoke generation and are used primarily for insulation materials and for high performance communications cables. In addition, support-separators using these... Agent: Guerry Leonard Grune

20100243293 - Cable wiring structure of sliding-type electronic apparatus, and electronic apparatus wiring harness: A cable wiring structure of a sliding-type electronic apparatus is provided which includes a plurality of casings with circuits attached to be movable relatively to each other wherein the circuits within the casings are electrically connected to each other by an electronic apparatus wiring harness. The electronic apparatus wiring harness... Agent: Sughrue Mion, PLLC

20100243292 - Method for fusing insulated wires, and fused wires produced by such method: A method for fusing a pair of insulated wires to one another, and a fused wire made by such method, in which the combined or major diameter of the fused wire equals, or very closely matches, the sum of the diameters of the individual wires prior to fusion. In the... Agent: Baker & Daniels LLP 111 E. Wayne Street

20100243294 - Support device for an electrical harness passing through a structure: A support device for supporting at least one electric harness where it passes through a through hole in a composite material structure, said structure presenting two faces into which said hole opens out, said device comprising a first element made of dielectric material presenting a first bearing surface designed to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100243295 - Nanowire-based transparent conductors and applications thereof: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as... Agent: Seed Intellectual Property Law Group PLLC

20100243296 - Dielectric ceramic composition and electronic component using the same: A dielectric porcelain composition contains a major component represented by a composition formula (BaO.xTiO2). The dielectric porcelain composition contains also contains a first minor component represented by a composition formula raB2O3 and a second minor component represented by a composition formula rbCuO. In the formulae, x is a molar ratio... Agent: Oliff & Berridge, PLC

20100243297 - Printed circuit board and method of manufacturing the same: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace... Agent: Panitch Schwarze Belisario & Nadel LLP

20100243298 - Carbon nanotube based interposer: In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side... Agent: Brooks Kushman P.C. /oracle America/ Sun / Stk

20100243299 - Multilayer printed wiring board: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100243302 - Components having voltage switchable dielectric materials: Various aspects provide for structures and devices to protect against spurious electrical events (e.g., electrostatic discharge). Some embodiments incorporate a voltage switchable dielectric material (VSDM) bridging a gap between two conductive pads. Normally insulating, the VSDM may conduct current from one pad to the other during a spurious electrical event... Agent: Carr & Ferrell LLP

20100243301 - Organic polymer coating for protection against creep corrosion: A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a... Agent: Arthur G. Schaier Carmody & Torrance LLP

20100243300 - Soldering method and related device for improved resistance to brittle fracture: A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The... Agent: Ryan, Mason & Lewis, LLP

20100243303 - Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member: The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate,... Agent: Griffin & Szipl, PC

20100243304 - Solder resist, dry film thereof, cured product, and printed wiring board: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the... Agent: Wenderoth, Lind & Ponack, L.L.P.

20100243305 - Substrate with metal film and method for manufacturing the same: A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100243306 - High rate selective polymer growth on a substrate: Method and systems provide growth of polymer structures at a high rate in a selective manner. In various embodiments, the method or system can expose the growth site to a polymer source and growing a polymer tube at a rate of at least 80 micrometer per hour at the growth... Agent: Lemoine Patent Services, PLLC

20100243307 - Leaded multi-layer ceramic capacitor with low esl and low esr: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates... Agent: Nexsen Pruet, LLC

20100243308 - Semiconductor memory module and electronic component socket for coupling with the same: The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a... Agent: Kile Goekjian Reed & Mcmanus PLLC

20100243309 - Connecting structure for circuit board and connecting method using the same: Disclosed is a connection structure for a circuit board using a solder bump to arrange circuit boards. The circuit board connection structure includes a solder bump prepared on one of two circuit boards and a perforated part formed at the other of the circuit boards to receive the solder bump.... Agent: Harness, Dickey & Pierce, P.L.C

20100243310 - Printed circuit board: A printed circuit board (PCB) includes a power layer, a ground layer, a through hole, and a conductor. The through hole goes through the power layer and the ground layer. The conductor includes a hollow columnar main body and an extending portion. The main body is formed in a bounding... Agent: Altis Law Group, Inc. Attn: Steven Reiss

20100243311 - Substrate with metal film and method for manufacturing the same: A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100243312 - Equipment container retention and bonding system and method: An equipment container retention and bonding system including a dagger pin block assembly that includes a mounting dagger pin and a bonding member formed of a compressive electrically conductive material that is retained on a surface of the dagger pin block assembly wherein the bonding member is compressed between the... Agent: Burr & Brown

20100243313 - Magnetic composite, method for producing the same, and shielding structure: The present invention provides a magnetic composite capable of enhancing the effect of shielding against electromagnetic noise and the like (magnetic shielding effect) while inhibiting a possible eddy current, and a method for producing the magnetic composite, and a shielding structure comprising the magnetic composite. A shielding member 10 as... Agent: Foley & Lardner LLP

20100243314 - Data transfer hinge: A data transfer hinge is disclosed. Embodiments of the present invention provide a door hinge that facilitates transmission of data from LAN wiring in a building through a door frame to a door mounted device. Power and ground connections can also pass through the hinge. Channels run in each leaf... Agent: Moore & Van Allen PLLC

20100243315 - Removable knockout plate for enclosures: The present invention relates generally to panels or enclosures. More particularly, the invention encompasses a removable knockout plate for enclosures. The present invention is also directed to a novel electrical panel or enclosure where at least a portion of at least one removable plate or panel is removably attached to... Agent: Siemens Corporation Intellectual Property Department

20100236808 - Lightning protection device: wet/dry field sensitive air terminal: A lightning protection device having a grounded Franklin rod and a conductive device attached to the rod and defining a predetermined overall shape of a predetermined size therearound. The lightning protection device is particularly devised to limit the amount of corona discharges under the ambient ground fields associated with lightning... Agent: Goudreau Gage Dubuc

20100236809 - Ergonomic bed locator: A locator can comprise a protective cover and a plurality of service outlets. The protective cover can be configured to be mounted on a wall. The protective cover can include a lower edge. The lower edge can be positioned at a height of less than about 10 inches above a... Agent: Hill-rom Services, Inc.

20100236826 - Protector for wire harness: A protector for a wire harness has a U-shaped main body casing for receiving a wire harness and a lid for closing an opening in the main body casing. The main body casing has opposite longitudinal ends with inlet and outlet portions for passing the wire harness. The inlet and... Agent: Hespos & Porco LLP

20100236827 - Wiring harness and method of forming a wiring harness: A protective tape (20) is composed of a three-layer base material (21) formed by bonding two knitted fabrics (22) by a glue (23) applied in dots, and an adhesive layer (24) formed on the underside of the base material (21). The base material (21) distributes an external load to the... Agent: Hespos & Porco LLP

20100236810 - Shielded cable: A shielded cable includes an inner conductor, a first insulator, a first outer conductor, a second insulator, and a second outer conductor, which are coaxially disposed in this order from an inner side, and has an outer circumference coated by an insulation sheath.... Agent: Wolf Greenfield & Sacks, P.C.

20100236811 - Electrical cable having crosslinked insulation with internal pulling lubricant: Electrical power cable having a reduced surface coefficient of friction and required installation pulling force, and the method of manufacture thereof, in which the central conductor core, with or without a separate insulating layer, is surrounded by a sheath of crosslinked polyethylene. A high viscosity, high molecular weight silicone based... Agent: Gardere Wynne Sewell LLP Intellectual Property Section

20100236813 - Alien crosstalk suppression with enhanced patch cord: Systems and methods for decreasing alien crosstalk use enhanced patch cords for introducing additional attenuation. The enhanced patch cords are preferably shielded to reduce alien crosstalk down their lengths and also attenuate signals passing therethrough to a greater extent than standard communication patch cords. The interaction of two enhanced patch... Agent: Panduit Corp.

20100236812 - Lan cable and method for making the same: A cable has at least a first layer of twisted pairs, having a combination of unshielded twisted pairs, and shielded twisted pairs as well as a second layer of twisted pairs, also having a combination of unshielded twisted pairs, and shielded twisted pairs.... Agent: Sofer & Haroun LLP.

20100236814 - High-frequency digital a/v cable: In high-frequency digital A/V cable having high-frequency signal line sets and low-frequency signal lines arranged in a parallel array, a metal shielding layer is set within an isolation layer inside the outer plastic sheath to surround the two high-frequency signal lines of each high-frequency signal line set for EMI protection,... Agent: Sure-fire Electrical Corporation

20100236815 - Planar contact with solder: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20100236816 - Insulator for electrified elements: An insulator member comprises a set of passages (2) (4) which, without intercrossing, extend through the main body (1a) of the insulator member. This set of passages (2) (4) includes an insulating passage (2) structurally arranged to be engaged by filiform elements (10) and an elongated anchor passage (4) structurally... Agent: Amin Talati, LLC

20100236818 - Circuit board with esd protection and electronic device using same: A circuit board includes a signal layer and a power supply layer. The signal layer includes a first surface and a second surface opposite to the first surface. A number of pads are formed on the first surface for connecting to an electronic component. The power supply layer is formed... Agent: Altis Law Group, Inc. Attn: Steven Reiss

20100236817 - Package substrate with a cavity, semiconductor package and fabrication method thereof: A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby... Agent: North America Intellectual Property Corporation

20100236819 - Printed circuit board and method for making the same: A method for making a printed circuit board includes: (a) preparing a laminate having a ceramic substrate, first and second metal foils disposed on two opposite surfaces of the ceramic substrate, and a through hole extending through the ceramic substrate and the first and second metal foils; (b) filling the... Agent: Occhiuti Rohlicek & Tsao, LLP

20100236820 - Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same: A prepreg, and a metal clad laminate and printed wiring board including the prepreg. The prepreg includes a substrate and a liquid crystal polymer resin impregnated into the substrate, and has a surface roughness in a range of 0.1 to 5.0 μm on one or both surfaces thereof.... Agent: Nixon Peabody LLP

20100236821 - Electronic component-embedded printed circuit board: Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic... Agent: Blakely Sokoloff Taylor & Zafman LLP

20100236822 - Wiring board and method for manufacturing the same: A wiring board is formed with a substrate, conductive patterns laminated in the thickness direction of the substrate, multiple pads having a predetermined pitch and formed on the same layer as the conductive patterns, a conductive bonding layer arranged on each of the multiple pads, and an electronic component having... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100236823 - Ring of power via: Systems and methods for providing plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH... Agent: Marsh Fischmann & Breyfogle LLP (oracle Formerly D/b/a Sun Microsystems)

20100236824 - Smart wall box: A building automation system is provided and includes a wall box of a building, a control device configured to be mounted on the wall box, the control device including a micro controller and a memory, the memory having executable instructions stored thereon, which, when executed, cause the micro controller to... Agent: Cantor Colburn, LLP

20100236825 - Assemble structure of connection device and electric device, connection device and electric device used for the same: An assemble structure includes: a connection device including a support element on one side of an attachment surface, a first connector on the attachment surface, and a key groove on a support surface of the support element; and the electric device including a casing to be attached to the attachment... Agent: Harness, Dickey & Pierce, P.L.C

20100230125 - Land electrode: A return path between a first HVDC station and a second HVDC station. A first electrode is connected to the first station and a second electrode is connected to the second station. The return path includes a first part including a first low resistive zone through the crust of the... Agent: Venable LLP

20100230126 - Arrangement for current limiting: An arrangement for current limiting is specified, using components (4, 5, 6) composed of a superconducting material which are arranged in a cryostat (KR) which comprises two metallic tubes (1, 2) which are arranged concentrically with respect to one another and between which vacuum insulation (3) is fitted, and which... Agent: Sofer & Haroun LLP.

20100230127 - Conduit box: A conduit box includes a first rear wall and a second rear wall spaced apart form the first rear wall to form a stair-stepped rear wall of the conduit box. The conduit box also includes a top wall, bottom wall, a first sidewall, and a second sidewall. The top and... Agent: Barnes & Thornburg LLP

20100230128 - Drain structure of electric connection box: Drain structure of an electric connection box is provided that is capable of preventing penetration of water with simplicity. According to the drain structure of the electric connection box, since a pair of engaging leg portions of a waterproof lid is engaged in a peripheral part of a communication hole... Agent: Turocy & Watson, LLP

20100230158 - Acid anhydride-introduced polymer, polymer composition, covered electric wire, and wiring harness: An acid anhydride-introduced polymer and a polymer composition that have improved material properties including mechanical properties when used along with fillers. In the acid anhydride-introduced polymer, a side chain is grafted onto a polymer main chain, and an acid anhydride structure is introduced into the grafted side chain through an... Agent: Oliff & Berridge, PLC

20100230157 - Method of covering wire harness branch section with protector and branch structure of wire harness: A protector includes a main body and a cover, which are a pair of T-shaped semi-annular sections formed by halving a T-shaped cylindrical body, and thin hinges connecting the main body and the cover. A setting jig is provided with a main body receiver including a main body receiving recess... Agent: Greenblum & Bernstein, P.L.C

20100230159 - Signal transfer apparatus: A signal transfer apparatus includes a plurality of input connectors to which a plurality of signals are input from a first electronic device; and a single output connector which is connected to the plurality of input connectors and transfers the plurality of signals to a second electronic device. The length... Agent: Sughrue Mion, PLLC

20100230160 - Crimp terminal, terminal-provided wire, and manufacturing method thereof: Provided is a technique of enabling high-compression crimping without breaking a crimp terminal while forming a recessed portion promoting a wire crimp portion of the crimp terminal to cut into a conductor in the wire crimp portion. The crimp terminal according to the invention includes a wire crimp portion, which... Agent: Oliff & Berridge, PLC

20100230161 - Joint structure between a wound coil and an ic-chip for a noncontact rfid device and methods of manufacturing the same: The present invention aims to provide such a joint structure of a wound coil 1 and an IC chip 2 for a noncontact RFID device that is able to yield electrically and mechanically excellent connection, employing the wound coil 1, which is made by winding copper electric wire, with small... Agent: Wenderoth, Lind & Ponack, L.L.P.

20100230162 - Extruded frame structures to house a conductor: Embodiments of the present disclosure provide extruded frame structures to house a conductor and associated techniques and configurations. An apparatus includes an extruded frame structure having a frame profile configured to house a conductor and insulator. Other embodiments may be described and/or claimed.... Agent: Schwabe Williamson & Wyatt Pacwest Center, Suite 1900

20100230129 - Symmetrical data cable for communications and data technology: The invention relates to a symmetrical data cable (1) for communications and data technology, comprising at least one symmetrical line pair (3) and a cable sheath (2), wherein the line pairs (3) are individually each encapsulated by a ferrite-filled and/or ferrite-coated material.... Agent: Merchant & Gould PC

20100230130 - Foam coaxial cable and method for manufacturing the same: A foam coaxial cable includes a central conductor; an inner skin layer surrounding the central conductor coaxially; an insulation layer surrounding the inner skin layer coaxially and made of polyethylene resin containing a plurality of foam cells uniformly formed therein; wherein the inner skin layer is made of polyolefin resin... Agent: Sherr & Vaughn, PLLC

20100230131 - Polyolefin-based high dielectric strength (hds) nanocomposites, compositions therefor, and related methods: The present invention is a cable having (a) one or more electrical conductors or a core of one or more electrical conductors and (b) each conductor or core being surrounded by a layer of insulation. The insulation layer is prepared from a composition comprising a polyolefin and a 3-dimensional, cage-structured... Agent: The Dow Chemical Company

20100230132 - Non-metallic, integrated sensor-interconnect device, manufacturing process, and related applications: Exemplary embodiments provide materials, devices and arrays of integrated sensor assembly, as well as methods for forming and using such devices and arrays in sensing systems. In one embodiment, the integrated sensor assembly can include an interconnecting member and at least one sensor member connected with the interconnecting member at... Agent: Mh2 Technology Law Group, LLP (cust. No. W/xerox)

20100230134 - Method of manufacturing electrical cable, and resulting product, with reduced required installation pulling force: Disclosed is type THHN cable having a reduced surface coefficient of friction, and the method of manufacture thereof, in which the central conductor core and insulating layer are surrounded by a nylon sheath. A high viscosity, high molecular weight silicone based pulling lubricant for THHN cable, or alternatively, erucamide or... Agent: Gardere Wynne Sewell LLP Intellectual Property Section

20100230133 - Multilayer insulated electric wire: A multilayer insulated electric wire includes a conductor and three or more insulating layers covering the conductor. In the multilayer insulated electric wire, the outermost layer (A) of the insulating layers includes a coating layer formed of a resin composition of a polyamide resin containing copper iodide, and the innermost... Agent: Kubotera & Associates, LLC

20100230135 - Additive disk drive suspension manufacturing using tie layers for vias and product thereof: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such... Agent: Intellectual Property Law Office Of Joel Voelzke

20100230137 - Method for manufacturing conductive pattern forming body: A method for manufacturing a conductive pattern capable of forming a highly precise pattern, also capable of forming by using a simple process, and being free from problems such as treatment of waste fluids. The method for manufacturing a conductive pattern forming body includes a process of preparing a pattern... Agent: Ladas & Parry LLP

20100230136 - Method for producing resist pattern: (1) forming a resist film, and exposing the formed resist film, and the like to form a patterned resist film by n cycles to obtain a resist pattern, wherein the resist film exposed in the step (1) in at least one cycle of the n cycles of the process of... Agent: Sughrue Mion, PLLC

20100230138 - Wiring board: A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity... Agent: Mcdermott Will & Emery LLP

20100230139 - Printed circuit boards by massive parallel assembly: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern. A circuit substrate, has a desired circuit pattern on a substrate,... Agent: Marger Johnson & Mccollom/parc

20100230140 - Rigid-flex printed circuit board module, and manufacturing method and processing method therefor: A rigid-flex printed circuit board module includes a non-working zone and a working zone. The non-working zone defines a receiving space. The working zone is disposed in the receiving space, and is connected to the non-working zone through a plurality of interconnecting zones. The interconnecting zones are flexible regions having... Agent: Foley And Lardner LLP Suite 500

20100230143 - Electrical interconnect structure: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure,... Agent: Schmeiser, Olsen & Watts

20100230142 - Method for manufacturing printed wiring board: Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one... Agent: Knobbe Martens Olson & Bear LLP

20100230141 - Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to... Agent: Drinker Biddle & Reath (dc)

20100230146 - Circuit layer comprising cnts and method of manufacturing the same: Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.... Agent: Blakely Sokoloff Taylor & Zafman LLP

20100230144 - Disk drive suspension via formation using a tie layer and product: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding... Agent: Intellectual Property Law Office Of Joel Voelzke

20100230145 - Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.... Agent: Foley & Lardner LLP

20100230147 - Layered electronic circuit device: Provided is a layered electronic circuit device capable of realizing high-density/high-function mounting, easily inspecting and repairing the respective constituent elements, and improving the electronic connection characteristic. The layered electronic circuit device includes a first circuit substrate (101) and a second circuit substrate (102) which are arranged in parallel such that... Agent: Steptoe & Johnson LLP

20100230148 - Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor element: To provide a substrate for mounting a semiconductor element, in which fine-pitch wiring layers are formed to allow a semiconductor element to be mounted, while heat generated in the semiconductor element will not result in a decrease in reliability. Semiconductor-element mounting substrate sandwiches low-thermal-expansion substrate with upper interlayer resin layer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100230151 - Circuit layout and method and device for producing a circuit pattern on a substrate: A circuit layout having a substrate with at least one electronic component, wherein contacts of the electronic component are electrically connected to contacting regions of a conductor strip. Furthermore, a method for producing a circuit pattern is provided, whereby at least one conductor strip is attached onto at least one... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20100230149 - Glass flux assisted sintering of chemical solution deposited thin dielectric films: A method of making dense dielectrics layers via chemical solution deposition by adding inorganic glass fluxed material to high dielectric constant compositions, depositing the resultant mixture onto a substrate and annealing the substrate at temperatures between the softening point of the inorganic glass flux and the melting point of the... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20100230152 - Method of soldering electronic component, and electronic component: A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member... Agent: Arent Fox LLP

20100230150 - Motherboard: A motherboard includes a mounting area, a plurality of first mounting holes, and a plurality of second mounting holes. The mounting area is configured to support an electronic component. The plurality of first mounting holes is defined in the motherboard around the mounting area to bound a first area, and... Agent: Altis Law Group, Inc. Attn: Steven Reiss

20100230153 - Electronic circuit board and electronic circuit board sheild method and construction: The present invention has the object of providing a technology that can facilitate inexpensive shields of individual electronic components with good heat exchange efficiency, the electronic circuit board according to the present invention being provided with: a plurality of conductor parts in a standing state that can extend and contract... Agent: Mcginn Intellectual Property Law Group, PLLC

20100230154 - Printed matter and its manufacturing method, and electromagnetic shielding material and its manufacturing method: Intended is to provide an electromagnetic shielding material having a conductive layer pattern by transferring a conductive composite to a transparent base material, and an electromagnetic shielding material having a metal layer formed on the transferred conductive layer. The electromagnetic shielding material is free from the troubles such as the... Agent: Posz Law Group, PLC

20100230155 - Apparatus comprising an electronics module and method of assembling apparatus: An apparatus comprising: a substrate; an electronics module mounted on the substrate; and an injection molded layer in contact with the substrate; wherein the substrate and the injection molded layer form a portion of a rigid housing.... Agent: Nokia, Inc.

20100230156 - Packaging device for an electronic element and method for making the same: A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an... Agent: Occhiuti Rohlicek & Tsao, LLP

20100224385 - Apparatus, method, and system for grounding support structures using an integrated grounding electrode: Disclosed herein are apparatus, methods, and systems for grounding outdoor light poles, as well as other structures, which may be exposed to lightning or other adverse electrical effects and may require a low impedance path to ground. Inventive aspects include a combination of apparatus integral to the pole or other... Agent: Mckee, Voorhees & Sease, P.L.C

20100224386 - Electronic parts: The present invention is relates to an electronic part. The electronic part of the present invention has an external appearance defined by a case 20. The case 20 is formed with a through-hole 22 for allowing an internal space of the case to communicate with the outside, and a terminal... Agent: Birch Stewart Kolasch & Birch

20100224387 - Case cable management: The case cable management has a shell, a circuit board, multiple sockets and a cover. The shell has a bottom board and a sidewall. The circuit board is attached securely to the bottom board of the shell. The sockets are mounted through the sidewall of the shell and have multiple... Agent: Posz Law Group, PLC

20100224406 - Insulated electric wire: There is provided a insulated electric wire with an electric conductor on which at least a lubricating layer is formed, in which a lubricant is added to the lubricating layer so that granular bodies, with sizes of 5 nm to 3 μm, which are formed by coagulation of the lubricant... Agent: Antonelli, Terry, Stout & Kraus, LLP

20100224405 - System and method for using magnets for protecting towed marine seismic equipment from shark bite: A system comprises marine seismic equipment adapted for towing through a body of water and at least one magnet attached to the marine seismic equipment. A method comprises towing marine seismic equipment having at least one magnet attached thereto.... Agent: Petroleum Geo-services, Inc.

20100224407 - Observation port or membrane to assist the proper positioning of a cable accessory on a cable: A splice comprising a hollow receptacle housing with a first connector end and a second connector end, where a first observation port is in the first end and a second observation port is in the second end. The splice covers the exposed sections of two cables and the device that... Agent: King & Spalding, LLP

20100224388 - Cable protection system with photoluminescent indicia and related methods: A cable protector may include a base member, at least one channel extending between opposing ends of the base member and structured to house at least one cable, and at least one indicia member positioned on the cable protector so as to be visible. The indicia member includes a photoluminescent... Agent: Holland & Hart

20100224389 - Method and apparatus for manufacturing mosaic tape for use in communication cable: Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape... Agent: Panduit Corp.

20100224390 - Multilayer structure, electrode for electrical curcuit using the same, and method for producing the same: A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film wherein difference of internal stress between the transparent conductive thin film and the molybdenum metal thin film is 1600 MPa or less.... Agent: Millen, White, Zelano & Branigan, P.C.

20100224393 - Display device: A display device with signal lines formed on a substrate and an organic insulation film which covers the signal lines and is formed over an upper layer side of the substrate, the display device further includes a terminal portion on which a conductive film is formed in a state that... Agent: Juan Carlos A. Marquez C/o Stites & Harbison PLLC

20100224392 - Line pattern formation method: A line pattern is formed on a substrate by performing a first step and a second step. In the first step, a liquid material containing a pattern formation material dispersed or dissolved therein is dropped onto the substrate and dried. In the second step, the liquid material is dropped onto... Agent: Akerman Senterfitt

20100224391 - Suspension board with circuit and production method thereof: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion... Agent: Akerman Senterfitt

20100224394 - Module substrate and production method: A module substrate includes a multilayer substrate that includes a plurality of layers, a bottommost of the layers being a ceramic layer. Solderable contacts, which include fired pads composed of a conductive paste, are applied to the bottommost ceramic layer. A covering layer overlies the pads. The covering layer covers... Agent: Slater & Matsil, L.L.P.

20100224396 - Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component: A high-reliability ceramic composite multilayer substrate that has excellent flatness and few remaining pores, can be produced at a low cost while simplifying the manufacturing process, and can eliminate layer separation or separation from a mother board. The ceramic composite multilayer substrate includes a laminate containing a first ceramic layer... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20100224395 - Multilayer wiring board and its manufacturing method: A multilayer wiring board includes a first wiring and a second wiring which are provided on both surfaces of an insulating board, a conductor passing through the insulating board for electrically connecting the first wiring to the second wiring, and an anchoring conductor passing through the insulating board. The anchoring... Agent: Wenderoth, Lind & Ponack L.L.P.

20100224398 - Mounting structure: In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the... Agent: Hamre, Schumann, Mueller & Larson P.C.

20100224397 - Wiring board and method for manufacturing the same: A wiring board has a substrate with an opening section, an electronic component having an electrode and arranged in the opening section, insulative material filled in the gaps between the substrate and the electronic component in the opening section, and a first conductive layer formed on the insulative material and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100224399 - Electromagnetic wave shielding heat-radiation sheet and manufactured method thereof: Disclosed is an electromagnetic wave shielding heat-radiation sheet allowing electricity and heat to be transferred from one side surface to the other side surface of the sheet, in which conductive protrusions formed by partially cutting a conductive layer laminated on an elastic support layer are bent toward the rear surface... Agent: Sughrue Mion, PLLC

20100224400 - Overlap helical conductive spring: A cross-diametric compression spring includes a conductive ribbon formed into an overlapping helical coil wherein adjacent loops of the conductive ribbon overlap. The conductive ribbon has a width extending substantially parallel to length of the overlapping helical coil.... Agent: Larson Newman & Abel, LLP

20100224401 - Methods and apparatus for shielding circuitry from interference: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam.... Agent: Kramer Levin Naftalis & Frankel LLP

20100224402 - Electromagnetic shielding article: A shielding article includes a polymeric conductive layer and a protective layer disposed adjacent the polymeric conductive layer. The polymeric conductive layer provides electromagnetic shielding characteristics so as to prevent receipt of data from a radio frequency information component by an external device when the component is located between the... Agent: 3m Innovative Properties Company

20100224403 - Power storage apparatus: A power storage apparatus includes a power storage module having a plurality of power storage elements which are aligned in one direction; a device placed adjacently to the power storage module in the direction of the alignment of the power storage elements; a high-voltage cable used in charge and discharge... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20100224404 - Dual access luminaire junction box: A recessed fixture having a junction box positioned adjacent at least one ceiling support structure comprises a recessed luminaire fixture, the junction box mounted to the recessed luminaire frame, the junction box being horizontally oriented, the junction box having a first facing junction box door and a second junction box... Agent: Philips Intellectual Property & Standards

20100218988 - Wildlife flashover preventer for high voltage electrical transmission structures: A conventional grounded steel tower, or other structure, supports multiple wires (e.g., 6) carrying multi-phase high voltage electricity (e.g., >100 kV). Each wire is supported by a ceramic insulator connected to a horizontal arm of the structure, where an angled strut helps support the arm. There are usually three tiers... Agent: Patent Law Group LLP

20100218968 - Paste extruded insulator with air channels: The invention provides an insulated wire having a conductor and an insulator of paste extruded PTFE fine powder around the conductor. The paste extruded insulator has at least one closed continuous longitudinal air channel spaced apart from the conductor. The invention further provides a process for forming an insulator around... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20100218969 - Adjustable plaster ring cover: A power distribution system has an electrical box configured to attach a power cable, a plaster ring releasably mounted to the box and one or more electrical devices installed. A pre-wired ground extends from a first end physically and electrically connected to a ground terminal on the electrical device. The... Agent: Knobbe Martens Olson & Bear LLP

20100218990 - Ground strap for motor vehicles: The invention relates to a ground cable for motor vehicles, the ground cable being located between a vehicle body 4 having electrical ground reference potential and a vehicle attachment part 6, which is electrically insulated against the body. Flexible and virtually trouble-free contact is rendered possible by virtue of the... Agent: Sunstein Kann Murphy & Timbers LLP

20100218991 - Cord seal for swimming pool and spa light niches: Provided is a cord seal for use in an underwater niche that comprises a seal cap and a main seal having a front side and a rear side and the main seal further includes a plurality of apertures that extend from the front side to the rear side. The cord... Agent: Greenberg Traurig (phx)

20100218992 - Moisture proof telescoping coupler assembly for electric metal tubes with enhanced grounding, sealing, and continuity: A moisture proof, telescoping coupler assembly for electric metal tubes and threaded rigid pipe with an enhanced grounding arrangement both internally and externally for electrically grounding and bonding the telescoping tube to the coupler body and improved continuity. A high conductivity metal plating on an internal cantered spring improves continuity... Agent: Paul A. Fattibene Fattibene & Fattibene

20100218970 - Cable: A cable includes an insulated electric wire, a lateral winding layer formed by spirally winding an elemental wire having conductivity on a periphery of the insulated electric wire, a reversal lateral winding layer formed by spirally winding an elemental wire having conductivity in a direction intersecting with the winding direction... Agent: Mcginn Intellectual Property Law Group, PLLC

20100218971 - Foldable electric cord and electrical connecting device using the same: A foldable electric cord includes a flexible insulated strap, a wire in the flexible strap. The flexible strap includes at least one first fixing member and at least one second fixing member formed thereon. The first fixing member may be fixed to the second fixing member, to fold the flexible... Agent: PCe Industry, Inc. Att. Steven Reiss

20100218972 - Insulated electric wire: An insulated electric wire is composed of a conductor, and a lubricating layer containing a lubricant. The lubricating layer is formed around the perimeter of the conductor. The lubricating layer is not less than 0.06 and not more than 0.12 in an absorbance ratio A1/A2 expressed by an absorbance A1... Agent: Scully Scott Murphy & Presser, PC

20100218973 - Separator for communication cable with geometric features: A separator for a communication cable that has a body including at least one segment adapted to define at least first and second quadrants in the communication cable for separating wires. The at least one segment has at least one part with a first width. The at least one segment... Agent: Blank Rome LLP

20100218974 - Multi-layer insulated conductor with crosslinked outer layer: An insulated conductor and method for making it are disclosed. The insulated conductor includes an elongate conductor and a two-layer insulation system. The two-layer insulation system has a first insulating layer including an aromatic thermoplastic material adjacent with the elongate conductor. The first insulating layer has a thickness along its... Agent: Tyco Electronics Corporation

20100218975 - Multi-layer insulated conductor with crosslinked outer layer: An insulated conductor and method for making it are provided. The insulated conductor includes an elongate conductor and an insulation system, the insulation system having an extruded inner insulating layer including an aromatic thermoplastic material adjacent the elongate conductor, an extruded intermediate layer adjacent the inner insulating layer, and an... Agent: Tyco Electronics Corporation

20100218976 - Protector for wire harness and method for fixing protector to wire harness: A wire harness includes a main line and branch lines. A protector has longitudinal ends with main line inlet and outlet ports and branch line ports between the ends. Branch line connectors are connected to the branch lines drawn out of the branch line ports. A main line connector is... Agent: Hespos & Porco LLP

20100218979 - Conductivity enhanced transparent conductive film and method of making the same: Disclosed herein is a method of fabricating a transparent conductive film, including preparing a carbon nanotube composite composition by blending a carbon nanotube in a solvent; coating the carbon nanotube composite composition on a base substrate to form a carbon nanotube composite film, and acid-treating the carbon nanotube composite film... Agent: Summa, Additon & Ashe, P.A.

20100218978 - Method of making an electrical circuit: A layer of transparent conductive material is disposed on a surface of a substrate. Further layers of conductive material are deposited on the layer of transparent conductive material or on an opposite surface of the substrate. The layers are selectively etched to yield a layout of pads for mounting electrical... Agent: Barnes & Thornburg LLP

20100218977 - Packaged device and producing method thereof: A packaged device includes a device substrate and a packaging unit. The device substrate includes a first surface and a device formed in the device substrate. The packaging unit includes an insulating layer which faces the device substrate. The insulating layer includes a second surface bonded to the first surface.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20100218982 - Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board: It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this... Agent: Greenblum & Bernstein, P.L.C

20100218983 - Method for manufacturing printed wiring board and printed wiring board: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100218980 - Printed wiring board: A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100218981 - Solar cell lead, method of manufacturing the same, and solar cell using the same: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating... Agent: Mcginn Intellectual Property Law Group, PLLC

20100218984 - Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board: The foregoing object can be achieved by using a multi-layer photosensitive dry film resist comprising at least: a first photosensitive layer which essentially includes a binder polymer (A1), a (meth)acrylic compound (B1), a photoreaction initiator (C1), and a flame retardant (D1), and a second photosensitive layer which essentially includes a... Agent: Kagan Binder, PLLC

20100218985 - Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board: An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on... Agent: Posz Law Group, PLC

20100218986 - Method for manufacturing printed wiring board and printed wiring board: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20100218987 - Thermoformed emi shield: Systems and methods for minimizing the transmission and reception of electromagnetic interference (“EMI”) are provided. A member having first and second sides and at least one edge can be formed to correspond to the interior of an enclosure. At least one aperture can penetrate the member from the first side... Agent: Hewlett-packard Company Intellectual Property Administration

20100218989 - Connector module for a door actuator: A door operator with at least one base element, a first and a second front element and two lateral elements, the base, front, and lateral elements being interconnected and at least one of the elements being configured with a breakthrough for the passage of electrical connecting elements. At least one... Agent: Cohen, Pontani, Lieberman & Pavane LLP