|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators April category listing, related patent applications 04/10Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 04/29/2010 > patent applications in patent subcategories. category listing, related patent applications
20100101835 - Apparatus for a connection point between two electrical high-voltage cables: An apparatus is provided for a connection point between a paper-insulated electrical high-voltage cable, which is impregnated with an insulating medium which can flow, and a plastic-insulated electrical high-voltage cable, in which an end termination, which is surrounded by a pressure-resistant partition isolator (12), is provided at the end of... Agent: Sofer & Haroun LLP.
20100101817 - Connecting box for field device: A connecting box is provided for a field device. To simplify installation even in the case of physically small devices, a connecting terminal of the connecting box is arranged in a cover of the connecting box so that when the cover is closed, the connecting terminal is contact-connectd to a... Agent: Buchanan, Ingersoll & Rooney PC
20100101818 - Hybrid electrical cover plate: An electrical plate is disclosed that is configured to mate a rectangular electrical box and a circular electrical box, wherein the electrical plate has a profile that covers both the rectangular electrical box and the circular electrical box. The electrical plate includes holes pattered to mate with the holes in... Agent: Pillsbury Winthrop Shaw Pittman, LLP
20100101819 - Protector for wire harness: A first coupling of a first protector includes a U-shaped inner wall section and a cover. The inner wall section has an inner bottom wall and opposed inner side walls. The cover extends from outer surfaces of the inner bottom wall and opposed inner side walls of the inner wall... Agent: Casella & Hespos
20100101858 - Conductive fiber connecting method and structure: A method and a structure of electrically connecting a conductive fiber in fabric to an external device electrically connects the conductive fiber to the external device by pressing a conductive member that is electrically connected to the external device against the fabric.... Agent: Greenblum & Bernstein, P.L.C
20100101859 - Conductive connector for electronic components: A conductive connector for electrically connecting electronic components comprises a first conductive body and a second conductive body. At least one protrusion is defined in the second conductive body. The first conductive body and the second conductive body are joined together. The at least one protrusion abuts the first conductive... Agent: PCe Industry, Inc. Att. Steven Reiss
20100101820 - Cable management accessories: A vertical cable manager includes a base, an interconnected double-spine assembly topped by a top frame, and a pair of doors. The double-spine assembly is supported by the base. Each door is removably coupled at each lower corner to the base and at each upper corner to the top frame,... Agent: Tillman Wright, PLLC
20100101821 - Metal-clad cable with foraminous coded label: A metal-clad cable having a plurality of spaced apart labels. The labels have coded information about the cable and are conductive and/or include a plurality of openings so as to assure conductivity between an outer sheath of the metal-clad cable and a terminating assembly connector member coupled thereto.... Agent: Gardere Wynne Sewell LLP Intellectual Property Section
20100101823 - Cable insulation with reduced electrical treeing: Treeing is suppressed in cables through the use of an insulation layer that comprises a polyolefin polymer and an additive with delocalized electron structure. The additive can be a carotenoid, carotenoid analog, a carotenoid derivative, a conducting polymer or a combination of two or more such materials.... Agent: Whyte Hirschboeck Dudek S.c./dow Intellectual Property Department
20100101824 - Polybutylene naphthalate-based resin composition and electric cable using polybutylene naphthalate-based resin composition: A polybutylene naphthalate-based resin composition contains, relative to (A) 100 parts by wt of polybutylene naphthalate resin, (B) 40-150 parts by wt of polyester block copolymer, (C) 0.5-5 parts by wt of hydrolysis retarder, and (D) 0.5-5 parts by wt of inorganic multiporous filler.... Agent: Foley And Lardner LLP Suite 500
20100101822 - Stress/thermal cracking resistant cable sheath material: A composition useful as a wire or cable insulation or sheathing layer, the composition comprising (i) an inorganic flame retardant, e.g., aluminum trihydroxide (ATH), (ii) ethylene ethyl acetate (EEA) or ethylene butyl acrylate (EBA), (iii) a homogeneous polyethylene, (iv) an ethylenic resin modified with an organo-functional group, e.g., maleic anhydride... Agent: Whyte Hirschboeck Dudek S.c./dow Intellectual Property Department
20100101826 - Communication cable with variable lay length: Communication cables are provided in which a core lay length of the cable varies along the cable length. The cable may be provided with different segments that have different core lay lengths. It is desirable for neighboring core lay lengths in a cable to differ by a factor of two,... Agent: Panduit Corp.
20100101825 - Thermally tuned coaxial cable for microwave antennas: A coaxial cable, including an inner conductor and an outer conductor surrounding the inner conductor and a thermally responsive material positioned between the outer conductor and the inner conductor. The outer conductor is in a generally concentric relationship to the inner conductor and the inner and outer conductors are adapted... Agent: Tyco Healthcare Group Lp Attn:IPLegal
20100101828 - Magnet wire with coating added with fullerene-type nanostructures: A magnet wire consists of an electrical conductor and a coating around the electric conductor, the coating is resistant to corona and/or of a low coefficient of friction, and is composed of 82% to 99.95% by weight of polymeric resin, and 0.05% to 18% by weight of fullerene-type nanostructures.... Agent: Michael Winfield Goltry
20100101827 - Polybutylene naphthalate-based resin composition and electric wire using the polybutylene naphthalate-based resin composition: There are provided a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide; and an electric wire using a polybutylene naphthalate-based resin composition, with an insulated coating layer formed on a conductor, by using a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a... Agent: Fleit Gibbons Gutman Bongini & Bianco Pl
20100101832 - Compound magnetic nanowires for tco replacement: This invention provides an optically transparent electrically conductive layer with a desirable combination of low electrical sheet resistance and good optical transparency. The conductive layer comprises a multiplicity of compound magnetic nanowires in a plane, the compound nanowires being aligned roughly (1) parallel to each other and (2) with the... Agent: Applied Materials C/o Pillsbury Winthrop Shaw Pittman LLP
20100101831 - Electrical contact material, method for manufacturing the same and electrical contact: The present invention relates to an electrical contact material having a surface layer made of a noble metal or an alloy having the noble metal as its main component, a method for manufacturing the same and an electrical contact using the same. Recently, electrical contact materials having excellent abrasion resistance... Agent: Kubotera & Associates, LLC
20100101830 - Magnetic nanoparticles for tco replacement: This invention provides an optically transparent conductive layer with a desirable combination of low electrical sheet resistance and good optical transparency. The conductive layer comprises a multiplicity of magnetic nanoparticles in a plane, the nanoparticles being aligned in strings, the strings being roughly parallel to each other and configured to... Agent: Applied Materials C/o Pillsbury Winthrop Shaw Pittman LLP
20100101829 - Magnetic nanowires for tco replacement: This invention provides an optically transparent conductive layer with a desirable combination of low electrical sheet resistance and good optical transparency. The conductive layer comprises a multiplicity of magnetic nanowires in a plane, the nanowires being aligned roughly (1) parallel to each other and (2) with the long axes of... Agent: Applied Materials C/o Pillsbury Winthrop Shaw Pittman LLP
20100101833 - Abrasion resistant cords and ropes: The abrasion resistance of organic fiber based ropes and cords is increased by a outer woven cover of tapes of high molecular weight and more preferably ultrahigh molecular weight polyethylene.... Agent: Edward S. Sherman, Esq.
20100101834 - Interlayer insulation film, interconnect structure, and methods of manufacturing them: An interlayer insulation film can be produced by laminating a hydrocarbon layer containing an Si atom and a fluorocarbon layer containing an N atom on each other, wherein the hydrocarbon layer contains an H atom and a C atom at such a ratio that the ratio of the number of... Agent: Pearne & Gordon LLP
20100101836 - Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate: A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP
20100101838 - Multilayer printed wiring board: A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 μm and a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100101837 - Printed circuit board: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second... Agent: PCe Industry, Inc. Att. Steven Reiss
20100101839 - Display apparatus: A display apparatus includes a first substrate including a plurality of pixels, a first electrode arranged on the first substrate, a second substrate facing the first substrate, and a second electrode arranged on the second substrate and spaced apart from the first electrode, the second electrode to form an electric... Agent: H.c. Park & Associates, PLC
20100101840 - Application of a self-assembled monolayer as an oxide inhibitor: An embodiment is directed to a method of forming a self assembled monolayer to reduce formation of an oxide. The method includes applying an inhibitor to a substrate including conductive contacts and processing the substrate and inhibitor to form the self assembled monolayer.... Agent: Pillsbury Winthrop Shaw Pittman LLP (raytheon Sas)
20100101842 - Low-temperature curable conductive paste for plating and electric wiring using the same: A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of −50° C. to 20°... Agent: Leydig Voit & Mayer, Ltd
20100101841 - Printed circuit board: A printed circuit board (PCB) is disclosed. The PCB includes a dielectric layer, a power layer, a ground layer, and an electromagnetic interference reducing layer. The dielectric layer includes a central portion and a periphery portion surrounding the central portion. The dielectric layer defines a number of via holes through... Agent: PCe Industry, Inc. Att. Steven Reiss
20100101843 - Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate: Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100101845 - Electronic device and manufacturing method for electronic device: An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting... Agent: Wenderoth, Lind & Ponack L.L.P.
20100101844 - Multi-piece board and fabrication method thereof: A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece and a frame; forming a first fitting portion at the frame by separating the defective piece; cutting out a defect-free... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100101849 - Electronic component built-in substrate and method of manufacturing the same: A method of manufacturing an electronic component built-in substrate, includes the steps of mounting a chip-like electronic component having a connection pad and a metal protection layer formed on a whole of one surface to cover the connection pad, on a wiring substrate to direct the connection pad upward; embedding... Agent: Kratz, Quintos & Hanson, LLP
20100101847 - Electronic component embedded printed circuit board and manufacturing method thereof: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an... Agent: Mcdermott Will & Emery LLP
20100101846 - Method and apparatus for spatially optimizing surface mount pads on a ball grid array package: Method and apparatus for spatially optimizing the arrangement of surface mount pads on a ball grid array package. An array containing T surface mount pads with a diameter less than or equal to 0.4 millimeter is arranged in an array of rows and columns less than or equal to 0.5... Agent: Motorola, Inc
20100101848 - Substrate unit, information processor and method of manufacturing substrate unit: A substrate unit includes an electronic component having a plurality of electrodes arranged in a given shape, a circuit substrate having a first face where the electronic component is mounted and the electrodes are jointed and a second face underside of the first face, and a resin-coated portion formed on... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100101850 - Printed circuit board and method of manufacturing the same: A printed circuit board includes a signal layer, an insulation layer, and a reference layer. A transmission line is located on the signal layer. A probing pad is located on the transmission line. Two aligned slots defined in opposite sides of the reference layer leaving a connecting portion. The slots... Agent: PCe Industry, Inc. Att. Steven Reiss
20100101851 - Wiring substrate and method of manufacturing the same: A wiring substrate, includes a first wiring layer, an insulating layer formed on the first wiring layer, a via conductor filled to penetrate the insulating layer in a thickness direction and connected to a connection portion of the first wiring layer, and a second wiring layer which is formed on... Agent: Kratz, Quintos & Hanson, LLP
20100101852 - Multilayer printed wiring board with filled viahole structure: The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiring board is comprised of conductor circuitry layers... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100101853 - Communication cable having electrically isolated shield providing enhanced return loss: A tape can comprise a strip of dielectric material, with adhering patches of electrical conductive material. The patches can be substantially electrically isolated from one another. The strip can be disposed in a communication cable to provide a shield that is electrically discontinuous or has high resistance between opposite cable... Agent: King & Spalding
20100101854 - Flush wall mount thermostat and in-set mounting plate for a heating, ventilation and air conditioning system: One aspect provides of this disclosure provides a flush wall mounting system for an electronic controller. This embodiment comprises a housing for receiving electrical components therein and having a front panel and a back panel coupled to the front panel. The back panel has a raised portion extending therefrom. This... Agent: Hitt Gaines P.C.
20100101855 - Cable raceway with box: A combination of a cable raceway and a power device box where the cable raceway includes at least one and usually at least two compartments extending along a length of the raceway. The power device box includes a base unit. The compartment of the cable raceway includes a removable cover... Agent: Ostrolenk Faber Gerb & Soffen
20100101856 - Organic light emitting diode display: An organic light emitting diode (OLED) display is disclosed. One aspect includes a display panel assembly, a support member supporting edges of the display panel assembly and including an opening exposing a rear surface of the display panel assembly, and a buffer member attached to the rear surface of the... Agent: Knobbe Martens Olson & Bear LLP
20100101857 - Electrical junction box and method for assembling the same: An electrical junction box may include a casing with a lower casing member and an upper casing member. A multi-layered circuit board may be retained in the electrical junction box. The multi-layered circuit board may contain a lower layer circuit board, an upper layer circuit board and an insulation plate... Agent: Oliff & Berridge, PLC04/22/2010 > patent applications in patent subcategories. category listing, related patent applications
20100096157 - Flush electrical powerpoint device box: Disclosed is a below grade electrical power delivery device for powering auxiliary electrical equipment. The device comprises a container, a lid attached to the container, an electrical box attached to the interior surface of the lid and a terminal box attached to the interior of the container. A power supply... Agent: Gowling Lafleur Henderson LLP
20100096158 - Multi-function cable studs and methods of assembling the same: Cable assemblies comprising a cable (102), an integrally formed cable stud (IFCS) disposed around the cable, a securing member (502, 1100), and a crimp ring (508). The IFCS (108) includes tubular bodies (530, 532, 534) of different sizes horizontally aligned along a common central axis (550) and a flange (536).... Agent: Harris Corporation C/o Darby & Darby PC
20100096183 - Tape: A tape that can be used to detect cracks in a structure to which it is attached is disclosed herein. The tape includes a plurality of structural fibers. The tape also includes an electrically-insulating binder at least partially encapsulating the plurality of structural fibers. The tape also includes quantities of... Agent: Meiers Law Office
20100096184 - Harness connection member: A harness connection member has a cover member. In fitting a cover member to a holder, a split slit is opened with use of a slit, and wires are inserted into the holder. Thereafter, the cover member is moved to the holder, then moved over one projected annular part of... Agent: Frishauf, Holtz, Goodman & Chick, PC
20100096185 - Wiring harness and a method for producing the same, and a method for connecting insulated wires: A wiring harness which is excellent in peel strength at a joining portion where conductors of electric wires are joined together, even if at least one of the electric wires have a small diameter. A wiring harness includes insulated wires whose conductors are partly exposed, and a metal leaf with... Agent: Oliff & Berridge, PLC
20100096159 - Method of manufacturing a foam-insulated wire using a porous solid and a foam-insulated wire manufactured thereby: A method of manufacturing a foam-insulated wire, which uses a porous solid, which is able to improve performance of a foam-insulated wire by controlling the dispersion of the void content of the insulation, and the foam-insulated wire manufactured thereby are provided. The method comprising the steps of: forming a film... Agent: Mattingly & Malur, P.C.
20100096160 - High performance data cable: The present invention is for a high performance data cable which has an interior support or star separator. The star separator or interior support extends along the longitudinal length of the data cable. The star separator or interior support has a central region. A plurality of prongs or splines extend... Agent: Lando & Anastasi, LLP
20100096161 - Downhole cable with thermally conductive polymer composites: A cable for transmitting electricity for use with an electric submersible pump has a plurality of conductors for conducting electricity along the length of the cable. A first layer of insulation surrounds each of the conductors. A jacket, or second layer of insulation, surrounds all of the conductors and the... Agent: Bracewell & Giuliani LLP
20100096162 - Lightweight copper/aluminum composite conductors: A lightweight composite electrical conductor for aerospace applications, having a core of a plurality of aluminum strands surrounded by an outer layer of a plurality of copper strands. The conductor may be a wire rope having a core of a plurality of aluminum members each having a plurality of aluminum... Agent: Daniel H. Steidl Kilgannon & Steidl
20100096163 - Wiring board and method of manufacturing the same: A wiring board comprises a first pad which is provided on a first surface side of a substrate and on which a first electronic component is to be mounted, and a second pad which is provided on the first surface side of the substrate and on which a second electronic... Agent: Drinker Biddle & Reath (dc)
20100096168 - Electric contact and method for producing the same and connector using the electric contacts: A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the... Agent: Abelman, Frayne & Schwab
20100096164 - Film and flexible metal-clad laminate: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained... Agent: Nixon & Vanderhye, PC
20100096166 - Flexible circuit assemblies without solder and methods for their manufacture: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, and 1700. The assembly 400 uses no solder. Components 406 or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The... Agent: The Tpl Group
20100096167 - Flexible printed circuit board for large capacity signal transmission medium: Provided is a flexible printed circuit board (FPCB) for a large capacity signal transmission medium that may maintain an impedance suitable for accurately transmitting a large capacity signal such as a low-voltage differential signaling (LVDS) signal and may also have an excellent flexibility. A copper foil large capacity signal wire... Agent: Rosenberg, Klein & Lee
20100096165 - Golden finger for flexible printed circuitboard: A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and... Agent: Morris Manning Martin LLP
20100096170 - Circuit board and layout method thereof: A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces arranged thereon. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground... Agent: PCe Industry, Inc. Att. Steven Reiss
20100096169 - Polyamide resin as well as epoxy resin composition using the same and use thereof: (in the formula (1), m and n are average values and satisfy a relationship of 0.005≦n/(m+n)≦1.00 and m+n is an integer of 2-200, and Ar1 is a bivalent aromatic group, Ar2 is a bivalent aromatic group having a phenolic hydroxyl group and Ar3 is a bivalent aromatic group) and (b)... Agent: Peters Verny , L.L.P.
20100096171 - Printed circuit board having round solder bump and method of manufacturing the same: Disclosed herein is a printed circuit board having round solder bumps and a method of manufacturing the same. The solder bump is configured to have a round connecting surface in contact with a pad, and thus have an increased contact area with respect to the pad, thus improving connection reliability.... Agent: Staas & Halsey LLP
20100096172 - Wiring structure and method for fabricating the same: A wiring structure has a silicon layer, a backing layer provided on the silicon layer, the backing layer comprising a copper alloy containing a nickel, and a copper layer provided on the backing layer, and a diffusion barrier layer having an electrical conductivity, the diffusion barrier layer being provided at... Agent: Mcginn Intellectual Property Law Group, PLLC
20100096175 - Adhesive film, connecting method, and joined structure: An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer... Agent: Buchanan, Ingersoll & Rooney PC
20100096174 - Filter circuit element and electronic circuit device: A plurality of vias is disposed side by side on a multilayer board. A first via which is one of the vias disposed at one outer portion is electrically connected to a first outgoing line provided on the multilayer board. A second via at the other outer portion is electrically... Agent: Mcginn Intellectual Property Law Group, PLLC
20100096176 - Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same: In a method of fabricating a thin film transistor array substrate for a liquid crystal display, a gate line assembly is formed on a substrate with a chrome-based under-layer and an aluminum alloy-based over-layer while proceeding in the horizontal direction. The gate line assembly has gate lines, and gate electrodes,... Agent: Innovation Counsel LLP
20100096177 - Coreless substrate having filled via pad and method of manufacturing the same: Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are... Agent: Staas & Halsey LLP
20100096178 - Non-shirinkage ceramic substrate and manufacturing method thereof: A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the ceramic laminated body and an outer electrode formed on a surface of the ceramic laminated body and electrically connected with the via... Agent: Mcdermott Will & Emery LLP
20100096179 - Communication cabling with shielding separator and discontinuous cable shield: A communications cable having a plurality of twisted wire pairs each having a substantially uniform twist rate along the cable. An elongated shielding separator is positioned between the twisted wire pairs and physically separates them from one another. The shielding separator has a plurality of electrically non-conductive separator sections positioned... Agent: Davis Wright Tremaine LLP/leviton
20100096180 - Ada compliant rf shielded door systems and related methods: Radio-frequency (RF) leakage from shielded enclosures is minimized while ensuring applicable RF attenuation standards and access requirements of the Americans with Disabilities Act (ADA) by attaching an inflatable bladder to a door of an enclosure. Substantially surrounding the bladder is an electrically conductive material. When the bladder is inflated it... Agent: Capitol Patent & Trademark Law Firm, PLLC
20100096181 - Electromagnetic shield sheet and rfid plate: Provided is an electromagnetic shield sheet having an excellent electromagnetic shielding effect which can be sufficiently exhibited even when the sheet has a reduced thickness and a reduced weight. Furthermore, the electromagnetic shield sheet has an excellent molding efficiency and flexibility and can be used in a desired shape such... Agent: Birch Stewart Kolasch & Birch
20100096182 - Isolator assembly, receptacle and method of operation: An isolator assembly includes an electrical receptacle housing. The housing defines an aperture extending inwardly from a first exterior wall of the housing and a longitudinal centerline of the aperture. The housing further has an internal cavity extending from the aperture and a slot spaced from the internal cavity and... Agent: Taylor & Aust, P.C.04/15/2010 > patent applications in patent subcategories. category listing, related patent applications
20100089605 - Back box with power pocket for in-wall electronic components: A multi-part electrical/electronics enclosure that may be used for in-wall installation of intercom, home audio, lighting, HVAC or other automation controls and similar system components. The enclosure includes two major components including a back box, serving to enclose low voltage electronics, and a power pocket portion, fitting into at least... Agent: Hamilton, Brook, Smith & Reynolds, P.C.
20100089604 - Electronic device enclosure: An electronic device enclosure includes a housing and a cover fixed on the housing. The housing defines a first latching portion, and the cover defines a plurality of first latching hooks to engage with the first latching portion. The electronic device enclosure further includes an urging assembly rotatably assembled in... Agent: PCe Industry, Inc. Att. Steven Reiss
20100089606 - Soda-lime-silica glass composition for a display screen:
20100089607 - Semiconductor power conversion apparatus and method of manufacturing the same: A bus bar has a lead portion and a bus bar portion which are integrally shaped. The lead portion is provided in such a shape that branches from the bus bar portion. A part of the lead portion forms a connection part directly electrically connected with a transistor electrode and... Agent: Sughrue Mion, PLLC
20100089641 - Low inductance busbar: A busbar assembly for an inverter module has a power module, a capacitor module with at least one capacitor, and a battery all interconnected by a busbar. The busbar includes a base busbar portion that is electrically coupled to the battery and a branch busbar portion that extends from the... Agent: Ingrassia Fisher & Lorenz, P.C. (gm)
20100089642 - Power feeding device for slide structure: A power feeding device for a slide structure, which includes a link arm 6 turnably provided to one of a slide structure 2 and a fixed structure 11 in a direction to absorb a surplus length of a wire harness, and a harness holding portion 19 provided to a top... Agent: Sughrue-265550
20100089608 - Device for electrical bonding of electrical cables shielding on composite structures: The invention relates to an electrical bonding device of a shielding (3) of electrical cables (5) in aircraft arranged in its structure in an area (15) made with a carbon fiber-based composite, comprising a metallic plate (9) with a lug (7) where a bonding lead (1) projecting from the shielding... Agent: Ladas & Parry LLP
20100089609 - Protector structure for electric power feeding apparatus: A curved wall portion 31 along which a wiring harness 6 is bendably extended has a foreign-matter-escape side opening 32, at one wall 34 continuing to a top opening 30 of an upward guiding cylinder 4 of a protector 20. A foreign-matter-escape side opening 32′ on the other wall 34′... Agent: Kratz, Quintos & Hanson, LLP
20100089610 - Flat cable: A very thin flat cable (100) comprising very thin coaxial cables (110) each having a center conductor (1) and a jacket (4), parallel arranged two-dimensionally in a flat shape, and joined by tangling them with a weft yarn (120) in units of predetermined number of very thin coaxial cables (110).... Agent: Christie, Parker & Hale, LLP
20100089611 - Flexible power cable with improved water treeing resistance: v
20100089612 - Electrical connection element of packaging substrate: An electrical connection element of packaging substrate is disclosed. Wherein a plurality of conductive pads and a solder mask are formed on the surface of the packaging substrate, and a plurality of openings is formed in the solder mask to expose the conductive pads covered there beneath. The electrical connection... Agent: Bacon & Thomas, PLLC
20100089613 - Electronic component and method for manufacturing the same: Disclosed is an electronic component comprising a connecting terminal part having a surface of an electroconductive base material and a germanium-containing nickel plating film provided on the surface. In the electronic component, the plating film provided on the surface of the electroconductive base material in the connecting terminal part possesses... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100089614 - electric control cable and an associated fabrication method: The present invention relates to an electric control cable of the type comprising a core of polymer material and a plurality of copper strands extending in the longitudinal direction of said core, said copper strands being distributed uniformly and concentrically on the periphery of said core so as to penetrate... Agent: Sofer & Haroun LLP.
20100089616 - Stretchable conductor and method for producing the same: The present invention relates to a compliant deformable conductor and a method for producing the same, comprising a wire or a tube made of an electrically insulating material and one or more electrical leads applied on said wire or tube, wherein one or more of said leads comprise a plurality... Agent: Norris Mclaughlin & Marcus, P.A.
20100089615 - Transparent electroconductive film and process for producing the same: In a transparent electroconductive film including a transparent substrate and a transparent electroconductive oxide layer disposed on the transparent substrate, when the transparent electroconductive oxide layer is composed of zinc oxide, the surface resistivity of the transparent electroconductive oxide layer increases with time and thus it has been difficult to... Agent: Wenderoth, Lind & Ponack, L.L.P.
20100089617 - High voltage shield: A high voltage corona shield including a body portion including a polymer material.... Agent: Venable LLP
20100089618 - Fence post insulator: A fencepost insulator that can be quickly and easily mounted on a wire of an electric fence for providing an electrically-resistive barrier between the electrified wire and a conductive fencepost. The insulator is a unitary, roll-shaped segment of electrically-resistive material with a loose spiral-shaped cross section. The insulator is installed... Agent: Kremblas, Foster, Phillips & Pollick
20100089619 - Circuit board of communication product and manufacturing method thereof: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality... Agent: Rabin & Berdo, PC
20100089620 - Electronic component module and method for the production thereof: An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composite layer... Agent: Cohen, Pontani, Lieberman & Pavane LLP
20100089622 - Barrier film for flexible copper substrate and sputtering target for forming barrier film: A barrier film for a flexible copper substrate comprising a Co—Cr alloy film containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co is provided. The barrier film has a thickness of 3 to 150 nm and a film thickness uniformity of 10% or... Agent: Howson & Howson LLP
20100089621 - Nucleation layer for thin film metal layer formation: A conductive film is formed on a flexible polymer support by applying a seed layer comprising gallium oxide, indium oxide, magnesium oxide, zinc oxide or mixture (including mixed oxides) thereof to the flexible polymer support, and applying an extensible, visible light-transmissive metal layer over the seed layer. The seed layer... Agent: 3m Innovative Properties Company
20100089625 - Component having a ceramic base with a metalized surface: A component which dissipates heat produced during operation thereof has a ceramic base the surface of which is covered in at least one area by a metalized coating, the ceramic base being spatially structured.... Agent: Fulbright & Jaworski, LLP
20100089626 - Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof: It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite (100) of the invention that comprises a fiber sheet (101) impregnated with a resin composition (102),... Agent: Griffin & Szipl, PC
20100089623 - Conductive laminated body and method for preparing the same: Disclosed is a conductive laminated body, and a method for preparing the same, wherein the conductive laminated body including: a substrate; a zinc oxide-based thin film doped with an element M; and an interlayer including an oxide M′2O3, which is interposed between the substrate and the zinc oxide-based thin film.... Agent: Mckenna Long & Aldridge LLP
20100089624 - Multilayer ceramic substrate and process for producing the same: Disclosed is a multi-layer ceramic substrate including a glass ceramic and an external terminal formed on a surface of the glass ceramic. The external terminal includes conductive materials mainly composed of at least one among Ag, Au, Pt and Pd, and added with at least one element among Bi, Cu,... Agent: Mcdermott Will & Emery LLP
20100089627 - Multilayer three-dimensional circuit structure and manufacturing method thereof: A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering... Agent: J C Patents
20100089628 - Component built-in circuit substrate and method of producing the same: A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling... Agent: Ratnerprestia
20100089629 - Electronic component device and method for producing the same: In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP
20100089630 - Crossover: A crossover is formed by imprinting a channel, by depositing a first conductor in the channel, by anodizing a surface of the first conductor and by electroforming a second conductor across the first conductor.... Agent: Hewlett-packard Company Intellectual Property Administration
20100089632 - printed wiring board and a method of production thereof: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100089631 - Wiring board and manufacturing method of the same: A wiring board, includes a substrate main body; a piercing electrode configured to pierce the substrate main body; a first wiring pattern provided at a first surface side of the substrate main body, the first wiring pattern having a pad, the pad being electrically connected to one end part of... Agent: Ipusa, P.l.l.c
20100089633 - Arrangement for hermetically sealing components, and method for the production thereof: Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically... Agent: Staas & Halsey LLP
20100089634 - Finishing tool for cable mold connection: The present invention relates to a finishing tool for a cable mold connection. The finishing tool includes a connection base, a connection cover, and a plurality of couplers. The connection base has a thickness corresponding to the base and has at least two acceptance grooves. The connection cover is coupled... Agent: Hyun Jong Park Park & Associates Intellectual Property Law LLC
20100089635 - Housing for an electric or electronic device: A housing for an electric or electronic device has at least one receiving part for accommodating electric and/or electronic components, parts, component groups and parts groups in an interior thereof has at least one locking part for closing the receiving part, and having a bayonet connector for connecting the at... Agent: Roberts Mlotkowski Safran & Cole, P.C. Intellectual Property Department
20100089636 - Nanoparticulate encapsulation barrier stack: A barrier stack for encapsulating a moisture and/or oxygen sensitive electronic device is provided. The barrier stack comprises a multilayer film having at least one barrier layer having low moisture and/or oxygen permeability, and at least one sealing layer arranged to be in contact with a surface of the barrier... Agent: Foley And Lardner LLP Suite 500
20100089637 - Film structure and electronic device housing utilizing the same: An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal... Agent: PCe Industry, Inc. Att. Steven Reiss
20100089638 - Sealing structure, electronic device, sealing method, gasket, and manufacturing method thereof: A sealing structure to seal housings includes a sealing member disposed between housings to be bonded to allow penetration of at least one signal line; and an adhesive material disposed between the signal lines penetrating the sealing member to bond the signal lines to be overlapped.... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20100089639 - Seal-tight grommet and method of producing same: The invention relates to a sealing device for a chamber partition, the partition having an orifice enabling a strand of conductor wires to pass between the outside and the inside of the chamber. The device includes a plug through which passes the strand, and an apparatus to keep the plug... Agent: Darby & Darby P.C.
20100089640 - Plastic cable clamps designs in steel outlet boxes: A cable clamp for securing a wire or cable in an electrical outlet box having an interior, an exterior and one or more openings therebetween is provided. The cable clamp includes a body and one or more retaining devices that define one or more apertures. The body is adapted to... Agent: Hoffmann & Baron, LLP04/08/2010 > patent applications in patent subcategories. category listing, related patent applications
20100084162 - Electronic package device: An electronic package device has an accommodation space being substantially sealed. The electronic package device includes a fluid, an electronic element and a space buffer mechanism. The fluid is located in the accommodation space. The electronic element is also disposed in the accommodation space, and at least a part thereof... Agent: Birch Stewart Kolasch & Birch
20100084153 - Electrical feedthrough structure for superconductor element: An electrical bushing structure includes a central conductor (19) designed to have one (26) of its two ends connected to a superconductor element situated in an enclosure (11) at cryogenic temperature, and its other end (25) connected to an article at ambient temperature. An electrically insulating sheath (20) surrounds the... Agent: Sofer & Haroun LLP.
20100084154 - Hinge system and method: Embodiments of the invention provide a hinge system and method for use with an electrical enclosure. The hinge system can include a first mounting plate having a bushing and a second mounting plate having an aperture. The hinge system can include a pin having a first portion received by the... Agent: Greenberg Traurig (phx)
20100084155 - Adjustable variable ring for electrical junction boxes: An adjustable variable ring for electrical junction boxes including a base frame having a guide tab; a sliding insert having a box shaped frame, the sliding insert being configured to slide in and out of the base frame. A ratchet mechanism having a ratchet plate on the base frame including... Agent: Christie, Parker & Hale, LLP
20100084189 - Conductor raceway separator: A divider for keeping current-carrying conductors separated transversely in raceways, such as walker ducts and cable trays, in which multiple conductors extend, in order that air can flow around the conductors and cool the conductors. The divider is mounted in the raceway to form passages through which some of the... Agent: Kremblas, Foster, Phillips & Pollick
20100084156 - Ptfe porous body, ptfe mixture, method for producing ptfe porous body, and electric wire/cable using ptfe porous body: A polytetrafluoroethylene porous body which is produced by molding a polytetrafluoroethylene mixture, including a polytetrafluoroethylene powder and a pore-forming agent, into a predetermined shape, and subsequently removing the pore-forming agent. The pore-forming agent includes (a) one or more powders selected from a group consisting of dicarboxylic acid powders and benzoic... Agent: Intellectual Property / Technology Law
20100084157 - Digital audio video cable: A low-capacitance, interference-free, stretch-prevention and high tensile strength digital audio video cable practical for a long-distance application is disclosed to include an electrical strand formed of multiple high-frequency transmission lines and low-frequency transmission wires and a filler, a tin foil layer surrounding the electrical strand, a braided layer surrounding the... Agent: Sure-fire Electrical Corporation
20100084158 - Flexible, high temperature rated lldpe jacket composition: Polymer compositions composed of a polyethylene resin (e.g., LLDPE), carbon black and an olefin block interpolymer are provided, which are useful for, among other things, the production of wire and cable jacketing that possess an increased high temperature rating, flexibility and comparable ease of removal of the jacket from the... Agent: Whyte Hirschboeck Dudek S.c./dow Intellectual Property Department
20100084159 - Sealed cable and terminal crimp: A cable includes a plurality of cable strands, an insulator disposed on a portion of the plurality of strands such that the plurality of strands are at least partially exposed, and a sealant disposed between gaps of the plurality of strands and at least partially under the insulator. Moreover, a... Agent: Delphi Technologies, Inc Legal Staff - M/c 483-400-402
20100084160 - Split flex cable: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first... Agent: Ibm Corporation
20100084161 - Conductive film and process for making same: A conductive polyolefin film characterized by acceptable physicals, no pinholes, and a resistance through its thickness of less than about 100 ohms, preferably less than about 10 ohms, and a method for making the same. The film includes a structural polymeric material such as a polyolefin blended with conductive additives... Agent: Chris A. Caseiro
20100084165 - Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part: A ceramic compact having a patterned conductor is obtained by coating the patterned conductor with a slurry and then by hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact, an isocyanate- or isothiocyanate-containing gelling agent and... Agent: Burr & Brown
20100084164 - Electronic component mounting method: A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface... Agent: Staas & Halsey LLP
20100084163 - Wiring board and method of fabricating the same: A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The... Agent: Ipusa, P.l.l.c
20100084166 - Method for fitting an electrical component to a contacting element and contacting element with an electrical component: The invention relates to a method for equipping a contacting element (1), in particular a punched grid with an SMD component (4), comprising the following steps: proving the contact element (1) with a casing, a connector point (3) being provided in a recess (7) of the casing (5); placing the... Agent: Merchant & Gould PC
20100084167 - Substrate applicable in chip led package: The present invention provides a substrate applicable in a chip LED package, the substrate having a conductive layer, an insulation layer and a heat-dissipation plate in this order, wherein the insulation layer comprises a liquid crystal polyester soluble in a solvent and a sheet comprising inorganic fibers and/or organic fibers.... Agent: Panitch Schwarze Belisario & Nadel LLP
20100084169 - Flexible multilayer wiring board: It is an object of the present invention to provide a flexible multilayer wiring board that can be easily reduced in thickness and that also has sufficient durability against repeated bending or heat shock. A preferred mode of the flexible multilayer wiring board comprises a flexible inner layer board obtained... Agent: Antonelli, Terry, Stout & Kraus, LLP
20100084168 - Manufacturing method of a flexible printed circuit board and a structure thereof: In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit... Agent: Roger H. Chu
20100084170 - Composite-forming method, composites formed thereby, and printed circuit boards incorporating them: A composite-forming process includes impregnating a reinforcing structure with a curable composition at a temperature of about 10 to about 40° C. The curable composition includes specific amounts of an epoxy resin, a poly(arylene ether), a solvent, and a curing promoter. The poly(arylene ether) includes, on average, about 1.6 to... Agent: Cantor Colburn LLP - Sabic (noryl)
20100084173 - Ceramic powder for a green sheet and multilayer ceramic substrate: Provided is a ceramic powder for a green sheet that gives a low-temperature fired ceramic substrate that can be fired at a temperature of 900° C. or lower and has excellent dielectric properties in the higher frequency bands such as microwave and millimeter-wave bands, has a low hygroscopicity, and has... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100084171 - Novel polyimide precursor composition, use thereof and production method thereof: An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide... Agent: Hamre, Schumann, Mueller & Larson, P.C.
20100084172 - Photosensitive resin composition, dry film, and processed product made using the same: Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance... Agent: Buchanan, Ingersoll & Rooney PC
20100084175 - Component built-in wiring substrate and manufacturing method thereof: A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected... Agent: Sughrue-265550
20100084174 - Sealing material and mounting method using the sealing material: A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to... Agent: Wenderoth, Lind & Ponack L.L.P.
20100084177 - Electronic circuit device: Provided is an electronic circuit device in which the bonding state of electrodes can be detected easily with high precision. The electronic circuit device has a stack structure in which a plurality of electronic circuit boards (1a, 1b, 100a, 100b, 100c) are stacked in three or more layers through ball... Agent: Fitzpatrick Cella Harper & Scinto
20100084176 - Preserving stopband characteristics of electromagnetic bandgap structures in circuit boards: The stopband characteristics of an electromagnetic bandgap structure in a printed circuit board may be preserved by selectively forming slots in an additional conductive layer of the printed circuit board. For example, an electromagnetic bandgap structure may include a layer with a continuous conductive region and another layer with a... Agent: Streets & Steele - IBM Corporation
20100084178 - bond strength and interconnection in a via: A via is provided on a printed circuit board with at least one additional depression encompassing the via, such that the via passes through a portion of the depression. Solder can pool in the depression, allowing for a stronger mechanical bond and eliminating many issues with respect to a lack... Agent: Brooks Kushman P.C. / Sun / Stk
20100084179 - Protective sleeve fabricated with hybrid yard, hybrid yarn, and methods of construction thereof: A hybrid yarn filament and sleeve constructed therefrom for protecting elongate members against at least one of EMI, RFI or ESD is provided, along with methods of constructing the hybrid yarn filament and sleeves. The hybrid yarn filament has a nonconductive filament and at least one conductive wire filament overlying... Agent: Robert L. Stearns Dickinson Wright PLLC
20100084180 - Electronic device with a shielding member: An electronic device includes a circuit board and a shielding member. The circuit board includes a pair of frames and a plurality of mounting holes disposed between the frames. The pair of frames surround at least one electronic component positioned within an area defined within the pair of frames. The... Agent: PCe Industry, Inc. Att. Steven Reiss
20100084181 - Radiation-proof sheath material and radiation-proof cable: A radiation-proof sheath material includes a polymer material containing molecular chains of ethylene units as a main component in which side chain groups are randomly distributed and cross-linked, an antioxidant, a processing aid, and a flame retardant. The polymer material includes chlorinated polyethylene containing chloro groups in the side chain... Agent: Foley And Lardner LLP Suite 500
20100084182 - Outlet assembly: An outlet assembly installed over an existing device box and wiring to provide an integrated appearance for a new low voltage installation alongside the existing device box, without requiring disturbance of the existing device box or wiring.... Agent: Mccormick, Paulding & Huber LLP
20100084183 - Twin-chip-mounting type diode: The present invention provides a diode that does not deteriorate its function even if it is used in an environment where the temperature change is considerable, such as in a terminal box for solar cell panel that is placed outdoors. A diode of twin-chip-mounting type in which each chip has... Agent: Kolisch Hartwell, P.C.
20100084184 - Open back junction box and method for pre-fab wiring: A bracket and open back junction box assembly allows simplified wiring at a construction site. An open back junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads, at a prefab facility. A Metal Clad (MC) cable may be attached... Agent: Averill & Varn
20100084185 - Means for connecting a light fixture to a wall: In one aspect, the present invention is directed to means for connecting a light fixture to a wall, ceiling, and the like. The connecting means comprising: a junction box, having an opening; an connection box in which the form thereof corresponds to the form of the box opening, dimension(s) of... Agent: Daniel J Swirsky
20100084186 - Fixture box enclosure: A fixture box for a light fixture or the like is disclosed. The fixture box has a housing with an interior and an exterior. An input port accessible from the exterior of the housing is provided to receive and terminate an incoming electrical power source cable. An output port accessible... Agent: Thomas R. Shaffer Glassmire & Shaffer Law Offices, PC
20100084187 - Coupler: A coupler that aids in the detection of partial discharge events in a vessel. The coupler comprises a housing for a detector which extends through a wall of the vessel. The housing is sealably connectable to a vessel and is at least partially transparent to electromagnetic radiation. The coupler may... Agent: Workman Nydegger 1000 Eagle Gate Tower
20100084188 - Method for knock out feature in brittle material: The present invention relates generally to electrical insulation barriers. More particularly, the invention encompasses an electrical insulation barrier having knock-out features for an electronic apparatus. The electrical insulation barrier is preferably made from a brittle material, such as, for example, a thermoset insulating material, a glass reinforced polyester laminate material... Agent: Siemens Corporation Intellectual Property Department04/01/2010 > patent applications in patent subcategories. category listing, related patent applications
20100078188 - Deflection resistant electrical enclosure: An electrical enclosure for use in poured concrete construction having a peripheral wall with opposed longitudinally extending walls longer than opposed laterally extending walls and at least one physical support located substantially midpoint along the opposed longitudinally extended walls to resist deflection of the opposed longitudinal walls caused by the... Agent: Riches, Mckenzie & Herbert, LLP
20100078189 - Environmentally sealed wiring device with removable weather-resistant cover: An environmentally sealed wiring device with removable weather-resistant cover includes a wiring device with a device housing, a shoulder extending from the device housing and a sealing element disposed about the shoulder. The wiring device includes wires extending through one or more openings in the device housing. The openings are... Agent: King & Spalding
20100078190 - Environmentally sealed wiring device with integral weather-resistant cover: A sealed device with integral weatherproof cover includes a device integral with a weatherproof cover to prevent the introduction of moisture into the device. A portion of the device is positioned within the weatherproof cover housing. The device includes wires extending out through one or more openings along or near... Agent: King & Spalding
20100078191 - Hermetic seal and a method of manufacturing hermetic seal: A hermetic seal includes a package base, a glass material provided on the inside of the package base, and a lead pin that is provided to penetrate through the glass material and is composed of a copper-tungsten alloy.... Agent: Buchanan, Ingersoll & Rooney PC
20100078192 - Transparent conductive film, sintered body target for transparent conductive film fabrication, and transparent conductive base material and display device using the same: A transparent conductive film which is amorphous, has a high transmittance of light in the visible region of short wavelengths, and is hard to beak with respect to bending is provided. The transparent conductive film is an amorphous oxide film composed of Ga, In, and O, in which a Ga... Agent: Smith, Gambrell & Russell
20100078214 - Water stopping structure of electric wire and marine vessel propulsion device: A water stopping structure of an electric wire includes a first coated electric wire, a second coated electric wire, a wiring member, and insulation. The first coated electric wire has a first core wire and a first insulating coating arranged to coat the first core wire. The second coated electric... Agent: Yamaha C/o Keating & Bennett, LLP
20100078193 - Communication wire: The present invention relates to an improved insulated conductor with a low dielectric constant and reduced materials costs. The conductor (12) extends along a longitudinal axis and an insulation (14, 14<1>) surrounds the conductor (12). At least on channel (16, 16<1>) in the insulation (14, 14<1>) extends generally along the... Agent: Merchant & Gould PC
20100078194 - Polymeric compositions containing nanotubes: A polymeric composition containing at least one polymer and carbon nanotubes is described. The polymeric composition can have carbon nanotubes that are multi-wall carbon nanotubes and/or single-wall carbon nanotubes. The compositions can also contain carbon black. Also described are various articles made from the polymeric compositions including cables and other... Agent: Robert J. Follett, Esq. Cabot Corporation
20100078195 - High voltage cable: An extruded high voltage cable including a conductor with at least three concentric layers of helically wound metal wires, an extruded inner conducting layer surrounding the conductor, and an extruded electrical insulation arranged outside the inner conducting layer. The two outermost layers of the conductor have the same lay direction.... Agent: Venable LLP
20100078196 - Category cable using dissimilar solid multiple layer: A flame retardant cable having a conductor, an inner polyolefin insulation layer surrounding the conductor having a first dielectric constant and a first limiting oxygen index, and a least one outer polyolefin insulation layer surrounding the inner insulation layer conductor having a second dielectric constant and a second limiting oxygen... Agent: Blank Rome LLP
20100078197 - Metal nanowires, method for producing the same, and transparent conductor: The present invention provides metal nanowires containing at least metal nanowires having a diameter of 50 nm or less and a major axis length of 5 μm or more in an amount of 50% by mass or more in terms of metal amount with respect to total metal particles.... Agent: Young & Thompson
20100078198 - High gradient multilayer vacuum insulator: where It is the transitional dielectric layer thickness below which failure of the vacuum insulator is by vacuum arcing, EBD is the breakdown field required to initiate vacuum arcing across one of said dielectric layers, and EM is the breakdown field required to initiate surface flashover across a monolithic dielectric... Agent: Lawrence Livermore National Security, LLC
20100078199 - Energy conditioning circuit arrangement for integrated circuit: The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated... Agent: Kenneth C. Spafford
20100078200 - Flex circuit assembly with a dummy trace between two signal traces: A flex circuit comprises a base film, a first adhesive layer coupled with the base film, at least two signal traces coupled with the first adhesive layer, and at least one dummy trace positioned between the two signal traces and coupled with the first adhesive layer. The flex circuit comprises... Agent: Hitachi C/o Wagner Blecher LLP
20100078201 - Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body: There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that... Agent: Ditthavong Mori & Steiner, P.C.
20100078202 - Printed circuit board for harsh environments: A printed circuit board (PCB 22) capable of withstanding ultra high G forces and ultra high temperature as in a gas turbine (11). The PCB includes a substrate having a plurality of cavities (30A, 36A) formed therein for receiving components of a circuit, and conductors embedded in the PCB for... Agent: Siemens Corporation Intellectual Property Department
20100078203 - Low index metamaterial: Various aspects of the disclosure provide low index metamaterials. The low index metamaterials may be used to form soft and/or hard electromagnetic (EM) boundaries to facilitate desired EM performance or propagation in applications including feed horns, spatial feed/combiners, isolation barriers between antennas or RF modules, and reduced radar cross-section applications.... Agent: Mcdermott Will & Emery LLP
20100078204 - Printed circuit board including electronic component embedded therein and method of manufacturing the same: Disclosed herein is a printed circuit board including an electronic component embedded therein and a method of manufacturing the printed circuit board. The electronic component is disposed in a cavity of a resin layer including circuit layers formed on both sides thereof. The resin layer, the electronic component and the... Agent: Staas & Halsey LLP
20100078205 - Wiring board with built-in electronic component and method for manufacturing the same: A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100078208 - Method of forming wiring board and wiring board obtained: A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an... Agent: Akerman Senterfitt
20100078209 - Method of forming wiring board and wiring board obtained: A method of forming a wiring board comprises: a step of forming conductive metallic portions in a desired conductive pattern by ejecting for drawing a colloidal metal solution on a substrate by an ink-jet system based on image date of the conductive pattern; and a step of performing wet heating... Agent: Akerman Senterfitt
20100078206 - Process of positioning groups of contact structures: A contact apparatus can be made by providing a first substrate with electrically conductive terminals and second substrates each of which can have contact structures. Each of the contact structures can have a contact tip. The second substrates can be aligned such that contact tips of the contact structures are... Agent: N. Kenneth Burraston Kirton & Mcconkie
20100078207 - Universal bump array structure: A bump array structure for an integrated circuit is presented. An array of metal alloy bumps is disposed on a surface of the integrated circuit. The array of metal alloy bumps is configured to receive input from a multi-layer substrate package and transmit output to the multi-layer substrate package. The... Agent: Martine Penilla & Gencarella, LLP
20100078211 - Memory module and topology of circuit board: Provided is a module having a symmetric topology. The module may include a pair of diverging via bodies configured to receive complementary signals. The pair of diverging via bodies may be further configured to diverge the complementary signals in at least three pairs of diverged complementary signals. The module may... Agent: Harness, Dickey & Pierce, P.L.C
20100078210 - Microelectronic device: A method of manufacturing a microelectronic device including imprinting a layer on a substrate with an imprinted pattern, the imprinted pattern defining a first anchor impression within the layer that includes a first base region positioned adjacent the layer and a first distal region positioned opposite the first base region,... Agent: Hewlett-packard Company Intellectual Property Administration
20100078212 - Multilayer printed wiring board and method for manufacturing multilayer printed wiring board: A method for manufacturing a multilayer printed wiring board suitable for forming fine conductive circuits. A multilayer printed wiring board is formed with a first insulative material and a first conductive circuit formed on the first insulative material. A second insulative material is formed on the first insulative material and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20100078213 - Method for manufacturing printed wiring board and printed wiring board: A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.Previous industry: Tool driving or impacting
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