|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators December patent applications/inventions, industry category 12/09Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 12/31/2009 > patent applications in patent subcategories. patent applications/inventions, industry category
20090321104 - Concealed and flush dual phone and power outlet: A system to enclose communication wiring of electronic devices includes a box; a power cover plate; a cover frame; a cover plate; and a low voltage connector plate attached to the power cover plate, wherein the power cover plate, the cover frame, and the cover plate attach to the box,... Agent: Rahman LLC
20090321105 - Flex duct: An apparatus may comprise a wire frame, a material, and mating connectors. The wire frame is covered by the material to form a flexible duct having a first end and a second end. A first mating connector may be electrically connected to the wire frame and attached to the material... Agent: Duke W. Yee
20090321131 - Wiring harness: For connecting a flat cable having a wire interval and a plurality of contact blades having a terminal interval different from the wire interval, a wiring harness includes a flat cable having a plurality of electric wires and joints joining the adjacent electric wires to each other, and a plurality... Agent: Edwards Angell Palmer & Dodge LLP
20090321106 - Carbon nanotube-based horizontal interconnect architecture: The invention relates to a device which makes it possible to establish a horizontal electrical connection between at least two bonding pads. This device comprises horizontal carbon nanotubes which link the vertical walls of said bonding pads and the bonding pads are made by stacking layers of at least two... Agent: Burr & Brown
20090321107 - Feedthrough assembly and associated method: A feedthrough assembly includes a ferrule, an insulating structure, at least one terminal pin and a glass seal that fixedly secures the insulating structure within the ferrule. The insulating structure has a top portion, a bottom portion, and an inner diameter portion. The inner diameter portion defines at least one... Agent: Medtronic, Inc.
20090321108 - High voltage electric cable: The present invention relates to an electric cable comprising a conductor element, an electrically insulating layer surrounding said conductor element, said electrically insulating layer being obtained from a mixture comprising polyethylene and a styrene copolymer, wherein the polyethylene is a plurimodal polyethylene.... Agent: Sofer & Haroun LLP.
20090321109 - Printed circuit board and manufacturing method thereof: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on... Agent: Mcdermott Will & Emery LLP
20090321111 - Flexible printed circuit module: A flexible printed circuit module includes a main body and at least one connecting socket. The main body includes a first connecting end, a strip body and a second connecting end. The first connecting end and the second connecting end each includes a connector, disposed thereon respectively. The strip body... Agent: PCe Industry, Inc. Att. Steven Reiss
20090321110 - Micro electro-mechanical system: In one embodiment, a MEMS includes a MEMS chip package, a first printed circuit board (PCB), an anisotropic conductive layer, a second PCB and at least one electrical wire. The MEMS chip package includes an exposed connecting portion, and at least one metallic pad formed on the exposed connecting portion.... Agent: PCe Industry, Inc. Att. Steven Reiss
20090321112 - Rigid-flexible printed circuit board having a peelable mask and method of making: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method... Agent: Muncy, Geissler, Olds & Lowe, PLLC
20090321116 - Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each... Agent: Antonelli, Terry, Stout & Kraus, LLP
20090321114 - Electrical inspection substrate unit and manufacturing method therefore: An electrical testing substrate unit includes a multi-layer ceramic substrate formed of mullite and a borosilicate glass as predominant ceramic components. In the multi-layer ceramic substrate, the borosilicate glass contains an alkali metal oxide in an amount of 0.5 to 1.5 mass %. The multi-layer ceramic substrate has a mean... Agent: Stites & Harbison PLLC
20090321113 - High contrast transparent conductors and methods of forming the same: Methods of enhancing contrast ratio of conductive nanostructure-based transparent conductors are described. Contrast ratio is significantly improved by reduction of light scattering and reflectivity of the nanostructures through steps of plating the conductive nanostructures followed by etching or oxidizing the underlying conductive nanostructures.... Agent: Seed Intellectual Property Law Group PLLC
20090321115 - Manufacturing method of metal structure in multi-layer substrate and structure thereof: Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of... Agent: Austin Rapp & Hardman
20090321117 - A curable epoxy resin composition having a mixed catalyst system and laminates made therefrom: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system... Agent: The Dow Chemical Company
20090321121 - Ceramic multilayer substrate and its manufacturing method: A ceramic multilayer substrate having excellent migration resistance and high bonding strength between a resin sealing material and a ceramic multilayer substrate body, includes a laminated substrate body having lands, and external electrodes, and covered with a siloxane film formed by a PVD process. The thickness of the siloxane film... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP
20090321119 - Device mounting board, semiconductor module, mobile device, and manufacturing method of device mounting board: A device mounting board is provided with: a substrate structural unit including a substrate made of a composition containing amorphous silicon, a first adhesive layer provided on one of the main surfaces of the substrate, and a second adhesive layer provided on the other main surface of the substrate; a... Agent: Mcdermott Will & Emery LLP
20090321120 - Printed circuit board and electronic device: A printed circuit board according to the present invention includes a printed wiring board, first electrodes, second electrodes, third electrodes, solders, and a flip chip. The printed wiring board includes a first surface and a second surface which is opposite the first surface. The first electrodes are respectively formed on... Agent: Knobbe Martens Olson & Bear LLP
20090321118 - Printed circuit board embedded chip and manufacturing method thereof: An electronic component embedded printed circuit board and a manufacturing method thereof. The electronic component embedded printed circuit board includes an insulating layer forming a core layer; an electronic component inserted to project a part thereof on an upper part of the insulating layer; a metallic seed layer formed on... Agent: Staas & Halsey LLP
20090321123 - Method for producing structured electrically conductive surfaces: The invention relates to a method for producing structured, electrically-conductive surfaces (3, 11) on an electrically nonconductive support (1), in which the structured and/or full-area electrically-conductive surfaces (3) of a first plane are applied onto the support (1) in a first step, an insulating layer (9) is applied in a... Agent: Connolly Bove Lodge & Hutz, LLP
20090321122 - Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate: Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing... Agent: Mcdermott Will & Emery LLP
20090321124 - Semiconductor device and manufacturing process thereof: A pair of discretionary points on a principal surface of a block are coupled to each other with a metal wire having a length larger than a distance between the pair of discretionary points, liquid resin is applied to the principal surface so as to cover the metal wire and... Agent: Mcdermott Will & Emery LLP
20090321125 - Plastic land grid array (plga) module and printed wiring board (pwb) with enhanced contact metallurgy construction: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a... Agent: Ibm Corporation RochesterIPLaw Dept. 917
20090321126 - Concentric vias in electronic substrate: A multiwall via structure in an electronic substrate having multiple conductive layers. The multiwall via structure includes an outer via coupled to a pair of the conductive layers, an inner via within the outer via and coupled to the same pair of conductive layers, and a dielectric layer between the... Agent: Qualcomm Incorporated
20090321127 - Arrangement for energy conditioning: Circuit arrangement embodiments that use relative groupings of energy pathways that include shielding circuit arrangements that can sustain and condition electrically complementary energy confluences.... Agent: NeifeldIPLaw, PC
20090321128 - Shield structural body, connector assembly and connector structural body having shield structural body, casing assembly, and electric compressor: Disclosed are a shield structural body, a connector assembly and connector structural body using the shield structural body, a casing assembly having the connector assembly, and an electric compressor having the casing assembly. The shield structural body is formed of an electrically conductive material and has a tube section, a... Agent: Baker Botts LLP C/o Intellectual Property Department
20090321129 - Electrical junction box: An electrical junction box for an automotive vehicle. The junction box includes an upper cover and a lower cover. The lower cover may be constructed as a unitary one-piece molded body that defines a plurality of separate terminal cavities. Each of the separate terminal cavities is adapted to receive a... Agent: Brooks Kushman P.C. / Lear Corporation
20090321130 - Enclosure with integrated heat wick: An electrical enclosure system for transferring heat from a closed environment, includes an electrical device having a heat-generating part, and a polymer-based ventless housing for protecting the electrical device from environmental contaminants. The ventless housing fully encloses the electrical device and includes a base layer forming an impact-resistant portion of... Agent: Schneider Electric / Square D Company Legal Dept. - I.p. Group (np)12/24/2009 > patent applications in patent subcategories. patent applications/inventions, industry category
20090314508 - Faceplate and electronic device using same: An exemplary faceplate comprises a panel, a guiding ring and two hooks. The panel includes an inner surface and an opposite outer surface, on which a number of passageways are defined running through the inner and outer surface. The guiding ring is mounted on the inner surface of the panel... Agent: PCe Industry, Inc. Att. Steven Reiss
20090314509 - Electrical outlet cover plate: The present disclosure describes a plate assembly for an electrical outlet. In some embodiments, the plate assembly includes a strapping plate that is attachable to the electrical outlet, and a cover plate sub-assembly that is selectively attachable to the strapping plate. In some embodiments, the cover plate sub-assembly includes a... Agent: Fish & Richardson P.C.
20090314510 - Elastomeric conductors and shields: Systems and methods presented herein provide for elastic conductors. The elastic conductors may be configured with a primary that includes an elastic material and a conductive material. For example, the primary may have an elastic fiber, such as spandex, with a conductive material, such as a braided metal wire, wrapped... Agent: Duft Bornsen & Fishman, LLP
20090314511 - Shielded wire-grounding construction: The lead-out side end of a drain wire (11) led out from a shield wire (10) and either a conductor exposed to one end of a ground wire (50), to the other end of which a ground terminal (51) is connected, or a conductor exposed to one end of a... Agent: Oliff & Berridge, PLC
20090314512 - Conduit body with curved lip: A conduit body for wires or cables with a curved lip on the inlet that allows a user to manipulate less hazardously wires or cables placed through the chamber of the conduit body.... Agent: Price Heneveld Cooper Dewitt & Litton, LLP
20090314513 - Toneable conduit with loose toning signal wire: A toneable conduit includes an elongate polymeric tube having a sidewall with an interior surface and an exterior surface. The interior surface defines a main channel. A sub-channel, smaller in cross sectional area than the main channel, extends longitudinally between the exterior and interior surfaces of the tube. A continuous... Agent: Commscope By Muncy, Geissler, Olds & Lowe, PLLC
20090314514 - Low-smoke self-extinguishing cable and flame-retardant composition comprising natural magnesium hydroxide: Cables, in particular for low-voltage electrical energy distribution or for telecommunications, have low-smoke self-extinguishing properties, and flame-retardant compositions used therein.... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090314515 - Folding cord with rigid sections and magnets: An apparatus for the compact and neat storage of electrical cords, such as power extension cords and cords for earplugs and other devices. The cord may have repeating rigid sections which allow for the easy folding and grouping of the sections to allow for organized collection of portions of the... Agent: Michael A. Guth
20090314516 - Flexible signal transmission module and manufacturing method thereof: A flexible signal transmission module and a manufacturing method thereof are provided. The flexible signal transmission module includes a first connector, a first transmission strip, and a second transmission strip. The first and second transmission strips are respectively connected to the first connector and disposed side by side. The ends... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP
20090314517 - Communications cable with fabric sleeve: A communications cable (11) is provided with a pliant sleeve (12, 21, 31) to allow it to be more easily inserted into a conduit. One form of the sleeve (12) has hook (14) and loop (15) connected to each other so that the sleeve (12) can engage the cable (11).... Agent: Edward G. Greive Renner, Kenner, Greive, Bobak, Taylor & Weber
20090314518 - Cable insertion structure for outboard motor: In a cable insertion structure for an outboard motor, a pawl section and a supporting section of a resinous cap are inserted from the inside of a cowling into a communicating hole of a rubber grommet, and the pawl section is fitted into a recess. Then, the communicating section of... Agent: Yamaha Hatsudoki Kabushiki Kaisha C/o Keating & Bennett, LLP
20090314519 - Direct layer laser lamination for electrical bump substrates, and processes of making same: A microelectronic device includes a laminated mounting substrate including a die side and a land side with a surface finish layer disposed in a recess on the mounting substrate die side. An electrically conductive first plug is in contact with the surface finish layer and an electrically conductive subsequent plug... Agent: Intel Corporation C/o Cpa Global
20090314520 - Method and apparatus for spraying on a track, in particular a conductor track, and electrical component with a conductor track: A method and an apparatus for spraying a track, in particular a conductor track, onto a substrate under mild conditions, includes generating a cold plasma having a plasma temperature of less than 3000 K in a spray lance, introducing a powder into the spray lance with the aid of a... Agent: Lerner Greenberg Stemer LLP
20090314521 - Method for producing parts for passive electronic components and parts produced: Method for producing parts for passive electronic components according to which: a laminated strip (1) is produced which is constituted by at least one stack of a thin metal strip and a layer of adhesive material, and at least one part (6) is cut from the laminated strip (1), the... Agent: Sughrue Mion, PLLC
20090314522 - Printed circuit board with additional functional elements, method of production and use: The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally... Agent: Cooper & Dunham, LLP
20090314523 - Adhesive sheet with base for flexible printed wiring boards, production method therefor, multilayer flexible printed wiring board and flex-rigid printed wiring board: An adhesive sheet with a base for flexible printed wiring boards is provided, which has advantages of easiness of machining, excellent moldability, high rigidity and preventing the fall of resin dust particles during machining of a multilayer flexible printed wiring board or a flex-rigid printed wiring board. This adhesive sheet... Agent: Edwards Angell Palmer & Dodge LLP
20090314524 - Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof: Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and... Agent: Austin Rapp & Hardman
20090314525 - Mold for wiring substrate formation and process for producing the same, wiring substrate and process for producing the same, process for producing multilayered laminated wiring substrate and method for viahole formation: A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base... Agent: The Webb Law Firm, P.C.
20090314526 - Resin film, adhesive sheet, circuit board, and electronic apparatus: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a... Agent: Hogan & Hartson L.L.P.
20090314527 - Semiconductor device and manufacturing method thereof: To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body... Agent: Eric Robinson
20090314528 - Wiring board and wiring board manufacturing method: A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes... Agent: Ratnerprestia
20090314529 - Aqueous printable electrical conductors (xink): An aqueous printable electrical conductor (APEC) is defined as a dispersion comprising metal powder (with specific surface properties) dispersed into an aqueous acrylic, styrene/acrylic, urethane/acrylic, natural polymers vehicle (gelatine, soy protein, casein, starch or similar) or in a film forming reactive fatty acids mixture without a binder resin. The aqueous... Agent: Henkel Corporation
20090314530 - Method of aligning nanotubes and wires with an etched feature: A method of forming an aligned connection between a nanotube layer and an etched feature is disclosed. An etched feature is formed having a top and a side and optionally a notched feature at the top. A patterned nanotube layer is formed such that the nanotube layer contacts portions of... Agent: Wilmerhale/boston
20090314531 - Method of making multilayered construction for use in resistors and capacitors: The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically... Agent: Richard S. Roberts Roberts & Roberts, LLP, Attorneys At Law
20090314532 - Thermosetting resin composition, dry film including thermosetting resin composition, and multilayer printed wiring board including thermosetting resin composition: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at... Agent: Ditthavong Mori & Steiner, P.C.
20090314533 - Adhesive for bonding circuit members, circuit board and process for its production: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the... Agent: Antonelli, Terry, Stout & Kraus, LLP
20090314534 - Electronic component: An electronic component (1) is provided with a circuit board (2) having a plurality of electrodes on the upper and lower planes of an insulating substrate, and a circuit element (7) fixed to the upper plane of the circuit board (2). The electronic component is also provided with an upper... Agent: Mots Law, PLLC
20090314535 - Printed board: A printed board is provided, which includes at least a first connecting electrode and a second connecting electrode. A solder is provided over the first connecting electrode and the second connecting electrode, and a chip component is provided over the solder. The chip component includes a first terminal electrode and... Agent: Cook Alex Ltd
20090314536 - Printed circuit board, electric instrument, and semiconductor package: A printed circuit board, an electronic instrument, and a semiconductor package are provided that are excellent in bonding strength and easy in rework. The printed circuit board includes a printed wiring board, an electronic device that is the semiconductor package, and an adhesion part. A protection member of the electronic... Agent: Knobbe Martens Olson & Bear LLP
20090314537 - Conductive connecting pin and package substrate: A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20090314538 - Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second... Agent: Intel Corporation C/o Cpa Global
20090314539 - Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods: An electromagnetic noise suppressor of the present invention includes a base material containing a binding agent and a composite layer formed by integrating the binding agent that is a part of the base material and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the... Agent: Ostrolenk Faber Gerb & Soffen
20090314540 - Composite housing using biodegradable plastics and manufacturing method thereof: A composite housing using biodegradable plastics comprises: a metallic plate; a layer of adhesive coated on an inner face of the metallic plate; and a layer of biodegradable plastics laminated on a coating face of the layer of adhesive coated on the metallic plate, wherein the metallic plate is formed... Agent: Staas & Halsey LLP
20090314541 - Expandable power distribution unit: A power distribution unit includes a first power box including a first chamber having a first termination zone, wherein a first wire set from a supply conduit is configured to be terminated at the first termination zone. The power distribution unit also includes a second power box ganged together with... Agent: Lisa Burgin Vaccarelli Tyco Technology Resources
20090314542 - Tag enclosing structure: A RFID tag enclosing structure withstands: temperatures ≦200° C.≦90 minutes; a maximum read operational temperature of 130° C.; water submersions ≦2 m≦2 hours; contact with alkaline acids with pH of 4-13; contact with solvents; severe vibrations having acceleration ≦14.7 g at 40 Hz in three directions ≦3 hours; impacts at... Agent: Young & Thompson12/17/2009 > patent applications in patent subcategories. patent applications/inventions, industry category
20090308630 - Lightning arrester: Provided is a lightning arrester capable of preventing damage caused by a lightning by discharging charges charged by approach of a thundercloud. The lightning arrester includes: a conductive rod installed at an upper part of an object to be protected from a lightning and connected to a ground part; a... Agent: Ballard Spahr LLP
20090308631 - Systems and methods for cable management: A method for cable management in an electronics enclosure is disclosed. The method involves extruding at least one length of material that forms a cable guide having a plurality of partitions defined by one or more cable dividers and two end clip flanges, where the end clip flanges each have... Agent: Fogg & Powers LLC
20090308632 - Shielded conductor: A shielded conductor A comprising a shield pipe 10 made of metal; a flexible shield member 20 which is made of metal and is connected to an end portion of the shield pipe 10; and an electric wire 30 which is shielded by being inserted into the shield pipe 10... Agent: Oliff & Berridge, PLC
20090308633 - Longitudinal shield tape wrap applicator with edge folder to enclose drain wire: A shielded electrical wire and device and method for making the same is disclosed. The device includes a first folding die configured to fold a first edge of a shield tape a first direction from a central portion of the shield tape and to fold a second edge of the... Agent: Blank Rome LLP
20090308634 - Communication cable of high capacity: In communication cable of high capacity according to present invention, conductor of diameter d is coated by insulation material to form wire of diameter D, plural number of said wire are twisted by pitch p to form pairs, plural number of said pairs are twisted by collective pitch P, and... Agent: Sherr & Vaughn, PLLC
20090308635 - Sputtering target, transparent conductive film, and transparent electrode for touch panel: A sputtering target which is composed of a sintered body of an oxide containing indium, tin and zinc as main components; the atomic ratio of In/(In+Sn+Zn) being 0.10 to 0.35; the atomic ratio of Sn/(In+Sn+Zn) being 0.15 to 0.35; and the atomic ratio of Zn/(In+Sn+Zn) being 0.50 to 0.70; and... Agent: Millen, White, Zelano & Branigan, P.C.
20090308636 - In-situ silicon cap for metal gate electrode: Structure and method of improving the performance of metal gate devices by depositing an in-situ silicon (Si) cap are disclosed. A wafer including a substrate and a dielectric layer is heated through a degas process, and then cooled to approximately room temperature. A metal layer is then deposited, and then... Agent: Hoffman Warnick LLC
20090308637 - Steel core for an electric transmission cable and method of fabricating it: An electric transmission-cable is provided, comprising a cable core having at least two individually coated and stranded wires, and a conductor surrounding the core, wherein the core is compacted. Further, a method of fabricating such compacted steel core is provided.... Agent: Foley And Lardner LLP Suite 500
20090308639 - Flexible printed circuit board: A flexible printed circuit board that can be used for mounting a light emitting diode. The flexible printed circuit board includes a lower insulator, an upper insulator, and a conductive pattern disposed between the upper and lower insulators. A white film is attached to the top of the upper insulator.... Agent: H.c. Park & Associates, PLC
20090308638 - Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board: Provided are a flexible printed circuit board (PCB), which can contribute to the reduction of damage to wiring layers and wiring defects regardless of a decrease in the width of wiring layers and can thus contribute to the miniaturization of various products, a method of fabricating the flexible PCB, and... Agent: F. Chau & Associates, LLC
20090308641 - Chip having side protection terminal and package using the chip: A chip includes a chip body having an upper surface on which an active surface is formed, and at least one side protrusion terminal protruding from a lateral surface of the chip body and electrically connected to the active surface. As a plurality of semiconductor chips or parts may be... Agent: F. Chau & Associates, LLC
20090308642 - Thermosetting resin composition: A thermosetting resin composition contains, as essential components, (A) an epoxy resin having at least two epoxy groups in its molecule, (B) a thermoplastic polyhydroxy polyether resin having a fluorene skeleton, (C) an epoxy curing agent, and (D) a filler. A dry film is obtained by forming a thin film... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20090308640 - Wafer level package and method of manufacturing the same: Provided is a wafer level package including a first substrate that has circuit patterns provided on the top surface thereof and first vias formed therein, the first vias being electrically connected to the circuit patterns; and a second substrate that is bonded to the bottom surface of the first substrate... Agent: Staas & Halsey LLP
20090308643 - Crosslinkable thermoset monomer, composition for producing printed circuit board comprising the thermoset monomer and printed circuit board using the composition: Disclosed herein is a crosslinkable thermoset monomer. The crosslinkable thermoset monomer has acetylene groups as crosslinking groups introduced at both ends of the backbone. Also disclosed herein is a composition for producing a printed circuit board which comprises the crosslinkable thermoset monomer. The composition exhibits excellent mechanical and thermal properties.... Agent: Cantor Colburn, LLP
20090308647 - Circuit board with buried conductive trace formed thereon and method for manufacturing the same: A circuit board with a buried conductive trace formed thereon according to the present invention is provided. A buried conductive trace layer is formed on the surface of a substrate and the pads and fingers of the conductive trace layer are heightened to facilitate the subsequent process of molding.... Agent: Lowe Hauptman Ham & Berner, LLP
20090308644 - Method for manufacturing pcb and pcb manufactured using the same: The present invention relates to a Printed Circuit Board (PCB), and, more particularly, to a printed circuit board in which a special-purpose dot circuit and an external circuit are simultaneously formed in order to improve electrical efficiency, for example by decreasing impedance and electromagnetic waves, and a method of manufacturing... Agent: Park Law Firm
20090308645 - Printed circuit board and manufacturing method thereof: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board having a circuit pattern formed therein includes a substrate having a groove formed therein, the groove corresponding to the circuit pattern; a first circuit pattern formed inside the groove; and a second circuit pattern formed... Agent: Staas & Halsey LLP
20090308648 - Printed board and image formation apparatus: A printed board having an input/output terminal that connects with a component in an image formation apparatus through a cable, and a control circuit that controls the component, the printed board which includes a conductive pattern on which a capacitor that suppresses an emission of an electromagnetic wave from the... Agent: Oliff & Berridge, PLC
20090308650 - Printed circuit board and method of manufacturing the same: The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the... Agent: Staas & Halsey LLP
20090308649 - Printed circuit board with reduced signal distortion: A printed circuit board with reduced signal distortion, including one or more layers of non-conductive substrate upon which are disposed conductive pathways that conduct signals, the signals characterized by distortion at least partly caused by orientation of the conductive pathways on the layers of the printed circuit board, and a... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP
20090308652 - Package substrate having double-sided circuits and fabrication method thereof: A package substrate having double-sided circuits and a method of manufacturing the same are proposed. The package substrate includes a core board having a plated through hole, a plurality of first electrical contact pads, and a first solder mask layer formed on the core board. A first wiring layer and... Agent: Schmeiser Olsen & Watts
20090308651 - Wiring substrate including conductive core substrate, and manufacturing method thereof: A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface... Agent: Fujitsu Patent Center C/o Cpa Global
20090308653 - Shielding device: A shielding device for serving as an electromagnetic shield includes a shield body having a top piece and a plurality of sidewall pieces, and an electromagnetic band-gap (EBG) structure disposed on the top piece of the shield body.... Agent: North America Intellectual Property Corporation
20090308654 - Multi position divider clip: The present invention is directed toward a divider clip that holds a divider wall in a multi-channel raceway. The divider clip includes a base and sidewalls extending from ends of the base. The divider clip also includes removable clip fingers that extend from the base. One of the removable clip... Agent: Panduit Corp.
20090308655 - Combination extruded and cast metal outdoor electronics enclosure: A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at... Agent: Fogg & Powers LLC12/10/2009 > patent applications in patent subcategories. patent applications/inventions, industry category
20090301747 - Ground electrode: A land electrode for a high voltage direct current transmission system including a converter station with a grounding point. The land electrode is connected to the grounding point and includes a plurality of electrode sections. Each electrode section includes at least one electrode element.... Agent: Venable LLP
20090301748 - Housing, electronic device using the housing, and manufacturing method thereof: A housing includes a thin film comprising transparent plastic and color particles, a protecting film attached to the thin film; and a substrate attached to the protecting film. A method for manufacturing the housing and an electronic device using the housing are also disclosed.... Agent: PCe Industry, Inc. Att. Steven Reiss
20090301749 - Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap: A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap (1, 30) includes a base member (2), a first plating layer (3, 31)... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090301777 - Apparatuses, systems, and methods for inhibiting the removal of cable from conduit: Apparatuses, systems, and methods for securing one or more wires or cables relative to a conduit, for example, an underground conduit, an above ground conduit, or a conduit disposed in a building. The inhibiting device can hinder or prevent the removal of such wires or cables from the conduit by... Agent: Mark D Miller Kimble, Macmichael & Upton
20090301750 - Hot-vulcanizable polyorganosiloxane compositions useful particularly for manufacturing electrical cables or wires: A polyorganosiloxane composition that can be vulcanized at high temperature to a silicone elastomer, useful in the field of the manufacture of electrical wires or cables having an improved fire performance is provided. The composition includes a semi-reinforcing filler chosen from the group composed of:—calcined kaolin powders, preferably that have... Agent: Baker Donelson Bearman, Caldwell & Berkowitz, PC
20090301752 - Ethylene/tetrafluoroethylene copolymer and method for its production: The ethylene/tetrafluoroethylene copolymer is produced by polymerizing ethylene with tetrafluoroethylene in an organic solvent containing no chlorine atoms as a polymerization medium, in the presence of a chain transfer agent containing no chlorine atoms and a polymerization initiator containing no chlorine atoms, and further in the substantial absence of a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.
20090301751 - Non-halogen flame retardant thermoplastic elastomer resin composition, method for fabricating same, and electric wire and cable using the same: A non-halogen flame retardant thermoplastic elastomer resin composition includes (A) 30 to 80 parts by weight of an ethylene-methylacrylate copolymer (EMA) containing 30 mass % or more of a methylacrylate or 30 to 80 parts by weight of an ethylene-ethylacrylate copolymer (EEA) containing 15 mass % or more of a... Agent: Scully Scott Murphy & Presser, PC
20090301753 - Polyamide-imide resin insulating varnish and insulated wire using the same: A polyamide-imide resin insulating varnish includes an aromatic diamine component, an aromatic diisocyanate component, an acid component including an aromatic tricarboxylic acid anhydride, and a solvent. The aromatic diamine component includes an aromatic diamine with three or more benzene rings and an aromatic diamine with two or less benzene rings.... Agent: Scully Scott Murphy & Presser, PC
20090301754 - Cable management system: Methods and apparatus for connecting multiple conductors are described. One method includes providing a first conductor having a first outer jacket with a first mating feature. A second conductor having a second outer jacket with a second mating feature is positioned adjacent to the first mating feature of the first... Agent: Nicole Daphne Tricoukes
20090301755 - Flat cable for mounted display devices: A flat high definition multimedia interface (HDMI) cable. The flat cable that is less visible in comparison to a round HDMI cable for wall mounted television setup. An HDMI connector is coupled to the flat cable. An active circuit isolates physical characteristics of the HDMI connector. The active circuit causes... Agent: Sony C/o Murabito, Hao & Barnes LLP
20090301756 - Insulated wire and a wiring harness: An insulated wire possessing flame retardancy, and wear resistance which is superior to a conventional insulated wire, which includes a conductor, an inside coat of one or more layers arranged to cover the conductor, and an outside coat arranged to cover the outermost layer of the inside coat, wherein at... Agent: Oliff & Berridge, PLC
20090301757 - Method and system for composite bond wires: Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture.... Agent: Haynes And Boone, LLPIPSection
20090301758 - Protector: Locking hooks 26a are engaged with and locked into locking hook engaging frames 26b, the locking hooks 26a being provided in a lower end portion on both sides in a width direction of a lid 12, the locking hook engaging frames 26b being provided in an upper end portion on... Agent: Greenblum & Bernstein, P.L.C
20090301759 - Modular electric fence system and assembly: A modular insulator system and assembly for attaching a conductor to a support member. The modular insulator assembly includes an insulator body attachable to a support member. A conductor retainer is attachable to the insulator body in a manner that forms a conductor passage between the conductor retainer and the... Agent: Holland Law Office P.l.l.c.
20090301761 - Cable assembly having connector with interior printed circuit board facilitating termination: A cable assembly includes an insulated housing (100) and a plurality of contacts (10) received therein, each contact having a tail portion extending beyond rear surface of the insulated housing; a printed circuit board (2) having a front portion and an opposite rear portion, with a plurality of conductive traces... Agent: Wei Te Chung Foxconn International, Inc.
20090301763 - Ink, method of forming electrical traces using the same and circuit board: An exemplary ink for forming electrical traces includes a plurality of noble-metal-coated diacetylene vesicles formed by combining a noble-metal-ions-containing aqueous solution with diacetylenic monomers each including a hydrophilic group and a lipophilic group. The noble metal ions are attracted to an external surface of each of the diacetylene vesicles.... Agent: PCe Industry, Inc. Att. Steven Reiss
20090301764 - Method for smoothing electrode, method for manufacturing ceramic substrate, and ceramic substrate: A method is provided for efficiently and securely smoothing a surface of an electrode disposed on a base, such as a ceramic substrate, without damaging the electrode or the base. The electrode is fired by a non-shrinkage process using a constraining layer and is separated from the constraining layer. The... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP
20090301760 - Method of soldering a module board: m
20090301762 - Oligomeric halogenated chain extenders for preparing epoxy resins: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with... Agent: The Dow Chemical Company
20090301765 - Printed circuit board: A printed circuit board is provided with at least one via hole, in which a heat dissipating element is arranged, wherein at least one radiant source is arranged on the heat dissipating element. The lighting device is provided with at least one such printed circuit board.... Agent: Viering, Jentschura & Partner - Osr
20090301767 - Printed circuit board and method of manufacturing the same: Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical... Agent: Staas & Halsey LLP
20090301766 - Printed circuit board including electronic component embedded therein and method of manufacturing the same: Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.... Agent: Staas & Halsey LLP
20090301770 - Embedded thin films: A method for forming a film on a conductive substrate, comprising immersing a substrate having a conductive portion in a solution comprising a metal ion ceramic precursor for the film and a peroxide; applying a voltage potential to the conductive portion with respect to a counter electrode in the solution,... Agent: Hoffberg & Associates
20090301769 - Method for manufacturing conductors and semiconductors: The invention relates to a sintering method for manufacturing structures by sintering. In addition, the invention relates to a sintered product, an electronic module, and new uses. In the method, a particle material containing conductive or semiconductive encapsulated nanoparticles is sintered, in order to increase its electrical conductivity, by applying... Agent: Birch Stewart Kolasch & Birch
20090301768 - Printed circuit board: A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole.... Agent: PCe Industry, Inc. Att. Steven Reiss
20090301771 - Conductive bump, method for forming the same, and electronic component mounting structure using the same: A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the... Agent: Wenderoth, Lind & Ponack L.L.P.
20090301772 - Filter and display device having the same: A filter for a display device is provided which includes a base substrate, an electromagnetic shielding layer formed on one surface of the base substrate to block electromagnetic waves, and an electrode formed along at least two sides among four sides of the base substrate to earth the electromagnetic shielding... Agent: Lerner, David, Littenberg, Krumholz & Mentlik
20090301773 - Shielding cage having improved gasket: A shielding cage (1) partially mounted to an opening (31) defined through a panel (3) for at least an electrical module. The shielding cage has a cage body (13) and a gasket (14) mounted around a front portion of the cage body. The cage body has a number of side... Agent: Wei Te Chung Foxconn International, Inc.
20090301774 - Electrical floor access module system: An electrical system (500) is positioned beneath an access floor (30) and includes a number of access floor modules (502) for providing electrical power locations for energizing electrical devices. Cable assemblies (578) electrically interconnect the modules (502) to the power source and to each other. Junction blocks (518) are mechanically... Agent: Varnum, Riddering, Schmidt & Howlett LLP
20090301775 - Wired circuit board and electronic device: A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating... Agent: Akerman Senterfitt
20090301776 - Electrical junction box with fastener knockout feature and method: A Chicago-style plenum-type electrical junction box provides an air impermeable barrier between a box support structure and a junction enclosure. The junction box comprises a base plate and a peripheral wall, the peripheral wall extending from the base plate such that the base plate and peripheral wall define the junction... Agent: Meroni & Meroni, P.C.12/03/2009 > 27 patent applications in 22 patent subcategories. patent applications/inventions, industry category
20090294170 - Systems for efficient insulation of electrical structures: An animal deterrent system to be placed on structures such as electrical apparatus to deter and protect birds, wildlife and other animals. Specifically, a perching deterrent having a saddle made to fit over any desired member of a structure and deterrent extensions may be used separately or in combination. The... Agent: Santangelo Law Offices, P.C.
20090294146 - Communication cable with improved crosstalk attenuation: The present invention relates to a barrier tape used as part of a communication cable to improve crosstalk attenuation. The barrier tape is provided with one or more barrier layers of discontinuous conductive segments. Conductive segments of one barrier layer are preferably sized and shaped to overlie gaps between conductive... Agent: Panduit Corp.
20090294147 - Enclosure for electrical receptacle: An enclosure for an electrical receptacle includes walls having one or more recesses for receiving associated electrical conductors. The recesses may be covered by at least a first membrane enclosing the recess. The conductors may be manually inserted through the membrane wherein the membrane and/or the recess is self-sealing to... Agent: Hahn Loeser / Lincoln
20090294148 - Wall plate with a multiple flexible member covered opening: The present disclosure is a wall plate with a multiple flexible member covered opening. A wall plate with a multiple flexible member covered opening may allow for multiple types of wires to run through the same wall box and wall plate. Wall plate may be designed to directly attach to... Agent: Ibm Corporation (swp)
20090294149 - Shield conductor and shield conductor manufacturing method: A shield conductor Wa comprises: a metallic pipe 20, a wire 10 to be inserted into the pipe 20, and a groove-like fitting member 22 provided in the pipe 20 as extending along the direction of axis of the wire 10, and at the same time, attached tightly to the... Agent: Oliff & Berridge, PLC
20090294150 - Energy saving cable assemblies: A cable assembly for use with any power cable for an electrical device, the cable assembly including a remotely locatable switch for connecting or disconnecting the electrical device from power draw. Also, a cable assembly for a power device such as a charger for providing output power to an electronic... Agent: Greenberg Traurig, LLP
20090294151 - Skin cured ptfe wire and cable: A wire having a conductor and an insulation where the insulation has a first inner layer of an uncured material and a second outer layer of a cured material.... Agent: Sofer & Haroun LLP.
20090294152 - Printed circuit board: A printed circuit board includes a ground layer and a signal layer. The ground layer has a grid formed by grid lines. A pair of signal traces is laid on the signal layer. The pair of signal traces is symmetrical about one grid line or one central line of the... Agent: PCe Industry, Inc. Att. Steven Reiss
20090294153 - Printing using a structure coated with ultraviolet radiation responsive material: Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process... Agent: The Nath Law Group
20090294154 - Printed circuit board providing heat dissipation: A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other.... Agent: PCe Industry, Inc. Att. Steven Reiss
20090294155 - Flexible printed circuit board, shield processing method for the circuit board and electronic apparatus: According to one embodiment, there is provided a flexible printed circuit board including a base layer, a signal layer formed on a surface of the base layer, a cover layer covering the signal layer, a connecting pattern portion formed in the signal layer, an opening formed in the cover layer... Agent: Knobbe Martens Olson & Bear LLP
20090294156 - Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board: An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality... Agent: Stites & Harbison PLLC
20090294157 - Electro-optic device and method for manufacturing the same:
20090294159 - Advanced print circuit board and the method of the same: The present invention provides a multilayer print circuit board having at least an inner print circuit pattern and an outer print circuit pattern which are laminated on a substrate through an insulation layer and being electrically connected to each other through a blind hole provided in the insulation layer. The... Agent: Muncy, Geissler, Olds & Lowe, PLLC
20090294158 - Electronic circuit and method for manufacturing same: To provide an electronic circuit board in which a conductive wire is excellently connected to a bonding pad formed directly on a polyimide film. The electronic circuit includes: a first layer metal pattern 3 formed on a substrate 1; a polyimide film 2 formed on the first layer metal pattern... Agent: Antonelli, Terry, Stout & Kraus, LLP
20090294160 - Method of making printed wiring board and electrically-conductive binder: A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder.... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090294161 - Core substrate and printed wiring board: The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090294162 - Printed circuit board and manufacturing method thereof: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board, having an electronic component mounted thereon, in accordance with an embodiment of the present invention includes: a substrate having a circuit pattern and a pad formed on one side thereof; a solder resist layer formed... Agent: Staas & Halsey LLP
20090294163 - Display device, method of laying out wiring in display device, and electronic device: A display device includes: a pixel array section having pixels arranged in a form of a matrix on a display panel; a first terminal group disposed on the display panel so as to correspond to each control line of a first control line group arranged in each pixel row of... Agent: Rader Fishman & Grauer PLLC
20090294164 - Printed circuit board including landless via and method of manufacturing the same: Disclosed herein is a printed circuit board including a landless via and a method of manufacturing the printed circuit board. The printed circuit board includes a landless via having no upper land. The via includes a circuit pattern having a line width smaller than the minimum diameter of the via.... Agent: Staas & Halsey LLP
20090294165 - Method of manufacturing a printed circuit board: A method of manufacturing a printed circuit board (PCB) includes of disposing thermal transfer vias and electrical vias through the PCB. The method further includes filling holes of the vias with a solder mask. The thermal transfer vias are filled to about 70% of capacity while the electrical vias are... Agent: Howard & Howard Attorneys PLLC
20090294167 - Multilayer wiring board: A multilayer wiring board is capable of preventing the occurrence of cracking in the vicinity of a connection portion of a conductor pattern disposed inside a basic material layer and a via-hole conductor even when the conductor pattern is connected to the via-hole conductor. A multilayer wiring board includes basic... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP
20090294166 - Printed wiring board: Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via.... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090294168 - Printed circuit board: A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer... Agent: PCe Industry, Inc. Att. Steven Reiss
20090294169 - Printed circuit board fabrication method, printed circuit board obtained thereby, and printed circuit board fabrication apparatus: A printed circuit board includes a through hole constituted by a hole penetrating through the front and rear surfaces of the printed circuit board. A fabrication method of the printed circuit board, includes applying conductive material plating to the inner wall surface of the hole to form a through hole... Agent: Staas & Halsey LLP
20090294171 - Case assembly structure and electronic device with same: The present invention provides a case assembly structure of an electronic device. The case assembly structure includes a first case, a second case and a heat-dissipating element. The first case has an engaging hole and a first opening. The second case has an engaging element engaged with the engaging hole... Agent: Kirton And Mcconkie
20090294172 - Electrical junction box: This invention provides an electrical junction box that can restrain a temperature from increasing in a casing. An electrical junction box 10 comprises a casing 11 made of a synthetic resin material, a circuit board 12 contained in the casing 11, semiconductor relays 32 mounted on the circuit board 12,... Agent: Oliff & Berridge, PLCPrevious industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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