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Electricity: conductors and insulators November recently filed with US Patent Office 11/09

20090288852 - Electronic device and method of manufacturing the same: An electronic device of the present invention has a substrate; an electro-conductive pattern (electrodes) provided over the substrate; a semiconductor chip mounted over the substrate, and electrically connected with the electrodes; a resin cap provided over the substrate and composed of two or more resin layers to hollow-sealing the semiconductor... Agent: Mcginn Intellectual Property Law Group, PLLC

20090288853 - Adapter for mounting a faceplate of a first style to an electrical outlet cavity of a second style: Apparatus for coupling a signal between a wiring and a device. Junction box mounting is popular in North America, whereas cavity mounting is popular in Europe and the Middle East. The apparatus includes an adapter and provides universal mounting for specialized faceplates which are designed and intended for junction box... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090288854 - Apparatus for positive, low-cost scalding prevention for hot water heaters: This invention provides a low-cost, life-saving, scalding protection against an unwanted change, in the temperature control knob on a hot-water heater. It is simple to install and operate, so as to invite apartment owners and operators to readily install this scald-prevention apparatus. It does not wear-out over time nor does... Agent: Abraham N. Seidman

20090288855 - Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material: The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090288856 - Multi-coated electrode and method of making: Various embodiments provide an electrode comprising a conductive substrate, a first layer of a mixture comprising iridium oxide in a crystalline phase and tantalum oxide in an amorphous phase on a portion of an outer surface of the conductive substrate, and a second layer of the mixture comprising iridium oxide... Agent: Snell & Wilmer LLP (freeport)

20090288858 - Circuit structure and manufacturing method thereof: A manufacturing method of a circuit structure is provided as follows. Firstly, a base conductive layer is formed on the carrier board and a first patterned plating-resistant layer having at least one trench for exposing a part of the base conductive layer is formed on the base conductive layer. A... Agent: J C Patents

20090288857 - Multilayer printed circuit board and method for manufacturing same: Disclosed is a multilayer wiring board in which a copper foil is bonded by a thermocompression bonding onto an insulating layer having a bump for interlayer connection buried therein, and the copper foil and the bump are electrically connected to each other. The copper foil is provided with an oxide... Agent: K&l Gates LLP

20090288859 - Non-cylinder via structure and thermal enhanced substrate having the same: A thermal enhanced substrate having a non-cylinder via structure includes at least a metal layer disposed on an insulating base material and a number of thermal channels respectively constituted by at least a trough pattern penetrating the insulating base material and a conductive material deposited in the trough pattern. The... Agent: J C Patents

20090288860 - Flexible printed circuit and method for making same: A flexible printed circuit (100) includes a main body (10) and at least one grounding layer (30). The main body includes a first connecting end (11), a band portion (12) and a second connecting end (13). The first connecting end and the second connecting end dispose a first connector (112)... Agent: PCe Industry, Inc. Att. Steven Reiss

20090288861 - Circuit board with buried conductive trace formed thereon and method for manufacturing the same: A circuit board with a buried conductive trace formed thereon according to the present invention is provided. A buried conductive trace layer is formed on the surface of a substrate and the pads of the conductive trace layer are plated with a layer of copper so that the pads are... Agent: Lowe Hauptman Ham & Berner, LLP

20090288862 - Wired circuit board and producing method thereof: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, a tin-based thin layer formed on a surface of the conductive pattern, and containing at least tin oxide, and an insulating cover layer formed on the insulating base layer so as to... Agent: Akerman Senterfitt

20090288863 - Glass composition with low coefficient of thermal expansion, glass fiber, insulating layer of printed circuit board and printed circuit board: The present invention relates to a glass composition having a low thermal expansion coefficient, a glass fiber, an insulating layer of printed circuit board and a printed circuit board. A glass fiber, an insulating layer of printed circuit board and a printed circuit board may be obtained by employing a... Agent: Christensen, O'connor, Johnson, Kindness, PLLC

20090288864 - Cable having esd dissipative adhesive electrically connecting leads thereof: A cable in one embodiment comprises a plurality of leads; and an electrostatically dissipative adhesive operatively electrically coupling the leads together, the adhesive comprising a mixture of an adhesive material and electrically conductive particles intermixed with the adhesive material. A method in one embodiment comprises applying an electrostatically dissipative adhesive... Agent: Zilka-kotab, PC- Ibm

20090288865 - Display device and electronic apparatus: A display device includes an anode electrode provided for each pixel, an opening insulation film which covers the periphery of the anode electrode and which defines an pixel opening, and a storage capacitor disposed below the anode electrode through a planarizing insulation film, having a function to store charge for... Agent: Sonnenschein Nath & Rosenthal LLP

20090288866 - Electronic carrier board: An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and... Agent: Edwards Angell Palmer & Dodge LLP

20090288867 - Circuit structure and photomask for defining the same: A circuit structure and a photomask for defining the same are described. The circuit structure includes a plurality of pickup pads and a plurality of lines in parallel, in which a part of the lines arranged contiguously are each disposed with a pickup pad. The pickup pad of any line... Agent: Jianq Chyun Intellectual Property Office

20090288869 - Curvilinear wiring structure to reduce areas of high field density in an integrated circuit: A method for reducing areas of high field density in an integrated circuit is disclosed. In one embodiment, the method includes forming a first curvilinear wiring structure in a first interconnect layer of an integrated circuit. A second curvilinear wiring structure may be formed in a second interconnect layer of... Agent: Ibm Washington - Nelson And Nelson

20090288868 - Signal connecting component: A signal connecting component is suitable to be disposed on a circuit board. The signal connecting component includes an insulation element, at least a first bridge line, at least a second bridge line, a plurality of first pins and a plurality of second pins. The first bridge line and the... Agent: J C Patents

20090288870 - Wiring substrate and method of manufacturing the same: A method of manufacturing a wiring substrate of the present invention, includes a step of forming a first wiring layer on an underlying layer, a step of forming a stacked body in which a protection layer is provided on an insulating layer, on the first wiring layer, a step of... Agent: Kratz, Quintos & Hanson, LLP

20090288872 - Printed circuit board including outmost fine circuit pattern and method of manufacturing the same: Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so... Agent: Staas & Halsey LLP

20090288871 - Thin film circuit board device: A thin film circuit board device includes: a first thin film circuit board having a first protrusion provided with a first conductive contact; a second thin film circuit board having a second protrusion provided with a second conductive contact; and an insulator film disposed between the first and second thin... Agent: Abelman, Frayne & Schwab

20090288873 - Wiring board and method of manufacturing the same: A wiring board is provided. The wiring board includes: a resin substrate having a through-hole therethrough; metal foil patterns formed on the resin substrate; and a first wiring layer formed on the metal foil patterns and on an inner surface of the through-hole, wherein the first wiring layer includes: a... Agent: Drinker Biddle & Reath (dc)

20090288874 - Simultaneous and selective partitioning of via structures using plating resist: Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with... Agent: Loza & Loza

20090288875 - Electromagnetic wave shielding mesh: Provided is an electromagnetic wave shielding mesh, which is arranged on the front face of a display such as a PDP (Plasma Display Panel) or an FED (Field Emission Display) thereby to shield the leakage of electromagnetic waves. The electromagnetic wave shielding mesh has excellent light transmitting and electromagnetic wave... Agent: Greer, Burns & Crain

20090288876 - Environmental protection coating system and method: A circuit board assembly includes a circuit board having an outer surface that is configured with a plurality of discrete electrical components that are each manufactured independently of one another. The circuit board assembly further includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer... Agent: Baker Botts LLP

20090288877 - Wire fitting: The present invention is directed to a wire fitting that may be used to pass a wire, cable or other conductor through a surface in order to produce a substantially secure and water tight connection between the wire fitting, the wire and the surface. The wire fitting may include a... Agent: Ware Fressola Van Der Sluys & Adolphson, LLP

20090288878 - Bushing and a method for producing the same: A bushing is disclosed with a duct for accommodating a conductor which is surrounded by an electrical field grading insulation. The bushing includes a core with a shell encapsulating the grading insulation and a flange surrounding the shell and carrying through holes distributed over its circumference for allowing the bushing... Agent: Buchanan, Ingersoll & Rooney PC

20090283287 - Device for preventing electrically induced fires in gas tubing: The present invention provides a device for preventing electrically induced gas fires involving gas tubing such as Corrugated Stainless Steel Tubing (CSST) and gas appliance connectors (GAC). Connectors for coupling the gas tubing to gas lines and appliances are affixed at each end of the tubing. These connectors are made... Agent: Carstens & Cahoon, LLP

20090283288 - Communication cable for high frequency data transmission: A communication cable for high-frequency data-transmission, includes a core including at least one group of twisted insulated conductors; an inner jacket of insulating polymeric material enclosing the core; and an outer jacket of a conductive polymeric material enclosing the cable core and inner jacket. The outer jacket has a sufficiently... Agent: Martin D. Moynihan D/b/a Prtsi, Inc.

20090283289 - Wedge retention assembly: A cable wedge assembly that can streamline installation of cabling assemblies upon trees and other structures is provided. For example, the cable wedge assembly need not require specialized tools for installation. Rather, the unique features and functions of the assembly attach to a cable merely by inserting a cable through... Agent: Turocy & Watson, LLP

20090283290 - Vacuum device: An object is to sufficiently keep the airtightness in a vacuum container even when it is made smaller. A photomultiplier tube 1 comprises a flat sheet-like lower substrate 4, a casing-like frame 3b erected on the lower substrate 4, an upper substrate 2 including a frame 3a airtightly joined to... Agent: Drinker Biddle & Reath (dc)

20090283291 - Face slide weatherproof electric enclosure: A weatherproof outlet enclosure is provided for connections between a number of electrical outlets and various electric loads comprising: at least one rectangular slider plate for replacing existing receptacle face plate in a gentle sliding way; a base plate for mating with a predetermined number of the slider plates which... Agent: Law Offices Of S.j. Christine Yang

20090283292 - Junction box cover assembly: A junction box cover assembly for mounting a fixture on a wall or ceiling. The assembly includes an adapter plate for being mounted on a junction box. A patch for supporting the cover assembly on the wall or ceiling in a mounted condition is provided. The patch is adapted to... Agent: Abelman, Frayne & Schwab

20090283293 - Cusion grip twist-on wire connector: A twist-on wire connector having a finger friendly cushion cover that covers not only the normal hand gripping region but at least part or all of the normal non-hand gripping region of the twist-on wire connector so that regardless of the way the twist-on wire connector is grasped the user... Agent: Jacobson And Johnson

20090283294 - Cover assembly for cables and electrical connections and methods for using the same: A cover assembly for covering an electrical substrate includes a double-walled, tubular sleeve defining an interior cavity between the walls thereof. The sleeve further defines a passage to receive the substrate. An uncured thermosetting polymer is disposed in the interior cavity. The sleeve can be installed on the substrate and... Agent: Marguerite E. Gerstner Tyco Electronics Corporation

20090283295 - Torque-balanced electrical cable: An embodiment of a wellbore cable comprises a cable core, at least a first armor wire layer comprising a plurality of strength members and surrounding the cable core, and at least a second armor wire layer comprising a plurality of strength members surrounding the first armor wire layer, the second... Agent: Schlumberger Ipc Attn: David Cate

20090283296 - coaxial cable: As a coaxial cable includes a dielectric layer around a center conductor, an outer conductor layer around the dielectric layer, and a sheath around the outer conductor layer, wherein the dielectric layer is made of unsintered polytetrafluoroethylene, and a metal foil imparting an increased shielding effectiveness and shape maintainability is... Agent: Collen Ip

20090283297 - Submersible motor electric wire: A submersible motor electric wire includes a conductor including a copper wire and an enamel coating formed on the periphery of the copper wire, and an insulating sheath layer formed outside the conductor. The insulating sheath layer includes a silane graft polymer as a main constituent. The silane graft polymer... Agent: Scully Scott Murphy & Presser, PC

20090283298 - Tapered transition ramp for cable protector: An exemplary ramp structure capable of being positioned over at least a portion of a cable protection system comprises a center portion, a first side ramp portion adjacent a side of the center portion, and a first tapered portion adjacent an end of the first side ramp portion. The first... Agent: Holland & Hart LLP

20090283299 - Component-embedded printed circuit board, method of manufacturing the same, and electronic apparatus including the same: According to one embodiment, a component-embedded printed circuit board is provided with a built-in component mounted on a component mounting surface of a substrate and enclosed by an insulating layer, an interior pattern layer for heat radiation which is provided on the opposite side of the built-in component from the... Agent: Knobbe Martens Olson & Bear LLP

20090283300 - Flex circuit with single sided routing and double sided attach: A flex circuit having conductive traces formed on only one side of a base film for attaching to both sides of a DITO touch sensor panel is disclosed. By having conductive traces formed on only one side of the base film, the number of process steps and fabrication cost can... Agent: Apple C/o Morrison And Foerster ,llp Los Angeles

20090283301 - Multilayer wiring board and method for manufacturing the same: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090283302 - Printed circuit board and manufacturing method thereof: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board in accordance with the present invention includes: a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, a stiffener formed on the metal support layer.... Agent: Staas & Halsey LLP

20090283304 - Methods and compositions for ink jet deposition of conductive features: Disclosed is an electrically conductive feature on a substrate, and methods and compositions for forming the same, wherein the electrically conductive feature includes metallic anisotropic nanostructures and is formed by injetting onto the substrate a coating solution containing the conductive anisotropic nanostructures.... Agent: Kagan Binder, PLLC

20090283303 - Package substrate having landless conductive traces: A package substrate having landless conductive traces is proposed, which includes a core layer with a plurality of plated through holes formed therein, and a plurality of conductive traces formed on at least a surface of the core layer. Each of the conductive traces has a connection end, a bond... Agent: Edwards Angell Palmer & Dodge LLP

20090283306 - Photosensitive glass paste and multilayer wiring chip component: A photosensitive glass paste that can be fired at a low temperature for a short period of time and that can suppress generation of voids and diffusion of Ag in glass layers formed by firing, and a high-performance multilayer wiring chip component manufactured by using the above photosensitive glass paste... Agent: Dickstein Shapiro LLP

20090283305 - Tin-silver compound coating on printed circuit boards: A tin-silver coating for use with circuit boards, which can include a conductive circuit with an exposed surface disposed on a substrate. The tin-silver coating covers the exposed surface of the conductive circuit. The conductive circuit can include electrical traces, contact pads and vias, each of which may include or... Agent: Darby & Darby P.C.

20090283309 - Ceramic-metal bonded body, method for manufacturing the bonded body and semi-conductor device using the bonded body: t

20090283308 - Curable resin composition and use thereof: A curable resin composition comprising an insulating polymer such as an alicyclic olefin polymer, a curing agent, and an inorganic filler, wherein the inorganic filler is silica particles whose surface is bound with 0.1 to 30% by weight, based on the weight of the silica particles, of an alkoxy group-containing... Agent: Birch Stewart Kolasch & Birch

20090283310 - Multi cap layer and manufacturing method thereof: A method of manufacturing a cap layer includes providing a substrate having at least a conductive layer, a base layer and a dielectric layer; forming a tensile stress cap layer on the substrate; forming a patterned hard mask layer o the tensile stress cap layer; and performing an etching process... Agent: North America Intellectual Property Corporation

20090283307 - Silicon nitride substrate, silicon nitride circuit substrate using the same, and its use: m

20090283311 - Electronic element wafer module and method for manufacturing electronic element wafer module, electronic element module, and electronic information device: An electronic element wafer module is provided, and the module includes: electronic element wafers, in which a plurality of electronic elements are provided on the front surface side and wiring is provided on the back surface side; and support substrates adhered by a resin adhesive layer, opposing the front surface... Agent: Edwards Angell Palmer & Dodge LLP

20090283312 - Printed wiring board and method for manufacturing the same: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, L.L.P.

20090283313 - Small form factor molded memory card and a method thereof: A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit... Agent: Sawyer Law Group PC

20090283314 - Wired circuit board and producing method thereof: A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead... Agent: Akerman Senterfitt

20090283316 - Circuit board viaholes and method of manufacturing the same: Provided are a circuit board with a viahole and a method of manufacturing the same. The circuit board includes: a substrate formed of an insulating material; a conductive layer disposed on the substrate; a plated layer comprising nickel and disposed on the conductive layer; and a viahole passing through the... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.

20090283315 - High density package substrate and method for fabricating the same: The invention provides a high density package substrate and a method for fabricating the same. A double-sided copper clad laminate containing an upper copper foil and a lower copper foil is provided. A bottom pad is disposed on the lower copper foil, aligned to a predetermined position of a through... Agent: Quintero Law Office, PC

20090283317 - Wiring board: A wiring board between which and a chip to be mounted a resin is filled includes: a substrate body on which a conductor portion to be connected to an electrode terminal of the chip is formed; and an insulating protection film formed on the substrate body and having an opening... Agent: Kratz, Quintos & Hanson, LLP

20090283318 - Integrated emi shield termination and cable support apparatus: An Electro-Magnetic Interference (EMI) shield termination and support apparatus for a cable to be terminated at a printed wiring board (PWB) comprises a metal shield conductively attached to an EMI shield metallized area on a portion of the PWB. In a preferred embodiment, the shield comprises an EMI shield cap... Agent: Honeywell International Inc. Patent Services

20090283319 - Shielding assembly: A shielding assembly (10) for electronic device is provided. The shielding assembly (10) comprises a plastic layer (12), a metal foil (16) mounted to the plastic layer (12), and a coolant (14) is formed between the plastic layer (12) and the metal foil (16). An electronic device using the shielding... Agent: PCe Industry, Inc. Att. Steven Reiss

20090283320 - All weather housing assembly for electronic components: An all weather housing assembly for protection of electrical components includes a first housing having an open end and defining a first compartment for receipt therein of electronic components; a cover attached to the first housing for enclosing the first compartment, the cover further including a mounting structure for receiving... Agent: Tillman Wright, PLLC

20090283321 - Network communication device: A network communication device comprises a top component and a bottom cover forming a receiving space therebetween when assembled. The top component further comprises a top cover and a body. The body is configured attaches the top cover and the bottom cover. The assembly of the top cover and the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090277661 - Control box arrangement: A control box arrangement including at least one control box, the inside of which is sub-divided, or can be sub-divided, into a plurality of compartments which are arranged one above the other and can be closed in a sealing manner by associated doors with a peripheral sealing arrangement acting on... Agent: Pauley Petersen & Erickson

20090277662 - Electrical device, band structure and methods for sealing at least one portion of an electrical device or a circuit board hermetically: An electrical device is provided. The electrical device comprises a circuit board and a waterproof layer. The waterproof layer substantially seals at least one portion of the circuit board to prevent the short circuit after water infiltrating. Thereby, this particular structure provides superior waterproof protection for the electrical device. This... Agent: Patterson, Thuente, Skaar & Christensen, P.A.

20090277685 - Apparatus for a junction point between two electrical high-voltage cables: An apparatus is specified for a junction point between two electrical high-voltage cables which each have an electrical conductor (1, 2), an inner conductive layer which rests thereon, insulation (5, 6) which surrounds the conductive layer, and an outer conductive layer (7, 8) which rests on the insulation, as well... Agent: Sofer & Haroun LLP.

20090277663 - Insulation of conductors with improved separability from processed broken stone: The invention deals with insulation with improved separability from the processed broken stone designed as single-layer or multi-layer insulation surrounding an electric conductor where the principle is that at least one layer of the insulation is made of magnetic material and at the same time at least one layer is... Agent: Notaro & Michalos P.C.

20090277665 - Connector and cable connector for balanced transmission: A connector for balanced transmission includes a block member having input and output contact pairs formed on front and back surfaces thereof, and a relay wiring substrate having front and back surfaces with a ground layer in between, on which surfaces input contact connecting pads, output contact connecting pads, input... Agent: Ipusa, P.l.l.c

20090277664 - Transmission line with high flexibility and characteristic impedance: The present invention discloses a transmission line including a flexible flat cable, an insulating layer and a metal layer, and the insulating layer and the metal layer are formed sequentially on a surface of the flexible flat cable to change the thickness of the insulating layer, so as to change... Agent: Troxell Law Office PLLC

20090277666 - Heat-resistant resin varnish, heat-resistant resin films, heat-resistant resin composites, and insulated wire: A heat-resistant resin varnish characterized by comprising a polyamideimide resin whose terminal isocyanate group is blocked with a blocking agent and a polyamic acid, which is freed from viscosity increase even without employing any complicated step such as heating or cooling and which is easily applicable to a substrate and... Agent: Mcdermott Will & Emery LLP

20090277667 - Printed circuit board and method of manufacturing the same: A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region... Agent: Panitch Schwarze Belisario & Nadel LLP

20090277669 - Flexible printed circuitboard with anti-solder crack structure: A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and... Agent: Wpat, PC

20090277668 - Infrared emitter with flexible circuit board: An apparatus for coupling to an appliance includes an infrared emitter, and a flexible printed circuit board coupled to the emitter. The circuit board includes a first surface and a generally opposing second surface. At least a portion of the circuit board is flexible. The apparatus also includes a pair... Agent: Michael Ries

20090277670 - High density printed circuit board interconnect and method of assembly: A printed circuit board assembly having an edge joined first and second sub-circuit board is provided. The first sub-circuit board includes an edge with a stair-step profile interconnection wherein each of the stairs on the profile exposes an area of a signal layer. Each exposed portion of the signal layer... Agent: Cantor Colburn LLP - IBM Rochester Division

20090277671 - Glass pane having soldered electrical terminal connections: A glass pane having at least one electrical functional element is provided. The functional element comprises at least one electrical conductor and at least one terminal area located at an end of the electrical conductor, wherein the electrical conductor and the terminal area are formed from an electrically conductive layer... Agent: Buchanan, Ingersoll & Rooney PC

20090277672 - Method for forming metal pattern, metal pattern and printed wiring board: The present invention provides a method for forming a metal pattern comprising a step of forming a polymer layer on a substrate; (a2) a step of applying a metal ion or the like to the polymer layer; (a3) a step of forming a conductive layer by reducing the metal ion... Agent: Sughrue Mion, PLLC

20090277673 - Pcb having electronic components embedded therein and method of manufacturing the same: Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the... Agent: Staas & Halsey LLP

20090277674 - Printed circuit board and manufacturing method thereof: A printed circuit board and a manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board can include: forming surface roughness on an insulation layer, coating a chemical compound onto the insulation layer that lowers the surface energy of the insulation layer, and forming a circuit pattern... Agent: Staas & Halsey LLP

20090277677 - Electronic assemblies without solder and method for their design, prototyping, and manufacture: A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into... Agent: The Tpl Group

20090277676 - In-mold decoration device and manufacturing method thereof: An in-mold decoration (IMD) device and a manufacturing method thereof are provided. The manufacturing method of the IMD device includes following steps. First, a patterned film is formed. The patterned film includes a pattern layer and a film layer located below the pattern layer. A conductive layer is then formed... Agent: Jianq Chyun Intellectual Property Office

20090277675 - Substrate for mounting electronic component and electronic apparatus including the substrate: A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base 2 having groove-shaped recesses (6) in the periphery, and groove-shaped recesses (6a and 6b) in the corner and... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20090277678 - Surface mount adhesive, mounting structure including the same, and method for producing mounting structure: A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler.... Agent: Mcdermott Will & Emery LLP

20090277679 - Method of manufacturing pcb and pcb manufactured by the same: Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole;... Agent: Staas & Halsey LLP

20090277680 - Insulating film, printed circuit board substrate and printed circuit board including same: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090277681 - Expansion cross-connect enclosure: An expansion cross-connect enclosure is disclosed. The expansion cross-connect enclosure includes a housing having a front, a rear, a top, a bottom, and left and right sides, the housing having a doorway at the front. The expansion cross-connect enclosure also includes a cross-connect panel detachably connected within the housing at... Agent: Merchant & Gould PC

20090277682 - Protective structure for a circuit board and method for fabricating the same: In a protective structure for a circuit board (1) that includes a casing (3) for receiving the circuit board, the casing is provided with a recess (11) for receiving a large component part protruding from the circuit board therein, and potting material (6) is filled in a space defined between... Agent: Arent Fox LLP

20090277683 - Crash survivable memory unit: A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing. A sacrificial material is disposed... Agent: Darby & Darby P.C.

20090277684 - Mounting structure and method for mounting electronic component onto circuit board: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the... Agent: Cantor Colburn, LLP

20090272557 - Earthing system for a wind turbine connected to a utility grid and for a wind turbine park: The invention relates to an earthing system for a wind turbine connected to a utility grid. The wind turbine comprises at least one electric system such as low or high voltage power systems and cables (16), at least one control system such as a SCADA system and control cables (18),... Agent: St. Onge Steward Johnston & Reens, LLC

20090272558 - Temporary protective cover for an electrical box: A temporary protective cover for an electrical box having an open front end. In some embodiments of the invention, the cover is constructed for attachment directly to a circular type electrical box and includes a circular plate of plastic having a pair of flexible wings for use in securing the... Agent: Kriegsman & Kriegsman

20090272559 - Connection box for solar panel: A box for connecting a ribbon output conductor of a solar panel with a feed cable has a base mountable on the solar panel and formed with a first hole for the ribbon output conductor and a second hole for the feed cable, a removable cover fittable with the base... Agent: K.f. Ross P.C.

20090272576 - Vehicle high power cable fastening system and method: A cable fastening system for high power cables that operates within a heavy duty vehicle is described. The cable fastening system comprises at least three conductive high-power cables and a cable spacer. The high-power cables include a cable cross-sectional center, and a cross-sectional diameter that is similar for each cable.... Agent: Procopio, Cory, Hargreaves & Savitch LLP

20090272577 - Clad material for wiring connection and wiring connection member processed from the clad material: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder... Agent: Neomax Materials Co., Ltd. C/o Keating & Bennett, LLP

20090272560 - Conductive film and method of producing thereof: A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature... Agent: Young & Thompson

20090272561 - protective casing for a high voltage cable: A protective casing for a joint, termination or cross-connection of at least one high voltage cable. The protective casing includes a first material portion of a first metal material having good strength properties. The protective casing includes a second material portion of a second metal material which is fixedly attached... Agent: Venable LLP

20090272562 - Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method: The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness... Agent: Greenblum & Bernstein, P.L.C

20090272563 - Electronic carrier board: An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with... Agent: Edwards Angell Palmer & Dodge LLP

20090272564 - Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method: The method of producing a multilayer circuit board in an aspect of the present invention includes a film-forming step of forming a swellable resin film on the surface of an insulative substrate, a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness... Agent: Greenblum & Bernstein, P.L.C

20090272565 - Control of carbon nanostructure growth in an interconnect structure: An interconnect structure on a substrate is provided. The interconnect structure comprises electrically conductive interconnect elements on at least two interconnect levels on or above a substrate level. In the interconnect structure of the invention, at least one electrically conductive via connects a first interconnect element on one interconnect level... Agent: Nxp, B.v. Nxp Intellectual Property & Licensing

20090272566 - Electrically conductive paste and multilayer ceramic substrate: An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range, in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit,... Agent: Dickstein Shapiro LLP

20090272567 - Electronic device and method for making the same: An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts of the first and second electronic parts, respectively. The first and second electronic parts are connected detachably and coupled electrically... Agent: Ladas & Parry

20090272568 - Microwave chip supporting structure: The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side, extending towards said outer limit. The microwave chip supporting structure further comprises... Agent: Ericsson Inc.

20090272569 - Component assembly: A component assembly includes an electric component with a body and a carrier substrate on which the component is fixed by means of a conductive adhesive layer. External electrical contacts that have a planar surface are arranged on the lower side of the body. The conductive adhesive acts upon the... Agent: Slater & Matsil, L.L.P.

20090272570 - Protective sleeve fabricated with hybrid yarn, hybrid yarn, and methods of construction thereof: A hybrid yarn filament used in construction of a sleeve for protecting elongate members against at least one of EMI, RFI or ESD, and methods of construction of the hybrid yarn filament. The hybrid yarn filament has a non-conductive filament and at least one conductive wire filament overlying an outer... Agent: Robert L. Stearns Dickinson Wright PLLC

20090272571 - Cabling having shielding separators: Cabling is provided including a jacket surrounding a core, and a separator positioned in the core. The separator has at least one shield segment defining walls separating the core into a plurality of chambers each configured to receive a plurality of twisted wire pairs. Each shield segment includes a metallic... Agent: Robert J. Kapalka Tyco Technology Resources

20090272572 - Mounting plate and cover assembly for electrical devices: Combination mounting plate and cover assemblies for mounting an electrical outlet box on one side of a stud in a wall are provided. The mounting plate and cover assemblies are configured to receive an additional bracket and/or outlet box on an opposite side of the stud. The combination mounting plate... Agent: King & Spalding, LLP

20090272573 - Connection box for solar panel: A box for connecting an output conductor of a solar panel with a feed cable has a base mountable on the solar panel and having a generally planar floor from whose outer periphery a side wall projects perpendicularly. A cover engageable with the side wall forms with the floor and... Agent: K.f. Ross P.C.

20090272574 - Connection box for solar panel: A box for connecting an output conductor from a solar panel with a feed cable has a base mountable on the solar panel and formed with a first hole for the panel-output conductor and a second hole for the feed cable, a removable cover fittable with the base in a... Agent: K.f. Ross P.C.

20090272575 - Cable coupler for connection of armored cable having armor layer and method of holding the armor layer: Disclosed herein is a cable coupler for the connection of an armored cable having an armor layer. The cable coupler of the present invention includes a sleeve, which has an inclined surface, which is brought into contact with the armor layer of the armored cable, and a fastening ring and... Agent: Kratz, Quintos & Hanson, LLP