Electricity: conductors and insulators inventions 10/09

20090242228 - Multi-element twisted assembly and method using reverse axial torsion: A plurality of individual elements are imparted with reverse axial twist and collectively twisted into a multi-element assembly. Each individual element has an axial twist direction in an opposite direction from the axial twist direction of the collective multi-element assembly. The reverse axial torsion in the assembly tightly binds the... Agent: Merchant & Gould Ks

20090242229 - Light-emitting device sealing structure and method for manufacturing the same: There is provided a light-emitting device sealing structure ensuring a moisture-proof property appropriately and being excellent in easiness of processing, and a method for manufacturing the same. A light-emitting device sealing structure, includes: a light-emitting device including, a front surface having an output region from which light is output and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090242230 - Electrical connector canopy: An electrical connector canopy including a pair of spaced-apart, end walls. A top wall extends between and connects together the end walls. A front wall extends downwardly from and connects to the top wall. The front wall is provided with a number of vertical slots that extend upwardly from the... Agent: Stephen R. Greiner, Esquire Greiner Law Offices, P.C.

20090242231 - Silver nanowire, production method thereof, and aqueous dispersion: A method for producing a silver nanowire including heating a silver complex in a water solvent at a temperature equal to or below the boiling point of the water solvent, and the silver nanowire produced by the method.... Agent: Sughrue Mion, PLLC

20090242232 - Traceable and theft deterrent reclaimable product: A theft deterrent cable may be provided. First, a plurality of unique codes may be created. Then a plurality of indicia may be placed periodically and longitudinally on the interior of the cable that may not be viable from the exterior of the cable. The plurality of indicia may respectively... Agent: Merchant & Gould Ks

20090242271 - Lightweight electric conductor assembly: The invention provides a lightweight electric conductor capable of storing waste heat induced by intermittent high currents. The conductor comprises a high electric conductivity (HEC) element and a phase change material (PCM) arranged in a thermal contact therewith. In one preferred embodiment, the HEC element is formed as a tubular... Agent: Aqwest LLC

20090242272 - Electrical cable harness and assembly for transmitting ac electrical power: An electrical connector/cable harness includes an electrically insulative housing and first and second passageways extending from a first end of the connector/cable harness to a second end thereof, first and second electrically conductive wires disposed in the passageways, respectively, wherein the passageways and the wires therein reverse their dispositions in... Agent: Pandiscio & Pandiscio, P.C.

20090242233 - Cable management apparatus and method for managing cables of an electronic apparatus: A cable management apparatus for holding a cable. The cable management apparatus includes a first hinge member supported by a first hinge shaft in a rotatable manner around the first hinge shaft and a coupling member separably fixed to the first hinge member. The coupling member includes a second hinge... Agent: Staas & Halsey LLP

20090242234 - Fastener for side-wall of electrical device: A fastener is for fastening wires in an electrical device. The fastener includes a base board and a catch. The base board is connected to the electrical device. The catch extends upwards from the base board. The catch includes a supporting portion extending upwards from the base board, a main... Agent: PCe Industry, Inc. Att. Steven Reiss

20090242235 - Fastening device for a line: A fastening device for a line, in particular for an electric cable (12) in a motor vehicle, is proposed, the fastening device having a bush (10) which can be locked in a holder (18), at least partially surrounds the line, is made of elastically deformable material and is fastened releaseably... Agent: Michael J. Striker

20090242236 - Method of forming conductive tracks: A patterned electrical conductor having improved resolution and conductivity is obtained by forming a latent image by exposing, to pressure or sensitising radiation according to a desired conductive track pattern, a pressure-sensitive or photosensitive element having a support substrate and a pressure-sensitive or photosensitive material coated thereon, being capable of... Agent: Eastman Kodak Company Patent Legal Staff

20090242237 - Surface mount device jumper and surface mount device jumper assembly: A surface mount device jumper includes a base member and an electrode member. The base member is fabricated from a resin laminate. The electrode member is fabricated from an electrically-conductive material and is formed in a generally C-shaped configuration to define an opening therethrough. The opening is sized to receive... Agent: Rader Fishman & Grauer PLLC

20090242238 - Buried pattern substrate: A buried pattern substrate includes an insulation layer; a circuit pattern buried in the insulation layer such that a part thereof is exposed at a surface of the insulation layer; and a stud bump buried in the insulation layer such that one end portion is exposed at one surface of... Agent: Staas & Halsey LLP

20090242239 - process for preparing a heatsink system and heatsink system obtainable by said process: (c) applying a printed circuit on the isolating layer by means of a hot embossing system. The invention further provides a heatsink system obtainable by said process, comprising a heat conducting substrate, an insulating layer that is applied on the heat conducting substrate, and a printed circuit that is applied... Agent: Lucas & Mercanti, LLP

20090242242 - Electronic component mounting board, method for manufacturing the same and electronic circuit unit: An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main... Agent: Sughrue Mion, PLLC

20090242241 - Flex-rigid wiring board and method of manufacturing same: A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090242240 - Flexible circuit board, flexible circuit board positioning method, flexible circuit board positioning structure, droplet ejection head and image forming device: A flexible circuit board with which positioning relative to a corresponding member is easy, a flexible circuit board positioning method for positioning the flexible circuit board at the corresponding member, a flexible circuit board positioning structure that positions the flexible circuit board at the corresponding member, a droplet ejection head... Agent: Akerman Senterfitt

20090242243 - Printed circuit board and method for fabricating a printed circuit board: A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second... Agent: Lerner Greenberg Stemer LLP

20090242245 - Multi-layer wiring board and method of manufacturing the same: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist... Agent: Stites & Harbison PLLC

20090242244 - Printed circuit board: An exemplary PCB includes a first reference layer, a first signal layer, and a second signal layer in that order. A first differential pair is arranged in the first signal layer in an edge-coupled structure referencing the first reference layer. A second differential pair is arranged in the second signal... Agent: PCe Industry, Inc. Att. Steven Reiss

20090242246 - Printed circuit board and method for manufacturing same: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090242247 - Package substrate and die spacer layers having a ceramic backbone: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.... Agent: Zea , Barlocci & Markvardsen

20090242248 - Insulating sheet and printed circuit board having the same: A method of manufacturing an insulating sheet can include: providing a reinforcement material on which a thermoplastic resin layer is stacked, stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate, and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.... Agent: Staas & Halsey LLP

20090242249 - Bonding material, electronic component, bonding structure and electronic device: A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that... Agent: Mcdermott Will & Emery LLP

20090242250 - Polyimide film, method for production thereof, polyimide-metal laminated product, and circuit board: Disclosed is a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing an aluminum chelate compound and, optionally, a nonionic surfactant and/or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization.... Agent: Knobbe Martens Olson & Bear LLP

20090242256 - Electronic component and electronic component module: In a dielectric element, the angle θ made by either the top face or the bottom face and the side faces is either 0°<θ<89°, or is 91°<θ<180°, and is an angle other than 89°≦θ≦91°. By this means, the area of contact of the side faces of the dielectric element with... Agent: Oliff & Berridge, PLC

20090242257 - Electronic component and electronic component module: In a dielectric element, the side faces are roughened so that the surface roughness Ra is 15 nm or greater. By this means, the area of contact between a glass epoxy resin substrate and insulating material is increased, adhesion with resin substrates is improved, and strength and reliability can be... Agent: Oliff & Berridge, PLC

20090242258 - Electronic device package with connection terminals including uneven contact surfaces: An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the... Agent: Fujitsu Patent Center C/o Cpa Global

20090242251 - Embedded printed circuit board and manufacturing method thereof: The present invention relates to an embedded printed circuit board and a manufacturing method thereof. The present invention provides an embedded printed circuit board including a substrate in which a cavity is formed in a predetermined portion and a wiring layer is formed in a portion without the cavity; a... Agent: Staas & Halsey LLP

20090242253 - Flexible printed circuit board and electronic apparatus: According to one embodiment, a plurality of conductive-paste-filling openings are provided in the cover layer to align with the conductive pattern portion, and a plurality of conductive portions are formed by filling conductive paste in the plurality of conductive-paste-filling openings to conductively join the metal layer to the conductive pattern... Agent: Knobbe Martens Olson & Bear LLP

20090242252 - Method for manufacturing a multilayer printed wiring board for providing an electronic component therein: A multilayer printed wiring board and method for manufacturing a multilayer printed wiring board. One method include a method for manufacturing a multilayer printed wiring board having an electronic component housed therein. The method includes forming a conduction circuit on a core substrate and forming an alignment mark on the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090242254 - Multilayer wiring board and electrical connecting apparatus using the same: The present invention makes repair easy and reduces effects on the electrical connection conditions of an electronic component to an internal wiring after repair and on the mechanical strength of the repair part in a case of breakage or separation of an electrode for implementation of the electronic component. In... Agent: Ingrassia Fisher & Lorenz, P.C.

20090242255 - Wiring board with built-in electronic component and method of manufacturing same: A method of manufacturing a wiring board with a built-in electronic component includes providing a first base material comprising a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090242260 - Device interconnects: A method of fabricating a device structure, comprises: forming an insulating layer (3b) over a first set of devices disposed over a substrate (3); forming one or more vias in the insulating layer; disposing a second set of devices (6) over the insulating layer, wherein devices of the second set... Agent: Mark D. Saralino ( Sharp ) Renner, Otto, Boisselle & Sklar, LLP

20090242259 - Printed circuit board and method of manufacturing the same: Ground traces are formed to sandwich a write wiring trace. Ground walls are formed on the ground traces. A ground cover is formed so as to couple upper ends of the ground walls. Thus, the ground traces, the ground walls and the ground cover are positioned in a region above... Agent: Panitch Schwarze Belisario & Nadel LLP

20090242261 - Printed wiring board and associated manufacturing methodology: A printed wiring board disperses stress throughout an inner conductor layer, ensuring the flatness of a substrate. Embedding wires into the outermost insulating layer and forming the wires in a tapered shape that widens downward reduces the amount of stress applied on the edge of the inner conductor layer. This... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090242262 - Multi-layer wiring board and method of manufacturing the same: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; terminal pins bonded to a corresponding one of the second terminals, wherein each... Agent: Stites & Harbison PLLC

20090242263 - System and method of forming a low profile conformal shield: A system and method for providing shielding to an electrical system is disclosed. A conformal shield is formed by applying a conformal insulating coating to an electrical system. A plurality of openings are formed in the insulating coating at desired locations and a first metallic layer is deposited over the... Agent: Ge Trading & Licensing

20090242264 - Two piece shielding device: A shielding device comprising: a metallic frame stamped from a sheet of metal material, the metallic frame having a top wall and sidewalls disposed along a periphery thereof, a central window defined on the top wall, a pair of interference pieces with a cutout extending therebetween and disposed on at... Agent: Wei Te Chung Foxconn International, Inc.

20090242265 - Power outlet unit: Certain embodiments of the present invention provide a power outlet unit. The power outlet unit includes an inlet, a first group of outlets spaced apart at intervals of one rack unit, a first circuit breaker electrically connected to the inlet and the first group of outlets, a second group of... Agent: Panduit Corp.

20090242267 - Box for accommodating electric connection box: A box for accommodating an electric connection box is provided. The box includes a lower cover which comprises a plurality of walls for surrounding a space to accommodate the electric connection box toward a predetermined insertion direction, and an upper cover. The plurality of walls includes: a first wall which... Agent: Sughrue-265550

20090242266 - Electric connection box: Fluid drainage slopes are formed at a lower frame part constituting a housing that is provided below circuit board housed inside housing. Drainage ports are also formed at a lowermost part of fluid drainage slope in lower frame part. Thus, fluid that forms in the housing flows down from circuit... Agent: Oliff & Berridge, PLC

20090242268 - Semiconductor device capable of switching operation modes: A semiconductor device according to the present invention includes first through fourth internal terminals placed along the perimeter of a substrate, a circuit coupled to the first internal terminal, a first external terminal coupled to the second internal terminal, a second external terminal coupled to the third internal terminal, and... Agent: Mcginn Intellectual Property Law Group, PLLC

20090242269 - Printed circuit board, electronic device and connection device: According to one embodiment, a printed circuit board comprises a printed wiring board and a connection device mounted on the printed wiring board. The connection device comprises a main body, a casing enclosing the main body, a receiving section provided in the casing to receive a connector, and terminals extending... Agent: Knobbe Martens Olson & Bear LLP

20090242270 - Wiring system for led signs: A wiring system for LED signs includes a plurality of coaxial cables in circuit relationship to a power supply and at least one light emitting diode within a letter box housing. A bushing connectable to the housing has two cylindrical longitudinal passageways therethrough, each passageway dimensioned to accommodate an outside... Agent: Gable & Gotwals