Electricity: conductors and insulators inventions 09/09

20090236142 - Method for grounding a high voltage electrode: Through the arrangement according to the invention it becomes possible to provide electrodynamic fragmenting installations in which the high voltage electrode (1) upon a gaining of access to its operational electrode end (5) is grounded in a self-actuated and reliable manner and wherein the grounding furthermore is visually recognizable. By... Agent: Marshall, Gerstein & Borun LLP

20090236114 - Micromechanical device and method of manufacturing micromechanical device: An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090236115 - Tamper resistant power receptacle having a safety shutter: A safety shutter for a power receptacle includes two identical sliding blocks engaged with each other and two biasing members. Each sliding block has a base and a platform extending from the base with a slanted surface. The slanted surfaces are disposed below the holes of the receptacle. The biasing... Agent: Ying Chen Chen Yoshimura LLP

20090236116 - Covers for power distribution line insulators: A cover is provided for acute angled insulator pair arrangement, such as a V-switch. The insulator pair arrangement includes a first insulator and a second insulator, the insulators extending relative to each other at an acute angle from first ends thereof. The cover includes a first cover member and a... Agent: Tyco Electronics Corporation- Intellectual Propery Law Department

20090236117 - Cable management accessories: A vertical cable manager includes a base, an interconnected double-spine assembly topped by a top frame, and a pair of doors. The double-spine assembly is supported by the base. Each door is removably coupled at each lower corner to the base and at each upper corner to the top frame,... Agent: Tillman Wright, PLLC

20090236118 - Colored foaming polymer composition: A foaming composition includes a fluoropolymer, a nucleating agent and a pigment, wherein said pigment is a manganese-antimony-titanium (Mn—Sb—Ti) oxide pigment.... Agent: Sofer & Haroun LLP.

20090236121 - Reduced size in twisted pair cabling: A twisted pair cable and a method of making the twisted pair cable are described. First and second insulated conductors are twisted about each other to form a twisted pair. A first insulating material surrounds a first conductor to form the first insulated conductor. In a first alternative or supplemental... Agent: Commscope By Muncy, Geissler, Olds & Lowe, PLLC

20090236119 - Finned jacket with core wrap for use in lan cables: A twisted pair cable includes a jacket having a plurality of projections extending away from an inner surface of the jacket to define a plurality of air channels along the inner surface of the jacket. A cable core, including four twisted wire pairs and possibly a separator, resides within the... Agent: Commscope By Muncy, Geissler, Olds & Lowe, PLLC

20090236120 - Separator tape for twisted pair in lan cable: A cable includes a jacket surrounding first and second insulated conductors and a first dielectric tape, wherein the first insulated conductor is twisted with the second insulated conductor with the first dielectric tape residing therebetween to form a first twisted pair. The cable's jacket may also surround a similarly formed... Agent: Commscope By Muncy, Geissler, Olds & Lowe, PLLC

20090236123 - Plated flat conductor and flexible flat cable therewith: Disclosed is a plated flat conductor including a flat conductor of copper or a copper alloy and a plated layer formed on a surface of the flat conductor. The plated layer includes a first intermetallic compound layer of Cu3Sn disposed on the surface of the flat conductor, a second intermetallic... Agent: Sughrue Mion, PLLC

20090236122 - Structure for flexible flat cable: The main body of the flexible flat cable of the invention includes a particular quantity of cores and sheath layers. The core includes a plurality of single conductor wires or a plurality of twisted conductor wires compressively combined by top and bottom sheath layers located above and below the core... Agent: Troxell Law Office PLLC

20090236124 - Device for opening and/or closing cable ducts: The present invention relates to a device for opening and/or closing cable duct. The device according to the invention comprises a main body shaped so as to provide a gripping surface for the operator. The main body comprises at least one base wall which extends, at least partly, according to... Agent: Connolly Bove Lodge & Hutz LLP

20090236125 - Multi-layer board and manufacturing method thereof: A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming... Agent: Staas & Halsey LLP

20090236126 - Flexible wiring board: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of... Agent: Jacobson Holman PLLC

20090236127 - Electronic device: An electronic device comprises a substrate; a wiring pattern which is provided on a front surface of the substrate, and which includes a plurality of connection ends; a circuit component which houses a circuit, and which includes bumps, electrically connected to the circuit, that project from a specific surface of... Agent: Fujitsu Patent Center C/o Cpa Global

20090236128 - Printed wiring board with resin complex layer and manufacturing method thereof: A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed on the insulation layer, the uncured resin layer... Agent: Leydig Voit & Mayer, Ltd

20090236129 - Methods for reducing corrosion on printed circuit boards: A method for processing a printed circuit board (PCB) wherein the method includes providing a substrate in contact with a metal surface, contacting the metal surface with an immersion silver solution thereby producing an immersion silver layer upon the metal surface, and thereafter, providing a solder mask in contact with... Agent: Andrea E. Tran Pramudji Wendt & Tran, LLP

20090236130 - Multilayered printed circuit board and method of manufacturing the same: Disclosed herein is a multilayered circuit board, including: a metal base layer including a metal layer formed through-holes, an insulating film formed on a surface of the metal layer, a first circuit layer having circuit patterns formed on one side of the metal layer and a second circuit layer having... Agent: Staas & Halsey LLP

20090236131 - Multilayered printed circuit board and method of manufacturing the same: Disclosed herein is a multilayered circuit board, including: a multilayered printed circuit board manufactured using the method includes an insulating resin layer having via holes, on one side of which a first circuit layer including circuit patterns is formed, and on the other side of which a second circuit layer,... Agent: Staas & Halsey LLP

20090236132 - Organic/inorganic hybrid composition with electrostatic discharge protection property: An organic/inorganic hybrid composition with electrostatic discharge protection properties, high thermal stability, good adhesion, low costs, and good processability is disclosed. The composition includes a thermosetting resin system, an inherently dissipative polymer, and non-insulating particles. The inherently dissipative polymer and the non-insulating particles are dispersed within the thermosetting resin system.... Agent: Pai Patent & Trademark Law Firm

20090236133 - Method of manufacturing a polymer and poymer material: In order to provide a method of manufacturing a polymer containing an extremely small amount of residual unreacted monomer component, and a material using the polymer, megasonic is directly radiated to a polymer containing a residual unreacted monomer under an atmosphere free of oxygen and moisture to thereby perfectly complete... Agent: Foley And Lardner LLP Suite 500

20090236134 - Low frequency ball grid array resonator: A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment,... Agent: Daniel J. Deneufbourg Cts Corporation

20090236135 - Multilayer wiring substrate and method of manufacturing the same: A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which... Agent: Drinker Biddle & Reath (dc)

20090236136 - Printed circuit board assembly: A printed circuit board assembly includes: a substrate; an soldermask formed on the substrate and formed with a recess; a solder pad having a first end portion received in the recess and formed on the portion of the substrate, and a second end portion extending from the first end portion;... Agent: VistaIPLaw Group LLP

20090236137 - Method for forming resist pattern, method for producing circuit board, and circuit board: There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming... Agent: Birch Stewart Kolasch & Birch

20090236138 - Multilayer wiring board and method of manufacturing the same: A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes is... Agent: Stites & Harbison PLLC

20090236139 - Printed wiring board assembly and related methods: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and... Agent: Allen, Dyer, Doppelt, Milbrath & Gilchrist

20090236140 - Wireless power receiver module: A charging system comprises a power pad and compatible circuitry on devices to be charged, including contacts in a constellation pattern that interface with conductive strips on the pad to ensure power transfer regardless of orientation. Safety and control circuitry provide spark suppression and short protection.... Agent: Cochran Freund & Young LLC

20090236141 - Electromagnetic bandgap structure and printed circuit board: According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate... Agent: Staas & Halsey LLP

20090236143 - Multilayer wiring board, multilayer wiring board unit and electronic device: A multilayer wiring board that includes multiple wiring layers, multiple insulating layers stacked alternately with the multiple wiring layers to form a multilayer structure, a first via, and a second via. The first via is in the shape of a recess and made of a conductor covering an inner surface... Agent: Staas & Halsey LLP

20090229847 - Earthing arrangement for a dc electrical system and a method of operating an earthing arrangement for a dc electrical system: An earthing arrangement for a DC electrical system (10), the electrical system (10) comprises a plurality of earthing points (24A, 24B, 24C) and each earthing point (24A, 24B, 24C) is directly and permanently connected to earth (26) by a high impedance connection (28A, 28B, 28C). Each earthing point (24A, 24B,... Agent: Oliff & Berridge, PLC

20090229848 - Superconducting cable: Provided is a superconducting cable capable of maintaining a predetermined thermal insulation property without having a vacuum thermal insulation structure. The superconducting cable of the present invention comprises: a cable unit 100, in which a core having a superconductor layer and an electrical insulation layer is housed in a core-housing... Agent: Foley & Lardner

20090229849 - Bus-bar for jointing capacitor: A bus-bar for assembling a capacitor device is disclosed, which is capable of improving the environment of a soldering operation for the bus-bar being soldered to a capacitor device, reducing the inferior rate of the capacitor device while improving the quality of the capacitor device, and reducing the weight of... Agent: Schmeiser Olsen & Watts

20090229880 - Conductor and wire harness: One aspect of the present invention can include a conductor to be installed on a vehicle for high current use including a stranded copper wire connected to an end portion of a single-core aluminum cable, an intermediary conductor made of copper is connected to the stranded copper wire and an... Agent: Oliff & Berridge, PLC

20090229881 - Method for interconnecting electric cables: A method for interconnecting a first electric cable, constituted by a carbon fibre bundle enveloped in a first insulating sheath, with a second cable constituted by a metallic conductor enveloped in a second insulating sheath; the method provides for the removal of a first portion of the first sheath that... Agent: Modiano & Associati

20090229850 - Cable for high speed data communications: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP

20090229851 - Crush resistant conductor insulation: A process of twinning a pair of polymer-insulated conductors to form a twisted pair, where the polymer-insulated conductors are formed by extruding a uniformly thick coating of polymer onto the conductors. More than one twisted pair is encased in a polymer jacket forming a cable. The twisted pair obtains a... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20090229852 - Crush resistant conductor insulation: A process of twinning a pair of polymer-insulated conductors to form a twisted pair, where the polymer-insulated conductors are formed by extruding a uniformly thick coating of polymer onto the conductors. More than one twisted pair is encased in a polymer jacket forming a cable. The twisted pair obtains a... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20090229855 - electrode and method of forming the master electrode: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090229854 - Electrode and method of forming the electrode: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090229853 - Solder bump, electronic component and method for manufacturing the electronic component: An electronic component includes a plurality of first electrode pads arranged on a first substrate, a plurality of second electrode pads arranged at positions corresponding to the first electrode pads on a second substrate and a plurality of solder bumps which join together the first electrode pads and the second... Agent: Nec Corporation Of America

20090229857 - Electrode and method of forming the electrode: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090229856 - Master electrode and method of forming the master electrode: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090229858 - Insulator for feedthrough: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture; the feedthrough assembly comprises a conductive element housed in a glass insulating member. A second substrate is coupled... Agent: Medtronic, Inc.

20090229859 - 10g xfp compliant pcb: The present invention is a specially designed PCB that allows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to... Agent: Alcatel-lucent

20090229860 - Green sheet for multi-layered electronics parts and manufacturing method for green chip using the same: e

20090229861 - Wiring board having solder bump and method for manufacturing the same: A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder... Agent: Stites & Harbison PLLC

20090229863 - Conductor carrier and arrangement comprising a conductor carrier: A conductor carrier includes a base insulating film, a contact insulating film, at least one first printed conductor and one second printed conductor. The contact insulating film includes at least one first recess and one second recess. The printed conductors are embedded between the two insulating films and each forms... Agent: Lerner Greenberg Stemer LLP

20090229862 - Multilayer printed wiring board and method of manufacturing the same: A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically... Agent: Ratnerprestia

20090229864 - Insulating circuit board and insulating circuit board having cooling sink: An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or... Agent: Darby & Darby P.C.

20090229865 - Conductor for flexible substrate and fabrication method of same, and flexible substrate using same: A conductor for a flexible substrate, used for a flexible flat cable or disposed inside a flexible printed-circuit board, according to the present invention comprises: a base conductor made of Cu or Cu-alloy; a plating film made of Sn or Sn-alloy formed on a surface of the base conductor; and... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090229866 - Wiring structure of a substrate: A wiring structure of a substrate adapted to mount a plurality of integrated circuits has a signal wire for connecting the integrated circuits to each other, first and second power supply layers faced to each other, and return path wires arranged generally in parallel to the signal wire. One of... Agent: Collard & Roe, P.C.

20090229867 - Method for manufacturing a printed circuit board element as well as a printed circuit board element: A circuit board element and production thereof are disclosed, whereby a noble metal is applied to a structured conductor layer on a circuit board substrate, comprising said conductor layer. The conductor layer is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer,... Agent: Ladas & Parry LLP

20090229870 - Block copolymerized polyimide ink composition for printing: The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low... Agent: Birch Stewart Kolasch & Birch

20090229868 - Printed wiring board with reinforced insulation layer and manufacturing method thereof: A printed wiring board is manufactured by a method in which a core substrate having an insulation substrate and a conductive circuit formed on the insulation substrate is provided. An inner insulation layer is formed on the core substrate, and a surface of the inner insulation layer is treated to... Agent: Leydig Voit & Mayer, Ltd

20090229869 - Wiring board and method of making the same: In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure... Agent: Posz Law Group, PLC

20090229871 - Feedthrough capacitor and mounted structure thereof: A feedthrough capacitor has: a capacitor element body of a substantially rectangular parallelepiped shape in which a plurality of insulator layers are laminated together; a signal internal electrode arranged in the capacitor element body; a ground internal electrode arranged in the capacitor element body and opposed to the signal internal... Agent: Oliff & Berridge, PLC

20090229872 - Electronic component built-in board, manufacturing method of electronic component built-in board, and semiconductor device: An electronic component built-in board including an electronic component having an electrode; a conductive material part arranged in an identical plane to the electronic component; and a resin member configured to support the electronic component and the conductive material part in a state where an upper side and a bottom... Agent: Ipusa, P.l.l.c

20090229873 - Multilayer printed wiring board and component mounting method thereof: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090229874 - Multilayer wiring board: A coreless wiring board has no core board but a laminated structure in which a conductor layer and resin insulating layers are alternately laminated into a multilayer. Each of the resin insulating layers is formed to contain a glass cloth in an epoxy resin. A plurality of via holes taking... Agent: Stites & Harbison PLLC

20090229875 - Printed circuit board having fine pattern and manufacturing method thereof: A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between... Agent: Staas & Halsey LLP

20090229876 - Flexible wiring board and method of manufacturing same: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090229877 - Housing having an electrical component and an electrical feed line: A housing having at least one electrical component situated therein and at least one electrical feed line, the housing having at least one through-opening, the electrical feed line being guided through the through-opening from an external environment into the interior of the housing, and there being an electrical connection between... Agent: Kenyon & Kenyon LLP

20090229878 - Portable electronic device: In order to provide a portable electronic device improved in water tightness by a simple method, the portable electronic device includes: a housing assembled from a plurality of housing pieces via a sealing member and having a built-in electronic circuit; and a flat cable group in which a plurality of... Agent: Staas & Halsey LLP

20090229879 - Printed circuit board and mounting structure for surface mounted device: The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGApackage as a surface mounted device includes a plurality of solder balls... Agent: Hamre, Schumann, Mueller & Larson P.C.

20090223694 - Communication cable with improved crosstalk attenuation: The present invention relates to a barrier tape used as part of a communication cable to improve crosstalk attenuation. The barrier tape is provided with one or more barrier layers of discontinuous conductive segments. Conductive segments of one barrier layer are preferably sized and shaped to overlie gaps between conductive... Agent: Panduit Corp.

20090223695 - Storage case: A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304) an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between... Agent: Sughrue Mion, PLLC

20090223696 - Exterior semi-recessed electric junction box: The exterior semi-recessed electrical junction box is used in conjunction with other building materials in the exterior walls of buildings to protect the building structure from water intrusion. A projecting flange integral to the junction box is sequenced with surrounding waterproofing materials to protect the opening made in wall sheathing... Agent: Douglas S. Gawoski

20090223697 - Cable handling structure for linear axis, and substrate transfer device equipped with the same: A cable handling structure for a linear axis includes a base member, a slide member capable of linearly sliding in parallel with the base member, and a cable guide configured to guide a cable extended from the base member to the slide member with the cable accommodated in the cable... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090223713 - Extra-fine copper alloy wire, extra-fine copper alloy twisted wire, extra-fine insulated wire, coaxial cable, multicore cable and manufacturing method thereof: An extra-fine copper alloy twisted wire comprising a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires comprising 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevitable impurity,... Agent: Scully Scott Murphy & Presser, PC

20090223698 - Spirally wound electrical cable for enhanced magnetic field cancellation and controlled impedance: An electrical cable with enhanced magnetic fields and better controlling of impedances. The electrical cable includes a central ground core, an inner dielectric layer surrounding the central ground core, and a pair of signal conductor wires spirally wound on the inner dielectric layer. The signal conductor wires are separated from... Agent: Ibm Corporation

20090223699 - Method for manufacturing an electrical leadthrough and an electrical leadthrough manufactured according to said method: The underlying purpose of the invention is to manufacture electrical leadthroughs, which are improved with regard to the temperature resistance thereof. Proposed for this purpose is a method for manufacturing an electrical leadthrough, for which at least one metal tube is fused in a glass insulator, whereby a metal rod... Agent: Demont & Breyer, LLC

20090223700 - Thin flexible circuits: An approach for making thin flexible circuits. A layer of dielectric may have one or two surfaces coated with metal. The dielectric and the metal may each have a sub-mil thickness. The dielectric may be held in a fixture for fabrication like that of integrated circuits. The metal may be... Agent: Honeywell International Inc. Patent Services

20090223701 - Porous resin base, method for manufacturing same, and multilayer substrate: A porous resin substrate and a manufacturing method thereof. The substrate comprises a porous resin film having at least one functional part including electrodes or circuits, or both of them, and the porous resin film has a height-altered part, the height of which is different from the height of the... Agent: Osha Liang L.L.P.

20090223702 - Trace carrier: A trace carrier is provided. The trace carrier includes a first insulating tube, a second insulating tube, a trace pair, and a sealed hollow insulating cylinder. The trace pair is passing through the first insulating tube and the second insulating tube, and is coiled up in an inner space of... Agent: J C Patents, Inc.

20090223703 - Method and composition for screen printing of conductive features: Disclosed is a method of screen printing an electrically conductive feature on a substrate, the electrically conductive feature including metallic anisotropic nanostructures, and a coating solution therefore.... Agent: Kagan Binder, PLLC

20090223704 - Laminated film and molded body: A laminated film including a structure where each 30 layers or more of a layer composed of a resin A (A layer) and a layer composed of a resin B (B layer) are alternately laminated, wherein a relative reflectance in a wavelength range of 400 nm to 1000 nm is... Agent: Ip Group Of Dla Piper LLP (us)

20090223705 - Electronic component mounting method and electronic circuit device: An electronic component mounting method includes a step of applying a resin composition (3) including solder powder, convective additive and resin having fluidity at the melting temperature of the solder powder on a main surface of a wiring substrate (1) provided with conductive wirings and connecting terminals, a step of... Agent: Mcdermott Will & Emery LLP

20090223706 - Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby: A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated... Agent: Mcdermott Will & Emery LLP

20090223707 - Mutual capacitance and magnetic field distribution control for transmission lines: Magnetic field distribution and mutual capacitance control for transmission lines are provided. A first circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, and attaching a first trace to the second surface of the dielectric material. A surface profile of the reference plane layer... Agent: Fiala & Weaver, P.l.l.c. C/o Cpa Global

20090223708 - Coaxial connector mounted circuit board: A circuit board has a multilayer substrate having a surface earth pattern and signal line on a surface of the multilayer substrate and an inner earth pattern in the multilayer substrate; a connecting conductor pattern arranged at an end of the inner earth pattern and an side face of the... Agent: Staas & Halsey LLP

20090223709 - Printed circuit board having adaptable wiring lines and method for manufacturing the same: A printed circuit board having adaptable wiring lines includes an insulation layer. Electrode terminals and ball lands are formed on an upper surface of the insulation layer and are separated from each other. Wiring patterns are formed on the insulation layer, interposed between the electrode terminals and the ball lands,... Agent: Ladas & Parry LLP

20090223710 - Method of forming solid vias in a printed circuit board: A method is described by which an electrical path is created between layers on a printed circuit board (PCB) without the use of plated through holes (PTH). Through the use of a liquid solder or conductive epoxy injection fixture, a conductive path is created in pre-drilled holes forming an electrical... Agent: International Business Machines Corporation Richard Lau

20090223711 - Shield method for electronic component enclosure and shield material: The objective of the present invention is to provide a shield method and shield material enabling to hold a flexibility degree with an enclosure shape and to make electronic component enclosures small and thin types. The shield method for electronic component enclosures in the present invention comprises a process in... Agent: Jordan And Hamburg LLP

20090223712 - Multi-tier mass interconnect device: An interface receiver having multiple tiers such that a first tier in the receiver houses a module having its longest dimension in first direction and a second tier houses a module having its longest dimension in second direction perpendicular to the first direction. The receiver has three or more cams... Agent: 24ip Law Group Usa, PLLC

20090218133 - Cable having externally joinable outer portion: In accordance with an aspect of the present invention, a device includes a cable having a periphery and an extrusion surrounding the periphery. The extrusion includes a main body portion, a male protrusion and a female indentation. The main body portion has an outer periphery. The male protrusion is disposed... Agent: Motorola, Inc. Law Department

20090218134 - Connecting passage node or end node and method for production thereof: The invention relates to method for producing a connecting passage node or end node which has a rectangular shape in cross section and consists of electrical conductors. The nodes are produced by compacting and subsequent welding of the conductors by means of ultrasound in a compression chamber of the ultrasound... Agent: Dennison, Schultz & Macdonald

20090218135 - Joining method and related junction for electric cables, tubular covering sleeve for electric-cable junctions and process for manufacturing the same: A tubular covering sleeve (9) is manufactured which comprises a primary tubular body (10) externally coated with a sheath (14) formed of a layer of semiconductive material (15) coupled with an elastomer layer (16). The sheath (14) is made separately of the primary body and subsequently coupled therewith, before or... Agent: Harness, Dickey & Pierce, P.L.C

20090218115 - High current cable: The heavy current cable (1) for 50/60 Hz TN-S mains comprises preferably a central earth connector (2), around which three phase leads (3, 4, 5) and a neutral lead (6) are stranded. The earth lead (2) can have a smaller cross-section than the phase leads (3, 4, 5) and the... Agent: John Alexander Galbreath

20090218116 - Built-in method of thermal dissipation layer for driver ic substrate and structure thereof: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base... Agent: North America Intellectual Property Corporation

20090218117 - Flexible printed circuit board and manufacturing method for the same: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate... Agent: Paul A. Fattibene Fattibene & Fattibene

20090218118 - Board and manufacturing method for the same: A board includes a core board, an electronic component arranged on the core board, and an intermediate layer that includes resin containing carbon fibers and that surrounds the electronic component from the side.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090218119 - Method of manufacturing multilayer printed wiring board: A method of manufacturing a multilayer printed wiring board includes forming a first interlaminar resin insulating layer, a first conductor circuit on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer, opening portions in the second interlaminar resin insulating layer to expose a face of the first... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090218121 - Method for manufacturing printed circuit board, printed circuit board, and electronic apparatus: A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads; coating surfaces of the plurality of electrode pads and surfaces of the through holes on an one side of the printed... Agent: Knobbe Martens Olson & Bear LLP

20090218120 - Printed circuit board, electronic device and connector: According to one embodiment, a printed circuit board includes a printed wiring board and a connector. The connector includes a housing, a lead received inside the housing, an insertion section which is provided in the housing and to which the printed wiring board is inserted, and a rotating mechanism. The... Agent: Knobbe Martens Olson & Bear LLP

20090218122 - Wiring substrate and method of manufacturing the same: There is provided a wiring substrate. The wiring substrate includes: a plurality of conductor patterns formed on a mounting surface on which an electronic component is to be mounted, wherein each of the conductor patterns is covered with a corresponding one of solder layers; and partition walls made of insulating... Agent: Rankin, Hill & Clark LLP

20090218123 - Multilayer interconnection board: A multilayer interconnection board includes a plurality of laminated ceramic layers. Wiring electrodes are disposed on principal surfaces of the ceramic layers, and dot patterns are arranged around the wiring electrodes. The dot patterns are arranged such that the density distribution thereof is varied such that the ratio of the... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090218124 - Method of filling vias with fusible metal: A method is disclosed in which a blind via in a PCB is filled. The vias are plated with a conductor and then with a fusible metal of lower melting point than the conductor. The plated vias are covered with a photoresist and the fusible metal is removed at locations... Agent: Motorola, Inc.

20090218125 - Multilayer printed wiring board and method of manufacturing multilayer printed wiring board: A multilayer printed wiring board includes a first interlaminar resin insulating layer, a first conductor circuit formed on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer formed on the first interlaminar resin insulating layer and the first conductor circuit, a second conductor circuit formed on the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090218126 - Printed circuit board: A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring... Agent: Panitch Schwarze Belisario & Nadel LLP

20090218127 - Plating processing method, light-transmitting conductive film and electromagnetic wave-shielding film: A plating processing method, which comprises continuously electroplating the surface of a film having a surface resistivity of from 1Ω/square to 1000Ω/square, wherein the transportation speed of the foregoing film is from 1 m/minute to 30 m/minute.... Agent: Sughrue-265550

20090218128 - Metallic floor box with non-metalic riser and flange: An in-floor electrical floor-box assembly includes a rectangular or nearly square metallic housing and a non-metallic riser with integral flange assembly having a rectangular flange that mates with the rectangular housing and an integral cylindrical riser for providing access to the electrical components through a round cover and finish flange.... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20090218129 - Fixing structure for electrical junction box and cassette: A fixing structure for an electrical junction box and a cassette, the fixing structure being adapted to fix the cassette on a side wall outer surface of the electrical junction box. A locking portion is provided on an outer surface of the cassette. A rib plate that extends in a... Agent: Oliff & Berridge, PLC

20090218130 - Leadthrough for passing conduits through constructional components: A leadthrough for passing conduits (6) through a constructional component (5) includes a circumferentially closed housing (12), an insert (21) of intumescent material located in the housing (12), and a first and second diaphragm-shaped sealing members (31, 36) formed, respectively, of an elastic material, and a textile flat material, each... Agent: Abelman, Frayne & Schwab

20090218131 - Conduit connector: In an embodiment, a conduit connector can comprise: a body comprising a box engagement region capable of engaging an opening in an enclosure and a spring configured to engage the connector and the enclosure. The box engagement region can have a root surface, a leading tab, and a follower tab... Agent: Cantor Colburn, LLP

20090218132 - device and method for universally leading through cables: Apparatus for universal cable bushing, comprising a cable bushing element (1, 1a, 1b, 1c) which is designed to accommodate at least one cable (30, 30a, 30b, 30c) made of at least one elastic base material and has on its inner side (4) at least one sealing lip which is suitable... Agent: Merchant & Gould PC