Electricity: conductors and insulators inventions 08/09

20090211775 - Waterproof electronic appliance: A waterproof electronic appliance has a casing including a bottom panel, a top panel, and a side wall which is divided into an upright wall adjacent to the bottom panel and a vertical wall adjacent to the top panel. A first double-sided adhesive tape is adhered on a top end... Agent: Staas & Halsey LLP

20090211776 - Plasma display panel: A position adjustment of substrates is facilitated by using a sealing/bonding material consisting of a translucent colored glass material. A plasma display panel has a frontside substrate and a backside substrate facing to each other, on which electrodes are formed respectively, and a sealing/bonding material placed on a sealing/bonding area... Agent: Miles & Stockbridge Pc

20090211777 - Plug in device dimensioning system and method: In general, the present disclosure provides a method of designing, and system for implementing, a plug-in-type device capable of coupling to a first plug of an outlet receptacle, and configured to allow utilization of a second plug, or inhibit the use of the second plug of the receptacle. For example,... Agent: Snell & Wilmer, LLP (dial Corp)

20090211778 - Electrical box cover with insect guard: An electrical box cover including a housing and a hood pivotally attached to the housing and moveable between an open and closed position. The housing includes a base wall adapted to be attached to an electrical box. The base wall is surrounded by an outwardly extending side wall. The side... Agent: Hoffmann & Baron, LLP

20090211779 - Electrical box cover with latching device: An electrical box cover includes a housing having a base wall adapted to be attached to an electrical box. The base wall is surrounded by an outwardly extending side wall. A hood is pivotally attached to the housing and moveable between an open and closed position. A latch is selectively... Agent: Hoffmann & Baron, LLP

20090211780 - Electrical cable provided with external marking and method of crimping the barrel of a contact onto an electrical cable provided with external marking: An electrical cable (1) provided with a sheath (2) having external marking. The marking is formed from a block (3) of two patterns (4, 5), the two patterns being consecutive along a length of the cable, said block being repeated at least twice along the length of the cable starting... Agent: Perman & Green

20090211809 - Cap and manufacturing method of the cap: A cap that covers an electric wire connecting portion in which respective conductive portions of a plurality of electric wires are interconnected is molded in such a manner that one end side of a tube having a tubular shape is hermetically sealed by welding treatment, and a tongue portion is... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090211810 - Sealant gel for a telecommunication enclosure: A sealant gel for a telecommunication enclosure, wherein the gel is formulated from three different polyols in a manner that maintains its favorable mechanical properties given environmental conditions, for example, over a wide temperature range. The first polyol is a polybutadiene-based polyol that has a low glass transition temperature that... Agent: Corning Incorporated

20090211781 - Protector: A protector main body including a bottom wall and both side walls and having an upper surface opening, is provided with an electric wire holder on a lower portion side of a bent portion, the electric wire holder projecting from a first side wall of the side walls and laid... Agent: Greenblum & Bernstein, P.L.C

20090211782 - Energy cable comprising a dielectric fluid and a mixture of thermoplastic polymers: A cable includes at least one electrical conductor and at least one extruded covering layer including a thermoplastic polymer material in admixture with a dielectric liquid, wherein the thermoplastic polymer material includes (a) at least 75% by weight, with respect to the total weight of the thermoplastic polymer material, of... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090211783 - Light-transmitting metal electrode and process for production thereof: The present invention provides a light-transmitting metal electrode including a substrate and a metal electrode layer having plural openings. The metal electrode layer also has such a continuous metal part that any pair of point-positions in the part is continuously connected without breaks. The openings in the metal electrode layer... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090211784 - Electrical conductor: An electrical conductor L is specified, which has a central core (1) and at least two layers which are arranged above the core (1) and are composed of electrically conductive individual wires, which are twisted around the core (1) in a first layer (2) and around the first layer (2)... Agent: Sofer & Haroun LLP.

20090211787 - Printed circuit board: A first insulating layer is formed on a suspension body, and a write wiring trace and a read wiring trace are formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring traces. A write wiring trace and... Agent: Panitch Schwarze Belisario & Nadel LLP

20090211785 - Printed circuit board with edge markings: A multilayer printed circuit board may include traces that are printed on selected layers of the board so that the traces extend to the edge of the corresponding layer. When the layers are assembled together, the ends of the traces may be viewable on a side of the printed circuit... Agent: Warren A. Sklar (soer) Renner, Otto, Boisselle & Sklar, LLP

20090211786 - Process for producing polyimide film with copper wiring: Is disclosed a process for producing a copper-wiring polyimide film from a carrier-accompanied copper foil laminated polyimide film by a subtractive method or a semi-additive method. Washing the polyimide surface exposed by etching the copper foil with a etching solution capable of removing mainly at least one metal selected from... Agent: Knobbe Martens Olson & Bear LLP

20090211788 - Heat dissipation structure of a print circuit board: The heat dissipation structure of a print circuit board comprising a stack of multiple layers including a mounting surface layer on which electronic components including heat generating components are soldered. On both sides of the print circuit board, inner vias bore surface layers but inner layers are not bored. Core... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090211790 - Connecting structure and connecting method, liquid ejection head and method of manufacturing same: The connecting structure of a flexible circuit board and electronic components, includes: the flexible circuit board having: a pattern of wires, holes passing through the flexible circuit board in a thickness direction of the wires at parts of the wires to which the electronic components are connected, and a weakened... Agent: Akerman Senterfitt

20090211789 - Method and apparatus for attaching a flex circuit to a printed circuit board: Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI... Agent: Technology & Innovation Law Group, Pc

20090211791 - Substrate formed on carrier having retaining features and resultant electronic device: A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate... Agent: Carestream Health, Inc.

20090211792 - Flexible printed circuit assembly with reduced dielectric loss: A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal... Agent: Matthew C. Zehrer Ibm Corporation, Dept. 917

20090211796 - Electronic device substrate and its fabrication method, and electronic device and its fabrication method: An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to... Agent: Foley And Lardner LLP Suite 500

20090211795 - Printed board and portable electronic device which uses this printed board: A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a... Agent: Hogan & Hartson L.l.p.

20090211793 - Substrate module, method for manufacturing substrate module, and electronic device: In a substrate module of the present invention, a connection electrode is provided on a first surface of a substrate, and a first penetrating hole portion is running through the substrate in a thickness direction thereof so as to reach a reverse surface of the connection electrode, with a penetrating... Agent: Mcdermott Will & Emery LLP

20090211794 - Wiring board and manufacturing method therefor: In order to provide a wiring board having a structure different from a conventional structure and a manufacturing method therefor, a wiring board (1) includes: a first principal surface (6a); a second principal surface (6b) being opposed to the first principal surface (6a); a plurality of wiring layers (81, 82,... Agent: Mcginn Intellectual Property Law Group, Pllc

20090211797 - Semiconductor package: A semiconductor package includes an IC chip having a rectangular (or square) semiconductor substrate, and an integrated circuit formed on a main surface of the semiconductor substrate. The semiconductor package also includes a support substrate on which the IC chip is mounted. A power source line is disposed on the... Agent: Volentine & Whitt Pllc

20090211798 - Pga type wiring board and method of manufacturing the same: A PGA type wiring board includes a wiring board to which a head portion of a pin is joined to a pad portion with solder interposed therebetween, and a pin fixing plate having a through hole formed therein through which a shank portion of the pin is inserted, and having... Agent: Kratz, Quintos & Hanson, LLP

20090211799 - Printed wiring board and manufacturing method therefor: The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin... Agent: Oliff & Berridge, Plc

20090211800 - Electromagnetic shielding device: An electromagnetic shielding device includes a frame and a cover. The frame is formed by bending a strip structure and disposed on a circuit board with an electronic component, and it encloses the electronic component. The cover has a top portion and a plurality of side portions. The side portions... Agent: Jianq Chyun Intellectual Property Office

20090211801 - Optical transceiver providing independent spaces for electrical components and for optical components: An optical transceiver that reduces the EMI noise leaked therefrom is reduced is disclosed. The optical transceiver of the invention provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space that installs the electronic circuit and a second space that installs the... Agent: Venable LLP

20090211802 - Electromagnetic interference (emi) shielding apparatus and related methods: According to various aspects, exemplary embodiments are provided of shielding apparatus suitable for use in providing electromagnetic interference shielding for one or more electrical components on a substrate. In one exemplary embodiment, a shielding apparatus generally includes first and second walls. The first wall includes laterally spaced-apart detent protrusions. The... Agent: Harness, Dickey, & Pierce, P.l.c

20090211803 - Auxiliary support case for at least one piece of electrical equipment: An auxiliary support case (1) for at least one piece of electrical equipment to be wall-mounted is described, such that a mounting seat (3) is defined, which is suitable to receive and hold said at least one piece of electrical equipment. The support case (1) can be removably fixed to... Agent: Hogan & Hartson LLP

20090211804 - Locking system for electronic device housing: A locking system for an electronic device housing comprises a top plate, a movable cover pivotal about a first edge of the top plate, and a lateral plate connected to a second edge of the top plate which is perpendicular to the first edge. The top plate defines an opening... Agent: Pce Industry, Inc. Att. Steven Reiss

20090211805 - Electric connection device and a method of producing such a device: A device for electric connection to an energy supply conductor for intermediate and high voltage. The device includes an insulation part and an electrically conducting voltage-carrying part. The voltage-carrying part is surrounded by an outer shell formed by the insulation part. The insulation part is formed by a thermoplastic polymer.... Agent: Venable LLP

20090211806 - Electronic assembly including rf feedthrough connector and related methods: An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RE feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality... Agent: Allen, Dyer, Doppelt, Milbrath & Gilchrist P.a.

20090211807 - Implement having a strain relief means for a connection cable: An implement having an electrical drive and a connection cable for supplying electrical energy to the implement. A strain relief mechanism is provided for the connection cable and includes a retention element, on the outer periphery of which is formed a receiver for the connection cable. A securing element is... Agent: Robert W. Becker & Associates

20090211808 - Conductor leadthrough, housing device, field apparatus and method for producing a conductor leadthrough: A conductor leadthrough for a field device is for connecting two electrical conductors. The conductor leadthrough comprises an external conductor and a sealing apparatus. The sealing apparatus is divided into a first separation device and a second separation device. The external conductor comprises a hollow internal region that extends along... Agent: Fay Kaplun & Marcin, LLP

20090205849 - Hermetic envelope and image display apparatus using the same: A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each... Agent: Fitzpatrick Cella Harper & Scinto

20090205866 - Electric three-phase power cable system: Electric three-phase power cable system, include a number of individual single-core cables (1-6) extending in parallel. There is provided supporting means (40) for keeping six single-core cables (1-6) along at least a part of their length, in a substantially regular hexagonal configuration as seen in cross-section, and means (30) for... Agent: Sofer & Haroun LLP.

20090205850 - Steering fabric that facilitates reducing power use for proximity communication: One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit signals using proximity communication. This array is comprised of a set of macropads, where each given macropad is... Agent: Pvf -- Sun Microsystems Inc. C/o Park, Vaughan & Fleming LLP

20090205851 - Electronic circuit device and method for fabricating the same: The present invention is to provide a method for manufacturing a circuit pattern-provided transparent substrate having a circuit pattern which is free from pattern peeling and remaining of resist and has good pattern precision and which does not cause disconnection when used as an electrode of an electron circuit or... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090205852 - Circuit board and manufacturing method thereof: A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located... Agent: J C Patents, Inc.

20090205853 - Method for applying a metal on a substrate: There is disclosed a method for applying a first metal on a substrate, which method comprises the steps a) producing polymers on the surface of said substrate, said polymers comprising carboxylic groups and adsorbed ions of at least one second metal, said ions being adsorbed at a pH above 7,... Agent: Morrison & Foerster LLP

20090205854 - Printed circuit board for a package and manufacturing method thereof: A printed circuit board for use in a package and to a method of manufacturing the printed circuit board. The method of manufacturing the printed circuit board can include: providing a substrate, on one side of which at least one solder pad and at least one guide pad are formed;... Agent: Staas & Halsey LLP

20090205856 - Carboxylic acid-modified bisphenol epoxy di(meth)acrylate: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates,... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090205857 - Printed wiring board and method for producing the same: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090205855 - Stiffener sheet and flexible printed circuit board using the same: m

20090205858 - Circuit carrier: Circuit carrier having a metal support layer, at least some portions of which are covered by a dielectric layer, the latter having a plurality of pores, with the pores being sealed by glass at least on the opposite side of the dielectric layer to the support layer.... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090205859 - Method of manufacturing printed wiring board with built-in electronic component: A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on... Agent: Leydig Voit & Mayer, Ltd

20090205860 - Wiring substrate, manufacturing method thereof and semiconductor package: In a wiring substrate in which plural wiring layers and insulating layers are alternately stacked and the adjacent wiring layers are electrically connected through a via hole formed in the insulating layer, plural holes constructing substrate management information recognizable as a character, a symbol, etc. are formed in the outside... Agent: Drinker Biddle & Reath (dc)

20090205861 - Electrical contact device: An electrical contact device comprising a first contact assemblage having multiple contact pads disposed in a row which are allocated to different connection types, and having a second contact assemblage having multiple contact pads disposed in a row in accordance with a predetermined sequence, which are allocated to different connection... Agent: Kenyon & Kenyon LLP

20090205862 - Printed circuit board and manufacturing method thereof: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a... Agent: Staas & Halsey LLP

20090205863 - Electrical shielding arrangement: An electrical shielding arrangement of a high-voltage line has at least two coupling elements. The coupling elements each have a tubular control electrode about a line leadthrough and are surrounded by a barrier. Owing to the fact that the reduction in the diameters of the control electrode and the barrier... Agent: Lerner Greenberg Stemer LLP

20090205864 - Back plate for network connection box: A back plate device is formed by a generally rectangular frame having an open front face a back plate which is recessed inwardly from the open front face, and at least one wall extending forward from the back plate to the open front face, the wall extending around at least... Agent: Procopio, Cory, Hargreaves & Savitch LLP

20090205865 - Electrical cable connector assembly and retaining spring: A conduit connector assembly which receives an end of a conduit carrying electrical wires includes a sleeve, a spring clip and a retaining spring. The retaining spring and the spring clip are each coupled to the sleeve. The spring clip is disposed within an interior passage of the sleeve and... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20090200056 - Vandal resistant pull box: A vandal resistant pull box to secure terminating utility cables and cable connections below ground surface. As a retrofit apparatus, brackets engage the bottom edges of the pull box container and a top cover securely engages the brackets. As a complete assembly, the container is included with the brackets and... Agent: The Maxham Firm

20090200077 - Method and apparatus for joining ends of wires and the like: A method of joining the interfacing ends of cables, one to another, wherein each comprises a plurality of conductor strands, comprising (i) providing each of the ends with an enlarged terminal portion of greater diameter than the cable adjacent the end, (ii) inserting the ends into a connecting tube having... Agent: Manelli Denison & Selter

20090200057 - Rail wiring duct: Certain embodiments of the present invention provide a DIN rail wiring duct. The DIN rail wiring duct has a top, a bottom, and a side. The DIN rail wiring duct includes a base. The base has a top wall, a bottom wall, a sidewall, and a divider wall, which define... Agent: Panduit Corp.

20090200058 - Cable for stringed musical instruments: A center conductor having an effective outer diameter; a dielectric material around the center conductor, a semi-conductive layer around the dielectric material, an outer conductor, or shield, around the dielectric material; the shield having an effective inner diameter; wherein the center conductor has a cross-sectional area of 3.141×10−4 in2 or... Agent: Gore Enterprise Holdings, Inc.

20090200059 - Cable having expanded, strippable jacket: An electric power cable contains a core and a jacket forming the exterior of the cable. The jacket is formed by extruding a first layer and a second layer over a plurality of concentric neutral elements, substantially encapsulating these elements. At least the first layer is an expanded polymeric material,... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090200060 - Communication cable comprising electrically discontinuous shield having nonmetallic appearance: A tape can comprise a dielectric film that has a pattern of electrically conductive areas adhering thereto. The conductive areas can be electrically isolated from one another. The tape can utilize means to obscure the metallic finish and can contain indicators to deter installers from grounding the tape at either... Agent: King & Spalding

20090200061 - High temperature high voltage cable: A cable having one or more conductive members and one or more strength members. Each conductive member has a metal microwire having an outer diameter and an inorganic cladding having an inner diameter. The microwire is positioned within the cladding, and the outer diameter of the microwire is at least... Agent: Naval Research Laboratory Associate Counsel (patents)

20090200062 - Electric supply device for slide structure: The present invention is to provide an electric supply device for a slide structure, which can prevent drooping of a wiring harness. The electric supply device for the slide structure has a wiring harness arranged to extend from a base body to a slide structure slidably provided on the base... Agent: Edwards Angell Palmer & Dodge LLP

20090200063 - Embedded spark gap: A multilayer printed circuit board may include a first layer, a second layer, and a third layer, the second layer being between the first layer and the second layer. The second layer may include a spark gap.... Agent: Harrity & Harrity, LLP

20090200064 - Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport: Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the... Agent: Young & Thompson

20090200065 - Heat dissipation device and power module: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200066 - Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure: A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the... Agent: Oliff & Berridge, PLC

20090200069 - Multilayer printed wiring board: A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high dielectric constant layer 43, formed of ceramic and first and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200068 - Substrate for mounting semiconductor device: A substrate for mounting a semiconductor device comprises a first and a second group of input and output terminals and common terminals. The substrate further comprises conductive pads that use for inputting and outputting data from and to the semiconductor device, non-conductive pads that no use for inputting and outputting... Agent: Young & Thompson

20090200067 - Wiring substrate for electronic-component inspection apparatus: A wiring substrate K for an electronic-component inspection apparatus includes a substrate body (1) composed of a plurality of stacked ceramic layers s1 to s8 and having a front surface (2) and a back surface (3); and front-surface terminal electrodes f formed on the front surface (2) of the substrate... Agent: Sughrue Mion, PLLC

20090200070 - Cu-based wiring material and electronic component using the same: An object of the present invention is to provide an electronic component, including a wiring that contacts a glass or a glass ceramics member, for which a Cu-based wiring material capable of suppressing generation of bubbles in the glass or the glass ceramics member and having excellent migration resistance is... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090200071 - Resin composition, prepreg, laminate, and wiring board: A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090200072 - Wiring substrate and method for manufacturing the same: The wiring substrate 10 includes an insulating layer 13, a wiring 19, a bonding layer provided on such portion of the upper surface 13A of the insulating layer 13 as corresponds to the forming area of the wiring 19, and a seed layer 16 interposed between the bonding layer and... Agent: Rankin, Hill & Clark LLP

20090200073 - Printed wiring board with capacitor: A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200074 - Circuit substrate having post-fed die side power supply connections: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die,... Agent: Ibm Corporation (mh) C/o Mitch Harris, Attorney At Law, L.L.C.

20090200075 - Method and apparatus for concealed installation of wires, cables, fibers, pipes and the like within a structure: A method and apparatus for concealing and installing wires, cables, fibers, pipes and the like within a conduit is made from a flexible, paintable material, preferably plastic, metal, a composite paper material or the like. The conduit is customizable in size and shape from its original convenient flat state for... Agent: Law Offices Of Christopher L. Makay

20090200076 - Compressor having wire retainer: A compressor comprising a shell, a compression mechanism disposed within the shell, a drive shaft for operating the compression mechanism, and a motor for driving the drive shaft. A terminal is secured to the shell for delivering electric current to at least one of the compression mechanism and the motor.... Agent: Harness, Dickey & Pierce, P.L.C

20090200056 - Vandal resistant pull box: A vandal resistant pull box to secure terminating utility cables and cable connections below ground surface. As a retrofit apparatus, brackets engage the bottom edges of the pull box container and a top cover securely engages the brackets. As a complete assembly, the container is included with the brackets and... Agent: The Maxham Firm

20090200077 - Method and apparatus for joining ends of wires and the like: A method of joining the interfacing ends of cables, one to another, wherein each comprises a plurality of conductor strands, comprising (i) providing each of the ends with an enlarged terminal portion of greater diameter than the cable adjacent the end, (ii) inserting the ends into a connecting tube having... Agent: Manelli Denison & Selter

20090200057 - Rail wiring duct: Certain embodiments of the present invention provide a DIN rail wiring duct. The DIN rail wiring duct has a top, a bottom, and a side. The DIN rail wiring duct includes a base. The base has a top wall, a bottom wall, a sidewall, and a divider wall, which define... Agent: Panduit Corp.

20090200058 - Cable for stringed musical instruments: A center conductor having an effective outer diameter; a dielectric material around the center conductor, a semi-conductive layer around the dielectric material, an outer conductor, or shield, around the dielectric material; the shield having an effective inner diameter; wherein the center conductor has a cross-sectional area of 3.141×10−4 in2 or... Agent: Gore Enterprise Holdings, Inc.

20090200059 - Cable having expanded, strippable jacket: An electric power cable contains a core and a jacket forming the exterior of the cable. The jacket is formed by extruding a first layer and a second layer over a plurality of concentric neutral elements, substantially encapsulating these elements. At least the first layer is an expanded polymeric material,... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090200060 - Communication cable comprising electrically discontinuous shield having nonmetallic appearance: A tape can comprise a dielectric film that has a pattern of electrically conductive areas adhering thereto. The conductive areas can be electrically isolated from one another. The tape can utilize means to obscure the metallic finish and can contain indicators to deter installers from grounding the tape at either... Agent: King & Spalding

20090200061 - High temperature high voltage cable: A cable having one or more conductive members and one or more strength members. Each conductive member has a metal microwire having an outer diameter and an inorganic cladding having an inner diameter. The microwire is positioned within the cladding, and the outer diameter of the microwire is at least... Agent: Naval Research Laboratory Associate Counsel (patents)

20090200062 - Electric supply device for slide structure: The present invention is to provide an electric supply device for a slide structure, which can prevent drooping of a wiring harness. The electric supply device for the slide structure has a wiring harness arranged to extend from a base body to a slide structure slidably provided on the base... Agent: Edwards Angell Palmer & Dodge LLP

20090200063 - Embedded spark gap: A multilayer printed circuit board may include a first layer, a second layer, and a third layer, the second layer being between the first layer and the second layer. The second layer may include a spark gap.... Agent: Harrity & Harrity, LLP

20090200064 - Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport: Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the... Agent: Young & Thompson

20090200065 - Heat dissipation device and power module: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200066 - Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure: A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the... Agent: Oliff & Berridge, PLC

20090200069 - Multilayer printed wiring board: A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high dielectric constant layer 43, formed of ceramic and first and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200068 - Substrate for mounting semiconductor device: A substrate for mounting a semiconductor device comprises a first and a second group of input and output terminals and common terminals. The substrate further comprises conductive pads that use for inputting and outputting data from and to the semiconductor device, non-conductive pads that no use for inputting and outputting... Agent: Young & Thompson

20090200067 - Wiring substrate for electronic-component inspection apparatus: A wiring substrate K for an electronic-component inspection apparatus includes a substrate body (1) composed of a plurality of stacked ceramic layers s1 to s8 and having a front surface (2) and a back surface (3); and front-surface terminal electrodes f formed on the front surface (2) of the substrate... Agent: Sughrue Mion, PLLC

20090200070 - Cu-based wiring material and electronic component using the same: An object of the present invention is to provide an electronic component, including a wiring that contacts a glass or a glass ceramics member, for which a Cu-based wiring material capable of suppressing generation of bubbles in the glass or the glass ceramics member and having excellent migration resistance is... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090200071 - Resin composition, prepreg, laminate, and wiring board: A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090200072 - Wiring substrate and method for manufacturing the same: The wiring substrate 10 includes an insulating layer 13, a wiring 19, a bonding layer provided on such portion of the upper surface 13A of the insulating layer 13 as corresponds to the forming area of the wiring 19, and a seed layer 16 interposed between the bonding layer and... Agent: Rankin, Hill & Clark LLP

20090200073 - Printed wiring board with capacitor: A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090200074 - Circuit substrate having post-fed die side power supply connections: A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die,... Agent: Ibm Corporation (mh) C/o Mitch Harris, Attorney At Law, L.L.C.

20090200075 - Method and apparatus for concealed installation of wires, cables, fibers, pipes and the like within a structure: A method and apparatus for concealing and installing wires, cables, fibers, pipes and the like within a conduit is made from a flexible, paintable material, preferably plastic, metal, a composite paper material or the like. The conduit is customizable in size and shape from its original convenient flat state for... Agent: Law Offices Of Christopher L. Makay

20090200076 - Compressor having wire retainer: A compressor comprising a shell, a compression mechanism disposed within the shell, a drive shaft for operating the compression mechanism, and a motor for driving the drive shaft. A terminal is secured to the shell for delivering electric current to at least one of the compression mechanism and the motor.... Agent: Harness, Dickey & Pierce, P.L.C

20090194308 - Metal housing: A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections.... Agent: PCe Industry, Inc. Att. Steven Reiss

20090194309 - Microcomponent provided with a cavity delimited by a cap with enhanced mechanical resistance: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11) The cap (13) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b) said stiffening member (12b) being located between... Agent: Nixon Peabody LLP

20090194310 - Self-centering fastener with mating seal flange: An aspect of the present invention provides a conduit body assembly. The conduit body assembly has a conduit body with a closed lower end and a side wall surrounding the lower end. The side wall includes a planar perimetrical rim which defines an open upper end. Also, the conduit body... Agent: Hoffmann & Baron, LLP

20090194311 - Quick connect electrical box: There is provided a quick connect electrical box assembly that can be attached to a construction member such as a wall stud. The electrical box includes a box frame and a box back. The box frame and box back each include reciprocal snap connectors so that the frame can be... Agent: Gallagher & Kennedy, P. A.

20090194312 - Convertible cover plate for a floor box: Disclosed herein is an electrical floor box cover assembly with a convertible top plate. The inventive convertible top plate can be installed in two orientations, resulting in either a flush or recessed finished assembly. The cover assembly is affixed to a floor mounted electrical box, and includes a floor box... Agent: Hoffmann & Baron, LLP

20090194327 - Power supply system: For improving durability of a wiring harness of a power supply system used in a sliding structure, a power supply system includes a casing; a wiring harness; a harness supporter arranged along a base of the casing so as to move freely back-and-forth in the casing; and a constant force... Agent: Edwards Angell Palmer & Dodge LLP

20090194328 - Tapered transition ramp for cable protector with offset center sections: An exemplary ramp structure capable of being positioned over at least a portion of a cable protection system comprises first and second center portions, a first side ramp portion adjacent a side of each center portion, and a first tapered portion adjacent an end of the first side ramp portion.... Agent: Holland & Hart LLP

20090194313 - Coaxial cable: A coaxial cable includes a core, an insulating layer, a shielding layer, a sheathing layer. The core includes an amount of carbon nanotubes having at least one conductive coating disposed about the carbon nanotubes. The carbon nanotubes are orderly arranged. The insulating layer is about the core. The shielding layer... Agent: PCe Industry, Inc. Att. Steven Reiss

20090194314 - Bimetallic wire with highly conductive core in oilfield applications: A cable and a method of making the cable includes an electrically conductive cable core for transmitting electrical power and at least one layer of a plurality of armor wires surrounding the cable core. At least one of the armor wires is a bimetallic armor wire having a coaxial inner... Agent: Schlumberger Ipc Attn: David Cate

20090194315 - Waterproof data cable with foam filler and water blocking material: A data cable includes conductors and a filler material substantially surrounding the conductors. The filler material includes a foam filler and a water blocking material. The data cable can also include insulation substantially surrounding each conductor, foam substantially surrounding each conductor, or a solid coating substantially surrounding each conductor The... Agent: Blank Rome LLP

20090194316 - Wire-in-channel superconductor: In a method of manufacturing a copper clad aluminum channel superconductive conductor, an electrically conductive wire comprising a metal or alloy core is formed with a longitudinally extending groove in a surface thereof. A wire made of a material that exhibits superconducting properties within a defined temperature range is soldered... Agent: Crowell & Moring LLP Intellectual Property Group

20090194317 - Electrical conductors and devices from prion-like proteins: The present invention provides novel polypeptides comprising a prion-aggregation domain and a second domain; novel polynucleotides encoding such polypeptides; host cells transformed or transfected with such polynucleotides; novel fibrils with specific functionalities and unusually high chemical and thermal stability; and methods of making and using the foregoing.... Agent: Marshall, Gerstein & Borun LLP

20090194319 - Photocurable resin composition, dry film, cured product, and printed circuit board: Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an aminoantraquinone skeleton, a photopolymerization initiator (C), and a compound (D) having two or more ethylenically unsaturated groups within one molecule thereof, the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090194318 - Printed circuit board and method for manufacturing the same: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method for manufacturing a printed circuit board can include forming a circuit pattern over a seed layer that is formed over an insulation layer, pressing the circuit pattern such that the circuit pattern and... Agent: Staas & Halsey LLP

20090194320 - White prepreg, white laminated plate, and metal foil clad white laminated plate: [Means for Solving the Problems] White prepreg according to the present invention is characterized in that it comprises a dried product of a resin composition (E) impregnated on a sheet glass fiber substrate; said composition (E) containing, as essential ingredients, an epoxy resin (A) comprising a cycloaliphatic epoxy resin (A1),... Agent: Mayer & Williams PC

20090194322 - Device mounting board and manufacturing method therefor, and semiconductor module: A device mounting board has a double-layer wiring structure where a first wiring layer and a second wiring layer are stacked together with an insulating layer held between the first and second wiring layers. The first wiring layer and the second wiring layer are electrically connected by way of a... Agent: Mcdermott Will & Emery LLP

20090194321 - Printed circuit board and method of manufacturing the same: A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the... Agent: Panitch Schwarze Belisario & Nadel LLP

20090194323 - Extension tube for concrete floor boxes: An extension tube for an electrical floor box that includes a first section and a second section. Each section has a curved wall with an interior surface and an exterior surface, a top portion, a bottom portion and first and second side edges. The bottom portion is offset radially outwardly... Agent: Hoffmann & Baron, LLP

20090194324 - Electric distribution box: An electric distribution box includes a resin exterior cover which houses an interior component and has an opening for resin-molding the exterior cover on a bottom wall of the exterior cover, and a resin cap which is fit into the opening to close the opening. A flange formed on an... Agent: Sughrue-265550

20090194325 - Electronic component package: The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold... Agent: Ratnerprestia

20090194326 - Electronic device, method for holding electronic component, and method for manufacturing electronic device: An electronic device includes: a housing; an electronic component provided inside the housing; and a holding member provided between an inner wall of the housing and the electronic component and configured to hold the electronic component. The holding member is configured to hold a first region of a major surface... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP