Electricity: conductors and insulators inventions 07/09

20090188693 - Electrical-outlet faceplate with hinged cover doors: A childproof electrical outlet faceplate with hinged cover doors includes a rectangular frame for covering an electrical outlet with a pair of sockets. The frame has an opening in its center through which a screw is extended to attach the faceplate to the outlet. The faceplate is similar in size... Agent: Evester N. Simmons

20090188715 - Insulator disk for supporting a linear conductor, and an electrical assembly including such a disk: An electrical insulator disk has central recesses and peripheral recesses to enable the disk to be mounted floatingly relative to flanges between which the disk is held and to a linear conductor that extends through the disk.... Agent: Nixon Peabody LLP

20090188716 - Detecting device and manufacturing method of detecting device: To provide a detecting device that is capable of securing flexibility in mounting and after mounting detectors such as antennas, and a manufacturing method of the detecting device. In the detecting device, a plurality of receiving antennas A11 to A18 and a radio unit are connected through a plurality of... Agent: Scully Scott Murphy & Presser, PC

20090188694 - Flexible conduit with visual identification: An electrical conduit having a flexible metal tubular structure having an outer sheathing and an interior hollow area. An electrical conductor is housed in the interior hollow area. A visible indicia is applied to the outer sheathing and extends along at least a portion of the metal tubular structure where... Agent: Tyco International Management Corp.

20090188695 - Nanostructures and method for making such nanostructures: The invention provides nanostructures, being arrays of nanosized filamentary material such as carbon nanotubes (CNTs) and other nanomaterials and especially to such materials connected to a substrate such as at least one top electrode and one bottom electrode, and to a method for manufacturing such nanostructures. A device according to... Agent: Philips Intellectual Property & Standards

20090188696 - Bonding wire for semiconductor device: The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of copper which is more inexpensive than gold wire, that is, provides... Agent: Kenyon & Kenyon LLP

20090188697 - Transparent conductors and methods for fabricating transparent conductors: Transparent conductors with nanowires having silver oxide complexes and methods for fabricating such transparent conductors are provided. In one exemplary embodiment, a transparent conductor comprises a substrate and a transparent conductive coating disposed overlying the substrate. The coating comprises silver nanowires at least a portion of which has a silver... Agent: Honeywell International Inc. Patent Services

20090188698 - Electric cable and insulator self-locking system, and method of installation thereof: The insulator comprises a lower bell shaped portion, an intermediate annular waist portion and an upper saddle portion for receiving and supporting an electric transmission overhead cable. An axial blind bore opens at its lower end for receiving an upstanding support pin. The saddle portion includes a transversely-curved groove, substantially... Agent: Fraser Clemens Martin & Miller LLC

20090188700 - Electrode substrate having conductive layers with different properties made of conductive materials with different properties formed on transparent base material: An electrode substrate of the present invention includes a first conductive layer made of a first conductive material and a second conductive layer made of a second conductive material formed on a transparent base material, wherein the first conductive layer is formed on the transparent base material, the second conductive... Agent: Birch Stewart Kolasch & Birch

20090188699 - Printed circuit board: A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace... Agent: PCe Industry, Inc. Att. Steven Reiss

20090188701 - Inorganic powder, resin composition filled with the powder and use thereof: The present invention relates to an inorganic powder having a frequency-size distribution with multiple peaks, wherein the peaks are present at least in the particle size regions from 0.2 to 2 μm and from 2 to 63 μm, preferably with the maximum particle size being 63 μm or less, the... Agent: Sughrue Mion, PLLC

20090188702 - Flexible printed wiring board and electronic apparatus: An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and... Agent: Knobbe Martens Olson & Bear LLP

20090188704 - Mounting substrate: A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating... Agent: Stanzione & Kim, LLP

20090188703 - Multilayer wiring board and method of manufacturing the same: A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090188705 - Construction of reliable stacked via in electronic substrates - vertical stiffness control method: A stacked via structure for reducing vertical stiffness includes: a plurality of stacked vias, each via disposed on a disc-like structure. The disc-like structure includes a platted through hole landing supporting the plurality of stacked vias. The platted through hole landing includes a compliant center zone; and spring-like stiffness-reducing connectors... Agent: Michael Buchenhorner, P.A.

20090188706 - Interconnection element for electric circuits: An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of... Agent: Tessera Lerner David Et Al.

20090188707 - Method and apparatus for manufacture of via disk: Aluminum filled via disks are manufactured utilizing a plurality of drilled substrates placed into a metal can in a stacked, interdisposed assembly with a corresponding number of graphite molds. Aluminum infiltration ingots are added and the can is heated to a temperature to melt the ingots. The molten aluminum is... Agent: Goodwin Procter LLP Patent Administrator

20090188708 - Printed wiring board and method for producing the same: A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090188709 - Electrical device: A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090188711 - Ground straddling in pth pinfield for improved impedance: High-speed communication links are improved by having differential pairs of traces in a connector pinfield on layers of a multilayer printed circuit board (PCB) to straddle respective rows of reference (ground) pins rather than the respective rows of signal vias. Thus, a desirable increase in the size of each an... Agent: Turocy & Watson, LLP

20090188710 - System and method for forming filled vias and plated through holes: Methods and apparatus for creating a filled, backdrilled plated through hole in a printed circuit board are disclosed. According to one aspect of the present invention, a method includes defining a hole in a printed circuit board panel. The hole has a first surface, and includes at least a first... Agent: Patent Capital Group - Cisco

20090188712 - Flexible multilayer printed circuit assembly with reduced emi emissions: A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is... Agent: Ibm Corporation

20090188713 - Hiding cables running along a surface: A structure (1) hides a cable (2) running along a surface (3). The structure (1) comprises a wall (10, 11; 12, 13, 14) arranged between a viewer (4) and the cable (2) for hiding the cable (2) for the viewer (4). The structure has a wall surface directed towards the... Agent: Philips Intellectual Property & Standards

20090188714 - Thermostatic apparatus and cover: Provided is a cover used for a thermostatic apparatus including an inner chamber enclosed with a plurality of walls and a temperature/humidity controller for controlling temperature and humidity in the inner chamber. The cover forms a space with a wall of the plurality of walls by being attached to the... Agent: Mots Law, PLLC

20090183890 - Apparatus, method and system for deep earth grounding: An apparatus and method for deep earth grounding includes positioning a power driver at a site, the power driver comprising a frame and an impact hammer operatively connected to the frame, adjusting placement of the impact hammer, raising the impact hammer, driving 10 foot sectioned grounding rods down into the... Agent: Mckee, Voorhees & Sease, P.L.C

20090183891 - Adjustable junction box: An adjustable electrical junction box with an adjustable sleeve that can be slidably mounted onto the junction box. The sleeve is attached to the junction box by four screws that connect to tapped openings on the junction box to allow the screws to rotate freely. The screws are also connected... Agent: Whiteford, Taylor & Preston, LLP Attn: Gregory M Stone

20090183915 - Onboard interior lighting system: An onboard interior lighting system includes: a functional section main body 11 including functional part attachment portions 11a, 11b and an electric wire connecting part PA connecting electric wires Wa; an electric wire protecting cover 1 configured to cover the electric wire connecting part after the electric wires are connected... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090183892 - Temperature-resistant electrical line: A temperature-resistant electrical line comprises at least one central electrical conductor, an insulation, which is made from a mineral material and surrounds the electrical conductor completely, and a metallic outer tube, which bears against the insulation. The outer tube (3) has, over its entire length, a helical notch (4), which... Agent: Ware Fressola Van Der Sluys & Adolphson, LLP

20090183894 - Coaxial cable: Certain embodiments of the present technology provide a cable comprising a conductor and a cable layer. The cable layer comprises a polypropylene material. The cable layer and/or the polypropylene material comprise a crystalline fraction crystallizing in the temperature range of 200 to 105° C. determined by stepwise isothermal segregation technique.... Agent: Mcandrews Held & Malloy, Ltd

20090183893 - Halogen-free resin composition, covered wire covered with that and wiring harness with at least one above covered wire: For providing a halogen-free resin composition, a covered wire and a wiring harness which can improve mechanical characteristics, abrasion resistance, flame retardant performance and flexibility even if flame retardant is added, a halogen-free resin composition includes a base resin composition of 100 weight division having 45 to 65% by weight... Agent: Edwards Angell Palmer & Dodge LLP

20090183895 - Thermally tuned coaxial cable for microwave antennas: A coaxial cable, including an an outer conductor and an inner conductor adapted to connect to an energy source for treating tissue and first and second dielectric materials disposed between the inner conductor and the outer conductor which position the inner conductor relative to the outer conductor in general concentric... Agent: Tyco Healthcare Group Lp

20090183896 - Apparatus and method for longitudinal sealing of electrical lines: In a method for longitudinal sealing of electrical conductors (2) that comprise one or more conductor elements (21) disposed inside an external sheath (22), and comprise cavities (23) between the individual conductor elements (21) and between the individual conductor elements (21) and the external sheath (22), according to the present... Agent: Kenyon & Kenyon LLP

20090183897 - Ultra high-speed coaxial cable: A cable for the ultra high-speed communication of high-frequency signals. The cable includes a longitudinal conductor and an insulator sheath at least partially covering the longitudinal conductor. The cable further includes an inner conductive sheath disposed about an outer periphery of the insulator sheath and an outer insulator jacket disposed... Agent: Mccormick, Paulding & Huber LLP

20090183898 - Conductive contact and method of manufacturing conductive contact: A shape of a cross-section perpendicular to a longitudinal direction of a main body section of a conductive contact is anisotropic.... Agent: Edwards Angell Palmer & Dodge LLP

20090183899 - Printed wiring board: When soldering is performed, heat transferred from through hole 6b is caused to bypass a mesh-like copper foil region between non-copper-foil regions and thus the transfer of heat to a solid pattern region around thermal land 13b is delayed. Signal wirings 8e, 8f and signal wirings 8g, 8 are formed... Agent: Nec Corporation Of America

20090183900 - Anti-static spacer for high temperature curing process of flexible printed circuit board: The present invention relates to a spacer for a flexible printed circuit board used in a high temperature process. In particular, in the spacer formed with a permanent anti-static layer for the flexible printed circuit board used in the high temperature process of the present invention, the anti-static layer is... Agent: Park Law Firm

20090183902 - Multilayer film for wiring and wiring circuit: The laminated film for wiring according to the present invention is characterized in that the laminated film for wiring comprises a metal layer with low resistance and an Al—Ni-based alloy layer containing 0.5 at % to 10.0 at % Ni laminated thereon. The metal layer with low resistance contains at... Agent: Roberts & Roberts, LLP Attorneys At Law

20090183903 - Printed circuit board: A printed circuit board print (PCB) having an insulation layer; an intaglio pattern formed by depressing a part of the insulation layer corresponding to a location where a circuit pattern is to be formed; and conductive ink forming the circuit pattern by filling the intaglio pattern. A method of manufacturing... Agent: Staas & Halsey LLP

20090183901 - Wiring boards and processes for manufacturing the same: p

20090183904 - Printed wiring board and method for producing the same: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090183905 - Circuit board configuration: A circuit board configuration and method of packaging electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on... Agent: Cislo & Thomas LLP

20090183906 - Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same: A substrate for mounting a device includes: an insulating resin layer made of an insulating resin; a wiring layer provided on one major surface of the insulating resin layer; and a projected portion that projects toward the direction opposite to the insulating resin layer from the wiring layer, and that... Agent: Mcdermott Will & Emery LLP

20090183907 - Wired circuit board: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the... Agent: Akerman Senterfitt

20090183909 - Coreless substrate: A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insulating layer, a via hole being... Agent: Staas & Halsey LLP

20090183908 - Method for manufacturing conductive contact holder, and conductive contact holder: A method for manufacturing a conductive contact holder includes forming, from an insulating material, a holder member for holding a plurality of conductive contacts; forming, from a conductive material, a substrate having a hollow portion to which the holder member can be fitted; and fixing the holder member formed from... Agent: Edwards Angell Palmer & Dodge LLP

20090183910 - Wiring board and method of manufacturing the same: First, a structure is fabricated by directly bonding a first base material and a second base material. The first base material has a recessed portion formed in a desired patterning layout on one surface thereof, and the bonding is performed in such a manner that the surface having the recessed... Agent: Kratz, Quintos & Hanson, LLP

20090183911 - Wiring board and method of manufacturing the same: A wiring board includes an external connection terminal of a cylindrical shape, in which an electrode terminal of the electronic component to be mounted is fitted. In one configuration, a portion of the external connection terminal is electrically connected to a pad portion formed on an electronic component mounting surface... Agent: Kratz, Quintos & Hanson, LLP

20090183913 - Casing with shielding function, method for manufacturing the same and electronic device using the same: A casing with a shielding function, a method for manufacturing the same and an electronic device using the same are disclosed. The electronic device has at least an electronic element and a casing. The casing includes a casing substrate and a film integrally formed with the casing substrate via an... Agent: Rabin & Berdo, PC

20090183912 - Corrosion resistant faraday cage electronic enclosure assembly: A corrosion resistant Faraday cage assembly includes an electrically conductive cover and a coated die cast housing having a ledge extending around the perimeter of the housing. A fence is positioned adjacent to the ledge and a track is positioned between the ledge and the fence. A plurality of serrated... Agent: Delphi Technologies, Inc.

20090183914 - Electrical guide section for cable leadthroughs: The application relates to an electrical guide section for feeding a motor vehicle cable through a wall of a motor vehicle, with a first connection for a power cable and a second connection for a power cable. A cable feedthrough of small construction space and easy to install can be... Agent: Bromberg & Sunstein LLP

20090178820 - Television signal splitter casing: A television signal splitter casing has a body and a cover. The body is hollow and has a front, an opening and a groove. The opening is defined in the front and has an annular edge. The groove is formed in the annular edge of the opening and has an... Agent: Cooper & Dunham, LLP

20090178821 - Modular rack for mounting avionics equipment: A modular rack for mounting avionics equipment comprises an upper rectangular frame, a lower rectangular frame, and a plurality of struts interconnecting the upper rectangular frame and the lower rectangular frame. Each strut is at least partially formed of an electrically conductive carbon fiber composite material and includes at least... Agent: Tarolli, Sundheim, Covell & Tummino L.L.P.

20090178822 - Frame for a wall cut-out: For a wall cut-out (100) defining a void (101) within a wall (102) for receiving a utility receptacle (104) wherein the cut-out has a perimeter edge (103) surrounding the void (101), the frame (10) includes an insert-flange (12) dimensioned to be inserted into and to sit within the void (101)... Agent: Malcolm J. Chisholm, Jr. Attorney At Law

20090178823 - Cover plate for surface mount junction box with locking member: A cover plate assembly for mounting an electrical circuit device to an electrical outlet box includes at least one electrical circuit device and a cover plate. The cover plate has a locking member rigidly mounted to its rear surface, whereby the attachment member mounted upon the electrical circuit device is... Agent: Jansson Shupe & Munger Ltd.

20090178824 - High efficiency paired phases busway system: A paired phase electrical power distribution bus way system wherein the three phase paired conductors are surrounded and encapsulated by the neutral conductor and packed all together with the housing as a company element to obtain equal separation between the neutral bus bar assembly and the paired phase conductors. The... Agent: Sanchelima & Associates, P.A. Jesus Sanchelima, Esq.

20090178846 - Wire harness that prevents water ingress: A wire harness for preventing water from contacting capped, connected electrical wires. A lid and a base define an interior chamber. The base has fingers extending vertically upwardly for holding wire caps and connected electrical wires therein. A shelf protrudes from the inner surface of each finger to provide a... Agent: Kremblas, Foster, Phillips & Pollick

20090178825 - Wire cable with saving energy: A wire cable of electric conductor forming of multiple metals or alloys includes single (bundle) wire cable or double (bundle) wire cables, in which at least in one bundle of electric conductor, each bundle of electric conductor is composed of slim electric wire made by two or more than two... Agent: Mcglew & Tuttle, PC

20090178826 - Advanced anisotropic insulated conductive ball for electric connection, preparing method thereof and product using the same: Disclosed are anisotropic conductive balls for electric connection comprised of conductive balls and insulation resin layers coating the surfaces of those conductive balls, where the conductive balls are coated with a core-shell-structured emulsion-phase or suspension-phase or water-dispersible resin to form insulation resin layers and the functions of the insulation layers... Agent: The Webb Law Firm, P.C.

20090178827 - Bi-material radio frequency transmission line and the associated manufacturing method: The present invention relates to a bi-material radio frequency transmission line of cylindrical shape comprising a thin layer of highly conductive material supported by a base material wherein both materials are selected in function of the frequency of the transmitted signal and wherein the thickness of the thin layer is... Agent: Fay Sharpe/lucent

20090178828 - Heat dissipating wiring board and method for manufacturing same: A heat dissipating wiring board comprises: a metal wiring plate with a circuit pattern formed therein: a filler-containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed; and a heat dissipating plate arranged on an under surface of the... Agent: Wenderoth, Lind & Ponack L.L.P.

20090178829 - Anti-breakage structure for transmitting end formed on flexible printed circuitboard: An anti-breakage structure for a transmitting end of flexible printed circuitboard (FPC) is disclosed, which comprises at least a via hole, being formed on the FPC at a position corresponding to each pin of the transmitting end while enabling the at least one via hole formed on any two neighboring... Agent: Morris Manning Martin LLP

20090178831 - Electroless ni-p plating method and substrate for electronic component: An electroless Ni—P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out... Agent: Nixon Peabody, LLP

20090178830 - Printed circuit board and component package having the same: A printed circuit board, a component package that includes the printed circuit board, and a method of manufacturing the component package are disclosed. The printed circuit board, which may include an insulation layer, a pad formed over the insulation layer and wire-bonded to a component, and a tin (Sn) alloy... Agent: Staas & Halsey LLP

20090178832 - Prepreg and its application products for low thermal expansion and low dielectric tangent: A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090178834 - Anisotropic electrically conductive film and connection structure: An anisotropic electrically conductive film formed by a thermosetting acrylic resin composition is disclosed. The composition contains at least a thermosetting agent (A), a thermo-settable ingredient (B), an acrylic rubber containing hydroxyl groups (C), organic fine particles (D) and electrically conductive particles (E). The thermo-settable ingredient (B) may include a... Agent: Osha Liang L.L.P.

20090178835 - Multileveled printed circuit board unit including substrate interposed between stacked bumps: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090178833 - Sliced electromagnetic cage for inductors: A system within a circuit is disclosed. The system comprises a first shield and a device above the first shield. The system also includes a plurality of conductive walls coupled to and extending from the first shield to block electromagnetic (EM) waves to other parts of the circuit. A system... Agent: Sawyer Law Group LLP

20090178836 - Wiring board for semiconductor device: A wiring board for a semiconductor device has a substrate, a solder resist provided on the substrate, a land, and a wiring line. The solder resist is not in contact with the land, and an end portion of the wiring line is arranged such that, when a solder ball is... Agent: Young & Thompson

20090178837 - Circuit board connecting structure: A circuit board connecting structure 10 includes a first circuit board 11, and a second circuit board 12. The circuit board connecting structure 10 is configured so that when a first connecting portion 13 and a second connecting portion 14 are sandwiched by a pair of pressing jigs 18, 19... Agent: Pearne & Gordon LLP

20090178838 - Circuit board having an electrodeposited coating on a conductive core within a via and method of making same: A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive... Agent: Ppg Industries Inc Intellectual Property Dept

20090178840 - Pcb and manufacturing method thereof: A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole... Agent: Mcdermott Will & Emery LLP

20090178839 - Recognition mark and method for manufacturing circuit board: Through hole (3) for product, through holes (7a, 7b) for laminate recognition marks, through holes (8a, 8b) for an X-ray recognition marks are formed on prepreg sheet (1) having mold release films (2a, 2b) attached to the front and back surfaces thereof. By masking through holes (7a, 7b) for laminate... Agent: Wenderoth, Lind & Ponack L.L.P.

20090178841 - Shielding device with a replaceable top: A shielding device with a replaceable top, comprising: a metallic frame 1 having side walls interconnected with a top portion having a top surface 10 thereon; a removable top surface 12 attached to the top surface 10; and a metallic cap 2 attached to the frame when the removable top... Agent: Wei Te Chung Foxconn International, Inc.

20090178842 - Adhesive patch structure for absorbing and shielding electromagnetic waves: An adhesive patch structure for absorbing and shielding electromagnetic waves is disclosed, wherein a preformed transparent or translucent adhesive patch is provided therein or on at least one surface thereof with a mineral material-based layer of a mineral composition rich in negative electromagnetic energy. The mineral material-based layer generates an... Agent: Rosenberg, Klein & Lee

20090178843 - Electromagnetic-wave suppressing radiator sheet and electronic apparatus: An electromagnetic-wave suppressing radiator sheet includes a heat conductive sheet and at least one magnetic layer in the heat conductive sheet. The magnetic layer includes a plurality of plate-shaped magnetic bodies.... Agent: Rader Fishman & Grauer PLLC

20090178844 - Tabletop cable management: A cable manager for a tabletop includes raceway and a holder. The tabletop includes a support surface and an edge surface. The raceway is for a cable having an end with a plug. The raceway is configured to be positioned lengthwise along at least a portion of a length of... Agent: Hewlett Packard Company

20090178845 - Electrical connector assembly with enhanced grounding: An electrical connector assembly having a snap fit adaptor with bent grounding tangs providing improved electrical contact and enhanced grounding. An electrical connector assembly is adapted to snap fit within a knockout hole of an electrical box or panel for making electrical connections. A snap fit adaptor placed on the... Agent: Paul A. Fattibene Fattibene & Fattibene

20090173515 - Elongated member and use thereof: An elongated member including an outer sleeve-like rigid insulator shell surrounding a high voltage conductor extending in the longitudinal direction of the shell and a gap inside the shell next to an internal wall of the shell at least partially surrounding the conductor and filled with a medium including a... Agent: Venable LLP

20090173511 - Communication cable comprising electrically isolated patches of shielding material: A tape can comprise a two-sided strip of dielectric material, with patches of electrical conductive material adhering to each side. Patches on one side can be longitudinally offset from patches on the opposite side. The patches can be electrically isolated from one another. The tape can be wrapped around one... Agent: King & Spalding

20090173512 - Electrical box with hingedly attached lid: An electrical box is disclosed, wherein the electrical box includes a lid hingedly attached to a back wall of the electrical box. The lid is adapted to be selectively moved between an open and a closed position, wherein the lid covers at least a portion of an opening into the... Agent: Fraser Clemens Martin & Miller LLC

20090173513 - Device cover and cutting guide and method for use: An electrical device outlet cover for use in covering an opening in an outlet box or an opening in an outlet box drywall ring. It includes a front plate having a cut line formed through a first, telescopable portion of the front plate, the cut line allowing the first, telescopable... Agent: Christie, Parker & Hale, LLP

20090173514 - Separator spline and cables using same: A cable, specifically a data cable, which utilizes a T-shaped spline to separate four internal data cables. This cable is a specific form of a more general cable which utilizes a central spline which is designed to separate all but one pair of component cables to provide for material savings... Agent: Lewis, Rice & Fingersh, Lc Attn: BoxIPDept.

20090173516 - Nanotubes as microwave frequency interconnects: The present invention provides nanotube interconnects capable of carrying current at high frequencies for use as high-speed interconnects in high frequency circuits. It is shown that the dynamical or AC conductance of single-walled nanotubes equal their DC conductance up to at least 10 GHZ, demonstrating that the current carrying capacity... Agent: Orrick, Herrington & Sutcliffe, LLPIPProsecution Department

20090173517 - Solder wire construction: A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.... Agent: Darby & Darby P.C.

20090173518 - Method and apparatus for aligning and securing a cable strain relief: The present disclosure relates to a strain relief. In various embodiments, the strain relief includes a strain relief body and at least one alignment feature. The strain relief body is configured to provide support for connection of a cable and/or a wire lead of the cable to a frame. The... Agent: Nellcor Puritan Bennett LLC Attn:IPLegal

20090173519 - Insulating element for busbars and insulating and supporting device for busbars comprising this element: The present invention relates to an insulating element (1) for producing an insulating and supporting device for busbars to install in cabinets for low voltage distribution switchboards. The invention also relates to an insulating and supporting device for busbars comprising the insulating element which essentially comprises a body made of... Agent: Abb Inc. Legal Department-4u6

20090173520 - Reduction of jitter in a semiconductor device by controlling printed ciucuit board and package substrate stackup: A model and method are provided for lowering device jitter by controlling the stackup of PCB planes so as to minimize inductance between a FPGA and PCB voltage planes for critical core voltages within the FPGA. Furthermore, a model and method are provided for lowering jitter by controlling the stackup... Agent: Xilinx, Inc Attn: Legal Department

20090173521 - Wired circuit board: A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged... Agent: Akerman Senterfitt

20090173522 - Interposer and method for manufacturing interposer: An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090173523 - Multilayer build-up wiring board: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 μm. The... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090173524 - Dual density printed circuit board isolation planes and method of manufacture thereof: A conductive power isolation plane for reducing interlayer cross-talk in a printed circuit board between conductive through vias on one side of the printed circuit board and conductive through vias on the other side of the printed circuit board and a method of manufacturing the same. In one embodiment, a... Agent: Tyco Technology Resources

20090173525 - Printed wiring board and printed substrate unit: A printed wiring board includes a main body, a plurality of glass fiber yarns disposed in parallel with each other with a predetermined width, a pair of first wirings disposed in parallel with the glass fiber yarns, a pair of second wirings disposed in parallel with the glass fiber yarns,... Agent: Staas & Halsey LLP

20090173526 - Electrical component with a sensor element, method for the encapsulation of a sensor element, and method for production of a plate arrangement: An electrical component is specified with a sensor element, which is embedded in a plate arrangement. The plate arrangement includes at least three plates and conductor tracks, which are located between them and are conductively connected with the sensor element. At least two of the conductor tracks have exposed areas.... Agent: Slater & Matsil, L.L.P.

20090173528 - Circuit board ready to slot: A circuit substrate ready to slot is revealed, primarily comprising a board base with slot-reserved area. A plurality of bonding fingers, a plating bus loop, and a plurality of plating lines disposed on the bottom surface of the board base. The bonding fingers are located adjacent to but outside the... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20090173529 - Circuit structure and fabrication method thereof: A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second... Agent: Jianq Chyun Intellectual Property Office

20090173530 - Interposer and method for manufacturing interposer: An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090173527 - Method for integrating functional nanostructures into microelectric and nanoelectric circuits: A nanostructure is provided on a substrate by forming at least one multi-electrode arrangement on the substrate, wherein said electrodes comprise respective electrode areas projected with respect to the opposite electrode ends which extend along a line in such a way that the adjacent ends produce a respectively frequency time-variable... Agent: Staas & Halsey LLP

20090173531 - Printed circuit board and manufacturing method thereof: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern over the other surface of the core substrate... Agent: Staas & Halsey LLP

20090173532 - Wiring board having a non-through hole with a vent hole: A wiring board has a substrate having a first surface and a second surface opposite to the first surface, at least one wiring layer being formed between the first surface and the second surface. A non-through hole is formed in the substrate with a depth from the first surface to... Agent: Fujitsu Patent Center C/o Cpa Global

20090173533 - Flexible data cable: A multi-layered cable consisting of three or more conductive layers separated by layers of dielectric and/or adhesive material. The bottom layer and the top layer may act as return path for the transmitted signals and as a shield to prevent interference between these and external electrical signals. Located between the... Agent: Apple Inc. C/o Dorsey & Whitney LLP

20090173534 - I/o connectors with extendable faraday cage: An apparatus providing one or more I/O connections to a computer. The apparatus includes a Faraday cage generally about a flex cable, or other computing element, that may translate when the I/O ports to the computer are utilized. The embodiment maintains the Faraday cage for the flex cable or element... Agent: Apple Inc. C/o Dorsey & Whitney LLP

20090173535 - Cable conduit system: A cable conduit system for a building frame structure having a bottom plate associated with each floor and a top plate associated with each ceiling. The system comprises a conduit stud and first and second header plates. The conduit stud has at least one cavity extending longitudinally from a first... Agent: Alix Yale & Ristas LLP

20090173536 - Protective cover for lamps and related structural unit: A protective cover (4) for lamps (1) forms a longitudinal axis (A) and comprises two parts (10, 11), which are in contact with one another transversely to the longitudinal axis. The parts have a goblet-like shape.... Agent: Frishauf, Holtz, Goodman & Chick, PC

20090173537 - Switch with dustproof wire through feed: The invention relates to a switch for electrical hand tools, comprising: a housing, switch means incorporated in the housing, at least one wire opening arranged in the housing for throughfeed of a connecting wire, at least one contact incorporated in the housing for making galvanic contact between a connecting wire... Agent: Demont & Breyer, LLC

20090166052 - Insulated electrical box: An electrical box is disclosed, wherein the electrical box includes a back panel and an insulating material disposed thereon. The insulating material reduces the heat transfer through the back panel of the electrical box.... Agent: Fraser Clemens Martin & Miller LLC

20090166053 - Two-gang adjustable mud ring: This invention pertains to an adjustable cover for an electrical outlet box. The cover is configured having a generally planar mounting plate with a collar surrounding an opening through this mounting plate. An extension sleeve moves within this opening and adjacent the collar. At least one fastener is located adjacent... Agent: Hoffmann & Baron, LLP

20090166054 - Cable for high speed data communications: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP

20090166056 - Contact member, connecting method of the contact member, and socket: A contact member inserted in a piercing hole of a socket provided between a first contacted member and a second contacted member facing each other, the contact member includes a first contact part configured to come in contact with a first pad formed in the first connected member; a second... Agent: Ipusa, P.l.l.c

20090166055 - Transparent conductors and methods for fabricating transparent conductors: Transparent conductors and methods for fabricating transparent conductors are provided. In one exemplary embodiment, a method for fabricating a transparent conductor comprises forming a dispersion comprising a plurality of conductive components and a solvent, applying the dispersion to a substrate in an environment having a predetermined atmospheric humidity that is... Agent: Honeywell International Inc.

20090166057 - Electric wire for automobile: A conductor for an automobile is provided that exhibits the characteristics of slender structure, improved strength and reduced weight. The conductor is configured by compressing a plurality of surrounding wires that surround a central wire. Individual wires of single materials are combined in various combinations to achieve the slender structure,... Agent: Oliff & Berridge, PLC

20090166059 - Circuit board and process thereof: A circuit board and process thereof are provided. The circuit board includes a dielectric layer, a main circuit, and two shielding circuits. The dielectric layer has an active surface. The main circuit is embedded in the dielectric layer and the shielding circuits are disposed at the dielectric layer. The shielding... Agent: J C Patents, Inc.

20090166060 - Insulating resin layer, insulating resin layer with carrier and multiple-layered printed wiring board: An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of... Agent: Smith, Gambrell & Russell

20090166061 - Pcb strip, pcb strip assembly device using the pcb strip, a method of using the pcb strip assembly device, and a method of fabricating a pcb strip: A PCB strip, a PCB strip assembly device, and methods of fabricating a PCB strip and using a PCB strip assembly device are provided. According to example embodiments, a PCB strip may include a PCB main body including a working area based on a process execution unit, wherein the working... Agent: Harness, Dickey & Pierce, P.L.C

20090166058 - Printed circuit board: A printed circuit board (PCB) includes a power layer having a base portion, and at least two extending portions. The at least two extending portions are extended from edges near at least one corner of the base portion for preventing the PCB from forming constructive interferences and lowering the resonance... Agent: PCe Industry, Inc. Att. Steven Reiss

20090166062 - Printed circuit board assembly: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing... Agent: PCe Industry, Inc. Att. Steven Reiss

20090166064 - Circuit board and process for producing the same: The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing... Agent: Mcdermott Will & Emery LLP

20090166066 - Copper foil: A copper foil according to the present invention has a B/A ratio within a range of 1.2 to 3.0, where B is an inclination value of a straight line in a straight portion of a rising area near the origin of a stress-strain curve of the copper foil which is... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090166063 - Stiffener and strengthened flexible printed circuit board having the same: An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula:... Agent: PCe Industry, Inc. Att. Steven Reiss

20090166065 - Thin multi-chip flex module: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining... Agent: Robert J. Lauf

20090166067 - Clad member and printed-circuit board: A clad member low in thermal expansion coefficient and excellent in workability is provided. The clad member 1 comprises a core member 11 and skin members 12 cladded on both sides of the core member. The core member 11 is constituted by an aluminum alloy consisting of Si: 5 to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090166068 - Electronic component: An electronic component includes: a multilayer ceramic substrate that has a penetration electrode formed therein, and has a passive element provided on the upper face thereof; an insulating film that is provided on the multilayer ceramic substrate, and has an opening above the penetration electrode; a first connecting terminal that... Agent: Arent Fox LLP

20090166073 - Ceramic substrate, method of manufacturing the same, and electrical device using the same: Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated... Agent: Mcdermott Will & Emery LLP

20090166072 - Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same: An electronic apparatus includes a multilayer wiring structure having insulating layers and wiring layers which are stacked and having a surface on which an electronic component is mounted, a dipole antenna formed on a surface 13A of the multilayer wiring structure, a radiating plate disposed on the surface together with... Agent: Drinker Biddle & Reath (dc)

20090166074 - Electronic component: The present invention provides an electronic component which is capable of effectively suppressing the characteristic deterioration of the passive element portion. An electronic component comprises a ceramic substrate, a passive element portion on the substrate, an insulator layer which is provided over the passive element portion and comprises a through-hole,... Agent: Oliff & Berridge, PLC

20090166070 - Flexible film and display device comprising the same: A flexible film is provided. The flexible film includes a dielectric film, a first metal layer, which is formed on the dielectric film, and a second metal layer, which is formed on the first metal layer, wherein the surface of the dielectric film is modified so as to provide a... Agent: Birch Stewart Kolasch & Birch

20090166069 - Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure: The camera module structure (10) of the present invention, is a board electrode (2) formed on a printed board (1) and a mounting electrode (4) formed on a camera module (3) mounted on the printed board (1) being joined through a solder joint section (5), and the board electrode (2)... Agent: Edwards Angell Palmer & Dodge LLP

20090166071 - Substrate and electronic device using the same: An electronic device which includes a feedthrough capacitor mounted on a front surface of a substrate. A feedthrough electrode penetrates a laminate (body of the capacitor). External electrodes are electrically connected to opposite ends of the feedthrough electrode. A capacitor electrode is disposed to form capacity in cooperation with the... Agent: Dickstein Shapiro LLP

20090166075 - Printed circuit board: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each... Agent: PCe Industry, Inc. Att. Steven Reiss

20090166076 - Insulating material and printed circuit board having the same: An insulating material, a printed circuit board that utilizes the insulating material, and a method of manufacturing the printed circuit board. The method includes perforating at least one through-hole corresponding with the at least one, which is in correspondence with the via, in a first insulator; applying a surface treatment... Agent: Staas & Halsey LLP

20090166079 - Microstructure and method of manufacturing the same: A microstructure that comprises an insulating base material having through micropores filled with metal at a high filling ratio and that can be used as an anisotropically conductive member is provided. The microstructure comprises an insulating base material having through micropores with a pore size of from 10 to 500... Agent: Sughrue Mion, PLLC

20090166078 - Multi-layered wiring substrate and method of manufacturing the same: In a multi-layered wiring substrate according to an exemplary aspect of the present invention, a conductor formed in an edge face area functions as a pad for mounting a connector.... Agent: Young & Thompson

20090166077 - Wiring board and method of manufacturing the same: A wiring board is provided. The wiring board includes: a core substrate; wiring layers formed on the core substrate; and a reinforcement conductor which penetrates through the core substrate and which is formed by flat-plate-shaped conductor portions that intersect each other in a plan view. The reinforcement conductor is formed... Agent: Drinker Biddle & Reath (dc)

20090166080 - Multilayer wiring board and method of manufacturing the same: A multilayer wiring board is manufactured by preparing a first wiring board, a second wiring board, and a joint sheet. The first wiring board is provided with a via having a first through-hole in which a conductive film is formed. The second wiring board is provided with a second through-hole... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090166081 - Electromagnetic shield: An electromagnetic shield is for covering an electronic component on a printed circuit board. The electromagnetic shield includes a frame and a lid. The frame is welded onto the printed board and surrounds the electronic component. The frame defines a slot near the top of the frame. The lid passes... Agent: PCe Industry, Inc. Att. Steven Reiss

20090166082 - Anti-electromagnetic-interference signal transmission flat cable: An anti-electromagnetic-interference (anti-EMI) signal transmission flat cable include a plurality of conducting wires; and an insulating sheath being an integrally formed flat and flexible member for longitudinally enclosing a circumferential surface of each of the conducting wires, so that the conducting wires are substantially equally spaced and parallelly arranged in... Agent: Nikolai & Mersereau, P.A.

20090166083 - Wire-type cable raceway, especially a cable raceway for home use: A cable raceway of this kind consists of lengths of wire-type cable raceway comprising both essentially rectilinear lengthwise or weft wires (2) and polygonal-shaped transverse or warp wires (4), with an opening formed in a corner and an even number of sides. Each length comprises at least four lengthwise weft... Agent: Young & Thompson

20090166084 - Electrical bushing for a superconductor element: The invention relates to an electrical bushing serving to make a connection at ambient temperature to a superconductor element situated in an enclosure at cryogenic temperature. The electrical bushing passes successively through an enclosure at intermediate temperature between ambient temperature and cryogenic temperature, and an enclosure at ambient temperature, and... Agent: Sofer & Haroun LLP.