Electricity: conductors and insulators inventions 06/09

20090159306 - Lightning protection system and an aircraft having such a system: Since the structure has holes designed for the fasteners, at least some of these fasteners have an attachment element from the lightning to this structure. This attachment element is inserted into the hole with its top part approximately even with the outer surface of this structure, and the attachment element... Agent: Perman & Green

20090159308 - Cover assembly for an in-floor box: A cover assembly for a floor-mounted enclosure or in-floor box includes a lid that remains flush with the floor and covers the in-floor box while permitting egress of electrical cables connected to receptacles housed in the box.... Agent: Mccormick, Paulding & Huber LLP

20090159307 - Magnetic light switch cover plate: A light switch cover plate with small but powerful neodymium (NIB) magnets, or other forms or types of strong magnets, located on the back or just beneath the surface of the cover. The magnets may be located 1 to 2 inches below the openings for the light switch, although other... Agent: W. Edward Ramage

20090159309 - Flat cable and plasma display device: A highly reliable flat cable is disclosed in which a short-circuit between adjacent electrodes due to whisker formation is prevented and the occurrence of contact failure between electrodes due to a foreign particle is prevented. A plasma display using this flat cable is also disclosed. The flat cable comprises a... Agent: Mcdermott Will & Emery LLP

20090159310 - Photonic-crystal transparent-conductor assembly: A photonic-crystal (PC)-based transparent-conductor assembly is disclosed, wherein the assembly includes a photonic-crystal cloaking element (PCCE) that surrounds at least one opaque conducting element. The PCCE has a refractive index distribution designed to “cloak” the at least one conductor contained therein from light incident upon the PCCE within a select... Agent: Corning Incorporated

20090159311 - Battery system for a vehicle with severable connections: A battery system for storing electrical power and supplying electrical power to a vehicle is disclosed. The system includes multiple battery packs, each with a plurality of cells. The cells in each battery pack are electrically connected with one another and the multiple battery packs are also electrically connected with... Agent: Brinks Hofer Gilson & Lione

20090159312 - Arrangement for establishing a connection between two cable support device elements and connection elements: b

20090159313 - Curable epoxy resin composition and laminates made therefrom: A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; (c) a catalytic amount of a nitrogen-containing catalyst; (d)... Agent: The Dow Chemical Company

20090159314 - Shieldless, high-speed, low-cross-talk electrical connector: An electrical connector may include a first connector with electrically-conductive contacts. The contacts may have blade-shaped mating ends, and may be arranged in a centerline. The electrical connector may include a second connector with electrically-conductive receptacle contacts, which may also be arranged in a centerline. The connectors may be mated... Agent: Woodcock Washburn, LLP

20090159315 - Wiring substrate: Disclosed herewith is a wiring substrate for releasing a heat generated by an electronic part efficiently through a heat pipe. The wiring substrate of the present invention includes a built-in heat pipe. The substrate also has amounting area. In the mounting area, an IC chip is mounted on a mounting... Agent: Mcginn Intellectual Property Law Group, PLLC

20090159316 - Wiring substrate and method of manufacturing the same: A wiring substrate is provided. The wiring substrate includes: a core layer in which a gap is formed; and a lamination layer which includes an insulating layer and a wiring layer and which is formed on at least one surface of the core layer. The lamination layer has a thermal... Agent: Drinker Biddle & Reath (dc)

20090159318 - Printed circuit board and manufacturing method thereof: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method may include forming at least one first bump over a first metal layer by selectively printing an alloy paste, stacking an insulation layer over the first metal layer such that the first bump... Agent: Staas & Halsey LLP

20090159317 - Printed circuit board and method for manufacturing the same: An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090159321 - Electronic devices with ultraviolet blocking layers and processes of forming the same: An electronic device can include a conductive feature and an ultraviolet (“UV”) blocking layer overlying the conductive feature. The electronic device can also include an insulating layer overlying the UV blocking layer. The electronic device can further include a conductive structure extending into an opening within the insulating layer, wherein... Agent: Larson Newman Abel & Polansky, LLP

20090159320 - Low cost high frequency device package and methods: A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.... Agent: Dla Piper LLP (us )

20090159319 - Resin ejection nozzle, resin encapsulation method, and electronic part assembly: A resin ejection nozzle is scanned over a substrate on which an electronic part is mounted, and ejects an encapsulation resin to an encapsulation area of the substrate. The resin ejection nozzle comprises an ejection part adapted to eject the encapsulation resin, the ejection part having a longitudinal direction which... Agent: Cooper & Dunham, LLP

20090159323 - Solid electrolytic capacitor having current breaking function: A solid electrolytic capacitor that can be miniaturized while maintaining the function for breaking current when excessive short-circuit current flows to a capacitor element. The solid electrolytic capacitor includes an anode body, a dielectric layer formed on the anode body, a conductive polymer layer formed on the dielectric layer, and... Agent: Mots Law, PLLC

20090159322 - Through hole capacitor and method of manufacturing the same: A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and... Agent: Jianq Chyun Intellectual Property Office

20090159324 - Printed circuit board and method of producing the same: According to one embodiment, a printed circuit board includes: a product portion having a given outer shape; and a cutout portion disposed in the given outer shape of the product portion, for being removed away in a later production step. The cutout portion comprises a test coupon including two signal... Agent: Knobbe Martens Olson & Bear LLP

20090159325 - Anisotropically conductive connector and anisotropically conductive connector device: An anisotropically conductive connector and an anisotropically conductive connector device. The anisotropically conductive connector includes a supporting member, a plurality of through-holes each extending in a thickness-wise direction of the supporting member, and anisotropically conductive sheets respectively held in the through-holes of the supporting member. Each anisotropically conductive sheet includes... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090159327 - Printed wiring board and manufacturing method of printed wiring board: A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090159326 - S-turn via and method for reducing signal loss in double-sided printed wiring boards: Embodiments of the invention include a Printed Wiring Board (PWB) having a first via connected to a top-side signal source, a second via connected to a bottom-side signal destination, and a third via connected to the first via on a lower signal layer of the PWB and further connected to... Agent: Buckley, Maschoff & Talwalkar LLC

20090159328 - Electromagnetic shielding layer and method for making the same: An electromagnetic shielding layer comprising at least one conductive layer and a carbon nanotube film structure, the conductive layer being disposed on the carbon nanotube film structure, and comes in contact with the carbon nanotube film structure electrically. A method for making the electromagnetic shielding layer includes the steps of:... Agent: PCe Industry, Inc. Att. Steven Reiss

20090159329 - Electrical device: The invention relates to an electrical device comprising a supporting substrate (1) which supports electronic components (2) as well as a strip conductor structure for connecting the electronic components (2) and on which an electrically conducting shielding element is disposed that surrounds the strip conductor structure and the components (2).... Agent: Cohen, Pontani, Lieberman & Pavane LLP

20090159330 - Direct current power supply: A portable electrochemical power supply for handheld electronic devices, such as cellular telephones, is disclosed. The power supply includes a housing with an electrical connector, a circuit board, and a removable electrochemical cell disposed therein. The circuit board carries power supply circuitry which receives electrical energy from the electrochemical cell... Agent: Michael C. Pophal Eveready Battery Company Inc

20090159331 - Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate: The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component,... Agent: Nxp, B.v. Nxp Intellectual Property Department

20090159332 - Cable seal assembly: A cable seal assembly includes a sealing member, a first housing member, and a second housing member. The sealing member defines a passageway that extends from a center opening of the sealing member through the periphery of the sealing member. The first housing member is disposed in the passageway and... Agent: Merchant & Gould PC

20090151970 - High-frequency coaxial cable: In a high-frequency coaxial cable (1), an internal solid layer (3), an insulation layer (4) made of a foam resin, an external solid layer (5), and an external conductor (6) are provided on the periphery of an internal conductor (2) in this order. The external solid layer (5) has a... Agent: Foley And Lardner LLP Suite 500

20090151971 - Cable housing system: An embedded housing system storing cables below the surface in a protected environment, with a moveable surface lid lying flush with the existing surface and following the crown or slope across the travel path. The cables are readily raised out of the housing structure to obstruct traffic across the travel... Agent: Michael J. Lamore

20090151972 - Cold weld hermetic mems package and method of manufacture: A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral device 445 then cold welded with an external force mechanism... Agent: HulseyIPIntellectual Property Lawyers, P.C.

20090151973 - Mobile device: A mobile device has a push-button type operation unit at a side surface of a body case. The body case has a dual-partitioned structure of a first case and a second case. The first case includes a main portion having a plane substantially parallel to a partitioning surface of the... Agent: Osha Liang L.L.P.

20090152004 - Cable closure end cap: An end cap (30) for sealing an end of a closure about a cable member directed therein. The end cap (30) includes a wall member (32) having a first surface (34), an exterior surface and an outer circumferential edge. A longitudinal port (40) extends through the wall member (32) from... Agent: 3m Innovative Properties Company

20090151974 - Coaxial cable including tubular bimetallic outer layer with folded edge portions and associated methods: A coaxial cable may include an inner conductor, an outer conductor, and a dielectric material therebetween. The outer conductor may include a tubular bimetallic layer having a pair of opposing longitudinal edge portions at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer and an outer... Agent: Allen Dyer Doppelt Milbrath & Gilchrist (commscope)

20090151976 - Coaxial cable including tubular bimetallic inner layer with angled edges and associated methods: A coaxial cable may include an inner conductor, an outer conductor and a dielectric material layer therebetween. The inner conductor may include a tubular bimetallic layer and may have a pair of opposing longitudinal edge portions at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer... Agent: Allen Dyer Doppelt Milbrath & Gilchrist (commscope)

20090151975 - Coaxial cable including tubular bimetallic inner layer with bevelled edge joint and associated methods: A coaxial cable may include an inner conductor, an outer conductor, and a dielectric material layer therebetween. The inner conductor may include a tubular bimetallic layer having a pair of opposing longitudinal edges at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer and an outer... Agent: Allen Dyer Doppelt Milbrath & Gilchrist (commscope)

20090151977 - Coaxial cable including tubular bimetallic inner layer with folded edge portions and associated methods: A coaxial cable may include an inner conductor, an outer conductor, and a dielectric material therebetween. The inner conductor may include a tubular bimetallic layer having a pair of opposing longitudinal edge portions at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer and an outer... Agent: Allen Dyer Doppelt Milbrath & Gilchrist (commscope)

20090151979 - Coaxial cable including tubular bimetallic outer layer with angled edges and associated methods: A coaxial cable may include an inner conductor, an outer conductor and a dielectric material layer therebetween. The outer conductor may include a tubular bimetallic layer and may have a pair of opposing longitudinal edge portions at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer... Agent: Allen Dyer Doppelt Milbrath & Gilchrist (commscope)

20090151978 - Coaxial cable including tubular bimetallic outer layer with bevelled edge joint and associated methods: A coaxial cable may include an inner conductor, an outer conductor, and a dielectric material layer therebetween. The outer conductor may include a tubular bimetallic layer having a pair of opposing longitudinal edges at a longitudinal seam. The tubular bimetallic layer may include an inner metal layer and an outer... Agent: Allen Dyer Doppelt Milbrath & Gilchrist (commscope)

20090151980 - Flexible flat cable and manufacturing method thereof: The invention discloses a flexible flat cable and the manufacturing method thereof. The Flexible flat cable is manufactured by the following steps of: forming a metal layer on an insulated base layer, then forming a protective layer on the metal layer which had been formed above the insulated base layer,... Agent: Jackson Walker, L.L.P.

20090151981 - Gap free anchored conductor and dielectric structure and method for fabrication thereof: A microelectronic structure and a method for fabricating the microelectronic structure use a dielectric layer that is located and formed upon a first conductor layer. An aperture is located through the dielectric layer. The aperture penetrates vertically into the first conductor layer and extends laterally within the first conductor layer... Agent: Scully, Scott, Murphy & Presser, P.C.

20090151982 - Metal-ceramic composite substrate and method of its manufacture: A metal-ceramic composite substrate having excellent heat dissipation and a method of manufacturing such a metal-ceramic composite substrate at low cost are disclosed. A metal-ceramic composite substrate (10) comprises a metal substrate (11), a ceramic layer (12) formed on the metal substrate (11), an electrode layer (13) formed on the... Agent: Masao Yoshimura, Chen Yoshimura LLP

20090151983 - Grommet for cables: A cable grommet system for installation in data centers, offices and the like, for sealing cable openings in raised flooring, wall or ceiling panels, server cabinets, etc. to facilitate the installation and revision of wiring and cabling to server installations while minimizing losses of any provided conditioned air. A wide... Agent: Schweitzer Cornman Gross & Bondell LLP

20090151984 - Composite resin molded article, laminate, multi-layer circuit board, and electronic device: A composite resin molded article produced by impregnating cloth made from long fibers of a liquid crystal polymer with a curable resin composition which comprises a polymer (A) and a curing agent (B), the polymer (A) having a weight average molecular weight of 10,000 to 250,000 and containing 5 to... Agent: Birch Stewart Kolasch & Birch

20090151987 - Composition for producing printed circuit board and printed circuit board using the same: A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can... Agent: Cantor Colburn, LLP

20090151985 - Method of dicing a circuit board sheet and package circuit board: When package circuit boards are formed by dicing a circuit board sheet with a core substrate that conducts electricity, conductive material is not exposed from the outer side surfaces of the package circuit boards, thereby preventing electrical shorting of the package circuit boards. A method of dicing a circuit board... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090151986 - Method of manufacturing wiring board, wiring board, and semiconductor device: A plurality of mounting terminals, a plane electrode formed around the plurality of mounting terminals, and a plurality of interconnects for plating, each of which is respectively connected to the plane electrode and a plurality of the mounting terminals different from each other are formed at one surface of the... Agent: Mcginn Intellectual Property Law Group, PLLC

20090151988 - Flexible printed circuit board and method of manufacturing the same: An FPCB and a method of manufacturing the same, in which an electrical signal-conductive portion of the FPCB is subjected to little stress so as not to be broken by fatigue in spite of repeated bending of the FPCB, thereby increasing the lifetime of the FPCB.... Agent: Staas & Halsey LLP

20090151989 - Insulating layer for rigid printed circuit boards: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.... Agent: Knobbe Martens Olson & Bear LLP

20090151990 - Multilayer wiring board and method of making the same: A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a... Agent: Foley And Lardner LLP Suite 500

20090151991 - Mounting structure, electrooptic device, and electronic apparatus: A mounting structure includes: a wiring board; an electronic element which is mounted in the wiring board and supplied with a periodic signal; and a first opening which is formed in the wiring board along one side of the electronic element in a longitudinal direction of the electronic element. The... Agent: Lowe Hauptman Ham & Berner, LLP

20090151992 - Formation and integration of passive structures using silicon and package substrate: An integrated circuit radio transceiver and method therefor includes an integrated circuit package that comprises a first substrate device, first and second nodes of a circuit on an outer surface of the first substrate device, a second substrate device and a trace on the second substrate device to provide crossover... Agent: Garlick Harrison & Markison

20090151995 - Package for semiconductor device and method of manufacturing the same: In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual... Agent: Rankin, Hill & Clark LLP

20090151993 - Shielded cable interface module and method of fabrication: A shielded cable interface module having cable receiving grooves extending laterally to an edge of the board, each including a center conductor groove, an insulator groove, and a shield groove. A center conductor via and a shield via extend through the board. A conductor plane on the cable termination side... Agent: Balzan Intellectual Property Law, PC

20090151994 - Wired circuit board: A wired circuit board includes a wiring formation portion, a terminal formation portion, and a middle portion formed therebetween. The wiring formation portion includes a first conductive layer formed on a first insulating layer, and a second conductive layer formed on a second insulating layer so as to overlap the... Agent: Akerman Senterfitt

20090151996 - Product having through-hole and laser processing method: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing... Agent: Mcdermott Will & Emery LLP

20090151997 - Circuit board: An exemplary embodiment of a circuit board is provided. The circuit board is compatible to a first chip with a first pin number, and a second chip with a second pin number, comprising a plurality of first pads, second pads and third pads. The arrangements of the first and second... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20090151998 - Electromagnetic wave shielding wiring circuit forming method and electromagnetic wave shielding sheet: The electromagnetic wave shielding wiring circuit forming method of the present invention comprises the steps of: preparing a fine copper particle dispersion, by dispersing fine copper particles into a disperse medium (S) including an organic solvent (A) having an amide-based compound, an organic solvent (B) having a boiling point of... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090151999 - Frame member for electromagnetic interference shielded panel: An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly... Agent: Barnes & Thornburg LLP

20090152000 - Electromagnetic interference shielded panel: An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly... Agent: Barnes & Thornburg LLP

20090152001 - Service posts for electrical and air delivery to workstations: A polygonal service post provides electrical services and optionally air to one or more workstations. The service post has a square cross-sectional shape with vertical faces having a channel for mounting a panel wherein adjacent panels form a workstation and having power and data outlets and an air damper for... Agent: Clifford A. Poff

20090152002 - Optoisolator leadframe assembly: An optoisolator leadframe assembly includes: an emitter leadframe part including a first rail and a plurality of emitter leadframe units, each rail including two rows of emitter leadframes, each having a die-mounting pad; and a receiver leadframe part including a second rail and a plurality of receiver leadframe units, each... Agent: Rosenberg, Klein & Lee

20090152003 - Housing for accommodating an electronic component and electronic component arrangement: A housing can accommodate an electronic component. An outer wall of the housing forms a flat contact wall in which contact areas for connecting the housing to an interconnect device are arranged.... Agent: Slater & Matsil, L.L.P.

20090145622 - Switching cabinet: A switching cabinet with a switching cabinet housing delimited at a top by an upper cover plate and having at least one switching cabinet door on a front surface. A plurality of transport eyes are attached to the top of the switching cabinet housing that can be covered by a... Agent: Pauley Petersen & Erickson

20090145623 - Hermetic chamber with electrical feedthroughs: A pressure cavity is durable, stable, and biocompatible and configured in such a way that it constitutes pico to nanoliter-scale volume. The pressure cavity is hermetically sealed from the exterior environment while maintaining the ability to communicate with other devices. Micromachined, hermetically-sealed sensors are configured to receive power and return... Agent: John S. Pratt, Esq Kilpatrick Stockton, LLP

20090145624 - Side-open outlet box arrangement: An outlet box arrangement having an adjustable capacity for receiving electric outlets includes an outlet box having a side wall, a top wall and bottom wall extending therefrom defining an outlet socket. A top flange and bottom flange extending from the top wall and bottom wall, respectively, on which flange... Agent: David And Raymond Patent Firm

20090145625 - System and method for securing a busway housing to busway power conductors: A power busway assembly includes a pair of opposing non-ferrous metal apertured side plates. The side plates have a U-shaped configuration and include a pair of top and bottom flanges that are joined by a flat piece. The power busway assembly further includes a means on one end of each... Agent: General Electric Company Ge Global Patent Operation

20090145658 - Bridge for a wire harness or other electrical components: A harness bridge member for retaining wires, harnesses or cables in a predetermined position on a member is disclosed. The harness bridge includes a substantially flat strap having a first side and a second side. It also includes a predetermined adhesive arranged on a predetermined portion of the first side... Agent: Raggio & Dinnin, P.C.

20090145626 - Separation and/or reinforcement device for a wire cable duct: A device for a wire cable duct (18) has a profiled part having a first wing (2), termed horizontal wing, and at least one second wing (4), termed vertical wing, extending substantially perpendicularly to the first wing on one side thereof. The device includes: at least one longitudinal housing (6)... Agent: Young & Thompson

20090145627 - Electric cable comprising a foamed polyolefine insulation and manufacturing process thereof: A process for manufacturing an electric cable including at least one core including a conductor and an insulating coating surrounding the conductor includes the steps of: providing a polyolefin material, a silane-based cross-linking system and a foaming system including at least one exothermic foaming agent in an amount of 0.1%... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090145628 - Method of using finely stranded 32-56 gauge \"litz wire\" in both the construction of the megasonic amplifier (including but not limited to the power transformer and the output filter magnetics) and the interconnect cabling from the amplifier to the transdu: Utilizing Litz wire characteristics in the construction of Megasonic components achieves lower temperatures, higher operating efficiencies, and the ability to deliver more power at higher frequencies with less cooling.... Agent: Mr. Karl Gifford

20090145629 - Micromachine and method for manufacturing the same: A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wiring (upper connection wiring) over the sacrificial layer, so that thinning,... Agent: Cook Alex Ltd

20090145630 - Printed wiring board and method for manufacturing printed wiring board: To provide a printed wiring board and a method for manufacturing the printed wiring board in which circuit widths of a signal transmission circuit and a power supply circuit or the like, which conventionally require to have greatly different circuit widths, are close to each other as much as possible... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20090145633 - Direct attach interconnect for connecting package and printed circuit board: A direct attach interconnect includes a housing and spring contacts. The housing has top and bottom sides lying in parallel planes defined by x and y axes. The spring contacts are individually disposed within a passage in the housing such that a top end of the spring contacts extends out... Agent: Brooks Kushman P.C. / Sun / Stk

20090145632 - Flexible printed circuit and method for manufacturing the same: Disclosed is a flexible printed circuit, comprising a substrate, and a silver foil and a reinforcement plate attached on said substrate in order, wherein there is an ink layer between said silver foil and said reinforcement plate. According to the invention, by printing the ink onto the silver foil and... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090145634 - Flexible printed circuitboard with reinforcement structure: A flexible printed circuitboard (FPC) with reinforcement structure is disclosed, which comprises: a flexible printed circuitboard (FPC), configured with an extended part at a side thereof; and an a stiffener, stacking on a surface of the FPC on the area excepting the extended part while configuring a recess on the... Agent: Wpat, PC

20090145631 - Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter: A reconfigurable system is described that can optimize the performance of the system. Substrates can be detached, levitated, moved, dropped and reattached as desired by the use of Coulomb forces generate between Coulomb islands. Thus, a system using a first set of substrates for a given frequency range can be... Agent: Thaddeus Gabara

20090145637 - Circuit board and image display apparatus: In a circuit board disposed in parallel to a fixing plane, a guard spacer (abutting member) is disposed on a multi-layer printed circuit board on the side of the fixing plane to suppress deformation of the multi-layer printed circuit board to prevent short circuit if an impact is applied to... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090145638 - Conductive pattern formation ink, conductive pattern and wiring substrate: A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink... Agent: Harness, Dickey & Pierce, P.L.C

20090145636 - Electronic component mounting package: An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulating layers. The entire surface of the coreless substrate, exclusive of pad... Agent: Kratz, Quintos & Hanson, LLP

20090145635 - Wiring substrate, manufacturing method of the same, and electronic component device: A wiring substrate includes (i) a wiring forming region in which wiring layers and an insulating layer are alternately stacked, (ii) an outer periphery region around the wiring forming region, and (iii) a reinforcing structural body having (a) a first reinforcing member continuously extending along said outer periphery region, and... Agent: Kratz, Quintos & Hanson, LLP

20090145640 - Conductive pattern formation ink, method of forming conductive pattern, conductive pattern and wiring substrate: A conductive pattern formation ink capable of forming a conductive pattern having high reliability, a conductive pattern having high reliability, a method of forming a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink... Agent: Harness, Dickey & Pierce, P.L.C

20090145639 - Conductive pattern forming ink, conductive pattern, and wiring substrate: where OH(A) represents an average number of hydroxyl groups in one molecule of the polyglycerol compound, Mw(A) represents a weight-average molecular weight of the polyglycerol compound, X(A) represents a content of the polyglycerol compound in the conductive pattern forming ink in weight percent; and OH(B) represents a number of hydroxyl... Agent: GlobalIPCounselors, LLP

20090145641 - Combining discrete electronic elements with printed electronic circuits: A method of printing electronic circuits uses pattern recognition to detect locations of interconnects on electronic components oriented on a substrate such that the interconnects face away from the substrate, the interconnects having ramps between the interconnects and the substrate, adjusts routing paths as needed based upon a difference between... Agent: Marger Johnson & Mccollom/parc

20090145642 - Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module: A power element mounting substrate including a circuit layer brazed to a surface of a ceramic plate, and a power element soldered to a front surface of the circuit layer, wherein the circuit layer is constituted using an Al alloy with an average purity of more than or equal to... Agent: Darby & Darby P.C.

20090145646 - Electromagnetic bandgap structure and printed circuit board: According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric... Agent: Staas & Halsey LLP

20090145645 - Interconnection element with posts formed by plating: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface... Agent: Tessera Lerner David Et Al.

20090145649 - Multi-layered wiring substrate, method for producing the same, and semiconductor device: A multi-layered wiring substrate, in which a wiring layer and an insulative layer are alternately arranged, having pads to connect to electronic components at one side thereof and wires to connect the corresponding pads to the wiring layer, is composed so that the multi-layered wiring substrate is provided with through... Agent: Drinker Biddle & Reath (dc)

20090145648 - Multilayer wiring board, manufacturing method thereof, and semiconductor device: A multilayer wiring board is so constituted that: a group of electronic part mounting capture pads are provided on one surface thereof; a first wiring layer formed on an uppermost layer thereof includes a first connection part arranged on the same surface as the surface where the pads are provided,... Agent: Drinker Biddle & Reath (dc)

20090145643 - Printed wiring board with a built-in resistive element: A printed wiring board with a built-in resistive element comprising a first electrode formed on the surface of an insulating member, a second electrode provided adjacent to the first electrode to form a space therebetween, a resistor-filling part formed by the space between the first electrode and the second electrode,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090145644 - Printed wiring board, air conditioner, and method of soldering printed wiring board: To provide a printed wiring board capable of completely soldering a solder land to a lead under simple control over a manufacturing process even in the case of using a lead-free solder of a low solder wettability. A printed wiring board for mounting a surface mounting device includes a solder... Agent: Buchanan, Ingersoll & Rooney PC

20090145647 - Surface mount device: The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad... Agent: Cermak Kenealy Vaidya & Nakajima LLP

20090145650 - Screen mask, method for printing conductive bonding material, mounting method of mounting devices, and mounting substrate: A screen mask according to an embodiment of the present invention includes a mask member in which a print pattern is formed to print a conductive bonding material onto a mounting substrate. The mask member includes a first print area in which a conductive bonding material is printed onto the... Agent: Birch Stewart Kolasch & Birch

20090145651 - Multilayer wiring board and method for producing the same: A multilayer wiring board 1 includes an insulating layer 2, a copper wiring upper layer 3 and a copper wiring lower layer 4 laminated on both surfaces of the insulating layer 2, a through hole 5 pierced through the insulating layer 2 and at least one of the copper wiring... Agent: Greenblum & Bernstein, P.L.C

20090145652 - Printed wiring board and its manufacturing method: The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on... Agent: Sughrue Mion, PLLC

20090145653 - Substrate pad structure: A substrate pad structure for connecting a lead connecting portion of an electronic device to a substrate is disclosed. The substrate pad structure includes a first pad portion and a second pad portion that are arranged on the substrate at corresponding positions of two end regions of the lead connecting... Agent: Ipusa, P.l.l.c

20090145654 - Electromagnetic shielding sheet, plasma display apparatus using the same, and related technology: There are provided an electromagnetic shielding sheet and a plasma display apparatus. The electromagnetic shielding sheet includes a base sheet; a first layer on a first surface of the base sheet, the first layer including first and second patterns crossing each other; and a second layer on a second surface... Agent: Fish & Richardson P.C.

20090145655 - Electromagnetically shielded cable: An electromagnetically shielded cable includes a shell having an end portion and a shield embedded in the end portion of the shell. A method of forming the electromagnetically shielded cable is also provided. The method includes the steps of inserting the end portion of the shield into a mold, and... Agent: Delphi Technologies, Inc.

20090145656 - Electrical device: A device embodied as a measuring- and/or switching-device of industrial measurements and automation technology and/or an electronic, device, has at least one housing with at least one chamber, especially a chamber accommodating electrical, electronic and/or electromechanical components and/or assemblies of the device, especially a chamber which is sealed pressure-tightly and/or... Agent: Bacon & Thomas, PLLC

20090145657 - Insulator with enhanced insulating capacity: When an insulator is used in a humid atmosphere, the cooling thereof causes a humidity condensation, which is deposited on the insulator surface. Drops of water formed by the humidity condensation are connected to each other that a water film substantially reducing the insulation resistance of the insulator is formed.... Agent: Siemens Corporation Intellectual Property Department

20090139739 - Lightning protection system for a wind turbine blade: The invention relates to a lightning protection system for a wind turbine blade, where the blade is a shell body made of a composite material and comprises a root area and a tip end. The lightning protection system comprises at least one lightning receptor arranged freely accessible in or on... Agent: The Nath Law Group

20090139740 - High voltage wiring system for electric powertrains: A high voltage wiring system for an electric powertrain is disclosed. The system includes a power conversion unit sealed in a first enclosure. The system also includes at least one second enclosure configured to be sealed and having at least one cable disposed therein. The disclosed system further includes a... Agent: Caterpillar/finnegan, Henderson, L.L.P.

20090139741 - Electrical junction box incorporating an electronic component and electrical connection unit having thereof: An electrical connection unit includes an electrical junction box that incorporates a capacitor and has (a) a body that has an electronic component accommodating space accommodating the capacitor via an opening; and an electric wire receiving space receiving an electric wire electrically connected to a terminal of the capacitor, and... Agent: Edwards Angell Palmer & Dodge LLP

20090139742 - Recessed while-in-use electrical box: The present invention is directed to an electrical wiring box assembly that includes an inner wall box including a peripheral inner wall bounded and enclosed by a rear wall and open at a front end of the inner wall box to form an inner volume. The inner wall box also... Agent: Bond, Schoeneck & King, PLLC

20090139765 - Feedthru assembly: A feedthru assembly configured to provide a conductive path extending between an interior of an enclosure and an exterior of the enclosure includes a flange, at least one conductive pin, and at least one insulative member. The flange is configured to couple to the enclosure and has one or more... Agent: Boston Scientific Neuromodulation Corp. C/o Darby & Darby P.C.

20090139743 - Wire/cable identification device: An electric wire identifier that includes an anti-short bushing in the form of an electrical insulating ring-like insert fitted onto the end of a metal or armored clad cable that defines the terminal end of the armored cable or into the end of an electrical connector that is generally inserted... Agent: Paul A. Fattibene Fattibene & Fattibene

20090139744 - Small-diameter wireline cables and methods of making same: A small-diameter wireline cable core has either two insulated preferably half moon profile conductors fixed together or an insulated central conductor over which three insulated conductors are helically cabled in a triad configuration. A layer of polymeric insulator covers all of the conductors to form a circular profile. A cable... Agent: Schlumberger Ipc Attn: David Cate

20090139745 - Repair device for printed circuit board: A repair device for a PCB includes a clamp portion having a plurality of receptacles defined therein, a connector head having a plurality of contacts configured to connect with the PCB, a plurality of conductive lines arranged side by side, and a lead wire. One end of each of the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090139746 - Substrate panel: A substrate panel is disclosed. The substrate panel may include a clamp contact, a bus line formed at a distance from the clamp contact, and a plurality of substrate units supplied with an electric current by way of the bus line, where an insulation part may be formed between the... Agent: Staas & Halsey LLP

20090139747 - Substrate panel: A substrate panel is disclosed. The substrate panel may include a pair of clamp contacts, a plurality of bus lines located between the pair of clamp contacts, and a plurality of substrate units supplied with an electric current by way of the plurality of bus lines, where the bus lines... Agent: Staas & Halsey LLP

20090139748 - Wiring substrate: A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the... Agent: Sughrue Mion, PLLC

20090139749 - Method for the preparation of a flexible transducer unit, the flexible transducer unit so prepared and an array containing such flexible transducer units: The present invention relates to a method for the preparation of a flexible transducer unit from a wafer containing a plurality of transducer structures comprising a substrate, a metal-oxide layer, at least one mesh structure in said metal-oxide layer and electric wires including at least one first contact pad in... Agent: Venable LLP

20090139750 - Printed wiring board and printed circuit board unit and electronic apparatus: A printed wiring board has a rigid insulating layer. A first substrate is partly overlaid on the front surface of the rigid insulating layer. The first substrate has a free end located outside the contour of the rigid insulating layer. A second substrate is partly overlaid on the back surface... Agent: Staas & Halsey LLP

20090139751 - Wiring substrate and manufacturing method thereof: In a wiring substrate having a wiring member 30B made by layering insulating layers 20, 20a, 20b, 20c and wiring layers 18, 18a, 18b, 18c, 18d, and a reinforcing body 50A disposed between the insulating layers of this wiring member 30B, this reinforcing body 50A is configured to cross plural... Agent: Drinker Biddle & Reath (dc)

20090139752 - Electronic device and method for producing electronic device: An electronic device having a substrate, a layer comprising a 6-member ring-structured carbon homologue as the main ingredient, a pair of electrodes, a layer comprising aluminium oxide as the main ingredient and disposed between the pair of electrodes, and a layer comprising aluminium as the main ingredient, wherein the layer... Agent: Birch Stewart Kolasch & Birch

20090139753 - Copper clad laminate for chip on film: The present invention relates to a copper clad laminate for chip on film, specifically to a copper clad laminate for a chip on film comprising a copper clad and at least one polyimide layer laminated on the copper clad, wherein the polyimide layer in contact with the copper clad comprises... Agent: Mckenna Long & Aldridge LLP

20090139754 - Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same: Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ. A... Agent: Frishauf, Holtz, Goodman & Chick, PC

20090139756 - Fabricating process of circuit board with embedded passive component: A fabricating process of a circuit board with an embedded passive component is described. First, a conductive layer including a first surface and a second surface opposite thereto is provided. The first surface has at least one component region on which at least one passive component material layer is formed.... Agent: J C Patents, Inc.

20090139757 - Multilayer chip capacitor and circuit board device including the same: A multilayer chip capacitor including: a capacitor body having a lamination structure where a plurality of dielectric layers are laminated and including a first capacitor part and a second capacitor part arranged according to a lamination direction; first to fourth outer electrodes formed on side surfaces of the capacitor body,... Agent: Mcdermott Will & Emery LLP

20090139755 - Surface mounted semiconductor device and method for manufacturing same: The present invention provides a surface mounted semiconductor device 1 formed by cutting an assembly board together with cathode wiring patterns 8 and anode wiring patterns 10 arranged on the assembly board on which light-emitting elements are mounted. When the surface mounted semiconductor device 1 is mounted on a mounting... Agent: Hamre, Schumann, Mueller & Larson P.C.

20090139758 - Printed circuit board assembly and manufacturing method for the same: A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals... Agent: Staas & Halsey LLP

20090139759 - Laminated ceramic electronic component and manufacturing method therefor: A laminated ceramic electronic component includes a plurality of ceramic green sheets. In each of the ceramic green sheets, which are not backed with a carrier film, coil conductor patterns and lead-out electrodes are formed by a screen printing method and simultaneously a conductive paste is filled in holes for... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090139760 - Multilayer printed wiring board and method of manufacturing the same: A multilayer printed wiring board including an insulation layer and a first interlayer resin insulation layer provided on the insulation layer. A layered capacitor section is provided on the first interlayer resin insulation layer and has a high dielectric layer and first and second layered electrodes that sandwich the high... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090139761 - Multilayer printed wiring board and manufacturing method thereof: A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interlayer connection is formed at a temperature higher than the operating temperature;... Agent: Ratnerprestia

20090139762 - Metamaterial spheric alignment mechanism: A chamber or series of chambers is formed from layers of nested shells and used to manipulate a work product within the chambers. The shells are formed from highly ordered material structures, such as superconductors and metamaterials, and the work product is manipulated using energy that is directed from the... Agent: Husch Blackwell Sanders LLP

20090139763 - Terminal box for a solar cell panel: A means for effectively preventing the temperature rise of the diode when the bypass diode is operating in a terminal box for a crystalline silicon solar cell panel is provided. The present invention is characterized in that, in the terminal box for a crystalline silicon solar cell panel, Schottky barrier... Agent: Fish & Richardson P.C.

20090139764 - Wearable device assembly having athletic functionality: A wearable device has a carrier having an aperture. A device has a USB connection and a protrusion wherein the protrusion is received in the aperture to connect the device to the carrier. The device is a USB type device having athletic functionality.... Agent: Banner & Witcoff, Ltd.