Electricity: conductors and insulators inventions 05/09

20090133895 - Water-blocked cable: A water-blocked cable comprised of a first and second line of defense against water invasion wherein said cable is comprised of materials that can meet both indoor and outdoor use requirements.... Agent: Lewis, Rice & Fingersh, Lc Attn: BoxIPDept.

20090133925 - Cable harness, more specifically a high-voltage cable harness for a motor vehicle, as well as a device for leading-through an electric cable and for connecting a shield of the cable: A cable harness, more specifically a high-voltage cable harness for a motor vehicle, is provided. The cable harness has at least one electric cable, which includes an electric line and a shield that surrounds the line, as well as a device for leading-through and for connecting the shield of the... Agent: Lerner Greenberg Stemer LLP

20090133926 - Non-halogen resin composition, insulated electrical wire, and wire harness: The present invention provides a non-halogen resin composition, an insulated electrical wire formed of the non-halogen resin composition, and a wire harness including the insulated electrical wire. The non-halogen resin composition, comprising: (A) 100 parts by weight of a base resin, containing 50 to 75 weight percent of a polypropylene,... Agent: Edwards Angell Palmer & Dodge LLP

20090133927 - Joint structure of copper wire and aluminum wire, and joint method: A joint structure of electric wires includes: a copper wire which includes a conductor formed of copper; an aluminum wire which includes a conductor formed of aluminum or aluminum alloy; and a joint terminal provided with a conductor press-fitting part having a U-shape in cross section. The conductor press-fitting part... Agent: Sughrue-265550

20090133928 - Floor-mounted domestic appliance: A floor-mounted domestic appliance includes an A.C. power connector that supplies the appliance with electric energy, an appliance outlet that corresponds to the A.C. power connector, wherein the appliance outlet comprises a terminal block for establishing an electrically conducting connection to a power supply lead.... Agent: Bsh Home Appliances Corporation Intellectual Property Department

20090133896 - Multiconductor cable assembly and fabrication method therefor: A multiconductor cable assembly includes two or more coated wires in a side-by-side contacting relation, and the covering of the wires includes a composition with specific proportions of a poly(arylene ether), a block copolymer, and a flame retardant. The multiconductor cable assembly exhibits excellent physical and flame retardant properties without... Agent: Cantor Colburn LLP - Sabic (noryl)

20090133897 - Substantially flat fire-resistant safety cable: The invention concerns a flat fire-resistant safety cable (1), comprising: at least two electrical conductors (3), one insulating layer (4) around each electrical conductor (3) to provide at least two insulated elements (5), the insulating layer (4) consisting of at least one polymeric material transformable at least at the surface... Agent: Harness, Dickey & Pierce, P.L.C

20090133898 - Flexible flat cable with carrier tape and manufacturing method thereof: The flexible flat cable with the carrier includes a plurality of flexible flat cables 2 each of which has a plurality of conductors 2a sandwiched between two insulating materials 2b and arrayed substantially in parallel at a prescribed pitch, with the conductors 2a at opposite ends of each flexible flat... Agent: Kanesaka Berner And Partners LLP

20090133899 - Drawn strand filled tubing wire: A wire for use in medical applications. The wire is formed by forming a bundle from a plurality of metallic strands and positioning the bundle within an outer tube. The tube and strands are then drawn down to a predetermined diameter to form a wire for use in medical devices.... Agent: Baker & Daniels LLP 111 E. Wayne Street

20090133903 - Electrode and method for forming the same: An electrode and a method for forming the electrode. The electrode comprises: a substrate; and a plurality of metal particles adhering to the substrate. The method comprises steps of: providing a substrate; providing a solution including a solvent and a plurality of metal particles on the substrate; removing the solvent;... Agent: Wpat, PC

20090133900 - Electronic circuit device and method for manufacturing same: Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles... Agent: Wenderoth, Lind & Ponack L.L.P.

20090133901 - Method for forming conductive pattern and wiring board: [Means for solving problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid... Agent: Mcdermott Will & Emery LLP

20090133902 - Printed circuit board: A printed circuit board is disclosed. The printed circuit board, which may include an insulation layer, a first metal pad formed on the insulation layer, a second metal pad electrically coupled with the first metal pad and having an ionization tendency lower than that of the first metal pad, and... Agent: Staas & Halsey LLP

20090133904 - Module and manufacturing method thereof: A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions;... Agent: Fish & Richardson P.C. Citigroup Center

20090133906 - Flexible printed circuit board and manufacturing method thereof: A flexible printed circuit board (FPCB) and FPCB manufacturing method that improves a signal transfer characteristic at a high speed. The FPCB includes an insulating layer having a signal pattern that transfers signals, a cover layer formed on the signal pattern, and a shielding layer formed at a position opposite... Agent: Cha & Reiter, LLC

20090133905 - Heat-curable resin composition including silicone powder: A heat-curable resin composition has excellent printability, non-tackiness, matte and electrical properties. The heat-curable resin composition includes a heat-curable resin (A) and silicone powder (B). Preferably, the silicone powder (B) is spherical or substantially spherical, and has a specific gravity of 0.95 to 1.5 and a particle diameter of 0.01... Agent: Sughrue Mion, PLLC

20090133907 - Novel polyimide copolymer and metal laminate using the same: A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at... Agent: Butzel LongIPDocketing Dept

20090133908 - Interconnect structure for a microelectronic device, method of manfacturing same, and microelectronic structure containing same: An interconnect structure for a microelectronic device includes an electrically conductive material (130, 730, 930) adjacent to a metallization layer (120, 320, 920). The electrically conductive material has a base (131, 931) and a body (132, 932). The base is wider than the body. The base and the body form... Agent: Intel Corporation C/o Cpa Global

20090133909 - Tip printing and scrape coating systems and methods for manufacturing electronic devices: Methods are disclosed for manufacturing electronic devices (e.g., transistors, and etc.), solar arrays, optical display arrays, portions of such devices and arrays, and the like. Utilizing a scrape coating and/or a tip printing process, various electronic and solar arrays are manufactured.... Agent: Fish & Richardson PC

20090133910 - Production method of multilayer printed wiring board and multilayer printed wiring board: Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090133911 - Release film for use in manufacture of printed circuit boards: To provide a release film which is used to avoid adherence between a press hot plate and a printed circuit board or a cover lay film at the time of press work effected to printed circuit boards such as printed wiring boards, flexible printed circuit boards and multilayered printed circuit... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090133914 - Method for producing an integrated device and a device produced thereby: A method for producing an integrated device. A source substrate is provided, the source substrate carrying one or more components to be attached to a receiver surface having a uneven topography. The source substrate includes a deformable layer on a surface on which the one or more components are carried.... Agent: Ibm Corporation, T.j. Watson Research Center

20090133912 - Resin composition and hybrid integrated circuit board making use of the same: A resin composition comprising a curable resin comprising an epoxy resin and a curing agent for the epoxy resin; and an inorganic filler filled in the curable agent; wherein the curing agent comprises a phenol novolak resin, and wherein the inorganic filler comprises a coarse powder containing particles having an... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090133913 - Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip: Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a... Agent: Sughrue Mion, PLLC

20090133917 - Multilayered circuit board for connection to bumps: A circuit board on which an electronic device having bumps arranged in an array form is to be mounted includes a substrate having a multilayer structure that includes interconnect lines and insulating layers, and vias penetrating through one or more of the insulating layers and coupled to one or more... Agent: Ipusa, P.l.l.c

20090133916 - Optoelectronic device and method for producing an optoelectronic device: An optoelectronic device includes an optoelectronic component, the optoelectronic component having an active region and at least one first conductive path on a first substrate, wherein the first conductive path is electrically connected to the active region. Further, the optoelectronic device comprises a second substrate with at least one second... Agent: Fish & Richardson P.C.

20090133915 - Wiring board, method for manufacturing same and semiconductor device: A wiring board which includes a product portion configured with at least one layer of electrically insulating base, a wiring pattern formed on the surface or inner portion of the electrically insulating base, and a wiring protection layer which is formed on the surface of the board and has an... Agent: Pearne & Gordon LLP

20090133918 - Double-sided wiring board, manufacturing method of double-sided wiring board, and mounting double-sided wiring board: In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion... Agent: Birch Stewart Kolasch & Birch

20090133919 - Multilayer printed wiring board, method for manufacturing buildup printed wiring board, and electronic apparatus: A multilayer printed wiring board includes: an insulating base including an indentation section formed thereon; a conductor pattern formed on the insulating base, the conductor pattern including a thick film section formed by embedding a conductor in the indentation section; and a via hole section formed in an upper layer... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090133920 - Printed circuit board and manufacturing method of the same: A printed circuit board and a manufacturing method of the same. The method includes forming a circuit board by selectively positioning a heat release layer among multiple insulation layers that have circuit patterns formed on their surfaces, perforating a through-hole that penetrates through one side and the other side of... Agent: Staas & Halsey LLP

20090133921 - Flexible pc board made through a water cleaning process: A flexible PC board made through a water cleaning process includes a substrate prepared from polymers or copolymers such as PET, PI, PP, PS, PMMA, PC, PU, PBT, ABS, nylon, etc. A release layer prepared from a hydrophilic material and printed on the substrate to leave a blank zone on... Agent: Pai Patent & Trademark Law Firm

20090133922 - Light transmitting conductive film, light transmitting electromagnetic wave shielding film, optical filter and method of producing display filter: A light transmitting conductive film formed by patterning a conductive metal part and a visible light transmitting part on a transparent support, wherein the conductive metal part is made up of mesh-forming thin lines of from 1 μm to 40 μm size and the mesh pattern continues for 3 m... Agent: Buchanan, Ingersoll & Rooney PC

20090133923 - Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter: l

20090133924 - Apparatus for signal and current transmission between end points which can move relative to one another: An apparatus is specified for signal and current transmission between end points which can move relative to one another, between which at least one flat ribbon line, which flat-ribbon line is subdivided into an inner winding area and an outer-winding area, which is connected thereto by means of an approximately... Agent: Sofer & Haroun LLP.

20090126990 - Retractable contact post shield and method: An electronic device having one or more contact posts is disclosed having a sleeve slidably mounted around the contact post and lockable by a push-push latching system in a retracted position in which the sleeve is below an upper end of the contact post and an extended position in which... Agent: Karen Henckel, Esq. Dorsey & Whitney LLP

20090126965 - Cooling of high voltage devices: A high voltage bushing including an electrical conductor configured to be electrically connected to a high voltage device and configured to be connected to an external fluid cooling system, and an insulating body surrounding the electrical conductor. A method includes cooling the high voltage bushing by connecting the electrical conductor... Agent: Venable LLP

20090126966 - Wire management transition block: A wire management transition system configured for placement in a floor panel of an aircraft system, and to be secured beneath a tracking strip. The system is configured to secure both data and power cables without damage to the wires. A top portion and bottom portion interconnect and are configured... Agent: Tyco Technology Resources

20090126967 - Thermal packaging of transmission controller using carbon composite printed circuit board material: A transmission controller includes a printed circuit board that mechanically supports and electrically connects circuitry of the transmission controller to a vehicle bus. The printed circuit board includes a lower layer of carbon composite and an upper layer of high temperature substrate. A flex circuit is laminated on the printed... Agent: Carlson, Gaskey & Olds, P.C.

20090126968 - Screwless wall-plate: The present invention provides for a screwless wall-plate assembly which includes a base plate component, at least two barbed fastener components, and a face plate component irremovably attached to the base plate component. The base plate component has a central opening for receiving at least one electrical component and at... Agent: Linda L. Vitone

20090126993 - Construction for stopping water from penetrating into drain wire contained in shielded wire and method for stopping water from penetrating thereinto: A Drain wire led out from the interior to the exterior of a shielded wire is covered with a heat shrinkable tube made of an insulating resin or with a rubber tube including silicon or EPDM (ethylene-propylene rubber). A water-stop agent is penetrated between the element wires of the drain... Agent: Oliff & Berridge, PLC

20090126969 - Helically-wound electric cable: A method of manufacturing an electric cable includes winding together two groups in such a manner as to form a group helix, each group having two twisted-together conductor wires, and where the groups are wound together at a speed that varies between two limit speeds having the same sign and... Agent: Joseph Sofer Sofer & Haroun, L.L.P.

20090126970 - High frequency electronic part: m

20090126971 - Multi-conductor cable construction: A cable for use in computer networking for example has a jacket defining an internal space. A separator is located in the internal space and divides the space into three or more segments. The separator has a three or more radiating walls, at least one of which has an extension... Agent: Alix Yale & Ristas LLP

20090126972 - Shield flat cable and manufacturing method thereof: A manufacturing method of a flat shield cable has a step of arranging a plurality of flat conductors including a ground line parallel with each other in one plane at a pitch P, a step of forming a flat cable by laminating a first insulating film on the flat conductors... Agent: Mcdermott Will & Emery LLP

20090126973 - Protective device against electrical discharges in fixing elements: The invention relates to a device (1) for the protection against electrical discharges of a conductive fixing element (4) of an aircraft, comprising a cap (2) made of non-conductive material and a washer (3) made of non-conductive material insulating the fixing element (4) from electrical discharges, said cap being an... Agent: Ladas & Parry LLP

20090126974 - Manufacturing process for a prepreg with a carrier, prepreg with a carrier, manufacturing process for a thin double-sided plate, thin double-sided plate and manufacturing process for a multilayer-printed circuit board: A process for manufacturing a prepreg with a carrier exhibiting excellent impregnating properties and thickness precision, which is particularly suitably used for preparing a build-up type multilayer-printed circuit board is provided. Also, a prepreg with a carrier prepared by the manufacturing process and a process for manufacturing a multilayer-printed circuit... Agent: Smith, Gambrell & Russell

20090126975 - Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate: A method for fabricating a multilayer circuit board, including: preparing a film 1 with interlayer adhesive in which a first protective film 102 and a first interlayer adhesive 104 are stacked; preparing a first circuit board 2 having a first base 202 and a conductive post 204 protruding from the... Agent: Ditthavong Mori & Steiner, P.C.

20090126976 - Flexible wiring board, method of producing the same and imaging device: A flexible wiring board is formed with a first mounting surface, a first erected surface portion, a relay portion, a second erected surface portion and a second mounting surface. The first erected surface portion and the second erected surface portion are positioned on the same plane. The second mounting surface... Agent: Sughrue Mion, PLLC

20090126977 - Multilayer film: This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film.... Agent: Hewlett Packard Company

20090126978 - Reference layer openings: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.... Agent: Schwabe, Williamson & Wyatt, P.C.

20090126979 - Semiconductor package circuit board and method of forming the same: A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an m-by-n matrix pattern so that the marking areas are... Agent: Marger Johnson & Mccollom, P.C.

20090126980 - Printed wiring board: In a printed wiring board, contacts are formed only on one side surface of a printed board, and electronic components are arranged only on the other side surface of the printed board. Then, soldering work employing Pb free solder is conducted only on the other side surface of the printed... Agent: Morgan Lewis & Bockius LLP

20090126981 - Wiring board and method for manufacturing the same: A wiring board 10 includes a wiring board main body 11 having a semiconductor device attaching pad 21 on which a semiconductor device 14 is attached, a dielectric layer 22 provided with the semiconductor device attaching pad 21, and a semiconductor device attaching area A in which the semiconductor device... Agent: Drinker Biddle & Reath (dc)

20090126982 - Wiring board and method for manufacturing the same: A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric... Agent: Drinker Biddle & Reath (dc)

20090126983 - Method and apparatus to reduce impedance discontinuity in packages: A method, system and apparatus for coating plated through holes (PTHs) to reduce impedance discontinuity in electronic packages. PTH vias are imbedded in the core of a printed circuit board comprising a core layer, a plurality of buildup layers, a plurality of micro-vias, and a plurality of traces. Traces electrically... Agent: Dillon & Yudell LLP

20090126984 - Electromagnetic shielding film and optical filter: An electromagnetic shielding film comprises a conductive portion and an opening portion, and a moire preventing part is formed in the opening portion. The moire preventing part may be formed approximately at the center of the opening portion, and may be formed on a line connecting intersections facing each other... Agent: Young & Thompson

20090126985 - Shield shell unit: A shield shell unit includes a shield shell that is attached to an end portion of a shield member for covering a wire, and an attached portion that is attached to the shield shell. The shield shell includes a shell main body, and a fixing portion which projects from the... Agent: Sughrue-265550

20090126986 - Electromagnetic shielding film for display device, filter having the same, and method of fabricating the same: An electromagnetic shielding film for a display device includes a transparent, resinous first base, an intaglio pattern formed on at least one side of the first base, and an electromagnetic shielding pattern containing a conductive material with which the intaglio pattern is filled. A method of fabricating an electromagnetic shielding... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20090126987 - Fold-in braided shield: A braided shield includes a housing formed from a plurality of wires braided together and having a dual-layer configuration. The housing has an outer layer integrally formed with an inner layer. A support is at least partially disposed in the housing, and the inner layer is disposed between the support... Agent: Delphi Technologies, Inc.

20090126988 - Large capacity universal conduit bodies: A conduit body device for accommodating wire therethrough the device is provided. The conduit body has a body wall including a pair of elongate side walls and a pair of end walls forming a perimetrical side wall, a bottom wall, and an open end defining a body interior. The conduit... Agent: Hoffmann & Baron, LLP

20090126989 - Passive fire protection system for energized electric utility facilities and method of installation: A passive fire protection system for a power facility having a fire resistant wrap enclosing cable joints and adjacent power cables; a fire resistant sheet carried between the power cables and the control cables defining a fire barrier to resist fire from the power cables damaging the control cables; a... Agent: Mcnair Law Firm, P.A.

20090126991 - Substrate for mounting electronic part and electronic part: The present invention is characterized by a structure having a substrate 1, and metallization layers 2 formed on the substrate 1, on which a Sn solder film 3 and an Ag film 4 are formed. The Ag film 4 is a metal free from oxidization at room temperature in the... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090126992 - Device for sealing of inserted cables, conduits or pipes: In a device for sealing of conduits inserted in circular lead-throughs of walls and roofs designed as frame (1) it is provided for the arrangement of a plug formed sealing body (2) of elastic material which forms a quadrangular pack accommodation (7). In the pack accommodation (7) elastic splitted modules... Agent: Harness, Dickey & Pierce, P.L.C

20090120659 - Insulated wire: in which P (mN) represents a load when a triangular pyramid indenter with tip angle of 115° is pressed against the surface of the resin coating layer, and D (μm) represents the indentation depth by the triangular pyramid indenter to the surface of the resin coating layer.... Agent: Birch Stewart Kolasch & Birch

20090120660 - Electrical member and method of manufacturing a printed circuit board using the same: An electrical member and a method of manufacturing a printed circuit board using the electrical member are disclosed. The method includes: forming an intaglio groove in an insulation layer, where the intaglio groove has at least one protrusion formed within; stacking a seed layer over the intaglio groove; forming a... Agent: Staas & Halsey LLP

20090120661 - Protective structure for high voltage cable: A protective structure for a high voltage cable includes a boost converter and a rear inverter installed in a hybrid vehicle and disposed to be separated from each other; a cable extending between the boost converter and the rear inverter; a protector provided in at least a section of a... Agent: Sughrue Mion, PLLC

20090120664 - Data cable with cross-twist cabled core profile: Cables including a plurality of twisted pairs of insulated conductors, a separator disposed among the plurality of twisted pairs so as to physically separate a first twisted pair from a second twisted pair, and a jacket surrounding the plurality of twisted pairs and the separator. The jacket may include a... Agent: Lowrie, Lando & Anastasi, LLP

20090120663 - Electrical cable: Electric cable having at least one conductor (1) with an insulating layer (2) applied thereto and being twisted around a longitudinal axis of the cable, where the insulated conductor (1, 2) is provided with an enclosing elastomer layer (3) of a material having a hardness being substantially lower than the... Agent: Sofer & Haroun LLP.

20090120662 - Multi-coaxial cable assembly and manufacturing method of the same: A multi-coaxial cable assembly of the present invention includes a multi-coaxial cable in which a plurality of coaxial cables having insulators, external conductors, and jackets on an outer periphery of center conductors are arranged in parallel; inclined cross sections formed on the end part of the multi-coaxial cable in such... Agent: Fleit Gibbons Gutman Bongini & Bianco Pl

20090120666 - Clad contact point material and method for mounting a clad contact point material: A clad contact point material 1 is formed into a tape in shape by attaching by pressure a contact point part 3 of silver or silver nickel to a copper base material 2, silver plating 4 is performed on the entire material. A 2 mm clad contact point 6 segmented... Agent: Schwegman, Lundberg & Woessner, P.A.

20090120665 - Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance: There is provided a gold alloy wire for a bonding wire having high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire contains one kind or two kinds of Pt and Pd of 5000 ppm to... Agent: Darby & Darby P.C.

20090120667 - Lead: A lead for transmitting an electrical signal within a gas turbine engine, from a node at a first part of the gas turbine engine having a first surface to a second part of the gas turbine engine having a second surface, wherein the first part and the second part are... Agent: Manelli Denison & Selter

20090120668 - Cabled signaling system and components thereof: An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively.... Agent: Tpl/interconnect Portfolio, LLC

20090120669 - Micro device with microtubes: The current invention is related to a micro device with microtubes that can be used as a heat exchanger for ultra fast cooling or heating of liquids. Using a damascene metal level in combination with thermal degradable polymer (TDP) enables the manufacturing of compact system of microtubes only separated by... Agent: Philips Intellectual Property & Standards

20090120670 - Bendable area design for flexible printed circuitboard: A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a... Agent: Wpat, PC

20090120671 - Fpcb substrate and method of manufacturing the same: A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at... Agent: PCe Industry, Inc. Att. Steven Reiss

20090120672 - Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device having a reduced cost, manufacturing time, weight, and thickness: A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or... Agent: Alston & Bird LLP

20090120673 - Multilayer circuit board and electronic device: A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the... Agent: Foley And Lardner LLP Suite 500

20090120674 - Built-in battery assembly and a method of assembling the built-in battery with a circuit board: A built-in battery assembly (100) including a battery body (10) and a flexible connecting board (50) is described. The flexible connecting board includes a first pair of terminals (52) and a second pair of terminals (55), wherein the first pair of terminals electrically connects to the battery body and the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090120675 - Mounted structural body and method of manufacturing the same: Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion... Agent: Mcdermott Will & Emery LLP

20090120676 - Process for the production of a conductor track structure: The invention concerns a process for the production of a conductor track structure on a flexible plastic film, a conductor track structure produced in accordance therewith, wherein the conductor track structure is connected to the plastic film by means of an adhesive layer hardened by irradiation, and is formed from... Agent: Hoffmann & Baron, LLP

20090120679 - Conductive through via structure and process for electronic device carriers: Conductive through vias are formed in electronic devices and electronic device carrier, such as, a silicon chip carrier. An annulus cavity is etched into the silicon carrier from the top side of the carrier and the cavity is filled with insulating material to form an isolation collar around a silicon... Agent: John A. Jordan, Esq.

20090120678 - Printed circuit board interconnecting structure with compliant cantilever interposers: An interconnecting structure for interconnecting two electronic modules. The structure includes a dielectric substrate having a copper trace deposited on the lower surface thereof, and a copper pad disposed on the upper surface of the substrate directly above one end of the trace. A first copper plate-up area deposited on... Agent: Lathrop & Gage Lc

20090120677 - Wiring substrate and associated manufacturing method: A wiring substrate for mounting electronic parts and a method for manufacturing the same are provided. The wiring substrate includes a substrate that includes a first surface, a second surface and a plurality of through-holes that extend through the substrate from the first surface to the second surface so as... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090120680 - Method for manufacturing a printed wiring board: A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090120681 - Electromagnetic noise absorber: An electromagnetic noise absorber to be attached around an electric cable to attenuate noise transmitted through the electric cable. The electromagnetic noise absorber comprises a strip-like base material and a plurality of ferrite pieces fixed to the strip-like base material. The plurality of ferrite pieces are formed by fixing a... Agent: Davis & Bujold, P.l.l.c.

20090120682 - Printed circuit board assembly: A printed circuit board assembly includes a printed circuit board; a component adapted to be mounted on the printed circuit board, the component having a ground/earth terminal in at least an outer face thereof; and a shield case for surrounding the printed circuit board or covering the component. The shield... Agent: Kratz, Quintos & Hanson, LLP

20090120683 - Cable organizer: A cable organizer is disclosed. The cable organizer includes a cable spool that is mountable to an underside of a support surface and is used to organize, store and separate cables and power cables used to operate and power electrical appliances. The cable spool is formed from cup structures that... Agent: Haverstock & Owens LLP

20090120684 - Sealing board and method for producing the same: There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exhibiting a high wettability to the... Agent: Smith, Gambrell & Russell

20090120685 - Method for encapsulating electrical and/or electronic components in a housing: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating moulding compound. The method according... Agent: John Alumit

20090120686 - Electric power terminal feed-through: A power terminal feed-through incorporates a metallic body through which extend one or more current conducting pins that are hermetically sealed to the metallic body by a glass-to-metal seal. The metallic body includes an annular lip with a protrusion. During welding installation of the power terminal feed-through, the protrusion serves... Agent: Harness, Dickey & Pierce, P.L.C

20090120687 - Electrical connector with outer retainer ring and internal unidirectional conductor retainer: Various embodiments of an electrical connector assembly that includes a connector body having an inlet end portion and an outlet end portion. The outlet end portion is held in a knock out hole of an electric box and the inlet end portion is provided with an adjacent opening for receiving... Agent: Paul A. Fattibene Fattibene & Fattibene

20090114413 - Insulated housing: A wall component for use in building structures preferably having a rear panel which is insulated. This panel preferably has one or more chambers which provide an improved R value to the housing which has traditionally been a thermal short in many applications. The panel preferably has one or more... Agent: Douglas T. Johnson Miller & Martin

20090114442 - Camera link booster cable assembly: A camera link cable assembly transmits signals from a digital camera to a frame grabber. The cable assembly has a significantly longer length than that provided by camera link cables of the prior art. A signal conditioning device is an integral part of the cable. The signal conditioning device extends... Agent: Thompson Coburn LLP

20090114415 - flat cable: A flat cable of the invention in which at least end portions of a plurality of coaxial cables are securely arranged in parallel on a sheet is characterized in that the sheet is made to remain in a band shape across an entire width of the flat cable, at a... Agent: Collen Ip

20090114414 - Multi-stabilized nbti composite superconducting wire: A light-weight, aluminum core, multi-stabilized, superconducting wire having improved electrical and mechanical properties. The superconducting wire has NbTi superconducting filaments embedded in a normal stablilizing copper metal matrix that encapsulates an aluminum central core.... Agent: Hodgson Russ LLP The Guaranty Building

20090114416 - Flexible insulated wires for use in high temperatures and methods of manufacturing: Flexible insulated wires for use in a high temperature environment are provided. In an embodiment, the wire includes a conductor and a coating over the conductor. The coating is formulated from a dielectric material and an organic binder having an organic component, wherein the organic component has been substantially decomposed... Agent: Honeywell International Inc.

20090114417 - Radiation-resistant non-halogen flame-retardant resin composition as well as electric wire and cable using same: An electric wire and cable according to the present invention comprises a sheath made of a radiation-resistant non-halogen flame-retardant resin composition in which the radiation-resistant non-halogen flame-retardant resin composition includes one to 30 parts by weight of aromatic amine antioxidant with a melting point of 40° C. or higher and... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090114418 - Wire with convertible outer jacket and method thereof: A multi-jacket electrical cable that includes an inner insulation jacket wrapped around or extruded onto one or more electrical conductors and an outer insulation jacket that is wrapped around or extruded onto the inner jacket and is removable therefrom. Each jacket includes a different characteristic such as color, texture of... Agent: Christopher & Weisberg, P.A.

20090114419 - Gap-type overhead transmission line and manufacturing method thereof: A gap-type overhead transmission line includes a steel core member; a conductor layer positioned to surround the steel core member and having at least one strand wire aggregated therein; and a coating layer interposed in a solid state between the steel core member and the conductor layer so as to... Agent: Jones Day

20090114420 - Electrical conductor and core for an electrical conductor: A core for an electrical conductor. The core includes an inner core component, an intermediate cladding component and an outer cladding component. The inner core component comprises a plurality of glass based stranded members in a first resin matrix. The intermediate cladding component surrounds the inner core component and comprises... Agent: The Watson Intellectual Property Group, PLC

20090114421 - Electrical component, manufacturing system and method: Disclosed herein is an electrical component comprising a segment having a diameter in the range of about 1 micrometers to about 10 cm, the segment comprising a plurality of non-metallic, resistive fibers in a non-metallic binder. The segment is precisely trimmed to impart to the segment an electrical resistance within... Agent: Alix, Yale & Ristas, LLP

20090114422 - Heizbares seil: A cable, which is especially suitable as a suspension cable for cable railways, is described. The cable comprises a core (31) and several outer strands that surround the core and consist, for example, of several wires (32.1 . . . 32.6, 34.1 . . . 34.12). The cable is characterized... Agent: Birch Stewart Kolasch & Birch

20090114423 - Electrical cable and manufacturing method thereof: An electrical transposed conductor is specified, which comprises two stacks (8, 9), which are located alongside one another, each comprising a plurality of flat electrical conductor elements (7) which are arranged one above the other, are isolated from one another and have a rectangular cross section. Over the entire length... Agent: Sofer & Haroun LLP.

20090114424 - Coaxial cable connector with internal pressure seal: A coaxial cable connection incorporating F-Type connectors and including a male connector for connecting an RG-6 or smaller coaxial cable incorporates an internal element for preventing moisture ingress and/or preventing loosening of a male connector from a female connector.... Agent: Chancellor Ip

20090114425 - Conductive paste and printed circuit board using the same: A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste.... Agent: Mcdermott Will & Emery LLP

20090114426 - Wired circuit board: A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.... Agent: Akerman Senterfitt

20090114427 - Circuit joining assembly materials for multi-layer lightning protection systems on composite aircraft: An exemplary embodiment provides a multi-layer circuit joining assembly material configured to repair multi-layer flex circuits deployed on or in a composite surface as a lightning protection system. The multi-layer circuit joining assembly material includes a first conductive layer having a first end portion, a second conductive layer having a... Agent: Hugh P. Gortler

20090114428 - Printed wiring board: A printed wiring board which is sufficiently prevented from being damaged at the time of heating is provided. This printed wiring board comprises a flexible board having flexibility, a lamination portion which is formed on at least one surface of the flexible board and includes an insulation layer and a... Agent: Birch Stewart Kolasch & Birch

20090114429 - Packaging substrate having pattern-matched metal layers: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal... Agent: Scully, Scott, Murphy & Presser, P.C.

20090114431 - Circuit board and manufacturing method thereof: A circuit board and method of manufacturing a circuit board. The circuit board includes a substrate, a conductor layer formed on the substrate, and an insulation layer formed on the substrate and the conductor layer, the insulating layer having an opening with an undercut therein, the opening reaching the conductor... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090114430 - Method for patterning of conductive polymer: Disclosed herein is a method of patterning a circuit using a self-assembly lithography. More specifically, the present invention is directed to a method of a circuit by a self-assembly lithography, which comprises the steps of: coating a substrate; forming the primary circuit; completing the patterning; and washing the substrate, a... Agent: Lowe Hauptman Ham & Berner, LLP

20090114432 - Laminate for printed wiring board, printed wiring board using same, method for manufacturing printed wiring board, electrical component, electronic component, and electrical device: Disclosed is a laminate comprising, on a support: an insulating resin composition layer configured to produce a reactive active species when provided with energy; and a reactive polymer precursor layer containing a compound configured to react with the insulating resin composition layer and form a polymer compound.... Agent: Sughrue Mion, PLLC

20090114434 - Method of manufacturing non-shrinkage ceramic substrate and non-shrinkage ceramic substrate using the same: There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least... Agent: Mcdermott Will & Emery LLP

20090114433 - Multi-layered ceramic board and method of manufacturing the same: There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with... Agent: Mcdermott Will & Emery LLP

20090114435 - Electronic device and method of manufacturing same: A method of manufacturing an electronic device includes: roughening an underside surface of a film made of a resin, opposite to a mounting surface of the film for mounting a circuit chip; forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the... Agent: Greer, Burns & Crain

20090114436 - Substrate structure: A substrate structure is provided. A plurality of solder pads is positioned on a substrate. A solder mask covers the substrate and has a plurality of openings to respectively expose portions of the solder pads, wherein the openings have the shape of a polygon of at least five sides.... Agent: Lowe Hauptman Ham & Berner, LLP

20090114437 - Shielding device: A shielding device configured to provide EMI and ESD protection includes an anti-ESD layer, a conductive layer, and an EMI blocking layer attached to each other in sequence. In addition, a supporting layer can be optionally attached to the EMI blocking layer to increase the strength of the shielding device.... Agent: North America Intellectual Property Corporation

20090114438 - Fabric-over-foam emi gaskets having transverse slits and related methods: According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region... Agent: Harness, Dickey, & Pierce, P.l.c

20090114439 - Connector housing for a small and portable transmitting-receiving module: A connector housing for a small and portable transmitting-receiving module includes an upper housing and a lower housing. The upper housing has a top board, two side walls and a rear cover. The lower edge of the two side walls has a first wedging plate, first convex blocks, and first... Agent: Rosenberg, Klein & Lee

20090114440 - Conductive magnetic filler, resin composition containing the filler, electromagnetic interference suppressing sheet using the resin composition and applications thereof, and process for producing the electromagnetic interference suppressing sheet: There are provided a soft magnetic material in the form of particles for suppressing occurrence of electromagnetic interference which is capable of exhibiting the suppressing effect in a broad frequency range from a low frequency band to a high frequency band, as well as an electromagnetic interference suppressing sheet using... Agent: Nixon & Vanderhye, PC

20090114441 - Electronic component: An electronic component includes: a first substrate; a second substrate; a sealing member surrounding a sealing space formed between the first substrate and the second substrate; and a functional element at least a part of which is disposed in the sealing space. In the electronic component, the sealing member includes... Agent: Harness, Dickey & Pierce, P.L.C