|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators April category listing, related patent applications 04/09Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 04/30/2009 > patent applications in patent subcategories. category listing, related patent applications
20090107692 - Micro-electro-mechanical-system package and method for manufacturing the same: According to an aspect of the present invention, there is provided a method for manufacturing a MEMS package, the method including: forming a MEMS device on a substrate; forming a sacrificing member on the MEMS device; forming a cavity formation film on the sacrificing member; forming a through hole in... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090107693 - Electrical apparatus having quick connect components: Methods and apparatuses for power distribution improve and can standardize electrical connections between electrical cables and the multitude of electrical switches, receptacles, and fixtures of known technology. The invention can include modular hardware components such as junction boxes, electrical devices, adaptors, a/b switches, etc. that simplify both installation and inspection... Agent: Fulbright & Jaworski, LLP
20090107719 - Pushable cable: A cable assembly may be provided. The cable assembly may comprise a conductor core and a binding element. The binding elements may be configured helically around the conductor core. In addition, the binding element may be configured to, when the cable assembly is pushed through a conduit having at least... Agent: Merchant & Gould Southwire
20090107720 - Cable device: A cable device wherein a signal-carrying cable is disposed within a flexible towing sleeve. The towing sleeve is made of a flexible, elongated sheet of abrasion-resistant material, into which is arranged a plurality of longitudinal, parallel pockets or sleeves. One or more elongated strain elements are arranged in the pockets... Agent: Christian D. Abel
20090107721 - Partial direct wire attach: A cable assembly including a cable, a ferrule, and a stringer. The cable includes a center conductor; a dielectric disposed around the center conductor; and a shield disposed around the dielectric. The ferrule is electrically connected to the shield and disposed around a portion of the dielectric exposed by the... Agent: Marger Johnson & Mccollom, P.C.
20090107694 - Shielded conductor for vehicle: A shield conductor has a metal pipe and wires accommodated in the metal pipe. The metal pipe is stainless steel, and the stainless steel pipe is provided with a resin layer containing a magnetic material.... Agent: Oliff & Berridge, PLC
20090107695 - Cable structure: A cable providing noise rejection in a wide frequency range. A cable has an inner section, an outer section and a jacket. The inner section may contain one or more core conductors that are surrounded by a common insulation, which is surrounded by a shield. The outer section contains one... Agent: Trojan Law Offices
20090107696 - Cable pathway system: A cable pathway system has a base with a bottom, a generally planar top surface, a first side, and a second side. The base is configured to be secured to an electronic equipment enclosure and also has an aperture formed therein and a wall positioned adjacent to the aperture. The... Agent: Panduit Corp.
20090107697 - Card insulator with provision for conformance to component height changes: A card insulator is formed with slits that conform to height changes required by the components mounted to a card. The insulative sheet has simple linear slits that extend completely through the sheet and allow the insulator to deform with simple linear bends when contacted by the tall components mounted... Agent: Bracewell & Giuliani LLP
20090107698 - Electric arc isolation structure for transformers: The present invention discloses an electric arc isolation structure for isolating an electric arc produced by an arc discharge at a transformer, and the transformer includes a primary side input electrode terminal and a secondary side high-voltage output terminal. The exterior of the transformer is covered by an insulating sheath,... Agent: Joe Mckinney Muncy
20090107699 - Method of manufacturing printed circuit board and printed circuit board manufactured by the same: A printed circuit board (PCB) and appertaining method of manufacturing are provided. The method includes: coating a metal layer on the entire surface of a substrate having an outer surface on which an interconnection pattern is formed; partially removing the metal layer from the surface of the substrate to form... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.
20090107700 - Printed board: A printed wiring board includes a substrate member, terminals and wiring pattern. The terminals are formed in a specific shape on the substrate member and arranged to be aligned in a specific arrangement direction on the substrate member. The wiring pattern is formed on the opposite side across the substrate... Agent: Pearne & Gordon LLP
20090107701 - Printed circuit board having adhesive layer and semiconductor package using the same: A PCB having an adhesive layer and a semiconductor package using the same. The PCB includes a body substrate, a solder resist layer including an open portion that exposes a portion of the body substrate, and an adhesive layer formed on the body substrate in the open portion. The adhesive... Agent: Marger Johnson & Mccollom, P.C.
20090107704 - Composite substrate: A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.... Agent: Knobbe Martens Olson & Bear LLP
20090107702 - Printed interconnection board and method of manufacturing the same: A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090107703 - Wiring board, packaging board and electronic device: To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers (11, 13) and wiring... Agent: Sughrue Mion, PLLC
20090107705 - Methods and systems for reducing noise coupling in high speed digital systems: Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the... Agent: Cantor Colburn LLP - IBM Research Triangle Park
20090107706 - Multilayer printed circuit board: A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit... Agent: PCe Industry, Inc. Att. Steven Reiss
20090107707 - Conductive paste and wiring board using it: A conductive paste is mainly composed of a metal powder, a glass frit, and an organic vehicle. The total content amount of the metal powder and glass frit with respect to the entire conductive paste is 85 wt % or more. The viscosity at a rotational speed of 1 rpm... Agent: Mcdermott Will & Emery LLP
20090107708 - Electronic parts substrate and method for manufacturing the same: An electronic parts substrate includes a base substrate, a plurality of insulating resin layers provided on the base substrate, at least one conductive circuit, and at least one filled via provided in the plurality of insulating resin layers. The at least one conductive circuit is sandwiched between the plurality of... Agent: Ditthavong Mori & Steiner, P.C.
20090107709 - Printed circuit board and manufacturing method thereof: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board may include: an insulation layer, a circuit pattern formed on an upper surface and a lower surface of the insulation layer, and a bump penetrating the insulation layer such that the... Agent: Staas & Halsey LLP
20090107710 - Differential trace profile for printed circult boards: Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity... Agent: James E. Harris
20090107711 - Plating apparatus, plating method and multilayer printed circuit board: A multilayer printed circuit board has an insulation layer, a first conductor layer provided over a first side of the insulation layer, a second conductor layer provided over a second side of the insulation layer opposite to the first side, and multiple filled vias electrically connecting the first conductor layer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090107714 - Electronic component module and circuit board thereof: An electronic component module, including: a circuit board having: an insulating layer; a plurality of conductive layers formed on respective surfaces of the insulating layer; a ground plane comprising one of the conductive layers and covering the greater part of the surface; and wiring formed on another of the surfaces... Agent: Arent Fox LLP
20090107712 - Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations: A hardware protection system for sensitive electronic-data modules protects against external manipulations. As a result, the sensor has a correspondingly adapted layout.... Agent: Staas & Halsey LLP
20090107713 - Surface coating: A composite is provided, comprising a substrate and a film on the substrate. The film has an RMS surface roughness of 25 nm to 500 nm, a film coverage of 25% to 60%, a surface energy of less than70 dyne/cm; and a durability of 10 to 5000 microNewtons. Depending on... Agent: Townsend And Townsend And Crew, LLP
20090107715 - Wiring board with a built-in component and method for manufacturing the same: Provided is a wiring board with a built-in component, which has an electric/electronic component (16) embedded in an insulating substrate (11). A method for manufacturing such wiring board is also provided. Manufacture burden is reduced and reliability is improved by such wiring board and the method. The wiring board is... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090107717 - Electrically conductive structure of circuit board and circuit board using the same: An electrically conductive structure includes a first conductive structure and a second conductive structure. Each has a conducting section at one end and a coupling section at the other end. The first and second conducting sections are electrically connected to a power and ground contact of an electronic device, respectively.... Agent: Rabin & Berdo, PC
20090107716 - Printed circuit board: A printed circuit board (PCB) includes a differential pair having a first differential trace and a second differential trace, a first via having an upper cap and a lower cap, and a second via having an upper cap and a lower cap. The first differential trace includes a first segment... Agent: PCe Industry, Inc. Att. Steven Reiss
20090107718 - Cable pathway system: A cable pathway system has a base with a bottom, a generally planar top surface, a first side, and a second side. The base is configured to be secured to an electronic equipment enclosure and also has an aperture formed therein and a wall positioned adjacent to the aperture. The... Agent: Panduit Corp.04/23/2009 > patent applications in patent subcategories. category listing, related patent applications
20090101382 - Sealed expansion module: Improved Sealed Expansion Module is an enclosure for housing electronics, such as circuit boards, POTS/VDSL cables having connectors, a fiber cable having a connector and a power cable having a connector. The preferred embodiment of Improved Sealed Expansion Module is comprised of at least some of the following: an enclosure... Agent: Galasso & Associates, Lp
20090101383 - Micromechanical device and method of manufacturing micromechanical device: A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090101384 - Waterproof structure and electronic equipment: With a waterproof structure for the space between a first case and a diaphragm doubling as a display panel provided facing the first case, a first resilient member is integrally formed at a surface of the diaphragm facing the first case, and the first resilient member is press-fitted into a... Agent: Cohen, Pontani, Lieberman & Pavane LLP
20090101385 - Epoxy sealed relay: A relay assembly is provided that includes an intermediate member to aid in coupling a wire to a housing.... Agent: Helen Odar Wolstoncroft Tyco Technology Resources
20090101386 - Size unconstrained faceplate display for use with infrastructure device: The present invention is directed to a system and method which allows a display to have a dimension significantly greater than the actual dimension of the matching utility box or traditional utility box device faceplate. Thus, by making the size of the faceplate independent from the size of the matching... Agent: Optimal Technologies, Inc.
20090101405 - Electrical-wire support apparatus: An electrical-wire support structure (30) is disposed at a rotary connection portion of a device and connects first and second portions (11, 12) of the device. The second portion being rotatable about at least two rotational axes. The electrical-wire support structure includes frame members having a through-hole (36, 43) through... Agent: Molex Incorporated
20090101406 - Electrical junction assembly for wiring harness: An electrical junction assembly for a wiring harness (10) couples one or more branch wires (18) to a main trunk line (12). The junction assembly includes a housing (16) having an internal cavity into which is received first (34) and second (36) trunk terminals which interlock with one another and... Agent: Dickinson Wright PLLC
20090101407 - Harness routing structure for link: A harness routing structure includes: a supporting portion; a link pivotally supported by the supporting portion; and a harness protector provided on the supporting portion. The harness protector includes a harness guide portion for guiding to lead a wire harness thereto, a harness guide path, successive to the harness guide... Agent: Sughrue-265550
20090101408 - Ultrafine-coaxial-wire harness, connecting method thereof, circuit-board-connected body, circuit-board module, and electronic apparatus: The invention offers an ultrafine-coaxial-wire harness that enables connectorless connection to a substrate in a narrow space while maintaining the reliability and speediness of the operation. A multicore ultrafine coaxial wire 10 is formed by consolidating a plurality of ultrafine coaxial wires 11 in a flat array. Each of the... Agent: Mcdermott Will & Emery LLP
20090101409 - Modular electrical distribution system for a building: A universal power distribution system is provided for routing electrical circuits within a building structure to comprehensively provide electrical power to the building in ceiling configurations, wall-mounted configurations, raised floor configurations and in office furniture configurations. The system components for all of these configurations have common plug connectors that are... Agent: Flynn, Thiel, Boutell & Tanis, P.C.
20090101387 - Anti-microbial/anti-fungal plastic jacketed/insulated electric power cords: Multiple conductor electrical power cords, signal transmitting wiring and cable is insulated with one or more layers or sheathing of a thermoplastic polymer composition with at least the outer layer of the composition containing contaminant resistant or combating agents that inhibit growth of biological contamination. The microbial resistant cord or... Agent: Merchant & Gould Southwire
20090101388 - Flat cable assembly for use in power supply apparatus: A flat cable assembly includes a plurality of power cables and a bonding medium. The plurality of power cables are parallel with each other, wherein every two adjacent power cables are separated from each other. The bonding medium is used for boding every two adjacent power cables together, thereby cooperatively... Agent: Kirton And Mcconkie
20090101389 - Cable-clamping device: A cable-clamping device, including a base having a through seat for accommodating electrical cables, for example electrical power cables of a household appliance; and a clamping element progressively insertable in the seat in a transversal direction with respect to the same defined in use by an axis (A) laying on... Agent: Lowe, Hauptman, Ham & Berner, LLP (itw)
20090101391 - Circuit board having barcode and fabrication method thereof: A circuit board having barcode and fabrication method thereof are disclosed. The method of the present invention includes the steps of providing a substrate body that has an insulation layer covered with a copper foil; forming a dry film on the copper foil; disposing a film having a circuit pattern... Agent: Edwards Angell Palmer & Dodge LLP
20090101390 - Electronic control unit and process of producing the same: An electronic control unit includes a printed wiring board (50), electronic components (51 to 53) mounted on the printed wiring board (50), and a synthetic resin coating (57) formed by injection molding to cover the printed wiring board (50) and the electronic component (51 to 53). The electronic components (51... Agent: Arent Fox LLP
20090101392 - Circuit board and semiconductor module using this, production method for circuit board: An object of this invention is to get a circuit board and a semiconductor module with high endurance against thermal cycles, and which is hard to be broken under thermal cycles, even if thick metal circuit board and thick metal heat sink are used, corresponding to high power operation of... Agent: Akerman Senterfitt
20090101393 - Metallic laminate and method for preparing the same: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.... Agent: Mckenna Long & Aldridge
20090101395 - Printed wiring board and electronic apparatus: A printed wiring board includes: a component mounting region; a plurality of electrode pads arranged at a peripheral edge portion of the component mounting region; a solder resist film that coats the component mounting region; and a plurality of solder bonding faces arranged at a region surrounded by the plurality... Agent: Knobbe Martens Olson & Bear LLP
20090101396 - Electronic device: An electronic device is provided. The electronic device includes: a circuit board having a surface on which a hollow is formed; an electronic component placed into the hollow; a pattern wiring which is formed on a bottom surface of the hollow and whose tip is provided at a position corresponding... Agent: Jianq Chyun Intellectual Property Office
20090101398 - Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component: In a method for fixing an electronic component (3) on a printed circuit board (2), and contact-connecting the electronic component (3) to the printed circuit board (2), the following steps are provided: —providing the printed circuit board (2) having a plurality of contact and connection pads (8), —providing the electronic... Agent: Jacobson Holman PLLC
20090101400 - Method for manufacturing component-embedded substrate and component-embedded substrate: A component-embedded substrate includes a component embedded in an uncured resin layer of a second layer. After curing the resin layer, a hole passing through the second layer in the vertical direction is formed. The hole is filled with an electroconductive paste to form a second interlayer connection conductor. A... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP
20090101397 - Printed circuit board having improved solder pad layout: A printed circuit board (100) includes a plurality of through-holes (140) defined therein, a plurality of first solder pads (110) defined to surround the through-holes respectively, and a second solder pad (190). Each of the first solder pads includes a first soldering zone (112) for accommodating solder used in a... Agent: PCe Industry, Inc. Att. Steven Reiss
20090101399 - Suspension board with circuit: A suspension board with circuit includes a slider mounting portion provided with three pedestals arranged in mutually spaced apart relation for supporting a slider on which a magnetic head is mounted.... Agent: Akerman Senterfitt
20090101401 - Wiring board: A thickness of the portion, which is placed between an electronic component mounting pad and a first wiring, of a first insulating layer (insulating layer in which electronic component mounting pads are placed) is set to be smaller than a thickness of the portion, which is placed between the first... Agent: Drinker Biddle & Reath (dc)
20090101402 - Circuit board, and electronic device: A circuit board having a plurality of wiring layers is provided that includes interlayer signal wires that provide an electrical connection between circuit patterns disposed on different wiring layers and ground planes formed in a manner to surround the interlayer signal wire on at least a part of the wiring... Agent: Jianq Chyun Intellectual Property Office
20090101403 - Electromagnetic shield for mobile communication device: An electromagnetic shield is configured for blocking electromagnetic waves in a mobile communication device. The electromagnetic shield includes an organic glass layer and an indium tin oxide layer. The organic glass layer is configured for providing main body of the electromagnetic shield. The indium tin oxide layer is plated on... Agent: PCe Industry, Inc. Att. Steven Reiss
20090101404 - Cable management apparatuses and systems: Several one-piece unitary easily manufactured and economical products that both facilitate the routing of cable and the storage of extra lengths of cable are provided wherein a cable management apparatus includes a centrally disposed first cable confinement portion mountable to a surface, a second cable confinement portion extending from a... Agent: Amin, Turocy & Calvin, LLP04/16/2009 > patent applications in patent subcategories. category listing, related patent applications
20090095522 - Robotic bypass system and method: A system and method, and robotic equipment for mechanical and/or electrical bypassing of short sections of energized high voltage line conductors by gripping the conductor at two close-by points, making good electrical and mechanical connection, then drawing the two points towards one another so as to relieve both mechanical and... Agent: Mirick, O'connell, Demallie & Lougee, LLP
20090095500 - Tamper resistant locking cap for utility poles and method: A locking cap for a utility pole is provided to safeguard the metal wiring therein. The locking cap prevents access to the metal wiring through the access opening in the utility pole. The locking cap has a base that detachably mounts with one or more fasteners to a utility pole... Agent: Weiss & Moy PC
20090095525 - Distributive conductor: A distributive conductor electromagnetically shields and protects an insulated wire 10 by inserting it into a pipe 20. Heat generated in the insulated wire 10 is absorbed into a low heat-reflective layer 21 of lower heat reflectivity, transferred to the pipe 20, and then dissipated from an outer circumferential wall... Agent: Oliff & Berridge, PLC
20090095501 - Noise-controllable high voltage electric wire: A noise-controllable high voltage electric wire, by which an electromagnetic wave noise can be effectively removed despite that the high voltage electric wire is a thick wire, is provided. The noise-controllable high voltage electric wire that is a pair of thick high voltage electric wires, through which a large current... Agent: Edwards Angell Palmer & Dodge LLP
20090095503 - Composite conductive film and semiconductor package using such film: A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low... Agent: Rabin & Berdo, PC
20090095502 - Multilayer pillar for reduced stress interconnect and method of making same: A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high ductility deformation region configured to absorb force imposed during chip assembly and thermal excursions... Agent: Greenblum & Bernstein, P.L.C
20090095504 - Clamp member and clamping method: A clamp member includes a first member of a substantially L-shaped cross section having at the front end thereof a tongue section and formed to project from the main surface of the clamp member and a second member having at the front end thereof bent sections of a substantially L-shaped... Agent: Patterson & Sheridan, L.L.P.
20090095505 - Powerfeeder spacer: A powerfeeder spacer includes a spacer hub, a neutral cable opening having an interior cable opening wall extending through the spacer hub, a plurality of spaced-apart spacer fingers extending from the spacer hub and a plurality of spaced-apart power cable notches each having a generally curved notch wall between the... Agent: Tung & Associates
20090095506 - Integrated insulator seal and shield assemblies: An integrated insulator sealing and shielding assembly includes a rubber housing having a plurality of radial weathersheds and a tapered end adjacent an endmost radial weathershed. A metal fitting is disposed adjacent to the endmost radial weathershed and receives the tapered end. A collar assembly is disposed at an upper... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.
20090095509 - Core substrate and method of producing the same: In the core substrate, short circuit between an electrically conductive core section and a plated through-hole section can be securely prevented and cables can be formed in a high dense state. The core substrate comprises: the electrically conductive core section having a pilot hole, through which the plated through-hole section... Agent: Staas & Halsey LLP
20090095507 - Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits: The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and to processes and methods for fabricating integrated circuits, and more particularly to the formation of networks of metal interconnects, and also... Agent: Alston & Bird LLP
20090095508 - Printed circuit board and method for manufacturing the same: A printed circuit board and a method for manufacturing the same are disclosed. The manufacturing method includes: forming a first plating resist corresponding to the circuit pattern on a surface of each of a first carrier and a second carrier; forming a second plating resist corresponding to the pad on... Agent: Staas & Halsey LLP
20090095510 - Electronic device, electronic module, and methods for manufacturing the same: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the... Agent: Oliff & Berridge, PLC
20090095511 - Circuit board and method of producing the same: The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor... Agent: Staas & Halsey LLP
20090095512 - Method for producing a glass plate with a conductive printed wire and glass plate with a conductive printed wire: The process for producing a glass plate with a conductive printed wire is characterized in that a laminate comprising a layer obtained by electro printing a first conductive toner having a number standard average particle size (D50) of 10 μm<D50≦50 μm and a layer obtained by electro printing a second... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090095513 - Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate: A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base... Agent: Masao Yoshimura, Chen Yoshimura LLP
20090095515 - Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil: An object of the present invention is to provide an electro-deposited copper foil having the equivalent low-profile surface as in a conventional low-profile electro-deposited copper foil and extremely large mechanical strength and a method for manufacturing the same. To achieve the object, the electro-deposited copper foil is formed by depositing... Agent: Greenblum & Bernstein, P.L.C
20090095514 - Wiring board, semiconductor apparatus and method of manufacturing them: There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the... Agent: Drinker Biddle & Reath (dc)
20090095516 - Double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board and wiring circuit board: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer as a main component, in which the double-sided pressure-sensitive adhesive tape or sheet has an amount of... Agent: Sughrue-265550
20090095517 - Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion... Agent: Sughrue-265550
20090095518 - Wiring board and method of manufacturing the same: A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode... Agent: Drinker Biddle & Reath (dc)
20090095519 - Current distribution structure and method: An electrical structure and method of forming. The electrical structure comprises an interconnect structure and a substrate. The substrate comprises an electrically conductive pad and a plurality of wire traces electrically connected to the electrically conductive pad. The electrically conductive pad is electrically and mechanically connected to the interconnect structure.... Agent: Schmeiser, Olsen & Watts
20090095521 - Circuit board and method of manufacturing the same: A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a core portion by thermal compression bonding... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090095520 - Wiring substrate and method of manufacturing the same: There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the first and second surfaces via the insulating layer;... Agent: Rankin, Hill & Clark LLP
20090095523 - Housings for electronic components: Housings for electrical or electronic components made using braid or woven fabric sheets having multiple sections treated with different materials as well as processes and materials for making such housings are disclosed.... Agent: Honeywell International Inc.
20090095524 - Core substrate and method of producing the same: The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of... Agent: Staas & Halsey LLP04/09/2009 > patent applications in patent subcategories. category listing, related patent applications
20090090532 - Housing structure: A housing structure includes an upper housing, a lower housing, a first waterproof member and a second waterproof member. The upper housing has a first connecting portion, and the lower housing has a second connecting portion. The upper housing and the lower housing are connected to each other by the... Agent: Quintero Law Office, PC
20090090531 - Micromechanical component having a cap having a closure: A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening.... Agent: Kenyon & Kenyon LLP
20090090552 - Electric cable that withstands electric arc propagation: An electric cable includes an electrical conductor surrounded by a first layer of mica tape made up of mica particles deposited by means of a polymer binder on a backing, a second layer of a polyimide tape, and a third layer of a polytetrafluoroethylene tape, where the first layer is... Agent: Sofer & Haroun LLP.
20090090551 - Modular multi-channel snake connector: A snake electrical connector comprising a central snake cable having a plurality of conductors terminating at a base connector at each end of the snake cable. Each of the base connectors has a respective plurality of individual electrical contacts corresponding to each conductor. A fan-out is provided at each end... Agent: Alix Yale & Ristas LLP
20090090533 - Horizontal cable manager: Embodiments of the invention provide a horizontal cable manager. A horizontal base can include a first molded section and an identical second molded section adapted to be coupled together. The horizontal cable manager can include a plurality of fingers extending from each one of the first molded section and the... Agent: Greenberg Traurig (phx)
20090090534 - Cable management patch panel system with vertical ducting: A cable management patch panel system having one or more vertical ducting enclosures and typically located in an equipment rack. The vertical ducting enclosure is integral with the patch panel system and allows for vertical routing of cables connected to the patch panel system. The cables are vertically routed by... Agent: Davis Wright Tremaine LLP/leviton
20090090535 - Flame retardant electrical and construction parts: This specification discloses the use of a polypropylene, rubber (thermoplastic elastomer) and non-halogenated flame retardant in recyclable construction boards, computer housings, and electrical connectors and wire cables. Also disclosed is the use of fillers to unexpectedly increase the break strength, thus making this material a cheaper non-halogenated substitute for computer... Agent: Edwin A. Sisson , Attorney At Law , LLC
20090090536 - Flame retardant composition for cable covering material and ocean cable using the same: Disclosed are a flame retardant composition for a cable covering material and an ocean cable using the same. The flame retardant composition of the present invention includes 100 parts by weight of a base resin; 30˜150 parts by weight of a flame retardant; 1-30 parts by weight of a cold... Agent: Stroock & Stroock & Lavan LLP
20090090537 - Aesthetic and safe electrical extension cord to floors: An electrical extension cords that has a format that prevents slips from who passes upon it and is able to adhere in diverse kinds of floor, smooth or upholstered, through a set of suction cups and Velcro tapes, avoiding to disturb the circulation of people where it is installed. Composed... Agent: Vinicius Jose Gomes Nunes
20090090539 - Harness protector structure for link: A harness protector structure for a link is provided, by which the durability of a bent part of a wiring harness is improved and interference with the outside is prevented when the wiring harness is rotated and bent by using a link. The harness protector structure includes: a support part;... Agent: Edwards Angell Palmer & Dodge LLP
20090090538 - Vertical cable manager: Embodiments of the invention provide a vertical cable manager for routing cables or wires. The vertical cable manager includes a vertical trough with sets of fingers. The fingers include arrow-shaped ends, which allow installation and/or removal of cables and wires, while retaining the cables and wires in cable rings. In... Agent: Greenberg Traurig (phx)
20090090540 - Hole in pad thermal management: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces... Agent: Honeywell International Inc.
20090090541 - Stacked semiconductor device and fabricating method thereof: Provided is a stacked semiconductor device including a first flexible layer and a second flexible layer combined together, serving as a flexible substrate body being bent somewhere such that a surface of the first flexible layer itself is face-to-face clipped, two semiconductor chips each embedded in the flexible substrate body,... Agent: Schmeiser Olsen & Watts
20090090542 - Multilayer printed wiring board: An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insulation layer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090090543 - Circuit board, semiconductor device, and method of manufacturing semiconductor device: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20090090545 - Electroconductive particle placement sheet and anisotropic electroconductive film: This invention provides an electroconductive particle placement sheet comprising electroconductive particles and an insulating resin sheet. The thickness of the insulating resin sheet is smaller than the average particle diameter of the electroconductive particles. Electroconductive particles are protruded from the reference plane (P1) on at least one side of the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090090547 - Multilayer printed wiring board: A multilayer printed wiring board 10 includes: a build-up layer that is formed on a core substrate 20 and has a conductor pattern disposed on an upper surface; a low elastic modulus layer 40 that is formed on the build-up layer 30; lands 52 that are disposed on an upper... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090090546 - Substrate for ac/ac multiple-phase power converter: A substrate includes a plurality of input ends, a plurality of output ends, first and second direct-current power lines, a first region and a second region. An alternating voltage is applied between any two of the input ends. The first region permits mounting of any one of a plurality of... Agent: GlobalIPCounselors, LLP
20090090544 - System and method for substrate with interconnects and sealing surface: A method includes providing a base. At least one lead is deposited on the base, the at least one lead including a trace of electrically conductive material having a first end and a second end. A dielectric layer is deposited on a portion of the at least one lead between... Agent: Baker Botts L.L.P.
20090090548 - Circuit board and fabrication method thereof: A circuit board is disclosed, including a core board, wherein at least one surface thereof has a core circuit layer with a plurality of conductive lands; a first dielectric layer disposed on the core board and disposed with a plurality of openings for exposing the conductive lands; a first coupling... Agent: Schmeiser Olsen & Watts
20090090549 - Under-floor cable support system: An under-floor cable support system comprising a first plurality of free-standing cable stands positioned on a sub-floor and movable independent of the floor-supporting pedestals. Each cable stand comprises a cross bar on a pair of spaced apart legs for supporting a cable tray at an elevation above the sub-floor and... Agent: Senniger Powers LLP (bln)
20090090550 - Cable management apparatus: A cable management apparatus for housing and organizing cables includes a stationary member having a set of ribs bridged by at least one spine and forming a first side wall, a second side wall, and a bottom wall. Further, the cable management apparatus also includes a first movable member having... Agent: Osha Liang L.L.P./sun04/02/2009 > patent applications in patent subcategories. category listing, related patent applications
20090084569 - Electrical systems, facilities, and methods with power pedestals having eufer grounding: Power pedestals are provided with an electrical ground connection to rebar encased in a foundation slab of a facility to thereby establish a EUFER ground for the power pedestal. Many pieces of rebar may be present within the foundation slab and may be interconnected to form a rebar network. In... Agent: At&t Legal Department - Wk Attn: Patent Docketing
20090084570 - Low profile photovoltaic (lppv) box: A low profile photovoltaic connection system for placement in space restricted areas. The connection system includes a connection box, diodes, and heat sinks inside of the connection box. The heat sink element is maintained in contact with the diode element such that the heat sink dissipates heat externally of the... Agent: Tyco Technology Resources
20090084571 - Method and apparatus for pre-fab wiring: A bracket and junction box assembly and method allows simplified wiring at a prefab production facility and at a construction site. A junction box including a detachable and reattachable rear cover plate is pre-assembled with a plaster ring, electrical device, and leads attached to the switch or outlet, at a... Agent: Averill & Varn
20090084573 - Device for protecting electrical apparatus and a group of parts including said device: Protection device for protecting at least one electrical apparatus which can be fixed to a wall by means of a supporting frame including a main body provided with at least one mounting window suitable to receive said electrical apparatus, characterized in that the protection device includes: a base part, removably... Agent: Seed Intellectual Property Law Group PLLC
20090084572 - Weatherproof connector: A weatherproof power inlet box and mating plug wherein the inlet box and mating plug are asymmetrical, positively latched and include more robust elements and a visual indicator of the status of the interconncct. Also included is a thermostat that trips to prevent overheating.... Agent: Jensen + Puntigam, P.s.
20090084603 - Cable protection and guide device: A general purpose mounting bracket of a specific length which can be easily mounted onto a cable protection and guide device. The cable protection and guide device includes a fine setting of the entire length can be made without increasing the number of parts. A bracket joint includes a coupling... Agent: Woodling, Krost And Rust
20090084574 - Poly(arylene ether) composition and its use in the fabrication of extruded articles and coated wire: An electron-beam cured poly(arylene ether) composition exhibits an excellent balance of flexibility, chemical resistance, and resistivity per unit volume. The chemical resistance of the composition is substantially improved by electron beam curing. The electron-beam cured poly(arylene ether) composition is useful for the fabrication of extruded articles, including insulation for automotive... Agent: Cantor Colburn LLP - Sabic (noryl)
20090084575 - Indicia-marked electrical cable: An electrical cable includes a sheath that envelops at least two internal conductors, and an indicia visible on the sheath is representative of the internal conductor.... Agent: Fish & Richardson P.C.
20090084576 - Twisted pairs cable with shielding arrangement: A multi-pair cable having a plurality of twisted conductor pairs and a shielding arrangement. The shielding arrangement including at least one shielding component. The shielding component including a length of tape encased by a dielectric material.... Agent: Merchant & Gould PC
20090084577 - Flame-retardant poly(arylene ether) composition and its use as a covering for coated wire: A flame retardant poly(arylene ether) composition is described. In addition to the poly(arylene ether), the composition includes a polyolefin component, and a flame retardant composition that includes a metal dialkyl phosphinate but excludes melamine phosphate, melamine pyrophosphate, and melamine polyphosphate. The polyolefin component can be a polyolefin polymer and/or the... Agent: Cantor Colburn LLP - Sabic (noryl)
20090084578 - Protector for wire harness: A resin-molded, annular protector for a wire harness for a vehicle includes a split pair of a main body and a lid body both having a semiannular shape, and split ends of the protector are joined and locked together. Lock holes are provided in a peripheral wall of the lid... Agent: Greenblum & Bernstein, P.L.C
20090084579 - Electrical power feed thru for aircraft fuselages: An electrical power feed thru for thin-walled vessels such as aircraft fuselages is disclosed which allows high electrical current power lines, and their associated high operating temperatures, to transition from the inside to the outside of the aircraft. The feed thru includes sealing surfaces, anti-rotation features and safety covers. This... Agent: Pietragallo Gordon Alfano Bosick & Raspanti, LLP
20090084580 - Grommet for cables: A cable grommet system for installation in data centers, offices and the like, for sealing cable openings in raised flooring, wall or ceiling panels, server cabinets, etc. to facilitate the installation and revision of wiring and cabling to server installations while minimizing losses of any provided conditioned air. A wide... Agent: Schweitzer Cornman Gross & Bondell LLP
20090084581 - Cable stand-off: The different embodiments of the cable stand-off serve as a thermally inslutative protector. In one embodiment, the cable stand-off includes an elongated member defining a lumen therethrough, and a plurality of fins extending from an outer surface of the elongated member, wherein the plurality of fins includes sets of fins,... Agent: Tyco Healthcare Group Lp
20090084582 - Printed circuit board having stepped conduction layer: A printed circuit board having a stepped conduction layer is disclosed. In one embodiment of the invention, a printed circuit board is provided in which at least one conduction layer configured for use as a signal transmission layer is divided into at least two base regions and at least one... Agent: Staas & Halsey LLP
20090084583 - Multilayer printed wiring board and method for fabrication thereof: Provided is a multilayer printed wiring board having a terminal portion of high quality. This multilayer printed wiring board has a flexible portion having flexibility, the flexible portion that can be bent when used, a rigid portion formed continuously with the flexible portion, the rigid portion having greater rigidity than... Agent: Birch Stewart Kolasch & Birch
20090084584 - Printed circuit board: A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked... Agent: Staas & Halsey LLP
20090084586 - Assembly comprising an electromagnetically screened smd component, method and use: The disclosure relates to an electronic component assembly including at least one SMD component (11) having a number of external surfaces (111) limited by edges (112) and at least two electrical terminals (113), an electromagnetic screen (12) for limiting the electromagnetic coupling to and from the SMD component or components,... Agent: Buchanan, Ingersoll & Rooney PC
20090084587 - Wiring board and method of preventing high voltage damage: A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern (3) including mounting pads (8, 10), on which an electronic device (5) is mounted, a second wiring pattern (21) having... Agent: Casella & Hespos
20090084585 - Wiring substrate and method of manufacturing the same: There is provided a wiring substrate. The wiring substrate includes: a wiring member formed by layering wiring layers and insulating layers; and a frame-like stiffening member having an opening therein. The wiring member is arranged in the opening, and an inner wall of the opening and an outer peripheral side... Agent: Rankin, Hill & Clark LLP
20090084588 - Circuit board, electronic device and method for manufacturing the same: A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090084589 - Lead terminal bonding method and printed circuit board: A lead terminal bonding method includes the steps of forming a land part on a front surface of a base substrate, the land part including a metal foil; forming a metal plating layer on a surface of the land part, the metal plating layer having a Young's modulus greater than... Agent: Cooper & Dunham, LLP
20090084590 - Circuit board: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is... Agent: Staas & Halsey LLP
20090084591 - Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor: A cavity capacitor fabrication method and a printed circuit board having an embedded cavity capacitor are disclosed. In accordance with an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor includes two conductive layers to be used as a power layer and a ground layer,... Agent: Staas & Halsey LLP
20090084594 - Heat resistant substrate incorporated circuit wiring board: This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090084593 - High-frequency circuit components: High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is... Agent: Klarquist Sparkman, LLP
20090084592 - Semiconductor device including wiring excellent in impedance matching, and method for designing the same: A semiconductor device includes an interposer, and a semiconductor chip mounted on the interposer. In a plan view, the interposer includes a first region overlapping the semiconductor chip, and a second region excluding the first region. The interposer includes at least one wiring formed astride the first region and the... Agent: Mcginn Intellectual Property Law Group, PLLC
20090084597 - Circuit board and connection substrate: There is provided a circuit board including a first and a second circuit substrate located with a spacing, on which a first and a second conductor pad are provided respectively; and a connection substrate including a first and a second conductor post projecting from one or the other side; the... Agent: Ditthavong Mori & Steiner, P.C.
20090084596 - Multi-layer board incorporating electronic component and method for producing the same: Both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain... Agent: K.a. Patents
20090084595 - Printed circuit board and manufacturing method of the same: A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier... Agent: Staas & Halsey LLP
20090084598 - Coreless substrate and method of manufacture thereof: Disclosed are a coreless substrate and a method of manufacturing the same. The coreless substrate includes a solder resist layer capable of being formed on each of on a first side and a second side of a metal panel. The solder resist layer includes at least one opening. A copper... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC C/o Intellevate, LLC
20090084599 - Nano inks for imparting emi shielding to windows: An EMI shielded display window for an electronic device is prepared by coating at least one surface of the window with an optically transparent shielding layer. The shielding layer is a coating or ink containing conductive nanoparticles applied to the window at a thickness of 10 microns or less. The... Agent: Rissman Jobse Hendricks & Oliverio, LLP
20090084600 - Nano coating for emi gaskets: EMI shielding gaskets prepared by coating a resilient nonconductive core gasket with a coating or ink containing conductive nanoparticles. The coating layer can be applied at a thickness of 10 microns or less to achieve shielding levels comparable to conventional coatings which are typically an order of magnitude thicker.... Agent: Rissman Jobse Hendricks & Oliverio, LLP
20090084602 - Automotive electric/electronic package: In an automotive electric/electronic package comprising an electronic component, a case for receiving the electronic component therein, and a lid covering an open top of the case, the case and the lid are joined together with a fluorochemical adhesive capable of chemically and/or physically adsorbing a corrosive gas. The package... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090084601 - Weatherproof chamber for a receptacle with gfi capability: An electrical receptacle includes an outlet that is protected from the environment in which the receptacle is used. The receptacle is designed for below grade use, such as in a tree well for providing tree lighting or other application in which a dry, clean environment is required. The plug end... Agent: Schneck & SchneckPrevious industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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