Electricity: conductors and insulators patents - Monitor Patents
FreshPatents.com Logo FreshPatents.com icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents



USPTO Class 174  |  Browse by Industry: Previous - Next | All     monitor keywords
03/2009 | Recent  |  13: Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn |  | 2008 | 2007 |

Electricity: conductors and insulators March listing by industry category 03/09

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
03/26/2009 > patent applications in patent subcategories. listing by industry category

20090078439 - Telecommunication wire with low dielectric constant insulator: A telecommunication wire having an electrical conductor is surrounded by an insulator. The insulator includes a main body made of a first polymeric insulator material. The main body defines a plurality of channels that run generally along a length of the electrical conductor. Each channel includes a first region and... Agent: Merchant & Gould PC

20090078440 - Flexible tubing with imbedded helical conductors and method of making: A smooth-bore plastic tubing with helical support bead is resistant to collapse and incorporates plural electrical conductors outside of the tubing bore and insulated from ambient, and from one another. The conductors may have a desired relatively high thermal conductivity to tidal air flow within the tubing, while also having... Agent: Terry L. Miller

20090078441 - Gasket sealing and installation process for door gasket on weatherproof outlet electrical box: The present invention is directed to a sealing member for establishing a water resistant seal between two elements which includes a resilient gasket having opposed gasket surfaces for engagement between the two elements; and a water resistant coating applied to the gasket. The water resistant coating providing releasable adhesive sealing... Agent: Hoffmann & Baron, LLP

20090078442 - Electrical junction box cover system for use near water: An electrical junction box cover system includes a waterproof dome-like covering lid allowing the system to be installed near water. The system also includes a manual power switch with a manual actuator installed on the outside of the covering lid and accessible to the user. The switch actuator has three... Agent: Bruzga & Associates

20090078443 - Ceiling fan mounting base: The disclosed inventions relate generally to electrical boxes that may be installed to a ceiling, and more particularly to electrical box ancillary devices, such as brackets, plates and struts, that permit the carrying of heavy ceiling appliances such as ceiling fans and lighting fixtures. Disclosed herein are structural plates and... Agent: Alan P. Halbert

20090078444 - Oversized electrical wall plate: A wall plate for securing an electrical outlet to a wall or other planar surface having channels that pass through recessed bores on an exterior surface and conduits for guiding the application of inserts for securing the electrical outlet to the wall or other planar surface.... Agent: Vedder Price P.C.

20090078445 - Snap-on-connector: Snap-on connectors (1) connect first electrodes (41) of circuits (40) comprising light emitting diodes (43) to first electrical elements (21) such as first wires having first element sizes and connect second electrodes (42) of the circuits (40) to second electrical elements (22) such as second wires having second element sizes... Agent: Philips Intellectual Property & Standards

20090078446 - Fire-resistant safety cable provided with a single insulating covering: The invention relates to a fire-resistant safety cable (10; 20; 30; 40; 50) comprising at least two electric conductors (2a, 2b), which are separated from each other by at least one space (5), a common insulating layer (3), which surrounds the electric conductors (2a, 2b), fills said space(s) (5) and... Agent: Harness, Dickey & Pierce, P.L.C

20090078447 - Cable, configuration with the cable, method of producing the cable, and apparatus for producing the cable: A cable (30) has a stranded wire (4) made from a plurality of individual conductors (5), and at least one connection area (6). In the connection area (6), the stranded wire (4) is fused to form a compacted block, the compacted block having at least one through opening (9).... Agent: Lerner Greenberg Stemer LLP

20090078448 - Electrical winding conductor with a rectangular cross section: An electrical winding conductor (1) with a rectangular cross section is specified in order to produce an electrical winding for electrical appliances which contain a liquid, which is used as a coolant and in which the winding is immersed in the in-use position. In order to improve the cooling, raised... Agent: Sofer & Haroun LLP.

20090078449 - Dielectric sheet: To provide a dielectric sheet that can be used as an elastomer connector in order to connect highly integrated circuit board and fine pitch electronic parts. The dielectric sheet (10f) comprises a first penetrating region (222c) having high permittivity, and a second penetrating region (33a) having conductivity, the regions are... Agent: Rader Fishman & Grauer PLLC

20090078450 - Electrical insulation tape with controlled bonding and resin impregnation properties: A mechanical interface for relieving stress between an outer layer and an inner insulating layer in a layered insulating tape structure surrounding an electrical conductor. The interface tape includes a porous non-woven carrier having opposing sides including a release region located at a first side and a non-release region located... Agent: Siemens Corporation Intellectual Property Department

20090078451 - Printed wiring board and method for manufacturing same: A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090078452 - Flexible printed circuit board: An exemplary FPCB includes a differential pair consisting of a first transmission line and a second transmission line, a signal layer with the first transmission line arranged therein, a ground layer having a void which includes the area beneath the first transmission line, and a dielectric layer lying between the... Agent: PCe Industry, Inc. Att. Steven Reiss

20090078453 - Polyimide film: The present invention relates to polyimide film for insulating material etc. prepared by reacting a mixture of 4,4-oxydiphthalic anhydride and at least one monomer of aromatic or aliphatic tetracarboxylic dianhydride with a mixture of p-phenylenediamine and at least one monomer of flexible diamines, and having excellent electric properties such as... Agent: Sughrue Mion, PLLC

20090078454 - Electronic circuit connecting structure of flat display panel substrate: An electronic circuit connecting structure of a flat display panel substrate is described. The electronic circuit connecting structure includes a plurality of conductive terminals on the flat display panel substrate and a plurality of conductive protrusions formed on the conductive terminals. In addition, an electronic circuit connecting method for the... Agent: Rabin & Berdo, PC

20090078455 - Light emitting module and method for manufacturing the same: Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of... Agent: Morrison & Foerster LLP

20090078456 - Three dimensional packaging optimized for high frequency circuitry: At least an embodiment of the present technology provides a method of manufacturing a mechanically adapting interconnecting device for multi-substrate packages comprising placing a metal laminate on each side of a polymer composite, forming a channel in the metal laminate; and metallizing the laminate to create a metal connection inside... Agent: James S. Finn

20090078457 - Electronic component and method for manufacturing same: A three-dimensional coil pattern, whose internal electrode is connected to external electrodes through a via, is formed within photosensitive resin colored by colorant. This structure allows this electronic component to be lower profile. Cured and colored resin that works as a protecting section of the coil pattern prevents irregular reflection... Agent: Ratnerprestia

20090078458 - Paste composition, insulating film, multilayer interconnection structure, printed-circuit board, image display device, and manufacturing method of paste composition: A disclosed paste composition includes a filler and a resin. The filler includes insulating filling material particles made of at least one of silica and titania, and insulating particles made of at least one of silica and titania whose surfaces have been hydrophobic treated, or insulating particles having at least... Agent: Cooper & Dunham, LLP

20090078459 - Light-transmitting conductive film and process for producing light-transmitting conductive film: A light-transmitting conductive film comprising a transparent support having provided thereon a mesh constituted by conductive metal portions and visible light-transmitting portions, wherein the mesh pattern continuously extends 3m or longer and are formed by exposure and development of a silver halide light-sensitive material to form metal portions having electrical... Agent: Sughrue-265550

20090078460 - Casing and mounting device: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a... Agent: Tyco Electronics Corporation

  
03/19/2009 > patent applications in patent subcategories. listing by industry category

20090071676 - Current insulation system for fluid systems: An electrical insulation system for a linear element forming part of a fluid system subjected to risks of possible external electrical discharges, such as an aircraft fuel system, using an insulating insert (12) between two parts (14, 16) of said linear element, consisting of providing said parts (14, 16) with... Agent: Ladas & Parry LLP

20090071677 - Vibration resistant cable: A vibration resistant cable may be provided. The vibration resistant cable may comprise a first conductor and a second conductor. The second conductor may be twisted around the first conductor at a lay length configured to cause a locking force between the first conductor and the second conductor. The locking... Agent: Merchant & Gould Southwire

20090071678 - Cradle arrangement: A cradle arrangement for an electrical back box, the arrangement comprising a back surface with legs extending to one side of the back surface, the back surface defined by an intumescent material layer and the legs configured in use to retain the intumescent material layer adjacent to an electrical back... Agent: Smith-hill And Bedell, P.C.

20090071679 - Electric junction box: An electric junction box has a binding band fitting hole, and two through holes through which a binding band for securing wire harnesses which are arranged along a lower face of a bottom wall of the binding band fitting hole are provided on the bottom wall so as to be... Agent: Sughrue-265550

20090071680 - Electrical gang box for controlling an electrical system: A receptacle-receiver unit is provided for an electrical system, such as a lighting system. The unit includes a receptacle having a plurality of female slots and a plurality of male ends, wherein the female slots are configured to receive a plug of the lighting system. The unit also includes a... Agent: Ditthavong Mori & Steiner, P.C.

20090071681 - Modular electrical assembly: A weatherproof, modular, outdoor electrical assembly for electrical devices includes a base, an adapter plate configured to fit into the opening of the base, and a cover. The electrical assembly further includes one or more adapter inserts that are attached to the adapter plate to convert the adapter plate to... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20090071682 - Temporary protective junction box cover: A temporary protective cover for junction boxes with or without installed switches and/or outlets and for conduit bodies, empty or containing wires or cables of various sizes and uses. The protective cover having a front and rear surface; having a trapezoidal cavity sized to receive installed switches and/or outlets in... Agent: Mcarvie Crawford Jr.

20090071683 - Electronic device mounting structure and method of making the same: An electronic device mounting structure includes a printed circuit board, a busbar, and an electronic device mounted on the busbar. The busbar includes a parallel portion extending parallel to the printed circuit board and a bent portion extending from the parallel portion toward the printed circuit board. The bent portion... Agent: Nixon & Vanderhye, PC

20090071684 - High voltage power cable termination: The present invention discloses a geometry electrode in a shed stress cone of a high voltage power cable termination, one end of the geometry electrode being leaded into a conductor of the power cable and the other end being leaded into a composite insulator cladding the conductor, the composite insulator... Agent: 3m Innovative Properties Company

20090071685 - Fault protected electrical cable: A low-voltage electrical power cable that includes of at least one uninsulated ground conductor and at least one insulated power conductor. The ground conductor and the power conductor are covered with an electrically conductive composition such that the power conductor contacts the electrical conductive composition for improving the flow of... Agent: Blank Rome LLP

20090071688 - Electrical control cable: The present invention relates to an electrical control cable of the type comprising a core having a plurality of polymer filaments, a plurality of strands of conductor material extending in the longitudinal direction of said core, an outer insulating sheath. According to the invention, said strands are distributed uniformly and... Agent: Sofer & Haroun LLP.

20090071686 - Medical electrical lead: A medical device lead is presented. The lead includes one or more jacketed conductive elements. The jacket comprises one or more covers. At least one conductive element includes a profiled longitudinal cover of polyether ketone (PEEK), the profiled longitudinal cover includes at least one protruding end.... Agent: Medtronic, Inc.

20090071687 - Medical electrical lead: A medical device lead is presented. The lead includes one or more jacketed conductive elements. The jacket comprises one or more covers. A first cover of expanded polytetrafluoroethylene (ePTFE) is in direct contact with the at least one conductive element. At least one conductive element and a ePTFE cover are... Agent: Medtronic, Inc.

20090071689 - Electrically conductive wire and method for its production: An electrically conductive wire (1) is specified for production of a winding which can be arranged in an electrical appliance and in which an oil which surrounds the winding and is used as a cooling medium is located. The wire (1) is surrounded by a layer (3) which covers the... Agent: Sofer & Haroun LLP.

20090071690 - Electrical cable comprising geometrically optimized conductors: A number of examples of insulated conductors having geometrically optimized shapes and form factors, that may be used in twisted-pair cables and other types of communication cable to enhance the performance of, and/or reduce the cost of manufacturing such cables.... Agent: Lowrie, Lando & Anastasi, LLP

20090071691 - Twisted pair cable having improved crosstalk isolation: A cable that provides reduced alien crosstalk between similar twisted pairs in cables that are in close proximity to one another and/or crosstalk between twisted pairs of the cable. In one example, a cable includes first, second and third twisted pairs, a shaped filler including a body portion and a... Agent: Lowrie, Lando & Anastasi, LLP

20090071692 - Process for the production of a multipolar cable, and multipolar cable produced therefrom: The present invention relates to a manufacturing process of a multipolar cable comprising at least one pair of cores, each core comprising at least one conductive element and at least one layer of electrical insulation in a position which is radially external to said at least one conductive element. This... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090071695 - Boron nitride agglomerated powder: Novel boron nitride agglomerated powders are provided having controlled density and fracture strength features. In addition methods for producing same are provided. One method calls for providing a feedstock powder including boron nitride agglomerates, and heat treating the feedstock powder to form a heat treated boron nitride agglomerated powder. In... Agent: Larson Newman Abel Polansky & White, LLP

20090071694 - Circuit card and method for increasing the resistance of a circuit card to the formation of conductive filaments: The present invention relates to a circuit card (4.3; 4.4) which includes conductive patterns (1, 2, 5, 6) and a web (3) made of glass fibers, at least one non-conductive blocking element (11.1; 11.2) for blocking the growth of a conductive filament (12.1; 12.2) along a glass fiber is provided... Agent: Kenyon & Kenyon LLP

20090071693 - Negative photosensitive material and circuit board: e

20090071696 - Partially rigid flexible circuits and method of making same: The present invention relates to partially rigid flexible circuits having both rigid portions and flexible portions and methods for making the same.... Agent: 3m Innovative Properties Company

20090071697 - Rubber-modified polyamide resin, epoxy resin compositon and cured product thereof: (wherein, each of x, y and z is an average value and 0.01≦z/(y+z)≦0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of... Agent: Nields, Lemack & Frame, LLC

20090071698 - Circuit board: A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board.... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090071699 - Packaging substrate structure and method for manufacturing the same: The present invention relates to a packaging substrate and a method for manufacturing the same. The packaging substrate comprises: a substrate body, wherein a surface thereof has a circuit layer comprising a plurality of circuits and a plurality of conductive pads, and the conductive pads are higher than the circuits;... Agent: Lowe Hauptman Ham & Berner, LLP

20090071700 - Wiring board with columnar conductor and method of making same: A wiring board with a columnar conductor includes a wiring board defined by a multilayer ceramic board, a columnar conductor on an upper surface of the wiring board, and an insulating support portion arranged to support a side of the columnar conductor and having an external shape that expands from... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090071701 - Laminated structure, forming method of the same, wiring board, matrix substrate and electronic display apparatus: A disclosed laminated structure includes a wettability variable layer containing a wettability variable material whose surface energy changes when energy is applied thereto and including at least a high surface energy area having high surface energy and a low surface energy area having low surface energy; and a conductive layer... Agent: Cooper & Dunham, LLP

20090071702 - Circuit board: A circuit board (10) for reducing a variation in impedance of signal traces thereon includes a first signal plane (30) and a second signal plane (50). The first signal plane includes a first signal trace (31) arranged thereon. The first signal trace has a first width. The second signal plane... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090071704 - Circuit board and method for fabricating the same: A circuit board and a method for fabricating the same are disclosed. The circuit board includes: a carrier board having a circuit layer formed on at least one surface thereof; a first dielectric layer formed on the carrier board and having first openings for exposing a part of the circuit... Agent: Edwards Angell Palmer & Dodge LLP

20090071703 - Conductive paste, circuit board, circuit article and method for manufacturing such circuit article: The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090071706 - Method for producing multilayered wiring substrate, multilayered wiring substrate, and electronic apparatus: A method for producing a multilayered wiring substrate includes forming a lyophobic area on a first conductive layer, forming an insulating layer with an opening portion on the first conductive layer by applying a functional liquid containing an insulating layer forming material on a periphery of the lyophobic area, laminating... Agent: Harness, Dickey & Pierce, P.L.C

20090071705 - Printed circuit board having embedded components and method for manufacturing thereof: A PCB (printed circuit board) having embedded components and a method for manufacturing thereof are disclosed. The PCB may include a dielectric substrate having a cavity formed in one side, a first component inserted in the cavity such that an electrode of the first component faces the one side of... Agent: Staas & Halsey LLP

20090071707 - Multilayer substrate with interconnection vias and method of manufacturing the same: A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole,... Agent: Tessera Lerner David Et Al.

20090071708 - Integrated electrical cross-talk walls for electrostatic mems: To reduce cross-talk between adjacent hot electrodes, the present invention provides a ground plane, which extends beneath each side of a MEMS mirror platform covering opposite edges of a hot electrode along each side thereof. The ground plane includes an overhang section extending between the mirror platform and the hot... Agent: Teitelbaum & Maclean

20090071709 - Electromagnetic bandgap structure and printed circuit board including multi-via: An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second... Agent: Staas & Halsey LLP

20090071710 - Flip-chip component and method for its production: The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a... Agent: Slater & Matsil, L.L.P.

20090071711 - Electronic component package: An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the... Agent: Pearne & Gordon LLP

20090071712 - Explosion containment vessel: An enclosure (10) that contains a switch (40, 42) and that is surrounded by an explosive or flammable environment that could be ignited by a spark from the switch, includes a body (52) that guides a flat cable (16) through a body bore (56) to the inside of the vessel.... Agent: Leon D. Rosen Freilich, Hornbaker & Rosen

  
03/12/2009 > patent applications in patent subcategories. listing by industry category

20090065236 - Article and method for sealing fluid-containing cables: A cable has a conductor extending therefrom and a partially exposed fluid-containing layer surrounding the conductor. A connector is joined to an end of the conductor, and an electrically insulative, elastomeric tube is covers all of the exposed fluid-containing layer and a portion of the connector. The elastomeric tube is... Agent: 3m Innovative Properties Company

20090065237 - Pressure restraining enclosure for cables: A pressure restraining enclosure for cables can include, for example, a first cable including a conductor and an oil-containing layer surrounding the conductor, and a second cable having a conductor. A splice can connect the conductor of the first cable with the conductor of the second cable. A pressure restraining... Agent: 3m Innovative Properties Company

20090065232 - Housing for an electric appliance: A housing for an electric appliance includes a wall with an electrically insulating solid structure, an electrically conductive skin that is fastened to the solid structure, an electrically conductive support, and at least one screw that engages into a bore of the structure and keeps the support pressed against the... Agent: Bsh Home Appliances Corporation Intellectual Property Department

20090065233 - Protective cover arrangement for an electrical unit: A protective cover arrangement (1) for a first electrical unit, e.g. a starter unit (3), mountable on a second electrical unit, e.g. a compressor (2). The protective cover arrangement (1) comprises an outer cover (5) and an inner cover (6). The outer cover (5) comprises mounting parts (8) adapted to... Agent: Mccormick, Paulding & Huber LLP

20090065249 - Marine wire organizer: A marine wire organizer intended for retaining and organizing a plurality of wires associated with various maritime vessels. The wire organizer has a series of spaced slots with corresponding notches through which wires of variable sizes and cross-sectional areas can be easily inserted leading to transverse holes that receive and... Agent: Robert Silvers

20090065250 - Cable joint: A cable joint assembly may include a base and a plurality of removable legs connected to the base, each leg preferably including a limiter. A securing assembly preferably maintains the leg connected to the base. The securing assembly preferably includes an indicator for providing a visual indication whether or not... Agent: Stroock & Stroock & Lavan LLP

20090065234 - Signal transmission electric wire for the aviation and space industries: The invention relates to a data transmission electric wire comprising a plurality of conductor strands covered in at least one insulating covering including PTFE, the plurality of strands comprising an inner core of first strands covered by at least one outer layer of second strands, said first and second strands... Agent: Sofer & Haroun LLP.

20090065235 - Grommet: In a grommet (1), a centering unit and a temporary anchor unit are provided on an outer surface of a grommet inner member (2). The centering unit includes a plurality of centering portions (e.g., centering claws 8) configured to elastically abut on an attachment panel (20) at an inner edge... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090065238 - Printed circuit board: An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090065239 - Printed circuit board and method of manufacturing the same: A printed circuit board on which protective plating has been carried out as surface treatment is provided. The printed circuit board includes a part of a wiring pattern formed with an upper surface and side surfaces of a conductive part including the wiring pattern being exposed on a substrate. Surfaces... Agent: Staas & Halsey LLP

20090065240 - Method of making wiring boards covered by thermotropic liquid crystal polymer film: The present invention provides a method of making a wiring board comprising: hot-pressing and laminating a thermotropic liquid crystal polymer film on a wiring board base material on the surface of which at least one layer containing a electro-conductive circuit is exposed, characterized by that a viscoelastic characteristic of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090065242 - Manufacturing method of printed wiring board and printed wiring board including potting dam obtained by using manufacturing method: The present invention provides a manufacturing method of a printed wiring board including a potting dam of favorable shape and positional accuracy. The method includes a process A of preparing a substrate comprising a wiring pattern, a process B of providing a resin layer on a surface of the substrate... Agent: Greenblum & Bernstein, P.L.C

20090065241 - Printed circuit board: A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces.... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090065243 - Printed wiring board: A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090065244 - Thermosetting resin compositions and uses thereof: Thermosetting resin compositions are excellent in balance among printability, tack properties, matting properties, electrical insulating properties and adhesion to objects. A thermosetting resin composition includes a thermosetting resin (A) and core-shell multilayer organic fine particles (B).... Agent: Sughrue Mion, PLLC

20090065245 - Circuit board structure and fabrication method thereof: A circuit board structure and a fabrication method thereof are disclosed. The circuit board structure includes a carrying board having a first and an opposite second surface and having at least one through cavity formed therein; a semiconductor chip disposed in the through cavity of the carrying board; an adhesive... Agent: Pearne & Gordon LLP

20090065246 - Circuit board structure and method for manufacturing the same: A circuit board disclosed in the present invention includes a core board on which a first circuit layer is placed, wherein the first circuit layer has a plurality of conductive pads; and at least one built-up structure covering the surface of the circuit board, which comprises a dielectric layer, a... Agent: Bacon & Thomas, PLLC

20090065247 - Multi - voltage housing: A housing for one or more electrical components that are connected to sources of a plurality of voltages comprises a box, a first cover to cover a first portion of the opening in the box and a second cover to cover a second portion of the opening. The first cover... Agent: Chernoff, Vilhauer, Mcclung & Stenzel

20090065248 - Devices, systems, and/or methods for electrically coupling an electric motor: Certain exemplary embodiments can provide a terminal box adapted to be releasably and/or operatively attached to a selected electric motor of a plurality of electric motors. The terminal box can be adapted to receive a plurality of electrical wires. The plurality of electrical wires can be adapted to convey electrical... Agent: Siemens Corporation Intellectual Property Department

  
03/05/2009 > patent applications in patent subcategories. listing by industry category

20090056968 - Lightning protection system for a wind turbine rotor blade and a method for manufacturing such a blade: The invention relates to a wind turbine rotor blade comprising a blade tip and a lightning protection system. The rotor blade includes at least one lightning receptor at the surface of the blade in an external distance (Lex) from the distal end of the blade tip, and a lightning receptor... Agent: St. Onge Steward Johnston & Reens, LLC

20090056969 - Commercial plastic electrical boxes with metal sections: Molded plastic commercial electrical boxes are provided with metal brackets to accept connectors for conduit or armored cable (BX). Using a sturdy molded plastic frame with metal brackets or regions is a cost-effective method to manufacture these electrical boxes. This type of construction can be used with electrical boxes having... Agent: Alfred M. Walker

20090056970 - Power mat: A power mat provides power to a variety of locations throughout a room, without obstructing traffic through the room. The power mat covers at least a portion of the floor of the room, and comprises a plurality of outlets, at least one cable connecting the plurality of outlets and an... Agent: Mccormick, Paulding & Huber LLP

20090056971 - Sweep style conduit bodies: A conduit body provides for the accommodation of wire extending therethrough. The conduit body includes a body wall having an elongate side wall, a bottom wall and an open end defining a body interior. At least one hub extends from the body wall in communication with the body interior. The... Agent: Hoffmann & Baron, LLP

20090057009 - Non-halogenous insulated wire and a wiring harness: A non-halogenous insulated wire possessing sufficient flame retardancy, wear resistance, flexibility and workability, and excellent coordination with a halogen-containing material, which includes a conductor, an inside coat formed of one or more layers and an outermost coat, wherein the outermost coat is in the range of 10-100 μm in thickness... Agent: Oliff & Berridge, PLC

20090057010 - Cover for terminated cables: A cover includes a flexible polymeric body defining a longitudinally extending space and having an outer surface, a first end defining an opening providing access to the space, a second end opposite to the first end, and an attachment segment positioned near the second end. The opening and the space... Agent: 3m Innovative Properties Company

20090056972 - Shielded electrical cable for data transmission: A highly flexible shielded electrical line for high-frequency data transmission in swivel-mounted display units having two current supply wires (20; 21) and/or at least two data wires (18; 19), provides a shielding (35) of non-insulated metallic cables enclosing the wires (18; 19; 20; 21), which are stranded and/or bundled or... Agent: Birch Stewart Kolasch & Birch

20090056973 - Semiconductive compositions: The present invention is a polymer composite made from or containing: (i) a phase I material consisting essentially of a polar copolymer of ethylene and an unsaturated ester having 4 to 20 carbon atoms; (ii) a phase II material consisting essentially of a nonpolar, low density polyethylene; and (iii) a... Agent: The Dow Chemical Company

20090056974 - Flexible electric line: A flexible electric line for movable loads is specified which has at least two wires, in each case consisting of an electrical conductor and an insulation surrounding it, as stranded elements which are stranded around a core consisting of insulating material with dents extending in the longitudinal direction in which... Agent: Sofer & Haroun LLP.

20090056975 - Transmission wire: A transmission wire includes an insulated packaging layer, at least one conducting wire, and a flexible fixing wire. The conducting wire is set inside the insulated packaging layer. The flexible fixing wire and the conducting wire are set inside the insulated packaging layer in common. The transmission wire can be... Agent: Rosenberg, Klein & Lee

20090056976 - Electrical power line insulator with end clamp: An electrical power line insulator has an end clamp with a saddle for supporting an electrical wire, a track provided on a front surface of the saddle, a keeper for compressing and supporting an electrical wire seated in the saddle, a bolt and a nut for fastening the keeper to... Agent: Katten Muchin Rosenman LLP (c/o Patent Administrator)

20090056978 - Multilayer ceramic circuit board having protruding portion and method for manufacturing the same: A multilayer ceramic circuit board includes ceramic wiring layers which are stacked together, one or two or more lifting layers which have a planar shape and which are disposed as an inner layer inside the stacked ceramic wiring layers or as a lower layer lower than a bottom ceramic wiring... Agent: Brinks Hofer Gilson & Lione

20090056979 - Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module: A PCB can include an insulating member, a cooling member, and a circuit pattern. The cooling member can be built into the insulating member. The cooling member can have a cooling passageway through which a cooling fluid can flow. The circuit pattern can be formed on the insulating member. Thus,... Agent: Mills & Onello LLP

20090056977 - Production method of solder circuit board: A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the printed wiring board so as to melt the solder to... Agent: Sughrue Mion, PLLC

20090056980 - Printed circuit board: Disclosed is a printed circuit board (1) comprising a top face (2) for positioning an electronic component. A bottom face (4) of the circuit board (1) is used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) create heat transfer from the top face (2)... Agent: Fasse Patent Attorneys, P.A.

20090056982 - Process for producing a double-sided flexible printed board and double-sided flexible printed board: s

20090056981 - Thin film-laminated polyimide film and flexible printed wiring board: The thin film-laminated polyimide film contains a substrate film and a thin film layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%.... Agent: Morrison & Foerster LLP

20090056986 - Integrated circuit (ic) carrier assembly with first and second suspension means: An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means interconnecting pairs of adjacent islands, and a second resilient suspension... Agent: Silverbrook Research Pty Ltd

20090056987 - Multilayer ceramic electronic device and method for manufacturing the same: In a method for manufacturing a multilayer ceramic electronic device, a resin introduction portion located outside a vertically projected region of a surface mount electronic device is disposed on a seat portion which includes a non-metallic inorganic powder as a primary component and on which the surface mount electronic device,... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20090056988 - Multiple chips bonded to packaging structure with low noise and multiple selectable functions: The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The... Agent: Mou-shiung Lin

20090056983 - Printed circuit board: A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween and a first differential pair and a second differential pair each having a positive differential trace and a negative differential trace. The positive differential traces of the two differential pairs are disposed within the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090056985 - Printed circuit board and method of production of an electronic apparatus: A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the... Agent: Staas & Halsey LLP

20090056984 - Signal transmission structure and layout method for the same: A signal transmission structure is provided. The signal transmission structure includes conduction blocks periodically formed at a power plane, neck blocks connecting adjacent conduction blocks, and openings formed corresponding to the neck blocks at a ground plane for reducing equivalent capacitance between the neck blocks and the ground plane, so... Agent: Jianq Chyun Intellectual Property Office

20090056990 - Electro-optic device and electronic apparatus: An electro-optic device includes a pixel electrode, an insulating film, a first conductive film, and a second conductive film. The second conductive film that is formed between the pixel electrode and the insulating film and formed in an island shape so as to overlap with a contact hole formed in... Agent: Workman Nydegger 1000 Eagle Gate Tower

20090056991 - Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom: The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various applications including but not limited to electronics manufacturing, printed circuit board manufacturing, metal electroplating, the protection of surfaces against... Agent: Morgan, Lewis & Bockius, LLP.

20090056989 - Printed circuit board and method for preparation thereof: Disclosed is a method for preparing a printed circuit board. The method comprises forming a conductive layer on an insulated layer substrate. The method further includes partitioning the conductive layer into a first area and a second area by applying a photoresist mask. Furthermore, the method includes applying a first... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC C/o Intellevate, LLC

20090056992 - Wiring substrate with lead pin and lead pin: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to... Agent: Rankin, Hill & Clark LLP

20090056993 - Method for forming cured film: The invention provides a method for forming a cured film, comprising discharging an ink-jet ink, which comprises predetermined compounds, whose viscosity at 25° C. is approximately 150 to approximately 3,000 mPa·s, from an ink-jet head at a discharging temperature of approximately 80 to approximately 150° C., which has a low... Agent: Hogan & Hartson LLPIPGroup, Columbia Square

20090056995 - Adhesive sheet, metal-laminated sheet and printed wiring board: The adhesive sheet contains a substrate film and an adhesive layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. The adhesive sheet... Agent: Morrison & Foerster LLP

20090056994 - Methods of treating a surface to promote metal plating and devices formed: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the... Agent: Morgan, Lewis & Bockius, LLP.

20090056996 - Electronic component module: An electronic component module 1 has a circuit board 2 in which metal plates 5 and 7 are bonded to both surfaces of a ceramic substrate 3, and an electronic component 9 that is bonded to at least one surface of the metal plate 5 and is operable at least... Agent: Foley And Lardner LLP Suite 500

20090056997 - Electronic assemblies without solder and methods for their manufacture: A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached... Agent: The Tpl Group

20090057000 - Connecting element: Connecting element for mounting on a printed circuit board, which connecting element has at least two connecting lines which cross one another and are not electrically connected between respectively associated contacts.... Agent: Osram Sylvania Inc

20090056998 - Methods for manufacturing a semi-buried via and articles comprising the same: Disclosed herein is a method comprising drilling a first hole in a multilayered device; the multilayered device comprising a fill layer disposed between and in intimate contact with two layers of a first electrically conducting material; the fill layer being electrically insulating; plating the first hole with a slurry; the... Agent: Cantor Colburn LLP - IBM Rochester Division

20090056999 - Printed wiring board: A printed wiring board suppresses characteristic impedance mismatch that occurs when the printed wiring board is equipped with a through-type coaxial connector, and includes ground layers stacked in a plurality of layers via insulating layers; a through-hole; a clearance serving as an anti-pad provided in an area between the through-hole... Agent: Nec Corporation Of America

20090057001 - Integrated circuit package and manufacturing method thereof: An IC package includes: a multi-layered PCB having a plurality of insulating layers and a plurality of conductive pattern layers stacked in sequence and a plurality of via-holes formed through the plurality of the insulating layers for an electrical connection between the layers; and an IC chip disposed in a... Agent: Cha & Reiter, LLC

20090057002 - Shield structure: A shield structure having a plurality of hollow columnar base members arranged with intervals therebetween along the periphery of a section to be shielded on a surface of a circuit board, and a shield cover with a peripheral wall having insertion pieces arranged along the edge thereof at positions corresponding... Agent: Dickstein Shapiro LLP

20090057003 - Electromagnetic interference shields and related manufacturing methods: According to various aspects, exemplary embodiments are provided of board level shields having single piece constructions. In an exemplary embodiment, a shielding enclosure includes sidewalls and an integral top surface. The sidewalls include upper and lower portions cooperatively defining an interlock therebetween. The upper sidewall portions depend downwardly from the... Agent: Harness, Dickey, & Pierce, P.l.c

20090057004 - Shield case device and display apparatus: According to one embodiment, a shield case device includes: a shield case; a heating element that is mounted on a circuit board housed in the shield case; and a heat conducting member that is provided between the shield case and the heating element, the heat conducting member thermally conducted to... Agent: Blakely Sokoloff Taylor & Zafman LLP

20090057005 - Cable conduit and method of mounting a cable relative to a wall opening: A cable harness for passing one or more cables through an opening the wall includes a cable conduit including a generally S-shaped channel defined by an inner surface of a first shell portion and an inner surface of a second shell portion attached to the first shell portion and a... Agent: Volvo Technology Of America, Corporate Patents

20090057006 - Electronic unit and production method of the same: A method of producing an electronic unit in which components are housed in a case and molded with resin, wherein an opening portion of the case housing the components of the unit is closed by a lid plate, the resin is poured into the case through the hole provided in... Agent: Pearne & Gordon LLP

20090057007 - Portable information terminal: A portable information terminal has a first casing, a second casing, a sliding mechanism to maintain a portable state wherein the first casing and second casing are overlapped, and a turning mechanism to modify the from the portable state, via a sliding state wherein the first casing and second casing... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090057008 - Sealing body for a cable sleeve: A sealing body for a cable sleeve, in which a compensation element is embodied as an elastomer element that is inlaid or embedded in the gel-like sealing element is disclosed. The compensation element, by means of which the alterations in the material behavior of the gel-like sealing element which occur... Agent: Corning Incorporated

Previous industry: Tool driving or impacting
Next industry: Boring or penetrating the earth


######

RSS FEED for 20130613: xml
Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.

######

Thank you for viewing Electricity: conductors and insulators patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Electricity: conductors and insulators patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Electricity: conductors and insulators patents we recommend signing up for free keyword monitoring by email.



###

FreshPatents.com Support - Terms & Conditions

Results in 0.82154 seconds

PATENT INFO