Electricity: conductors and insulators inventions 02/09

20090050344 - Energy distribution system: An energy distribution system (2) is provided having a metering box (6) having a housing portion (14) and a cover (16), the cover being lockable to the metering box. An energy meter (32) is provided in the metering box with a first connector (34) extending to a wall (20) of... Agent: Tyco Technology Resources

20090050366 - Arrangement for current distribution and contact arrangement and fuse protection thereof of the outgoing cables: The invention relates to a potential distribution system for motor vehicles, which makes provision for a reserve on contact bars of an excess number of connection possibilities for further outlets. The connection possibilities which are not required can be closed off with a blanking plug and the connection possibilities which... Agent: Bromberg & Sunstein LLP

20090050345 - Wire management system with integrated din rail and selectively accessible wire: A wiring system includes a first mounting bracket and a second mounting bracket having respective mounting flanges configured to secure the first and second mounting brackets to a mounting surface. The first and second mounting brackets extend away from the mounting surface to a distal end where a hinge is... Agent: Rockwell Automation, Inc./(qb)

20090050346 - Coiled wire armored cable: The coiled wire armored cable (10) includes transmission wires (14) encased by an insulator (12). A solid protective wire (16) is spirally wound over the exterior of the insulator. The protective wire (16) is fabricated from a metal, such as steel or titanium material, and will have a gauge that... Agent: Charles R. Wolfe, Jr. Blank Rome LLP

20090050347 - Insulated conducting device with multiple insulation segments: Insulated conducting devices and related methods are disclosed. An insulated conducting device for a voltage structure comprises: a conductor connected to a voltage; and multiple insulation segments enclosing the conductor, the multiple insulation segments interfacing with one another.... Agent: Scott Faber, Esq. Varian Semiconductor Equipment Associates, Inc

20090050348 - Reinforced superconductor element: A superconductor element comprising Nb3Sn, in particular, multi-filament wire, which contains at least one superconducting filament (1) which is obtained after drawing through solid diffusion reaction from an initial filament structure which comprises a longitudinal hollow tube (3) of niobium (Nb) or an Nb alloy, in particular, NbTa or NbTi,... Agent: Kohler Schmid Moebus

20090050349 - Compact spillover fitting and method of use thereof: A spillover fitting is positioned on an upstanding side of a lateral cable trough. The spillover fitting includes a first exit path having a first curved surface that extends at least partially over a base of the lateral cable trough, and a bottom wall having a second curved surface intersecting... Agent: Panduit Corp.

20090050350 - Wire harness lead-out structure of protector: A wire harness lead-out structure includes a body that includes a containing portion for receiving a wire harness and a corrugated tube covering the wire harness, a lid that is attached to the body to close an upper opening of the body, two completely-fixing ribs that are formed on the... Agent: Sughrue-265550

20090050351 - Hermetic electrical feedthrough assembly for a compressor and method for making the same: An electrical feedthrough assembly for providing connection to components of a compressor. The electrical feedthrough assembly includes a housing having an inner surface defining a channel. A sealed wire assembly is provided in the channel. The sealed wire assembly includes a body having an outer surface defining a groove and... Agent: Edwards Angell Palmer & Dodge LLP

20090050353 - Mounting structure of electronic component: A mounting structure of an electronic component includes: a bump electrode included in the electronic component, the bump electrode having an internal resin as a core and a conductive film covering a surface of the internal resin, and elastically deforming so as to follow a shape of at least one... Agent: Harness, Dickey & Pierce, P.L.C

20090050352 - Substrate structures for flexible electronic devices and fabrication methods thereof: The invention provides flexible electronic substrate structures and fabrication methods thereof. The flexible electronic substrate structures include a large scale carrier and a plurality of flexible substrates disposed on the large scale carrier, wherein the flexible substrate includes polymeric material formed by coating. The flexible substrates are patterned polymer materials... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20090050354 - Printed circuit board substrate and printed circuit board having the same: A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090050355 - Thermoplastic films for insulated metal substrates and methods of manufacture thereof: An insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer comprises a thermoplastic film having a thickness of less than or equal to 10 micrometers, a thermal resistance of less than or equal to 0.050 Kelvin-square inches per watt,... Agent: Cantor Colburn, LLP

20090050356 - Capacitors with insulating layer having embedded dielectric rods: A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material.... Agent: Slater & Matsil, L.L.P.

20090050357 - Wiring structure and electronic device designed on basis of electron wave-particle duality: According to a simultaneous duel model that a de Broglie wave accompanies an electron drift-moving in an electron circuit, wiring is considered as a waveguide of the average de Broglie wave and design was performed by reducing the resistance value at bending portion of the wiring. Furthermore, by providing a... Agent: Oliff & Berridge, PLC

20090050359 - Circuit board having electrically connecting structure and fabrication method thereof: A circuit board having an electrically connecting structure and a method for fabricating the same are provided. A circuit board body having inner-layer circuits is provided. A circuit layer is formed on at least an outermost surface of circuit board body, and including electrically connecting pads and circuits. The electrically... Agent: Edwards Angell Palmer & Dodge LLP

20090050358 - Electrical connector with elastomeric element: An electrical connector is provided. The electrical connector includes a substrate and an elastomeric element extending outwardly from the substrate. The elastomeric element extends outwardly from a base portion thereof at the substrate to an end portion thereof that is opposite the base portion. An electrical contact engages an electrically... Agent: Robert J. Kapalka Tyco Electronics Corporation

20090050360 - Shield assembly with gaskets: A shielding assembly (100) for protecting several modules from electromagnetic interference, includes a cage (40) installable on a circuit board (200), a first gasket (20), and a second gasket (50). The cage includes a front end portion (41), a cover (42), a base (48), and at least one interior wall... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090050361 - Gaskets for providing environmental sealing and/or electromagnetic interference (emi) shielding: A gasket generally includes a base member having an inner surface and an outer surface, and a top member having an inner surface and an outer surface. The gasket also has first and second oppositely-disposed lateral members curving generally inwardly relative to each other and connecting the base member to... Agent: Harness, Dickey, & Pierce, P.l.c

20090050362 - Electrical shielding material composed of metalized stainless steel monofilament yarn: A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20090050363 - Cable mounting structure and snap fit door hinge for telecommunications distribution pedestal: A cable mounting structure for a telecommunications cable distribution pedestal is provided. The structure has back to back compartments, may be used with fiber or wire and includes at least one door. The structure also includes protection and organization features. The structure is field convertible, reconfigurable and upgradeable. A snap... Agent: Harness, Dickey, & Pierce, P.l.c

20090050364 - Field convertible telecommunications distribution pedestal: A cable mounting structure for a telecommunications cable distribution pedestal is provided. The structure has back to back compartments and a universal mounting plate. The structure also includes protection and organization features. The structure is field convertible, reconfigurable and upgradeable. A method for field converting a telecommunications cable distribution pedestal... Agent: Harness, Dickey, & Pierce, P.l.c

20090050365 - Fire resistant and/or water resistant enclosure for operable computer digital data storage device: A fire and/or water resistant enclosure is provided for housing an operable digital data storage device. The enclosure is a low cost, preferably molded gypsum enclosure having various embodiments for providing resistance to fire occurring outside said enclosure and/or to water. In one embodiment, a fan cooperates with one or... Agent: Bruce H. Johnsonbaugh Eckhoff & Hoppe

20090044963 - Convenient and safe receptacle/switch and terminal block: An electrical device for wiring an electrical appliance is provided. The electrical device comprises a grounding wire having a fork and a grounding screw with the grounding wire permanently installed on the electrical device. A clamp mechanism is provided having a flexible sheet of material having a top surface, a... Agent: Emery L. Tracy

20090044964 - Utility outlets as a security system: Utility outlets that function as a security system in a premises is disclosed. Utility outlets that function as a security system reduces the number of devices that need to be installed in a premises, thereby by reducing overall costs in installing a security system. Additionally, using utility outlets as a... Agent: Fulbright & Jaworski L.l.p

20090044965 - Fluororesin composition and electric wire: The present invention provides a fluororesin composition which is improved in moldability in melt extrusion molding and, in particular, makes it possible to markedly reduce molding defects even when the extrusion molding for covering electric wires is carried out at a high speed. The present invention is a fluororesin composition... Agent: Sughrue Mion, PLLC

20090044966 - Indium-solder-coated copper foil ribbon conductor and method of connecting the same: Another method includes soldering an indium solder 3 (having the same composition as shown above) to the electrode layer 4B beforehand, subsequently placing a ribbon-form copper foil or tin-plated copper foil 2 thereon, and connecting the copper foil 2 to the electrode layer 4B with an ultrasonic soldering iron 5.... Agent: Sughrue-265550

20090044967 - Circuit board, electronic circuit device, and display device: A circuit board, an electronic circuit device, and a display device, in which generation of an edge short-circuit is prevented, includes wirings that are arranged much more densely. A circuit board includes a substrate having a first main surface on which a semiconductor integrated circuit is mounted and a second... Agent: Sharp Kabushiki Kaisha C/o Keating & Bennett, LLP

20090044968 - Flexible printed circuit board: An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair,... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090044969 - Wired circuit board and connection structure between wired circuit boards: A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed... Agent: Akerman Senterfitt

20090044970 - Methods for fabricating current-carrying structures using voltage switchable dielectric materials: A method comprises providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic... Agent: Carr & Ferrell LLP

20090044972 - Circuit board, method of forming wiring pattern, and method of manufacturing circuit board: When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.... Agent: Staas & Halsey LLP

20090044971 - Printed wiring board, process for producing the same and usage of the same: The printed wiring board includes an insulating base and a plurality of wirings formed on the surface of the insulating base, wherein the wiring circuit has a conductive undercoat layer formed on the surface of the insulating base, a Cu nodule layer formed on the upper surface of the undercoat... Agent: The Webb Law Firm, P.C.

20090044973 - Device for guiding cables or wires: A device which is used to guide cables or wires through walls. The device includes a maintaining device which is connected to two or more cable maintaining elements that surround, in a frame-like manner, a mounting area which includes a through-opening, and the cable maintaining elements are arranged in the... Agent: Pauley Petersen & Erickson

20090044974 - Leadthrough for an electrical high voltage through a wall surrounding a process area: In a leadthrough for an electrical high voltage conductor through a wall which separates a process area from an ambient area, comprising a body of a dielectric high voltage resistant material, two axially adjacent geometric base structures are provided, a cylinder and a truncated cone having a smaller diameter end... Agent: Klaus J. Bach

20090038819 - Wind turbine lightning connection means method and use hereof: The invention relates to a wind turbine (1) comprising stationary means such as a nacelle (3) and a tower (2) comprising stationary lightning protection means (46), and rotating means such as a rotor including at least one wind turbine blade (5) and shaft means (14), each of said at least... Agent: Cantor Colburn, LLP

20090038825 - Electric connection box and manufacturing method of electric connection box: One aspect of the present invention can include an electric connection box including a housing, a circuit component positioned in the housing, a filler material in the housing enclosing the circuit component, a filling inlet configured to receive the filler material, the filling inlet positioned at an upper part of... Agent: Oliff & Berridge, PLC

20090038845 - Pivoting strain relief bar for data patch panels: A pivoting strain relief bar assembly that is comprised of a patch panel rotatably coupled to a strain relief bar, where the patch panel and strain relief bar are also coupled to a conventional rack capable of supporting telecommunications or other electronic equipment. Cables that are to be terminated to... Agent: Panduit Corp.

20090038820 - Coating neural electrodes with carbon nanotubes and variations: The present invention provides a method and system of using carbon nanotubes (CNTs) to coat neural electrodes of different geometries and materials. Additional elements such as gold platinum, polypyrrole, polyethylenedioxythiophene or other conductive polymers and covalent linkage through an amide bond are formed with the CNTs for attachment to the... Agent: Carr LLP

20090038821 - Covered electric wire and coaxial cable: The present invention provides a covered electric wire having a covering excellent in electrical characteristics and thermal stability as well as in crack resistance. The present invention is related to a covered electric wire comprising a core wire covered with a tetrafluoroethylene [TFE]-based copolymer comprising TFE-derived TFE units and perfluoro... Agent: Sughrue Mion, PLLC

20090038822 - Multifilament superconductor, as well as method for its production: A multifilament superconductor (1) has a core area (2), several superconductor filaments (7) and reinforcement filaments (6). The superconductor filaments (7) and the reinforcement filaments (6) are arranged, so that they have a regular two-dimensional matrix (5) in the cross-section of core area (2). The reinforcement filaments (6) consist of... Agent: Baker Botts L.L.P. Patent Department

20090038823 - Wiring substrate with lead pin and lead pin: A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a... Agent: Rankin, Hill & Clark LLP

20090038824 - Wire holder: A wire holder includes a synthetic resin component that includes a clamp portion for holding at least one wire and a metal component that includes at least one lead portion mounted on a circuit board. The synthetic resin component includes a groove-shaped fitting groove portion. The metal component includes at... Agent: Davis & Bujold, P.l.l.c.

20090038826 - Circuit board and radiating heat system for circuit board: A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each... Agent: Ipla P.A.

20090038827 - Control grid for solar energy concentrators and similar equipment: This invention provides a better means to achieve affordable solar energy, as well as other technologies. It does so by improving control grids (for addressing and alignment) in solar concentrators and optical equipment in general. Thus troublesome and expensive grid material like Indium Tin Oxide (ITO) can be replaced by... Agent: Mario Rabinowitz

20090038828 - Flexible printed circuit board substrate and flexible printed circuit board fabricated using the same: The present invention relates to a flexible printed circuit board substrate and FPCB made from the flexible printed circuit board substrate. In one embodiment, a flexible printed circuit board substrate includes a dielectric layer, a rolled copper foil and an electroplated copper foil disposed on two opposite surfaces of the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090038831 - Printed circuit board: A printed circuit board includes a main board part, a reserved board part, a connecting part and a groove. The main board part has a first extending circuit. The reserved board part has a second extending circuit corresponding to the first extending circuit. The connecting part connects the main board... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20090038829 - Printed circut board for population with surface-mounted devices and also method therefor: A printed circuit board for population with surface-mounted devices is provided simultaneously with a lead frame, which has a three-dimensional shape and which is surrounded by a plastic.... Agent: Delphi Technologies, Inc.

20090038830 - Substrate for mounting ic chip and method of manufacturing the same: A substrate for mounting an IC chip including a printed substrate including a first build-up layer. The first build-up layer including (i) a first conductor layer having first conductor circuits and (ii) a resin insulating layer. The first conductor circuits and the resin insulating layer alternating along a length of... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090038832 - Device and method of forming electrical path with carbon nanotubes: Carbon nanotubes are dispersed in a curable polymer matrix to form a dispersion. When electrical energy is applied to the dispersion, the carbon nanotubes become oriented to form an electrical path. The polymer matrix is cured to fix the electrical path.... Agent: Hewlett Packard Company

20090038834 - Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same: An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090038833 - Silicon compound, ultraviolet absorbent, method for manufacturing multilayer wiring device and multilayer wiring device: A layer of a porous insulating film precursor is formed on or over a substrate, a layer of a specific silicon compound is then formed, this silicon compound layer is pre-cured as necessary, and the porous insulating film precursor is exposed to UV through the silicon compound layer or pre-cured... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090038835 - Multilayer printed wiring board and method for manufacturing the same: A multilayer printed wiring board includes a core substrate, a resin insulation layer laminated on the core substrate and a capacitor section coupled to the resin insulating layer. The capacitor section includes a first electrode including a first metal and configured to be charged by a negative charge, and a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090038836 - Wiring board and method of manufacturing wiring board: A wiring board assembly and a method of making a wiring board assembly. The wiring board assembly includes a first wiring board having a first substrate, a non-pliable second substrate having a smaller mounting area than a mounting area of the first substrate and a base substrate laminated between the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090038837 - Multilayered printed circuit board and manufacturing method thereof: A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking... Agent: Staas & Halsey LLP

20090038838 - Circuit board and method for fabricating the same: A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be... Agent: Schmeiser Olsen & Watts

20090038839 - Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090038840 - Electromagnetic bandgap structure and printed curcuit board: Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates... Agent: Staas & Halsey LLP

20090038841 - Metal raceway system: The present invention is directed to a raceway system including a base, at least two covers, a device bracket and a faceplate. The base includes sidewalls having a top wall with a flange member. The covers include a top portion having two ends with a flange member at each end.... Agent: Panduit Corp.

20090038842 - Recessed electrical outlet box for concrete floors: An outlet box assembly for installation within a concrete floor, or any other type of poured flooring, includes a housing for accommodating a receptacle assembly with an electrical power and/or data receptacle as well as the wiring connected to the receptacle and the receptacle assembly has a self adjusting attachment... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20090038843 - Functional element-mounted module and a method for producing the same: A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of... Agent: Oliff & Berridge, PLC

20090038844 - Gangable electrical bracket: A ganged electrical device which supports electrical components. The ganged electrical device includes a housing having first and second opposed elongate side walls and a pair of end walls joining the side walls. The first and second side walls include cooperative attachment structure for attaching the first side wall of... Agent: Hoffmann & Baron, LLP

20090032284 - \"spider\" bracket: This design of the invention is for support electrical conduit and flexible tube,cable by One-hole strap or mini-strap at the Cable-tray, Junction-box,electrical panel or other electrical enclosures.... Agent: Weixiong Huo

20090032278 - Protective electrical wiring device with a center nightlight: The present invention is directed to a electrical wiring device that includes a housing having a plurality of line terminals and a plurality of load terminals, the plurality of load terminals including a plurality of receptacle terminals. A cover assembly is coupled to the housing. The cover assembly includes at... Agent: Bond, Schoeneck & King, PLLC

20090032279 - User-manipulated door mechanism for selectively covering an electrical socket: A user-manipulated door mechanism is mounted on the faceplate of an electronic module for allowing user access to an electrical socket disposed inboard of a faceplate aperture. An inwardly extending rectangular shoulder formed along one edge of the door is rotatably mounted about an axis inboard of the faceplate, and... Agent: Delphi Technologies, Inc.

20090032280 - Hinge for cable trough cover: A cable trough system includes a trough member including a base wall and first and second sidewalls extending from the base wall to form a trough. The system also includes a cover including a main body with a first end and a second end, and first and second hinge portions... Agent: Merchant & Gould PC

20090032281 - Conduit sleeve pass through for concrete construction: A conduit sleeve for a concrete pass through includes a tubular member having an inside diameter for receiving a cylindrical conduit at a forward end thereof. A flange is coupled to a rearward end of the tubular member. The flange is for coupling to a concrete form. A flexing structure... Agent: Patent Group 2n Jones Day

20090032282 - Cable strain relief module assembly: A cable strain relief module assembly for securing a cable and providing strain relief is described. The cable strain relief module assembly includes a module and a twist nut. The module has a male threaded portion and the twist nut has a female threaded portion. A portion of a cable... Agent: Panduit Corp.

20090032283 - Electric bushing and a method of manufacturing an electric bushing: A bushing for electrical current and/or voltage through a grounded plane. A substantially rotationally symmetrical insulating body surrounds a central electrical conductor. The bushing includes a sealing member for gas/liquid sealing between the conductor and the insulator body. The bushing includes a compressible sealing element, which forms a gas /liquid... Agent: Venable LLP

20090032288 - Connector and printed circuit board: A connector including a first pin and a second pin is disclosed. The first pin includes a first side including a first protrudent part. The second pin includes a second side facing the first side. The first protrudent part approaches the second side.... Agent: Birch Stewart Kolasch & Birch

20090032286 - Epoxy resin composition: An epoxy resin composition containing (A) an oxazolidone ring-containing epoxy resin, (B) a novolac-type epoxy resin, (C) a guanidine derivative, and (D) an imidazole as components, wherein the component (A) contains an isocyanuric ring as well as an oxazolidone ring and, the IR absorbance ratio of the isocyanuric ring to... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090032285 - Multi-layer circuit substrate manufacturing method and multi-layer circuit substrate: A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat... Agent: Ratnerprestia

20090032287 - Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal... Agent: Antonelli, Terry, Stout & Kraus, LLP

20090032289 - Circuit board having two or more planar sections: A single circuit board has at least two planar sections and a bent section linking the planar sections. The circuit board has a circuit layer disposed on an insulating layer to provide routings and electrical connections to the electronic components on the two planar sections. The circuit layer has at... Agent: Ware Fressola Van Der Sluys & Adolphson, LLP

20090032290 - Flexible printed circuit board base film, flexible laminates and flexible printed circuit boards including same: A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20090032292 - Printed circuit board reinforcement structure and integrated circuit package using the same: A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a... Agent: The Farrell Law Firm, P.C.

20090032291 - Spider clip for securing a circuit board within a communications module: A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip... Agent: Workman Nydegger 1000 Eagle Gate Tower

20090032294 - Circuit board: Provided is a circuit board including: a circuit board body with at least one surface having a plurality of electrically connecting pads; an insulating protection layer formed on the circuit board body and formed with an opening corresponding in position to one of the electrically connecting pads, being larger than... Agent: Schmeiser Olsen & Watts

20090032293 - Electroconductive bonding material and electric/electronic device using the same: A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening... Agent: Wenderoth, Lind & Ponack L.L.P.

20090032297 - component casing comprising a micro circuit: A component case comprising one or more micro circuits (6), where the micro circuit component is placed on a base, most suitably on a printed circuit board and said component is joined to the base with a known reversing circuit or thread bonding techniques and the base has elevations (5)... Agent: Stites & Harbison PLLC

20090032295 - Metal base circuit board, led, and led light source unit: A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090032296 - Method for manufacturing a contact arrangement between a microelectronic component and a carrier substrate as well as an assembly unit manufactured by this method: The invention relates to a method for manufacturing a contact arrangement (10) between a microelectronic component (11) and a carrier substrate (12) and to an assembly unit (24) manufactured by this method, whereby thermal energy required in the connecting areas is achieved by exposing the back of the component to... Agent: Quarles & Brady LLP

20090032298 - Substrate structure and electronic apparatus: A substrate structure 10 comprises a substrate 11, plural electronic components 12 mounted along one mounting surface 11A in the substrate 11, and a resin part 13 for making close contact with the mounting surface 11A of the substrate 11while each of the electronic components 12 is covered with a... Agent: Pearne & Gordon LLP

20090032299 - Suspension board with circuit: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide... Agent: Akerman Senterfitt

20090032300 - Method of and apparatus for providing an rf shield on an electronic component: A shielding assembly is configured to provide electromagnetic shielding and environmental protection to one or more electronic components coupled to a substrate. The shielding assembly includes a non-conductive mold compound layer, such as a dielectric epoxy. The mold compound layer is applied to a top surface of the substrate, thereby... Agent: Haverstock & Owens LLP