|Electricity: conductors and insulators patents - Monitor Patents|
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Electricity: conductors and insulators January recently filed with US Patent Office 01/09Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 01/29/2009 > patent applications in patent subcategories. recently filed with US Patent Office
20090025952 - Electric motor power connection assembly: An electric motor power connection assembly diverts heat from an electrical conductor that carries electrical current between a power source and an electric motor. The electrical conductor is characterized by an effective cross-sectional area perpendicular to the direction of current flow and a length in the direction of current flow... Agent: General Motors Corporation Legal Staff
20090025953 - Electrical box with movable mounting system: An electrical box is disclosed, wherein the electrical box includes a mounting system that facilitates a repositioning of the electrical box on a mounting structure without a complete removal of fastening devices from the mounting structure.... Agent: Fraser Clemens Martin & Miller LLC
20090025954 - Switchgear cabinet: A switchgear cabinet including covering parts and at least one cabinet door mounted on a cabinet carcass by hinges and having a door frame including two vertical profiled elements and two horizontal profiled elements as well as corner pieces joining the profiled elements. In order to simplify the structure and... Agent: Pauley Petersen & Erickson
20090025955 - Electrical fixture face plate and communication cover: An electrical fixture faceplate that has illumination functionality is disclosed. The faceplate may be associated with various electrical fixtures such as a receptacle or switch. The faceplate may be illuminated by a lighting device associated or incorporated with the faceplate. The lighting device may further comprise an LED, neon, chemiluminescent... Agent: Lewis And Roca LLP
20090025956 - Security or safety bus system: A bus system for an industrial guard has a support on which is supported a plurality of modules each having at its two ends respectively first and second parts of a multi-way connector, whereby one module may be electrically connected to another module already mounted on the support. Each module... Agent: Mr. Thomas M. Wozny Andrus, Sceales, Starke & Sawall, LLP
20090025978 - Non-halogenous insulated wire and a wiring harness: A non-halogenous insulated wire possessing sufficient flame retardancy and excellent heat resistance, wear resistance and flexibility, and a wiring harness including the wire. The wire includes a conductor, an inside coat of one or more layers and an outermost coat, wherein the outermost coat is in the range of 10... Agent: Oliff & Berridge, PLC
20090025957 - Extruded wire duct end cap: The present invention provides a wiring duct assembly including a duct base, a cover, and an end cap. The end cap is attached to the open end of the duct base with a friction fit to prevent any objects from accidentally entering the inside of the wiring duct. The cover... Agent: Hoffmann & Baron, LLP
20090025979 - Coupling structure of superconducting cable: A coupling structure of a superconducting cable is formed at an end portion of the superconducting cable having a superconducting layer and an outer peripheral layer formed thereon. The superconducting layer is coupled to a coupling member. A holding member 220 covers the superconducting layer between an end portion of... Agent: Foley And Lardner LLP Suite 500
20090025958 - Communication wire: The present invention relates to an improved isolated core or insulated conductor with a low dielectric constant and reduced materials costs. Apparatuses and methods of manufacturing the improved isolated core or insulated conductor are also disclosed.... Agent: Merchant & Gould PC
20090025959 - Edm wire: An EDM wire having an outer coating of gamma phase brass with an overlayer of continuous unalloyed zinc or ductile epsilon phase brass entrapping the gamma phase and a process for manufacturing the EDM wire is provided. A second process for synthesizing a ductile epsilon phase brass coating on the... Agent: John R. Hlavka Tarolli, Sundheim, Covell & Tummino, LLP
20090025960 - Cable-type composite printed wiring board, cable component, and electronic device: An embodiment of the present invention is provided with a first wiring board, a cable component juxtaposed with the first wiring board, and second wiring boards laminated onto the first wiring board, which have a second conductor layer pattern connected to the cable component and a second insulating substrate. The... Agent: Birch Stewart Kolasch & Birch
20090025961 - Electronic component-embedded board and method of manufacturing the same: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and... Agent: Oliff & Berridge, PLC
20090025962 - Electronic module expansion bridge: Taught herein is an electronic module expansion bridge (115). In an exemplary embodiment, the bridge (115) includes a flexible mounting plate (155). In contact with the mounting plate (155) is a conductive lead (160) with at least one first contact area (165) and at least one second contact area (170).... Agent: Meadwestvaco Corporation Attn:IPLegal (docket Administrator)
20090025965 - Assembly substrate and method of manufacturing the same: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped... Agent: Oliff & Berridge, PLC
20090025964 - Circuit substrate and method for fabricating inductive circuit: A circuit substrate including a laminated layer, an embedded electronic device, at least a circuit structure, and a solder mask layer is provided. The embedded electronic device is disposed within the laminated layer. The circuit structure is disposed on a surface of the laminated layer and is connected between a... Agent: J C Patents, Inc.
20090025963 - Wired circuit board and production method thereof: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component... Agent: Akerman Senterfitt
20090025966 - Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board: The present invention provides: a copper-clad laminate, facilitating the formation of highly reliable fine wires, in which copper foil has been formed firmly on a flat and smooth surface; a laminate; an electroless plating material; a fiber-resin composite; and a printed wiring board obtained with use of them. Further, the... Agent: Birch Stewart Kolasch & Birch
20090025969 - Dual cavity, high-heat dissipating printed wiring board assembly: Two panel-sized fully populated printed wiring board assemblies formed together, with an anisotropic epoxy that provides electrical connection for RF signals and DC supplies without the need for wirebonds, mechanical interconnects or solder balls.... Agent: Klein, O'neill & Singh, LLP
20090025967 - Methods for attachment and devices produced using the methods: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried... Agent: Lowrie, Lando & Anastasi, LLP
20090025968 - Wired circuit board and producing method thereof: A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a... Agent: Akerman Senterfitt
20090025971 - Electronic component-embedded board and method of manufacturing the same: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and... Agent: Oliff & Berridge, PLC
20090025970 - Multilayer wiring board, and electronic module and electronic device including the multilayer wiring board: A multilayer wiring board (1) of the present invention provided in a camera module has a sandwiched wiring layer (13) between opened wiring layers (11) having openings (12). The openings (12) formed in the opened wiring layers (11) form a through hole (12a) which penetrates the opened wiring layer (11)... Agent: Edwards Angell Palmer & Dodge LLP
20090025972 - Solder mounting structure, manufacturing method and apparatus of the solder mounting structure, electronic apparatus, and wiring board: A camera module structure (100) of the present invention is arranged such that a heat-sensitive camera module (2) is joined to a printed wiring board (1) through solder joint sections (3). The printed wiring board (1) has through holes (11) formed therein and terminals (12) formed thereon so as to... Agent: Edwards Angell Palmer & Dodge LLP
20090025973 - Electromagnetic screen: The device according to an exemplary embodiment of the present invention relates to an area of wireless communication and can be used for shielding from electromagnetic radiation. The electromagnetic screen with the big surface impedance contains a flat metal reflector substrate and two lattices of capacitor type that are shifted... Agent: H.c. Park & Associates, PLC
20090025974 - Shield box: A shield box is composed of metal-made upper box and lower box, which are combined with each other. The shield box houses therein a plurality of shield connectors interconnecting shield wires, and thereby electromagnetically shields entirety of the shield connectors and the shield wires. On an upper surface of a... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090025975 - Integrated junction box operable with gas valve: A junction box is operable with a gas valve and includes an enclosure having one or more mechanical coupling features arranged to interface with one or more mating features of the gas valve. An electrical terminal strip is disposed within the enclosure and a quick-disconnect electrical connector is disposed on... Agent: Honeywell International, Inc. Patent Services Group
20090025976 - Electric component: An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090025977 - Removable cable gland: A removable cable gland includes a two-piece fitting which may be laterally assembled over a cable, as opposed to a cable being fed through an opening in the fitting. A two-piece compression nut may also be laterally assembled over the cable. The two pieces of the compression nut are slid... Agent: Muncy, Geissler, Olds & Lowe, PLLC01/22/2009 > patent applications in patent subcategories. recently filed with US Patent Office
20090020304 - Subgrade vault with latching cover: A subgrade vault with a latching cover. The vault includes a peripheral wall with an open access port at the top. A peripheral ledge surrounds the access port. A cover to close the access port fits inside it, with a latch assembly inside it and a retractable latch pin disposed... Agent: Sheridan Ross Pc
20090020305 - Modular conduit-bridging ramp and couplings for electrical conduits: A modular assembly for bridging elongate conduits includes two ramps which define a conduit-receiving channel between them. A bridge member overlies each of the ramps, spanning the conduit-receiving channel. A link member joins the two ramps in side-by-side relationship. To allow the width of the conduit-receiving channel to be varied,... Agent: Leydig Voit & Mayer, Ltd
20090020306 - Adjustable plaster ring cover: A power distribution system has an electrical box configured to attach a power cable, a plaster ring releasably mounted to the box and one or more electrical devices installed into the ring. A pre-wired ground extends from a first end physically and electrically connected to a ground terminal on the... Agent: Knobbe Martens Olson & Bear LLP
20090020307 - Methods and apparatuses for a magnetic decorator wall cover plate with the option to record decorating choices: The invention provides methods and apparatuses for affixing a decorative cover over an existing switch plate by the use of magnets on the decorative that are positioned to attach to the screws used to hold the existing wall plate to the electrical fixture. The invention also discloses how to record... Agent: Peter O. Roach Jr
20090020308 - Illuminated electrical fixture face plate and safety cover: An electrical fixture faceplate that has illumination functionality is disclosed. The faceplate may be associated with various electrical fixtures such as a receptacle or switch. The faceplate may be illuminated by a lighting device associated or incorporated with the faceplate. The lighting device may further comprise an LED, neon, chemiluminescent... Agent: Lewis And Roca LLP
20090020331 - Power supply apparatus for long slide: The present invention provides a power supply apparatus for long slide without drooping or bending a wire harness when a sliding structure is moved. The problems are solved by utilizing a power supply apparatus 1 for long slide including: a case 2 for receiving a wire harness 3 folded in... Agent: Kratz, Quintos & Hanson, LLP
20090020332 - Interconnection structure for circuit boards and terminal members: An interconnection structure for circuit board and terminal members improves a configuration of a terminal member to be soldered to conductors on boards, and relaxes a stress applied to soldered portions, thereby preventing the soldered portions from a problem, such as cracking. An interconnection structure for circuit boards and terminal... Agent: Oliff & Berridge, Plc
20090020309 - Wire management cover and system: A wire management cover having a cover body configured to detachably engage a connector and having an opening configured to allow passage of one or more wires. The cover includes a wire management portion hingedly attached to the cover body. The wire management portion has a plurality of channels, each... Agent: Tyco Technology Resources
20090020310 - Thermal mass compensated dielectric foam support structures for coaxial cables and method of manufacture: Thermal mass compensated foam support structures for coaxial cables such as inner conductors and or inner conductor support structures. The foam support structures provided with an adhesive solid or high density foam polymer or blend layer to increase the thermal mass of the support structure enough to allow the foam... Agent: Babcock Ip, Pllc
20090020311 - Halogen-free flame retardant composition for cable covering material and cable for railway vehicles using the same: Disclosed are a composition for a cable-covering material used in railway vehicles, and a cable for railway vehicles using the same. The present invention provides the halogen-free flame retardant composition including 100 parts by weight of a base resin including ethylene-vinylacetate copolymers; 60 to 250 parts by weight of mixed... Agent: Stroock & Stroock & Lavan LLP
20090020312 - Portable electronic device with conducting pole: A portable electronic device (20) includes a circuit board (21) and at least one conducting pole (22). The conducting pole is mounted on the circuit board and includes a breakable portion (2224), the breakable portion is configured to be the part that breaks when the conducting pole is crumpled.... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang
20090020315 - Automated direct emulsion process for making printed circuits and multilayer printed circuits: A method for making multilayer printed circuits includes a) coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, b) imaging the coated substrate with a circuit design, c) developing the imaged substrate, d) directly plating the developed image onto the coated substrate, e)... Agent: Snell & Wilmer L.l.p. (main)
20090020313 - Circuit logic embedded within ic protective layer: A system comprising a first layer comprising one or more metal sub-layers and a protective overcoat (PO) layer adjacent to the first layer. The PO layer is adapted to protect the first layer, and a circuit logic is at least partially embedded within the PO layer. The circuit logic couples... Agent: Texas Instruments Incorporated
20090020314 - Direct emulsion process for making printed circuits: A direct emulsion process for making printed circuits and printed circuit boards which includes coating a non-metallized substrate with a solution which creates a light sensitive surface on the substrate, imaging the coated substrate with a circuit design, developing the imaged substrate, and directly plating the developed image onto the... Agent: Snell & Wilmer L.l.p. (main)
20090020316 - Method of manufacturing chip on film and structure thereof: A method of manufacturing a chip on film (COF) is provided, including: providing a flexible circuit board; and forming a plurality of leads on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um and a cross-section shape is substantially rectangular. A COF structure, having... Agent: North America Intellectual Property Corporation
20090020318 - Circuit board, and semiconductor device: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary... Agent: Hamre, Schumann, Mueller & Larson P.c.
20090020317 - Wiring board and method of manufacturing wiring board: A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.
20090020320 - Gold finger of circuit board and fabricating method thereof: A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality of gold finger bodies and... Agent: Jianq Chyun Intellectual Property Office
20090020319 - Multilayer printed circuit board: A multilayer printed circuit board is characterized in that circuit boards 1 and 2 and a circuit board 3 are laminated alternately to form a multilayer body using a simultaneous lamination method, the circuit boards 1 and 2 including a film-, thin plate-, or sheet-like insulating substrate 11 made of... Agent: Darby & Darby P.c.
20090020321 - Metal-ceramic substrate: In the case of a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material which includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic and to which the metallization is applied by active soldering before patterning,... Agent: Hoffman Wasson & Gitler, P.c Crystal Center 2, Suite 522
20090020323 - Circuit board structure and method for fabricating the same: A circuit board structure and a method for fabricating the same are disclosed, including providing a core board having conductive traces and solder pads respectively formed thereon, wherein width of the solder pads corresponds to that of the conductive traces, and pitch between adjacent solder pads is made wide enough... Agent: Edwards Angell Palmer & Dodge LLP
20090020322 - Packaging substrate with conductive structure: A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly... Agent: Schmeiser Olsen & Watts
20090020324 - Wired circuit board: A wired circuit board comprises a metal supporting board, a metal foil formed on the metal supporting board, a first protecting layer formed on the surface of the metal foil, the first protecting layer is made of tin or a tin alloy, a first insulating layer formed on the metal... Agent: Akerman Senterfitt
20090020325 - Weldable contact and method for the production thereof: A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the... Agent: Fish & Richardson Pc
20090020326 - Wiring board and method of manufacturing wiring board: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.
20090020327 - Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus: A wiring unit includes a first insulating layer which is provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer; a second insulating layer which is formed on the one surface of the first insulating layer and which covers the... Agent: Eugene Ledonne, Esq. Reed Smith LLP
20090020328 - Hybrid antenna structure: An electrical component is provided that provides at least a two shot injection molding structure. One of the at least two shots of plastic comprises a laser direct structuring material. Another of the at least two shots of plastic comprises a non-platable plastic. The laser direct structuring material is selectively... Agent: Holland & Hart, LLP
20090020329 - Systems and methods for providing a utility line protection plate: Embodiments of the invention are directed to systems and methods for providing a utility line protection plate. In one embodiment of the invention, a system for providing a utility line protection plate can include at least two plate portions configured to resist impact of a penetrating object. The system can... Agent: Sutherland Asbill & Brennan LLP
20090020330 - Electronic apparatus mountable on rack: An electronic apparatus is mountable in either of a standard mount state in a rack, or an offset mount state which offsets forward from the standard mount state in a depth direction of the rack. A pair of side boards extend rearward from a front panel in the depth direction,... Agent: Rossi, Kimms & Mcdowell LLP.01/15/2009 > patent applications in patent subcategories. recently filed with US Patent Office
20090014208 - Hinged bushing suspension clamp and method for using said clamp: A clamp with a first clamp halve with a hinge portion and a first opening for a fastener; a second clamp halve, with a hinge portion and a first opening for a fastener; a cable opening; and a hinge device for connecting the two hinge portions. The clamp may also... Agent: Sughrue Mion, PLLC
20090014196 - Recessed electrical outlet box for floors: An outlet box assembly for installation within a wood, tile or carpeted floor, or any other type of flooring, includes a housing for accommodating an electrical power and/or data receptacle as well as the wiring connected to the receptacle and an adjustment mechanism attached to an outer surface of the... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.
20090014197 - Paintable wall plate covering assembly and method: Disclosed embodiments relate to a wall plate assembly, such as for light switches and electrical outlets, that may be painted to coordinate with the color of a room's walls, trim, or décor. The wall plate assembly comprises a transparent outer or cover plate and a concealed backing plate. A reverse... Agent: Roberts, Mardula & Wertheim, LLC
20090014212 - Micro encapsulation seal for coaxial cable connectors and method of use thereof: A coaxial cable connector comprising a connector body, a tubular inner post configured to receive a coaxial cable and a clamping member, whereby at least one surface of the coaxial cable connector is coated with microcapsules creating an adhesive material. An adhesive layer is pre-applied to defined components of the... Agent: Ppc, A Divisionof John Mezzalingua Assc., Inc.
20090014198 - Corrugated tube with a locking structure: A corrugated tube has a slit (13) and first closing walls (14A) of circumferentially extending annular projections (12) are formed along the slit (13). Lock projections (16) dimensioned to be fitted inside the annular projections (12) are provided between the first closing walls (14A) and second closing walls (15A). The... Agent: Casella & Hespos
20090014199 - Insulated non-halogenated heavy metal free vehicular cable: Described is an insulated non-halogenated, heavy metal free vehicular cable comprising an inner core of a copper based metal wire having a cross sectional area of between about 0.05 mm2 and about 0.13 mm2, and an outer insulation, covering the length of the inner core, comprised of a thermoplastic polyphenylene... Agent: Delphi Technologies, Inc.
20090014200 - Spiral stripping electrical wire and extrusion device for same: An extrusion device for making spiral stripping electrical wires is disclosed to include a fixed mold member, which has a main flow path and a supplementary flow path for the passing of a first insulative material and a second insulative material, and a rotating mold member, which is rotatably supported... Agent: Pro-techtor International Services
20090014202 - Data cable with cross-twist cabled core profile: Cables including a plurality of twisted pairs of insulated conductors, a separator disposed among the plurality of twisted pairs so as to physically separate a first twisted pair from a second twisted pair, and a jacket surrounding the plurality of twisted pairs and the separator. The jacket may include a... Agent: Lowrie, Lando & Anastasi, LLP
20090014201 - Non-halogenated heavy metal free vehicular cable insulation and harness covering material: Described is a vehicular harness comprising a plurality of insulated non-halogenated, heavy metal free vehicular cables, each comprising an inner core of a copper based metal wire having a thickness area of at least about 0.1 mm, an outer insulation, covering the length of the inner core, comprised of a... Agent: Delphi Technologies, Inc.
20090014203 - Vehicle grommet: A grommet is attached between a body panel and a trunk lid at a location spaced from a hinge structure that movably supports the trunk lid. The grommet forms a wiring passageway between an opening in the body panel and an opening in the trunk lid. The grommet includes a... Agent: GlobalIPCounselors, LLP
20090014204 - Flexible printed circuit board: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang
20090014205 - Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same: A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another,... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090014206 - Printed wiring board and electronic apparatus including same: A printed wiring board, which may be included in an electronic apparatus, includes a pair of signal pads including a first signal pad and a second signal pad formed on a front side thereof and configured to transmit differential signals, a ground pad formed at a position in proximity to... Agent: Cooper & Dunham, LLP
20090014207 - Wiring board and method of manufacturing the same: A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090014209 - Cable support bracket: A cable support bracket which includes a backplate with a front surface and an opposed rear surface, and a first end and a second end opposed to the first end. At least one cable constraint is connected to the front surface, and each the cable constraint includes a post extending... Agent: Quarles & Brady LLP
20090014210 - Electrical cable support bracket: A cable support bracket includes a backplate with a number of structures extending transversely therefrom and defining a plurality of cable restraints and slots. The cable restraints have a series of projections formed on the transversely extending structures. Each cable restraint has a series of projections aligned so as to... Agent: Quarles & Brady LLP
20090014211 - High-voltage bushing: A high-voltage bushing has a conductor and a core surrounding the conductor, wherein the core comprises a sheet-like spacer, which spacer is impregnated with an electrically insulating matrix material. The spacer is wound in spiral form around an axis, the axis being defined through the shape of the conductor. Thus,... Agent: Buchanan, Ingersoll & Rooney PC01/08/2009 > patent applications in patent subcategories. recently filed with US Patent Office
20090008126 - Cable joint: A cable joint and a method of assembling a cable joint include at least two cables having inner conducting elements secured to each other at a point of connection. At least one of the cables is a paper-insulated lead cable including paper insulation impregnated with oil. A deformable elastomeric sleeve... Agent: Barley Snyder, LLC
20090008119 - Explosion proof enclosure: A method and apparatus for providing an explosion proof enclosure by providing expandable or extendible enclosure wall, side, top, or bottom sections which allow the explosion to be contained internally without the enclosure erupting or the enclosure bursting.... Agent: Tarolli, Sundheim, Covell & Tummino L.L.P.
20090008120 - Junction device for electrical enclosure: A junction device includes a junction device main portion configured for attachment to an electrical enclosure and a modular device portion electrically coupled to the junction device main portion and configured for electrical coupling to an inner junction of the electrical enclosure. At least one conductive pass-through electrically couples the... Agent: Dicke, Billig & Czaja
20090008121 - Electrical box for concrete walls: An electrical outlet box for accommodating an electrical fixture which includes a generally rectangular box having a back wall, a perimetrical side wall surrounding said back wall defining an open front face and a box interior, said side wall includes a first and second set of generally parallel spaced apart... Agent: Hoffmann & Baron, LLP
20090008122 - Electrical junction box to be mounted on motor vehicle: An electrical junction box for a motor vehicle is configured to prevent loss of a fuse that falls down during maintenance. Fuse-containing sections are provided on a vertical surface of a casing of an electrical junction box. The fuse-containing sections are opposed to a trim cover provided with an opening... Agent: Oliff & Berridge, PLC
20090008123 - Protective electrical outlet cover having integrated positive locking mechanism: A safety device for electrical outlets includes a body having prongs rigidly attached to the body which can be inserted into the openings of a standard electrical outlet, wherein one or more of the prongs define a spring-biased portion defining a barb for engaging the rear surface of the outlet... Agent: Fox Rothschild, LLP Pittsburgh
20090008149 - Method and device for splicing electric cables: The present invention relates to a method as well as to a joint assembly (12) for splicing a first and a second eclectic cable (1, 2) by means of a tubular elastic sleeve (15) at a splicing zone (11) between such cables (1, 2), said tubular sleeve (15) being supported... Agent: Norris Mclaughlin & Marcus, P.A.
20090008124 - Multilayer structure, and electrode for electrical circuit using the same: A multilayer structure including a transparent conductive thin film and a molybdenum metal thin film, the transparent conductive thin film having a thickness of 35 nm or less.... Agent: Millen, White, Zelano & Branigan, P.C.
20090008125 - Insulating control device and method for vehicle proximity remote: A system and method for controlling the radio frequency emissions of a proximity remote keyless system for permitting or denying remote access to premises of a vehicle. The source power is controlled to thereby control when the vehicle is authorized to start. The proximity remote can thus be left in... Agent: Goudreau Gage Dubuc
20090008127 - Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board: Means for solving problems: A phosphorous compound comprising 1.8 or more but less than 3 phenolic hydroxyl groups on an average and 0.8 or more phosphorous atom on an average within a molecule is reacted in advance with a particular bifunctional epoxy resin (selected from biphenyl, naphthalene, dicylcopentadiene or other... Agent: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
20090008129 - Cooling of substrate using interposer channels: A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1≦M≦N). Each loop... Agent: Schmeiser, Olsen & Watts
20090008130 - Cooling of substrate using interposer channels: A structure. The structure includes an interposer adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The... Agent: Schmeiser, Olsen & Watts
20090008128 - Electronic apparatus: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are... Agent: Antonelli, Terry, Stout & Kraus, LLP
20090008131 - Flexible printed-circuit board: A flexible printed board that is adapted to high-speed transmission and can mount a plurality of connectors at low cost is provided. The board comprises a flexible printed board body 100 that has a first side 100a and a second side 100b opposed to each other, and an overlap portion... Agent: Wenderoth, Lind & Ponack L.L.P.
20090008132 - Flexible wiring board for tape carrier package: A flexible wiring board for a tape carrier package with reduced tackiness and a tape carrier package formed by using the flexible wiring board is disclosed. The flexible wiring board for a tape carrier package has an insulating film 1, a wiring pattern 3 formed on a surface of the... Agent: Knobbe Martens Olson & Bear LLP
20090008135 - Circuit substrate: A surface treatment process for a substrate is provided. There are a plurality of first conductive patterns on a top surface of the substrate and a plurality of second conductive patterns on a bottom surface of the substrate and a plurality of inner circuits electrically connected with the first conductive... Agent: Jianq Chyun Intellectual Property Office
20090008134 - Module: A module includes a first multilayer wiring board, a second multilayer wiring board having an upper surface facing a lower surface of the first multilayer wiring board, a component mounted on an upper surface of the first multilayer wiring board, a first terminal electrode provided on the lower surface of... Agent: Mcdermott Will & Emery LLP
20090008136 - Multilayered printed circuit board and fabricating method thereof: A multilayered printed circuit board and a method of fabricating the printed circuit board are disclosed. The method of fabricating the multilayered printed circuit board can include: providing a core substrate, which has an outer circuit, and which has a thermal expansion coefficient of 10 to 20 ppm/° C. at... Agent: Staas & Halsey LLP
20090008133 - Patterned circuits and method for making same: Provided are patterned circuits with accurately aligned raised features. Also provided are methods for making the circuits using photoresist-on-photoresist patterning.... Agent: 3m Innovative Properties Company
20090008137 - Wired circuit board and producing method thererof: A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover... Agent: Akerman Senterfitt
20090008138 - Thermosetting resin composition and uses thereof: The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and... Agent: Sughrue Mion, PLLC
20090008141 - Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where... Agent: Antonelli, Terry, Stout & Kraus, LLP
20090008140 - Electronic assemblies without solder and methods for their manufacture: An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with IPO leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with... Agent: The Tpl Group
20090008139 - Multilayer pwb and a method for producing the multilayer pwb: A multilayered printed wiring board, a multilayer PWB, and a method for manufacturing the same. The multilayer PWB comprises a first main surface and an opposing second main surface, where the multilayer PWB has a height being defined by the distance from the first main surface to the opposing second... Agent: Warren A. Sklar (soer) Renner, Otto, Boisselle & Sklar, LLP
20090008142 - Porous film and multilayer assembly using the same: A 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer of the multilayer assembly and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf to give... Agent: Birch Stewart Kolasch & Birch
20090008143 - Board having buried patterns and manufacturing method thereof: A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern,... Agent: Staas & Halsey LLP
20090008144 - Slanted vias for electrical circuits on circuit boards and other substrates: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to... Agent: Perkins Coie LLP Patent-sea
20090008145 - Embedded circuit structure and fabricating process of the same: A fabricating process for an embedded circuit structure is provided. A through hole is formed in a core panel and penetrates the core panel. Two indent patterns are respectively formed on two opposite surfaces of the core panel. A conductive material is electroplated into the through hole and the indent... Agent: J C Patents, Inc.
20090008146 - Optimizing in-building wireless signal propagation while ensuring data network security: A shield capable of attenuating wireless signals on demand has been created using a conductive member, such as a metal mesh or perforated metal sheet, which is either coupled to ground or subjected to an electron flow. A metal enshrouded signal isolation chamber was built and a wireless router was... Agent: John M. Olivo Armstrong World Industries, Inc.
20090008147 - Electrically conductive dynamic environmental seal: A seal including a base and a conductor mounted to conduct current from a source disposed on a first side of said base to a sink disposed on a second side of said base. In the illustrative embodiment, the base is annular (ring-shaped) and fabricated of airtight, watertight and/or electrically... Agent: Raytheon Company Intellectual Property & Licensing
20090008148 - Inductor built-in wiring board having shield function: There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at... Agent: Rankin, Hill & Clark LLP01/01/2009 > patent applications in patent subcategories. recently filed with US Patent Office
20090000802 - Device to attenuate atmospheric discharges: The invention of the present application provides a device that comprises an assembly of a toroid and a rod with one or several pointed ends; and a filter system; wherein, around the pointed end or the pointed ends of the rod, an electrical field is formed with air ionization, wherein... Agent: John J. Martinez Md. Jd.
20090000803 - Synthetic material end for a dc electric cable: The invention relates to a synthetic material end for a DC electric cable. In the invention, the synthetic material end includes a composite insert that is placed between the inner insulator and the outer insulating sleeve of the cable, the insert generally being in the form of a sheath surrounding... Agent: Sofer & Haroun LLP.
20090000804 - Transmission cable: A transmission cable is provided and includes multiple signal lines formed on one side of an insulation layer 1 and a ground line between the signal lines. The ground line is electrically connected to a shield layer formed on a back surface side of the insulation layer and to a... Agent: Bell, Boyd & Lloyd, LLP
20090000805 - Barrier system for the line bushing of an electrical installation: A barrier system for a line leadthrough in an electric installation has mutually adjacent wall elements forming barriers that extend in an axial longitudinal direction and are spaced apart from each other, forming channels. The wall elements lie partially on a support, at least at their lower ends. The wall... Agent: Lerner Greenberg Stemer LLP
20090000806 - High voltage bushing and high voltage device comprising such bushing: A high voltage bushing for a high voltage device containing insulating liquid includes a voltage grading shield, improving performance and facilitating manufacturing.... Agent: Venable LLP
20090000807 - Connecting structure and adhesion method of pcb using anisotropic conductive film, and method for evaluating connecting condition using the same: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of... Agent: Stroock & Stroock & Lavan LLP
20090000808 - Flexible printed circuit board and method of fabricating the same: Flexible printed circuit board and a method for fabricating the same are introduced. The circuit board of the flexible printed circuit board is mainly made up of a PI substrate having a circuit layer, and a polyimide layer press-bonded onto the PI substrate by using an adhesive layer. In order... Agent: Lin & Associates Intellectual Property, Inc.
20090000809 - Flexible substrate: According to an aspect of an embodiment, a flexible circuit board for connecting a first device and a second device, the flexible circuit board comprises: a base material comprising a flexible material having a first end adapted to connect with the first apparatus, a second end adapted to connect with... Agent: Staas & Halsey LLP
20090000810 - Printed circuit board: According to one embodiment, there is provided a printed wiring board includes a mounting surface for mounting an electronic component, a first component mounted on the mounting surface, an index portion provided on the mounting surface for defining a mounting position Pa of a second component being mounted on the... Agent: Blakely Sokoloff Taylor & Zafman LLP
20090000811 - Chip resistor and method for fabricating the same: A chip resistor and method for fabricating the same are disclosed according to the present invention, wherein a thermic welding layer is applied to bond together a substrate and a resistor in face-to-face orientation, and a passivation layer is applied to partially cover the resistor, such that it consequently divides... Agent: Muncy, Geissler, Olds & Lowe, PLLC
20090000812 - Multilayer printed wiring board: A multilayer printed wiring board includes a core substrate and a built-up wiring layer formed by alternately layering conductor circuits and insulating resin layers. The built-up wiring layer includes a first surface provided in contact with the core substrate and a second surface opposing the first surface and including a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090000813 - Packaging substrate structure and manufacturing method thereof: A packaging substrate structure includes a dielectric layer with a plurality of dielectric pillars disposed on a portion of a large-dimension opening area of the dielectric layer; and a first circuit layer with a plurality of first circuits disposed on a portion of the dielectric layer, and a conductive block... Agent: Schmeiser Olsen & Watts
20090000814 - Multiple layer printed circuit board having misregistration testing pattern: A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the... Agent: Faegre & Benson, LLP 32469
20090000815 - Conformal shielding employing segment buildup: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is... Agent: Withrow & Terranova, P.l.l.c.
20090000816 - Conformal shielding process using flush structures: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is... Agent: Withrow & Terranova, P.l.l.c.
20090000817 - Current conductor for an electrical device, especially bus bar conductor for an electrical medium voltage installation: A current conductor for an electrical device including an electrically conducting central section having a first side and a second side. The central section is configured to receive at least one inserted electrical component. Two electrical conducting shield sections are each disposed on one of the first side and the... Agent: Darby & Darby P.C.
20090000818 - Perforated emi gaskets and related methods: According to various aspects, exemplary embodiments are provided of EMI shields, such as EMI gaskets. One exemplary embodiment includes a gasket that is deflectable into a collapsed orientation between first and second surfaces. The gasket may have a body of indefinite length and a base with a generally flat outer... Agent: Harness, Dickey, & Pierce, P.l.c
20090000819 - Electromagnetic interference shielded panel and method of manufacture: An electromagnetic interference shielded panel and method of manufacture. The panel includes one or more frame members having a rib adapted to provide sacrificial material when a first skin member is welded to the frame member. The first skin member is welded to the frame members of a frame assembly... Agent: Barnes & Thornburg LLP
20090000820 - Lightning resistive and manufacture procedure: A lightning resistive bush body includes a cylindrical bush body body. The bush body is composed of an inner insulative layer, a center electric-magnetic absorbing metal layer and an outer insulative layer, wherein the inner insulative layer, the center electric-magnetic absorbing metal layer and the outer insulative layer is integrated,... Agent: Lianjun Li
20090000821 - Cord protector for power tools: A power tool having a housing, a motor disposed in the housing, a power cord connected to the motor, and a cord protector operably engaging the power cord. The cord protector comprising a spring member coupled to the housing on a first end and engaging the power cord on a... Agent: Harness Dickey & Pierce, P.L.CPrevious industry: Tool driving or impacting
Next industry: Boring or penetrating the earth
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