Electricity: conductors and insulators inventions 12/08

20080314617 - Cable joint: A joint for a paper-insulated lead covered cable (PILC) including paper insulation impregnated with oil, the joint comprising a first PILC and a retaining jacket having a hollow interior, the first PILC having an inner conducting element that is conductively secured to an inner conducting element of a further cable... Agent: Barley Snyder, LLC

20080314611 - System and method of grounding fiber storage trays: An optical fiber cable management panel includes drawer assemblies, each including a drawer slidable within a chassis. The chassis incorporates a grounding point, and the drawer assemblies are electrically connected to the grounding point by a grounding strap. The grounding strap flexes to allow the slidable movement of the drawer... Agent: Merchant & Gould PC

20080314612 - Conductor of electric cable for wiring, electric cable for wiring, and methods of producing them: A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to... Agent: Birch Stewart Kolasch & Birch

20080314613 - Signal transmission cable and multi-wire cable: An insulating layer 3 mainly composed of a fluorine resin is provided at an outer periphery of an inner conductor 2 to provide an inner insulated wire 4. A skin layer 5 mainly composed of a fluorine resin and doped with titanium oxide and carbon black or the titanium oxide... Agent: Mcginn Intellectual Property Law Group, PLLC

20080314614 - Mirrored arc conducting pair: A mirrored arc geometrical arrangement of two conductors configured to perform similar functions as a traditional twisted pair of wires is presented. The mirrored arc conductor pair occupies the same physical space required by prior art twisted pair cable designs. Each conductor pair includes two inward-facing arc shaped conductors placed... Agent: The Hecker Law Group

20080314615 - Acoustically transparent stranded cable: A cable having universal applications for transmitting any kind of electrical signal, including AC and DC power, for sensitive test instruments cables and, particularly, for conducting audio, video and digital signals through a stranded metal wire conductor can consist of virtually any configuration, or randomly—no configuration. The cable can be... Agent: Glenn Patent Group

20080314616 - High pressure, high voltage penetrator assembly for subsea use: The invention relates to a high pressure, high voltage penetrator assembly for subsea use, wherein the assembly is upright attachable to a wet gas, subsea gas compressor, and wherein the assembly comprises a penetrator unit for feed-through of electric power to a compressor motor; a funnel shaped housing with a... Agent: Rodman Rodman

20080314619 - Conductive paste, printed circuit board, and manufacturing method thereof: A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times,... Agent: Staas & Halsey LLP

20080314620 - Skew compensation by changing ground parasitic for traces: According to embodiments, small holes or openings may be cut on or through the ground plane(s) adjacent to a selected trace line, so that C and L will be changed accordingly. Then phase velocity will also be changed. As a result, the flying time from one location or point to... Agent: Intel/bstz Blakely Sokoloff Taylor & Zafman LLP

20080314618 - Solution, component for plating, insulating sheet, laminate, and printed circuit board: It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface... Agent: Birch Stewart Kolasch & Birch

20080314621 - Parallel chip embedded printed circuit board and manufacturing method thereof: A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper... Agent: Staas & Halsey LLP

20080314624 - Component adapted for being mounted on a substrate and a method of mounting a surface mounted device: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting... Agent: Philips Intellectual Property & Standards

20080314626 - Electroded sheet (esheet) products: A sheet in an electronic display is composed of a substrate containing an array of wire electrodes. The wire electrodes are preferably electrically connected to patterned transparent conductive electrode lines. The wire electrodes are used to carry the bulk of the current. The wire electrodes are capable of being extended... Agent: Brown & Michaels, PC 400 M & T Bank Building

20080314622 - Method of fabricating board having high density core layer and structure thereof: Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making... Agent: Lin & Associates Intellectual Property, Inc.

20080314623 - Printed circuit board and method for manufacturing the same: Also this invention relates to a method for manufacturing a printed circuit board comprising a step of forming a photo-resist layer on a non-conductive porous sheet or foil; a step of forming a circuit pattern in the photo-resist layer by exposing and developing; a step of plating the circuit pattern... Agent: Floyd B Carothers Carothers And Carothers

20080314625 - Printed circuit board and method of manufacturing the same: The present invention relates to a method of manufacturing a printed circuit board and to a printed circuit board, the method comprising the steps of: preliminarily forming a plurality of test pattern layers 3 and 4 for detecting the depth of an inner layer in a multilayer printed circuit board... Agent: Crowell & Moring LLP Intellectual Property Group

20080314627 - Electronic component and method for manufacturing the same: There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely... Agent: Dickstein Shapiro LLP

20080314628 - Method of forming metal pattern, patterned metal structure, and thin film transistor-liquid crystal displays using the same: Disclosed is a method of forming a metal pattern, the method comprising depositing a dielectric substrate on a supporting substrate; forming a latent mask pattern of a metal pattern on the dielectric substrate; etching the dielectric substrate exposed by the latent mask pattern; forming a seed layer on the supporting... Agent: Cantor Colburn, LLP

20080314629 - Multi-layer substrate and manufacturing method thereof: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with... Agent: Kirton And Mcconkie

20080314630 - Electromagnetic bandgap structure and printed circuit board: An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second... Agent: Staas & Halsey LLP

20080314631 - Novel via structure for improving signal integrity: The embodiment of the invention is about a novel via structure which can be incorporated into printed circuit boards, integrated circuit packages, and integrated circuits in order to reduce crosstalk, to improve signal integrity and to achieve EM emission compliance. A 4-layer (2 signal layers and 2 power layers or... Agent: Sinorica, LLC

20080314632 - Multilayered printed wiring board: A multilayered printed wiring board has a core substrate having a through hole opening with a radius R, a through hole structure formed at the through hole opening and including a lid-shaped conductive structure, a first interlaminar resin insulation layer formed over the core substrate and having a first via... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080314634 - Electromagnetic bandgap structure and printed circuit board: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer,... Agent: Staas & Halsey LLP

20080314633 - Printed circuit board: A printed circuit board, which increases the contact area between an IC and a printed circuit board, thus increasing the degree of adhesion, is disclosed. The printed circuit board includes: an insulation layer which includes a first circuit pattern, including at least one via land, embedded in the upper surface... Agent: Staas & Halsey LLP

20080314635 - Printed circuit board having electromagnetic bandgap structure: A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer,... Agent: Staas & Halsey LLP

20080314636 - Multi-layer shielded wire: A multilayer shielded wire includes an inner conductor, a first conductor which covers the inner conductor through a first insulating layer, and a second conductor which covers the first conductor through a second insulating layer. A predetermined interlayer distance between the first conductor and the second conductor are set. A... Agent: Sughrue-265550

20080314637 - Cable bushing device: To improve a cable bushing device of this nature such that the assembly is simplified while retaining all the positive properties with regard to explosion and/or flame-proof protection and at the same time wider tolerances are possible in the manufacture of the housing bore, the fixing device has on the... Agent: Fish & Richardson P.C.

20080308288 - Utility pole grounding plate: A utility pole grounding plate including a main section and a plurality of flaps. The main section has a general plate shape adapted to be connected around an outer curved surface of a utility pole. The flaps extend outward from an exterior side of the main section. The flaps are... Agent: Harrington & Smith, PC

20080308289 - Cable for high speed data communications: A cable for high speed data communications and method of manufacturing the cable, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer, the inner conductors and the dielectric layers twisted in a rotational direction at... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP

20080308290 - Switch box extender grounding strap: An electrical box extender with a grounding strap which includes an extender having a perimeter wall section and an integral bendable grounding strap connected to the wall section, wherein the grounding strap extends from the wall section and has a remote end that includes a spade or lug connector for... Agent: Hoffmann & Baron, LLP

20080308291 - Safety filler plug for recessed electrical contacts: A safety filler plug for recessed electrical contacts is provided. The plug includes a pair of spaced apart generally rectangular arm members including a first stationary arm member and a second tab arm member. The first arm member and the second arm member each have an insertion end, an extension... Agent: Thomas R Shaffer Glassmire & Shaffer Law Offices, P.C.

20080308292 - U-turn bus bar: A U-turn bus bar comprises a body portion constituting a linear essential part formed of a conductive plate member, having an overall thickness (t) and an overall width (2b); at least a terminal portion expanded in the direction perpendicular to the longitudinal direction of the body portion; and a connection... Agent: Oliff & Berridge, PLC

20080308293 - Cable for high speed data communications: A cable for high speed data communications and methods for manufacturing such cable are disclosed, the cable including a first inner conductor enclosed by a first dielectric layer and a second inner conductor enclosed by a second dielectric layer. The cable also includes conductive shield material wrapped in a rotational... Agent: Ibm (rps-blf) C/o Biggers & Ohanian, LLP

20080308294 - Swizzled twisted pair cable for simultaneous skew and crosstalk minimization: A novel varied twist-rate wire pair and cable architecture are disclosed. The invention implements variable twist rate along twisted wire pair length, providing approximately equivalent physical and electrical length values for segments of such twisted wire pair, and consequently, low delay skew, and substantially minimized inter-pair crosstalk due to reduction... Agent: Rajendran Nair, Comlsi Inc.

20080308295 - Conductive tape and method for making the same: The present invention relates to a conductive tape. The conductive tape includes a adhesive layer and a plurality of carbon nanotubes. The adhesive layer has a first surface and an opposite second surface. The carbon nanotubes are substantially embedded in parallel in the adhesive layer and perpendicular to the first... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080308296 - Polyolefin composition for use as an insulating material: The invention relates to a polymer composition, comprising (a) a polyolefin base resin which comprises at least (a1) a first olefin homo- or copolymer fraction, and (a2) a second olefin homo- or copolymer fraction, wherein the weight average molecular weight of the first fraction is lower than the weight average... Agent: Roberts Mlotkowski Safran & Cole, P.C. Intellectual Property Department

20080308297 - Ubm pad, solder contact and methods for creating a solder joint: A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with... Agent: Glenn Patent Group

20080308298 - Electrical switching device, in particular high-voltage circuit breaker, with a housing: An electric switchgear has a housing which surrounds an interrupter unit. Post insulators are provided so as to support the interrupter unit in an insulated manner. The post insulators are fitted with a capacitive coating which homogenizes the voltage distribution along the post insulators. Additionally, the capacitive coatings can be... Agent: Lerner Greenberg Stemer LLP

20080308299 - Connection apparatus: A connection apparatus (1) is provided. The apparatus has: a body (7); at least two connectors (6a, 6b); and an interconnection element (16). The wire connectors (6a, 6b) connect wires to the apparatus (1) and provide a conductive connection of the wires to an interconnection element (16).... Agent: Kremblas, Foster, Phillips & Pollick

20080308300 - Method of manufacturing electrically conductive strips: A silver layer (24) is sandwiched between a tin layer (20) and a tin top coat (28) on an electrically-conductive substrate (14) which may comprise copper. The substrate having the three discrete metal layers thereon is heated to a temperature of at least about 220° C., preferably from about 220°... Agent: Cantor Colburn, LLP

20080308301 - Photocurable and thermosetting resin composition, cured product thereof, and printed circuit board: The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A),... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080308302 - Printed circuit board with anti-oxidation layer: An anti-oxidant printed circuit board includes at least one layer of insulative base board, some circuits on the base board, at least one electric pad and a notch. The electric pad includes an upper surface plated with at least one layer of anti-oxidant metal foil, a lower surface attached to... Agent: Wei Te Chung Foxconn International, Inc.

20080308303 - Chip carrier substrate and production method therefor: Method for producing a macroporous silicon substrate suitable as a carrier for microelectronic components. Blind holes are produced from a front surface of the substrate. An insulator layer is produced on the front and rear surfaces of the substrate. Selective isotropic etching is performed from the rear surface with uncovering... Agent: Dickstein Shapiro LLP

20080308304 - Multilayer wiring board and its manufacturing method: A multilayer wiring board employs a thin insulating substrate having substantially only resin flow as the compression property effect, and has an any-layer IVH structure where at least one core layer is formed without burying wiring. For sufficiently securing an effective compression amount of the crush-allowance of a conductor, the... Agent: Wenderoth, Lind & Ponack L.L.P.

20080308306 - Shifted segment layout for differential signal traces to mitigate bundle weave effect: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first... Agent: Buckley, Maschoff & Talwalkar LLC

20080308305 - Wiring substrate with reinforcing member: A wiring substrate with a reinforcing member includes: a resin wiring substrate having a substrate principal surface, a substrate rear surface, and substrate side surfaces, forming a rectangular shape having four sides in plan view, and including a resin insulating layer and a conductor layer; and a reinforcing member formed... Agent: Sughrue-265550

20080308308 - Method of manufacturing wiring board, method of manufacturing semiconductor device and wiring board: A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are laminated and insulating layers are laminated... Agent: Rankin, Hill & Clark LLP

20080308307 - Trace structure and method for fabricating the same: A trace structure with a particular profile to eliminate stress concentration and the fabricating method thereof are provided. The trace structure includes a conductive line, a seed layer, and a protection layer, wherein an upper part of the trace line is covered by the protection layer to prevent sharp edges... Agent: Jianq Chyun Intellectual Property Office

20080308310 - Device comprising a substrate including an electronic contact, and transponder: The invention relates to a device comprising a first electric contact (8, 98) and a substrate (1, 91). The first electric contact (8, 98) comprises a first area (10, 110) with a first wettability, and the substrate (1, 91) comprises a second area (3) with a second wettability and a... Agent: Nxp, B.v. Nxp Intellectual Property Department

20080308311 - Optical path converting member, multilayer print circuit board, and device for optical communication: e

20080308309 - Structure of packaging substrate having capacitor embedded therein and method for fabricating the same: A structure of a packaging substrate having capacitors embedded therein is disclosed. The structure comprises a core substrate, a dielectric layer, and an outer circuit layer. The core substrate comprises an inner circuit layer. The dielectric layer is disposed at both sides of the core substrate, having first conductive vias... Agent: Bacon & Thomas, PLLC

20080308312 - Ceramic electronic component: A ceramic electronic component comprises a ceramic element body and an outer electrode arranged on the ceramic element body. The outer electrode includes a first electrode layer and a second electrode layer formed on the first electrode layer. The first electrode layer is formed on an outer surface of the... Agent: Oliff & Berridge, PLC

20080308313 - Split wave compensation for open stubs: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface... Agent: Henneman & Associates, PLC

20080308314 - Implementation structure of semiconductor package: An implementation structure of a semiconductor package includes: a printed wiring board which has via-holes piercing a mounted surface and an opposite surface of the printed wiring board; a via-land which is formed on the opposite surface so as to cover openings of the via-holes on the opposite surface and... Agent: Mcginn Intellectual Property Law Group, PLLC

20080308315 - Multilayer printed circuit board and method of fabricating the same: This invention relates to a multilayer printed circuit board and a method of fabricating the same, which can increase the reliability of the multilayer printed circuit board and can decrease the process time to thus improve productivity.... Agent: Staas & Halsey LLP

20080308316 - Elbow connection for multiple-wire electric cable: i

20080308317 - Ceiling raceway: Among various embodiments of the present disclosure, a ceiling raceway can be formed with an enclosable compartment for a number of cables locatable above a lower surface of a drop ceiling. The enclosable compartment can have a bottom hinged surface that is openable to enable access to an interior of... Agent: Brooks & Cameron, PLLC

20080302567 - Connection mechanism for coupling a power module to an electrical busway: A connection mechanism for coupling a power module to an electrical busway is provided. The connection mechanism has a cam mechanism having a number of pivotable members. Each of the pivotable members has a generally horizontal extending shoulder portion that is coupled to a generally downwardly extending arm portion. A... Agent: Eckert Seamans Cherin & Mellott

20080302566 - Power module for an electrical busway: A power module for an electrical busway is provided. The power module has a holder with an aperture provided therein and a number of posts provided thereon. A plug-in adapter is received within the aperture of the holder. The plug-in adapter has a number of electrical contacts that are structured... Agent: Eckert Seamans Cherin & Mellott

20080302568 - Electrical connector: By enabling two separate and independent flexible metal conduit and/or armored or metal clad cables are quickly and easily secured to a single connector for being mounted directly to a single elongated rigid or solid electrical tubing/conduit, an efficient, easily manufactured and easily assembled connector is realized. In the present... Agent: Melvin I. Stoltz

20080302553 - Data and power distribution system for an electrical busway: A data and power distribution system for an electrical busway is provided. The system has a base plate and a data channel located adjacent to or proximate to the base plate. The data channel is structured to receive a number of data transport devices therein. An electrical busway is coupled... Agent: Eckert Seamans Cherin & Mellott

20080302554 - Armored cable with integral support: A system for providing cable support may be provided. The system may comprise a conductor core, a filler that may provide integral core support, and armor. The conductor core may comprise at least one conductor. The filler may be applied around at least a portion of the conductor core. The... Agent: Merchant & Gould Southwire

20080302555 - High heat-resistance resin composition and high heat-resistance insulated cable which uses the same: A high heat-resistance resin composition, the high heat-resistance resin composition being thermally treated at 150° C. for 100 hours, wherein a heat absorption amount of the high heat-resistance resin composition which is measured at a melting point thereof by Differential Scanning Calorimetry (DSC) is equal to or less than 45... Agent: Foley And Lardner LLP Suite 500

20080302556 - Enhanced electrical seismic land cable: An electrical cable comprises a cable core comprising at least one electrical conductor, at least one polymeric inner layer enclosing the cable core, and at least one polymeric outer layer enclosing the cable core and the inner layer to form the electrical cable, the outer layer operable to maintain integrity... Agent: Schlumberger Ipc Attn: David Cate

20080302557 - Attachment device for an electrical connection terminal for attachment to a housing wall: An attachment device for electrical connection terminals to pass through a housing wall includes a terminal housing including an insulating material. The terminal housing is attachable in an opening in the housing wall. The attachment device includes an attachment insert detachably affixable in the terminal housing. The attachment insert is... Agent: Darby & Darby P.C.

20080302558 - Prepreg, metal-clad laminate and printed circuit board using same: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080302559 - Flexible and elastic dielectric integrated circuit: General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a... Agent: Thomas, Kayden, Horstemeyer & Risley LLP

20080302560 - Printed wiring board and a method of manufacturing a printed wiring board: A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080302561 - Conductive ink containing thermally exfoliated graphite oxide and method of making a conductive circuit using the same: A conductive ink containing a conductive polymer, wherein the conductive polymer contains at least one polymer and a modified graphite oxide material, which is a thermally exfoliated graphite oxide with a surface area of from about 300 m2/g to 2600 m2/g, and it use in a method for making a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080302562 - Printed circuit board: A circuit is printed on a circuit board material, which does not have a copper foil layer and does have a paper base material is impregnated with a resin, using an electroconductive coating material. The board material preferably is a paper phenol board material, wherein the paper base material is... Agent: Darby & Darby P.C.

20080302563 - Wiring board and manufacturing method thereof: In a wiring board, insulation layers and wiring conductors are alternately laminated, and a plurality of strip-shaped wiring conductors for connecting semiconductor elements are arranged side by side on the outermost insulation layer. Each of the wiring conductors partly has a connection pad to which the electrode terminals of the... Agent: Clark & Brody

20080302564 - Circuit assembly including a metal core substrate and process for preparing the same: A substrate for an electronic device package includes an electrically conductive core shaped to define a cavity for receiving an electronic device, a first insulating layer positioned on a first side of the core, and a first contact positioned adjacent to a surface within the cavity. Method of fabricating the... Agent: Ppg Industries Inc Intellectual Property Dept

20080302565 - Shielded connector comprising an annular spring: The invention relates to a shielded circular connector or a shielded box. The preferably metal housing of said connector comprises at least one cap nut (1) and union screw (2), or two corresponding cap nuts or union screws, which can be fixed by means of a thread, bayonet fitting, detent... Agent: K.f. Ross P.C.

20080296059 - Enhanced pole guards for electric utility poles: A novel pole guard for electric utility poles has at least one notch for allowing a portion of the pole guard to provide insulative coverage below a cross arm of a utility pole. Further features include hooks, pins, or other fasteners on the pole guard for attaching insulative blankets.... Agent: Schwegman, Lundberg & Woessner, P.A.

20080296038 - Coaxial cable for exterior use: A coaxial cable is disclosed and includes a dielectric surrounding a center conductor. The coaxial cable further includes a shield surrounding the dielectric. The coaxial cable further includes a jacket surrounding the shield, the jacket having an interior surface. A dry floodant compound is dispersed on the interior surface of... Agent: Toler Law Group

20080296037 - Electrical-cable shielding: An electrical-cable transition, where two or more bundles of shielded cables divide from a shielded main bundle, is shielded from electromagnetic interference by a flexible shielding-element of bare or covered metal mesh wrapped round the transition to overlap or be overlapped by shielding of the branch bundles and interconnect electrically... Agent: Davis Bujold & Daniels, P.l.l.c.

20080296039 - Dual-hinge recessed outdoor box and cover: A recessed electrical outlet box which includes a body that is selectably connected to a cover by either a first or a second hinge assembly. The body includes a back wall, a face plate, a side wall and an interior, wherein the side wall extends between the back wall and... Agent: Hoffmann & Baron, LLP

20080296040 - Electrically conductive buoyant cable: Disclosed herein is an electrically conductive buoyant cable. The cable includes an electrical conductor member having at least one electrical conductor. The cable also includes a filler layer that consists of buoyant materials with relative density lower than 1. The filler layer surrounds and encloses the electrical conductor member. The... Agent: PeninsulaIPGroup

20080296041 - Insulated wire, insulated cable, non-halogen flame retardant wire, and non-halogen flame retardant cable: A metallic conductor and an insulator provided at an outer periphery of the metallic conductor for coating the metallic conductor constitutes an insulated wire or cable. The insulator has a reactor blended type polyolefin-based thermoplastic resin containing 51-85 mol % per monomer unit of the crystalline polypropylene. In the insulator... Agent: Scully Scott Murphy & Presser, PC

20080296043 - Electric control cable: The present invention relates to a composite control cable comprising a polymer core and a plurality of strands of electrically conductive material extending in the longitudinal direction of the cable around said core. According to the invention, the polymer is selected from polymers presenting elongation at break that is greater... Agent: Sofer & Haroun LLP.

20080296042 - Profiled insulation and method for making the same: A wire has a conductor and an insulation extruded onto the conductor. The insulation has a plurality of alternating crests and crevasses, where the ratio of the distance from the conductor to a top of the crest to the distance from the conductor to a lowest point in the adjacent... Agent: Sofer & Haroun LLP.

20080296044 - Flexible flat cable: A flat cable includes a plurality of flat cores arranged at an interval, an insulating layer covering integrally each core, and an adhesive sheet. Both surfaces of the insulating layer are provided with a plurality of grooves to correspond to the cores respectively. The distal end of each core extends... Agent: Hdsl

20080296045 - Method for manufacturing a post insulator and a post insulator: A method for manufacturing a post insulator. A core is introduced into a tube of an insulating stiff material while leaving a small circumferential space separating the core and inner walls of the tube. Adhesive is introduced under an overpressure into an interior of the tube and is cured while... Agent: Venable LLP

20080296046 - Electric insulator and a method for the production thereof: The present invention relates to an electrical insulator (1) comprising a tube (3) surrounded by an insulating sheath (5) that may be smooth or provided with fins (7). The insulating sheath is composed of a filled, hardened, flexibilised, hydrophobic, cycloaliphatic epoxy resin containing from 25 to 75% by weight of... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080296047 - Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus: According to one embodiment, there is provided a printed wiring board assembly composed of a printed wiring board having a first component mounting portion provided on one surface of the printed wiring board, a second component mounting portion provided on the other surface of the printed wiring board having the... Agent: Knobbe Martens Olson & Bear LLP

20080296048 - Flexible printed circuit board and electronic apparatus: A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that... Agent: Knobbe Martens Olson & Bear LLP

20080296049 - Printed circuit board: A printed circuit board includes a base insulating layer and a conductor pattern provided on the base insulating layer. The conductor pattern includes a line portion linearly extending along a virtual axis line in a line region, a first bend portion extending along the axis line while being bent in... Agent: Panitch Schwarze Belisario & Nadel LLP

20080296050 - Semiconductor chip mounting board with multiple ports: A semiconductor chip mounting board comprises an insulating substrate and a plurality of input or output ports to be connected to a semiconductor chip for processing a high-frequency signal. The semiconductor chip has on top thereof a chip ground layer structured by a metal layer. The insulating substrate comprises a... Agent: Harness, Dickey & Pierce, P.L.C

20080296051 - Printed circuit board: A printed circuit board includes a base insulating layer and a wiring. The wiring is composed of a terminal portion on an upper surface side of the base insulating layer, a copper plating layer inside a through hole of the base insulating layer and a wiring pattern on a lower... Agent: Panitch Schwarze Belisario & Nadel LLP

20080296053 - Electronic component module and method of manufacturing the same: A method of manufacturing an electronic component module includes mounting an electronic component on at least one surface of a first board, subsequently inspecting the first board for functions, forming a resin layer burying or covering the electronic component on the one surface of the first board to flatten the... Agent: Ratnerprestia

20080296054 - High performance chip carrier substrate: A multilayer chip carrier with increased space for power distribution PTHs and reduced power-related noise. In a multilayer chip carrier with two signal redistribution fanout layers, in addition to signal escape from near-edge signal pads at the first fanout layer, remaining signal pads are moved closer to the edge of... Agent: John A. Jordan, Esq.

20080296052 - Multilayer printed wiring board: A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 μm and a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080296055 - Printed circuit board and method of fabricating the same: This invention relates to a printed circuit board and a method of fabricating the same, in which the thickness of a circuit pattern is decreased to thus realize a fine circuit, the circuit pattern is embedded in an insulating layer to thus decrease the thickness of a printed circuit board,... Agent: Staas & Halsey LLP

20080296056 - Printed circuit board, production method therefor, electronic-component carrier board using printed circuit board, and production method therefor: A printed wiring board has a substrate having a first surface and a second surface on both sides of the substrate. A cavity is provided on the first surface. The cavity caves in towards the second surface. Several bumps are formed in the cavity as protruding towards the first surface.... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080296057 - Simultaneous and selective partitioning of via structures using plating resist: Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with... Agent: Law Office Of Andrei D Popovici, P.C.

20080296058 - Antenna device and shield cover thereof: A circuit board has a first face and a second face opposite to the first face. An antenna element is mounted on the first face. A shield cover is attached to the second face. The shield cover includes a polygonal base portion, a first wall provided on a first side... Agent: Whitham, Curtis & Christofferson & Cook, P.C.

20080296060 - Structured cabling chassis: Structured cabling solutions may include techniques and systems usable to route, organize, and otherwise manager wires, optical fibers, and other cables. Structured cabling solutions may include one or more chassis coupled to and movable relative to a frame to provide access to signal connectors on the chassis. Structured cabling solutions... Agent: Lee & Hayes, PLLC

20080296061 - Connector for an electrical junction box: This invention relates to a connector for securing a cable to an electrical junction box by contact with extending projections. In particular, the invention is a connector having a locking system for securing a cable in a knock-out opening of an electrical junction box.... Agent: Blank Rome LLP