Electricity: conductors and insulators inventions 11/08

20080289870 - Method and apparatus for reducing wire theft from street light and utility poles: An apparatus and method is provided for inhibiting theft of electrical wiring through the access opening of an electrical fixture supporting pole, such as a street light pole. Prior to securing the pole to the base, a wire clamping element is placed on the base around the passage for the... Agent: Oyen, Wiggs, Green & Mutala LLP 480 - The Station

20080289844 - Decorative receptacle and switch covers: A decorative electrical socket cover is provided to be placed over an electrical socket of an electrical outlet assembly. The outlet assembly is located on a wall or other surface that is finished in a predetermined color, and a user desires that the color of the socket cover match the... Agent: Sachnoff & Weaver, Ltd.

20080289845 - Wall box mounting apparatus: An apparatus and method for mounting a device in a wall box is provided. The apparatus includes a base plate formed by a front portion and a plurality of side portions extending to the rear to define a substantially open rear portion, and a latching mechanism coupled to the base... Agent: Gardere Wynne Sewell LLP Intellectual Property Section

20080289846 - Outlet cover with barrier wall: An outlet cover with barrier wall, the cover for an outlet box mounted in a building wall including an outer wall with an outer opening; a surrounding wall integrally joined to and extending substantially normal to the outer wall; an L-shaped barrier wall integrally joined to and extending substantially normal... Agent: Cardinal Law Group

20080289847 - Metal raceway system: The present invention is directed to a raceway system including a base, at least two covers and a faceplate. The base includes sidewalls having a top wall with a flange member. The covers include a top portion having two ends with a flange member at each end. The flange members... Agent: Panduit Corp.

20080289848 - Data transmission: The present invention relates to a system for data transmission over an electricity distribution network. The system comprises an electrical apparatus having a shielded electrical cable connected thereto. The cable has a core surrounded by a metallic sheath and armour surrounding the metallic sheath. The armour is disengaged from around... Agent: O''shea Getz P.C.

20080289874 - Spiral heater wire termination: An electrical connector for use with providing an electrical termination to an end of a cable having a conductor helically disposed between a core and a layer overlying the core. The connector includes a first portion having an opening sized greater than a diameter defined by the helically disposed conductor... Agent: Tyco Technology Resources

20080289849 - Enhanced electrical cables: Electrical cables formed from at least one insulated conductor, a layer of inner armor wires disposed adjacent the insulated conductor, and a layer of shaped strength members disposed adjacent the outer periphery of the first layer of armor wires. A polymeric material is disposed in interstitial spaces formed between the... Agent: Schlumberger Ipc Attn: David Cate

20080289850 - Electrical wire and method of making an electrical wire: An electrical wire and a method of making an electrical wire are disclosed. The electrical wire comprises a conductor and a covering. The covering comprises a thermoplastic composition comprising a poly(arylene ether), a polyolefin and a polymeric compatibilizer. The thermoplastic composition may further comprise a flame retardant.... Agent: General Electric Company Global Patent Operation

20080289851 - Modular opto-electrical cable unit: A modular cable unit for oilfield wireline includes multiple cable modules. The cable modules are interchangeable to achieve a modular cable unit with desired telemetry and electrical properties to suit a specific application. The cable modules can be an optical fiber module, a power cable or an opto-electrical module assembly.... Agent: Schlumberger Ipc Attn: David Cate

20080289852 - Cable assembly: A cable assembly is provided including an encapsulated cable having one or more elements and an intermediary section. The encapsulated cable extends along a length direction. The intermediary section extends along the length direction and is attached along a length of the encapsulated cable and extends outwardly therefrom. The intermediary... Agent: Christie, Parker & Hale, LLP

20080289853 - Composite substrate and method for manufacturing composite substrate: In a composite body, a frame body to be connected to a first major surface of a substrate body includes a frame member made of an insulating material and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole at the approximate center... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080289854 - Pushable cable: A cable assembly may be provided. The cable assembly may comprise a conductor core and a binding element. The binding elements may be configured helically around the conductor core. In addition, the binding element may be configured to, when the cable assembly is pushed through a conduit having at least... Agent: D. Kent Stier Merchant & Gould P.C.

20080289855 - Pushable cable: A cable assembly may be provided. The cable assembly may comprise a conductor core and a binding element. The binding elements may be configured helically around the conductor core. In addition, the binding element may be configured to, when the cable assembly is pushed through a conduit having at least... Agent: Merchant & Gould Southwire

20080289856 - Wildlife guard for electrical power distribution and substation facilities: A wildlife guard for electrical power equipment including an electrically insulating material with a conductive material therein in a quantity sufficient for the guard to maintain an electrostatic charge when placed in an electrical field.... Agent: Polster, Lieder, Woodruff & Lucchesi

20080289857 - High-voltage insulator and cooling element with this high-voltage insulator: A high-voltage insulator contains, in a coaxial arrangement: an insulating tube with an end in the form of a bearing ring, a hollow metal armature held on the bearing ring, an adhesive-bonding joint, which is provided between an adhesive-bonding area of the bearing ring and an adhesive-bonding area of the... Agent: Buchanan, Ingersoll & Rooney PC

20080289858 - Printed circuits and method for making same: A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing... Agent: Snell & Wilmer L.L.P. (main)

20080289862 - Electronic component package: An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part,... Agent: Staas & Halsey LLP

20080289859 - Flex-rigid wiring board and manufacturing method thereof: A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, conductor circuit provided on the insulative base material and a cover... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080289860 - Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board: The present invention provides a flexible printed wiring board comprising at least an electric insulating layer and a conductor layer wherein the surface of the electric insulating layer has a 10-point average roughness of at least 1.5 μm and less than 2.0 μm and contact angle of at least 60°... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.

20080289861 - Multi-layer flexible printed circuit board and method for manufacturing the same: Disclosed are a multi-layer flexible printed circuit board and a method for manufacturing the same. The multi-layer flexible printed circuit board includes an adhesion sheet from which a pressing and heating area is cut, an upper base layer, from which the pressing and heating area is cut, on the adhesion... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association

20080289864 - Printed wiring board and method for producing the same: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080289863 - Surface finish structure of multi-layer substrate and manufacturing method thereof: A surface finish structure of multi-layer substrate and manufacturing method thereof. The surface finish structure of the present invention includes a bond pad layer, at least one cover metal layer and a solder mask. The cover metal layer covers the bond pad layer. The solder mask has a hole to... Agent: Madson & Austin

20080289868 - Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080289865 - Method for manufacturing dielectric layer constituting material, dielectric layer constituting material obtained thereby; method for manufacturing capacitor circuit forming piece using dielectric layer constituting material, capacitor circuit forming pie: An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object,... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20080289867 - Multi-strand substrate for ball-grid array assemblies and method: A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2... Agent: Freescale Semiconductor, Inc. Law Department

20080289866 - Wiring board and wiring board manufacturing method: A wiring board including a stacked wiring layer portion in which a dielectric layer and a conductor layer are stacked is formed on a core board portion, the stacked wiring layer portion including a stacked composite layer portion in which a polymer dielectric layer, a conductor layer and a ceramic... Agent: Sughrue Mion, PLLC

20080289869 - Novel via structure for improving signal integrity: The embodiment of the invention is about a novel via structure which can be incorporated into printed circuit boards, integrated circuit packages, and integrated circuits in order to reduce crosstalk, to improve signal integrity and to achieve EM emission compliance. A 4-layer (2 signal layers and 2 power layers or... Agent: Sinorica, LLC

20080289871 - Adapter plate assembly for outdoor installation of notification appliances: The present invention generally discloses a weatherproof flush adapter plate assembly. In one embodiment, the adapter plate assembly includes a plate. The plate includes a front side, a back side, an outer edge, at least one inner edge, at least one mounting member for receiving a back box and at... Agent: Patterson & Sheridan L.L.P. Nj Office

20080289872 - Laser surgery station power system: A surgery power station incorporates a pedestal having at least one internal power panel and a conduit extending from the pedestal and communicating with the interior of the pedestal through a first aperture. The conduit extends upward for engagement to an electrical box integral with a ceiling structure of an... Agent: Felix L. Fischer, Attorney At Law

20080289873 - Network enclosure with removable and interchangeable sides: A networking enclosure with removable and interchangeable sides includes a housing with an internal cavity for receipt of electrical devices and first, second, and third openings. The enclosure also includes first, second, and third sets of panels corresponding to each of the openings. The first set of panels includes at... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20080283266 - Tool for installing electrical boxes: A tool for installing various configurations of electrical boxes to framing studs during building construction includes a staff having graduations indicating distances from an end of the staff. A mounting fixture is slidably disposed on the staff and can be secured at a desired position along the length of the... Agent: Wood, Herron & Evans, LLP

20080283267 - Carbon nanotube-based electronic devices: Carbon nanotube-based devices that can be used to meet the growing miniaturization and performance needs of electronic systems, are provided. In particular, a transmission line and inductor that include nanotube bundles is disclosed. In a further embodiment a method for isolating nanotubes with proteins is disclosed. In another embodiment a... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20080283268 - Method for stopping water of earth wire and earth wire: A first sealant 6 of the UV-cure type having as a contact angle with respect to the bare conductor 1a of the ground cable 1 an acute one and a viscosity of 15-500 mPa·s is delivered by drops onto the bare conductor. The first sealant 6 is delivered by drops... Agent: Akerman Senterfitt

20080283269 - Systems and methods for nanomaterial transfer: Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template onto the substrate. In some embodiments, the step of transferring the nanomaterials involves pressing the... Agent: Troutman Sanders LLP

20080283270 - Protective sheath against radiation, in particular derived from electric field generated by electric cables: The invention concerns a protective sheath against radiation, in particular derived from electric field generated by electric cables (1, 2, 3) extending inside the sheath. The invention is characterized in that it comprises an electrically insulating plastic outer layer (4) covering an electrically conductive material layer (5), the sheath end... Agent: Young & Thompson

20080283271 - Fluoropolymer wire insulation: FEP compositions are provided that provide foam insulation in coaxial cable that surpasses the return loss obtained when PFA is used to make the foamed insulation, one composition comprising a blend of tetrafluoroethylene/hexafluoropropylene copolymers, one of said copolymers exhibiting a strip force of at least about 3 lbf (13.3 N)... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080283272 - Self-healing cable for extreme environments: Self-healing cable apparatus and methods disclosed. The self-healing cable has a central core surrounded by an adaptive cover that can extend over the entire length of the self-healing cable or just one or more portions of the self-healing cable. The adaptive cover includes an axially and/or radially compressible-expandable (C/E) foam... Agent: OpticusIPLaw, PLLC

20080283273 - Semiconductive composition and power cable using the same: The present invention relates to a semiconductive composition and a power cable using the same. The semiconductive composition according to the present invention constituting a semi-conductive layer of a power cable includes 100 parts by weight of a base resin composed of an ethylene-based copolymer resin; 45 to 70 parts... Agent: Stroock & Stroock & Lavan LLP

20080283274 - Multi-pair cable with varying lay length: A multi-pair cable having a plurality of twisted conductor pairs. The twisted conductor pairs each have an initial lay length that is different from that of the other twisted conductor pairs. The plurality of twisted conductor pairs defines a cable core. The core is twisted at a varying twist rate... Agent: Merchant & Gould PC

20080283275 - Metal deposition: A method for electroless plating of metal on a laser-patterned substrate. A substrate is provided on which both a thermal imaging layer and catalytic layer are deposited. On exposure to a laser beam, sufficient levels of radiation are converted to heat in the thermal imaging layer to render the exposed... Agent: Sughrue Mion, PLLC

20080283276 - Wiring board and method of manufacturing wiring board: A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080283277 - Wiring board manufacturing method and wiring board: A wiring board 100 has a multilayer structure in which insulating layers and wiring layers are arranged on upper and lower surfaces of a core substrate 240, and has a via structure 200 in which electrolytic Cu plating is carried out over a via forming opening provided by patterning a... Agent: Rankin, Hill & Clark LLP

20080283278 - Flexible circuit substrate: The present invention is directed to a substrate for subsequent eutectic bonding with a subsequently applied metal to provide, or as a precursor to the provision of, a circuit substrate. The circuit substrate comprises a dielectric film and a layer of an oxide or oxides of a metal on the... Agent: 3m Innovative Properties Company

20080283279 - Composite ceramic substrate: A composite ceramic substrate includes a ceramic substrate having surface-mounted components mounted thereon, external terminal electrodes connecting wiring patterns disposed on the ceramic substrate and surface electrodes of a motherboard, and a convex leg portion made of resin and arranged such that an end surface supports the external terminal electrodes,... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080283280 - Method for connecting printed circuit boards: To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire... Agent: 3m Innovative Properties Company

20080283281 - Multilayer ceramic substrate: A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity.... Agent: Kanesaka Berner And Partners LLP

20080283282 - Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board: Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the via holes 66 are arranged linearly, thereby making it possible... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080283283 - Material for forming capacitor layer and method for manufacturing the material for forming capacitor layer: An object of the present invention is to provide a material for forming a capacitor layer comprising a dielectric layer formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method. The material can reduce a leakage current of a capacitor circuit. In order to... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20080283285 - Circuit arrangement: A circuit arrangement comprising a set of signal layers, a set of first power layers, a set of second power layers, a set of signal vias, a set of first power vias, a set of second power vias, wherein a signal via of the set of signal vias provides a... Agent: International Business Machines Corporation

20080283284 - Wiring board connection method and wiring board: A wiring board connection method connects wiring boards each having a strip-shaped connection terminal for connecting with another substrate, the method including the steps of: aligning the wiring boards so that the connection terminals face each other with a fluid interposed therebetween; and bonding the connection terminals with each other... Agent: Ratnerprestia

20080283286 - Printed circuit board: A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover... Agent: Panitch Schwarze Belisario & Nadel LLP

20080283288 - Printed circuit board using paste bump and manufacturing method thereof: A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a... Agent: Staas & Halsey LLP

20080283287 - Wiring board and method of manufacturing wiring board: A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080283289 - Printed circuit boards: The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080283290 - Article including sheet-like electromagnetic shielding structure: The present invention relates to an article to which a characteristic of shielding electromagnetic waves is imparted, which comprises at least a sheet-like electromagnetic shielding structure, the sheet-like electromagnetic shielding structure comprising a thin layer-like substrate; and a fiber convex structure section having a characteristic of conducting or absorbing electromagnetic... Agent: Sughrue-265550

20080283291 - Modular raceway with base and integral divider: Raceway modules of predetermined length are joined by couplers designed to allow optional gaps between the T-shaped raceway base plate portions. Upper and lower L-shaped raceway covers are separately snapped out the base, allowing electrical and data/communication devices to be provided in staggered relationship, and anywhere along the raceway. The... Agent: Mccormick, Paulding & Huber LLP

20080283292 - Wall flush mount supporting device for electric or electronic components: The present invention refers to a wall flush mount supporting device for electric or electronic components, which comprises an external cover (5) or finishing plate (4) in perfectly co-planar position with the wall where the supporting device of the invention is recessed.... Agent: Robert M. Gamson Armstrong, Kratz, Quintos,hanson & Brooks

20080283293 - Feedthrough for microelectromechanical system: A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled... Agent: Medtronic, Inc.

20080277158 - Systems and methods for stabilizing cables under heavy loading conditions: Systems and methods are disclosed for stabilizing a wire, cable (10), line, or cord system. The present invention involves systems that allow a cable (10), such as a power line cable (10) and the insulator strings (20), the ability to extend during loading conditions and to regain their previous geometry... Agent: North Weber & Baugh LLP

20080277133 - Mountable power strips: A mountable power strip includes: first and second arm sections each including a plurality of electrical receptacles; a coupling assembly configured to couple the arm sections together for rotational movement relative to each other about a rotational axis; and a ratcheting assembly configured to define degrees of relative rotational movement... Agent: Tillman Wright, PLLC

20080277134 - Protective device plate for an electrical box: A cover for an electrical box having a face plate, an elongate slot in the face plate, a lid support structure and a lid. The lid fits on the front of the face plate and over the opening and is pivotably movable between an open position, which allows access to... Agent: Hoffmann & Baron, LLP

20080277161 - Bussing connector: A low-profile electrical connector and connector system having a connector body. The connector body includes at least one bussing interconnection capable of electrically connecting to electrical devices and including at least one structure configured to receive a receptacle body having a plurality of arms configured to apply a contact force... Agent: Tyco Technology Resources

20080277135 - Current-seen cable: A current-seen cable, includes a main cord as a power cord or a signal cord and a plurality of electroluminescence cords, said a plurality of electroluminescence cords are arrayed abreast and are intertwisted helically in sequence to be a electroluminescence cable which is insulated from the main cord and emit... Agent: Schmeiser, Olsen & Watts

20080277136 - Flame retardant wire and cable: Cables include a conductor core and an insulative wall. The insulative wall is generally ultra-thin, and may have a thickness of from about 0.10 mm to about 0.44 mm. The insulative wall includes a flame retardant additive and is essentially halogen free.... Agent: Edwin A. Sisson , Attorney At Law , LLC

20080277137 - Distannoxane catalysts for silane crosslinking and condensation reactions: A fabricated article (e.g., jacketed or insulated wire or cable) is prepared by a process comprising the steps of: applying a coating of a moisture-curable composition onto a wire or cable; and reacting the moisture-curable composition with water, wherein the moisture-curable composition comprises at least one resin having hydrolysable reactive... Agent: Whyte Hirschboeck Dudek Sc The Dow Chemical Company

20080277138 - Retroreflecting elongated metal wire product: A retroreflective metal wire product (100) is described having a first coating (120) covering the metallic wires (110) wherein retroreflective beads (130) are partly embedded and a protective coating (150) covering said beads (130) and first coating (120). The metal wire product (100) can be made from a metallic strand... Agent: Foley And Lardner LLP Suite 500

20080277139 - Sealing tape: A cable joint includes at least two cables each having inner conducting elements. At least one of the cables has a layer of paper insulation impregnated with an oil. The inner conducting elements of the cables are secured to each other at a junction. A sealing tape has an inner... Agent: Barley Snyder, LLC

20080277140 - Electroless gold plating method and electronic parts: Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a... Agent: Birch Stewart Kolasch & Birch

20080277141 - Circuit board and method of fabricating the same: A circuit board including a dielectric layer, a circuit layer, at least one conductive joint column, and a solder mask layer is provided. The circuit layer having at least one pad is in contact with the dielectric layer. The conductive joint column is disposed on the pad. The solder mask... Agent: J C Patents, Inc.

20080277144 - Method for indicating quality of a circuit board: A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around each circuit board unit and extended to form a plating trace in an inner-layer circuit structure of... Agent: Edwards Angell Palmer & Dodge LLP

20080277143 - Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufcturing method thereof: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal... Agent: Antonelli, Terry, Stout & Kraus, LLP

20080277142 - Wired circuit board: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is... Agent: Akerman Senterfitt

20080277145 - Flexible printed circuit: A flexible printed circuit includes a flexible substrate, a plurality of first conductive wires, and a plurality of second conductive wires. The flexible substrate includes a first surface and a second surface facing the first surface. The first conductive wires are provided on the first surface. The first conductive wires... Agent: Wei Te Chung Foxconn International, Inc.

20080277148 - Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080277146 - Radiant heat printed circuit board and method of fabricating the same: Disclosed is a radiant heat printed circuit board, which has improved heat-radiating properties and reliability, and a method of fabricating the same.... Agent: Staas & Halsey LLP

20080277147 - Wired circuit board and producing method thereof: A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. The conductive pattern includes an underlying layer formed on the insulating layer and a conductive layer formed on the underlying layer. The underlying... Agent: Akerman Senterfitt

20080277151 - Electronic assemblies without solder and methods for their manufacture: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly... Agent: The Tpl Group

20080277149 - Electronic device manufacturing method and supporter: A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the support surface and lower than the support surface,... Agent: Harness, Dickey & Pierce, P.L.C

20080277150 - Wiring board with built-in component and method for manufacturing the same: A method for manufacturing a wiring board with built-in component. The method provides a secure connection between a component and interlayer insulating layers so that the wiring board with built-in component has excellent reliability. The wiring board is manufactured through a core board preparation step, a component preparation step, an... Agent: Kusner & Jaffe Highland Place Suite 310

20080277152 - Printed circuit board and its designing method, and designing method of ic package terminal and its connecting method: The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (2b), (2c), and (2d) for connecting solder balls are disposed in lattice. Central... Agent: Mcdermott Will & Emery LLP

20080277154 - Process for making stubless printed circuit boards: A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed... Agent: Connolly Bove Lodge & Hutz LLP

20080277153 - System and method for capacitive coupled via structures in information handling system circuit boards: Power supplied to an information handling system electronic component through a circuit board has component package inductance parasitic effects compensated by configuring connections to the electronic component to have increased parasitic capacitance. For instance, power and ground vias that connect a processor to power and ground planes of the circuit... Agent: Hamilton & Terrile, LLP

20080277155 - Wiring substrate and method of manufacturing the same: In a method of manufacturing a wiring substrate of the present invention, a through-hole plating layer is formed from an inner surface of a through hole in a substrate to both surface sides, then a resin is filled in a through hole, and then a first resist in which an... Agent: Kratz, Quintos & Hanson, LLP

20080277156 - Emi shielding containers: Embodiments of electromagnetic interference (EMI) shielding containers are disclosed according to the present invention. The EMI shielding containers are especially useful for protecting sources of electronic evidence from EMI contamination prior to data extraction. However, the embodiments of EMI shielding containers of the present invention may be used in any... Agent: Morriss Obryant Compagni, P.C.

20080277157 - Electromagnetic wave shielding sheet and process for producing the same: An electromagnetic wave shielding sheet 1 comprises a transparent substrate 11, and line parts 107 that define openings 105, provided on the transparent substrate 11. The line parts 107 have a metal mesh layer 21, and a blackening layer 25A formed on the surface of the metal layer 21, on... Agent: Oliff & Berridge, PLC

20080277159 - Holder and a placement tool therefor: A holder device (1, 100) for an article such as a thermocouple (9) is disclosed. The holder (1, 100) facilitates the placement and retention of the thermocouple (9) in an apparatus such as a lyophilizer by clamping the thermocouple (9) stably in position between adjacent shelves (80, 90) of the... Agent: Hoffmann & Baron, LLP

20080277160 - Electrical offset nipple connector with frustro-conical retaining rings: This disclosure is directed to electrical connectors, and more specifically to various types of electrical connectors, including an offset nipple connector assembly having an integrally formed connector body having opposed end openings provided with an outer surface that slopes downwardly toward the outlet opening and having a complementary sloping or... Agent: Paul A. Fattibene Fattibene & Fattibene

20080271907 - System and method for loop detector installation: A pre-fabricated ferromagnetic loop having a footprint characterized by a continuous wire shaped according to a predetermined planar pattern. In some embodiments, the predetermined planar pattern can be multiple contiguous polygons within a larger footprint used for establishing a sensor for the detection of moving vehicles. The footprint may include... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20080271908 - Hermetic sealing cap, method of manufacturing hermetic sealing cap and electronic component storage package: Cap for airtight sealing (1) that not only suppresses any deterioration of the properties of electronic parts (20) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer (2);... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080271919 - Bundled composite cable with no outer over-jacket: A composite cable is formed by wrapping plural separately jacketed cables in a helical fashion by an outer containment element, such as a jacket formed as a strip of material. Air gaps may exist between wound strands of the outer jacket to expose the inner cables. Two or more strip-like... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080271920 - System for supplying electrical energy to assimilation lamps in a glasshouse, glasshouse lighting power current cable for use in a glasshouse: The invention relates to a glasshouse lighting power current cable for supplying electrical energy to assimilation lamps in a glasshouse. The glasshouse lighting power current cable according to the invention has at least three electrically insulated through conductors embedded in the cable for the transmission of three-phase current, the cable... Agent: Troutman Sanders LLP

20080271921 - Contact device for providing an electrical contact between flat current carrying line elements: A contact device for providing an electrical contact between a first busbar (3) and a second busbar (4) which are arranged substantially parallel to each other, comprises a holder (2) with two sidewalls (21, 22) which extend substantially parallel. Said sidewalls (21, 22) enclose a slot (23) for receiving the... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20080271909 - Insulated non-halogenated heavy metal free vehicular cable: Described is an insulated non-halogenated, heavy metal free vehicular cable comprising an inner core of a copper based metal wire having a cross sectional area of at least about 0.1 mm2, and an outer insulation, covering the length of the inner core, comprised of a thermoplastic polyphenylene ether composition that... Agent: Delphi Technologies, Inc.

20080271910 - Polygonal overhead cable: An overhead cable including a plurality of element wires stranded to form a naked stranded cable, which has a cross-sectional shape of an equilateral polygon inscribed in a circle having a diameter of 18.2 mm to 38.4 mm as a fundamental cross-sectional shape, in which two sides of this equilateral... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080271912 - Printed circuit board and manufacturing method thereof: Provided is a printed circuit board which can be improved in plating adhesiveness to give high reliability and productivity by reducing development residues in opening portions such as a minute pad formed in a predetermined region of an alkali development type solder resist layer, and a manufacturing method thereof. An... Agent: Ditthavong Mori & Steiner, P.C.

20080271911 - Submerged electrode and material thereof: [Means for solving problems] An electrode of configuration resulting from coating solid pieces of 5 to 60 mm size with electrically conductive diamond, supporting them on supports and bringing the same into contact with each other so as to realize current passage as a whole is used in various electrochemical... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080271913 - Three-dimensional wiring body for mounting electronic component and electronic component mounting structure: An electronic components mounted wiring body (10) comprises a flat wiring body (2) on which a plurality of electronic components (20) is mounted, and a plurality of base members (31) on which the flat wiring body (2) is mounted. The flat wiring body (2) has arrangement direction changing folds (9),... Agent: Cantor Colburn, LLP

20080271914 - Printed wiring board and information processing apparatus: According to one embodiment, a printed wiring board includes, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20080271915 - Method for making a circuit board and multi-layer substrate with plated through holes: A method for making a circuit board includes the following steps. At least two substrates are provided, wherein each substrate includes two surfaces, two circuit layers respective formed on the two surfaces and at least a via passing through the two surfaces. A metal layer is formed on the side... Agent: Lowe Hauptman Ham & Berner, LLP

20080271916 - Gaskets for protecting fingerprint readers from electrostatic discharge surges: According to various aspects, exemplary embodiments are provided of gaskets that can protect fingerprint readers from receiving electrostatic discharge surges when a user's finger is placed in contact with the electronic scanning portion of the fingerprint reader. In exemplary embodiments, a gasket can provide an electrically-insulative barrier between the exposed... Agent: Harness, Dickey, & Pierce, P.l.c

20080271917 - Electrosmog shielding for cable conduit: In combination with a alternating-current-carrying electric power cables and a guide holding the cable. The guide is constructed such that electrical or magnetic radiation emitted by the cable can pass through the guide, an electrosmog shield has a channel formed of a material capable of blocking low-frequency electrical and magnetic... Agent: K.f. Ross P.C.

20080271918 - Corner duct with co-extruded hinges: The present invention is directed to a one-piece corner duct that routes wires in a corner of an enclosure. The one-piece corner duct includes a back wall and sidewalls. The back wall has at least one co-extruded hinge that enables the back wall to pivot to allow the one-piece corner... Agent: Panduit Corp.