Electricity: conductors and insulators inventions 10/08

20080257579 - Superconducting cable and dc transmission system incorporating the superconducting cable: The invention offers a superconducting cable easy to form a twisted structure even when a plurality of cable cores are used and a DC transmission system incorporating the superconducting cable. A superconducting cable 1 has a structure formed by twisting together two types of cable cores (two first cores 2... Agent: Drinker Biddle & Reath (dc)

20080257580 - Cable harness: A cable harness is provided with electric wires arranged in rows to maintain intervals therebetween at both terminals thereof. An intermediate portion of the cable harness is divided into at least two electric wire groups and bundled. At least one of the wire bundles has a length different from those... Agent: Mcdermott Will & Emery LLP

20080257602 - Apparatus for mounting busbars: An apparatus for mounting bus bars having at least one bus bar holder which can be attached to a loadbearing structure and which has at least one foot receptacle for introducing a foot section of a bus bar and fixing the latter by a holding piece. Simple, stable mounting of... Agent: Pauley Petersen & Erickson

20080257581 - Terminal for engaging type connector: A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080257582 - Sleeve for an electrical cable: The sleeve for an electric cable comprises two bodies (2, 3) and a hinge (4). Each body (2, 3) is flexible in the profile thereof, has, in the absence of mechanical stress, a position of rest in which it is curved whereas it is designed for being bent from the... Agent: Young & Thompson

20080257583 - Layout circuit: The layout circuit comprises a first 3×2 grid array and a second 3×2 grid array. The first 3×2 grid array comprises first, second and third signal contact points and the first and second fixed potential contact points are coupled to a first fixed potential. The first and second fixed potential... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080257584 - Multilayer wiring board: A multilayer wiring board includes a substrate and even numbered wiring patterns. The substrate is made of an insulating material. Each of the even numbered wiring patterns is made of a conductive material, and the wiring patterns are laminated onto one another in a lamination direction via the substrate. One... Agent: Harness, Dickey & Pierce, P.L.C

20080257585 - Electrical power substrate: An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to... Agent: Macmillan Sobanski & Todd, LLC

20080257588 - Capacitor layer forming material, manufacturing method thereof, and printed wiring board with embedded capacitor layer obtained using capacitor layer forming material: A capacitor layer forming material that consists of a dielectric film making use of the sol-gel process excelling in production cost merit, being capable of producing a capacitor circuit of prolonged life having a nonconventional high electric capacity. There is provided capacitor layer forming material (1) having dielectric layer (4)... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20080257586 - Flexible circuit structure with stretchability and method of manufacturing the same: A manufacturing method of a flexible circuit structure with stretchability includes the following steps. A plurality of compressible flexible bumps is formed on a flexible substrate; next, a metal circuit is formed on the flexible substrate and each of the compressible flexible bumps. When an external tensile force is applied... Agent: Workman Nydegger

20080257589 - Method for the production of expandable circuit carrier and expandable circuit carrier: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such... Agent: Barnes & Thornburg LLP

20080257587 - Rigid-flex printed circuit board with weakening structure: A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure... Agent: Rosenberg, Klein & Lee

20080257592 - Apparatus for balancing power plane pin currents in a printed wiring board using collinear slots: An apparatus for balancing power plane pin currents in a printed wiring board (PWB) provides for reduction in pin counts required for power plane (including ground plane) connections and/or reduction in requirements for connector current handling per pin. One or more slots are introduced in the metal layer implementing the... Agent: Ibm Corporation (mh) C/o Mitch Harris, Attorney At Law, L.L.C.

20080257590 - High thermal conducting circuit substrate and manufacturing process thereof: A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as... Agent: J.c. Patents

20080257591 - Printed wiring board and a method of production thereof: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080257593 - Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes: A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of... Agent: Staas & Halsey LLP

20080257594 - Printed board assembly and a method: The present invention relates to a method and a printed board assembly for use in a MicroTCA system, wherein backplane pin connectors of the printed board assembly are arranged to be received in receiving connectors of a backplane interconnect, characterized in that it comprises at least one switch unit which... Agent: Nixon & Vanderhye, PC

20080257595 - Packaging substrate and method for manufacturing the same: The present invention relates to a packaging substrate and a method for manufacturing the same. The packaging substrate includes: a substrate body, having a plurality of conductive pads on the surface thereof, wherein the top surfaces of the conductive pads have a concave each; a solder mask, disposed on the... Agent: Bacon & Thomas, PLLC

20080257596 - Wiring board manufacturing method, semiconductor device manufacturing method and wiring board: A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and a first electrode pad 130... Agent: Rankin, Hill & Clark LLP

20080257597 - Printed circuit board manufacturing method and printed circuit board: The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present... Agent: International Business Machines Corporation Dept. 18g

20080257598 - Process for creating a durable emi/rfi shield between two or more structural surfaces and shield formed therefrom: A method for producing a durable electromagnetic and radio frequency interference shield between two or more structural members of a wall or enclosure and a shielded shelter produced using the method. In one embodiment, joints between structural members are preferably filled with an electrically conductive filler. A base coat of... Agent: John P. O'banion O'banion & Ritchey LLP

20080257599 - Electromagnetic wave absorber: A conductive pattern basically has a substantially polygonal outline shape which is a polygon and can have a high peak value of the electromagnetic wave absorption amount as compared to a case when the conductive pattern has a circular outline shape. Thus, the conductive pattern is basically a polygon and... Agent: Harness, Dickey & Pierce, P.L.C

20080257600 - Wire harness leading-out port structure of electric connection box: A wire harness leading-out opening is provided at a junction between an electric connection box and a bottom surface cover which constitute an electric connection box. A cylindrical wire harness leading-out guide is provided on the periphery of the wire harness leading-out opening, and is formed in a way that... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080257601 - Electrical apparatus and supporting frame for wall mounting same: Electrical apparatus (1) that can be fixed to a supporting frame (2) provided with a mounting window (22) suitable to receive said electrical apparatus (1), the electrical apparatus (1) comprising: —a main body having a substantially box-like shape; and—first fixing elements (8,9,10) provided on a first (3) and a second... Agent: Hogan & Hartson LLP

20080257579 - Superconducting cable and dc transmission system incorporating the superconducting cable: The invention offers a superconducting cable easy to form a twisted structure even when a plurality of cable cores are used and a DC transmission system incorporating the superconducting cable. A superconducting cable 1 has a structure formed by twisting together two types of cable cores (two first cores 2... Agent: Drinker Biddle & Reath (dc)

20080257580 - Cable harness: A cable harness is provided with electric wires arranged in rows to maintain intervals therebetween at both terminals thereof. An intermediate portion of the cable harness is divided into at least two electric wire groups and bundled. At least one of the wire bundles has a length different from those... Agent: Mcdermott Will & Emery LLP

20080257602 - Apparatus for mounting busbars: An apparatus for mounting bus bars having at least one bus bar holder which can be attached to a loadbearing structure and which has at least one foot receptacle for introducing a foot section of a bus bar and fixing the latter by a holding piece. Simple, stable mounting of... Agent: Pauley Petersen & Erickson

20080257581 - Terminal for engaging type connector: A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080257582 - Sleeve for an electrical cable: The sleeve for an electric cable comprises two bodies (2, 3) and a hinge (4). Each body (2, 3) is flexible in the profile thereof, has, in the absence of mechanical stress, a position of rest in which it is curved whereas it is designed for being bent from the... Agent: Young & Thompson

20080257583 - Layout circuit: The layout circuit comprises a first 3×2 grid array and a second 3×2 grid array. The first 3×2 grid array comprises first, second and third signal contact points and the first and second fixed potential contact points are coupled to a first fixed potential. The first and second fixed potential... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080257584 - Multilayer wiring board: A multilayer wiring board includes a substrate and even numbered wiring patterns. The substrate is made of an insulating material. Each of the even numbered wiring patterns is made of a conductive material, and the wiring patterns are laminated onto one another in a lamination direction via the substrate. One... Agent: Harness, Dickey & Pierce, P.L.C

20080257585 - Electrical power substrate: An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to... Agent: Macmillan Sobanski & Todd, LLC

20080257588 - Capacitor layer forming material, manufacturing method thereof, and printed wiring board with embedded capacitor layer obtained using capacitor layer forming material: A capacitor layer forming material that consists of a dielectric film making use of the sol-gel process excelling in production cost merit, being capable of producing a capacitor circuit of prolonged life having a nonconventional high electric capacity. There is provided capacitor layer forming material (1) having dielectric layer (4)... Agent: Rothwell, Figg, Ernst & Manbeck, P.C.

20080257586 - Flexible circuit structure with stretchability and method of manufacturing the same: A manufacturing method of a flexible circuit structure with stretchability includes the following steps. A plurality of compressible flexible bumps is formed on a flexible substrate; next, a metal circuit is formed on the flexible substrate and each of the compressible flexible bumps. When an external tensile force is applied... Agent: Workman Nydegger

20080257589 - Method for the production of expandable circuit carrier and expandable circuit carrier: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such... Agent: Barnes & Thornburg LLP

20080257587 - Rigid-flex printed circuit board with weakening structure: A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure... Agent: Rosenberg, Klein & Lee

20080257592 - Apparatus for balancing power plane pin currents in a printed wiring board using collinear slots: An apparatus for balancing power plane pin currents in a printed wiring board (PWB) provides for reduction in pin counts required for power plane (including ground plane) connections and/or reduction in requirements for connector current handling per pin. One or more slots are introduced in the metal layer implementing the... Agent: Ibm Corporation (mh) C/o Mitch Harris, Attorney At Law, L.L.C.

20080257590 - High thermal conducting circuit substrate and manufacturing process thereof: A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as... Agent: J.c. Patents

20080257591 - Printed wiring board and a method of production thereof: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080257593 - Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes: A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of... Agent: Staas & Halsey LLP

20080257594 - Printed board assembly and a method: The present invention relates to a method and a printed board assembly for use in a MicroTCA system, wherein backplane pin connectors of the printed board assembly are arranged to be received in receiving connectors of a backplane interconnect, characterized in that it comprises at least one switch unit which... Agent: Nixon & Vanderhye, PC

20080257595 - Packaging substrate and method for manufacturing the same: The present invention relates to a packaging substrate and a method for manufacturing the same. The packaging substrate includes: a substrate body, having a plurality of conductive pads on the surface thereof, wherein the top surfaces of the conductive pads have a concave each; a solder mask, disposed on the... Agent: Bacon & Thomas, PLLC

20080257596 - Wiring board manufacturing method, semiconductor device manufacturing method and wiring board: A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and a first electrode pad 130... Agent: Rankin, Hill & Clark LLP

20080257597 - Printed circuit board manufacturing method and printed circuit board: The present invention provides a method of manufacturing printed a circuit board capable of formation of via holes having a low aspect ratio and formation of fine lines, and a printed circuit board manufactured by the method. The method of manufacturing a printed circuit board 10 according to the present... Agent: International Business Machines Corporation Dept. 18g

20080257598 - Process for creating a durable emi/rfi shield between two or more structural surfaces and shield formed therefrom: A method for producing a durable electromagnetic and radio frequency interference shield between two or more structural members of a wall or enclosure and a shielded shelter produced using the method. In one embodiment, joints between structural members are preferably filled with an electrically conductive filler. A base coat of... Agent: John P. O'banion O'banion & Ritchey LLP

20080257599 - Electromagnetic wave absorber: A conductive pattern basically has a substantially polygonal outline shape which is a polygon and can have a high peak value of the electromagnetic wave absorption amount as compared to a case when the conductive pattern has a circular outline shape. Thus, the conductive pattern is basically a polygon and... Agent: Harness, Dickey & Pierce, P.L.C

20080257600 - Wire harness leading-out port structure of electric connection box: A wire harness leading-out opening is provided at a junction between an electric connection box and a bottom surface cover which constitute an electric connection box. A cylindrical wire harness leading-out guide is provided on the periphery of the wire harness leading-out opening, and is formed in a way that... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080257601 - Electrical apparatus and supporting frame for wall mounting same: Electrical apparatus (1) that can be fixed to a supporting frame (2) provided with a mounting window (22) suitable to receive said electrical apparatus (1), the electrical apparatus (1) comprising: —a main body having a substantially box-like shape; and—first fixing elements (8,9,10) provided on a first (3) and a second... Agent: Hogan & Hartson LLP

20080251291 - Cable duct: A cable duct is provided for cables to be laid along walls or tops of subterranean tubes, ducts, etc. for the transport of water, energy, data, optical fiber cables, etc. The cable duct is installed in the tube from a surface through access shafts and fixed to the duct. The... Agent: Lerner Greenberg Stemer LLP

20080251270 - Coaxial cable: A coaxial cable (10) includes at least one conducting wire (110), at least one insulating layer (120) coating a respective conducting wire (110), at least one shielding layer (130) surrounding the at least one insulating layer (120), and a single sheath (140) wrapping the at least one shielding layer (130).... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080251271 - Water-resistant wire coil, wire winding, and motor, and method of increasing motor power: A water-resistant wire coil includes a coated wire with a conductor and a covering. The covering is prepared from a composition that includes a poly(arylene ether), a polyolefin, and a hydrogenated block copolymer. The wire coil is useful for the fabrication of wire windings for the rotors and/or stators of... Agent: Cantor Colburn LLP - Sabic (noryl)

20080251272 - Flexible electric control cable: A description is given of a flexible electric control cable in which one or more layers of control wires are stranded on a central element and the at least one layer of control wires is surrounded by an outer jacket, the central element (1) comprising at least one pair of... Agent: Sofer & Haroun LLP.

20080251274 - Coaxial cable: A coaxial cable (10) includes at least one conducting wire (110), at least one insulating layer (120) coating a respective conducting wire (110), at least one shielding layer (130) surrounding the at least one insulating layer (120), and a single sheath (140) wrapping the at least one shielding layer (130).... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080251276 - Data cable with cross-twist cabled core profile: Cables including a plurality of twisted pairs of insulated conductors and a jacket surrounding the plurality of twisted pairs of insulated conductors, the jacket including a plurality of protrusions extending away from an inner circumferential surface of the jacket toward a center of the cable. The plurality of protrusions are... Agent: Lowrie, Lando & Anastasi, LLP

20080251275 - Decoupling transmission line: Devices and methods are described for storing and dispensing electrical energy. A device comprises first and second electrical conductors. An insulator separates the first and second electrical conductors. The first and second electrical conductors can be formed in a folded, linear, stacked, coiled, or coaxial configuration relative to each other.... Agent: Courtney Staniford & Gregory LLP

20080251273 - Plenum cable flame retardant layer/component with excellent aging properties: The present invention is a plenum cable component with excellent fire retardant and aging properties. The plenum cable component is prepared from a polyolefin-based composition, containing an olefinic polymer and a surface treated metal hydroxide. Depending upon the surface treatment, the composition may comprise other components. The present invention is... Agent: The Dow Chemical Company

20080251277 - Data transmission cable pairs and cables and methods for forming the same: A data transmission pair includes first and second longitudinally extending electrical conductors each having a longitudinally extending, substantially flat side surface. The first and second conductors are paired such that their respective flat side surfaces face one another. The pair further includes an insulation cover having a separator portion and... Agent: Myers Bigel Sibley & Sajovec

20080251278 - Recycling printed circuit boards: A method of recycling radio frequency printed circuit boards comprising track material printed on a laminate having a known dielectric constant using the steps of separating the substrate of one or more circuit boards from the track material; and processing the separated material to form a thin layer of substrate... Agent: Seed Intellectual Property Law Group PLLC

20080251279 - Wiring board and method of manufacturing the same: A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein... Agent: Rankin, Hill & Clark LLP

20080251280 - Soldering structure between circuit boards: A substrate coupling structure including a flexible circuit board having first conductors provided thereon, a rigid circuit board having second conductors provided thereon so as to face the first conductors, solder plating disposed on at least one of the first conductors and the second conductors, and an insulating layer which... Agent: Sughrue Mion, PLLC

20080251281 - Electrical interconnect structure and method: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect... Agent: Schmeiser, Olsen & Watts

20080251282 - Highly thermally conductive circuit substrate: A highly thermally conductive circuit substrate includes a metallic substrate, an insulated layer, a first medium layer, and an electrically conductive layer. The insulated layer is formed on a surface of said metallic substrate. The first medium layer is formed on a surface of said insulated layer. The electrically conductive... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20080251283 - Mounting substrate and electronic device: A mounting substrate includes: a mounting area on which an electronic element is mounted; an electrode forming area on which electrodes are formed and which is formed to surround the mounting area; and a dam member which is formed on a boundary between the mounting area and the electrode forming... Agent: Rankin, Hill & Clark LLP

20080251285 - Capacitor and wiring board including the capacitor: A capacitor is provided having a tough surface portion which prevents cracking that tends to occur when the capacitor is built-in or surface-mounted on a wiring board. A ceramic sintered body of the capacitor includes a capacitor forming layer portion, a cover layer portion and an interlayer portion. The capacitor... Agent: Stites & Harbison PLLC

20080251284 - Electronics structures using a sacrificial multi-layer hardmask scheme: An electronic structure including a substrate having a having a dielectric layer with at least one metallic interconnect structure within and a dielectric barrier layer above the dielectric layer, and a multi-layer hardmask stack coated with a self-assembled layer, where the self-assembled layer is a pattern of nanoscale and/or microscale... Agent: Nugent & Smith, LLP

20080251286 - Method for increasing a routing density for a circuit board and such a circuit board: A multi layer circuit board (MPCB) is disclosed that is comprised of a first layer and a fourth layer substantially parallel to the first layer. Pluralities of electrical contacts are formed on the first layer of the multilayer circuit board and are disposed in a first grid. The plurality of... Agent: Philips Intellectual Property & Standards

20080251288 - Multilayer high-frequency circuit board: A multilayer high-frequency circuit board includes a signal line, ground layers, and an interlayer circuit. A signal line where a high-frequency signal flows is formed in the signal line layer. The ground layers are laminated on both sides of the signal line layer, each of which is grounded. The interlayer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080251287 - Substrate and method for manufacturing the same: A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of... Agent: Drinker Biddle & Reath (dc)

20080251289 - Device for repair of a contact pad of a printed circuit board: Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed... Agent: Tsc Hunting Products, LLC

20080251290 - Shielding apparatus: A shielding apparatus for electromagnetic testing comprises a platform, a lid, a driving unit, a pulley system, and a counterbalance. The platform is for placing an electronic device to be tested. The lid is for covering the platform to define a closed space. The driving unit is for lifting and... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080245543 - Monolithic integrated circuit arrangement: A monolithic integrated circuit arrangement is provided that includes a first circuit component, which is formed as a differentially supplied coil and has at least one conductor loop encompassing an interior region, and at least one additional circuit component. According to an embodiment of the invention, the additional circuit component... Agent: Muncy, Geissler, Olds & Lowe, PLLC

20080245544 - Control module housing: A housing unit for securing electronics of a control module to a vehicle may include a housing and at least two connection members. The connection members connected to the housing may be adapted to engage an adaptor member (e.g., bracket) configured to be secured to a vehicle. The connection members... Agent: Patton Boggs LLP

20080245545 - Metal-sealing material-feedthrough: Metal-sealing material-feedthrough, especially for devices which are subjected to high pressures, include at least one metal pin located in a sealing material in a feedthrough opening in a base body, whereby the at least one metal pin is enveloped at least partially by a conductive component element, so that a... Agent: Taylor & Aust, P.C.

20080245546 - Paint shield: A paint shield for covering an electrical device has a generally planar plate with an attachment element connected thereto. The attachment element releasably engages one or more of a standard wall switch, a decor type switch or a socket. At least one overspray wall on the rear face of the... Agent: Cook Alex Ltd

20080245565 - Device for connecting a basic electrical component and an additional electrical component to a supply network, especially of a motor vehicle, and methods for the production of such a connecting device: The invention relates to a device for connecting a basic electrical component and an additional electrical component to a supply network, especially of a motor vehicle, and several methods for producing such a connecting device. Said device comprises at least one first contact to which the supply network can be... Agent: Foley And Lardner LLP Suite 500

20080245566 - Adaptor and testing device for electrical connector: An adaptor is for electrically connecting with pins of an electrical connector. The adaptor includes an insulating housing, a pair of crimping connectors, and two connecting members. The insulating housing includes two holes. The crimping connectors are accommodated respectively in the holes. Each crimping connector includes a first crimping portion... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080245567 - Electrical bifurcated splice: An electrical bifurcated splice and splice terminal. An electrical bifurcated splice terminal comprises two wireways configured such that a continuous wire may be placed in both wireways; a post separating the two wireways and configured such that the continuous wire may be positioned around the post; and two crimps, each... Agent: John H. Holcombe IBM Corporation,IPLaw Dept.

20080245547 - Cable and apparatus interconnection close quarters environmental seal: A sealing assembly for a cable to apparatus electrical interconnection. The assembly having a unitary cylindrical gasket, the outer diameter of the cylindrical gasket provided with an insertion opening to an interconnection cavity; the insertion opening having a generally circle sector shape at a cable end and an apparatus end,... Agent: Babcock Ip, PLLC

20080245548 - Conductive tape and method for making the same: The present invention relates to a conductive tape. The conductive tape includes a base, an adhesive layer, and a carbon nanotube layer. The adhesive layer is configured for being sandwiched between the base and the carbon nanotube layer. And a method for making the conductive tape includes the steps of:... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080245549 - Wiring board and method of manufacturing the same: In a method of manufacturing a wiring board, the method includes: (i) forming a plurality of conductive patterns to come into contact with a support plate; (ii) forming a resin layer to cover the plurality of conductive patterns and to come into contact with the support plate; (iii) forming another... Agent: Rankin, Hill & Clark LLP

20080245550 - Electronic component and method for manufacturing the same: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities... Agent: Mcdermott Will & Emery LLP

20080245551 - Circuit board structure for embedding semiconductor chip therein and method for fabricating the same: A semiconductor chip-embedded circuit board and a fabrication method thereof are provided, including: a core board having first and second surfaces with first and second circuit layers thereon respectively, the first surface having a chip-receiving area (CRA); a laminated layer formed on the first and second surfaces and formed with... Agent: Schmeiser Olsen & Watts

20080245552 - Printed wiring board with enhanced structural integrity: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face... Agent: Allen, Dyer, Doppelt, Milbrath & Gilchrist

20080245553 - Interconnection, electronic device and method for manufacturing an electronic device: An interconnection includes a bundle of conductive members, each of the conductive members being made of carbon nanotube having an end connected to a first conductive film, and another end connected to a second conductive film separated from the first conductive film; and carbon particles each having a diamond crystal... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080245554 - Fabrication method and structure of pcb assembly, and tool for assembly thereof: A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing... Agent: Quintero Law Office, PC

20080245555 - Circuit substrate with plated through hole structure and method: A circuit substrate includes an outer plated through hole structure and an inner plated through hole structure located within the outer plated through hole structure. In one example, the circuit substrate includes a core and an outer plated through hole structure having a first metal layer configured over the core... Agent: Advanced Micro Devices, Inc. C/o Vedder Price P.C.

20080245557 - Optimizing asic pinouts for hdi: Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer... Agent: Patterson & Sheridan, LLP/cisc

20080245556 - Optimizing the pcb layout escape from an asic using hdi: Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer... Agent: Patterson & Sheridan, LLP/cisc

20080245558 - Via structure of printed circuit board: A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang

20080245559 - Variable interconnect geometry for electronic packages and fabrication methods: Disclosed is a variable interconnect geometry formed on a substrate that allows for increased electrical performance of the interconnects without compromising mechanical reliability. The compliance of the interconnects varies from the center of the substrate to edges of the substrate. The variation in compliance can either be step-wise or continuous.... Agent: Law Offices Of Kenneth W. Float

20080245560 - Combined environmental-electromagnetic rotary seal: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the... Agent: Benman, Brown & Williams

20080245561 - Housing for shielding from electromagnetic interference: Housing for shielding from electromagnetic interference, comprising a first housing component with a first VELCRO-type fastening element and a second housing component with a second VELCRO-type fastening element each made of conductive material, wherein an aperture between the first housing component and the second housing component is closed in an... Agent: Marshall, Gerstein & Borun LLP

20080245562 - Screened housing with press-fit pins and method for production thereof: A screened housing (1) with press-fit pins (2) for electrical contacting on an electrical support component, in particular for automobile application, is composed of two housing sections (14,15) each comprising a housing base (3) each with two housing edges (4) with press-fit pins (2). Above all a screened housing is... Agent: Baker Botts L.L.P. Patent Department

20080245563 - Electromagnetic wave shielding device: An electromagnetic wave shielding layer 1 comprises a transparent substrate 11, an adhesive layer 13 which is provided as needed, an electromagnetic wave shielding layer 15, and a transparent resin layer 17. The electromagnetic shielding layer 15 includes a mesh portion 103 facing a screen portion 100 of an image... Agent: Oliff & Berridge, PLC

20080245564 - Power feeding box: A power feeding box includes an electric wire for feeding a power to a movable body to be moved in up-and-down directions and a housing unit contains a surplus length of the electric wire. The housing unit includes an inlet port which is provided on an upper side of the... Agent: Sughrue-265550

20080236890 - Method for connecting two objects electrically: A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the... Agent: Baker Botts LLP C/o Intellectual Property Department

20080236856 - Damper assembly staking system: A damper assembly staking system that provides for staking damper weights onto a messenger is disclosed. The damper assembly comprises at least one damper weight with a forked side which accepts a messenger. A hole is drilled in the forked side of the damper weight to receive the messenger. A... Agent: Amin, Turocy & Calvin, LLP

20080236858 - Cable management system: Embodiments of the present invention are directed to a cable management system. In one embodiment, the cable management system comprises a housing, a plurality of baffles extending from the housing, wherein the plurality of baffles are configured to resist movement of a connector relative to a port in a connection... Agent: Hewlett Packard Company

20080236857 - Method and system for preventing intrusion of poured concrete in an electrical or telecommunications box: The present invention is directed to a method and system for preventing intrusion of viscous poured concrete into electrical or telecom boxes using resilient members having a top surface that fills the surface opening of the box it is inserted into where the spring back of the resilient member insures... Agent: Drinker Biddle & Reath LLP Attn: Patent Docket Dept.

20080236859 - Protective device plate for an electrical box: A protective cover for an electrical device mounting structure that includes a generally rectangular plate defined by a perimetrical edge and having a front side, a back side, a right side, a left side, a top and a bottom. The protective cover can also include one or more tabs extending... Agent: Hoffmann & Baron, LLP

20080236860 - Electrical switch cover: A cover for temporarily covering a switch positioned within an electrical housing includes a panel section that can be removably attached to the electrical housing, and a casing shaped and sized to cover and contact the switch. The casing is mounted on the panel for a predetermined range of sliding... Agent: Adams Intellectual Property Law, P.A.

20080236889 - Connection structure for small diameter shielded cable: A shielded cable connection structure includes a plurality of shielded cables. Each of the shielded cables has a center conductor, a shielding conductor, and an insulative jacket. A metal grounding member has at least two rows of mutually parallel substantially comb shaped teeth. The comb shaped teeth in each of... Agent: Barley Snyder, LLC

20080236861 - Kit or set comprising at least two differently dimensioned types of cable glands: A kit or set made up of a number of differently dimensioned types of cable glands, which can each be used to hold and fix cables of different diameters or dimensions, respectively including two differently dimensioned clamping or sealing inserts so that the cable can be clamped at an outer... Agent: Volpe And Koenig, P.C.

20080236862 - Electrical conduit body: The electrical conduit body has a base section and an end section that forms an oblong box when joined together, and a cover removably attached to the box. The base section and the end section each have a semicircular recess forming a first port through the back wall opposite the... Agent: Mckinney Law, LLC Suite 2300

20080236863 - Direct bury splice kit: A decoder system and a direct bury splice kit for in situ encapsulation of an electrical wire and wire connector wherein the encapsulation minimizes separating forces between the joined wires in the wire connector... Agent: Carl L. Johnson Jacobson And Johnson

20080236864 - Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom: Disclosed herein is a composition comprising: a cross linked polysiloxane/polyimide block copolymer having a siloxane content of 10 to 45 weight percent, based on the total weight of the block copolymer, wherein the cross linked polysiloxane/polyimide block copolymer has a heat distortion temperature measured at 0.44 megaPascals that is at... Agent: Cantor Colburn, LLP

20080236865 - Electrical-discharge-inhibiting conformable layer for use in inner-cooled coils: A conformable layer (14) for inhibiting electrical discharge between vent tubes (16) and strands (12) in an inner-cooled coil (5). The conformable layer comprises a resistive inner core (24) and a conductive strip (20) wrapped in a conductive outer wrap (26). The conductive strip (20) is electrically connected to the... Agent: Siemens Corporation Intellectual Property Department

20080236866 - Multifuncional connection cord for multimedia device: A multifunctional connection cord having data and power interfaces for a personal computer and audio interface for an earphone is provided. A multifunctional connection cord of the present invention includes a stem; an audio plug mounted to protrude from one side of the stem for establishing audio signal lines with... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20080236867 - Electrical cable: An electrical cable includes insulated primary conductors and at least one insulated secondary conductor, which extend along the cable. The primary conductors define interstitial spaces between adjacent primary conductors, and the primary conductors have approximately the same diameter. The primary conductors include power conductors and a telemetric conductor. The secondary... Agent: Schlumberger Ipc Attn: David Cate

20080236868 - Electronic apparatus with flexible flat cable for high-speed signal transmission: According to one embodiment, a flexible flat cable includes a plurality of ground lines and a plurality of signal lines. Each of the ground lines is connected to an electromagnetic shield layer by two connection line members. An arrangement of the ground lines and signal lines that are positioned in... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080236869 - Low resistivity joints for joining wires and methods for making the same: Method for joining wires using low resistivity joints is provided. More specifically, methods of joining one or more wires having superconductive filaments, such as magnesium diboride filaments, are provided. The wires are joined by a low resistivity joint to form wires of a desired length for applications, such in medical... Agent: General Electric Company (pcpi) C/o Fletcher Yoder

20080236870 - Electronic component and method for manufacturing the same: A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080236871 - Gas venting component mounting pad: Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC C/o Intellevate, LLC

20080236872 - Printed wiring board, process for producing the same and semiconductor device: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base... Agent: The Webb Law Firm, P.C.

20080236874 - Devices and methods for producing electrical conductors: A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate,... Agent: Lowrie, Lando & Anastasi, LLP

20080236873 - Electronic component and method for manufacturing the same: An electronic component is: formed by laminating multiple conductive films and multiple insulating films; and provided with an extraction electrode which is extracted to be exposed from the insulating films for establishing connection to another electrode. The electronic component includes a shield film configured to cover an interface between the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080236875 - Wiring structure and method of forming the same: A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080236876 - Multilayer printed circuit board: The multilayer printed circuit board according to the present invention is a multilayer printed circuit board, in which conductor circuits and insulating layers are formed and layered, an optical path for transmitting an optical signal comprising a resin composite is formed, and conductor circuits are formed on an outermost insulating... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080236877 - Power core devices and methods of making thereof: A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core so that... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080236878 - Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor: There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal... Agent: Mcdermott Will & Emery LLP

20080236879 - Circuit board and method of manufacturing the same, and circuit device and method of manufacturing the same: Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover... Agent: Fish & Richardson P.C.

20080236880 - Mounting board including a flat-type electrical element and capable of being reduced in size, and lead-attached electric element that is flat in shape and has a lead bonded to each electrode face: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080236881 - Multilayer printed wiring board and method for manufacturing the same: A multilayer printed wiring board includes a first insulating layer, a pair of second insulating layers sandwiching therebetween the first insulating layer, a pair of internal-layer wiring trace formed between the first insulating layer and the second insulating layer, and an external-layer wiring trace formed on the exposed surface of... Agent: Jackson Chen Nec Corporation Of America

20080236882 - Circuit board and method of manufacturing same: The present invention provides a circuit board and a method for manufacturing the circuit board, the circuit board and method allowing a further shorter connection distance between electrodes of a semiconductor device, and also allowing a sufficient thickness of a solder pre-coat in a soldering process. The circuit board comprises... Agent: Nixon & Vanderhye, PC

20080236883 - Structures for implementing emi shielding for rigid cards and flexible circuits: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition... Agent: Ibm Corporation RochesterIPLaw Dept 917

20080236884 - Method and apparatus for finished installation of electrical outlet box without use of external cover plate: An electrical outlet box installation in which there is no exposed cover plate, only the operative portion of the electrical component is visible at the wall surface. The operative portion of the component may be an electrical outlet, jack, switch, knob, or light, for example. The body of the electrical... Agent: Todd N. Hathaway

20080236885 - Thin film device and method for manufacturing the same: A terminal electrode body on a substrate is exposed relative to a resin layer, protruding out beyond the side of the resin layer. That is, the terminal electrode body is not covered by the resin layer. The electronic element is covered by an insulating layer and the terminal electrode body... Agent: Oliff & Berridge, PLC

20080236886 - Panel box: The invention concerns a panel box, for the electrical connection of a photovoltaic module for a solar installation, with a base piece (1) for mounting on the photovoltaic module and for the electrical connection of a connection line of the photovoltaic module, and with another part for placement on the... Agent: Rankin, Hill & Clark LLP

20080236887 - Mounting assembly: A mounting assembly comprising: a first housing portion adapted to be mounted to an object, the first housing portion having a first opening and a plurality of pins located in the opening and a first portion of a closing mechanism located on the outside of the first housing portion; and... Agent: Pelco

20080236888 - Power cord fixing structure: As well as forming a notch in a rear extreme of a rib wall protruding integrated with a rail which supports a main substrate, in which is locked a power cord pulled in a right direction across the rail, a rib which presses into a groove of a bush from... Agent: Morgan Lewis & Bockius LLP