Electricity: conductors and insulators inventions 09/08

20080230249 - System for conducting away lightning currents and/or fault currents: The invention relates to a system (1) for conducting lightning currents and/or fault currents away from a roof area (2) and/or façade area of a building (3) to the ground (4). According to the invention, the system is equipped with at least one strip (5), which is laid in the... Agent: Jason H. Vick Sheridan Ross, PC

20080230265 - Electric power cable fixing apparatus for an insulator: The present invention relates to an apparatus fixing power cable to insulator, which clamps the head of an insulator to fix power cable to the insulator head, easily and firmly. To this end, the apparatus in accordance with the present invention comprises; a main body formed with a vertical through... Agent: Blakely Sokoloff Taylor & Zafman LLP

20080230268 - Flexible wiring cable: A flexible wiring cable includes a first wiring assembly connected to a load, a second wiring assembly connected to the first wiring assembly and extending toward an external signal source, and a circuit element mounted on the first wiring assembly to drive the load. The second wiring assembly is connected... Agent: Baker Botts LLP C/o Intellectual Property Department

20080230269 - Crimp contact for an aluminum stranded wire, and cable end structure of an aluminum stranded wire having the crimp contact connected thereto: A crimp contact for an aluminum stranded wire having a serration 5 provided in an inner face 1b of a crimping portion 1 of the crimp contact, wherein a ratio d/e is 0.33 or more, in which d represents a depth of a groove 4 constituting the serration 5 and... Agent: Birch Stewart Kolasch & Birch

20080230250 - Clamping device for clamping fittings in electric board channels: The invention relates to a clamping device for clamping fittings in electric board channels, comprising a rod element which can be engaged in a cavity formed in electric component channels and coupled, through an end piece, to a fitting supporting body, the supporting body being adapted to be locked on... Agent: Hedman & Costigan P.C.

20080230251 - Crosslinked automotive wire having improved surface smoothness: The present invention is a crosslinked automotive wire comprising a metal conductor, a flame retardant insulation layer surrounding the metal conductor, and optionally, a wire jacket surrounding the insulation layer. The automotive wire passes the specifications of one or more several automotive cable testing protocols: (a) SAE J-1128, (b) ISO-6722,... Agent: The Dow Chemical Company

20080230252 - Printed micro coaxial cable: A printed micro coaxial cable has a first metal shield layer, a first insulative layer formed on the first metal shield layer, and a conductive layer printed on the first insulative layer. The conductive layer includes a plurality of conductive transmitters spaced from each other. Two conductive transmitters are defined... Agent: Rosenberg, Klein & Lee

20080230253 - Roebel winding with conductive felt: A conductive filler comprising a conductive felt and a non-conductive resin for use in a Roebel bar or winding and the manufacture of the conductive filler and Roebel bar or winding.... Agent: Pearne & Gordon LLP

20080230254 - Transmission cable: A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer formed on a back surface of the... Agent: Bell, Boyd & Lloyd, LLP

20080230255 - Electrode pattern and wire bonding method: An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and... Agent: Leydig Voit & Mayer, Ltd

20080230256 - Structure and method for a twisted bus bar for low impedance power distribution and electromagnetic field suppression: A twisted pair symmetric bus bar structure for electric power distribution includes a first conductor; a second conductor; an insulator; wherein the first conductor and the second conductor form an interwoven alternating interlocking pattern; wherein the first and second conductors are formed from a series of Z-shaped sections; wherein the... Agent: Cantor Colburn LLP - IBM Rochester Division

20080230257 - Grommet and assembling method therefor: A grommet 1 has a central shaft 2 through which a wire harness 5 is inserted. A circular connection portion 31 is provided continuously to the periphery of the central shaft 2. A convex cross-sectionally V-shaped ring-like lip 32 is extensibly provided to the circular connection portion 31 in the... Agent: Sughrue-265550

20080230258 - Printed circuit board, design method thereof and mainboard of terminal product: A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of... Agent: Leydig, Voit & Mayer, Ltd (for Huawei Technologies Co., Ltd)

20080230259 - Method and structure for implementing control of mechanical flexibility with variable pitch meshed reference planes yielding nearly constant signal impedance: A method and structure are provided for implementing flexible circuits of various electronic packages and circuit applications. A meshed reference plane includes a variable mesh pitch arranged for control of mechanical flexibility. A dielectric core separates a signal layer from the variable pitch meshed reference plane. An electrically conductive coating... Agent: Ibm Corporation RochesterIPLaw Dept 917

20080230260 - Flip-chip substrate: A flip-chip substrate is disclosed, which comprises a core substrate including an aluminum oxide substrate and a first circuit layer, wherein the aluminum oxide substrate has a top surface, a bottom surface, and a plurality of conductive through holes, the conductive through holes connect the top surface and the bottom... Agent: Bacon & Thomas, PLLC

20080230261 - Thermosetting resin composition and use thereof: A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.... Agent: Sughrue Mion, PLLC

20080230262 - Electrically stable copper filled electrically conductive adhesive: An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper... Agent: Nugent & Smith, LLP

20080230263 - Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board: The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution... Agent: Sughrue Mion, PLLC

20080230264 - Interconnection structure and method thereof: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump... Agent: Snell & Wilmer L.L.P. (main)

20080230266 - Devices and methods for flangeless installations: A flangeless mounting system, suitable for in-wall speakers and other components, includes a panel that is finished to provide at least a superficially continuous junction between the edges of the panel and the surrounding wall, ceiling, or other structure. A rim advantageously extends outwardly from a first surface of the... Agent: Fish & Associates, PC Robert D. Fish

20080230267 - Quick insert clamp for metal boxes: A dual-clamp device attaches a pair of metal clad cables to a junction box. The clamp device is integrally formed defining a pair of side-by-side cable receiving members separated by a central web. Each cable receiving member is generally in the form of an elongate split cylinder permitting radial resilient... Agent: Hoffmann & Baron, LLP

20080223596 - Aqueous-based insulating fluids and related methods: Provided herein are compositions that include an aqueous-based insulating fluid that comprises an aqueous base fluid, a water-miscible organic liquid, and a synthetic polymer. In another embodiment, provided herein is a method of forming an aqueous-based insulating fluid comprising: mixing an aqueous base fluid and a water-miscible organic liquid to... Agent: Craig W. Roddy Halliburton Energy Services, Inc.

20080223597 - Electrical connection box: An electrical connection box includes a circuit casing comprising a casing for accommodating a circuit structure therein and a cover, a lower connector housing disposed on the lower surface side of the circuit casing and connectable to an external connector, and a plurality of lower on-bus-bar terminals for electrically connecting... Agent: Oliff & Berridge, PLC

20080223598 - All environment communications enclosure: A communications enclosure apparatus for use in a power line communications network, including a box, the box including a connection mechanism to connect the box to a standard interface of an electricity device, and the box including a water proofing system to provide the communications enclosure with all environment functionality.... Agent: Mainnet Communications

20080223599 - Electrical junction box: An electrical junction box for securing an electrical device substantially behind the exterior of a building structure to protect it from rain and other elements includes a box-shaped housing having a top wall, a bottom wall, side walls, a back wall, a front opening, a front edge surrounding the front... Agent: King & Spalding LLP

20080223600 - Two-gang adjustable mud ring: This invention pertains to an adjustable cover for an electrical outlet box. The cover is configured having a generally planar mounting plate with a collar surrounding an opening through this mounting plate. An extension sleeve moves within this opening and adjacent the collar. At least one fastener is located adjacent... Agent: Hoffmann & Baron, LLP

20080223601 - Weatherproof cover and hinge assembly: A cover assembly for attaching to an electrical box includes a base plate, a body and a cover hinged to the body. The assembly is mounted to the electrical box to protect an electrical device from moisture while allowing access to the electrical device. Hinge members are provided that are... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20080223613 - Repositionable insulator: A repositionable insulator housing for an angle connector formed from first and second housing sections that are joined together. Each housing section has an exterior surface and a base portion that includes an end wall, a pair of opposing side walls and a back wall. Each of the end walls... Agent: Hoffmann & Baron, LLP

20080223614 - Sleeve adapted for a crimping process: A branch sleeve adapted to carry out a crimping process around mutually parallel electrically conductive conductor sections. The sleeve includes a first groove-shaped recess which connects with a second groove-shaped recess and with an open part that extends between the recesses. The first recess is adapted to freely embrace or... Agent: The Maxham Firm

20080223602 - Polysiloxane/polyimide copolymer blends: A thermoplastic composition comprises a polysiloxane/polyimide block copolymer and a polyester/polyether block copolymer. The polysiloxane/polyimide block copolymer has 5 to 50 weight percent (wt %) polysiloxane, based on the total weight of the polysiloxane/polyimide block copolymer. The polyester/polyether block copolymer has 5 to 30 wt % polyether based on the... Agent: Cantor Colburn, LLP

20080223603 - Capacitor embedded printed circuit board: A capacitor embedded printed circuit board (PCB), the PCB including: a multilayer polymer capacitor layer where a plurality of polymer sheets is laminated; one or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets and alternately disposed to form a... Agent: Mcdermott Will & Emery LLP

20080223604 - Process for preparing an electrically stable copper filled electrically conductive adhesive: A process for preparing an electrically conductive adhesive (ECA) with low and stable contact resistance by mixing at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is... Agent: Nugent & Smith, LLP

20080223605 - Embedded circuit board and process thereof: An embedded circuit board including a glass fiber layer, two dielectric layers, and two circuit layers is provided. The glass fiber layer has a first surface and a second surface corresponding to the first surface. The dielectric layers are disposed on the first surface and the second surface, respectively. The... Agent: J C Patents, Inc.

20080223606 - Ceramic substrate and method for manufacturing the same: A chip-mounted substrate includes a chip electronic component on a ceramic substrate having surface electrodes. The chip electronic component includes a ceramic sintered compact defining an element assembly and terminal electrodes. The surface electrodes of the ceramic substrate are integrated with the corresponding external terminal electrodes by sintering.... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080223609 - Electronic device and electronic component mounting method: According to an aspect of an embodiment, an electronic device comprises a bonding material, an electronic component providing a plurality of pads on a bottom surface thereof, and a printed circuit board providing a plurality of pads on a surface thereof, at least one of the pads of the printed... Agent: Staas & Halsey LLP

20080223607 - Wiring board and capacitor to be built into wiring board: An intermediate board has a board core formed by a main core body and a sub-core portion. The main core body has a plate-like shape and includes an open sub-core housing portion in which the sub-core portion is housed. A first terminal array of the board core has an area... Agent: Stites & Harbison PLLC

20080223608 - Wiring substrate and electronic device: A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080223610 - Bga package substrate and method of fabricating same: Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.... Agent: Darby & Darby P.C.

20080223611 - Printed wiring board and electric apparatus: A printed wiring board having a wiring layer formed by a wiring pattern for wiring an electronic circuit comprised of an electric part mounted thereon and including a connecting terminal, a first conductor layer formed by a first conductor pattern that is maintained at either a power potential or a... Agent: Staas & Halsey LLP

20080223612 - Wiring substrate and manufacturing method thereof: In a wiring substrate, a wiring pattern is formed on a substrate. An insulating layer covers the substrate. A connection part of the wiring pattern is exposed from the insulating layer. A pedestal for mark is formed on the substrate. An alignment mark is formed on the top part of... Agent: Rankin, Hill & Clark LLP

20080217053 - Insulation barrier for high voltage power lines and method of installation of same: The present invention relates to an insulated barrier preventing wildlife from simultaneously contacting an electrically energized and an electrically grounded surface, comprising: electrically insulated radially and axially extending members forming an hexagonal web having a first hexagonal rib that defines an opening offset from the geometric center of the barrier;... Agent: Howard Ip Law Group

20080217041 - Grounding wire structure having stainless steel covering and method of manufacturing the same: The present invention provides a grounding wire structure having a stainless steel covering and a method of manufacturing the grounding wire structure. In the present invention, first and second hollow connection frames (4) and (4′), each of which has a compressing groove (4a), (4a′) and an internal thread (4b), (4b′),... Agent: Levine & Mandelbaum

20080217042 - Method for making rail bonds: A rail bond for bonding a wire or cable to a surface of rail includes a copper sheet and weld metal material solidified from molten metal material. A copper or other metal sheet is placed against the surface of the rail where the bond is to be located, and against... Agent: Jonathan A. Platt Renner, Otto, Boisselle & Sklar, LLP

20080217055 - Electrical wire connector with temporary grip: An electrical connector includes a crimpable tubular body including a receiving portion for receiving a wire conductor via an opening at a longitudinal end of the tubular body. The tubular body provides a permanent electrical connection to the wire conductor only upon at least a portion of the tubular body... Agent: Edell, Shapiro & Finnan, Llc

20080217056 - Duct assemblies for housing service cables, pipes and the like and components thereof: A channel shaped extruded duct unit cooperates with an identical duct unit to form a closed duct therewith. The duct unit has at least one integral longitudinally extending attachment formation configured to hold captive relative to the duct unit a plurality of complementary clamp elements adapted to operatively encircle a... Agent: Christensen, O'connor, Johnson, Kindness, Pllc

20080217043 - Fire-retarding cable conduit for electrical lines in regions potentially exposed to fire in aircraft: The base body including an intumescent plastic foam material, in the event of a fire, the electrical lines that extend into the interior space are protected, at least temporarily, against the effect of the flames and/or of the combustion gases. Furthermore, the electrical lines may be placed in the cable... Agent: Christopher Paradies, Ph.d.

20080217044 - Coupled building wire assembly: A coupled building wire assembly is provided wherein more than one length of NM cable having the same or different gauges are coupled together that permits one to pull multiple lengths of cable from a single coil. The exterior surfaces of the coupled building wire assembly is also coated with... Agent: Gardere Wynne Sewell LLP Intellectual Property Section

20080217045 - Underlay substrate, screen printing method and manufacturing method of printed circuit substrate: A plurality of through holes having an equal size are formed in an underlay substrate. Positions of the plurality of through holes are suitably set according to the shape of a substrate sheet. Specifically, an equal number of through holes are formed in each of end blank corresponding regions that,... Agent: Panitch Schwarze Belisario & Nadel LLP

20080217047 - Circuit board surface structure: A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to... Agent: Schmeiser Olsen & Watts

20080217046 - Circuit board surface structure and fabrication method thereof: A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating protective layers formed on the surface of the circuit... Agent: Schmeiser Olsen & Watts

20080217048 - Wired circuit board and producing method thereof: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer and including a wire and a terminal portion, an insulating cover layer formed on the insulating base layer and having an opening portion to expose the terminal portion, and a metal thin... Agent: Akerman Senterfitt

20080217049 - Embedded capacitive stack: A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early... Agent: Loza & Loza

20080217050 - Multi-layered interconnect structure using liquid crystalline polymer dielectric: A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first... Agent: Scully, Scott, Murphy & Presser, P.c.

20080217051 - Wiring board and method of manufacturing wiring board: A wiring board including a plated through hole provided on the wiring board, and an indicator provided around the plated through hole. The indicator indicating a processing state related to the plated through hole.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080217052 - Wiring board and method of manufacturing wiring board: A wiring board including a plated through hole formed in the wiring board; a test plated through hole or a test via hole provided in the surrounding area of the plated through hole to check a processing state related to the plated through hole; and a conductive pattern used to... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080217054 - Gang box clip: It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interject or limit... Agent: Michael P. Walton

20080210452 - Extendable while-in-use cover: An expandable while-in-use cover includes: a cap having a pair of cap side walls, a first cap end wall, a second cap end wall and a top wall, which define a cap opening and a cap interior; a base having a pair of base side walls, a first base end... Agent: Hoffmann & Baron, LLP

20080210453 - Water-soluble polymer coating for use on electrical wiring: A water-soluble polymer coating for application to electrical wiring used in aircraft and other electrical structures is provided. The coating includes a water-soluble polymer such as polyvinyl acetate, polyvinyl alcohol, and methyl cellulose which is dissolved in water to form a solution. The solution may be applied to electrical wiring... Agent: Dinsmore & Shohl LLP

20080210454 - Composite superconductor cable produced by transposing planar subconductors: A method of forming a low AC loss, fully transposed cabled superconductor from multiple superconducting subconductors cut in a serpentine form from a wider superconducting tape is disclosed. By assembling pre-cut subconductor tapes a cable with a short transposition pitch length can be formed without excessive in-plane or out-of-plane deformation... Agent: Dann, Dorfman, Herrell & Skillman

20080210455 - Hermetically-sealed feed-through device and method of assembly: A method of making a hermetically-sealed feed-through device includes inserting an elongate conductor or conductors within a hollow portion or portions of a plastic insulator body and inserting the plastic insulator body within a hollow outer jacket to form an assembly. At least one of the conductor or conductors, insulator... Agent: Howson And Howson

20080210456 - Method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and resulting device: The invention concerns a method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and the resulting device. The invention is characterized in that it consists in: coating the non-developable surface (6) uniformly with a layer of electrically conductive material (9), which is in turn coated... Agent: Stevens Davis LLP

20080210457 - Tape carrier for semiconductor device and method for making same: A tape carrier for semiconductor device has a resin tape provided with an opening section for bonding, and a wiring lead formed on the resin tape. The wiring lead has a notched section disposed in the opening section and including a notch width WN, and a lead width WL at... Agent: Foley And Lardner LLP Suite 500

20080210458 - Flexible substrate, multilayer flexible substrate and process for producing the same: t

20080210459 - Warpage-proof circuit board structure: The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder... Agent: Schmeiser Olsen & Watts

20080210460 - Circuit board structure with capacitors embedded therein and method for fabricating the same: A circuit board structure with capacitors embedded therein and a method for fabricating the same are disclosed. The structure comprises at least two core layers individually comprising a dielectric layer having two opposite surfaces, circuit layers disposed on the outsides of the two opposite surfaces of the dielectric layer, and... Agent: Bacon & Thomas, PLLC

20080210461 - Circuit board with a three-terminal jumber and method for fabricating the same: A method of fabricating a circuit board includes the steps of: (a) defining a first jumper symbol and a second jumper symbol of a schematic circuit symbol library; (b) drawing the first jumper symbol and the second jumper symbol of the schematic circuit symbol library in a schematic circuit diagram... Agent: North America Intellectual Property Corporation

20080210462 - Method for manufacturing circuit modules and circuit module: A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080210463 - Plastics articles for metalization with improved shaping properties: wherein the tensile strain at break of component A is greater by a factor of from 11 to 100 than the tensile strain at break of the plastics mixture comprising components A, B, and, if present, C and D, and wherein the tensile strength of component A is greater by... Agent: Connolly Bove Lodge & Hutz, LLP

20080210464 - Strapping base and assembly: A strapping base including a central portion having a generally flat surface, the central portion having a central hole pattern defined therein, an angled portion coupling the central portion to the lateral portion, and at least one lateral portion having a generally flat surface and having a plurality of lateral... Agent: Workman Nydegger

20080210465 - Modular wiring system: A modular wiring system and method. At least some of the illustrative embodiments are systems comprising an electrical box having a first side wall, a second side wall and a back, and an opening through the first side wall (the side walls and the back define an internal cavity). The... Agent: Conley Rose, P.C. David A. Rose