Electricity: conductors and insulators inventions 08/08

20080202787 - Wall mounted electrical apparatus: A wire management box is sized to contained a high voltage plug and a low voltage terminal inward of a building wall surface. The box has an access opening that is sized for a user manually to reach through with the plug and the terminal. The box further has a... Agent: Patent Group 2n Jones Day

20080202788 - Capsule housing extending in an essentially tubular manner comprising at least three housing sections: A capsule housing has at least three housing sections, extends along an axis, and has a substantially tubular-shaped frame. The housing sections are connected together on the front side thereof and they surround a receiving chamber on the inside. The inside has an electric circuit device. The receiving chamber has... Agent: Lerner Greenberg Stemer LLP

20080202789 - Compliant cap: A compliant cap for inserting into an aperture of an electrical connector. The cap includes two halves connected by a living hinge. The two radial members in the two halves each extend perpendicular to the living hinge with the second radial member being longer than the first. One of the... Agent: Roylance, Abrams, Berdo & Goodman, L.L.P.

20080202790 - Cover plate and group of parts for wall mounting an electrical apparatus: Cover plate (1, 21) for the wall application of at least one electrical apparatus (20), characterised in that it comprises: —a base (2) having a through opening (3) adapted to receive a front portion of said at least one electrical apparatus (20); —a mask (4), which can be coupled to... Agent: Hogan & Hartson LLP

20080202791 - High fidelity signal transmission cable: v

20080202792 - Interconnections for flip-chip using lead-free solders and having reaction barrier layers: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally... Agent: David Aker

20080202793 - Electrical insulation system based on poly(butylene terephthalate): An electrical insulation system and method are disclosed which are based on poly(butylene terephthalate), wherein the poly(butylene terephthalate) contains a polymerized cyclic low molecular weight oligomeric poly(butylene terephthalate) resin. At least one filler material or a mixture of filler materials can be included. At least one hydrophobic compound or a... Agent: Buchanan, Ingersoll & Rooney PC

20080202794 - Ratchet-head conductor locking medium voltage electrical bus polymer insulator with pin mount: Cable support insulators of the present invention generally have an insulator body having a cable base and a plurality of insulator sheds. The cable base has a ratchet locking mechanism to secure an electrical conductor to the insulator. In preferred embodiments, a cable support insulator is provided that has an... Agent: Patent Group C/o Dla Piper US LLP

20080202795 - Method of improving the strength of a spot-welded joint between fine enameled wire and circuit board: A method for improving the reliability of the welding spot between thin enameled wires and an electronic board and thus securing the connection therebetween, by pulling the terminals of the enameled wires to the back of the electronic board and thereby creating a bearing point on the structure of the... Agent: Wang & Ho

20080202796 - Flexible wiring cable: A flexible wiring cable includes a flexible flat base, and a plurality of first and second leads wired on first and second surfaces of the base respectively. First and second circuit elements are mounted on the first and second leads respectively. A plurality of terminal electrodes is provided on the... Agent: Baker Botts LLP C/o Intellectual Property Department

20080202797 - Flexible wiring cable: A plurality of first output terminals is provided along one side of a circuit element, and a plurality of input terminals and a plurality of second output terminals are provided adjacently along the other opposite side thereof. Leads include a first output lead extending from the first output terminal to... Agent: Baker Botts LLP C/o Intellectual Property Department

20080202798 - Transparent substrate with thin film and method for manufacturing transparent substrate with circuit pattern wherein such transparent substrate with thin film is used: An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080202799 - Embedding an electronic component between surfaces of a printed circuit board: A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is... Agent: Marsh, Fischmann & Breyfogle LLP

20080202800 - Re-routing method and the circuit thereof: A re-routing method and the circuit thereof, used to rearrange the external circuit coupled with the integrated circuit (IC), comprises the steps of providing a plurality of first conductive plate on the substrate of the IC to form an isolation layer; providing a plurality of second conductive plates on the... Agent: Rosenberg, Klein & Lee

20080202801 - Circuit board structure and method for manufacturing a circuit board structure: The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (2) and a conductor pattern (6) on the surface of the conductor foil. A component (9) is attached to the conductor layer and the conductor layer... Agent: Baker & Daniels LLP

20080202802 - Printed circuit board module having two printed circuit boards for mounting inline package elements and adhibit elements respectively: An exemplary printed circuit board (PCB) module (200) includes a first PCB (210); a second PCB electrically connected to the first PCB (230); a plurality of in-line package elements (220) provided on the first PCB and no surface-mounting elements provided thereon; and a plurality of surface-mounting elements (240) provided on... Agent: Wei Te Chung Foxconn International, Inc.

20080202803 - Wiring structure, forming method of the same and printed wiring board: There is disclosed a wiring structure or the like capable of sufficiently improving a connection property between a body to be wired and a wiring pattern (layer) connected to the body to be wired. In a semiconductor-embedded substrate 1, conductive patterns 13 are formed on opposite surfaces of a core... Agent: Oliff & Berridge, PLC

20080202804 - Printed circuit board and method of producing the same: There is provided a printed circuit board in which space between pads used for surface mounting can be narrowed and an FPC can be mounted along with electronic components by the reflow method even when the FPC is mounted and a method of producing the same. A printed circuit board... Agent: Nec Corporation Of America

20080202805 - Radio frequency isolation container: An RF isolation container that includes a counterweight system to assist an operator with opening and closing operations, an electromagnet locking mechanism for easier and consistent locking of the RF isolation container and a motion damping mechanism to relieve fatigue on operating components and on human operators.... Agent: Bereskin And Parr

20080202806 - Shielding device: A shielding device configured to provide EMI or ESD protection to an electronic component (80) comprises a cover (83), and a wall (10) of a resilient material. By molding the resilient material under the influence of a magnetic field provided by a number of separate magnets, a dispersed plurality of... Agent: Myers Bigel Sibley & Sajovec, P.A.

20080202807 - Shielded flexible circuits and methods for manufacturing same: A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support... Agent: Knobbe Martens Olson & Bear LLP

20080202808 - Method for ethernet and electric power cabling: Present invention outlines a structured wiring methodology for installing a premise-wide distributed Ethernet LAN (Local Area Network) featuring Broadband Points with Power-over-Ethernet (PoE) and Electrical Sockets, allowing connection to Broadband Appliances. The necessary LAN and electrical cabling stays entirely within a Beading (or Casing and Capping), which recursively loops along... Agent: Greenblum & Bernstein, P.L.C

20080202809 - Buss plate bushing retainer and assembly thereof: A method and apparatus for the economical and reliable assembly of buss plates and components thereon, having a bushing positioned on one or more surfaces or therebetween. A resilient retainer is employed to retain bushings in proximity to buss plate through holes to facilitate easy assembly. The use of the... Agent: Basch & Nickerson LLP

20080196916 - Electrically conductive chain: The invention concerns a novel type of electrical conductor made up of a string of beads (10). The conductor is isothermal. An inventive manufacturing method enables said string to be produced from a bulk aggregate of beads (1) which are subjected to a difference of electric potential via two electrodes... Agent: Bacon And Thomas

20080196925 - Electrical component: An electric component, in particular an electric switch placed in a liquid-filled housing of an electrical installation, in particular a transformer, is filled with an insulating and cooling medium. The use of a compensating element, for example in the form of a bellow, makes it possible to transmit volume variations... Agent: Lerner Greenberg Stemer LLP

20080196917 - Fluid supply hose for a windscreen or headlamp washer system of a vehicle: A fluid supply hose for a windscreen or headlamp washer system of a vehicle having an electric heating element, said heating element comprising a coaxial cable (2, 12) with an inner current conductor (3, 13) and an outer current conductor (5, 15) surrounding said inner conductor (3, 13), an insulator... Agent: Hanley, Flight & Zimmerman, LLC

20080196918 - Electrical device: An electrical device having a housing and moisture-sensitive electrical structural units situated in the housing, having a pressure compensation element situated in a housing part, which avoids, preferably prevents, the ingress of moisture, the pressure compensation element including a diaphragm which is permeable to gas, having an impact protection element... Agent: Kenyon & Kenyon LLP

20080196920 - Expansion vessel for stepping switches: A stepping switch S has a housing filled with a dielectric liquid and devices for compensating for thermally related volume variations of the liquid. A bellows/compensator switch K is used to take up the volume variation of the dielectric liquid. The compensation device forms a compact structural component devoid of... Agent: Lerner Greenberg Stemer LLP

20080196919 - Watertight sensor: The invention relates to electrical sensors, which are tight against longitudinal water, and to a process for a simple and cost efficient manufacture, with a tightly closed housing, a sensor element, at least one cable leading out of the housing, wherein the electrical conductors of the cable in the housing... Agent: Head, Johnson & Kachigian

20080196921 - Universal recessed while-in-use electrical box assembly: A electrical box assembly is provided that includes an electrical outlet box and an adapter plate configured to accommodate electrical components in a single or double gang formation. An engaging mechanism permits the adapter plate to snap into the electrical outlet box without the use of screws or other fasteners.... Agent: Hoffmann & Baron, LLP

20080196940 - Textile material comprising a circuit module and an antenna: The invention relates to a textile material comprising a circuit module (20, 24) and an antenna (12), wherein the antenna (12) is configured as an E field emitter for a working frequency in the UHF or microwave range and consists entirely of components of the textile material itself in the... Agent: Collard & Roe, P.C.

20080196941 - Metal raceway system: The present invention is directed towards a metal raceway system. The metal raceway system includes a metal raceway and a coupling fitting. The metal raceway snaps onto the coupling fitting to mount the metal raceway to the fitting. The metal raceway has a channel defined by a top wall, side... Agent: Panduit Corp.

20080196923 - Aluminum conducting wire: An aluminum conducting wire, containing a stranded conductor that is formed by stranding solid conductors of an aluminum alloy, in which the aluminum alloy comprises 0.1 to 1.0 mass % of Fe, 0.05 to 0.5 mass % of Cu, and 0.05 to 0.4 mass % of Mg, in which the... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080196922 - Outer sheath layer for power or communication cable: The present invention relates to a power or communications cable comprising an outer sheath layer made of a polyethylene composition comprising a base resin which comprises (A) a first ethylene homo- or copolymer fraction, and (B) a second ethylene homo- or copolymer fraction, wherein fraction (A) has a lower molecular... Agent: Fay Sharpe LLP

20080196924 - Laminated bus bars and methods of manufacture thereof: A method of assembling a multilayer bus bar assembly includes coating a dielectric layer with a molten reactive hot-melt adhesive, placing the dielectric layer between first and second subassemblies, wherein the first and second subassemblies comprise a conductive element, adhering the molten reactive hot-melt adhesive to the subassemblies by applying... Agent: Cantor Colburn, LLP

20080196926 - Copper clad ballast wire: Copper clad wire for ballast of fluorescent lamps is disclosed as having a core wire of a lower priced metal core than copper and a copper coating fixed on the core wire by means of a thin diffusion layer.... Agent: Law Offices Of Clement Cheng

20080196927 - Working panel for multilayer printed circuit board: Disclosed is a working panel for a multilayer printed circuit board. The working panel for a multilayer printed circuit board is constructed in a manner such that first and second strips, having circuit layers and insulating layers which are layered on the upper and lower sides of a core in... Agent: Staas & Halsey LLP

20080196928 - Method for the production of a functional constructional unit, and functional constructional unit: The invention relates to a method for producing a functional assembly as well as a functional assembly. According to the inventive method, at least one first material and a second material which are provided with different properties are applied layer by layer, partially in some parts, so as to create... Agent: Kaplan Gilman Gibson & Dernier L.L.P.

20080196929 - Optical transmitter module: An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to... Agent: Mcdermott Will & Emery LLP

20080196930 - Method for manufacturing a circuit board structure, and a circuit board structure: This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way... Agent: Baker & Daniels LLP

20080196932 - Multilayer substrate including components therein: Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These... Agent: Knobbe Martens Olson & Bear LLP

20080196931 - Printed circuit board having embedded components and method for manufacturing thereof: A printed circuit board having embedded components and a method for the manufacturing of the printed circuit board are disclosed. The printed circuit board includes: an intermediary insulation layer; a first core board, in which a first component having at least one electrode formed on one side is embedded, stacked... Agent: Staas & Halsey LLP

20080196933 - Printed circuit board substrate and method for constructing same: A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the... Agent: Hewlett Packard Company

20080196934 - Circuit board process: A circuit board process is provided. First, multiple carriers is provided, and a first conductive layer having multiple concave structures is formed on each carrier. A dielectric layer is then provided, and the carriers with the first conductive layers are laminated on a first and a second surface of the... Agent: Jianq Chyun Intellectual Property Office

20080196935 - Multilayer printed wiring boards with copper filled through-holes: Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal characteristics of filled through-holes of printed circuit boards to provide extra reliability to the printed circuit boards. In one embodiment,... Agent: Christie, Parker & Hale, LLP

20080196936 - Base unit for dual wiring system: A base unit suitable to improve easy exchangeability of a function unit in a dual wiring system is provided. The base unit is mounted in a wall surface of a structure, and connected to both of an electric power line and an information line previously installed in the structure. The... Agent: Edwards Angell Palmer & Dodge LLP

20080196937 - Structure supporting distribution cable of document reading apparatus: An embodiment of the present invention involves a document reading apparatus that includes an optical scanning unit that moves back and forth in a document reading direction so as to read information of a document placed on a document placement table arranged in a top face of a frame by... Agent: Mark D. Saralino (general) Renner, Otto, Boisselle & Sklar, LLP

20080196938 - Rain shielded box for exiting through siding: A mounting box for installation on an exterior wall of a building. The mounting box has a box-shaped structure having a substantially horizontally disposed top surface when in situ, a nailing flange around a perimeter of the box-shaped structure, a downwardly and outwardly inclined shoulder on each side of the... Agent: Vermette & Co.

20080196939 - Lead anchoring assembly: An electrical lead anchoring assembly comprising a body comprising at least one recess and at least one channel therethrough for receiving at least one electrical lead, at least one arm pivotably coupled to the body and moveable between an open and a closed position wherein the arm is at least... Agent: Leydig Voit & Mayer, Ltd

20080190644 - Transformer conservator isolation valve (tciv): A Transformer Conservator Isolation Valve, (TCIV) comprising of an inlet conduit or pipe (2), outlet conduit, or pipe (5) connected to a rectangular housing (7) with an operating device. (10) fixed on a shaft (19) placed inside, the rectangular housing (7) and lever (9) for locking of the operating device... Agent: Howrey LLP

20080190637 - Fault current limiting hts cable and method of configuring same: A cryogenically-cooled HTS cable is configured to be included within a utility power grid having a maximum fault current that would occur in the absence of the cryogenically-cooled HTS cable. The cryogenically-cooled HTS cable includes a continuous liquid cryogen coolant path for circulating a liquid cryogen. A continuously flexible arrangement... Agent: Holland & Knight LLP

20080190639 - Home network system augmentation with remote guidance and local set up and monitoring: This application relates to a network including powerline adapters (“PLAs”) of the HomePlug Alliance variety or similar implementations such as the European in Opera standard. The technology disclosed provides diagnostic capability and software enhanced powerline adapters. The diagnostic capability includes collecting network performance data and either analyzing or forwarding data... Agent: Haynes Beffel & Wolfeld LLP

20080190638 - Wall box mounting apparatus: An apparatus for mounting a device in a wall box is provided that includes a base plate formed by a substantially flat front portion and a plurality of side portions extending to the rear to define a substantially open rear portion, and at least one magnet. The front portion is... Agent: Gardere Wynne Sewell LLP Intellectual Property Section

20080190640 - Safety module electrical distribution system: A wiring module that can be installed in an electrical junction box and can receive a removable electrical outlet module, a removable electrical switch module, or other types of electrical functional modules. The wiring module and the removable electrical outlet and switch modules may include connectors having a mechanical portion... Agent: Knobbe Martens Olson & Bear LLP

20080190641 - Connection of electrical cables: A method for the production of an electrical connection between at least two cables, particularly battery leads for motor vehicles, wherein at least one first cable is formed by one conductor and one insulating sheath and at least one second cable is at least formed by one conductor. In order... Agent: Bromberg & Sunstein LLP

20080190661 - Trim panel with wiring harness and method of making the same: A wiring harness for connection to a body, the wiring harness comprising at least one conductor and a protective covering having an inner portion for insulating the at least one conductor and an outer portion arranged over a region of the inner portion, wherein at least a section of the... Agent: Magna International, Inc.

20080190662 - Conduit body assembly with sealed cover: In an aspect of the subject invention, a conduit body assembly is provided. The conduit body assembly has a conduit body having a closed lower end, a side wall surrounding the lower end, the side wall including a planar perimetrical rim defining an open upper end. A cover is positionable... Agent: Hoffmann & Baron, LLP

20080190642 - Cable for stringed musical instruments: A center conductor having an effective outer diameter; a dielectric material around the center conductor, a semi-conductive layer around the dielectric material, an outer conductor, or shield, around the dielectric material; the shield having an effective inner diameter; wherein the center conductor has a cross-sectional area of 3.141×10−4 in2 or... Agent: Allan M. Wheatcraft W. L. Gore & Associates, Inc.

20080190643 - Process for manufacturing a cable resistant to external chemical agents: A process for manufacturing a cable includes the steps of conveying at least one conductor to an extruder apparatus; extruding an insulating coating layer radially external to the at least one conductor; longitudinally folding a metal tape around the extruded insulating coating layer, the metal tape bearing at least one... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080190645 - Semiconductive polymer composition: The invention relates to a semiconductive polymer composition for use in power cables. The composition comprises a multimodal ethylene homo- or copolymer produced in a polymerisation process comprising a single site catalyst whereby the polymer composition has a density of 870 to 930 kg/m3, a MFR2 of 1 to 30... Agent: Fay Sharpe LLP

20080190646 - Parallel connected hts fcl device: A superconducting electrical cable system is configured to be included within a utility power grid having a known fault current level. The superconducting electrical cable system includes a non-superconducting electrical path interconnected between a first node and a second node of the utility power grid. A superconducting electrical path is... Agent: Holland & Knight LLP

20080190647 - Electronic component and lead unit therefor: An electronic component has a casing. An electrically-conductive body enclosed in the casing. The inner end of a lead is welded to the electrically-conductive body. The outer end of the lead projects outward out of the casing through a through hole formed in the casing. An enlarged portion is formed... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080190648 - Method of contacting an electrical conductor and flexible element for providing an electrical contact: A method of contacting an electrical conductor (1) having a conducting core (2) covered partly by an insulating material (3), comprising installing a contacting device (10) in electrical contact with the conducting core in a position (4) where the conducting core is free from the insulating material. Said method further... Agent: Sughrue Mion, Pllc

20080190649 - Overhead and underground pole mount cable restraint insulator: An improved pole mount cable restraint insulator is described featuring a pin and bolt locking mechanism that may be used to secure a medium voltage 5 kV to 35 kV electrical cable to the insulator and riser pole. The cable restraint insulator includes a seat to secure the cable. A... Agent: Patent Group C/o Dla Piper Us LLP

20080190650 - Insulating support disc for a conductor and electrical assembly comprising this disc: Supports for high or medium voltage electrical conductors (6, 7) at potentials different from the potential of an enclosure (1) are supported by disc-shaped parts (4, 5) made from thermoplastic polyester, for example terephthalate polyethylene. The discs (4 and 5) provide good insulation without largely disturbing the electrical field around... Agent: Thelen Reid Brown Raysman & Steiner LLP

20080190651 - Multi-layered printed circuit board comprising conductive test surfaces, and method for determining a misalignment of an inner layer: The invention relates to a multi-layered printed circuit board (1) comprising conductive test surfaces (7) on at least one inner layer (2) for determining a possible misalignment of an inner layer or an inner layer structuring, the conductive test surfaces consisting of ring structures (7.i) which are arranged in a... Agent: Ladas & Parry LLP

20080190652 - Wired circuit board and method for producing the same: A wired circuit board includes: a first insulating layer; a conductive pattern formed on the first insulating layer and having a terminal portion; and a second insulating layer formed on the first insulating layer to cover the conductive pattern. A surface of the terminal portion is formed to be exposed... Agent: Akerman Senterfitt

20080190653 - Method and system of heat conductor: The present invention relates to surface mount assembly of electronic equipment. More especially it relates to mounting of high frequency electronic components for efficient cooling also with low cost circuit boards. Particularly it relates to efficiently transporting heat and eliminating air gaps in microwave equipment.... Agent: Ericsson Inc.

20080190654 - Printed wiring board: The printed wiring board in accordance with the present invention is comprised of a substrate, an electrically conductive pattern formed on the substrate to define a circuit wire and a pad electrically connected to the circuit wire, and an electrical insulator covering the substrate and the electrically conductive pattern therewith.... Agent: Sughrue Mion, Pllc

20080190655 - Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points: e

20080190656 - Trimming of embedded passive components using pulsed heating: There is described a printed circuit board with a thermally trimmable component embedded therein. A layer of refractory insulating material is provided to provide mechanical support and chemical passivation for the thermally trimmable component. The component is trimmed by applying a sequence of heat pulses the a heating element, which... Agent: Ogilvy Renault LLP

20080190658 - Multilayer printed wiring board: An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely takes place in the interlaminar resin insulating layers in the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080190657 - Circuit board: A circuit board includes a plurality of through holes (14, 44) into which a plurality of leads (18) of one electronic devices are inserted and soldered. Among these through holes (14, 44), the volume of through hole (14b, 24b, 34b, 44b, 54, 64b) into which the outermost end lead of... Agent: Hayes Soloway P.c.

20080190659 - System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition process: A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316)... Agent: The Webb Law Firm, P.c.

20080190660 - Magnetic induction protecting structure: A magnetic induction protecting structure comprises a platform, an induction ruler, an induction head and a protection assembly. The protection assembly covers an induction distance between the induction head and the induction ruler completely for scraping off the chips and dust on the induction ruler and to prevent the chips... Agent: Dr. Banger Shia

20080185169 - Water stopping method, wire harness processed by the method and water stopping apparatus: A water stopping apparatus for causing a water stopping material to penetrate exposed core wires of a sheathed wire forming a wire harness includes a pair of dies which can abut against each other in a mutually opposed condition, thereby forming a pressurizing space in which an exposed portion of... Agent: Sughrue-265550

20080185166 - Outlet cover with barrier wall: An outlet cover with barrier wall, the cover for an outlet box mounted in a building wall including an outer wall with an outer opening formed in the outer wall; a surrounding wall integrally joined to an outer periphery of the outer wall and extending substantially normal to the outer... Agent: Cardinal Law Group Suite 2000

20080185168 - Electronic device and harness for wiring electronic devices: An electronic device includes at least first and second enclosures mounted so as to enable relative displacement therebetween, and an electric wire which electrically connects a circuit of the first enclosure and a circuit of the second enclosure. The electric wire includes a tape-shaped flat cable, including a plurality of... Agent: Sughrue Mion, PLLC

20080185167 - Flat cable and electronic appliance having the same: A flat cable and an electronic appliance having the same. The flat cable includes a first signal transmission layer including a first insulating member, and a plurality of first ground lines and a plurality of first signal lines embedded in a row within the first insulating member, a second signal... Agent: Stanzione & Kim, LLP

20080185170 - Methods and media for processing a circuit board: A method of processing a circuit board including providing a circuit board having disposed thereon a conductive pattern, the pattern comprising a trace terminating at a terminal and depositing conductive material on the terminal and trace to form a land extending away from the terminal on the trace past a... Agent: Andrea E. Tran Pramudji Wendt & Tran, LLP

20080185171 - Tape for semiconductor package and cutting method thereof: A tape for semiconductor package is provided. The tape comprise a base comprising a plurality of cutting areas, leads formed each of the cutting areas on the base, and narrow wires connected to corresponding leads. The narrow wires in at least one of the cutting areas are offset from central... Agent: Sheridan Ross PC

20080185173 - Environmental protection coating system and method: According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly having a first protective dielectric layer and a second dielectric layer. The circuit assembly has an outer surface on which a plurality of discrete electrical components are attached. The first protective dielectric layer overlays the... Agent: Baker Botts LLP

20080185172 - Printed wiring board and method of manufacturing the same: A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080185174 - Passivation layer for a circuit device and method of manufacture: According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric... Agent: Baker Botts L.L.P.

20080185175 - Multilayer wiring board and method of manufacturing the same: A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender... Agent: Kratz, Quintos & Hanson, LLP

20080185177 - Circuit board structure for electrical testing and fabrication method thereof: The invention provides a circuit board structure for electrical testing and a fabrication method thereof. The circuit board structure includes: a core board having a plurality of first circuits, an electroplating conductive wires, and distributing wires for electrical connection thereof; a dielectric layer formed on the core board, the first... Agent: Schmeiser Olsen & Watts

20080185176 - Wiring board member for forming multilayer wiring board, method of manufacturing the same, and multilayer wiring board: A wiring board member for forming a multilayer wiring board includes an insulation layer (11) having a hole (11a) and a metal layer (12) as a conductive layer joined to the insulation layer. The metal layer (12) includes a via portion (12b) occupying the hold of the insulation layer, a... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080185178 - Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment: A circuit board of the present invention, includes: an electrical insulating layer including at least one layer of electrical insulating base; and a conductive portion formed in a via hole provided in the electrical insulating base. A land for mounting only is disposed on at least one surface of the... Agent: Hamre, Schumann, Mueller & Larson P.C.

20080185179 - Electromagnetic bandgap structure and printed circuit board: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are... Agent: Staas & Halsey LLP

20080185180 - Method for fabricating a printed circuit board having a coaxial via: A method of fabricating a printed circuit board having a coaxial via is disclosed. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through the plurality of... Agent: Lewis And Roca, LLP

20080185181 - Alternating via fanout patterns: Various techniques are disclosed for identifying different fanout via configurations that can be created using fanout vias, and then arranging those fanout via configurations in an alternating manner in order to increase the amount and/or area of routing channels available to route traces to the fanout vias. According to some... Agent: Mentor Graphics Corp. Patent Group

20080185182 - Electrical unit for boat and outboard motor: An electrical unit includes one of a large current relay, a circuit protection fuse, and an operation time display section fixed on a circuit board having an external connector. The electrical unit is incorporated in a case having an opening, and the electrical unit is sealed by a sealing resin... Agent: Yamaha Marine Kabushiki Kaisha C/o Keating & Bennett, LLP

20080185183 - Resonance-coordinating device for audio and video: A resonance-coordinating device for an audio and video can clamp a transmission cable. The device including: a main body. An adjustable part for making the main body clamps oppositely or for moving opposite to the main body to adjust location sets on the main body. A vibration absorbing unit with... Agent: Bacon & Thomas, PLLC