Electricity: conductors and insulators inventions 06/08

20080149360 - Self cutting electrical outlet box: The present invention is directed to a self-cutting electrical outlet box. The electrical outlet box is self cutting, allowing the box to be installed through an existing building surface. The box includes teeth or cutting members to assist in self-cutting. The box also includes features to assist in placement and... Agent: Hoffmann & Baron, LLP

20080149361 - Wired circuit board and producing method thereof: A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so... Agent: Akerman Senterfitt

20080149362 - Conduits: A conduit (1) having a substantially semi-circular outer cross-section comprising a base portion (3) and a lid portion (2), the lid portion (2) being attached to the base portion (3) by a hinge (4) and having a clip (23) on the opposite side, wherein the hinge (4) is located at... Agent: Curatolo Sidoti Co., Lpa

20080149363 - Semi-conducting polymer compositions for the preparation of wire and cable: Compositions comprising a polyolefin polymer and an expanded graphite exhibit uniform conductivity over a broad range of temperature. In one embodiment, the polyolefin polymer is polypropylene or polyethylene homopolymer or a polypropylene or polyethylene copolymer. The compositions provide uniform conductivity and can be used as a conductive formulation for medium... Agent: Whyte Hirschboeck Dudek S.c.

20080149364 - Ribbon cable: A ribbon cable 1 having a plurality of electric conductors 3 which are arranged in a plane 2 side by side and at a distance from one another and which are enclosed by an insulation 4 consisting of thermoplastic plastics, which insulation 4 comprises a first outer face 5 which... Agent: Sughrue Mion, Pllc

20080149365 - Fan having wire securing mechanism: A fan includes an exterior frame, a motor with an impeller disposed in the frame, a wire electrically connected with the motor and reaching out of the frame, and at least one wire securing mechanism. The at least one wire securing mechanism includes two spaced hooks formed on the frame... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080149366 - Interleaved printed circuit board: A printed circuit board may move an electrical or optical component. A first trace may be supported by a substrate having a first surface. A second trace may interleave the first trace where current flow through the first trace and the second trace may generate a first magnetic field. The... Agent: Brinks Hofer Gilson & Lione

20080149368 - Method of electroplating a plurality of conductive fingers: A method of electroplating may include placing a pair of conductive fingers in proximity to an edge of a circuit board, where the pair are coupled to be electrically isolated, and where the pair are substantially longitudinally oriented away from the edge. A trace electrically couples the pair of conductive... Agent: Harness, Dickey & Pierce, P.L.C

20080149367 - Printed circuit board and light sensing device using the same: A printed circuit board (PCB) adapted for mounting different kinds of light sensing modules thereon includes a lighting sensing area and a plurality of pads. The pads are disposed around the lighting sensing area, for configuring one light sensing module thereon. In the present invention, the PCB is suitable for... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080149369 - Printed wiring board: A method of manufacturing a printed wiring board includes preparing a wiring substrate having a conductive circuit, coating a solder-resist layer over the conductive circuit, leveling a surface of the solder-resist layer so as to obtain a maximum surface roughness in a predetermined range, removing the resin film from the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080149370 - Local temperature control fixture applied to reflow process for circuit board: A local temperature control fixture suitable for a circuit board is provided, and the circuit board has at least a first heat-receiving region. The fixture includes a heat-insulating board. The heat-insulating board is positioned over the circuit board suitably and has at least a first exposing region whose projection on... Agent: Jianq Chyun Intellectual Property Office

20080149371 - Flexible circuit: A flexible circuit is formed from a dielectric core sheet and one or more patterned conductive sheets coupled to the dielectric core sheet. The patterned conductive sheets form conductive paths. In one embodiment, one or two flexible patterned graphite sheets are laminated onto the dielectric core sheet. Electrical contact may... Agent: Schwegman, Lundberg & Woessner, P.a.

20080149372 - Printed circuit board and semiconductor memory module using the same: A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface.... Agent: Harness, Dickey & Pierce, P.L.C

20080149373 - Printed circuit board, light emitting apparatus having the same and manufacturing method thereof: A printed circuit broad capable of improving reliability, a light emitting apparatus having the same and a manufacturing method thereof are disclosed. The printed circuit board mounted with a light emitting device package includes a first metal layer, an insulating layer disposed on the first metal layer, a second metal... Agent: Mckenna Long & Aldridge LLP

20080149374 - Laminated multi-layer circuit board: Plural thermoplastic resin films, each having a circuit pattern formed thereon, are laminated. Via-holes filled with conductor past are formed in the thermoplastic films to electrically connect neighboring layers. The laminated body is pressed under heat between a pair of hot press plates to thereby form an integral body of... Agent: Posz Law Group, Plc

20080149375 - Wired circuit board and producing method thereof: A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semiconductive layer formed on a surface of the insulating base layer exposed from the conductive pattern, an insulating cover layer... Agent: Akerman Senterfitt

20080149376 - Microwave circuit board: A microwave circuit board includes: a board made of insulator; a metallic conductor to transfer an electric signal which is formed on at least one of a main surface and a rear surface of the board; and an electric power layer formed on the rear surface of the board and/or... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080149378 - Light source simulating device: A light source simulating device comprises a circuit board, at least a conductor and at least a resistor. The circuit board has a first surface. The conductor is disposed on the first surface of the circuit board. The resistor is also disposed on the first surface of the circuit board... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080149377 - Transceiver module and pcb structure thereof: A transceiver module including an adaptor and a PCB is provided. The PCB, connected with the adaptor, has a first signal layer, a second signal layer and a singular ground layer wherein the singular ground layer is set between the first signal layer and the second signal layer. The first... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20080149379 - Wiring structure of printed wiring board and method for manufacturing the same: In a semiconductor-embedded substrate, a conductive pattern is formed on both sides of a core substrate and a semiconductor device is placed in a resin layer stacked over the core substrate. The resin layer has via-holes so that the conductive pattern and a bump of the semiconductor device protrude from... Agent: Oliff & Berridge, Plc

20080149380 - Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board: A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A... Agent: Hamre, Schumann, Mueller & Larson, P.c.

20080149381 - Method for manufacturing component incorporating module and component incorporating module: In a method for manufacturing a component incorporating module, lands for mounting components are independently formed on a transfer plate in an isolated manner, and circuit components are connected to the lands for mounting components. An insulation resin layer is formed so as to cover the circuit components on the... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080149382 - Method of inspecting printed wiring board and printed wiring board: According to one embodiment, in a method of inspecting a printed wiring board, the printed wiring board which is provided with an outer-layer surface and an inner-layer surface is prepared for inspection. The printed wiring board includes a land provided on the outer-layer surface, a via ranging from the land... Agent: Blakely Sokoloff Taylor & Zafman

20080149383 - Wiring substrate and method for manufacturing the same: A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents... Agent: Drinker Biddle & Reath (dc)

20080149384 - Multilayer wiring board and power supply structure to be embedded in multilayer wiring board: A multilayer wiring board capable of feeding sufficient electric power to a circuit element, such as an IC chip. In one embodiment of the present invention, a multilayer wiring board is comprised of: a core board; a build up layer disposed on an upper surface of the core board; a... Agent: Kusner & Jaffe Highland Place Suite 310

20080149386 - Electrical junction box: An electrical junction box facilitates a worker's wiring of a wire harness without using a superfluous component and allows the workability in assembling the electrical junction box as well as that in disassembling to be improved. The electrical junction box includes a box body and a cover to be mounted... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080149387 - Electrical junction box: An electrical junction box includes a casing body containing a bus bar that serves as an internal circuit. A bus bar terminal portion is disposed on an outer edge of an upper surface of the casing body to be connected to a terminal. An electrical wire, on which the terminal... Agent: Oliff & Berridge, Plc

20080149385 - Electrical junction box and assembling method thereof: An electrical junction box is provided to reduce looseness of a cover. The electrical junction box includes a box body and the cover to be slidably mounted on a lateral side of the box body from above. The cover has a front wall and a pair of left and right... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080149388 - Electrical duplex connector having an integrally formed connector body with a frustro-conical retaining ring and unidirectional cable retainers: This disclosure is directed to electrical connectors, and more specifically to a duplex or multiplex electrical connector having an integrally formed connector body having an inlet end portion defining a plurality of passageways for receiving a cable, and an outlet end portion wherein the outlet end portion is provided with... Agent: Paul A. Fattibene Fattibene & Fattibene

20080142238 - Large area circuitry using appliques: An appliqué for forming a surface coating to a substrate is disclosed. The appliqué contains a sectioned metal foil that provides a large area electrical circuit for connecting electrical devices. The appliqué may provide additional functions including lightning strike protection. The substrate may be an aircraft surface.... Agent: Mcnees Wallace & Nurick Llc

20080142239 - Transposition device for a prefabricated electrical canalization: The present invention relates to a transposition device for a prefabricated electrical canalization, said canalization comprising a certain number of conducting bars distributing different phases including or not the neutral, said bars extending substantially parallel to one another, said transposition device being designed to reverse the position of at least... Agent: Steptoe & Johnson LLP

20080142240 - Cable restraint and radius control apparatus: A cable management apparatus includes a cable restraint adapted to provide strain relief to a cable and a radial guide adapted to provide a desired bend radius to a cable. The apparatus may have a compressible body provided with a receiving channel adapted to receive a cable in a receiving... Agent: Wm. Brook Lafferty Scientific-atlanta, Inc.

20080142241 - Electrical box with multi-mount features: A multi-mount, multi-use commercial line electrical box includes first and second side walls, lower and upper walls forming a front opening into the electrical box, and a rear wall. The first side wall has one or more removable external flanges, each flange having a front surface flush with an edge... Agent: Alfred M. Walker

20080142242 - Electrical box with multi-mount features: A multi-use electrical box has first and second side walls, lower and upper walls, which, together, form a front opening into the electrical box, and a rear wall. The first side wall includes a plurality of removable alignment tabs extending therefrom. The lower and upper walls each have external grooves... Agent: Alfred M. Walker

20080142260 - Power feeding apparatus and harness wiring structure using the same: A power feeding apparatus includes: a wire harness which includes a first portion, a second portion, and a bended portion connected to the first portion and the second portion, the bended portion has a substantially U-shape; a first protector which supports the first portion; and a second protector which supports... Agent: Sughrue-265550

20080142261 - Gel-filled casing for electric connections: Gel-filled casing for electric connections comprising a base element (100; 200) having an internal volume filled with dielectric gel (G) and a covering or upper element (102; 201) which can be reciprocally coupled in a reversible or irreversible manner to the base element (100, 200), the latter delimiting an internal... Agent: Mcglew And Tuttle John James Mcglew

20080142243 - Wire inline t tap/splice: A splice enclosure is provided for enclosing a splice of a plurality of wires. The splice enclosure comprises first and second shells, a first conductor arrangement and a second conductor arrangement. The first and second shells are adapted to mate with each other and each include an interior channel that... Agent: Brooks Kushman P.c./fgtl

20080142244 - Cables: A cable for suspended disposition in a borehole or the like for supplying electrical power, has a conducting member which is part of the load bearing system, or even carries the majority of the tensile stress on the cable. The conducting member comprises copper-clad steel or beryllium-copper alloy. The conducting... Agent: K.f. Ross P.c.

20080142245 - High temperature cable and the use thereof: The invention relates to a high temperature cable comprising a plurality of electric conductors which extend in a common envelop and are remote from each other and from said envelop by means of a plurality of insulating bodies which are successively disposed in the longitudinal direction of the cable and... Agent: The Webb Law Firm, P.c.

20080142246 - Communication cable with variable lay length: Communication cables are provided in which a core lay length of the cable varies along the cable length. The cable may be provided with different segments that have different core lay lengths. It is desirable for neighboring core lay lengths in a cable to differ by a factor of two,... Agent: Panduit Corp.

20080142247 - Electrical cable, and power supply system provided therewith: An electric cable has two groups of bundles including a first group of bundles connectable to a negative pole of a power source and a second group of bundles connectable to a positive pole of the power source, each of the groups of bundles include three bundles, each of the... Agent: Ilya Zborovsky

20080142248 - Printed circuit board having coplanar lc balance: Provided is a printed circuit board having coplanar LC balance, comprising: an insulation layer, printed circuit patterns formed on the insulation layer, power source wirings supplying power in the printed circuit patterns, and at least three signal wirings formed between the power source wirings, wherein widths of signal wirings far... Agent: Marger Johnson & Mccollom, P.c.

20080142251 - Chip component: A chip component is obtained by laminating a dielectric substrate, a first insulating layer provided on a principal surface of the dielectric substrate, and a second insulating layer covering substantially the entire first insulating layer. A circuit pattern includes a resonance line provided in an interface between the dielectric substrate... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080142250 - Electronic component connection support structures including air as a dielectric: Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and electrical connectors. The support medium provides physical support to conductive connections and a mechanical structure to enable electrical connections between electronic... Agent: Henry Groth Patent Attorney, Legal Department - Ip

20080142249 - Selective surface roughness for high speed signaling: A circuit board and a method for fabricating a circuit board are provided. The circuit board includes a dielectric core comprising a first surface and a second surface and a conductive layer comprising a first surface and a second surface. The first surface of the conductive layer is coupled to... Agent: Sawyer Law Group LLP

20080142252 - Solid via with a contact pad for mating with an interposer of an ate tester: An epoxy filled via hole in a printed circuit board is presented. The epoxy filled via hole may have metal plating between the epoxy and the via hole walls of the printed circuit board. The epoxy filled via hole may have a land pad directly over the epoxy filling, creating... Agent: Verigy, Ltd.

20080142253 - Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same: A microelectronic device, a method of fabricating the device, and a system including the device. The device includes: a substrate including a polymer build-up layer, and a passive structure embedded in the substrate. The passive structure includes a top conductive layer overlying the polymer build-up layer, a dielectric layer overlying... Agent: Intel Corporation C/o Intellevate, Llc

20080142254 - Carrier and manufacturing process thereof: A manufacturing process of a carrier is disclosed. First, a first substrate is provided. A circuit layer having a number of contacts is formed on a surface of the first substrate. Then, a solder mask is formed on the circuit layer and exposes the contacts. Next, a second substrate having... Agent: J C Patents, Inc.

20080142255 - Printed circuit board and method of manufacturing printed circuit board: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080142256 - Wiring board manufacturing method: The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably forming the build-up layer on a... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080142257 - Ceramic substrate grid structure for the creation of virtual coax arrangement: Signal line conductors passing through vertical vias in an insulative substrate for supporting and interconnecting integrated circuit chips are provided with shielding conductors in adjacent vias that link respective power and ground planes. The shielding conductors' presence in positions around a signal via is made possible through the employment of... Agent: Heslin Rothenberg Farley & Mesiti P.c.

20080142258 - High speed interposer: A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP

20080142259 - Wire bundle routing assembly and installation method: A wire bundle routing assembly for routing and at least partially enclosing and sealing a wire bundle between a a vehicle door frame and a vehicle door body. A door mounting base is slidably receivable in a slot formed in a front wall of a door body and includes a... Agent: Delphi Technologies, Inc.

20080135277 - Method and apparatus for administering passivator to a conductor: A method for administering an additive to oil, wherein a reservoir of the additive is provided in the oil.... Agent: Venable LLP

20080135273 - Impact-resistant, high-strength, braided wiring harness: A wiring harness is disclosed. The wiring harness may have at least one conducting wire having a length direction, a first end, and an opposing second end. The wiring harness may also have a first electrical device connected to the first end of the at least one conducting wire, and... Agent: Caterpillar/finnegan, Henderson, L.l.p.

20080135274 - Surface mount power outlet: A surface mount power outlet for connecting to a plug includes a cover having a fin disposed on an outer surface and a substantially circular face with a plurality of slots for receiving a plug. The cover also has a substantially arcuate body disposed below the face, an open back,... Agent: Roylance, Abrams, Berdo & Goodman, L.l.p.

20080135288 - Cold shrink article and method of using cold shrink article: An article can include a protective core having two end portions. The article can include a number of support cores. Each support core can be positioned substantially adjacent each end portion of the protective core. The article can include a cold shrinkable material held in an expanded state over at... Agent: 3m Innovative Properties Company

20080135275 - Electrical connection line for an electrical unit of a motor vehicle: An electrical connection line (L) for an electrical unit of a motor vehicle, which electrical connection line serves to electrically connect the unit to an electrical power source which is arranged in the motor vehicle and/or to another electrical unit. The connection line (L) is designed as a three-phase line... Agent: Sofer & Haroun LLP.

20080135276 - Flat cable: The invention provides a flat cable including an insulator and a plurality of connectors disposed in the insulator. The conductors in the insulator are arranged in at least three layers. The width of the conductors in the middle layer is less than or equal to that of the conductors in... Agent: Birch Stewart Kolasch & Birch

20080135278 - Printed board: To provide a multivendor-compatible printed board. On one face of an IVH (Interstitial Via Hole) board, wiring is provided for mounting a first semiconductor device, and on the other face, wiring is provided for mounting a second semiconductor device having pin positions and pin counts different from the first semiconductor.... Agent: Katten Muchin Rosenman LLP

20080135279 - Printed wiring board having plural solder resist layers and method for production thereof: A printed wiring board includes: a substrate main body; a solder resist layer provided on the substrate main body and having a first opening in which a part of the solder bump is formed; and a solder resist layer provided on the solder resist layer and having a second opening... Agent: Mcginn Intellectual Property Law Group, Pllc

20080135280 - Wired circuit board: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a... Agent: Akerman Senterfitt

20080135281 - Motherboard: A motherboard includes a printed circuit board (10), and at least a power/ground trace (20) formed on the printed circuit board. The trace includes a pair of main lines (14, 24) and at least a protection line (12, 22) connected between the main lines. A width of the main lines... Agent: Pce Industry, Inc. Att. Cheng-ju Chiang

20080135282 - Printed multilayer circuit containing active devices and method of manufaturing: A printed multilayer electronic circuit has printed electronic components on a first level circuit. Electrical conductors are printed on the first level circuit, electrically connected to the electronic components. A layer of dielectric material is printed over the printed electrical conductors. The dielectric layer contains apertures or openings that extend... Agent: Motorola, Inc.

20080135283 - Protruding electrode for connecting electronic component, electronic component mounted body using such electrode, and methods for manufacturing such electrode and electronic component mounted body: A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of... Agent: Mcdermott Will & Emery LLP

20080135284 - Flexible foil and method for manufacturing the same: Disclosed is a flexible foil including a thin and flexible foil that isolates electromagnetic waves. The foil has a smooth surface and an opposite surface on which a plurality of three-dimensional raised projections is formed and consecutively lined up. A slicing-facilitated, flexible thinned layer is formed between adjacent ones of... Agent: Leong C Lei

20080135285 - Intumescent cover for a poke-through assembly: One aspect of the present invention provides a poke-through assembly for installation in a hole in a floor structure. The floor structure defines a floor in a first working environment and a ceiling in a second working environment. The poke-through assembly includes at least one intumescent member, a base plate... Agent: Hoffmann & Baron, LLP

20080135286 - Intumescent cover for a poke-through assembly: One aspect of the present invention provides a poke-through assembly for installation in a hole in a floor structure. The floor structure defines a floor in a first working environment and a ceiling in a second working environment. The poke-through assembly includes at least one intumescent member and an intumescent... Agent: Hoffmann & Baron, LLP

20080135287 - Zone access floor network distribution system: An access floor line distribution system that includes a low profile access floor system with a low profile switch box placed inside a switch box vault formed in the floor system. The access floor system is designed to be six inches or less in height and includes support props formed... Agent: Dean A. Craine

20080128163 - Hot-stick capable cutout cover: A cutout cover includes an arcuate top portion covering an insulator having a closed top and an open bottom with a slit extending therebetween. A midsection can connect the top portion to an open end adapted to access the cutout. The top portion is bell-shaped with an upper and lower... Agent: Roylance, Abrams, Berdo & Goodman, L.l.p.

20080128161 - Releasable utility line retention apparatus: A device or apparatus that reduces the number of utility pole breakages occurring during severe weather events and facilitates quicker and more cost efficient repair of downed utility lines. The device secures utility lines such as power service lines to utility poles during normal operating conditions, but allow the lines... Agent: 24ip Law Group Usa, Pllc

20080128148 - Adapter for mounting a faceplate of a first style to an electrical outlet cavity of a second style: An adapter for mounting electrical outlet faceplates designed for mounting on rectangular junction boxes in hollow walls onto solid walls with cylindrical cavities and sleeves. Junction box mounting is popular in North America, whereas cavity mounting is popular in Europe and the Middle East. Such an adapter provides universal mounting... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20080128149 - Universal lid for underground access boxes: A universal lid closure for underground landscape and other utility access boxes uses flexible tongues depending from the underside of the lid and adapted to engage the interior of the access box, which box may have any one of various constructions. In one embodiment, the tongues have a plurality of... Agent: Andrus, Sceales, Starke & Sawall, LLP

20080128150 - Bus bar assembly: A bus bar assembly includes a first bus bar having at least first and second mounting arms and a second bus bar having at least third and fourth mounting arms. The first and third mounting arms are adapted to alternately interleave with one another such that the position of the... Agent: Siemens Corporation Intellectual Property Department

20080128165 - Mounting structure for wiring harness: A mounting structure for a wire harness for use in a movable structure, such as a door of a passenger vehicle, is disclosed. The mounting structure may include a mounting frame and a bracket for use in a recess of the movable structure. The mounting structure may be installed on... Agent: Delphi Technologies, Inc.

20080128151 - Electrical control cable: The present invention concerns an electrical control cable (1′) with a section diameter at most equal to 2 mm, of the type including a plurality of strands extending in the longitudinal direction of the cable, said strands being twisted to form a stranded conductor. According to the invention, only certain... Agent: Sofer & Haroun LLP.

20080128152 - Tapeless cable assembly and methods of manufacturing same: The present invention relates to methods of manufacturing tapeless cable assemblies. The methods generally include providing a plurality of adjacent conductor cables, followed by applying a cross-linkable first material around the plurality of conductor cables and in the interstitial openings occurring between the cables. Cross-linking can be initiated by applying... Agent: Schlumberger Ipc Attn: David Cate

20080128153 - Multi-layered electrical flat strip conductor: The invention relates to an electrical cable for motor vehicles, having a power conductor which is in the form of a flat strip conductor and is surrounded by an insulating layer. To reduce the number of cable harnesses in motor vehicles, it is proposed that at least two further conductors... Agent: Bromberg & Sunstein LLP

20080128154 - Method for producing a winding conductor for electrical appliances, and winding conductor producing according to said method: A method for producing a winding conductor (6a) for electrical appliances, in which one or a plurality of thermoplastic insulating layers (60) are applied by an extrusion process to an enameled wire (2) pre-insulated with a functional insulation (22), and in which each of these thermoplastic insulating layers (60) consists... Agent: Young & Thompson

20080128155 - Power transmission conductor for an overhead line: The invention relates to a power transmission conductor, in particular for overhead electric lines, and including at least one central composite core made up of continuous fibers impregnated by a thermosetting resin matrix, the core being coated by at least one layer of insulating material, with aluminum or aluminum alloy... Agent: Sofer & Haroun LLP.

20080128156 - Opening and closing device: An opening and closing device to be used in a variety of electronic apparatuses is disclosed, and the opening and closing device can be manufactured at a low cost and ensures a positive opening/closing action. After the reversing cam moves along an axial line, a movable cam protruding on an... Agent: Ratnerprestia

20080128157 - Manufacturing method of multilayer ceramic board: A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic... Agent: Murata Manufacturing Company, Ltd. C/o Keating & Bennett, LLP

20080128158 - Wire-printed circuit board or card comprising conductors with a rectangular or square cross section: The invention relates to a wire-printed circuit board or card comprising conductors that run on and/or in the circuit board or card between connection points. In order to improve circuit boards of this type, the invention provides for at least one of the conductors to have a rectangular or square... Agent: Cantor Colburn, LLP

20080128159 - Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board: A tape substrate includes IC lands electrically connected to pins of a driver IC (integrated circuit), circuit board terminal lands electrically connected to an external circuit board, test lands for testing the driver IC mounted on the tape substrate, and a plating terminal used for plating the land. The test... Agent: Oliff & Berridge, Plc

20080128160 - Soldering an electronics package to a motherboard: In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of the first and second... Agent: Schwegman, Lundberg & Woessner, P.a.

20080128162 - Cable duct: A cable duct (1) is provided for wall mounting a cable. The duct includes a cable acceptance region (2) and a lower terminating section (3) for arrangement on the floor and for covering the edges of floor coverings. The cable acceptance region (2) has a cable acceptance housing (4) attached... Agent: Roberts, Mlotkowski & Hobbes

20080128164 - Conduit connector assembly: A conduit connector assembly which receives an end of a conduit carrying electrical wires includes a body, a grommet and a spring clip. The grommet and the spring clip are each mounted to the body. The spring clip is disposed within an interior bore of the fitting body and has... Agent: Roylance, Abrams, Berdo & Goodman, L.l.p.