Electricity: conductors and insulators inventions 01/08

20080023210 - Electric dipole streamer discharge type lightning conductor: Disclosed therein is an electric dipole streamer discharge type lightning conductor, which can gather electric charges in the atmospheric air at one side thereof and generate an electric discharge due to a dielectric breakdown when a potential difference is formed between the electric charges gathered by an electric dipole and... Agent: Ipla P.A.

20080023211 - Motor control center subunit having moveable line contacts and method of manufacutre: A system and method for connecting supply power to motor control components includes use of a motor control center subunit with moveable supply power contacts. After a motor control center subunit is secured into a motor control center compartment, the supply power contacts may be advanced to engage supply power... Agent: Ziolkowski Patent Solutions Group, Sc (eaton)

20080023223 - Protector: In a protector, a lock mechanism for a stay is provided at a protector body. The lock mechanism includes a stay abutment plate which is perpendicular to a direction of a normal line of the protector body, a boss for passing through a boss passage hole in the stay, and... Agent: Sughrue-265550

20080023224 - Electrical wire connector with temporary grip: An electrical connector includes a crimpable tubular body including a receiving portion for receiving a wire conductor via an opening at a longitudinal end of the tubular body. The tubular body provides a permanent electrical connection to the wire conductor only upon at least a portion of the tubular body... Agent: Edell, Shapiro & Finnan, LLC

20080023212 - Cable pathway patch panel rack: Assemblies and methods for mounting a patch panel rack to a cable management pathway are provided. A typical assembly includes a patch panel rack adapted to host a plurality of ports. The patch panel rack is mounted onto two mounting brackets. The mounting brackets are mounted onto a cable management... Agent: Mccarter & English , LLP Stamford Office

20080023213 - Asymmetrical separator and communication cable having the same: A separator for a communication cable includes a plurality of barriers formed in a radial direction so that at least two pair units, in each of which at least two insulation-coated wires are spirally twisted, are received in spaces formed by the barriers one by one so as to separate... Agent: Jones Day

20080023214 - Flexible printed circuit cable and method of soldering the same to a printed circuit board: A Flexible Printed Circuit Cable (FPC) (1) for being soldered to a Printed Circuit Board (PCB) (2), comprises a plurality of flat wires (11), a glue layer (12) attached to the wires and a pair of base boards (13) enclosing the flat wires and the glue layer, the base boards... Agent: Wei Te Chung Foxconn International, Inc.

20080023215 - Thermoplastic polymer composition, production method thereof, and shaped article and electric cable obtained therefrom: Propylene-based resin compositions contain an inorganic filler in a high ratio and are excellent in flexibility, mechanical strength, elongation at break, heat resistance, scratch resistance, whitening resistance and flame retardancy. Shaped articles comprise the compositions. A first propylene-based resin composition of the present invention contains 5 to 64.9% by weight... Agent: Foley And Lardner LLP Suite 500

20080023216 - Method of forming low temperature cofired composite ceramic devices for high frequency applications and compositions used therein: The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080023217 - Flexible printed wiring board: An object of the present invention is to provide a flexible printed wiring board which relaxes stress concentration in the flexible printed wiring board during production steps, thereby preventing wire breakage in inner lead portions and cracking in solder resist which would otherwise be caused during mounting of devices such... Agent: Sughrue Mion, PLLC

20080023218 - Electrolytic plating method: A novel electrolytic plating method suitable for filling non-through holes with metal is disclosed. The electrolytic plating method uses a plating solution containing additives such as a surfactant, a brightening agent and a smoothing agent and includes pulse plating for controlling adsorption and desorption of tie additives on the surface... Agent: John L. Cordani Carmody & Torrance LLP

20080023219 - Electronic component and method for manufacturing same: An electronic component having: a substrate, a lower conductor layer provided on the substrate; an inorganic dielectric film that covers the lower conductor layer; and an upper conductor layer having an upper electrode portion provided on the inorganic dielectric film. The lower conductor layer has a lower electrode portion that... Agent: Oliff & Berridge, PLC

20080023220 - Plating buss and a method of use thereof: The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing... Agent: Dinsmore & Shohl LLP

20080023221 - Via structure of printed circuit board: An exemplary printed circuit board includes at least a pair of differential vias defined therein, each of the differential vias has an annular ring formed on the PCB, a conductive hole defined in the PCB, and a clearance hole defined in at least one inner layer of the PCB. Each... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20080023222 - Self-aligning electromagnetic interference gaskets for customer removable modules: An electromagnetic interference (EMI) gasket for an electronic module comprises a valley feature formed on one side of an EMI gasket and a crown feature formed on the other side of the EMI gasket in order to complement the valley. One or more EMI gaskets are used to construct a... Agent: Pete Scott, Senior Corporate Counsel Lsi Logic Corporation

20080017397 - Folding assembly type cable protection and guide device technical field: A folding assembly type cable protection and guide device is provided in which a cable is accommodated into a cable accommodating space. The cable protection and guide device can be easily manufactured by extrusion molding without requiring different metal molds to accommodate different size cables. Assembly is simplified. Dimensional stability... Agent: Woodling, Krost And Rust

20080017398 - Wiring device and cover plate snap-on assembly: The present invention relates to an installation of a wiring device configured to receive a cover plate which snaps on to a wiring device such as a switch or receptacle. With this invention, openings for threaded fasteners in the face of the cover plate are eliminated. In an embodiment, the... Agent: Paul J. Sutton, Esq., Barry G. Magidoff, Esq. Greenberg Traurig, LLP

20080017399 - Sealing-end structure for superconducting cable: The present invention offers a sealing-end structure for a superconducting cable. The structure performs, through a bushing, the outputting and inputting of electric power between a normal-temperature side and a cryogenic-temperature side, where an end portion of a superconducting cable is placed. The sealing-end structure is provided with a coolant... Agent: Drinker Biddle & Reath (dc)

20080017400 - Element, thin film transistor and sensor using the same, and method of manufacturing element: Provided is an element which is formed of a conductor composed of a monocrystalline organic compound. Employed is an element including a pair of electrodes with a gap of 10 to 900 nm therebetween and a conductor composed of a monocrystalline organic compound disposed between the pair of electrodes.... Agent: Birch Stewart Kolasch & Birch

20080017401 - Grommet and forming method for the grommet: A grommet is formed having a funnel shaped portion and a tubular portion linked to a small diameter end portion of the funnel shaped portion. The grommet is inserted to an aperture of a car body panel after a wire harness is passed through and attached to the funnel shaped... Agent: Greenblum & Bernstein, P.L.C

20080017402 - Substrate module with high thermal conductivity and its fabrication method of same: A high thermal conductivity substrate includes multiple substrate material layers each having a first plane and a second plane opposite to the first plane, thermal conducting columns arranged in the substrate material layers and respectively extending through the first planes and second planes of each substrate material layer along its... Agent: Bacon & Thomas, PLLC

20080017403 - Method of manufacturing circuit-forming board and material of circuit-forming board: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion... Agent: Wenderoth, Lind & Ponack L.L.P.

20080017404 - Miniature circuitry and inductive components and methods for manufacturing same: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole... Agent: Knobbe Martens Olson & Bear LLP

20080017405 - Circuit board and anti-static module thereof: An anti-static module for a circuit board having a plurality of grounding traces comprises a copper region having a tip toward one of the grounding traces. Static electricity on the circuit board can be removed by discharging from the tip to the grounding trace, avoiding damage to the elements on... Agent: Birch Stewart Kolasch & Birch

20080017407 - Interposer and electronic device using the same: A novel interposer(10) includes a silicon substrate(12), a plurality of through-hole conductors (20) formed on the silicon substrate, and capacitors (15) having of upper and lower electrodes (14,18) formed with land portions, respectively, of the through-hole conductors, and a dielectric layer (16) formed between both the electrodes. When desired, wiring... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080017406 - Thermal conduit: A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit mounted on a circuit board and a thermal conduit having a first and a second portion. The first portion of... Agent: Blakely Sokoloff Taylor & Zafman

20080017408 - Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package: A method of fabricating a device including plural electronic parts mounted on a circuit board with mounting areas for mounting the electronic parts being covered by a sealing resin is disclosed. The method prevents small air bubbles from entering into the sealing resin near the electronic parts. The method includes... Agent: Cooper & Dunham, LLP

20080017409 - Multilayer board: A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer connectors is disposed in the base member, and is electrically connected to the conductor pattern by a heating process.... Agent: Posz Law Group, PLC

20080017410 - Method for forming a plated microvia interconnect: A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a substrate in direct mechanical contact with a conductive element thereon. An opening in the EDL exposes the conductive element and create a microvia in the EDL. A sidewall and bottom wall surface of... Agent: Schmeiser, Olsen & Watts

20080017411 - High-speed signal transmission structure having parallel disposed and serially connected vias: A high-speed signal transmission structure having parallel disposed and serially connected vias is disclosed. The structure is applicable to a multi-layered circuit board such as a high-speed digital circuit board for forming a high-speed signal transmission circuit on the high-speed digital circuit board. The structure includes a pair of parallel... Agent: Edwards Angell Palmer & Dodge LLP

20080017412 - Multilayer interconnection board: A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L2≦(L1/3) is set, where L1 denotes the distance between center positions of a... Agent: Kratz, Quintos & Hanson, LLP

20080017413 - Recessed outlet box assembly: The present invention provides an outlet box assembly including an outlet box having a bottom wall bounded by an outwardly extending perimeter wall forming a housing for receiving a first receptacle. An attachment structure is disposed in the housing for securing the first receptacle to the outlet box. The perimeter... Agent: Hoffmann & Baron, LLP

20080017414 - Housing for accommodating electrical components: A housing is disclosed for accommodating electrical components having a housing lower part, having a conductor feed opening and having a housing cover for covering the housing lower part. In at least one embodiment, the housing is intended to provide the possibility of very convenient fitting and dismantling. The conductor... Agent: Harness, Dickey & Pierce, P.L.C

20080017415 - Fluid-tight cable duct: The invention relates to a fluid-tight cable duct (1) which is used to guide a cable (2) into a chamber (3) which can be impinged upon by pressure, and which comprises a housing (4), at least one cable (2) and one first and one second seal (5a, 5b) which can... Agent: Pearl Cohen Zedek Latzer, LLP

20080011500 - Lightning grounding towers as used in sytems for inducing lightning to eliminate hurricanes: It is believed that Raytheon uses lightning strikes to prevent rotating clouds from building into hurricanes. In this invention, metal towers are placed on islands so as to safely ground the Raytheon man made lightning strokes without damage to property or loss of life.... Agent: Leo J. Aubel

20080011503 - Universal recessed while-in-use box and cover: A while-in-use recessed electrical outlet box configured with multiple interior bosses, each having one or more mounting opening pairs therein. The mounting opening pairs are positioned such that one pair may be used to secure a single electrical fixture within the box while other mounting opening pairs may be used... Agent: Hoffman & Baron, LLP

20080011514 - Optical fiber distribution apparatus and method: A system and apparatus for storing and organization optical fibers and fiber dispensing reels are provided. The storage system may include a housing having multiple mandrels configured to receive one or more fiber dispensing reels. The mandrels may further be configured to allow stacking of multiple dispensing reels on a... Agent: Banner & Witcoff, Ltd.

20080011515 - Photosensitive conductive paste for electrode formation and electrode: A photosensitive conductive paste for electrode formation, containing conductive metal particles, a glass binder, a monomer, a photoinitiator, an organic polymer binder, an organic medium and carbon black.... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center

20080011501 - Closed electrical enclosure: An electrical enclosure includes a body, a face, an outer junction, an inner junction, and a pass-through. The body has an inner surface and an outer surface that are separated without an opening. The outer junction is adjacent the outer surface of the body. The inner junction is adjacent the... Agent: Dicke, Billig & Czaja

20080011502 - Sealing element for sealing a strand-shaped body in an aperture of a wall: A sealing element for sealing a strand-shaped body in an aperture of a wall, in particular for sealing a loom of cables in an aperture of a vehicle-body sheet, has a bush through which the strand-shaped body is guided. The bush has a circumferential wall bounding a cavity. A clamping... Agent: Lerner Greenberg Stemer LLP

20080011504 - Extendable/retractable lead having downsized lead body: A lead assembly includes a flexible lead body extending from a proximal end to a distal end, and the lead body includes two or more conductors disposed therein. The second conductor is disposed within the first conductor, and the first conductor has a coating of insulation disposed on a portion... Agent: Schwegman, Lundberg & Woessner, P.A.

20080011505 - Separator for separating windings: A separator is disclosed which provides an electrically insulating layer between groups of windings in an electrical apparatus, such as a rotating electrical machine. The separator comprises a matrix of interconnected rods. This can allow air gaps to be present between groups of windings, which may improve the cooling efficiency... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20080011506 - Method of reducing noise induced from reference plane currents: A method of reducing noise induced from reference plane currents is disclosed. The method includes routing a first path for an electrical trace on a circuit board such that the first path references a voltage plane. The method further includes routing a second path for the electrical trace on the... Agent: Baker Botts, LLP

20080011507 - Build-up printed wiring board substrate having a core layer that is part of a circuit: Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are... Agent: Kauth , Pomeroy , Peck & Bailey ,llp

20080011508 - Electronic parts packaging structure and method of manufacturing the same: An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess... Agent: Kratz, Quintos & Hanson, LLP

20080011509 - Fractal and space-filling transmission lines, resonators, filters and passive network elements: A high frequency electromagnetic circuit is disclosed as being patterned on a metallic or superconducting film on top of a dielectric in a plurality of configurations. A part of the circuit such as the characteristic strip or slot of the configurations is shaped in a novel space-filling geometry which allows... Agent: Winstead PC

20080011510 - Hybrid faceplate having reduced emi emissions: A hybrid plastic-metal faceplate having reduced EMI emissions for use with electric circuit card rack systems. The faceplate uses an electrically conductive thermoplastic front plate that is simpler to construct. The faceplate also includes a first metal element in electrically conducting contact with the front plate and a second metal... Agent: Sabic - 08ct Sabic Innovative Plastics -IPLegal

20080011511 - Structure having a characteristic of conducting or absorbing electromagnetic waves: The present invention relates to a structure having a characteristic of conducting or absorbing electromagnetic waves, which comprises a substrate; and a fiber convex structure section which has a characteristic of conducting or absorbing electromagnetic waves and is formed at least partially on the substrate in such a form that... Agent: Sughrue-265550

20080011512 - Wire management system: A wire management system including a channel having a plurality of alternating retention tabs extending inwardly from the side edges of the channel under which wires or cables may be laced. The channel defines a plurality of openings adapted to receive screws for attachment of the channel to a desired... Agent: Fulbright And Jaworski LLP

20080011513 - Glossy colored injection molded article: An injection molded article comprising a polycarbonate composition. The polycarbonate composition is scratch resistant, flame retardant, has a low chlorine and bromine content and is dark colored.... Agent: Cantor Colburn LLP - Ge Plastics - Smith

20080006429 - Wall switch with a safety module: The present invention discloses a wall switch with a current control safety module, comprising a bottom seat, a triple-conductors assembly, a press-button assembly, a top cover, and a current control safety module. The current control safety module is structurally independent of other parts of the switch and operates via a... Agent: Dr. Banger Shia

20080006430 - Panel cover structure for a computer casing: A panel cover structure for a computer casing, which is used to be pivoted on a front of the computer casing, is composed of a base panel, and at least one piece of decoration panel which is assembled on a front of the base panel, such that a noise transmitting... Agent: Troxell Law Office PLLC Suite 1404

20080006427 - Method and system for testing or measuring electrical elements, using two offset pulses: A method for testing electric elements includes applying a first beam of particles to a first location of an electric element, to liberate electrons from the first location, and applying a second beam of particles to a second location of an electric element, with a temporal shift (Δt) different from... Agent: Akin Gump Strauss Hauer & Feld L.L.P.

20080006428 - Side-by-side outlet: An outlet box includes two electrical boxes in side by side relationship with each other and which are connected together so the open ends of the boxes face away from each other. This orientation allows the boxes to be used in adjoining rooms of a building and both secured to... Agent: Sung I. Oh, Professional Law Corporation

20080006431 - Multifunction clips and ground/mounting strap for wiring device: The instant invention overcomes the difficulties encountered with respect to mounting electrical wiring devices to a common box and then positioning the devices relative to each other prior to attaching a wall plate. Some of the difficulties encountered are positioning the wiring devices to be in alignment with each other,... Agent: William Collard Collard & Roe, P.C.

20080006432 - Non-woven self-wrapping acoustic sleeve and method of construction thereof: A non-woven acoustic sleeve and method of construction thereof provides routing and protection for elongate members and suppression of noise generation from the elongate members while in the sleeve. The sleeve has an elongate wall with opposite sides that are self-wrapping about a longitudinal axis to define a generally tubular... Agent: Robert L. Stearns Dickinson Wright PLLC

20080006433 - Electrical bus and method for forming an electrical bus: An electrical bus forming method including the steps of interlocking a plurality of electrical conductors and forming a shaped conductor. The interlocking step includes interlocking a plurality of electrical conductors including a first electrical conductor with a second electrical conductor thereby forming an interlocked conductor. The forming step includes forming... Agent: Taylor & Aust, P.C.

20080006434 - Low thermal conductivity reusable insulation jacket for pipe, tubing, valves, and fittings: A reusable insulation jacket for straight industrial tubing, as well as elbow, union, coupling, tee, valve, and other connectors carrying extreme hot and cold materials comprises a thin insulating mat. For straight tubing, the jacket is of a width as to completely wrap the tubing and overlap itself. For tubing... Agent: Jacob Nygaard

20080006435 - Non-halogenated heavy metal free vehicular cable insulation and harness covering material: Described is a vehicular harness comprising a plurality of insulated non-halogenated, heavy metal free vehicular cables, each comprising an inner core of a copper based metal wire having a thickness area of at least about 0.1 mm, an outer insulation, covering the length of the inner core, comprised of a... Agent: Delphi Technologies, Inc.

20080006436 - Electric wire: An electric wire assembly includes at least two electric wires. Each of the at least two electric wires includes an insulating sheath. A protrusion having a certain length is formed longitudinally on an outer surface of the insulating sheath of one of the at least two electric wires. A recess... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20080006437 - Bond and method for bonding two contact surfaces: A bond between two contact surfaces using at least two bonding wires, as well as a method for producing such a bond. The bonding wires are positioned one above the other and are conductively interconnected.... Agent: Kenyon & Kenyon LLP

20080006438 - Visual latching indicator arrangement for an electrical bushing and terminator: An elbow terminator has a socket in which an electrical probe is disposed. The terminator is insertable onto an electrical bushing such that a tongue of the bushing is received in the socket of the terminator, and the probe of the terminator is electrically coupled to a contact sleeve disposed... Agent: Thomas G. Scavone Niro, Scavone, Haller & Niro

20080006439 - Reference layer openings: A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein.... Agent: Schwabe, Williamson & Wyatt, P.C.

20080006440 - Process for manufacturing an injection molded part with integrated flexible printed circuit board: A process and manufacturing system for manufacturing injection molded parts with integrated flexible printed circuit board (9), provided with a cover (39/47) of plastic, fixed in a recess (2) of a carrier strip (1) by projecting carrier elements (14, 15, 16, 17). A circuit board (9) fixed in the carrier... Agent: Mcglew & Tuttle, PC

20080006441 - Wiring board and semiconductor device excellent in folding endurance: A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C)... Agent: The Webb Law Firm, P.C.

20080006442 - Tape carrier package: A tap tape of a tape carrier package prevents connection parts from being eroded. The tap tape includes a base film having a device hole formed to mount a driver chip for driving a panel of a flat panel display, input patterns positioned on the base film and having a... Agent: Fish & Richardson P.C.

20080006443 - Magnetic shielding door and magnetic shielding room: A magnetic shielding door (10) opens and closes a gate (16) of a magnetic shielding room. Magnetic members (15) made of a magnetic material are aligned at intervals on walls of the magnetic shielding room. Magnetic shielding forming members (27) are disposed to correspond to the respective magnetic members (15)... Agent: Casella & Hespos

20080006444 - Method for providing electromagnetic interference shielding in electronics enclosures by forming tubular patterns in conductive polymer: Provides a configuration of a hard drive enclosure system and method for manufacture in which a polymer including electromagnetic interference shielding (EMI shielding) properties is configured such that shielding gaskets may be reduced or eliminated completely. Patterned honeycomb “tubes” are molded into the front wall of the front panel providing... Agent: David Bogart Dort Stealthdrive LLC