Electricity: conductors and insulators inventions 12/07

20070295526 - Multi-pair cable with varying lay length: A multi-pair cable having a plurality of twisted conductor pairs. The twisted conductor pairs each have an initial lay length that is different from that of the other twisted conductor pairs. The plurality of twisted conductor pairs defines a cable core. The core is twisted at a varying twist rate... Agent: Merchant & Gould PC

20070295525 - Insulated non-halogenated heavy metal free vehicular cable: Described is an insulated non-halogenated, heavy metal free vehicular cable comprising an inner core of a copper based metal wire having a cross sectional area of at least about 0.1 mm2, and an outer insulation, covering the length of the inner core, comprised of a thermoplastic polyphenylene ether composition that... Agent: Delphi Technologies, Inc.

20070295527 - Twisted pairs cable with shielding arrangement: A multi-pair cable having a plurality of twisted conductor pairs and a shielding arrangement. The shielding arrangement including at least one shielding component. The shielding component including a length of tape encased by a dielectric material.... Agent: Merchant & Gould PC

20070295528 - Pb-free sn-based material, wiring conductor, terminal connecting assembly, and pb-free solder alloy: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of a surface the wiring conductor, and the Sn-based material part includes a base metal doped with a transformation retardant element and an oxidation control element. The transformation retardant element is at least one... Agent: Mcginn Intellectual Property Law Group, PLLC

20070295529 - Cord management device: A cord management device (100) includes: a receptacle (110) defining an interior space (120) and including: (a) a stationary portion (111); and (c) a cord management feature (113) coupled to the stationary portion, the cord management feature includes: (1) a first finger (171); and (2) a second finger (172), the... Agent: Walter P. Opaska Bryan Cave LLP

20070295530 - Coatings and methods for inhibiting tin whisker growth: An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a conformal coating formed on the tin layer to impede tin whisker growth. The conformal coating includes a polymer matrix, and particles that are dispersed about the matrix. The particles are either significantly harder than... Agent: Honeywell International Inc.

20070295531 - Substrate structure and method for manufacturing the same: A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask; herein the core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20070295533 - Buildup board, and electronic component and apparatus having the buildup board: A buildup board includes a buildup layer having a multilayer structure and/or a core layer having a multilayer structure. The multilayer structure includes a signal wiring pattern, a pad connected to the signal wiring pattern, an insulating part arranged around the pad on the same layer as the pad, and... Agent: Kratz, Quintos & Hanson, LLP

20070295532 - Multilayer printed wiring board: A multilayer printed wiring board 10 includes: a build-up layer 30 that is formed on a core substrate 20 and has a conductor pattern 32 disposed on an upper surface; a low elastic modulus layer 40 that is formed on the build-up layer 30; lands 52 that are disposed on... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20070295534 - Wired circuit board: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the... Agent: Akerman Senterfitt

20070295535 - Electronic device housing and systems and methods for forming same: The described embodiments relate to electronic devices. One exemplary device includes a pair of sidewall components extending between respective top portions and bottom portions, the bottom portions lying in a plane that extends between the bottom portions. The device also includes a bottom component joined with and extending between the... Agent: Hewlett-packard Company Intellectual Property Administration

20070289764 - Low inductance optical transmitter submount assembly: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface... Agent: Workman Nydegger

20070289765 - Conduit junction box adapter closure: An adapter closure structure for electrical conduit systems of the type having conduit bodies, for which additional conduit access to an in-service conduit junction box can be provided without the need for removing and/or rewiring the in-service junction box. In a first embodiment, a structure is provided in the form... Agent: Jeffer, Mangels, Butler & Marmaro, LLP

20070289766 - Electric power supply system and a method of production thereof: A power supply system including an element connected to a remote power supply source or power consumer through an electric power supply device. The element is movably arranged in relation the source or consumer in an environment in which at least a part of the power supply device is subjected... Agent: Venable LLP

20070289767 - Line guide device: A line guide device for guiding lines can comprise a plurality of links, connected to each other in articulated fashion, where at least some, or all, of the links each display a bottom element, opposite side walls and at least one cover element, the plurality of links are integrally moulded... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC

20070289768 - Wire-based flat panel displays: An effective method to create very large electronic displays forms the structure using fiber or tube arrays or electroded sheets containing wire electrodes. The electroded sheets are formed by embedding wire electrodes into the surface of a polymer substrate and electrically connecting a patterned transparent conductive electrode lines to the... Agent: Brown & Michaels, PC 400 M & T Bank Building

20070289769 - Multi-layer wiring, method of manufacturing the same and thin film transistor having the same: A multi-layer wiring for use with thin film transistors (TFTs), methods of manufacturing the multi-layer wiring, and TFTs employing the multi-layer wiring are provided. In one embodiment, the multi-layer wiring includes a main wiring and a sub-wiring on the main wiring. The main wiring includes a first metal and the... Agent: Macpherson Kwok Chen & Heid LLP

20070289770 - Two-piece clip: A two-piece clip includes: a grommet; and a pin-shaped member, wherein: the grommet includes a leg portions, an elastic engagement member formed on a side wall through a slit, and a sliding protrusion; the pin-shaped member includes an insertion member to be inserted into the slit; the insertion member is... Agent: Mcginn Intellectual Property Law Group, PLLC

20070289771 - Semiconductor device: The present invention realizes high density mounting along with achieving power source sharing by a digital semiconductor element and an analog semiconductor element in a semiconductor device. An power layer for analog is connected to one end of an EBG layer, a power layer for digital is connected to the... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070289772 - Electronic circuit: The present invention has an object to provide an electronic circuit capable of efficiently transmitting signals in a case where signals are transmitted over substrates with three or more substrates three-dimensionally mounted. In the present invention, LSI chips are stacked in three layers, and a bus is formed over three... Agent: Kratz, Quintos & Hanson, LLP

20070289773 - High speed interposer: A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP

20070289774 - Electromagnetic interference shielding filter and manufacturing method thereof: An electromagnetic interference (EMI) shielding filter includes a conductive pattern for shielding electromagnetic waves; and blackened layers formed on a surface of the conductive pattern. The electromagnetic interference (EMI) shielding filter is manufactured by preparing a base film; forming on the base film a first blackened layer, a conductive layer,... Agent: Lee, Hong, Degerman, Kang & Schmadeka

20070289775 - Rfid shielding devices: Unauthorized electronic access to RFID devices embedded in credit cards, personal identification cards, and other cards is prevented by providing wallets, purses, card holders, and other card receiving devices with layers of electromagnetic shielding material which substantially surround cards having RFID devices embedded therein.... Agent: Michael A. O'neil Michael A. O'neil, P.C.

20070289776 - Providing airflow to an electronics enclosure while providing protection and shielding against electromagnetic interference: Methods and apparatus for shielding an object from relative high electromagnetic radio frequencies while allowing airflow to pass to and from the object are disclosed. According to one aspect of the present invention, a shield arrangement that shields a chassis includes at least a first plane and a second plane.... Agent: Cisco Systems, Inc. Scientific-atlanta, Inc.

20070289777 - Package-on-package system: A package-on-package system is provided with a base package. Solder caps are provided on the top of the base package. The solder caps are configured to protrude above subsequent resin bleed, and are configured for merging with solder balls of a top package to form larger solder balls between such... Agent: Ishimaru & Zahrt LLP

20070284127 - Electrical cable employing resistance conductors: An electrical cable that minimizes frequency sensitive group delay for consumer products and industrial use. A method constructing an electrical cable that minimizes frequency sensitive group delay for consumer products and industrial use. The cables utilize flat conductor made from resistive conductors. In other embodiments the conductors use a combination... Agent: Buhler Associates Buhler, Kirk A.

20070284143 - Aerial cable spacer with cable retaining arm having non-rectangular plus-shaped cross section and angled pawl locking member: An aerial cable spacer is provided with a cable retainer and vertically disposed strengthening tabs or ribs. The cable retainer includes a cable retaining arm. A mid portion of the cable retaining arm has a non-rectangular plus “+” shaped cross section. The plus “+” shaped cross section engages and exerts... Agent: Fay Sharpe LLP

20070284128 - Decorative switch assembly: “Confirmed with USPTO that no abstract was provided.”... Agent: Shaojie Xu

20070284146 - Shrinkable closure: A tubular housing is provided having an open face and a circumferential perimeter portion adjacent the open face of the housing. An elastomeric film can be mounted on the circumferential perimeter portion of the tubular housing across the open face of the tubular housing. The elastomeric film can be adapted... Agent: 3m Innovative Properties Company

20070284129 - Tamper resistant electrical ground block: A tamper-resistant electrical ground block includes a ground block chassis that is looped over a port structure so that an installer has to use a security-type wrench to tighten or loosen coaxial cable connectors from the port structure. A ground clamp, one-piece with the chassis, accommodates a wide range of... Agent: Pastel Law Firm

20070284132 - Method of making closure housing for sealing: A method is provided for making a closure housing for sealing. The method includes forming a plurality of housings. At least one of the housings is formed as a concave housing with an open face. The method also includes aligning one or more layers, such as for example an elastomeric... Agent: 3m Innovative Properties Company

20070284130 - Connection termination for a superconductive cable: A termination for connecting one end of a superconductive cable (10), the end being made up of at least one resistively-conductive central support (12) of substantially cylindrical shape, of a superconductor (14, 16) disposed around the support, and of an insulating sheath (18) surrounding the superconductor. According to the invention,... Agent: Sofer & Haroun LLP.

20070284131 - Closure housing for sealing: A closure housing includes several housings. At least one of the housings is a concave housing with an open face. At least one layer, such as for example an elastomeric film or conformable sealant, is mounted on a circumferential perimeter portion of the concave housings across the open face of... Agent: 3m Innovative Properties Company

20070284133 - Cable having translucent, semi-transparent or transparent esd dissipative layer and/or metallic layer: A cable in one embodiment includes a plurality of leads; and an electrostatic discharge (ESD) dissipative layer operatively coupled to the leads, the ESD dissipative layer being characterized as being at least one of translucent, semi-transparent or transparent. A cable in another embodiment includes a plurality of leads; an ESD... Agent: Zilka-kotab, PC

20070284134 - Textile system with a plurality of electronic functional elements: A textile system is provided with a flat textile part and with a plurality of electronic functional elements. The functional elements are arranged on the textile part. A process for data transmission in a textile system is also presented and described. The textile part has a first conductor and a... Agent: Mcglew & Tuttle, PC

20070284135 - Flexible printed-circuit boards bonding method and printed circuit board: A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner... Agent: Staas & Halsey LLP

20070284136 - Method for production of electronic circuit board: A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can further include the steps of... Agent: Sughrue Mion, PLLC

20070284137 - Method of manufacturing printed circuit board base sheet, method of manufacturing printed circuit board, and printed circuit board: A printed circuit board base sheet is manufactured by laminating an insulating resin film and a metal foil using a laminate roller. A rustproofing layer containing chromium is formed on a surface of the metal foil. The temperature of the laminate roller is set to 330 to 390° C. A... Agent: Akin Gump Strauss Hauer & Feld L.L.P.

20070284138 - Circuit board: A circuit board is provided. The circuit board includes a first metal layer, at least a second metal layer and at least an insulating layer. The first metal layer has at least a solder pad. The second metal layer does not overlap with the solder pad. The insulating layer is... Agent: Rabin & Berdo, PC

20070284139 - Sawn integrated circuit package system: An integrated circuit package system is provided including providing an integrated circuit die, forming an encapsulation over the integrated circuit die, and sawing the encapsulation with a multi-level saw.... Agent: Ishimaru & Zahrt LLP

20070284140 - Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system: A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced substrate includes a first conductive layer with a plurality of conductors on which an electrical component may be positioned and electrically coupled. The pads... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP

20070284141 - Lance-tab mounting method: Aspects of the present disclosure provide methods for mounting fingerstock EMI shielding gaskets on sheet metal structures. The fingerstock EMI shielding gasket may include a generally D-shaped cross section with at least one mounting tab forming at least part of an upright portion. In one particular exemplary embodiment, a mounting... Agent: Harness, Dickey, & Pierce, P.l.c

20070284142 - Emi/rfi finger clip gasket: An elongated EMI/RFI grounding and shielding structure is formed from a resiliently deflectable, electrically conductive material and has a longitudinally spaced series of specially configured finger sections interdigitated with spring sections. Each finger structure has a domed central body portion, a first end portion with an inwardly curved, generally hook-shaped... Agent: Huffman Law Group, P.C.

20070284144 - Integrated circuit packaging: Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another... Agent: Timothy M Honeycutt Attorney At Law

20070284145 - Metal/ceramic composite conductor and cable including same: A conductor cable includes an inner portion and a conductive coating. The inner portion is formed of a metal/ceramic composite. The conductive coating is coated on the inner portion.... Agent: 3m Innovative Properties Company

20070277993 - Waterproof cover for an audio system: A waterproof cover for an audio system includes a frame and a shield pivotally connected to the frame. The flame has two elongated recesses respectively defined in two opposed sides defining the through hole and an inclined trough sandwiched by the two elongated recesses and defined in a bottom side... Agent: Pai Patent & Trademark Law Firm

20070277994 - Conductor for liquid-cooled windings: A conductor for windings cooled by liquid, especially for transformer windings, has an insulating covering which surrounds the entire conductor (1). At least one layer (2) of the covering completely surrounds the conductor (1). An external layer (3) provided with at least two layers (2, 3) of the covering comprises... Agent: Baker Botts L.L.P. Patent Department

20070277995 - Double wire cord and portable audio device using the same: A double wire cord is used in an electro-acoustic converter, such as earphones and headphones, and has a long first cord and a long second cord. For example, the first cord is substantially circular in cross section and has a large diameter, the second cord is also substantially circular in... Agent: Merchant & Gould PC

20070277996 - Conductor with non-circular cross-section: Communication wires are provided with insulated corrugated conductors. The corrugated conductors have ridges and depressions, such that air gaps are provided between insulation and the outer surfaces of the wires in the regions of the depressions. In some embodiments, the ridges and depressions form a sine wave profile in cross-section.... Agent: Panduit Corp.

20070277998 - Printed wiring board, its manufacturing method, and electronic equipment: According to one embodiment, a printed wiring board includes a first layer, a flexible sheet member disposed at a part on a surface of the first layer, and a second layer which is disposed on the first layer and the flexible sheet member, a part of the second layer which... Agent: Pillsbury Winthrop Shaw Pittman, LLP Eric S. Cherry - Docketing Supervisor

20070277997 - Substrate and layout method: Layout methods for a substrate are disclosed. In one embodiment, the method includes: defining a first plating line on a non-conducting layer coupled to a first pad; and defining a second plating line on the first conducting layer coupled to a second pad. Along a direction away from the first... Agent: North America Intellectual Property Corporation

20070277999 - Circuit board and electrical connection box having the same: A circuit board includes a metal core having a plate shape, an insulation section covering a surface of the metal core, and a heat radiation section in which the metal core is exposed and which is provided at a circumference of the metal core.... Agent: Sughrue-265550

20070278000 - Component-embedded printed wiring board, manufacturing method for component-embedded printed wiring board, and electronic apparatus: According to one embodiment, a component-embedded printed wiring board includes a base including a component mounting surface, a pair of conductive patterns which is disposed on the component mounting surface of the base, and a circuit component which is mounted on the base so as to be in close contact... Agent: Knobbe Martens Olson & Bear LLP

20070278001 - Method and apparatus for a high frequency coaxial through hole via in multilayer printed circuit boards: A high frequency coaxial through hole via in a multilayer printed circuit board is presented. The high frequency coaxial through hole via may include two traces connected by a plated through hole via and surrounded by more than one ground plane, where the more than one ground planes are capacitively... Agent: Verigy

20070278002 - Method and apparatus for a low thermal impedance printed circuit board assembly: A low thermal impedance printed circuit board assembly compatible with surface mount assembly reflow solder processes is presented. The low thermal impedance printed circuit board assembly may have filled vias soldered directly to solder balls of the surface mount assembly.... Agent: Verigy

20070278003 - Carbon bonded carbon foam emi shielding enclosures: Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference and various methods for producing such enclosures are described. Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference may be prepared by bonding at least two sections of carbon... Agent: Philip D. Lane

20070278004 - Comformal coverings for electronic devices: Stand-alone conformal coverings for electronic devices and methods of making and using such coverings.... Agent: Honeywell International Inc.

20070278005 - Split cable seal: A method for sealing a cable in an enclosure includes assembling a first portion and a second portion of a cable seal around a cable. The first and second portions of the cable seal define a central axial opening having a sealing surface. The cable is disposed in the central... Agent: Merchant & Gould PC

20070278006 - Snap-in connector for electrical junction box: In a snap-in electrical connector for attaching helical metal cable and conduit to a junction box or the like, the connector having the locking ring with flexible tabs engageable with the cable/conduit, the improvement wherein the tabs have legs angled inwardly of the ring at specified angles, tips that form... Agent: Pearne & Gordon LLP