Electricity: conductors and insulators inventions 10/07

20070246259 - Tapered transition ramp for cable protector: An exemplary ramp structure capable of being positioned over at least a portion of a cable protection system comprises a center portion, a first side ramp portion adjacent a side of the center portion, and a first tapered portion adjacent an end of the first side ramp portion. The first... Agent: Holland & Hart LLP

20070246239 - Cable and apparatus for forming the same: The invention relates to a cable and apparatus and a method for forming the same. The cable comprises a series of conductors, said conductors arranged in sets of two or more, each set having the conductors twisted with respect to each other and passing along the length of the cable... Agent: Head, Johnson & Kachigian

20070246240 - Ceramifying composition for fire protection: The invention relates to a ceramifying composition for forming a fire resistant ceramic under fire conditions the composition comprising: (i) at least 10% by weight of mineral silicate; (ii) from 8% to 40% by weight of at least one inorganic phosphate that forms a liquid phase at a temperature of... Agent: Nixon Peabody LLP - Patent Group

20070246241 - Electrical splice assembly: An electrical splice assembly includes a bus plate having a plurality of coplanar, spaced male blades extending from the bus plate in cantilever fashion, a plurality of female terminals attached to the male blades, and a generally U-shaped housing of extrudable shape. The housing has an elongate open end portion... Agent: Delphi Technologies, Inc.

20070246242 - High-precision foamed coaxial cable: A high-precision foamed coaxial cable includes an internal conductor constructed by stranding conductors, an insulator constructed by winding a porous tape around an outer circumference of the internal conductor, and an external conductor constructed by braiding a plurality of thin conductor wires around an outer circumference of the insulator. The... Agent: Mcginn Intellectual Property Law Group, PLLC

20070246243 - Halogen-free electric wire, wire bundle, and automotive wiring harness: Provided are a halogen-free electric wire including an insulation coating the life of which is less reduced in the case of the insulating coating being in contact with a PVC-resin-containing member; a wire bundle including the halogen-free electric wire and a PVC-resin-containing member, wherein a reduction in the life of... Agent: Mcdermott Will & Emery LLP

20070246244 - Electrical line: An improved electrical line comprising an electrical conductor (5) and a layer of thermoplastic material wherein the layer consists of at least one inner layer (6) and one outer layer (7) and the outer layer (7) comprises a lubricant which has migrated from the inner layer (6) into the outer... Agent: Sofer & Haroun LLP.

20070246245 - Conductive curable compositions: Conductive curable compositions contain a free radical polymerizable monomer, oligomer or polymer (i); an organoborane amine complex (ii), and an electrically or thermally conductive filler (iii). The conductive curable compositions can also contain an amine reactive compound having amine reactive groups (iv); and (v) a component capable of generating a... Agent: Dow Corning Corporation Co1232

20070246246 - Electrically conductive elastomer mixture, method for its manufacture, and use thereof: The invention relates to an electrically conductive elastomer mixture and to a method. The mixture comprises a thermoplastic styrene elastomer and, as an electrically conductive filler, metal-containing particles. The mixture further comprises a polymer which is an acid-grafted, acid-anhydride-grafted or acid-copolymer and which forms an IPN (Interpenetrating Polymer Network) net-work... Agent: Young & Thompson

20070246247 - Wired circuit board: The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed... Agent: Akerman Senterfitt

20070246248 - Flexible printed circuit board: A flexible printed circuit board (FPC) is disclosed which can eliminate the need for forming through holes and ensure the strength required for mounting components. The FPC has a metal foil layer formed only on one side of an insulating layer via an adhesive layer. The FPC is configured such... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070246249 - Metal pattern forming methd, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same: The present invention provides a method of forming a metal pattern and a metal pattern obtained by the method. The method includes the steps of (I) forming on a substrate a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a... Agent: Sughrue Mion, PLLC

20070246250 - Wiring board: [MEANS FOR SOLVING PROBLEMS]A wiring board is provided with a board, which is formed by stacking along a board flat plane direction of a plurality of dielectric layers arranged along a facing direction of the both main surfaces of the board, and an inner conductor pattern arranged on the surface... Agent: Mcdermott Will & Emery LLP

20070246251 - Novel bonding structure for a hard disk drive suspension using anisotropic conductive film: A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anisotropic bonding to ensure durable bonding. At... Agent: Kenyon & Kenyon LLP

20070246252 - Manufacture of printed circuit boards with stubless plated through-holes: A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed... Agent: Ibm Corporation (yorktown) T.j Watson Research Center

20070246254 - Printed circuit boards with stacked micro vias: Printed circuit boards having circuit layers laminated with stacked (or staggered) micro via(s) and methods of manufacturing the same. Aspects of embodiments of the present invention are directed to a printed circuit board with Z-axis interconnect(s) or micro via(s) that can eliminate a need for plating micro vias and/or eliminate... Agent: Christie, Parker & Hale, LLP

20070246255 - Laminate for printed wiring board: A laminate for a printed wiring board having a laminate structure comprising an electrical insulator layer (A) and an electrical conductor layer (B) bonded directly to each other, wherein the electrical insulator layer (A) is formed of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070246253 - Through substrate, interposer and manufacturing method of through substrate: A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20070246256 - Electronics housing: An electronics housing for placement on a support rail includes a base part and an upper part. The base part and the upper part can be detachably connected to one another, and the base part can be snapped to the support rail. Two housing side walls having fasteners are disposed... Agent: Darby & Darby P.C.

20070246257 - Memory circuit and corresponding production method: A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to the memory circuit. The memory circuit... Agent: Dicke, Billig & Czaja

20070246258 - Rotatable liquid-tight conduit connector assembly: The conduit assembly includes two mateable generally cylindrical conduit connector bodies with a longitudinal internal bore extending therethrough. The connector bodies include a locking surface for joining and retaining the bodies together at a desired angle. One connector body is externally threaded and the other provides an external snap-on attachment... Agent: Hoffman & Baron, LLP

20070240893 - Power cable for direct electric heating system: Electric power cable used as a riser (15) and/or feeder cable (16) in a Direct Electric Heating system for oil or condensate pipelines (10), comprising at least two conductors (1, 5) and insulation layers (3, 6). An outer concentric conductor (5) is connected to a near end of the pipeline,... Agent: Sofer & Haroun LLP.

20070240894 - Electrical connection box: A fuse block 23 includes a main body portion 34, which is arranged along a top edge portion 21a of a frame 21, and an arm portion 35, which extends from an end of the main body portion 34 along a side edge portion 21b of the frame 21 that... Agent: Oliff & Berridge, PLC

20070240895 - Wiring harness clip and method of making same from an extrudable blank: An extrudable wiring harness clip has an elongate base for taping the wiring harness clip to a bundle of cables and an integral self expanding head for attaching the bundle of cables to a support panel or the like. The extrudable wiring harness clip has a constant cross section extending... Agent: Delphi Technologies, Inc.

20070240896 - Protective sleeve assembly having an integral closure member and methods of manufacture and use thereof: A protective sleeve assembly for elongate members has a tubular wall with an inner surface providing a cavity extending along a longitudinal axis between opposite ends of the sleeve. The assembly includes at least one closure member laid-in with the tubular wall, such that at least a portion of the... Agent: Robert L. Sterns Dickinson Wright PLLC

20070240897 - Bi-metallic connectors, method for producing the same, and method for connecting the same to a structure: A bimetallic connecting element has a first part made from a first metal, and a portion of this part is adapted for being attached to a structure. A second portion of this part has a peripheral wall defining a cavity. A second part of the connector is made from a... Agent: Nath & Associates

20070240898 - Flat cable: A flat cable having at least two conductor planes, in which a number of electrical conductors running in the longitudinal direction of the cable are arranged, in which the electrical conductors in the flat cable thickness direction and/or in the flat cable width direction are kept at a defined distance... Agent: Allan M Wheatcraft W L Gore & Associates Inc

20070240899 - Circuit device: A first insulating layer is formed on the front surface of a circuit board, and a second insulating layer on the back surface. A conductive pattern is formed on the surface of the first insulating layer. Circuit elements are connected to the conductive pattern. Sealing resin covers the front and... Agent: Watchstone P+d, PLC

20070240900 - Multilayer printed wiring board and component mounting method thereof: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first,... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070240901 - Wiring board and method for fabricating the same: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20070240902 - Cable entry device comprising means for adjustment: A cable entry device for providing sealing in a space between a cable and a surrounding material. The cable entry comprises a covering, and a first and a second sealing member for receiving said material therebetween. The first sealing member provides a biasing force on the covering when inserted into... Agent: Potomac Patent Group PLLC

20070235204 - Method and apparatus for electrical box repair cover: A method and apparatus for an electrical box repair cover have been described. A cover may be secured to an electrical box by various techniques including straps, clamps, etc. Additionally the cover may secure electrical devices to the electrical box.... Agent: Heimlich Law

20070235205 - Receptacle with shaped surface: The instant invention discloses a receptacle where the surface of the face along its width is flat in one plane and along its length has a constant radius. The shape of the face of the receptacle allows for the proper seating of an inserted plug. The receptacle is adapter to... Agent: Paul J. Sutton, Esq., Barry G. Magidoff, Esq. Greenberg Traurig, LLP

20070235206 - Hinged weatherproof electrical box cover: The present invention is directed to a weatherproof electrical outlet box assembly for shielding and protecting electrical components from moisture comprising a faceplate for attaching to an outlet box, the faceplate being substantially planar, and perimetrically bounded by a substantially rectangular side edge, the faceplate having at least one aperture... Agent: Hoffman & Baron, LLP

20070235207 - Wiring conductor, method for fabricating same, terminal connecting assembly, and pb-free solder alloy: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P,... Agent: Scully Scott Murphy & Presser, PC

20070235208 - Utp cable: A cable for reducing crosstalk having a plurality of unshielded twisted pairs, each of which has a different lay length. A jacket enclose the plurality of unshielded twisted pairs, where the unshielded twisted pair that has the longest lay length among the plurality of unshielded twisted pairs is positioned within... Agent: Sofer & Haroun LLP.

20070235209 - Wiring component: A wiring component includes an array of multiple wires, at least one connector which engages the wires, and at least two layers of a hardened fiber and a filler compound that sandwiches the wires. The areas adjacent to the wires include a filler which immobilizes the wires relative to the... Agent: Workman Nydegger (f/k/a Workman Nydegger & Seeley)

20070235211 - Method for laying a superconductor cable: A method for laying a superconductor cable having a superconductive cable core and a cryostat enclosing the superconductive cable core, with the superconductive cable core being arranged freely mobile in the cryostat. The method includes cooling the superconductive cable core to the operating temperature after laying the superconductor cable, shortening... Agent: Sofer & Haroun LLP.

20070235210 - Superconductive composite tape and a method of fabrication thereof: There are provided herein a superconductive composite tape and a method of fabrication thereof: a tape having a layer made of superconductive material positioned on a substrate is etched, for example by using laser equipment, in order to obtain a plurality of grooves through the superconductive material layer and delimit... Agent: Venable LLP

20070235212 - Wiring harness: A wiring harness that is protected against damage caused by exposure to ultraviolet light is disclosed and claimed. The harness may be constructed out of two pieces that may be joined together, and may also be mounted against a surface, and its structure and design may be altered to minimize... Agent: Bingham Mccutchen LLP

20070235213 - 2-layer printed circuit board and method of manufacturing the same: The present invention relates to a 2-layer printed circuit board (PCB) for enabling impedance matching of a high frequency signal line, and a method of manufacturing the 2-layer PCB. In the present invention, an insulation layer with a predetermined thickness is formed as an insulation substance on a top surface... Agent: Birch Stewart Kolasch & Birch

20070235214 - Moisture resistant printed circuit board: A printed circuit board structure includes a plurality of layers. The plurality of layers includes at least one metal layer or partial metal layer and at least one dielectric layer of a first type. The plurality of layers also includes two dielectric layers of a second type that is different... Agent: Buckley, Maschoff & Talwalkar LLC

20070235217 - Devices with microjetted polymer standoffs: An electronic package having a controlled standoff height between a surface mount electronic device and a substrate includes a plurality of polymeric standoffs adhered to at least one of the underside of the surface mount electronic device or an upper surface of the substrate. The polymeric standoffs prevent collapse of... Agent: Delphi Technologies, Inc.

20070235216 - Multichip package system: A multichip integrated circuit package system is provided attaching a first integrated circuit die on a substrate top surface, mounting a second integrated circuit die over the first integrated circuit die, connecting an external interconnect on a substrate bottom surface, and forming a first encapsulation having a recess to expose... Agent: Ishimaru & Zahrt LLP

20070235215 - Multiple flip-chip integrated circuit package system: An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.... Agent: Ishimaru & Zahrt LLP

20070235218 - Electronic device substrate and its fabrication method, and electronic device and its fabrication method: An electronic device substrate is formed of a thin-plate reinforcing substrate; an external connection wiring layer stacked on the reinforcing substrate, and comprising an electrical insulation provided on the reinforcing substrate, an opening formed in the electrical insulation, a first conductor pattern and a via-hole conductor provided in the opening... Agent: Foley And Lardner LLP Suite 500

20070235219 - Wired circuit board and production method thereof: A wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a first semi-conductive layer formed on the conductive pattern, an insulating cover layer formed on the first semi-conductive layer, and a second... Agent: Akerman Senterfitt

20070235220 - Printed circuit board using bump and method for manufacturing thereof: The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 μm of a thickness... Agent: Staas & Halsey LLP

20070235221 - Metal shielding apparatus: The present invention is a metal shielding apparatus; it includes a cover shielding and a bottom shielding. The cover shielding has a number of holes while the bottom shielding has a number of jutted points. The holes and the jutted points can be used for alignment when combining these two... Agent: Anthony R. Barkume

20070235222 - Cable management unit: A cable organizer box for the maintenance of cables connecting computer workstations and peripherals, including power supplies, is described. The system comprises a specially adapted box that attaches via a removable top surface to the underside of a table or desk. The box has a hinged wall that opens easily... Agent: Michael A. Shippey, Ph. D.

20070227755 - Power supply cover box: An outlet cover comprising an outlet surface and a cord container for convenient cord storage is provided. The outlet surface has at least one outlet opening, and the cord container is disposed corresponding to the outlet opening. The above cord container has a plurality of cord entry/exit holes and at... Agent: Birch Stewart Kolasch & Birch

20070227754 - Insulating electricity distribution systems: A shroud barrier is provided for shrouding an electricity distribution system to and to mounted on a substrate. The system includes a support for supporting an electrical distribution panel on a substrate and an electrical distribution panel on the support. The distribution panel includes at least one busbar arranged on... Agent: The Webb Law Firm, P.C.

20070227756 - Reversible cable support arm: A cable support arm is provided. In one embodiment, the cable support arm includes first and second arm sections that are rotatably coupled one over the other at a hinge structure. In this embodiment, the first and second arm sections include attachment mechanisms configured to couple the arm sections to... Agent: Hewlett Packard Company

20070227757 - Sealed eurytopic make-break connector utilizing a conductive elastomer contact: An electrical connection with first and second electrical connectors are adapted to engage each other to form an electrical connection. An electrical wire is connected to each connector. At least one of the connectors has a contact formed of a conductive elastomeric material with conductive particles dispersed in the material,... Agent: Fulbright & Jaworski, LLP

20070227758 - Jacket for heat-insulated conduits and method for making same: A jacket (3) for flexible heat-insulated conduits, in particular district heat transport lines, comprising a foamed or inflated polyethylene-based thermoplastic with a modulus of elasticity between 90 and 300 MPa and a density between 0.560 and 0.850 g/cm3.... Agent: Ware Fressola Van Der Sluys & Adolphson, LLP

20070227759 - Coupled building wire: The coupled building wire of the present invention comprises a first length of non-face metallic cable having a top surface and a bottom surface and a second length non-metallic cable having a top surface and a bottom surface, wherein the bottom surface of the first length of non-metallic cable is... Agent: Smith, Gambrell & Russell

20070227760 - Superconducting cable and method for the production thereof: The present invention relates to a superconducting hollow cable and a method for the production thereof. The superconducting hollow cable (1) has an outer tube (2) which has a circular inner cross-section and a cylindrical inner wall (3). In addition, the superconducting hollow cable (1) has a central cooling channel... Agent: Ronald R Santucci Frommer Lawrence & Haug

20070227761 - Heat conduction from an embedded component: This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic... Agent: Birch Stewart Kolasch & Birch

20070227763 - Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same: A coreless thin substrate with embedded circuits in dielectric layers is provided. The substrate includes a plurality of first patterned dielectric layers with embedded circuits, and at least a second patterned dielectric layer with embedded conducting elements. The second patterned dielectric layer is disposed between the first patterned dielectric layers,... Agent: J C Patents, Inc.

20070227764 - Printed circuit board and manufacturing method thereof: A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other... Agent: Akin Gump Strauss Hauer & Feld L.L.P.

20070227762 - Multilayer circuit board with grounding grids and method for controlling characteristic impedance of the multilayer circuit board: A multilayer circuit board has a first insulating layer, a first grounding grid layer and a transmission layer. The first grounding grid layer is formed below the bottom surface of the first insulating layer and has multiple grids. The grids are arranged in an array pattern and are made of... Agent: Birch Stewart Kolasch & Birch

20070227765 - Multilayer printed circuit board and multilayer printed circuit board manufacturing method: A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a transition layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070227767 - Connecting device for eletronic components: A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite sides of the insulating film. The film composite is formed... Agent: Cohen, Pontani, Lieberman & Pavane

20070227766 - Drill and method of producing printed circuit board: A drill in which no positional shift on a drilled hole and no irregularities on an internal wall are formed. A torsion angle of a shaving discharge groove of a drill is set in the range of 30 degrees to 50 degrees. In this manner, a positional shift of a... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070227768 - Flexible printed circuit board and hard disk drive employing the same: A flexible printed circuit board has a flexible dynamic region, and relatively rigid static regions between which the dynamic region extends. Portions of a base layer, a patterned conductive layer extending on the base layer, and a cover layer covering the conductive layer make up the dynamic region. Extensions of... Agent: Volentine & Whitt PLLC

20070227769 - Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An... Agent: Ibm Corporation RochesterIPLaw Dept. 917

20070227770 - Cable fixing structure: A cable fixing structure mounted in a case of an electronic device allowing a cable to cross over a circuit board erectly mounted therein, then pass to another end of the electronic device, comprising: a carrier, having a ledge part mounted thereon, and a press part, coupled with the ledge... Agent: Edwards Angell Palmer & Dodge LLP

20070227771 - Gasket made of an elastomer, especially silicone: In the case of a gasket made of an elastomer, especially silicone, for leading through several single-conductor cables (7), provided especially with contact clips, in a sealed manner into a housing (2) provided with a floor and covering lid (3), which gasket (1) comprises lead-through openings (4, 5, 6) adjacent... Agent: William Collard Collard & Roe, P.C.

20070227772 - Cable gland: The invention relates to a cable gland. The latter comprises a gland body for feeding a cable therethrough, an elastic sealing ring that is applicable to the front side of the gland body and whose internal diameter essentially corresponds to the diameter of the cable, and a gland ring that... Agent: Ostrolenk Faber Gerb & Soffen