Electricity: conductors and insulators inventions 02/07

20070039750 - Toll transponder case having functional attachments: A storage system incorporates a toll transponder mounted to the inside of a vehicle windshield. A transponder case surrounds the toll transponder whereby the transponder supports the case on the vehicle windshield. The case includes a hook and loop attachment for mounting functional items to the case such as a... Agent: The Law Office Of Randall T. Erickson, P.C.

20070039751 - Motor vehicle wiring harness having a grommet between occupant and engine compartments: A truck has an occupant compartment (24), an engine compartment (20) forward of the occupant compartment, and a wiring harness (34) extending through a dash panel (26) separating the two compartments from each other. A grommet (46) is secured at a fixed location on a wire bundle (42) that passes... Agent: International Truck Intellectual Property Company,

20070039752 - Electrical hermetic penetrant structure of low voltage: The invention concerns to electrical hermetic penetrant structure of the low voltage, used for input of electrical energy and signals in tight premises, for example, in atomic power stations, nuclear vessels, underground, etc. The objective of the present invention is creation of electrical penetrant structure, keeping operational properties at the... Agent: Houston Eliseeva

20070039753 - Built-up printed circuit board with stack type via-holes: A built-up printed circuit board includes stacked micro via-holes, each of which is provided for interconnection between layers in the printed circuit board, and in each of which a filling material, such as liquefied resin or conductive paste, is filled using a poly screen of a general screen printing machine.... Agent: Morgan Lewis & Bockius LLP

20070039754 - Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate: A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable... Agent: Blakely Sokoloff Taylor & Zafman

20070039755 - Cable management device and method of cable management: An electrical device (800, 1100, 1700, 1800) includes: a housing (810, 1110) having a top portion (811, 1111); a bottom portion (816, 1316) opposite the top portion; and a first side portion (917, 1217) between the top portion and the bottom portion; and a first cable management element (850) located... Agent: Walter P. Opaska Bryan Cave LLP

20070034399 - Emitter for an ion source and method of producing same: An emitter for a liquid metal ion source is provided. The emitter includes a wire comprising a substantially curved portion and a surface wherein at least a portion of the wire surface is tapered at the substantially curved portion to form an emitter tip. Furthermore, a manufacturing method for such... Agent: Patterson & Sheridan, L.L.P.

20070034400 - Integrated cable management stay: The present invention is a stay for retaining cables or other long, flexible structures in a coiled or bundled condition. The stay retains an end of the cable in an shape in which the end is wrapped around the coil or bundle when desired, such that a user of the... Agent: Reed Smith LLP

20070034401 - Circuit board and manufacturing method thereof: A circuit board may have a metal land supporting a pillar. The pillar may be fabricated by half-etching the metal land. An insulating layer may be provided on the circuit board so that the pillar of the metal land may be exposed through the insulating layer.... Agent: Harness, Dickey & Pierce, P.L.C

20070034403 - Four-way lead flat package ic-mount printed circuit board, method of soldering four-way-lead flat package ic and air conditioner: A four-way lead flat package IC-mount printed circuit board, carrying a four-way lead flat package IC and having front soldering land groups placed in front of the four way lead flat package IC and rear soldering land groups placed in the rear of the four-way lead flat package IC, has... Agent: Buchanan, Ingersoll & Rooney PC

20070034402 - Tape substrate, tape package and flat panel display using same: A tape substrate having hole(s) formed discontinuously along a bent portion thereof and configured to dissipate stress applied to the bent portion. A tape package using the tape substrate may be connected to a panel and a printed circuit board using an ACF. The tape package may be bent and... Agent: Volentine Francos, & Whitt PLLC

20070034404 - Tab tape for tape carrier package: A TAB tape for a tape carrier package may have an opening formed in a shortest connection portion. The opening may be provided in the shortest connection portion and a portion of the corresponding second lead. The opening may be arranged near a boundary between the corresponding first lead and... Agent: Harness, Dickey & Pierce, P.L.C

20070034405 - Using rows/columns of micro-vias to create pcb routing channels in bga interconnect grid (micro-via channels): A printed circuit board having micro-vias used to connect a portion of the contacts in a selected row or column to the first internal layer of the board, thereby creating routing channels on the second and subsequent internal layers of the board between selected rows or columns of through-board vias... Agent: Law Office Of Jim Zegeer

20070034406 - Emi shielding containers: Embodiments of electromagnetic interference (EMI) shielding containers are disclosed according to the present invention. The EMI shielding containers are especially useful for protecting sources of electronic evidence from EMI contamination prior to data extraction. However, the embodiments of EMI shielding containers of the present invention may be used in any... Agent: Morriss O'bryant Compagni, P.C.

20070034407 - cord outlet structure of electric instrument cabinet: A cord outlet structure of an electric instrument cabinet, includes: an opening window for a cord outlet; and a cover for the opening window, wherein: the cover being formed continuous with one of the sides of the edges of the opening window through a resin hinge; the opening window is... Agent: Osha Liang L.L.P.

20070029107 - Wiring board and production method of wiring board: A wiring board comprises a substrate; a resin layer which is selectively formed on one main surface of the substrate and has fine metal particles contained or adhered to its surface; and a conductive metal layer which is formed on the resin layer with the fine metal particles interposed between... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20070029108 - Printed circuit board and soldering method and apparatus: A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each through hole in which a component lead is inserted, whereby solder wicking up into the through hole is enhanced... Agent: Workman Nydegger (f/k/a Workman Nydegger & Seeley)

20070029109 - Multilayer printed wiring board and production method therefor: A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors)... Agent: Blank Rome LLP

20070029110 - Magnetic shield panel: A magnetic shield panel includes a magnetic shield member made of magnetic material; and a metallic plate or a translucent plate member, wherein the magnetic shield member is attached to the metallic plate or the translucent plate member.... Agent: Kenyon & Kenyon LLP

20070023199 - Electrical connection protector kits, insert assemblies and methods for using the same: A connection protector kit for use with an electrical stub connection assembly, the stub connection assembly including first and second conductors forming a connection and defining a crotch therebetween, includes an insert assembly. The insert assembly includes an insert member and a sealant pad mounted on the insert member. The... Agent: Marguerite E. Gerstner Tyco Electronics Corporation

20070023198 - Gland: A gland (10) for supporting one or more cables (29) comprises an annular gland body (11) defining a hollow passage (12) that is open at either end (12a, 12b). A core (13) is insertable into and removal from the passage via at least one of the ends (12a, 12b) thereof.... Agent: Baker & Daniels LLP

20070023200 - Cable splice closure and method of installation therefor: A cable splice closure comprising a casing and at least one resilient end plug for closing a respective entry/exit port of the casing, the casing being capable of being closed around the said plug to close the closure, the said end plug having at least one opening through which a... Agent: Baker & Daniels LLP

20070023201 - Visual latching indicator arrangement for an electrical bushing and terminator: An elbow terminator has a socket in which an electrical probe is disposed. The terminator is insertable onto an electrical bushing such that a tongue of the bushing is received in the socket of the terminator, and the probe of the terminator is electrically coupled to a contact sleeve disposed... Agent: Thomas G. Scavone Niro, Scavone, Haller & Niro

20070023202 - Circuit board and circuit apparatus using the same: A circuit board and a circuit apparatus using the same which can prevent displacement and film exfoliation ascribable to thermal expansion, and suppress a drop in reliability at increasing temperatures. The circuit board of the circuit apparatus includes a metal substrate having pierced holes as a core member. Protrusions are... Agent: Mcdermott Will & Emery LLP

20070023203 - Method and system for customized radio frequency shielding using solder bumps: An RF shield arrangement (30) includes a first substrate (12) having a first or top ground plane (41), a second substrate (22) having a second or bottom ground plane (42), and a plurality of solder bumped areas (14) coupled between the top ground plane and the bottom ground plane forming... Agent: Motorola, Inc Intellectual Property Section