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USPTO Class 174 | Browse by Industry: Previous - Next | All 01/2007 | Recent | 08: Jun | May | Apr | Mar | Feb | Jan | | 07: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 06: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | Electricity: conductors and insulators inventions 01/07Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 01/25/2007 > 18 patent applications in 12 patent subcategories. 20070017686 - Electronic apparatus, and heat sink incorporated in the electronic apparatus: According to one embodiment, the heat sink secured to the LSI mounted on the circuit board of an electronic apparatus has radiating plates extended substantially parallel to the circuit board, and radiating fins extended from the radiating plate to the circuit board. The radiating fins are made short to ensure... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP 20070017685 - Fire resistant and/or water resistant enclosure for operable computer digital data storage device: A fire and/or water resistant enclosure is provided for housing an operable digital data storage device. The enclosure is a low cost, preferably molded enclosure having various embodiments for providing resistance to fire and/or water. In one embodiment, a fan cooperates with one or more hatchless ventilation passageways to cool... Agent: Bruce H. Johnsonbaugh Eckhoff & Hoppe 20070017687 - Conduit attachment apparatus: A conduit attachment apparatus is secured to an open end of a conduit for holding cables or wires. In one embodiment the conduit attachment apparatus comprises a spillway and a securement collar. The spillway is adapted to provide bend radius control to cables or wires extending out of the conduit.... Agent: Panduit Corp. 20070017688 - Liquid-tight connector with deformable o-ring: A liquid tight connector for terminating one end of an elongate electrical conductor includes a connector body having a rearward conduit receiving end, an opposed forward end and a central bore therethrough. A gland nut is movably secured to the rearward conduit receiving end of the body for securing the... Agent: Hoffmann & Baron, LLP 20070017689 - Cable connector: A cable clamp includes a housing having a cavity therein with two opposed walls and an open end in communication with the cavity. A pair of wedge shaped jaws are located within the housing and are slideably movable toward and away from the opening. Each of the jaws includes a... Agent: Norman E. Lehrer, P.C. 20070017690 - Electrical cable for a linear motor and winding produced from it: A winding for a linear motor, which winding has three electrical cables arranged in grooves of an elongated inductor. The three electrical cables have an electrically conductive sheath and an electrically conductive intermediate layer arranged between the sheath and an outer conductive layer. At least one metal strand of an... Agent: Sofer & Haroun LLP. 20070017691 - Covered wire and automobile-use wire harness: There are provided a lightweight insulated electric wire capable of reducing influences of external magnetic fields while having an excellent conductivity and an excellent strength and an automobile wire harness using the same insulated electric wire. There is provided a signal electric wire including a conductor portion consisting of one... Agent: Mcdermott Will & Emery LLP 20070017692 - Insulated power cable: This invention relates to an insulated power cable comprising a multi-strand cable of a plurality of bundles of uninsulated wires, and electrical insulation sheathing the cable, the electrical insulation having a thickness of from 0.0625 to 0.5 inches (0.16 to 1.3 centimeters) and comprising a plurality of layers of spirally-wrapped,... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center 20070017693 - Printed circuit board including pads with vacancies: Methods and apparatuses for affecting the frequency behavior of connections within a printed circuit board or an integrated circuit are disclosed. Some embodiments include a printed circuit board comprising, a plurality of conductive layers each comprising at least one conductive pad, where each conductive pad on the conductive layers includes... Agent: Hewlett Packard Company 20070017694 - Wiring board and manufacturing method for wiring board: The area of attaching portions 27b provided in the peripheral region of an insulating film 20 is made greater than that of attaching portions 27a provided in the inward region. In addition, the thickness of solder bumps 25b which are formed by providing solder to attaching portions 27b is made... Agent: Baker Botts LLP C/o Intellectual Property Department 20070017697 - Circuit substrate and method of manufacturing plated through slot thereon: A circuit substrate and a method of manufacturing a slot-shaped plated through slot thereon are provided. The circuit substrate has a linear slot. A slot-shaped plated through hole with a multiple transmission paths is formed in the linear slot so that a multiple of signals can be transmitted through the... Agent: J.c. Patents 20070017696 - Multi-layer printed circuit board: A multi-layer printed circuit board (PCB) is provided allowing balanced power supply to components requiring large working current. The PCB includes a plurality of layers disposed thereon. A first power area, and a second power area are separately arranged on different layers. The first power area and the second power... Agent: Morris Manning Martin LLP 20070017695 - Wired circuit board: A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce... Agent: Akerman Senterfitt 20070017698 - Multilayer printed wiring board fabrication method and multilayer printed wiring board: An inner printed wiring board is provided with an inner insulating resin layer, an inner circuit pattern, and an inner via land. In order for the inner via land to make an interlayer connection, a pattern form for making a connection, unlike an ordinary wiring pattern, is adopted. The inner... Agent: Birch Stewart Kolasch & Birch 20070017699 - Circuit board: A pair of through holes are formed in a circuit board, and a silver paste filled up in the through holes connects lands formed on a front surface and a rear surface of the circuit board, respectively to each other. When the silver paste is solidified, the silver paste bulges... Agent: Reed Smith LLP 20070017702 - Contact-making apparatus: A contact-making apparatus for electrical connection of a unit under test to an electrical test device. The apparatus has a plurality of electrical test contacts, which are associated with at least one holding element, for making contact with the unit under test. An adapter device increases the distance between adjacent... Agent: Ostrolenk Faber Gerb & Soffen 20070017701 - Electromagnetic interference shield apparatus: An EMI shield apparatus includes an EMI shield (10) and a heat sink (20). The EMI shield comprises a pair of first sidewalls (14), a pair of second sidewalls (16), and an interconnecting top wall (12). The top wall and the first and second sidewalls cooperatively surround a receiving space... Agent: Morris Manning Martin LLP 20070017700 - Sp3 bonding boron nitride nitride thin film having self-forming surface shape being advantageous in exhibiting property of emitting electric field electrons, method for preparation thereof and use thereof: The solving means consists of providing a membrane body of sp3-bonded boron nitride excellent in field electron emission obtained by a method comprising the steps of introducing a reactive gas including a boron source and a nitrogen source into a reaction system; adjusting the temperature of a substrate in the... Agent: Kanesaka Berner And Partners LLP 01/18/2007 > 15 patent applications in 13 patent subcategories.20070012467 - Paste extruded insulator with air channels: The invention provides an insulated wire having a conductor and an insulator of paste extruded PTFE fine powder around the conductor. The paste extruded insulator has at least one closed continuous longitudinal air channel spaced apart from the conductor. The invention further provides a process for forming an insulator around... Agent: E I Du Pont De Nemours And Company Legal Patent Records Center 20070012468 - Strippable semiconductive shield and compositions therefor: This invention is generally directed to semi-conductive power cable shields, cables with such shield and compositions for making such shields. The semi-conductive shields are strippable from power cable insulation, resistant to thermal aging, have improved processability during cable extrusion and include little or no butyl nitrile rubber (NBR).... Agent: The Dow Chemical Company 20070012469 - Electromagnetically insulated conduit and system: A conduit includes an elongate member with an outer surface and an inner surface defining an inner passage for enclosing one or more electrical signal conductors therein, and an electromagnetic shield disposed coaxially with the elongate member to block electromagnetic radiation emitted by the one or more electrical signal conductors.... Agent: Mavis S. Gallenson, Esq. C/o Ladas & Parry 20070012470 - Fire resistant electrical cable splice: The fire resistant electrical cable splice joins two electrical cables. The two electrical cables are joined by at least one connection. The connection is formed between at least two conductors, at least one conductor from each of the electrical cables. The connection connects the conductors mechanically and electrically. An insulating... Agent: Hayes Soloway PC 20070012471 - Insulation-coated electric conductor: A multilayer insulation-coated electric conductor for a coil constituting a circuit by forming a welded portion in the coil, wherein at least one layer of the multilayer insulation-coating layers of the coated metal conductor is composed of at least one resin selected from the group consisting of a polyimide resin,... Agent: Knobbe Martens Olson & Bear LLP 20070012472 - Prevention of lightning induced csst fires: The present invention provides a method and apparatus for preventing electrically induced gas fires involving Corrugated Stainless Steel Tubing (CSST). Connectors for coupling the CSST to gas lines and appliance are affixed at each end of the tubing. These connectors are made of a conductive material such as brass. Conductive... Agent: Carstens & Cahoon, LLP 20070012474 - Communication wall receptacle cap retaining system and method: To assist in searching, the following abstract includes a receptacle system used to keep a receptacle cap secure through use of an enhanced retaining strap with its associated wall plate when the receptacle cap is unscrewed. The enhanced retaining strap is a separate individual component and is separably coupled to... Agent: Davis Wright Tremaine, LLP 20070012473 - Protective cover and system for electrical enclosures: A cover and system are provided for protecting an electrical enclosure during intense storms. The cover includes a top wall and a sidewall parametrically bounding the top wall and that is attached thereto. The cover further includes at least one vent disposed in the sidewall for allowing heat to escape... Agent: Thomas & Betts Corporation 20070012476 - Circuit board with plating bar: A circuit board includes a pad, a transmitting trace and a plating bar. The plating bar is used for forming an electroplating metallic layer on the pad, the pad and the transmitting trace are used for the signal transmission. Due to the plating bar causes a noise during the signal... Agent: Birch Stewart Kolasch & Birch 20070012475 - Rigid-flex wiring board and method for producing same: In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one... Agent: C. Irvin Mcclelland Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C. 20070012477 - Electronic component package including joint material having higher heat conductivity: An electronic component is mounted on the surface of a printed wiring board. A heat conductive member is received on the surface of the electronic component. A joint material is interposed between the electronic component and the heat conductive member. The joint material is made of material containing Ag in... Agent: Arent Fox PLLC 20070012478 - Contact spring assembly: The present invention relates to a method of securing a reliable electrical contact between two adjacent surfaces by means of a contact spring (30) of a contact spring assembly (1). The secure and reliable contact is achieved by providing excellent conditions for maintaining the contact spring fully operable at all... Agent: Ericsson Inc. 20070012479 - Ultra-low height electromagnetic shielding enclosure: The electromagnetic shielding device includes a frame and a lid. The frame includes sidewalls and upstanding male detent elements with outwardly extending detent protrusions. The lid includes a generally planar top with peripheral lip portions. Slots are formed at the intersection of the lid and the peripheral lip portions so... Agent: Harness, Dickey, & Pierce, P.l.c 20070012480 - Cable organizer: An apparatus for organizing a number of cables with respective bodies connected to ends thereof for use with an electronic device with a back wall. The back wall has a number of connectors with which the ends of the cables are connectable. The apparatus includes a body having a number... Agent: Gowling Lafleur Henderson LLP 20070012481 - Circuit board/envelope compound structure: A printed circuit board/sheathing bond structure with a sheathing enclosing a printed circuit board (11) includes two plastic-half-shells (12, 13) whose edges are closely bonded to each other in order to hermetically seal the printed circuit board (11).... Agent: Quarles & Brady LLP 01/11/2007 > 15 patent applications in 13 patent subcategories.20070007028 - Adhesively mounted electrical box assembly: This invention pertains to an electrical box assembly for securing to a stud using an adhesive. The assembly comprises an electrical enclosure, a bracket and at least one pair of opposed pads. The bracket is affixed to the enclosure and defines a stud-receiving cavity extending along an edge of the... Agent: Hoffman & Baron, LLP 20070007027 - Fast set screw device for non-metallic boxes: A non-metallic electrical wiring box having a fast set screw mounting socket for mounting electrical devices inside the box. The box includes a pair of side walls, a pair of end walls, a back wall, a front opening and one or more fast set screw mounting sockets in each end... Agent: Hoffmann & Baron, LLP 20070007029 - Flat cable clamp: To provide a flat cable clamp which can not only prevent breakage of a hinge but also limit a bending direction of the hinge, First and second protective protrusions 36, 43 are disposed in the vicinity of both side edge surface 26, 27 of first and second thin-walled hinges 14,... Agent: Sughrue Mion, PLLC 20070007030 - Outdoor cord connection cover apparatus: The invention is an outdoor electrical cord connection protector. A pair of mated covers is at least partially hinged along a common access. Each mated cover provides a snap together wire entrance at one end and a wire exit at the other end of the snap together covers. Each wire... Agent: William B. Ritchie Law Office Of William B. Ritchie 20070007031 - Method for forming a circuit board via structure for high speed signaling: One embodiment of the invention comprises an improved via structure for use in a printed circuit board (PCB), and method for fabricating the same. The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and... Agent: Wong, Cabello, Lutsch, Rutherford & Brucculeri, L.L.P. 20070007032 - Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same: A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP 20070007033 - Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include... Agent: Lawrence R. Fraley Hinman, Howard & Kattell, LLP 20070007034 - Connector-to-pad printed circuit board translator and method of fabrication: In one embodiment, a laminated printed circuit board translator is provided. In some embodiments, the translator includes a receiving board adapted to receive a pin, the receiving board includes a plated via extending through the receiving board and has a hole for receiving a pin. An interface board laminated with... Agent: Aagaard & Balzan, LLP 20070007035 - Press-fit pins for making electrical contact with vias: A press-fit pin for making electrical contact with a via is a self-supporting pin having a serpentine shape. The pin may have at least two bends therein, so as to make contact with the via at multiple pairs of contact points separated longitudinally along the length of the pin. This... Agent: Jonathan A. Platt Renner, Otto, Boisselle & Sklar, LLP 20070007036 - Electromagnetic wave shielding sheet,front plate and display: An electromagnetic wave shielding sheet comprises a transparent substrate 11 and a metal layer 15 provided on one surface of the transparent substrate 11 through an adhesive layer 13. The metal layer 15 includes a mesh part 103 and a frame part 101 surrounding the mesh part 103. The frame... Agent: Oliff & Berridge, PLC 20070007037 - Automatic electromagnetic sealing system for apertures in electromagnetic shields: In an electromagnetic shield an electromagnetic sealing system is provided comprising an aperture (3) defined by a jamb (6) in a fixed wall (2), a movable closing element (4) defined by a frame (7) designed to close said aperture (3), a conductive contact element (5) disposed between the jamb (6)... Agent: Nixon & Vanderhye, PC 20070007038 - Sealing member for an entry port: A sealing member includes an elastomeric interior portion and a rigid exterior portion. At least one passage extends through the elastomeric interior portion from a first end to a second end of the sealing member. The passage is configured to receive at least one longitudinal member therein. The elastomeric interior... Agent: 3m Innovative Properties Company 01/04/2007 > 14 patent applications in 10 patent subcategories.20070000678 - Transparent conductor: A transparent conductor includes a film-shaped or plate-shaped support and a transparent conductive layer that is disposed on the support and has a surface formed as a rough surface. The surface of the transparent conductive layer is formed so that a maximum peak height that shows a surface roughness of... Agent: Greenblum & Bernstein, P.L.C 20070000679 - Thermostat and panel cover: A housing is provided for covering an object on a building wall. The housing includes sidewalls and a front cover supported relative to the sidewalls. The sidewalls and front cover function to form an interior space generally within the sidewalls and front cover to house the object on the building... Agent: Dann, Dorfman, Herrell & Skillman 20070000680 - Polymer bushing and cable terminal end connector using the same: It is intended to achieve the weight reduction, sliming, and downsizing of bushings, compatibility of types of bushings, and simplification of operating steps. A polymer bushing comprises a conductor draw-out bar (1) having a conductor insertion hole (1a) in the lower end, a hard insulation sleeve (2) installed around the... Agent: Bacon & Thomas, PLLC 20070000681 - T-shaped raceway base scoring system (with slots): T-shaped raceway base components are provided of standard length, and the flat back plate portions are scored at intervals. The forwardly projecting web portion of the T-shaped base has a leading edge that defines opposed flanges for receiving cover components, and these covers also mount to the top and bottom... Agent: Mccormick, Paulding & Huber LLP 20070000682 - Electrical cables with stranded wire strength members: Disclosed are high strength wellbore electric cables, which are formed from a plurality of strength members. The strength members are formed from several stranded filament wires which may be encased within a jacket of polymeric material. The strength members may be used as a central strength member, or even layered... Agent: Schlumberger Ipc Attn: Tim Curington 20070000683 - Hanging box and faceplate adapter: A versatile device that enables at least one receptacle to be installed in a raceway system. The versatile device includes a hanging box and a faceplate adapter. The hanging box is secured to the raceway system and the faceplate adapter is positioned over the hanging box and secured to the... Agent: Panduit Corp. 20070000684 - Circuit board and visual inspection method of mount position of electronic component: A circuit board is equipped with soldering lands for a hall element and visual inspection marks printed at a vicinity of the soldering lands. The visual inspection marks include a pair of slender marks arranged so as to sandwich the two soldering lands to which two terminal pins protruding from... Agent: Nidec Corporation C/o Keating & Bennett, LLP 20070000687 - Apparatus and method for an embedded air dielectric for a package and a printed circuit board: A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing... Agent: Buckley, Maschoff, Talwalkar LLC 20070000685 - Connection sheet: A first high speed transmission line board (1) having a stripline structure is composed of a first elastomer sheet (1A) that has a fixed dielectric constant, plural first elastomer strips (1B) that are conductive, arrayed at two edges of the first elastomer sheet (1A), and plural first high speed transmission... Agent: Rader Fishman & Grauer PLLC 20070000689 - Printed circuit board: In an outer lead portion, outer lead wirings are provided on one surface of a base insulating layer and a plurality of metal substrates are provided on the opposite surface thereof. The plurality of metal substrates are provided with predetermined spacings therebetween. The outer lead wirings are not provided on... Agent: Akin Gump Strauss Hauer & Feld L.L.P. 20070000688 - Substrates for high performance packages including plated metal on ceramic substrates and thick organic substrates: Embodiments include electronic device substrates and methods for forming the same. A method for forming a package comprising a multilayer substrate includes forming a stack of a plurality of dielectric layers comprising a ceramic material, the stack including upper and lower dielectric layers. The method also includes providing a plurality... Agent: Konrad Raynes & Victor, LLP. Attn: Int77 20070000686 - System, method and apparatus for routing signals from an integrated circuit using thickfilm and printed circuit interconnects: A package is disclosed for routing high frequency signals and low frequency signals between an integrated circuit device and other components. A package includes a thickfilm substrate having thickfilm interconnects, and a printed circuit board having printed circuit interconnects. A microcircuit system is disclosed for routing high frequency signals and... Agent: Agilent Technologies Inc. 20070000690 - Printed circuit board assembly and method for preventing emi of crystal oscillator thereof: A printed circuit board Assembly (PCBA), including at least one crystal oscillator and a printed circuit board (PCB), is provided. The crystal oscillator includes a body and a shell. The shell covers the body. The PCB includes at least one inserting area and at least one plated hole. The inserting... Agent: Rabin & Berdo, PC 20070000691 - Printed circuit board having vias: A printed circuit board (PCB) having vias for reducing reflections of input signals includes a first signal layer, a second signal layer, one via, an input signal line arranged on the first signal layer, and an output signal line arranged on the second signal layer. The via further includes a... Agent: Morris Manning Martin LLP Previous industry: Tool driving or impactingNext industry: Boring or penetrating the earth ###### RSS FEED for 20080717: Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates. For more info, read this article. ###### Thank you for viewing Electricity: conductors and insulators patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Electricity: conductors and insulators patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Electricity: conductors and insulators patents we recommend signing up for free keyword monitoring by email. ### FreshPatents.com Support Results in 2.27352 seconds |