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Electricity: conductors and insulators inventions 05/06

Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.

   05/25/2006 > 11 patent applications in 10 patent subcategories.

20060108137 - Quick connect electrical junction box assembly: A quick connect electrical junction box assembly for receipt and support of electrical appliances including a first support member adapted to be attached to a building, the first support member having a female electrical receptacle connected thereto, a second support member to support an electrical appliance, the second support member...

20060108138 - Semiconductor chip package having an adhesive tape attached on bonding wires: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for...

20060108139 - Wire grommet: Disclosed is a wire grommet intended to be positioned in a hole made into a surface of a panel or plate. The grommet is made of two identical elements having adjacent edges provided with tongues and grooves allowing them to be assembled to form an open container with a size...

20060108140 - Automatic gel splice: An improved automatic gel splice is described. The automatic splice can include a tapered cylindrical body having end funnels positioned at opposite ends. Within the end funnels, a gel is positioned to protect the splice from potential contaminants. The gel can be a semi-conductive, waterproof gel. The gel acts with...

20060108141 - Portable electronic information and/or entertainment rendering devices carrier: The nature of the device herein described is as follows: It is a carrier for portable electronic information and/or entertainment rendering devices. The carrier engages the contour(s) and/or edge(s) of the aforementioned devices and by means of frictional surface forces prevents slippage. It is an attacheable and detacheable carrier. The...

20060108142 - Vents with signal image for signal return path: A method, structure, and method of design relating an electrical structure that includes a metal voltage plane laminated to a dielectric substrate. A determination is made as to where to place an opening for venting gases generated during fabrication of the dielectric laminate. An identification is made of a problematic...

20060108144 - Circuit board with embedded component and method of manufacturing same: A circuit board has an embedded electronic component such as an integrated circuit chip with a wafer level chip size package. A via hole extends through the electronic component. Another via hole extends through the substrate or prepreg on which the electronic component is mounted inside the circuit board. Conductors...

20060108143 - Signal transmission structure and circuit substrate thereof: A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall of a through...

20060108145 - Method for producing printed wiring board: An insulating resin layer 50 is formed on a surface of a conductor portion 2 by performing a plating pretreatment to the conductor portion 2 that has been formed on a surface of a wiring board substrate 1, and forming numerous dendrites 3 on the surface of the conductor portion...

20060108146 - Structure of electronic package and method for fabricating the same: A structure of an electronic package and a method for fabricating the structure are provided in the present invention. The provided method includes steps of providing a first substrate, forming an electronic component thereon, providing a second substrate to cover the first substrate and the electronic component so that a...

20060108147 - Printed wiring board: A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on...

  
05/18/2006 > 19 patent applications in 15 patent subcategories.

20060102368 - Stranded copper-plated aluminum cable, and method for its fabrication: Aluminum cable type electrical conductor comprising at least one stranded conductor based on conductive wires with an aluminum core coated with an intermediate layer of copper itself coated by a surface layer of nickel. The surface layer of nickel has a thickness from about 1.3 μm to about 3 μm,...

20060102369 - Fire stop frame assembly: A fire stop assembly for bordering a conduit access through a building separation, includes a rigid body portion with an access opening with the access opening being adjustably closed to define a conduit fitting opening within the access opening. The remainder of the access opening is adjustably closed by a...

20060102371 - Electrical box straddling a construction stud: An electrical straddle box that includes a pair of electrical boxes sized to fit between construction studs and are joined alongside one another by a U shaped saddle, where the saddle legs are the opposing sides of the electrical boxes, and the saddle web is the width of, and is...

20060102370 - Housing for receiving an electrical device: The invention relates to a casing (i.e., housing) for receiving an electrical device, particularly a switching device or sensor, having at least one indicating apparatus for indicating different electrical states, particularly switching states, of the device. The casing is characterized in that each indicating apparatus has a plurality of indicating...

20060102372 - Receptacle for enclosing low-voltage electronic devices in a wall: A receptacle for enclosing low-voltage electronic devices and maintaining the integrity of a vapor barrier. The receptacle includes a base, and four side walls. Each side wall is joined to two adjacent side walls to form a perimeter wall. The perimeter wall is joined to the base and extends from...

20060102374 - Component with ultra-high frequency connections in a substrate: The present invention relates to contacting technology for signal connections in the substrate of an extremely high frequency module, in particular a microwave or millimeter wave module. The extremely high frequency module contains a) a multilayer substrate having at least two dielectric layers and metallization layers and inter-layer connections, and...

20060102373 - Member for semiconductor device: There is provided a member for a semiconductor device, such as a substrate, having an excellent resin bonding property capable of improving resin bonding strength at the time the member for a semiconductor device being bonded with resin and maintaining a high resin bonding strength even after various reliability tests,...

20060102375 - Stepped compression connector: A stepped compression connector includes a body having an exterior surface, a cable receiving open end, and a terminal connection end with an end wall. A generally tubular bore extends into the body from the open end and includes an inner surface. An axial slot is disposed on the inner...

20060102376 - Electrical cable with foamed semiconductive insulation shield: An electrical power cable with a foamed, compressible, semiconductive insulation shield which serves as both a cushioning layer and an electrical shield....

20060102377 - Cable and method of making the same: Cable and method for cable. Embodiments of the cable are useful, for example, as an overhead power transmission line....

20060102378 - Cable and method of making the same: Cable and method for cable. Embodiments of the cable are useful, for example, as an overhead power transmission line....

20060102379 - Electric wire: An electric wire, in which a color of an outer surface of the electric wire is securely prevented from coming off, is provided. The electric wire (1) includes a core wire (4), coating (5), mark (23) and coating layer (6). The coating (5) coats the core wire (4). The mark...

20060102380 - Multilayer insulating wire: The present invention discloses a multilayer insulating wire, which complies with the safety standards and comprises a conductor and at least two insulating layers covered onto the conductor. A fluorothermoplastic is used to form the insulating layer, and any two adjacent layers are comprised of different fluorothermoplastics to form mutually...

20060102381 - Cable tidy: A cable tidy, including a rigid support member, carrying a cable retaining net which allows air to flow past the cable in order that heat dissipates quickly....

20060102382 - Manufacturing method of electronic part and wiring substrate: A manufacturing method of an electronic part, comprises: sectioning a wiring substrate along a line intersecting a through hole, the wiring substrate having; a base substrate, a wiring pattern provided on a first surface of the base substrate, a reinforcement member provided on a second surface of the base substrate,...

20060102383 - Method of fabricating high density printed circuit board: Disclosed is a method of fabricating a high density PCB. Electric properties of a high frequency package product are reduced due to an increased length of a circuit even though the increased length of the circuit is necessary to maintain physical strength in the course of fabricating the PCB. Accordingly,...

20060102384 - Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as...

20060102385 - Printed board for electronic devices controlling a motor vehicle: In order to protect a printed circuit board (1, 1′) especially against the development of heat by simple means, said printed circuit board includes strip conductors for electronic circuits and connections for a voltage supply unit equipped with at least one SMD-component and additional electronic and/or electromechanical parts that are...

20060102386 - Multi-layered flexible print circuit board and manufacturing method thereof: A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at...

  
05/11/2006 > 10 patent applications in 8 patent subcategories.

20060096772 - Cables or the like protection and guide device: A cable or the like protection and guide device is provided in which a partitioning shelf plate member can be easily attached and detached and the damage of the cover of the cables or the like and the dropping of the shelf plate member can be prevented. In a cables...

20060096773 - Reduced cost and gasketting \"one-hit\" and other manufacturing emi-shielding solutions for computer enclosures: The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a “one-hit” solution may be implemented to provide adequate electromagnetic interference shielding (EMC shielding) and is configured such that shielding gaskets, “spoons” or other excessive structures may be reduced or eliminated...

20060096774 - Environmental seal for network interface device: A NID includes a base defining an interior cavity and a protective outer cover attached to the base for movement between an opened position and a closed position. At least one of the base and the outer cover has one or more channels formed therein and the other of the...

20060096775 - Weatherproof cover and disconnect switch: A weatherproof cover for protecting electrical receptacles from the harsh elements of weather is disclosed herein. This novel weatherproof cover is operable while the electrical receptacle is in use and includes a weatherproof switch that controls power to the receptacle such that when the receptacle cover of the weatherproof cover...

20060096776 - Gripping means for a signal line and signal line: The invention relates to a gripping means for a signal line, which signal line is embodied such that the signal transmitted through the line can be influenced by loads exerted externally on the cable, which gripping means comprise at least one rigid component adapted to grip the sleeve of the...

20060096777 - High performance support-separators for communications cables: The present invention includes a high performance communications cable exhibiting reduced cross-talk between transmission media that includes one or more core support-separators having various shaped profiles which define a clearance to maintain a spacing between transmission media or transmission media pairs. The core may be formed of a conductive or...

20060096778 - Protective circuit board for battery pack: A protective circuit board for a battery pack for controlling charge and discharge states of the battery pack includes an insulation layer and a first signal pattern disposed inside the insulation layer. The circuit can further include a second signal pattern disposed inside the insulation layer. The circuit can include...

20060096779 - Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board: The impedance of a newly manufactured data transmission wire pattern can be measured easily and accurately. A multilayer type printed-wiring board 1 comprises a pair of data transmission wire patterns 4, 5 arranged between a CPU module 2 and a memory module 3 on respective inner layer substrates 6, 7,...

20060096780 - Thin film circuit integrating thick film resistors thereon: A method of fabricating printed circuit boards integrating thick film resistor components and thin film circuit portions thereon is disclosed. This is a two-phase process, where the first phase is to create multiple thick film resistors, and the second phase is to create a thin film circuit portion on the...

20060096781 - Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same: A disclosed substrate is composed of a base member having a through-hole, a penetrating via provided in the through-hole, and a wiring connected to the penetrating via. The penetrating via includes a penetrating part having two ends on both sides of the base member, which is provided in the through-hole,...

  
05/04/2006 > 19 patent applications in 17 patent subcategories.

20060090915 - Streamer discharge type lightening rod capable of generating lots of ions: A streamer discharge type lightening rod is disclosed, which is capable of generating lots of ions so that a certain object can be effectively protected from lightening in such a manner that an induction current is formed using ions in the air as thundercloud is formed, and ions having polarities...

20060090916 - Protector: A protector body is formed with a semi-annular portion. The semi-annular portion has an inner peripheral surface projected with a rib to engage with a trough portion of the corrugated tube. The lid is provided with a larger-diameter lid and a smaller-diameter lid depending upon a diameter of the corrugated...

20060090917 - Support base with movable mounting pad: An enclosure installation assembly comprises a support base and a mounting pad adapted to be secured to the support base. The support base, having a lower portion slightly larger than its upper portion, is placed in a hole in the ground. Dirt is compacted around the support base to secure...

20060090918 - Venting device for tamper resistant electronic modules: A tamper resistant enclosure for an electronic circuit includes an inner copper case, a tamper sensing mesh wrapped around the inner case, an outer copper case enclosing the inner case and the tamper sensing mesh, and a venting device forming a vent channel from inside the inner case to outside...

20060090919 - Electrical outlet box having captive screw clamp: The present invention provides a clamp assembly for clamping an electrical wire to the wall of the electrical outlet box. The clamp assembly includes a wire clamp non-rotatably supported in the box adjacent to the wall. The wire clamp has an internally threaded aperture therethrough. A threaded screw assembly is...

20060090920 - Wire harness construction: A wire harness is slidably arranged between a vehicle body and an opening/dosing member of the vehicle. A grommet is fitted onto one end of a wire harness, which is arranged in the opening/closing member and is pulled out toward the vehicle body. The grommet has a diaphragm portion that...

20060090921 - Terminal end processing method and terminal end shielding structure of shielded cable, and light transmitting/receiving system using terminal end shielding structure: A terminal end shielding method of a shielded cable, including the steps of: forming a first electrically-conductive thin film, which is elastic, on a peripheral surface of an outer skin end portion at a shielded cable terminal end portion at which a shielding member is exposed by a predetermined length...

20060090923 - Integrated power and data insulated electrical cable having a metallic outer jacket: The present invention is directed to a hybrid electrical cable providing for power transmission or distribution and data and/or voice signal communications. In one preferred embodiment, the hybrid electrical cable includes a power cable having a group of one or more high voltage power conductors for conducting power and one...

20060090922 - Interconnecting cable: The invention relates to the provision of a cable and method of producing the same. The cable can be adapted and used for the generation of audio, video, data, electrical supply and other uses and comprises at least two conductor sets running along the cable. Each conductor set includes at...

20060090924 - Flexible ribbon or flat cable: A flexible ribbon or flat cable which is made of at least one electric current conductor provided with an insulating layer and embedded between at least two non-woven fabric layers. The non-woven fabric layers are made purely of polyester, polyamide, polyolefin, syndiotactic polystyrene, polysulphone and/or glass fibers and are joined...

20060090925 - Self-sealing electrical cable using rubber resins: An electrical cable and a method for manufacturing the electrical cable are provided in which a plurality of insulated conductors have an inner protective layer extruded thereabout. A plurality of longitudinally extending ribs or fins or exterior ribbed or finned surfaces are formed outward of the inner protective layer between...

20060090926 - Device for the insulation of an electric conductor: A device for insulating an electric conductor includes a non-woven substrate made of fibers and configured to be electrically insulating and a coating containing mica disposed on the fibers....

20060090927 - Circuit board cam-action standoff connector: A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a...

20060090928 - Printed wiring board for plasma display and process for producing the same: A printed wiring board for a plasma display, comprising: an insulating film having a folding slit(s) provided at its folding position; a wiring pattern provided on at least one surface of the insulating film; and a flame retardant solder resist layer provided so as for a terminal part to be...

20060090929 - Multi-layer printed circuit with low noise: A multi-layer printed circuit board having a low noise characteristic, the multi-layer printed circuit board includes at least one circuit layer; at least one isolation line for dividing the at least one circuit layer into at least two areas, the at least one isolation line forming an open pattern and...

20060090930 - Multi-layer printed circuit with low noise: A multi-layer printed circuit board having a low noise characteristic, the multi-layer printed circuit board includes: at least one circuit layer; at least one isolation line for dividing the at least one circuit layer into at least two areas, the at least one isolation line forms an open pattern and...

20060090931 - Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument: A semiconductor device includes a semiconductor chip and a substrate having an interconnecting pattern formed thereover. The substrate has the semiconductor chip mounted on one surface thereof. The substrate has an outline larger than the semiconductor chip. First terminals are formed in a region outside the region of the substrate...

20060090932 - Solder-bearing wafer for use in soldering operations: A solder-bearing wafer is provided for use in a soldering operation. The solder-bearing wafer is designed to provide a solder material which is used in a soldering operation for electrically connecting a first electronic device to a second electronic device. According to a first embodiment, the wafer comprises a substrate...

20060090933 - Apparatus and method for improving printed circuit board signal layer transitions: A method and apparatus for improving printed circuit board signal layer transitions are described. In one embodiment, the method includes the formation of a first via within a printed circuit board (PCB). A second via is formed concurrently within the PCB. In one embodiment, the second via is positioned proximate...

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